Heat dissipation structure, display module, electronic device and processing method of display module

Abstract

This application relates to a heat dissipation structure, a display module, an electronic device, and a method for processing the display module. The heat dissipation structure includes a first heat dissipation layer, a support layer, and a second heat dissipation layer. The support layer and the second heat dissipation layer are disposed on the same side of the first heat dissipation layer, and the orthographic projections of the support layer and the second heat dissipation layer onto the first heat dissipation layer do not overlap. The technical solution of this application effectively solves the problem of uneven heat dissipation in existing heat dissipation structures.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display modules, and in particular to a heat dissipation structure, a display module, an electronic device, and a processing method of a display module. BACKGROUND

[0002] With the improvement of people's requirements for vehicle display experience, the form of vehicle display is becoming more and more diversified. Customers propose to use a double curved edge (Edge) form for central control screen design. Currently, there are Edge OLED mobile phone designs. Because the glass cover plate edge is assembled with the middle frame during assembly of the middle frame, the display screen can meet the requirements by pasting a flexible heat dissipation structure (SCF) behind the display screen.

[0003] In vehicle display products, because the screen is large, heavy, and the use scene is limited, in order to meet the strength, heat dissipation, and installation requirements of vehicle products, a support plate (aluminum plate, titanium alloy, etc.) is needed behind the display screen for assembly with the whole machine. Based on the above requirements for strength, heat dissipation, and installation, the existing vehicle display heat dissipation structure brings great challenges to subsequent use. SUMMARY

[0004] The present application provides a heat dissipation structure, a display module, an electronic device, and a processing method of a display module, to solve the problem of uneven heat dissipation of the heat dissipation structure in the prior art.

[0005] To solve the above problems, the present application provides a heat dissipation structure, comprising: a first heat dissipation layer, a support layer, and a second heat dissipation layer, the support layer and the second heat dissipation layer are arranged on the same side of the first heat dissipation layer, and the orthographic projection of the support layer and the second heat dissipation layer on the first heat dissipation layer does not overlap.

[0006] Further, the support layer and the second heat dissipation layer have a gap therebetween, and the gap is between 0.1mm and 0.45mm.

[0007] Further, the thickness of the support layer and the thickness of the second heat dissipation layer are the same.

[0008] Further, the second heat dissipation layer comprises a plurality of heat dissipation sub-layers, and each heat dissipation sub-layer is attached in a superimposed manner.

[0009] Further, the material of each heat dissipation sub-layer is the same, or the materials of the plurality of heat dissipation sub-layers are different.

[0010] Further, the first heat dissipation layer comprises a copper foil layer and a grid adhesive layer, the second heat dissipation layer and the support layer are arranged on the same side of the copper foil layer, and the grid adhesive layer is located on the side of the copper foil layer away from the support layer.

[0011] Further, the first heat dissipation layer further comprises a foam layer, and the foam layer is located between the copper foil layer and the grid adhesive layer.

[0012] According to another aspect of the present application, a display module is also provided, comprising: a heat dissipation structure as described above; a display panel comprising a first region and a second region connected to each other, the second region being capable of being deformed, the heat dissipation structure being attached to the display panel, the first heat dissipation layer being located in the first region and the second region, the support layer being located in the first region, and the second heat dissipation layer being located in the second region.

[0013] Further, a side of the heat dissipation structure away from the support structure is flush with a side of the second region away from the first region in a plane perpendicular to the display module; or a side edge of the heat dissipation structure away from the support structure is closer to the support structure than a side edge of the second region away from the first region.

[0014] Further, the second heat dissipation layer has a predetermined distance from a bending starting point of the second region.

[0015] According to another aspect of the present application, an electronic device is also provided, comprising the display module as described above.

[0016] According to another aspect of the present application, a processing method of a display module is also provided, the display module being as described above, the processing method comprising the following steps: arranging the heat dissipation structure in the second region of the display panel; attaching a carrier film to a side of the heat dissipation structure away from the display panel; and bending the display panel with the heat dissipation structure by applying a force to the carrier film.

