A welding ball implantation method and a corresponding welding ball placement device

Abstract

The present invention relates to the field of semiconductor manufacturing technology, and discloses a solder ball implantation method and a corresponding solder ball placement device. The solder ball implantation device is designed to realize the implantation of solder balls during the implantation process, wherein the solder ball implantation device comprises a supporting structure, the supporting structure is provided with a plurality of through holes, and a solder ball transmission structure is provided in the through holes. The positions of the through holes on the solder ball implantation device correspond to the positions of solder pads for subsequent implantation on a substrate. The technical solution of the present invention reduces the number of molds in the implantation process, eliminates vacuum operation conditions, and realizes the optimization of the implantation operation.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a solder ball implantation method and a corresponding solder ball placement device. Background Art

[0002] The main process of the existing BGA ball planting method includes: scraping flux -> applying flux -> taking balls -> planting balls. The ball taking mold is divided into an upper ball planting mold and a lower ball planting mold. When the solder ball is taken into the lower ball planting mold, the upper ball planting mold is pressed together with the lower ball planting mold. The upper ball planting mold is vacuumed to suck the solder ball onto the upper ball planting mold, and then moved to the top of the substrate. The upper ball planting mold blows air and vibrates to place the solder ball on the designated pad position on the substrate to complete the complete ball planting.

[0003] like Figure 2 As shown in (a), the solder ball groove 10 drops the solder balls 30 into the lower ball mold 20 according to the moving direction shown by the arrow. After all the solder balls 30 are dropped into the lower ball mold 20, Figure 2 As shown in (b), the upper ball mold 40 is moved to the upper part of the lower ball mold 20, and the lower ball mold 20 and the upper ball mold 40 are blown and sucked in the blowing and sucking directions shown by the arrows to transfer the solder balls 30 in the lower ball mold 20 to the upper ball mold 40, and then Figure 3 As shown in (a) in the figure, the upper ball planting mold 40 is moved to the top of the substrate 50, the substrate 50 is coated with a soldering flux 60, and each solder ball 30 in the upper ball planting mold 40 is aligned with each soldering flux 60 on the substrate 50, and then each solder ball 30 in the upper ball planting mold 40 is transferred to the surface of each soldering flux 60 on the substrate 50, thereby completing the ball planting, as shown in FIG. Figure 3 (b) is a schematic diagram after ball implantation is completed.

[0004] However, the above-mentioned BGA ball planting method has the problem that, in the process of removing the ball, the upper ball planting mold 40 and the lower ball planting mold 20 need to perform vacuum suction on the upper mold and air blowing on the lower mold respectively to achieve the purpose of removing the soldered ball. This requires connecting air ducts on the upper ball planting mold 40 and the lower ball planting mold 20, making the implementation process more complicated. Summary of the invention

[0005] The purpose of the present invention is to overcome the problem of complicated process of existing ball planting method, and provide a solder ball planting method and a corresponding solder ball picking and placing device.

[0006] In order to achieve the above object, the present invention provides a solder ball implantation method, comprising the following steps:

[0007] A solder ball picking and placing device is provided, wherein the solder ball picking and placing device comprises a support structure, the support structure is provided with a plurality of through holes, a solder ball transmission structure is provided in the through holes, and the positions of the through holes on the solder ball picking and placing device correspond to the positions of solder pads for subsequent ball planting on the solder pads of the substrate;

[0008] Solder balls are placed in different through holes of the solder ball placement device, and the solder ball transmission structures in the different through holes respectively transmit the placed solder balls so that the solder balls are fixed in the placed through holes respectively;

[0009] The solder ball picking and placing device with solder balls fixed in the through holes is moved above the substrate, and the solder ball transmission structures in different through holes respectively transmit the solder balls fixed in the through holes so that the solder balls in the through holes fall on the corresponding pad positions on the substrate, thereby completing the ball planting.

