Display module, preparation method thereof and electronic device

Abstract

The application relates to the technical field of display, and discloses a display module, a preparation method thereof and electronic equipment, which comprises a substrate and a plurality of chips, the substrate has a first surface, the first surface is provided with a plurality of conductive layers, the plurality of conductive layers are arranged at intervals, and the plurality of chips are connected to the plurality of conductive layers respectively. When the chips are connected to the conductive layers, a heat insulation layer is arranged on the first surface, the heat insulation layer is provided with a plurality of first through holes, and the plurality of first through holes are arranged in one-to-one correspondence with the plurality of conductive layers. The display module can reduce the influence of heat generated when the chips are connected to the conductive layers on the circuit and driving devices on the substrate, reduce the risk of damaging the circuit and driving devices on the substrate, and improve the yield of the display screen module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display module, a preparation method thereof and an electronic device. BACKGROUND

[0002] In the related art, when the display module is assembled, the metal electrical connection part on the substrate is generally fused by hot pressing, so as to weld the chip and the metal electrical connection part on the substrate. However, the heat generated in the hot pressing process will affect the circuit and driving device (such as resistance, capacitance, etc.) on the substrate, the risk of damaging the circuit and driving device on the substrate is high, and the yield of the display module is low. SUMMARY

[0003] The embodiments of the present application disclose a display module, a preparation method thereof and an electronic device, which can reduce the influence of the heat generated when the chip is connected with the conductive layer on the circuit and driving device on the substrate, reduce the risk of damaging the circuit and driving device on the substrate, and improve the yield of the display module.

[0004] In the first aspect, the embodiments of the present application disclose a display module, comprising a substrate and a plurality of chips, the substrate has a first surface, the first surface is provided with a plurality of conductive layers, a plurality of the conductive layers are arranged at intervals, and a plurality of the chips are connected to a plurality of the conductive layers, respectively.

[0005] When the chip is connected with the conductive layer, a heat insulation layer is arranged on the first surface, the heat insulation layer is provided with a plurality of first through holes, and a plurality of first through holes are arranged one by one corresponding to a plurality of the conductive layers.

[0006] As an optional manner, in the embodiments of the present application, the material of the heat insulation layer is opaque or translucent material.

[0007] As an optional manner, in the embodiments of the present application, the thickness of the heat insulation layer is greater than the thickness of the conductive layer.

[0008] As an optional manner, in the embodiments of the present application, the display module further comprises a transparent substrate layer, the transparent substrate layer is arranged on the first surface, the transparent substrate layer is provided with a plurality of second through holes, and a plurality of the first through holes are in communication with a plurality of the second through holes, respectively.

[0009] When the chip is connected with the conductive layer, the heat insulation layer is arranged on the side of the transparent substrate layer away from the first surface.

[0010] As an optional manner, in the embodiments of the present application, the thickness of the transparent substrate layer is greater than or equal to the thickness of the heat insulation layer.

[0011] In a second aspect, the embodiments of the present application disclose an electronic device, comprising a device body and the display module of the first aspect, wherein the display module is arranged on the device body.

[0012] In a third aspect, the embodiments of the present application disclose a preparation method of a display module, comprising:

[0013] providing a substrate, wherein the substrate has a first surface;

[0014] forming a plurality of conductive layers on the first surface, wherein the plurality of conductive layers are arranged at intervals;

[0015] attaching a thermal insulation layer to the first surface, wherein the thermal insulation layer is provided with a plurality of first through holes, and the plurality of first through holes are arranged one by one in correspondence with the plurality of conductive layers;

[0016] connecting a plurality of chips to the plurality of conductive layers one by one respectively;

[0017] peeling the thermal insulation layer from the first surface.

[0018] As an optional manner, in the embodiments of the present application, the material of the thermal insulation layer is opaque or translucent.

[0019] As an optional manner, in the embodiments of the present application, the thickness of the thermal insulation layer is greater than the thickness of the conductive layer.

