Liquid Chromatograph and Analytical Method

By setting up the mounting part for filling the column and chip column in the liquid chromatograph, and adjusting the upper limit temperature of the column thermostat according to the installation of the chip column, the problem of chip columns being easily damaged at high temperatures is solved, and appropriate temperature management and analysis stability are achieved.

CN115004040BActive Publication Date: 2025-07-29SHIMADZU SEISAKUSHO LTD
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Patent Information

Application Number
CN202080094747.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-02-21
Publication Date
2025-07-29
Estimated Expiration
2040-02-21

AI Technical Summary

Technical Problem

The chip column has low heat resistance and is prone to damage under high temperature conditions. The existing liquid chromatographs are insufficient in temperature management, resulting in chip column damage.

Method used

The first mounting part and the second mounting part are provided in the liquid chromatograph, which are used to fill the column and the chip column respectively. The column thermostat adjusts the upper limit temperature according to the installation of the chip column, sets different temperature limits, and prevents the chip column from being installed at high temperature through the temperature adjustment part and the blocking part.

Benefits of technology

Effectively protect the chip column, appropriately manage the temperature of the liquid chromatograph, prevent the chip column from being damaged at high temperatures, and ensure the stable progress of the analysis.

✦ Generated by Eureka AI based on patent content.

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Abstract

An object of the present invention is to provide a liquid chromatograph and an analysis method in which a first mounting portion capable of mounting a packed column and a second mounting portion capable of mounting a chip column having a flow path functioning as a separation column on a substrate are housed in a column oven. Designation of the temperature of the column oven is received by a designated temperature receiving unit. When no chip column is mounted on the second mounting portion, the upper limit temperature of the column oven is set by a setting unit to a first temperature. Further, when a chip column is mounted on the second mounting portion, the upper limit temperature of the column oven is set by the setting unit to a second temperature lower than the first temperature. When the temperature received by the designated temperature receiving unit is equal to or lower than the upper limit temperature set by the setting unit, the temperature of the column oven is adjusted by a temperature adjusting unit to the received temperature.
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Description

Technical Field

[0001] The present invention relates to a liquid chromatograph and an analysis method. Background Art

[0002] In a liquid chromatograph, a sample of an analysis target and a mobile phase are supplied to a separation column together. The sample introduced into the separation column is separated into components according to differences in chemical properties or composition, and is introduced into a detector together with the mobile phase. In the detector, the sample separated by the separation column is detected. Based on the detection result obtained by the detector, a liquid chromatogram is generated.

[0003] [Prior Art Documents]

[0004] [Patent Documents]

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2007-523351

[0006] Patent Document 2: Japanese Patent Application Laid-Open No. 2015-172586 Summary of the Invention

[0007] [Problems to be Solved by the Invention]

[0008] In recent years, sometimes a part of a flow path formed on a substrate is used as a separation column (for example, refer to Patent Document 1 and Patent Document 2). However, a separation column having a structure in which a flow path is formed on a substrate (hereinafter, referred to as a chip column) has relatively low heat resistance. Therefore, when analyzing a sample under high-temperature conditions, the chip column sometimes breaks. Therefore, in order to prevent the chip column from breaking, appropriate temperature management of the liquid chromatograph is required.

[0009] An object of the present invention is to provide a liquid chromatograph and an analysis method capable of appropriately performing temperature management.

[0010] [Technical Means for Solving the Problems]

[0011] One aspect of the present invention relates to a liquid chromatograph including a first mounting portion capable of mounting a packed column; a second mounting portion capable of mounting a chip column having a flow path functioning as a separation column on a substrate; a column oven housing the first mounting portion and the second mounting portion; a designated temperature receiving portion for receiving a designation of the temperature of the column oven; a setting portion for setting an upper limit temperature of the column oven to a first temperature when the chip column is not mounted on the second mounting portion, and setting the upper limit temperature of the column oven to a second temperature lower than the first temperature when the chip column is mounted on the second mounting portion; and a temperature adjustment portion for adjusting the temperature of the column oven to the temperature received by the designated temperature receiving portion when the temperature received by the designated temperature receiving portion is equal to or lower than the upper limit temperature set by the setting portion.

