Preparation Method of Core Board and Preparation Method of Printed Circuit Board

Abstract

The present application provides a method for preparing a core board and a method for preparing a printed circuit board. The method for preparing the core board includes providing a substrate, the substrate including at least one positioning area, the positioning area including an indication area and a circular punching area, the indication area being disposed around the outer side of the punching area; forming a conductive layer on the first surface and / or the second surface of the substrate, the conductive layer covering the positioning area; removing a part of the conductive layer, and forming a plurality of indication grooves in the indication area, the plurality of indication grooves being uniformly disposed on the outer side of the punching area, and each indication groove including an indication portion, the indication portion pointing to the center of the punching area; determining the center of the punching area according to the positions of the plurality of indication portions, and punching in the punching area according to the center of the punching area to form a through hole, and setting the center of the through hole in the plane of the substrate as the center of the punching area. The present application can solve the problems that the substrate at the edge of the through hole is damaged or the through hole is offset.

Description

Technical Field

[0001] This application relates to the field of printed circuit boards, and particularly to a method for preparing a core board and a method for preparing a printed circuit board. Background Art

[0002] A printed circuit board is an electronic component that can replace complex wiring and achieve electrical connections between various components in a circuit. The application of printed circuit boards not only simplifies the assembly and soldering work of electronic devices, reduces the wiring workload in the traditional method, and greatly reduces the labor intensity of workers; but also reduces the overall volume of the machine, lowers the equipment cost, and improves the quality and reliability of electronic devices.

[0003] Common multi-layer printed circuit boards are usually formed by laminating multiple core boards. The core board includes a base material and copper sheets laid on the base material, and through holes are provided on the core board. There are various types of through holes, such as positioning holes for positioning. When laminating multiple core boards, the multiple positioning holes provided on multiple core boards are aligned, so as to play a positioning role during the lamination process of the multiple core boards. Currently, when forming through holes such as positioning holes on the core board, it is usually necessary to remove some copper sheets on the core board to expose the base material, so as to play a certain indicating role, and then drill holes at the exposed base material to realize the formation process of the through holes.

[0004] When drilling holes in the base material, the base material after removing the copper sheets may be unevenly stressed, resulting in damage to the base material at the edge of the through hole or deviation of the through hole. Summary of the Invention

[0005] Embodiments of this application provide a method for preparing a core board and a method for preparing a printed circuit board to solve the problems of damage to the base material at the edge of the through hole or deviation of the through hole.

[0006] The method for preparing a core board and a method for preparing a printed circuit board provided by embodiments of this application include:

[0007] Providing a base material, the base material includes at least one positioning area, the positioning area includes an indicating area and a circular drilling area, and the indicating area is annularly arranged outside the drilling area;

[0008] Forming a conductive layer on the first surface and / or the second surface of the base material, and the conductive layer covers the positioning area;

[0009] Removing part of the conductive layer, and forming a plurality of indicating grooves in the indicating area. The plurality of indicating grooves are evenly arranged outside the drilling area, and each indicating groove includes an indicating portion, and the indicating portion points to the center of the drilling area;

[0010] Determine the center of the punching area according to the positions of the plurality of indicating portions, and punch holes in the punching area according to the center of the punching area to form through holes. In the plane where the substrate is located, the center of the through hole is set as the center of the punching area.

[0011] By adopting the above technical solution, when preparing the core board, a conductive layer is formed on the first surface and / or the second surface of the substrate, so that the conductive layer covers the positioning area, and then a part of the conductive layer is removed, so that a part of the substrate is exposed in the indicating area and a plurality of indicating grooves are formed. Each indicating groove includes an indicating portion pointing to the center of the punching area, so that a certain positioning function can be achieved through the indicating portions of the plurality of indicating grooves; then, holes are punched in the punching area to form through holes; thus, when punching, a certain positioning function can be achieved by using the indicating portions of the plurality of indicating grooves, and punching can be performed on the substrate covered with the conductive layer, so that the stress on the substrate is more uniform, and the possibility of breakage of the substrate at the edge of the through hole or deviation of the through hole is reduced.

