Liquid discharge head and liquid discharge apparatus

Abstract

The present application provides a liquid ejection head and a liquid ejection apparatus which solve the problem that, when a temperature sensor is provided outside the liquid ejection head, the difference between the temperature measured by the temperature sensor and the temperature of the ink in the pressure chamber can be greater than the difference between the temperature inside the liquid ejection head and the temperature of the ink in the pressure chamber. The liquid ejection head has: a piezoelectric element including a first electrode, a second electrode, and a piezoelectric body; a vibration plate that is deformed by driving of the piezoelectric element; a pressure chamber substrate provided with a pressure chamber whose volume changes due to deformation of the vibration plate; a wiring substrate; an independent lead electrode that electrically connects the wiring substrate and the first electrode; a common lead electrode that electrically connects the wiring substrate and the second electrode; and a resistance wiring that is electrically connected to the wiring substrate and used to detect the temperature of the pressure chamber.

Description

TECHNICAL FIELD

[0001] The present application relates to a liquid ejection head and a liquid ejection apparatus. BACKGROUND

[0002] In Patent Literature 1, a liquid ejection head having a piezoelectric element, a pressure chamber, and a nozzle communicating with the pressure chamber is disclosed. The liquid ejection head is provided in a printer which is one example of a liquid ejection apparatus, and a volume of the pressure chamber is changed by driving the piezoelectric element by a control section, and ink which is one example of a liquid supplied to the pressure chamber is ejected from the nozzle. Further, in the printer, on a side of a carriage on which the liquid ejection head is mounted, a temperature sensor which measures an ambient temperature outside the liquid ejection head is provided. Also, the control section drives and controls the piezoelectric element based on the ambient temperature measured by the temperature sensor.

[0003] In the liquid ejection apparatus as in Patent Literature 1, the temperature sensor is provided outside the liquid ejection head. Therefore, a difference between the temperature measured by the temperature sensor and a temperature of the ink in the pressure chamber can be larger than a difference between a temperature in the liquid ejection head and the temperature of the ink in the pressure chamber. In this case, the liquid ejection apparatus can not be able to implement ejection control of the liquid ejection head which is appropriate to the temperature of the ink in the pressure chamber.

[0004] Patent Literature 1: Japanese Patent Application Publication No. 2011-104916 SUMMARY

[0005] The liquid ejection head has: a piezoelectric element including a first electrode, a second electrode, and a piezoelectric body, and in a stacking direction in which the first electrode, the second electrode, and the piezoelectric body are stacked, the piezoelectric body is disposed between the first electrode and the second electrode; a vibration plate disposed on one side in the stacking direction with respect to the piezoelectric element, and deformed by driving of the piezoelectric element; a pressure chamber substrate disposed on the one side in the stacking direction with respect to the vibration plate, and provided with a plurality of pressure chambers whose volumes are changed by deformation of the vibration plate; a wiring substrate; a first wiring electrically connecting the wiring substrate and the first electrode; a second wiring electrically connecting the wiring substrate and the second electrode; and a temperature detecting section electrically connected to the wiring substrate, and used to detect a temperature of the pressure chamber.

[0006] The liquid ejection apparatus has the liquid ejection head and a control section which controls an ejection operation of ejecting a liquid from the liquid ejection head. BRIEF DESCRIPTION OF DRAWINGS

[0007] Figure 1This is a block diagram illustrating the general structure of a liquid ejection device having a liquid ejection head as one embodiment of the present disclosure.

[0008] Figure 2 An exploded perspective view showing the detailed structure of the liquid ejector head.

[0009] Figure 3 This is a plan view showing the liquid ejector head.

[0010] Figure 4 To indicate Figure 3 The cross-sectional view of the liquid ejector head along section IV-IV is shown.

[0011] Figure 5 for Figure 4 Detailed diagram of the main parts of the liquid ejector head shown.

[0012] Figure 6 To indicate Figure 3 The cross-sectional view of section VI-VI of the liquid ejector head shown.

[0013] Figure 7 This is a detailed view of the main parts of the liquid ejector head according to Embodiment 2.

[0014] Figure 8 This is a detailed view of the main parts of the liquid ejector head involved in Embodiment 3.

[0015] Figure 9 This is a plan view showing the liquid ejector head according to Embodiment 4.

[0016] Figure 10 This is a plan view showing a modified example of the liquid ejector head according to Embodiment 4.

[0017] Figure 11 This is a plan view showing a modified example of the liquid ejector head according to Embodiment 4.

[0018] Figure 12 This is a plan view showing the liquid ejector head according to Embodiment 5.

[0019] Figure 13 Detailed diagram of the main parts of the liquid ejector head involved in other embodiments.

[0020] Figure 14 This is a cross-sectional view of a liquid ejector head according to other embodiments. Detailed Implementation

[0021] The present invention will now be described based on embodiments. In the various figures, the same components are labeled with the same symbols, and repeated descriptions are omitted.

[0022] Furthermore, in each diagram, X, Y, and Z represent three mutually orthogonal spatial axes. In this specification, the directions along these axes are designated as the X-axis, Y-axis, and Z-axis directions. When a specific orientation is defined, a positive direction is designated as "+", and a negative direction as "-". Both positive and negative signs are used in the direction markings. The direction indicated by the arrow in each diagram is designated as the "+" direction, and the opposite direction is designated as the "-" direction. Additionally, the Z-direction represents the vertical direction, the +Z-direction represents the vertical downward direction, and the -Z-direction represents the vertical upward direction. Moreover, the three spatial axes X, Y, and Z, whose positive and negative directions are not defined, are designated as the X-axis, Y-axis, and Z-axis, respectively.

[0023] 1. Implementation Method 1

[0024] In this embodiment, the liquid ejection device 500 is configured as an inkjet printer to eject ink onto printing paper P, thereby forming an image. Ink is an example of a liquid. Alternatively, instead of printing paper P, any type of medium such as resin film or cloth can be used as the ink ejection target.

[0025] like Figure 1 As shown, the liquid ejection device 500 includes a liquid ejection head 510, an ink tank 550, a conveying mechanism 560, a moving mechanism 570, and a control unit 580.

[0026] The liquid ejector head 510 has a large number of nozzles 21 and ejects ink in the +Z direction to form an image on the printing paper P. Furthermore, the liquid ejector head 510 has a resistive wiring 401, which serves as an example of a temperature detection unit. The detailed structure of the liquid ejector head 510 will be described later. For example, four colors of ink can be ejected: black, blue-green, magenta, and yellow. Alternatively, inks of any color, such as light blue-green, light magenta, or white, can also be ejected, not limited to these four colors. The liquid ejector head 510 is mounted on a carriage 572 (described later) of the moving mechanism 570 and reciprocates in the main scanning direction along with the movement of the carriage 572. In this embodiment, the main scanning direction is the +X direction and the -X direction.

[0027] The ink reservoir 550 collects the ink ejected from the liquid nozzle 510. The ink reservoir 550 is not mounted on the carriage 572. The ink reservoir 550 and the liquid nozzle 510 are connected by a resin tube 552, through which ink is supplied from the ink reservoir 550 to the liquid nozzle 510. Alternatively, a bag-shaped liquid bag formed of a flexible film can be used instead of the ink reservoir 550.

[0028] The conveyance mechanism 560 conveys the print paper P in the sub-scanning direction. The sub-scanning direction is a direction orthogonal to the X-axis direction that is the main scanning direction, and in the present embodiment, the +Y direction and the -Y direction. The conveyance mechanism 560 has a conveyance bar 564 on which three conveyance rollers 562 are mounted, and a conveyance motor 566 that rotationally drives the conveyance bar 564. The plurality of conveyance rollers 562 are rotated and the print paper P is conveyed in the +Y direction in the sub-scanning direction by the rotational driving of the conveyance bar 564 by the conveyance motor 566. Note that the number of conveyance rollers 562 is not limited to three, and can be any number. Further, a configuration can be provided in which a plurality of conveyance mechanisms 560 are provided.

[0029] The moving mechanism 570 has, in addition to the carriage 572 described above, a conveyance belt 574, a moving motor 576, and a pulley 577. The carriage 572 mounts the liquid discharge head 510 in a state in which ink can be discharged. The carriage 572 is mounted on the conveyance belt 574. The conveyance belt 574 is stretched between the moving motor 576 and the pulley 577. The conveyance belt 574 is reciprocally moved in the main scanning direction by the rotational driving of the moving motor 576. As a result, the carriage 572 mounted on the conveyance belt 574 is also reciprocally moved in the main scanning direction.

[0030] The control section 580 controls the entire liquid discharge apparatus 500. For example, the control section 580 controls the reciprocating movement of the carriage 572 in the main scanning direction, the conveyance movement of the print paper P in the sub-scanning direction, and the discharge movement of the liquid discharge head 510. Further, in the present embodiment, the control section 580 detects the temperature of the pressure chamber 12 described later based on a measurement value measured by a temperature detection section provided to the liquid discharge head 510. Further, the control section 580 also functions as a drive control section of the piezoelectric element 300 described later. That is, the control section 580 controls the discharge of ink to the print paper P by outputting a drive signal based on the detected temperature of the pressure chamber 12 to the liquid discharge head 510 and driving the piezoelectric element 300. The control section 580 can be constituted by one or a plurality of processing circuits such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array), and one or a plurality of storage circuits such as a semiconductor memory, for example.

[0031] As Figure 2As shown, the liquid ejector head 510 is an ejector head that ejects ink droplets in the Z-axis direction, more specifically in the +Z direction. As structural components, the liquid ejector head 510 includes a pressure chamber substrate 10, a connecting plate 15, a nozzle plate 20, a malleable substrate 45, a vibrating plate 50 (described later), a piezoelectric element 300 (described later), a protective substrate 30, a housing component 40, and a wiring substrate 120. Furthermore, the pressure chamber substrate 10, connecting plate 15, nozzle plate 20, malleable substrate 45, vibrating plate 50, piezoelectric element 300, protective substrate 30, and housing component 40 can also be considered as an example of a stacked component forming the liquid ejector head 510 by being laminated.