[0010] As an implementation method, the welding ball transmission structure includes at least two active annular gears and corresponding at least two driven arc gears, the outer wall of the active annular gear is evenly provided with main gear teeth, the outer wall of the driven arc gear facing the active annular gear is evenly provided with secondary gear teeth, and the driven arc gear and the corresponding active annular gear are movably connected through the secondary gear teeth meshing with the main gear teeth;

[0011] When the welding ball falls into the through hole, the welding ball falls on the inner walls of at least two driven arc gears in the through hole, and then the at least two active ring gears in the through hole respectively drive the corresponding driven arc gears to rotate, and the welding ball is fixed in the middle area surrounded by the inner walls of the at least two driven arc gears, and then the at least two active ring gears in the through hole drive the corresponding driven arc gears to rotate until the welding ball falls out of the middle area surrounded by the inner walls of the at least two driven arc gears and falls on the corresponding pad position on the substrate.

[0012] As an implementation method, when the welding ball falls on the inner wall of at least two driven arc gears in the through hole, the diameter of the ring formed by the upper ends of at least two driven arc gears is larger than the diameter of the welding ball, and the diameter of the welding ball is larger than the diameter of the ring formed by the lower ends of the driven arc gears; when the welding ball is fixed in the middle area surrounded by the inner walls of at least two driven arc gears, the diameter of the ring formed by the upper ends of at least two driven arc gears and the diameter of the ring formed by the lower ends of at least two driven arc gears are respectively smaller than the diameter of the welding ball; when the welding ball falls out of the middle area surrounded by the inner walls of at least two driven arc gears, the diameter of the ring formed by the upper ends of at least two driven arc gears is smaller than the diameter of the welding ball, and the diameter of the welding ball is smaller than the diameter of the ring formed by the lower ends of the driven arc gears.

[0013] As an implementation method, the steps of placing solder balls in different through holes of the solder ball picking and placing device, and the solder ball transmission structures in different through holes respectively transmitting the placed solder balls so that the solder balls are respectively fixed in the placed through holes specifically include:

[0014] A welding ball slot for storing welding balls is provided, and the welding ball slot is moved above the welding ball picking and placing device, and a force is applied to the welding ball slot so that the welding balls in the welding ball slot fall into different through holes of the welding ball picking and placing device in sequence and fall on the welding ball transmission structure in the through holes, and then the welding ball transmission structures in different through holes respectively transmit the fallen welding balls so that the welding balls are respectively fixed in the through holes into which they fall.

[0015] As an implementation method, multiple through holes are arranged in parallel, and the welding ball groove moves according to the arrangement direction of the multiple through holes. When the hole of the welding ball groove moves above different through holes, a force is applied to the welding ball groove so that the welding balls in the welding ball groove fall into different through holes in sequence.

[0016] As an implementation method, the corners of the support structure and the solder ball transmission structure are both rounded, and the surface of each solder pad is coated with solder flux.

[0017] Correspondingly, the present invention also provides a welding ball picking and placing device, comprising: a supporting structure, wherein the supporting structure is provided with a plurality of through holes, wherein a welding ball transmission structure is provided in the through holes, wherein the welding ball transmission structure is used to transmit the welding balls inserted into the through holes so as to fix the inserted welding balls in the through holes, and then transmit the welding balls fixed in the through holes so as to make the welding balls in the through holes fall into designated positions respectively.

[0018] As an implementation method, the welding ball transmission structure includes at least two active annular gears and corresponding at least two driven arc gears, the outer wall of the active annular gear is evenly provided with main gear teeth, the outer wall of the driven arc gear facing the active annular gear is evenly provided with secondary gear teeth, and the driven arc gear and the corresponding active annular gear are movably connected through the secondary gear teeth meshing with the main gear teeth;

[0019] When the welding ball falls into the through hole, the welding ball falls on the inner walls of at least two driven arc gears in the through hole, and then the at least two active ring gears in the through hole respectively drive the corresponding driven arc gears to rotate, and the welding ball is fixed in the middle area surrounded by the inner walls of the at least two driven arc gears, and then the at least two active ring gears in the through hole drive the corresponding driven arc gears to rotate until the welding ball falls out of the middle area surrounded by the inner walls of the at least two driven arc gears and falls on the designated position.

