Dual-pulse power system with independent voltage and timing control and reduced power consumption

Abstract

Systems, apparatus, methods, and computer program products are provided for controlling a laser source comprising two laser discharge chambers. An example laser control system may include a first pulsed dynamic system including a first independent circuit configured to generate a first resonant charge supply (RCS) output voltage. The first RCS output voltage can be configured to drive the first laser discharge chamber. The example laser control system may also include a second pulsed dynamic system including a second independent circuit configured to generate a second RCS output voltage independent of the first RCS output voltage. The second RCS output voltage can be configured to drive a second laser discharge chamber independent of the first laser discharge chamber.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Application No. 62 / 955,620, filed December 31, 2019, entitled “DUAL PULSED POWER SYSTEM WITHINDEPENDENT VOLTAGE AND TIMING CONTROL AND REDUCED POWERCONSUMPTION”, which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to systems and methods for controlling laser sources used in, for example, lithography equipment and systems. Background Technology

[0004] A photolithography apparatus is a machine that applies a desired pattern onto a substrate (typically onto a target portion of the substrate). Photolithography apparatuses can be used, for example, in the fabrication of integrated circuits (ICs). In this case, a patterning apparatus (or mask or photomask) can be used to generate a circuit pattern to be formed on a single layer of the IC. This pattern can then be transferred onto a target portion (e.g., a portion comprising one or more dies) on a substrate (e.g., a silicon wafer). The transfer of the pattern is typically via imaging onto a layer of radiation-sensitive material (resist) disposed on the substrate. Typically, a single substrate will contain a network of adjacent target portions patterned sequentially. Conventional photolithography apparatuses include: a so-called stepper, in which each target portion is irradiated by exposing the entire pattern onto the target portion at once; and a so-called scanner, in which each target portion is irradiated by scanning the pattern with a radiation beam in a given direction (scanning direction) while simultaneously scanning the target portion parallel or antiparallel to that scanning direction. A pattern can also be transferred from a patterning apparatus to a substrate by imprinting the pattern onto the substrate.

[0005] A laser source can be used with photolithography equipment to generate radiation for irradiating a patterning apparatus. The laser source may include a dual-pulse dynamic system to drive two separate laser discharge chambers for generating and amplifying the laser beam used in the photolithography equipment. A system and method for controlling the laser source and its dual dynamic system are needed. Summary of the Invention

[0006] This disclosure describes various aspects of systems, apparatus, methods, and computer program products for controlling laser sources and their power systems, such as dual-pulse power systems with independent voltage and timing control and, in some cases, reduced power consumption. In some aspects, this disclosure provides independent voltage control for each power system. In some aspects, this disclosure provides independent control of each pulse power system to allow three operating modes: (i) single-pulse power system operation; (ii) synchronous dual-output with independent voltage operation; or (iii) interleaved dual-output with independent voltage operation. In some aspects, this disclosure provides single-channel operation to allow “soft-landing” or “limp” performance or capability to serve one power system while the other remains operational. In some aspects, this disclosure provides single-channel operation to allow for lower power consumption and reduced lifetime.

[0007] In some aspects, this disclosure describes a laser control system. The laser control system may include a first pulsed dynamic system including a first independent circuit configured to generate a first resonant charge supply (RCS) output voltage. The first RCS output voltage may be configured to drive a first laser discharge chamber. The laser control system may also include a second pulsed dynamic system including a second independent circuit configured to generate a second RCS output voltage independent of the first RCS output voltage. The second RCS output voltage may be configured to drive a second laser discharge chamber independent of the first laser discharge chamber.

[0008] In some aspects, this disclosure describes an apparatus. The apparatus may include a first pulsed dynamic system including a first independent circuit configured to generate a first RCS output voltage. The first RCS output voltage may be configured to drive a first laser discharge chamber. The apparatus may also include a second pulsed dynamic system including a second independent circuit configured to generate a second RCS output voltage independent of the first RCS output voltage. The second RCS output voltage may be configured to drive a second laser discharge chamber independent of the first laser discharge chamber.

[0009] In some aspects, this disclosure describes a method for manufacturing an apparatus. The method may include providing a first pulsed dynamic system including a first independent circuit configured to generate a first RCS output voltage. The first RCS output voltage may be configured to drive a first laser discharge chamber. The method may also include providing a second pulsed dynamic system including a second independent circuit configured to generate a second RCS output voltage independent of the first RCS output voltage. The second RCS output voltage may be configured to drive a second laser discharge chamber independent of the first laser discharge chamber. The method may further include forming a laser control system including the first and second pulsed dynamic systems.

[0010] Other features, as well as the structure and operation of each aspect, are described in detail below with reference to the accompanying drawings. It should be noted that this disclosure is not limited to the specific aspects described herein. Such aspects are presented herein for illustrative purposes only. Additional aspects will be apparent to those skilled in the art based on the teachings contained herein. Attached Figure Description

[0011] The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate the present disclosure and, together with the description, further serve to explain the principles of aspects of the present disclosure and to enable those skilled in the art to make and use aspects of the present disclosure.

[0012] Figure 1A This is a schematic diagram of an example reflective lithography apparatus based on some aspects of this disclosure.

[0013] Figure 1B This is a schematic diagram of an example transmission lithography apparatus based on some aspects of this disclosure.

[0014] Figure 2 Based on some aspects of this disclosure Figure 1A A more detailed schematic diagram of the reflective lithography apparatus shown.

[0015] Figure 3 This is a schematic diagram of an example photolithography unit based on some aspects of this disclosure.

[0016] Figure 4 This is a schematic diagram of an example laser source, including an example laser control system, according to some aspects of this disclosure.

[0017] Figure 5 This is a schematic diagram of another example laser source, including another example laser control system, according to some aspects of this disclosure.

[0018] Figure 6This is a schematic diagram of yet another example laser source, including yet another example laser control system, according to some aspects of this disclosure.

[0019] Figure 7 It is a flowchart illustrating an example of a method for manufacturing an apparatus or its(multiple) parts according to some aspects of this disclosure.

[0020] Figure 8 It is an example computer system for implementing some aspects or more parts of this disclosure.

[0021] The features and advantages of this disclosure will become more apparent from the specific embodiments set forth below in conjunction with the accompanying drawings, in which similar reference numerals consistently identify corresponding elements. In the drawings, unless otherwise stated, similar reference numerals generally denote identical, functionally similar, and / or structurally similar elements. Additionally, typically, the leftmost(s) of the reference numerals identifies the drawing in which the reference numeral first appears. Unless otherwise stated, the drawings provided throughout this disclosure should not be construed as being drawn to scale. Detailed Implementation

[0022] This specification discloses one or more embodiments incorporating the features of this disclosure. The disclosed embodiments(s) are merely illustrative of this disclosure. The scope of this disclosure is not limited to the disclosed embodiments(s). The breadth and scope of this disclosure are defined by the appended claims and their equivalents.

[0023] The described embodiments and references to "an embodiment," "embodiment," "example embodiment," etc., in the specification indicate that the described embodiments may include a particular feature, structure, or characteristic, but each embodiment may not necessarily include that particular feature, structure, or characteristic. Furthermore, these phrases do not necessarily refer to the same embodiment. Additionally, when a particular feature, structure, or characteristic is described in connection with embodiments, it should be understood that, whether explicitly described or not, incorporating other embodiments to affect that feature, structure, or characteristic is within the knowledge of those skilled in the art.

[0024] For ease of description, spatially relative terms such as “below,” “under,” “down,” “above,” “over,” and “up” may be used herein to describe the relationship between one element or feature shown in the figures and another element(s) or feature(s). In addition to the orientations depicted in the figures, spatially relative terms are intended to cover different orientations of the device in use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein may be interpreted accordingly.

[0025] As used herein, the term “about” indicates the value of a given quantity that can vary based on a particular technique. Based on a particular technique, the term “about” can mean the value of a given quantity that varies within, for example, 10-30% of the value (e.g., ±10%, ±20%, or ±30% of the value).

[0026] Overview

[0027] Conventional pulsed power systems in deep ultraviolet (DUV) lithography equipment have dual power systems to drive the laser discharge chamber. By design, each pulsed power system is typically controlled to the same operating voltage and synchronously triggered to allow operation of the master oscillator power amplifier (MOPA) and master oscillator power ring amplifier (MOPRA) lasers.

[0028] The pulsed power system may include a high-voltage power supply, a resonant charge supply, a master oscillator (MO) commutator, an MO compressor head, a power amplifier (PA) or power ring amplifier (PRA) commutator, a PA or PRA compressor head, an MO laser discharge chamber, and a PA or PRA laser discharge chamber. Auxiliary components may include: a laser control system configured to provide voltage and timing control to the pulsed power system; and an input stage subrack and power distribution system configured to manage AC and DC power to the pulsed power system.

[0029] In addition, the pulsed power system may include a blower system for each laser discharge chamber, driven by a master / slave blower motor controller. During normal operation, both blower systems are energized and operate at a target blower speed. The blower system may include: a blower motor controller (BMC) with master and slave outputs; a master blower motor (MO); a slave blower motor (MO); a master blower motor (PA or PRA); and a slave blower motor (PA or PRA). The pulsed power system may also include a heater and cooling subsystem for each laser discharge chamber to help maintain optimal chamber temperature during operation and idle periods.

[0030] Driving MO and PA or PRA laser discharge chambers with the same voltage is advantageous in terms of timing control and synchronization, but this can have several drawbacks. For example, MO and PA or PRA laser discharge chambers are designed for their specific applications (e.g., as master oscillators, power amplifiers, or power ring amplifiers, respectively). The operating conditions of each application can benefit from the ability to independently control the voltage and associated timing of the pulsed power system for each laser discharge chamber. However, conventional timing control systems only allow for independent timing control of dual-chamber systems. Decoupling the voltage control of the pulsed power system for each laser discharge chamber can provide benefits to the performance, reliability, and lifetime of the system, subsystems, and components included or associated with them. Decoupled voltage control can also be beneficial for laser source designs requiring single-channel operation, interleaved excitation, synchronous excitation, and / or simultaneous excitation.

[0031] Current pulsed power systems require charging and discharging of each pulsed dynamic system and close timing differences (e.g., less than about 5.0 nanoseconds). As a result, neither single-channel operation nor interleaved operation is a viable option for current pulsed power systems. Furthermore, current pulsed power systems do not allow one pulsed dynamic system to operate or service independently while another is energized or operating. Additionally, current pulsed power systems do not allow for a soft landing if one pulsed dynamic system fails but the other remains operational. Moreover, during dual-chamber discharge operation, current pulsed power systems require the blower systems for each laser discharge chamber to be operational to support MOPA or MOPRA operation. Typically, the blower systems are energized and commanded to operate simultaneously. The chamber temperature control subsystem also operates independently but simultaneously. Similarly, during single-chamber operation, current pulsed power systems consume power to operate idle chambers, which drives: increased power consumption; increased cooling operations (e.g., air cooling, water cooling); increased heating operations; increased operating costs; reduced system, subsystem, and component lifetime; and reduced system, subsystem, and component reliability.

[0032] Compared to these conventional systems, this disclosure provides a method for independently controlling the voltage of each laser discharge chamber in a dual-cavity laser source. In some aspects described herein, this disclosure provides control of a laser source comprising a dual-pulse power system. In some aspects described herein, this disclosure provides a dual-pulse power system with independent voltage and timing control and, in some cases, reduced power consumption.

[0033] In some aspects described herein, an example laser control system may include a first pulsed dynamic system comprising a first independent circuit (e.g., a first independent charging and voltage regulation circuit) configured to generate a first resonant charge supply (RCS) output voltage. The first RCS output voltage may be configured to drive a first laser discharge chamber. The example laser control system may also include a second pulsed dynamic system comprising a second independent circuit (e.g., a second independent charging and voltage regulation circuit) configured to generate a second RCS output voltage independent of the first RCS output voltage. The second RCS output voltage may be configured to drive a second laser discharge chamber independent of the first laser discharge chamber.

[0034] In some respects, independent voltage control of the two pulse power drive systems can be achieved by modifying the RCS design so that each RCS output is coupled to an independent charging and voltage regulation circuit. Each resonant charging circuit is able to: (i) share a storage capacitor (e.g., Figure 4 The example laser control system 402 shown); or (ii) has a separate storage capacitor (e.g., Figure 5 The example laser control system 502 shown is shown below; Figure 6 The example laser control system 602 shown is an example of this. Furthermore, each storage capacitor can be charged by any of the following: (iii) a common high-voltage power supply (HVPS) (e.g., Figure 4 Example laser control system 402 shown; Figure 5 The example laser control system 502 shown); or (iv) its own HVPS (e.g., one HVPS for each storage capacitor, such as in Figure 6 In the example laser control system 602 shown). For example, this disclosure provides a laser control system (e.g., an independent voltage pulse power system) having dual independent charging and voltage regulation circuits and any one of the following: (a) a single RCS, a single storage capacitor and a single HVPS (e.g., Figure 4 (a) Example laser control system 402 shown); (b) Dual RCS, dual storage capacitors and a single HVPS (e.g., Figure 5 (e.g., the example laser control system 502 shown in Figure 6); or (c) dual RCS, dual storage capacitors and dual HVPS (e.g., the example laser control system 602 shown in Figure 6).

