A flexible ultra-thin Mini-LED backlight and its assembly method

Abstract

The present invention discloses a flexible ultra-thin Mini-LED backlight source and an assembly method thereof, comprising a substrate, wherein a plurality of groups of welding heads are evenly arranged on the upper end surface of the substrate, the welding heads being grouped in pairs, and an LED chip being welded to a group of welding heads; the LED chip has an upwardly curved or downwardly curved structure; the outside of the LED chip is coated with packaging glue, and a glue frame is fixedly arranged on all four sides of the upper end of the substrate, and a light-enhancing sheet is connected to the upper end of the glue frame through a light-shielding glue; the LED chip of the present invention has an upwardly curved or downwardly curved structure, the curved section of the LED chip serves as the light source, and welding feet are fixedly arranged at both ends of the curved section, and the LED chip is welded to the welding head through the welding feet, and the upwardly curved light source and the downwardly curved light source are selected according to actual needs. The provision of the mounting components can realize rapid disassembly and installation of the substrate, and facilitate replacement of the light source.

Description

Technical Field

[0001] The present invention relates to the technical field of LED backlight sources, and in particular to a flexible ultra-thin Mini-LED backlight source and an assembly method thereof. Background Art

[0002] Currently, the penetration rate of LED backlights in LCD panel displays has exceeded 90%. There are two main types of backlight module architectures: edge-lit and direct-lit. Edge-lit LED backlights place the LED light source on the side of a light guide plate. Light from the LED is coupled into the light guide plate, where it is then reflected and scattered by reflectors and mesh points. However, this approach results in relatively poor image contrast and lacks local dimming. Direct-lit LED backlights, however, are becoming the mainstream market trend, offering more accurate image rendering and superior color and contrast.

[0003] A direct-lit LED backlight module generally includes a PCB board on which a number of packaged LED chips are mounted. The light emitted by the LED chips is irradiated onto the LCD display screen, thereby illuminating the liquid crystal display device.

[0004] The chips of existing LED backlight sources are generally straight-plate type and do not have a curved chip board structure. Therefore, they cannot emit the light effect that a curved chip board can emit. At the same time, the LED substrate is fixedly installed, which is troublesome to disassemble and replace. Summary of the Invention

[0005] The purpose of the present invention is to provide a flexible ultra-thin Mini-LED backlight source and an assembly method thereof, wherein the LED chip has an upwardly curved or downwardly curved structure, the curved section of the LED chip is the light source, and solder feet are fixedly provided at both ends of the curved section. The LED chip is soldered to the welding head through the solder feet, and the upwardly curved light source and the downwardly curved light source are selected according to actual needs. When the LED chip is selected to have an upwardly curved structure, the height of the welding head is reduced, and when the LED chip is selected to have a downwardly curved structure, the height of the welding head is increased, thereby ensuring that the position of the highest point of the LED chip remains consistent regardless of whether it protrudes upward or bends downward, so that except for the different structures of the LED chips, the structures of other components of the backlight source remain consistent.

[0006] The purpose of the present invention can be achieved through the following technical solutions:

[0007] A flexible ultra-thin Mini-LED backlight source includes a substrate, wherein the upper surface of the substrate is evenly provided with a plurality of groups of welding heads, with the welding heads grouped in pairs, and an LED chip is welded to each welding head in a group; the LED chip has an upwardly or downwardly curved structure; the outside of the LED chip is coated with packaging glue, and a glue frame is fixedly provided around the upper end of the substrate, and a brightening sheet is connected to the upper end of the glue frame via light-shielding glue.

[0008] As a further solution of the present invention: a protective film is provided above the packaging glue, and a gap is provided between the protective film and the packaging glue.

[0009] As a further solution of the present invention: a diffusion film is provided on the upper end of the protective film, and a brightness enhancement film connected to the brightness enhancement sheet is provided on the upper end of the diffusion film.

[0010] As a further solution of the present invention: a plurality of groups of thermal pads for dissipating heat from the LED chips are evenly arranged on the bottom of the substrate.

[0011] As a further solution of the present invention: mounting components for mounting the substrate are provided on both sides of the bottom of the substrate.

[0012] As a further solution of the present invention: the installation components are symmetrically arranged in groups of two, and each group of installation components includes multiple groups of guide pillars, and sleeves are rotatably installed on the guide pillars. The lower ends of the sleeves are fixedly connected to the installation heads through connecting rods.

[0013] As a further solution of the present invention: a torsion spring is sleeved on the outer periphery of the sleeve, and a stop pin connected to the torsion spring is fixedly provided on the guide column and the sleeve.