[0017] Further, the processing method further comprises the following step after the display panel with the heat dissipation structure is bent: attaching the display panel with the heat dissipation structure after being bent to a flexible printed circuit board.

[0018] The above technical solutions provided by the embodiments of the present application have the following advantages compared with the prior art:

[0019] By applying the technical solutions of the present application, heat dissipation is usually achieved by thermal radiation, heat conduction and heat convection. The support layer and the second heat dissipation layer are arranged on the same side of the first heat dissipation layer, so that the heat dissipation in the area of the support layer and the area of the second heat dissipation layer tends to be consistent, avoiding a large temperature difference between the area of the support layer of the first heat dissipation layer and the area of the first heat dissipation layer where the second heat dissipation layer is arranged. In addition, the orthographic projections of the support layer and the second heat dissipation layer on the first heat dissipation layer do not overlap, so that the support layer and the second heat dissipation layer are less likely to interfere with each other when the heat dissipation structure is bent. The technical solutions of the present application effectively solve the problem of uneven heat dissipation of the heat dissipation structure in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0020] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments consistent with the present application and, together with the description, further serve to explain the principles of the application.

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings can also provide further drawings based on these drawings for those of ordinary skill in the art without any creative effort.

[0022] Figure 1 A structural schematic view of the display module of embodiment one in a flat state is shown.

[0023] Figure 2 A structural schematic view of the second area of the display module of embodiment one in a curved state is shown.

[0024] Figure 3 A structural schematic view of the display panel of the display module of Figure 2 in a curved state is shown.

[0025] Figure 4 A structural schematic view of the display module of embodiment two in a flat state is shown.

[0026] Figure 5 A structural schematic view of the display module of embodiment three in a flat state is shown.

[0027] Figure 6 A structural schematic view of the display module of embodiment four in a flat state is shown.

[0028] Figure 7 A partial structural schematic view of the electronic device of the present application is shown.

[0029] Figure 8 A structural schematic view of the electronic device of Figure 4 from another angle is shown.

[0030] Among the above drawings, the following reference signs are included:

[0031] 10, first heat dissipation layer; 11, copper foil layer; 12, grid adhesive layer; 13, foam layer; 20, support layer; 30, second heat dissipation layer; 31, heat dissipation sub-layer; 40, display panel; 41, first area; 42, second area; 43, back film; 44, back plate; 45, polaroid; 46, lower optical transparent adhesive; 47, touch panel; 48, upper optical transparent adhesive; 50, glass cover plate; 60, pressure-sensitive adhesive layer. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0033] As shown in Figures 1 to 3 , the heat dissipation structure of the first embodiment comprises a first heat dissipation layer 10, a support layer 20 and a second heat dissipation layer 30. The support layer 20 and the second heat dissipation layer 30 are arranged on the same side of the first heat dissipation layer 10, and the orthographic projections of the support layer 20 and the second heat dissipation layer 30 on the first heat dissipation layer 10 do not overlap.

[0034] By applying the technical scheme of the present embodiment, heat dissipation is usually achieved by thermal radiation, heat conduction and heat convection. The support layer 20 and the second heat dissipation layer 30 are arranged on the same side of the first heat dissipation layer 10, so that the heat dissipation in the area of the support layer 20 and the area of the second heat dissipation layer 30 tends to be consistent, avoiding the temperature difference between the area of the support layer 20 of the first heat dissipation layer 10 and the area of the second heat dissipation layer 30 of the first heat dissipation layer 10. In addition, the orthographic projections of the support layer 20 and the second heat dissipation layer 30 on the first heat dissipation layer 10 do not overlap, so that the support layer 20 and the second heat dissipation layer 30 do not easily interfere with each other when the heat dissipation structure is bent. The technical scheme of the present embodiment effectively solves the problem of uneven heat dissipation of the heat dissipation structure in the prior art.