[0012] Another aspect of the present invention relates to an analysis method, which is an analysis method using a liquid chromatograph. Among them, a first mounting portion capable of mounting a packed column and a second mounting portion capable of mounting a chip column having a flow path functioning as a separation column on a substrate are housed in a column oven. The analysis method includes: a step of receiving a designation of the temperature of the column oven; when the chip column is not mounted on the second mounting portion, setting the upper limit temperature of the column oven to a first temperature, and when the chip column is mounted on the second mounting portion, setting the upper limit temperature of the column oven to a second temperature lower than the first temperature; and a step of adjusting the temperature of the column oven to the received temperature when the received temperature is below the set upper limit temperature.

[0013] [Effects of the Invention]

[0014] According to the present invention, the temperature management of the liquid chromatograph can be appropriately carried out. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram showing the structure of a liquid chromatograph according to an embodiment of the present invention.

[0016] Figure 2 It is a block diagram showing the structure of a processing device.

[0017] Figure 3 It is shown by Figure 2 A flowchart showing an example of an algorithm of temperature control processing executed by the processing device.

[0018] Figure 4 It is shown by Figure 2 A flowchart showing an example of an algorithm of temperature control processing executed by the processing device.

[0019] Figure 5 It is a table showing an example of setting the upper limit temperature.

[0020] Figure 6 It is a table showing an example of setting the upper limit temperature. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, the liquid chromatograph and the analysis method according to the embodiment of the present invention will be described in detail with reference to the drawings. In the following description, a separation column having a flow path filled with a particulate packing material (stationary phase) is referred to as a packed column. A separation column having a flow path on a substrate is referred to as a chip column. The substrate includes, for example, a semiconductor chip or a ceramic chip. In the chip column, the flow path on the substrate functions as a separation column.

[0022] (1) Structure of the Liquid Chromatograph

[0023] Figure 1 Schematic diagram showing the structure of a liquid chromatograph according to one embodiment of the present invention. Figure 1 As shown, the liquid chromatograph 100 includes a mobile phase container 10 , a liquid delivery unit 20 , a sample supply unit 30 , a flow path switching unit 40 , a column oven 50 , a three-way joint 60 , a detector 70 and a processing device 80 .

[0024] The mobile phase container 10 stores a mobile phase such as an aqueous solution or an organic solvent. The liquid delivery unit 20, for example, is a pump, which pressure-feeds the mobile phase stored in the mobile phase container 10 and introduces it into the flow path switching unit 40. The sample supply unit 30, for example, is a sample injector, which supplies the sample to be analyzed to the mobile phase pressure-fed by the liquid delivery unit 20. The flow path switching unit 40 is, for example, a valve having an inlet 41 and outlets 42 and 43. The mobile phase (including the sample, the same applies hereinafter) introduced into the inlet 41 is selectively discharged from the outlet 42 or the outlet 43.

[0025] The column oven 50 houses a mounting portion 51 and a mounting portion 52. The mounting portion 51 and the mounting portion 52 are examples of a first mounting portion and a second mounting portion, respectively. The mounting portion 51 is configured to accommodate the packed column 1. Specifically, the user can attach the packed column 1 to the mounting portion 51 by tightening a fastener such as a nut using a tool such as a wrench. Alternatively, the user can remove the packed column 1 from the mounting portion 51 by loosening the fastener using a tool.

[0026] The mounting portion 52 is configured to accommodate the chip cartridge 2. Specifically, the user inserts the chip cartridge 2 through an insertion port (not shown) provided in the mounting portion 52 to mount the chip cartridge 2. Furthermore, the user can remove the chip cartridge 2 from the mounting portion 52 by operating an ejection button (not shown) provided in the mounting portion 52. Therefore, the chip cartridge 2 is more user-friendly than the packed cartridge 1 in terms of replacement and maintenance.

