Microphone components and electronic devices

Abstract

The present invention relates to a microphone assembly and an electronic device. The microphone assembly includes: a substrate assembly, the substrate assembly being provided with a sound inlet hole; a housing connected to the substrate assembly, the housing and the substrate assembly defining a rear cavity; an acoustic-to-electric conversion device disposed within the rear cavity and defining a front cavity between the substrate assembly, the acoustic-to-electric conversion device including at least a diaphragm, the diaphragm separating the front cavity from the rear cavity; wherein an air bleed channel is provided on the housing and / or the substrate assembly, the air bleed channel connecting the rear cavity and the exterior of the housing. In the microphone assembly proposed by the present invention, air inside the rear cavity can be vented through the air bleed channel, or external air can flow into the rear cavity through the air bleed channel to balance the air pressure on both sides of the diaphragm, thereby reducing the probability of diaphragm damage and improving product reliability.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to a microphone assembly and an electronic device. Background Art

[0002] This section merely provides background information related to the present disclosure and is not necessarily prior art.

[0003] A microphone, also known as a mouthpiece or microphone, is an energy conversion device that converts sound signals into electrical signals. Both piezoelectric and condenser microphones feature a diaphragm. Piezoelectric microphones use sound signals to stimulate the diaphragm, causing it to vibrate, resulting in changes in pressure within the piezoelectric material and outputting a corresponding electrical signal. Condenser microphones utilize the principle of capacitance between conductors. Using an ultra-thin metal or gold-plated plastic film as the diaphragm, the diaphragm senses sound pressure, changing the static voltage between the conductors and directly converting it into an electrical signal.

[0004] Generally, a microphone has a front cavity for collecting sound waves. The microphone is also provided with a sound inlet hole connecting the front cavity and the outside, so that external sound waves can be transmitted through the sound inlet hole to the front cavity and collected by the sound-to-electric conversion device. To improve the sound pickup quality, existing equipment generally forms a closed back cavity between the housing and the substrate to accommodate the sound-to-electric conversion device to prevent interference from external electromagnetic waves. The diaphragm is arranged in the front cavity, and the front cavity and the back cavity are separated by the diaphragm, so that the diaphragm can respond to the sound waves entering the front cavity and generate vibrations. However, when used in the client, if it is subjected to high temperature heating or drop impact, the sound pressure on both sides of the diaphragm will change greatly in a short period of time, and the diaphragm is very likely to be damaged. Summary of the Invention

[0005] The present invention aims to at least address the technical problem of the diaphragm being easily damaged by the large variations in sound pressure on both sides of the diaphragm within a short period of time. This objective is achieved through the following technical solutions:

[0006] The first technical solution of the present invention provides a microphone assembly, which includes:

[0007] A substrate assembly, wherein the substrate assembly is provided with a sound inlet hole; a shell connected to the substrate assembly, the shell and the substrate assembly defining a rear cavity; an acoustic-to-electric conversion device, disposed in the rear cavity and defining a front cavity between the shell and the substrate assembly, the acoustic-to-electric conversion device comprising at least a diaphragm, the diaphragm separating the front cavity from the rear cavity; wherein an air leakage channel is provided on the shell and / or the substrate assembly, the air leakage channel connecting the rear cavity and the outside of the shell.

[0008] According to the microphone assembly proposed in the present invention, an air leakage channel connected to the back cavity is provided on the shell and / or the substrate assembly. When the external ambient temperature of the microphone assembly suddenly changes sharply or the microphone assembly falls, and the sound pressure on both sides of the diaphragm changes greatly due to external factors, the air inside the back cavity can be discharged through the air leakage channel or the external air can flow into the back cavity through the air leakage channel to balance the air pressure on both sides of the diaphragm, thereby reducing the probability of diaphragm damage and helping to improve product reliability.

[0009] In addition, the microphone assembly according to the present invention may also have the following additional technical features:

[0010] In some embodiments of the present invention, the microphone assembly further includes: a waterproof membrane, sealed to the substrate assembly, the waterproof membrane being used to seal the sound inlet hole.