[0035] In some respects, decoupling the pulsed power system further upstream from the laser discharge chamber increases the potential benefit of being able to operate and maintain the pulsed power systems independently. In some respects, decoupling the resonant charging circuits for the two pulsed power systems will allow for independent energy recovery for each pulsed power system. In some respects, the requirement for closely synchronizing the discharge of the two pulsed power systems can be eliminated, and continuous use of single-channel operation, intermittent or interleaved operation, and MOPA or MOPRA operation can be allowed.

[0036] In some respects, to address potential timing synchronization issues in MOPA or MOPRA operation, the pulsed power system disclosed herein can provide tight timing control and jitter for each pulsed power system to allow timing jitter of + / - 2.0 nanoseconds. The timing jitter budget depends on several components in the pulsed power system, such as: resonant charger voltage repeatability; timing variations in the switching and pulse compression circuitry in the commutator and compressor head; and timing variations due to discharge in the laser discharge chamber. In some respects, if MOPA or MOPRA operation requires independent voltage operation, RCS voltage repeatability can be improved. For example, timing variations as a function of voltage can be approximately 2.0 nanoseconds / volt, which would drive voltage repeatability in the resonant charge to less than approximately 0.1% (+ / - 0.05%) or ideally less than 0.05% (+ / - 0.025%). In some respects, the RCS common-mode repeatability can be limited to + / - 0.1% using a voltage regulation circuit system. In some respects, further improvements in voltage repeatability can be achieved by implementing additional fine-tuning circuitry to allow for improved voltage repeatability. In an illustrative example, one such implementation could be the use of a bleed-down circuit employed after the voltage regulation circuitry has completed its function.

[0037] In some respects, decoupling the blower systems used in the two laser discharge chambers allows for independent operation of each chamber. In dual-chamber operation, the blower systems can continue to be excited and controlled for simultaneous operation. In single-chamber operation, one blower system can be idled to reduce or eliminate the power consumption typically used in dual-chamber operation.

[0038] In some respects, decoupling the temperature control systems for the two laser discharge chambers can provide independent operation for each chamber. In dual-chamber operation, the temperature control systems can continue to be excited and controlled to operate simultaneously. In single-chamber operation, one temperature control system can be idled to reduce or eliminate the power consumption and actuation typically used in dual-chamber operation.

[0039] In some respects, the laser source disclosed herein can utilize two independent lasers instead of a single laser.

[0040] The systems, apparatus methods, computer program products, and manufacturing techniques disclosed herein offer numerous advantages and benefits. For example, this disclosure provides independent voltage control for each power system. Furthermore, this disclosure provides independent control for each pulsed power system to allow three operating modes: (i) single-pulse power system operation; (ii) synchronous dual-output with independent voltage operation; or (iii) interleaved dual-output with independent voltage operation. Additionally, this disclosure provides single-channel operation to allow for “soft-landing” or “limp” performance or capability to serve one power system while another remains operational. Furthermore, this disclosure provides single-channel operation to allow for reduced power consumption and reduced lifetime reduction. As a result, these and other aspects of this disclosure provide: reduced operating costs; reduced planned and unplanned downtime; and improved maintainability through a lighter system weight. Additionally, during single-chamber operation and other operating modes, these and other aspects of this disclosure provide: reduced power consumption; reduced cooling operations (e.g., air cooling, water cooling); reduced heating operations; reduced operating costs; increased system, subsystem, and component lifetime; and improved system, subsystem, and component reliability.

[0041] However, it is beneficial to present example environments in which aspects of this disclosure can be implemented before describing these aspects in more detail.

[0042] Example lithography system

[0043] Figure 1A and Figure 1B These are schematic diagrams of lithography equipment 100 and lithography equipment 100', respectively, which can realize various aspects of this disclosure. For example... Figure 1A and Figure 1B As shown, lithography apparatuses 100 and 100' are shown from a perspective (e.g., a side view) orthogonal to the XZ plane (e.g., the X-axis points to the right and the Z-axis points upward), while patterning apparatus MA and substrate W are presented from an additional perspective (e.g., a top view) orthogonal to the XY plane (e.g., the X-axis points to the right and the Y-axis points upward).

[0044] Lithography apparatus 100 and 100' each include: an irradiation system (irradiator) IL configured to modulate a radiation beam B (e.g., a deep ultraviolet (DUV) radiation beam or an extreme ultraviolet (EUV) radiation beam); a support structure (e.g., a mask stage) MT configured to support a patterning apparatus (e.g., a mask, a stencil, or a dynamic patterning apparatus) MA and connected to a first positioner PM configured to precisely position the patterning apparatus MA; and a substrate holder (e.g., a wafer stage) WT, such as a substrate stage, configured to hold a substrate (e.g., a wafer coated with resist) W and connected to a second positioner PW configured to precisely position the substrate W. Lithography apparatuses 100 and 100' also have a projection system PS configured to project a pattern imparted by the radiation beam B by the patterning apparatus MA onto a target portion C (e.g., a portion including one or more dies) of the substrate W. In the lithography apparatus 100, the pattern forming apparatus MA and the projection system PS are reflective. In the lithography apparatus 100', the pattern forming apparatus MA and the projection system PS are transmissive.

[0045] The irradiation system IL may include various types of optical components, such as refractive, reflective, anti-refractive, magnetic, electromagnetic, electrostatic or other types of optical components, or any combination thereof, for guiding, shaping or controlling the radiation beam B.

[0046] The support structure MT holds the patterning apparatus MA in a manner that depends on the orientation of the patterning apparatus MA relative to the reference frame, the design of at least one of the lithography apparatuses 100 and 100', and other conditions such as whether the patterning apparatus MA is held in a vacuum environment. The support structure MT can use mechanical, vacuum, electrostatic, or other clamping techniques to hold the patterning apparatus MA. The support structure MT can be, for example, a frame or a stage, which may be fixed or movable as needed. By using sensors, the support structure MT can ensure that the patterning apparatus MA is in a desired position, for example, relative to the projection system PS.

[0047] The term "patterning apparatus" MA should be broadly interpreted as any apparatus that can be used to impart a pattern onto the cross-section of a radiation beam B to create a pattern in a target portion C of a substrate W. The pattern imparted by the radiation beam B can correspond to a specific functional layer in the target portion C to form an integrated circuit device.

[0048] The pattern forming apparatus MA can be transmissive (e.g., in...) Figure 1B In a lithography device 100') or a reflective type (such as in Figure 1A(In the lithography apparatus 100). Examples of pattern forming apparatus MA include photomasks, masks, programmable mirror arrays, or programmable LCD panels. Masks include mask types such as binary, alternating phase-shift, or attenuation phase-shift masks, as well as various hybrid mask types. An example of a programmable mirror array employs a matrix arrangement of small mirrors, each of which can be individually tilted to reflect the incoming radiation beam in different directions. The tilted mirrors impart a pattern in the radiation beam B, which is reflected by the matrix of small mirrors.

[0049] The term "projection system" PS can encompass any type of projection system, including refractive, reflective, antirefractive, magnetic, electromagnetic, and electrostatic optical systems, or any combination thereof, suitable for the exposure radiation used, or suitable for other factors such as the use of an immersion liquid on the substrate W or the use of a vacuum. A vacuum environment can be used for EUV or electron beam radiation because other gases may absorb excessive radiation or electrons. Therefore, a vacuum environment can be provided throughout the beam path by means of vacuum walls and vacuum pumps.

[0050] The lithography apparatus 100 and / or lithography apparatus 100' can be of the type having two (dual-stage) or more substrate stages WT (and / or two or more mask stages). In such a "multi-stage" machine, additional substrate stages WT can be used in parallel, or preparation steps can be performed on one or more stages while one or more other substrate stages WT are used for exposure. In some cases, the additional stages may not be substrate stages WT.

[0051] Photolithography apparatuses can also be of the type in which at least a portion of the substrate can be covered by a liquid (e.g., water) with a relatively high refractive index to fill the space between the projection system and the substrate. Immersion liquids can also be applied to other spaces within the photolithography apparatus, such as the space between the mask and the projection system. Immersion techniques provide a means of increasing the numerical aperture of the projection system. The term “immersion” as used herein does not imply that structures such as the substrate must be submerged in the liquid, but simply that the liquid is located between the projection system and the substrate during exposure.

[0052] refer to Figure 1A and Figure 1B The irradiation system IL receives a radiation beam from the radiation source SO. For example, when the radiation source SO is an excimer laser, the radiation source SO and the lithography equipment 100, 100' can be separate physical entities. In this case, the radiation source SO is not considered part of the lithography equipment 100 or 100', and the radiation beam B is delivered by means of a beam delivery system BD including, for example, suitable directional mirrors and / or beam expanders (e.g., in...). Figure 1B(As shown in the diagram) the radiation is transferred from the radiation source SO to the irradiator IL. In other cases, for example, when the radiation source SO is a mercury lamp, the radiation source SO may be a component of the lithography apparatus 100, 100'. If desired, the radiation source SO and the irradiator IL, together with the beam delivery system BD, may be referred to as a radiation system.

[0053] The irradiation system IL may include an adjuster AD for adjusting the angular intensity distribution of the radiation beam (e.g., in...). Figure 1B (As shown in the diagram). Typically, at least the outer and / or inner radial ranges of the intensity distribution in the pupil plane of the irradiator can be adjusted (typically referred to as "σ-outer" and "σ-inner," respectively). Furthermore, the irradiation system IL can include various other components (e.g., in...). Figure 1B (In the middle), such as integrator IN and radiation collector CO (e.g., a beam gatherer or collector optics). The illumination system IL can be used to adjust the radiation beam B to have a desired uniformity and intensity distribution in the cross-section of the radiation beam B.

[0054] Reference Figure 1A A radiation beam B is incident on a patterning apparatus (e.g., a mask) MA held on a support structure (e.g., a mask stage) MT and patterned by the patterning apparatus MA. In the lithography apparatus 100, the radiation beam B is reflected from the patterning apparatus MA. After being reflected from the patterning apparatus MA, the radiation beam B passes through a projection system PS, which focuses the radiation beam B onto a target portion C of the substrate W. The substrate stage WT can be precisely moved (e.g., to position different target portions C in the path of the radiation beam B) by means of a second positioner PW and a position sensor IF2 (e.g., an interferometric device, a linear encoder, or a capacitive sensor). Similarly, a first positioner PM and another position sensor IF1 (e.g., an interferometric device, a linear encoder, or a capacitive sensor) can be used to precisely position the patterning apparatus MA relative to the path of the radiation beam B. The patterning apparatus MA and the substrate W can be aligned using mask alignment marks M1 and M2 and substrate alignment marks P1 and P2.

[0055] Reference Figure 1B A radiation beam B is incident on a patterning apparatus MA held on a support structure MT and patterned by the patterning apparatus MA. After passing through the patterning apparatus MA, the radiation beam B passes through a projection system PS, which focuses the beam onto the target portion C of the substrate W. The projection system has a pupil PPU conjugate to the illumination system pupil IPU. The radiated portion is emitted from the intensity distribution at the illumination system pupil IPU and passes through the mask pattern without being affected by diffraction at the mask pattern, thus generating an image of the intensity distribution at the illumination system pupil IPU.

[0056] The projection system PS projects an image MP' of a mask pattern MP onto a photoresist layer coated on a substrate W, wherein the image MP' is formed by a diffracted beam generated from radiation from the marked pattern MP by an intensity distribution. For example, the mask pattern MP may comprise an array of lines and spacings. The diffraction of radiation at the array differs from zero-order diffraction, generating a directional diffracted beam with a change in direction perpendicular to the lines. The undiffracted beam (i.e., the so-called zero-order diffracted beam) passes through the pattern without any change in its propagation direction. The zero-order diffracted beam passes through an upper lens or upper lens group upstream of the pupil conjugate PPU in the projection system PS to reach the pupil conjugate PPU. The portion of the intensity distribution in the plane of the pupil conjugate PPU and associated with the zero-order diffracted beam is an image of the intensity distribution in the illumination system pupil IPU of the illumination system IL. An aperture device PD is, for example, disposed or substantially disposed in the plane comprising the pupil conjugate PPU of the projection system PS.

