Heat dissipation components, housing components and electronic devices

Abstract

The present application discloses a heat dissipation component, a housing component and an electronic device, wherein the heat dissipation component comprises: a liquid cooling plate, wherein the liquid cooling plate has a cooling liquid flow channel and has a first liquid cooling plate opening connected to the cooling liquid flow channel; a cooling liquid power mechanism, wherein the cooling liquid power mechanism comprises a liquid cavity, a gas cavity and a gas power component separated from each other, wherein the liquid cavity is located in the gas cavity; the gas cavity has a first gas cavity opening, wherein the first gas cavity opening is connected to the gas power component, wherein the liquid cavity is connected to the first liquid cooling plate opening, wherein the volume of the liquid cavity can decrease as the pressure in the gas cavity increases, and increase as the pressure in the gas cavity decreases. Therefore, the heat dissipation component has the advantages of being less likely to get stuck, having a higher maximum flow rate and being easy to install.

Description

Technical Field

[0001] The present application relates to the field of electronic equipment, and in particular, to a heat dissipation component, a housing component and an electronic device. Background Art

[0002] With the continuous improvement of Internet technology, electronic devices play an increasingly important role in people's daily lives. Although the widespread popularity of electronic devices has led to an increasing variety of design styles, it is still not enough to meet people's growing needs. In recent years, people's functional requirements for terminal electronic consumer products have become increasingly apparent. In product design, engineers will stack a large number of modules and structures to further increase the functions of the product to meet user needs. However, with the increase in internal modules and structures of electronic devices, the power consumption of electronic devices is also gradually increasing.

[0003] Electronic devices in the prior art can usually meet the heat dissipation requirements of products by passive heat dissipation (natural convection). However, as the power of electronic devices is further increased, it is difficult to meet the temperature rise requirements of products by relying on natural convection while ensuring that the volume of electronic devices remains unchanged, which in turn reduces the performance of electronic products and brings unfriendly user experience. An efficient heat dissipation process that drives the flow of cooling liquid through an external liquid pump to achieve forced convection has emerged, but the liquid pumps currently used in heat dissipation components still have problems such as low maximum flow and inconvenient installation.

[0004] Therefore, current heat dissipation components, housing components and electronic devices still need to be improved. Summary of the invention

[0005] In one aspect of the present application, the present application proposes a heat dissipation assembly, comprising: a liquid cooling plate, the liquid cooling plate having a cooling liquid flow channel, and having a first liquid cooling plate opening connected to the cooling liquid flow channel; a cooling liquid power mechanism, the cooling liquid power mechanism comprising a liquid cavity, a gas cavity and a gas power assembly separated from each other, the liquid cavity being located in the gas cavity; the gas cavity having a first gas cavity opening, the first gas cavity opening being connected to the gas power assembly, the liquid cavity being connected to the first liquid cooling plate opening, wherein the volume of the liquid cavity can decrease as the pressure in the gas cavity increases, and increase as the pressure in the gas cavity decreases. As a result, the heat dissipation assembly has the advantages of being less likely to get stuck, having a higher maximum flow rate, and being easy to install.

[0006] In another aspect of the present application, the present application proposes a housing assembly, comprising: a housing base, the housing base defining a receiving space, and the housing base having the aforementioned heat dissipation assembly disposed on one side facing the receiving space. Thus, the housing assembly has all the features and advantages of the aforementioned heat dissipation assembly, which will not be described in detail here.

[0007] In another aspect of the present application, the present application proposes an electronic device, comprising: a housing assembly, the housing assembly being the aforementioned housing assembly, a heat dissipation assembly being electrically connected to a mainboard, a battery and the mainboard, the battery and the mainboard being located inside a receiving space defined by the housing assembly, and the mainboard and the battery being electrically connected. Thus, the electronic device has all the features and advantages of the aforementioned housing assembly, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0009] Figure 1 A schematic diagram of the structure of a heat dissipation assembly according to an embodiment of the present application is shown;

[0010] Figure 2 A schematic diagram of the structure of a gas power assembly according to an embodiment of the present application is shown;

[0011] Figure 3 A schematic structural diagram of a heat dissipation assembly according to another embodiment of the present application is shown;

[0012] Figure 4 A schematic structural diagram of a heat dissipation assembly according to another embodiment of the present application is shown;

[0013] Figure 5 A schematic diagram showing the before and after changes of two liquids flowing through a liquid pump according to a comparative example of the present application;

[0014] Figure 6 A schematic diagram showing the before and after changes of two liquids flowing through a liquid pump according to yet another comparative example of the present application;

[0015] Figure 7 A schematic diagram showing a pump sticking phenomenon of a liquid pump according to yet another comparative example of the present application.

