A packaging structure

Abstract

The application discloses a packaging structure, which comprises a substrate, a light-emitting unit located on one side of the substrate, a water-blocking layer located on a side of the light-emitting unit away from the substrate and covering the light-emitting unit, a water-vapor flow-guiding layer located on a side of the water-blocking layer away from the light-emitting unit, a barrier adhesive layer located on a side of the water-vapor flow-guiding layer away from the water-blocking layer, and a barrier film layer located on a side of the barrier adhesive layer away from the water-vapor flow-guiding layer. The water-vapor flow-guiding layer is used for absorbing water vapor in the packaging structure, and the barrier adhesive layer is used for absorbing water vapor in the water-vapor flow-guiding layer. The packaging structure provided by the application can reduce or prevent water vapor from flowing to the water-blocking layer, and the reliability of the packaging structure is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of device packaging, and in particular to a packaging structure. Background Art

[0002] Organic Light Emitting Diodes (OLEDs) are optoelectronic devices that emit light through carrier injection and recombination. The specific process is that electrons are injected through the cathode and transported to the light-emitting layer via an electron-transporting material. Holes are injected through the anode and transported to the light-emitting layer via a hole-transporting material. The electrons and holes recombine in the light-emitting layer to form excitons, which then de-excite to emit light. OLEDs have attracted considerable attention for their uniform emission, thinness, bendability, flexibility, and stretchability. However, OLEDs are extremely sensitive to water and oxygen, necessitating packaging. Currently, the mainstream packaging method is thin-film packaging. The packaging structure used in automotive and TV OLED displays consists of a water-blocking layer, a barrier adhesive layer, and metal foil. This packaging structure presents a significant problem: when water vapor intrudes through the interface between the barrier adhesive layer and the water-blocking layer, it flows in both directions, toward the barrier adhesive and the water-blocking layer. Over time, the water vapor can corrode the OLED through the barrier adhesive, rendering it incapable of emitting light. Summary of the Invention

[0003] The packaging structure provided by the embodiment of the present invention can reduce or prevent water vapor from flowing toward the water-blocking layer, thereby improving the reliability of the packaging structure.

[0004] The present invention provides a packaging structure, which includes:

[0005] substrate;

[0006] a light emitting unit, located on one side of the substrate;

[0007] a water-blocking layer, located on a side of the light-emitting unit away from the substrate and covering the light-emitting unit;

[0008] a water vapor guiding layer, located on a side of the water blocking layer away from the light emitting unit;

[0009] a barrier adhesive layer, located on a side of the water vapor guiding layer away from the water blocking layer;

[0010] a barrier film layer, located on a side of the barrier adhesive layer away from the water vapor guide layer;

[0011] The water vapor guide layer is used to absorb water vapor in the packaging structure;

[0012] The barrier adhesive layer is used to absorb water vapor in the water vapor guide layer.

[0013] Optionally, the water vapor guide layer includes a water vapor guide sublayer or at least two stacked water vapor guide sublayers;

[0014] The water vapor guide layer includes pores;

[0015] When the water vapor guide layer includes at least two stacked water vapor guide sub-layers, the water vapor guide layer is used to guide the water vapor in the packaging structure into the barrier adhesive layer.

[0016] Optionally, when the water vapor guide layer includes at least two stacked water vapor guide sublayers, the pores of the water vapor guide sublayer decrease layer by layer along the direction from the water blocking layer to the barrier adhesive layer, the hydrophilicity of the water vapor guide sublayer increases layer by layer, and the surface energy of the water vapor guide sublayer increases layer by layer.

[0017] Optionally, the thickness of the water vapor guide layer is 100 nm to 10 μm.

[0018] Optionally, the material of the water vapor guide layer includes at least one of bionic gold, urethane compounds, aldehyde compounds, olefin compounds, aromatic hydrocarbon compounds, polyester compounds, epoxy compounds, silicon oxide, silicon oxynitride and titanium oxide.

[0019] Optionally, the pore size of the water vapor guide layer is 5 nm to 10 μm.

[0020] Optionally, the material of the barrier rubber layer includes polyolefin or rubber;

[0021] The barrier adhesive layer is doped with water-absorbing material.

[0022] Optionally, the water-absorbing material includes metal oxides, metal salts or organic metal oxides.