[0057] The projection system PS is arranged to capture not only the zeroth-order diffraction beam but also first-order or higher-order diffraction beams (not shown) through a lens or lens group L. In some aspects, dipole illumination for imaging a line pattern extending in a direction perpendicular to the line can be used to utilize the resolution enhancement effect of dipole illumination. For example, a first-order diffraction beam interferes with the corresponding zeroth-order diffraction beam at the level of the substrate W to create an image of the mask pattern MP at the highest possible resolution and process window (i.e., the available depth of focus combined with tolerable exposure dose deviations). In some aspects, astigmatism can be reduced by providing a radiating pole (not shown) in the phase confinement of the illumination system pupil IPU. Furthermore, in some aspects, astigmatism can be reduced by blocking the zeroth-order beam in the projection system pupil conjugate PPU associated with the radiating pole in the phase confinement.

[0058] With the aid of a second positioner PW and a position sensor IF (e.g., an interferometer, a linear encoder, or a capacitive sensor), the substrate stage WT can be moved precisely (e.g., to position different target portions C within the path of the radiation beam B). Similarly, the first positioner PM and another position sensor ( Figure 1B (Not shown) can be used to precisely position the pattern forming apparatus MA relative to the path of the radiation beam B (e.g., after mechanical retrieval from the mask library or during scanning).

[0059] Typically, the movement of the support structure MT can be achieved using long-stroke positioners (coarse positioning) and short-stroke positioners (fine positioning), which together form part of the first positioner PM. Similarly, the movement of the substrate stage WT can be achieved using long-stroke and short-stroke positioners, which together form part of the second positioner PW. In the case of a stepper (opposite to a scanner), the support structure MT may be connected only to the short-stroke actuator or may be fixed. Mask alignment marks M1, M2 and substrate alignment marks P1, P2 can be used to align the patterning apparatus MA and the substrate W. Although the substrate alignment marks (as shown) occupy dedicated target portions, they can be located in the space between the target portions (e.g., scribe alignment marks). Similarly, when more than one die is provided on the patterning apparatus MA, the mask alignment marks can be located between the dies.

[0060] The support structure MT and patterning apparatus MA can be located within a vacuum chamber V, where an in-vacuum robot IVR can be used to move the patterning apparatus (e.g., a mask) into and out of the vacuum chamber. Alternatively, when the support structure MT and patterning apparatus MA are located outside the vacuum chamber, an external vacuum robot can be used for various transport operations, similar to the in-vacuum robot IVR. Both the in-vacuum and external vacuum robots need to be calibrated to smoothly transfer any payload (e.g., a mask) to a fixed motion support at a transport station.

[0061] Photolithography equipment 100 and 100' can be used in at least one of the following modes:

[0062] 1. In step mode, the support structure MT and substrate stage WT are kept essentially stationary while the entire pattern, subjected to radiation beam B, is projected onto the target portion C in one pass (i.e., single static exposure). The substrate stage WT is then shifted in the X and / or Y directions so that different target portions C can be exposed.

[0063] 2. In the scanning mode, the support structure MT and the substrate stage WT are scanned synchronously, while a pattern imparted by the radiation beam B is projected onto the target portion C (i.e., single dynamic exposure). The velocity and direction of the substrate stage WT relative to the support structure (e.g., mask stage) MT can be determined by the (de)magnification and image inversion characteristics of the projection system PS.

[0064] 3. In another mode, the support structure MT is kept substantially stationary to hold the programmable patterning apparatus MA, while the substrate stage WT, to which the radiation beam B is applied, is moved or scanned simultaneously onto the target portion C. A pulsed radiation source SO can be used, and the programmable patterning apparatus can be updated as needed after each movement of the substrate stage WT or between consecutive radiation pulses during scanning. This mode of operation can be readily applied to maskless lithography utilizing the programmable patterning apparatus MA (such as a programmable mirror array).

[0065] A combination and / or variation of the described usage pattern or completely different usage patterns may also be adopted.

[0066] On the other hand, the lithography apparatus 100 includes an EUV source configured to generate an EUV radiation beam for EUV lithography. Typically, the EUV source is configured in a radiation system, and a corresponding irradiation system is configured to modulate the EUV radiation beam from the EUV source.

[0067] Figure 2 The lithography apparatus 100 is shown in more detail, including a radiation source SO (source collector device), an irradiation system IL, and a projection system PS. (As shown...) Figure 2 As shown, the lithography apparatus 100 is illustrated from a view perpendicular to the XZ plane (e.g., a side view) (e.g., the X-axis points to the right and the Z-axis points upward).

[0068] The radiation source SO is constructed and arranged such that a vacuum environment can be maintained within the enclosed structure 220. The radiation source SO includes a source chamber 211 and a collector chamber 212, and is configured to generate and transmit EUV radiation. EUV radiation can be generated from a gas or vapor (e.g., xenon (Xe) gas, lithium (Li) vapor, or tin (Sn) vapor, wherein an EUV radiation-emitting plasma 210 is generated to emit radiation in the EUV range of the electromagnetic spectrum). For example, the EUV radiation-emitting plasma 210 (at least partially ionized) can be generated by, for example, a discharge or a laser beam. To efficiently generate radiation, a partial pressure of, for example, about 10 Pa of Xe gas, Li vapor, Sn vapor, or any other suitable gas or vapor can be used. In some aspects, an excited tin plasma is provided to generate EUV radiation.

[0069] Radiation emitted by EUV radiation-emitting plasma 210 is transmitted from source chamber 211 into collector chamber 212 via an optional gas barrier or contaminant trap 230 (also referred to in some cases as a contaminant barrier or foil trap), which is located in or behind an opening in source chamber 211. Contaminant trap 230 may include a channel structure. Contaminant trap 230 may also include a gas barrier or a combination of a gas barrier and a channel structure. Contaminant trap 230, as further indicated herein, includes at least a channel structure.

[0070] Collector chamber 212 may include a radiation collector CO (e.g., a clusterer or collector), which may be a so-called grazing incidence collector. The radiation collector CO has an upstream radiation collector side 251 and a downstream radiation collector side 252. Radiation passing through the collector CO may be reflected away from the grating spectral filter 240 to be focused on a virtual source point IF. The virtual source point IF is often referred to as the intermediate focus, and the source collector device is arranged such that the virtual source point IF is located at or near the opening 219 in the enclosed structure 220. The virtual source point IF is an image of the EUV radiation-emitting plasma 210. The grating spectral filter 240 is specifically used to suppress infrared (IR) radiation.

[0071] Subsequently, radiation passes through an illumination system IL, which may include a faceted field mirror assembly 222 and a faceted pupil mirror assembly 224. The faceted field mirror assembly 222 and the faceted pupil mirror assembly 224 are arranged to provide a desired angular distribution of the radiation beam 221 at the patterning apparatus MA, and to provide a desired uniformity of radiation intensity at the patterning apparatus MA. When the radiation beam 221 is reflected at the patterning apparatus MA, which is held by a support structure MT, a patterned beam 226 is formed, and the patterned beam 226 is imaged by a projection system PS via reflective elements 228 and 229 onto a substrate W held by a wafer stage or a support structure WT.

[0072] More components than are typically shown in the irradiation system IL and projection system PS. Optionally, depending on the type of lithography equipment, a grating spectral filter 240 may be present. Furthermore, more than... Figure 2 The mirror shown has more mirrors, such as those with Figure 2 Compared to the example shown, one to six additional reflective elements can exist in the projection system PS.

[0073] like Figure 2As shown, the radiation collector CO is depicted as a nested collector with grazing incidence reflectors 253, 254, and 255, merely as an example of a collector (or collector mirror). The grazing incidence reflectors 253, 254, and 255 are arranged axially symmetrically about the optical axis O, and this type of radiation collector CO is preferably used in conjunction with a discharge-generated plasma (DPP) source.

[0074] Example lithography unit

[0075] Figure 3 The image shows a lithography unit 300, sometimes also called a lithocell or cluster. For example... Figure 3 As shown, the lithography unit 300 is shown from a view (e.g., a top view) perpendicular to the XY plane (e.g., the X-axis points to the right and the Y-axis points upward).

[0076] The lithography apparatus 100 or 100' may form part of the lithography unit 300. The lithography unit 300 may also include one or more devices for performing pre-exposure and post-exposure processes on the substrate. For example, these devices include a spin coater SC for depositing a resist layer, a developer DE for developing the exposed resist, a cooling plate CH, and a baking plate BK. A substrate processor RO (robotic arm) picks up substrates from input / output ports I / O1, I / O2, moves them between different processing devices, and delivers them to the loading chamber LB of the lithography apparatus 100 or 100'. These devices, generally referred to collectively as tracks, are under the control of a track control unit TCU, which is itself controlled by a supervisory control system SCS, which also controls the lithography apparatus via a lithography control unit LACU. Therefore, different devices can be operated to maximize throughput and processing efficiency.

[0077] Example laser source including example laser control system

[0078] Example laser control system with a single RCS, a single storage capacitor, and a single HVPS

[0079] Figure 4This is a schematic diagram of an example laser source 400 including an example laser control system 402 (e.g., an independent voltage pulse power system) according to some aspects of this disclosure. In some aspects, the example laser control system 402 may include dual independent charging and voltage regulation circuits (e.g., a first independent circuit 422 and a second independent circuit 424) and a single RCS (e.g., a common RCS 420), a single storage capacitor (e.g., a common storage capacitor 426), and a single HVPS (e.g., a common HVPS 446). In some aspects, the example laser source 400 may be used as part of or other than the radiation source SO of the lithography apparatus 100 or 100'. Additionally or alternatively, the example laser source 400 may generate DUV radiation for DUV lithography.

[0080] like Figure 4 As shown, the example laser source 400 can be a dual-chamber laser source, which includes a dual-pulse power system with independent voltage and timing control and reduced power consumption in some cases. For example, the example laser source 400 may include a first laser discharge chamber 404 and a second laser discharge chamber 408, the first laser discharge chamber 404 being configured to generate a first laser beam 406, and the second laser discharge chamber 408 being configured to receive the first laser beam 406 and amplify it to generate a second laser beam 410. The example laser source 400 can output the second laser beam 410 or a modified version thereof to a lithography apparatus (e.g., lithography apparatus 100 or 110'). While some aspects discussed with reference to the example laser source 400 include two laser discharge chambers, aspects of this disclosure can be applied to laser sources including a single laser discharge chamber or multiple laser discharge chambers.

[0081] In some aspects, the second laser discharge chamber 408 can be configured to receive and amplify light from the first laser discharge chamber 404. In some aspects, the first laser discharge chamber 404 can be implemented as part of a master oscillator (MO), and the second laser discharge chamber 408 can be implemented as part of a power amplifier (PA) or a power ring amplifier (PRA). For example, the example laser source 400 can be a MOPA laser source including both MO and PA, where the MO includes the first laser discharge chamber 404 and the PA includes the second laser discharge chamber 408. In another example, the example laser source 400 can be a MOPRA laser source including both MO and PRA, where the MO includes the first laser discharge chamber 404 and the PRA includes the second laser discharge chamber 408.

[0082] In some aspects, the example laser source 400 may include one or more compression heads. For example, the example laser source 400 may include a first compression head 412 coupled to a first laser discharge chamber 404, and the example laser source 400 may also include a second compression head 414 coupled to a second laser discharge chamber 408.

[0083] In some aspects, the first laser discharge chamber 404 and the second laser discharge chamber 408 may contain a gas mixture. For example, in the case where the example laser source 400 is an excimer laser source, the first laser discharge chamber 404 and the second laser discharge chamber 408 may contain halogens (e.g., fluorine) and other gases (e.g., argon, neon, and other suitable gases) for generating and amplifying the laser beam. In some aspects, the first laser discharge chamber 404 and the second laser discharge chamber 408 may contain the same gas mixture or different gas mixtures. For example, both the first laser discharge chamber 404 and the second laser discharge chamber 408 may contain krypton.

[0084] In some aspects, example laser source 400 may include, or may be coupled to, one or more gas sources (e.g., gas cylinders) and one or more gas control systems configured to independently control the one or more gas sources. For example, a first gas source may be coupled to a first laser discharge chamber 404 to provide a first gas mixture for generating a first laser beam 406. Additionally, a second gas source may be coupled to a second laser discharge chamber 408 to provide a second gas mixture for generating a second laser beam 410. In some aspects, the second gas source may be substantially similar to the first gas source, and the second gas mixture may be the same as or nearly the same as the first gas mixture. In one illustrative example aspect, the first gas source may include, but is not limited to, a gas mixture of fluorine, argon, and neon. In some examples, the first and second gas sources may be coupled to the first laser discharge chamber 404 and the second laser discharge chamber 408, respectively, via one or more valves controlled by one or more gas control systems.

