Display panel and method of manufacturing the same

Abstract

The present invention discloses a display panel and a manufacturing method thereof. The display panel includes a substrate, a first sub-pixel and a second sub-pixel. The first sub-pixel is arranged on the substrate. The first sub-pixel has a first directional characteristic, and a first bonding material is provided between the first sub-pixel and the substrate. The second sub-pixel is arranged on the substrate. The second sub-pixel has a second directional characteristic, and a second bonding material is provided between the second sub-pixel and the substrate. The first directional characteristic is different from the second directional characteristic, and the first bonding material is different from the second bonding material.

Description

Technical Field

[0001] The present invention relates to a panel and a method, and in particular to a display panel and a manufacturing method thereof. Background Art

[0002] As the size of display panels increases, how to quickly and efficiently repair defective pixels in the display panels has become one of the important issues to be solved in the art. Summary of the invention

[0003] The invention provides a display panel and a manufacturing method thereof, so as to efficiently repair defective pixels in the display panel.

[0004] The display panel of the present invention comprises a substrate, a first sub-pixel and a second sub-pixel. The first sub-pixel is arranged on the substrate. The first sub-pixel has a first directional characteristic, and a first bonding material is provided between the first sub-pixel and the substrate. The second sub-pixel is arranged on the substrate. The second sub-pixel has a second directional characteristic, and a second bonding material is provided between the second sub-pixel and the substrate. The first directional characteristic is different from the second directional characteristic, and the first bonding material is different from the second bonding material.

[0005] The manufacturing method of the display panel of the present invention includes: providing a substrate; setting a first sub-pixel on the substrate, wherein the first sub-pixel has a first directional characteristic, and a first bonding material is provided between the first sub-pixel and the substrate; and setting a second sub-pixel on the substrate, wherein the second sub-pixel has a second directional characteristic, and a second bonding material is provided between the second sub-pixel and the substrate, wherein the first directional characteristic is different from the second directional characteristic, and the first bonding material is different from the second bonding material.

[0006] Based on the above, the display panel and the manufacturing method thereof of the present invention can repair defects on the display panel through relatively simple hardware devices and relatively short operation processes to improve the display effect of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a schematic top view of a display panel according to a first embodiment of the present invention;

[0008] Figure 2A to Figure 2F is a schematic top view of a manufacturing process of a pixel in a display panel according to an embodiment of the present invention;

[0009] Figure 3A to Figure 3E , Figure 3G is a schematic top view of a manufacturing process of a pixel in another display panel according to an embodiment of the present invention;

[0010] Figure 3F for Figure 3E A schematic side view of the middle transfer element head ST grabbing a sub-pixel for pressing;

[0011] Figure 4A to Figure 4C is a schematic diagram of a sub-pixel used for replacement according to an embodiment of the present invention;

[0012] Figure 5A to Figure 5C Schematic diagram of pixel arrangement according to an embodiment of the present invention;

[0013] Figure 6A to Figure 6G FIG. 1 is a schematic diagram of pixel arrangement according to an embodiment of the present invention.

[0014] Explanation of symbols

[0015] 1: Display panel

[0016] 10: First Pixel

[0017] 10R, 10G, 10B: Sub-pixel

[0018] 11: Second Pixel

[0019] 11R, 11G, 11B, 111, 112, 113: Sub-pixel

[0020] PX2, PX3, PX5a, PX5b, PX5c, PX5d, PX6A to PX6E, PX6F1, PX6F2, PX6G1, PX6G2: Pixels

[0021] ST: Transpose Component Head

[0022] 12: Substrate

[0023] AD2: Second bonding material

[0024] D1: First direction

[0025] D2: Second direction

[0026] PD1~PD6: pads

[0027] RA: Display pixel area

[0028] RB: Main pixel area

[0029] RC: Spare pixel area DETAILED DESCRIPTION

[0030] Figure 11 is a top view of a display panel 1 according to an embodiment of the present invention. The display panel 1 includes a plurality of first pixels 10, a plurality of second pixels 11, and a substrate 12. The substrate 12 is divided into a plurality of display pixel areas RA, and the first pixels 10 and the second pixels 11 are disposed on the substrate 12 and are disposed in corresponding display pixel areas RA, respectively. Specifically, the first pixel 10 has a first directional characteristic, and the second pixel 11 has a second directional characteristic, and the first directional characteristic is different from the second directional characteristic.