[0016] Description of reference numerals:

[0017] 101: liquid chamber; 102: gas chamber; 103: gas power assembly; 104: first pipeline; 105: metal substrate; 106: liquid cooling plate; 107: coolant flow channel; 108: piezoelectric ceramic sheet; 109: first gas pump opening; 110: second gas pump opening; 114: first switch valve; 204: second pipeline; 214: second switch valve. DETAILED DESCRIPTION

[0018] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0019] This application is based on the inventor's discovery and understanding of the following facts and problems:

[0020] In the related art, a liquid cooling plate is used as a heat dissipation component of an electronic device for internal heat distribution or heat exchange with an external cold source. A liquid pump is usually used to drive the cooling liquid to bring the heat to the low-temperature area through which it flows. The heat is then carried away from the electronic device through the outer shell of the liquid cooling plate by natural convection or forced cooling. That is, the cooling liquid in the related art needs to flow through the liquid pump before it can be driven by the liquid pump to achieve flow heat transfer of the cooling liquid.

[0021] The inventors found that when a micro-liquid pump is used to drive the cooling liquid to flow in the liquid cooling plate of an electronic device, there will be problems such as powder stuck in the pump, emulsification of mixed liquids, and bubbles stuck in the pump. Specifically, first, in order to achieve better heat dissipation and appearance effects, multiple liquids are usually used as cooling liquids at the same time. When multiple liquids are mixed and pass through the one-way valve of the pump, the two liquids with clear boundaries will be broken into small droplets of two colors due to the destruction of their surface tension, and cannot be restored to the original state of coexistence of the two liquids, that is, emulsification occurs (see Figure 5 , the clearly defined liquid 1 and liquid 2 are mixed and passed through a micro-liquid pump to form multiple droplets of different sizes). The color of the emulsified liquid is whitish and foggy (see Figure 6 , the boundary between the liquids with clear boundaries is not obvious after the liquids are mixed through the micro liquid pump), there is no obvious boundary between the liquids, so there is no appearance effect and no flow effect can be formed; secondly, since the liquid cooling plate needs to take into account the appearance effect while achieving cooling and heat dissipation, a better appearance effect can be achieved by doping particles in the cooling liquid. Since the micro liquid pump realizes the pumping in and out of the cooling liquid through the opening and closing of the wheel valve, and the opening and closing size of the wheel valve is limited, usually less than 30μm, when the dispersion and size of the doped particles cannot be highly matched with the opening and closing size of the wheel valve, the pump will get stuck (see Figure 7 ); Finally, when there are bubbles in the cooling liquid, even if there are only a very small number of bubbles, the bubbles are compressible, which will cause the micro liquid pump to do some useless work in a working cycle, that is, the pressure change does not fully act on the cooling liquid, thereby causing the liquid pump to fail. It is difficult to fully degas and degas the cooling liquid inside the liquid cold plate, and the cost is high, which is not convenient for promotion and industrial production.

[0022] The present application aims to alleviate or solve at least one of the above-mentioned problems to at least some extent.

