Heat dissipation component and preparation method thereof, and electronic equipment

Abstract

The present application discloses a heat dissipation component and a preparation method thereof, and an electronic device. The heat dissipation component includes: a first cover body and a second cover body that are arranged opposite to each other, a support plate, the support plate is located between the first cover body and the second cover body, and the first cover body, the second cover body and the support plate together form a closed space; a liquid wick, the liquid wick is located on a side surface of the first cover body facing the second cover body, in the direction from the first cover body to the second cover body, the thickness of the liquid wick is less than the thickness of the support plate, the orthographic projection of the liquid wick on the first cover body does not overlap with the orthographic projection of the support plate on the first cover body, and a cooling medium, the cooling medium is absorbed inside the liquid wick, and the cooling medium can be vaporized by heat. In this way, a heat dissipation component with high temperature uniformity, high lightness and thinness, and technological visualization can be obtained.

Description

Technical Field

[0001] The present application relates to the field of electronic equipment, and in particular, to a heat dissipation component and a preparation method thereof, and electronic equipment. Background Art

[0002] In response to the current consumer pursuit of experience, the thinness and lightness of terminal products has become an important trend in the development of next-generation terminal equipment. Finding a good solution between achieving thinness and lightness and heat dissipation performance is an issue that urgently needs attention. In addition, the visualization of technological power has gradually become the mainstream exploration direction of terminal equipment manufacturers in terms of appearance, striving to bring consumers more diversified visual beauty. In addition, low-cost and more environmentally friendly materials are increasingly being adopted by terminal manufacturers, and are gradually becoming one of the considerations for consumers to buy machines. In recent years, the heat dissipation and thinning technology of terminal products has gradually matured, and heat dissipation components such as graphite sheets, ultra-thin heat pipes, and ultra-thin heat spreaders have emerged. However, the heat dissipation components in related technologies generally have problems such as low degree of thinness and poor appearance.

[0003] Therefore, the current heat dissipation components and preparation methods thereof, and electronic devices still need to be improved. Summary of the invention

[0004] This application is based on the inventor's discovery and understanding of the following facts and problems:

[0005] The inventors found that the heat dissipation components in the related art all have certain problems. For example, although the graphite sheet has the advantage of being light and thin, it is limited by the thickness and thermal conductivity, and its heat dissipation and uniform heating effect is limited; the ultra-thin heat pipe cannot achieve sufficient uniform heating due to its small heat dissipation area; although the ultra-thin heat spreader has a high thermal conductivity, it is subject to the material process and its weight is large. It is not conducive to achieving a lightweight setting, and the manufacturing cost is high. In addition, the heat dissipation components such as graphite sheets, ultra-thin heat pipes, and ultra-thin heat spreaders in the related art all have a single and rough appearance, and are limited to use as structural parts, and cannot meet the needs of technological visualization.

[0006] The present application aims to alleviate or solve at least one of the above-mentioned problems to at least some extent.

[0007] In one aspect of the present application, the present application proposes a heat dissipation component, comprising: a first cover body and a second cover body arranged opposite to each other, a support plate, the support plate is located between the first cover body and the second cover body, the first cover body, the second cover body and the support plate together form a cavity; a liquid absorbent core, the liquid absorbent core is located on a side surface of the first cover body facing the second cover body, in the direction from the first cover body to the second cover body, the thickness of the liquid absorbent core is less than the thickness of the support plate, the orthographic projection of the liquid absorbent core on the first cover body does not overlap with the orthographic projection of the support plate on the first cover body, and a cooling medium, the cooling medium is absorbed inside the liquid absorbent core, and the cooling medium can be vaporized by heat. In this way, a heat dissipation component with high temperature uniformity, high lightness and thinness, and technological visualization can be obtained.

[0008] In another aspect of the present application, the present application proposes a method for preparing the aforementioned heat dissipation assembly, comprising: welding a support plate to one of a first cover body and a second cover body; fixing a wick on the first cover body; welding the support plate to the other of the first cover body and the second cover body to form a cavity structure of the heat dissipation assembly; injecting a cooling medium into the cavity structure of the heat dissipation assembly through a reserved liquid injection port, and sealing the reserved liquid injection port to obtain the heat dissipation assembly. The aforementioned heat dissipation assembly can be prepared relatively simply by this method, and thus, the method has all the features and advantages of the aforementioned heat dissipation assembly, which will not be described in detail here.