[0020] As an optional manner, in the embodiments of the present application, before the step of attaching the thermal insulation layer to the first surface, the preparation method further comprises:

[0021] attaching a transparent substrate layer to the first surface, wherein the transparent substrate layer is provided with a plurality of second through holes, and the plurality of second through holes are arranged one by one in correspondence with the plurality of conductive layers.

[0022] As an optional manner, in the embodiments of the present application, the step of attaching the thermal insulation layer to the first surface, wherein the thermal insulation layer is provided with a plurality of first through holes, and the plurality of first through holes are arranged one by one in correspondence with the plurality of conductive layers, comprises:

[0023] attaching the thermal insulation layer to the side of the transparent substrate layer away from the substrate, wherein the thermal insulation layer is provided with a plurality of first through holes, and the plurality of first through holes are arranged one by one in correspondence with the plurality of conductive layers;

[0024] the step of peeling the thermal insulation layer from the first surface, comprises:

[0025] peeling the thermal insulation layer from the transparent substrate layer.

[0026] As an optional manner, in the embodiment of the present application, the thickness of the transparent substrate layer is greater than or equal to the thickness of the heat insulation layer.

[0027] As an optional manner, in the embodiment of the present application, the one-to-one connection of the plurality of chips to the plurality of conductive layers comprises:

[0028] The plurality of chips are connected to the plurality of conductive layers one by one by laser welding.

[0029] As an optional manner, in the embodiment of the present application, the heat insulation layer is attached to the first surface, and the heat insulation layer is provided with a plurality of first through holes, and the plurality of first through holes are arranged one by one corresponding to the plurality of conductive layers, comprising:

[0030] The liquid glue is spin-coated on the first surface to form the heat insulation layer.

[0031] The plurality of first through holes are photoetched on the heat insulation layer by a mask photoetching method, and the plurality of first through holes are arranged one by one corresponding to the plurality of conductive layers.

[0032] Compared with the prior art, the embodiment of the present application has at least the following beneficial effects:

[0033] In the embodiment of the present application, a plurality of conductive layers are arranged on the first surface of the substrate, the plurality of conductive layers are arranged at intervals, and a plurality of chips are connected to the plurality of conductive layers. In this way, the plurality of chips can be electrically connected to the substrate, so that the plurality of chips can be controlled to work through the substrate, and the display function of the display module is realized. Moreover, when the chips are connected to the conductive layers, the heat insulation layer is arranged on the first surface, and the heat insulation layer is used to reduce the influence of the heat generated when the chips are connected to the conductive layers on the lines and driving devices on the substrate, so as to reduce the risk of damaging the lines and driving devices on the substrate and improve the yield of the display screen module. At the same time, the plurality of first through holes of the heat insulation layer are arranged one by one corresponding to the plurality of conductive layers, so as to avoid the heat insulation layer from shielding the conductive layers and providing a space for the connection of the chips and the conductive layers. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0035] Figure 1 is a structural schematic diagram of the display module (when the chips are connected to the conductive layers) disclosed in the embodiment of the present application;

[0036] Figure 2 is a structural diagram of a display module according to the embodiment of the present application; Figure 1 is a structural diagram of a display module according to the embodiment of the present application;

[0037] Figure 3 is a structural diagram of a display module according to the embodiment of the present application;

[0038] Figure 4 is a structural diagram of a display module according to the embodiment of the present application; Figure 2 is a structural diagram of a display module according to the embodiment of the present application;

[0039] Figure 5 is a structural diagram of an electronic device according to the embodiment of the present application;

[0040] Figure 6 is a flow diagram of a preparation method according to the embodiment of the present application;

[0041] Figure 7 is a flow diagram of another preparation method according to the embodiment of the present application.

[0042] Explanation of Main Reference Signs

[0043] 100, display module; 10, substrate; 10a, first surface; 101, conductive layer; 11, chip; 12, thermal insulation layer; 12a, first through hole; 13, transparent base material layer; 13a, second through hole. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0045] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not intended to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0046] In addition, in addition to indicating the orientation or positional relationship, some of the above terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. Those skilled in the art can understand the specific meaning of these terms in the present application according to the specific circumstances.