[0011] In some embodiments of the present invention, the substrate assembly includes: the substrate assembly includes: a first substrate, the shell and the sound-to-electric conversion device are both connected to the first substrate; a second substrate, the second substrate is connected to the side of the first substrate away from the shell, and a accommodating cavity is formed between the first substrate and the second substrate; the sound inlet includes: a first sub-sound inlet, provided on the first substrate, the first sub-sound inlet is connected to the accommodating cavity; a second sub-sound inlet, provided on the second substrate, the second sub-sound inlet is connected to the accommodating cavity; wherein the waterproof membrane is provided in the accommodating cavity, and the waterproof membrane separates the first sub-sound inlet and the second sub-sound inlet.

[0012] In some embodiments of the present invention, the air leakage channel is provided in the substrate assembly, and the air leakage channel includes: a first air leakage hole, provided on the first substrate, and the first air leakage hole is connected to the rear cavity; a second air leakage hole, provided on the first substrate, and the second air leakage hole is connected to the outside; an air flow channel, provided on the second substrate, and the first air leakage hole is connected to the second air leakage hole through the air flow channel.

[0013] In some embodiments of the present invention, the first substrate includes a first side and a second side opposite to each other, the first air leakage hole is disposed near the first side, and the second air leakage hole is disposed near the second side.

[0014] In some embodiments of the present invention, at least a portion of the air flow channel is annular and spaced apart from an outer edge of the second substrate.

[0015] In some embodiments of the present invention, the microphone assembly further includes: a sealing connector, which is arranged around the outer edge of the waterproof membrane; the sealing connector is sealed to the first substrate or the second substrate, so that a gap is formed between the waterproof membrane and the first substrate and between the waterproof membrane and the second substrate.

[0016] In some embodiments of the present invention, the air leakage channel is provided on the housing; the microphone assembly further includes a dustproof filter, which is provided on the housing and covers the air leakage channel.

[0017] According to a second technical solution of the present invention, an electronic device is provided. The electronic device includes: the microphone assembly of the first technical solution; and a complete housing, wherein the microphone assembly is disposed in the complete housing.

[0018] The electronic device proposed according to the present invention not only has a waterproof function, but also when the sound pressure on both sides of the diaphragm changes greatly due to environmental factors, the air inside the rear cavity can be discharged through the air leakage channel or the external air can flow into the rear cavity through the air leakage channel to balance the air pressure on both sides of the diaphragm, thereby reducing the probability of diaphragm damage and helping to improve product reliability.

[0019] In some embodiments of the present invention, the microphone assembly is bonded to the inner wall of the entire housing, forming an annular sealing portion between the microphone assembly and the inner wall of the entire housing. The entire housing has a sound collecting cavity connected to the outside, and the second sub-sound inlet hole in the microphone assembly is connected to the sound collecting cavity. The sealing portion separates the second air leakage hole in the microphone assembly from the sound collecting cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. The same reference numerals are used throughout the accompanying drawings to denote the same components. In the accompanying drawings:

[0021] Figure 1 A schematic structural diagram of a microphone assembly according to an embodiment of the present invention is shown;

[0022] Figure 2 A schematic structural diagram of a microphone assembly according to an embodiment of the present invention is shown;

[0023] Figure 3 A schematic structural diagram of a microphone assembly according to an embodiment of the present invention is shown;

[0024] Figure 4A schematic structural diagram of a first substrate according to an embodiment of the present invention is shown;

[0025] Figure 5 Shown Figure 4 Cross-sectional view of the AA section;

[0026] Figure 6 shows a schematic structural diagram of a second substrate according to an embodiment of the present invention;

[0027] Figure 7 Shown Figure 6 Cross-sectional view of the middle BB part;

[0028] Figure 8 A schematic structural diagram of a first substrate according to an embodiment of the present invention is shown;

[0029] Figure 9 Shown Figure 8 Cross-sectional view of the CC section;

[0030] Figure 10 shows a schematic structural diagram of a second substrate according to an embodiment of the present invention;

[0031] Figure 11 Shown Figure 10 Cross-sectional view of the middle DD part;

[0032] Figure 12 shows a cross-sectional view of a second substrate according to one embodiment of the present invention;

[0033] Figure 13 A cross-sectional view of a second substrate according to one embodiment of the present invention is shown.