[0009] In another aspect of the present application, the present application proposes an electronic device, comprising: a display screen and a mainboard; a housing assembly, the housing assembly defines a storage space, the mainboard is located inside the storage space defined by the housing assembly; a heat dissipation assembly, the heat dissipation assembly is the aforementioned heat dissipation assembly, the heat dissipation assembly is located between the housing assembly and the display screen. Therefore, the electronic device has all the features and advantages of the aforementioned heat dissipation assembly, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0011] Figure 1 A schematic diagram of the structure of a heat dissipation assembly according to an embodiment of the present application is shown;

[0012] Figure 2 A partial structural schematic diagram of a heat dissipation assembly according to an embodiment of the present application is shown;

[0013] Figure 3 A partial structural cross-sectional view of a heat dissipation assembly according to an embodiment of the present application is shown;

[0014] Figure 4 A structural schematic diagram showing a method for preparing a heat dissipation assembly according to an embodiment of the present application is shown;

[0015] Figure 5 A schematic diagram showing the structure of an electronic device according to an embodiment of the present application is shown;

[0016] Figure 6 A schematic structural diagram of an electronic device according to yet another embodiment of the present application is shown.

[0017] Description of reference numerals:

[0018] 100: heat dissipation component; 101: first cover body; 102: second cover body; 103: support plate; 104: edge sealing structure; 105: support structure; 106: cavity; 107: liquid absorption core; 201: reserved liquid injection port; 202: vacuum liquid injection tube; 203: leak detection device; 204: sealing structure; 200: shell assembly; 300: pressure plate bracket; 400: heating device; 500: middle frame; 600: display screen. DETAILED DESCRIPTION

[0019] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0020] In one aspect of the present application, the present application proposes a heat dissipation component, referring to Figure 1 , including: a first cover body 101 and a second cover body 102 arranged opposite to each other, a support plate 103, the support plate 103 is located between the first cover body 101 and the second cover body 102, the first cover body 101, the second cover body 102 and the support plate 103 jointly form a cavity 106; a liquid absorbent core 107, the liquid absorbent core 107 is located on a side surface of the first cover body 101 facing the second cover body 102, in the direction from the first cover body 101 to the second cover body 102, the thickness of the liquid absorbent core 107 is less than the thickness of the support plate 103, the orthographic projection of the liquid absorbent core 107 on the first cover body 101 and the orthographic projection of the support plate 103 on the first cover body 101 do not overlap, and a cooling medium, the cooling medium is absorbed inside the liquid absorbent core 107, and the cooling medium can be vaporized by heat. By using transparent material as the material for forming the cover body and dissipating heat evenly through the vaporization and condensation of the cooling medium in the wick 107, the heat dissipation component can meet the requirements of high temperature uniformity while also taking into account the requirements of lightness and technological visualization.

[0021] For ease of understanding, the principle of the heat dissipation assembly in the present application having the above beneficial effects is explained below:

[0022] The heat spreader in the related art is usually composed of an upper cover, a lower cover, a capillary structure, and a working medium. Specifically, the upper cover and the lower cover of the heat spreader are usually made of copper or copper alloy, and are sealed by high-temperature welding to form a closed cavity. A capillary layer with a capillary structure can be arranged inside the cavity, and a certain amount of working medium is filled in the capillary layer to form a phase change circulation system. The heat dissipation process of the heat spreader is also a two-phase heat dissipation process using the working medium to undergo a gas-liquid two-phase change.

[0023] The inventors discovered that when metal foil or polymer film is selected as the cover material of the heat spreader, the upper and lower covers need to be connected by a flexible liquid absorbent core, and the liquid absorbent core is mostly a loose porous structure with poor inherent strength, resulting in poor bonding between the upper and lower covers. The manufacturing process of the heat spreader involves a liquid injection process, which has high requirements on the strength of the heat spreader itself. In actual work, the internal pressure of the cavity is relatively high, and delamination is very likely to occur, causing the heat spreader to bulge or fail.

[0024] Furthermore, the inventors also found that when polymer flexible material is used as the cover material, the high water vapor permeability of the polymer material will cause a potential risk of failure of the heat dissipation component; when the heat spreader is sealed by gluing, it is impossible to effectively prevent water vapor leakage inside the heat spreader, and the solution is not feasible.