[0047] In addition, the terms "mount", "set", "provided with", "connect", "connected" should be broadly understood. For example, it can be fixed connection, detachable connection, or integral structure; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0048] In addition, the terms "first", "second" and the like are mainly used to distinguish different devices, elements or components (the specific type and structure may be the same or different), and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "multiple" is two or more.

[0049] The application discloses a display module, a preparation method thereof and an electronic device, which can reduce the influence of heat generated when the chip is connected with the conductive layer on the circuit and driving device on the substrate, reduce the risk of damaging the circuit and driving device on the substrate, and improve the yield of the display screen module.

[0050] In one embodiment, referring to Figure 1 and Figure 2 The display module 100 provided by the embodiment of the application includes a substrate 10 and a plurality of chips 11. The substrate 10 has a first surface 10a, and the first surface 10a is provided with a plurality of conductive layers 101. The plurality of conductive layers 101 are arranged at intervals. The plurality of chips 11 are respectively connected to the plurality of conductive layers 101. When the chip 11 is connected with the conductive layer 101, the display module 100 further includes a heat insulation layer 12. The heat insulation layer 12 is arranged on the first surface 10a. The heat insulation layer 12 is provided with a plurality of first through holes 12a. The plurality of first through holes 12a are arranged in one-to-one correspondence with the plurality of conductive layers 101.

[0051] As Figure 1 shown, Figure 1 a structural schematic diagram of the display module 100 when the chip 11 is connected with the conductive layer 101 is shown.

[0052] The substrate 10 can be a rigid circuit board, a flexible circuit board, a rigid-flexible combined board, etc. The chip 11 can be an LED (Light-emitting Diode) chip 11, an LCD (Liquid Crystal Display) chip 11, etc. The conductive layer 101 can be a metal layer. The metal includes but is not limited to copper, silver, gold, aluminum, etc. The embodiment is not limited in this regard, and the selection can be made according to the actual situation.

[0053] The embodiment realizes the electrical connection between the plurality of chips 11 and the substrate 10 by arranging a plurality of conductive layers 101 on the first surface 10a of the substrate 10 and connecting the plurality of chips 11 to the plurality of conductive layers 101 respectively. In this way, the substrate 10 can control the operation of the chips 11 to realize the display function of the display module 100. When the chips 11 are connected to the conductive layers 101, the conductive layers 101 usually need to be heated to melt, so that the chips 11 are welded to the conductive layers 101, for example, by hot pressing. During the hot pressing process, the heat generated not only melts the conductive layers 101, but also transfers to the substrate 10, which will affect the lines and driving devices on the substrate 10. Therefore, the embodiment further arranges a thermal insulation layer 12 on the first surface 10a when the chips 11 are connected to the conductive layers 101. In this way, the thermal insulation layer 12 reduces the influence of the heat generated when the chips 11 are connected to the conductive layers 101 on the lines and driving devices (such as resistors, capacitors, etc.) on the substrate 10, reduces the risk of damaging the lines and driving devices on the substrate 10, and improves the yield of the display module. In addition, a plurality of first through holes 12a of the thermal insulation layer 12 are arranged one by one corresponding to the plurality of conductive layers 101, which can avoid the thermal insulation layer 12 from shielding the conductive layers 101 and provide space for the connection between the chips 11 and the conductive layers 101. That is, the main function of the thermal insulation layer 12 is to provide thermal insulation for the substrate 10 when the chips 11 are connected to the conductive layers 101, to reduce the influence of the heat generated when the chips 11 are connected to the conductive layers 101 on the lines and driving devices on the substrate 10. Therefore, after the chips 11 are connected to the conductive layers 101, the thermal insulation layer 12 can be peeled off from the substrate 10 to provide space for the packaging process of the display module 100. As shown in Figure 3 and Figure 4 , Figure 3 and Figure 4 shows a schematic view of the display module 100 after the thermal insulation layer 12 is peeled off from the substrate 10.