[0085] In some aspects, the example laser source 400 may include one or more temperature control systems, which include one or more temperature actuators configured to independently control the gas temperature in a first laser discharge chamber 404 and a second laser discharge chamber 408. In some aspects, the one or more temperature control systems may include a first temperature control system comprising: one or more temperature sensors disposed in or near the first laser discharge chamber 404 and configured to detect the gas temperature in the first laser discharge chamber 404; and a first temperature actuator configured to control the gas temperature in the first laser discharge chamber 404, the gas temperature in the first laser discharge chamber 404 being independent of the gas temperature in the second laser discharge chamber 408. In some aspects, one or more temperature control systems may further include a second temperature control system comprising: one or more temperature sensors disposed in or near the second laser discharge chamber 408 and configured to detect the gas temperature in the second laser discharge chamber 408; and a second temperature actuator configured to control the gas temperature in the second laser discharge chamber 408, the gas temperature in the second laser discharge chamber 408 being independent of the gas temperature in the first laser discharge chamber 404. In some aspects, the first temperature control system and the second temperature control system may provide independent operation for the first laser discharge chamber 404 and the second laser discharge chamber 408, respectively.

[0086] In some aspects, one or more temperature actuators may include one or more heating systems, including but not limited to one or more coils configured to add heat to a gas in a corresponding laser discharge chamber. The one or more coils may be implemented as one or more resistive loads configured to generate heat proportional to the square of one or more applied voltages. In some aspects, one or more temperature actuators may also include one or more cooling systems, including but not limited to one or more fluid channels configured to remove heat from the gas in the corresponding laser discharge chamber. The one or more fluid channels may be implemented as one or more water pipes coupled to one or more valves configured to remove heat by controlling the fluid flow rate in the one or more water pipes.

[0087] In some aspects, the first laser discharge chamber 404 may include a first temperature actuator, which includes a first heating system and a first cooling system. The first temperature actuator may be configured to control the temperature of the gas in the first laser discharge chamber 404. In some aspects, the second laser discharge chamber 408 may include a second temperature actuator, which includes a second heating system and a second cooling system. The second temperature actuator may be configured to control the temperature of the gas in the second laser discharge chamber 408.

[0088] In some aspects, the first temperature actuator can be configured to control the gas temperature in the first laser discharge chamber 404 based on: the gas temperature detected in the first laser discharge chamber 404 (e.g., by one or more temperature sensors located in or near the first laser discharge chamber 404); and one or more temperature setpoints set for the gas temperature in the first laser discharge chamber 404 (e.g., by user input or by a first temperature control system); and independently of the gas temperature in the second laser discharge chamber 408. In some aspects, the second temperature actuator can be configured to control the gas temperature in the second laser discharge chamber 408 based on: the gas temperature detected in the second laser discharge chamber 408 (e.g., by one or more temperature sensors located in or near the second laser discharge chamber 408); and one or more temperature setpoints set for the gas temperature in the second laser discharge chamber 408 (e.g., by user input or by a second temperature control system); and independently of the gas temperature in the first laser discharge chamber 404.

[0089] In some aspects, the example laser source 400 may include an example laser control system 402 configured to independently control the voltage and timing of a first pulse dynamic system coupled to or associated with a first laser discharge chamber 404 and a second pulse dynamic system coupled to or associated with a second laser discharge chamber 408. In some aspects, the example laser control system 402 may be configured to reduce the power consumption of the first pulse dynamic system, the second pulse dynamic system, or both.

[0090] In some respects, the example laser control system 402 can provide three different configurations for the example laser source 400: (i) MOPA; (ii) MOPRA; and (iii) two independent lasers. For example, when the example laser control system 402 is configured to provide the MOPA configuration for the example laser source 400, the first laser discharge chamber 404 can be an MO laser discharge chamber and the second laser discharge chamber 408 can be a PA laser discharge chamber. In another example, when the example laser control system 402 is configured to provide the MOPRA configuration for the example laser source 400, the first laser discharge chamber 404 can be an MO laser discharge chamber and the second laser discharge chamber 408 can be a PRA laser discharge chamber. In yet another example, when the example laser control system 402 is configured to provide a “two independent lasers” configuration for the example laser source 400, the first laser discharge chamber 404 may include a first laser device configured to generate a first set of photons based on a first RCS output voltage 480 (e.g., based on a first commutator output voltage 482), and the second laser discharge chamber 408 may include a second laser device configured to generate a second set of photons based on a second RCS output voltage 484 (e.g., based on a second commutator output voltage 486).

[0091] In some aspects, the example laser control system 402 may include a common RCS 420, a first commutator 434 (e.g., an MO commutator), a second commutator 438 (e.g., a PR commutator or a PRA commutator), a voltage controller 440 (e.g., an FCP / FCC), a laser discharge chamber timing controller 442 (e.g., a TEM), and a common HVPS 446. In some aspects, the common RCS 420 may include a first independent circuit 422, a second independent circuit 424, and a common storage capacitor 426. In some aspects, the first independent circuit 422 may include a first independent charging and voltage regulation circuit, and the second independent circuit 424 may include a second independent charging and voltage regulation circuit.

[0092] In some aspects, the common storage capacitor 426 can be configured to be electrically coupled to the first independent circuit 422 and the second independent circuit 424. In some aspects, the first independent circuit 422 and the second independent circuit 424 can share the common storage capacitor 426, which can be charged by the common HVPS 446. For example, the common HVPS 446 can be configured to transmit a high-voltage signal 488 to the common storage capacitor 426. The common storage capacitor 426 can be configured to receive the high-voltage signal 488 from the common HVPS 446 and charge the first independent circuit 422 and the second independent circuit 424 based on the high-voltage signal 488.

[0093] In some aspects, the example laser control system 402 may include a first pulsed dynamic system including a first independent circuit 422. The first independent circuit 422 may be configured to generate a first RCS output voltage 480, which is configured to drive a first laser discharge chamber 404, independent of a second laser discharge chamber 408. In some aspects, the first RCS output voltage 480 may be configured to drive the first laser discharge chamber 404 via a first commutator 434, a first commutator output voltage 482, and a first compression head 412. For example, the first independent circuit 422 may be configured to transmit the first RCS output voltage 480 to the first commutator 434. Subsequently, the first commutator 434 can be configured to: receive a first RCS output voltage 480 from the first separate circuit 422, generate a first commutator output voltage 482 based on the first RCS output voltage 480, and transmit the first commutator output voltage 482 to the first compression head 412 for driving the first laser discharge chamber 404.

[0094] In some aspects, the example laser control system 402 may also include a second pulsed dynamic system, which includes a second independent circuit 424. The second independent circuit 424 may be configured to generate a second RCS output voltage 484 independent of a first RCS output voltage 480, which is configured to drive a second laser discharge chamber 408 independent of a first laser discharge chamber 404. In some aspects, the second RCS output voltage 484 may be configured to drive the second laser discharge chamber 408 via a second commutator 438, a second commutator output voltage 486, and a second compression head 414. For example, the second independent circuit 424 may be configured to transmit the second RCS output voltage 484 to the second commutator 438. Subsequently, the second commutator 438 can be configured to: receive a second RCS output voltage 484 from the second independent circuit 424, generate a second commutator output voltage 486 based on the second RCS output voltage 484, and transmit the second commutator output voltage 486 to the second compression head 414 for driving the second laser discharge chamber 408.

[0095] In some aspects, the example laser control system 402 may include multiple communication interfaces, such as communication interface 460 (e.g., arranged in, coupled to or associated with common HVPS 446), communication interface 462 (e.g., arranged in, coupled to or associated with second commutator 438), communication interface 464 (e.g., arranged in, coupled to or associated with common RCS 420), communication interface 466 (e.g., arranged in, coupled to or associated with common RCS 420), and communication interface 468 (e.g., arranged in, coupled to or associated with common RCS 420). In some aspects, the common RCS 420 may also include: a first communication interface (e.g., one of communication interface 464 or communication interface 468) configured to be electrically coupled to a first independent circuit 422; and a second communication interface (e.g., the other of communication interface 464 or communication interface 468) configured to be electrically coupled to a second independent circuit 424. In some aspects, the multiple communication interfaces (e.g., communication interface 460, communication interface 462, communication interface 464, communication interface 466, and communication interface 468) may be or include multiple digital communication interfaces, multiple controller area network (CAN) nodes, multiple Ethernet nodes, multiple serial or parallel communication cable nodes, multiple general purpose interface bus (GPIB) nodes, or multiple other suitable communication interfaces.

[0096] In some aspects, the voltage controller 440 may be electrically coupled to a common RCS 420 via communication interfaces 464 and 468, respectively, and more specifically, electrically coupled to a first independent circuit 422 and a second independent circuit 424. In some aspects, the voltage controller 440 may be configured to independently control the voltage of the first pulse dynamic system (e.g., by controlling the voltage of the first RCS output voltage 480) and the voltage of the second pulse dynamic system (e.g., by controlling the voltage of the second RCS output voltage 484). In some aspects, the voltage controller 440 may be configured to generate a first voltage control signal and transmit it to the communication interface 464 to independently control the voltage of the first RCS output voltage 480. In some aspects, the voltage controller 440 may be configured to generate a second voltage control signal and transmit it to the communication interface 468 to independently control the voltage of the second RCS output voltage 484.

[0097] In some aspects, the laser discharge chamber timing controller 442 can be electrically coupled to the first commutator 434 and the second commutator 438 via communication interfaces 466 and 468, respectively. In some aspects, the laser discharge chamber timing controller 442 can be configured to independently control the discharge timing of the first pulse dynamic system (e.g., by controlling the timing of the first commutator output voltage 482) and the discharge timing of the second pulse dynamic system (e.g., by controlling the timing of the second commutator output voltage 486). In some aspects, the laser discharge chamber timing controller 442 can be configured to generate a first timing control signal and transmit it to the communication interface 466 to independently control the timing of the first commutator output voltage 482. In some aspects, the laser discharge chamber timing controller 442 can be configured to generate a second timing control signal and transmit it to the communication interface 462 to independently control the timing of the second commutator output voltage 486.

[0098] In some respects, the example laser control system 402 can provide the example laser source 400 with three different operating modes: (i) single pulse dynamic system operation of the first pulse dynamic system or the second pulse dynamic system; (ii) simultaneous dual pulse dynamic system operation (including but not limited to simultaneous dual pulse dynamic system operation) for the first pulse dynamic system and the second pulse dynamic system; and (iii) interleaved dual pulse dynamic system operation (including but not limited to intermittent dual pulse dynamic system operation) for the first pulse dynamic system and the second pulse dynamic system. In some respects, the example laser control system 402 may provide independent control of each pulse dynamic system (e.g., independent voltage control, independent timing control, independent gas control, independent blower control, independent temperature control, or combinations thereof) to allow three operating modes: (i) single pulse dynamic system operation of the first laser discharge chamber 404 or the second laser discharge chamber 408; (ii) synchronous dual outputs (including, but not limited to, simultaneous dual outputs) from the first laser discharge chamber 404 and the second laser discharge chamber 408 with independent voltage operation; or (iii) interleaved dual outputs (including, but not limited to, discontinuous dual outputs) from the first laser discharge chamber 404 and the second laser discharge chamber 408 with independent voltage operation.

[0099] In some aspects, the example laser control system 402 can be configured to independently control the voltage and timing of the first pulse dynamic system and the voltage and timing of the second pulse dynamic system. For example, the example laser control system 402 can be configured to independently control the first voltage of the first pulse dynamic system (e.g., using voltage controller 440 and communication interface 464) and the second voltage of the second pulse dynamic system (e.g., using voltage controller 440 and communication interface 468). The example laser control system 402 can also be configured to independently control the first timing of the first pulse dynamic system (e.g., using laser discharge chamber timing controller 442 and communication interface 466) and the second timing of the second pulse dynamic system (e.g., using laser discharge chamber timing controller 442 and communication interface 462).

[0100] In some aspects, the example laser control system 402 can be configured to independently control the voltages of a first pulse dynamic system and a second pulse dynamic system, and also to control the timing of the second pulse dynamic system based on the timing of the first pulse dynamic system. For example, the example laser control system 402 can be configured to independently control a first voltage of the first pulse dynamic system (e.g., using a voltage controller 440 and a communication interface 464) and a second voltage of the second pulse dynamic system (e.g., using a voltage controller 440 and a communication interface 468). The example laser control system 402 can also be configured to control a first timing of the first pulse dynamic system (e.g., using a laser discharge chamber timing controller 442 and a communication interface 466). The example laser control system 402 can also be configured to control a second timing of the second pulse dynamic system based on the first timing of the first pulse dynamic system (e.g., using a laser discharge chamber timing controller 442 and a communication interface 462). In an illustrative example, the example laser control system 402 can be configured to control the second timing of the second pulse dynamic system based on a delay (e.g., discrete duration) relative to the first timing of the first pulse dynamic system. In some aspects, the delay can be based on the light propagation time between the first laser discharge chamber 404 and the second laser discharge chamber 408 (e.g., equal to the light propagation time, a multiple of the light propagation time, or a portion of the light propagation time). In some aspects, the delay can be a controllable parameter. In some aspects, the delay can be based on the desired bandwidth of the light generated by the second laser discharge chamber 408. In some aspects, the delay can be greater than about 1.0 femtosecond, 1.0 picosecond, 1.0 nanosecond, 0.1 millisecond, 1.0 millisecond, 1 second, or 10 seconds.