[0023] Optionally, the material of the barrier film layer includes titanium, aluminum, copper, iron or an alloy.

[0024] Optionally, the barrier film layer includes an organic sublayer and an inorganic water-blocking sublayer;

[0025] The organic sublayer is located on a side of the barrier adhesive layer away from the water vapor guide layer;

[0026] The inorganic water-blocking sub-layer is located on a side of the organic sub-layer away from the barrier adhesive layer;

[0027] The material of the organic sublayer includes polyethylene terephthalate plastic, polyimide or polyethylene naphthalate;

[0028] The material of the inorganic water-blocking sub-layer includes at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride and silicon oxynitride.

[0029] This embodiment provides a packaging structure in which a vapor-guiding layer is located on the side of the water-blocking layer away from the light-emitting unit. The vapor-guiding layer absorbs moisture within the packaging structure, reducing or preventing the flow of moisture toward the water-blocking layer, thereby preventing the intrusion of moisture into the light-emitting unit. A barrier adhesive layer located on the side of the vapor-guiding layer away from the water-blocking layer absorbs moisture from the vapor-guiding layer, thereby rapidly moving moisture away from the water-blocking layer and allowing the vapor-guiding layer to absorb even more moisture. The packaging structure provided by this embodiment reduces or prevents the flow of moisture toward the water-blocking layer, thereby improving the reliability of the packaging structure.

[0030] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 is a structural diagram of a packaging structure provided according to an embodiment of the present invention;

[0033] Figure 2 is a structural schematic diagram of another packaging structure provided according to an embodiment of the present invention;

[0034] Figure 3 is a structural schematic diagram of another packaging structure provided according to an embodiment of the present invention;

[0035] Figure 4 3 is a structural diagram of another packaging structure provided according to an embodiment of the present invention. DETAILED DESCRIPTION

[0036] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0037] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0038] Figure 1 is a schematic diagram of a packaging structure provided according to an embodiment of the present invention, with reference to Figure 1 The packaging structure provided in this embodiment includes: a substrate 110; a light-emitting unit 120, located on one side of the substrate 110; a water-blocking layer 130, located on a side of the light-emitting unit 120 away from the substrate 110, and covering the light-emitting unit 120; a water vapor guide layer 140, located on a side of the water-blocking layer 130 away from the light-emitting unit 120; a barrier adhesive layer 150, located on a side of the water vapor guide layer 140 away from the water-blocking layer 130; a barrier film layer 160, located on a side of the barrier adhesive layer 150 away from the water vapor guide layer 140; the water vapor guide layer 140 is used to absorb water vapor in the packaging structure; and the barrier adhesive layer 150 is used to absorb water vapor in the water vapor guide layer 140.

[0039] Specifically, substrate 110 can be a flexible substrate or a rigid substrate. When substrate 110 is a flexible substrate, the material of substrate 110 can be an organic polymer such as polyethylene terephthalate plastic, polyimide, or polyethylene naphthalate. When substrate 110 is a rigid substrate, substrate 110 can be glass. Light-emitting unit 120 includes a first electrode 121, a light-emitting layer 122, and a second electrode 123, which are stacked in sequence. First electrode 121 can be either a cathode or an anode, and second electrode 123 can be either a cathode or an anode. When first electrode 121 is a cathode, second electrode 123 is an anode. The anode material includes indium tin oxide (ITO) and / or indium zinc oxide (IZO), and the cathode material is one or more metal materials such as Ag, Mg, Al, Ca, and Ba. The function of the water-blocking layer 130 is to block water and oxygen. The material of the water-blocking layer 130 includes any one of silicon nitride, silicon oxide, silicon oxynitride, epoxy resin or polyolefin, or a combination of at least two of them. The preparation method of the water-blocking layer 130 can be one or a mixture of atomic layer deposition, plasma-enhanced chemical vapor deposition, inkjet printing, screen printing or sputtering.

[0040] The water vapor guide layer 140 can be prepared by spin coating, slit coating, inkjet printing, etc. The water vapor guide layer 140 is located on the side of the water blocking layer 130 away from the light-emitting unit 120. The specific structure can be that the water vapor guide layer 140 covers the water blocking layer 130, and the barrier adhesive layer 150 is located on the side of the water vapor guide layer 140 away from the water blocking layer 130. The specific structure can be that the barrier adhesive layer 150 covers the water vapor guide layer 140.