[0054] In some embodiments, the connection between the chips 11 and the conductive layers 101 can be realized by laser welding. Compared with the hot pressing process, the local stress of the chips 11 is larger during the hot pressing process, and stress concentration occurs on the substrate 10, which may cause the lines on the substrate 10 to be broken. Therefore, the embodiment adopts laser welding, which can avoid the situation that the lines on the substrate 10 are broken due to stress concentration on the substrate 10 when the chips 11 are connected to the conductive layers 101, thereby improving the yield of the display module 100.

[0055] Exemplarily, the material of the thermal insulation layer 12 can include polyimide, silica gel, resin, etc., which is not limited in the embodiment.

[0056] Optionally, the material of the heat insulation layer 12 is opaque or translucent. Considering that the chip 11 is connected with the conductive layer 101, the chip 11 is usually moved to the position corresponding to the conductive layer 101 by means of automatic equipment, and then the two are connected. Based on this, in the embodiment, since the heat insulation layer 12 is provided with a plurality of first through holes 12a corresponding to a plurality of conductive layers 101, respectively, when the automatic equipment moves the chip 11 to the position corresponding to the conductive layer 101, the position can be recognized by means of the first through hole 12a, so that the chip 11 and the conductive layer 101 are aligned. Therefore, by adopting the heat insulation layer 12 made of opaque or translucent material, the automatic equipment can more clearly know the outline of the first through hole 12a, so as to improve the accuracy of determining the position of the first through hole 12a, so as to improve the alignment accuracy of the chip 11 and the conductive layer 101, and the yield of the display module 100 is higher.

[0057] In some embodiments, the thickness of the heat insulation layer 12 is greater than the thickness of the conductive layer 101. In this way, when the heat insulation layer 12 is attached to the first surface 10a, each conductive layer 101 of the substrate 10 is recessed in the corresponding first through hole 12a, and when the chip 11 is moved to contact the conductive layer 101 to further connect the chip 11 and the conductive layer 101, at least part of the peripheral side surface of the chip 11 and the inner wall surface of the first through hole 12a can abut each other, so as to position the chip 11 by means of the first through hole 12a, improve the position accuracy of connecting the chip 11 and the conductive layer 101, and the yield of the display module 100 is higher.

[0058] Further, referring again to Figure 1 and Figure 2 , the display module further comprises a transparent substrate layer 13, the transparent substrate layer 13 is arranged on the first surface 10a, the transparent substrate layer 13 is provided with a plurality of second through holes 13a, the plurality of second through holes 13a are arranged one by one corresponding to the plurality of conductive layers 101, when the chip 11 is connected with the conductive layer 101, the heat insulation layer 12 is arranged on the side of the transparent substrate layer 13 away from the first surface 10a, and the plurality of first through holes 12a are respectively communicated with the plurality of second through holes 13a. Considering that after the chip 11 is connected with the conductive layer 101, in order to provide space for the packaging process of the display module 100, the heat insulation layer 12 needs to be peeled off from the substrate 10, and when the heat insulation layer 12 is peeled off from the substrate 10, there is a risk that the circuit on the substrate 10 will be damaged due to tearing. Therefore, by arranging the transparent substrate layer 13 on the first surface 10a, and arranging the heat insulation layer 12 on the side of the transparent substrate layer 13 away from the substrate 10, the heat insulation layer 12 is prevented from directly contacting the circuit on the substrate 10, so that when the heat insulation layer 12 is peeled off from the substrate 10, the transparent substrate layer 13 is torn, but the circuit on the substrate 10 is not torn, and the situation that the circuit on the substrate 10 is damaged due to tearing when the heat insulation layer 12 is peeled off from the substrate 10 can be avoided.

[0059] And the display module 100 needs to fill transparent material when packaging, on the one hand, the display module 100 can be packaged, on the other hand, the transparent material will not affect the display effect of the display module 100. Based on this, even when the heat insulation layer 12 peels off the substrate 10, part of the transparent substrate layer 13 peels off the substrate 10 with the heat insulation layer 12, and the remaining part of the transparent substrate layer 13 reduces the amount of transparent material filled when the display module 100 is packaged, so as to reduce the filling of transparent material in the packaging process and improve the production efficiency of the display module 100.