[0025] In this application, reference is made to Figure 1 and Figure 2The first cover body 101 and the second cover body 102 are combined together through the support plate 103. The first and second cover bodies and the support plate 103 together constitute a cavity 106 of the heat dissipation component. A liquid wick 107 is arranged in the cavity 106. The liquid wick 107 is also filled with a cooling medium (not shown in the figure), such as deionized water, so that the heat dissipation of the heat spreader can be achieved through the gas-liquid two-phase change of the cooling medium. Specifically, the heat dissipation process of the heat dissipation component in the present application mainly includes four steps: conduction, evaporation, convection, and condensation. The heat dissipation principle is as follows: the heat generated by the heat source in contact with the heat dissipation component enters the heat dissipation component through heat conduction, so that the cooling medium near the heat source area absorbs the heat and quickly vaporizes to form steam, while taking away a large amount of heat; the steam in the heat dissipation component diffuses from the high-pressure area to the low-pressure area (i.e., the low-temperature area), and when the steam contacts the inner wall of the heat dissipation component with a lower temperature (such as the support plate 103, the first cover body 101, and the second cover body 102), it will quickly condense into a liquid and release heat energy; the cooling medium condensed into a liquid will then return to the heat source area under the action of the capillary force generated by the microstructure inside the liquid wick 107, thereby completing a heat conduction cycle and forming a two-way circulation system in which the cooling medium vapor and liquid coexist. When the heat dissipation component is working, its internal vaporization and liquefaction continue, and its internal pressure will maintain balance as the temperature changes. The heat dissipation component in the present application has the advantages of a large size coverage range and flexible layout. Its size specifications can be designed according to the actual size and distribution of the heat source, so as to flexibly and completely cover the heat source area, thereby being able to dissipate heat for multiple heat sources at the same time.

[0026] According to some embodiments of the present application, the structure of the support plate 103 is not particularly limited. Figure 1-Figure 3 , the first cover 101 includes a main body area and an edge area surrounding the main body area, the support plate 103 may include a plurality of support structures 105 and an edge sealing structure 104, the plurality of support structures 105 are arranged at intervals, the orthographic projections of the plurality of support structures 105 on the first cover 101 are located in the main body area, the orthographic projections of the edge sealing structure 104 on the first cover 101 are located in the edge area and surround the main body area, and the first cover 101, the second cover 102 and the edge sealing structure 104 jointly form a cavity 106. The arrangement of the support structure 105 can effectively support the first cover 101 and the second cover 102, thereby effectively improving the strength and structural stability of the heat dissipation assembly; the arrangement of the edge sealing structure 104 can effectively block the water vapor leakage inside the heat spreader, and avoid the problem of failure of electronic equipment caused by water vapor leakage. According to other embodiments of the present application, the shape and distribution of the support structure 105 are not particularly limited. For example, the shape of the support structure 105 can be at least one of cylindrical, square, elliptical and teardrop-shaped; the distribution of the support structure 105 can be a square array distribution, a circular distribution, etc.

[0027] It can be understood that, in the description of the present application, “plurality” means two or more.

[0028] According to some embodiments of the present application, in order to reduce the risk of failure of the heat dissipation assembly caused by the high water vapor transmission rate of the cover, the water vapor transmission rate of the cover should be low. For example, the water vapor transmission rate (WVTR) of the first cover 101 and the second cover 102 may be no greater than 1×10 -2 g / m 2 day, when the water vapor permeability of the first cover body 101 and the second cover body 102 is within the above range, the vacuum retention time inside the heat dissipation component can be effectively improved, so that the vacuum degree of the heat dissipation component decays by no more than 10% within two years.

[0029] According to some embodiments of the present application, in order to make the cover have a lower water vapor permeability, a thermoplastic transparent polymer material can be used as the material for forming the cover. Further, the surface of the first cover 101 and the second cover 102 facing the cavity 106 can have an inorganic oxide. At this time, the material forming the first cover 101 and the second cover 102 can independently include at least one of polyethylene terephthalate, polyetherimide and polyethylene naphthalate. Thus, the first cover 101 and the second cover 102 can have a lower water vapor permeability by coating the surface with inorganic oxide. When the above-mentioned polymer material is used as the material for forming the cover, the material properties of the polymer can be used to make the heat dissipation roll have flexible, transparent and lightweight properties, thereby expanding the use of heat dissipation components in terminal products and opening up new ideas for the visualization of scientific and technological power. In addition, since the polymer material has a small hardness and rigidity and is easy to deform, it is very suitable for fitting and assembling with the battery cover, screen and other components of the terminal product.