[0041] Optional, Figure 2 is a schematic diagram of another packaging structure provided according to an embodiment of the present invention, with reference to Figure 2 The water vapor guiding layer 140 is located on the side of the water blocking layer 130 away from the light-emitting unit 120. The specific structure can be that the water vapor guiding layer 140 covers part of the water blocking layer 130 and the edge of the water vapor guiding layer 140 does not contact the substrate 110. The barrier adhesive layer 150 is located on the side of the water vapor guiding layer 140 away from the water blocking layer 130. The specific structure can be that the barrier adhesive layer 150 covers the water vapor guiding layer 140.

[0042] The moisture guide layer 140 absorbs moisture within the packaging structure, reducing or preventing the flow of moisture toward the water-blocking layer 130 , thereby preventing the intrusion of moisture into the light-emitting unit 120 and, consequently, protecting the light-emitting unit 120 from damage caused by moisture erosion. The moisture guide layer 140 can be physically absorbent. For example, the material of the moisture guide layer 140 can be porous, enabling the moisture guide layer 140 to rapidly absorb moisture within the packaging structure.

[0043] The barrier adhesive layer 150 and the barrier film layer 160 can prevent external water and oxygen from corroding the light-emitting unit 120. A water-absorbing material can be added to the barrier adhesive layer 150 to allow the barrier adhesive layer 150 to absorb water vapor from the water vapor guide layer 140. Arranging the barrier adhesive layer 150 to absorb water vapor within the water vapor guide layer 140 can, on the one hand, accelerate the flow of water vapor away from the water-blocking layer 130. On the other hand, when the water vapor guide layer 140 is saturated with water, it can no longer absorb water vapor. However, after the barrier adhesive layer 150 absorbs water vapor from the water vapor guide layer 140, the water vapor guide layer 140 can continue to absorb water vapor within the packaging structure, further reducing or preventing the flow of water vapor toward the water-blocking layer 130.

[0044] It should be noted that in this embodiment, after the barrier adhesive layer 150 absorbs water vapor from the water vapor guiding layer 140, it undergoes a chemical reaction with the water vapor. That is, the water vapor does not exist as water molecules after entering the barrier adhesive layer 150. Therefore, the water vapor guiding layer 140 does not absorb the water vapor from the barrier adhesive layer 150. After entering the water vapor guiding layer 140, the water vapor exists as water molecules.

[0045] This embodiment provides a packaging structure in which a vapor-guiding layer is located on the side of the water-blocking layer away from the light-emitting unit. The vapor-guiding layer absorbs moisture within the packaging structure, reducing or preventing the flow of moisture toward the water-blocking layer, thereby preventing the intrusion of moisture into the light-emitting unit. A barrier adhesive layer located on the side of the vapor-guiding layer away from the water-blocking layer absorbs moisture from the vapor-guiding layer, thereby rapidly moving moisture away from the water-blocking layer and allowing the vapor-guiding layer to absorb even more moisture. The packaging structure provided by this embodiment reduces or prevents the flow of moisture toward the water-blocking layer, thereby improving the reliability of the packaging structure.

[0046] Optionally, the water vapor guide layer includes a water vapor guide sublayer or at least two stacked water vapor guide sublayers; the water vapor guide sublayer includes pores; when the water vapor guide layer includes at least two stacked water vapor guide sublayers, the water vapor guide layer is used to guide the water vapor in the packaging structure to the barrier adhesive layer.

[0047] Specifically, the vapor diversion layer includes pores, allowing it to quickly absorb moisture from the packaging structure. Porosity is a material property, and its size depends on the material type. The size of the pores in the vapor diversion layer can be controlled by selecting different materials. When the vapor diversion layer includes a sub-vapor diversion layer, this sub-vapor diversion layer can absorb moisture from the packaging structure while still reducing or preventing the flow of moisture to the water-blocking layer. Figure 3 is a structural diagram of another packaging structure provided according to an embodiment of the present invention. Figure 3 The structure shown is that the water vapor guide layer 140 includes at least two layers of water vapor guide sub-layers 141 stacked together. Figure 3 When the water vapor guiding layer 140 includes at least two stacked water vapor guiding sublayers 141, since each water vapor guiding sublayer 141 includes pores, the pore sizes of the different water vapor guiding sublayers 141 can be varied based on the capillary principle, allowing the water vapor guiding layer 140 to guide water vapor within the packaging structure to the barrier adhesive layer 150. The capillary principle allows water vapor to flow from areas with larger pores to areas with smaller pores. Therefore, the pore sizes of the water vapor guiding sublayers 141 can be gradually reduced in the direction from the water-blocking layer 130 toward the barrier adhesive layer 150. This allows the water vapor within the water vapor guiding layer 140 to move toward the barrier adhesive layer 150, ultimately allowing the water vapor guiding layer 140 to guide the water vapor within the packaging structure to the barrier adhesive layer 150.

