Substrate processing apparatus and method of processing a cylindrical shield

Abstract

The present application provides a substrate processing apparatus and a processing method of a cylindrical shield. The substrate processing apparatus includes a rotation holding member that rotates a substrate held thereby around a prescribed rotation axis, a liquid supply member that supplies a liquid to the substrate held by the rotation holding member, and a cylindrical shield made of resin that surrounds the substrate held by the rotation holding member. The cylindrical shield has an inner circumferential surface and a concave-convex portion provided on the inner circumferential surface. The concave-convex portion has a plurality of concave portions and a plurality of convex portions between mutually adjacent ones of the concave portions. The concave portions have a width smaller than a diameter of a liquid droplet flying from the substrate held by the rotation holding member and a depth that prevents the liquid droplet from contacting a bottom of the concave portion in a state where the liquid droplet contacts the plurality of convex portions. The convex portions have a width smaller than the diameter of the liquid droplet and smaller than the width of the concave portions.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate processing apparatus that processes a substrate, and a processing method of a cylindrical shield used for the substrate processing apparatus that processes a substrate. The substrate to be processed includes, for example, a semiconductor wafer, a substrate for a FPD (Flat Panel Display) such as a liquid crystal display device and an organic EL (Electroluminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a reticle, a ceramic substrate, a substrate for a solar cell, and the like. BACKGROUND

[0002] Japanese Patent Application Publication No. 2020-155590 and Japanese Patent Application Publication No. 2018-166135 disclose a substrate processing apparatus that has a cylindrical cup formed with a plurality of longitudinal grooves.

[0003] The cup of Japanese Patent Application Publication No. 2020-155590 and Japanese Patent Application Publication No. 2018-166135 catches liquid in a state of droplets scattered from a substrate, and causes the liquid to slide along the side surfaces or the bottom surface of the plurality of grooves. Thus, it is possible to suppress splashing (rebound) of the droplets from the cup. A new structure that achieves suppression of splashing of the droplets from the inner peripheral surface of the cup is sought. SUMMARY

[0004] Therefore, an object of the present application is to provide a substrate processing apparatus and a processing method of a cylindrical shield that can suppress scattering of droplets from the cylindrical shield toward a substrate.

[0005] One embodiment of the present application provides a substrate processing apparatus including: a rotation holding member that rotates a substrate around a prescribed rotation axis while holding the substrate; a liquid supply member that supplies a liquid to the substrate held by the rotation holding member; and a cylindrical shield made of resin that surrounds the substrate held by the rotation holding member.

[0006] The cylindrical shield in the substrate processing apparatus has an inner peripheral surface and a concave-convex portion provided on the inner peripheral surface, the concave-convex portion having a plurality of concave portions and a plurality of convex portions between the concave portions adjacent to each other. The concave portion has a width smaller than a diameter of a droplet of the liquid scattered from the substrate held by the rotation holding member, and a depth that does not allow the droplet to contact a bottom of the concave portion in a state where the droplet contacts the plurality of convex portions. The convex portion has a width smaller than the diameter of the droplet and smaller than the width of the concave portion.

[0007] According to the substrate processing apparatus, it is possible to supply liquid from the liquid supply member to the substrate held by the rotary holding member. When liquid is supplied to the substrate in the rotating state, liquid droplets are scattered from the substrate in the rotating state, and it is possible to catch the liquid droplets scattered from the substrate by the inner peripheral surface of the resin-made cylindrical guard.

[0008] The concave-convex portion provided on the inner peripheral surface of the cylindrical guard has a plurality of concave portions and a plurality of convex portions between adjacent concave portions. The concave portions have a width smaller than the diameter of the liquid droplets, and the convex portions have a width smaller than the diameter of the liquid droplets and smaller than the width of the concave portions. Therefore, the liquid droplets caught by the concave-convex portion of the inner peripheral surface do not completely enter the concave portions and come into contact with the plurality of convex portions. In addition, the depth of the concave portions is a depth at which the liquid droplets do not come into contact with the bottoms of the concave portions in a state in which the liquid droplets come into contact with the plurality of convex portions. If the concave-convex portion and the liquid droplets have such a dimensional relationship, it is possible to reduce the area of contact of the liquid droplets with the inner peripheral surface of the cylindrical guard compared to a flat surface on which the concave-convex portion is not formed. Therefore, it is possible to make the contact angle of the liquid droplets with the concave-convex portion larger than the contact angle of the liquid droplets with the flat surface on which the concave-convex portion is not formed. That is, it is possible to improve the hydrophobicity of the inner peripheral surface.

[0009] Therefore, it is possible to suppress the liquid droplets scattered from the substrate and caught by the inner peripheral surface of the cylindrical guard from remaining on the inner peripheral surface. Therefore, it is possible to reduce the amount of liquid droplets remaining on the inner peripheral surface of the cylindrical guard. As a result, it is possible to well suppress the liquid droplets scattered from the substrate from being scattered from the inner peripheral surface toward the substrate due to the collision of the liquid droplets newly scattered from the substrate with the liquid droplets remaining on the inner peripheral surface. Therefore, it is possible to achieve the suppression of the scattering of the liquid droplets from the cylindrical guard toward the substrate.

[0010] The diameter of the liquid droplets scattered from the substrate rotating at a rotational speed of 600 rpm or more and 1200 rpm or less is mainly 1.5 mm or less. If the depth of the concave portions is 10 μm or more and the width of the concave portions and the width of the convex portions are smaller than 1.5 mm, it is possible to effectively suppress the liquid droplets having a diameter of 1.5 mm or less from coming into contact with the bottoms of the concave portions and to hydrophobize the liquid droplets having a diameter of 1.5 mm or less.

[0011] In particular, if the width of the concave portions is 100 μm or more and smaller than 1.0 mm, the depth of the concave portions is 200 μm or less, and the width of the convex portions is 40 μm or less, it is possible to effectively suppress the liquid droplets having a diameter of 1.5 mm or less from coming into contact with the bottoms of the concave portions and to well hydrophobize the inner peripheral surface. The average surface roughness of the concave-convex portion having such a dimensional relationship is 3.0 or more and 6.0 or less.

[0012] In one embodiment of the present application, the plurality of recesses include a plurality of circular groove portions extending along the circumference of the inner circumferential surface. Furthermore, the plurality of circular groove portions are provided at the inner circumferential surface at intervals in the axial direction along the central axis of the inner circumferential surface. Thus, the hydrophobicity of the inner circumferential surface can be improved over the entire region in the circumferential direction of the inner circumferential surface. Thus, the liquid droplets flying from the substrate and caught by the inner circumferential surface of the cylindrical shield can be prevented from remaining on the inner circumferential surface without fail over the entire region of the inner circumferential surface.

[0013] In one embodiment of the present application, the plurality of recesses include a plurality of cross groove portions extending in a direction intersecting the circular groove portions. A lattice shape is formed by the plurality of cross groove portions and the plurality of circular groove portions. Thus, compared with a structure in which only circular groove portions are provided as recesses, the hydrophobicity can be improved uniformly over the entire region of the concave-convex portions.

[0014] In one embodiment of the present application, the inner circumferential surface of the cylindrical shield has a cylindrical surface extending in the vertical direction, and an inclined surface connected to the upper end of the cylindrical surface and extending obliquely with respect to the cylindrical surface. Furthermore, the plurality of recesses include a plurality of first recesses formed at the inclined surface.

[0015] The liquid droplets flying obliquely upward from the substrate are mainly caught by the inclined surface connected to the upper end of the cylindrical surface, and the liquid droplets flying obliquely downward from the substrate are mainly caught by the cylindrical surface. Since the liquid droplets flying from the inner circumferential surface of the cylindrical shield tend to fly obliquely downward, the reattachment of the liquid droplets flying from the inclined surface to the substrate is more likely to be a problem than the reattachment of the liquid droplets flying from the cylindrical surface to the substrate.

[0016] Thus, if the plurality of recesses are a structure including a plurality of first recesses formed at the inclined surface, the hydrophobicity of the inclined surface can be improved, and thus the attachment of the liquid droplets flying from the inner circumferential surface to the substrate can be prevented.

[0017] In one embodiment of the present application, the plurality of recesses include a plurality of second recesses formed at the cylindrical surface. The liquid droplets caught by the inclined surface move downward along the inclined surface and are guided toward the cylindrical surface. If the plurality of recesses are a structure including a plurality of second recesses formed at the cylindrical surface, the hydrophobicity of the cylindrical surface can be improved, and thus the liquid droplets can be prevented from remaining on the cylindrical surface. Thus, the liquid droplets flying from the substrate toward the cylindrical surface can be prevented from colliding with the liquid droplets remaining on the cylindrical surface. As a result, the liquid droplets flying from the cylindrical surface toward the substrate due to the collision between the liquid droplets newly flying from the substrate and the liquid droplets remaining on the cylindrical surface can be prevented.

[0018] In one embodiment of the present application, the plurality of convex portions include a plurality of first convex portions between the first recesses adjacent to each other, and a plurality of second convex portions between the second recesses adjacent to each other. Furthermore, the width of the first convex portions is smaller than the width of the second convex portions.

[0019] According to the substrate processing apparatus, since the width of the first convex portion is smaller than the width of the second convex portion, the hydrophobicity of the inclined surface is higher than the hydrophobicity of the cylindrical surface. By making the hydrophobicity of the inclined surface higher than the hydrophobicity of the cylindrical surface, it is possible to suppress liquid droplets from remaining on the inclined surface. Liquid droplets flying from the inclined surface of the cylindrical shield are more likely to adhere to the substrate than liquid droplets flying from the cylindrical surface. Therefore, by increasing the hydrophobicity of the inclined surface, it is possible to suppress liquid droplets from flying from the inclined surface and adhering to the substrate.

[0020] In one embodiment of the present application, the cylindrical shield is formed using a hydrophobic resin. Therefore, it is possible to further increase the hydrophobicity of the inner circumferential surface of the cylindrical shield.

[0021] Another embodiment of the present application provides a substrate processing apparatus including: a rotation holding member that holds a substrate in such a manner that the substrate rotates around a prescribed rotation axis; a liquid supply member that supplies a liquid to the substrate held by the rotation holding member; and a cylindrical shield made of a resin that surrounds the rotation holding member. The cylindrical shield in the substrate processing apparatus has an inner circumferential surface and a concave-convex portion provided to the inner circumferential surface, the concave-convex portion having a plurality of concave portions and a plurality of convex portions located between the concave portions adjacent to each other. Further, the concave portions have a depth of 10 μm or more and a width of less than 1.5 mm, and the convex portions have a width smaller than the width of the concave portions and less than 1.5 mm.

[0022] According to the substrate processing apparatus, as described above, it is possible to effectively suppress liquid droplets having a diameter of 1.5 mm or less from contacting the bottoms of the concave portions and to hydrophobize the liquid droplets having a diameter of 1.5 mm or less.