[0020] As an implementation method, when the welding ball falls on the inner wall of at least two driven arc gears in the through hole, the diameter of the ring formed by the upper ends of at least two driven arc gears is larger than the diameter of the welding ball, and the diameter of the welding ball is larger than the diameter of the ring formed by the lower ends of the driven arc gears; when the welding ball is fixed in the middle area surrounded by the inner walls of at least two driven arc gears, the diameter of the ring formed by the upper ends of at least two driven arc gears and the diameter of the ring formed by the lower ends of at least two driven arc gears are respectively smaller than the diameter of the welding ball; when the welding ball falls out of the middle area surrounded by the inner walls of at least two driven arc gears, the diameter of the ring formed by the upper ends of at least two driven arc gears is smaller than the diameter of the welding ball, and the diameter of the welding ball is smaller than the diameter of the ring formed by the lower ends of the driven arc gears.

[0021] As an implementation method, the corners of the support structure and the solder ball transmission structure are both rounded, and the surface of each solder pad is coated with solder flux.

[0022] Beneficial effects of the present invention: The present invention provides a solder ball planting method and a corresponding solder ball picking and placing device, and the solder ball is picked and placed during the planting process through the designed solder ball picking and placing device, wherein the solder ball picking and placing device includes a supporting structure, the supporting structure is provided with a plurality of through holes, and a solder ball transmission structure is provided in the through holes, and the positions of the through holes on the solder ball picking and placing device correspond to the positions of the solder pads for subsequent ball planting on the substrate; the technical solution of the present invention reduces the number of molds in the ball planting process, eliminates the vacuum operation conditions, and realizes the optimization of the ball planting operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the steps of the solder ball implantation method of the present invention.

[0024] Figure 2 This is a schematic diagram of the process in which the solder ball groove transfers the solder ball to the lower solder ball mold in the traditional solder ball planting method, and the lower solder ball mold then transfers the solder ball to the upper solder ball mold.

[0025] Figure 3 Schematic diagram of the process of transferring solder balls to a substrate using a ball placement mold in a conventional solder ball placement method.

[0026] Figure 4 The figure is a schematic diagram of the process of ball planting by the welding ball planting method of the present invention.

[0027] Figure 5 for Figure 4 Enlarged view of (b). DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] See also Figure 1 , this embodiment provides a technical solution: a solder ball implantation method, comprising the following steps:

[0030] Step S100, providing a solder ball picking and placing device, wherein the solder ball picking and placing device comprises a support structure, the support structure is provided with a plurality of through holes, a solder ball transmission structure is provided in the through holes, and the positions of the through holes on the solder ball picking and placing device correspond to the positions of solder pads for subsequent ball planting on the solder pads of the substrate;

[0031] Step S200, solder balls are respectively placed in different through holes of the solder ball placement device, and the solder ball transmission structures in the different through holes respectively transmit the placed solder balls so that the solder balls are respectively fixed in the placed through holes;

[0032] In step S300, a solder ball placement device with solder balls fixed in through holes is moved to above the substrate, and solder ball transmission structures in different through holes respectively transmit the solder balls fixed in the through holes so that the solder balls in the through holes fall on corresponding pad positions on the substrate, thereby completing ball planting.