[0030] According to some embodiments of the present application, the material forming the support plate 103 is not particularly limited. For example, the material forming the support plate 103 can be the same as the material of the first cover 101 and the second cover 102, that is, the material forming the support plate 103, the material forming the first cover 101 and the material forming the second cover 102 can be consistent. That is, the material forming the support plate 103, the material forming the first cover 101 and the material forming the second cover 102 can all be made of the aforementioned polymer material, so that the high-temperature process in the traditional metal temperature plate process, such as brazing, diffusion welding, etc., can be avoided, and the production cost can be greatly reduced and the yield rate can be improved. In addition, when the material of the support plate 103 is consistent with the material of the cover, the defect that the welding of different materials usually cannot achieve stable airtight packaging can also be avoided. It can be understood that when the support plate 103 has an edge sealing structure 104, the surface of the material forming the support plate 103 can also be coated with an inorganic oxide, so as to prevent water vapor from leaking from the side wall of the heat dissipation component.

[0031] According to some embodiments of the present application, the size of each component structure of the heat dissipation assembly is not particularly limited. For example, Figure 1 In the direction from the first cover 101 to the second cover 102, the thickness of the first cover 101 can be 0.01-0.2 mm, the thickness of the second cover 102 can be 0.01-0.2 mm, the thickness of the support plate 103 can be 0.1-0.3 mm, and the thickness of the wick 107 can be 0.05-0.2 mm. When the thickness of the support plate 103 is 0.1-0.3 mm, the cavity 106 of the heat dissipation component can have a certain height, thereby providing space for the vaporization of the cooling medium.

[0032] In the description of the present application, it should be understood that the terms "thickness", "upper", "lower", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0033] According to some embodiments of the present application, the type of the wick 107 is not particularly limited. For example, the material of the wick 107 may include a metal wick and a polymer wick. Specifically, the metal wick may include a copper mesh, foam copper, etc.; the polymer wick may include a non-woven fabric, etc.

[0034] In another aspect of the present application, the present application proposes a method for preparing the aforementioned heat dissipation component, which specifically comprises the following steps:

[0035] S100: welding the support plate 103 to one of the first cover 101 and the second cover 102

[0036] According to some embodiments of the present application, reference Figure 4 In (a), the support plate 103 and the first cover 101 may be connected by welding first, and then the absorbent core 107 may be arranged on the first cover 101, and then the support plate 103 and the second cover 102 may be connected; or the support plate 103 and the second cover 102 may be connected by welding first, and then the absorbent core 107 may be arranged on the first cover 101, and then the support plate 103 and the first cover 101 may be connected. Those skilled in the art may select according to actual conditions, and the following is an example of first connecting the support plate 103 and the first cover 101 by welding:

[0037] According to some embodiments of the present application, the welding process is not particularly limited. For example, the welding process includes at least one of ultrasonic welding, laser welding, high-frequency welding and pulse welding. Sealing by gluing will result in poor airtightness of the heat dissipation component. In the present application, by using the above-mentioned welding with uniform energy distribution for connection and subsequent sealing, the airtightness of the heat dissipation component connection is effectively improved while also taking into account that the appearance of the film material is not affected. Figure 3 After welding using the aforementioned welding method, it can be seen that the welding quality between the first cover body 101, the second cover body 102 and the support plate 103 is good, and both the first and second cover bodies maintain a high degree of flatness.

[0038] S200: Fixing the absorbent core 107 on the first cover 101

[0039] According to some embodiments of the present application, reference Figure 4 In (b), in this step, the absorbent core 107 with a hollow structure at the corresponding position of the support structure 105 is placed on the first cover body 101, the support structure 105 passes through the absorbent core 107 through the hollow hole, and the absorbent core 107 is fixed on the first cover body 101.

[0040] According to some embodiments of the present application, the connection method between the wick 107 and the first cover 101 is not particularly limited. For example, when the wick 107 is a metal wick, fixing the wick 107 on the first cover 101 may include: first heating the wick 107 to a first temperature, wherein the first temperature is not less than the melting point of the material forming the first cover 101; then bringing the wick 107 into contact with the first cover 101, thereby more firmly setting the wick 107 on the first cover 101 by a high-temperature melting method; when the wick 107 is a polymer wick, the wick 107 may be more firmly set on the first cover 101 by the welding process used to connect the first cover 101 with the support plate 103. When the wick 107 and the cover are fixed in the above-mentioned manner, it can be avoided that the glue used for fixing with glue is not stable under long-term high temperature and high humidity, and it is easy to introduce non-condensable gas into the heat dissipation component, resulting in failure of the heat dissipation component.