[0023] Therefore, it is possible to suppress liquid droplets flying from the substrate and caught by the inner circumferential surface of the cylindrical shield from remaining on the inner circumferential surface. Since it is possible to reduce the amount of liquid droplets remaining on the inner circumferential surface of the cylindrical shield, it is possible to effectively suppress liquid droplets flying from the inner circumferential surface toward the substrate due to the collision of liquid droplets newly flying from the substrate with the liquid droplets remaining on the inner circumferential surface.

[0024] In another embodiment of the present application, the width of the concave portions can be 100 μm or more and less than 1.0 mm, and the depth of the concave portions can be 200 μm or less. Further, the width of the convex portions can be 40 μm or less.

[0025] In another embodiment of the present application, the average surface roughness of the inner circumferential surface can be 3.0 or more and 6.0 or less.

[0026] Another other embodiment of the present application provides a processing method of a cylindrical shield that is made of resin and used to surround a rotary holding member that rotates a substrate around a prescribed rotation axis while holding the substrate in a substrate processing apparatus that processes the substrate with a liquid. The processing method includes a shield preparation step of preparing the cylindrical shield having an inner circumferential surface, and a hydrophobizing step of hydrophobizing the inner circumferential surface of the cylindrical shield by forming a concave-convex portion on the inner circumferential surface.

[0027] According to the processing method, it is possible to manufacture the cylindrical shield in which the concave-convex portion that hydrophobizes the inner circumferential surface is formed on the inner circumferential surface. Therefore, it is possible to improve the hydrophobicity of the inner circumferential surface compared to a surface on which the concave-convex portion is not formed. In addition, it is possible to additionally form the concave-convex portion on the cylindrical shield on which the concave-convex portion has already been formed.

[0028] Therefore, it is possible to suppress liquid droplets that have been scattered from the substrate and caught by the inner circumferential surface of the cylindrical shield from remaining on the inner circumferential surface. Since it is possible to reduce the amount of liquid droplets remaining on the inner circumferential surface of the cylindrical shield, it is possible to well suppress liquid droplets that have been newly scattered from the substrate from being scattered from the inner circumferential surface toward the substrate due to collision of the liquid droplets with the liquid droplets remaining on the inner circumferential surface. Therefore, it is possible to achieve suppression of scattering of liquid droplets from the cylindrical shield toward the substrate.

[0029] In still another other embodiment of the present application, in the hydrophobizing step, the concave-convex portion having an average surface roughness of 3.0 or more and 6.0 or less is formed. If the concave-convex portion having such an average surface roughness can be formed, it is possible to make a contact angle formed by the inner circumferential surface and a liquid droplet larger than a contact angle formed by a surface on which the concave-convex portion is not formed and the liquid droplet. That is, it is possible to improve the hydrophobicity of the inner circumferential surface compared to a surface on which the concave-convex portion is not formed.

[0030] Therefore, it is possible to suppress liquid droplets that have been scattered from the substrate and caught by the inner circumferential surface of the cylindrical shield from remaining on the inner circumferential surface. Since it is possible to reduce the amount of liquid droplets remaining on the inner circumferential surface of the cylindrical shield, it is possible to well suppress liquid droplets that have been newly scattered from the substrate from being scattered from the inner circumferential surface toward the substrate due to collision of the liquid droplets with the liquid droplets remaining on the inner circumferential surface.

[0031] In still another other embodiment of the present application, the hydrophobizing step includes a cutting member moving step of moving a cutting member along the inner circumferential surface by a prescribed feed distance per prescribed feed time while rotating the cylindrical shield around a central axis of the inner circumferential surface, and a cutting step of cutting the inner circumferential surface by pushing the cutting member into the inner circumferential surface by a prescribed push-in amount after moving the cutting member by the feed distance to form a circular groove portion.

[0032] By simple movement of the cutting member, it is possible to form a plurality of circular groove portions having a constant depth at constant intervals. Therefore, it is possible to improve uniformity of the size of the concave-convex portion formed on the inner circumferential surface.

[0033] The above and other objects, features and effects of the present application will become clearer from the following description of the embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 is a diagrammatic plan view showing the internal structure of a substrate processing apparatus according to an embodiment of the present application.

[0035] Figure 2 is a diagrammatic longitudinal sectional view as viewed from the line II-II of Figure 1 .

[0036] Figure 3 is a diagrammatic sectional view for explaining a structure example of a processing unit provided in the above-described substrate processing apparatus.

[0037] Figure 4 is a diagrammatic sectional view for explaining a structure of a cylindrical shield provided in the above-described processing unit.

[0038] Figure 5 is a view showing the vicinity of the inner periphery surface of the cross section of the above-described cylindrical shield, enlarged.

[0039] Figure 6 is a view showing the above-described concavo-convex portion as viewed from the arrow VI shown in Figure 5 .

[0040] Figure 7 is a diagrammatic perspective view for explaining the shape of the concavo-convex portion provided on the inner periphery surface of the above-described cylindrical shield.

[0041] Figure 8 corresponds to the cross section along the line VIII-VIII of Figure 6 , and is a diagram for explaining the structure of the above-described concavo-convex portion.

[0042] Figure 9 is a diagram for explaining the case where liquid droplets are scattered from a substrate.

[0043] Figure 10 is a block diagram showing the electrical structure of the main part of the above-described substrate processing apparatus.

[0044] Figure 11 is a flowchart for explaining an example of the substrate processing by the above-described substrate processing apparatus.

[0045] Figure 12 is a graph showing the relationship between the rotation speed of a substrate and the scattering angle of water droplets.

[0046] Figure 13 is a graph showing the diameter of water droplets scattered from a substrate.

[0047] Figure 14 is a graph showing the relationship between the number of water droplets scattered from the cylindrical guard and the rotation speed of the substrate.

[0048] Figure 15 is a graph for explaining the reduction effect of the number of water droplets adhering to the upper surface of the substrate generated based on the presence of the concave-convex portion.

[0049] Figure 16 is a graph for explaining the reduction effect of the number of particles adhering to the upper surface of the substrate generated based on the presence of the concave-convex portion.

[0050] Figure 17 is a graph schematically showing the vicinity of a water droplet dropped to the above-mentioned concave-convex portion in a contact angle measurement experiment.

[0051] Figure 18 is a graph showing the results of a contact angle measurement experiment using a cylindrical guard having a concave-convex portion with different average surface roughnesses.

[0052] Figures 19A to 19D is a schematic view for explaining the manufacturing method of the above-mentioned cylindrical guard.

[0053] Figure 20A is a schematic view for explaining a first modification example of the above-mentioned concave-convex portion.

[0054] Figure 20B is a schematic view for explaining a second modification example of the above-mentioned concave-convex portion.

[0055] Figure 20C is a schematic view for explaining a third modification example of the above-mentioned concave-convex portion.

[0056] Figure 20D is a schematic view for explaining a fourth modification example of the above-mentioned concave-convex portion.

[0057] Figure 20E is a schematic view for explaining a fifth modification example of the above-mentioned concave-convex portion. DETAILED DESCRIPTION

[0058] Figure 1 is a diagrammatic plan view showing the internal structure of a substrate processing apparatus 1 according to one embodiment of the present application. Figure 2 is a diagrammatic longitudinal sectional view as viewed from the line II-II of Figure 1 .

[0059] The substrate processing apparatus 1 includes an indexer block 2, a processing block 3 which is contiguous to the indexer block 2 in the lateral (horizontal) direction thereof, and a controller 4 which controls the substrate processing apparatus 1 (see the description to be given later). Figure 10 ).

[0060] The index block 2 includes a plurality of (four in this embodiment) load ports LP and an index robot IR.

[0061] The load ports LP are arranged in a horizontal direction. Each load port LP is configured to be able to hold one carrier CA. The carrier CA is a substrate-accommodating container that accommodates a substrate W that is a processing target. The substrate W is, for example, a semiconductor wafer.

[0062] The index robot IR is configured to access the carriers CA held in the plurality of load ports LP respectively and carry in / out the substrate W, and is able to carry the substrate W between the processing block 3. In this embodiment, the index robot IR is a multi-joint arm robot that is provided with a multi-joint arm.

[0063] The processing block 3 includes a plurality of (twelve in this embodiment) processing units 5, a plurality of substrate placement portions 6 (first substrate placement portions 6U and second substrate placement portions 6L), and a plurality of main carrier robots CR (first main carrier robots CRU and second main carrier robots CRL).

[0064] The plurality of processing units 5 perform processing on the substrate W. In this embodiment, each processing unit 5 is a single-wafer processing unit that processes the substrate W one by one.

[0065] The plurality of processing units 5 are arranged on both sides of a carrying space 8 in which the substrate W is carried by the plurality of main carrier robots CR, and face the carrying space 8. The carrying space 8 extends in a straight line in a direction away from the index block 2 when viewed from above.

[0066] The plurality of processing units 5 constitute a plurality of (four in this embodiment) processing towers TW. When viewed from above, a plurality of (two in this embodiment) processing towers TW are arranged on each of the sides of the carrying space 8. Each processing tower TW includes a plurality of (six in this embodiment) processing units 5 stacked in the vertical direction. In this embodiment, twenty-four processing units 5 are arranged six each in the four processing towers TW. All of the processing units 5 have a substrate carrying-in / out port 5a at a position facing the carrying space 8.

[0067] A fluid supply portion 9 and an exhaust portion 10 are arranged laterally of each processing tower TW. The fluid supply portion 9 accommodates piping for supplying processing fluid used by the plurality of processing units 5 that constitute the processing tower TW, and a pump for delivering the liquid in the piping. The exhaust portion 10 accommodates piping for exhausting ambient gas inside the plurality of processing units 5 that constitute the processing tower TW.

[0068] The processing fluid is a liquid (processing liquid) or a gas used by the substrate processing apparatus 1. As the processing liquid, the following can be cited: a chemical liquid, a rinse liquid, and the like, which will be described later.

[0069] Viewed from above, the exhaust section 10 houses an exhaust pipe 11 for guiding exhaust gases from the plurality of processing units 5 constituting the corresponding processing tower TW to an exhaust device outside the substrate processing apparatus 1. The exhaust section 10 may also also house a switching mechanism 12 for switching the exhaust pipe 11 according to the type of processing (more specifically, the type of processing liquid) within the processing unit 5. Although not shown in the figure, the exhaust section 10 houses an actuator for driving the switching mechanism 12.

[0070] Multiple processing units 5 are classified as lower-level processing units 5 or upper-level processing units 5. In this embodiment, the processing units 5 in the lower three layers are lower-level processing units 5, and the processing units 5 in the upper three layers are upper-level processing units 5.

[0071] The first substrate mounting section 6U and the second substrate mounting section 6L are arranged side by side in the vertical direction. The first main transport robot CRU and the second main transport robot CRL are arranged side by side in the vertical direction within the transport space 8.

[0072] The first substrate mounting section 6U is temporarily held on substrate W, which is exchanged between the indexing robot IR and the first main transport robot CRU. The second substrate mounting section 6L is temporarily held on substrate W, which is exchanged between the indexing robot IR and the second main transport robot CRL.