[0031] In some embodiments, the first pixel 10 and the second pixel 11 may be set by the same transposition element head, but by different transposition procedures. For example, the transposition element head may first set each first pixel 10 in each display pixel area RA on the substrate 12, and after inspection to remove the first pixel 10 with defects therein, the second pixel 11 is filled into the vacant display pixel area RA by the same transposition element head. In this way, the operation of repairing or replacing the first pixel 10 with defects in the entire display panel 1 can be completed by the same transposition element head without switching hardware devices. Therefore, the overall operation process can be relatively simple and avoid the cost of additional hardware configuration.

[0032] In some embodiments, since the first pixel 10 and the second pixel 11 are taken from different chips by the transposition element head, the first pixel 10 and the second pixel 11 disposed on the substrate 12 have different directional characteristics. The directional characteristics may include, for example, the position offset and the angle offset between each pixel and its corresponding display pixel area RA. Figure 1 Each first pixel 10 in the display pixel area RA has a consistent position offset and angle offset, and each second pixel also has a consistent position offset and angle offset. More specifically, each first pixel 10 is arranged to be aligned with the upper left corner of the corresponding display pixel area RA compared to its respective corresponding display pixel area RA, and the arrangement direction of each first pixel 10 is parallel to the extension direction (and the second direction D2) of the corresponding display pixel area RA, that is, each first pixel 10 and the display pixel area RA have an angle offset of zero. In contrast, each second pixel 11 and the upper left corner of its corresponding display pixel area RA have a position offset in the first direction D1 and / or the second direction D2, so that the second pixel 11 is not aligned with the corresponding display pixel area RA, and the arrangement direction of the second pixel 11 is not parallel to the extension direction of the display pixel area RA, that is, each second pixel 11 and the display pixel area RA have an angle offset that is not zero.

[0033] Therefore, the first pixels 10 have the same first directional characteristics, and the second pixels 11 have the same second directional characteristics. In the first directional characteristics and the second directional characteristics, the position offset of the first pixel 10 is different from the position offset of the second pixel 11, and / or the angle offset of the first pixel 10 is different from the angle offset of the second pixel 11.

[0034] On the other hand, in some embodiments, when the transposition element head sets the first pixel 10, the first adhesive material is used to fix the first pixel 10 in each display pixel area RA on the substrate 12. In order to selectively set the second pixel 11 in the vacant display pixel area RA when the transposition element head sets the second pixel 11, the second adhesive material with adhesiveness is first applied to the vacant display pixel area RA before the transposition element head sets the second pixel 11. In this way, when the transposition element head takes the second pixel 11 and presses it on the substrate 12, the second pixel 11 can be adhered to the previously vacant display pixel area RA by the second adhesive material, thereby completing the replacement of the first display pixel 10.

[0035] In some embodiments, the first pixel 10 and the second pixel 11 may be, for example, a light emitting diode, an organic light emitting diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro LED or a quantum dot light emitting diode (QD, which may be, for example, QLED, QDLED) or other suitable pixels or materials. In some embodiments, the first bonding material is different from the second bonding material. The first bonding material may be, for example, solder. The second bonding material may, for example, include metal, photoresist, resin, colloid, black light-shielding layer, color filter, quantum dot or other suitable material. Further, the metal may be, for example, gold, silver, copper, tin or other suitable metal.

[0036] Figure 2A to Figure 2F FIG. 1 is a schematic top view of a manufacturing process of a pixel PX2 in a display panel according to an embodiment of the present invention.

