A semiconductor laser heat sink rapid correction pressing device and correction pressing method

Abstract

The present invention relates to the field of semiconductor laser packaging technology, and discloses a semiconductor laser heat sink rapid correction tableting device, including a base, a fixing frame 1, a fixing frame 2, a fixing frame 3 and a fixing seat 1, wherein the left side of the top of the base is connected to the fixing frame 1, the rear side of the top of the fixing frame 1 is connected to a motor, and the end of the output shaft of the motor is connected to a rotating wheel. The fixture structure of the present invention is simple, low cost, convenient and reliable to operate and inspect, and the device is used to perform heat sink correction tableting, and multiple heat sinks can be corrected and pressed at the same time, and the efficiency of heat sink correction tableting is increased by 5-10 times, which greatly reduces the production cost. The device can accurately adjust the position of the X-axis screw and the Z-axis screw, and is suitable for correcting and pressing heat sinks of different thicknesses, which solves the problem of poor consistency of manual heat sink correction, and the qualified rate of heat sink correction is increased by more than 10%.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor laser packaging, in particular to a semiconductor laser heat sink rapid correction tablet pressing device and a correction tablet pressing method. Background Art

[0002] Due to the advantages of small size, light weight, high electro-optical conversion efficiency, long life and high reliability, semiconductor lasers have gradually replaced the use of gas and solid lasers in the fields of communication, medical treatment, display, industrial production and security, and their application scope is also gradually expanding. The waste heat generated by the chip when the semiconductor laser is working needs to be discharged in a timely and effective manner, otherwise it will cause the temperature of the laser chip to be too high, reduce the luminous efficiency of the device and induce the failure of the laser. The currently widely used technical solution is to solidify the semiconductor laser chip onto a heat sink block with strong heat dissipation capacity, and effectively evacuate the heat generated by the chip when it is working through the heat sink block. Since the heat sink is made of copper material with good electrical conductivity, its thickness generally does not exceed 0.5mm. Each heat sink has 10-20 square bars, and each square bar has 20-30 heat sink blocks. The structural characteristics of the heat sink determine that the heat sink has poor rigidity. In the production process of semiconductor laser packaging, the heat sink needs to go through operations such as cleaning, drying, patching, and indium evaporation. In the production process, it is very easy for the square bars and heat sink blocks to warp and deform. If this heat sink with warped edges is not corrected, it will seriously affect the packaging consistency of the laser and reduce the laser packaging qualification rate. Therefore, it is necessary to correct the deformed heat sink.

[0003] The commonly used heat sink correction method is to place the heat sink to be corrected on a platform, place a flat plate on the upper end of the heat sink, press the flat plate with your hands, and flatten the deformed square bars and heat sink blocks through the extrusion of the flat plate and the platform to restore the heat sink to a normal state. Then, the heat sink is placed on a sticky metal sheet, and the heat sink and the metal sheet are pressed together to prevent the heat sink from deforming again. This method is simple to operate, but the production efficiency is low. Only a single heat sink can be corrected and pressed at a time, and the heat sink correction and pressing work cannot be carried out at the same time, and the work efficiency is relatively low. At the same time, the heat sink correction is manually operated, and the size of the pressure and the height of the downward pressure cannot be controlled, and it is difficult to ensure the consistency of the heat sink correction. The labor intensity of long-term operation is relatively high. During the entire heat sink correction and pressing process, it is difficult for the operator to avoid direct contact with the heat sink, which is easy to cause contamination caused by human factors. Therefore, a heat sink correction and pressing device and a correction and pressing method are needed that are efficient and fast, easy to operate, can correct and press multiple heat sinks at the same time, have high correction and pressing efficiency, high precision and good consistency, so as to solve the problems existing in the current heat sink correction and pressing work. Summary of the invention

[0004] In view of the shortcomings of the prior art, the present invention provides a semiconductor laser heat sink rapid correction pressing device and correction pressing method, which has the advantages of simple structure, convenient operation, ability to perform correction pressing on multiple heat sinks at the same time, and applicability to heat sinks of different thicknesses, etc., solving the problems raised in the above-mentioned background technology.