[0033] Execute step S100, the welding ball transmission structure includes at least two active annular gears and corresponding at least two driven arc gears, the outer wall of the active annular gear is evenly provided with main gear teeth, the outer wall of the driven arc gear facing the active annular gear is evenly provided with secondary gear teeth, and the driven arc gear and the corresponding active annular gear are movably connected by meshing the secondary gear teeth with the main gear teeth;

[0034] When the welding ball falls into the through hole, the welding ball falls on the inner walls of at least two driven arc gears in the through hole, and then the at least two active ring gears in the through hole respectively drive the corresponding driven arc gears to rotate, and the welding ball is fixed in the middle area surrounded by the inner walls of the at least two driven arc gears, and then the at least two active ring gears in the through hole drive the corresponding driven arc gears to rotate until the welding ball falls out of the middle area surrounded by the inner walls of the at least two driven arc gears and falls on the corresponding pad position on the substrate.

[0035] Specifically, when the welding ball falls on the inner wall of at least two driven arc gears in the through hole, the diameter of the ring formed by the upper ends of at least two driven arc gears is larger than the diameter of the welding ball, and the diameter of the welding ball is larger than the diameter of the ring formed by the lower ends of the driven arc gears; when the welding ball is fixed in the middle area surrounded by the inner walls of at least two driven arc gears, the diameter of the ring formed by the upper ends of at least two driven arc gears and the diameter of the ring formed by the lower ends of at least two driven arc gears are respectively smaller than the diameter of the welding ball; when the welding ball falls out of the middle area surrounded by the inner walls of at least two driven arc gears, the diameter of the ring formed by the upper ends of at least two driven arc gears is smaller than the diameter of the welding ball, and the diameter of the welding ball is smaller than the diameter of the ring formed by the lower ends of the driven arc gears.

[0036] like Figure 4 As shown, when there are two active annular gears and two driven arc gears, the positions of the support structure 110, two active annular gears 120 and two corresponding driven arc gears 130 of the welding ball picking and placing device 100 at different stages are shown. Figure 5 for Figure 4 From the enlarged view of (b), it can be seen that main gear teeth 121 are distributed on the outer wall of the active ring gear 120, and secondary gear teeth 131 are distributed on the outer wall of the driven arc gear 130 facing the active ring gear 120, and the secondary gear teeth 131 are meshed and movably connected with the main gear teeth 121.

[0037] The step of executing step S200, in which solder balls are respectively placed in different through holes of the solder ball picking and placing device, and the solder ball transmission structures in different through holes respectively transmit the placed solder balls so that the solder balls are respectively fixed in the placed through holes, specifically includes:

[0038] A welding ball slot for storing welding balls is provided, and the welding ball slot is moved above the welding ball picking and placing device, and a force is applied to the welding ball slot so that the welding balls in the welding ball slot fall into the welding ball transmission structure in different through holes of the welding ball picking and placing device in sequence, and then the welding ball transmission structures in different through holes respectively transmit the fallen welding balls so that the welding balls are respectively fixed in the through holes into which they fall.

[0039] The steps of sequentially dropping the solder balls in the solder ball slots into different through holes of the solder ball picking and placing device and onto the solder ball transmission structures in the through holes, and then respectively transmitting the dropped solder balls by the solder ball transmission structures in the different through holes so that the solder balls are fixed in the dropped through holes specifically include:

[0040] The welding balls in the welding ball grooves fall into different through holes of the welding ball picking and placing device in turn and fall on the inner walls of at least two driven arc gears in the through holes, and then at least two active ring gears in different through holes respectively drive the corresponding driven arc gears to rotate, and the welding balls are fixed in the middle area surrounded by the inner walls of at least two driven arc gears, thereby fixing the welding balls in the through holes into which they fall.

[0041] In this embodiment, the plurality of through holes may be arranged in parallel, and the welding ball groove moves according to the arrangement direction of the plurality of through holes. When the hole of the welding ball groove moves above different through holes, a force is applied to the welding ball groove so that the welding balls in the welding ball groove fall into different through holes in sequence. The force is applied to the welding ball groove by tilting the welding ball groove to a certain degree to the left and right so that the welding balls in the welding ball groove roll into the through holes. The arrangement of the plurality of through holes can refer to Figure 2 The arrangement of the blowing recesses for placing the solder balls 30 in the lower ball implantation mold 20, and the moving direction of the solder ball grooves can also refer to Figure 2 The moving direction of the solder ball groove 10 is determined so that the solder balls are placed in different through holes respectively.