[0032] The pressure chamber substrate 10 is made of, for example, a silicon substrate, a glass substrate, an SOI substrate, or various ceramic substrates. The pressure chamber substrate 10 can also be referred to as an example of a substrate.

[0033] like Figure 3 As shown, on the pressure chamber substrate 10, a plurality of pressure chambers 12 arranged along the Y-axis direction are arranged in two rows along the X-axis direction. In other words, the liquid ejector head 510 has a plurality of pressure chambers 12, which form a plurality of pressure chamber rows arranged along the Y-axis direction. The Y-axis direction is an example of a first direction, and the X-axis direction is an example of a second direction. Furthermore, the pressure chamber row is an example of a pressure chamber group. In addition, the pressure chamber row that is on the +X direction side is called the first pressure chamber row, and the pressure chamber row that is separated from the first pressure chamber row in the -X direction in the X-axis direction is called the second pressure chamber row. The +X direction is an example of one of the second directions, and the -X direction is an example of the other of the second directions. In addition, although Figure 3 This is a plan view of the liquid ejector head 510, but the structure around the pressure chamber substrate 10 is shown. For ease of explanation, the protective substrate 30 and the housing component 40 are also omitted.

[0034] Multiple pressure chambers 12 constituting each pressure chamber row are arranged in a straight line along the Y-axis such that their positions are identical in the X-axis direction. Pressure chambers 12 adjacent to each other in the Y-axis direction are... Figure 6 The partition 11 shown is used to divide the space. Of course, the arrangement of the pressure chambers 12 is not particularly limited. For example, the arrangement of multiple pressure chambers 12 arranged side by side in the Y-axis direction can also be a so-called staggered arrangement in which each pressure chamber 12 is set at a position staggered in the X-axis direction at an interval of one.

[0035] Further, the pressure chamber 12 of the present embodiment is formed in, for example, a rectangular shape in which the length in the X-axis direction is longer than the length in the Y-axis direction when viewed from the +Z direction plane. Of course, the shape of the pressure chamber 12 when viewed from the +Z direction plane is not particularly limited, and can be, for example, a parallelogram shape, a polygonal shape, a circular shape, an oblong shape, or the like. Further, the oblong shape referred to herein means a shape in which both ends in the length direction are semicircular shapes based on a rectangular shape, and includes a rounded rectangular shape, an elliptical shape, an egg shape, or the like.

[0036] As shown in FIG. 1, the pressure chamber 12 is formed in a rectangular shape in which the length in the X-axis direction is longer than the length in the Y-axis direction when viewed from the +Z direction plane. Figure 2 , Figure 4 As shown in FIG. 1, the pressure chamber 12 is formed in a rectangular shape in which the length in the X-axis direction is longer than the length in the Y-axis direction when viewed from the +Z direction plane.

[0037] In the communication plate 15, a nozzle communication passage 16 that communicates the pressure chamber 12 and the nozzle 21 is provided. Further, in the communication plate 15, a first manifold portion 17 and a second manifold portion 18 that constitute a part of a manifold 100 that becomes a common liquid chamber to which a plurality of pressure chambers 12 are communicated are provided. The first manifold portion 17 is provided so as to penetrate the communication plate 15 in the Z-axis direction. Further, the second manifold portion 18 is provided so as to be open in the face on the +Z direction side without penetrating the communication plate 15 in the Z-axis direction.

[0038] Further, in the communication plate 15, a supply communication passage 19 that communicates with one end portion of the pressure chamber 12 in the X-axis direction is provided independently for each pressure chamber 12. The supply communication passage 19 communicates the second manifold portion 18 and each pressure chamber 12, and thereby supplies ink in the manifold 100 to each pressure chamber 12.

[0039] As the communication plate 15, a silicon substrate, a glass substrate, an SOI substrate, various ceramic substrates, a metal substrate, or the like can be used. As the metal substrate, for example, a stainless steel substrate or the like can be listed. Further, it is preferable that the communication plate 15 use a material having substantially the same thermal expansion rate as the pressure chamber substrate 10. Thereby, when the temperature of the pressure chamber substrate 10 and the communication plate 15 changes, warping of the pressure chamber substrate 10 and the communication plate 15 due to a difference in thermal expansion rate can be suppressed.

[0040] The nozzle plate 20 is provided on the face on the +Z direction side of the communication plate 15 opposite the pressure chamber substrate 10. In the nozzle plate 20, the nozzle 21 that communicates with each pressure chamber 12 via the nozzle communication passage 16 is formed.

[0041] In the present embodiment, the plurality of nozzles 21 are arranged side by side in a manner that they are aligned along the Y-axis direction. Also, on the nozzle plate 20, the nozzle rows in which the plurality of nozzles 21 are arranged in rows are provided in two rows in a manner that the rows are separated in the X-axis direction. The two rows of nozzle rows correspond to the first pressure chamber row and the second pressure chamber row, respectively. The plurality of nozzles 21 of each row are arranged in a manner that the positions in the X-axis direction are the same. Note that the arrangement of the nozzles 21 is not particularly limited. For example, the nozzles 21 arranged side by side in the Y-axis direction can also be arranged at positions staggered in the X-axis direction at every other position.

[0042] As the material of the nozzle plate 20, there is no particular limitation, and for example, a silicon substrate, a glass substrate, an SOI substrate, various ceramic substrates, a metal substrate can be used. As the metal substrate, for example, a stainless steel substrate or the like can be cited. Also, as the material of the nozzle plate 20, an organic substance such as a polyimide resin or the like can also be used. Among them, it is preferable that the nozzle plate 20 use a material having substantially the same thermal expansion rate as that of the communication plate 15. Thereby, when the temperature of the nozzle plate 20 and the communication plate 15 changes, the warping of the nozzle plate 20 and the communication plate 15 due to the difference in thermal expansion rate can be suppressed.

[0043] The plastic substrate 45 is provided on the side of the communication plate 15 opposite to the pressure chamber substrate 10, that is, the +Z direction side, together with the nozzle plate 20. The plastic substrate 45 is provided around the nozzle plate 20 and seals the openings of the first manifold portion 17 and the second manifold portion 18 provided in the communication plate 15. In the present embodiment, the plastic substrate 45 has a sealing film 46 composed of a thin film having flexibility and a fixed substrate 47 composed of a hard material such as metal. The region of the fixed substrate 47 opposite to the manifold 100 is an opening portion 48 completely removed in the thickness direction. Therefore, one face of the manifold 100 becomes a plastic portion 49 sealed only by the sealing film 46 having flexibility.

[0044] On the other hand, although the details will be described later, on the side of the pressure chamber substrate 10 opposite to the nozzle plate 20 or the like, that is, the -Z direction side, a vibration plate 50 and a piezoelectric element 300 are stacked, the piezoelectric element 300 causing the vibration plate 50 to be flexibly deformed, thereby causing the ink in the pressure chamber 12 to change in pressure. In other words, the vibration plate 50 is provided in the +Z direction in the Z-axis direction with respect to the piezoelectric element 300, and the pressure chamber substrate 10 is provided in the +Z direction in the Z-axis direction with respect to the vibration plate 50. The Z-axis direction is one example of the stacking direction, the +Z direction is one example of one of the stacking directions, and the -Z direction is one example of the other of the stacking directions. In addition, Figure 4 This is a diagram for explaining the overall structure of the liquid ejection head 510 and simplifies the structure of the piezoelectric element 300.

[0045] On the -Z direction side surface of the pressure chamber substrate 10, a protection substrate 30 having substantially the same size as the pressure chamber substrate 10 is further joined by an adhesive or the like. The protection substrate 30 has a holding portion 31 that is a space for protecting the piezoelectric elements 300. The holding portion 31 is independently provided for each column of the piezoelectric elements 300 arranged side by side in the Y axis direction, and is formed side by side in two in the X axis direction. Further, a through hole 32 is provided in the protection substrate 30, which penetrates between the two holding portions 31 arranged side by side in the X axis direction in the Z axis direction.

[0046] Further, on the protection substrate 30, a housing member 40 that divides a manifold 100 communicating with the plurality of pressure chambers 12 together with the pressure chamber substrate 10 is fixed. The housing member 40 has substantially the same shape as the above-mentioned communication plate 15 when viewed from the -Z direction plane, and is joined to the protection substrate 30 as well as the above-mentioned communication plate 15.

[0047] Such a housing member 40 has a housing portion 41 that is a space capable of housing the pressure chamber substrate 10 and the protection substrate 30 in the depth direction on the protection substrate 30 side. The housing portion 41 has a larger opening area than the surface of the protection substrate 30 joined to the pressure chamber substrate 10. Further, in a state where the pressure chamber substrate 10 and the protection substrate 30 are housed in the housing portion 41, the opening surface of the nozzle plate 20 side of the housing portion 41 is sealed by the communication plate 15.

[0048] Further, in the housing member 40, a third manifold portion 42 is divided on the outer side of the housing portion 41 in the X axis direction. Further, the manifold 100 of the present embodiment is constituted by the first manifold portion 17 and the second manifold portion 18 provided in the communication plate 15, and the third manifold portion 42. The manifold 100 is continuously provided in the Y axis direction, and the supply communication passages 19 that communicate each pressure chamber 12 and the manifold 100 are arranged side by side in the Y axis direction.

[0049] Further, in the housing member 40, a supply port 44 for supplying ink to each manifold 100 in communication with the manifold 100 is provided. Further, a connection port 43 is provided in the housing member 40, which communicates with the through hole 32 of the protection substrate 30 and is inserted through by a wiring substrate 120.

[0050] In this embodiment of the liquid ejector head 510, ink is drawn in from the supply port 44, which is connected to the ink tank 550 via a pipe 552. After the interior is filled with ink from the manifold 100 to the nozzle 21, the head circuit 121 applies a voltage based on a drive signal to each piezoelectric element 300 corresponding to the pressure chamber 12. As a result, the vibrating plate 50 and the piezoelectric elements 300 flex and deform together, thereby increasing the pressure in each pressure chamber 12, and ink droplets are ejected from each nozzle 21.