[0005] The present invention provides the following technical solution: a semiconductor laser heat sink rapid correction tablet pressing device, comprising a base, a fixing frame 1, a fixing frame 2, a fixing frame 3 and a fixing seat 1, the left side of the top of the base is connected to the fixing frame 1, the rear side of the top of the fixing frame 1 is connected to a motor, the end of the output shaft of the motor is connected to a rotating wheel, the outer ring of the front of the rotating wheel is movably connected to a connecting rod, the rear side of the middle of the top of the base is connected to the fixing frame 2, the top of the front of the fixing frame 2 is provided with a guide rail, the front of the guide rail is movably connected to a fixing plate, the other end of the connecting rod is connected to the left side of the front of the fixing plate The side is movably connected, the middle part of the front side of the fixed plate is connected with a correction wheel through a vertical screw rod, a fixed seat 1 is provided on the front side of the middle part of the top of the base, a fixing clamp adapted to the heat sink is provided on the top of the fixed seat 1, the fixing clamp is located below the correction wheel, a pressing plate is provided at the right end of the fixed plate, the pressing plate is movably connected to the guide rail, a pressing block is provided on the right side of the pressing plate, the right end of the top of the base is connected with a fixing frame 3 through a transverse screw rod, the left side of the fixing frame 3 is connected with a material tray 2 through a fixing seat 2, a correction plate is provided on the left side of the material tray 2, and a button is provided on the front side of the top of the base.

[0006] Preferably, the motor is a high-precision servo motor, a bearing is provided in the middle of the top of the fixing frame, the output shaft of the motor is connected to the rotating wheel through the bearing, and the rotating wheel is located on the front side of the fixing frame, and the heat sink consists of a square bar and a heat sink block on the square bar.

[0007] Preferably, a connecting groove is connected to the middle of the top end of the front side of the fixed plate, a vertical screw is movably connected to the inner cavity of the connecting groove, a vertical handle is connected to the top of the vertical screw, a moving block is threadedly connected to the outer ring of the bottom end of the vertical screw, a connecting block is connected to the front side of the moving block, and the connecting block is located below the vertical screw, and a correction wheel is movably connected to the middle of the inner cavity of the connecting block.

[0008] Preferably, the fixing fixture consists of a material tray and a pressing sheet, the material tray is provided with two positioning grooves, the width dimension of the positioning groove is adapted to the width dimension of the heat sink, the depth dimension of the positioning groove is greater than the thickness dimension of the heat sink, the four corners of the material tray are provided with fixing holes, the pressing sheet is located at the top of the material tray, a square hole is provided in the middle of the pressing sheet, a convex edge is provided on the outer side of the square hole, the width dimension of the convex edge is adapted to the size of the heat sink frame, and fixing columns adapted to the fixing holes are provided at the same positions of the four corners of the pressing sheet.

[0009] Preferably, there are two guide rails, which are symmetrically distributed, and the top and bottom ends of the back side of the fixing plate are movably connected to the guide rails.

[0010] Preferably, the length and width dimensions of the pressing plate are adapted to the dimensions of the material tray 2, four pressing blocks are provided on the right side of the pressing plate, the length and width dimensions of the pressing blocks are adapted to the length and width dimensions of the heat sink, and positioning holes 1 are provided at the four corners of the pressing plate respectively.

[0011] Preferably, the right end of the top of the base is movably connected to a transverse screw rod, the right end of the transverse screw rod is connected to a transverse handle, a threaded hole is provided in the middle of the bottom end of the fixing frame three, and the fixing frame three is threadedly connected to the transverse screw rod through a bolt hole.

[0012] Preferably, four positioning grooves 2 are provided in the middle of the second material tray, the length of the second positioning grooves is adapted to the size of the heat sink, and a positioning column is provided at each of the four corners of the second material tray.

[0013] Preferably, four correction pieces are provided in the middle of the correction plate, the size of the correction pieces is adapted to the size of the heat sink, a sticky adhesive layer is provided on the side of the correction piece away from the pressing block, and two positioning holes adapted to the positioning columns are respectively provided at the four corners of the correction plate.

