Board Connector

Abstract

The present invention relates to a substrate connector, which includes: a plurality of RF contacts for transmitting RF (Radio Frequency) signals; an insulating portion for supporting the plurality of RF contacts; a plurality of transmission contacts coupled to the insulating portion between a first RF contact among the plurality of RF contacts and a second RF contact among the plurality of RF contacts, such that the first RF contact and the second RF contact are spaced apart from each other in a first axial direction; and a ground cover coupled with the insulating portion, the ground cover including a ground inner wall facing the insulating portion, a ground outer wall spaced apart from the ground inner wall, and ground connection walls respectively coupled to the ground inner wall and the ground outer wall, the ground inner wall and the ground outer wall being double shielding walls on the sides surrounding an inner space, and the first RF contact and the second RF contact being located in the inner space surrounded by the double shielding walls.

Description

Technical Field

[0001] The present invention relates to a board connector provided in an electronic device for electrical connection between a plurality of boards. Background Art

[0002] A connector is a device provided in various electronic devices for electrical connection. For example, connectors are provided in electronic devices such as mobile phones, computers, and tablet computers, and can electrically connect various components provided in the electronic devices to each other.

[0003] Generally, in an electronic device, an RF connector and a board-to-board connector (hereinafter referred to as a "board connector") are provided inside a wireless communication device such as a smart phone or a tablet PC. The RF connector transmits an RF (Radio Frequency) signal. The board connector processes digital signals such as those of a camera.

[0004] Such an RF connector and a board connector are mounted on a PCB (Printed Circuit Board). Since a plurality of board connectors and RF connectors are mounted together with a plurality of components in a limited PCB space in the prior art, there is a problem that the PCB mounting area becomes large. Therefore, with the miniaturization trend of smart phones, there is a need for a technology that optimizes with a smaller PCB mounting area by integrating an RF connector and a board connector.

[0005] Figure 1 It is a schematic perspective view of a prior art board connector.

[0006] Refer to Figure 1 , the prior art board connector 100 includes a first connector 110 and a second connector 120.

[0007] The first connector 110 is for coupling to a first board (not shown). The first connector 110 can be electrically connected to the second connector 120 through a plurality of first contacts 111.

[0008] The second connector 120 is for coupling to a second board (not shown). The second connector 120 can be electrically connected to the first connector 110 through a plurality of second contacts 121.

[0009] As a plurality of the first contact members 111 and a plurality of the second contact members 121 are connected to each other, the prior-art substrate connector 100 can electrically connect the first substrate and the second substrate to each other. In addition, in a case where a part of the contact members among the plurality of the first contact members 111 and the plurality of the second contact members 121 are used as a plurality of RF contact members for transmitting RF signals, the prior-art substrate connector 100 can be configured to transmit RF signals between the first substrate and the second substrate through the RF contact members.

[0010] Here, the prior-art substrate connector 100 has the following problems.

[0011] First, in the prior-art substrate connector 100, in a case where a plurality of the contact members that are relatively close to each other among the plurality of the contact members 111 and 121 are used as the RF contact members, signal transmission cannot be smoothly performed due to RF signal interference between the plurality of the RF contact members 111', 111", 121', and 121".

[0012] Second, in the prior-art substrate connector 100, an RF signal shielding portion 112 is provided at the outermost periphery of the connector, and the RF signal radiation to the outside can be shielded, but shielding between RF signals cannot be achieved.

[0013] Third, in the prior-art substrate connector 100, the plurality of RF contact members 111', 111", 121', and 121" each include a plurality of mounting portions 111a', 111a", 121a', and 121a" mounted on the substrate, and the plurality of the mounting portions 111a', 111a", 121a', and 121a" are configured to be exposed to the outside. Thus, the prior-art substrate connector 100 cannot achieve shielding of the plurality of the mounting portions 111a', 111a", 121a', and 121a". Summary of the Invention

[0014] Problems to be Solved by the Invention

[0015] The present invention is designed to solve the above problems, and aims to provide a substrate connector capable of reducing the possibility of RF signal interference occurring between a plurality of RF contact members.

[0016] Technical Solutions for Solving the Problems

[0017] In order to solve the above-described problems, the present invention may include the following configurations.

[0018] The substrate connector of the present invention may include: a plurality of RF contacts for transmitting RF (Radio Frequency) signals; an insulating portion for supporting the plurality of RF contacts; a plurality of transmission contacts coupled to the insulating portion between a first RF contact among the plurality of RF contacts and a second RF contact among the plurality of RF contacts, such that the first RF contact and the second RF contact are spaced apart from each other in a first axial direction; and a ground cover coupled with the insulating portion. The ground cover may include a ground inner wall facing the insulating portion, a ground outer wall spaced apart from the ground inner wall, and ground connection walls respectively coupled to the ground inner wall and the ground outer wall. The ground inner wall and the ground outer wall may be double shielding walls on the sides surrounding an inner space. The first RF contact and the second RF contact may be located in the inner space surrounded by the double shielding walls.

[0019] The substrate connector of the present invention may include: a plurality of RF contacts for transmitting RF (Radio Frequency) signals; an insulating portion for supporting the plurality of RF contacts; a plurality of transmission contacts coupled to the insulating portion between a first RF contact among the plurality of RF contacts and a second RF contact among the plurality of RF contacts, such that the first RF contact and the second RF contact are spaced apart from each other in a first axial direction; and a ground cover coupled with the insulating portion. The ground cover may include a ground side wall on the side surrounding an inner space, a ground upper wall protruding from an upper end of the ground side wall toward the inner space side, and a ground lower wall protruding from a lower end of the ground side wall toward the opposite side of the inner space. The first RF contact and the second RF contact may be located in the inner space surrounded by the ground side wall, the ground upper wall, and the ground lower wall.

[0020] Advantages of the Invention

[0021] According to the present invention, the following advantages can be achieved.

[0022] The present invention can utilize the ground cover to implement the functions of shielding signals, electromagnetic waves, etc. for the plurality of RF contacts. Thereby, the present invention can prevent the electromagnetic waves generated from the plurality of RF contacts from being interfered by the signals of the plurality of circuit components located around the electronic device, and can prevent the electromagnetic waves generated from the plurality of circuit components located around the electronic device from interfering with the RF signals transmitted by the plurality of RF contacts. Therefore, the present invention can utilize the ground cover to improve the EMI (ElectroMagnetic Interference) shielding performance and EMC (Electro Magnetic Compatibility) performance.

[0023] The present invention can be implemented such that all of a plurality of RF contacts, including those mounted on a substrate, are located inside a ground cover. Thus, the present invention can utilize the ground cover to enhance the shielding function for the plurality of RF contacts, thereby enabling complete shielding. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a schematic perspective view of a prior art board connector.

[0025] Figure 2 is a schematic perspective view of a jack connector and a plug connector in the board connector of the present invention.

[0026] Figure 3 is a schematic perspective view of a board connector according to a first embodiment.

[0027] Figure 4 is a schematic exploded perspective view of a board connector according to a first embodiment.

[0028] Figure 5 is a schematic top view of a board connector according to a first embodiment.

[0029] Figure 6 is a schematic perspective view of a ground cover of a board connector according to a first embodiment.

[0030] Figure 7 is taken along Figure 2 line I-I as a reference and is a schematic side sectional view.

[0031] Figures 8 to 12 is an enlarged Figure 7 section A of which shows a schematic side sectional view of the combined form of a board connector according to a first embodiment and a board connector according to a second embodiment.

[0032] Figure 13 is taken along Figure 6 line II-II as a reference and is a schematic side sectional view showing the bonding relationship between the ground cover of a board connector according to a first embodiment and the ground cover of a board connector according to a second embodiment.

[0033] Figure 14 is a schematic top view for explaining a ground loop in a board connector according to a first embodiment.

[0034] Figure 15 and Figure 16 are enlarged to show a schematic side sectional view of Figure 7 section A for explaining the bonding relationship between the ground cover and the insulating portion of a board connector according to a first embodiment.

[0035] Figure 17It is an enlarged schematic side sectional view showing the bonding relationship between the ground cover and the insulating portion of the board connector of the first embodiment. Figure 7 of part B.

[0036] Figure 18 and Figure 19 It is an enlarged schematic side sectional view showing the bonding relationship between the ground cover and the insulating portion of the board connector of the first embodiment. Figure 7 of part A.

[0037] Figure 20 It is a schematic exploded side view of the ground cover and the insulating portion of the board connector of the first embodiment.

[0038] Figure 21 It is a schematic perspective view of the board connector of the second embodiment.

[0039] Figure 22 It is a schematic exploded perspective view of the board connector of the second embodiment.

[0040] Figure 23 It is a schematic top view of the board connector of the second embodiment.

[0041] Figure 24 It is a schematic perspective view of the ground cover of the board connector of the second embodiment.

[0042] Figure 25 It is based on Figure 21 line III-III of the schematic side sectional view.

[0043] Figure 26 It is an enlarged Figure 7 schematic side sectional view showing the form of the combination of the board connector of the first embodiment and the board connector of the second embodiment by showing part A.

[0044] Figure 27 It is a schematic top view for explaining the ground loop in the board connector of the second embodiment. Detailed implementation mode

[0045] Hereinafter, with reference to the drawings, embodiments of the board connector of the present invention will be described in detail.