[0012] It is further set that removing a part of the conductive layer includes;

[0013] Pretreat the conductive layer located in the positioning area, and etch the conductive layer with etching solution to expose a part of the substrate and form the indicating groove.

[0014] It is further set that pretreating the conductive layer located in the positioning area includes:

[0015] Lay a photosensitive dry film on the conductive layer located in the indicating area and the punching area. The indicating area includes a first area and a second area, and the first area corresponds to the indicating groove;

[0016] Expose the photosensitive dry film laid on the second area and the punching area;

[0017] Use a developing solution to dissolve the photosensitive dry film on the first area to expose the conductive layer on the first area.

[0018] It is further set that after completing the etching of the conductive layer with the etching solution:

[0019] Use a film stripping solution to dissolve the photosensitive dry film laid on the second area and the punching area to expose the conductive layer.

[0020] It is further set that the conductive layer is provided on the first surface and the second surface, and the plurality of indicating grooves on the first surface are arranged in one-to-one correspondence with the plurality of indicating grooves on the second surface.

[0021] Further configured such that, within the plane where the substrate is located, the positioning area is square, and the side length of the positioning area is greater than or equal to 3.2 mm and less than or equal to 4.8 mm.

[0022] Further configured such that the indicating groove further includes a connecting portion, the indicating portion extends along the radial direction of the punching area, the connecting portion is disposed on a side of the indicating portion away from the punching area, and is communicated with the indicating portion.

[0023] Further configured such that, within each indicating groove, the extending direction of the connecting portion is perpendicular to the extending direction of the indicating portion.

[0024] Further configured such that, taking the plane where the substrate is located as a cross-section, the length of the indicating portion is greater than or equal to 0.4 mm and less than or equal to 0.6 mm; the length of the connecting portion is greater than or equal to 0.4 mm and less than or equal to 0.6 mm.

[0025] The embodiment of the present application further provides a method for manufacturing a printed circuit board, including manufacturing a core board, and the method for manufacturing the core board selects the method for manufacturing the above-mentioned core board.

[0026] By adopting the above technical solution, when manufacturing the core board, a conductive layer is formed on the first surface and / or the second surface of the substrate, so that the conductive layer covers the positioning area, and then a part of the conductive layer is removed, so that a part of the substrate is exposed within the indicating area, and a plurality of indicating grooves are formed. Each indicating groove includes an indicating portion pointing to the center of the punching area, so as to play a certain positioning role through the indicating portions of the plurality of indicating grooves; then, holes are punched within the punching area to form through holes; thus, when punching, the indicating portions of the plurality of indicating grooves can play a certain positioning role, and punching can be performed on the substrate covered with the conductive layer, so that the stress on the substrate is more uniform, reducing the possibility that the substrate at the edge of the through hole is damaged or the through hole is offset. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.

[0028] Figure 1 It is a schematic flow chart of the method for manufacturing the core board provided by the embodiment of the present application;

[0029] Figure 2 It is a schematic flow chart of removing a part of the conductive layer in the method for manufacturing the core board provided by the embodiment of the present application;

[0030] Figure 3 It is a schematic structural diagram of the core board provided by the embodiment of the present application;

[0031] Figure 4Cross-sectional view of the core board provided by the embodiment of the present application;

[0032] Figure 5 Schematic flow chart of the method for preparing a printed circuit board provided by the embodiment of the present application.

[0033] Explanation of reference numerals:

[0034] 1. Substrate; 11. Positioning area; 111. Indication area; 1111. Indication groove; 11111. Indication part; 11112. Connection part; 112. Drilling area; 1121. Through hole; 2. Conductive layer.

[0035] Through the above-mentioned drawings, the specific embodiments of the present application have been shown, and there will be more detailed descriptions hereinafter. These drawings and text descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. Detailed implementation manners

[0036] As described in the background art, when drilling a core board currently, it is usually necessary to remove some copper foils on the core board to expose the substrate, so as to play a certain indication role, and then drill at the exposed substrate to realize the formation process of through holes. However, when drilling on the substrate, the exposed substrate may be unevenly stressed. Especially when the thickness of the substrate is small, the substrate at the edge of the through hole may be damaged or the through hole may be offset.