[0027] The mounting portion 52 is provided with a determination portion 53. The determination portion 53 includes a sensor such as a photoelectric sensor or a micro switch, and determines whether the chip post 2 is mounted on the mounting portion 52. The determination portion 53 provides the determination result to the processing device 80.

[0028] The three-way joint 60 has an inlet 61, an inlet 62, and an outlet 63. The mobile phase discharged from the outlet 42 of the flow path switching unit 40 passes through the packed column 1 mounted on the mounting portion 51 of the column oven 50 and is introduced into the inlet 61 of the three-way joint 60. The packed column 1 retains the sample components for different periods of time depending on the affinity of the sample components in the passing mobile phase with the packed column 1 and the mobile phase.

[0029] The mobile phase derived from the outlet 43 of the flow path switching unit 40 passes through the chip column 2 installed in the installation unit 52 of the column oven 50 and is guided to the inlet 62 of the tee joint 60. The chip column 2 retains the components of the sample at different times depending on the affinity of each component of the sample in the passing mobile phase with the chip column 2 and the mobile phase. The tee joint 60 derives the mobile phase introduced into the inlet 61 or the inlet 62 from the outlet 63.

[0030] The detector 70 includes, for example, an absorbance detector or a refractive index detector, and sequentially detects the components of the sample in the mobile phase derived from the outlet 63 of the tee joint 60. The processing device 80 includes a central processing unit (CPU) or a microcomputer, and controls the operations of the liquid delivery unit 20, the sample supply unit 30, the flow path switching unit 40, the column oven 50, and the detector 70. In addition, the processing device 80 generates a liquid chromatogram representing the relationship between the retention time and the detection intensity of each component by processing the detection results obtained by the detector 70. Details of the processing device 80 will be described later.

[0031] (2) Processing device

[0032] Figure 2 is a block diagram showing the structure of the processing device 80. As Figure 2 shown, the processing device 80 includes a maximum temperature reception unit 81, a maximum temperature reception unit 82, a setting unit 83, a specified temperature reception unit 84, a temperature adjustment unit 85, a blocking unit 86, and output units 87 and 88 as functional units. The functional units of the processing device 80 are realized by the CPU of the processing device 80 executing a prescribed program stored in a memory (not shown). Part or all of the functional units of the processing device 80 may also be realized by hardware such as an electronic circuit.

[0033] The maximum temperature reception unit 81 receives the input of the first temperature. The maximum temperature reception unit 82 receives the input of the second temperature lower than the first temperature. The maximum temperature reception unit 81 and the maximum temperature reception unit 82 are examples of the maximum temperature reception unit. The user can input the first temperature and the second temperature to the maximum temperature reception unit 81 and the maximum temperature reception unit 82 respectively by operating an operation unit such as a keyboard, a pointing device, or an operation button provided on the liquid chromatograph 100.

[0034] The setting unit 83 obtains the determination result from the determination unit 53 as to whether the chip column 2 is installed in the installation unit 52. When the chip column 2 is not installed in the installation unit 52, the setting unit 83 sets the upper limit temperature of the column oven 50 to the first temperature received by the upper limit temperature receiving unit 81. On the other hand, when the chip column 2 is installed in the installation unit 52, the setting unit 83 sets the upper limit temperature of the column oven 50 to the second temperature received by the upper limit temperature receiving unit 82.

[0035] The designated temperature receiving unit 84 receives the designation of the temperature of the column oven 50. The user can assign the desired operating temperature of the column oven 50 to the designated temperature receiving unit 84 by operating the operation unit provided in the liquid chromatograph 100. When the temperature received by the designated temperature receiving unit 84 is equal to or lower than the upper limit temperature set by the setting unit 83, the temperature adjustment unit 85 adjusts the temperature of the column oven 50 to the temperature received by the designated temperature receiving unit 84.

