Substrate Processing Apparatus, Substrate Transfer System, Method of Manufacturing Semiconductor Device, and Recording Medium

Abstract

The present invention provides a substrate processing apparatus, which includes: a plurality of placement units for placing a substrate container; a driving unit for driving the placement units; a transfer mechanism that performs loading of the substrate container onto the placement units and unloading of the substrate container from the placement units; and a control unit that controls the driving unit and the transfer mechanism such that the support portion of the transfer mechanism is lifted and lowered without the support portion of the transfer mechanism moving from the initial position, thereby transferring the substrate container from the placement unit to the support portion of the transfer mechanism or transferring the substrate container from the support portion of the transfer mechanism to the placement unit.

Description

[0001] This application is a divisional application of Chinese Patent Application No. 201580084838.6 (PCT Application No. PCT / JP2015 / 083408) with the filing date of November 27, 2015 and the invention title of "Substrate Processing Apparatus". Technical Field

[0002] The present invention relates to a substrate processing apparatus. Background Art

[0003] Generally, in a semiconductor manufacturing apparatus (which is a type of substrate processing apparatus), in order to improve the operation efficiency, a substrate container (hereinafter, also referred to as a FOUP: Front Opening Unified Pod) that houses substrates (hereinafter, also referred to as wafers) for the next substrate processing is prepared in the apparatus in advance.

[0004] For example, according to Patent Document 1, a configuration is disclosed in which a plurality of FOUPs can be placed on a FOUP rotary rack and the number of FOUPs stored can be adjusted. Patent Document 1 also discloses the following: Accordingly, by increasing or decreasing the number of storage containers, it is possible to cope with an increase in the number of substrates to be processed per batch. According to Patent Document 2, a configuration is disclosed in which an upper I / O stage corresponding to a top plate box transfer AGV, a lower I / O stage corresponding to a manual or floor-mounted AGV, and a virtual (dammy) cassette shelf or a monitoring cassette shelf located between the upper and lower two I / O stages are provided. In addition, according to Patent Document 3, a configuration is disclosed in which a storage unit for storing FOUPs is provided above a processing furnace.

[0005] Here, since the apparatus width is at least 1100 mm according to the Semi standard, in order to increase the number of FOUPs stored without increasing the floor area (footprint), the FOUPs are arranged above the apparatus. However, considering the Fab height during apparatus transportation, the Road Traffic Law, and the transportation height limit of airplanes, there are height limits for the apparatus and divided heights, and the apparatus height cannot be increased infinitely.

[0006] In addition, for the case of increasing the number of substrates processed in a delivered apparatus, it is necessary to add a buffer shelf to the upper part of the apparatus and replace the robot transfer unit, so the modification becomes difficult. There is no description of such modification and conversion in the above-mentioned prior art documents.

[0007] Prior Art Documents

[0008] Patent Documents

[0009] Patent Document 1: Japanese Patent Laid-Open No. 2000-216212

[0010] Patent Document 2: Japanese Patent Laid-Open No. 2000-091398

[0011] Patent Document 3: Japanese Patent Laid-Open No. 2009-010009 Summary of the Invention

[0012] Problems to be Solved by the Invention

[0013] An object of the present invention is to provide a configuration that can cope with a change in the number of processed substrate carriers that require apparatus modification.

[0014] Means for Solving the Problems

[0015] According to one aspect of the present invention, there is provided a configuration including: a plurality of mounting portions for mounting a substrate carrier; a driving portion for driving the mounting portions; a transfer mechanism for loading the substrate carrier onto the mounting portions and unloading the substrate carrier from the mounting portions; and a control portion for controlling the driving portion and the transfer mechanism so that the support portion of the transfer mechanism is lifted and lowered without moving the support portion of the transfer mechanism from an initial position, and the substrate carrier is transferred between the mounting portions and the support portion of the transfer mechanism.

[0016] The present invention also provides the following technical solutions:

[0017] (1) A substrate processing apparatus including:

[0018] a plurality of mounting portions for mounting a substrate carrier; a driving portion for driving the mounting portions; a transfer mechanism for loading the substrate carrier onto the mounting portions and unloading the substrate carrier from the mounting portions; and a control portion for controlling the driving portion and the transfer mechanism so that the support portion of the transfer mechanism is lifted and lowered without moving the support portion of the transfer mechanism from an initial position, and the substrate carrier is transferred between the mounting portions and the support portion of the transfer mechanism.

[0019] (2) In the substrate processing apparatus according to (1) above, it is configured such that: a movable rack for storing the substrate carrier is provided above a movable area of a carriage loader including the transfer mechanism, and the mounting portions of the movable rack are driven in the vertical direction to transfer the substrate carrier with respect to the transfer mechanism.

[0020] (3) In the substrate processing apparatus described in (1) above, it is configured such that a movable rack for accommodating the substrate container is provided between the first unit and the second unit, and the placement portion of the movable rack is driven in the horizontal direction to effect the transfer of the substrate container with respect to the transfer mechanism.

[0021] (4) In the substrate processing apparatus described in (2) or (3) above, a first protrusion for supporting the substrate container at a plurality of points is provided on the placement portion of the movable rack, and a second protrusion for supporting the substrate container at a plurality of points is provided on the support portion of the transfer mechanism.

[0022] (5) In the substrate processing apparatus described in (2) or (3) above, the notch portion of the movable rack is configured such that when the transfer mechanism lifts (retrieves) the substrate container or lowers the substrate container to the placement portion, the support portion of the transfer mechanism and the placement portion of the movable rack do not interfere with each other.

[0023] (6) In the substrate processing apparatus described in (5) above, the cross-sectional area of the notch portion is configured to be larger than the cross-sectional area of the support portion of the transfer mechanism.

[0024] (7) In the substrate processing apparatus described in (1) above, the control unit is configured to control the transfer mechanism and the placement portion such that the placement portion of the transfer mechanism and the placement portion of the movable rack are respectively moved to the transfer position for transfer and the standby position for reception.

[0025] (8) In the substrate processing apparatus described in (1) above, the control unit is configured to execute the following sequence. In this sequence, while moving the transfer mechanism to the standby position for reception, the movable rack is moved to the transfer position for transfer, the transfer mechanism is moved downward or upward with respect to the transfer position, the substrate container is retrieved from the movable rack or transferred to the movable rack, the transfer mechanism is moved to the transfer avoidance position, and the movable rack returns to its original position.

[0026] (9) A substrate processing apparatus, wherein a housing is partitioned into a processing area and a transfer area for transferring the substrate container, and in the transfer area, there are provided: a loading port for the substrate container to enter and exit; a rotary storage rack for storing the substrate container; a carriage loader located between the loading port and the rotary storage rack; a movable rack provided at a position directly above the carriage loader; and a drive unit for driving the placement portion of the movable rack in the vertical direction.

[0027] Further, the substrate processing apparatus has a control unit that controls the drive unit and the carriage loader in such a manner that the substrate container is transferred between the movable rack and the carriage loader without operating the support portion of the carriage loader.

[0028] (10) A substrate processing apparatus, wherein a housing is partitioned into a processing area and a transfer area for transferring a substrate container, and in the transfer area, there are provided: a loading port for the substrate container to enter and exit; a rotary storage rack for storing the substrate container; a carriage loader located between the loading port and the rotary storage rack; a movable rack provided between the loading ports; and a drive unit for driving the placement portion of the movable rack in the horizontal direction.

[0029] Further, the substrate processing apparatus has a control unit that controls the drive unit and the carriage loader in such a manner that the substrate container is transferred between the movable rack and the carriage loader without operating the placement portion of the carriage loader.

[0030] (11) In the substrate processing apparatus according to the above (9) or (10), the control unit is configured to control in such a manner that: while moving the carriage loader to a standby position for transfer, moving the movable rack to a transferable transfer position, moving the carriage loader below or above the transfer position, receiving the substrate container from the movable rack or transferring the substrate container to the movable rack, and moving the carriage loader to a transfer avoidance position.

[0031] Advantages of the Invention

[0032] According to the present invention, it is possible to reduce the burden during apparatus modification accompanying a change in the number of processed product substrates. Description of the Drawings

[0033] Figure 1 is a top view of a substrate processing apparatus applicable to an embodiment of the present invention.

[0034] Figure 2 is Figure 1 a vertical sectional view taken along line A-A of

[0035] Figure 3 is a vertical sectional view of a heat treatment furnace suitable for use in a substrate processing apparatus to which the present invention can be applied.

[0036] Figure 4 is a block diagram showing the configuration of a controller suitable for use in a substrate processing apparatus to which the present invention can be applied.

[0037] Figure 5 ​​​​​A block diagram showing the configuration of a sub-controller suitable for use in a substrate processing apparatus to which the present invention can be applied.

[0038] Figure 6 A flowchart showing a substrate processing process to which the present invention can be applied.

[0039] Figure 7 A comparative example of a transfer sequence executed by a sub-controller suitable for use in a substrate processing apparatus to which the present invention can be applied.

[0040] Figure 8A An example diagram of a lifting and transfer sequence executed by a sub-controller suitable for use in a substrate processing apparatus to which the present invention can be applied.

[0041] Figure 8B An example diagram of a horizontal slide transfer sequence executed by a sub-controller suitable for use in a substrate processing apparatus to which the present invention can be applied.

[0042] Figure 8C For explaining Figure 8A 、 Figure 8B An example diagram showing the details of the transfer of a common pod.

[0043] Figure 9 An example of a flowchart of a transfer sequence suitable for use in the present embodiment.

[0044] Figure 10 A diagram showing a front view and a vertical cross-sectional view of a substrate processing apparatus suitable for use in the present embodiment. Detailed Description of the Invention

[0045] (1) Configuration of the Substrate Processing Apparatus

[0046] Hereinafter, the embodiments will be described with reference to the drawings. However, in the following description, the same reference numerals are given to the same components, and repeated descriptions may sometimes be omitted. It should be noted that, for the sake of clarity, in the drawings, the widths, thicknesses, shapes, etc. of each part are sometimes shown schematically compared with the actual solution, but this is only an example and does not limit the interpretation of the present invention.