[0037] To solve the above technical problems, the embodiment of the present application provides a method for preparing a core board and a method for preparing a printed circuit board. When preparing the core board, a conductive layer is formed on the first surface and / or the second surface of the substrate, and then part of the conductive layer is removed to form a plurality of indication grooves in the indication area. Each indication groove includes an indication part pointing to the center of the circle of the drilling area, so as to play a certain positioning role through the indication parts of the plurality of indication grooves; then drill in the drilling area to form through holes; thus, when drilling, the indication parts of the plurality of indication grooves can play a certain positioning role, and drilling can be performed on the substrate covered with the conductive layer, making the stress of the substrate more uniform and reducing the possibility of damage to the substrate at the edge of the through hole or offset of the through hole.

[0038] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are only examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0039] The following uses specific embodiments to elaborate in detail on the technical solution of the present application and how the technical solution of the present application solves the above technical problems. The following several specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0040] Referring to Figures 1-4 , the embodiment of the present application provides a method for preparing a core board, including: providing a substrate 1, the substrate 1 includes at least one positioning area 11, the positioning area 11 includes an indication area 111 and a circular punching area 112, the indication area 111 is arranged around the outside of the punching area 112; forming a conductive layer 2 on the first surface and / or the second surface of the substrate 1, the conductive layer 2 covers the positioning area 11; removing a part of the conductive layer 2 to expose a part of the substrate 1, within the indication area 111, forming a plurality of indication grooves 1111, the plurality of indication grooves 1111 are uniformly arranged outside the punching area 112, and each indication groove 1111 includes an indication portion 11111, the indication portion 11111 points to the center of the punching area 112; punching in the punching area 112 to form a through hole, within the plane where the substrate 1 is located, the center of the through hole is set as the center of the punching area 112.

[0041] By adopting the above technical solution, when preparing the core board, the conductive layer 2 is formed on the first surface and / or the second surface of the substrate 1, so that the conductive layer 2 covers the positioning area 11, and then a part of the conductive layer 2 is removed, so that a part of the substrate 1 is exposed within the indication area 111, and a plurality of indication grooves 1111 are formed, and each indication groove 1111 includes an indication portion 11111 pointing to the center of the punching area 112, so as to play a certain positioning role through the indication portions 11111 of the plurality of indication grooves 1111; then punching in the punching area 112 to form a through hole; thus, when punching, the indication portions 11111 of the plurality of indication grooves 1111 can play a certain positioning role, and punching can be performed on the substrate 1 covered with the conductive layer 2, so that the stress of the substrate 1 is more uniform, reducing the possibility that the substrate 1 at the edge of the through hole 1121 is damaged or the through hole 1121 is offset.

[0042] S101. Provide a substrate 1, the substrate 1 includes at least one positioning area 11, the positioning area 11 includes an indication area 111 and a circular punching area 112, the indication area 111 is arranged around the outside of the punching area 112;

[0043] Referring to Figures 1-4 , in the embodiment of the present application, a positioning area 11 for playing a positioning role is provided on the substrate 1, and the positioning area 11 is provided with a punching area 112 for punching and an indication area 111 for playing an indication role, so as to be able to position the position of the punching area 112 by using the indication area 111, making the position of the punching area 112 more accurate.

[0044] Exemplarily, within the plane where the substrate 1 is located, the positioning area 11 can be set in various shapes as long as it can meet the normal use of the positioning area 11. For example, the positioning area 11 is set as a circle, or in the embodiment of the present application, the positioning area 11 is square, and the side length of the positioning area 11 is greater than or equal to 3.2 mm and less than or equal to 4.8 mm. For example, the side length of the positioning area 11 is 4 mm.