[0060] In addition, the plurality of second through holes 13a of the transparent substrate layer 13 are arranged one by one corresponding to the plurality of conductive layers 101, which can avoid the transparent substrate layer 13 shielding the conductive layer 101, and provide space for the chip 11 to connect with the conductive layer 101.

[0061] Exemplarily, the thickness of the transparent substrate layer 13 is greater than or equal to the thickness of the heat insulation layer 12. If the thickness of the transparent substrate layer 13 is less than the thickness of the heat insulation layer 12, when the heat insulation layer 12 peels off the substrate 10, the force for peeling off acts on the transparent substrate layer 13 at the same time, and the transparent substrate layer 13 is more likely to peel off the substrate 10 than the heat insulation layer 12, so that the transparent substrate layer 13 will tear the circuit on the substrate 10 and cause damage to the circuit. Therefore, by making the thickness of the transparent substrate layer 13 greater than or equal to the thickness of the heat insulation layer 12, when the heat insulation layer 12 peels off the substrate 10, the transparent substrate layer 13 can avoid tearing the circuit on the substrate 10 and causing damage to the circuit.

[0062] The embodiment of the present application provides a display module 100, by arranging a plurality of conductive layers 101 on the first surface 10a of the substrate 10, the plurality of conductive layers 101 are arranged at intervals, and a plurality of chips 11 are connected to the plurality of conductive layers 101, so that the plurality of chips 11 can be electrically connected to the substrate 10, thereby controlling the working of the plurality of chips 11 through the substrate 10 to realize the display function of the display module 100. And when the chip 11 is connected with the conductive layer 101, the heat insulation layer 12 is arranged on the first surface 10a, and the heat insulation layer 12 is used to reduce the influence of the heat generated when the chip 11 is connected with the conductive layer 101 on the circuit and the driving device on the substrate 10, so as to reduce the risk of damaging the circuit and the driving device on the substrate 10 and improve the yield of the display screen module. At the same time, the plurality of first through holes 12a of the heat insulation layer 12 are arranged one by one corresponding to the plurality of conductive layers 101, which can avoid the heat insulation layer 12 shielding the conductive layer 101 and provide space for the chip 11 to connect with the conductive layer 101.

[0063] In one embodiment, please refer to Figure 5A structural schematic diagram of an electronic device 200 provided by the embodiment of the present application is shown in the figure, which comprises a device body 20 and the display module 100 of the first embodiment, and the display module 100 is arranged on the device body 20.

[0064] The electronic device 200 comprises but is not limited to a display, a television, a computer, a mobile phone and the like, and the present embodiment does not make specific limitation thereto.

[0065] The electronic device 200 provided by the embodiment of the present application can reduce the influence of the heat generated when the chip is connected with the conductive layer on the circuit and the driving device on the substrate, reduce the risk of damaging the circuit and the driving device on the substrate, and improve the yield of the display module.

[0066] In one embodiment, refer to Figure 6 A flowchart of a preparation method provided by the embodiment of the present application is shown in the figure, the preparation method is applied to the display module, and the preparation method comprises the following steps.

[0067] 301. A substrate is provided, which has a first surface.

[0068] Exemplarily, the substrate can be a rigid circuit board, a flexible circuit board, a rigid-flexible combined board and the like, and the present embodiment does not make specific limitation thereto, which can be selected according to the actual situation.

[0069] 302. A plurality of conductive layers are formed on the first surface, and the plurality of conductive layers are arranged at intervals.

[0070] The step 302 can provide the condition for the electrical connection between the plurality of chips and the substrate by forming the plurality of conductive layers on the first surface, and the plurality of conductive layers are arranged at intervals to be insulated from each other, so that the substrate can independently control each chip when the plurality of chips are respectively electrically connected with the plurality of conductive layers.

[0071] 303. A heat insulation layer is attached to the first surface, the heat insulation layer is provided with a plurality of first through holes, and the plurality of first through holes are arranged one by one corresponding to the plurality of conductive layers.