[0046] Refer to Figure 2, the substrate connector 1 of the present invention can be disposed in electronic devices (not shown) such as mobile phones, computers, and tablet computers. The substrate connector 1 of the present invention can be used for electrically connecting a plurality of substrates (not shown). The plurality of substrates can be printed circuit boards (PCBs, Printed Circuit Boards). For example, in the case of electrically connecting a first substrate and a second substrate, a receptacle connector mounted on the first substrate and a plug connector mounted on the second substrate can be connected to each other. Thus, the first substrate and the second substrate can be electrically connected to each other through the receptacle connector and the plug connector.

[0047] The substrate connector 1 of the present invention can be implemented by the receptacle connector. The substrate connector 1 of the present invention can be implemented by the plug connector. The substrate connector 1 of the present invention can also be implemented to include both the receptacle connector and the plug connector. Hereinafter, an embodiment in which the substrate connector 1 of the present invention is implemented by the receptacle connector is defined as the substrate connector 200 of the first embodiment, and an embodiment in which the substrate connector 1 of the present invention is implemented by the plug connector is defined as the substrate connector 300 of the second embodiment, and a detailed description will be given with reference to the drawings. Thus, obviously, those skilled in the art to which the present invention pertains can deduce an embodiment in which the substrate connector 1 of the present invention includes both the receptacle connector and the plug connector.

[0048] <The substrate connector 200 of the first embodiment>

[0049] Refer to Figures 2 to 4 , the substrate connector 200 of the first embodiment can include a plurality of RF contacts 210, a plurality of transmission contacts 220, a ground cover 230, and an insulating portion 240.

[0050] The RF contacts 210 are used for transmitting RF (Radio Frequency) signals. The plurality of RF contacts 210 can transmit ultra-high frequency RF signals. The plurality of RF contacts 210 can be supported by the insulating portion 240. The plurality of RF contacts 210 can be combined with the insulating portion 240 through an assembly process. The plurality of RF contacts 210 can also be integrally formed with the insulating portion 240 by injection molding.

[0051] A plurality of the RF contacts 210 may be arranged spaced apart from each other. The plurality of the RF contacts 210 are mounted on the first substrate so as to be electrically connected to the first substrate. The plurality of the RF contacts 210 are connected to a plurality of RF contacts of the plug connector so as to be electrically connected to the second substrate on which the plug connector is mounted. Accordingly, the first substrate and the second substrate can be electrically connected.

[0052] A first RF contact 211 among the plurality of the RF contacts 210 and a second RF contact 212 among the plurality of the RF contacts 210 may be spaced apart from each other in a first axial direction (X-axis direction). The first RF contact 211 and the second RF contact 212 may be supported by the insulating portion 240 at positions spaced apart from each other in the first axial direction (X-axis direction). Figure 4 The substrate connector 200 of the first embodiment is shown to include two RF contacts 210, but is not limited thereto, and the substrate connector 200 of the first embodiment may include three or more RF contacts 210. On the other hand, in the present specification, the case where the substrate connector 200 of the first embodiment includes two RF contacts 210 will be described as a reference.

[0053] The first RF contact 211 may include a first RF mounting member 2111. The first RF mounting member 2111 may be mounted on the first substrate. Accordingly, the first RF contact 211 can be electrically connected to the first substrate through the first RF mounting member 2111. The first RF contact 211 may be formed of a material having electrical conductivity. For example, the first RF contact 211 may be formed of metal. The first RF contact 211 may be connected to any one of the plurality of RF contacts of the plug connector.

[0054] The second RF contact 212 may include a second RF mounting member 2121. The second RF mounting member 2121 may be mounted on the first substrate. Accordingly, the second RF contact 212 can be electrically connected to the first substrate through the second RF mounting member 2121. The second RF contact 212 may be formed of a material having electrical conductivity. For example, the second RF contact 212 may be formed of metal. The second RF contact 212 may be connected to any one of the plurality of RF contacts of the plug connector.

[0055] Refer to Figures 2 to 4, a plurality of the transmission contacts 220 are coupled to the insulating portion 240. The plurality of the transmission contacts 220 can function to transmit signals (Sinal), data (Data), etc. The plurality of the transmission contacts 220 can be coupled to the insulating portion 240 through an assembly process. The plurality of the transmission contacts 220 can also be integrally formed with the insulating portion 240 by injection molding.

[0056] Based on the first axis direction (X-axis direction), the plurality of the transmission contacts 220 can be disposed between the first RF contact 211 and the second RF contact 212. Thus, in order to reduce RF signal interference between the first RF contact 211 and the second RF contact 212, the plurality of the transmission contacts 220 can be disposed in a space separating the first RF contact 211 and the second RF contact 212. Therefore, the substrate connector 200 of the first embodiment can not only reduce RF signal interference by increasing the distance between the first RF contact 211 and the second RF contact 212 from each other, but also improve the space utilization rate of the insulating portion 240 by disposing the plurality of the transmission contacts 220 in the separating space therebetween.

[0057] The plurality of the transmission contacts 220 can be disposed at intervals from each other. The plurality of the transmission contacts 220 are mounted on the first substrate, so as to be electrically connected to the first substrate. In this case, the transmission mounting members 2201 each of the plurality of the transmission contacts 220 has can be mounted on the first substrate. The plurality of the transmission contacts 220 can be formed of a material having electrical conductivity. For example, the plurality of the transmission contacts 220 can be formed of metal. The plurality of the transmission contacts 220 are connected to the plurality of transmission contacts of the plug connector, so as to be electrically connected to the second substrate on which the plug connector is mounted. Thus, the first substrate and the second substrate can be electrically connected.

[0058] On the other hand, Figure 4 It is shown in that the substrate connector 200 of the first embodiment includes four transmission contacts 220, but is not limited thereto. The substrate connector 200 of the first embodiment can include five or more transmission contacts 220. The plurality of the transmission contacts 220 can be spaced from each other along the first axis direction (X-axis direction) and the second axis direction (Y-axis direction). The first axis direction (X-axis direction) and the second axis direction (Y-axis direction) are axis directions perpendicular to each other.

[0059] Refer to Figures 2 to 6, the ground cover 230 is coupled to the insulating part 240. The ground cover 230 is mounted on the first substrate so that it can be grounded. Thus, the ground cover 230 can perform functions such as shielding signals, electromagnetic waves, etc. for the plurality of RF contacts 210. In this case, the ground cover 230 can prevent the electromagnetic waves generated from the plurality of RF contacts 210 from interfering with the signals of the circuit components located around the electronic device, and can prevent the electromagnetic waves generated from the circuit components located around the electronic device from interfering with the RF signals transmitted by the plurality of RF contacts 210. Thus, the substrate connector 200 of the first embodiment can utilize the ground cover 230 to improve the EMI (Electro Magnetic Interference) shielding performance and EMC (Electro Magnetic Compatibility) performance. The ground cover 230 can be formed of a material having electrical conductivity. For example, the ground cover 230 can be formed of metal.

[0060] The ground cover 230 can be configured to surround the sides of the inner space 230a. A part of the insulating part 240 can be disposed in the inner space 230a. The first RF contact 211, the second RF contact 212, and the transmission contact 22 can all be located in the inner space 230a. In this case, the first RF mounting member 2111, the second RF mounting member 2121, and the transmission mounting member 2201 can also all be located in the inner space 230a. Therefore, by forming a shielding wall for all of the first RF contact 211 and the second RF contact 212, the ground cover 230 can enhance the shielding function for the first RF contact 211 and the second RF contact 212, thereby achieving complete shielding. The plug connector can be inserted into the inner space 230a.

[0061] The ground cover 230 can be configured to surround all sides with respect to the inner space 230a. The inner space 230a can be disposed inside the ground cover 230. When the ground cover 230 is integrally formed in a rectangular ring shape, the inner space 230a can be formed in a cuboid shape. In this case, the ground cover 230 can be configured to surround four sides with respect to the inner space 230a.

[0062] Refer to Figures 2 to 7, the ground cover 230 can be implemented to have a double shielding wall. To this end, the ground cover 230 may include a ground inner wall 231, a ground outer wall 232, and a ground connection wall 233.

[0063] The ground inner wall 231 faces the insulating portion 240. The ground inner wall 231 may be configured to face the inner space 230a. The ground inner wall 231 may be configured to surround all sides with respect to the inner space 230a. When the plug connector is inserted into the inner space 230a, the ground inner wall 231 may be connected to the ground cover of the plug connector.

[0064] The ground outer wall 232 is spaced apart from the ground inner wall 231. The ground outer wall 232 may be disposed outside the ground inner wall 231. The ground outer wall 232 may be configured to surround all sides with respect to the ground inner wall 231.

[0065] The ground outer wall 232 and the ground inner wall 231 may be implemented by a double shielding wall surrounding the sides of the inner space 230a. The first RF contact 211 and the second RF contact 212 may be located in the inner space 230a surrounded by the double shielding wall. Thus, the ground cover 230 can enhance the shielding function for a plurality of the RF contacts 210 by using the double shielding wall. Therefore, the substrate connector 200 of the first embodiment can further improve the EMI shielding performance and EMC performance by using the double shielding wall.

[0066] The ground outer wall 232 is mounted on the first substrate and thus can be grounded. In this case, the ground cover 230 can be grounded through the ground outer wall 232. The lower end of the ground outer wall 232 may be mounted on the first substrate. In this case, the ground outer wall 232 may be formed to have a higher height than the ground inner wall 231.

[0067] The ground connection wall 233 is respectively coupled to the ground inner wall 231 and the ground outer wall 232. The ground connection wall 233 may be disposed between the ground inner wall 231 and the ground outer wall 232. Through the ground connection wall 233, the ground inner wall 231 and the ground outer wall 232 can be electrically connected to each other. Thus, when the ground outer wall 232 is mounted on the first substrate and grounded, the ground connection wall 233 and the ground inner wall 231 are also grounded, thereby enabling the shielding function. When the plug connector is inserted into the inner space 230a, the ground connection wall 233 may be connected to the ground cover of the plug connector.