[0047] For the substrate processing apparatus according to the embodiment using the heater according to the embodiment, use Figures 1 to 3 ​​​​​​​This will be described. In this specification, when the term "wafer" is used, it includes: the case where it means "the wafer itself", the case where it means "a laminate (aggregate) of the wafer and a specified layer, film, etc. formed on its surface", that is, the case where a specified layer, film, etc. is formed on the surface and it is called a wafer. In addition, in this specification, when the term "the surface of the wafer" is used, it includes: the case where it means "the surface (exposed surface) of the wafer itself", the case where it means "the surface of a specified layer, film, etc. formed on the wafer, that is, the outermost surface of the wafer as a laminate".

[0048] Therefore, in the specification, when it is described that "a specified gas is supplied to the wafer", it includes: the case where it means "a specified gas is supplied to the surface (exposed surface) of the wafer itself", the case where it means "a specified gas is supplied to a layer, film, etc. formed on the wafer, that is, the outermost surface of the wafer as a laminate". In addition, in this specification, when it is described that "a specified layer (or film) is formed on the wafer", it includes: the case where it means "a specified layer (or film) is formed on the surface (exposed surface) of the wafer itself", the case where it means "a specified layer (or film) is formed on a layer, film, etc. formed on the wafer, that is, on the outermost surface of the wafer as a laminate". In addition, in this specification, when the term "substrate" is used, it has the same meaning as when the term "wafer" is used.

[0049] Hereinafter, with reference to the drawings, a substrate processing apparatus according to an embodiment of the present invention will be described. As an example, the substrate processing apparatus in this embodiment is configured as a semiconductor manufacturing apparatus that performs a processing step in a manufacturing method of a semiconductor device (IC: Integrated Circuit). It should be noted that in the following description, as the substrate processing apparatus, the case of a batch-type vertical semiconductor manufacturing apparatus (hereinafter, simply referred to as the processing apparatus) that applies oxidation, diffusion treatment, CVD treatment, etc. to the substrate will be described.

[0050] As Figure 1 and 2As shown, the processing device 100 of the present invention includes a housing 111. Herein, the processing device 100 of the present invention uses a FOUP (substrate container, hereinafter also referred to as a cassette) 110, and the FOUP 110 serves as a wafer carrier for accommodating wafers (substrates) 200 formed of silicon or the like. In the front portion directly in front of the front wall 111a of the housing 111, a front maintenance port 103, which is an opening provided for maintenance, is formed, and front maintenance doors 104, 104 for opening and closing the front maintenance port 103 are respectively constructed. On the front wall of the housing 111, a cassette loading / unloading port (substrate container loading / unloading port) 112 is formed so as to communicate the inside and outside of the housing 111, and the cassette loading / unloading port 112 is configured to be opened and closed by a front gate (substrate container loading / unloading port opening / closing mechanism) 113. On the front side directly in front of the cassette loading / unloading port 112, loading ports (substrate container transfer tables) 114 are respectively provided on the upper side and the lower side, and the loading ports 114 are configured to place the cassette 110 and align it. The cassette 110 is carried into the loading ports 114 by an in-process transfer device (OHT and AGV), and is configured to be carried out from the loading ports 114. It should be noted that the loading ports 114 may also be configured as placement portions in the present application. Hereinafter, the upper loading port, which is an OHT table (first table), may be denoted as 114a, and the lower loading port, which is an AGV table (second table), may be denoted as 114b.

[0051] At the upper part of the substantially central portion in the front-rear direction within the housing 111, a rotary cassette rack (substrate container mounting rack) 105 serving as a rotary storage rack is provided, and the rotary cassette rack 105 is configured to store a plurality of cassettes 110. That is, the rotary cassette rack 105 includes: a column 116 that is vertically erected and intermittently rotates in a horizontal plane; and a plurality of shelf plates (substrate container mounting tables) 117 that are radially supported on the column 116 at respective positions on four upper and lower levels, and the plurality of shelf plates 117 are configured to hold the cassette 110 in a state where the cassette 110 is respectively placed at a plurality of positions. Between the loading port 114 and the rotary cassette rack 105 within the housing 111, a cassette transfer device (substrate container transfer device) 118 serving as a carrier loader is provided. The cassette transfer device 118 is composed of a cassette elevator (substrate container lifting mechanism) 118a serving as a lifting portion, and a cassette transfer mechanism (substrate container transfer mechanism) 118b serving as a transfer mechanism. The cassette elevator 118a can lift and lower while holding the cassette 110 at a support portion, and the cassette transfer mechanism 118b includes the support portion for placing the cassette 110 thereon, and an arm serving as a telescopic portion that moves the support portion by expansion and contraction. The cassette transfer device 118 is configured to transfer the cassette 110 between the loading port 114, the rotary cassette rack 105, and a cassette opener (substrate container lid opening and closing mechanism) 121 by the continuous operation of the cassette elevator 118a and the cassette transfer mechanism 118b. In addition, since cassette presence sensors are respectively provided on the loading port 114, the rotary cassette rack 105, and the cassette opener (substrate container lid opening and closing mechanism) 121, the cassette 110 can be transferred efficiently. It should be noted that operation units (movable racks described later) are appropriately provided in spaces A and B. In the present embodiment, an extra shelf 131 serving as a movable rack and a sub shelf 132 serving as a movable rack are respectively provided. Movable mounting portions 131a and 132a are provided on these extra shelf 131 and sub shelf 132, and cassette presence sensors are installed.

[0052] At the lower part of the substantially central portion in the front-rear direction within the housing 111, a subcase body 119 is constructed over the rear end. On the front wall 119a of the subcase 119, a pair of wafer loading / unloading ports (substrate loading / unloading ports) 120 are provided in two vertically arranged layers for loading and unloading the wafer 200 with respect to the inside of the subcase 119. A pair of cassette openers 121, 121 are respectively provided on the upper and lower layer wafer loading / unloading ports 120, 120. The cassette opener 121 includes a mounting table 122, 122 serving as a mounting portion for mounting the cassette 110 and a cap mounting / dismounting mechanism (cover body mounting / dismounting mechanism) 123, 123 for mounting and dismounting the cap (cover body) of the cassette 110. The cassette opener 121 is configured to open and close the wafer inlet / outlet of the cassette 110 by mounting and dismounting the cap of the cassette 110 mounted on the mounting table 122 through the cap mounting / dismounting mechanism 123.

[0053] The subcase 119 forms a transfer chamber 124, and the transfer chamber 124 is fluid-isolated from a transfer area 129 provided with a cassette transfer device 118, a rotary cassette rack 105, etc. A wafer transfer mechanism (substrate transfer mechanism) 125 is provided in the front side area of the transfer chamber 124. The wafer transfer mechanism 125 is composed of a wafer transfer device (substrate transfer device) 125a capable of rotating and linearly moving the wafer 200 in the horizontal direction and a wafer transfer device elevator (substrate transfer device lifting mechanism) 125b for lifting the wafer transfer device 125a. By the continuous operation of the wafer transfer device elevator 125b and the wafer transfer device 125a, the tweezers (substrate holder) 125c of the wafer transfer device 125a is configured as a holding portion for the wafer 200, and the wafer 200 is filled (charging) and taken out (discharging) with respect to the susceptor (substrate holder) 217.

[0054] At Figure 1 At the right end of the transfer chamber 124 shown, which is the side opposite to the wafer transfer device elevator 125b side, a cleaning unit 134 composed of a supply fan and a dust filter is provided to supply a purified atmosphere or a cleaning gas 133 as an inert gas. The cleaning gas 133 blown out from the cleaning unit 134 flows through the wafer transfer device 125a and is then sucked through a duct (not shown) and exhausted to the outside of the housing 111, or is configured to circulate to the suction side (supply side) of the cleaning unit 134, and is blown out into the transfer chamber 124 again through the cleaning unit 134.

[0055] In the rear region of the transfer chamber 124, a housing (hereinafter referred to as a pressure-resistant housing) 140 is provided. The housing 140 has an airtight performance capable of maintaining a pressure lower than atmospheric pressure (hereinafter referred to as negative pressure). The load lock chamber 141 is formed by using the pressure-resistant housing 140. The load lock chamber 141 is a load lock type standby chamber having a volume capable of accommodating the susceptor 217. In the front wall 140a of the pressure-resistant housing 140, a wafer loading / unloading opening (substrate loading / unloading opening) 142 is provided, and the wafer loading / unloading opening 142 is configured to be opened and closed by a gate valve (substrate loading / unloading port opening / closing mechanism) 143. On a pair of side walls of the pressure-resistant housing 140, a gas supply pipe 144 for supplying nitrogen gas to the load lock chamber 141 and an exhaust pipe 145 for exhausting the load lock chamber 141 to negative pressure are respectively connected. Above the load lock chamber 141, a processing furnace 202 is provided. The lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace port gate valve (furnace port opening / closing mechanism) 147. A furnace port gate valve cover is installed at the upper end portion of the front wall 140a of the pressure-resistant housing 140, and the furnace port gate valve cover 149 accommodates the furnace port gate valve 147 when the lower end portion of the processing furnace 202 is opened.

[0056] As Figure 1 shown, a susceptor elevator (substrate holder lifting mechanism) 115 for lifting the susceptor 217 is provided on the pressure-resistant housing 140. A sealing cap 219 as a lid is horizontally installed on an arm 128 which is a connecting member connected to the susceptor elevator 115. The sealing cap 219 is configured to vertically support the susceptor 217 and be able to close the lower end portion of the processing furnace 202. The susceptor 217 includes a plurality of holding members and is configured to horizontally hold a plurality of (for example, about 50 to 125) wafers 200 in a state where their centers are aligned and arranged in the vertical direction.

[0057] Next, a general operation of the processing apparatus of the present invention will be described. As Figure 1 and Figure 2As shown, when the cassette 110 is supplied to the loading port 114, the cassette loading and unloading port 112 is opened by the front gate 113, and the cassette 110 on the loading port 114 is transferred from the cassette loading and unloading port 112 into the interior of the housing 111 by the cassette transfer device 118. The transferred cassette 110 is automatically transferred and delivered to a designated shelf 117 of the rotary cassette rack 105 by the cassette transfer device 118, and after being temporarily stored, it is transferred from the shelf 117 to a cassette opener 121 to be transferred to the mounting table 122, or directly transferred to the cassette opener 121 to be transferred to the mounting table 122. At this time, the wafer loading and unloading port 120 of the cassette opener 121 is closed by the cap mounting and dismounting mechanism 123, and the clean gas 133 flows into the transfer chamber 124 and is filled. For example, by filling the transfer chamber 124 with nitrogen gas as the cleaning gas 133 , the oxygen concentration is set to 20 ppm or less, which is much lower than the oxygen concentration inside the housing 111 (the air atmosphere).