[0034] The reference numerals are as follows:

[0035] 10-substrate assembly, 11-first substrate, 111-first side, 112-second side, 12-second substrate, 13-sound inlet, 131-first sub-sound inlet, 132-second sub-sound inlet, 14-accommodation cavity;

[0036] 20-shell, 21-rear cavity;

[0037] 30-acoustic-electrical conversion device, 31-substrate, 32-diaphragm, 33-front cavity;

[0038] 40-air leakage channel, 41-first air leakage hole, 42-second air leakage hole, 43-air flow channel;

[0039] 51- waterproof membrane, 52- sealing connector, 53- dustproof filter;

[0040] 60-Signal processing device. DETAILED DESCRIPTION

[0041] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0042] It should be understood that the terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "comprise", "include", "contain" and "have" are inclusive and therefore specify the presence of stated features, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the specific order described or illustrated, unless the order of execution is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0043] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates otherwise, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0044] For ease of description, spatially relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figures, such as "inside," "outside," "inside," "outside," "below," "beneath," "above," and the like. Such spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is flipped, an element described as "below" or "below" another element or feature would then be oriented as "above" or "above" another element or feature. Thus, the example term "below" can include both above and below orientations. The device may be otherwise oriented (rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein are interpreted accordingly.

[0045] like Figure 1 and Figure 2As shown, according to an embodiment of the present invention, a microphone assembly is proposed, and the microphone assembly includes: a substrate assembly 10, a shell 20 and an acoustic-to-electric conversion device 30. Specifically, a sound inlet hole 13 is provided on the substrate assembly 10, which runs through two opposite sides thereof, so as to realize the sound collecting function of the microphone assembly, so that external sound waves can enter the space on the other side from one side of the substrate assembly 10 through the sound inlet hole 13. The shell 20 is connected to the substrate assembly 10. The shell 20 can be an integrally formed metal shell or a non-metallic shell coated with a metal material. The shell 20 is sealed and connected to the substrate assembly 10 at one end in the opening direction to form a closed rear cavity 21. The rear cavity 21 is used to accommodate the acoustic-to-electric conversion device 30. By arranging the acoustic-to-electric conversion device 30 in the rear cavity 21, the shell 20 can block external electromagnetic interference, thereby improving the sound pickup quality of the microphone assembly. The acoustic-to-electric conversion device 30 is arranged in the rear cavity 21 and defines a front cavity 33 between the substrate assembly 10. The acoustic-to-electric conversion device 30 includes at least a diaphragm 32, which separates the front cavity 33 from the rear cavity 21, so that the diaphragm 32 can vibrate in response to sound waves entering the front cavity 33 through the sound inlet 13. When the diaphragm 32 vibrates, the capacitance or voltage of the acoustic-to-electric conversion device 30 can change, and then the changed capacitance signal or voltage signal is processed to convert the sound wave into an electrical signal. It should be noted that the microphone assembly also includes an air leakage channel 40, which is arranged on the shell 20 or the substrate assembly 10, or the air leakage channel 40 is provided on both the shell 20 and the substrate assembly 10, so that the rear cavity 21 can be connected to the external space through the air leakage channel 40. When the external ambient temperature of the microphone assembly suddenly changes sharply or the microphone assembly falls, etc., the sound pressure on both sides of the diaphragm 32 changes greatly, the air inside the rear cavity 21 can be discharged through the air leakage channel 40 or the external air can flow into the rear cavity 21 through the air leakage channel 40 to balance the air pressure on both sides of the diaphragm 32, thereby reducing the probability of damage to the diaphragm 32, which is beneficial to improving the reliability of the product.

[0046] In an exemplary embodiment, an acoustic-to-electrical converter 30 includes a connected substrate 31 and a diaphragm assembly, which is used to convert sound waves into electrical signals. One side of the substrate 31 is connected to the base plate assembly 10. A front cavity 33 is formed on the substrate 31, connecting the sound inlet 13 and the rear cavity 21. The diaphragm assembly includes a diaphragm 32, which is connected to the side of the substrate 31 away from the base plate assembly 10. The diaphragm 32 separates the front cavity 33 from the rear cavity 21. When external sound waves enter the front cavity 33 through the sound inlet 13, the sound waves within the front cavity 33 disturb the diaphragm 32, causing it to vibrate. The diaphragm 32 senses the sound pressure, which can change the voltage of the diaphragm assembly, thereby generating an electrical signal.