[0051] The following describes in detail the structure, including the aforementioned vibrating plate 50 and piezoelectric element 300, which is stacked on the -Z direction side of the pressure chamber substrate 10. As a structure stacked on the -Z direction side of the pressure chamber substrate 10, in addition to the vibrating plate 50 and piezoelectric element 300, the liquid ejector head 510 also has an independent lead electrode 91, a common lead electrode 92, a measuring lead electrode 93, and a resistance wiring 401.

[0052] like Figure 4 to Figure 6 As shown, the vibrating plate 50 is composed of an elastic membrane 51 and an insulating membrane 52. The elastic membrane 51 is disposed on the side of the pressure chamber substrate 10 and is made of silicon oxide, while the insulating membrane 52 is disposed on the elastic membrane 51 and is made of zirconium oxide. The liquid flow channels, such as the pressure chamber 12, are formed by anisotropic etching of the pressure chamber substrate 10 starting from the +Z direction side. The -Z direction side of the liquid flow channels, such as the pressure chamber 12, is composed of the elastic membrane 51.

[0053] Furthermore, the structure of the vibrating plate 50 is not particularly limited. The vibrating plate 50 may be composed of either an elastic membrane 51 or an insulating membrane 52, and may also include other membranes besides the elastic membrane 51 and the insulating membrane 52. Examples of other membrane materials include silicon and silicon nitride.

[0054] The piezoelectric element 300 is an example of a piezoelectric actuator that causes a pressure change in the ink within the pressure chamber 12. The piezoelectric element 300 has a first electrode 60, a piezoelectric body 70, and a second electrode 80 sequentially stacked from the +Z direction side (which serves as the vibrating plate 50) towards the -Z direction side. In other words, the piezoelectric element 300 includes the first electrode 60, the second electrode 80, and the piezoelectric body 70, with the piezoelectric body 70 disposed between the first electrode 60 and the second electrode 80 in the Z-axis direction in which the first electrode 60, the second electrode 80, and the piezoelectric body 70 are stacked.

[0055] The first electrode 60 and the second electrode 80 are electrically connected to the wiring substrate 120, and apply a voltage corresponding to a drive signal supplied from a head circuit 121 mounted on the wiring substrate 120 to the piezoelectric body 70. A drive voltage that differs depending on the amount of ink to be ejected is supplied to the first electrode 60, and a fixed holding voltage is supplied to the second electrode 80 regardless of the amount of ink to be ejected. In addition, the amount of ink to be ejected becomes a required amount of change in volume of the pressure chamber 12. Thus, a potential difference is generated between the first electrode 60 and the second electrode 80, and the piezoelectric body 70 is deformed. That is, the piezoelectric element 300 is driven, the diaphragm 50 is deformed or vibrated, the volume of the pressure chamber 12 is changed, and pressure is applied to the ink accommodated in the pressure chamber 12, and the ink is ejected from the nozzle 21 via the nozzle communication passage 16.

[0056] A portion of the piezoelectric element 300 in which a piezoelectric strain is generated in the piezoelectric body layer 70 when a voltage is applied between the first electrode 60 and the second electrode 80 is referred to as an active portion 310. In contrast, a portion in which a piezoelectric strain is not generated in the piezoelectric body layer 70 is referred to as an inactive portion 320. That is, the portion of the piezoelectric element 300 in which the piezoelectric body layer 70 is sandwiched by the first electrode 60 and the second electrode 80 is the active portion 310, and the portion of the piezoelectric body layer 70 that is not sandwiched by the first electrode 60 and the second electrode 80 is the inactive portion 320. Furthermore, when the piezoelectric element 300 is driven, a portion that is actually displaced in the Z-axis direction is referred to as a flexible portion, and a portion that is not displaced in the Z-axis direction is referred to as a non-flexible portion. That is, the portion of the piezoelectric element 300 that opposes the pressure chamber 12 in the Z-axis direction is the flexible portion, and the portion outside the pressure chamber 12 is the non-flexible portion. In addition, the active portion 310 is also referred to as an active portion, and the inactive portion 320 is also referred to as an inactive portion.

[0057] Generally, one of the electrodes of the active portion 310 is configured as an independent electrode that is independent for each active portion 310, and the other electrode is configured as a common electrode that is shared by a plurality of active portions 310. In the present embodiment, the first electrode 60 is configured as an independent electrode, and the second electrode 80 is configured as a common electrode.

[0058] Specifically, the first electrode 60 is disposed on the +Z direction side in the Z-axis direction with respect to the piezoelectric body 70, and is divided for each pressure chamber 12, thereby being configured as an independent electrode that is independent for each active portion 310. That is, the first electrode 60 is independently disposed with respect to a plurality of pressure chambers 12. The first electrode 60 is formed in the Y-axis direction with a width that is narrower than the width of the pressure chamber 12. That is, in the Y-axis direction, the end portion of the first electrode 60 is positioned inside the region that opposes the pressure chamber 12.

[0059] Furthermore, the +X direction end 60a and the -X direction end 60b of the first electrode 60 are respectively disposed outside the pressure chamber 12. For example, in the first pressure chamber row, such as Figure 5 As shown, the end 60a of the first electrode 60 is positioned on the +X direction side compared to the end 12a of the pressure chamber 12 in the +X direction. The end 60b of the first electrode 60 is positioned on the -X direction side compared to the end 12b of the pressure chamber 12 in the -X direction.

[0060] While the material of the first electrode 60 is not particularly limited, conductive materials such as metals like platinum (Pt), iridium (Ir), gold (Au), and titanium (Ti), or conductive metal oxides like indium tin oxide (ITO), can be used. Alternatively, multiple materials such as platinum (Pt), iridium (Ir), gold (Au), and titanium (Ti) can be formed in a stacked manner. In this embodiment, platinum (Pt) is used as the first electrode 60.

[0061] like Figure 3 As shown, the piezoelectric element 70 has a predetermined length in the X-axis direction and is continuously arranged in the Y-axis direction. That is, the piezoelectric element 70 is continuously arranged along the side-by-side arrangement direction of the pressure chamber 12 with a predetermined thickness. Although the thickness of the piezoelectric element 70 is not particularly limited, it is formed with a thickness of about 1000 nanometers to 4000 nanometers.

[0062] In addition, such as Figure 5 As shown, the length of the piezoelectric element 70 in the X-axis direction is longer than the length of the pressure chamber 12 in the X-axis direction. Therefore, the piezoelectric element 70 extends to the outside of the pressure chamber 12 on both sides in the X-axis direction. In this way, by extending the piezoelectric element 70 to the outside of the pressure chamber 12 in the X-axis direction, the strength of the vibrating plate 50 is improved. Therefore, when the piezoelectric element 300 is displaced by driving the active part 310, it is possible to suppress the generation of cracks or the like in the vibrating plate 50 or the piezoelectric element 300.

[0063] In addition, for example, such as Figure 5 As shown, in the first pressure chamber array, the +X direction end 70a of the piezoelectric body 70 is located on the +X direction side, which is further outward than the end 60a of the first electrode 60. That is, the end 60a of the first electrode 60 is covered by the piezoelectric body 70. On the other hand, the -X direction end 70b of the piezoelectric body 70 is located on the +X direction side, which is further inward than the end 60b of the first electrode 60, and the end 60b of the first electrode 60 is not covered by the piezoelectric body 70.

[0064] In addition, such as Figure 3 as well as Figure 6As shown, a groove portion 71, which is a portion having a thickness thinner than other portions, is formed on the piezoelectric body 70 in correspondence with each of the partition walls 11. The groove portion 71 of the present embodiment is formed by completely removing the piezoelectric body 70 in the Z-axis direction. That is, the piezoelectric body 70 has a portion having a thickness thinner than other portions, and also includes a portion in which the piezoelectric body 70 is completely removed in the Z-axis direction. Of course, on the bottom surface of the groove portion 71, the piezoelectric body 70 can also be formed to be thinner than other portions.

[0065] Further, the length in the Y-axis direction of the groove portion 71, that is, the width of the groove portion 71 is the same as or larger than the width of the partition wall 11. In the present embodiment, the width of the groove portion 71 is larger than the width of the partition wall 11.

[0066] Such a groove portion 71 is formed in a rectangular shape when viewed from the -Z direction side plane. Of course, the shape of the groove portion 71 when viewed from the -Z direction side plane is not limited to a rectangular shape, and can be a polygonal shape of five sides or more, or a circular shape or an elliptical shape, or the like.

[0067] By providing the groove portion 71 on the piezoelectric body 70, the rigidity of the portion of the vibration plate 50 that opposes the end portion of the pressure chamber 12 in the Y-axis direction, that is, the arm portion of the vibration plate 50 is suppressed, and thus the piezoelectric element 300 can be displaced more favorably.

[0068] As the piezoelectric body 70, a crystal film of a perovskite structure, which is a ferroelectric ceramic material that exhibits electro-mechanical conversion, so-called perovskite crystal, formed on the first electrode 60 can be cited. As the material of the piezoelectric body 70, for example, a ferroelectric piezoelectric material such as zirconate titanate (PZT), or a material obtained by adding a metal oxide such as niobium oxide, nickel oxide, or magnesium oxide to the material, or the like can be used. Specifically, lead titanate (PbTiO3), lead zirconate titanate (Pb(Zr, Ti)O3), lead zirconate (PbZrO3), lead lanthanum titanate ((Pb, La)TiO3), lead lanthanum zirconate titanate ((Pb, La)(Zr, Ti)O3), or lead zirconate titanate magnesium niobate (Pb(Zr, Ti)(Mg, Nb)O3), or the like can be used. In the present embodiment, lead zirconate titanate (PZT) is used as the piezoelectric body 70.