[0058] The end face of the opening side of the cassette 110 placed on the mounting table 122 is pressed against the opening edge of the wafer transfer port 120 on the front wall 119a of the sub-shell 119, and the cap of the cassette 110 is removed by the cap mounting and dismounting mechanism 123, and the wafer access port of the cassette 110 is opened. In addition, when the wafer transfer port 142 of the load lock chamber 141, which is previously at atmospheric pressure, is opened by the action of the gate valve 143, the wafer 200 passes through the wafer access port from the cassette 110 and is picked up by the tweezers 125c of the wafer transfer device 125a, and after the wafers are integrated by the notch alignment device 301, they are transferred into the load lock chamber 141 through the wafer transfer port 142 and transferred and filled into the wafer boat 217 (wafer filling). The wafer transfer device 125a that has transferred the wafer 200 to the wafer boat 217 returns to the cassette 110, and fills the wafer boat 217 with the next wafer 200. The structure and operation of the wafer transfer device 125a will be described in detail later.

[0059] While one of the (upper or lower) crystal box openers 121 is filling the crystal boat 217 with the wafer 200 using the wafer transfer device 125a, the other crystal boxes 110 are transported from the rotary crystal box rack 105 and the loading port 114 to the other (lower or upper) crystal box opener 121 via the crystal box transport device 118, and the crystal box 110 is opened using the crystal box opener 121 at the same time.

[0060] When wafers 200 of a pre-specified number are loaded into the boat 217, the wafer loading / unloading opening 142 is closed by the gate valve 143, and the load lock chamber 141 is evacuated through the exhaust pipe 145 to reduce the pressure therein. When the pressure in the load lock chamber 141 is reduced to the same level as the pressure inside the processing furnace 202, the lower end of the processing furnace 202 is opened by the furnace port gate valve 147. At this time, the furnace port gate valve 147 is moved into the interior of the furnace port gate valve cover 149 and accommodated therein. Next, the seal cap 219 is raised by the boat elevator 115, and the boat 217 supported by the seal cap 219 is loaded (transferred) into the processing furnace 202.

[0061] After loading, any processing is performed on the wafers 200 by the processing furnace 202. After processing, the boat 217 is pulled out by the boat elevator 115. In addition, after the pressure inside the load lock chamber 141 is restored to atmospheric pressure, the gate valve 143 is opened. Thereafter, except for the wafer alignment process performed by the notch alignment device 135, the wafers 200 and the cassette 110 are taken out to the outside of the housing 111 by substantially the reverse steps of the above.

[0062] Next, based on the drawings, the processing furnace in the embodiment of the present invention will be described. As Figure 3 shown, the processing furnace 202 has a heater 206 as a heating mechanism. The heater 206 has a cylindrical shape and is vertically installed by being supported by a heater base 251 serving as a holding plate.

[0063] Inside the heater 206, a processing tube 203 serving as a reaction tube is arranged concentrically with the heater 206. The processing tube 203 is composed of an inner tube 204 serving as an internal reaction tube and an outer tube 205 serving as an external reaction tube provided outside thereof. The inner tube 204 is formed of a heat-resistant material such as quartz (SiO2) or silicon carbide (SiC), and is formed in a cylindrical shape with openings at both the upper and lower ends. A processing chamber 201 is formed in the hollow portion of the inner tube 204, and is configured to be able to accommodate wafers 200 serving as substrates in a state where multiple layers are arranged horizontally and vertically in the vertical direction by the boat 217 described later. The outer tube 205 is formed of a heat-resistant material such as quartz or silicon carbide, and is formed in a cylindrical shape with an inner diameter larger than the outer diameter of the inner tube 204, a closed upper end, and an open lower end, and is arranged concentrically with the inner tube 204.

[0064] Below the outer tube 205, a manifold 209 is arranged concentrically with the outer tube 205. The manifold 209 is formed of, for example, stainless steel or the like, and is formed in a cylindrical shape with openings at the upper and lower ends. The manifold 209 is arranged to engage with the inner tube 204 and the outer tube 205, thereby supporting the inner tube 204 and the outer tube 205. It should be noted that an O-ring 220a as a sealing member is provided between the manifold 209 and the outer tube 205. The manifold 209 is supported by the heater base 251, whereby the processing tube 203 is vertically installed. A reaction vessel is formed by the processing tube 203 and the manifold 209.

[0065] On the sealing cap 219 described later, a nozzle 230 as a gas introduction part is connected in communication with the inside of the processing chamber 201, and a gas supply pipe 232 is connected to the nozzle 230. On the upstream side, which is the side opposite to the connection side of the gas supply pipe 232 with the nozzle 230, a processing gas supply source and an inert gas supply source (not shown) are connected via an MFC (Mass Flow Controller) 241 as a gas flow controller. An electric connection is made between the MFC 241 and a gas flow control unit 235, and it is configured to control the flow rate of the supplied gas to a desired amount at a desired timing. Here, at least the nozzle 230, the gas supply pipe 232, and the MFC 241 constitute a gas supply system. Although not shown, respectively, the nozzle 230a, the gas supply pipe 232a, and the MFC 241a are defined as the processing gas system, the nozzle 230b, the gas supply pipe 232b, and the MFC 241b are defined as the reaction gas system, and the nozzle 230c, the gas supply pipe 232c, and the MFC 241c are defined as the purge gas (inert gas) system.

[0066] On the manifold 209, an exhaust pipe 231 for exhausting the atmosphere inside the processing chamber 201 is provided. The exhaust pipe 231 is arranged at the lower end of the cylindrical space 250 formed by the gap between the inner tube 204 and the outer tube 205, and is in communication with the cylindrical space 250. On the downstream side, which is the side opposite to the connection side of the exhaust pipe 231 with the manifold 209, a vacuum exhaust device 246 such as a vacuum pump is connected via a pressure sensor 245 as a pressure detector and an APC (Auto Pressure control) valve 242 as a pressure regulating device, and is configured to be able to perform vacuum exhaust so that the pressure inside the processing chamber 201 becomes a specified pressure (vacuum degree). An electric connection is made between the APC valve 242 and the pressure sensor 245 and a pressure control unit 236, and the pressure control unit 236 is configured to control the pressure inside the processing chamber 201 to a desired pressure at a desired timing based on the pressure detected by the pressure sensor 245 by means of the APC valve 242.

[0067] Below the manifold 209, a sealing cap 219 as a lid is provided to hermetically seal the lower end opening of the manifold 209. The sealing cap 219 is configured to abut against the lower end of the manifold 209 from the lower side in the vertical direction. The sealing cap 219 is formed of a metal such as stainless steel, for example, and is formed in a disk shape. On the upper surface of the sealing cap 219, an O-ring 220b as a sealing member that abuts against the lower end of the manifold 209 is provided. On the side of the sealing cap 219 opposite to the processing chamber 201, a rotation mechanism 254 for rotating the susceptor is provided. The rotation shaft 255 of the rotation mechanism 254 penetrates the sealing cap 219 and is connected to the susceptor 217 described later, and is configured to rotate the wafer 200 by rotating the susceptor 217. The sealing cap 219 is configured to be vertically movable by a susceptor elevator 115 as a lifting mechanism vertically provided outside the processing tube 203, whereby the susceptor 217 can be loaded into and unloaded from the processing chamber 201. The rotation mechanism 254 and the susceptor elevator 115 are electrically connected to a drive control unit 237, which is configured to control at a desired timing in a manner to perform a desired operation.

[0068] The susceptor 217 as a substrate holder is formed of a heat-resistant material such as quartz or silicon carbide, for example, and is configured to arrange and hold multiple wafers 200 in a horizontal posture and centered with each other in multiple layers. It should be noted that, below the susceptor 217, multiple heat shield plates 216 as heat insulating members in a circular plate shape formed of a heat-resistant material such as quartz or silicon carbide are arranged in a horizontal posture and in multiple layers, and are configured to make the heat from the heater 206 less likely to conduct to the manifold 209 side.

[0069] In the processing tube 203, a temperature sensor 263 as a temperature detector is provided. The heater 206 and the temperature sensor 263 are electrically connected to a temperature control unit 238, which is configured to adjust the power supply to the heater 206 based on the temperature information detected by the temperature sensor 263, and thus control at a desired timing in a manner to make the temperature in the processing chamber 201 a desired temperature distribution.

[0070] Sub-controllers such as a gas flow rate control unit 235, a pressure control unit 236, a drive control unit 237, and a temperature control unit 238, together with an operation unit and an input / output unit (not shown), are electrically connected to a main control unit 239 that controls the entire substrate processing apparatus. These gas flow rate control unit 235, pressure control unit 236, drive control unit 237, temperature control unit 238, and main control unit 239 are configured as a controller 240.

[0071] (Controller)

[0072] For the controller as a control unit, use Figure 4 andFigure 5 will be described.

[0073] A controller 240 including a main control unit 239 is connected to a heater 206, an MFC 241, valves, an APC valve 242, a vacuum pump 246, a susceptor rotation mechanism 267, a susceptor elevator 115, etc., and controls the gas flow control unit 235, the pressure control unit 236, the drive control unit 237, and the temperature control unit 238 in such a way as to adjust the temperature of the heater 206, adjust the flow rate of the MFC 241, control the opening and closing actions of the valves and the APC valve 242, start and stop the vacuum pump 246, adjust the rotation speed of the susceptor rotation mechanism 267, and control the lifting action of the susceptor elevator 115.

[0074] The main control unit 239 is configured as a computer having a CPU (Central Processing Unit) 239a, a RAM (Random Access Memory) 239b, a storage device 239c, and an I / O port 239d. The RAM 239b, the storage device 239c, and the I / O port 239d are configured to be able to exchange data with the CPU 239a via an internal bus 239e. An input / output device 322 configured in the form of, for example, a touch panel is connected to the main control unit 239.