[0035] As shown in Figure 1 and Figure 2 , in the technical scheme of the present embodiment, there is a gap between the support layer 20 and the second heat dissipation layer 30, and the gap is between 0.1mm and 0.45mm. The above-mentioned gap ensures that when the support layer 20 and the second heat dissipation layer 30 are deformed from a flat state to a bent state, the second heat dissipation layer 30 will be deformed, and the support layer 20 and the second heat dissipation layer 30 will not interfere with each other. In addition, the range of the above-mentioned gap distance is also limited by the processing technology and technical level.

[0036] As shown in Figure 1 and Figure 2 , in the technical scheme of the present embodiment, the thickness of the support layer 20 and the thickness of the second heat dissipation layer 30 are the same. This is conducive to eliminating the mold impression and facilitating the next operation. For example, when an external force is applied to the heat dissipation structure to bend the heat dissipation structure, the thickness of the support layer 20 and the thickness of the second heat dissipation layer 30 are the same, which is conducive to the overall adhesion of the carrier film.

[0037] From the above, the processing is relatively convenient, for example, the second area 42 is bent and deformed in the later stage, the attachment is relatively easy, and the influence of the height difference between the second heat dissipation layer 30 and the support layer 20 does not need to be considered, and for example, the support structure behind the support layer 20 and the second heat dissipation layer 30 is relatively convenient to set in the later stage of the process, and the processing cost is relatively low. It should be noted that the above can also be understood as the thickness of the second heat dissipation layer 30 and the support layer 20 is substantially the same, and the thickness of the pressure-sensitive adhesive layer 60 is ignored or the second heat dissipation layer 30 also has a pressure-sensitive adhesive layer 60 with the same thickness.

[0038] As shown in Figure 1 and Figure 2 In the technical scheme of embodiment one, the second heat dissipation layer 30 includes a plurality of heat dissipation sub-layers 31, and each heat dissipation sub-layer 31 is attached in a superimposed manner. The plurality of heat dissipation sub-layers 31 are arranged on one side of the copper foil layer 11, and the grid adhesive layer 12 is located on the side of the copper foil layer 11 away from the support layer 20. The above structure guarantees the uniformity of heat dissipation, and on the other hand, guarantees that the heat dissipation structure is better attached to the display panel 40.

[0039] It should be noted that the materials of the heat dissipation sub-layers 31 are the same, or the materials of the plurality of heat dissipation sub-layers 31 are different. Each heat dissipation sub-layer 31 can be a copper plate, or an aluminum plate, or a graphite layer, or a graphene layer, etc., and can be a copper plate, an aluminum plate, or a plurality of copper plates with an aluminum plate sandwiched therebetween. Regardless of the combination, the temperature of the first area 41 and the temperature of the second area 42 tend to be the same.

[0040] As shown in Figures 1 to 3 In the technical scheme of embodiment one, the first heat dissipation layer 10 includes a copper foil layer 11 and a grid adhesive layer 12, and the second heat dissipation layer 30 and the support layer 20 are arranged on the same side of the copper foil layer 11, and the grid adhesive layer 12 is located on the side of the copper foil layer 11 away from the support layer 20. The above structure guarantees the uniformity of heat dissipation, and on the other hand, guarantees that the heat dissipation structure is better attached to the display panel 40.

[0041] It should be noted that the first heat dissipation layer 10 also includes a foam layer 13, and the foam layer 13 is located between the copper foil layer 11 and the grid adhesive layer 12. The above structure guarantees that the attachment effect of the heat dissipation layer is better. Specifically, the bottom layer of the display panel 40 adopts the structure of EMBO (grid adhesive) + Foam (foam) + Cu foil (copper foil), which can effectively prevent bubbles and mold printing during attachment.

[0042] AsFigure 1 and Figure 2 As shown in the technical scheme of the embodiment, the second heat dissipation layer 30 and the support layer 20 are both plate-shaped structures. It should be noted that the heat dissipation layer has a large contact area with the display panel 40, which is more conducive to heat conduction and heat radiation, and such a structure makes the heat transfer faster.

