Dual-head die bonding apparatus

Abstract

The application relates to the technical field of semiconductor wafer processing equipment, and discloses a double-head die bonding device which comprises a fixed connecting plate, a crosswise linear driving module is connected to a crossbeam base below the fixed connecting plate, a longitudinal linear driving module is installed below the crossbeam base, a rectangular voice coil vertical lifting module is connected to the mover below the longitudinal linear driving module, two movers of a voice coil motor of the rectangular voice coil vertical lifting module are respectively connected to a set of die bonding heads, the longitudinal linear driving module comprises a plurality of spliced stator mechanisms, a floating stator damping module is arranged below the longitudinal linear driving module, the rectangular voice coil vertical lifting module drives the vertical lifting of the die bonding heads, the longitudinal linear driving module drives the longitudinal displacement of the rectangular voice coil vertical lifting module, and the crosswise linear driving module drives the crosswise displacement of the crossbeam base. The hoisting type structure is adopted, the XY displacement module occupies less space, unnecessary displacement is reduced, and the mounting efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor wafer processing equipment, in particular to a double-head die bonding device. BACKGROUND

[0002] The die bonder is a key equipment in the semiconductor packaging process, which realizes the automatic picking of chips (die) from the wafer and placing them on the lead frame. The current die bonding device is composed of multiple linear modules to form a three-axis moving platform, and the die bonding head performs a series of actions such as lifting, translation, and material taking.

[0003] The die bonder disclosed in the Chinese utility model patent "Die Bonding Device and Die Bonder" (application number: CN202121460772) has a main structure of a die bonding support installed on the ground in the workshop. The horizontal moving module, vertical moving module, and lifting module are installed on the die bonding support to jointly drive the die bonding head to realize free movement in XYZ three directions. Due to the fixed mode of the support, the horizontal moving module protrudes from the support, and the vertical moving module protrudes from the horizontal moving module, which results in a large occupied space of the entire device and reduces the operation space of the die bonding head. In addition, the moving structure design leads to a slow die bonding efficiency. SUMMARY

[0004] The purpose of the present application is to solve the above problems and provide a double-head die bonding device that occupies less space through a hoisting structure, reduces unnecessary displacement, and improves the die bonding efficiency.

[0005] The technical solution adopted by the present application is as follows:

[0006] A double-head die bonding device, characterized in that it comprises a fixed connection plate, a horizontal linear drive module is connected to a beam base below the fixed connection plate, a vertical linear drive module is installed below the beam base, a rectangular voice coil vertical lifting module is connected to the mover in front of the vertical linear drive module, two movers of the voice coil motor of the rectangular voice coil vertical lifting module are respectively connected to a set of die bonding heads, the vertical linear drive module comprises a plurality of spliced stator mechanisms, a floating stator damping module is arranged below the vertical linear drive module, the rectangular voice coil vertical lifting module drives the vertical lifting of the die bonding head, the vertical linear drive module drives the vertical displacement of the rectangular voice coil vertical lifting module, and the horizontal linear drive module drives the horizontal displacement of the beam base, so that the die bonding head realizes the movement of the wafer in XYZ three-dimensional directions.

[0007] Further, the horizontal linear drive module comprises a linear motor, a gantry push plate, and a limiting assembly arranged between the fixed connection plate and the beam base, and the length and width dimensions of the beam base and the fixed connection plate are matched.

[0008] Further, a motor support seat is arranged below the longitudinal linear drive module, the rectangular voice coil vertical lifting module is installed on the motor support seat, and a buffer assembly is arranged at the rear side of the motor support seat.

[0009] Further, the fixed plate on which the rectangular voice coil vertical lifting module is installed is arranged, two suction head bases are installed at the front end of the fixed plate, a suction rod is installed in each suction head base, the lower end of the suction rod is a suction head, and the upper end edge is connected with a pneumatic unit.

[0010] Further, two direction adjusting motors are arranged at the rear end of the fixed plate, a transmission wheel is arranged below the suction rod, and each direction adjusting motor is connected to one suction rod.

[0011] Further, a reading head assembly is installed on the outer side of each of the two suction head bases.

[0012] Further, a position sensor is arranged between the longitudinal linear drive module and the cross beam base.