[0073] The first main transfer robot (CRU) transfers substrate W between the first substrate placement section 6U and the upper processing unit 5. The second main transfer robot (CRL) transfers substrate W between the second substrate placement section 6L and the lower processing unit 5.

[0074] The processing unit 5 includes: a rotary chuck 15 that holds the substrate W horizontally while rotating the substrate W about a rotation axis A1 (vertical axis); a processing cup 16 that surrounds the rotary chuck 15 when viewed from above; and a processing chamber 17 that houses the rotary chuck 15 and the processing cup 16. The rotation axis A1 is a vertical straight line passing through the center of the substrate W. The rotary chuck 15 is an example of a rotation holding member.

[0075] Processing chamber 17 includes a lower wall 17A, multiple (four in this embodiment) side walls 17B, and an upper wall 17C (see below). Figure 3 These divide the interior space 101 of the processing chamber 17. A substrate removal / moving inlet 5a is formed on the side wall 17B of the processing chamber 17.

[0076] Figure 3 This is a schematic cross-sectional view used to illustrate a structural example of processing unit 5.

[0077] The rotary chuck 15 includes multiple chuck pins 20, a rotary base 21, a rotary shaft 22, and a rotary motor 23.

[0078] The rotating base 21 has a circular plate shape along the horizontal direction. When viewed from above, the rotating base 21 has a circular shape with a diameter larger than that of the substrate W. On the upper surface of the rotating base 21, a plurality of chuck pins 20 are arranged at intervals along the circumference of the rotating base 21 to hold the periphery of the substrate W. The chuck pins 20 are also referred to as holding pins.

[0079] The rotating base 21 and multiple chuck pins 20 constitute a substrate holding unit that holds the substrate W horizontally. The substrate holding unit is also called a substrate holder.

[0080] A rotating shaft 22 extends vertically along the rotation axis A1. The upper end of the rotating shaft 22 is engaged with the center of the lower surface of the rotating base 21. A rotating motor 23 applies a rotational force to the rotating shaft 22. By rotating the rotating shaft 22 using the rotating motor 23, the rotating base 21 rotates. Consequently, the substrate W rotates about the rotation axis A1. The rotating motor 23 is an example of a substrate rotating unit that rotates the substrate W about the rotation axis A1.

[0081] The processing unit 5 includes multiple processing liquid nozzles 30 and an FFU (Fan Filter Unit) 26. The multiple processing liquid nozzles 30 are housed within the processing chamber 17.

[0082] FFU26 is installed in the opening 17a of the upper wall 17C of the processing chamber 17 and is an example of an air supply unit that delivers clean air into the processing chamber 17. FFU26 includes: a fan (not shown) that generates airflow from outside the processing chamber 17 toward inside the processing chamber 17; a filter (not shown) for removing foreign matter contained in the airflow; and an actuator such as a motor that drives the fan (not shown).

[0083] Each processing liquid nozzle 30 is an example of a liquid supply component that supplies liquid to the substrate W held in the rotary chuck 15. The plurality of processing liquid nozzles 30 include: a liquid nozzle 31 that sprays liquid toward the upper surface of the substrate W; an upper rinsing liquid nozzle 32 that sprays rinsing liquid toward the upper surface of the substrate W; and a lower rinsing liquid nozzle 33 that sprays rinsing liquid toward the lower surface of the substrate W.

[0084] The medicine nozzle 31 is connected to a medicine pipe 41 that guides the medicine to the medicine nozzle 31. A medicine valve 51 that opens and closes its flow path and a medicine pump 61 that delivers medicine to the medicine nozzle 31 are installed on the medicine pipe 41. When the medicine valve 51 is opened, the medicine is sprayed downward from the medicine nozzle 31 in a continuous flow.

[0085] In this embodiment, the liquid nozzle 31 is a movable nozzle that moves horizontally and vertically via the first nozzle moving unit 71. The liquid nozzle 31 is configured to move horizontally between a central position and its original position (retracted position). If the liquid valve 51 is opened when the liquid nozzle 31 is in the central position, liquid is supplied to the central region of the upper surface of the substrate W.

[0086] The first nozzle moving unit 71 may include: an arm 71A that is coupled to the liquid nozzle 31 and extends horizontally; a rotating shaft 71B that is coupled to the arm 71A and extends vertically; and a rotating shaft drive unit 71C that raises and lowers the rotating shaft.

[0087] The rotating shaft drive unit 71C includes: a drive motor (not shown) that causes the arm 71A to swing by rotating the rotating shaft 71B about a rotating axis A2 extending in the vertical direction; and an arm lift (not shown) that causes the arm 71A to rise and fall by raising and lowering the rotating shaft 71B in the vertical direction. The arm lift is, for example, a ball screw mechanism or a rack and pinion mechanism.

[0088] The liquid nozzle 31 may also be different from this embodiment, and may be a fixed nozzle whose position is fixed in both the horizontal and vertical directions.

[0089] The liquid sprayed from the liquid nozzle 31 may be, for example, a liquid containing at least one of sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, ammonia, hydrogen peroxide solution, organic acid (e.g., citric acid, oxalic acid, etc.), organic base (e.g., TMAH: tetramethylammonium hydroxide, etc.), surfactant, and corrosion inhibitor. Examples of liquids obtained by mixing these liquids include SPM (sulfuric acid / hydrogen peroxide mixture) and APM (ammonia-hydrogen peroxide mixture).

[0090] The upper flushing fluid nozzle 32 is connected to the upper flushing fluid piping 42, which guides the flushing fluid upward to the upper flushing fluid nozzle 32. An upper flushing fluid valve 52, which opens and closes its flow path, and an upper flushing fluid pump 62, which delivers flushing fluid to the upper flushing fluid nozzle 32, are clamped to the upper flushing fluid piping 42. When the upper flushing fluid valve 52 is opened, the flushing fluid is sprayed downward from the upper flushing fluid nozzle 32 in a continuous flow.

[0091] In this embodiment, the upper flushing fluid nozzle 32 is a movable nozzle that moves horizontally and vertically via the second nozzle moving unit 72. The upper flushing fluid nozzle 32 is configured to move horizontally between a central position and its original position (retracted position). If the upper flushing fluid valve 52 is opened when the upper flushing fluid nozzle 32 is in the central position, flushing fluid is supplied to the central region of the upper surface of the substrate W.

[0092] The second nozzle moving unit 72 may include: an arm 72A that is coupled to the upper flushing fluid nozzle 32 and extends horizontally; a rotating shaft 72B that is coupled to the arm 72A and extends in a vertical direction; and a rotating shaft drive unit 72C that raises and lowers the rotating shaft 72B.

[0093] The rotating shaft drive unit 72C includes: a drive motor (not shown) that causes the arm 72A to swing by rotating the rotating shaft 72B about a rotating axis A3 extending in the vertical direction; and an arm lift (not shown) that causes the arm 72A to rise and fall by raising and lowering the rotating shaft in the vertical direction. The arm lift is, for example, a ball screw mechanism or a rack and pinion mechanism.

[0094] The upper flushing fluid nozzle 32 may also be different from this embodiment, and may be a fixed nozzle whose position is fixed in both the horizontal and vertical directions.

[0095] The lower flushing fluid nozzle 33 is a fixed nozzle that sprays flushing fluid toward the center of the lower surface of the substrate W. The lower flushing fluid nozzle 33 is inserted into the through hole 21a that opens at the center of the upper surface of the rotating base 21, and into the internal space 22a of the rotating shaft 22 that communicates with the through hole 21a. The outlet 33a of the lower flushing fluid nozzle 33 protrudes from the upper surface of the rotating base 21.

[0096] The lower flushing fluid nozzle 33 is connected to a lower flushing fluid pipe 43 that guides flushing fluid to the lower flushing fluid nozzle 33. A lower flushing fluid valve 53, which opens and closes its flow path, and a lower flushing fluid pump 63, which delivers flushing fluid to the lower flushing fluid nozzle 33, are clamped to the lower flushing fluid pipe 43. When the lower flushing fluid valve 53 is opened, the flushing fluid is sprayed upwards from the lower flushing fluid nozzle 33 in a continuous flow.

[0097] Rinsing solutions can include DIW, carbonated water, electrolyzed ionized water, hydrochloric acid diluted to a concentration of approximately 1 ppm to 100 ppm, ammonia diluted to a concentration of approximately 1 ppm to 100 ppm, reduced water (hydrogen water), etc.

[0098] A lower gas flow path 25 is formed through the space between the lower flushing fluid nozzle 33 and the through hole 21a of the rotating base 21. The lower gas flow path 25 is connected to a lower gas pipe 44 that passes between the inner circumferential surface of the rotating shaft 22 and the lower flushing fluid nozzle 33 into the internal space 22a. When the lower gas valve 54, which is clamped on the lower gas pipe 44, is opened, gases such as nitrogen (N2 gas) are ejected from the lower gas flow path 25 toward the space between the lower surface of the substrate W and the upper surface of the rotating base 21.

[0099] The gas ejected from the lower gas flow path 25 is not limited to nitrogen. The gas ejected from the lower gas flow path 25 can also be air. Furthermore, the gas ejected from the lower gas flow path 25 can also be an inert gas other than nitrogen. An example of an inert gas other than nitrogen is argon.

[0100] The receiving cup 16 includes: a plurality of cylindrical shields 80 for catching liquid splashed outward from the substrate W held in the rotating chuck 15; a plurality of receiving cups 90 for catching liquid guided downward by the plurality of cylindrical shields 80; and an exhaust tank 100 surrounding the plurality of cylindrical shields 80 and the plurality of receiving cups 90 when viewed from above. The cylindrical shields 80 are an example of liquid receiving components for catching liquid splashed from the substrate W.

[0101] In this embodiment, an example is shown that includes two cylindrical covers 80 (first cylindrical cover 80A and second cylindrical cover 80B) and two cups 90 (first cup 90A and second cup 90B).

[0102] The cylindrical protective cover 80 is made of resin. The cylindrical protective cover 80 is formed from a hydrophilic resin or a hydrophobic resin. Preferably, the cylindrical protective cover 80 is formed from a hydrophobic resin.

[0103] The hydrophobic resin is, for example, a fluoropolymer. Specifically, the cylindrical shield 80 is formed of one or a mixture of two or more of the following: perfluoroalkoxyalkane (PFA), polytetrafluoroethylene (PTFE), polychlorotrifluoroethylene (PCTFE), and ethylene-chlorotrifluoroethylene copolymer (ECTFE).

[0104] The first cup 90A and the second cup 90B each have an upward-opening annular groove.

[0105] The first cylindrical cover 80A and the second cylindrical cover 80B are each generally cylindrical in shape, with the upper end of each cylindrical cover 80 inclined inward toward the center of the cylindrical cover 80. The first cylindrical cover 80A is arranged to surround the base plate W held in the rotary chuck 15. The second cylindrical cover 80B (inner cover) is arranged to surround the base plate W held in the rotary chuck 15 at a position closer to the center of the first cylindrical cover 80A (outer cover) than the first cylindrical cover 80A (outer cover).