[0014] As a further solution of the present invention: a connecting plate is fixedly provided on the upper part of the sleeve, and multiple groups of connecting plates are rotatably connected to the driving slide at one end away from the sleeve.

[0015] As a further solution of the present invention: a guide rod is fixedly provided at the bottom of the base plate, and a guide groove matching the guide rod is provided on the driving slide.

[0016] As a further solution of the present invention: a method for assembling a flexible ultra-thin Mini-LED backlight source, the assembly method specifically comprises the following steps:

[0017] Step 1: Weld the soldering heads evenly on the upper surface of the substrate, then solder the LED chip to the corresponding soldering heads. After the LED chip is soldered, fix the glue frame on the upper surface of the substrate.

[0018] Step 2: After fixing the plastic frame, add packaging glue to the substrate so that the packaging glue completely covers the LED chip and the solder joint. Then install a layer of protective film on top of the packaging glue, and ensure that there is a gap between the protective film and the packaging glue.

[0019] Step 3: After the protective film is installed, place the diffusion film, the brightness enhancement film and the brightness enhancement sheet on the protective film in sequence, and fix the brightness enhancement sheet to the glue frame with light-shielding glue to complete the installation on the upper end face of the substrate;

[0020] Step 4: Fix and weld multiple guide rods and guide posts on both sides of the bottom of the baseboard, and stick the thermal pad to the bottom of the baseboard. Then rotate the installation sleeve on the guide post and install the drive slide on the guide rod;

[0021] Step 5: Before installing the sleeve on the guide post, first put a torsion spring on the outside of the sleeve, then fix the connecting rod and the mounting head on the bottom of the sleeve, and fix the connecting plate on the upper part of the sleeve. After the sleeve is installed on the guide post, fix the two ends of the torsion spring to the guide post and the sleeve respectively;

[0022] Step 6: After the sleeve is installed, rotate and install the connecting plate and the driving slide to complete the installation of the lower end surface of the base plate.

[0023] Beneficial effects of the present invention:

[0024] (1) The LED chip is in an upward or downward curved structure. The curved section of the LED chip is the light source. Solder pins are fixed at both ends of the curved section. The LED chip is soldered to the welding head through the solder pins. The upward curved light source and the downward curved light source are selected according to actual needs. When the LED chip is in an upward curved structure, the height of the welding head is reduced. When the LED chip is in a downward curved structure, the height of the welding head is increased, thereby ensuring that the position of the highest point of the LED chip remains consistent regardless of whether it protrudes upward or bends downward. Therefore, except for the different structures of the LED chip, the structures of other components of the backlight source remain consistent.

[0025] (2) The LED chips are arranged in an array on the substrate. Different array arrangements can be set according to different usage scenarios, such as rectangular arrays, circular arrays or diamond arrays, and adjacent LED chips are staggered. Adjacent staggered LED chips can effectively improve the uniformity of light emission, and LED chips can select light sources of different colors. When LED chips use light sources of different colors, LED chips of different colors are staggered in the horizontal and vertical directions, and chips of the same type are not adjacent in the same row and column. Such an arrangement can ensure that light sources of different colors are evenly distributed, and the emitted light is also relatively evenly mixed, thereby improving the overall luminous effect of the backlight source and ensuring the beauty of the light source.

[0026] (3) When the substrate needs to be disassembled and assembled, the driving slide is toggled, and the driving slide drives multiple sets of connecting plates to rotate at the same time. The connecting plates rotate and the sleeves are driven to rotate. The sleeves drive the connecting rods and the mounting heads at the bottom to rotate, so that the mounting heads are opposite to the mounting holes set on the shell. Then the substrate is moved downward as a whole so that the mounting heads are inserted into the mounting holes. Then the driving slide is released, and the mounting heads rotate inside the mounting holes under the action of the torsion springs. The substrate is fixed and installed by the mounting heads to ensure that the substrate remains stable after installation. At the same time, the setting of the mounting components can realize the rapid disassembly and installation of the substrate, which is convenient for replacing the light source. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention will be further described below with reference to the accompanying drawings.

[0028] Figure 1 This is a schematic diagram of the structure of the present invention that is bent upward as a whole;

[0029] Figure 2 This is a schematic diagram of the structure of the present invention that is bent downward as a whole;

[0030] Figure 3 This is a schematic structural diagram of the LED chip arrangement of the present invention;

[0031] Figure 4 This invention Figure 2 Schematic diagram of the enlarged structure at A in the middle;

[0032] Figure 5 It is a structural schematic diagram of the driving slide of the present invention;

[0033] Figure 6 It is a structural schematic diagram of the connecting plate of the present invention.