[0023] In one aspect of the present application, the present application proposes a heat dissipation component, referring to Figure 1 , including: a liquid cooling plate 106, wherein the liquid cooling plate 106 has a cooling liquid flow channel 107, and has a first liquid cooling plate opening connected to the cooling liquid flow channel 107; a cooling liquid power mechanism, wherein the cooling liquid power mechanism includes a liquid cavity 101, a gas cavity 102 and a gas power component 103 separated from each other, and the liquid cavity 101 is located in the gas cavity 102; the gas cavity 102 has a first gas cavity opening, and the first gas cavity opening is connected to the gas power component 103, and the liquid cavity 101 is connected to the first liquid cooling plate opening, wherein the volume of the liquid cavity 101 can decrease with the increase of the pressure in the gas cavity 102, and increase with the decrease of the pressure in the gas cavity 102. At least one of the liquid cooling plate, the liquid cavity and the first pipeline contains cooling liquid, so that the volume of the soft liquid cavity changes by changing the gas pressure in the hard gas cavity, so that when the gas pressure in the gas cavity increases, the liquid cavity contracts and the volume of the liquid cavity decreases, and the cooling liquid in the liquid cavity is squeezed out from the first liquid cavity opening of the liquid cavity, flows to the liquid cooling plate through the first pipeline, and exchanges heat with the heat source in the liquid cooling plate to increase the temperature; then, as the gas pressure in the gas cavity decreases, the liquid cavity expands and the volume increases, and the cooling liquid in the liquid cooling plate is squeezed out from the first liquid cooling plate opening of the liquid cooling plate, and flows back to the liquid cavity through the first pipeline. Through the continuous increase and decrease of the gas pressure in the gas cavity, the cooling liquid in the liquid cavity is continuously squeezed out and sucked, so that the cooling liquid circulates in the heat dissipation component, and then the cooling and heat dissipation of the heat source area near the liquid cooling plate is realized.

[0024] In the present application, the cooling liquid does not need to directly contact the driving structure during the flow process, thereby completely avoiding the problems of powder pump jam or gas pump jam when a micro liquid pump is used to drive the flow of cooling liquid in the related art. Moreover, since the liquid cooling plate and the cooling liquid power mechanism are arranged separately, the liquid cooling plate and the cooling liquid power mechanism can be arranged far apart in actual application, and the liquid cooling plate can be accurately fitted to the heat source area of ​​the electronic equipment. Compared with the structure in the related art in which the micro liquid pump is fixed to the liquid cooling plate, the heat dissipation component in the present application has a wider range of applications and stronger selectivity and operability. In short, the heat dissipation component has the advantages of being less likely to get stuck and being easy to install.

[0025] For ease of understanding, the principle of the heat dissipation assembly in the present application having the above beneficial effects is further explained below:

[0026] As a heat dissipation component of electronic equipment, the liquid cooling plate can be used to evenly distribute heat internally or exchange heat with an external cold source to help electronic equipment maintain a lower operating temperature. Through direct contact with the heat source, the energy of the heat source enters the cooling liquid through the shell of the liquid cooling plate. Driven by the liquid pump, the cooling liquid brings the heat to the low-temperature area it flows through, and is taken away from the electronic equipment through the shell of the liquid cooling plate by natural convection or forced cooling.

[0027] In this application, specifically, reference is made to Figure 1 The liquid cavity 101 is connected to the liquid cooling plate 106 through the first pipe 104, and the first pipe 104 passes through the second gas cavity opening on the gas cavity 102 to connect the first liquid cavity opening of the liquid cavity 101 and the first liquid cooling plate opening of the liquid cooling plate 106, so that the cooling liquid can flow freely between the liquid cavity 101 and the liquid cooling plate 106. The liquid cavity 101 and the gas cavity 102 are independent and not connected to each other, and the gas cavity 102 is a sealed structure, so that a positive pressure is formed inside the gas cavity 102, resulting in a pressure difference between the cavity and the external environment.