[0068] The grounding connection wall 233 can be respectively coupled to the upper ends of the grounding outer wall 232 and the grounding inner wall 231. The grounding connection wall 233 can be formed in a plate shape disposed in the horizontal direction, and the grounding outer wall 232 and the grounding inner wall 231 can be respectively formed in a plate shape disposed in the vertical direction. The grounding connection wall 233, the grounding outer wall 232, and the grounding inner wall 231 can also be formed integrally.

[0069] The grounding housing 230 can include a grounding bottom 234.

[0070] The grounding bottom 234 protrudes from the grounding inner wall 231 toward the inner space 230a side. The grounding bottom 234 can protrude from the lower end of the grounding inner wall 231 toward the inner space 230a side. Thus, the substrate connector 200 of the first embodiment can also achieve a shielding function on the bottom side of the grounding housing 230 by using the grounding bottom 234, thereby further strengthening the shielding function for the first RF contact 211 and the second RF contact 212. If the plug connector is inserted into the inner space 230a, the grounding bottom 234 can be connected to the grounding housing of the plug connector. Thus, the substrate connector 200 of the first embodiment can increase the contact area through the connection between the grounding bottom 234 and the grounding housing of the plug connector, thereby further strengthening the shielding function. In addition, the substrate connector 200 of the first embodiment can reduce the adverse electrical effects such as crosstalk generated by mutual capacitance or mutual inductance between adjacent terminals by increasing the contact area between the grounding housing 230 and the grounding housing of the plug connector. In this case, the substrate connector 200 of the first embodiment can ensure a path for electromagnetic waves to flow into the ground of at least one of the first substrate and the second substrate, thereby further strengthening the EMI shielding performance. The grounding bottom 234 can be formed in a plate shape disposed in the horizontal direction.

[0071] As Figure 11 shown, the connection portion between the grounding bottom 234 and the grounding outer wall 232 can be formed in an arc shape. Thus, when the plug connector is inserted into the inner space 230a, the connection portion between the grounding bottom 234 and the grounding outer wall 232 can serve as a guide for the plug connector. In this case, the portion of the connection portion between the grounding bottom 234 and the grounding outer wall 232 facing the inner space 230a can have a curved surface and be formed in an arc shape.

[0072] The grounding bottom 234, the grounding connection wall 233, the grounding outer wall 232, and the grounding inner wall 231 may also be formed integrally. In this case, the grounding cover 230 may be integrally formed without seams. The grounding cover 230 may be integrally formed without seams by a metal injection molding process such as die casting or MIM (Metal Injection Molding). The grounding cover 230 may also be integrally formed without seams by CNC (Computer Numerical Control) machining, MCT (Machining Center Tool) machining, etc.

[0073] Referring to Figures 2 to 12 , in order to further enhance the shielding function by improving the contact between the grounding inner wall 231 and the grounding cover of the plug connector, the grounding cover 230 may include the following configuration.

[0074] First, as Figure 8 shown, the grounding cover 230 may include a connection groove 235. The connection groove 235 may be formed on the inner surface of the grounding inner wall 231. The inner surface of the grounding inner wall 231 is the surface facing the inner space 230a. The connection groove 235 may be realized by a groove formed on the inner surface of the grounding inner wall 231 with a specified depth. The grounding cover 330 of the plug connector may be inserted into the connection groove 235. In this case, the connection protrusion 335 of the grounding cover 330 of the plug connector may be inserted into the connection groove 235. Thus, the substrate connector 200 of the first embodiment uses the connection groove 235 to improve the contact between the grounding cover 230 and the grounding cover 330 of the plug connector, thereby further enhancing the shielding function for the first RF contact 211 and the second RF contact 212. Figure 8 It is shown that the connection groove 235 is formed to be longer than the connection protrusion 335 in the up-down direction, but it is not limited thereto. The connection groove 235 and the connection protrusion 335 may also be formed to have substantially the same length. On the other hand, the grounding inner wall 231 supports the connection protrusion 335 inserted into the connection groove 235, thereby also preventing the connection protrusion 335 from disengaging from the connection groove 235. The grounding cover 230 may also include a plurality of the connection grooves 235. In this case, the plurality of connection grooves 235 may be arranged at intervals along the inner surface of the grounding inner wall 231.

[0075] Next, as Figure 9As shown, the ground cover 230 may also include a connection projection 236. The connection projection 236 may be formed on the inner surface of the ground inner wall 231. The connection projection 236 may protrude from the inner surface of the ground inner wall 231. The connection projection 236 may be inserted into the ground cover 330 of the plug connector. In this case, the connection projection 236 may be inserted into the connection groove 334 of the ground cover 330 of the plug connector. Thus, the board connector 200 of the first embodiment uses the connection projection 236 to improve the contact between the ground cover 230 and the ground cover 330 of the plug connector, thereby further enhancing the shielding function for the first RF contact 211 and the second RF contact 212. Figure 9 It is shown that the connection projection 236 is formed to have a length shorter than that of the connection groove 334 with respect to the up-down direction, but it is not limited thereto, and the connection projection 236 and the connection groove 334 may also be formed to have substantially the same length. On the other hand, the connection projection 236 is inserted into the connection groove 334 and supported by the ground cover 330, thereby also preventing the connection projection 236 from disengaging from the connection groove 334. The ground cover 230 may also include a plurality of the connection projections 236. In this case, the plurality of connection projections 236 may be arranged at intervals from each other along the inner surface of the ground inner wall 231.

[0076] Next, as Figure 10 shown, when the ground cover 230 includes the connection projection 236, the connection projection 236 may also support the connection projection 335 of the ground cover 330 of the plug connector. Thus, the board connector 200 of the first embodiment uses the connection projection 236 to improve the contact between the ground cover 230 and the ground cover 330 of the plug connector, thereby further enhancing the shielding function for the first RF contact 211 and the second RF contact 212. On the other hand, the connection projection 236 is disposed above the connection projection 335 and supports the connection projection 335, thereby also preventing the connection projection 335 from disengaging.

[0077] Next, as Figure 11 shown, the ground cover 230 may also contact the ground cover 330 of the plug connector through surface contact between the inner surface of the ground inner wall 231 and the ground cover 330 of the plug connector. In this case, a gap may occur between the inner surface of the ground inner wall 231 and the ground cover 330 of the plug connector. To compensate for this, as Figure 12As shown, the ground cover 230 may include a conductive member 237. The conductive member 237 may be coupled to the inner surface of the ground inner wall 231. The conductive member 237 may be formed to extend along the inner surface of the ground inner wall 231 including the corner portion 231a ( Figure 6 shown in) to form a closed loop shape. Thus, the substrate connector 200 of the first embodiment uses the conductive member 237 to improve the contact between the ground cover 230 and the ground cover 330 of the plug connector, thereby further enhancing the shielding function for the first RF contact 211 and the second RF contact 212. Additionally, in the case of the embodiment using the connection protrusion 236 and the connection groove 235, it is difficult to perform operations on the corner portion 231a on the inner surface of the ground inner wall 231. However, in the case of the embodiment using the conductive member 237, the ease of performing operations on the corner portion 231a on the inner surface of the ground inner wall 231 can be improved. The conductive member 237 may be formed of a material having electrical conductivity to electrically connect the ground inner wall 231 and the ground cover 330 of the plug connector. For example, the conductive member 237 may be formed of metal. After being separately manufactured, the conductive member 237 may be coupled to the ground inner wall 231 by being installed, attached, fastened, etc. on the inner surface of the ground inner wall 231. The conductive member 237 may also be coupled to the ground inner wall 231 by coating the inner surface of the ground inner wall 231 with a conductive shielding material.

[0078] Referring to Figures 2 to 13 , the ground cover 230 may include a ground arm 238 ( Figure 13 shown in).

[0079] The grounding arm 238 protrudes from the grounding bottom 234 toward the inner space 230a side. The grounding arm 238 may be inclined such that the height becomes higher as it protrudes more toward the inner space 230a side. Thus, when the plug connector is inserted into the inner space 230a, the grounding arm 238 can rotate downward about the point where it is connected to the grounding bottom 234 as it is pressed by the grounding cover 330 of the plug connector. Thus, the grounding arm 238 presses the grounding cover 330 by the restoring force, and thus makes strong contact with the grounding cover 330. Therefore, the substrate connector 200 of the first embodiment uses the grounding arm 238 to improve the contact between the grounding cover 230 and the grounding cover 330 of the plug connector, thereby further strengthening the shielding function for the first RF contact 211 and the second RF contact 212. The grounding cover 230 may also include a plurality of the grounding arms 238. In this case, the plurality of the grounding arms 238 may be arranged at intervals from each other along the grounding bottom 234.

[0080] Referring to Figures 2 to 13 , the grounding cover 230 may include a welding inspection window 239 ( Figure 5 and Figure 6 shown in).

[0081] The welding inspection window 239 may be formed to penetrate the grounding cover 230. The welding inspection window 239 may be used to inspect the state in which the first RF mounting member 2111 is mounted on the first substrate. In this case, the first RF contact 211 may be coupled to the insulating portion 240 such that the first RF mounting member 2111 is located at a position corresponding to the welding inspection window 239. Thus, the first RF mounting member 2111 is not blocked by the grounding cover 230. Therefore, in the state where the substrate connector 200 of the first embodiment is mounted on the first substrate, an operator can inspect the state in which the first RF mounting member 2111 is mounted on the first substrate through the welding inspection window 239. Thus, in the substrate connector 200 of the first embodiment, even if the first RF contact 211 including the first RF mounting member 2111 is entirely located inside the grounding cover 230, the accuracy of the mounting operation of mounting the first RF contact 211 to the first substrate can be improved. The welding inspection window 239 may be implemented by a groove formed in the grounding bottom 234 with a predetermined depth.