[0014] A correction and pressing method for a semiconductor laser heat sink quick correction and pressing device comprises the following steps:

[0015] Step 1: Evenly arrange the heat sink to be corrected into the positioning groove 1 of the material tray 1, so that the positioning groove 1 is filled with heat sinks;

[0016] Step 2: Through the close fit of the fixing column and the fixing hole, the pressing sheet is covered on the top of the material tray 1 to complete the assembly of the fixing fixture, and the fixing fixture is placed on the top of the fixing seat 1;

[0017] Step 3: evenly place the corrected heat sink to be pressed into the second positioning groove of the second tray;

[0018] Step 4: Take a correction plate, assemble the correction plate and the second material tray together through the cooperation of the second positioning hole and the positioning column, and place the second material tray after cooperation on the second fixing seat;

[0019] Step 5: After adjusting the horizontal handle and the vertical handle to the appropriate position according to the thickness of the heat sink, press the start button of the device and the motor starts to rotate;

[0020] Step 6: The motor drives the rotating wheel connected to it to rotate, and the rotating wheel drives the fixed plate to move through the connecting rod, and the fixed plate drives the correction wheel and the pressing plate to move, and the correction wheel presses to the top of the heat sink to correct the square bar and the heat sink block of the heat sink. In the correction process, the correction wheel moves from left to right, and the fixed plate drives the pressing plate to approach the correction plate. The pressing block on the pressing plate presses the correction sheet on the correction plate into the second positioning groove on the second material tray, and presses the correction sheet and the heat sink together;

[0021] Step 7: Press the button again, the motor drives the correction wheel and the pressing plate to reset, and the heat sink is taken out from tray 1 and tray 2, completing the rapid correction and pressing of the heat sink.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The semiconductor laser heat sink rapid correction tableting device and correction tableting method have a simple fixture structure, low cost, convenient and reliable operation and inspection. When the device is used for heat sink correction tableting, multiple heat sinks can be corrected and pressed at the same time, and the heat sink correction tableting efficiency is improved by 5-10 times, which greatly reduces the production cost. Through the precise adjustment of the position of the horizontal screw and the vertical screw, it is suitable for correction tableting of heat sinks of different thicknesses, which solves the problem of poor consistency of manual heat sink correction and improves the qualified rate of heat sink correction by more than 10%.

[0024] 2. The semiconductor laser heat sink rapid correction pressing device and correction pressing method realize mechanical automatic correction pressing instead of manual operation, which greatly reduces the labor intensity. During the whole correction pressing process, the operator does not have direct contact with the heat sink, avoiding human factors and causing product contamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a front schematic diagram of the three-dimensional structure of the present invention;

[0026] Figure 2 yes Figure 1 The right side schematic diagram of

[0027] Figure 3 It is a schematic diagram of a partial three-dimensional structure of the present invention;

[0028] Figure 4 It is a three-dimensional structural schematic diagram of the fixing fixture of the present invention;

[0029] Figure 5 It is a three-dimensional structural schematic diagram of the tablet of the present invention;

[0030] Figure 6 It is a schematic diagram of the three-dimensional structure of a material tray 1 of the present invention;

[0031] Figure 7is a schematic diagram of the three-dimensional structure of the heat sink of the present invention;

[0032] Figure 8 It is a schematic diagram of the three-dimensional structure of the pressing plate, the correction plate and the material tray of the present invention;

[0033] Fig. 9 It is a three-dimensional structural schematic diagram of the pressing plate of the present invention;

[0034] Fig.10 It is a three-dimensional structural schematic diagram of the correction plate of the present invention;

[0035] Fig.11 It is a schematic diagram of the three-dimensional structure of the material tray 2 and the heat sink of the present invention.

[0036] In the figure: 1. base; 2. fixing frame 1; 3. fixing frame 2; 4. fixing frame 3; 5. fixing seat 1; 6. motor; 7. rotating wheel; 8. guide rail; 9. fixing plate; 10. vertical handle; 11. vertical screw rod; 12. moving block; 13. connecting block; 14. correction wheel; 15. connecting rod; 16. fixing fixture; 17. button; 18. horizontal handle; 19. horizontal screw rod; 20. fixing seat 2; 21. material tray 2; 22. correction plate; 23. pressing plate; 24. material tray 1; 25. pressing sheet; 26. heat sink; 27. convex edge; 28. square hole; 29. ​​positioning groove 1; 30. fixing hole; 31. square bar; 32. heat sink block; 33. pressing block; 34. positioning hole 1; 35. correction sheet; 36. positioning hole 2; 37. positioning column; 38. positioning groove 2; 39. fixing column. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] See also Figure 1 and 2 A semiconductor laser heat sink rapid correction tablet pressing device includes a base 1, a fixing frame 2 is connected to the left side of the top of the base 1 by bolts, a motor 6 is connected to the rear side of the top of the fixing frame 2 by bolts, the motor 6 adopts a high-precision servo motor, the output shaft of the motor 6 is connected to a rotating wheel 7 through a bearing, and the rotating wheel 7 is located on the front side of the fixing frame 2. Through the setting of the motor 6, the rotation of the motor 6 can drive the rotating wheel 7 connected thereto to rotate.