[0028] For example, when the gas power component 103 is a gas pump, when the gas outlet of the gas pump is connected to the gas chamber 102 through an opening (i.e., the first gas chamber opening) on ​​the outer shell of the hard gas chamber 102, the gas can be pumped into the gas chamber 102 through the gas pump, thereby forming a positive pressure. Figure 2 The piezoelectric vibrator formed by the piezoelectric ceramic sheet 108 disposed on the metal substrate 105 inside the gas pump is used as the core motion device. The high-frequency vibration (>10kHz) of the piezoelectric vibrator forms positive and negative pressures in the cavity of the gas pump, which promotes the flow of external air, enters the pump body through the air inlet, and is discharged from the air outlet. When the piezoelectric vibrator first moves toward the air outlet (such as Figure 2 110 side in the figure), the volume of the gas pump cavity is reduced compared with the initial state, thereby forming a high-speed airflow in the Venturi tube. From the Bernoulli equation, it can be seen that the higher the flow rate of the fluid, the lower the pressure. Therefore, when the outside air flows into the gas pump cavity from the air inlet, the gas also flows toward the air outlet, thereby increasing the air output; when the piezoelectric vibrator returns to its original state, the volume of the gas pump cavity has not changed compared with the initial state, and the airflow continues to flow from the air inlet to the air outlet due to inertia; when the piezoelectric vibrator is toward the air inlet (such as Figure 2 When the piezoelectric vibrator (109 side) vibrates, the vibration increases the volume of the gas pump chamber. At this time, a small part of the air flows back into the gas pump chamber from the air outlet, but more air flows from the air inlet to the air outlet due to inertia, so that the gas pump completes a cycle. From the above, it can be seen that in one cycle, although the vibration of the piezoelectric vibrator causes the pressure of the gas pump cavity to change continuously, the gas pump outlet blows out continuously, and the air inlet sucks air into the pump continuously.

[0029] Further, refer to Figure 1 and Figure 2 When a voltage is applied to the piezoelectric ceramic (i.e., the potential that causes the piezoelectric vibrator to vibrate), the external air can be blown into the gas cavity 102. Since the shell of the gas cavity 102 is closed and hard, the pressure inside the gas cavity 102 will continue to increase with the increase of the air blown in, so that a pressure difference is formed between the liquid cavity 101 inside the gas cavity 102 and the liquid cooling plate 106 in the external environment. At this time, the liquid cavity 101 is deformed, and the cooling liquid in the liquid cavity 101 is squeezed into the liquid cooling plate 106. When no voltage is applied to the piezoelectric ceramic (i.e., the piezoelectric vibrator is in a power-off state and the piezoelectric vibrator does not vibrate), because the air pressure in the gas cavity is greater than the external atmospheric pressure, the gas blown into the gas cavity 102 will be automatically released back into the air through the gas pump, so that the pressure in the gas cavity 102 continues to decrease until it returns to the atmospheric pressure, causing the cooling liquid that originally flowed into the liquid cooling plate 106 to flow back into the liquid cavity 101, and finally completing a liquid cycle. When the liquid cooling plate is arranged near the heat source area and the liquid cavity is located near the cold source area, the heat source energy can be transported by circulating the cooling liquid in the liquid cooling plate 106 and the liquid cavity 101, thereby achieving the purpose of heat dissipation and cooling.

[0030] Further, refer to Figure 2 and Figure 4 When a voltage is applied to the piezoelectric ceramic (i.e., the potential that causes the piezoelectric vibrator to vibrate), the air in the gas cavity 102 can be blown into the outside atmosphere. Since the outer shell of the gas cavity 102 is closed and hard, the pressure inside the gas cavity 102 will continue to decrease as the gas is blown out, so that a pressure difference is formed between the liquid cavity 101 inside the gas cavity 102 and the liquid cooling plate 106 in the external environment. At this time, the liquid cavity 101 is deformed, and the cooling liquid in the liquid cooling plate 106 is squeezed into the liquid cavity 101. When no voltage is applied to the piezoelectric ceramic (i.e., the piezoelectric vibrator is in a power-off state and the piezoelectric vibrator does not vibrate), because the air pressure in the gas cavity is lower than the outside atmospheric pressure, the outside gas will automatically flow back to the gas cavity through the gas pump, so that the pressure in the gas cavity 102 continues to increase until it returns to the atmospheric pressure, causing the cooling liquid that originally flowed into the liquid cavity 101 to flow back to the inner liquid cooling plate 106, and finally completing a liquid cycle. When the liquid cooling plate is arranged near the heat source area and the liquid cavity is located near the cold source area, the heat source energy can be transported by circulating the cooling liquid in the liquid cooling plate 106 and the liquid cavity 101, thereby achieving the purpose of heat dissipation and cooling.