[0045] S102. Form a conductive layer 2 on the first surface and / or the second surface of the substrate 1, and the conductive layer 2 covers the positioning area 11;

[0046] Refer to Figures 1-4 , in the embodiment of the present application, it is easy to understand that the conductive layer 2 can be simultaneously provided on the first surface and the second surface of the substrate 1, that is, on both surfaces of the substrate 1, or can be provided only on the first surface or the second surface of the substrate 1, that is, on one of the two surfaces of the substrate 1. The present application does not make further limitations on this. As for the material of the conductive layer 2, exemplarily, the conductive layer 2 is made of a metal material, such as copper, etc., and the thickness of the conductive layer 2 can be adjusted according to the actual situation. For example, in the embodiment of the present application, the thickness of the substrate 1 is 2 mil, the thickness of the conductive layer 2 is 3 OZ, and the conductive layer 2 is simultaneously provided on the first surface and the second surface of the substrate 1.

[0047] Exemplarily, forming the conductive layer 2 on the substrate 1 can be achieved through various methods. For example, the conductive layer 2 is laid on the first surface and the second surface of the substrate 1 and fixed to the substrate 1; and the conductive layer 2 can completely cover the surface of the substrate 1, or only cover the positioning area 11, so as to be able to remove part of the conductive layer 2 within the positioning area 11 to form an indicating groove 1111.

[0048] It is easy to understand that when the conductive layer 2 is simultaneously provided on the first surface and the second surface of the substrate 1, the positioning area 11 provided on the first surface of the substrate 1 is disposed opposite to the positioning area 11 provided on the second surface of the substrate 1, and the multiple indicating grooves 1111 located on the first surface correspond to the multiple indicating grooves 1111 located on the second surface one by one. Thus, when drilling in the drilling area 112, it can ensure that the force on the substrate 1 is more uniform, reducing the possibility that the substrate 1 at the edge of the through hole 1121 is damaged or the through hole 1121 is offset.

[0049] S103. Remove part of the conductive layer 2, and within the indicating area 111, form multiple indicating grooves 1111. The multiple indicating grooves 1111 are evenly disposed outside the drilling area 112, and each indicating groove 1111 includes an indicating portion 11111, and the indicating portion 11111 points to the center of the drilling area 112;

[0050] Continue to refer to Figures 1-4, in the embodiments of the present application, the process of removing part of the conductive layer 2 can be achieved in various ways. For example, the conductive layer 2 on the substrate 1 can be removed by a cutting device or a milling device, so that the substrate 1 can be exposed. Or, by way of example, removing part of the conductive layer 2 includes:

[0051] Pre-treat the conductive layer 2 located in the positioning area 11, and use an etching solution to etch the conductive layer 2, so that part of the substrate 1 is exposed and an indication groove 1111 is formed.

[0052] S1031. Pre-treat the conductive layer 2 located in the positioning area 11;

[0053] Specifically, a photosensitive dry film is laid on the conductive layer 2 located in the indication area 111 and the punching area 112. The indication area 111 includes a first area and a second area, and the first area corresponds to the indication groove 1111; the photosensitive dry film laid on the second area and the punching area 112 is exposed; a developer is used to dissolve the photosensitive dry film on the first area to expose the conductive layer 2 on the first area.

[0054] By way of example, the photosensitive dry film is a special product for printed circuit board manufacturing, and is usually composed of three parts: a polyethylene film (PE), a photoresist film, and a polyester film (PET). Among them, the photoresist film is also called the photosensitive layer and is the most important part of the photosensitive dry film. Its main component is a photosensitive material for lithography. The polyester film is the carrier of the photosensitive layer and is used to coat and form a film by mixing photosensitive materials; the polyethylene film is the protective layer of the photosensitive dry film, and its main function is to isolate oxygen, layer separation, and avoid mechanical scratches.

[0055] By adopting the above technical solution, when part of the conductive layer 2 is removed, the conductive layer 2 located in the positioning area 11 is pre-treated, and the exposed photosensitive dry film can play a certain protective role for the conductive layer 2 at the second area and the punching area 112; then a developer is used to dissolve the photosensitive dry film on the first area to expose the conductive layer 2 on the first area, so that it can react with the etching solution, while the conductive layer covered with the photosensitive dry film will not be etched by the etching solution.