[0034] In the figure: 1. Base plate; 2. Welding head; 3. LED chip; 4. Packaging glue; 5. Protective film; 6. Diffusion film; 7. Brightening film; 8. Brightening sheet; 9. Shading glue; 10. Glue frame; 11. Protective pad; 12. Mounting component; 13. Thermal pad; 14. Guide column; 15. Sleeve; 16. Torsion spring; 17. Stop pin; 18. Connecting rod; 19. Mounting head; 20. Connecting plate; 201. Waist hole groove; 202. Arc groove; 21. Driving slide; 211. Connecting groove; 212. Shaft; 213. Guide groove; 22. Guide rod. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0036] Example 1

[0037] See also Figure 1 and Figure 2 As shown, the present invention is a flexible ultra-thin Mini-LED backlight source, comprising a substrate 1, wherein a plurality of groups of welding heads 2 are evenly arranged on the upper surface of the substrate 1, and the welding heads 2 are grouped in pairs, and an LED chip 3 is welded on a group of welding heads 2; the LED chip 3 is in an upwardly curved or downwardly curved structure, and the curved section of the LED chip 3 is a light source, and welding feet are fixedly provided at both ends of the curved section, and the LED chip 3 is welded to the welding head 2 through the welding feet. The upwardly curved light source and the downwardly curved light source are selected according to actual needs. When the LED chip 3 is in an upwardly curved structure, the height of the welding head 2 is reduced, and when the LED chip 3 is in a downwardly curved structure, the height of the welding head 2 is increased, thereby ensuring that the LED chip 3 is not The tube protrudes upward or bends downward, and the position of its highest point remains consistent, so that except for the different structures of the LED chip 3, the structures of other components of the backlight source remain consistent; the outside of the LED chip 3 is coated with packaging glue 4, and a glue frame 10 is fixedly provided on all sides of the upper end of the substrate 1. The setting of the glue frame 10 realizes the edge sealing effect of the substrate 1, effectively preventing the packaging glue 4 that seals the LED chip 3 from leaking. At the same time, a protective pad 11 is also provided between the glue frame 10 and the substrate 1. The setting of the protective pad 11 effectively protects the substrate 1, preventing the glue frame 10 from damaging the substrate 1 and affecting the normal use of the LED backlight source; the upper end of the glue frame 10 is connected to a light-enhancing sheet 8 through a light-shielding glue 9, and the setting of the light-enhancing sheet 8 enhances the light.

[0038] A protective film 5 is provided above the encapsulant 4. A gap is formed between the protective film 5 and the encapsulant 4. This gap allows the LED chip 3 to dissipate heat during operation, thereby increasing the service life of the LED backlight. A diffusion film 6 is provided above the protective film 5 to diffuse the light. A brightness enhancement film 7 is provided above the diffusion film 6 and is connected to a brightness enhancement sheet 8 to further enhance the light.

[0039] See also Figure 3As shown, the LED chips 3 are arranged in an array on the substrate 1. Different array arrangements can be set according to different usage scenarios, such as a rectangular array, a circular array or a diamond array, and adjacent LED chips 3 are staggered. The adjacent staggered LED chips 3 can effectively improve the uniformity of the light source, and the LED chips 3 can select light sources of different colors. When the LED chips 3 use light sources of different colors, LED chips 3 of different colors in the horizontal and vertical directions are staggered, and chips of the same type are not adjacent in the same row and column. Such an arrangement can ensure that light sources of different colors are evenly distributed, and the emitted light is also relatively evenly mixed, thereby improving the overall luminous effect of the backlight source and ensuring the aesthetics of the light source.

[0040] Example 2

[0041] The structure of this embodiment is the same as that of the first embodiment, except that:

[0042] See also Figure 4-Figure 6 As shown, several groups of thermal pads 13 for dissipating heat from the LED chips 3 are evenly arranged at the bottom of the substrate 1. Preferably, the number of thermal pads 13 corresponds to the number of LED chips 3, and the thermal pads 13 are located directly below the LED chips 3, effectively conducting and dissipating the heat emitted by the LED chips 3 during operation.