[0106] The center side of the first cylindrical shield 80A (hereinafter referred to as the "inner shield side IS") is also the inner side of the rotational radial direction of the substrate W. The opposite side of the center side of the first cylindrical shield 80A (hereinafter referred to as the "outer shield side OS") is also the outer side of the rotational radial direction of the substrate W. The first cylindrical shield 80A and the second cylindrical shield 80B are arranged coaxially, and the center side of the first cylindrical shield 80A is also the center side of the second cylindrical shield 80B.

[0107] The first cup 90A and the second cylindrical shield 80B are integrally formed, and the first cup 90A receives the liquid guided downwards by the first cylindrical shield 80A. The second cup 90B receives the liquid guided downwards by the second cylindrical shield 80B. The liquid received by the first cup 90A is recovered through a first processing liquid recovery passage (not shown) connected to the lower end of the first cup 90A. The liquid received by the second cup 90B is recovered through a second processing liquid recovery passage (not shown) connected to the lower end of the second cup 90B.

[0108] Processing unit 5 includes a cover lifting unit 95 that raises and lowers the first cylindrical cover 80A and the second cylindrical cover 80B respectively. The cover lifting unit 95 raises and lowers the first cylindrical cover 80A between a lower position and an upper position. The cover lifting unit 95 raises and lowers the second cylindrical cover 80B between a lower position and an upper position.

[0109] When both the first cylindrical shield 80A and the second cylindrical shield 80B are in the upper position, the liquid splashed from the substrate W is caught by the second cylindrical shield 80B. When the second cylindrical shield 80B is in the lower position and the first cylindrical shield 80A is in the upper position, the liquid splashed from the substrate W is caught by the first cylindrical shield 80A.

[0110] When both the first cylindrical cover 80A and the second cylindrical cover 80B are in the lower position, the corresponding main transport robot CR can move the substrate W into the processing chamber 17 or move the substrate W out of the processing chamber 17.

[0111] The protective cover lifting unit 95 includes a first protective cover lifting unit for raising and lowering a first cylindrical protective cover 80A, and a second protective cover lifting unit for raising and lowering a second cylindrical protective cover 80B. The first protective cover lifting unit is, for example, a first actuator (not shown) that applies driving force to a first lifting mechanism (not shown) coupled to the first cylindrical protective cover 80A. The first lifting mechanism is, for example, a ball screw mechanism or a rack and pinion mechanism. The second protective cover lifting unit is a second actuator (not shown) that applies driving force to a second lifting mechanism (not shown) coupled to the second cylindrical protective cover 80B. The second lifting mechanism is, for example, a ball screw mechanism or a rack and pinion mechanism.

[0112] The protective cover lifting unit 95 is also called the protective cover lifting machine. Similarly, the first protective cover lifting unit is the first protective cover lifting machine, and the second protective cover lifting unit is the second protective cover lifting machine.

[0113] The internal space 101 of the processing chamber 17 is divided into an inner space 102, which is located on the inner side of the first cylindrical protective cover 80A, and an outer space 103, which is located outside the inner space 102. At least one side wall 17B of the processing chamber 17 is provided with a partition plate 104 that vertically separates the outer space 103 of the processing chamber 17. Specifically, the outer space 103 is divided by the partition plate 104 into an upper space 103A, which is located on the upper side of the partition plate 104, and a lower space 103B, which is located on the lower side of the partition plate 104. The partition plate 104 is supported by an exhaust stack 100.

[0114] The upper space 103A includes a space that is on the upper side of the partition plate 104 and on the inner side of the first cylindrical cover 80A (IS), and a space that is on the upper side of the partition plate 104 and on the outer side of the first cylindrical cover 80A (OS).

[0115] The lower space 103B is divided into an inner lower space 105, which is located inside the cover IS relative to the exhaust pipe 100, and an outer lower space 106, which is located outside the cover OS relative to the exhaust pipe 100.

[0116] The ambient gas inside the processing chamber 17 is discharged through an exhaust connection pipe 45 that passes through the side wall 17B of the processing chamber 17 and the exhaust stack 100. The exhaust connection pipe 45 is connected to the exhaust piping 11 located in the exhaust section 10 (see reference). Figure 1 )connect.

[0117] FFU26 generates an airflow F by supplying clean air to the interior space 101 of the processing chamber 17. The airflow F is delivered from the upper space 103A through the inner space 102 of the shroud or the lower space 103B to the exhaust connection pipe 45 of the exhaust section 10. The airflow F flows into the lower space 103B through the gap G1 between the end of the inner side IS of the partition plate 104 and the first cylindrical shroud 80A, or through the gap G2 formed at the end of the outer side OS of the partition plate 104.

[0118] The airflow F1 that passes through the gap G1 and flows into the inner lower space 105 flows into the exhaust connecting pipe 45 from the inner lower space 105.

[0119] The airflow F2, which passes through the gap G2 and flows into the outer lower space 106, flows into the inner lower space 105 through the opening 100a formed on the exhaust pipe 100, and then flows into the exhaust connecting pipe 45. The airflow F3, which flows into the inner space 102 of the shield, flows into the exhaust connecting pipe 45 from the inner space 102 of the shield.

[0120] By adjusting the height of the first cylindrical shield 80A, the size of the gap G1 between the partition plate 104 and the first cylindrical shield 80A can be adjusted. By adjusting the size of the gap G1, the flow rates of airflows F1 to F3 can be adjusted.

[0121] Figure 4 This is a schematic cross-sectional view used to illustrate the structure of the cylindrical protective cover 80.

[0122] Reference Figure 4 Each cylindrical cover 80 includes a cylindrical portion 81, an extended portion 82, and a hanging portion 83.

[0123] The cylindrical portion 81 is a circular cylindrical portion when viewed from above. The cylindrical portion 81 surrounds the rotating chuck 15. The central side of the cylindrical portion 81 is also the inner side of the protective cover IS, and the opposite side of the central side of the cylindrical portion 81 is also the outer side of the protective cover OS.

[0124] The extension section 82 has a ring shape when viewed from above. The extension section 82 is connected to the upper end of the cylindrical section 81 and extends from the upper end of the cylindrical section 81 toward the center side of the cylindrical section 81.

[0125] The drooping portion 83 is directly connected to the end of the extended portion 82 on the central side of the cylindrical portion 81 (hereinafter referred to as "central side end 82a"), and extends downward from the central side end 82a. The drooping portion 83 has an annular shape when viewed from above. The drooping portion 83 has a tapered front end that narrows towards the bottom. The drooping portion 83 is triangular in cross-section.

[0126] The extension section 82 has an inclined section 84 extending obliquely upward toward the inner side IS of the cover, and a horizontal section 86 extending horizontally above the inclined section 84 and connected to the upper end of the hanging section 83. It can also be connected with... Figure 4 Unlike other examples, instead of providing a horizontal part 86, the vertical part 83 is directly connected to the upper end of the inclined part 84.

[0127] The cylindrical shield 80 has an inner peripheral surface 120 and a protrusion / contour 121 provided on the inner peripheral surface 120. The inner peripheral surface 120 of the cylindrical shield 80 is composed of a cylindrical surface 122, which is the inner peripheral surface of the cylindrical portion 81; an inclined surface 123, which is the inner peripheral surface of the inclined portion 84; and a curved surface 124 that smoothly connects the cylindrical surface 122 and the inclined surface 123. The cylindrical surface 122 is a cylindrical surface extending in the vertical direction. The inclined surface 123 is connected to the upper end of the cylindrical surface 122 via the curved surface 124 and extends obliquely relative to the cylindrical surface 122. In detail, the inclined surface 123 extends obliquely upward from the upper end of the curved surface 124 toward the inner side 15 of the shield. It can also be connected with... Figure 4 Unlike other examples, instead of setting a curved surface 124, the inclined surface 123 is directly connected to the upper end of the cylindrical surface 122.

[0128] The protrusion 121 is provided on both the inclined surface 123 and the cylindrical surface 122. The protrusion 121 is provided on the inner peripheral surface 120 in a region that is lower than the lower end of the vertical portion 83.

[0129] Figure 5 This is an enlarged view of the inner circumferential surface 120 of the cross-sectional view of the cylindrical protective cover 80. Figure 6 From Figure 5 The diagram shows the concave-convex portion 121 observed by arrow VI. Figure 7 It is a schematic perspective view used to illustrate the shape of the concave and convex portion 121 provided on the inner circumferential surface 120 of the cylindrical cover 80.

[0130] like Figure 5 and Figure 6 As shown, the protrusion 121 has a plurality of recesses 130 and a plurality of protrusions 131 located between adjacent recesses 130. In this embodiment, as... Figure 7 As shown, the recess 130 is a circular groove 135 along the circumferential direction CD of the inner peripheral surface 120. Similarly, the protrusion 131 is a circular protrusion 136 along the circumferential direction CD of the inner peripheral surface 120 (see reference). Figure 6 Multiple circular grooves 135 are spaced apart on the inner circumferential surface 120 along the axial direction X.

[0131] Multiple recesses 130 are located along the central axis A4 of the inner circumferential surface 120 (see reference). Figure 7 The axes A4 and A5 are spaced apart along the axial direction X on the inner circumferential surface 120. The central axis A4 coincides with the rotation axis A1 (see reference). Figure 3 ).

[0132] Reference Figure 5 and Figure 6 The recess 130 formed on the inclined surface 123 is referred to as the first recess 130A, and the recess 130 formed on the cylindrical surface 122 is referred to as the second recess 130B. The convex portion 131 located between the first recesses 130A is referred to as the first convex portion 131A, and the convex portion 131 located between the second recesses 130B is referred to as the second convex portion 131B.

[0133] Figure 8 Equivalent to along Figure 6 The cross section of line VIII-VIII is a schematic diagram used to illustrate the structure of the concave-convex portion 121.

[0134] Reference Figure 8The recess 130 has a width W1 smaller than the diameter Dm of the droplet LD, and a depth De that prevents the droplet LD from contacting the bottom 130a of the recess 130 when the droplet LD is in contact with the plurality of protrusions 131. The protrusions 131 have a width W2 smaller than the diameter Dm of the droplet LD and smaller than the width W1 of the recess 130.

[0135] Therefore, the droplet LD caught by the protrusions 121 of the inner circumferential surface 120 will not completely enter the recess 130 but will contact the protrusions 131. The recess 130 has a depth De that prevents the droplet LD from contacting the bottom 130a of the recess 130 when the droplet LD is in contact with the protrusions 131. If the protrusions 121 and the droplet LD have this dimensional relationship, the droplet LD can contact the air inside the recess 130, thereby reducing the contact area between the droplet LD and the inner circumferential surface 120 of the cylindrical shield 80.

[0136] Therefore, the contact angle θ of the droplet LD relative to the uneven portion 121 can be made greater than the contact angle of the droplet LD relative to the inner peripheral surface where the uneven portion 121 is not formed. That is, the hydrophobicity of the inner peripheral surface 120 of the cylindrical shield 80 can be improved compared to the inner peripheral surface where the uneven portion 121 is not formed. If a hydrophobic resin is used to form the cylindrical shield 80, the hydrophobicity of the inner peripheral surface 120 can be further improved.