[0036] When the temperature received by the designated temperature receiving unit 84 exceeds the second temperature, the blocking unit 86 controls the installation unit 52 to block the installation of the chip column 2 into the installation unit 52. For example, the installation unit 52 can also be controlled so that the insertion port of the chip column 2 is blocked by a cover member. Alternatively, the installation unit 52 can also be controlled to discharge the chip column 2 from the insertion port at the time when a part of the chip column 2 is inserted into the insertion port. According to the above structure, when the temperature received by the designated temperature receiving unit 84 exceeds the second temperature, the installation of the chip column 2 in the installation unit 52 can be prevented.

[0037] When the temperature received by the designated temperature receiving unit 84 exceeds the second temperature, the output unit 87 outputs a warning when the installation operation of the chip column 2 into the installation unit 52 is performed. In this case, when the user installs the chip column 2 in the installation unit 52, it can be recognized that the temperature received by the designated temperature receiving unit 84 exceeds the second temperature. Thus, the chip column 2 can be protected more appropriately. The installation operation of the chip column 2 into the installation unit 52 can be detected based on the determination result obtained by the determination unit 53, or can also be detected based on the operation of the cover member of the insertion port of the chip column 2.

[0038] The output unit 87 is an example of the first output unit. As a warning based on the output unit 87, when the liquid chromatograph 100 includes a display device, strings such as "The designated temperature exceeds the upper limit temperature. Please change the designated temperature." can be displayed. Alternatively, when the liquid chromatograph 100 includes a sound output device, a sound indicating the same content can be output, or a warning sound such as a buzzer can also be output. When the liquid chromatograph 100 includes a display lamp such as a lamp, the display lamp can also be lit, extinguished, or flashed in a form corresponding to the content of the warning.

[0039] When the setting unit 83 sets the upper limit temperature to the second temperature, the output unit 88 outputs a warning when the specified temperature reception unit 84 receives a temperature higher than the second temperature. In this case, the user can easily recognize that a temperature higher than the upper limit temperature has been specified. Thus, the user can easily assign an appropriate temperature to the specified temperature reception unit 84.

[0040] An example where the output unit 88 is the second output unit. The form of the warning based on the output unit 88 can be the same as the form of the warning based on the output unit 87. Alternatively, as the warning based on the output unit 88, a string or sound such as "The specified temperature exceeds the upper limit temperature. Please remove the chip column" may also be output.

[0041] (3) Temperature control process

[0042] Figure 3 and Figure 4 is a flowchart showing an example of an algorithm for the temperature control process executed by the Figure 2 processing device 80. Figure 5 and Figure 6 is a table showing an example of the setting of the upper limit temperature. Hereinafter, Figures 2 to 6 is used to explain the temperature control process.

[0043] First, the upper limit temperature reception unit 81 determines whether the first temperature has been input (step S1). The user can input the first temperature by operating the operation unit. When the first temperature has been input, the upper limit temperature reception unit 81 stores the input first temperature (step S2). When the first temperature has not been input in step S1, or when the first temperature has been stored in step S2, the upper limit temperature reception unit 81 proceeds to step S3.

[0044] In step S3, the upper limit temperature reception unit 82 determines whether the second temperature has been input (step S3). The user can input the second temperature by operating the operation unit. When the second temperature has been input, the upper limit temperature reception unit 82 stores the input second temperature (step S4). When the second temperature has not been input in step S3, or when the second temperature has been stored in step S4, the upper limit temperature reception unit 82 proceeds to step S5.