[0043] It should be noted that the support layer 20 is made of a metal material, which can be aluminum material or Al-Ti alloy or SUS stainless steel, etc. In the technical scheme of the embodiment, the support layer 20 is made of aluminum alloy material, so that the support layer 20 not only has a supporting function but also has a heat dissipation function. The aluminum plate is attached to the non-display surface (the surface of the display panel 40 facing away from the light-emitting side) of the first area 41. Similarly, the heat dissipation layer is also made of a metal material, which has good heat conduction and heat radiation effects. It should be noted that the heat dissipation layer can not only dissipate heat but also support the second area 42 to prevent it from deforming.

[0044] The display module is made by combining the heat dissipation structure of Embodiment One with the display panel 40. The display module includes the heat dissipation structure and the display panel 40. The heat dissipation structure is the heat dissipation structure described above. The display panel 40 includes the first area 41 and the second area 42 connected to each other, the second area 42 is bendable and deformable, the heat dissipation structure is combined with the display panel 40, the first heat dissipation layer 10 is located between the first area 41 and the second area 42, the support layer 20 is located in the first area 41, and the second heat dissipation layer 30 is located in the second area 42.

[0045] The first area 41 of the display panel 40 is supported by the support layer 20, which can dissipate heat from the first area 41 through heat radiation and heat conduction. The second area 42 of the display panel 40 is cooled by the second heat dissipation layer 30, which can also dissipate heat through heat radiation and heat conduction. The above structure allows the first area 41 and the second area 42 to dissipate heat, so that the temperature of the first area 41 and the temperature of the second area 42 tend to be consistent, greatly improving the problem that the temperature of the first area 41 and the temperature of the second area 42 differ greatly in the prior art. The display module with such a structure effectively solves the problem of uneven heat dissipation of the display module in the prior art.

[0046] It should be noted that the display module described above is a display module applied to a vehicle. The first area 41 is a flat area, and the second area 42 is a curved area. The display module is combined with the display panel 40 through the support layer 20 and the second heat dissipation layer 30. Figure 3It can be seen that the second area 42 is located at the edge of the first area 41, and two second areas 42 are respectively located at opposite sides of the first area 41. As other embodiments, the circumferential outer side of the first area 41 is provided with the second area 42, and the second heat dissipation layer 30 is correspondingly provided with the second area 42. The display panel 40 is composed of multiple layers, including a back film 43, a back plate 44, a polarizer 45, a lower optical transparent adhesive 46, a touch panel 47 and an upper optical transparent adhesive 48 in sequence from close to the support layer 20 to far from the support layer 20; and a glass cover plate 50 is arranged on the side of the display panel 40 far from the support layer 20.

[0047] As shown in Figure 1 and Figure 2 , in the technical solution of the embodiment, the side edge of the second heat dissipation layer 30 far from the support layer 20 is closer to the support layer 20 than the side edge of the second area 42 far from the first area 41. That is, the outer edge of the second heat dissipation layer 30 is staggered by a certain distance, which can prevent glue leakage, that is, the adhesive on the second heat dissipation layer 30 is not easy to interfere with the display panel 40. Specifically, the staggered distance in the embodiment is 0.3mm, which prevents glue leakage and does not affect the consistency of heat dissipation. When the second area 42 of the display panel 40 is bent, the edges of the multiple heat dissipation sub-layers 31 are staggered. As other embodiments, when the display module is in a flat state, the side of the second heat dissipation layer 30 far from the support layer 20 is flush with the side of the second area 42 far from the first area 41 in a plane perpendicular to the display module. Such a structure is more conducive to heat dissipation, further reducing the probability of large temperature differences in the display panel 40, that is, the temperatures of each position of the second area 42 of the display panel 40 tend to be consistent, and the temperature of the first area 41 of the display panel 40 and the temperature of the second area 42 of the display panel 40 also tend to be consistent, and the problem of yellowing of the display panel 40 due to uneven temperature is not easy to occur.

[0048] As shown in Figure 1 and Figure 2 , in the technical solution of the embodiment, the second heat dissipation layer 30 has a predetermined distance from the bending starting point of the second area 42. The above-mentioned predetermined distance can meet the needs of processing of the second heat dissipation layer 30 on the one hand, and on the other hand, the above-mentioned structure can also ensure that the second heat dissipation layer 30 and the support layer 20 do not easily interfere with each other when the display panel 40 is bent and deformed.