[0042] Specifically, when there are two active annular gears and two driven arc gears, first, Figure 4 (a) shows a solder ball slot 10 storing a plurality of solder balls 30. When the solder balls 30 in the solder ball slot enter different through holes, the solder balls 30 will directly fall into the holes as shown in FIG. Figure 4 The inner walls of the two driven arc gears 130 in the through hole shown in (b) of FIG. 1 are arranged such that the diameter of the ring formed by the upper ends of the two driven arc gears is larger than the diameter of the welding ball, and the diameter of the welding ball is larger than the diameter of the ring formed by the lower ends of the driven arc gears, so that the inner walls of the two driven arc gears 130 can support the fallen welding ball 30; then, the driving ring gear 120 drives the corresponding driven arc gear 130 to rotate downward until the driven arc gear 130 is rotated as shown in FIG. Figure 4 In the position shown in (c), at this time, the diameter of the circular ring formed by the upper ends of the two driven arc-shaped gears and the diameter of the circular ring formed by the lower ends of the two driven arc-shaped gears are respectively smaller than the diameter of the welding ball, thereby fixing the welding ball in the middle area surrounded by the inner walls of the two driven arc-shaped gears in the through hole, that is, fixed in the through hole of the welding ball picking and placing device.

[0043] The step of executing step S300, wherein the solder ball transmission structures in different through holes respectively transmit the solder balls fixed in the through holes so that the solder balls in the through holes respectively fall on the corresponding solder pad positions on the substrate, specifically includes:

[0044] At least two active ring gears in different through holes drive the corresponding driven arc gears to rotate until the welding ball falls out of the middle area surrounded by the inner walls of at least two driven arc gears and falls on the corresponding different welding pad positions on the substrate, thereby completing the ball planting.

[0045] Specifically, a solder ball picking and placing device with a solder ball fixed in a through hole is moved above the substrate, and the through hole position of the solder ball picking and placing device is aligned with the solder pad position on the substrate. When the solder ball picking and placing device has two active ring gears and two driven arc gears, the two active ring gears in different through holes drive the corresponding driven arc gears to rotate to the position as shown in FIG. Figure 4 At the position shown in (d), at this time, the diameter of the circular ring formed by the upper ends of the two driven arc-shaped gears is smaller than the diameter of the welding ball, and the diameter of the welding ball is smaller than the diameter of the circular ring formed by the lower ends of the driven arc-shaped gears, so that the welding ball falls out of the middle area surrounded by the inner walls of at least two driven arc-shaped gears and falls on the welding pad of the substrate, completing the ball planting.

[0046] Furthermore, in order to protect the welding balls from damage, the corners of the support structure and the welding ball transmission structure are rounded. In addition, the welding balls can be tin balls, and each pad surface is coated with flux. The tin balls fall and are placed on the pads coated with flux to complete the ball planting.

[0047] This embodiment reduces the number of molds in the ball planting process, eliminates the vacuum operation condition, and optimizes the ball planting operation.

[0048] Based on the same inventive concept, an embodiment of the present invention also provides a welding ball picking and placing device, including: a supporting structure, the supporting structure is provided with a plurality of through holes, a welding ball transmission structure is provided in the through holes, the welding ball transmission structure is used to transmit the welding balls inserted into the through holes so as to fix the inserted welding balls in the through holes, and then transmit the welding balls fixed in the through holes so as to make the welding balls in the through holes fall into designated positions respectively.