[0137] The contact angle θ is the angle formed inside the droplet LD between the gas-liquid interface of the droplet LD and the interface between the uneven portion 121 and the droplet LD. When the liquid constituting the droplet LD is water, the contact angle θ is preferably 99° or more.

[0138] Next, the specific values ​​of the scattering angle θs of the droplets LD scattering from the substrate W and the diameter Dm of the scattering droplets LD will be explained. Figure 9 This is a schematic diagram used to illustrate the situation where liquid splashes from substrate W.

[0139] With liquid present on the upper surface of substrate W, rotating substrate W causes the liquid to scatter from the periphery of substrate W toward the outside. The diameter Dm of the scattering droplet LD and the scattering angle θs of the droplet LD depend on the rotational speed of substrate W. The scattering angle θs is the angle between the horizontal plane HS and the scattering direction SD of the droplet LD.

[0140] If the rotational speed of the substrate W is less than 600 rpm, most of the droplets LD will scatter downwards at an angle. If the rotational speed of the substrate W is less than 600 rpm, most of the droplets LD will be caught by the cylindrical surface 122. On the other hand, if the rotational speed of the substrate W is 600 rpm or more, most of the droplets LD will scatter upwards at an angle. Therefore, if the rotational speed of the substrate W is 600 rpm or more, most of the droplets LD will be caught by the inclined surface 123.

[0141] The diameter Dm of the droplets LD flying off the substrate W varies depending on the supply flow rate of the liquid relative to the substrate W and the shear energy. The shear energy varies depending on the rotational speed of the substrate W and the diameter of the substrate W. The diameter of the substrate W is approximately 300 mm. The diameter Dm of the droplets LD flying off the substrate W is approximately 0.1 mm or more and 3.0 mm or less. If the rotational speed of the substrate W is 600 rpm or more and 1200 rpm or less, then the diameter Dm of the droplets LD flying off the substrate W is 0.1 mm or more and 1.5 mm or less.

[0142] To prevent droplets LD with a diameter Dm of 1.5 mm or less from entering the recess 130, the depth De of the recess 130 is preferably 1 mm or less but more than 10 μm. Furthermore, the width W1 of the recess 130 is preferably 100 μm or more but less than 1.5 mm. Additionally, the width W2 of the protrusion 131 is preferably 1.0 μm or more but less than 1.5 mm.

[0143] If the rotational speed of the substrate W is 600 rpm or more and 1200 rpm or less, the diameter Dm of the droplets LD flying off the substrate W is mainly 1.0 mm or less. To further suppress droplets LD with a diameter Dm of 1.0 mm or less from entering the recess 130, similar to the conditions for suppressing droplets LD with a diameter Dm of 1.5 mm or less from entering the recess 130, the depth De of the recess 130 is preferably 10 μm or more and 1.0 mm or less. Furthermore, the width W1 of the recess 130 is more preferably 100 μm or more and less than 1.0 mm, and the width W2 of the protrusion 131 is more preferably 1.0 μm or more and less than 1.0 mm.

[0144] To form the uneven portion 121 of this size, the average surface roughness of the uneven portion 121 needs to be set to 3.0 or more and 6.0 or less. If the average surface roughness Ra is 6.0 or less, the width W1 of the recess 130 becomes small enough to effectively suppress the entry of droplets LD with a diameter Dm of 1.5 mm or less into the recess 130. If the average surface roughness Ra is 3.0 or more, the depth De of the recess 130 becomes large enough to effectively suppress the entry of droplets LD with a diameter Dm of 1.5 mm or less into the recess 130. The average surface roughness Ra is particularly preferably 3.8.

[0145] In order to set the average surface roughness Ra to be 3.0 or more and 4.0 or less, the depth De of the recess 130 is preferably 10 μm or more and 200 μm or less. In addition, the width W1 of the recess 130 is preferably 100 μm or more and less than 1.0 mm, and the width W2 of the protrusion 131 is preferably 30 μm or more and 40 μm or less.

[0146] Therefore, when the substrate W is rotated at a speed of 600 rpm or higher while the upper surface of the substrate W is treated with a processing liquid, it is preferable to form at least one recess 121 on the inclined surface 123 on the inner peripheral surface 120. Furthermore, the depth De of the recess 130 is preferably 10 μm or more, the width W1 of the recess 130 is preferably less than 1.5 mm, and the width W2 of the protrusion 131 is preferably smaller than the width of the recess 130 and less than 1.5 mm.

[0147] Furthermore, when forming a rough portion 121 with a high average surface roughness Ra, the width W2 of the protrusion 131 becomes narrower. Specifically, if the rough portion 121 is machined to achieve an average surface roughness Ra of 6.0, the width W2 of the protrusion 131 becomes 40 μm or less. Therefore, compared to a rough portion 121 with an average surface roughness Ra greater than 6.0, it is easier to machine a rough portion 121 with an average surface roughness Ra of 6.0 or less on the inner peripheral surface 120. Especially when the rough portion 121 is formed by rotary cutting on a lathe, the difference in machining ease is significant. Therefore, from the viewpoint of machining ease, an average surface roughness Ra of 6.0 or less is preferable.

[0148] Figure 10 This is a block diagram showing the electrical structure of the main parts of the substrate processing apparatus 1. The controller 4 is equipped with a microcomputer and controls the controlled objects of the substrate processing apparatus 1 according to a prescribed control program.

[0149] Specifically, the controller 4 may be a computer including a processor (CPU) 4A and a memory 4B storing control programs. The controller 4 is configured to perform various controls for substrate processing by executing the control programs by the processor 4A.

[0150] The controller 4 controls the indexing robot IR and multiple main transport robots CR. The controller 4 controls actuators located in the exhaust section 10, valves (medicine valve 51, upper flushing fluid valve 52, lower flushing fluid valve 53, lower gas valve 54) and pumps (medicine pump 61, upper flushing fluid pump 62, lower flushing fluid pump 63) located in the fluid supply section 9.

[0151] The controller 4 also controls the components of the processing unit (rotary motor 23, first nozzle moving unit 71, second nozzle moving unit 72, protective cover lifting unit 95, FFU 26).

[0152] Figure 11 This is a flowchart illustrating an example of substrate processing performed by the substrate processing apparatus 1. In the substrate processing performed by the substrate processing apparatus 1, for example... Figure 11As shown, the liquid treatment process (step S1), the rinsing process (step S2), and the rotary drying process (step S3) are performed in this order.

[0153] The following is mainly based on Figure 3 and Figure 11 First, the untreated substrate W is indexed by the robot IR (refer to...). Figure 1 ), and one of the multiple main transport robots CR (refer to Figure 1 The substrate W is moved from the carrier CA into the processing unit 5 and transferred to the rotary chuck 15. As a result, the substrate W is held horizontally by the rotary chuck 15 (substrate holding process).

[0154] The rotary chuck 15 holds the substrate W until the rotary drying process (step S3) ends. During the period from the start of the substrate holding process to the end of the rotary drying process (step S3), the cover lifting unit 95 adjusts the height of the first cylindrical cover 80A and the second cylindrical cover 80B so that at least one cylindrical cover 80 is in the upper position. With the substrate W held in the rotary chuck 15, the rotary motor 23 rotates the rotating base 21. Thus, the horizontally held substrate W begins to rotate (substrate rotation process). The rotation speed of the substrate W is, for example, 600 rpm or more and 1200 rpm or less.

[0155] Then, the lower gas valve 54 is opened to eject gas from the lower gas flow path 25 (gas ejection process). The lower gas valve 54 remains open until the rotary drying process (step S3) ends. The gas flow rate from the lower gas flow path 25 is, for example, 50 L / min. The exhaust flow rate is adjusted by the gas supply from the lower gas flow path 25 and the gas inflow based on FFU 26 to regulate the internal pressure of the processing chamber 17 to a specified pressure. The exhaust flow rate is, for example, 3 m³ / min. 3 / min. In this case, the internal pressure of the processing chamber 17 is adjusted to -30Pa.

[0156] Next, a chemical treatment process (step S1) is performed to treat the upper surface of the substrate W with a chemical solution.

[0157] Specifically, the first nozzle moving unit 71 moves the liquid medicine nozzle 31 to the processing position. The processing position of the liquid medicine nozzle 31 is, for example, the central position.

[0158] With the liquid nozzle 31 in the processing position, the liquid valve 51 is opened. As a result, liquid is supplied (ejected) from the liquid nozzle 31 toward the central region of the upper surface of the rotating substrate W (liquid supply process).

[0159] The chemical solution supplied to the upper surface of substrate W is radially diffused by centrifugal force, covering the entire upper surface of substrate W. The chemical solution is then discharged from the periphery of the upper surface of substrate W due to centrifugal force. Thus, the entire upper surface of substrate W is treated with the chemical solution.

[0160] The liquid medicine discharged from the upper surface of the substrate W is mainly caught by the inclined surface 123 of one of the first cylindrical shield 80A and the second cylindrical shield 80B. The liquid medicine caught by the inclined surface 123 moves downward along the inclined surface 123 and is guided towards the cylindrical surface 122. The liquid medicine guided to the cylindrical surface 122 is finally caught by the corresponding cup 90.

[0161] Next, a rinsing process (step S2) is performed to clean the substrate W using a rinsing solution. Specifically, after closing the solution valve 51, the first nozzle moving unit 71 moves the solution nozzle 31 back to its original position. After closing the solution valve 51, the second nozzle moving unit 72 moves the upper rinsing solution nozzle 32 to the processing position. The processing position of the upper rinsing solution nozzle 32 is, for example, the center position.

[0162] With the upper flushing fluid nozzle 32 in the processing position, the upper flushing fluid valve 52 is opened. As a result, flushing fluid is supplied (ejected) from the upper flushing fluid nozzle 32 toward the central region of the upper surface of the rotating substrate W (upper flushing fluid supply process).

[0163] The rinsing fluid supplied to the upper surface of substrate W is radially diffused by centrifugal force, covering the entire upper surface of substrate W. The rinsing fluid is discharged from the periphery of the upper surface of substrate W due to centrifugal force. Thus, the entire upper surface of substrate W is rinsed using the rinsing fluid (upper rinsing process).

[0164] The rinsing fluid discharged from the upper surface of the substrate W is mainly caught by the inclined surface 123 of one of the first cylindrical shield 80A and the second cylindrical shield 80B. The rinsing fluid caught by the inclined surface 123 moves downward along the inclined surface 123 and is guided towards the cylindrical surface 122. The rinsing fluid guided to the cylindrical surface 122 is finally caught by the corresponding cup 90.

[0165] When supplying rinsing fluid to the upper surface of substrate W, the lower rinsing fluid valve 53 can also be opened to allow rinsing fluid to be sprayed out from the lower rinsing fluid nozzle 33 (lower rinsing fluid supply process). Thus, the lower surface of substrate W is rinsed with rinsing fluid (lower rinsing process).