[0069] Furthermore, the material used for the piezoelectric element 70 is not limited to lead-based piezoelectric materials containing lead; lead-free, non-lead piezoelectric materials can also be used. Examples of lead-free piezoelectric materials include, for instance, bismuth ferrite ((BiFeO3, abbreviated as "BFO")), barium titanate ((BaTiO3, abbreviated as "BT")), potassium sodium niobate ((K,Na)(NbO3, abbreviated as "KNN")), lithium sodium potassium niobate ((K,Na,Li)(NbO3)), lithium sodium potassium tantalate ((K,Na,Li)(Nb,Ta)O3), potassium bismuth titanate ((Bi1 / 2K1 / 2)TiO3, abbreviated as "BKT"), sodium bismuth titanate ((Bi1 / 2Na1 / 2)TiO3, abbreviated as "BNT"), and bismuth manganate (BiMnO3). The following are examples of composite oxides with perovskite structure, including bismuth, potassium, titanium and iron (abbreviated as "BM"), (x[(BixK1-x)TiO3]-(1-x)[BiFeO3], abbreviated as "BKT-BF"), ((1-x)[BiFeO3]-x[BaTiO3], abbreviated as "BFO-BT"), or substances obtained by adding metals such as manganese, cobalt, and chromium to the composite oxide ((1-x)[Bi(Fe1-yMy)O3]-x[BaTiO3] (M is Mn, Co or Cr)).

[0070] like Figure 3 , Figure 5 , Figure 6 As shown, the second electrode 80 is disposed on the side opposite to the first electrode 60, i.e., on the -Z direction side of the Z-axis, relative to the piezoelectric body 70, and constitutes a common electrode shared by multiple active parts 310. That is, the second electrode 80 is disposed in common with respect to multiple pressure chambers 12. The second electrode 80 has a predetermined length in the X-axis direction, and is thus continuously disposed in the Y-axis direction. This second electrode 80 is also disposed on the inner surface of the groove 71, i.e., on the side surface of the groove 71 of the piezoelectric body 70, and on the insulating film 52 that serves as the bottom surface of the groove 71. In addition, regarding the interior of the groove 71, the second electrode 80 may be disposed only on a portion of the inner surface of the groove 71, or it may not be disposed to cover the entire inner surface of the groove 71.

[0071] In addition, for example, such as Figure 5As shown, in the first pressure chamber row, the end portion 80a of the second electrode 80 in the +X direction is arranged on the +X direction side so as to be located outward of the end portion 60a of the first electrode 60 covered by the piezoelectric body 70. That is, the end portion 80a of the second electrode 80 is located on the +X direction side outward of the end portion 12a of the pressure chamber 12 and on the +X direction side outward of the end portion 60a of the first electrode 60. In the present embodiment, the end portion 80a of the second electrode 80 substantially coincides with the end portion 70a of the piezoelectric body 70 in the X axis direction. Therefore, the end portion of the active portion 310 in the +X direction, that is, the boundary between the active portion 310 and the inactive portion 320 is defined by the end portion 60a of the first electrode 60.

[0072] On the other hand, although the end portion 80b of the second electrode 80 in the -X direction is arranged on the -X direction side outward of the end portion 12b of the pressure chamber 12, it is arranged on the +X direction side inward of the end portion 70b of the piezoelectric body 70. As described above, the end portion 70b of the piezoelectric body 70 is located inward of the end portion 60b of the first electrode 60 on the +X direction side. Therefore, the end portion 80b of the second electrode 80 is located on the piezoelectric body 70 on the +X direction side of the end portion 60b of the first electrode 60. Therefore, on the -X direction side of the end portion 80b of the second electrode 80, there is a portion in which the surface of the piezoelectric body 70 is exposed.

[0073] Thus, since the end portion 80b of the second electrode 80 is arranged on the +X direction side of the end portion 70b of the piezoelectric body 70 and the end portion 60b of the first electrode 60, the end portion of the active portion 310 in the -X direction, that is, the boundary between the active portion 310 and the inactive portion 320 is defined by the end portion 80b of the second electrode 80.

[0074] Although the material of the second electrode 80 is not particularly limited, as with the first electrode 60, for example, a conductive material such as a metal such as platinum (Pt), iridium (Ir), gold (Au), titanium (Ti), a conductive metal oxide such as indium tin oxide abbreviated as ITO, or the like is used. Alternatively, a plurality of materials such as platinum (Pt), iridium (Ir), gold (Au), titanium (Ti), and the like can be formed in a stacked manner. In the present embodiment, iridium (Ir) is used as the second electrode 80.

[0075] Further, on the outer side of the end portion 80b of the second electrode 80, that is, on the further -X direction side of the end portion 80b of the second electrode 80, a wiring portion 85 is provided which, although constituted by the same layer as the second electrode 80, is not electrically continuous with the second electrode 80. Further, the wiring portion 85 is formed in a state of being separated by a gap from the piezoelectric body 70 in a manner not in contact with the end portion 80b of the second electrode 80, and is formed so as to span from the piezoelectric body 70 to the first electrode 60 which is provided extending in the -X direction compared to the piezoelectric body 70. This wiring portion 85 is provided independently for each active portion 310. That is, the wiring portion 85 is provided a plurality of times at predetermined intervals along the Y axis direction. In addition, although the wiring portion 85 can also be formed from a layer independent of the second electrode 80, it is preferable to be formed from the same layer as the second electrode 80. Thereby, it is possible to simplify the manufacturing process of the wiring portion 85, and thus realize a reduction in cost.

[0076] Further, among the first electrode 60 and the second electrode 80 which constitute the piezoelectric element 300, an independent lead electrode 91 is connected to the first electrode 60, and a common lead electrode 92 which is a common electrode for driving is electrically connected to the second electrode 80. The independent lead electrode 91 is one example of a first wiring, and the common lead electrode 92 is one example of a second wiring. To the end portion of the independent lead electrode 91 and the common lead electrode 92 on the side opposite to the end portion connected to the piezoelectric element 300, a wiring substrate 120 having flexibility is electrically connected. On the wiring substrate 120, a plurality of wirings for connection to a control portion 580 and a power supply circuit not shown are formed. In the present embodiment, the wiring substrate 120 is constituted by, for example, an FPC (Flexible Printed Circuit). In addition, instead of the FPC, any substrate having flexibility such as an FFC (Flexible Flat Cable) or the like can be used.

[0077] In the present embodiment, the independent lead electrode 91 and the common lead electrode 92 are provided extending in a manner exposed within a through-hole 32 formed in the protective substrate 30, and are electrically connected to the wiring substrate 120 within the through-hole 32. On the wiring substrate 120, a head circuit 121 is mounted, the head circuit 121 having a switching element for driving the piezoelectric element 300.

[0078] Although the independent lead electrode 91 and the common lead electrode 92 are constituted by the same layer in the present embodiment, they are formed in a manner not electrically continuous. Thereby, compared to a case in which the independent lead electrode 91 and the common lead electrode 92 are formed independently, it is possible to simplify the manufacturing process, and thus reduce the cost. Of course, the independent lead electrode 91 and the common lead electrode 92 can also be formed from different layers.

[0079] The material of the independent lead electrode 91 and the common lead electrode 92 is not particularly limited as long as it is a material having electrical conductivity, and, for example, gold (Au), copper (Cu), titanium (Ti), tungsten (W), nickel (Ni), chromium (Cr), platinum (Pt), aluminum (Al), or the like can be used. In the present embodiment, gold (Au) is used as the independent lead electrode 91 and the common lead electrode 92. Furthermore, the independent lead electrode 91 and the common lead electrode 92 can also have a close contact layer that improves the close contact between the first electrode 60 and the second electrode 80 and the diaphragm 50.

[0080] The independent lead electrode 91 is provided for each active portion 310, that is, for each first electrode 60. As shown in FIG. 6, for example, in the first pressure chamber row, the independent lead electrode 91 is connected to the vicinity of the end portion 60b of the first electrode 60 provided on the outer side of the piezoelectric body 70 via the wiring portion 85 and is led out to the pressure chamber substrate 10 in the -X direction, and is actually led out to the diaphragm 50. Figure 5

[0081] On the other hand, as shown in FIG. 7, for example, in the first pressure chamber row, the common lead electrode 92 is led out to the diaphragm 50 in the -X direction from the second electrode 80 that constitutes the common electrode on the piezoelectric body 70 at both end portions in the Y axis direction. Furthermore, the common lead electrode 92 has an extension provided portion 92a and an extension provided portion 92b. As shown in FIG. 8, for example, in the first pressure chamber row, the extension provided portion 92a is provided so as to extend in the Y axis direction in a region corresponding to the end portion 12a of the pressure chamber 12, and the extension provided portion 92b is provided so as to extend in the Y axis direction in a region corresponding to the end portion 12b of the pressure chamber 12. These extension provided portions 92a and 92b are continuously provided in the Y axis direction with respect to the plurality of active portions 310. Figure 3 Figure 3 Figure 5

[0082] Furthermore, the extension provided portion 92a and the extension provided portion 92b are provided so as to extend in the X axis direction from the inner side of the pressure chamber 12 to the outer side of the pressure chamber 12. In the present embodiment, the active portion 310 of the piezoelectric element 300 is provided so as to extend to the outer side of the pressure chamber 12 at both end portions in the X axis direction of the pressure chamber 12, and the extension provided portion 92a and the extension provided portion 92b are provided so as to extend to the outer side of the pressure chamber 12 on the active portion 310.

[0083] Figure 5 ​​​​​As shown, a resistance wiring 401 (first resistance wiring) is provided on the surface of the vibrating plate 50 in the -Z direction. The resistance wiring 401 is an example of a temperature detection unit used to detect the temperature of the pressure chamber 12. The temperature detection unit in this embodiment utilizes the characteristic that the resistance value of a metal or semiconductor changes with temperature. The material of the resistance wiring 401 is not particularly limited as long as its resistance value is temperature-dependent; for example, gold (Au), platinum (Pt), iridium (Ir), aluminum (Al), copper (Cu), titanium (Ti), tungsten (W), nickel (Ni), chromium (Cr), etc., can be used. From the viewpoint of a large resistance value change due to temperature and high stability and accuracy, platinum (Pt) is preferably used as the material for the resistance wiring 401. Furthermore, the resistance value is an example of the measured value of the temperature detection unit. In this embodiment, the resistance wiring 401 is formed in a manner where it is in the same layer as the first electrode 60 but not electrically continuous with it on the surface of the vibrating plate 50 in the -Z direction. Therefore, the material of the resistor wiring 401 is the same platinum (Pt) as the first electrode 60. This simplifies the manufacturing process and reduces costs compared to forming the resistor wiring 401 independently of the first electrode 60. Alternatively, the resistor wiring 401 could be formed on a different layer than the first electrode 60.