[0075] The storage device 239c is composed of, for example, a flash memory, an HDD (Hard Disk Drive), etc. In the storage device 239c, a control program for controlling the operation of the substrate processing apparatus, a transfer sequence describing the transfer steps between the cassette transfer device 118 and the movable racks 131 and 132 described later, a process recipe describing the steps and conditions of substrate processing, etc. are stored in a readable manner. The transfer sequence and the process recipe are combined in such a way that the controller 240 executes each step in the substrate processing process described later, so as to obtain a specified result, and function as a program. Hereinafter, the process recipe, the control program, etc. will be collectively and simply referred to as a program. When using the term "program" in this specification, it sometimes refers to a case where only the process recipe is included alone, sometimes refers to a case where only the control program is included alone, or includes both cases. In addition, the RAM 239b is configured as a memory area (working area) for temporarily storing programs, data, etc. read by the CPU 239a.

[0076] The I / O port 239d is also connected to transfer mechanisms such as the cassette transfer device 118, the wafer transfer mechanism 125, and the susceptor elevator 115 via the drive control unit 237.

[0077] The CPU 239a is configured to read and execute a control program from the storage device 239c, and read a process according to the input of an operation instruction from the input / output device 322, etc. from the storage device 239c. The CPU 239a is configured to control the transfer operation of the cassette transfer device 118, the operations of the respective placement parts 117, 131a, 132a, etc. of the cassette 110, the transfer operation of the wafer transfer mechanism 125, the lifting operation of the cassette elevator 115, etc. according to the content of the read process.

[0078] The controller 240 is not limited to being configured as a dedicated computer, and may also be configured as a general-purpose computer. For example, an external storage device (for example, magnetic tape, floppy disk or hard disk, etc. disk, CD, DVD, etc. optical disk, MO, etc. optical disk, USB memory (USB Flash Drive), semiconductor memory such as a memory card) 323 storing the above program can be prepared, and the program can be installed on a general-purpose computer using this external storage device 323, etc., thereby constituting the controller 240 of the present embodiment. However, the means for supplying the program to the computer is not limited to the case of supplying via the external storage device 323. For example, communication means such as the Internet and dedicated lines can also be used to supply the program without passing through the external storage device 323. The storage device 239c and the external storage device 323 are configured as computer-readable recording media. Hereinafter, they will also be collectively referred to simply as recording media. In this specification, for the case of using the term recording medium, it includes: the case of including only the storage device 239c alone, the case of including only the external storage device 323 alone, or the case of including both of them.

[0079] Figure 5 It is an example diagram of a functional block for controlling each transfer mechanism by the drive control unit 237 which is one of the sub-controllers. As Figure 5 shown, the drive control unit 237 is configured to control each transfer mechanism including the cassette transfer device 118, the cassette elevator 115, the wafer transfer mechanism 125, the rotary cassette rack 105, the movable rack 131, etc. described later. In addition, it is also configured to acquire data from sensors equipped in each transfer mechanism. In the present embodiment, since the sub-controller 237 as the drive control unit has the same configuration as the controller 240, the description thereof is omitted.

[0080] When the loading port 114 places the cassette 110 transferred from outside the device, a signal is transmitted to the drive control unit 237 by the cassette presence / absence sensor. In addition, the drive control unit 237 is configured to drive the cassette transfer device 118, and transfer the cassette 110 to any one of the rotary cassette rack 105 which is an operation unit, the movable racks 131 and 132 described later according to the type of the wafer 200 stored in the cassette 110.

[0081] In addition, the drive control unit 237 is configured to execute the following transfer sequence, which transfers the FOUP 110 between the rotary FOUP stand 105 and the FOUP transfer device 118. Thus, the rotary FOUP stand 105 is configured to rotate the placement unit 117 by means of the drive control unit 237, thereby transferring the FOUP transfer device 118 and the FOUP 110.

[0082] As Figure 7 shown, in step 100 (S100), the drive control unit 237 moves the FOUP transfer device 118 to the FOUP reception position and rotates the placement unit 117 of the rotary FOUP stand 105 to move it to the transfer FOUP position.

[0083] In step 200 (S200), the drive control unit 237 moves the arm of the FOUP transfer device 118 so that the support portion supporting the wafer 200 moves below the transfer FOUP position. In addition, in step 300 (S300), the drive control unit 237 raises the FOUP transfer mechanism 118, thereby transferring the FOUP 110 from the placement unit 117 of the rotary FOUP stand 105 to the support portion of the FOUP transfer device 118.

[0084] Then, in step 400 (S400), the drive control unit 237 moves the arm of the FOUP transfer mechanism 118 to the original position. The FOUP transfer device 118 is moved to the FOUP transfer destination and the rotary FOUP stand 105 is rotated, so that the next FOUP 110 is moved to the transfer FOUP position. The drive control unit 237 is configured to repeatedly execute the sequence from step 100 to step 400 until the wafers 200 in the FOUP 110 of the rotary FOUP stand 105 of a specified number are transferred.

[0085] In addition, the drive control unit 237 is configured to respectively execute the following transfer sequence, which transfers the FOUP 110 between the movable stands 131 and 132 as operation units and the FOUP transfer device 108.

[0086] Figure 9 The figure showing the transfer sequence executed by the drive control unit 237 in the present embodiment is a sequence for transferring the FOUP 110 between the FOUP transfer device 118 and the movable stands 131 and 132 (placement units 131a and 132a). Figure 9 The transfer sequence shown in is a sequence for transferring the FOUP 110 from the movable stands 131 and 132 to the FOUP transfer device 118.

[0087] Aspects different from the conventional transfer sequence, such as Figure 7The crystal cassette transfer device 118 shown is different from the rotary crystal cassette rack in the following aspect: Instead of moving the arm of the crystal cassette transfer device 118, the placement parts 131a, 132a of the movable racks 131, 132 are moved to the handover position of the crystal cassette 110.

[0088] Figure 9 The transfer sequence shown has the following processes: Process (S1), moving the crystal cassette transfer device 118 to the reception position and moving the movable racks 131, 132 (placement parts 131a, 132a) to the handover position; Process (S2), moving the crystal cassette transfer device 118 from the reception position to the position before handover (the position below the placement parts 131a, 132a); Process (S3), the crystal cassette transfer device 118 ascending from the position before handover to the position after handover (the position above the placement parts 131a, 132a); Process (S4), moving the crystal cassette transfer device 118 from the position after handover to the handover avoidance position; and Process (S5), moving the movable racks 131, 132 (placement parts 131a, 132a) back to the original position from the handover position.

[0089] Here, the sequence of handing over the crystal cassette 110 from the crystal cassette transfer device 118 to the movable racks 131, 132 is the reverse of Figure 9 the transfer sequence shown. That is, only regarding the movement of the crystal cassette transfer device 118, it moves to the handover avoidance position (S1), the position after handover (S2), the position before handover (S3), and the reception position (S4) respectively.

[0090] On the other hand, when handing over the crystal cassette 110 from the crystal cassette transfer device 118 to the movable racks 131, 132, the movement of the movable racks 131, 132 (placement parts 131a, 132a) is still the same as Figure 9 the transfer sequence shown.

[0091] As described above, the drive control unit 237 controls in the following manner: The crystal cassettes 110 placed on the rotary crystal cassette rack 105 and the movable racks 131, 132, or the crystal cassettes 110 placed on the load ports 114 are respectively transported to the crystal cassette opener 121 and transferred to the placement table 122. Moreover, the drive control unit 237 is configured to respectively control the wafer transfer mechanism 125 and the susceptor elevator 115, fill the wafers 200 into the susceptor 217, and transport the susceptor 217 into the processing furnace 202. After performing a prescribed process on the wafers 200, the drive control unit 237 is configured to perform the reverse transport actions as described above to store the processed wafers 200 in the crystal cassettes 110.

[0092] (2) Substrate processing process

[0093] An overview of a substrate processing step for processing a substrate using a substrate processing apparatus 100, which is a semiconductor manufacturing apparatus, will be described. The above substrate processing step is, for example, one step for manufacturing a semiconductor device. It should be noted that in the following description, the operations and processes of each part constituting the substrate processing apparatus 100 are controlled by a controller 240.

[0094] Here, an example will be described in which a film is formed on a wafer 200 by alternately supplying a first processing gas (source gas) and a second processing gas (reaction gas) to the wafer 200 as a substrate. Hereinafter, an example will be described in which hexachloroethyldisilane (Si 2 Cl 6 , abbreviated as: HCDS) gas is used as the source gas and NH 3 (ammonia) is used as the reaction gas to form a SiN (silicon nitride) film as a thin film on the wafer 200. It should be noted that, for example, a predetermined film may be previously formed on the wafer 200, and a predetermined pattern may be previously formed on the wafer 200 or the predetermined film.

[0095] For the substrate processing step, Figure 6 will be described.

[0096] (Substrate loading step S102)

[0097] First, the wafer 200 is loaded into the susceptor 217 and transferred into the processing chamber 201, thereby performing the substrate loading step S102.

[0098] (Film formation step S104)

[0099] Next, a film formation step S104 for forming a thin film on the surface of the wafer 200 is performed. The film formation step sequentially performs the following four steps. It should be noted that between steps 1 to 4, the wafer 200 is preheated to a predetermined temperature by a heater 206.

[0100] [Step 1]

[0101] In step 1, Si 2 Cl 6 gas flows in. First, the valve provided in the Si 2 Cl 6 gas supply pipe 232a and the APC valve 243 provided in the exhaust duct 231 are both opened, and the Si 2 Cl 6 gas whose flow rate has been adjusted by the MFC241a is introduced into the nozzle 230a, supplied into the processing chamber 201, and exhausted from the exhaust duct 231 at the same time. At this time, the pressure in the processing chamber 201 is maintained at a predetermined pressure. As a result, a silicon thin film is formed on the surface of the wafer 200.

[0102] [Step 2]

[0103] In Step 2, close the valve of the Si 2 Cl 6 gas supply pipe 232a to stop the supply of Si 2 Cl 6 gas. Keep the APC valve 243 of the exhaust pipe 231 open, evacuate the processing chamber 201 using the vacuum pump 246, and remove the residual gas from the processing chamber 201.

[0104] [Step 3]

[0105] In Step 3, flow in NH 3 gas. Open both the valve of the NH 3 gas supply pipe 232b and the APC valve 243 of the exhaust pipe 231, and supply the NH 3 gas whose flow rate has been adjusted by the MFC241b from the nozzle 230b into the processing chamber 201. At the same time, exhaust from the exhaust pipe 231. In addition, adjust the pressure in the processing chamber 201 to a specified pressure. Through the supply of NH 3 gas, the silicon thin film formed on the surface of the wafer 200 by the Si 2 Cl 6 gas undergoes a surface reaction with the NH 3 gas, thereby forming a SiN film on the wafer 200.