[0013] Further, the cross beam base has a trapezoidal structure with a large upper end and a small lower end, and heat exchange channels are arranged at both ends.

[0014] Further, the two movers of the voice coil motor are independently driven by a control system.

[0015] The beneficial effects of the present application are:

[0016] (1) The crystal fixing device has a more reasonable structure and occupies less space through the lifting mode;

[0017] (2) The taking and placing operations of two wafers are simultaneously completed, and the work efficiency is improved;

[0018] (3) The segmented linear motor is designed to be arranged compactly in the base, has high power, and has fast response;

[0019] (4) The vibration reduction module and the heat dissipation channel structure ensure that the system operates efficiently and stably. BRIEF DESCRIPTION OF DRAWINGS

[0020] The overall three-dimensional structure of the present application is intended to be attached Figure 1

[0021] The lateral linear drive module position after the transparentization of the fixed connection plate is a partial schematic view; Figure 2 The three-dimensional structure of the cross beam base is a schematic view;

[0022] Figure 3 The three-dimensional structure of the cross beam base is a schematic view;

[0023] The three-dimensional structure of the cross beam base is a schematic view; Figure 4 The three-dimensional structure of the cross beam base is a schematic view;​​

[0024] Figure 1 is a schematic view of a longitudinal position of the present application; Figure 5 Figure 2 is a schematic view of a cross section of the present application;

[0025] Figure 3 is a schematic view of a side perspective of the present application; Figure 6 Figure 4 is a schematic view of a bottom perspective of the present application.

[0026] Figure 5 is a schematic view of a side perspective of the present application. Figure 7 Figure 6 is a schematic view of a bottom perspective of the present application.

[0027] The reference numbers in the drawings are as follows:

[0028] 1. fixed connecting plate; 2. transverse linear driving module;

[0029] 3. crossbeam base; 4. linear motor;

[0030] 5. gantry push plate; 6. limiting component;

[0031] 7. longitudinal linear driving module; 8. stator mechanism;

[0032] 9. floating stator damping module; 10. guide rail slider;

[0033] 11. mover group; 12. exhaust fan;

[0034] 13. air inlet; 14. rectangular voice coil vertical lifting module;

[0035] 15. die bonding head; 16. motor support seat;

[0036] 17. buffer component; 18. fixed plate;

[0037] 19. suction head base; 20. suction rod;

[0038] 21. suction head; 22. steering motor;

[0039] 23. transmission wheel; 24. reading head component. DETAILED DESCRIPTION

[0040] The specific embodiment of the double-head die bonding device of the present application is described in detail below in combination with the drawings.

[0041] Referring to the drawings, Figure 1 The double-head die bonding device includes a fixed connecting plate 1, which is installed below the top plate (not shown in the drawing) of a building or workshop equipment, and is fixed with the top plate by fasteners. The top plate is set to a predetermined height, which matches the working position of the double-head die bonding device.

[0042] Referring to the drawings, Figure 2,Fixed connection plate 1 below through the setting of horizontal linear drive module 2 connecting beam base 3, horizontal linear drive module 2 includes setting between fixed connection plate 1 and beam base 3 linear motor 4, gantry push plate 5 and limit component 6. The top size of beam base 3 and the size of fixed connection plate 1 are basically matched. Linear motor 4 drives beam base 3 to produce displacement in the width direction of fixed connection plate 1, so that beam base 3 produces displacement control in the horizontal direction and X axis direction. Linear motor 4 is divided into three groups and arranged in the length direction of beam base 3, two sets of gantry push plate 5 are arranged between the three groups of linear motor 4, and limit component 6 is installed on one side of the middle linear motor 4. Linear motor 4 generates horizontal thrust on beam base 3, gantry push plate 5 supports the stability of thrust, and limit component 6 controls the movement range of beam base 3.

[0043] Referring to the accompanying drawings Figure 3 ,Beam base 3 is a frame structure, and the space below is used for installing longitudinal linear drive module 7. The cross section is rectangular with the upper part being wide and the lower part being narrow, and the two sides are closed or provided with lightening and ventilation holes. The overall size is comparable to that of fixed connection plate 1.