[0045] In step S5, the setting unit 83 determines whether the first temperature and the second temperature have been stored (step S5). In Figure 5 and Figure 6In the example, 60°C and 50°C are stored as the first temperature and the second temperature, respectively. When the first temperature and the second temperature have not been stored completely, the setting unit 83 proceeds to step S9. When the first temperature and the second temperature have been stored completely, the setting unit 83 determines whether the chip column 2 is installed in the installation unit 52 (step S6). In this example, the setting unit 83 executes step S6 by obtaining the determination result from the determination unit 53.

[0046] When the chip column 2 is not installed in the installation unit 52 ( Figure 5 ), the setting unit 83 sets the upper limit temperature to the first temperature stored in step S2 (step S7) and proceeds to step S9. On the other hand, when the chip column 2 is installed in the installation unit 52 ( Figure 6 ), the setting unit 83 sets the upper limit temperature to the second temperature stored in step S4 (step S8) and proceeds to step S9.

[0047] In step S9, the specified temperature reception unit 84 determines whether the operating temperature of the column oven 50 has been specified (step S9). The user can specify the operating temperature by operating the operation unit. When the operating temperature has been specified, the specified temperature reception unit 84 sets the specified operating temperature as the specified temperature (step S10). When the operating temperature has not been specified in step S9, or when the specified temperature has been set in step S10, the specified temperature reception unit 84 proceeds to step S11.

[0048] In step S11, the temperature adjustment unit 85 determines whether the upper limit temperature and the specified temperature have been set (step S11). When the upper limit temperature and the specified temperature have not been set completely, the temperature adjustment unit 85 returns to step S1. Steps S1 to S11 are repeated until the upper limit temperature and the specified temperature are set. In the repeated process, when the first temperature, the second temperature, or the operating temperature is changed, the setting of the upper limit temperature or the specified temperature is updated. The same applies to subsequent repeated processes.

[0049] When the upper limit temperature and the specified temperature have been set, the temperature adjustment unit 85 determines whether the specified temperature set in step S10 is less than or equal to the upper limit temperature set in step S7 or step S8 (step S12). When the specified temperature is not less than or equal to the upper limit temperature, the output unit 88 outputs a warning (step S13) and returns to step S1. By recognizing the warning, the user can take measures such as changing the first temperature, the second temperature, or the operating temperature, or removing the chip column 2.

[0050] When the specified temperature is below the upper limit temperature, the temperature adjustment unit 85 adjusts the temperature of the column oven 50 to the specified temperature (step S14). In addition, the temperature adjustment unit 85 determines whether the upper limit temperature is the first temperature (step S15). When the upper limit temperature is not the first temperature, the temperature adjustment unit 85 returns to step S1. Furthermore, the upper limit temperature not being the first temperature means that the upper limit temperature is the second temperature, and the chip column 2 is installed in the installation unit 52 ( Figure 6 ).

[0051] When the upper limit temperature is the first temperature, that is, when the chip column 2 is not installed in the installation unit 52 ( Figure 5 ), the temperature adjustment unit 85 determines whether the specified temperature is below the second temperature (step S16). When the specified temperature is below the second temperature, the temperature adjustment unit 85 returns to step S1. When the specified temperature is not below the second temperature, the temperature adjustment unit 85 determines whether the installation operation of the chip column 2 into the installation unit 52 has been performed (step S17).

[0052] When the installation operation of the chip column 2 has not been performed, the temperature adjustment unit 85 returns to step S1. On the other hand, when the installation operation of the chip column 2 has been performed, the blocking unit 86 controls the installation unit 52 to block the installation of the chip column 2 into the installation unit 52 (step S18). In this case, the installation of the chip column 2 in the installation unit 52 can be prevented. Thus, the chip column 2 can be appropriately protected.

[0053] In addition, the output unit 87 outputs a warning (step S19) and returns to step S1. By recognizing the warning, the user can easily understand that the specified temperature exceeds the upper limit temperature. In addition, the user can take measures such as changing the first temperature, the second temperature, or the operating temperature. Either step S18 or step S19 can be executed first, or step S18 and step S19 can be executed simultaneously.