[0101] In some aspects, the example laser control system 402 can be configured to trigger a second pulse dynamics system in a first operating mode to operate simultaneously with the first pulse dynamics system. The first operating mode can be configured to provide, for example, synchronous dual-pulse dynamics operation for the first and second pulse dynamics systems, or any other suitable operation or combination of operations. In some aspects, the example laser control system 402 can be configured to trigger the first pulse dynamics system in a second operating mode that is delayed relative to the second pulse dynamics system. The second operating mode can be configured to provide, for example, interleaved dual-pulse dynamics operation for the first and second pulse dynamics systems, or any other suitable operation or combination of operations.

[0102] Example laser control system with dual RCS, dual storage capacitors and a single HVPS

[0103] Figure 5 This is a schematic diagram of an example laser source 500 including an example laser control system 502 (e.g., an independent voltage pulse power system) according to some aspects of this disclosure. In some aspects, the example laser control system 502 may include dual independent charging and voltage regulation circuits (e.g., a first independent circuit 522 and a second independent circuit 524), dual RCS (e.g., a first RCS 520 and a second RCS 521), dual storage capacitors (e.g., a first storage capacitor 526 and a second storage capacitor 527), and a single HVPS (e.g., a common HVPS 546). In some aspects, the example laser source 500 may be used as part of or other than the radiation source SO of the lithography apparatus 100 or 100'. Additionally or alternatively, the example laser source 500 may generate DUV radiation for DUV lithography.

[0104] like Figure 5 As shown, the example laser source 500 can be a dual-chamber laser source, including a dual-pulse power system with independent voltage and timing control and reduced power consumption in some cases. For example, the example laser source 500 may include a first laser discharge chamber 504 and a second laser discharge chamber 508, the first laser discharge chamber 504 being configured to generate a first laser beam 506, and the second laser discharge chamber 508 being configured to receive the first laser beam 506 and amplify it to generate a second laser beam 510. The example laser source 500 can output the second laser beam 510 or a modified version thereof to a lithography apparatus (e.g., lithography apparatus 100 or 110'). While some aspects discussed with reference to the example laser source 500 include two laser discharge chambers, aspects of this disclosure can be applied to laser sources including a single laser discharge chamber or multiple laser discharge chambers.

[0105] In some aspects, the second laser discharge chamber 508 may be configured to receive and amplify light from the first laser discharge chamber 504. In some aspects, the first laser discharge chamber 504 may be implemented as part of a master oscillator (MO), and the second laser discharge chamber 508 may be implemented as part of a power amplifier (PA) or a power ring amplifier (PRA). For example, the example laser source 500 may be a MOPA laser source including both an MO and a PA, wherein the MO includes the first laser discharge chamber 504 and the PA includes the second laser discharge chamber 508. In another example, the example laser source 500 may be a MOPRA laser source including both an MO and a PRA, wherein the MO includes the first laser discharge chamber 504 and the PRA includes the second laser discharge chamber 508. In some aspects, the example laser source 500 may include one or more compression heads. For example, the example laser source 500 may include a first compression head 512 coupled to the first laser discharge chamber 504, and the example laser source 500 may also include a second compression head 514 coupled to the second laser discharge chamber 508. In some respects, the first laser discharge chamber 504 and the second laser discharge chamber 508 may include or be coupled to the above reference. Figure 4 The example laser source 400 described herein is discussed in any aspect, structure, feature, component or system.

[0106] In some aspects, the example laser source 500 may include an example laser control system 502, which is configured to independently control the voltage and timing of a first pulse dynamic system coupled to or associated with a first laser discharge chamber 504 and a second pulse dynamic system coupled to or associated with a second laser discharge chamber 508. In some aspects, the example laser control system 502 may be configured to reduce the power consumption of the first pulse dynamic system, the second pulse dynamic system, or both.

[0107] In some respects, the example laser control system 502 can provide three different configurations for the example laser source 500: (i) MOPA; (ii) MOPRA; and (iii) two independent lasers. For example, when the example laser control system 502 is configured to provide the MOPA configuration for the example laser source 500, the first laser discharge chamber 504 can be an MO laser discharge chamber and the second laser discharge chamber 508 can be a PA laser discharge chamber. In another example, when the example laser control system 502 is configured to provide the MOPRA configuration for the example laser source 500, the first laser discharge chamber 504 can be an MO laser discharge chamber and the second laser discharge chamber 508 can be a PRA laser discharge chamber. In yet another example, when the example laser control system 502 is configured to provide a “two independent lasers” configuration for the example laser source 500, the first laser discharge chamber 504 may include a first laser device configured to generate a first set of photons based on a first RCS output voltage 580 (e.g., based on a first commutator output voltage 582), and the second laser discharge chamber 508 may include a second laser device configured to generate a second set of photons based on a second RCS output voltage 584 (e.g., based on a second commutator output voltage 586).

[0108] In some aspects, the example laser control system 502 may include a first RCS 520, a second RCS 521, a first commutator 534 (e.g., an MO commutator), a second commutator 538 (e.g., a PR commutator or a PRA commutator), a voltage controller 540 (e.g., an FCP / FCC), a laser discharge chamber timing controller 542 (e.g., a TEM), and a common HVPS 546. In some aspects, the first RCS 520 may include a first independent circuit 522 and a first storage capacitor 526, and the second RCS 521 may include a second independent circuit 524 and a second storage capacitor 527. In some aspects, the first independent circuit 522 may include a first independent charging and voltage regulation circuit, and the second independent circuit 524 may include a second independent charging and voltage regulation circuit.

[0109] In some aspects, the first storage capacitor 526 may be configured to be electrically coupled to the first independent circuit 522, and the second storage capacitor 527 may be configured to be electrically coupled to the second independent circuit 524. In some aspects, the first storage capacitor 526 and the second storage capacitor 527 may be charged by a common HVPS 546. For example, the common HVPS 546 may be configured to send a high-voltage signal 588 to the first storage capacitor 526 and the second storage capacitor 527. The first storage capacitor 526 may be configured to receive the high-voltage signal 588 from the common HVPS 546 and charge the first independent circuit 522 based on the high-voltage signal 588, and the second storage capacitor 527 may be configured to receive the high-voltage signal 588 from the common HVPS 546 and charge the second independent circuit 524 based on the high-voltage signal 588.

[0110] In some aspects, the example laser control system 502 may include a first pulsed dynamic system including a first independent circuit 522. The first independent circuit 522 may be configured to generate a first RCS output voltage 580, which is configured to drive a first laser discharge chamber 504, independent of a second laser discharge chamber 508. In some aspects, the first RCS output voltage 580 may be configured to drive the first laser discharge chamber 504 via a first commutator 534, a first commutator output voltage 582, and a first compression head 512. For example, the first independent circuit 522 may be configured to transmit the first RCS output voltage 580 to the first commutator 534. Subsequently, the first commutator 534 can be configured to: receive a first RCS output voltage 580 from the first separate circuit 522, generate a first commutator output voltage 582 based on the first RCS output voltage 580, and transmit the first commutator output voltage 582 to the first compression head 512 for driving the first laser discharge chamber 504.

[0111] In some aspects, the example laser control system 502 may also include a second pulsed dynamic system comprising a second independent circuit 524. The second independent circuit 524 may be configured to generate a second RCS output voltage 584, independent of a first RCS output voltage 580, which is configured to drive a second laser discharge chamber 508, independent of the first laser discharge chamber 504. In some aspects, the second RCS output voltage 584 may be configured to drive the second laser discharge chamber 508 via a second commutator 538, a second commutator output voltage 586, and a second compression head 514. For example, the second independent circuit 524 may be configured to transmit the second RCS output voltage 584 to the second commutator 538. Subsequently, the second commutator 538 can be configured to: receive a second RCS output voltage 584 from the second independent circuit 524, generate a second commutator output voltage 586 based on the second RCS output voltage 584, and transmit the second commutator output voltage 586 to the second compression head 514 for driving the second laser discharge chamber 508.

[0112] In some aspects, the example laser control system 502 may include multiple communication interfaces, such as communication interface 560 (e.g., arranged in, coupled to, or associated with common HVPS 546), communication interface 562 (e.g., arranged in, coupled to, or associated with second commutator 538), communication interface 568 (e.g., arranged in, coupled to, or associated with second RCS 521), communication interface 564 (e.g., arranged in, coupled to, or associated with first RCS 520), and communication interface 566 (e.g., arranged in, coupled to, or associated with first commutator 534). In some aspects, the first RCS 520 may include a communication interface 564, which may be configured to be electrically coupled to a first independent circuit 522. In some aspects, the second RCS 521 may include a communication interface 568, which may be configured to be electrically coupled to a second independent circuit 524. In some aspects, the multiple communication interfaces (e.g., communication interface 560, communication interface 562, communication interface 564, communication interface 566, and communication interface 568) may be or include multiple digital communication interfaces, multiple CAN nodes, multiple Ethernet nodes, multiple serial or parallel communication cable nodes, multiple GPIB nodes, or multiple other suitable communication interfaces.

[0113] In some aspects, voltage controller 540 can be electrically coupled to the first RCS 520 and the second RCS 521 via communication interfaces 564 and 568, respectively. In some aspects, voltage controller 540 can be configured to independently control the voltage of the first pulse dynamic system (e.g., by controlling the voltage of the first RCS output voltage 580) and the voltage of the second pulse dynamic system (e.g., by controlling the voltage of the second RCS output voltage 584). In some aspects, voltage controller 540 can be configured to generate a first voltage control signal and transmit it to communication interface 564 to independently control the voltage of the first RCS output voltage 580. In some aspects, voltage controller 540 can be configured to generate a second voltage control signal and transmit it to communication interface 568 to independently control the voltage of the second RCS output voltage 584.

[0114] In some aspects, the laser discharge chamber timing controller 542 can be electrically coupled to the first commutator 534 and the second commutator 538 via communication interfaces 566 and 568, respectively. In some aspects, the laser discharge chamber timing controller 542 can be configured to independently control the discharge timing of the first pulse dynamic system (e.g., by controlling the timing of the first commutator output voltage 582) and the discharge timing of the second pulse dynamic system (e.g., by controlling the timing of the second commutator output voltage 586). In some aspects, the laser discharge chamber timing controller 542 can be configured to generate a first timing control signal and transmit it to the communication interface 566 to independently control the timing of the first commutator output voltage 582. In some aspects, the laser discharge chamber timing controller 542 can be configured to generate a second timing control signal and transmit it to the communication interface 562 to independently control the timing of the second commutator output voltage 586.

[0115] In some respects, the example laser control system 502 can provide the example laser source 500 with three different operating modes: (i) single pulse dynamic system operation of the first pulse dynamic system or the second pulse dynamic system; (ii) synchronous double pulse dynamic system operation (including but not limited to simultaneous double pulse dynamic system operation) for the first pulse dynamic system and the second pulse dynamic system; and (iii) interleaved double pulse dynamic system operation (including but not limited to intermittent double pulse dynamic system operation) for the first pulse dynamic system and the second pulse dynamic system. In some respects, the example laser control system 502 may provide independent control of each pulse dynamic system (e.g., independent voltage control, independent timing control, independent gas control, independent blower control, independent temperature control, or combinations thereof) to allow three operating modes: (i) single pulse dynamic system operation of the first laser discharge chamber 504 or the second laser discharge chamber 508; (ii) synchronous dual outputs (including but not limited to simultaneous dual outputs) from the first laser discharge chamber 504 and the second laser discharge chamber 508 with independent voltage operation; or (iii) interleaved dual outputs (including but not limited to discontinuous dual outputs) from the first laser discharge chamber 504 and the second laser discharge chamber 508 with independent voltage operation.

[0116] In some aspects, the example laser control system 502 can be configured to independently control the voltage and timing of the first pulse dynamic system and the voltage and timing of the second pulse dynamic system. For example, the example laser control system 502 can be configured to independently control the first voltage of the first pulse dynamic system (e.g., using voltage controller 540 and communication interface 564) and the second voltage of the second pulse dynamic system (e.g., using voltage controller 540 and communication interface 568). The example laser control system 502 can also be configured to independently control the first timing of the first pulse dynamic system (e.g., using laser discharge chamber timing controller 542 and communication interface 566) and the second timing of the second pulse dynamic system (e.g., using laser discharge chamber timing controller 542 and communication interface 562).