[0106] [Step 4]

[0107] In Step 4, purge the inside of the processing chamber 201 again with an inert gas. Close the valve of the NH 3 gas supply pipe 232b to stop the supply of NH 3 gas. Keep the APC valve 243 of the exhaust pipe 231 open, evacuate the processing chamber 201 using the vacuum pump 246, and remove the residual gas from the processing chamber 201.

[0108] Take the above Steps 1 to 4 as one cycle, and repeat this cycle multiple times to form a SiN film with a specified film thickness on the wafer 200.

[0109] (Substrate unloading process S106)

[0110] Next, take out the boat 217 carrying the wafer 200 on which the SiN film has been formed from the processing chamber 201.

[0111] Example

[0112] The operations associated with the modification in the substrate processing apparatus 100 suitable for use in the present embodiment will be described using examples.

[0113] In the prior art ( Figure 2 substrate processing apparatus 100), the rotary cassette rack 105 has 4 FOUPs per layer and 4 layers, so 4 FOUPs × 4 = 16 FOUPs.

[0114] Regarding the space B in the figure, according to the Semi standard, the lower loading port 114b (which serves as an AGV station) and the upper loading port 114a (which serves as an OHT station) have configuration height limits and operation safety area ensuring limits. When the cassette transfer device 118 performs the handover operation of the cassette 110 on the AGV station 114b and the OHT station 114a, only one layer of buffer racks can be set between the AGV station 114b and the OHT station 114a.

[0115] Therefore, since there are 1 FOUP × 2 = 2 FOUPs of sub - racks set between the OHT station 114a and the lower loading port 114b (space B) which serves as the AGV station 114b, a total of 18 FOUPs can be accommodated in the apparatus. In the existing specifications, when the number of product substrates is 125, it can cope.

[0116] To cope with the specification change related to the delivered substrate processing apparatus 100 to 150 - sheet processing (currently up to 125 sheets), the number of FOUPs required for 2 batches (accommodating 25 sheets) needs the following total of 22 FOUPs: For production: 6 FOUPs × 2 batches; For virtual wafer filling (for filling dummy, for supplementing production wafer loss): 6 FOUPs; For side dummy (for heat preservation of the upper and lower sides of the production wafer): 1 FOUP × 2 batches; For monitoring (for inspecting production wafers): 1 FOUP × 2 batches. That is, 4 additional FOUPs are required.

[0117] When the rotary cassette rack 105 is changed from 4 layers to 5 layers, although the accommodation number of the cassette 110 as FOUP can be ensured, the up - and - down transfer stroke of the cassette transfer device 118 also needs to be extended.

[0118] When the stroke of the cassette elevator 118a is extended due to the five - layer arrangement of the rotary rack 5, it is necessary to remove this unit (the cassette transfer device 118) from the housing 111, transport it in a horizontally placed state, reassemble it on - site, and make adjustments. In this way, when adding a buffer rack to the already - delivered substrate processing device 100 due to the five - layer arrangement of the rotary cassette rack 105, replacement of the cassette transfer device 118 is also required, which will lead to a major modification. In addition, if the number of cassettes 110 corresponding to one layer provided on the rotary cassette rack 105 is made five, the height of the cassette transfer device 118 can be maintained. Therefore, it is expected to reduce the burden of on - site reassembly and readjustment. However, when the number of layers of the rotary cassette rack 105 is increased from four to five, it is necessary to make the width of the main body frame larger than the current situation, and it is difficult to carry out the modification on - site.

[0119] Therefore, the burden of design operations associated with the above - mentioned modification, as well as the burden of reassembly and readjustment at the customer's factory (on - site), are important issues for the specification changes associated with the modification.

[0120] The inventors of the present application, in order to solve the above - mentioned problems, found that by improving the transfer sequence and unitizing the movable rack, the modification burden can be reduced.

[0121] First, the transfer sequence is improved from the conventional one to the transfer sequence in the present embodiment ( Figure 9 ). That is, the improvement is made as follows: The transfer of the cassette 110 between the movable racks 131, 132 and the cassette transfer device 118 applies the transfer sequence shown in Figure 9 . The driving part is used to make the placing parts 131a, 132a act, thereby performing the handover of the cassette 110 between the movable racks 131, 132 and the cassette transfer device 108. For example, the movable rack 131 as an additional rack is configured such that the placing part 131a is driven in the vertical direction by the drive control part 237, and the movable rack 132 as a sub - rack is configured such that the placing part 132a is driven in the horizontal direction by the drive control part 237.

[0122] Using Figure 8A , Figure 8B , Figure 8C , the following situation is described: applying the improved transfer sequence to the handover of the cassette 110 between each of the movable racks 131, 132 and the cassette transfer device 108. Here, Figure 8A is an example diagram related to the following transfer, in which the cassette 110 placed on the placing part 131a of the movable rack 131 as an additional rack is placed on the supporting part of the cassette transfer device 118, Figure 8A The S201 - S205 shown respectively correspond to S1 - S5 shown in Figure 9 .

[0123] As Figure 8A shown, in step 201 (S201), the drive control unit 237 moves the cassette transfer device 118 to the reception standby position, and controls the drive unit to lower the placement unit 131a of the movable frame 131 and move it to the transfer position.

[0124] In step 202 (S202), the drive control unit 237 moves from the reception standby position to a position below the placement unit 131a of the movable frame 131 (pre-transfer position) while keeping the support unit of the cassette transfer device 118 at the initial position without extending or retracting the arm of the cassette transfer device 118. Then, in step 203 (S203), the drive control unit 237 loads the cassette 110 from the placement unit 131a onto the support unit of the cassette transfer device 118, and raises the cassette transfer device 118 from the pre-transfer position and moves it to the post-transfer position while continuing to keep the support unit of the cassette transfer device 118 at the initial position.

[0125] In step 204 (S204), the drive control unit 237 moves the cassette transfer device 118 from the post-transfer position to the transfer avoidance position. Finally, in step 205 (S205), the drive control unit 237 operates the drive unit to return the placement unit 131a from the transfer position to the original position. By performing the above operations, the cassette transfer between the movable frame 131 and the cassette transfer device 118 is performed. Thereafter, the cassette transfer device 118 is moved to the position of the transfer destination of the cassette 110.

[0126] At this time, the support unit of the cassette transfer device 118 has not moved from the initial position (no arm extension or retraction operation) and is fixed. That is, by lowering the placement unit 131a and moving the placement unit 131a within the movable area of the cassette transfer device 118, the cassette 110 can be transferred even without operating the support unit of the cassette transfer device 118.

[0127] As described above, when adding the movable frame 131 as an operation unit to perform the cassette transfer between it and the cassette transfer device 118, since it is not necessary to consider the arm operation of the cassette transfer device 118 and the movable area of the cassette transfer device does not need to be changed, it is expected to shorten the time consumed for startup.

[0128] Figure 8B For an example diagram of the following transfer, in this transfer, the cassette 110 placed on the placement unit 132a of the movable frame 132 as a sub-frame is placed on the support unit of the cassette transfer device 118. Figure 8B S301 to S305 shown respectively correspond to Figure 9 S1 to S5 shown.

[0129] Figure 8B The upper figure is a plan view of the transfer process showing the transfer of the cassette 110 between the cassette transfer device 118 and the movable stage 132 as viewed from directly above. Figure 8B The lower figure is a sectional view of the process showing the transfer of the cassette 110 between the cassette transfer device 118 and the movable stage 132 as viewed from the side. In addition, in the case of the plan view, the cassette 110 is shown transparently to clarify the positional relationship between the cassette transfer mechanism 118b and the placement portion 312a.

[0130] In step 301 (S301), the drive control unit 237 moves the cassette transfer device 118 to the FOUP reception position and slides the placement portion 132a of the movable stage 132 from the original position to the transfer position.

[0131] In step 302 (S302), the drive control unit 237 moves the support portion of the cassette transfer device 118 to a position directly below the placement portion 132a of the movable stage 132 (pre-transfer position) without moving the arm of the cassette transfer device 118. Then, in step 303 (S303), the drive control unit 237 raises the cassette transfer device 118 in such a manner that the cassette 110 is placed on the support portion of the cassette transfer device 118 from the placement portion 132a, thereby moving it to the post-transfer position. At this time, due to the notch portion 132b being provided, the support portion of the cassette transfer device 118 can place the cassette 110 on the support portion of the cassette transfer device 118 without contact with the placement portion 132a.

[0132] In step 304 (S304), the drive control unit 237 moves the cassette transfer device 118 carrying the cassette 110 from the post-transfer position to the transfer avoidance position. Finally, in step 205 (S205), the drive control unit 237 operates the drive unit to return the placement portion 132a from the transfer position to the original position. By performing the above operations, the cassette transfer between the movable stage 132 and the cassette transfer device 118 is performed, and thereafter, the cassette transfer device 118 is moved to the position of the transfer destination of the cassette 110.

[0133] At this time, the support portion of the cassette transfer device 118 has not moved from the initial position (no telescopic movement of the arm) and is fixed. Therefore, there is no need to ensure an area for the movement of the arm of the cassette transfer device 118 between the first unit 114a and the second unit 114b.

[0134] In addition, Figure 8C shows a plan view (hereinafter, simply referred to as Figure C) of the following situation as viewed from above, which is Figure 8A in step 202 ( Figure 8BIn step 302), without moving the arm of the cassette transfer device 118, the drive control unit 237 moves the cassette transfer device 118 to a position (pre-handover position) below the movable frames 131 and 132. Here, in Figure C, the cassette 110 is omitted to clarify the positional relationship between the placement portions 131a and 132a and the cassette transfer mechanism 118b.

[0135] As Figure 8C shown, in the next step (step 203 or step 303), the cassette transfer mechanism 118b with the arm held at the initial position is configured not to interfere with the placement portions 131a and 132a of the movable frames 131 and 132. That is, the notch (space) portions 131b and 132b of the placement portions 131a and 132a are configured to be larger than not only the support portion of the cassette transfer device 118 but also the cassette transfer mechanism 118b. In addition, in Figure C, the first protrusion of the placement portions 131a and 132a and the second protrusion provided on the support portion of the cassette transfer mechanism 118b are set to be in substantially the same position. This is to stably perform the handover of the cassette 110 between the movable frame 131 and the cassette transfer device 118 by making the portions supporting the cassette 110 the same.