[0082] The grounding housing 230 may also include a plurality of the welding inspection windows 239. In this case, the second RF mounting member 2121 and the plurality of the transmission mounting members 2201 may be located at positions corresponding to the plurality of the welding inspection windows 239. Accordingly, in a state where the substrate connector 200 of the first embodiment is mounted on the first substrate, an operator can inspect the states in which the first RF mounting member 2111, the second RF mounting member 2121, and the plurality of the transmission mounting members 2201 are mounted on the first substrate through the welding inspection windows 239. Thereby, the substrate connector 200 of the first embodiment can improve the accuracy of the operation of mounting the first RF contact 211, the second RF contact 212, and the plurality of the transmission contacts 220 to the first substrate.

[0083] Referring to Figures 2 to 12 , the insulating part 240 supports the plurality of the RF contacts 210. A plurality of the RF contacts 210 and a plurality of the transmission contacts 220 may be coupled to the insulating part 240. The insulating part 240 may be formed of an insulating material. The insulating part 240 may be coupled to the grounding housing 230 such that the plurality of the RF contacts 210 are located in the inner space 230a.

[0084] The insulating part 240 may include an insulating member 241.

[0085] The insulating member 241 supports the plurality of the RF contacts 210 and the plurality of the transmission contacts 220. The insulating member 241 may be located in the inner space 230a. The insulating member 241 may be located inside the grounding bottom 234. In this case, the grounding bottom 234 may be located between the grounding inner wall 231 and the insulating member 241. The grounding bottom 234 may be configured to surround the outer surface of the insulating member 241.

[0086] The insulating part 240 may include an insertion member 242 and a connection member 243.

[0087] The insertion member 242 is inserted between the grounding inner wall 231 and the grounding outer wall 232. As the insertion member 242 is inserted between the grounding inner wall 231 and the grounding outer wall 232, the insulating part 240 may be coupled to the grounding housing 230. The insertion member 242 may be inserted between the grounding inner wall 231 and the grounding outer wall 232 in an interference fit manner. The insertion member 242 may be disposed outside the insulating member 241. The insertion member 242 may be configured to surround the outside of the insulating member 241.

[0088] The connection member 243 is respectively coupled to the insertion member 242 and the insulating member 241. Through the connection member 243, the insertion member 242 and the insulating member 241 can be connected to each other. Based on the up-down direction, the connection member 243 can be formed to have a lower height than the insertion member 242 and the insulating member 241. Thereby, a space is provided between the insertion member 242 and the insulating member 241, and the plug connector can be inserted into this space. The connection member 243 can be disposed on the lower side of the grounding bottom 234. In this case, the grounding bottom 234 can be configured to cover the connection member 243. The connection member 243, the insertion member 242, and the connection member 243 can also be formed integrally.

[0089] Referring to Figures 2 to 7 , the insulating portion 240 may include a soldering inspection window 244 ( Figure 5 shown in

[0090] The soldering inspection window 244 may be formed to penetrate the insulating portion 240. The soldering inspection window 244 can be used to inspect the state in which the first RF mounting member 2111 is mounted on the first substrate. In this case, the first RF contact 211 may be coupled to the insulating portion 240 such that the first RF mounting member 2111 is located at the soldering inspection window 244. Thereby, the first RF mounting member 2111 is not blocked by the insulating portion 240. Therefore, in a state where the substrate connector 200 of the first embodiment is mounted on the first substrate, an operator can inspect the state in which the first RF mounting member 2111 is mounted on the first substrate through the soldering inspection window 244. Thus, in the substrate connector 200 of the first embodiment, even if all of the first RF contacts 211 including the first RF mounting member 2111 are located inside the grounding housing 230, the accuracy of the mounting operation of mounting the first RF contacts 211 to the first substrate can be improved. The soldering inspection window 244 may be formed to penetrate the insulating member 241.

[0091] The insulation part 240 may also include a plurality of the welding inspection windows 244. In this case, the second RF mounting member 2121 and the plurality of the transmission mounting members 2201 may be located at the plurality of the welding inspection windows 244. Therefore, in a state where the substrate connector 200 of the first embodiment is mounted on the first substrate, an operator can check the states in which the first RF mounting member 2111, the second RF mounting member 2121, and the plurality of the transmission mounting members 2201 are mounted on the first substrate through the welding inspection windows 244. Thereby, the substrate connector 200 of the first embodiment can improve the accuracy of the operation of mounting the first RF contact 211, the second RF contact 212, and the plurality of the transmission contacts 220 on the first substrate.

[0092] Referring to Figures 2 to 7 and Figure 14 , the substrate connector 200 of the first embodiment may include a first ground contact 250.

[0093] The first ground contact 250 is coupled to the insulation part 240. The first ground contact 250 is mounted on the first substrate so as to be grounded. The first ground contact 250 may be coupled to the insulation part 240 through an assembly process. The first ground contact 250 may also be integrally formed with the insulation part 240 by injection molding.

[0094] The first ground contact 250 may, together with the ground cover 230, achieve a shielding function for the first RF contact 211. In this case, as Figure 5As shown, the ground cover 230 may include a first double shielding wall 230b, a second double shielding wall 230c, a third double shielding wall 230d, and a fourth double shielding wall 230e. The first double shielding wall 230b, the second double shielding wall 230c, the third double shielding wall 230d, and the fourth double shielding wall 230e may be realized by the ground inner wall 231, the ground outer wall 232, and the ground connection wall 233 respectively. The first double shielding wall 230b and the second double shielding wall 230c are configured to face each other with respect to the first axial direction (X-axis direction). With respect to the first axial direction (X-axis direction), the first RF contact 211 may be provided between the first double shielding wall 230b and the second double shielding wall 230c. With respect to the first axial direction (X-axis direction), the first RF contact 211 may be located at a position where the distance between it and the first double shielding wall 230b is shorter than the distance between it and the second double shielding wall 230c. The third double shielding wall 230d and the fourth double shielding wall 230e may be configured to face each other with respect to the second axial direction (Y-axis direction). With respect to the second axial direction (Y-axis direction), the first RF contact 211 may be provided between the third double shielding wall 230d and the fourth double shielding wall 230e. With respect to the second axial direction (Y-axis direction), the first RF contact 211 may be separated from the third double shielding wall 230d and the fourth double shielding wall 230e by substantially the same distance.

[0095] With respect to the first axial direction (X-axis direction), the first ground contact 250 may be disposed between the first RF contact 211 and the plurality of transmission contacts 220. Thus, with respect to the first axial direction (X-axis direction), the first RF contact 211 may be located between the first double shielding wall 230b and the first ground contact 250, and with respect to the second axial direction (Y-axis direction), it may be located between the third double shielding wall 230d and the fourth double shielding wall 230e. Therefore, the substrate connector 200 of the first embodiment may utilize the first ground contact 250, the first double shielding wall 230b, the third double shielding wall 230d, and the fourth double shielding wall 230e to enhance the shielding function for the first RF contact 211.

[0096] The first ground contact 250, the first double shielding wall 230b, the third double shielding wall 230d, and the fourth double shielding wall 230e are arranged on four sides with respect to the first RF contact 211, and can achieve the shielding force for the RF signal. In this case, the first ground contact 250, the first double shielding wall 230b, the third double shielding wall 230d, and the fourth double shielding wall 230e can achieve a ground loop 250a ( Figure 14 shown in) of the first RF contact 211. Therefore, the substrate connector 200 of the first embodiment utilizes the ground loop 250a to further enhance the shielding function for the first RF contact 211, thereby enabling complete shielding of the first RF contact 211.

[0097] The first ground contact 250 can be formed of a material having electrical conductivity. For example, the first ground contact 250 can be formed of metal. When the plug connector is inserted into the inner space 230a, the first ground contact 250 can be connected to the ground contact of the plug connector.

[0098] Referring to Figures 2 to 7 and Figure 14 , the substrate connector 200 of the first embodiment can include a second ground contact 260.

[0099] The second ground contact 260 is coupled to the insulating portion 240. The second ground contact 260 is mounted on the first substrate and thus can be grounded. The second ground contact 260 can be coupled to the insulating portion 240 through an assembly process. The second ground contact 260 can also be integrally formed with the insulating portion 240 by injection molding.

[0100] The second ground contact 260 can, together with the ground cover 230, achieve the shielding function for the second RF contact 212. Based on the first axis direction (X-axis direction), the second ground contact 260 can be arranged between a plurality of the transmission contacts 220 and the second RF contact 212. Thus, based on the first axis direction (X-axis direction), the second RF contact 212 can be located between the second ground contact 260 and the second double shielding wall 230c, and based on the second axis direction (Y-axis direction), it can be located between the third double shielding wall 230d and the fourth double shielding wall 230e. Therefore, the substrate connector 200 of the first embodiment can utilize the second ground contact 260, the second double shielding wall 230c, the third double shielding wall 230d, and the fourth double shielding wall 230e to enhance the shielding function for the second RF contact 212.