[0037] exist Figure 2A In the embodiment, a pixel PX2 is first provided on a substrate 12, and the pixel PX2 has sub-pixels 10R, 10G, and 10B. The sub-pixels 10R, 10G, and 10B can be used to display colors such as red, green, and blue, respectively. Each pixel PX2 can be arranged in a corresponding display pixel area. In this embodiment, the display pixel area of ​​the pixel PX2 can be divided into three main pixel areas RB and three spare pixel areas RC. The sub-pixels 10R, 10G, and 10B are respectively arranged in the corresponding main pixel areas RB. An adjacent spare pixel area RC is arranged next to each main pixel RB.

[0038] Although not shown in Figure 2A A first bonding material is disposed between the sub-pixels 10R, 10G, 10B and the substrate 12, and the sub-pixels 10R, 10G, 10B can be fixed on the substrate 12 by the first bonding material. The first bonding material can be, for example, solder.

[0039] exist Figure 2B In the embodiment, each sub-pixel 10R, 10G, 10B of the pixel PX2 is individually inspected to see if it has a defect. In this embodiment, the sub-pixel 10R of the upper left pixel PX2 is inspected and is determined to be a defective sub-pixel 10R.

[0040] exist Figure 2C In the above example, the defective sub-pixel 10R can be removed from the pixel PX2 at the upper left corner. Therefore, in the pixel PX2 at the upper left corner, since the sub-pixel 10R originally provided is removed, the main pixel area RB is vacant.

[0041] exist Figure 2D In the upper left pixel PX2, for the main pixel region RB where the sub-pixel 10R is originally disposed, a second bonding material different from the first bonding material may be coated on the adjacent spare pixel region RC.

[0042] In some embodiments, the second bonding material may be applied to the spare pixel region RC by ink jet printing (IJP). The second bonding material may be, for example, a conductive or non-conductive bonding material having viscosity. In this embodiment, the second bonding material may include, for example, metal, photoresist, resin, colloid, black matrix (BM), color filter (CF), quantum dots or other suitable materials. The metal may include, for example, gold, silver, copper, tin or other suitable metals.

[0043] In some embodiments, the second bonding material may be, for example, a photoresist material. After the second bonding material is coated on the spare pixel region RC, the second bonding material may be exposed by laser direct imaging (LDI). The exposed second bonding material will become sticky. In this embodiment, the second bonding material may include, for example, metal, photoresist, resin, colloid, black light shielding layer, color filter, quantum dot or other suitable material. The metal may include, for example, gold, silver, copper, tin or other suitable metal.

[0044] exist Figure 2E In the embodiment, the transposition element head can be provided by a spare chip (not shown in FIG. Figure 2A to Figure 2FThe transposition element head captures a plurality of sub-pixels 11R on the top of the spare pixel region RC, and applies appropriate pressure on the sub-pixels 11R on the rows formed by the spare pixel region RC. More specifically, the transposition element head can press the sub-pixels 11R on the spare pixel region RC, and the main pixel region RB where the sub-pixels 10R are arranged is next to the spare pixel region RC.

[0045] In some embodiments, when the second bonding material is a conductor, the transposition element head can press the sub-pixel 11R onto the second bonding material so that it is adhered by the second bonding material. In some embodiments, when the second bonding material is a non-conductor, the transposition element head can press the sub-pixel 11R onto the substrate 12 with a greater pressure so that the sub-pixel 11R can penetrate the second bonding material and directly contact and be electrically connected to the wiring on the substrate 12.

[0046] exist Figure 2F In the embodiment, when the transfer element head leaves the substrate 12, only the sub-pixel 11R in the upper left pixel PX2 will be left due to the second bonding material. Since the second bonding material is not applied to other pixels PX2, the sub-pixel 11R will not be retained in the spare pixel area RC of other pixels.