[0039] A fixing frame 2 3 is connected to the rear side of the middle part of the top of the base 1 by bolts, and the top and bottom ends of the front side of the fixing frame 2 3 away from the base 1 are connected to the guide rail 8 by bolts, and a fixing plate 9 is movably connected to the front side of the guide rail 8, and the fixing plate 9 is connected to the rotating wheel 7 by a connecting rod 15, and the middle parts of both ends of the connecting rod 15 are fixedly connected to circular rings, and the outer ring of the front side of the rotating wheel 7 and the middle part of the left side of the front side of the fixing plate 9 are welded with cylinders, and the cylinders are movably connected to the inner cavity of the circular rings, and through the setting of the connecting rod 15, the rotation of the motor 6 enables the connecting rod 15 to drive the fixing plate 9 to move, and the fixing plate 9 moves horizontally in the direction where the guide rail 8 is located.

[0040] A connecting groove is connected to the middle of the top of the front side of the fixed plate 9, and a vertical screw rod 11 is movably connected in the inner cavity of the connecting groove. A vertical handle 10 is connected to the top of the vertical screw rod 11. The rotation of the vertical handle 10 can drive the vertical screw rod 11 to rotate. The outer ring thread of the bottom end of the vertical screw rod 11 is connected to a moving block 12. The rotation of the vertical screw rod 11 can change the height of the moving block 12. The front of the bottom end of the moving block 12 is connected to a connecting block 13 by bolts, and the connecting block 13 is located below the vertical screw rod 11. A correction wheel 14 is movably connected to the middle of the inner cavity of the connecting block 13. The shape of the connecting block 13 is M-shaped. The vertical handle 10 drives the rotation of the vertical screw rod 11, and then controls the lifting and lowering of the moving block 12, thereby adjusting the lifting height of the connecting block 13, and then controlling the lifting height of the correction wheel 14. The design of this structure enables the device to correct heat sinks 26 of different thicknesses.

[0041] See also Figure 3 The front side of the middle part of the top of the base 1 is connected with a fixing seat 5 by bolts, and a fixing fixture 16 is fixed on the top of the fixing seat 5. The fixing seat 5 is used to position and fix the fixing fixture 16. The size of the fixing seat 5 is adapted to the size of the fixing fixture 16, and the fixing fixture 16 is located below the correction wheel 14.

[0042] See also Figure 4 and 5 The fixing fixture 16 is composed of a material tray 24 and a pressing sheet 25. The fixing fixture 16 is used to fix the heat sink 26. The pressing sheet 25 is located on the top of the material tray 24. The pressing sheet 25 is made of stainless steel. A square hole 28 is provided in the middle of the pressing sheet 25. A convex edge 27 is provided on the outer side of the square hole 28. The width of the convex edge 27 is adapted to the size of the frame of the heat sink 26. When the heat sink 26 is fixed to the fixing fixture 16, the heat sink 26 will not move due to the contact and extrusion between the pressing sheet 25, the convex edge 27 and the frame of the heat sink 26. Fixed columns 39 are provided at the four corners of the pressing sheet 25 respectively. The size of the fixed column 39 is adapted to the size of the fixing hole 30 of the material tray 24.

[0043] See also Figure 6Two positioning grooves 29 are provided on the material tray 24. The positioning grooves 29 are used to position the heat sink 26. The width of the positioning grooves 29 is adapted to the width of the heat sink 26. The depth of the positioning grooves 29 is greater than the thickness of the heat sink 26. The four corners of the material tray 24 are respectively provided with fixing holes 30. Through the close fit between the fixing columns 39 and the fixing holes 30, the pressing sheet 25 can be fixed together with the material tray 24.