[0072] Alternatively, the step 303 can be: spin coating liquid glue on the first surface to form a heat insulation layer, and a plurality of first through holes are photoetched on the heat insulation layer by a mask photoetching method, and the plurality of first through holes are arranged one by one corresponding to the plurality of conductive layers.

[0073] The spin coating can also be called rotary coating, which is a coating process that relies on the centrifugal force and gravity generated when the workpiece rotates to flow the liquid droplets of the coating material on the workpiece to the surface of the workpiece. That is, the liquid glue can be fully spread on the first surface by rotating the substrate and using the centrifugal force and gravity generated when the liquid glue falls on the first surface.

[0074] In step 303, the heat insulation layer is attached to the first surface, so that the heat generated when the chip is connected to the conductive layer can be reduced by the heat insulation of the heat insulation layer, thereby reducing the risk of damaging the circuit and driving device on the substrate and improving the yield of the display module.

[0075] Exemplarily, the material of the heat insulation layer can include polyimide, silica gel, resin, etc., which is not specifically limited in the embodiment.

[0076] In some embodiments, the thickness of the heat insulation layer is greater than the thickness of the conductive layer. In this way, when the heat insulation layer is attached to the first surface, each conductive layer of the substrate is recessed in the corresponding first through hole, and when the chip is moved to contact the conductive layer to further connect the chip to the conductive layer, at least part of the side surface of the chip can abut against the inner wall surface of the first through hole, thereby positioning the chip by the first through hole and improving the position accuracy of the connection between the chip and the conductive layer, and the yield of the display module is higher.

[0077] 304, respectively connecting a plurality of chips to a plurality of conductive layers.

[0078] Optionally, the connection between the chip and the conductive layer can be realized by a hot pressing process or a laser welding process. The embodiment preferably uses the laser welding process, which can avoid the stress concentration of the substrate and the breakage of the circuit on the substrate when the chip is connected to the conductive layer, thereby improving the yield of the display module.

[0079] 305, peeling the heat insulation layer from the first surface.

[0080] Step 305 peels the heat insulation layer from the substrate, which can provide space for the packaging process of the display module.

[0081] The embodiment of the application provides a preparation method, which can reduce the influence of the heat generated when the chip is connected to the conductive layer on the circuit and driving device on the substrate, reduce the risk of damaging the circuit and driving device on the substrate, and improve the yield of the display module.

[0082] In one embodiment, please refer to Figure 7 A flowchart of a preparation method provided by the embodiment of the application is provided, the preparation method is applied to a display module, and the preparation method comprises the following steps:

[0083] 401, providing a substrate, the substrate having a first surface.

[0084] 402, forming a plurality of conductive layers on the first surface, and the plurality of conductive layers are arranged at intervals.

[0085] 403. A transparent substrate layer is attached to the first surface. The transparent substrate layer has multiple second through holes, and the multiple second through holes are arranged one-to-one with multiple conductive layers.

[0086] In this design, multiple second vias in the transparent substrate layer correspond to multiple conductive layers, which can prevent the transparent substrate layer from blocking the conductive layers and provide a buffer for the connection between the chip and the conductive layers.

[0087] 404. The heat insulation layer is attached to the side of the transparent substrate layer away from the substrate. The heat insulation layer is provided with a plurality of first through holes, and the plurality of first through holes are respectively connected to a plurality of second through holes.

[0088] In some other embodiments, the transparent substrate layer and the heat insulation layer may be bonded together first, and then the whole may be bonded to the first surface.

[0089] 405. Peel off the heat insulation layer from the transparent substrate layer.

[0090] By implementing steps 403 and 404, a transparent substrate layer is provided on the first surface of the substrate, and a heat insulation layer is provided on the side of the transparent substrate layer away from the substrate. This can prevent the heat insulation layer from directly contacting the circuits on the substrate. Thus, when step 405 is implemented, the transparent substrate layer is torn, and the circuits on the substrate are torn. This can prevent the heat insulation layer from tearing the circuits on the substrate when it is peeled off, thus avoiding damage to the circuits.