[0166] Next, a rotary drying process (step S3) is performed, in which the substrate W is rotated at high speed to dry the upper surface of the substrate W. Specifically, the upper rinsing liquid valve 52 and the lower rinsing liquid valve 53 are closed. As a result, the supply of rinsing liquid to the substrate W is stopped. Furthermore, the second nozzle moving unit 72 moves the upper rinsing liquid nozzle 32 back to its original position.

[0167] Then, the rotary motor 23 accelerates the rotation of the substrate W, causing it to rotate at a high speed (e.g., 1500 rpm). This generates a greater centrifugal force that acts on the liquid remaining on the upper and lower surfaces of the substrate W, thereby throwing the liquid adhering to the substrate W outwards. The liquid thrown off the substrate W is caught by one of the first cylindrical shield 80A and the second cylindrical shield 80B.

[0168] Then, the rotary motor 23 stops the rotation of the substrate W. The shield lifting unit 95 moves the first cylindrical shield 80A and the second cylindrical shield 80B to the lower position. Afterwards, the main transfer robot CR enters the processing unit 5, removes the processed substrate W from the chuck pin 20 of the rotary chuck 15, and moves it out of the processing unit 5. The substrate W is transferred from the main transfer robot CR to the indexing robot IR, and is stored by the indexing robot IR in the carrier CA.

[0169] In this substrate processing apparatus 1, since the inner peripheral surface 120 of the cylindrical shield 80 has a protrusion 121, the hydrophobicity of the inner peripheral surface 120 is improved. Therefore, it is possible to suppress droplets LD that fly from the substrate W and are caught by the inner peripheral surface 120 of the cylindrical shield 80 from remaining on the inner peripheral surface 120. Since the amount of droplets LD remaining on the inner peripheral surface 120 of the cylindrical shield 80 can be reduced, it is possible to effectively suppress the amount of droplets LD that fly from the inner peripheral surface 120 toward the substrate W due to collisions between newly fly-from-the-substrate-W droplets LD and droplets LD remaining on the inner peripheral surface 120.

[0170] The plurality of recesses 130 include a plurality of circular grooves 135 along the circumferential direction CD of the inner peripheral surface 120. Furthermore, the plurality of circular grooves 135 are spaced apart in the axial direction X on the inner peripheral surface 120. Therefore, the hydrophobicity of the inner peripheral surface 120 can be improved throughout the entire area of ​​the circumferential direction CD. Therefore, droplets LD that have splashed from the substrate W and are caught by the inner peripheral surface 120 of the cylindrical shield 80 can be effectively suppressed from remaining on the inner peripheral surface 120 throughout the entire area of ​​the inner peripheral surface 120.

[0171] Furthermore, according to this embodiment, the inner peripheral surface 120 of the cylindrical cover 80 has a cylindrical surface 122 extending in the vertical direction and an inclined surface 123 connected to the upper end of the cylindrical surface 122 and extending obliquely relative to the cylindrical surface 122. Moreover, the plurality of recesses 130 include a plurality of first recesses 130A formed on the inclined surface 123.

[0172] Since droplets LD splashing (splashing back) from the inner peripheral surface of the cylindrical shield tend to scatter downwards at an angle, the re-attachment of droplets LD splashing from the inclined surface 123 to the substrate W is more problematic than that of droplets LD splashing from the cylindrical surface 122. In this embodiment, since the plurality of recesses 130 include a plurality of first recesses 130A formed on the inclined surface 123, the hydrophobicity of the inclined surface 123 can be improved. Therefore, the adhesion of droplets LD splashing from the inner peripheral surface 120 to the substrate W can be effectively suppressed.

[0173] Furthermore, according to this embodiment, the plurality of recesses 130 include a plurality of second recesses 130B formed on the cylindrical surface 122. The droplets LD caught by the inclined surface 123 move downwards along the inclined surface 123 and are guided toward the cylindrical surface 122. In this embodiment, since the plurality of recesses 130 include a plurality of second recesses 130B formed on the cylindrical surface 122, the hydrophobicity of the cylindrical surface 122 can be improved, thus suppressing liquid residue on the cylindrical surface 122. Therefore, it is possible to suppress the collision between droplets LD flying from the substrate W toward the cylindrical surface 122 and droplets LD remaining on the cylindrical surface 122. As a result, it is possible to effectively suppress the scattering of droplets LD from the cylindrical surface 122 toward the substrate W due to collisions between newly scattered droplets LD from the substrate W and droplets LD remaining on the cylindrical surface 122.

[0174] Furthermore, the dimensions of the protrusions 121 formed on the cylindrical surface 122 can be the same as or different from the dimensions of the protrusions 121 formed on the inclined surface 123. For example, Figure 5 As shown, the width W2 of the first protrusion 131A can be smaller than the width W2 of the second protrusion 131B.

[0175] In this case, the hydrophobicity of the inclined surface 123 is higher than that of the cylindrical surface 122. By making the hydrophobicity of the inclined surface 123 higher than that of the cylindrical surface 122, it is possible to suppress the residue of droplets LD on the inclined surface 123. Droplets LD that fly off from the inclined surface 123 of the cylindrical shield 80 are more likely to adhere to the substrate W than droplets LD that fly off from the cylindrical surface 122. Therefore, by increasing the hydrophobicity of the inclined surface 123, it is possible to suppress the flyoff of droplets LD from the inclined surface 123 and their adhesion to the substrate W.

[0176] <Experiment for Measuring the Angle of Water Droplets>

[0177] The results of the experiment on the scattering angle of water droplets, namely, the use of a high-speed camera to photograph the scattering of DIW droplets LD (hereinafter sometimes referred to as "water droplets") from the substrate W and the measurement of the scattering angle of the water droplets, are explained.

[0178] Figure 12 This is a graph showing the relationship between the rotational speed of the substrate W and the scattering angle θs of the water droplets. Figure 12The horizontal axis in the graph represents the scattering angle θs of water droplets emanating from the substrate W. If the scattering direction SD of the droplets is diagonally upward, the scattering angle θs is greater than 0°. If the scattering direction LD of the droplets is diagonally downward, the scattering angle θs is less than 0°.

[0179] like Figure 12 As shown, the following results were obtained: If the rotation speed of the substrate W is 500 rpm, the scattering angle θs of most of the droplets LD is less than 0°, therefore most of the droplets LD scatter diagonally downwards. The following results were obtained: If the rotation speed of the substrate W is 800 rpm or 1200 rpm, the scattering angle θs of most of the droplets LD is greater than 0°, therefore most of the droplets LD scatter diagonally upwards.

[0180] <Experiment for Measuring the Size of Water Droplets>

[0181] The results of the water droplet size measurement experiment, which involves using a high-speed camera to photograph water droplets flying off a substrate W and measuring the diameter of the droplets, are explained.

[0182] Figure 13 This is a graph showing the diameter of water droplets that fly off a substrate W rotating at 1000 rpm when DIW is supplied at 0.5 L / min. Figure 13 The horizontal axis in the chart represents the diameter Dm of the water droplets that scatter from the substrate W. Figure 13 The vertical axis in the chart represents the probability of water droplets of different diameters scattering. For example... Figure 13 As shown, the following results were obtained: the majority of water droplets scattered from the substrate W rotating at 1000 rpm had a diameter Dm of less than 1.5 mm. A particularly large number of water droplets had a diameter Dm of less than 1.0 mm.

[0183] <Experiment for Determining the Number of Water Droplets>

[0184] The results of the experiment on the number of water droplets adhering to the substrate W, which is to observe the number of water droplets splashed back from the cylindrical shield 80 and scattered toward the substrate W using a microscope, are explained.

[0185] Specifically, while rotating the substrate W, a three-second DIW was supplied to the upper and lower surfaces of the substrate W at a rate of 2L / min, and at the same time, a high-speed camera was used to measure the number of water droplets splashed back toward the substrate W within three seconds.

[0186] Figure 14 This is a graph showing the relationship between the number of water droplets scattered from the cylindrical shield 80 and the rotational speed of the substrate W. Figure 14 In the graph, the horizontal axis represents the rotational speed of the substrate W, and the vertical axis represents the number of water droplets that fly from the cylindrical shield 80 and adhere to the upper surface of the substrate W. For example... Figure 14As shown, the following results were obtained: when the rotation speed of substrate W was set to 300 rpm, fewer water droplets adhered to the upper surface of substrate W; when the rotation speed of substrate W was set to 600 rpm, more water droplets adhered to the upper surface of substrate W. The following results were obtained: when the rotation speed of substrate W was set to 800 rpm, 1200 rpm, and 1600 rpm, similarly to the case of a rotation speed of 600 rpm, more water droplets adhered to the upper surface of substrate W than when the rotation speed was 300 rpm. Therefore, it is deduced that when the rotation speed of substrate W is above 600 rpm, the scattering of droplets from the cylindrical protective cover 80 to the upper surface of substrate W becomes a problem.

[0187] Next, while rotating the substrate W at 1200 rpm, DIW was supplied to the upper surface of the substrate W at 2 L / min for 30 seconds, and the number of water droplets splashed back from the cylindrical shield 80 and attached to the substrate W during the DIW supply process was measured using water-sensitive paper.

[0188] To confirm the effect of reducing the amount of water droplets scattered due to the uneven portion 121, the number of water droplets attached to the upper surface of the substrate W when using the cylindrical cover 80 with the uneven portion 121 was compared with the number of water droplets attached to the upper surface of the substrate W when using the cylindrical cover 80 without the uneven portion 121 was used. Figure 15 This is a graph used to illustrate the effect of reducing the number of water droplets adhering to the upper surface of the substrate W due to the presence of the uneven portion 121.

[0189] like Figure 15 As shown, the following results were obtained: A cylindrical protective cover 80 having an inner peripheral surface 120 with an uneven surface 121 having an average surface roughness Ra of 3.0 or higher was obtained. Figure 15 The number of water droplets that scatter and adhere to the upper surface of the substrate W (as shown in the "cylindrical shield with protrusions and depressions") is greater than the number of water droplets that scatter and adhere to the upper surface of the substrate W from the cylindrical shield 80 (which has an inner peripheral surface 120 without protrusions and depressions 121). Figure 15 The number of water droplets (shown as "unprocessed cylindrical shield") that scatter and adhere to the upper surface of the substrate W is small. Therefore, it can be deduced that the presence of the uneven portion 121 with an average surface roughness Ra of 3.0 or higher can reduce the number of water droplets scattering from the cylindrical shield 80 toward the substrate W.

[0190] <Experiment for Determining the Number of Adhered Particles>

[0191] The results of a particle adhesion quantity measurement experiment, specifically measuring the number of particles adhering to the upper surface of substrate W after substrate treatment, are explained. In the particle adhesion quantity measurement experiment, after substrate treatment of the upper surface of substrate W was performed in the order of dilute hydrofluoric acid, APM, and isopropanol (IPA), the number of particles adhering to substrate W was measured using a microscope. To confirm the reduction effect of particle adhesion quantity due to the presence of the uneven portion 121, the number of particles adhering to the upper surface of substrate W when using a cylindrical shield 80 with the uneven portion 121 was compared with the number of particles adhering to the upper surface of substrate W when using a cylindrical shield 80 without the uneven portion 121 was formed. Figure 16 This is a graph used to illustrate the effect of reducing the number of particles attached to the upper surface of the substrate W due to the presence of the uneven portion 121.