[0043] Both sides of the bottom of the base plate 1 are provided with mounting components 12 for mounting the base plate 1. The mounting components 12 are symmetrically arranged in groups of two. Each group of mounting components 12 includes multiple groups of guide posts 14. Sleeves 15 are rotatably mounted on the guide posts 14. The lower end of the sleeve 15 is fixedly connected to a mounting head 19 via a connecting rod 18. The mounting head 19 is a rectangular structure, and both sides of the upper short side of the mounting head 19 are provided with downward chamfers. The chamfers facilitate the rotation and insertion of the mounting head 19 into the corresponding mounting slot. A torsion spring 16 is sheathed around the outer periphery of the sleeve 15. Stop pins 17 connected to the torsion spring 16 are fixedly mounted on both the guide posts 14 and the sleeve 15. The provision of the torsion spring 16 can prevent the base plate 1 from falling off due to unintended circumstances.

[0044] A connecting plate 20 is fixedly provided on the upper part of the sleeve 15, and an arc groove 202 is provided on the side of the connecting plate 20 close to the sleeve 15. The arc groove 202 fits with the outer periphery of the sleeve 15 to ensure that the connecting plate 20 and the sleeve 15 are stably welded. Multiple groups of connecting plates 20 are rotatably connected to the driving slide 21 at one end away from the sleeve 15. A waist hole groove 201 is provided at the connection between the connecting plate 20 and the driving slide 21. The waist hole groove 201 is a long strip waist hole to ensure that when the connecting plate 20 rotates, it will not get stuck with the driving slide 21. A guide rod 22 is fixedly provided at the bottom of the base plate 1, and a guide groove 213 is provided on the driving slide 21 to cooperate with the guide rod 22. A connecting groove 211 connected to the connecting plate 20 is provided on the driving slide 21. The connecting groove 211 is also a long waist hole, which is used to facilitate the movement of the connecting plate 20 in the connecting groove 211. A shaft rod 212 is installed in the connecting groove 211, and the shaft rod 212 is inserted into the waist hole groove 201 of the connecting plate 20.

[0045] When the substrate 1 needs to be disassembled and assembled, the driving slide 21 is toggled, and the driving slide 21 drives multiple groups of connecting plates 20 to rotate at the same time. The connecting plates 20 rotate while driving the sleeve 15 to rotate. The sleeve 15 drives the connecting rod 18 and the mounting head 19 at the bottom to rotate, so that the mounting head 19 is opposite to the mounting hole set on the shell. Then the substrate 1 is moved downward as a whole so that the mounting head 19 is inserted into the mounting hole. Then the driving slide 21 is released, and the mounting head 19 rotates inside the mounting hole under the action of the torsion spring 16. The substrate 1 is fixed and installed by the mounting head 19 to ensure that the substrate 1 remains stable after installation. At the same time, the setting of the mounting component 12 can realize the rapid disassembly and installation of the substrate 1, which is convenient for replacing the light source.

[0046] The present invention also discloses a method for assembling a flexible ultra-thin Mini-LED backlight source, which specifically includes the following steps:

[0047] Step 1: Welding heads 2 are evenly welded on the upper surface of the substrate 1, and then the LED chips 3 are welded to the corresponding welding heads 2. After the LED chips 3 are welded, the plastic frame 10 is fixed on the upper surface of the substrate 1;

[0048] Step 2: After fixing the plastic frame 10, add the packaging glue 4 to the substrate 1 so that the packaging glue 4 completely covers the LED chip 3 and the welding head 2. Then, install a layer of protective film 5 on the top of the packaging glue 4, and ensure a certain gap between the protective film 5 and the packaging glue 4.

[0049] Step 3: After the protective film 5 is installed, the diffusion film 6, the brightness enhancement film 7 and the brightness enhancement sheet 8 are placed on the protective film 5 in sequence, and the brightness enhancement sheet 8 is fixedly connected to the glue frame 10 through the light-shielding glue 9 to complete the installation on the upper end surface of the substrate 1;

[0050] Step 4: Weld multiple guide rods 22 and guide posts 14 to both sides of the bottom of the base plate 1, and stick the thermal pad 13 to the bottom of the base plate 1. Then, rotate the sleeve 15 on the guide post 14 and install the driving slide 21 on the guide rod 22.

[0051] Step 5: Before installing the sleeve 15 on the guide post 14, first sleeve the torsion spring 16 on the outside of the sleeve 15, then fix the connecting rod 18 and the mounting head 19 on the bottom of the sleeve 15, and fix the connecting plate 20 on the upper part of the sleeve 15. After the sleeve 15 is installed on the guide post 14, fix the two ends of the torsion spring 16 to the guide post 14 and the sleeve 15 respectively;

[0052] Step 6: After the sleeve 15 is installed, the connecting plate 20 and the driving slide plate 21 are rotated and installed to complete the installation of the lower end surface of the base plate 1.