[0056] S1032. Use an etching solution to etch the conductive layer 2, so that part of the substrate 1 is exposed and an indication groove 1111 is formed;

[0057] Specifically, when the conductive layer 2 located in the positioning area 11 is pre-treated, an etching solution is used to etch the conductive layer 2. The exposed photosensitive dry film can play a certain protective role for the covered conductive layer 2, so that the etching solution can react with the conductive layer 2 in the first area, and then part of the substrate 1 can be exposed, and a plurality of indication grooves 1111 are formed in the indication area 111.

[0058] In the embodiments of the present application, there are various types of etching solutions. For example, the etching solution can be selected from acidic copper chloride solution, alkaline copper chloride solution, ferric chloride solution, etc. And according to the different oxidants added, the etching process system can be divided into three etching processes: hydrochloric acid copper chloride + air system, hydrochloric acid copper chloride + sodium chlorate system, and hydrochloric acid copper chloride + hydrogen peroxide system. The embodiments of the present application do not further limit this, as long as the etching quality of the conductive layer 2 can be ensured.

[0059] It should be noted that during the preparation of the core board, it is usually necessary to use the etching solution to etch conductive patterns on the conductive layers 2 on both sides of the core board, so as to realize the functions of the core board by using the conductive patterns; in the embodiments of the present application, when etching the conductive patterns, a part of the conductive layer 2 in the first region can be etched together, thereby reducing the processing steps for removing the conductive layer 2 and making the removal process of the part of the conductive layer 2 in the first region more convenient.

[0060] Refer to Figure 3 and Figure 4 , the position of the indicating groove 1111 in the positioning area 11 will be described below. In the indicating area 111, each indicating groove 1111 includes a connecting portion 11112, and the indicating portion 11111 extends along the radial direction of the punching area 112. The connecting portion 11112 is arranged on the side of the indicating portion 11111 away from the punching area 112 and is connected to the indicating portion 11111; and in each indicating groove 1111, the extending direction of the connecting portion 11112 is perpendicular to the extending direction of the indicating portion 11111, so as to improve the indicating function of the indicating groove 1111 and make the formation process of the indicating groove 1111 simpler.

[0061] Exemplarily, four indicating grooves 1111 are provided, and the four indicating grooves 1111 are arranged circumferentially along the punching area 112. The indicating portion 11111 of each indicating groove 1111 points to the center of the punching area 112. The indicating portions 11111 on two relatively arranged indicating grooves 1111 extend in the same direction, and the two connecting portions 11112 on adjacent indicating grooves 1111 are perpendicularly arranged, so as to play a certain indicating role for the center of the punching area 112.

[0062] The specific shape of the indicating groove 1111 will be described below. It is easy to understand that the indicating groove 1111 can be set in various shapes, such as rectangular or triangular, etc., as long as the positioning accuracy can be ensured. The present application does not further limit this.

[0063] Continue to refer to Figure 3 and Figure 4, in an embodiment of the present application, exemplarily, taking the plane where the substrate 1 is located as a cross-section, the length of the indicating portion 11111 is greater than or equal to 0.4 mm and less than or equal to 0.6 mm. For example, the length of the indicating portion 11111 is set to 0.5 mm, and the width of the indicating portion 11111 is greater than or equal to 0.16 mm and less than or equal to 0.24 mm. For example, the width of the indicating portion 11111 is set to 0.2 mm; the length of the connecting portion 11112 is greater than or equal to 0.4 mm and less than or equal to 0.6 mm. For example, the length of the connecting portion 11112 is set to 0.5 mm, and the width of the connecting portion 11112 is greater than or equal to 0.16 mm and less than or equal to 0.24 mm. For example, the width of the connecting portion 11112 is set to 0.5 mm.

[0064] By adopting the above technical solution, the indicating groove 1111 is set to include the indicating portion 11111 and the connecting portion 11112, making the position of the indicating groove 1111 clearer. And when using an automatic punching machine to punch in the punching area 112, the vertically arranged indicating portion 11111 and connecting portion 11112 can make the positioning of the punching area 112 more accurate. Moreover, the rectangular indicating area 111 and connecting area also make the production process of the indicating groove 1111 more convenient.