[0047] In this embodiment, the substrate assembly 10 is a PCB board, on which circuits are printed to realize corresponding electrical functions, and can be selected and designed according to actual needs. The diaphragm assembly can be a piezoelectric diaphragm assembly or a capacitive diaphragm assembly, which is not specifically limited here. The shape of the shell 20 can be an inverted U-shaped bowl structure, a cube, a cylinder or a sphere, etc., which is not limited here. The shell 20 and the substrate assembly 10 can be connected by conductive glue or solder paste, which can realize electrical connection between the shell 20 and the substrate assembly 10, thereby forming a conductive shielding cavity.

[0048] In some embodiments of the present invention, Figure 2 As shown, the microphone assembly further includes a waterproof membrane 51, which is sealed to the substrate assembly 10 and is used to seal the sound inlet 13, thereby preventing external liquid (such as water) from entering the front cavity 33 through the sound inlet 13, thereby achieving the waterproof function of the microphone assembly. Figures 1 to 3 As shown, the substrate assembly 10 includes a first substrate 11 and a second substrate 12, which are stacked and connected. The first substrate 11 is disposed between the second substrate 12 and the housing 20, and the housing 20 and the substrate 31 are both connected to the first substrate 11. A accommodating cavity 14 is formed between the first substrate 11 and the second substrate 12. The sound inlet 13 is connected to the accommodating cavity 14, and the accommodating cavity 14 traverses the sound inlet 13, dividing the sound inlet 13 into a first sub-sound inlet 131 disposed on the first substrate 11 and a second sub-sound inlet 132 disposed on the second substrate 12. A waterproof membrane 51 is disposed within the accommodating cavity 14, and the edge of the waterproof membrane 51 is sealed to the inner wall of the accommodating cavity 14, so that the waterproof membrane 51 completely separates the first sub-sound inlet 131 from the second sub-sound inlet 132, thereby sealing the sound inlet 13 and achieving a waterproof function. In this embodiment, by arranging the waterproof membrane 51 in the accommodating cavity 14, the first substrate 11 and the second substrate 12 can serve as the shell 20 for protecting the waterproof membrane 51, reducing the probability of external objects contacting the waterproof membrane 51, thereby reducing the damage or wear caused by the impact of external objects on the waterproof membrane 51, and effectively increasing the service life of the waterproof membrane 51.

[0049] In an exemplary embodiment, a recessed groove is formed on one side of the first substrate 11 and the other side of the second substrate 12 , respectively. The two recessed grooves are engaged with each other to form the accommodation cavity 14 .

[0050] In other embodiments, the sinking groove may be provided on only one of the first substrate and the second substrate, and the sinking groove may be covered by the other substrate to form the accommodation cavity.

[0051] In a specific embodiment, the material of the waterproof membrane may be PPS (polyphenylene sulfide) or PI (polyimide).

[0052] In an exemplary embodiment, Figure 2 As shown, the microphone assembly also includes a sealing connector 52, which is arranged around the outer edge of the waterproof membrane 51. The sealing connector 52 is sealed with the first substrate 11 or the second substrate 12, so that gaps are formed between the waterproof membrane 51 and the first substrate 11, as well as between the waterproof membrane 51 and the second substrate 12, so that the waterproof membrane 51 can vibrate in the accommodating cavity 14 when receiving sound vibrations, thereby improving the sensitivity of the waterproof membrane 51 to generate vibrations itself, and can better restore the sound transmitted by the second sub-sound inlet 132, thereby improving the sound pickup quality of the microphone assembly.

[0053] In one specific embodiment, the sealing connector 52 is annular and has a circular cross-section. The sealing connector 52 is made of silicone, which is corrosion-resistant, has a long service life, and is elastic and provides a good sealing effect. The circular cross-section of the sealing connector 52 allows for better contact between the sealing connector 52 and the first substrate 11 or the second substrate 12, thereby improving the sealing effect.