[0101] The second ground contact 260, the second double shielding wall 230c, the third double shielding wall 230d, and the fourth double shielding wall 230e are arranged on four sides with respect to the second RF contact 212, and can achieve the shielding force for RF signals. In this case, the second ground contact 260, the second double shielding wall 230c, the third double shielding wall 230d, and the fourth double shielding wall 230e can achieve the ground loop 260a ( Figure 14 shown in) for the second RF contact 212. Therefore, the substrate connector 200 of the first embodiment utilizes the ground loop 260a to further enhance the shielding function for the second RF contact 212, thereby enabling complete shielding for the second RF contact 212.

[0102] The second ground contact 260 can be formed of a material having electrical conductivity. For example, the second ground contact 260 can be formed of metal. When the plug connector is inserted into the inner space 230a, the second ground contact 260 can be connected to the ground contact of the plug connector.

[0103] Referring to Figures 15 to 20 , the substrate connector 200 of the first embodiment can be implemented to more firmly bond the ground cover 230 and the insulating portion 240. The following is a detailed description thereof.

[0104] First, as Figure 15As shown, the insulating part 240 may include a protruding member 245. The protruding member 245 may protrude from the insertion member 242. The protruding member 245 may protrude from the inner side surface of the insertion member 242 facing the inner space 230a ( Figure 2 shown in) toward the inner space 230a ( Figure 2 shown in). When the grounding cover 230 and the insulating part 240 are combined, the protruding member 245 may press the grounding inner wall 231. The surface of the grounding inner wall 231 facing the insertion member 242 may be pressed by the protruding member 245. As the protruding member 245 presses the grounding inner wall 231, the grounding cover 230 and the insulating part 240 may be firmly combined by insertion. The protruding member 245 and the insertion member 242 may also be formed integrally. Although not shown, the insulating part 240 may also include a plurality of the protruding members 245. The plurality of protruding members 245 may protrude from the insertion member 242 at positions spaced apart from each other.

[0105] Next, as Figure 16 shown, the insulating part 240 may include the protruding member 245. The protruding member 245 may protrude from the insertion member 242. The protruding member 245 may protrude from the inner side surface of the insertion member 242 facing the inner space 230a ( Figure 2 shown in) toward the inner space 230a ( Figure 2 shown in).

[0106] The grounding cover 230 may include an inner wall hole 231b. The inner wall hole 231b may be formed through the grounding inner wall 231. When the grounding cover 230 and the insulating part 240 are combined, the protruding member 245 may be inserted into the inner wall hole 231b. Thus, the protruding member 245 supports the grounding inner wall 231, and therefore the grounding cover 230 and the insulating part 240 may be firmly combined. The protruding member 245 and the insertion member 242 may also be formed integrally. Although not shown, the insulating part 240 may also include a plurality of the protruding members 245. The plurality of protruding members 245 may protrude from the insertion member 242 at positions spaced apart from each other. In this case, the grounding cover 230 may include a plurality of the inner wall holes 231b. The plurality of inner wall holes 231b may be formed through the grounding inner wall 231 at positions spaced apart from each other.

[0107] Next, as Figure 17As shown, the insulating part 240 may include the protruding member 245. The protruding member 245 may protrude from the insertion member 242. The protruding member 245 may protrude outward in the outward direction from the outer side surface of the insertion member 242. The outer side surface of the insertion member 242 is the surface located on the side opposite to the inner side surface of the insertion member 242. The outward direction is the direction opposite to the direction toward the inner space 230a side.

[0108] The ground cover 230 may include an outer wall hole 232a. The outer wall hole 232a may be formed through the ground outer wall 232. When the ground cover 230 and the insulating part 240 are combined, the protruding member 245 may be inserted into the outer wall hole 232a. Thus, the protruding member 245 supports the ground outer wall 232, so that the ground cover 230 and the insulating part 240 can be firmly combined. The protruding member 245 and the insertion member 242 may also be formed integrally. Although not shown, the insulating part 240 may also include a plurality of the protruding members 245. The plurality of protruding members 245 may protrude from the insertion member 242 at positions spaced apart from each other. In this case, the ground cover 230 may include a plurality of the outer wall holes 232a. The plurality of outer wall holes 232a may be formed through the ground outer wall 232 at positions spaced apart from each other.

[0109] Next, as Figure 18 shown, the insulating part 240 may include a locking groove 241a. The locking groove 241a may be formed in the insulating member 241. The locking groove 241a may be formed on the surface of the insulating member 241 facing the insertion member 242 side. When the ground cover 230 and the insulating part 240 are combined, the ground arm 238 may be inserted into the locking groove 241a. Thus, the insulating member 241 supports the ground arm 238, so that the ground cover 230 and the insulating part 240 can be firmly combined.

[0110] Although not shown, elastic grooves may be formed in the grounding bottom 234. The elastic grooves may be located on both sides of the grounding arm 238. Through the elastic grooves, the displacement of the grounding arm 238 capable of elastically moving relative to the grounding bottom 234 can be increased. The elastic grooves may also be formed to extend from the grounding bottom 234 to the grounding inner wall 231. The grounding cover 230 may also include a plurality of the grounding arms 238. The plurality of the grounding arms 238 may be configured to protrude from the grounding bottom 234 at positions spaced apart from each other. In this case, the insulating portion 240 may include a plurality of the locking grooves 241a. The plurality of the locking grooves 241a may be formed in the insulating member 241 in a manner of being located at positions spaced apart from each other.

[0111] Next, as Figure 19 shown, when the grounding cover 230 and the insulating portion 240 are combined, the grounding arm 238 may be pressed by the first grounding contact 250. Since the first grounding contact 250 supports the grounding arm 238 in a state of being combined with the insulating portion 240, the grounding cover 230 and the insulating portion 240 may be firmly combined.

[0112] Although not shown, elastic grooves may be formed in the grounding bottom 234. The elastic grooves may be located on both sides of the grounding arm 238. Through the elastic grooves, the displacement of the grounding arm 238 capable of elastically moving relative to the grounding bottom 234 can be increased. The elastic grooves may also be formed to extend from the grounding bottom 234 to the grounding inner wall 231. The grounding cover 230 may also include a plurality of the grounding arms 238. The plurality of the grounding arms 238 may be configured to protrude from the grounding bottom 234 at positions spaced apart from each other. A part of the plurality of the grounding arms 238 may be pressed by the first grounding contact 250, and a part of the plurality of the grounding arms 238 may also be pressed by the second grounding contact 260 ( Figure 14 shown in). A part of the plurality of the grounding arms 238 may also be pressed by the transmission contact 220 ( Figure 14 shown in).

[0113] As Figure 20 shown, the insulating portion 240 may include an insertion groove 242a. The insertion groove 242a may be formed in the insertion member 242. The insertion groove 242a may be realized by a groove formed in the outer side surface of the insertion member 242 with a predetermined depth. A locking surface 242b configured to face the insertion groove 242a may be formed in the insertion member 242.

[0114] The grounding housing 230 may include a locking member 232b. The locking member 232b may be formed on the grounding outer wall 232. In this case, the grounding housing 230 may include a plurality of grounding outer walls 232 arranged at intervals from each other such that the grounding outer walls 232 are inserted into the insertion grooves 242a. The locking member 232b may protrude from opposite sides facing each other among the plurality of grounding outer walls 232. Thus, when the grounding housing 230 and the insulating portion 240 are coupled, the locking member 232b may press the locking surface 242b. In this case, the locking member 232b may be inserted into the locking surface 242b like a wedge. Accordingly, the grounding housing 230 and the insulating portion 240 may be firmly coupled. Although not illustrated, the insulating portion 240 may also include a plurality of the insertion grooves 242a. The plurality of insertion grooves 242a may be formed in the insertion member 242 at positions spaced apart from each other. In this case, the grounding housing 230 may include a plurality of grounding outer walls 232 formed with the locking member 232b. The plurality of grounding outer walls 232 are arranged at positions spaced apart from each other so as to be inserted into each of the plurality of insertion grooves 242a.

[0115] <The substrate connector 300 of the second embodiment>

[0116] Refer to Figure 2 and Figure 21 , the substrate connector 300 of the second embodiment may include a plurality of RF contacts 310, a plurality of transmission contacts 320, a grounding housing 330, and an insulating portion 340.

[0117] The RF contacts 310 are used to transmit RF signals. The plurality of RF contacts 310 may transmit ultra-high frequency RF signals. The plurality of RF contacts 310 may be supported by the insulating portion 340. The plurality of RF contacts 310 may be coupled to the insulating portion 340 through an assembly process. The plurality of RF contacts 310 may also be integrally formed with the insulating portion 340 by injection molding.

[0118] A plurality of the RF contacts 310 may be arranged at intervals from each other. The plurality of RF contacts 310 are mounted on the second substrate so as to be electrically connected to the second substrate. The plurality of RF contacts 310 are connected to a plurality of RF contacts included in the jack connector so as to be electrically connected to the first substrate on which the jack connector is mounted. Accordingly, the second substrate and the first substrate can be electrically connected. In this case, the jack connector may also be implemented by the substrate connector 200 of the first embodiment. On the other hand, the plug connector in the substrate connector 200 of the first embodiment may also be implemented by the substrate connector 300 of the second embodiment.

[0119] A first RF contact 311 among the plurality of RF contacts 310 and a second RF contact 312 among the plurality of RF contacts 310 may be spaced apart from each other in the first axial direction (X-axis direction). The first RF contact 311 and the second RF contact 312 may be supported by the insulating portion 340 at positions spaced apart from each other in the first axial direction (X-axis direction). Figure 22 The substrate connector 300 of the second embodiment is shown to include two RF contacts 310, but is not limited thereto, and the substrate connector 300 of the second embodiment may include three or more RF contacts 310. On the other hand, in the present specification, the case where the substrate connector 300 of the second embodiment includes two RF contacts 310 will be described as a reference.