[0047] Therefore, by coating the second adhesive material with adhesiveness, the substrate 12 can selectively adhere the required sub-pixels 11R from the transposition element head on the spare pixel area RC, and keep other spare pixel areas RC that do not need to be set empty. In this way, in each pixel PX2, the total number of sub-pixels set is equal. Therefore, the number of sub-pixels in each pixel PX2 will not be different due to the replacement of defective sub-pixels, which can effectively maintain the uniform brightness of the entire display panel and reduce unnecessary power consumption.

[0048] On the other hand, in some embodiments, Figure 2A The sub-pixels 10R, 10G, and 10B in the embodiment may also be connected with Figure 2E The same transposition element head as the sub-pixel 11R is set. Figure 2A After the sub-pixels 10R, 10G, and 10B are set in the steps Figure 2E In the step, the defective sub-pixel can be replaced by the same transposition element head, avoiding the operation time of replacing the transposition element head, which can effectively save the overall hardware cost and operation time cost.

[0049] Figure 3A to Figure 3F FIG. 4 is a schematic top view of a manufacturing process of a pixel PX3 in another display panel according to an embodiment of the present invention. Figure 3A to Figure 3F The pixel PX3 shown in FIG. Figure 2A to Figure 2F The pixel PX2 shown in FIG. 1 is a pixel PX3 in which only a main pixel region RB is provided and no spare pixel region is provided.

[0050] exist Figure 3A In the present invention, a pixel PX3 is first provided on a substrate 12, and the pixel PX3 includes sub-pixels 10R, 10G, and 10B. The sub-pixels 10R, 10G, and 10B can be respectively arranged in corresponding main pixel regions RB.

[0051] Although not shown in Figure 3A A first bonding material is disposed between the sub-pixels 10R, 10G, 10B and the substrate 12, and the sub-pixels 10R, 10G, 10B can be fixed on the substrate 12 by the first bonding material. The first bonding material can be, for example, solder.

[0052] exist Figure 3B In the embodiment, each sub-pixel 10R, 10G, 10B of the pixel PX3 is individually inspected to see if it has a defect. In this embodiment, the sub-pixel 10G of the upper left pixel PX3 is inspected and is determined to be a defective sub-pixel 10G.

[0053] exist Figure 3C In the above example, the defective sub-pixel 10G can be removed from the pixel PX3 at the upper left corner. Therefore, in the pixel PX3 at the upper left corner, since the sub-pixel 10G originally arranged is removed, the main pixel region RB is vacant.

[0054] exist Figure 3D In the upper left pixel PX3, a second bonding material different from the first bonding material may be coated on the main pixel region RB where the sub-pixel 10G is originally disposed.

[0055] In some embodiments, the second bonding material may be coated on the spare pixel region RC by ink jet printing (IJP). The second bonding material may be, for example, a conductive or non-conductive bonding material having viscosity. In this embodiment, the second bonding material may include, for example, metal, photoresist, resin, colloid, black light shielding layer, color filter layer, quantum dots or other suitable materials. The metal may be, for example, gold, silver, copper, tin or other suitable metals.

[0056] In some embodiments, the second bonding material may be, for example, a photoresist material. After the second bonding material is coated on the spare pixel region RC, the second bonding material may be exposed by laser direct imaging (LDI). The exposed second bonding material will become sticky. In this embodiment, the second bonding material may include, for example, metal, photoresist, resin, colloid, black light shielding layer, color filter layer, quantum dots or other suitable materials. The metal may be, for example, gold, silver, copper, tin or other suitable metals.

[0057] exist Figure 3E In the embodiment, the transposition element head can be provided by a spare chip (not shown in FIG. Figure 3A to Figure 3F The transposition element head captures a plurality of sub-pixels 11G on the main pixel region RB and presses the sub-pixels 11G on the row formed by the main pixel region RB with appropriate pressure. More specifically, the transposition element head can press one of the sub-pixels 11G on the main pixel region RB where the sub-pixel 10G is removed, while the other sub-pixels 11G are pressed on the sub-pixels 10G that are not removed.