[0054] In some embodiments of the present invention, Figure 2 and Figure 3 As shown, the air leakage channel 40 is provided on the substrate assembly 10. Specifically, the air leakage channel 40 includes a first air leakage through hole 41, a second air leakage through hole 42 and an air flow channel 43. The first air leakage through hole 41 and the second air leakage through hole 42 are both provided on the first substrate 11. The first air leakage through hole 41 and the second air leakage through hole 42 are through holes that penetrate the first substrate 11. The first air leakage through hole 41 is connected to the rear cavity 21, and the second air leakage through hole 42 is connected to the outside. The air flow channel 43 is provided on the second substrate 12. The first air leakage through hole 41 is connected to the second air leakage through hole 42 through the air flow channel 43, so that the air in the rear cavity 21 can flow into the air flow channel 43 through the first air leakage through hole 41 and be discharged through the second air leakage through hole 42, or the external air can flow into the air flow channel 43 through the second air leakage through hole 42 and flow into the rear cavity 21 through the first air leakage through hole 41. It should be emphasized that in this embodiment, the microphone assembly will be pasted into the housing of the entire machine during client application. Only the second sub-sound inlet hole 132 structure on the client application side (i.e., the side of the second substrate 12 facing away from the first substrate 11) will connect to the acoustic cavity structure of the entire machine and extend to the outside. Therefore, the waterproof function of the microphone assembly can be achieved after the waterproof membrane 51 closes the sound inlet hole 13. As for the second air leakage hole 42, which extends from the end to the side of the first substrate 11 facing away from the second substrate 12, that is, the space where the second air leakage hole 42 leads to the entire machine structure, external water will not flow into the second air leakage hole 42 through the acoustic cavity structure of the entire machine, that is, external liquid will not enter the rear cavity 21 through the air leakage channel 40. Therefore, the waterproof function of the air leakage channel 40 does not need to be considered when the microphone assembly is used.

[0055] In an exemplary embodiment, Figures 8 to 12 As shown, the first substrate 11 includes a first side 111 and a second side 112 that are opposite each other. The first air leakage hole 41 is located near the first side 111, and the second air leakage hole 42 is located near the second side 112. This allows the first air leakage hole 41 and the second air leakage hole 42 to be separated by a relatively large distance, thereby increasing the length of the air flow channel 43. This increases the total length of the air leakage channel 40, which is equivalent to increasing the overall space of the rear cavity 21 and increasing the acoustic resistance, thereby improving the acoustic performance of the product. In a specific embodiment, the air flow channel 43 is annular and is located near the edge of the second substrate 12. By providing the annular air flow channel 43, the overall volume of the air leakage channel 40 can be further increased, thereby further improving the acoustic performance of the product.

[0056] In other embodiments, Figures 4 to 7 As shown, the first air relief hole 41 and the second air relief hole 42 are both arranged close to the second side 112, so that the total length of the air flow channel 43 is relatively short. When the external ambient temperature of the microphone assembly suddenly changes drastically or the microphone assembly falls, and the sound pressure on both sides of the diaphragm 32 changes greatly due to external factors, the air inside the rear cavity 21 can be quickly discharged through the first air relief hole 41, the air flow channel 43 and the second air relief hole 42, so as to realize the pressure relief inside the rear cavity 21 and quickly achieve the air pressure balance on both sides of the diaphragm 32, thereby reducing the probability of damage to the diaphragm 32 and helping to improve the reliability of the product.

[0057] In a specific embodiment, Figure 7 As shown, the air flow channel 43 on the second substrate 12 includes two countersunk holes arranged perpendicular to the second substrate 12 and connected to the first air leakage hole 41 and the second air leakage hole 42 respectively, and a through hole arranged parallel to the second substrate 12 to connect the two countersunk holes.

[0058] In another specific embodiment, Figure 13 As shown, the air flow channel 43 is a groove formed on the second substrate 12, the opening of the groove faces the first substrate 11, the first air leakage hole 41 and the second air leakage hole 42 are directly connected to the groove, and the air flow channel 43 is defined by a side wall of the first substrate 11 facing the second substrate 12 and the groove.

[0059] In some embodiments of the present invention, an air bleed channel 40 is provided on the housing 20. When the sound pressure on both sides of the diaphragm 32 changes dramatically due to external factors such as a sudden and drastic change in the ambient temperature of the microphone assembly or the microphone assembly being dropped, the air within the rear cavity 21 can be directly released through the air bleed channel 40 on the housing 20 to quickly balance the air pressure on both sides of the diaphragm 32, thereby reducing the probability of damage to the diaphragm 32 and improving product reliability. In this embodiment, to prevent dust or foreign matter from entering the rear cavity 21 through the air bleed channel 40 and affecting the sound pickup quality of the microphone assembly, a dust filter 53 is also provided on the housing 20. The dust filter 53 is used to cover the air bleed channel 40. Specifically, the dust filter 53 can be made of a material such as non-woven fabric.