[0053] The above is a detailed description of an embodiment of the present invention. However, the content described is only a preferred embodiment of the present invention and should not be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A flexible ultra-thin Mini-LED backlight source, characterized in that: The invention comprises a substrate (1), wherein a plurality of groups of welding heads (2) are evenly arranged on the upper surface of the substrate (1), wherein the welding heads (2) are grouped in pairs, and an LED chip (3) is welded to a group of welding heads (2); the LED chip (3) is in an upwardly curved or downwardly curved structure; the outside of the LED chip (3) is coated with a packaging glue (4); a glue frame (10) is fixedly arranged around the upper end of the substrate (1), and a light-enhancing sheet (8) is connected to the upper end of the glue frame (10) via a light-shielding glue (9); Both sides of the bottom of the substrate (1) are provided with mounting components (12) for mounting the substrate (1); The mounting components (12) are symmetrically arranged in two groups, each group of mounting components (12) includes a plurality of guide columns (14), a sleeve (15) is rotatably mounted on the guide columns (14), and the lower end of the sleeve (15) is fixedly connected to a mounting head (19) via a connecting rod (18); A torsion spring (16) is sleeved on the outer periphery of the sleeve (15), and a stop pin (17) connected to the torsion spring (16) is fixedly provided on the guide column (14) and the sleeve (15); A connecting plate (20) is fixedly provided on the upper portion of the sleeve (15), and a plurality of groups of connecting plates (20) are rotatably connected to the driving slide plate (21) at one end away from the sleeve (15).

2. The flexible ultra-thin Mini-LED backlight according to claim 1, characterized in that: A protective film (5) is provided above the packaging glue (4), and a gap is provided between the protective film (5) and the packaging glue (4).

3. The flexible ultra-thin Mini-LED backlight according to claim 2, characterized in that: A diffusion film (6) is provided on the upper end of the protective film (5), and a brightness enhancement film (7) connected to the brightness enhancement sheet (8) is provided on the upper end of the diffusion film (6).

4. The flexible ultra-thin Mini-LED backlight according to claim 1, characterized in that: Several groups of thermal pads (13) for dissipating heat from the LED chips (3) are evenly arranged on the bottom of the substrate (1).

5. The flexible ultra-thin Mini-LED backlight according to claim 1, characterized in that: A guide rod (22) is fixedly provided at the bottom of the base plate (1), and a guide groove (213) matching the guide rod (22) is provided on the driving slide plate (21).

6. A method for assembling a flexible ultra-thin Mini-LED backlight according to claim 1, characterized in that: The assembly method specifically comprises the following steps: Step 1: uniformly welding welding heads (2) on the upper surface of the substrate (1), then welding the LED chip (3) to the corresponding welding head (2), and after the LED chip (3) is welded, fixing the glue frame (10) on the upper surface of the substrate (1); Step 2: After fixing the glue frame (10), add the packaging glue (4) to the substrate (1) so that the packaging glue (4) completely covers the LED chip (3) and the welding head (2), and then install a protective film (5) on the packaging glue (4) so that there is a gap between the protective film (5) and the packaging glue (4); Step 3: After the protective film (5) is installed, the diffusion film (6), the light-enhancing film (7) and the light-enhancing sheet (8) are placed on the protective film (5) in sequence, and the light-enhancing sheet (8) is fixedly connected to the glue frame (10) by light-shielding glue (9), thereby completing the installation on the upper end surface of the substrate (1); Step 4: Weld a plurality of guide rods (22) and guide posts (14) to both sides of the bottom of the base plate (1), and stick the thermal pad (13) to the bottom of the base plate (1). Then, rotate the mounting sleeve (15) on the guide post (14), and install the driving slide (21) on the guide rod (22); Step 5: Before the sleeve (15) is installed on the guide post (14), a torsion spring (16) is first installed on the outside of the sleeve (15), and then a connecting rod (18) and a mounting head (19) are fixedly installed on the bottom of the sleeve (15), and a connecting plate (20) is fixedly installed on the upper part of the sleeve (15). After the sleeve (15) is installed on the guide post (14), the two ends of the torsion spring (16) are fixedly connected to the guide post (14) and the sleeve (15); Step 6: After the sleeve (15) is installed, the connecting plate (20) and the driving slide plate (21) are rotated and installed to complete the installation of the lower end surface of the base plate (1).

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