[0136] In addition, as Figure 8C shown, not only for the placement portions 131a and 132a of the L-side movable frames 131 and 132, but also for the placement portions 131a and 132a of the R-side movable frames 131 and 132, in step 202 (step 302), when the drive control unit 237 moves the cassette transfer device 118 to a position below the movable frames 131 and 132 without moving the arm of the cassette transfer device 118, it can be seen that in the next step (step 203 or step 303), the cassette transfer mechanism 118b with the arm held at the initial position is configured not to interfere with the placement portions 131a and 132a of the movable frames 131 and 132. Therefore, although the reception standby position, pre-handover position, post-handover position, and handover avoidance position are respectively left-right symmetric, for the R-side movable frame, the same transfer as that Figure 8A and Figure 8B shown can also be achieved. That is, on the L side and the R side, the handover of the cassette 110 can be achieved without changing the orientation of the cassette transfer mechanism 118b. Therefore, even when the movable frames 131 and 132 are added, since the transfer sequence can still be made common, the setting operations related to the cassette transfer device 118 can be suppressed.

[0137] ( Figure 2 space A in

[0138] In this embodiment, the following modification is made: the above-mentioned Figure 9The transfer sequence shown is applied to the transfer sequence of the cassette 110 between the movable rack (additional rack) 131 and the cassette transfer device 118.

[0139] Specifically, a movable rack 131 as an additional rack is provided above the area (space A) where the cassette transfer device 118 transfers the cassette 110. Regarding the transfer operation of the cassette 110 between the movable rack 131 and the cassette transfer device 118, it is improved to Figure 8A the lifting transfer sequence shown, in which the placement part 131a of the additional rack 131 can perform a lifting operation on the cassette transfer device 118 side.

[0140] Thereby, the movement of the arm of the cassette transfer mechanism 118b toward the additional rack 131 is not required. In addition, as Figure 8C shown, by making the notch part 131b of the placement part 131a larger than the cassette transfer mechanism 118b, it is possible to achieve the transfer of the cassette 110 between the placement part 131a of the additional rack 131 and the support part of the cassette transfer device 118 while keeping the arm in the initial position without movement.

[0141] In addition, since the placement part 131a of the movable rack 131 is configured to move within the operation range of the existing cassette transfer device 118, by making a small modification such as adding the additional rack 131 to the delivered substrate processing device 100, it is possible to cope with the change in increasing the storage number of cassettes 110. That is, two additional racks 131 are arranged on the L side and the R side, so it is possible to add two buffer racks while using the existing substrate processing device 100 ( Figure 2 ).

[0142] ( Figure 2 space B in

[0143] Next, in the present embodiment, the following modification is made: the transfer sequence shown above is applied to the transfer sequence of the cassette 110 between the movable rack (sub-rack) 132 and the cassette transfer device 118. Figure 9 Specifically, between the first OHT stage 114a and the second AGV stage 114b (space B), a movable rack 132 as a sub-rack is provided, and it is improved to

[0144] the horizontal sliding transfer sequence shown, in which the sub-rack 132 can perform a sliding operation on the cassette transfer device 118 side. Thereby, the movement of the arm of the cassette transfer mechanism 118b toward the sub-rack 132 is not required. Figure 8B

[0145] ​In addition, with the above improvements, it is not necessary to move the arm of the cassette transfer mechanism 118b into the operation area of the second unit 114b specified by the Semi standard. In addition, there is no need to consider the intrusion space of the arm, and the sub-frame 132 can be arranged compactly up and down. As a result, two layers of movable frames 132 can be arranged between the first unit 114a and the second unit 114b.

[0146] Therefore, although at most two buffer racks could be arranged between the first unit 114a and the second unit 114b heretofore, by applying the transfer sequence of the present embodiment to the transfer of the cassette 110 between the cassette transfer device 118 and the sub-frame 132, two layers of sub-frames 132 can be arranged. Since two sub-frames 132 are arranged on the L side and the R side, as a result, four buffer racks can be arranged.

[0147] Figure 10 The schematic diagram of the substrate processing apparatus 100 after being modified from the 125-sheet specification to the 150-sheet specification according to the present embodiment is shown. As described above, from Figure 2 (The substrate processing apparatus 100 before modification), two additional racks 131 and four sub-frames 132 are added.

[0148] The additional rack 131 and the sub-frame 132 are each unitized, and the others have the same configuration as the Figure 2 substrate processing apparatus 100 before modification shown. Therefore, compared with the substrate processing apparatus 100 before modification, the floor area is the same.

[0149] In addition, when the cassette transfer device 118 approaches (accesses) the cassette 110 at the uppermost part of the rotary cassette rack 105, the additional rack 131 serving as the upper buffer rack is driven and controlled by the drive control unit 237 so as to move to the lowered position only at the time of the handover of the cassette 110 at the raised avoidance position ( Figure 8B the original position described therein).

[0150] In addition, two additional racks 131 are arranged on the L side and the R side, and are driven and controlled by the drive control unit 237 so that while one approaches, the other maintains the upper avoidance position (the original position). Similarly, two sub-frames 132 are also arranged on the L side and the R side, and are driven and controlled by the drive control unit 237 so that while one approaches, the other maintains the upper avoidance position (the original position). In addition, when there is no transfer with the cassette transfer device 118, the placement portion 132a of the sub-frame 132 remains at the original position as the initial position.

[0151] Therefore, the additional rack 131 and the sub-rack 132 can be added without interfering with the transfer of the cassette 110 between the loading port 114, the rotary cassette rack 105, and the cassette opener 121. In addition, since the movable racks 131 and 132 form independent motion units for each rack, the degree of freedom in the combination of the number of buffer racks for storing the cassette 110 can be ensured.

[0152] In addition, even when the additional rack 131 and the sub-rack 132 are additionally provided, regarding the transfer of the cassette 110 between each of the additional rack 131 and the sub-rack 132 and the cassette transfer device 118, since the cassette 110 can be transferred without operating the arm of the cassette transfer mechanism 118b while keeping the arm in the initial position, compared with the conventional transfer sequence in which the arm is operated, the shortening of the teaching work can be achieved.

[0153] Regarding the teaching work for implementing the transfer sequence of the present embodiment, for the cassette transfer device 118, only the teaching related to the four aspects of the transfer avoidance position, the pre-transfer position, the post-transfer position, and the transfer standby position is required, and for the movable racks 131 and 132, only the teaching related to the two aspects of the transfer position and the original position (initial position) (where the original position is not required) is required. Therefore, compared with the Figure 7 conventional transfer sequence shown in the comparative example, the time for the teaching work can be shortened.

[0154] In contrast, in the conventional transfer sequence, as shown in the Figure 7 comparative example, not only the movement of the arm of the cassette transfer device 118 should be considered, but also the area for performing the transfer needs to be ensured.

[0155] In particular, in this embodiment, for the additional rack 131, since the movement of the arm of the cassette transfer device 118 must be considered for teaching, the teaching is not easy. Moreover, it is difficult to ensure the area for performing the cassette transfer. In this case, it will lead to large-scale modifications accompanied by design changes, and therefore, a great deal of time and cost are required.

[0156] On the other hand, in the present embodiment, by improving the transfer sequence, the motion units other than the movable racks 131 and 132 can be made common with the existing substrate processing device 100. Therefore, the housing 111, the loading port 114, the cassette transfer device 118, and the rotary cassette rack 105 can be kept as they are, and thus can be made common with the delivered substrate processing device 100 as they are. In particular, since the moving stroke of the cassette elevator 118a of the cassette transfer device 118 does not need to be changed, it is not necessary to remove the cassette elevator 118a during the device transportation and transport it separately, so the on-site startup period can be shortened.

[0157] In the present embodiment, the additional rack 131 and the sub-rack 132 need to be newly designed respectively. In addition, software measures for executing the transfer sequence of the present embodiment are required. However, in other words, only the modifications required for adding the additional rack 131 and the sub-rack 132, and the time and cost required for the modifications need to be considered. As described above, according to the present embodiment, it is possible to add the movable racks 131 and 132 by making a small-scale modification to the delivered substrate processing apparatus 100.

[0158] Therefore, it is possible to control within the limit of the modification associated with the addition and removal of the movable racks 131 and 132 described above. Therefore, even if the number of cassettes 110 accommodated in the substrate processing apparatus 100 increases or decreases, the man-hours and cost required for the modification can be suppressed to a low level.

[0159] In addition, in the present embodiment, the addition of the operation unit is described, but it is also applicable to the removal of the operation unit.

[0160] In addition, according to the present embodiment, operation units other than the movable racks can be made common with the existing substrate processing apparatus, and thus the burden of reassembly and readjustment at the customer's factory (site) can be significantly reduced.

[0161] It should be noted that in the present embodiment, an example in which the movable rack drives the placement unit in the vertical direction or the horizontal direction is described, but it is not limited to the above solution. Any solution that can move the cassette 110 to the movable area of the cassette transfer apparatus 118 by driving the placement unit is acceptable. That is, the following configuration is sufficient, in which the placement unit can be moved to a position where the cassette 110 can be handed over without extending the arm of the cassette transfer mechanism 118b and while keeping it fixed at the initial position.

[0162] <Effect in the present embodiment>

[0163] According to the present embodiment, at least one or more of the following effects (a) to (f) can be achieved.

[0164] (a) According to the present embodiment, by using the improved transfer sequence for the handover of the cassette between the movable rack and the cassette transfer apparatus, operation units other than the movable rack can be made common with the existing substrate processing apparatus. Therefore, it can be easily attached to the delivered apparatus and the modification cost can be reduced.

[0165] (b) According to the present embodiment, operation units other than the movable rack can be made common with the existing substrate processing apparatus. Therefore, not only can the modification cost be reduced, but also the burden of reassembly and readjustment at the customer's factory (site) can be significantly reduced.

[0166] (c) According to this embodiment, since it is not necessary to change the moving stroke of the cassette elevator 118a of the cassette transfer device 118, it is not necessary to remove the cassette elevator 118a during device transportation and transport it separately, so the on-site startup period can be shortened.

[0167] (d) According to this embodiment, the operation units other than the movable stage can be made common with the existing substrate processing device, so the operation burden of setting (starting up) before the transfer sequence of the movable stage and the cassette transfer device can be reduced, and the on-site startup period can be shortened.