[0091] This invention provides a manufacturing method that can reduce the impact of heat generated when the chip is connected to the conductive layer on the circuits and driving devices on the substrate, reduce the risk of damaging the circuits and driving devices on the substrate, and prevent the thermal insulation layer from tearing the circuits on the substrate during the peeling process, thereby improving the yield of the display module.

[0092] The above provides a detailed description of a display module, its preparation method, and electronic device disclosed in the embodiments of the present invention. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the display module, its preparation method, electronic device, and its core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A display module, characterized in that, include: A substrate having a first surface, wherein the first surface is provided with a plurality of conductive layers, the plurality of conductive layers being spaced apart from each other. as well as Multiple chips, each of which is connected to a plurality of conductive layers; When connecting the chip to the conductive layer, a heat insulation layer is provided on the first surface. The heat insulation layer has a plurality of first through holes, which are provided one-to-one with the plurality of conductive layers. The inner wall surface of the plurality of first through holes abuts against at least a portion of the peripheral surface of the plurality of chips.

2. The display module according to claim 1, characterized in that, The insulation layer is made of an opaque or semi-transparent material.

3. The display module according to claim 1, characterized in that, The thickness of the heat insulation layer is greater than the thickness of the conductive layer.

4. The display module according to any one of claims 1 to 3, characterized in that, The display module further includes a transparent substrate layer, which is disposed on the first surface. The transparent substrate layer has a plurality of second through holes, and the plurality of second through holes are disposed in a one-to-one correspondence with the plurality of conductive layers. When the chip is connected to the conductive layer, the heat insulation layer is disposed on the side of the transparent substrate layer opposite to the first surface, and the plurality of first through holes are respectively connected to the plurality of second through holes.

5. The display module according to claim 4, characterized in that, The thickness of the transparent substrate layer is greater than or equal to the thickness of the heat insulation layer.

6. An electronic device, characterized in that, The electronic device includes a device body and a display module as described in claims 1 to 5, wherein the display module is disposed on the device body.

7. A method for manufacturing a display module, characterized in that, The preparation method includes: A substrate is provided, the substrate having a first surface; Multiple conductive layers are formed on the first surface, and the multiple conductive layers are spaced apart. A heat insulation layer is attached to the first surface, and the heat insulation layer is provided with a plurality of first through holes, and the plurality of first through holes are respectively provided with a plurality of conductive layers; Multiple chips are connected one-to-one to multiple conductive layers; Peel the heat insulation layer off the first surface.

8. The preparation method according to claim 7, characterized in that, Before attaching the heat insulation layer to the first surface, wherein the heat insulation layer has a plurality of first through holes, and the plurality of first through holes are respectively disposed in correspondence with the plurality of conductive layers, the preparation method further includes: A transparent substrate layer is attached to the first surface. The transparent substrate layer has a plurality of second through holes, and the plurality of second through holes are arranged in a one-to-one correspondence with the plurality of conductive layers.

9. The preparation method according to claim 8, characterized in that, The heat insulation layer is attached to the first surface, and the heat insulation layer has a plurality of first through holes, each of which corresponds to a plurality of conductive layers, including: The heat insulation layer is attached to the side of the transparent substrate layer away from the substrate. The heat insulation layer is provided with a plurality of first through holes, and the plurality of first through holes are respectively connected to a plurality of second through holes. The step of peeling the heat insulation layer off the first surface includes: Peel the heat insulation layer off the transparent substrate layer.

10. The preparation method according to any one of claims 7 to 9, characterized in that, The step of connecting multiple chips to multiple conductive layers one-to-one includes: Multiple chips are individually connected to multiple conductive layers by laser welding.

11. The preparation method according to any one of claims 7 to 9, characterized in that, The heat insulation layer is attached to the first surface, and the heat insulation layer has a plurality of first through holes, each of which corresponds to a plurality of conductive layers, including: The heat insulation layer is formed by spin-coating liquid adhesive onto the first surface; Multiple first through holes are photolithographically formed on the heat insulation layer using a photomask, and each of the multiple first through holes corresponds to one of the multiple conductive layers.

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