[0120] The first RF contact 311 may include a first RF mounting member 3111. The first RF mounting member 3111 may be mounted on the second substrate. Accordingly, the first RF contact 311 can be electrically connected to the second substrate through the first RF mounting member 3111. The first RF contact 311 may be formed of a material having electrical conductivity. For example, the first RF contact 311 may be formed of metal. The first RF contact 311 may be connected to any one of the plurality of RF contacts included in the jack connector.

[0121] The second RF contact 312 may include a second RF mounting member 3121. The second RF mounting member 3121 may be mounted on the second substrate. Accordingly, the second RF contact 312 can be electrically connected to the second substrate through the second RF mounting member 3121. The second RF contact 312 may be formed of a material having electrical conductivity. For example, the second RF contact 312 may be formed of metal. The second RF contact 312 may be connected to any one of the plurality of RF contacts included in the jack connector.

[0122] Refer to Figure 2 、 Figure 21 and Figure 22 , a plurality of the transmission contact members 320 are coupled to the insulating portion 340. The plurality of the transmission contact members 320 can function to transmit signals (Sinal), data, etc. The plurality of the transmission contact members 320 can be coupled to the insulating portion 340 through an assembling process. The plurality of the transmission contact members 320 can also be integrally formed with the insulating portion 340 by injection molding.

[0123] Based on the first axis direction (X-axis direction), the plurality of the transmission contact members 320 can be disposed between the first RF contact member 311 and the second RF contact member 312. Thus, in order to reduce RF signal interference between the first RF contact member 311 and the second RF contact member 312, the plurality of the transmission contact members 320 can be disposed in a space separating the first RF contact member 311 and the second RF contact member 312. Therefore, the substrate connector 300 of the second embodiment can not only reduce RF signal interference by expanding the distance between the first RF contact member 311 and the second RF contact member 312 from each other, but also improve the space utilization rate of the insulating portion 340 by disposing the plurality of the transmission contact members 320 in the separating space therebetween.

[0124] The plurality of the transmission contact members 320 can be disposed at intervals from each other. The plurality of the transmission contact members 320 are mounted on the second substrate, so as to be electrically connected to the second substrate. In this case, the transmission mounting members 3201 each of the plurality of the transmission contact members 320 has can be mounted on the second substrate. The plurality of the transmission contact members 320 can be formed of a material having electrical conductivity. For example, the plurality of the transmission contact members 320 can be formed of metal. The plurality of the transmission contact members 320 are connected to the plurality of transmission contact members of the jack connector, so as to be electrically connected to the second substrate on which the jack connector is mounted. Thus, the second substrate and the second substrate can be electrically connected.

[0125] On the other hand, Figure 22 The substrate connector 300 of the second embodiment is shown to include four transmission contact members 320, but is not limited thereto. The substrate connector 300 of the second embodiment can include five or more transmission contact members 320. The plurality of the transmission contact members 320 can be spaced apart from each other along the first axis direction (X-axis direction) and the second axis direction (Y-axis direction).

[0126] Refer toFigures 21 to 24 , the ground cover 330 is combined with the insulating part 340. The ground cover 330 is installed on the second substrate so that it can be grounded. Thus, the ground cover 330 can achieve the function of shielding signals, electromagnetic waves, etc. for a plurality of the RF contacts 310. In this case, the ground cover 330 can prevent the electromagnetic waves generated from the plurality of the RF contacts 310 from being interfered by the signals of the circuit components located around the electronic device, and can prevent the electromagnetic waves generated from the circuit components located around the electronic device from being interfered by the RF signals transmitted by the plurality of the RF contacts 310. Thus, the substrate connector 300 of the second embodiment can use the ground cover 330 to improve the EMI (Electro Magnetic Interference) shielding performance and EMC (Electro Magnetic Compatibility) performance. The ground cover 330 can be formed of a material having electrical conductivity. For example, the ground cover 330 can be formed of metal.

[0127] The ground cover 330 can be configured to surround the side of the inner space 330a. The insulating part 340 can be provided in the inner space 330a. The first RF contact 311, the second RF contact 312, and a plurality of the transmission contacts 22 can all be located in the inner space 330a. In this case, the first RF mounting member 3111, the second RF mounting member 3121, and a plurality of the transmission mounting members 3201 can also all be located in the inner space 330a. Therefore, by implementing a shielding wall for both the first RF contact 311 and the second RF contact 312, the ground cover 330 can strengthen the shielding function for the first RF contact 311 and the second RF contact 312, thereby achieving complete shielding. The jack connector can be inserted into the inner space 330a. In this case, a part of the jack connector is inserted into the inner space 330a, and a part of the substrate connector 300 of the second embodiment can be inserted into the inner space of the jack connector.

[0128] The ground cover 330 can be configured to surround all sides with respect to the inner space 330a. The inner space 330a can be configured inside the ground cover 330. When the ground cover 330 is integrally formed in a rectangular ring shape, the inner space 330a can be formed in a cuboid shape. In this case, the ground cover 330 can be configured to surround four sides with respect to the inner space 330a.

[0129] Refer toFigures 21 to 25 The grounding housing 330 may include a grounding sidewall 331, a grounding bottom wall 332, and a grounding top wall 333.

[0130] The grounding sidewall 331 may be configured to surround the side of the inner space 330a. The grounding sidewall 331 may be configured to surround all sides with respect to the inner space 330a. When the jack connector is inserted into the inner space 330a, the grounding sidewall 331 may be connected to the grounding housing of the jack connector. In this case, the grounding sidewall 331 may be connected to the grounding inner wall 231. The grounding sidewall 331 may be formed in a plate shape arranged in the vertical direction.

[0131] The grounding bottom wall 332 protrudes from the lower end of the grounding sidewall 331 to the opposite side of the inner space 330a. That is, the grounding bottom wall 332 may protrude to the outside of the grounding sidewall 331. The grounding bottom wall 332 may be formed in an annular shape that extends along the lower end of the grounding sidewall 331 and is closed. The grounding bottom wall 332 is mounted on the second substrate, so that it can be grounded. Thus, through the grounding bottom wall 332, the grounding sidewall 331 and the grounding top wall 333 can be grounded. That is, the grounding housing 330 can be grounded through the grounding bottom wall 332. When the jack connector is inserted into the inner space 330a, the grounding bottom wall 332 may be connected to the grounding housing of the jack connector. In this case, the grounding bottom wall 332 may be connected to the grounding connection wall 233. The grounding bottom wall 332 may be formed in a plate shape arranged in the horizontal direction.

[0132] The grounding top wall 333 protrudes from the upper end of the grounding sidewall 331 to the inner space 330a side. The grounding top wall 333 may be formed in an annular shape that extends along the upper end of the grounding sidewall 331 and is closed. When the jack connector is inserted into the inner space 330a, the grounding top wall 333 may be connected to the grounding housing of the jack connector. In this case, the grounding top wall 333 may be connected to the grounding bottom 234. The grounding top wall 333 may be formed in a plate shape arranged in the horizontal direction.

[0133] The upper ground wall 333, the lower ground wall 332, and the ground side wall 331 may also be formed integrally. In this case, the ground cover 330 may also be integrally formed without seams. The ground cover 330 may be integrally formed without seams by a metal injection process such as die casting or MIM (Metal Injection Molding). The ground cover 330 may also be integrally formed without seams by CNC (Computer Numerical Control) machining, MCT (Machining Center Tool) machining, etc.

[0134] Referring to Figures 8 to 26 , in order to further enhance the shielding function by improving the contact between the ground side wall 331 and the ground cover of the jack connector, the ground cover 330 may include the following configuration.

[0135] First, as Figure 8 shown, the ground cover 330 may include a connecting protrusion 335. The connecting protrusion 335 may be formed on the outer surface of the ground side wall 331. The connecting protrusion 335 may protrude from the outer surface of the ground side wall 331. The connecting protrusion 335 may be inserted into the ground cover 330 of the jack connector. In this case, the connecting protrusion 335 may be inserted into the connecting groove 235 of the ground cover 330 of the jack connector. Thus, the substrate connector 300 of the second embodiment uses the connecting protrusion 335 to improve the contact between the ground cover 330 and the ground cover 330 of the jack connector, thereby further enhancing the shielding function for the first RF contact 311 and the second RF contact 312. Figure 8 It is shown that the connecting protrusion 335 is formed to be shorter than the connecting groove 235 in the vertical direction, but it is not limited thereto. The connecting protrusion 335 and the connecting groove 235 may also be formed to have substantially the same length. The ground cover 330 may also include a plurality of the connecting protrusions 335. In this case, the plurality of connecting protrusions 335 may be arranged at intervals along the outer surface of the ground side wall 331.

[0136] Next, as Figure 9As shown, the ground cover 330 may include a connection groove 334. The connection groove 334 may be formed on the outer surface of the ground sidewall 331. The connection groove 334 may be implemented as a groove formed at a predetermined depth on the outer surface of the ground sidewall 331. The ground cover 330 of the jack connector may be inserted into the connection groove 334. In this case, the connection protrusion 236 of the ground cover 330 of the jack connector may be inserted into the connection groove 334. Thus, the substrate connector 300 of the second embodiment uses the connection groove 334 to improve the contact between the ground cover 330 and the ground cover 330 of the jack connector, thereby further enhancing the shielding function for the first RF contact 311 and the second RF contact 312. Figure 9 It is shown that the connection groove 334 is formed to be longer than the connection protrusion 236 in the vertical direction, but it is not limited thereto, and the connection groove 334 and the connection protrusion 236 may also be formed to have substantially the same length. On the other hand, the ground sidewall 331 supports the connection protrusion 236 inserted into the connection groove 334, thereby also preventing the connection protrusion 236 from detaching from the connection groove 334. The ground cover 330 may also include a plurality of the connection grooves 334. In this case, the plurality of connection grooves 334 may be arranged at intervals from each other along the outer surface of the ground sidewall 331.