[0044] See also Figure 7 The heat sink 26 is composed of a square bar 31 and a heat sink block 32 on the square bar 31 .

[0045] See also Figure 1 , 8 To 11, the right end of the fixed plate 9 is connected to the pressing plate 23 by bolts, and the rotation of the motor 6 can drive the correction wheel 14 and the pressing plate 23 to move at the same time. The pressing plate 23 is used to press the correction sheet 35 and the heat sink 26 together. The length and width of the pressing plate 23 are adapted to the size of the material tray 21. Four pressing blocks 33 are arranged in the middle of the pressing plate 23. The length and width of the pressing blocks 33 are adapted to the length and width of the heat sink 26. Positioning holes 34 are respectively arranged at the four corners of the pressing plate 23.

[0046] The right end of the top of the base 1 is movably connected with a transverse screw rod 19, and the right end of the transverse screw rod 19 is fixedly connected with a transverse handle 18. A threaded hole is provided in the middle of the bottom end of the fixing frame three 4, and the fixing frame three 4 is threadedly connected to the transverse screw rod 19 through the bolt hole. Through the setting of the transverse screw rod 19, the transverse handle 18 rotates to drive the transverse screw rod 19 to rotate, and the rotation of the transverse screw rod 19 causes the fixing frame three 4 to move horizontally. This design enables the device to correct heat sinks 26 of different thicknesses.

[0047] The left side of the fixing frame 3 4 is connected with the fixing seat 20 by bolts, and the left side of the fixing seat 20 is fixedly connected with the material tray 21. The middle part of the material tray 21 is provided with four positioning grooves 28. The length and width of the positioning grooves 28 are adapted to the size of the heat sink 26. Through the setting of the positioning grooves 28, the heat sink 26 and the material tray 21 can be fixed together. The four corners of the left side of the material tray 21 are evenly welded with positioning columns 37. The material tray 21 is clamped with a correction plate 22 through the positioning columns 37. The correction plate 22 adopts The thickness is 0.5-1mm and the rigid stainless steel is good. Four correction pieces 35 are arranged in the middle of the correction plate 22. The size of the correction piece 35 is adapted to the size of the heat sink 26. A sticky adhesive layer is applied on the side of the correction piece 35 away from the pressing block 33. The adhesive layer is used to stick the heat sink 26 and the correction piece 35 together so that the corrected heat sink 26 remains flat. Positioning holes 36 are respectively arranged at the four corners of the correction plate 22. The size of the positioning hole 36 is adapted to the size of the positioning column 37 of the tray 21.

[0048] See also Figure 1A button 17 is provided on the front side of the top of the base 1, and the button 17 is used to control the start and stop of the device.

[0049] A correction and pressing method for a semiconductor laser heat sink quick correction and pressing device comprises the following steps:

[0050] Step 1: Evenly arrange the heat sink 26 to be corrected into the positioning groove 29 of the tray 24, so that the positioning groove 29 is filled with the heat sink 26;

[0051] Step 2: Cover the pressing sheet 25 on the top of the tray 24 through the tight fit of the fixing column 39 and the fixing hole 30, complete the assembly of the fixing fixture 16, and place the fixing fixture 16 on the top of the fixing seat 5;

[0052] Step 3: evenly place the corrected heat sink 26 to be pressed into the second positioning groove 38 of the second tray 21;

[0053] Step 4: Take a piece of correction plate 22, and assemble the correction plate 22 and the second material tray 21 together through the cooperation of the second positioning hole 36 and the positioning column 37, and place the second material tray 21 after cooperation on the second fixing seat 20;

[0054] Step 5: After adjusting the horizontal handle 18 and the vertical handle 10 to a suitable position according to the thickness of the heat sink 26, press the start button 17 of the device, and the motor 6 starts to rotate;