[0058] about Figure 3E For further details on the operation, please refer to Figure 3F . Figure 3F for Figure 3E , a side view showing the transposition element head ST grabbing the sub-pixel 11G and pressing it. Figure 3F For the convenience of explanation, some elements (such as sub-pixels 10R and 10B) are omitted.

[0059] In detail, when the transposition element head ST grabs the sub-pixel 11G and presses it, the transposition element head ST will press the sub-pixel 11G above the main pixel area RB where the sub-pixel 10G was originally removed. On the other hand, since the transposition element head ST is an array structure, the transposition element head ST will also press the sub-pixel 11G above the sub-pixel 10G of other pixels PX3. Further, in order to make the sub-pixel 11G better adhered by the second material AD2, the transposition element head ST can press with appropriate pressure to press the sub-pixel 11G above the main pixel area RB where the sub-pixel 10G was originally removed without damaging other sub-pixels 10G.

[0060] exist Figure 3G In the embodiment, when the transposition element head ST leaves the substrate 12, due to the second bonding material AD2, only the sub-pixel 11G in the upper left pixel PX3 will be left, so the defective sub-pixel 10G can be replaced. In addition, in the replaced pixel PX3, the sub-pixel 11G can be arranged at a higher height on the substrate 12 than the sub-pixels 10R and 10B.

[0061] Figure 4A to Figure 4C Schematic diagram of sub-pixels 111 - 113 for replacement according to an embodiment of the present invention.

[0062] exist Figure 4AIn the embodiment, the sub-pixel 111 to be replaced may be a chip with a lateral structure, and two pads PD1 and PD2 are disposed on the upper portion of the sub-pixel 111. Thus, when the sub-pixel 111 is placed, the sub-pixel 111 may be adhered to the substrate via a second non-conductive adhesive material, and the sub-pixel 111 may be electrically connected to the pads PD1 and PD2 via indium tin oxide (ITO) on the upper portion of the sub-pixel 111.

[0063] exist Figure 4B In the embodiment, the sub-pixel 112 to be replaced may be, for example, a chip of a structure manufactured by flip chip technology, and the sub-pixel 112 is provided with two pads PD3 and PD4 at the bottom. In this way, when the sub-pixel 112 is placed, it can be adhered between the sub-pixel 112 and the substrate through a second conductive adhesive material, and then electrically connected to the pads PD3 and PD4. Alternatively, when the sub-pixel 112 is placed, it can be adhered between the sub-pixel 112 and the substrate through a second non-conductive adhesive material, and appropriate pressure is applied by the transposition element head, so that the pads PD3 and PD4 of the sub-pixel 112 can directly contact the substrate and be electrically connected.

[0064] exist Figure 4C In the embodiment, the sub-pixel 113 to be replaced may be a chip with a vertical structure, and the sub-pixel 113 is provided with pads PD5 and PD6 above and below it, respectively. In this way, when the sub-pixel 113 is placed, it can be adhered between the sub-pixel 111 and the substrate through the second conductive adhesive material, and then electrically connected to the pad PD6.

[0065] Figure 5A to Figure 5C FIG. 1 is a top view schematic diagram of a manufacturing process of pixels PX5a to PX5d in a display panel according to an embodiment of the present invention. In this embodiment, pixels PX5a to PX5d can be divided into three main pixel regions RB and only one spare pixel region RC.

[0066] exist Figure 5A , the sub-pixel 10R at the upper left corner of the pixel PX5a, the sub-pixel 10G at the upper right corner of the pixel PX5b, and the sub-pixel 10B at the lower left corner of the pixel PX5d can be determined as defective sub-pixels after inspection.

[0067] exist Figure 5B In the process, after the second bonding material is coated in the spare pixel region RC of the pixel PX5a and the transposition element head grabs the sub-pixel 11R and places it on the substrate, the sub-pixel 11R can be set in the spare pixel region RC of the sub-pixel PX5a.