[0117] In some aspects, the example laser control system 502 can be configured to independently control the voltages of a first pulse dynamic system and a second pulse dynamic system, and also to control the timing of the second pulse dynamic system based on the timing of the first pulse dynamic system. For example, the example laser control system 502 can be configured to independently control a first voltage of the first pulse dynamic system (e.g., using a voltage controller 540 and a communication interface 564) and a second voltage of the second pulse dynamic system (e.g., using a voltage controller 540 and a communication interface 568). The example laser control system 502 can also be configured to control a first timing of the first pulse dynamic system (e.g., using a laser discharge chamber timing controller 542 and a communication interface 566). The example laser control system 502 can also be configured to control a second timing of the second pulse dynamic system based on the first timing of the first pulse dynamic system (e.g., using a laser discharge chamber timing controller 542 and a communication interface 562). In an illustrative example, the example laser control system 502 can be configured to control the second timing of the second pulse dynamic system based on a delay (e.g., a discrete duration) relative to the first timing of the first pulse dynamic system. In some aspects, the delay can be based on the light propagation time between the first laser discharge chamber 504 and the second laser discharge chamber 508 (e.g., equal to the light propagation time, a multiple of the light propagation time, or a portion of the light propagation time). In some aspects, the delay can be a controllable parameter. In some aspects, the delay can be based on the desired bandwidth of the light generated by the second laser discharge chamber 508. In some aspects, the delay can be greater than about 1.0 femtosecond, 1.0 picosecond, 1.0 nanosecond, 0.1 millisecond, 1.0 millisecond, 1 second, or 10 seconds.

[0118] In some aspects, the example laser control system 502 can be configured to trigger a second pulse dynamics system in a first operating mode to operate simultaneously with the first pulse dynamics system. The first operating mode can be configured to provide, for example, synchronous dual-pulse dynamics operation for the first and second pulse dynamics systems, or any other suitable operation or combination of operations. In some aspects, the example laser control system 502 can be configured to trigger the first pulse dynamics system in a second operating mode that is delayed relative to the second pulse dynamics system. The second operating mode can be configured to provide, for example, interleaved dual-pulse dynamics operation for the first and second pulse dynamics systems, or any other suitable operation or combination of operations.

[0119] Example laser control system with dual RCS, dual storage capacitors and dual HVPS

[0120] Figure 6This is a schematic diagram of an example laser source 600, including an example laser control system 602 (e.g., an independent voltage pulse power system), according to some aspects of this disclosure. In some aspects, the example laser control system 602 may include dual independent charging and voltage regulation circuits (e.g., a first independent circuit 622 and a second independent circuit 624), dual RCS (e.g., a first RCS 620 and a second RCS 621), dual storage capacitors (e.g., a first storage capacitor 626 and a second storage capacitor 627), and dual HVPS (e.g., a first HVPS 646 and a second HVPS 647). In some aspects, the example laser source 600 may be used as part of or other than the radiation source SO of the lithography apparatus 100 or 100'. Additionally or alternatively, the example laser source 600 may generate DUV radiation for DUV lithography.

[0121] like Figure 6 As shown, the example laser source 600 can be a dual-chamber laser source, including a dual-pulse power system with independent voltage and timing control and reduced power consumption in some cases. For example, the example laser source 600 may include a first laser discharge chamber 604 and a second laser discharge chamber 608, the first laser discharge chamber 604 being configured to generate a first laser beam 606, and the second laser discharge chamber 608 being configured to receive the first laser beam 606 and amplify it to generate a second laser beam 610. The example laser source 600 can output the second laser beam 610 or a modified version thereof to a lithography apparatus (e.g., lithography apparatus 100 or 110'). While some aspects discussed with reference to the example laser source 600 include two laser discharge chambers, aspects of this disclosure can be applied to laser sources including a single laser discharge chamber or multiple laser discharge chambers.

[0122] In some aspects, the second laser discharge chamber 608 may be configured to receive and amplify light from the first laser discharge chamber 604. In some aspects, the first laser discharge chamber 604 may be implemented as part of a master oscillator (MO), and the second laser discharge chamber 608 may be implemented as part of a power amplifier (PA) or a power ring amplifier (PRA). For example, the example laser source 600 may be a MOPA laser source including both an MO and a PA, wherein the MO includes the first laser discharge chamber 604 and the PA includes the second laser discharge chamber 608. In another example, the example laser source 600 may be a MOPRA laser source including both an MO and a PRA, wherein the MO includes the first laser discharge chamber 604 and the PRA includes the second laser discharge chamber 608. In some aspects, the example laser source 600 may include one or more compression heads. For example, the example laser source 600 may include a first compression head 612 coupled to the first laser discharge chamber 604, and the example laser source 600 may also include a second compression head 614 coupled to the second laser discharge chamber 608. In some aspects, the first laser discharge chamber 604 and the second laser discharge chamber 608 may include or be coupled to the above reference. Figure 4 The example laser source 400 described herein is discussed in any aspect, structure, feature, component or system.

[0123] In some aspects, the example laser source 600 may include an example laser control system 602, which is configured to independently control the voltage and timing of a first pulse dynamic system coupled to or associated with a first laser discharge chamber 604 and a second pulse dynamic system coupled to or associated with a second laser discharge chamber 608. In some aspects, the example laser control system 602 may be configured to reduce the power consumption of the first pulse dynamic system, the second pulse dynamic system, or both.

[0124] In some respects, the example laser control system 602 can provide three different configurations for the example laser source 600: (i) MOPA; (ii) MOPRA; and (iii) two independent lasers. For example, when the example laser control system 602 is configured to provide the MOPA configuration for the example laser source 600, the first laser discharge chamber 604 can be an MO laser discharge chamber and the second laser discharge chamber 608 can be a PA laser discharge chamber. In another example, when the example laser control system 602 is configured to provide the MOPRA configuration for the example laser source 600, the first laser discharge chamber 604 can be an MO laser discharge chamber and the second laser discharge chamber 608 can be a PRA laser discharge chamber. In yet another example, when the example laser control system 602 is configured to provide a “two independent lasers” configuration for the example laser source 600, the first laser discharge chamber 604 may include a first laser device configured to generate a first set of photons based on a first RCS output voltage 680 (e.g., based on a first commutator output voltage 682), and the second laser discharge chamber 608 may include a second laser device configured to generate a second set of photons based on a second RCS output voltage 684 (e.g., based on a second commutator output voltage 686).

[0125] In some aspects, the example laser control system 602 may include a first RCS 620, a second RCS 621, a first commutator 634 (e.g., an MO commutator), a second commutator 638 (e.g., a PR commutator or a PRA commutator), a voltage controller 640 (e.g., an FCP / FCC), a laser discharge chamber timing controller 642 (e.g., a TEM), a first HVPS 646, and a second HVPS 647. In some aspects, the first RCS 620 may include a first independent circuit 622 and a first storage capacitor 626, and the second RCS 621 may include a second independent circuit 624 and a second storage capacitor 627. In some aspects, the first independent circuit 622 may include a first independent charging and voltage regulation circuit, and the second independent circuit 624 may include a second independent charging and voltage regulation circuit.

[0126] In some aspects, the first storage capacitor 626 may be configured to be electrically coupled to the first independent circuit 622, and the second storage capacitor 627 may be configured to be electrically coupled to the second independent circuit 624. In some aspects, the first storage capacitor 626 may be charged by the first HVPS 646, and the second storage capacitor 627 may be charged by the second HVPS 647. For example, the first HVPS 646 may be configured to transmit a first high-voltage signal 688 to the first storage capacitor 626, and the second HVPS 647 may be configured to transmit a second high-voltage signal 689 to the second storage capacitor 627. The first storage capacitor 626 may be configured to receive the first high-voltage signal 688 from the first HVPS 646 and charge the first independent circuit 622 based on the first high-voltage signal 688, and the second storage capacitor 627 may be configured to receive the second high-voltage signal 689 from the second HVPS 647 and charge the second independent circuit 624 based on the second high-voltage signal 689.

[0127] In some aspects, the example laser control system 602 may include a first pulsed dynamic system including a first independent circuit 622. The first independent circuit 622 may be configured to generate a first RCS output voltage 680, which is configured to drive a first laser discharge chamber 604, independent of a second laser discharge chamber 608. In some aspects, the first RCS output voltage 680 may be configured to drive the first laser discharge chamber 604 via a first commutator 634, a first commutator output voltage 682, and a first compression head 612. For example, the first independent circuit 622 may be configured to transmit the first RCS output voltage 680 to the first commutator 634. Subsequently, the first commutator 634 can be configured to: receive a first RCS output voltage 680 from the first separate circuit 622, generate a first commutator output voltage 682 based on the first RCS output voltage 680, and transmit the first commutator output voltage 682 to the first compression head 612 for driving the first laser discharge chamber 604.

[0128] In some aspects, the example laser control system 602 may also include a second pulsed dynamic system comprising a second independent circuit 624. The second independent circuit 624 may be configured to generate a second RCS output voltage 684 independent of a first RCS output voltage 680, which is configured to drive a second laser discharge chamber 608 independent of a first laser discharge chamber 604. In some aspects, the second RCS output voltage 684 may be configured to drive the second laser discharge chamber 608 via a second commutator 638, a second commutator output voltage 686, and a second compression head 614. For example, the second independent circuit 624 may be configured to transmit the second RCS output voltage 684 to the second commutator 638. Subsequently, the second commutator 638 can be configured to: receive a second RCS output voltage 684 from the second independent circuit 624, generate a second commutator output voltage 686 based on the second RCS output voltage 684, and transmit the second commutator output voltage 686 to the second compression head 614 for driving the second laser discharge chamber 608.

[0129] In some aspects, the example laser control system 602 may include multiple communication interfaces, such as communication interface 660 (e.g., disposed in, coupled to, or associated with the first HVPS 646), communication interface 661 (e.g., disposed in, coupled to, or associated with the second HVPS 647), communication interface 662 (e.g., disposed in, coupled to, or associated with the second RCS 621), communication interface 664 (e.g., disposed in, coupled to, or associated with the first RCS 620), and communication interface 666 (e.g., disposed in, coupled to, or associated with the first RCS 620), and communication interface 666 (e.g., disposed in, coupled to, or associated with the first commutator 634). In some aspects, the first RCS 620 may include a communication interface 664, which may be configured to be electrically coupled to a first independent circuit 622. In some aspects, the second RCS 621 may include a communication interface 668, which may be configured to be electrically coupled to a second independent circuit 624. In some aspects, multiple communication interfaces (e.g., communication interfaces 660, 661, 662, 664, 666, and 668) may be or include multiple digital communication interfaces, multiple CAN nodes, multiple Ethernet nodes, multiple serial or parallel communication cable nodes, multiple GPIB nodes, or multiple other suitable communication interfaces.

[0130] In some aspects, voltage controller 640 can be electrically coupled to the first RCS 620 and the second RCS 621 via communication interfaces 664 and 668, respectively. In some aspects, voltage controller 640 can be configured to independently control the voltage of the first pulse dynamic system (e.g., by controlling the voltage of the first RCS output voltage 680) and the voltage of the second pulse dynamic system (e.g., by controlling the voltage of the second RCS output voltage 684). In some aspects, voltage controller 640 can be configured to generate a first voltage control signal and transmit it to communication interface 664 to independently control the voltage of the first RCS output voltage 680. In some aspects, voltage controller 640 can be configured to generate a second voltage control signal and transmit it to communication interface 668 to independently control the voltage of the second RCS output voltage 684.

[0131] In some aspects, the laser discharge chamber timing controller 642 can be electrically coupled to the first commutator 634 and the second commutator 638 via communication interfaces 666 and 662, respectively. In some aspects, the laser discharge chamber timing controller 642 can be configured to independently control the discharge timing of the first pulse dynamic system (e.g., by controlling the timing of the first commutator output voltage 682) and the discharge timing of the second pulse dynamic system (e.g., by controlling the timing of the second commutator output voltage 686). In some aspects, the laser discharge chamber timing controller 642 can be configured to generate a first timing control signal and transmit it to the communication interface 666 to independently control the timing of the first commutator output voltage 682. In some aspects, the laser discharge chamber timing controller 642 can be configured to generate a second timing control signal and transmit it to the communication interface 662 to independently control the timing of the second commutator output voltage 686.

[0132] In some respects, the example laser control system 602 can provide the example laser source 600 with three different operating modes: (i) single pulse dynamics operation of the first pulse dynamics system or the second pulse dynamics system; (ii) simultaneous dual pulse dynamics operation of the first pulse dynamics system and the second pulse dynamics system (including but not limited to simultaneous dual pulse dynamics operation); and (iii) interleaved dual pulse dynamics operation of the first pulse dynamics system and the second pulse dynamics system (including but not limited to intermittent dual pulse dynamics operation). In some respects, the example laser control system 602 may provide independent control of each pulse dynamic system (e.g., independent voltage control, independent timing control, independent gas control, independent blower control, independent temperature control, or combinations thereof) to allow three operating modes: (i) single pulse dynamic system operation of the first laser discharge chamber 604 or the second laser discharge chamber 608; (ii) synchronous dual outputs (including but not limited to simultaneous dual outputs) from the first laser discharge chamber 604 and the second laser discharge chamber 608 with independent voltage operation; or (iii) interleaved dual outputs (including but not limited to discontinuous dual outputs) from the first laser discharge chamber 604 and the second laser discharge chamber 608 with independent voltage operation.