[0031] From the above, it can be seen that as long as one end of the gas power component is connected to the gas cavity, the function of driving the coolant to flow through the gas power component can be realized. Technical personnel in this field can specifically choose which end of the gas power component to connect to the gas cavity according to actual conditions.

[0032] According to some embodiments of the present application, the structure of the gas power assembly is not particularly limited as long as it can cause the gas pressure of the gas chamber to increase and decrease alternately. For example, Figure 2 The gas power assembly may include: a gas pump, the gas pump includes a gas pump cavity and a piezoelectric ceramic sheet 108, a first gas pump opening 109 and a second gas pump opening 110 are provided on the gas pump cavity, a venturi tube is provided at the second gas pump opening 110, one of the first gas pump opening 109 and the second gas pump opening 110 is connected to the first gas cavity opening, and the other of the first gas pump opening 109 and the second gas pump opening 110 is connected to the atmosphere, wherein the side opening provided with the venturi tube serves as the gas outlet of the gas pump, and the side opening without the venturi tube structure serves as the gas inlet. The gas pressure of the gas cavity is changed by the gas pump, thereby generating a pressure difference between the inside and outside of the liquid cavity, realizing the flow of cooling liquid between the liquid cavity and the liquid cold plate, and having both appearance effect and heat dissipation performance.

[0033] According to some embodiments of the present application, the structures of the liquid cavity, the gas cavity, and the liquid cooling plate are not particularly limited. For example, Figure 3 The liquid cavity and the first liquid cooling plate opening may be communicated with each other through a first pipeline 104, the liquid cavity may further include a second liquid cavity opening, the liquid cooling plate may further include a second liquid cooling plate opening, the gas cavity may further include a third gas cavity opening, the second pipeline 204 passes through the third gas cavity opening and connects the second liquid cavity opening and the second liquid cooling plate opening, wherein a first switch valve 114 is provided on the first pipeline 104, and a second switch valve 214 is provided on the second pipeline 204, thereby realizing the circulation of the cooling liquid, enhancing the heat dissipation effect, and constructing different appearance effects. Specifically, when the gas power component blows air into the gas cavity 102 to increase the gas pressure in the gas cavity 102, the first switch valve 114 on the first pipeline 104 is opened, and the second switch valve 214 is kept closed. At this time, the cooling liquid flows from the liquid cavity 101 to the liquid cooling plate 106 through the first pipeline 104; when the gas power component sucks out the gas in the gas cavity 102 to reduce the gas pressure in the gas cavity 102, the second switch valve 214 is opened, the first switch valve 114 is closed, and the cooling liquid flows from the liquid cooling plate 106 to the liquid cavity 101 through the second pipeline 204, thereby realizing a cycle. It can be understood that in the description of the present application, "first feature" and "second feature" may include one or more of such features.

[0034] According to some embodiments of the present application, the structures of the liquid cavity, the gas cavity and the liquid cooling plate are not particularly limited. For example, the liquid cavity may further include a plurality of liquid cavity openings, the liquid cooling plate may further include a plurality of liquid cooling plate openings, the gas cavity may further include a plurality of gas cavity openings, and a plurality of pipelines pass through the plurality of gas cavity openings correspondingly, and connect the plurality of liquid cavity openings and the plurality of liquid cooling plate openings, wherein a plurality of pipelines are provided with switch valves. Thus, by coordinated control between a plurality of switch valves, a plurality of ways of circulating the cooling liquid can be realized to enhance the heat dissipation effect. It is to be understood that in the description of the present application, the meaning of "plurality" is two or more.

[0035] According to some embodiments of the present application, the connection method between the gas pump and the gas chamber is not particularly limited. For example, Figure 1 and Figure 2 The second gas pump opening 110 (gas outlet) can be connected to the first gas cavity opening, so that the gas pressure in the gas cavity increases when the gas pump is powered on, and the gas pressure in the gas cavity decreases when the gas pump is powered off, thereby realizing the circulation of cooling liquid between the liquid cavity 101 and the liquid cooling plate 106.