[0041] S300: welding the support plate 103 to the other of the first cover body 101 and the second cover body 102

[0042] According to some embodiments of the present application, in this step, the support plate 103 is connected to the second cover body 102 to form a cavity structure of the heat dissipation assembly. Specifically, the support plate 103 and the second cover body 102 can be connected by welding. The welding process for connecting the support plate 103 and the second cover body 102 can be consistent with the welding process for connecting the support plate 103 and the first cover body 101, and will not be repeated here.

[0043] S400: Injecting cooling medium into the cavity structure of the heat dissipation component through the reserved liquid injection port 201

[0044] According to some embodiments of the present application, in this step, a cooling medium is injected into the cavity 106. Specifically, refer to Figure 4 In (d), the vacuum injection tube 202 can be first inserted into the reserved injection port 201 set on the side wall of the cavity 106, and pre-sealing treatment can be performed at the reserved injection port 201, such as using glue for temporary sealing, and at the same time, a leak detection device 203, such as helium detection, is used to detect leaks. After ensuring that the leakage rate meets the requirements, the cooling medium is injected into the cavity 106 through the injection tube 202, and then the cavity 106 is evacuated.

[0045] S500: Sealing the reserved liquid injection port 201

[0046] According to some embodiments of the present application, the reserved liquid injection port 201 is sealed in this step to obtain a heat dissipation component. The sealing process is not particularly limited, and it is not necessary to ensure that it has a good appearance after sealing, as long as the sealing structure 204 formed after the sealing process has high air tightness and low water vapor permeability. Specifically, the sealing process can include at least one of ultrasonic welding, laser welding, high frequency welding and pulse welding.

[0047] In another aspect of the present application, the present application provides an electronic device, referring to Figure 5 and Figure 6 , including: a display screen 600 and a mainboard; a housing assembly 200, the housing assembly 200 defines a receiving space, and the mainboard is located inside the receiving space defined by the housing assembly 200; a heat dissipation assembly 100, the heat dissipation assembly 100 is the aforementioned heat dissipation assembly, and the heat dissipation assembly 100 is located between the housing assembly 200 and the display screen 600. Therefore, the electronic device has all the features and advantages of the aforementioned heat dissipation assembly, which will not be repeated here.

[0048] According to some embodiments of the present application, reference Figure 5, the electronic device further includes a middle frame 500, and the heat dissipation assembly 100 can be located between the shell assembly 200 and the middle frame 500. Specifically, the heat dissipation assembly 100 can be located inside the shell assembly 200. At this time, a part of the heat generated by the heating device 400 is transferred to the heat dissipation assembly 100 through other structures in the electronic device, such as the pressure plate bracket 300, etc.; another part of the heat generated by the heating device 400 is conducted to the other side of the display screen 600 of the electronic device through the middle frame 500. Therefore, the heat dissipation assembly 100 can not only use its high thermal conductivity to help electronic equipment products dissipate heat, but also use its fully transparent characteristics to act as an electronic device appearance film to improve the appearance of the electronic device. Furthermore, the first cover 101 or the second cover 102 of the heat dissipation assembly 100 can be fixed to the shell assembly 200 by means of adhesive.

[0049] According to some embodiments of the present application, reference Figure 6 , the electronic device further includes a middle frame 500, and the heat dissipation assembly 100 can be located between the display screen 600 and the middle frame 500. Specifically, the heat dissipation assembly 100 can be located inside the display screen 600. At this time, a part of the heat generated by the heating device 400 is conducted to the heat dissipation assembly 100 through the middle frame 500; another part of the heat generated by the heating device 400 is conducted to the housing assembly 200 through other structures in the electronic device, such as the pressure plate bracket 300. Since the heat dissipation assembly in the present application has the characteristics of full flexibility, it can effectively solve the problem of traditional metal heat sinks damaging the screen due to excessive rigidity. Furthermore, the first cover body 101 or the second cover body 102 of the heat dissipation assembly can be fixed to the inner side of the display screen 600 or the middle frame 500 by means of adhesive.

[0050] According to some embodiments of the present application, the heating device 400 is not particularly limited. For example, the heating device 400 can be a chip device set on the mainboard of the electronic device. Specifically, the chip device can be an application processor, a power management chip, and other devices.