[0049] The welding ball transmission structure comprises at least two driving annular gears and corresponding at least two driven arc gears, the outer wall of the driving annular gear is evenly provided with main gear teeth, the outer wall of the driven arc gear facing the driving annular gear is evenly provided with secondary gear teeth, and the driven arc gear and the corresponding driving annular gear are movably connected through the secondary gear teeth meshing with the main gear teeth;

[0050] When the welding ball falls into the through hole, the welding ball falls on the inner walls of at least two driven arc gears in the through hole, and then the at least two active ring gears in the through hole respectively drive the corresponding driven arc gears to rotate, and the welding ball is fixed in the middle area surrounded by the inner walls of the at least two driven arc gears, and then the at least two active ring gears in the through hole drive the corresponding driven arc gears to rotate until the welding ball falls out of the middle area surrounded by the inner walls of the at least two driven arc gears and falls on the designated position.

[0051] When the welding ball falls on the inner wall of at least two driven arc gears in the through hole, the diameter of the ring formed by the upper ends of at least two driven arc gears is larger than the diameter of the welding ball, and the diameter of the welding ball is larger than the diameter of the ring formed by the lower ends of the driven arc gears; when the welding ball is fixed in the middle area surrounded by the inner walls of at least two driven arc gears, the diameter of the ring formed by the upper ends of at least two driven arc gears and the diameter of the ring formed by the lower ends of at least two driven arc gears are respectively smaller than the diameter of the welding ball; when the welding ball falls out of the middle area surrounded by the inner walls of at least two driven arc gears, the diameter of the ring formed by the upper ends of at least two driven arc gears is smaller than the diameter of the welding ball, and the diameter of the welding ball is smaller than the diameter of the ring formed by the lower ends of the driven arc gears.

[0052] The corners of the support structure and the solder ball transmission structure are both rounded and blunt, and the surface of each solder pad is coated with solder flux.

[0053] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A solder ball implantation method, characterized in that: The following steps are involved: A solder ball pick-up and placement device is provided, wherein the solder ball pick-up and placement device comprises a support structure, the support structure is provided with a plurality of through holes, a solder ball transmission structure is provided in the through holes, the solder ball transmission structure comprises at least two active annular gears and at least two corresponding driven arc gears, the outer wall of the active annular gear is evenly provided with main gear teeth, the outer wall of the driven arc gear facing the active annular gear is evenly provided with secondary gear teeth, the driven arc gear and the corresponding active annular gear are movably connected by meshing with the primary gear teeth through the secondary gear teeth, and the position of the through hole on the solder ball pick-up and placement device corresponds to the position of the solder pad for subsequent soldering of the solder pad on the substrate; Solder balls are placed in different through holes of the solder ball picking and placing device, and the solder ball transmission structures in the different through holes respectively transmit the placed solder balls so that the solder balls are fixed in the placed through holes. Specifically, when the solder balls fall into the through holes, the solder balls fall on the inner walls of at least two driven arc gears in the through holes, and then the at least two active ring gears in the through holes respectively drive the corresponding driven arc gears to rotate, so that the solder balls are fixed in the middle area surrounded by the inner walls of the at least two driven arc gears. The solder ball picking and placing device with the solder balls fixed in the through holes is moved above the substrate, and the solder ball transmission structures in different through holes respectively transmit the solder balls fixed in the through holes, and the at least two active ring gears in the through holes drive the corresponding driven arc gears to rotate until the solder balls fall out of the middle area surrounded by the inner walls of the at least two driven arc gears and fall on the corresponding solder pad position on the substrate, thereby completing the ball planting.

2. The solder ball implantation method according to claim 1, characterized in that: When the welding ball falls on the inner wall of at least two driven arc gears in the through hole, the diameter of the ring formed by the upper ends of at least two driven arc gears is larger than the diameter of the welding ball, and the diameter of the welding ball is larger than the diameter of the ring formed by the lower ends of the driven arc gears; when the welding ball is fixed in the middle area surrounded by the inner walls of at least two driven arc gears, the diameter of the ring formed by the upper ends of at least two driven arc gears and the diameter of the ring formed by the lower ends of at least two driven arc gears are respectively smaller than the diameter of the welding ball; when the welding ball falls out of the middle area surrounded by the inner walls of at least two driven arc gears, the diameter of the ring formed by the upper ends of at least two driven arc gears is smaller than the diameter of the welding ball, and the diameter of the welding ball is smaller than the diameter of the ring formed by the lower ends of the driven arc gears.