[0133] In some aspects, the example laser control system 602 can be configured to independently control the voltage and timing of the first pulse dynamic system and the voltage and timing of the second pulse dynamic system. For example, the example laser control system 602 can be configured to independently control the first voltage of the first pulse dynamic system (e.g., using voltage controller 640 and communication interface 664) and the second voltage of the second pulse dynamic system (e.g., using voltage controller 640 and communication interface 668). The example laser control system 602 can also be configured to independently control the first timing of the first pulse dynamic system (e.g., using laser discharge chamber timing controller 642 and communication interface 666) and the second timing of the second pulse dynamic system (e.g., using laser discharge chamber timing controller 642 and communication interface 662).

[0134] In some aspects, the example laser control system 602 can be configured to independently control the voltages of a first pulse dynamic system and a second pulse dynamic system, and also to control the timing of the second pulse dynamic system based on the timing of the first pulse dynamic system. For example, the example laser control system 602 can be configured to independently control a first voltage of the first pulse dynamic system (e.g., using a voltage controller 640 and a communication interface 664) and a second voltage of the second pulse dynamic system (e.g., using a voltage controller 640 and a communication interface 668). The example laser control system 602 can also be configured to control a first timing of the first pulse dynamic system (e.g., using a laser discharge chamber timing controller 642 and a communication interface 666). The example laser control system 602 can also be configured to control a second timing of the second pulse dynamic system based on the first timing of the first pulse dynamic system (e.g., using a laser discharge chamber timing controller 642 and a communication interface 662). In an illustrative example, the example laser control system 602 can be configured to control the second timing of the second pulse dynamic system based on a delay (e.g., a discrete duration) relative to the first timing of the first pulse dynamic system. In some aspects, the delay can be based on the light propagation time between the first laser discharge chamber 604 and the second laser discharge chamber 608 (e.g., equal to the light propagation time, a multiple of the light propagation time, or a portion of the light propagation time). In some aspects, the delay can be a controllable parameter. In some aspects, the delay can be based on the desired bandwidth of the light generated by the second laser discharge chamber 608. In some aspects, the delay can be greater than about 1.0 femtosecond, 1.0 picosecond, 1.0 nanosecond, 0.1 millisecond, 1.0 millisecond, 1 second, or 10 seconds.

[0135] In some aspects, the example laser control system 602 can be configured to trigger a second pulse dynamic system in a first operating mode to operate simultaneously with the first pulse dynamic system. The first operating mode can be configured to provide, for example, synchronous dual-pulse dynamic system operation for the first and second pulse dynamic systems, or any other suitable operation or combination of operations. In some aspects, the example laser control system 602 can be configured to trigger the first pulse dynamic system in a second operating mode that is delayed relative to the second pulse dynamic system. The second operating mode can be configured to provide, for example, interleaved dual-pulse dynamic system operation for the first and second pulse dynamic systems, or any other suitable operation or combination of operations.

[0136] Example process for manufacturing equipment

[0137] Figure 7This is a flowchart illustrating an example method 700 for manufacturing an apparatus according to some aspects or a portion thereof. In some aspects, the apparatus may be or include a laser source, a laser control system, or a dual-pulse power system having independent voltage and timing control and, in some cases, reduced power consumption. The operation described with reference to example method 700 can be performed by or according to any system, apparatus, method, computer program product, component, technology, or combination thereof described herein, such as with reference to Figures 1 to 14 above. Figure 6 And below Figure 8 Those described.

[0138] At operation 702, the method may include providing a first pulsed dynamic system, the first pulsed dynamic system including a first independent circuit (e.g., first independent circuit 422, 522, or 622) configured to generate a first resonant charge supply (RCS) output voltage (e.g., first RCS output voltage 480, 580, or 680). In some aspects, the first RCS output voltage may be configured to drive a first laser discharge chamber (e.g., first laser discharge chamber 404, 504, or 604). In some aspects, providing the first pulsed dynamic system may include providing according to reference Figures 1 to... Figure 6 and below Figure 8 The first pulse dynamic system of any aspect or combination of aspects described.

[0139] At operation 704, the method may include providing a second pulsed dynamic system, the second pulsed dynamic system including a second independent circuit (e.g., second independent circuit 424, 524, or 624), the second independent circuit being configured to generate a second RCS output voltage (e.g., second RCS output voltage 484, 584, or 684) independent of the first RCS output voltage. In some aspects, the second RCS output voltage may be configured to drive a second laser discharge chamber (e.g., second laser discharge chamber 408, 508, or 608) independent of the first laser discharge chamber. In some aspects, providing the second pulsed dynamic system may include providing according to the above-referenced Figures 1 to 12. Figure 6 and the following references Figure 8 The second pulse dynamic system of any aspect or combination of aspects described.

[0140] At operation 706, the method may include forming a laser control system (e.g., a dual-pulse power system or an independent voltage pulse power system, including but not limited to example laser control system 402, example laser control system 502, or example laser control system 602), which includes a first pulse power system and a second pulse power system. In some aspects, the laser control system may have dual independent charging and voltage regulation circuits, and any of the following:

[0141] (A) A single RCS, a single storage capacitor, and a single HVPS (e.g., Figure 4 Example laser control system 402 shown;

[0142] (b) Dual RCS, dual storage capacitors, and a single HVPS (e.g., Figure 5 Example laser control system 502 shown; or

[0143] (c) Dual RCS, dual storage capacitors, and dual HVPS (e.g., Figure 6 Example laser control system 602 shown.

[0144] In some respects, this example laser control system can provide three configurations: (i) an MOPA configuration, wherein the first laser discharge chamber can be an MO laser discharge chamber and the second laser discharge chamber can be a PA laser discharge chamber; (ii) an MOPRA configuration, wherein the first laser discharge chamber can be an MO laser discharge chamber and the second laser discharge chamber can be a PRA laser discharge chamber; or (iii) a “two independent lasers” configuration, wherein the first laser discharge chamber can include a first laser device configured to generate a first set of photons based on a first RCS output voltage, and the second laser discharge chamber can include a second laser device configured to generate a second set of photons based on a second RCS output voltage.

[0145] In some respects, the example laser control system can provide independent control of each pulse dynamics (e.g., independent voltage control, independent timing control, independent gas control, independent blower control, independent temperature control, or a combination thereof) to allow three operating modes: (i) single pulse dynamics operation of the first laser discharge chamber or the second laser discharge chamber; (ii) synchronous dual outputs from the first and second laser discharge chambers with independent voltage operation; or (iii) interleaved dual outputs from the first and second laser discharge chambers with independent voltage operation.

[0146] In some aspects, forming a laser control system may include, as shown in Figures 1 to 14 above. Figure 6 and the following references Figure 8 Any aspect or combination of aspects described herein may be used to form a laser control system.

[0147] Example computing system

[0148] The aspects of this disclosure can be implemented in hardware, firmware, software, or any combination thereof. The aspects of this disclosure can also be implemented as instructions stored on a machine-readable medium that can be read and executed by one or more processors. The machine-readable medium can include any mechanism for storing or transmitting information in a machine-readable form (e.g., a computing device). For example, a machine-readable medium can include read-only memory (ROM); random access memory (RAM); disk storage media; optical storage media; flash memory devices; electrical, optical, acoustic, or other forms of propagation signals, etc. Furthermore, firmware, software, routines, and / or instructions may be described herein as performing certain actions. However, it should be understood that such descriptions are for convenience only, and such actions are actually generated by the computing device, processor, controller, or other device executing the firmware, software, routines, and / or instructions.

[0149] For example, you can use such as Figure 8 One or more computing systems of the example computing system 800 shown implement various aspects. The example computing system 800 may be a special-purpose computer capable of performing the functions described herein, such as: [reference needed] Figure 4 The example laser control system 402 described; Reference Figure 5 The example laser control system 502 described; Reference Figure 6 The described example laser control system 602; any other suitable system, subsystem, or component; or any combination thereof. The example computing system 800 may include one or more processors (also referred to as a central processing unit or CPU), such as processor 804. Processor 804 is connected to communication infrastructure 806 (e.g., a bus). The example computing system 800 may also include multiple user input / output devices 803 (such as monitors, keyboards, pointing devices, etc.) that communicate with communication infrastructure 806 via multiple user input / output interfaces 802. The example computing system 800 may also include main memory 808 (e.g., one or more main storage devices), such as random access memory (RAM). Main memory 808 may include one or more levels of cache. Control logic (e.g., computer software) and / or data are stored in main memory 808.

[0150] The example computing system 800 may also include secondary storage 810 (e.g., one or more secondary storage devices). Secondary storage 810 may include, for example, a hard disk drive 812 and / or a removable storage drive 814. The removable storage drive 814 may be a floppy disk drive, a magnetic tape drive, an optical disk drive, an optical storage device, a magnetic tape backup device, and / or any other storage device / drive.

[0151] The removable storage drive 814 can interact with the removable storage unit 818. The removable storage unit 818 includes a computer-usable or readable storage device on which computer software (control logic) and / or data are stored. The removable storage unit 818 can be a floppy disk, magnetic tape, optical disc, DVD, optical storage disc, and / or any other computer data storage device. The removable storage drive 814 reads from and / or writes to the removable storage unit 818.

[0152] According to some aspects, secondary storage 810 may include additional components, tools, or other methods for allowing computer programs and / or other instructions and / or data to be accessed by example computing system 800. Such components, tools, or other methods may include, for example, removable storage unit 822 and interface 820. Examples of removable storage unit 822 and interface 820 may include a program box and box interface (such as those found in video game devices), a removable memory chip (such as EPROM or PROM) and associated socket, a memory stick and USB port, a memory card and associated memory card slot, and / or any other removable storage unit and associated interface.

[0153] The example computing system 800 may also include a communication interface 824 (e.g., one or more network interfaces). The communication interface 824 enables the example computing system 800 to communicate and interact with any combination of remote devices, remote networks, remote entities, etc. (collectively referred to individually and collectively as remote device 828). For example, the communication interface 824 may allow the example computing system 800 to communicate with the remote device 828 via a communication path 826, which may be wired and / or wireless, and may include any combination of LAN, WAN, Internet, etc. Control logic, data, or both may be transmitted to and from the example computing system 800 via the communication path 826.

[0154] The operations described in the foregoing aspects of this disclosure can be implemented in a wide variety of configurations and architectures. Therefore, some or all of the operations described in the foregoing aspects can be performed in hardware, software, or both. In some aspects, a tangible non-transient device or article of manufacture includes a tangible non-transient computer-usable or readable medium having control logic (software) stored thereon, also referred to herein as a computer program product or program storage device. This includes, but is not limited to, the example computing system 800, main memory 808, secondary memory 810 and removable storage units 818 and 822, and tangible articles of manufacture embodying any combination of the foregoing. When executed by one or more data processing devices (such as the example computing system 800), such control logic causes such data processing devices to operate as described herein.

[0155] Based on the teachings contained in this disclosure, it will be apparent to those skilled in the art that different methods are used... Figure 8 It will be apparent from the data processing apparatus, computer system, and / or computer architecture shown that various aspects of this disclosure can be made and used. Specifically, various aspects of this disclosure may be operated using software, hardware, and / or operating systems different from those described herein.

[0156] While specific references may be made herein to the use of lithography equipment in IC manufacturing, it should be understood that the lithography equipment described herein may have other applications, such as manufacturing integrated optical systems, guiding and detecting patterns for magnetic domain memory, flat panel displays, LCDs, thin-film magnetic heads, etc. Those skilled in the art will understand that, in the context of such alternative applications, any use of the terms "wafer" or "bare die" herein may be considered synonymous with the more general terms "substrate" or "target portion," respectively. The substrate mentioned herein may be processed before or after exposure in, for example, a tracking unit (typically a tool for applying a resist layer to the substrate and developing the exposed resist), a measurement unit, and / or an inspection unit. Where applicable, the disclosure herein may be applied to such and other substrate processing tools. Furthermore, for example, to create multilayer ICs, the substrate may be processed more than once, such that the term "substrate" as used herein may also refer to a substrate that already contains multiple processed layers.

[0157] It should be understood that the wording or terminology used herein is for descriptive rather than limiting purposes, and that the terminology or terminology used herein should be interpreted by those skilled in the art based on the teachings herein.

[0158] The term "substrate" as used in this article describes the material on which a layer of material is added. In some respects, the substrate itself may be patterned, and the material added on top of it may also be patterned, or it may remain unpatterned.

[0159] The examples disclosed herein are illustrative of embodiments of this disclosure and not limiting. Other suitable modifications and adaptations to various conditions and parameters commonly encountered in the art (which will be apparent to those skilled in the art) are within the spirit and scope of this disclosure.