[0051] Unless otherwise specified, all scientific and technological terms used in this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. All patents and publications involved in this application are incorporated herein by reference in their entirety. The terms "comprising" or "including" are open-ended expressions, i.e., including the contents specified in this application, but not excluding contents in other aspects. In this application, regardless of whether the words "about" or "approximately" are used, all numbers disclosed herein are approximate values. The numerical value of each number may differ by less than 10% or a reasonable difference considered by those skilled in the art, such as a difference of 1%, 2%, 3%, 4% or 5%.

[0052] In the description of this specification, the description with reference to the terms "one embodiment", "another embodiment", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment are included in at least one embodiment of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory. In addition, it should be noted that in this specification, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated.

[0053] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A heat dissipation component, characterized in that: include: The first cover body and the second cover body are arranged opposite to each other. A support plate, wherein the support plate is located between the first cover body and the second cover body, and the first cover body, the second cover body and the support plate together form a cavity; A liquid wick, the liquid wick is located on a side surface of the first cover body facing the second cover body, the thickness of the liquid wick is less than the thickness of the support plate in the direction from the first cover body to the second cover body, the orthographic projection of the liquid wick on the first cover body does not overlap with the orthographic projection of the support plate on the first cover body, and a cooling medium is absorbed inside the liquid wick, and the cooling medium can be vaporized by heat; The water vapor permeability of the first cover and the second cover is not greater than 1×10 -2 g / m 2 day; The surfaces of the first cover and the second cover facing the sealed space have inorganic oxides; The first cover body, the second cover body and the support plate are all made of polymer materials, and the support plate is integrally connected with the first cover body and the second cover body by ultrasonic welding; The liquid wick is made of polymer material and is ultrasonically welded to the surface of the first cover body.

2. The heat dissipation assembly according to claim 1, characterized in that: The first cover body includes a main body area and an edge area surrounding the main body area, the support plate includes a plurality of support structures and an edge sealing structure, the plurality of support structures are arranged at intervals, the orthographic projections of the plurality of support structures on the first cover body are located in the main body area, the orthographic projection of the edge sealing structure on the first cover body is located in the edge area and surrounds the main body area, and the first cover body, the second cover body and the edge sealing structure together form a cavity.

3. The heat dissipation assembly according to claim 1, characterized in that: The materials of the first cover and the second cover independently include at least one of polyethylene terephthalate, polyetherimide and polyethylene naphthalate.

4. The heat dissipation assembly according to claim 1, characterized in that: In the direction from the first cover body to the second cover body, the thickness of the first cover body is 0.01-0.2 mm, the thickness of the second cover body is 0.01-0.2 mm, the thickness of the support plate is 0.1-0.3 mm, and the thickness of the wick is 0.05-0.2 mm.

5. A method for preparing the heat dissipation component according to any one of claims 1 to 4, characterized in that: include: Ultrasonic welding the support plate to one of the first cover body and the second cover body; Ultrasonic welding the wick to the first cover; Performing the ultrasonic welding process on the support plate and the other of the first cover body and the second cover body to form a cavity structure of the heat dissipation assembly; Injecting a cooling medium into the cavity structure of the heat dissipation component through a reserved liquid injection port, and sealing the reserved liquid injection port to obtain the heat dissipation component; Wherein, the support plate, the first cover body, the second cover body and the liquid absorbent core are all made of polymer materials.

6. The method according to claim 5, characterized in that Injecting the cooling medium into the cavity structure of the heat dissipation component includes: inserting a vacuum injection tube into the reserved injection port and pre-sealing the reserved injection port; injecting the cooling medium into the cavity structure of the heat dissipation component and performing a vacuum treatment.

7. An electronic device, characterized in that: include: Display screen and motherboard; A housing assembly, wherein the housing assembly defines a receiving space, and the mainboard is located inside the receiving space defined by the housing assembly; A heat dissipation component, wherein the heat dissipation component is the heat dissipation component according to any one of claims 1 to 4, and the heat dissipation component is located between the shell component and the display screen.

8. The electronic device according to claim 7, characterized in that: The electronic device further comprises a middle frame, and the heat dissipation component is located between the housing component and the middle frame.

9. The electronic device according to claim 7, characterized in that: The electronic device further comprises a middle frame, and the heat dissipation component is located between the display screen and the middle frame.

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