[0036] According to some embodiments of the present application, the connection method between the gas pump and the gas chamber is not particularly limited. For example, Figure 2 and Figure 4 , the first gas pump opening 109 (air inlet) can be connected to the first gas cavity opening, so that the pressure in the gas cavity 102 can be reduced when the gas pump is powered on, and the cooling liquid flows from the liquid cooling plate 106 to the liquid cavity 101. When the gas pump is powered off, the pressure in the gas cavity 102 increases to atmospheric pressure, and the cooling liquid flows back from the liquid cavity 101 to the liquid cooling plate 106, thereby realizing the circulation of the cooling liquid between the liquid cavity 101 and the liquid cooling plate 106.

[0037] According to some embodiments of the present application, the gas flow rate of the gas pump is not particularly limited, for example, the gas flow rate of the gas pump may be 10-200 mL / min. Further, the size of the gas pump is not particularly limited, for example, the minimum size of the gas pump may be 7 mm x 7 mm x 2 mm, which is suitable for use in miniaturized and compact electronic products.

[0038] According to some embodiments of the present application, the material forming the gas cavity is not particularly limited. For example, the material forming the gas cavity may include at least one of polymethyl methacrylate, polycarbonate, acrylonitrile-butadiene-styrene copolymer, metal and glass. When the material forming the gas cavity is within the above-mentioned types, the gas cavity is a hard structure with high compressive strength, which can support an atmospheric pressure of up to 60 kPa. Furthermore, the sealing method of the peripheral area of ​​the gas cavity opening on the gas cavity is not particularly limited. For example, the sealing of the pipeline and the hard gas cavity can be achieved by gluing, sealing connectors and other processes.

[0039] According to some embodiments of the present application, the material forming the liquid cavity is not particularly limited. For example, the material forming the liquid cavity may include at least one of polyethylene terephthalate, polyethylene, polyetherimide, polyethylene naphthalate, and polyimide. When the material forming the liquid cavity is the above-mentioned type, the formed liquid cavity has good deformability, and the thickness can be controlled within 0.5 mm.

[0040] It should be understood that in the description of the present application, the terms "thickness", "upper", "lower", etc., indicating orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0041] According to some embodiments of the present application, the material forming the pipeline is not particularly limited. For example, the material forming the liquid cavity, the material forming the liquid cooling plate, and the material forming the pipeline may be the same, so that the liquid cavity, the liquid plate, and the pipeline can be integrally formed; the material forming the pipeline may also be different from the material forming the liquid cavity and the material forming the liquid cooling plate. After the liquid cavity, the liquid cooling plate, and the pipeline are respectively formed, the pipeline can be connected to the liquid cavity and the liquid diaphragm through processes such as adapters, gluing, and hot pressing welding.

[0042] According to some embodiments of the present application, the structure of the liquid cooling plate is not particularly limited. For example, the liquid cooling plate may include a first cover body and a second cover body that are arranged opposite to each other, and the cooling liquid flow channel is sealed between the first cover body and the second cover body. The materials forming the first cover body and the second cover body are not particularly limited. For example, the materials forming the first cover body and the second cover body may independently include at least one of polyester, polyimide, polymethyl methacrylate, polyethylene, polyvinyl chloride, polystyrene, ceramics and glass. Furthermore, there may be a partition between the first cover body and the second cover body, and the partition has a hollow pattern, and the hollow pattern constitutes the cooling liquid flow channel. According to some other embodiments of the present application, the material forming the partition may be consistent with the material forming the first cover body or the second cover body, that is, the material forming the partition may be at least one of polyester, polyimide, polymethyl methacrylate, polyethylene, polyvinyl chloride, polystyrene, ceramics and glass. Therefore, the liquid cooling plate formed by sealing the first cover body and the second cover body, or the liquid cooling plate formed by sealing the first cover body, the second cover body and the partition plate can obtain a rigid liquid cooling plate or a flexible liquid cooling plate according to the different materials used, that is, the heat dissipation component formed by the combination of the liquid cooling plate and the piezoelectric ceramic pump can be rigid or flexible.