[0054] (4) Effects

[0055] In the liquid chromatograph 100 of the present embodiment, the installation unit 51 capable of installing the packed column 1 and the installation unit 52 capable of installing the chip column 2 are housed in the column oven 50. The specification of the temperature of the column oven 50 is accepted by the specified temperature acceptance unit 84.

[0056] Here, when the chip column 2 is not installed in the installation unit 52, the upper limit temperature of the column oven 50 is set to the first temperature by the setting unit 83. In addition, when the chip column 2 is installed in the installation unit 52, the upper limit temperature of the column oven 50 is set to the second temperature lower than the first temperature by the setting unit 83. When the temperature accepted by the specified temperature acceptance unit 84 is below the upper limit temperature set by the setting unit 83, the temperature adjustment unit 85 adjusts the temperature of the column oven 50 to the accepted temperature.

[0057] According to the above structure, when the chip column 2 is not installed in the installation part 52, the upper limit temperature of the column oven 50 is set to a first temperature. In this case, by installing the packed column 1 in the installation part 51, the analysis of the sample can be carried out even under high temperature conditions.

[0058] On the other hand, when the chip column 2 is installed in the installation part 52, the upper limit temperature of the column oven 50 is set to a second temperature. Therefore, it is possible to prevent the chip column 2 from being used under high temperature conditions, and the analysis of the sample can be carried out in the case of using either the packed column 1 or the chip column 2. In this way, the temperature management of the liquid chromatograph 100 can be appropriately carried out.

[0059] (5) Other embodiments

[0060] (a) In the above embodiment, the flow path switching unit 40 selectively exports the mobile phase introduced into the inlet 41 from the outlet 42 or the outlet 43, but the embodiment is not limited thereto. The flow path switching unit 40 may also export the mobile phase introduced into the inlet 41 from the outlet 42 and the outlet 43 at the same time. In this case, the analysis of the sample using the packed column 1 and the analysis of the sample using the chip column 2 can be carried out simultaneously.

[0061] (b) In the above embodiment, the setting unit 83 sets the upper limit temperature of the column oven 50 to the first temperature or the second temperature based on the determination result obtained by the determination unit 53, but the embodiment is not limited thereto. For example, the setting unit 83 may also obtain a notification from the user as to whether the chip column 2 is installed in the installation part 52, and set the upper limit temperature of the column oven 50 to the first temperature or the second temperature based on the result of the notification. In this case, the liquid chromatograph 100 may not include the determination unit 53 either.

[0062] (c) In the above embodiment, the processing device 80 includes both the upper limit temperature receiving unit 81 and the upper limit temperature receiving unit 82, but the embodiment is not limited thereto. When the second temperature is set based on the first temperature, or when the second temperature is determined in advance, the processing device 80 may not include the upper limit temperature receiving unit 82 either. When the first temperature is set based on the second temperature, or when the first temperature is determined in advance, the processing device 80 may not include the upper limit temperature receiving unit 81 either. When both the first temperature and the second temperature are determined in advance, the liquid chromatograph 100 may not include both the upper limit temperature receiving unit 81 and the upper limit temperature receiving unit 82 either.

[0063] (d) In the described embodiment, the processing device 80 includes both the blocking unit 86 and the output unit 87, but the embodiment is not limited thereto. The processing device 80 may not include either the blocking unit 86 or the output unit 87, or may not include both the blocking unit 86 and the output unit 87.

[0064] (e) In the described embodiment, the processing device 80 includes the output unit 88, but the embodiment is not limited thereto. The processing device 80 may also not include the output unit 88.

[0065] (6) Form

[0066] Those skilled in the art can understand that the above-described multiple exemplary embodiments are specific examples of the following forms.