[0168] (e) According to this embodiment, by adopting the transfer sequence of the movable stage and the cassette transfer device, the unitization of the movable stage can be easily performed, and the degree of freedom in combining the number of buffer stages for storing cassettes can be ensured.

[0169] (f) According to this embodiment, the movable stage can be formed into independent units for each stage, so the degree of freedom in combining the number of buffer stages for storing cassettes can be ensured. Thus, when changing the number of wafers 200 to be processed, even if there are changes associated with the modification, it is possible to expect a response within a short delivery time.

[0170] As described above, the embodiments and examples of the present invention have been specifically described, but the present invention is not limited to the above embodiments and examples, and various changes can be made without departing from the gist thereof.

[0171] For example, in the above embodiment, an example in which HCDS gas is used as the source gas has been described. However, the present invention is not limited to the above method. For example, as the source gas, silane (SiH 4 , abbreviation: MS) gas, disilane (Si 2 H 6 , abbreviation: DS) gas, trisilane (Si 3 H 8 , abbreviation: TS) gas and other inorganic silane source gases without halogen groups can be used. In addition, for example, as the source gas, in addition to HCDS gas, monochlorosilane (SiH 3 Cl, abbreviation: MCS) gas, dichlorosilane (SiH 2 Cl 2 , abbreviation: DCS) gas, trichlorosilane (SiHCl 3 , abbreviation: TCS) gas, tetrachlorosilane i.e. silicon tetrachloride (SiCl 4 , abbreviation: STC) gas, octachlorotrisilane (Si 3 Cl 8 , abbreviation: OCTS) gas and other inorganic halogenated silane source gases, tris(dimethylamino)silane (Si[N(CH3 ) 2 3 H, abbreviated as: 3DMAS) gas, tetra(dimethylamino)silane (Si[N(CH 3 ) 2 4 , abbreviated as: 4DMAS) gas, bis(diethylamino)silane (Si[N(C 2 H 5 ) 2 2 H 2 , abbreviated as: BDEAS) gas, bis(tert-butylamino)silane (SiH 2 [NH(C 4 H 9 )] 2 , abbreviated as: BTBAS) gas, etc., amino-based (amine-based) silane raw material gases without halogen groups.

[0172] In addition, for example, in the above embodiment, an example of using NH 3 gas as the reaction gas was described. However, the present invention is not limited to the above method. For example, as the reaction gas, in addition to NH 3 gas, diazene (N 2 H 2 ) gas, hydrazine (N 2 H 4 ) gas, N 3 H 8 gas and other hydrogen nitride-based gases, gases containing the above compounds, etc. can also be used. In addition, as the reaction gas, triethylamine ((C 2 H 5 ) 3 N, abbreviated as: TEA) gas, diethylamine ((C 2 H 5 ) 2 NH, abbreviated as: DEA) gas, monoethylamine (C 2 H 5 NH 2 , abbreviated as: MEA) gas and other ethylamine-based gases, trimethylamine ((CH 3 ) 3 N, abbreviated as: TMA) gas, dimethylamine ((CH 3 ) 2 NH, abbreviated as: DMA) gas, monomethylamine (CH 3 NH 2 , abbreviated as: MMA) gas and other methylamine-based gases, etc.

[0173] ​​​In addition, for example, in the above-described embodiment, an example of forming a silicon-containing film such as a SiN film has been described. However, the present invention is not limited to the above-described manner. For example, the present invention can be suitably used when forming a film containing metal elements such as titanium (Ti), zirconium (Zr), hafnium (Hf), tantalum (Ta), niobium (Nb), aluminum (Al), molybdenum (Mo), and tungsten (W), that is, a metal-based film, on the wafer 200.

[0174] That is, the present invention can be suitably applied to the case of forming a film containing specified elements such as semiconductor elements and metal elements.

[0175] In addition, in the above-described embodiment, an example of depositing a film on the wafer 200 has been described. However, the present invention is not limited to the above-described manner. For example, the present invention can be suitably used when performing processes such as oxidation treatment, diffusion treatment, annealing treatment, and etching treatment on the film formed on the wafer 200.

[0176] In addition, in the embodiment, a vertical substrate processing apparatus for batch processing has been described, but it is not limited thereto, and it can also be applied to a horizontal substrate processing apparatus for batch processing.

[0177] In addition, it is not limited to semiconductor manufacturing apparatuses such as the substrate processing apparatus according to the present embodiment that process semiconductor wafers, and it can also be applied to LCD (Liquid Crystal Display) manufacturing apparatuses that process glass substrates.

[0178] <Preferred Embodiments of the Present Invention>

[0179] Hereinafter, preferred embodiments of the present invention will be appended.

[0180] (Appended Note 1) According to one aspect of the present invention, there is provided a substrate processing apparatus including: a plurality of mounting portions on which a substrate storage container (wafer cassette) is mounted; a driving portion that drives the mounting portions; a cassette transfer device (loader), which includes a transfer mechanism that transfers the cassette into the mounting portions and out of the mounting portions; and a control portion that controls the driving portion and the loader so that the support portion of the transfer mechanism is lifted and lowered without moving the arm of the loader from the initial position, thereby transferring the cassette from the mounting portions to the support portion of the loader.

[0181] (Appended Note 2) In the substrate processing apparatus of Appended Note 1, preferably, a movable rack (additional rack) for storing the cassette is provided above the movable region of the loader, and the control portion is configured to transfer the cassette relative to the loader by lifting and lowering (driving in the vertical direction or sliding up and down) the mounting portions of the rack.

[0182] (Supplementary Note 3) For the substrate processing apparatus of Supplementary Note 1 or Supplementary Note 2, preferably, a movable rack (sub-rack) for accommodating the above cassette is provided between the first stage (OHT stage) and the second stage (AGV stage), and the control unit is configured to transfer the above cassette with respect to the above cassette loader by horizontally moving (driving in the horizontal direction, or horizontally sliding) the placement portion of the above movable rack.

[0183] (Supplementary Note 4) For the substrate processing apparatus of Supplementary Note 2 or Supplementary Note 3, preferably, a first protrusion for supporting the above cassette at multiple points is provided on the placement portion of the above movable rack, and a second protrusion for supporting the above cassette at multiple points is provided on the above support portion of the above cassette loader.

[0184] (Supplementary Note 5) For the substrate processing apparatus of Supplementary Note 2 or Supplementary Note 3, preferably, the notch portion of the above movable rack is configured such that when the above cassette loader lifts (retrieves) the above cassette or lowers the above cassette to the above placement portion, the support portion of the above cassette loader and the placement portion of the above movable rack do not interfere with each other.

[0185] (Supplementary Note 6) For the substrate processing apparatus of Supplementary Note 5, preferably, the cross-sectional area of the above notch portion is configured to be larger than the cross-sectional area of the above transfer mechanism (support portion) of the above cassette loader and larger than the cross-sectional area of the placement portion of the above movable rack.

[0186] (Supplementary Note 7) For the substrate processing apparatus of Supplementary Note 1, preferably, the control unit is configured to control the above cassette loader and the above placement portion so that the placement portion and the support portion of the above cassette loader respectively move to the transferable position and the reception standby position.

[0187] (Supplementary Note 8) For the substrate processing apparatus of Supplementary Note 7, preferably, the control unit controls in such a manner as to execute the following sequence: in this sequence, while moving the above cassette loader to the reception standby position, moving the above movable rack to the transferable transfer position, moving the above cassette loader above or below the above transfer position, retrieving the above cassette from the above movable rack or transferring the above cassette to the above movable rack, and moving the above cassette loader to the transfer avoidance position.

[0188] (Supplementary Note 9) According to another aspect of the present invention, there is provided a substrate processing apparatus, wherein a housing is partitioned into a processing area and a storage area for storing cassettes. In the above storage area, there are respectively provided: a loading / unloading stage (I / O stage) for the above cassettes to enter and exit; a rotary storage rack for storing the above cassettes; a carriage loader located between the above I / O stage and the rotary storage rack; a rack provided at a position directly above the carriage loader; a driving unit for driving the placement part of the rack in the vertical direction; and a control unit that controls the above driving unit and the above carriage loader so as to perform the handover of the above cassettes between the above rack and the above carriage loader without operating the placement part of the above carriage loader.

[0189] (Supplementary Note 10) According to yet another aspect of the present invention, there is provided a substrate processing apparatus, wherein a housing is partitioned into a processing area and a storage area for storing cassettes. In the above storage area, there are respectively provided: an I / O stage for the above cassettes to enter and exit; a rotary storage rack for storing the above cassettes; a carriage loader located between the above I / O stage and the above rotary storage rack; a movable rack provided between the above I / O stages; a driving unit for driving the placement part of the rack in the horizontal direction; and a control unit that controls the above driving unit and the above carriage loader so as to perform the handover of the above cassettes between the above movable rack and the above carriage loader without operating the support part of the above carriage loader.

[0190] (Supplementary Note 11) In the substrate processing apparatus according to Supplementary Note 9 or Supplementary Note 10, preferably, the control unit is configured to control in the following manner: while moving the above carriage loader to the reception standby position, moving the above movable rack to the handover position where handover is possible, moving the support part of the above carriage loader above or below the handover position, receiving the above cassette from the above movable rack, and returning the above carriage loader to the handover avoidance position.

[0191] (Supplementary Note 12) According to yet another aspect of the present invention, there is provided a cassette transfer method, which has the following steps: a step of moving a carriage loader to a reception standby position while moving a movable rack to a handover position where handover is possible; a step of moving the above carriage loader above or below the handover position without operating the support part of the above carriage loader from the initial position to receive the above cassette from the above movable rack or hand over the above cassette to the above movable rack; and a step of moving the above carriage loader to a handover avoidance position.

[0192] (Supplementary Note 13) According to another aspect of the present invention, there is provided a sequence (program) and a computer-readable recording medium recording the sequence (program). The above sequence (program) has the following steps: a step of moving the carriage loader to the reception position while moving the movable frame to the transfer position where transfer is possible; a step of moving the carriage loader above or below the transfer position without moving the support portion of the carriage loader from the initial position, and receiving the cassette from the movable frame or transferring the cassette to the movable frame; and a step of returning the carriage loader and the movable frame to the transfer avoidance positions respectively.