[0049] Depending on the processing conditions, the predetermined distance is between 0.08mm and 0.35mm. Specifically, the predetermined distance is 0.3mm. This way, when the second heat dissipation layer 30 is multi-layered, and the display panel 40 is in a flat state, the side of the second heat dissipation layer 30 near the support layer 20 is flush with the plane perpendicular to the display panel 40, that is, the distance between the side of the second heat dissipation layer 30 near the support layer 20 and the side of the support layer 20 near the second heat dissipation layer 30 is the same. When the second area 42 of the display panel 40 is in a curved state, the edges of the multi-layer heat dissipation sub-layers 31 are staggered, that is, the edges of the multi-layer heat dissipation sub-layers 31 near the support layer 20 are not in the aforementioned plane.

[0050] In the technical solution of Embodiment 1, there are two second regions 42 and two second heat dissipation layers 30. The two second regions 42 are respectively disposed on opposite sides of the first region 41, and the two second heat dissipation layers 30 are disposed in a one-to-one correspondence with the two second regions 42.

[0051] In the technical solution of Embodiment 1, the display panel 40 is a flexible display panel, and the light-emitting layer can be an OLED (Organic Light-Emitting Diode). OLEDs are current-driven organic light-emitting devices that emit light through the injection and recombination of charge carriers; the luminous intensity is proportional to the injected current. Under the influence of an electric field, holes generated at the anode and electrons generated at the cathode move and are injected into the hole transport layer and electron transport layer, respectively, migrating to the light-emitting layer. When these two elements meet in the light-emitting layer, they generate excitons, thereby exciting the light-emitting molecules to ultimately produce visible light.

[0052] like Figure 4 As shown, the difference between the heat dissipation structure of Embodiment 2 and Embodiment 1 is that the second heat dissipation layer 30 is a plate-like structure. A groove is formed on the side of the plate-like structure facing away from the display panel 40, and the extension direction of the groove is consistent with the bending axis of the second region 42. The groove on the second heat dissipation layer 30 improves heat exchange efficiency because the groove structure increases the plane perpendicular to the surface of the display panel 40, thus increasing the heat dissipation area. Furthermore, the groove on the second heat dissipation layer 30 can reduce the force applied when bending the second region 42.

[0053] In the technical scheme of the second embodiment, the first area 41 of the display panel 40 is supported by the support layer 20, and the support layer 20 supports the first area 41 and radiates heat away from the first area 41 by heat radiation and heat conduction, and the second area 42 of the display panel 40 is radiated by the second radiating layer 30, so that the second area 42 is also radiated by heat radiation and heat conduction. The above structure enables the first area 41 and the second area 42 to be radiated, so that the temperature of the first area 41 and the temperature of the second area 42 tend to be consistent, greatly improving the problem that the temperature of the first area 41 and the temperature of the second area 42 are quite different in the prior art.

[0054] In the technical scheme of the second embodiment, the grooves are arranged in parallel. Such a structure further increases the heat dissipation efficiency of the second area 42. In addition, when the second radiating layer 30 is bent, the stress on the second radiating layer 30 is more uniform. It should be noted that in the technical scheme of the present embodiment, the structures of the grooves are the same, the widths of the grooves are between 0.03 mm and 1 mm, the lengths of the grooves are the same as the length of the bending axis of the second area 42, and the depths of the grooves are between 0.01 mm and 0.8 mm. In other embodiments, the depths of the grooves can also be different.

[0055] In the technical scheme of the second embodiment, the second radiating layer 30 is in a plate structure, which is an integral copper plate, and the side of the copper plate away from the display panel 40 is provided with grooves, and the grooves penetrate the bending axis direction of the copper plate. The side of the second radiating layer 30 close to the support layer 20 has a predetermined distance from the bending starting point of the second area 42. The above predetermined distance can meet the processing needs of the second radiating layer 30. The predetermined distance in the present embodiment is smaller than that in the first embodiment, and the predetermined distance can be 0.1 mm. When the display module is in a flat state, the side of the second radiating layer 30 away from the support layer 20 is closer to the support layer 20 than the side of the second area 42 away from the first area 41. That is, the outer edge of the second radiating layer 30 is inwardly offset by a certain distance, which can prevent glue leakage, that is, the glue on the second radiating layer 30 is not easy to interfere with the display panel 40.