[0060] In some embodiments of the present invention, Figure 3 As shown, the microphone assembly further includes a signal processing device 60, which is located within the rear cavity 21 and connected to the first substrate 11. The signal processing device 60 is also electrically connected to the acoustic-to-electrical converter 30. Specifically, when sound waves enter the front cavity 33, causing the air pressure inside the front cavity 33 to change, the diaphragm 32 bends with the change in air pressure, and the capacitance or voltage signal of the diaphragm assembly changes. The signal processing device 60 can convert the above signal into an electrical signal and transmit the electrical signal to an external processor through the substrate.

[0061] In an exemplary embodiment, the sound-to-electric conversion device 30 includes a MEMS chip, and the signal processing device 60 includes an ASIC chip. The MEMS chip and the ASIC chip are electrically connected via a wire. The wire can be a gold wire or a copper wire, etc., which effectively improves the stability of the electrical connection. In this embodiment, MEMS is a micro-electro-mechanical system (MEMS), and the ASIC chip is an application-specific integrated circuit (ASIC). Specifically, in this embodiment, the MEMS chip and the ASIC chip are arranged on the first substrate 11. The ASIC chip is electrically connected to the MEMS chip via a wire. The MEMS chip is used to sense and detect the sound signal flowing in from the sound inlet 13, and can convert the sound signal into an electrical signal for transmission and transmit it to the ASIC chip. The ASIC chip is used to provide voltage to the MEMS chip and process and amplify the signal output by the MEMS chip, so that the microphone assembly provides a sound receiving function for the electronic device. In this embodiment, the MEMS chip includes a substrate 31 and a diaphragm assembly. The substrate 31 is connected to the first substrate 11. Specifically, the substrate 31 can be connected to the solder mask layer on the first substrate 11 through a MEMS adhesive. The solder mask can prevent solder from overflowing and causing a short circuit; it can also effectively prevent moisture and protect the performance of the circuit board. The substrate 31 is provided with a through hole that passes through the substrate 31, and the through hole forms a front cavity 33. The substrate 31 and the diaphragm 32 in the diaphragm assembly are connected to the side of the substrate 31 away from the first substrate 11 to separate the front cavity 33 and the rear cavity 21. The substrate 31 is made on a wafer through a semiconductor deposition process. The diaphragm assembly can be a piezoelectric structure or a capacitive structure, which is not limited here. For example, when the diaphragm assembly is a piezoelectric structure, it includes a diaphragm 32 and a piezoelectric material provided on both sides of the diaphragm 32. The diaphragm 32 is excited by a sound signal to vibrate the diaphragm 32, causing the pressure of the piezoelectric material to change, thereby outputting a corresponding electrical signal. When the diaphragm assembly is a capacitive structure, the diaphragm assembly includes a diaphragm 32 and an electrode plate connected to the substrate 31 at one end away from the first substrate 11. The diaphragm 32 and the electrode plate are arranged at corresponding intervals. When the air pressure changes, the diaphragm 32 will bend with the change in air pressure. When the diaphragm 32 bends, the distance between it and the electrode plate changes, causing the capacitance C to change so that the signal ASIC chip can convert this capacitance signal into an electrical signal and transmit the electrical signal to the external processor through the substrate assembly 10.

[0062] According to an embodiment of the present invention, an electronic device is also provided, which includes a microphone assembly and a complete housing. The microphone assembly is arranged in the complete housing. The electronic device not only has a waterproof function, but also, when the sound pressure on both sides of the diaphragm changes greatly due to environmental factors, the air inside the rear cavity can be discharged through the air leakage channel or the external air can flow into the rear cavity through the air leakage channel to balance the air pressure on both sides of the diaphragm, thereby reducing the probability of damage to the diaphragm and helping to improve the reliability of the product.

[0063] The electronic device can be a wearable electronic device, such as a microphone, a smart watch or a bracelet, or a mobile terminal, such as a mobile phone or a laptop computer, or other devices that need to have an acoustic-to-electrical conversion function, which is not limited here.