[0043] In summary, the heat dissipation assembly in this application has at least the following beneficial effects:

[0044] (1) The maximum flow rate of the micro liquid pump in the related art is usually <10mL / min. The flow rate of the gas power component in this application is the same as the gas flow rate of the gas pump, and the maximum flow rate can reach 200mL / min, which is 20 times that of the micro liquid pump. The heat dissipation capacity of the liquid cooling plate is directly related to the flow rate of the cooling liquid. The heat dissipation capacity of the liquid cooling plate in this application that uses the gas power component to drive the cooling liquid flow far exceeds the heat dissipation capacity of the liquid cooling plate in the related art that uses the micro liquid pump to drive the cooling liquid flow.

[0045] (2) The size selection of the doped powder in the cooling liquid in the related art is limited by the opening and closing scale of the pump body of the micro liquid pump (usually less than 30μm), and the selectivity is poor. The maximum size of the doped powder in the heat dissipation component in the present application can be the minimum space that can pass through the liquid cooling plate (about 200μm), the powder selectivity is significantly improved, and the dispersion requirements of the powder are correspondingly reduced. In addition, the cooling liquid in the heat dissipation component in the present application does not need to flow through the gas pump, the gas pump is not in direct contact with the cooling liquid, and the gas pump will not have problems such as pump jamming. Therefore, the cooling liquid and the inside of the liquid cooling plate do not need to be degassed, which significantly reduces the production cost of the heat dissipation component and greatly improves the reliability of the heat dissipation component.

[0046] (3) Since the coolant power mechanism and the liquid cooling plate are separate structures, the space restriction is smaller. In actual application, the liquid cooling plate can be set only in the heat source area with a small space, and the coolant power mechanism can be arranged at a location with a larger space at the far end.

[0047] In this application, all the numbers disclosed herein are approximate values, regardless of whether the words "about" or "approximately" are used. The value of each number may vary by less than 10% or a reasonable difference considered by those skilled in the art, such as 1%, 2%, 3%, 4% or 5%.

[0048] In another aspect of the present application, the present application proposes a housing assembly, comprising: a housing base, the housing base defining a receiving space, and the housing base having the aforementioned heat dissipation assembly on one side facing the receiving space. Thus, the housing assembly has all the features and advantages of the aforementioned heat dissipation assembly, which will not be described in detail here.

[0049] In another aspect of the present application, the present application proposes an electronic device, comprising: a housing assembly, the housing assembly being the aforementioned housing assembly, a heat dissipation assembly being electrically connected to a mainboard, a battery and a mainboard, the battery and the mainboard being located inside a receiving space defined by the housing assembly, and the mainboard and the battery being electrically connected. Thus, the electronic device has all the features and advantages of the aforementioned housing assembly, which will not be described in detail here.

[0050] According to some embodiments of the present application, the structure of the electronic device is not particularly limited. For example, the electronic device may further include a chip, and the chip is located in the area near the liquid cooling plate. The heat generated by the electronic device mainly comes from the battery and the chip on the mainboard. Generally, the temperature of the battery and mainboard areas on the electronic device will be higher than other parts. By setting the above-mentioned shell assembly on the electronic device, the heat from the heat source area, that is, the area where the chip or battery is located, can be quickly transferred to the cold source area where the cooling liquid power mechanism is located through the liquid cooling plate inside the shell assembly, thereby achieving the effect of uniform heating and temperature. Through the simple structural setting of the heat dissipation component, the position design and reasonable layout of the liquid cooling plate and the cooling liquid power mechanism can be used to increase the temperature of the positions that are not easily touched by the user during use, and reduce the temperature of the frequently touched positions. Therefore, because the electronic device has the above-mentioned shell assembly with good temperature balancing performance, there will be no local overheating during use, and the user experience is good.

[0051] Unless otherwise specified, all scientific and technological terms used in this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. All patents and publications related to this application are incorporated herein by reference in their entirety. The term "comprising" or "including" is an open expression, i.e., including the content specified in this application, but does not exclude the content of other aspects.