[0056] In the technical scheme of the present embodiment, as another implementable manner, the second radiating layer 30 can be an integral aluminum plate. The use of an aluminum plate can reduce costs, and the specific material to be used can be determined according to the temperature difference between the first area 41 and the second area 42.

[0057] As can be seen from the above, in the technical scheme of the second embodiment, the display module is divided into a flat area and two curved areas opposite to the two sides of the flat area, and the edges of the two curved areas are bent towards the non-display area. The non-display surface of the flat area is attached to an aluminum alloy support layer, and the edge distance between each radiating sub-layer 31 and the support layer 20 is 0.1 mm.

[0058] As shown in Figure 5 , the difference between the technical solution of embodiment three and the technical solution of embodiment two is that the plurality of grooves of embodiment three are symmetrically arranged, the width of the middle groove is larger, and the width of the grooves gradually decreases from the middle groove to the two sides. This is more in line with the use of the second area 42. The width of the groove corresponding to the position where the second area 42 changes relatively large is relatively large, and the width of the groove gradually decreases to the two sides. Such arrangement is more accurate.

[0059] The other structures of embodiment three can be the same as those of embodiment two, and will not be described here.

[0060] As shown in Figure 6 , the technical solution of embodiment four, the second heat dissipation layer 30 includes a metal plate body and a plurality of protrusions arranged on the same surface of the metal plate body. The side of the metal plate body away from the plurality of protrusions is attached to the display panel 40. This further increases the heat dissipation area of the second heat dissipation layer 30.

[0061] In the technical solution of embodiment four, the plurality of protrusions are arranged in an array. Such structure can reduce the force when bending the second area 42. It should be noted that if the bending axis is taken as a row, each row in the array is parallel to the bending axis. When the second area 42 is bent, the counteracting force applied by the second heat dissipation layer 30 is smaller.

[0062] As shown in Figure 7 and Figure 8 , the present application also provides an electronic device. The electronic device includes a display module, and the display module is the display module described above. The display screen of such electronic device has a long service life. As an embodiment of the electronic device, it can be a vehicle-mounted display screen.

[0063] The present application also provides a processing method of a display module. The display module is the display module described above. The processing method includes the following steps: arranging the second heat dissipation layer 30 on the second area 42 of the display panel 40. Attaching the bearing film to the side of the second heat dissipation layer 30 away from the display panel 40. Bending the display panel 40 with the second heat dissipation layer 30 by applying a force to the bearing film. The processing method of the display module described above arranges the display panel 40 with the second heat dissipation layer 30 by arranging the bearing film, and then applies a force to the bearing film. The bearing film drives the display module so that the bending of the second area 42 reaches the predetermined bending curvature. Such method ensures that the second area 42 is stressed relatively uniformly when it is bent and deformed. More importantly, the display module is relatively precise, and the force applied by the method will not damage the display module. According to the needs, when bending the vehicle-mounted display module, the display module is bent into a predetermined bending shape according to the needs.

[0064] The processing method of the display module of the present application further sequentially comprises the following steps before the second heat dissipation layer 30 is arranged on the second area 42 of the display panel 40: bonding of the polarizer → cutting of the pad area → bonding of the chip on film → bonding of the PCB board → cutting of the outer shape → bonding of the lower optical transparent adhesive → bonding of the cover plate, the top optical transparent adhesive and the touch screen on the lower optical transparent adhesive. On the one hand, the processing method of the display panel 40 ensures the processing precision of the display module, and on the other hand, the processing method avoids repeated processing steps, which has the beneficial effect of saving manpower and material resources.

[0065] In the processing method of the display module of the present application, after the display panel 40 with the second heat dissipation layer 30 is bent, the display panel 40 with the second heat dissipation layer 30 after bending is bonded on the flexible printed circuit board.