[0067] (First item) A liquid chromatograph of one form may include:

[0068] A first mounting portion capable of mounting a packed column;

[0069] A second mounting portion capable of mounting a chip column having a flow path functioning as a separation column on a substrate;

[0070] An oven housing the first mounting portion and the second mounting portion;

[0071] A designated temperature receiving portion for receiving the designation of the temperature of the oven;

[0072] A setting portion that sets the upper limit temperature of the oven to a first temperature when the chip column is not mounted on the second mounting portion, and sets the upper limit temperature of the oven to a second temperature lower than the first temperature when the chip column is mounted on the second mounting portion; and

[0073] A temperature adjustment portion that adjusts the temperature of the oven to the temperature received by the designated temperature receiving portion when the temperature received by the designated temperature receiving portion is equal to or lower than the upper limit temperature set by the setting portion.

[0074] In the liquid chromatograph, the first mounting portion capable of mounting a packed column and the second mounting portion capable of mounting a chip column having a flow path functioning as a separation column on a substrate are housed in an oven. The designation of the temperature of the oven is received by the designated temperature receiving portion. When the chip column is not mounted on the second mounting portion, the upper limit temperature of the oven is set to a first temperature by the setting portion. Additionally, when the chip column is mounted on the second mounting portion, the upper limit temperature of the oven is set to a second temperature lower than the first temperature by the setting portion. When the temperature received by the designated temperature receiving portion is equal to or lower than the upper limit temperature set by the setting portion, the temperature of the oven is adjusted to the received temperature by the temperature adjustment portion. ]

[0075] According to the above structure, when the chip column is not installed in the second installation part, the upper limit temperature of the column oven is set to a first temperature higher than the second temperature. In this case, by installing the packed column in the first installation part, the analysis of the sample can be carried out even under high temperature conditions. On the other hand, when the chip column is installed in the second installation part, the upper limit temperature of the column oven is set to the second temperature. Therefore, it is possible to prevent the use of the chip column under high temperature conditions, and the analysis of the sample can be carried out using either the packed column or the chip column. In this way, the temperature management of the liquid chromatograph can be appropriately carried out.

[0076] (Second item) The liquid chromatograph according to the first item may further include a determination unit that determines whether the chip column is installed in the second installation part.

[0077] Based on the determination result obtained by the determination unit, the setting unit sets the upper limit temperature of the column oven to the first temperature or the second temperature.

[0078] In this case, the setting unit can easily set the upper limit temperature of the column oven to the first temperature or the second temperature.

[0079] (Third item) The liquid chromatograph according to the first item or the second item may further include an upper limit temperature receiving unit.

[0080] The upper limit temperature receiving unit receives the designation corresponding to at least one of the first temperature and the second temperature set by the setting unit.

[0081] In this case, the upper limit temperature of the column oven can be set to an arbitrary temperature.

[0082] (Fourth item) The liquid chromatograph according to any one of the first to third items may further include an obstruction unit.

[0083] When the temperature received by the designated temperature receiving unit exceeds the second temperature, the obstruction unit controls the second installation part to obstruct the installation of the chip column into the second installation part.

[0084] According to the above structure, when the temperature received by the designated temperature receiving unit exceeds the second temperature, it is possible to prevent the installation of the chip column in the second installation part. Thus, the chip column can be appropriately protected.

[0085] (Fifth item) The liquid chromatograph according to any one of the first to fourth items may further include a first output unit.

[0086] When the temperature received by the designated temperature receiving unit exceeds the second temperature, the first output unit outputs a first warning when the installation operation of the chip column into the second installation part is performed.

[0087] In this case, when the user installs the chip column in the second installation part, it can be recognized that the temperature received by the specified temperature receiving part exceeds the second temperature. Thus, the chip column can be more appropriately protected.

[0088] (Sixth item) The liquid chromatograph according to any one of the first to fifth items may further include a second output part,

[0089] When the upper limit temperature is set to the second temperature by the setting part, the second output part outputs a second warning when a temperature higher than the second temperature is received by the specified temperature receiving part.