[0052] In the description of this specification, the description with reference to the terms "one embodiment", "another embodiment", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment are included in at least one embodiment of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory. In addition, it should be noted that in this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0053] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A heat dissipation component, characterized in that: include: A liquid cooling plate, wherein the liquid cooling plate has a cooling liquid flow channel therein and has a first liquid cooling plate opening connected to the cooling liquid flow channel; A coolant power mechanism, the coolant power mechanism comprising a liquid chamber, a gas chamber and a gas power assembly separated from each other, the liquid chamber being located in the gas chamber; The gas cavity has a first gas cavity opening, the first gas cavity opening is connected to the gas power component, the gas power component can make the gas pressure in the gas cavity increase and decrease alternately, the liquid cavity is connected to the first liquid cooling plate opening, The gas cavity and the liquid cavity are not connected to each other, and the gas cavity is a sealed structure. The volume of the soft liquid cavity changes by changing the gas pressure in the hard gas cavity, so that the volume of the liquid cavity can decrease with the increase of the pressure in the gas cavity, so as to squeeze the cooling liquid in the liquid cavity to the opening of the first liquid cooling plate, and can increase with the decrease of the pressure in the gas cavity, so that the cooling liquid in the liquid cooling plate can flow back to the liquid cavity through the opening of the first liquid cooling plate.

2. The heat dissipation assembly according to claim 1, characterized in that: The gas power component includes: a gas pump, which includes a gas pump cavity and a piezoelectric ceramic sheet. The gas pump cavity is provided with a first gas pump opening and a second gas pump opening, and a venturi tube is provided at the second gas pump opening. One of the first gas pump opening and the second gas pump opening is connected to the first gas cavity opening, and the other of the first gas pump opening and the second gas pump opening is connected to the atmosphere.

3. The heat dissipation assembly according to claim 2, characterized in that: The liquid cavity and the first liquid cooling plate opening are connected through a first pipeline, the liquid cavity further includes a second liquid cavity opening, the liquid cooling plate further includes a second liquid cooling plate opening, the gas cavity further includes a third gas cavity opening, and a second pipeline passes through the third gas cavity opening and connects the second liquid cavity opening and the second liquid cooling plate opening, wherein a first switch valve is provided on the first pipeline, and a second switch valve is provided on the second pipeline.

4. The heat dissipation assembly according to claim 3, characterized in that: The liquid cavity further includes a plurality of liquid cavity openings, the liquid cooling plate further includes a plurality of liquid cooling plate openings, the gas cavity further includes a plurality of gas cavity openings, a plurality of pipelines correspondingly pass through the plurality of gas cavity openings, and connect the plurality of liquid cavity openings and the plurality of liquid cooling plate openings, wherein a switch valve is provided on each of the plurality of pipelines.

5. The heat dissipation assembly according to any one of claims 2 to 4, characterized in that: The second gas pump opening is connected to the first gas chamber opening.

6. The heat dissipation assembly according to any one of claims 2 to 4, characterized in that: The first gas pump opening is connected to the first gas chamber opening.

7. The heat dissipation assembly according to claim 2, characterized in that: The gas flow rate of the gas pump is 10-200 mL / min.

8. The heat dissipation assembly according to claim 1, characterized in that: The material of the gas cavity includes at least one of polymethyl methacrylate, polycarbonate, acrylonitrile-butadiene-styrene copolymer, metal and glass.

9. The heat dissipation assembly according to claim 1, characterized in that: The material of the liquid chamber includes at least one of polyethylene terephthalate, polyethylene, polyetherimide, polyethylene naphthalate and polyimide.

10. A housing assembly, characterized in that: include: A shell base defines a receiving space, and a heat dissipation assembly according to any one of claims 1 to 9 is provided on a side of the shell base facing the receiving space.

11. An electronic device, characterized in that: include: The housing assembly is the housing assembly according to claim 10, the heat dissipation assembly is electrically connected to the mainboard, The battery and the mainboard are located inside the accommodating space defined by the shell assembly, and the mainboard and the battery are electrically connected.

12. The electronic device according to claim 11, characterized in that: The electronic device further includes a chip, and the chip is located near the liquid cooling plate.

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