[0160] While specific references may be made herein to the use of devices and / or systems in IC manufacturing, it should be clearly understood that such devices and / or systems have many other possible applications. For example, they may be employed in the manufacture of integrated optical systems, guiding and detection patterns for magnetic domain memories, LCD panels, thin-film magnetic heads, and so on. Those skilled in the art will understand that, in the context of such alternative applications, any use of the terms “mask,” “wafer,” or “bare die” herein should be considered to be replaced by the more general terms “mask,” “substrate,” and “target portion,” respectively.

[0161] While specific aspects of this disclosure have been described above, it should be understood that these aspects can be practiced in ways other than those described. This description is not intended to limit the embodiments of this disclosure.

[0162] It should be understood that the "Detailed Description" section, rather than the "Background Art," "Summary," and "Abstract" sections, is intended to be used to interpret the claims. The "Summary" and "Abstract" sections may set forth one or more, but not all, exemplary embodiments contemplated by the inventors, and are therefore not intended to limit this embodiment and the appended claims in any way.

[0163] Some aspects of this disclosure have been described above using functional building blocks that illustrate the implementation of specific functions and their relationships. For ease of description, the boundaries of these functional building blocks have been arbitrarily defined herein. Alternative boundaries can be defined as long as the specified functions and their relationships are performed appropriately.

[0164] The foregoing description of specific aspects of this disclosure will so fully reveal the general nature of these aspects that others can readily modify and / or adapt various applications of such specific embodiments by applying knowledge within the art without departing from the general conception of this disclosure, without excessive experimentation. Therefore, based on the teachings and guidance presented herein, such adaptations and modifications are intended to be within the equivalent meaning and scope of the disclosed aspects.

[0165] Other aspects of the invention are set forth in the following numbered clauses.

[0166] 1. A laser control system, comprising:

[0167] A first pulsed dynamic system includes a first independent circuit configured to generate a first resonant charge supply (RCS) output voltage, wherein the first RCS output voltage is configured to drive a first laser discharge chamber; and

[0168] The second pulse dynamic system includes a second independent circuit configured to generate a second RCS output voltage, which is independent of the first RCS output voltage. The second RCS output voltage is configured to drive a second laser discharge chamber, which is independent of the first laser discharge chamber.

[0169] 2. The laser control system according to Clause 1, wherein the laser control system is configured as follows:

[0170] Independently control the first voltage of the first pulse dynamic system and the second voltage of the second pulse dynamic system; and

[0171] Independently control the first timing of the first pulse dynamic system and the second timing of the second pulse dynamic system.

[0172] 3. The laser control system according to Clause 1, wherein the laser control system is configured as follows:

[0173] Independently control the first voltage of the first pulse dynamic system and the second voltage of the second pulse dynamic system;

[0174] The first timing for controlling the first pulse dynamic system; and

[0175] The second timing of the second pulse dynamic system is controlled based on the first timing of the first pulse dynamic system.

[0176] 4. The laser control system according to Clause 3, wherein the laser control system is configured as follows:

[0177] The second timing of the second pulse dynamic system is controlled based on the delay of the first timing relative to the first pulse dynamic system.

[0178] 5. The laser control system according to Clause 4, wherein the delay is based on the light propagation time between the first laser discharge chamber and the second laser discharge chamber.

[0179] 6. A laser control system according to Clause 4, wherein the delay is a controllable parameter.

[0180] 7. The laser control system according to Clause 4, wherein the delay is based on the desired bandwidth of the light generated by the second discharge optical chamber.

[0181] 8. The laser control system according to Clause 1, wherein the laser control system is configured as follows:

[0182] In the first operating mode, the second pulse power system is triggered to operate simultaneously with the first pulse power system; and

[0183] In the second operating mode, the first pulse power system is triggered with a delay relative to the second pulse power system.

[0184] 9. The laser control system according to Clause 1 further includes:

[0185] A common RCS includes a first independent circuit, a second independent circuit, and a common storage capacitor configured to be electrically coupled to the first and second independent circuits; and

[0186] The high-voltage power supply (HVPS) is configured to transmit high-voltage signals to a common storage capacitor.

[0187] 10. The laser control system pursuant to Clause 1 further includes:

[0188] The first RCS includes a first independent circuit and a first storage capacitor, the first storage capacitor being configured to be electrically coupled to the first independent circuit.

[0189] The second RCS includes a second independent circuit and a second storage capacitor, the second storage capacitor being configured to be electrically coupled to the second independent circuit; and

[0190] The high-voltage power supply (HVPS) is configured as follows:

[0191] Transmit the first high-voltage signal to the first storage capacitor, and

[0192] The second high-voltage signal is transmitted to the second storage capacitor.

[0193] 11. The laser control system according to Clause 1 further includes:

[0194] The first RCS includes a first independent circuit and a first storage capacitor, the first storage capacitor being configured to be electrically coupled to the first independent circuit.

[0195] The second RCS includes a second independent circuit and a second storage capacitor, the second storage capacitor being configured to be electrically coupled to the second independent circuit; and

[0196] A first high-voltage power supply (HVPS) is configured to transmit a first high-voltage signal to a first storage capacitor; and

[0197] The second HVPS is configured to transmit a second high-voltage signal to the second storage capacitor.

[0198] 12. The laser control system according to Clause 1 further includes:

[0199] The first communication interface is configured to be electrically coupled to a first independent circuit; and

[0200] The second communication interface is configured to be electrically coupled to a second independent circuit.

[0201] 13. The laser control system according to Clause 1, wherein the second laser discharge chamber is configured to receive and amplify light from the first laser discharge chamber.

[0202] 14. The laser control system according to Clause 1, wherein the first laser discharge chamber is a master oscillator (MO) laser discharge chamber, and wherein the second laser discharge chamber is a power amplifier (PA) discharge chamber or a power ring amplifier (PRA) discharge chamber.

[0203] 15. The laser control system according to Clause 1, wherein the first laser discharge chamber includes a first laser device configured to generate a first set of photons based on a first RCS output voltage, and wherein the second laser discharge chamber includes a second laser device configured to generate a second set of photons based on a second RCS output voltage.

[0204] 16. The laser control system according to Clause 1, wherein the laser control system is configured to provide single-pulse power system operation of either the first pulse power system or the second pulse power system.

[0205] 17. The laser control system according to Clause 1, wherein the laser control system is configured to provide synchronized dual-pulse power system operation for the first pulse power system and the second pulse power system.

[0206] 18. The laser control system according to Clause 1, wherein the laser control system is configured to provide interleaved dual-pulse dynamic system operation for the first pulse dynamic system and the second pulse dynamic system.

[0207] 19. An apparatus comprising:

[0208] A first pulsed dynamic system includes a first independent circuit configured to generate a first resonant charge supply (RCS) output voltage, wherein the first RCS output voltage is configured to drive a first laser discharge chamber; and

[0209] The second pulse dynamic system includes a second independent circuit configured to generate a second RCS output voltage, which is independent of the first RCS output voltage. The second RCS output voltage is configured to drive a second laser discharge chamber, which is independent of the first laser discharge chamber.

[0210] 20. A method for manufacturing equipment, comprising:

[0211] A first pulsed power system is provided, the first pulsed power system including a first independent circuit, the first independent circuit being configured to generate a first resonant charge supply (RCS) output voltage, wherein the first RCS output voltage is configured to drive a first laser discharge chamber;

[0212] A second pulsed dynamic system is provided, the second pulsed dynamic system including a second independent circuit configured to generate a second RCS output voltage independent of a first RCS output voltage, wherein the second RCS output voltage is configured to drive a second laser discharge chamber independent of the first laser discharge chamber; and

[0213] A laser control system is formed, which includes a first pulse dynamic system and a second pulse dynamic system.

[0214] The breadth and scope of the embodiments should not be limited by any of the exemplary embodiments described above, but should be limited only by the appended claims and their equivalents.

Claims

1. A laser control system, comprising: A first pulsed power system includes a first independent circuit configured to generate a first resonant charge supply RCS output voltage, wherein the first RCS output voltage is configured to drive a first laser discharge chamber. The second pulse dynamic system includes a second independent circuit configured to generate a second RCS output voltage, which is independent of the first RCS output voltage. The second RCS output voltage is configured to drive a second laser discharge chamber, which is independent of the first laser discharge chamber. The common RCS includes the first independent circuit, the second independent circuit, and a common storage capacitor configured to be electrically coupled to the first independent circuit and the second independent circuit. as well as A common high-voltage power supply (HVPS) is configured to transmit a high-voltage signal to the common storage capacitor, wherein the laser control system is configured to: Controlling the first timing of the first pulse dynamic system; as well as The second timing of the second pulse dynamic system is controlled based on the delay of the first timing relative to the first timing of the first pulse dynamic system.

2. The laser control system according to claim 1, wherein the laser control system is configured to: The first voltage of the first pulse dynamic system and the second voltage of the second pulse dynamic system can be controlled independently.

3. The laser control system according to claim 1, wherein the delay is based on the light propagation time between the first laser discharge chamber and the second laser discharge chamber.

4. The laser control system according to claim 1, wherein the delay is a controllable parameter.

5. The laser control system of claim 1, wherein the delay is based on the desired bandwidth of the light generated by the second laser discharge chamber.

6. The laser control system according to claim 1, wherein the laser control system is configured to: In the first operating mode, the second pulse power system is triggered to operate simultaneously with the first pulse power system; and In the second operating mode, the first pulse dynamic system is triggered with a delay relative to the second pulse dynamic system.

7. The laser control system according to claim 1, further comprising: The first communication interface is configured to be electrically coupled to the first independent circuit; as well as The second communication interface is configured to be electrically coupled to the second independent circuit.

8. The laser control system of claim 1, wherein the second laser discharge chamber is configured to receive and amplify light from the first laser discharge chamber.

9. The laser control system according to claim 1, wherein the first laser discharge chamber is the master oscillator (MO) laser discharge chamber, and wherein the second laser discharge chamber is the power amplifier (PA) discharge chamber or the power ring amplifier (PRA) discharge chamber.

10. The laser control system of claim 1, wherein the first laser discharge chamber includes a first laser device configured to generate a first set of photons based on the first RCS output voltage, and wherein the second laser discharge chamber includes a second laser device configured to generate a second set of photons based on the second RCS output voltage.

11. The laser control system of claim 1, wherein the laser control system is configured to provide single-pulse dynamics operation of the first pulse dynamics system or the second pulse dynamics system.

12. The laser control system of claim 1, wherein the laser control system is configured to provide synchronized dual-pulse dynamic system operation for the first pulse dynamic system and the second pulse dynamic system.

13. The laser control system of claim 1, wherein the laser control system is configured to provide interleaved dual-pulse dynamics operation for the first pulse dynamics system and the second pulse dynamics system.

14. An apparatus comprising: A first pulse dynamic system includes a first independent circuit configured to generate a first resonant charge supply RCS output voltage, wherein the first RCS output voltage is configured to drive a first laser discharge chamber. The second pulse dynamic system includes a second independent circuit configured to generate a second RCS output voltage, which is independent of the first RCS output voltage. The second RCS output voltage is configured to drive a second laser discharge chamber, which is independent of the first laser discharge chamber. The common RCS includes the first independent circuit, the second independent circuit, and a common storage capacitor configured to be electrically coupled to the first independent circuit and the second independent circuit. as well as A common high-voltage power supply (HVPS) is configured to transmit a high-voltage signal to the common storage capacitor, wherein the device is configured to: Controlling the first timing of the first pulse power system; as well as The second timing of the second pulse dynamic system is controlled based on the delay of the first timing relative to the first timing of the first pulse dynamic system.

15. A method for manufacturing equipment, comprising: A first pulsed power system is provided, the first pulsed power system including a first independent circuit, the first independent circuit being configured to generate a first resonant charge supply RCS output voltage, wherein the first RCS output voltage is configured to drive a first laser discharge chamber; A second pulse dynamic system is provided, the second pulse dynamic system including a second independent circuit, the second independent circuit being configured to generate a second RCS output voltage, the second RCS output voltage being independent of a first RCS output voltage, wherein the second RCS output voltage is configured to drive a second laser discharge chamber, the second laser discharge chamber being independent of the first laser discharge chamber; A common RCS is provided, the common RCS including the first independent circuit, the second independent circuit, and a common storage capacitor, the common storage capacitor being configured to be electrically coupled to the first independent circuit and the second independent circuit; as well as A common high-voltage power supply (HVPS) is provided, the HVPS being configured to transmit high-voltage signals to the common storage capacitor and A laser control system is formed, the laser control system including a first pulse dynamic system and a second pulse dynamic system, wherein the laser control system is configured as follows: Controlling the first timing of the first pulse dynamic system; as well as The second timing of the second pulse dynamic system is controlled based on the delay of the first timing relative to the first timing of the first pulse dynamic system.

Images