[0090] In this case, the user can easily recognize that a temperature higher than the upper limit temperature is specified. Thus, the user can easily assign an appropriate temperature to the specified temperature receiving part.

[0091] (Seventh item) Another form of the analysis method is an analysis method using a liquid chromatograph, wherein,

[0092] The first installation part capable of installing a packed column and the second installation part capable of installing a chip column having a flow path functioning as a separation column on a substrate are housed in an oven,

[0093] The analysis method may include:

[0094] A step of receiving the specification of the temperature of the oven;

[0095] A step of setting the upper limit temperature of the oven to a first temperature when the chip column is not installed in the second installation part, and setting the upper limit temperature of the oven to a second temperature lower than the first temperature when the chip column is installed in the second installation part; and

[0096] A step of adjusting the temperature of the oven to the received temperature when the received temperature is below the set upper limit temperature.

[0097] According to the analysis method, when the chip column is not installed in the second installation part, the upper limit temperature of the oven is set to a first temperature higher than the second temperature. In this case, by installing a packed column in the first installation part, the analysis of the sample can be performed even under high-temperature conditions. On the other hand, when the chip column is installed in the second installation part, the upper limit temperature of the oven is set to the second temperature. Therefore, the use of the chip column under high-temperature conditions can be prevented. Thus, the temperature management of the liquid chromatograph can be appropriately performed.

Claims

1. A liquid chromatograph, comprising: A first mounting portion capable of mounting a packed column; A second mounting portion capable of mounting a chip column having a flow path functioning as a separation column on a substrate; An oven housing the first mounting portion and the second mounting portion; A designated temperature receiving portion for receiving the designation of the temperature of the oven; A setting portion that, when the chip column is not mounted on the second mounting portion, sets the upper limit temperature of the oven to a first temperature, and when the chip column is mounted on the second mounting portion, sets the upper limit temperature of the oven to a second temperature lower than the first temperature; And A temperature adjustment portion that, when the temperature received by the designated temperature receiving portion is equal to or lower than the upper limit temperature set by the setting portion, adjusts the temperature of the oven to the temperature received by the designated temperature receiving portion.

2. The liquid chromatograph according to claim 1, further comprising a determination portion that determines whether the chip column is mounted on the second mounting portion, The setting portion sets the upper limit temperature of the oven to the first temperature or the second temperature based on the determination result obtained by the determination portion.

3. The liquid chromatograph according to claim 1 or 2, further comprising an upper limit temperature receiving portion that receives the designation corresponding to at least one of the first temperature and the second temperature set by the setting portion.

4. The liquid chromatograph according to claim 1 or 2, further comprising an obstruction portion that, when the temperature received by the designated temperature receiving portion exceeds the second temperature, controls the second mounting portion to obstruct the mounting of the chip column on the second mounting portion.

5. The liquid chromatograph according to claim 1 or 2, further comprising a first output portion that outputs a first warning when the temperature received by the designated temperature receiving portion exceeds the second temperature and the mounting operation of the chip column on the second mounting portion is performed.

6. The liquid chromatograph according to claim 1 or 2, further comprising a second output portion that outputs a second warning when the upper limit temperature is set to the second temperature by the setting portion and a temperature higher than the second temperature is received by the designated temperature receiving portion.

7. An analysis method, which is an analysis method using a liquid chromatograph, wherein A first mounting portion capable of mounting a packed column and a second mounting portion capable of mounting a chip column having a flow path functioning as a separation column on a substrate are housed in an oven, The analysis method includes: A step of receiving the designation of the temperature of the oven; A step of setting the upper limit temperature of the oven to a first temperature when the chip column is not mounted on the second mounting portion, and setting the upper limit temperature of the oven to a second temperature lower than the first temperature when the chip column is mounted on the second mounting portion; And A step of adjusting the temperature of the oven to the received temperature when the received temperature is equal to or lower than the set upper limit temperature.

Citation Information

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