[0084] like Figure 3 As shown, the resistance wiring 401 is continuous. One end of the resistance wiring 401, which is on the +X side in the X-axis direction, is connected to the measuring lead electrode 93a, and the other end of the resistance wiring 401, which is on the -X side in the X-axis direction, is connected to the measuring lead electrode 93b. Thus, the resistance wiring 401 is electrically connected to the wiring board 120, and the control unit 580 can measure the resistance value of the resistance wiring 401. The measuring lead electrode 93, which includes the measuring lead electrode 93a and the measuring lead electrode 93b, is an example of the connection portion of the resistance wiring 401 connected to the wiring board 120. Furthermore, in this embodiment, the resistance wiring 401 is covered by the piezoelectric element 70 and is located between the vibrating plate 50 and the piezoelectric element 70 in the Z-axis direction.

[0085] The resistance wiring 401 has a first pressure chamber column side meandering pattern on the +X direction side in the X axis direction, and a second pressure chamber column side meandering pattern on the -X direction side in the X axis direction. The first pressure chamber column side meandering pattern meanders along the Y axis direction at a position overlapping the supply communication passage 19 which communicates with each pressure chamber 12 constituting the first pressure chamber column when viewed from the -Z direction. The second pressure chamber column side meandering pattern meanders along the Y axis direction at a position overlapping the supply communication passage 19 which communicates with each pressure chamber 12 constituting the second pressure chamber column when viewed from the -Z direction. That is, the resistance wiring 401 has the first pressure chamber column side meandering pattern corresponding to the first pressure chamber column formed of the plurality of pressure chambers 12, and the second pressure chamber column side meandering pattern corresponding to the second pressure chamber column formed of the plurality of pressure chambers 12. Further, as shown in Figs. 21 and 22, the distance of the -Z direction side end of the pressure chamber 12 from the Z axis direction of the resistance wiring 401 is shorter than the dimension of the pressure chamber 12 in the Z axis direction. Further, for example, in the first pressure chamber column, the longest distance of the +X direction end 12a of the pressure chamber 12 from the X axis direction of the resistance wiring 401 is shorter than the dimension of the pressure chamber 12 in the X axis direction. Therefore, the resistance value of the resistance wiring 401 easily changes in correspondence with the temperature change of the pressure chamber 12. Figure 4 、 Figure 5

[0086] In the present embodiment, the measurement lead electrode 93 including the measurement lead electrode 93a and the measurement lead electrode 93b is formed in the same layer as the independent lead electrode 91 and the common lead electrode 92, but is formed in a manner so as not to be electrically continuous. Thereby, compared to a case where the measurement lead electrode 93 is formed independently of the independent lead electrode 91 and the common lead electrode 92, it is possible to simplify the manufacturing process, thereby reducing the cost. Of course, it can also be configured to form the measurement lead electrode 93 in a different layer from the independent lead electrode 91 and the common lead electrode 92.

[0087] The material of the measurement lead electrode 93 is not particularly limited as long as it is a material having electrical conductivity, and for example, gold (Au), copper (Cu), titanium (Ti), tungsten (W), nickel (Ni), chromium (Cr), platinum (Pt), aluminum (Al), or the like can be used. In the present embodiment, gold (Au) is used as the measurement lead electrode 93. Thereby, the material of the measurement lead electrode 93 is the same material as the independent lead electrode 91 and the common lead electrode 92. Further, the measurement lead electrode 93 can also have a close contact layer which improves close contact with the resistance wiring 401 and the vibrating plate 50.

[0088] ​In the present embodiment, the measurement lead electrode 93 is extended in a manner so as to be exposed within the through-hole 32 formed in the protection substrate 30, and is electrically connected to the wiring substrate 120 within the through-hole 32. Thereby, the control section 580 is able to acquire the resistance value of the resistance wiring 401 via the wiring substrate 120. In the present embodiment, the control section 580 stores in advance a correspondence relation between the resistance value of the resistance wiring 401 and temperature. Further, the control section 580 measures the resistance value of the resistance wiring 401 at the time of driving of the piezoelectric element 300, and detects the temperature of the pressure chamber 12 based on the correspondence relation between the resistance value of the resistance wiring 401 and temperature.

[0089] For example, when the temperature detecting section is provided outside the liquid ejecting head 510, the difference between the temperature measured by the temperature detecting section and the temperature within the pressure chamber 12 can be larger than the difference between the temperature within the liquid ejecting head 510 and the temperature within the pressure chamber 12. In this case, the liquid ejecting apparatus 500 can not be able to perform the ejection control of the liquid ejecting head 510 that is appropriate to the temperature of the ink within the pressure chamber 12. In the present embodiment, the resistance wiring 401 is provided in a stacked manner to the vibration plate 50 that is a structural member of the liquid ejecting head 510. That is, the resistance wiring 401 is provided within the liquid ejecting head 510. Thereby, the liquid ejecting head 510 has the resistance wiring 401, and thus, compared to the case where the temperature of the outside environment of the liquid ejecting head 510 is measured, it is possible to reduce the difference between the temperature detected based on the resistance value of the resistance wiring 401 that is measured and the temperature within the pressure chamber 12. Further, thereby, the liquid ejecting apparatus 500 is easy to perform the ejection control of the liquid ejecting head 510 that is appropriate to the temperature of the ink within the pressure chamber 12.

[0090] As described above, according to the liquid ejecting head 510 according to Embodiment 1 and the liquid ejecting apparatus 500 according to Embodiment 1, the following effects can be obtained.

[0091] The liquid ejection head 510 includes: the piezoelectric element 300 including the first electrode 60, the second electrode 80, and the piezoelectric body 70, and in the Z-axis direction in which the first electrode 60, the second electrode 80, and the piezoelectric body 70 are stacked, the piezoelectric body 70 is disposed between the first electrode 60 and the second electrode 80; the vibration plate 50 disposed on the +Z direction side of the Z-axis direction with respect to the piezoelectric element 300; the pressure chamber substrate 10 disposed on the +Z direction side of the Z-axis direction with respect to the vibration plate 50, and provided with a plurality of pressure chambers 12 whose volumes change due to deformation of the vibration plate 50 caused by driving of the piezoelectric element 300; the wiring substrate 120; the independent lead electrode 91 electrically connecting the wiring substrate 120 and the first electrode 60; the common lead electrode 92 electrically connecting the wiring substrate 120 and the second electrode 80; and the resistance wiring 401 electrically connected to the wiring substrate 120 and used to detect the temperature of the pressure chamber 12. Thus, the liquid ejection head 510, because of having the resistance wiring 401, can reduce the difference between the temperature detected based on the measured value of the resistance wiring 401 and the temperature in the pressure chamber 12, compared to the case where the temperature of the external environment of the liquid ejection head 510 is measured.

[0092] The resistance wiring 401 is formed of the same material as the first electrode 60. Thus, in the case of forming the resistance wiring 401, it is easy to form the same as the first electrode 60 in the same process.

[0093] The first electrode 60 is respectively independently provided with respect to a plurality of pressure chambers 12 arranged in the Y-axis direction, and the second electrode 80 is commonly provided with respect to the plurality of pressure chambers 12, the first electrode 60 is disposed on the +Z direction side of the Z-axis direction with respect to the piezoelectric body 70, and the second electrode 80 is disposed on the -Z direction side of the Z-axis direction with respect to the piezoelectric body 70. Thus, it is easy to implement driving of the piezoelectric element 300 corresponding to the required ejection amount of ink.

[0094] The wiring substrate 120 has a head circuit 121 capable of applying a driving voltage that changes corresponding to the ejection amount of ink to the first electrode 60 via the independent lead electrode 91, and applying a fixed holding voltage to the second electrode 80 via the common lead electrode 92 regardless of the ejection amount of ink. Thus, it is easy to implement driving of the piezoelectric element 300 corresponding to the required ejection amount of ink.

[0095] The independent lead electrode 91 is disposed between the common lead electrode 92 and the measurement lead electrode 93 in the Y-axis direction. Thus, it is possible to efficiently connect the first electrode 60, the second electrode 80, and the resistance wiring 401 to the wiring substrate 120.

[0096] The liquid ejection device 500 includes a liquid ejection head 510 and a control unit 580 that controls the ejection action of ink ejected from the liquid ejection head 510. As a result, it is easy to realize a structure that can control the ejection action of the liquid ejection head 510.

[0097] 2. Implementation Method 2

[0098] Next, the resistor wiring 451 provided in the liquid nozzle 510 of Embodiment 2, which is an embodiment of this disclosure, will be described. Furthermore, parts common to the liquid nozzle 510 of Embodiment 1 will be marked with the same symbols, and their descriptions will be omitted.

[0099] In Embodiment 1, the resistor wiring 401 is stacked on the -Z direction side surface of the vibrating plate 50 in a manner that is co-layered with but not electrically continuous with the first electrode 60. In contrast, as... Figure 7 As shown, in this embodiment, the resistance wiring 451 is provided on the surface of the piezoelectric body 70 in the -Z direction. The resistance wiring 451 is an example of a temperature sensing unit used to detect the temperature of the pressure chamber 12. The material of the resistance wiring 451 is not particularly limited as long as its resistance value is temperature-dependent; for example, gold (Au), platinum (Pt), iridium (Ir), aluminum (Al), copper (Cu), titanium (Ti), tungsten (W), nickel (Ni), chromium (Cr), etc., can be used. In this embodiment, the resistance wiring 451 is laminated on the surface of the piezoelectric body 70 in the -Z direction, in a manner that it is in the same layer as the second electrode 80 but not electrically continuous with it. Therefore, the material of the resistance wiring 451 is the same as that of the second electrode 80, iridium (Ir). This simplifies the manufacturing process and reduces costs compared to forming the resistance wiring 451 independently of the second electrode 80. Of course, it is also possible to form the resistance wiring 451 on a different layer than the second electrode 80.