[0192] like Figure 16 As shown, the following results were obtained: When using a cylindrical shield 80 having an inner circumferential surface 120 with an uneven surface 121 having an average surface roughness Ra of 3.0 or higher... Figure 16 The number of particles attached to the upper surface of the substrate W after substrate processing (as shown in the "cylindrical shield with uneven portions") is higher than that of the cylindrical shield 80 (with an inner peripheral surface 120 where uneven portions 121 are not formed) after substrate processing. Figure 16 The "unprocessed cylindrical shield" shown has fewer particles adhering to the upper surface of the substrate W after substrate processing. Therefore, it is inferred that the presence of the uneven portion 121 with an average surface roughness Ra of 3.0 or higher reduces the number of water droplets flying from the cylindrical shield 80 toward the substrate W, resulting in a reduction in the number of particles adhering to the upper surface of the substrate W.

[0193] <Contact Angle Measurement Experiment>

[0194] Next, use Figure 17 and Figure 18 The results of the contact angle measurement experiment, which compares the contact angle θ1 of a water droplet WD with that of a cylindrical shield 80 with different average surface roughness Ra and unevenness 121, are explained. Figure 17 This is a schematic diagram showing a water droplet WD falling onto the concave-convex part 121 during a contact angle measurement experiment.

[0195] The steps of the contact angle measurement experiment are as follows: (1) Drop a water droplet WD of 2 mm or more and less than 3 mm onto the inner circumferential surface 120. (2) Use a microscope to obtain an image of the vicinity of the water droplet WD. (3) Measure the contact angle θ1 of the water droplet WD relative to the inner circumferential surface 120 based on the image obtained in (2).

[0196] In the contact angle measurement experiment, four types of cylindrical shields 80 were used as samples: one with an inner peripheral surface 120 without the concave and convex portions 121, and the other with an inner peripheral surface 120 having concave and convex portions 121 with different average surface roughness Ra.

[0197] The average surface roughness Ra, the width W1 and depth De of the recess 130, and the width W2 of the protrusion 131 for each sample are shown in Table 1. As shown in Table 1, for the cylindrical cover 80 (sample A) with an inner circumferential surface 120 where the recess and protrusion 121 are not formed, it is recorded as "unprocessed" in the column for average surface roughness Ra. In addition, since no measurements were performed for each dimension (width W1 and depth De of the recess 130, and width W2 of the protrusion 131) for sample A, it is recorded as "-" in the column for each dimension.

[0198] Table 1

[0199] Sample Average surface roughness Ra Width W1 of the recess Depth De of the recess Width W2 of the convex portion Sample A Unprocessed － － － Sample B 1.3 30 to 80 μm 5 to 15 μm 10 to 60 μm Sample C 3.1 220 to 255 μm 20 to 40 μm 6 to 15 μm Sample D 4.5 350 to 380 μm 50 to 70 μm 8 to 20 μm Sample E 6.5 450 μm or more 90 μm or more 6 to 40 μm

[0200] The dimensions shown in Table 1 were measured using a microscope. The sample size for each of the samples A through E was 5 (N = 5). Each sample was formed by injection molding using PFA as the material.

[0201] Figure 18 This is a graph representing the results of the contact angle measurement experiment. For example... Figure 18 As shown, the contact angle θ1 of water droplet WD relative to sample A is greater than 83° and less than 96°. The contact angle θ1 of water droplet WD relative to sample B is greater than 80° and less than 95°. Therefore, it can be inferred that with an average surface roughness Ra of approximately 1.3, the inner circumferential surface 120 cannot be sufficiently hydrophobic.

[0202] The contact angle θ1 of water droplet WD relative to sample C is 99° or higher and 116° or lower. The contact angle θ1 of water droplet WD relative to sample D is 102° or higher and 126° or lower. Furthermore, the contact angle θ1 of water droplet WD relative to sample E is 119° or higher and 137° or lower. Therefore, it is deduced that if the average surface roughness Ra is at least 3.0 or higher, the inner circumferential surface 120 can be sufficiently hydrophobic.

[0203] based on Figure 14 and Figure 15 The results of the experiment showing the number of water droplets adhering to the surface are shown. Figure 16 The results of the particle adhesion quantity determination experiment shown, and Figure 18 Based on the results of the contact angle measurement experiment shown, the following can be inferred.

[0204] If the average surface roughness Ra is 3.0 or higher, the inner circumferential surface 120 can be sufficiently hydrophobic. In addition, if the average surface roughness is 3.0 or higher, even if the rotation speed of the substrate W is 600 rpm or higher, the splashing of droplets LD from the cylindrical shield 80 can be suppressed, and the adhesion of particles to the upper surface of the substrate W can be suppressed.

[0205] <Processing method of cylindrical protective cover>

[0206] The following is a detailed description of the processing method for the cylindrical protective cover 80. Figures 19A to 19D This is a schematic diagram illustrating the processing method of the cylindrical protective cover 80. Figures 19A to 19D The machining method shown is a lathe rotary machining method. First, as... Figure 19A As shown, an unprocessed cylindrical cover 80 is prepared for processing (cover preparation process). Specifically, the cylindrical cover 80 is held by the retaining member 161 in such a way that the central axis A4 of the cylindrical cover 80 is aligned with the rotation axis A5 of the retaining member 161, thereby completing the preparation of the cylindrical cover 80 (cover holding process). An unprocessed cylindrical cover 80 refers to a cylindrical cover 80 in which no protrusions 121 are formed on the inner circumferential surface 120.

[0207] With the retaining member 161 holding the cylindrical cover 80, the retaining member 161 is rotated about a predetermined rotation axis A5 (cover rotation process). The retaining member 161 has a cylindrical hole 161a that surrounds the cylindrical cover 80 from the outside. The unprocessed cylindrical cover 80 has the same structure as the cylindrical cover 80, except that the protrusions 121 are not formed on the inner circumferential surface 120.

[0208] Furthermore, while rotating the cylindrical shield 80 about the rotation axis A5 (central axis A4), the inner circumferential surface 120 of the cylindrical shield 80 is machined using the cutting component 163. The cutting component 163 is a component with a needle-shaped cutting tool 163a at its front end. Specifically, while moving the cutting component 163 in the axial direction X1 along the rotation axis A5, a concave-convex portion 121 is formed on the inner circumferential surface 120 (see reference). Figure 19C (The process of forming concave and convex parts).

[0209] Next, the process of forming the uneven parts will be described in detail. For example... Figure 19B As shown, the cutting component 163 is moved a predetermined feed distance L1 in a direction that intersects the rotation direction S of the cylindrical cover 80 and moves along the inner circumferential surface 120 of the cylindrical cover 80 at each predetermined feed time (cutting component moving operation).

[0210] After the cutting component 163 is moved by the feed distance L1, as follows Figure 19CAs shown, the cutting member 163 is moved in an orthogonal direction OD1 relative to the inner peripheral surface 120. Specifically, the cutting member 163 is moved to a position where the cutting tool 163a is pushed in by a predetermined pushing amount L2 relative to the inner peripheral surface 120. As a result, the inner peripheral surface 120 is cut to form a recess 130 constituting the concave-convex portion 121 on the inner peripheral surface 120 (cutting process).

[0211] By maintaining the cutting member 163 in a state where it is pushed into the inner peripheral surface 120 for a predetermined time, a recess 130, i.e., a circular groove 135, extending over the entire circumferential area of ​​the inner peripheral surface 120 can be formed. After the predetermined time has elapsed, the cutting member 163 is moved away from the inner peripheral surface 120 in an orthogonal direction OD1 relative to the inner peripheral surface 120. Then, the cutting member moving process and the cutting process are repeated. By forming a plurality of recesses 130, a protrusion 131 (circular protrusion 136) is formed between adjacent recesses 130. The inner peripheral surface 120 is hydrophobic by forming the recessed and protruding portions 121 (hydrophobicity process).

[0212] In this way, by simply moving the cutting member 163, multiple circular grooves 135 with constant depths can be formed at constant intervals. Therefore, the uniformity of the dimensions of the protrusions and recesses 121 formed on the inner peripheral surface 120 can be improved.

[0213] The inner circumferential surface 120 has a cylindrical surface 122 and an inclined surface 123. Therefore, when forming the concave and convex portions 121 with respect to the cylindrical surface 122, as... Figure 19A and Figure 19B As shown, in the cutting component movement process, the cutting component 163 moves in the direction (axial X1) along the cylindrical surface 122 (first movement process). Figure 19A and Figure 19C As shown, in the cutting process, the cutting component 163 is pushed into the cylindrical surface 122 from an orthogonal direction OD1 relative to the cylindrical surface 122 (first pushing-in process). When forming the concave-convex portion 121 for the inclined surface 123, as... Figure 19D As shown, in the cutting component moving step, the cutting component 163 is moved in the direction along the inclined surface 123 (the inclined direction X2 is inclined relative to the axial direction X1) (second moving step). In the cutting step, the cutting component 163 is pushed into the inclined surface 123 from the orthogonal direction OD2, which is orthogonal to the inclined surface 123 (second pushing step).

[0214] When forming the uneven portion 121 on the inclined surface 123, the angle of the cutting member 163 is adjusted so that the cutting member 163 can move along the inclined surface 123 and can be pushed into the inclined surface 123 from the orthogonal direction OD2 relative to the inclined surface 123. That is, the angle of the cutting member 163 is adjusted according to the angle of the surface to be machined.

[0215] In this way, by simply moving the cutting component along the cylindrical surface 122 and the inclined surface 123, multiple grooves with constant depths can be formed at constant intervals. Therefore, the uniformity of the grooves formed on the inner circumferential surface can be improved.

[0216] Thus, if the recess 130 is a circular groove 135, the concave-convex portion 121 can be formed simply by rotating the cylindrical cover 80 while moving the cutting member 163. Therefore, machining is easier compared to forming a discontinuous recess 130 along the circumferential direction CD of the inner circumferential surface 120.

[0217] <Examples of variations in the concave and convex parts>

[0218] Figures 20A to 20E These are schematic diagrams illustrating the first to fifth variations of the concave-convex portion 121. Figures 20A to 20E This is a diagram of the concave-convex portion 121 as viewed from an orthogonal direction relative to the inclined surface 123.

[0219] like Figure 20A As shown in the first modified example, the plurality of recesses 130 of the protrusion 121 include not only a plurality of circular grooves 135, but also a plurality of intersecting grooves 137 extending in a direction intersecting with the circular grooves 135. Figure 20A In the middle, the intersecting grooves 137 extend in a direction orthogonal to the circular grooves 135. A grid shape is formed by multiple circular grooves 135 and multiple intersecting grooves 137. Each protrusion 131 is surrounded by a pair of circular grooves 135 and a pair of intersecting grooves 137. The width W2 of the protrusion 131 is smaller than the width W11 (width W1) of the circular grooves 135 and the width W12 (width W1) of the intersecting grooves 137. Widths W11 and W12 may also be different.