[0068] exist Figure 5C In, after repeated Figure 4BThe sub-pixels 11G and 11B can be respectively disposed in the spare pixel regions RC of the pixels PX5b and PX5d. In addition, the defective sub-pixels 10R, 10G, and 10B in the pixels PX5a, PX5b, and PX5d can also be removed.

[0069] Although in Figure 2A to Figure 2F and Figure 3A to Figure 3G In the manufacturing process illustrated, the defective sub-pixel is removed first and then the replacement sub-pixel is placed. However, in the case of a spare pixel area, the step of removing the defective sub-pixel can of course be flexibly adjusted. For example, after the replacement sub-pixel is placed, the defective sub-pixel is removed, which should also fall within the scope of the embodiments of the present invention.

[0070] Figure 6A to Figure 6G Schematic diagram of pixel arrangement in an embodiment of the present invention. Since those skilled in the art can adjust the number of spare pixel regions in the display pixel region or the arrangement of the main pixel region and the spare pixel region in the display pixel region according to different design requirements, Figure 6A to Figure 6G The arrangement diagram of different pixels is exemplarily shown in FIG.

[0071] exist Fig. 6A In the embodiment, the pixel PX6A can be divided into three main pixel regions and three spare pixel regions, and each main pixel region and the corresponding spare pixel region are arranged adjacent to each other.

[0072] exist Figure 6B In the example, the pixel PX6B can be divided into three main pixel regions and only one spare pixel region. The main pixel regions and the spare pixel regions can be arranged together in a rectangle or a square, so that each main pixel region is adjacent to the spare pixel region.

[0073] exist Figure 6C , the pixel PX6C can be divided into three main pixel regions and only one spare pixel region, and the main pixel region and the spare pixel region can be arranged together in a T-shape. More specifically, the three main pixel regions can be arranged together in a horizontal row, and the spare pixel region is arranged below the T-shaped horizontal row.

[0074] exist Fig.6D In the embodiment, the pixel PX6C can be divided into three main pixel regions and only one spare pixel region, and the main pixel regions and the spare pixel regions can be arranged together in a T-shape. More specifically, the spare pixel region is arranged in the center of the horizontal row of the T-shape, and the three main pixel regions are arranged at the three tops of the T-shape.

[0075] exist Fig. 6E, the pixel PX6C can be divided into three main pixel regions and only one spare pixel region. The main pixel regions can be rectangular in shape with the same size and are arranged in a row. The spare pixel regions are arranged below the row of main pixel regions, so that the main pixel regions and the spare pixel regions together form a rectangle.

[0076] exist Fig. 6F In the left side of the display array, the pixel PX6F1 may have two main pixel areas and only one spare pixel area. The two main pixel areas may be provided with red and green sub-pixels, respectively. Further, the pixel PX6F2 may be connected to the right side of the pixel PX6F1, and also has two main pixel areas and only one spare pixel area. The main pixel area of ​​the pixel PX6F2 may be provided with blue and green sub-pixels, respectively. Therefore, by repeatedly arranging the pixels PX6F1 and PX6F2, the pixels in the display array may be arranged together into Fig. 6F The form on the right.

[0077] exist Figure 6G In the left side of the figure, pixels PX6G1 and PX6G2 can share a spare pixel area. In detail, pixels PX6G1 and PX6G2 can have red, green, and blue sub-pixels respectively, and six sub-pixels are arranged around the spare pixel area. Therefore, by repeatedly arranging pixels PX6G1 and PX6G2, the pixels in the display array can be arranged together into Figure 6G The form on the right.

[0078] In summary, the display panel and manufacturing method of the present invention selectively adhere the second pixel to the vacant display pixel area through the second adhesive material, so that in the process of manufacturing the display panel, the first pixel and the second pixel can be set through the same transposition element head. Therefore, defects on the display panel can be repaired through relatively simple hardware devices and relatively short operation processes to improve the display effect of the display panel.