[0065] S1033. Use a stripping solution to dissolve the photosensitive dry film laid in the second area and the punching area 112, so as to expose the conductive layer 2.

[0066] Use an etching solution to etch the conductive layer 2, so as to expose part of the substrate 1, thereby forming a conductive pattern. After forming a plurality of indicating grooves 1111 in the positioning area 11, the photosensitive dry film covers part of the conductive layer 2. Therefore, in an embodiment of the present application, in order to remove the photosensitive dry film, use a stripping solution to dissolve the photosensitive dry film laid in the second area and the punching area 112, so as to expose the conductive layer 2, thereby forming a plurality of indicating grooves 1111 in the positioning area 11.

[0067] Exemplarily, the stripping solution can be an alkaline solution such as sodium hydroxide, which can react with the exposed photosensitive dry film and dissolve the photosensitive dry film, thereby exposing the conductive layer 2 on the core board.

[0068] By adopting the above technical solution, when laying the conductive layer 2 on the substrate 1 and removing part of the conductive layer 2 to form the indicating grooves 1111, first form the conductive layer 2 on the first surface and / or the second surface of the substrate 1 so that the conductive layer 2 covers the positioning area 11, then pre-treat the conductive layer 2, and then use the etching solution to remove part of the conductive layer 2, so that part of the substrate 1 is exposed in the indicating area 111 and multiple indicating grooves 1111 are formed. Each indicating groove 1111 includes an indicating portion 11111 pointing to the center of the punching area 112. Finally, use the stripping solution to dissolve the photosensitive dry film laid in the second area and the punching area 112, so that the conductive layer 2 is exposed, so that a certain positioning function can be achieved through the indicating portions 11111 of the multiple indicating grooves 1111.

[0069] S104. Determine the center of the punching area 112 according to the positions of the multiple indicating portions 11111, and punch holes in the punching area 112 according to the center of the punching area 112 to form through holes. In the plane of the substrate 1, the center of the through hole is set as the center of the punching area 112.

[0070] After the conductive layer 2 is formed on the substrate 1, punch holes in the punching area 112 to form through holes, and in the plane of the substrate 1, the center of the through hole is set as the center of the punching area 112; the positioning area 11 can play a certain positioning role in the punching process, and the multiple indicating grooves 1111 can indicate the center of the punching; and the conductive layer 2 provided on the substrate 1 can play a certain protective role, so as to avoid punching directly on the substrate 1, making the force on the substrate 1 more uniform, and reducing the possibility of damage to the substrate 1 at the edge of the through hole 1121 or deviation of the through hole 1121.

[0071] As for the specific structure of the punching device used for punching in the punching area 112, this application does not further limit it, as long as the punching accuracy can be ensured.

[0072] In summary, when preparing the core board, a conductive layer 2 is formed on the first surface and / or the second surface of the base material 1, such that the conductive layer 2 covers the positioning area 11. Then, the conductive layer 2 is pretreated, and a part of the conductive layer 2 is removed by using an etching solution, so that a part of the base material 1 is exposed within the indication area 111, and a plurality of indication grooves 1111 are formed. Each indication groove 1111 includes an indication part 11111 pointing to the center of the punching area 112, so as to play a certain positioning role through the indication parts 11111 of the plurality of indication grooves 1111. Subsequently, a hole is punched in the punching area 112 to form a through hole. Thus, when punching, a certain positioning role can be played by the indication parts 11111 of the plurality of indication grooves 1111, and punching can be performed on the base material 1 covered with the conductive layer 2, making the stress on the base material 1 more uniform, and reducing the possibility that the base material 1 at the edge of the through hole 1121 is damaged or the through hole 1121 is offset.

[0073] On the other hand, referring to Figures 1-5 , the embodiment of the present application further provides a method for preparing a printed circuit board, including preparing a core board, and the method for preparing the core board uses the above-mentioned method for preparing the core board.