[0066] It should be noted that in this document, relational terms such as“first” and“second”, and the like, are used solely to distinguish one entity or action from another entity or action, without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms“comprises”,“comprising”, or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element preceded by“comprises... a” does not, without more constraints, foreclose the existence of additional identical elements in the process, method, article, or apparatus that comprises the recited element.

[0067] The above description is merely one specific implementation of the application, and thus the skilled in the art will be able to understand or implement the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Accordingly, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation structure, characterized in that, The display module comprises: a first heat dissipation layer (10), a support layer (20) and a second heat dissipation layer (30), the support layer (20) and the second heat dissipation layer (30) are arranged on the same side of the first heat dissipation layer (10), the support layer (20) and the second heat dissipation layer (30) are arranged in a horizontal direction, and the orthographic projections of the support layer (20) and the second heat dissipation layer (30) on the first heat dissipation layer (10) do not overlap; the support layer (20) and the second heat dissipation layer (30) have a gap therebetween, and the gap is between 0.1 mm and 0.45 mm; the thickness of the support layer (20) is the same as the thickness of the second heat dissipation layer (30); wherein the support layer (20) is arranged in a first area (41) of the display panel, the second heat dissipation layer (30) is arranged in a second area (42) of the display panel, the first heat dissipation layer (10) is located between the first area (41) and the second area (42), the first area (41) is a flat area of the display panel, and the second area (42) is a curved area of the display panel.

2. The heat dissipating structure according to claim 1, wherein The second heat dissipation layer (30) comprises a plurality of heat dissipation sub-layers (31), and each heat dissipation sub-layer (31) is arranged in a stacked manner.

3. The heat dissipating structure according to claim 2, wherein The material of each heat dissipation sub-layer (31) is the same, or the materials of the plurality of heat dissipation sub-layers (31) are different.

4. The heat dissipating structure according to claim 1, wherein The first heat dissipation layer (10) comprises a copper foil layer (11) and a grid adhesive layer (12), the second heat dissipation layer (30) and the support layer (20) are arranged on the same side of the copper foil layer (11), and the grid adhesive layer (12) is located on the side of the copper foil layer (11) away from the support layer (20).

5. The heat dissipating structure according to claim 4, wherein The first heat dissipation layer (10) further comprises a foam layer (13), and the foam layer (13) is located between the copper foil layer (11) and the grid adhesive layer (12).

6. A display module, characterized by The display module comprises: a heat dissipation structure as claimed in any one of claims 1 to 5; a display panel (40) comprising a first area (41) and a second area (42) connected to each other, the second area (42) being capable of being deformed in a curved manner, the heat dissipation structure being arranged in a stacked manner with the display panel (40), the first heat dissipation layer (10) being located between the first area (41) and the second area (42), the support layer (20) being located in the first area (41), and the second heat dissipation layer (30) being located in the second area (42).

7. The display module of claim 6, wherein, The side of the second heat dissipation layer (30) away from the support layer (20) is flush with the side of the second area (42) away from the first area (41) in a plane perpendicular to the display module; or the side of the second heat dissipation layer (30) away from the support layer (20) is closer to the support layer (20) than the side of the second area (42) away from the first area (41).

8. The display module of claim 6, wherein, The second heat dissipation layer (30) is at a predetermined distance from the starting point of the bending of the second area (42).

9. An electronic device, comprising: The display module comprises:

10. A processing method of a display module, characterized by, the display module as claimed in any one of claims 6 to 8. The display module as claimed in any one of claims 6 to 8, and the processing method comprises the following steps: A second heat dissipation layer (30) is provided in a second area (42) of a display panel (40); A carrier film is attached to a side of the second heat dissipation layer (30) away from the display panel (40); The display panel (40) with the second heat dissipation layer (30) is bent by applying a force to the carrier film.

11. The method of claim 10, wherein the display module is a liquid crystal display module. The display panel (40) with the second heat dissipation layer (30) is attached to a flexible printed circuit board after being bent.

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