[0220] In the first modified example, since a grid shape is formed by multiple intersecting grooves 137 and multiple circular grooves 135, the hydrophobicity can be uniformly improved throughout the entire area of ​​the concave and convex portions 121 compared to a structure that only has circular grooves 135 as recesses 130.

[0221] like Figure 20BAs shown, the recess 130 can also be a vertical groove extending vertically. In this case, a plurality of protrusions 131 extend vertically. The plurality of recesses 130 (a plurality of vertical grooves) are arranged side by side along the circumferential direction CD, and the protrusions 131 are located between adjacent vertical grooves on the circumferential direction CD.

[0222] In addition, such as Figure 20C and Figure 20D As shown, the recess 130 can also be an inclined groove that extends at an angle relative to the circumferential direction CD (horizontal direction).

[0223] In addition, such as Figure 20E As shown, the recess 130 can also be a circular hole. When multiple recesses 130 are circular holes, the multiple circular holes are arranged at equal intervals in the circumferential direction CD and in orthogonal directions orthogonal to the circumferential direction CD. The protrusion 131 is the portion between adjacent circular holes. The width W1 of the recess 130 corresponds to the diameter of the circular hole, and the width W2 of the protrusion 131 corresponds to the spacing between vertically or horizontally adjacent circular holes.

[0224] The plurality of recesses 130 and protrusions 131 constituting the concave-convex portion 121 may not be arranged in a regular manner as in the above-described embodiments and the first to fifth modifications, but may be arranged irregularly.

[0225] The above-described modifications are based on the example of the concave and convex portion 121 formed on the inclined surface 123, but the same modifications can also be applied to the concave and convex portion 121 formed on the cylindrical surface 122.

[0226] <Other Implementation Methods>

[0227] The present invention is not limited to the embodiments described above, and can be implemented in other ways.

[0228] For example, the above embodiment provides two cylindrical covers 80 (a first cylindrical cover 80A and a second cylindrical cover 80B). However, it is also possible to provide only one cylindrical cover 80, which is different from the above embodiment.

[0229] Furthermore, in the above embodiment, the processing liquid nozzle 30 includes a drug nozzle 31, an upper rinsing liquid nozzle 32, and a lower rinsing liquid nozzle 33. However, in addition to the drug nozzle 31, the upper rinsing liquid nozzle 32, and the lower rinsing liquid nozzle 33, the processing liquid nozzle 30 may also include an organic solvent nozzle that sprays organic solvents such as IPA toward the upper surface of the substrate W. Additionally, the drug nozzle 31 may be configured to selectively spray multiple drug solutions. In this case, the substrate processing performed in the particle adhesion quantity measurement experiment, i.e., substrate processing that treats the upper surface of the substrate W in the order of hydrofluoric acid, APM, and IPA, can be performed.

[0230] Additionally, a partition plate 104 is provided in the above embodiment. However, unlike the above embodiment, it may be configured such that the partition plate 104 is not provided and the outer space 103 of the protective cover is not divided vertically. In this case, the exhaust connection pipe 45 opens into the side wall 17B of the processing chamber 17.

[0231] In addition, Figures 19A to 19D The machining method of the shown cylindrical cover 80 uses an unmachined cylindrical cover 80. However, when the unevenness 121 is additionally machined (additionally formed) on the cylindrical cover 80 having an inner peripheral surface 120 with the unevenness 121 already formed, it is also possible to use... Figures 19A to 19D The processing method shown.

[0232] Furthermore, the processing method for the cylindrical cover 80 is not limited to the lathe rotary cutting process described above. It can also be laser processing, in which a recess 130 is formed on the inner circumferential surface 120 of the cylindrical cover 80 by laser irradiation. Alternatively, it can be mold transfer processing, in which a recess 130 is formed on the inner circumferential surface 120 by transferring the protrusions and concave parts formed on the mold to the inner circumferential surface 120.

[0233] Furthermore, the dimensions of the concave and convex portions 121 do not need to be constant within the inclined surface 123. Alternatively, there can be multiple regions within the inclined surface 123 with different dimensions of the concave and convex portions 121 (the width W1 and depth De of the concave portion 130, and the width W2 of the convex portion 131), i.e., different average surface roughness Ra. Similarly, there can also be multiple regions with different average surface roughness Ra within the cylindrical surface 122.

[0234] Furthermore, in the above embodiment, multiple processing units 5 are disposed together with multiple substrate mounting units 6, indexing robots IR, multiple main transport robots CR, and controller 4 in the substrate processing apparatus 1. However, the substrate processing apparatus may also be composed of only a single processing unit 5. In other words, the processing unit 5 may also be an example of a substrate processing apparatus.

[0235] Furthermore, while expressions such as "along," "horizontal," and "vertical" are used in the above embodiments, they do not necessarily have to be strictly "along," "horizontal," or "vertical." That is, these expressions allow for deviations in manufacturing precision, setting precision, etc.

[0236] In this specification, when “~” or “-” is used to indicate a range of values, unless otherwise specified and mentioned, both endpoints are included and the units are common.

[0237] The embodiments of the present invention have been described in detail, but these descriptions are merely specific examples used to clarify the technical content of the present invention. The present invention should not be limited to these specific examples for interpretation, and the scope of the present invention is defined only by the claims.

[0238] This application corresponds to Japan Patent Application No. 2021-21618, filed with the Japan Patent Office on February 15, 2021, the entire disclosure of which is incorporated herein by reference.

Claims

1. A substrate processing apparatus characterized by comprising: Possessing: a rotation holding member that rotates a substrate around a prescribed rotation axis while holding the substrate; a liquid supply member that supplies liquid to a substrate held by the rotation holding member; and a cylindrical resin-made shroud that surrounds a substrate held by the rotation holding member, the cylindrical shroud has an inner peripheral surface and a concave-convex portion provided to the inner peripheral surface, the concave-convex portion has a plurality of concave portions and a plurality of convex portions between mutually adjacent ones of the concave portions, the concave portions have a width that is smaller than a diameter of liquid droplets that are scattered from a substrate held by the rotation holding member and a depth that causes the liquid droplets not to contact a bottom of the concave portion in a state in which the liquid droplets contact the plurality of convex portions, the convex portions have a width that is smaller than the diameter of the liquid droplets and smaller than the width of the concave portions, the depth of the concave portions is 10 μm or more, the width of the concave portions is less than 1.5 mm, the width of the convex portions is less than 1.5 mm.

2. The substrate processing apparatus according to claim 1, wherein the depth of the concave portions is 200 μm or less, the width of the concave portions is 100 μm or more and less than 1.0 mm, the width of the convex portions is 40 μm or less.

3. The substrate processing apparatus according to claim 1 or 2, wherein an average surface roughness of the concave-convex portion is 3.0 or more and 6.0 or less.

4. The substrate processing apparatus according to claim 1 or 2, wherein the diameter of the liquid droplets is a diameter of liquid droplets that are scattered from a substrate that is rotated by the rotation holding member at a rotation speed of 600 rpm or more and 1200 rpm or less.

5. The substrate processing apparatus according to claim 1 or 2, wherein the diameter of the liquid droplets is 1.5 mm or less.

6. The substrate processing apparatus according to claim 1 or 2, wherein the plurality of concave portions include a plurality of circular groove portions along a circumferential direction of the inner peripheral surface, the plurality of circular groove portions are provided to the inner peripheral surface at intervals in an axial direction along a central axis of the inner peripheral surface.

7. The substrate processing apparatus according to claim 6, wherein the plurality of concave portions include a plurality of cross groove portions that extend in a direction that intersects the circular groove portions, a lattice shape is formed by the plurality of cross groove portions and the plurality of circular groove portions.

8. The substrate processing apparatus according to claim 1 or 2, wherein the inner peripheral surface of the cylindrical shroud has a cylindrical surface that extends in a vertical direction and an inclined surface that is connected to an upper end of the cylindrical surface and extends obliquely with respect to the cylindrical surface, the plurality of concave portions include a plurality of first concave portions that are formed to the inclined surface.

9. The substrate processing apparatus according to claim 8, wherein the plurality of concave portions include a plurality of second concave portions that are formed to the cylindrical surface.

10. The substrate processing apparatus according to claim 9, wherein the plurality of convex portions include a plurality of first convex portions between mutually adjacent ones of the first concave portions and second convex portions between mutually adjacent ones of the second concave portions, a width of the first convex portions is smaller than a width of the second convex portions.

11. The substrate processing apparatus according to claim 1 or 2, wherein the cylindrical cover is formed of a hydrophobic resin.

12. A substrate processing apparatus, characterized by comprising: provided with: a rotation holding member that holds the substrate so as to rotate the substrate around a prescribed rotation axis; a liquid supply member that supplies liquid to the substrate held by the rotation holding member; and a cylindrical cover made of a resin that surrounds the rotation holding member, the cylindrical cover has an inner peripheral surface and a concave-convex portion provided on the inner peripheral surface, the concave-convex portion has a plurality of concave portions and a plurality of convex portions between the concave portions adjacent to each other, the concave portions have a depth of 10 μm or more and a width of less than 1.5 mm, the convex portions have a width that is smaller than the width of the concave portions and is less than 1.5 mm.

13. The substrate processing apparatus according to claim 12, wherein the width of the concave portions is 100 μm or more and less than 1.0 mm, the depth of the concave portions is 200 μm or less, the width of the convex portions is 40 μm or less.

14. The substrate processing apparatus according to claim 12 or 13, wherein the average surface roughness of the inner peripheral surface is 3.0 or more and 6.0 or less.

15. A processing method of a cylindrical cover made of a resin and used to surround a rotation holding member that rotates a substrate around a prescribed rotation axis while holding the substrate in a substrate processing apparatus that processes the substrate using liquid, the processing method of the cylindrical cover being characterized by comprising: a cover preparation step of preparing a cylindrical cover having an inner peripheral surface; and a hydrophobization step of hydrophobizing the inner peripheral surface of the cylindrical cover by forming a concave-convex portion on the inner peripheral surface, in the hydrophobization step, the concave-convex portion is formed so as to have a plurality of concave portions and a plurality of convex portions between the concave portions adjacent to each other, the concave portions have a depth of 10 μm or more and a width of less than 1.5 mm, and the convex portions have a width that is smaller than the width of the concave portions and is less than 1.5 mm.

16. The processing method of the cylindrical cover according to claim 15, wherein in the hydrophobization step, the concave-convex portion is formed so as to have an average surface roughness of 3.0 or more and 6.0 or less.

17. The processing method of the cylindrical cover according to claim 15 or 16, wherein the hydrophobization step includes: a cutting member moving step of moving a cutting member along the inner peripheral surface by a prescribed feed distance per prescribed feed time while rotating the cylindrical cover around a central axis of the inner peripheral surface; and a cutting step of cutting the inner peripheral surface by pushing the cutting member into the inner peripheral surface by a prescribed push-in amount after moving the cutting member by the feed distance, to form a circular groove portion that constitutes the concave-convex portion. ​

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