[0074] By adopting the above technical solution, when preparing the core board, a conductive layer 2 is formed on the first surface and / or the second surface of the base material 1, such that the conductive layer 2 covers the positioning area 11. Then, a part of the conductive layer 2 is removed, so that a part of the base material 1 is exposed within the indication area 111, and a plurality of indication grooves 1111 are formed. Each indication groove 1111 includes an indication part 11111 pointing to the center of the punching area 112, so as to play a certain positioning role through the indication parts 11111 of the plurality of indication grooves 1111. Subsequently, a hole is punched in the punching area 112 to form a through hole. Thus, when punching, a certain positioning role can be played by the indication parts 11111 of the plurality of indication grooves 1111, and punching can be performed on the base material 1 covered with the conductive layer 2, making the stress on the base material 1 more uniform, and reducing the possibility that the base material 1 at the edge of the through hole 1121 is damaged or the through hole 1121 is offset.

[0075] After considering the specification and practicing the invention disclosed herein, those skilled in the art will readily think of other embodiments of the present application. The present application aims to cover any variations, uses or adaptations of the present application, and these variations, uses or adaptations follow the general principles of the present application and include the common knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the following claims.

[0076] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

Claims

1. A method for preparing a core plate, characterized in that: include: Providing a substrate, the substrate comprising at least one positioning area, the positioning area comprising an indicator area and a circular perforated area, the indicator area being arranged around the outer side of the perforated area; forming a conductive layer on the first surface and / or the second surface of the substrate, wherein the conductive layer covers the positioning area; Retain the conductive layer covering the perforated area, remove part of the conductive layer in the indicator area, and form a plurality of indicator grooves in the indicator area, wherein the plurality of indicator grooves are evenly arranged on the outside of the perforated area and arranged circumferentially along the perforated area, each of the indicator grooves including an indicator portion and a connecting portion, wherein the indicator portion extends radially along the perforated area and points to the center of the perforated area, the connecting portion is arranged on a side of the indicator portion away from the perforated area and is connected to the indicator portion, and the extending direction of the connecting portion is perpendicular to the extending direction of the indicator portion; According to the positions of the multiple indicating parts, the center of the punching area is determined, and according to the center of the punching area, a hole is punched in the punching area covered with the conductive layer to form a through hole. In the plane where the substrate is located, the center of the through hole is set as the center of the punching area.

2. The method for preparing a core plate according to claim 1, wherein: The removing part of the conductive layer includes: The conductive layer located in the positioning area is pre-treated, and the conductive layer is etched with an etching solution to expose a portion of the substrate and form the indicator groove.

3. The method for preparing a core plate according to claim 2, wherein: The pre-processing of the conductive layer located in the positioning area includes: Laying a photosensitive dry film on the conductive layer located in the indicator area and the punching area, wherein the indicator area includes a first area and a second area, and the first area corresponds to the indicator groove; exposing the photosensitive dry film laid on the second area and the punching area; The photosensitive dry film on the first area is dissolved by a developer to expose the conductive layer on the first area.

4. The method for preparing a core plate according to claim 3, wherein: After the conductive layer is etched using the etching solution: The photosensitive dry film laid on the second area and the punching area is dissolved by using a film stripping solution to expose the conductive layer.

5. The method for preparing a core plate according to claim 1, wherein: The conductive layer is provided on the first surface and the second surface, and the plurality of indicator grooves on the first surface are provided in a one-to-one correspondence with the plurality of indicator grooves on the second surface.

6. The method for preparing a core plate according to claim 1, wherein: In the plane where the substrate is located, the positioning area is square, and the side length of the positioning area is greater than or equal to 3.2 mm and less than or equal to 4.8 mm.

7. The method for preparing a core plate according to claim 1, wherein: Taking the plane where the substrate is located as a cross section, the length of the indicating portion is greater than or equal to 0.4 mm and less than or equal to 0.6 mm; the length of the connecting portion is greater than or equal to 0.4 mm and less than or equal to 0.6 mm.

8. A method for preparing a printed circuit board, characterized in that: The method comprises preparing a core board, wherein the method for preparing the core board is selected from the method for preparing the core board according to any one of claims 1 to 7.

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