[0055] Step 6: The motor 6 drives the rotating wheel 7 connected thereto to rotate, and the rotating wheel 7 drives the fixed plate 9 to move through the connecting rod 15, and the fixed plate 9 drives the correction wheel 14 and the pressing plate 23 to move, and the correction wheel 14 presses to the top of the heat sink 26 to correct the square bar 31 and the heat sink block 32 of the heat sink 26, and in the process of correction, the correction wheel 14 moves from left to right, and the fixed plate 9 drives the pressing plate 23 to approach the correction plate 22, and the pressing block 33 on the pressing plate 23 presses the correction sheet 35 on the correction plate 22 into the second positioning groove 38 on the second material tray 21, and presses the correction sheet 35 and the heat sink 26 together;

[0056] Step 7: Press the button 17 again, the motor 6 drives the correction wheel 14 and the pressing plate 23 to reset, and the heat sink 26 is taken out from the material tray 1 24 and the material tray 2 21, completing the rapid correction and pressing work of the heat sink 26.

[0057] The electrical components involved in this application are all available on the market and are all prior art. Although the embodiments of the present invention have been shown and described, it is understandable to those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor laser heat sink rapid correction pressing device, comprising a base (1), a fixing frame 1 (2), a fixing frame 2 (3), a fixing frame 3 (4) and a fixing seat 1 (5), Features: The left side of the top of the base (1) is connected to a fixing frame 1 (2), the rear side of the top of the fixing frame 1 (2) is connected to a motor (6), the end of the output shaft of the motor (6) is connected to a rotating wheel (7), the outer ring of the front of the rotating wheel (7) is movably connected to a connecting rod (15), the rear side of the middle of the top of the base (1) is connected to a fixing frame 2 (3), the top of the front of the fixing frame 2 (3) is provided with a guide rail (8), the front of the guide rail (8) is movably connected to a fixing plate (9), the other end of the connecting rod (15) is movably connected to the left side of the front of the fixing plate (9), the middle of the front of the fixing plate (9) is connected to a correction wheel (14) through a vertical screw rod (11), the middle of the top of the base (1) is connected to a fixing frame 2 (3), the top of the front of the fixing frame 2 (3) is provided with a guide rail (8), the front of the guide rail (8) is movably connected to a fixing plate (9), the other end of the connecting rod (15) is movably connected to the left side of the front of the fixing plate (9), the middle of the front of the fixing plate (9) is connected to a correction wheel (14) through a vertical screw rod (11), A fixing seat (5) is provided on the front side of the part, a fixing fixture (16) adapted to the heat sink (26) is provided on the top of the fixing seat (5), the fixing fixture (16) is located below the correction wheel (14), a pressing plate (23) is provided on the right end of the fixing plate (9), the pressing plate (23) is movably connected to the guide rail (8), a pressing block (33) is provided on the right side of the pressing plate (23), the right end of the top of the base (1) is connected to a fixing frame (4) through a transverse screw rod (19), the left side of the fixing frame (4) is connected to a material tray (21) through a fixing seat (20), a correction plate (22) is provided on the left side of the material tray (21), and a button (17) is provided on the front side of the top of the base (1).

2. A semiconductor laser heat sink rapid correction pressing device according to claim 1, Features: The motor (6) is a high-precision servo motor. A bearing is provided in the middle of the top of the fixing frame (2). The output shaft of the motor (6) is connected to the rotating wheel (7) through the bearing. The rotating wheel (7) is located at the front side of the fixing frame (2). The heat sink (26) is composed of a square bar (31) and a heat sink block (32) on the square bar (31).

3. A semiconductor laser heat sink rapid correction pressing device according to claim 1, Features: The middle part of the top of the front side of the fixed plate (9) is connected with a connecting groove, and a vertical screw rod (11) is movably connected in the inner cavity of the connecting groove. The top of the vertical screw rod (11) is connected with a vertical handle (10), and the outer ring of the bottom end of the vertical screw rod (11) is threadedly connected with a moving block (12). The front side of the moving block (12) is connected with a connecting block (13), and the connecting block (13) is located below the vertical screw rod (11). The middle part of the inner cavity of the connecting block (13) is movably connected with a correction wheel (14).