Claims

1. A display panel, comprising: substrate; A plurality of first sub-pixels are disposed on the substrate, the first sub-pixels have a first directional characteristic, and a first bonding material is disposed between the first sub-pixels and the substrate; and A plurality of second sub-pixels are disposed on the substrate, the second sub-pixels have a second directional characteristic, and a second bonding material is disposed between the second sub-pixels and the substrate. The first sub-pixels and the second sub-pixels are arranged by the same transposition element head, the first directional characteristic is different from the second directional characteristic, the first bonding material is different from the second bonding material, The first sub-pixels and the second sub-pixels are respectively arranged in corresponding display pixel areas. The first directional characteristic includes a first position offset and a first angle offset between each of the first sub-pixels and the corresponding display pixel regions, and the second directional characteristic includes a second position offset and a second angle offset between each of the second sub-pixels and the corresponding display pixel regions. The first position offset and the second position offset are different, and / or the first angle offset and the second angle offset are different. 2 . The display panel as claimed in claim 1 , wherein a first height exists between the first sub-pixels and the substrate, a second height exists between the second sub-pixels and the substrate, and the first height and the second height are different. The display panel as claimed in claim 2 , wherein the second height is greater than the first height. 4 . The display panel as claimed in claim 1 , wherein the first bonding material or the second bonding material comprises metal, photoresist, resin, colloid, black light shielding layer, color filter layer or quantum dot.

5. The display panel as claimed in claim 1, wherein each of the display pixel regions comprises a main pixel region and a spare pixel region, wherein each of the first sub-pixels and the second sub-pixels is arranged on one of the main pixel region and the spare pixel region in the corresponding display pixel region.

6. A method for manufacturing a display panel, comprising: providing a substrate; Disposing a plurality of first sub-pixels on the substrate, wherein the first sub-pixels have a first directional characteristic, and a first bonding material is disposed between the first sub-pixels and the substrate; and A plurality of second sub-pixels are arranged on the substrate, the second sub-pixels have a second directional characteristic, and a second bonding material is provided between the second sub-pixels and the substrate. wherein the first directional characteristic is different from the second directional characteristic, the first bonding material is different from the second bonding material, the first sub-pixels and the second sub-pixels are arranged by the same transposition element head, The first sub-pixels and the second sub-pixels are respectively arranged in corresponding display pixel areas. The first directional characteristic includes a first position offset and a first angle offset between each of the first sub-pixels and the corresponding display pixel regions, and the second directional characteristic includes a second position offset and a second angle offset between each of the second sub-pixels and the corresponding display pixel regions. The first position offset and the second position offset are different, and / or the first angle offset and the second angle offset are different.

7. The manufacturing method according to claim 6, comprising: After the first sub-pixels are arranged, the first sub-pixels are inspected to determine a plurality of third sub-pixels having defects from the first sub-pixels; removing the third sub-pixels; and The second sub-pixels are respectively disposed in a plurality of mark display pixel regions where the third sub-pixels are removed.

8. The manufacturing method as claimed in claim 7, wherein the step of respectively arranging the second sub-pixels in the mark display pixel regions where the third sub-pixels are arranged comprises: After coating the second adhesive material in the mark display pixel regions, the second sub-pixels are disposed in the mark display pixel regions. 9 . The manufacturing method as claimed in claim 6 , wherein a first height exists between the first sub-pixels and the substrate, a second height exists between the second sub-pixels and the substrate, and the first height and the second height are different. 10 . The manufacturing method as claimed in claim 9 , wherein the second height is greater than the first height. 11 . The manufacturing method as claimed in claim 6 , wherein the first bonding material or the second bonding material comprises metal, photoresist, resin, colloid, black light shielding layer, color filter layer or quantum dot.

12. The manufacturing method as claimed in claim 6, wherein each of the display pixel regions comprises a main pixel region and a spare pixel region, wherein each of the first sub-pixels and the second sub-pixels is arranged on one of the main pixel region and the spare pixel region in the corresponding display pixel region.

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