[0137] Next, as Figure 10 shown, when the ground cover 330 includes the connection protrusion 335, the connection protrusion 335 may also be supported by the connection protrusion 236 of the ground cover 330 of the jack connector. Thus, the substrate connector 300 of the second embodiment uses the connection protrusion 335 to improve the contact between the ground cover 330 and the ground cover 330 of the jack connector, thereby further enhancing the shielding function for the first RF contact 311 and the second RF contact 312. On the other hand, the connection protrusion 335 is disposed below the connection protrusion 236, so that it can be supported by the connection protrusion 236.

[0138] Next, as Figure 11 shown, the ground cover 330 may also contact the ground cover 330 of the jack connector through surface contact between the outer surface of the ground sidewall 331 and the ground cover 330 of the jack connector. In this case, a gap may occur between the outer surface of the ground sidewall 331 and the ground cover 330 of the jack connector. To compensate for this, as Figure 26As shown, the grounding housing 330 may include a conductive member 336. The conductive member 336 may be coupled to the outer surface of the grounding sidewall 331. The conductive member 336 may be formed to extend along the outer surface of the grounding sidewall 331 including the corner portion 3301 ( Figure 24 shown in) to form a closed loop shape. Thus, the substrate connector 300 of the second embodiment uses the conductive member 336 to improve the contact between the grounding housing 330 and the grounding housing 330 of the jack connector, thereby further enhancing the shielding function for the first RF contact 311 and the second RF contact 312. Additionally, in the case of the embodiment using the connection protrusion 335 and the connection groove 334, it is difficult to perform operations on the corner portion 3301 on the outer surface of the grounding sidewall 331. However, in the case of the embodiment using the conductive member 336, the ease of performing operations on the corner portion 3301 on the outer surface of the grounding sidewall 331 can be improved. The conductive member 336 may be formed of a material having electrical conductivity to electrically connect the grounding sidewall 331 and the grounding housing 330 of the jack connector. For example, the conductive member 336 may be formed of metal. After being separately manufactured, the conductive member 336 may be coupled to the grounding sidewall 331 by mounting, attaching, fastening, etc. on the outer surface of the grounding sidewall 331. The conductive member 336 may also be coupled to the grounding sidewall 331 by coating the outer surface of the grounding sidewall 331 with a conductive shielding material.

[0139] Referring to Figures 13 to 26 , the grounding housing 330 may include a ground plate 337 ( Figure 13 shown in).

[0140] The ground plate 337 protrudes from the ground upper wall 333 toward the inner space 330a. When the jack connector is inserted into the inner space 330a, the ground plate 337 can press the ground shield 230 of the jack connector. In this case, the ground plate 337 can cause the ground arm 238 of the ground shield 230 to rotate and move downward by pressing the ground arm 238. Thus, the ground arm 238 presses the ground plate 337 by the restoring force, so as to strongly contact the ground plate 337. Therefore, the substrate connector 300 of the second embodiment can improve the contact between the ground shield 330 and the ground shield 230 of the jack connector by using the ground plate 337, thereby further strengthening the shielding function for the first RF contact 311 and the second RF contact 312. The ground shield 330 may also include a plurality of the ground plates 337. In this case, the plurality of the ground plates 337 may be arranged at intervals from each other along the ground upper wall 333.

[0141] Referring to Figures 21 to 26 , the insulating part 340 supports a plurality of the RF contacts 310. A plurality of the RF contacts 310 and a plurality of the transmission contacts 320 may be coupled to the insulating part 340. The insulating part 340 may be formed of an insulating material. The insulating part 340 may be coupled to the ground shield 330 such that a plurality of the RF contacts 310 are located in the inner space 330a. The insulating part 340 may also be coupled to the ground shield 330 in an interference fit manner.

[0142] The insulating part 340 may include a soldering inspection window 341 ( Figure 23 shown in

[0143] The welding inspection window 341 may be formed to penetrate the insulating portion 340. The welding inspection window 341 may be used to inspect the state in which the first RF mounting member 3111 is mounted on the second substrate. In this case, the first RF contact 311 may be coupled to the insulating portion 340 such that the first RF mounting member 3111 is located in the welding inspection window 341. Thus, the first RF mounting member 3111 is not blocked by the insulating portion 340. Therefore, in a state where the substrate connector 300 of the second embodiment is mounted on the second substrate, an operator can inspect the state in which the first RF mounting member 3111 is mounted on the second substrate through the welding inspection window 341. Thus, in the substrate connector 300 of the second embodiment, even if all of the first RF contacts 311 including the first RF mounting member 3111 are located inside the ground cover 330, the accuracy of the installation operation of mounting the first RF contacts 311 to the second substrate can be improved. The welding inspection window 341 may be formed to penetrate the insulating member 241.

[0144] The insulating portion 340 may also include a plurality of the welding inspection windows 341. In this case, the second RF mounting member 3121 and the plurality of transmission mounting members 3201 may be located in the plurality of welding inspection windows 341. Therefore, in a state where the substrate connector 300 of the second embodiment is mounted on the second substrate, an operator can inspect the states in which the first RF mounting member 3111, the second RF mounting member 3121, and the plurality of transmission mounting members 3201 are mounted on the second substrate through the plurality of welding inspection windows 341. Thus, the substrate connector 300 of the second embodiment can improve the accuracy of the operation of mounting the first RF contact 311, the second RF contact 312, and the plurality of transmission contacts 320 to the second substrate.

[0145] Referring to Figures 21 to 27 , the substrate connector 300 of the second embodiment may include a first ground contact 350.

[0146] The first ground contact 350 is coupled to the insulating portion 340. The first ground contact 350 is mounted on the second substrate so as to be grounded. The first ground contact 350 may be coupled to the insulating portion 340 through an assembly process. The first ground contact 350 may also be integrally formed with the insulating portion 340 by injection molding.

[0147] The first ground contact 350 may, together with the ground cover 330, achieve a shielding function for the first RF contact 311. In this case, as Figure 23 and Figure 27As shown, the ground cover 330 may include a first shielding wall 330b, a second shielding wall 330c, a third shielding wall 330d, and a fourth shielding wall 330e. The first shielding wall 330b, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e may be realized by the ground sidewall 331, the ground bottom wall 332, and the ground top wall 333, respectively. The first shielding wall 330b and the second shielding wall 330c are configured to face each other with respect to the first axis direction (X-axis direction). With respect to the first axis direction (X-axis direction), the first RF contact 311 may be provided between the first shielding wall 330b and the second shielding wall 330c. With respect to the first axis direction (X-axis direction), the first RF contact 311 may be located at a position where the distance between it and the first shielding wall 330b is shorter than the distance between it and the second shielding wall 330c. The third shielding wall 330d and the fourth shielding wall 330e are configured to face each other with respect to the second axis direction (Y-axis direction). With respect to the second axis direction (Y-axis direction), the first RF contact 311 may be provided between the third shielding wall 330d and the fourth shielding wall 330e. With respect to the second axis direction (Y-axis direction), the first RF contact 311 may be separated from the third shielding wall 330d and the fourth shielding wall 330e by substantially the same distance.

[0148] With respect to the first axis direction (X-axis direction), the first ground contact 350 may be disposed between the first RF contact 311 and the plurality of transmission contacts 320. Thus, with respect to the first axis direction (X-axis direction), the first RF contact 311 may be located between the first shielding wall 330b and the first ground contact 350, and with respect to the second axis direction (Y-axis direction), may be located between the third shielding wall 330d and the fourth shielding wall 330e. Therefore, the substrate connector 300 of the second embodiment can utilize the first ground contact 350, the first shielding wall 330b, the third shielding wall 330d, and the fourth shielding wall 330e to enhance the shielding function of the first RF contact 311.

[0149] The first ground contact 350, the first shielding wall 330b, the third shielding wall 330d, and the fourth shielding wall 330e can be arranged on four sides with respect to the first RF contact 311, so as to achieve the shielding force for RF signals. In this case, the first ground contact 350, the first shielding wall 330b, the third shielding wall 330d, and the fourth shielding wall 330e can form a ground loop 350a ( Figure 27 shown in) for the first RF contact 311. Therefore, the substrate connector 300 of the second embodiment utilizes the ground loop 350a to further enhance the shielding function for the first RF contact 311, thereby enabling complete shielding of the first RF contact 311.

[0150] The first ground contact 350 can be formed of a material having electrical conductivity. For example, the first ground contact 350 can be formed of metal. When the jack connector is inserted into the inner space 330a, the first ground contact 350 can be connected to the ground contact of the jack connector.

[0151] The substrate connector 300 of the second embodiment can also include a plurality of the first ground contacts 350. The plurality of the first ground contacts 350 can be arranged at intervals along the second axis direction (Y-axis direction). As the first ground contacts 350 are connected to the ground contacts of the jack connector, the gaps formed by the plurality of the first ground contacts 350 being spaced apart from each other can be blocked.

[0152] Referring to Figures 21 to 27 , the substrate connector 300 of the second embodiment can include a second ground contact 360.

[0153] The second ground contact 360 is coupled to the insulating portion 340. The second ground contact 360 is mounted on the second substrate so as to be grounded. The second ground contact 360 can be coupled to the insulating portion 340 through an assembly process. The second ground contact 360 can also be integrally formed with the insulating portion 340 by injection molding.