[0100] As described above, in the liquid ejector head 510 according to Embodiment 2, the resistor wiring 451 is formed of the same material as the second electrode 80, so it is easy to form the resistor wiring 451 using the same process as the second electrode 80.

[0101] 3. Implementation Method 3

[0102] Next, the resistor wiring 461 provided in the liquid nozzle 510 of Embodiment 3, which is an embodiment of this disclosure, will be described. Furthermore, parts common to the liquid nozzle 510 of Embodiment 1 will be marked with the same symbols, and their descriptions will be omitted.

[0103] The electric resistance wiring 401 of Embodiment 1 is formed on the -Z direction side surface of the diaphragm 50 in a manner so as to be in the same layer as the first electrode 60 and not to be in electrical continuity with the first electrode 60. In contrast, as shown in Figure 8 The electric resistance wiring 461 of the present embodiment is provided on the -Z direction side surface of the piezoelectric body 70. The electric resistance wiring 461 is one example of a temperature detecting portion for detecting the temperature of the pressure chamber 12. The material of the electric resistance wiring 461 is not particularly limited as long as it is a material having a temperature-dependent electric resistance value, and, for example, gold (Au), platinum (Pt), iridium (Ir), aluminum (Al), copper (Cu), titanium (Ti), tungsten (W), nickel (Ni), or chromium (Cr) can be used.

[0104] In the present embodiment, the electric resistance wiring 461 is formed on the -Z direction side surface of the piezoelectric body 70 in a manner so as to be in the same layer as the measurement lead electrode 93 including the measurement lead electrode 93a and the measurement lead electrode 93b and to be in electrical continuity with the measurement lead electrode 93. That is, the electric resistance wiring 461 is the same wiring as the measurement lead electrode 93. Therefore, although the electric resistance wiring 461 of the present embodiment is configured by the same layer as the independent lead electrode 91 and the common lead electrode 92, it is formed in a manner so as not to be in electrical continuity. Therefore, the material of the electric resistance wiring 461 is gold (Au) which is the same material as the independent lead electrode 91 and the common lead electrode 92. Thus, compared to a case where the electric resistance wiring 461 is formed independently of the independent lead electrode 91 and the common lead electrode 92, the manufacturing process can be simplified, thereby reducing the cost. Of course, the electric resistance wiring 461 can be formed in a layer different from the independent lead electrode 91, the common lead electrode 92, and the measurement lead electrode 93.

[0105] As described above, according to the liquid ejection head 510 according to Embodiment 3, the electric resistance wiring 461 is formed of the same material as any one of the independent lead electrode 91 and the common lead electrode 92, and thus, in the case where the electric resistance wiring 461 is formed, it is easy to form it in the same process as any one of the independent lead electrode 91 and the common lead electrode 92.

[0106] 4. Embodiment 4

[0107] Next, the electric resistance wiring provided in the liquid ejection head 510 according to Embodiment 4, which is one embodiment of the present disclosure, will be described. For portions common to the liquid ejection head 510 according to Embodiment 1, the same reference numerals are assigned and the description thereof will be omitted.

[0108] The electric resistance wiring 401 of Embodiment 1 has a first pressure chamber row side meandering pattern corresponding to the first pressure chamber row formed of the plurality of pressure chambers 12, and a second pressure chamber row side meandering pattern corresponding to the second pressure chamber row formed of the plurality of pressure chambers 12. That is, the liquid ejecting head 510 of Embodiment 1 has one electric resistance wiring 401 corresponding to the first pressure chamber row and the second pressure chamber row. In contrast to this, as shown in Figure 9 to Figure 11 , the liquid ejecting head 510 of the present embodiment can also have a plurality of temperature detecting portions provided corresponding to a plurality of pressure chamber groups formed of the plurality of pressure chambers 12. Thereby, the liquid ejecting head 510 can divide and detect the temperatures of the plurality of pressure chambers 12 into a plurality of groups.

[0109] In the present embodiment, as shown in Figure 9 , a pressure chamber group formed of the plurality of pressure chambers 12 of the first pressure chamber row on the -Y direction side compared to the center of the Y axis direction is set as a first pressure chamber group G1, a pressure chamber group formed of the plurality of pressure chambers 12 of the first pressure chamber row on the +Y direction side compared to the center of the Y axis direction is set as a second pressure chamber group G2, a pressure chamber group formed of the plurality of pressure chambers 12 of the second pressure chamber row on the -Y direction side compared to the center of the Y axis direction is set as a third pressure chamber group G3, and a pressure chamber group formed of the plurality of pressure chambers 12 of the second pressure chamber row on the +Y direction side compared to the center of the Y axis direction is set as a fourth pressure chamber group G4, and is described. In addition, the -Y direction is one example of one side of the first direction, and the +Y direction is one example of the other side of the first direction.

[0110] For example, as shown in Figure 9 , the liquid ejecting head 510 can also have an electric resistance wiring 402 (second electric resistance wiring) having a meandering pattern that meanders along the Y axis direction at a position overlapping with the supply communication passage 19 communicating with each pressure chamber 12 constituting the first pressure chamber row when viewed from the -Z direction, and an electric resistance wiring 403 (third electric resistance wiring) having a meandering pattern that meanders along the Y axis direction at a position overlapping with the supply communication passage 19 communicating with each pressure chamber 12 constituting the second pressure chamber row when viewed from the -Z direction. The electric resistance wiring 402 and the electric resistance wiring 403 are one example of a temperature detecting portion for detecting the temperature of the pressure chamber 12. Furthermore, the measurement lead electrode 93 can also include a measurement lead electrode 93a, a measurement lead electrode 93b, a measurement lead electrode 93c, and a measurement lead electrode 93d.

[0111] The resistance wiring 402 is continuous, one end of the resistance wiring 402 is connected to the measurement lead electrode 93a, and the other end of the resistance wiring 402 is connected to the measurement lead electrode 93c. Further, the resistance wiring 403 is continuous, one end of the resistance wiring 403 is connected to the measurement lead electrode 93b, and the other end of the resistance wiring 403 is connected to the measurement lead electrode 93d. Thus, the resistance wiring 402 is electrically connected to the wiring substrate 120, and the control section 580 is able to measure the resistance value of the resistance wiring 402. Further, the resistance wiring 403 is electrically connected to the wiring substrate 120, and the control section 580 is able to measure the resistance value of the resistance wiring 403.

[0112] In this case, the plurality of pressure chamber groups include a first pressure chamber row and a second pressure chamber row. Thus, the liquid ejecting head 510 of the present embodiment is able to implement driving of the piezoelectric elements 300 corresponding to the temperature of the ink in the pressure chambers 12 constituting the respective pressure chamber rows, in a case where the temperature of the ink in the pressure chambers 12 constituting the first pressure chamber row is different from the temperature of the ink in the pressure chambers 12 constituting the second pressure chamber row. Further, thus, the liquid ejecting apparatus 500 is more easily able to implement ejection control of the liquid ejecting head 510 that is appropriate for the temperature of the ink in the pressure chambers 12.

[0113] Further, for example, as shown in Figure 10 the liquid ejecting head 510 can also be provided with: a resistance wiring 404 (fourth resistance wiring) that has a meandering pattern that meanders along the Y-axis direction at a position that overlaps with the supply communication passage 19 that communicates with each of the pressure chambers 12 constituting the first pressure chamber group G1 when viewed from the -Z direction, and a meandering pattern that meanders along the Y-axis direction at a position that overlaps with the supply communication passage 19 that communicates with each of the pressure chambers 12 constituting the third pressure chamber group G3 when viewed from the -Z direction; and a resistance wiring 405 (fifth resistance wiring) that has a meandering pattern that meanders along the Y-axis direction at a position that overlaps with the supply communication passage 19 that communicates with each of the pressure chambers 12 constituting the second pressure chamber group G2 when viewed from the -Z direction, and a meandering pattern that meanders along the Y-axis direction at a position that overlaps with the supply communication passage 19 that communicates with each of the pressure chambers 12 constituting the fourth pressure chamber group G4 when viewed from the -Z direction. The resistance wiring 404 and the resistance wiring 405 are one example of a temperature detection section for detecting the temperature of the pressure chambers 12. Further, the measurement lead electrodes 93 can also include the measurement lead electrode 93a, the measurement lead electrode 93b, the measurement lead electrode 93c, and the measurement lead electrode 93d.

[0114] The resistance wiring 404 is continuous, and one end of the resistance wiring 404 is connected to the measurement lead electrode 93a, and the other end of the resistance wiring 404 is connected to the measurement lead electrode 93b. Further, the resistance wiring 405 is continuous, and one end of the resistance wiring 405 is connected to the measurement lead electrode 93c, and the other end of the resistance wiring 405 is connected to the measurement lead electrode 93d. Thereby, the resistance wiring 404 is electrically connected to the wiring substrate 120, and the control section 580 is able to measure the resistance value of the resistance wiring 404. Further, the resistance wiring 405 is electrically connected to the wiring substrate 120, and the control section 580 is able to measure the resistance value of the resistance wiring 405.

[0115] In this case, the plurality of pressure chamber groups include the first pressure chamber group G1 and the second pressure chamber group G2. Alternatively, the plurality of pressure chamber groups include the third pressure chamber group G3 and the fourth pressure chamber group G4. Thereby, the liquid ejecting head 510 of the present embodiment is able to implement driving of the piezoelectric elements 300 corresponding to the temperature of the ink in the pressure chambers 12 of the pressure chamber groups on one side of the pressure chamber row and the temperature of the ink in the pressure chambers 12 of the pressure chamber groups on the other side of the pressure chamber row, in the case where the temperature of the ink in the pressure chambers 12 of the pressure chamber groups on one side of the pressure chamber row is different from the temperature of the ink in the pressure chambers 12 of the pressure chamber groups on the other side of the pressure chamber row. Further, thereby, the liquid ejecting apparatus 500 is more easily able to implement ejecting control of the liquid ejecting head 510 that is appropriate for the temperature of the ink in the pressure chambers 12.