[0048] Optionally, when the water vapor guide layer includes at least two stacked water vapor guide sub-layers, the pores of the water vapor guide sub-layers decrease layer by layer along the direction from the water-blocking layer to the barrier adhesive layer, the hydrophilicity of the water vapor guide sub-layers increases layer by layer, and the surface energy of the water vapor guide sub-layers increases layer by layer.

[0049] Specifically, along the direction from the water-blocking layer to the barrier adhesive layer, as the pore size decreases, the capillary force increases, causing water vapor to flow toward the side with smaller pores. At the same time, the surface energy increases from small to large, and the hydrophilicity increases layer by layer, further providing power for the flow of water vapor and accelerating the speed at which water vapor enters the barrier adhesive layer.

[0050] Optionally, the thickness of the water vapor guide layer is 100 nm to 10 μm.

[0051] Specifically, if the thickness of the water vapor guide layer is less than 100 nm, the water absorption of the water vapor guide layer becomes weak. If the thickness of the water vapor guide layer is greater than 10 μm, it is not convenient for the barrier adhesive layer to be attached, and the volume of the packaging structure will increase. Therefore, setting the thickness of the water vapor guide layer to 100 nm to 10 μm can ensure the water absorption of the water vapor guide layer without excessively increasing the volume of the packaging structure.

[0052] Optionally, the material of the water vapor guide layer includes at least one of bionic gold, urethane compounds, aldehyde compounds, olefin compounds, aromatic hydrocarbon compounds, polyester compounds, epoxy compounds, silicon oxide, silicon oxynitride and titanium oxide.

[0053] Specifically, materials such as bionic gold, urethane compounds, aldehyde compounds, olefin compounds, aromatic hydrocarbon compounds, polyester compounds, epoxy compounds, silicon oxide, silicon oxynitride and titanium oxide have pores and strong water absorption. Using these materials to make a water vapor guide layer can enable the water vapor guide layer to quickly absorb water vapor in the packaging structure.

[0054] Optionally, the pore size of the water vapor guiding layer is 5 nm to 10 μm.

[0055] Specifically, the pore size of the water vapor guide layer is 5 nm to 10 μm, which can improve the water absorption of the water vapor guide layer.

[0056] Optionally, the material of the barrier adhesive layer includes polyolefin or rubber; and the barrier adhesive layer is doped with water-absorbing material.

[0057] Specifically, polyolefins and rubber are readily available and low-cost. Using polyolefins or rubber to form the barrier layer can reduce the cost of the packaging structure. Furthermore, both polyolefins and rubber can block the intrusion of water and oxygen. Doping the barrier layer with a water-absorbing material allows it to absorb water vapor from the vapor diversion layer.

[0058] Optionally, the water-absorbing material includes metal oxides, metal salts or organic metal oxides.

[0059] Specifically, the metal oxide includes phosphorus pentoxide (P2O5), lithium oxide (Li2O), sodium oxide (Na2O), barium oxide (BaO), calcium oxide (CaO) or magnesium oxide (MgO). Metal salts include sulfates, metal halides, and metal chlorates. Sulfates include lithium sulfate (Li2SO4), sodium sulfate (Na2SO4), calcium sulfate (CaSO4), magnesium sulfate (MgSO4), cobalt sulfate (CoSO4), titanium gallium sulfate (Ti(SO4)2), and nickel sulfate (NiSO4). Metal halides include magnesium chloride (MgCl2), strontium chloride (SrCl2), yttrium chloride (YCl3), copper chloride (CuCl2), cesium fluoride (CsF), tantalum fluoride (TaF5), lithium bromide (LiBr), calcium bromide (CaBr2), cesium bromide (CeBr3), selenium bromide (SeBr4), and vanadium bromide (VBr3). Metal chlorates include barium perchlorate (Ba(ClO4)2) and magnesium perchlorate (Mg(ClO4)2). The water-absorbing material in this embodiment can be at least one of the above materials.