[0154] The second ground contact 360 can, together with the ground cover 330, achieve the shielding function for the second RF contact 312. Based on the first axis direction (X-axis direction), the second ground contact 360 can be arranged between a plurality of the transmission contacts 320 and the second RF contact 212. Thus, based on the first axis direction (X-axis direction), the second RF contact 312 can be located between the second ground contact 360 and the second shielding wall 330c, and based on the second axis direction (Y-axis direction), it can be located between the third shielding wall 330d and the fourth shielding wall 330e. Therefore, the substrate connector 300 of the second embodiment can utilize the second ground contact 360, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e to enhance the shielding function for the second RF contact 312.

[0155] The second ground contact 360, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e can be arranged on four sides with respect to the second RF contact 312, thereby enabling the shielding force for RF signals. In this case, the second ground contact 360, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e can form a ground loop 360a for the second RF contact 312 ( Figure 27 shown in). Therefore, the substrate connector 300 of the second embodiment can utilize the ground loop 360a to further enhance the shielding function for the second RF contact 312, thereby enabling the complete shielding of the second RF contact 312.

[0156] The second ground contact 360 can be formed of a material having electrical conductivity. For example, the second ground contact 360 can be formed of metal. When the jack connector is inserted into the inner space 330a, the second ground contact 360 can be connected to the ground contact of the jack connector.

[0157] The substrate connector 300 of the second embodiment can also include a plurality of the second ground contacts 360. The plurality of the second ground contacts 360 can be arranged at intervals from each other along the second axis direction (Y-axis direction). As the second ground contacts 360 are connected to the ground contacts of the jack connector, the gaps formed by the plurality of the second ground contacts 360 being spaced apart from each other can be blocked.

[0158] The present invention described above is not limited to the foregoing embodiments and drawings, and those of ordinary skill in the art to which the present invention pertains can clearly understand that various substitutions, deformations, and changes can be made without departing from the technical idea of the present invention.

Claims

1. A substrate connector, characterized in that, Comprising: A plurality of RF contacts for transmitting RF signals; An insulating portion for supporting the plurality of RF contacts; A plurality of transmission contacts coupled to the insulating portion between a first RF contact among the plurality of RF contacts and a second RF contact among the plurality of RF contacts, such that the first RF contact and the second RF contact are spaced apart from each other in a first axial direction; And A ground cover coupled with the insulating portion, The ground cover includes a ground inner wall facing the insulating portion, a ground outer wall spaced apart from the ground inner wall, and ground connection walls respectively coupled to the ground inner wall and the ground outer wall, The ground inner wall and the ground outer wall are double shielding walls on the sides surrounding an inner space, The first RF contact and the second RF contact are located in the inner space surrounded by the double shielding walls.

2. The substrate connector according to claim 1, wherein The ground cover includes a ground bottom protruding from the ground inner wall toward the inner space side, The insulating portion includes an insulating member for supporting the plurality of RF contacts and the plurality of transmission contacts, The ground bottom is located between the ground inner wall and the insulating member.

3. The substrate connector according to claim 2, wherein The insulating portion includes: An insertion member inserted between the ground inner wall and the ground outer wall; and A connection member respectively coupled to the insertion member and the insulating member, The ground bottom is configured to cover the connection member.

4. The substrate connector according to claim 1, wherein The ground cover is integrally formed without seams.

5. The substrate connector according to claim 1, wherein Including a first ground contact coupled to the insulating portion between the first RF contact and the plurality of transmission contacts, The ground cover includes: A first double shielding wall and a second double shielding wall configured to face each other with respect to the first axial direction; and A third double shielding wall and a fourth double shielding wall configured to face each other with respect to a second axial direction perpendicular to the first axial direction, With respect to the first axial direction, the first RF contact is located between the first double shielding wall and the first ground contact, and with respect to the second axial direction, the first RF contact is located between the third double shielding wall and the fourth double shielding wall.

6. The substrate connector according to claim 5, wherein The first double shielding wall, the first ground contact, the third double shielding wall, and the fourth double shielding wall are arranged on four sides with respect to the first RF contact to achieve a shielding force for RF signals.

7. The substrate connector according to claim 5, wherein Including a second ground contact coupled to the insulating portion between the second RF contact and the plurality of transmission contacts, Based on the first axis direction, the second RF contact is located between the second double shielding wall and the second ground contact. Based on the second axis direction, the second RF contact is located between the third double shielding wall and the fourth double shielding wall.

8. The substrate connector according to claim 7, wherein the second double shielding wall, the second ground contact, the third double shielding wall, and the fourth double shielding wall are arranged on four sides with respect to the second RF contact to achieve the shielding force for RF signals.

9. The substrate connector according to claim 1, wherein the ground cover includes a connection groove formed on the inner surface of the ground inner wall.

10. The substrate connector according to claim 1, wherein the ground cover includes a connection protrusion protruding from the inner surface of the ground inner wall.

11. The substrate connector according to claim 1, wherein the ground cover includes a conductive member coupled to the inner surface of the ground inner wall, and the conductive member is formed in a closed ring shape and extends along the inner surface of the ground inner wall including the corner portion of the inner surface of the ground inner wall.

12. The substrate connector according to claim 1, wherein the ground cover includes: a ground bottom protruding from the ground inner wall toward the inner space side; and a ground arm protruding from the ground bottom toward the inner space side, and the ground arm is inclined such that the height becomes higher as it protrudes more toward the inner space side.

13. The substrate connector according to claim 1, wherein the first RF contact includes a first RF mounting member for mounting to a substrate, and the first RF mounting member is coupled to the insulating portion such that the first RF mounting member is located in a welding inspection window formed by penetrating the insulating portion.

14. The substrate connector according to claim 1, wherein the first RF contact includes a first RF mounting member for mounting to a substrate, and the first RF mounting member is coupled to the insulating portion such that the first RF mounting member is located at a position corresponding to a welding inspection window formed by penetrating the ground cover.

15. The substrate connector according to claim 1, wherein the ground cover includes a ground bottom protruding from the ground inner wall toward the inner space side, and the ground bottom is connected to the ground cover of a plug connector inserted into the inner space and is connected to a ground upper wall of the ground cover of the plug connector.

16. The substrate connector according to claim 1, wherein the ground outer wall is mounted on a substrate, and the ground cover is grounded through the ground outer wall mounted on the substrate.

17. A substrate connector, characterized in that, Comprising: a plurality of RF contacts for transmitting RF signals; an insulating portion for supporting the plurality of RF contacts; A plurality of transmission contact members are combined with the insulating portion between a first RF contact member among the plurality of RF contact members and a second RF contact member among the plurality of RF contact members, such that the first RF contact member and the second RF contact member are spaced apart from each other in a first axial direction; and a ground cover, combined with the insulating portion, the ground cover includes a ground side wall surrounding a side of an inner space, a ground upper wall protruding toward the inner space side from an upper end of the ground side wall, and a ground lower wall protruding toward the opposite side of the inner space from a lower end of the ground side wall, the first RF contact member and the second RF contact member are located in the inner space surrounded by the ground side wall, the ground upper wall, and the ground lower wall.

18. The substrate connector according to claim 17, wherein the ground cover is integrally formed without seams.

19. The substrate connector according to claim 17, wherein it includes a first ground contact member combined with the insulating portion between the first RF contact member and the plurality of transmission contact members, the ground cover includes: a first shielding wall and a second shielding wall configured to face each other with respect to the first axial direction; and a third shielding wall and a fourth shielding wall facing each other with respect to a second axial direction perpendicular to the first axial direction, with respect to the first axial direction, the first RF contact member is located between the first shielding wall and the first ground contact member, and with respect to the second axial direction, the first RF contact member is located between the third shielding wall and the fourth shielding wall.

20. The substrate connector according to claim 19, wherein the first shielding wall, the first ground contact member, the third shielding wall, and the fourth shielding wall are arranged on four sides with respect to the first RF contact member to achieve a shielding force for RF signals.

21. The substrate connector according to claim 19, wherein it includes a second ground contact member combined with the insulating portion between the second RF contact member and the plurality of transmission contact members, with respect to the first axial direction, the second RF contact member is located between the second shielding wall and the second ground contact member, and with respect to the second axial direction, the second RF contact member is located between the third shielding wall and the fourth shielding wall.

22. The substrate connector according to claim 21, wherein the second shielding wall, the second ground contact member, the third shielding wall, and the fourth shielding wall are arranged on four sides with respect to the second RF contact member to achieve a shielding force for RF signals.

23. The substrate connector according to claim 17, wherein the ground cover includes a connection groove formed on an outer surface of the ground side wall.

24. The substrate connector according to claim 17, wherein the ground cover includes a connection protrusion protruding from an outer surface of the ground side wall.

25. The substrate connector according to claim 17, wherein The grounding housing includes a conductive member coupled to an outer surface of the grounding sidewall, The conductive member is formed in a closed loop shape to extend along the outer surface of the grounding sidewall including a corner portion of the outer surface of the grounding sidewall.

26. The substrate connector according to claim 17, wherein The grounding housing includes a grounding plate protruding from the grounding upper wall toward the inner space side.

27. The substrate connector according to claim 17, wherein The first RF contact includes a first RF mounting member for mounting to a substrate, and the first RF mounting member is coupled to the insulating portion such that the first RF mounting member is located in a soldering inspection window formed by penetrating the insulating portion.

28. The substrate connector according to claim 17, wherein The grounding lower wall is mounted to a substrate, The grounding housing is grounded through the grounding lower wall mounted to the substrate.

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