[0116] Further, for example, as Figure 11As shown, the liquid ejection head 510 can also have: a resistance wiring 406 (sixth resistance wiring) having a meandering pattern that meanders along the Y-axis direction at a position overlapping with the supply communication passage 19 that communicates with each pressure chamber 12 constituting the first pressure chamber group G1 when viewed from the -Z direction; a resistance wiring 407 (seventh resistance wiring) having a meandering pattern that meanders along the Y-axis direction at a position overlapping with the supply communication passage 19 that communicates with each pressure chamber 12 constituting the second pressure chamber group G2 when viewed from the -Z direction; a resistance wiring 408 (eighth resistance wiring) having a meandering pattern that meanders along the Y-axis direction at a position overlapping with the supply communication passage 19 that communicates with each pressure chamber 12 constituting the third pressure chamber group G3 when viewed from the -Z direction; and a resistance wiring 409 (ninth resistance wiring) having a meandering pattern that meanders along the Y-axis direction at a position overlapping with the supply communication passage 19 that communicates with each pressure chamber 12 constituting the fourth pressure chamber group G4 when viewed from the -Z direction. The resistance wiring 406, the resistance wiring 407, the resistance wiring 408, and the resistance wiring 409 are one example of a temperature detection unit for detecting the temperature of the pressure chamber 12. Further, the measurement lead electrode 93 can include the measurement lead electrode 93a, the measurement lead electrode 93b, the measurement lead electrode 93c, the measurement lead electrode 93d, the measurement lead electrode 93e, the measurement lead electrode 93f, the measurement lead electrode 93g, and the measurement lead electrode 93h.

[0117] The resistance wiring 406 is continuous, one end of the resistance wiring 406 is connected to the measurement lead electrode 93e, and the other end of the resistance wiring 406 is connected to the measurement lead electrode 93a. Further, the resistance wiring 407 is continuous, one end of the resistance wiring 407 is connected to the measurement lead electrode 93c, and the other end of the resistance wiring 407 is connected to the measurement lead electrode 93g. Further, the resistance wiring 408 is continuous, one end of the resistance wiring 408 is connected to the measurement lead electrode 93f, and the other end of the resistance wiring 408 is connected to the measurement lead electrode 93b. Further, the resistance wiring 409 is continuous, one end of the resistance wiring 409 is connected to the measurement lead electrode 93d, and the other end of the resistance wiring 409 is connected to the measurement lead electrode 93h. Thus, the resistance wiring 406 is connected to the wiring substrate 120, and the control unit 580 can measure the resistance value of the resistance wiring 406. Further, the resistance wiring 407 is connected to the wiring substrate 120, and the control unit 580 can measure the resistance value of the resistance wiring 407. Further, the resistance wiring 408 is connected to the wiring substrate 120, and the control unit 580 can measure the resistance value of the resistance wiring 408. Further, the resistance wiring 409 is connected to the wiring substrate 120, and the control unit 580 can measure the resistance value of the resistance wiring 409.

[0118] In this case, the plurality of pressure chamber groups include a first pressure chamber group G1, a second pressure chamber group G2, a third pressure chamber group G3, and a fourth pressure chamber group G4. Thus, the liquid ejecting head 510 of the present embodiment is able to implement driving of the piezoelectric elements 300 corresponding to the temperatures of the inks in the pressure chambers 12 constituting the respective pressure chamber groups, for example, in a case where the temperatures of the inks in the pressure chambers 12 constituting the first pressure chamber group G1, the temperatures of the inks in the pressure chambers 12 constituting the third pressure chamber group G3, the temperatures of the inks in the pressure chambers 12 constituting the second pressure chamber group G2, and the temperatures of the inks in the pressure chambers 12 constituting the fourth pressure chamber group G4 are different. Further, thus, the liquid ejecting apparatus 500 is more likely to implement ejection control of the liquid ejecting head 510 appropriate for the temperatures of the inks in the pressure chambers 12.

[0119] 5. Embodiment 5

[0120] Next, the measurement lead electrode 93 and the resistance wiring 410 provided in the liquid ejecting head 510 of Embodiment 5, which is one embodiment of the present disclosure, will be described. For portions common to the liquid ejecting head 510 of Embodiment 1, the same reference numerals are assigned and the description thereof will be omitted.

[0121] The measurement lead electrode 93 of Embodiment 1 includes a measurement lead electrode 93a and a measurement lead electrode 93b, one end of the resistance wiring 401 is connected to the measurement lead electrode 93a, and the other end of the resistance wiring 401 is connected to the measurement lead electrode 93b. In contrast to this, as shown in Figure 12 the measurement lead electrode 93 of the present embodiment includes a measurement lead electrode 93i and a measurement lead electrode 93j. The measurement lead electrode 93 including the measurement lead electrode 93i and the measurement lead electrode 93j is one example of the connection portion of the resistance wiring 410 connected to the wiring substrate 120.

[0122] Further, the liquid ejecting head 510 of the present embodiment has the resistance wiring 410. The resistance wiring 410 is one example of the temperature detection portion for detecting the temperature of the pressure chamber 12. The resistance wiring 410 is continuous, one end of the resistance wiring 410 on the +X direction side in the X axis direction is connected to the measurement lead electrode 93i, and the other end of the resistance wiring 410 on the -X direction side in the X axis direction is connected to the measurement lead electrode 93j. Thus, the resistance wiring 410 is electrically connected to the wiring substrate 120, and the control portion 580 is able to measure the resistance value of the resistance wiring 410.

[0123] The measurement lead electrode 93 in the present embodiment is provided between the individual lead electrode 91 and the common lead electrode 92 in the Y-axis direction. Thereby, the first electrode 60, the second electrode 80, and the resistance wiring 410 can be effectively connected to the wiring substrate 120.

[0124] Further, a plurality of temperature detecting portions corresponding to a plurality of pressure chamber groups can be provided as in Embodiments 2 to 4 while the measurement lead electrode 93 is provided between the individual lead electrode 91 and the common lead electrode 92 in the Y-axis direction as in the present embodiment.

[0125] Although the liquid ejecting head 510 according to the above-described embodiment and the liquid ejecting apparatus 500 according to the above-described embodiment are based on the case where they have the above-described structures, of course, a partial change or omission of the structure or the like within a range not departing from the gist of the present application can be implemented. Further, the above-described embodiment and other embodiments described below can be implemented in combination within a range not technically conflicting. Hereinafter, other embodiments will be described.

[0126] In each of the above-described embodiments, the control section 580 can not have a function of measuring the resistance value of the resistance wiring 401 and detecting the temperature of the pressure chamber 12. Also, the liquid ejecting head 510 can have a function of measuring the resistance value of the resistance wiring 401 and detecting the temperature of the pressure chamber 12. In this case, for example, the liquid ejecting head 510 can have a temperature detecting circuit having a storage section SA that stores in advance a correspondence relation between a measurement value in the temperature detecting portion and a temperature, a measurement value acquisition section MA that measures the measurement value in the temperature detecting portion, and a temperature acquisition section TA that acquires the temperature at the time of driving the piezoelectric element 300 based on the correspondence relation stored in the storage section SA and the measurement value acquired by the measurement value acquisition section MA. In addition, the measurement value in the temperature detecting portion can be the resistance value, in which case the measurement value acquisition section MA can be a resistance acquisition section MA. Alternatively, the liquid ejecting head 510 can have the storage section SA, the measurement value acquisition section MA, and the temperature acquisition section TA in the head circuit 121. Also, the liquid ejecting head 510 can measure the resistance value of the resistance wiring 401 at the time of driving the piezoelectric element 300 and detect the temperature of the pressure chamber 12 based on a correspondence relation between the resistance value of the resistance wiring 401 and the temperature.

[0127] In each of the above-described embodiments, the method of measuring the resistance value of the resistance wiring 401 is not particularly limited. For example, a well-known two-terminal measurement method or a four-terminal measurement method can be used.

[0128] In each of the above-described embodiments, the electric resistance wiring can also be provided corresponding to all of the pressure chambers 12. For example, in Embodiment 1, the electric resistance wiring 401 can also be provided corresponding to all of the pressure chambers 12. Alternatively, the electric resistance wiring 401 can also be provided corresponding to a part of the pressure chambers 12 constituting the first pressure chamber row and a part of the pressure chambers 12 constituting the second pressure chamber row.

[0129] In each of the above-described embodiments, the meandering pattern of the electric resistance wiring can also not meander in the Y-axis direction at a position overlapping the supply communication passage 19 communicating with the corresponding pressure chamber 12 when viewed from the -Z direction. For example, in Embodiment 1, the first pressure chamber row side meandering pattern of the electric resistance wiring 401 can also meander in the X-axis direction at a position overlapping the supply communication passage 19 communicating with each of the pressure chambers 12 constituting the first pressure chamber row when viewed from the -Z direction.

[0130] In each of the above-described embodiments, the electric resistance wiring can also not meander if provided at a position overlapping the supply communication passage 19 communicating with the corresponding pressure chamber 12 when viewed from the -Z direction.

[0131] In each of the above-described embodiments, the electric resistance wiring can also be provided in a manner passing through a position overlapping the corresponding pressure chamber 12 when viewed from the -Z direction. For example, in Embodiment 1, the electric resistance wiring 401 can also be provided in a manner passing through a position overlapping the pressure chamber 12 on the outer side of the Y-axis direction with respect to the first electrode 60 when viewed from the -Z direction.