4. A semiconductor laser heat sink rapid correction pressing device according to claim 1, Features: The fixing fixture (16) is composed of a material tray (24) and a pressing sheet (25). The material tray (24) is provided with two positioning grooves (29). The width of the positioning grooves (29) is adapted to the width of the heat sink (26). The depth of the positioning grooves (29) is greater than the thickness of the heat sink (26). The four corners of the material tray (24) are provided with fixing holes (30). The pressing sheet (25) is located at the top of the material tray (24). A square hole (28) is provided in the middle of the pressing sheet (25). A convex edge (27) is provided on the outer side of the square hole (28). The width of the convex edge (27) is adapted to the frame size of the heat sink (26). The same positions of the four corners of the pressing sheet (25) are provided with fixing columns (39) adapted to the fixing holes (30).

5. A semiconductor laser heat sink rapid correction pressing device according to claim 1, Features: There are two guide rails (8), which are symmetrically distributed, and the top and bottom ends of the back side of the fixing plate (9) are movably connected to the guide rails (8).

6. A semiconductor laser heat sink rapid correction pressing device according to claim 1, Features: The length and width of the pressing plate (23) are adapted to the size of the second material tray (21); four pressing blocks (33) are provided on the right side of the pressing plate (23); the length and width of the pressing blocks (33) are adapted to the length and width of the heat sink (26); and positioning holes (34) are provided at the four corners of the pressing plate (23).

7. A semiconductor laser heat sink rapid correction pressing device according to claim 1, Features: The right end of the top of the base (1) is movably connected to a transverse screw rod (19), and the right end of the transverse screw rod (19) is connected to a transverse handle (18). A threaded hole is provided in the middle of the bottom end of the fixing frame three (4), and the fixing frame three (4) is threadedly connected to the transverse screw rod (19) through a bolt hole.

8. A semiconductor laser heat sink rapid correction pressing device according to claim 1, Features: Four positioning grooves (38) are provided in the middle of the second material tray (21), and the length of the second positioning groove (38) is adapted to the size of the heat sink (26). A positioning column (37) is provided at each of the four corners of the second material tray (21).

9. A semiconductor laser heat sink rapid correction pressing device according to claim 8, Features: Four correction pieces (35) are provided in the middle of the correction plate (22), the size of the correction piece (35) is adapted to the size of the heat sink (26), a sticky adhesive layer is provided on the side of the correction piece (35) away from the pressing block (33), and two positioning holes (36) adapted to the positioning columns (37) are respectively provided at the four corners of the correction plate (22).

10. A correction pressing method for a semiconductor laser heat sink rapid correction pressing device according to any one of claims 1 to 9, Features: The following steps are involved: Step 1: Evenly arrange the heat sink (26) to be corrected into the positioning groove (29) of the material tray (24), so that the positioning groove (29) is filled with the heat sink (26); Step 2: Cover the pressing sheet (25) on the top of the material tray (24) by tightly fitting the fixing column (39) and the fixing hole (30), complete the assembly of the fixing fixture (16), and place the fixing fixture (16) on the top of the fixing seat (5); Step 3: evenly placing the corrected heat sink (26) to be pressed into the second positioning groove (38) of the second tray (21); Step 4: Take a piece of correction plate (22), and assemble the correction plate (22) and the second material tray (21) together through the cooperation of the second positioning hole (36) and the positioning column (37), and place the second material tray (21) after cooperation on the second fixing seat (20); Step 5: After adjusting the horizontal handle (18) and the vertical handle (10) to a suitable position according to the thickness of the heat sink (26), the start button (17) of the device is pressed, and the motor (6) starts to rotate; Step 6: The motor (6) drives the rotating wheel (7) connected thereto to rotate, and the rotating wheel (7) drives the fixed plate (9) to move through the connecting rod (15), and the fixed plate (9) drives the correction wheel (14) and the pressing plate (23) to move, and the correction wheel (14) presses to the top of the heat sink (26), and corrects the square bar (31) and the heat sink block (32) of the heat sink (26), and in the correction process, the correction wheel (14) moves from left to right, and the fixed plate (9) drives the pressing plate (23) to approach the correction plate (22), and the pressing block (33) on the pressing plate (23) presses the correction sheet (35) on the correction plate (22) into the second positioning groove (38) on the second material tray (21), and presses the correction sheet (35) and the heat sink (26) together; Step 7: Press the button (17) again, the motor (6) drives the correction wheel (14) and the pressing plate (23) to reset, and the heat sink (26) is taken out from the material tray 1 (24) and the material tray 2 (21), completing the rapid correction and tableting work of the heat sink (26).

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