[0193] (Supplementary Note 14) According to another aspect of the present invention, there is provided a substrate container transfer system, which includes: an operation unit (movable frame), the operation unit (movable frame) having a placement portion for placing a substrate container (cassette) and a drive portion for driving the placement portion; a cassette transfer device (carriage loader), which includes a transfer mechanism for carrying in the cassette to the placement portion and carrying out the cassette from the placement portion; and a control portion for controlling the drive portion and the carriage loader so that the transfer mechanism is lifted and lowered without moving the support portion of the carriage loader, thereby transferring the cassette from the placement portion to the support portion of the carriage loader or transferring the cassette from the support portion of the carriage loader to the placement portion.

[0194] (Supplementary Note 15) In the substrate container transfer system of Supplementary Note 14, preferably, the substrate container transfer system includes a sensor (cassette presence / absence sensor) for detecting whether the substrate container (cassette) exists on the placement portion, and the control portion is configured to control the drive portion in such a way as to omit driving of the placement portion not detected by the sensor.

[0195] (Supplementary Note 16) In the substrate container transfer system of Supplementary Note 14, preferably, the control portion is configured to control the drive portion in such a way as to move the placement portion from the original position to the transfer position where the cassette can be transferred.

[0196] (Supplementary Note 17) In the substrate container transfer system of Supplementary Note 14, preferably, the control portion is configured to control the carriage loader in the following manner: moving the carriage loader upward or downward without moving the support portion of the carriage loader, thereby placing the cassette on the placement portion or placing the cassette on the support portion of the carriage loader.

[0197] (Supplementary Note 18) For the substrate container transfer system of Supplementary Note 16, preferably, the control unit is configured to lift the carriage loader while keeping the support portion fixed at the initial position without extending or retracting the arm of the carriage loader.

[0198] (Supplementary Note 19) For the substrate container transfer system of Supplementary Note 14, preferably, a first protrusion for supporting the cassette at multiple points is provided on the placement portion, and a second protrusion for supporting the cassette at multiple points is provided on the support portion of the carriage loader.

[0199] (Supplementary Note 20) For the substrate container transfer system of Supplementary Note 14, preferably, the notch portion of the movable frame is configured such that when the carriage loader lifts (retrieves) the cassette or lowers the cassette to the placement portion, the support portion of the carriage loader does not interfere with the placement portion.

[0200] (Supplementary Note 21) For the substrate processing apparatus of Supplementary Note 20, preferably, the cross-sectional area of the notch portion is configured to be larger than the cross-sectional area of the transfer mechanism (support portion) of the carriage loader and larger than the cross-sectional area of the placement portion of the movable frame.

[0201] (Supplementary Note 22) According to another aspect of the present invention, there is provided an operation unit (movable frame) including: a placement portion for placing a substrate container (cassette); and a drive unit for driving the placement portion between the original position where the substrate container (cassette) is received and the transfer position where the substrate container (cassette) can be transferred. The original position is the position where the substrate container (cassette) is stored, and the operation unit is configured to move the placement portion from the original position to the transfer position where the cassette can be transferred when the cassette is loaded into the movable frame or unloaded from the movable frame.

[0202] (Supplementary Note 23) For the operation unit of Supplementary Note 19, preferably, it further includes a sensor (cassette presence / absence sensor) for detecting whether the substrate container (cassette) is placed at the original position, and the drive unit is configured to omit driving the placement portion that is not detected by the sensor.

[0203] (Supplementary Note 24) According to another aspect of the present invention, there is provided a cassette transfer device, which is the following cassette transfer device (carrier loader). The cassette transfer device (carrier loader) includes: a transfer mechanism that includes a support portion on which a substrate container (cassette) is placed, and performs loading of the above cassette into the above placement portion and unloading of the above cassette from the above placement portion; and a lifting portion (wafer elevator) that lifts and lowers the above transfer mechanism. The cassette transfer device is configured to lift and lower the support portion without operating the support portion of the carrier loader (while maintaining it fixed in the initial position), so as to transfer the above cassette from the above placement portion to the support portion of the carrier loader.

[0204] Industrial Applicability

[0205] Regarding the substrate processing device, it can be applied to the following substrate processing device, which has a configuration capable of coping with changes in the number of processed product substrates.

[0206] Explanation of Reference Numerals

[0207] 100... Substrate processing device 105... Rotary cassette rack (rotary storage rack) 114... Loading port 114a... OHT table (first table) 114b... AGV table (second table) 131... Movable rack (additional rack) 132... Movable rack (sub-rack) 200... Wafer 240... Controller.

Claims

1. A substrate processing device comprising: A transport mechanism including a support portion on which a substrate container is placed, a lifting portion for lifting and lowering the support portion, and a telescopic portion for moving the support portion by telescoping; A storage unit having a placement unit on which a substrate container is placed, and a driving unit that moves the placement unit to a lifting range of the support unit; as well as The control unit is configured to control the conveying mechanism and the storage unit so that the driving unit moves the placing unit of the storage unit to the lifting and lowering range of the supporting unit and the lifting unit lifts and lowers the supporting unit when the telescopic unit is in a retracted state.

2. The substrate processing apparatus according to claim 1, in, The control unit is configured to move the transport mechanism to an upper position or a lower position of the placement unit in the storage unit.

3. The substrate processing apparatus according to claim 1, in, The storage portion is provided outside a range of a lifting and lowering range of the support portion when the placement portion is in an original position.

4. The substrate processing apparatus according to claim 2 or 3, wherein the control unit drives the placement unit downward, thereby delivering the substrate container to the transfer mechanism in a state where the placement unit is fixed.

5. The substrate processing apparatus according to claim 1, in, The placing portion of the storage unit is provided with a first protrusion that supports the substrate container at a plurality of points, and the supporting portion of the transport mechanism is provided with a second protrusion that supports the substrate container at a plurality of points.

6. The substrate processing apparatus according to claim 1, in, The notch of the storage unit is configured so that when the transport mechanism lifts the substrate container via the support unit or when the transport mechanism lowers the substrate container from the support unit to the placement unit, the support unit of the transport mechanism and the placement unit of the storage unit do not interfere with each other.

7. The substrate processing apparatus according to claim 6, in, The cross-sectional area of ​​the notch portion is configured to be larger than the cross-sectional area of ​​the support portion of the conveying mechanism.

8. The substrate processing apparatus according to claim 6, in, The cross-sectional area of ​​the notch portion is configured to be larger than the cross-sectional area of ​​the placement portion of the storage portion.

9. The substrate processing apparatus according to claim 1, in, Furthermore, a sensor for detecting the presence or absence of the substrate container is provided in the placement section of the storage section.

10. The substrate processing apparatus according to claim 1, in, The control unit is configured to control the conveying mechanism and the placing unit so as to move the placing unit of the storage unit into a lifting range of the supporting unit of the conveying mechanism and to move the supporting unit of the conveying mechanism to a transferable position.

11. The substrate processing apparatus according to claim 1, in, The control unit is configured to execute the following sequence, in which the placement unit of the storage unit is moved to an exchange position for exchanging the substrate container, the transfer mechanism is moved below or above the exchange position, the substrate container is retrieved from the placement unit or the substrate container is exchanged to the placement unit, and the transfer mechanism is moved to an exchange avoidance position, and the placement unit is returned to its original position.

12. The substrate processing apparatus according to claim 1, wherein, the transfer mechanism is configured to exchange the substrate container with the storage unit while being held at the initial position of the telescopic unit.

13. The substrate processing apparatus according to claim 12, wherein, the transfer mechanism is configured to move up and down while being held at the initial position without the telescopic unit performing a telescopic operation.

14. The substrate processing apparatus according to claim 1, wherein, the control unit is configured to control in the following manner: move the placement unit to an exchangeable exchange position, move the transfer mechanism below or above the exchange position, retrieve the substrate container from the placement unit or exchange the substrate container to the placement unit, and move the transfer mechanism to an exchange avoidance position.

15. The substrate processing apparatus according to claim 1, further comprising a housing that is partitioned into a processing area for processing a substrate and a transfer area for transferring the substrate container, and the transfer mechanism is disposed in the transfer area.

16. The substrate processing apparatus according to claim 15, further comprising: a loading port for the substrate container to enter and exit, and a rotary storage unit for storing the substrate container, the transfer mechanism is configured such that at least one of the loading port and the rotary storage unit can exchange the substrate container with the transfer mechanism disposed in the transfer area between the loading port and the rotary storage unit.

17. The substrate processing apparatus according to claim 16, wherein, the transfer mechanism moves the support unit through the telescopic unit, thereby exchanging the substrate container between the support unit and the loading port or between the support unit and the rotary storage unit.

18. A substrate transfer system, comprising: a transfer mechanism having a support unit for placing a substrate container, a lifting unit for lifting and lowering the support unit, and a telescopic unit for moving the support unit by telescoping; a storage unit having a placement unit for placing a substrate container and a drive unit for moving the placement unit to the lifting range of the support unit; and a control unit configured to control the transfer mechanism and the storage unit to perform a process of moving the placement unit of the storage unit to the lifting range of the support unit by the drive unit and a process of lifting and lowering the support unit by the lifting unit while the telescopic unit is in a retracted state.

19. A method of manufacturing a semiconductor device, comprising a step of transferring a substrate container between a transfer mechanism and a storage unit, the transfer mechanism having a support unit on which the substrate container is placed, a lifting unit that lifts and lowers the support unit, and a telescopic unit that moves the support unit by expansion and contraction, the storage unit having a placement unit on which the substrate container is placed, and a drive unit that moves the placement unit into the lifting range of the support unit. In the method of manufacturing the semiconductor device, in the step of transferring the substrate container, a process of moving the placement unit of the storage unit into the lifting range of the support unit by the drive unit and a process of lifting and lowering the support unit by the lifting unit with the telescopic unit in a retracted state are performed.

20. A computer-readable recording medium recording a program executed by a substrate processing apparatus, the substrate processing apparatus including: a transfer mechanism having a support unit on which a substrate container is placed, a lifting unit that lifts and lowers the support unit, and a telescopic unit that moves the support unit by expansion and contraction; a storage unit having a placement unit on which the substrate container is placed and a drive unit that moves the placement unit into the lifting range of the support unit; and a control unit that controls the storage unit and the transfer mechanism. The control unit is caused to execute the following steps: a process of moving the placement unit of the storage unit into the lifting range of the support unit by the drive unit and a process of lifting and lowering the support unit by the lifting unit with the telescopic unit in a retracted state.

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