3. The solder ball implantation method according to claim 1, characterized in that: The steps of placing solder balls in different through holes of the solder ball picking and placing device, and the solder ball transmission structures in different through holes respectively transmitting the placed solder balls so that the solder balls are respectively fixed in the placed through holes specifically include: A welding ball slot for storing welding balls is provided, and the welding ball slot is moved above the welding ball picking and placing device, and a force is applied to the welding ball slot so that the welding balls in the welding ball slot fall into different through holes of the welding ball picking and placing device in sequence and fall on the welding ball transmission structure in the through holes, and then the welding ball transmission structures in different through holes respectively transmit the fallen welding balls so that the welding balls are respectively fixed in the through holes into which they fall.

4. The solder ball implantation method according to claim 3, characterized in that: A plurality of through holes are arranged in parallel, and the welding ball groove moves according to the arrangement direction of the plurality of through holes. When the hole of the welding ball groove moves above different through holes, a force is applied to the welding ball groove so that the welding balls in the welding ball groove fall into different through holes in sequence.

5. The solder ball implantation method according to claim 1, characterized in that: The corners of the support structure and the solder ball transmission structure are both rounded and blunt, and the surface of each solder pad is coated with solder flux.

6. A welding ball picking and placing device, characterized in that: include: A support structure, wherein the support structure is provided with a plurality of through holes, wherein a welding ball transmission structure is provided in each of the through holes, wherein the welding ball transmission structure comprises at least two active annular gears and at least two corresponding driven arc gears, wherein the outer wall of the active annular gear is evenly provided with main gear teeth, and the outer wall of the driven arc gear facing the active annular gear is evenly provided with secondary gear teeth, and the driven arc gear is movably connected with the corresponding active annular gear through the meshing of the secondary gear teeth with the main gear teeth; The welding ball transmission structure is used to transmit the welding ball placed in the through hole so as to fix the placed welding ball in the through hole. When the welding ball falls into the through hole, the welding ball falls on the inner wall of at least two driven arc gears in the through hole, and then the at least two active ring gears in the through hole respectively drive the corresponding driven arc gears to rotate, so as to fix the welding ball in the middle area surrounded by the inner wall of at least two driven arc gears. The welding ball fixed in the through hole is then transmitted, and the corresponding driven arc gear is driven by at least two active ring gears in the through hole to rotate until the welding ball falls out of the middle area surrounded by the inner walls of at least two driven arc gears and falls on the designated position.

7. The solder ball picking and placing device according to claim 6, characterized in that: When the welding ball falls on the inner wall of at least two driven arc gears in the through hole, the diameter of the ring formed by the upper ends of at least two driven arc gears is larger than the diameter of the welding ball, and the diameter of the welding ball is larger than the diameter of the ring formed by the lower ends of the driven arc gears; when the welding ball is fixed in the middle area surrounded by the inner walls of at least two driven arc gears, the diameter of the ring formed by the upper ends of at least two driven arc gears and the diameter of the ring formed by the lower ends of at least two driven arc gears are respectively smaller than the diameter of the welding ball; when the welding ball falls out of the middle area surrounded by the inner walls of at least two driven arc gears, the diameter of the ring formed by the upper ends of at least two driven arc gears is smaller than the diameter of the welding ball, and the diameter of the welding ball is smaller than the diameter of the ring formed by the lower ends of the driven arc gears.

8. The solder ball picking and placing device according to claim 6, characterized in that: The corners of the support structure and the solder ball transmission structure are both rounded and blunt, and the surface of each solder pad is coated with solder flux.

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