[0060] Optionally, the material of the barrier film layer includes titanium, aluminum, copper, iron or an alloy.

[0061] Specifically, the barrier film layer can generally be used as the encapsulation layer of the encapsulation structure. The barrier film layer is made of titanium, aluminum, copper, iron or an alloy, so that the barrier film layer can better protect the light-emitting unit.

[0062] Optional, Figure 4 is a schematic diagram of another packaging structure provided according to an embodiment of the present invention, with reference to Figure 4 The barrier film layer 160 includes an organic sublayer 161 and an inorganic water-blocking sublayer 162; the organic sublayer 161 is located on the side of the barrier adhesive layer 150 away from the water vapor guide layer 140; the inorganic water-blocking sublayer 162 is located on the side of the organic sublayer 161 away from the barrier adhesive layer 150; the material of the organic sublayer 161 includes polyethylene terephthalate plastic, polyimide or polyethylene naphthalate; the material of the inorganic water-blocking sublayer 162 includes at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride and silicon oxynitride.

[0063] Specifically, the organic sub-layer 161 and the inorganic water-blocking sub-layer 162 both have the function of blocking the invasion of water and oxygen from the outside, thereby protecting the light-emitting unit 120 from being corroded by water and oxygen.

[0064] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0065] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A packaging structure, characterized in that: include: substrate; a light emitting unit, located on one side of the substrate; a water-blocking layer, located on a side of the light-emitting unit away from the substrate and covering the light-emitting unit; a water vapor guiding layer, located on a side of the water blocking layer away from the light emitting unit; a barrier adhesive layer, located on a side of the water vapor guiding layer away from the water blocking layer; a barrier film layer, located on a side of the barrier adhesive layer away from the water vapor guide layer; The water vapor guide layer is used to absorb water vapor in the packaging structure; The barrier adhesive layer is used to absorb water vapor in the water vapor guide layer; Wherein, the water vapor guide layer includes a water vapor guide sublayer or at least two stacked water vapor guide sublayers; The water vapor guide layer includes pores; When the water vapor guide layer includes at least two stacked water vapor guide sub-layers, the water vapor guide layer is used to guide the water vapor in the packaging structure to the barrier adhesive layer; Along the direction from the water-blocking layer to the barrier adhesive layer, the pores of the water vapor guide layer decrease layer by layer.

2. The packaging structure according to claim 1, wherein: When the water vapor guide layer includes at least two stacked water vapor guide sublayers, the hydrophilicity of the water vapor guide sublayer increases layer by layer along the direction from the water blocking layer to the barrier adhesive layer, and the surface energy of the water vapor guide sublayer increases layer by layer.

3. The packaging structure according to claim 1, wherein: The thickness of the water vapor guide layer is in the range of 100 nm to 10 μm.

4. The packaging structure according to claim 1, wherein: The material of the water vapor guide layer includes at least one of bionic gold, urethane compounds, aldehyde compounds, olefin compounds, aromatic hydrocarbon compounds, polyester compounds, epoxy compounds, silicon oxide, silicon oxynitride and titanium oxide.

5. The packaging structure according to claim 1, wherein: The pore size of the water vapor guiding layer is within a range of 5 nm to 10 μm.

6. The packaging structure according to claim 1, wherein: The material of the barrier rubber layer includes polyolefin or rubber; The barrier adhesive layer is doped with water-absorbing material.

7. The packaging structure according to claim 6, wherein: The water-absorbing material includes metal oxides, metal salts or organic metal oxides.

8. The packaging structure according to claim 1, wherein: The material of the barrier film layer includes titanium, aluminum, copper, iron or alloy.

9. The packaging structure according to claim 1, wherein: The barrier film layer includes an organic sublayer and an inorganic water-blocking sublayer; The organic sublayer is located on a side of the barrier adhesive layer away from the water vapor guide layer; The inorganic water-blocking sub-layer is located on a side of the organic sub-layer away from the barrier adhesive layer; The material of the organic sublayer includes polyethylene terephthalate plastic, polyimide or polyethylene naphthalate; The material of the inorganic water-blocking sub-layer includes at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride and silicon oxynitride.

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