[0064] In some embodiments of the present invention, the microphone assembly is bonded to the inner wall of the entire housing, and an annular sealing portion is formed between the microphone assembly and the inner wall of the entire housing. The entire housing has a sound collecting cavity connected to the outside, and the second sub-sound inlet hole in the microphone assembly is connected to the sound collecting cavity. The sealing portion separates the second air leakage hole in the microphone assembly from the sound collecting cavity. In this embodiment, the second air leakage hole is separated from the sound collecting cavity by the sealing portion, and external liquid will not pass through the sound collecting cavity and the air leakage channel into the rear cavity, thereby realizing the waterproof function of the electronic device. In some embodiments, in order to fix the microphone assembly and the electronic device to be used and transmit electrical signals, the surface of the second substrate facing away from the accommodating cavity is provided with a soldering foot or a soldering pad. The soldering foot or soldering pad can be conveniently soldered to the mainboard circuit of the electronic device through processes such as SMT, and multiple soldering feet can be provided to improve the stability of the structural connection and data transmission.

[0065] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A microphone assembly, characterized in that: The microphone assembly comprises: A substrate assembly, wherein the substrate assembly is provided with a sound inlet hole, and the substrate assembly comprises a first substrate and a second substrate; a housing, the housing being connected to the first substrate, the second substrate being connected to a side of the first substrate facing away from the housing, the housing and the substrate assembly defining a rear cavity; an acoustic-to-electrical conversion device connected to the first substrate, disposed within the rear cavity and defining a front cavity between the substrate assembly, the acoustic-to-electrical conversion device comprising at least a diaphragm, the diaphragm separating the front cavity from the rear cavity; In which, an air leakage channel is provided on the substrate assembly, and the air leakage channel connects the rear cavity and the outside of the shell. The air leakage channel includes a first air leakage through hole, a second air leakage through hole and an air flow channel. The first air leakage through hole is provided on the first substrate, and the first air leakage through hole is connected to the rear cavity. The second air leakage through hole is provided on the first substrate, and the second air leakage through hole is connected to the outside. The axis of the first air leakage through hole is spaced apart from the axis of the second air leakage through hole. The air flow channel is provided on the second substrate, and the first air leakage through hole is connected to the second air leakage through hole through the air flow channel.

2. The microphone assembly according to claim 1, wherein: The microphone assembly further includes: A waterproof membrane is sealed and connected to the substrate assembly, and the waterproof membrane is used to seal the sound inlet hole.

3. The microphone assembly according to claim 2, wherein: A receiving cavity is formed between the first substrate and the second substrate; The sound inlet hole includes: a first sub-sound inlet hole, provided on the first substrate, the first sub-sound inlet hole being in communication with the accommodating cavity; a second sub-sound inlet hole, provided on the second substrate, the second sub-sound inlet hole being in communication with the accommodating cavity; The waterproof membrane is provided in the accommodating cavity, and the waterproof membrane separates the first sub-sound inlet hole and the second sub-sound inlet hole.

4. The microphone assembly according to claim 3, wherein: The first substrate includes a first side and a second side opposite to each other. The first air leakage hole is arranged close to the first side, and the second air leakage hole is arranged close to the second side.

5. The microphone assembly according to claim 4, wherein: At least a portion of the air flow channel is annular and spaced apart from the outer edge of the second substrate.

6. The microphone assembly according to any one of claims 3 to 5, characterized in that The microphone assembly further includes: A sealing connector, the sealing connector being arranged around the outer edge of the waterproof membrane; The sealing connection member is sealed to the first substrate or the second substrate, so that gaps are formed between the waterproof membrane and the first substrate and between the waterproof membrane and the second substrate.

7. The microphone assembly according to claim 1, wherein: The air release channel is provided on the housing; The microphone assembly further includes a dustproof filter, which is disposed on the housing and covers the air leakage channel.

8. An electronic device, characterized in that: The electronic device comprises: The microphone assembly according to any one of claims 1 to 7; The whole machine housing, the microphone assembly is arranged in the whole machine housing.

9. The electronic device according to claim 8, wherein: The microphone assembly is bonded to the inner wall of the entire housing, forming an annular sealing portion between the microphone assembly and the inner wall of the entire housing. The entire housing has a sound collecting cavity connected to the outside, and the second sub-sound inlet hole in the microphone assembly is connected to the sound collecting cavity. The sealing portion separates the second air leakage hole in the microphone assembly from the sound collecting cavity.

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