[0132] In each of the above-described embodiments, the first electrode 60 can be a common electrode, and the second electrode 80 can be an independent electrode. In this case, the first electrode 60 is provided on the +Z direction side of the Z-axis direction with respect to the piezoelectric body 70 and is commonly provided with respect to the plurality of pressure chambers 12. Further, the second electrode 80 is provided on the -Z direction side of the Z-axis direction with respect to the piezoelectric body 70 and is independently provided with respect to the plurality of pressure chambers 12. Further, in this case, the first electrode 60 is connected to the common lead electrode 92, and the second electrode 80 is connected to the independent lead electrode 91.

[0133] In each of the above-described embodiments, the temperature detecting portion can not be a resistance wiring if it is able to detect the temperature of the pressure chamber 12 based on the measurement value in the temperature detecting portion, and can be, for example, a thermocouple. For example, in Embodiment 1, in the case where the resistance wiring 401 is replaced with a thermocouple, a temperature measuring contact at which one end of two kinds of metal wirings constituting the thermocouple are connected to each other is arranged at a position overlapping with the supply communication passage 19 that communicates with the plurality of pressure chambers 12 constituting the first pressure chamber row and the second pressure chamber row when viewed in the -Z direction. Further, by electrically connecting the other end of one of the metal wirings to the measurement lead electrode 93a and electrically connecting the other end of the other of the metal wirings to the measurement lead electrode 93b, the control portion 580 is able to measure the thermoelectric power of the thermocouple as a potential difference between the other end of one of the metal wirings and the other end of the other of the metal wirings. Further, the control portion 580 can also measure the thermoelectric power of the thermocouple at the time of driving of the piezoelectric element 300 and detect the temperature of the pressure chamber 12 based on the thermoelectric power of the thermocouple and the temperature in the vicinity of the wiring substrate 120 detected by the temperature sensor provided separately from the wiring substrate 120. Furthermore, in this case, the two kinds of metal wirings constituting the thermocouple can be provided in the same layer as any one of the first electrode 60, the second electrode 80, the independent lead electrode 91, and the common lead electrode 92 and can be laminated. For example, as shown in Figure 13

[0134] In each of the above-described embodiments, the discharge flow passage can be made to communicate with the nozzle 21 and the ink can be ejected from the nozzle 21 while circulating the liquid from the supply flow passage to the discharge flow passage via the nozzle 21. For example, as shown in Figure 14 ​As shown, in addition to the supply port 44 provided on the -X direction side, a discharge port 200 can be provided on the +X direction side, and the two nozzle communication passages 16 are connected by a flow passage extending in the X axis direction, and a nozzle 21 is provided midway in the connection portion. In this case, the ink supplied from the supply port 44 flows in the order of the -X direction side pressure chamber 12, the nozzle communication passage 16, the +X direction side pressure chamber 12, and is discharged from the discharge port 200, and the flow of the ink is controlled by a pump not shown. By performing a cycle operation consisting of a series of ink supply, discharge as described above while performing the ejection of ink from the nozzle 21, an increase in viscosity due to evaporation of ink in the vicinity of the nozzle 21, and the like can be suppressed. In addition, although in Figure 14 the above, a case in which two pressure chambers 12 are communicated with respect to one nozzle 21, and the ejection of ink from one nozzle 21 is performed by driving of two piezoelectric elements 300, one pressure chamber 12 can be communicated with one nozzle 21. For example, in Figure 14 the above, the piezoelectric element 300 on the +X direction side can not be provided.

[0135] Symbol Explanation

[0136] 10…pressure chamber base plate; 11…partition wall; 12…pressure chamber; 15…communication plate; 16…nozzle communication passage; 17…first manifold portion; 18…second manifold portion; 19…supply communication passage; 20…nozzle plate; 21…nozzle; 30…protective base plate; 31…holding portion; 32…through hole; 40…housing member; 41…receiving portion; 42…third manifold portion; 43…connection port; 44…supply port; 45…plastic base plate; 46…sealing film; 47…fixed base plate; 48…opening portion; 49…plastic portion; 50…vibration plate; 51…elastic film; 52…insulator film; 60…first electrode; 70…piezoelectric body; 71…groove portion; 80…second electrode; 85…wiring portion; 91…individual lead electrode; 92…common lead electrode; 93, 93a, 93b, 93c, 93d, 93e, 93f, 93g, 93h, 93i, 93j…measurement lead electrode; 100…manifold; 120…wiring base plate; 121…head circuit; 300…piezoelectric element; 310…active portion; 320…inactive portion; 401, 402, 403, 404, 405, 406, 407, 408, 409, 410, 451, 461…resistance wiring; 500…liquid ejection device; 510…liquid ejection head; 550…ink tank; 552…tube; 560…transport mechanism; 562…transport roller; 564…transport bar; 566…transport motor; 570…movement mechanism; 572…carriage; 574…transport belt; 576…movement motor; 577…pulley; 580…control portion; G1…first pressure chamber group; G2…second pressure chamber group; G3…third pressure chamber group; G4…fourth pressure chamber group.

Claims

1. A liquid ejection head, characterized by, A piezoelectric element including a first electrode, a second electrode, and a piezoelectric body, and in a stacking direction in which the first electrode, the second electrode, and the piezoelectric body are stacked, the piezoelectric body is disposed between the first electrode and the second electrode; A vibrating plate disposed on one side in the stacking direction with respect to the piezoelectric element, and deformed by driving of the piezoelectric element; A pressure chamber substrate disposed on the one side in the stacking direction with respect to the vibrating plate, and provided with a plurality of pressure chambers whose volumes change due to deformation of the vibrating plate; A wiring substrate; A first wiring electrically connecting the wiring substrate and the first electrode; A second wiring electrically connecting the wiring substrate and the second electrode; A temperature detecting portion electrically connected to the wiring substrate, and configured to detect a temperature of the pressure chamber; A first measurement lead electrode electrically connecting one end of the temperature detecting portion and the wiring substrate; A second measurement lead electrode electrically connecting the other end of the temperature detecting portion and the wiring substrate, The temperature detecting portion is formed of the same material as the first electrode.

2. The liquid ejection head according to claim 1, wherein a plurality of the temperature detecting portions are provided corresponding to a plurality of pressure chamber groups formed of the plurality of the pressure chambers.

3. The liquid ejection head according to claim 2, wherein when a direction intersecting the stacking direction is set as a first direction, the plurality of the pressure chambers form a pressure chamber row in which the plurality of the pressure chambers are arranged in the first direction, the plurality of the pressure chamber groups include: a first pressure chamber group formed of the plurality of the pressure chambers on one side of the pressure chamber row in the first direction; and a second pressure chamber group formed of the plurality of the pressure chambers on the other side of the pressure chamber row in the first direction.

4. The liquid ejection head according to claim 2, wherein when a direction intersecting the stacking direction is set as a first direction, and a direction intersecting the stacking direction and the first direction is set as a second direction, the plurality of the pressure chamber groups include a first pressure chamber row in which the plurality of the pressure chambers are arranged in the first direction, and a second pressure chamber row which is separated from the first pressure chamber row in the second direction and in which the plurality of the pressure chambers are arranged in the first direction.

5. The liquid ejection head according to claim 2, wherein when a direction intersecting the stacking direction is set as a first direction, and a direction intersecting the stacking direction and the first direction is set as a second direction, the plurality of the pressure chambers form a first pressure chamber row in which the plurality of the pressure chambers are arranged in the first direction, and a second pressure chamber row which is separated from the first pressure chamber row in the second direction and in which the plurality of the pressure chambers are arranged in the first direction, the plurality of the pressure chamber groups include: ​ a first pressure chamber group formed of a plurality of the pressure chambers of the first pressure chamber row on one side in the first direction; a second pressure chamber group formed of a plurality of the pressure chambers of the first pressure chamber row on the other side in the first direction; a third pressure chamber group formed of a plurality of the pressure chambers of the second pressure chamber row on the one side in the first direction; a fourth pressure chamber group formed of a plurality of the pressure chambers of the second pressure chamber row on the other side in the first direction.

6. The liquid ejecting head according to claim 1, wherein when a direction intersecting the stacking direction is set as a first direction, the first electrodes are respectively independently provided with respect to a plurality of the pressure chambers that are side by side in the first direction, the second electrodes are commonly provided with respect to the plurality of the pressure chambers, the first electrodes are provided on the one side in the stacking direction with respect to the piezoelectric body, the second electrodes are provided on the other side in the stacking direction with respect to the piezoelectric body.

7. The liquid ejecting head according to claim 6, wherein the wiring substrate has a head circuit that is capable of applying, to the first electrodes via the first wiring, a drive voltage that varies in correspondence with an amount of ejection of liquid, and applying, to the second electrodes via the second wiring, a fixed holding voltage regardless of the amount of ejection of liquid.

8. The liquid ejecting head according to claim 6 or claim 7, wherein the first wiring is provided between the second wiring and a connection portion of the temperature detecting portion that is connected to the wiring substrate in the first direction.

9. The liquid ejecting head according to claim 6 or claim 7, wherein the connection portion of the temperature detecting portion that is connected to the wiring substrate is provided between the first wiring and the second wiring in the first direction.

10. The liquid ejection head of claim 1, wherein Further comprising: a resistance acquiring portion that acquires a resistance value of the temperature detecting portion; a temperature acquiring portion that acquires a temperature at the time of driving of the piezoelectric element on the basis of the resistance value acquired by the resistance acquiring portion.

11. The liquid ejecting head according to claim 10, wherein the resistance acquiring portion acquires the resistance value by either of a two-terminal measurement method and a four-terminal measurement method.

12. The liquid ejecting head according to claim 11, further comprising a storage portion that stores, in advance, a correspondence relation between a temperature and a resistance value of a material of the temperature detecting portion, the temperature acquiring portion acquires a temperature at the time of driving of the piezoelectric element on the basis of the correspondence relation stored in the storage portion and the resistance value acquired by the resistance acquiring portion. comprising:

13. A liquid ejection device, comprising: the liquid ejecting head according to any one of claims 1 to 12; a control portion that controls an ejection operation of ejecting liquid from the liquid ejecting head. ​

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