[0044] Referring to the accompanying drawings Figure 4 、 5 ,Beam base 3 is a frame structure, and the space below is used for installing longitudinal linear drive module 7. The cross section is rectangular with the upper part being wide and the lower part being narrow, and the two sides are closed or provided with lightening and ventilation holes. The overall size is comparable to that of fixed connection plate 1.

[0045] Referring to the accompanying drawings Figure 1 ,Since the stator mechanism 8 drives the mover group 11 is the main motion power consumption of the die bonding device, the stator mechanism 8 will generate heat, therefore, air flow channels are formed at both ends of the beam base 3, one end is provided with an exhaust fan 12, and the other end is provided with an air inlet 13 with a filter.

[0046] Referring to the accompanying drawings Figure 1 、 4The rectangular voice coil vertical lifting module 14 is used to drive the vertical lifting of the die bonding head 15. The mover set 11 of the longitudinal linear driving module 7 drives the longitudinal displacement of the rectangular voice coil vertical lifting module 14, i.e. the displacement in the Y-axis direction. The motor support seat 16 is connected to the two mover sets 11 of the longitudinal linear driving module 7, and the rectangular voice coil vertical lifting module 14 is connected to the motor support seat 16. The rear side of the motor support seat 16 is provided with the buffer assembly 17, so that the rectangular voice coil vertical lifting module 14 can move stably. The rectangular voice coil vertical lifting module 14 includes two movers, and two sets of die bonding heads 15 are installed respectively (only one set of die bonding head is drawn in the figure). The rectangular voice coil vertical lifting module 14 drives the lifting of the two die bonding heads 15, so as to realize the Z-axis displacement of the die bonding head 15. The displacements of the X-axis, Y-axis and Z-axis are matched with each other, so as to realize the full freedom motion of the die bonding head 15.

[0047] Referring to the accompanying drawings Figure 6 , 7 The structure of the die bonding head 15 includes the fixed plate 18 installed on the rectangular voice coil vertical lifting module 14. The two suction head bases 19 are installed at the front end of the fixed plate 18. The suction rod 20 is installed in each suction head base 19. The lower end of the suction rod 20 is the suction head 21, and the upper end is connected to the pneumatic unit. The two direction adjusting motors 22 are arranged at the rear end of the fixed plate 18. The transmission wheel 23 is arranged below the suction rod 20. Each direction adjusting motor 22 is connected to one suction rod 20. The reading head assembly 24 is installed at the outer side of each of the two suction head bases 19.

[0048] The working process of the die bonding device will be introduced as follows. The control system determines the moving amount of the XYZ-axis according to the predetermined operation path of the die bonding head 15, and drives the horizontal linear driving module 2 and the longitudinal linear driving module 7 respectively or simultaneously, so that the die bonding head 15 moves to the upper side of the wafer chip. The rectangular voice coil vertical lifting module 14 drives the die bonding head 15 to fall. The suction head 21 of the die bonding head 15 sucks the wafer chip and then lifts it. The die bonding head 15 is moved to the substrate at the wiring position through the XY-axis. The die bonding head 15 adjusts the position through the direction adjusting motor 22 after sucking the wafer chip. One of the two suction heads 21 of the die bonding head 15 sucks the wafer chip to be wired, and then moves to the substrate at the wiring position. The second suction head 21 sucks the chip which has been tested, and then the chip on the first suction head 21 is placed on the wiring position, so as to realize the action of replacing the chip by taking one and placing one.

[0049] The above is only the preferred embodiment of the present application. It should be pointed out that, for those skilled in the art, some improvements and refinements can be made without departing from the principles of the present application, and these improvements and refinements should also be regarded as the protection scope of the present application.

Claims

1. A dual-head die bonding apparatus, characterized by: The application relates to a wafer operation device, which comprises a fixed connecting plate, a crosswise linear drive module connecting a crossbeam base below the fixed connecting plate, a longitudinal linear drive module installed below the crossbeam base, a rectangular voice coil vertical lifting module connected to the mover below the longitudinal linear drive module, two movers of a voice coil motor of the rectangular voice coil vertical lifting module being respectively connected to a set of fixed crystal heads, the longitudinal linear drive module comprising a plurality of spliced stator mechanisms, a floating stator damping module being arranged below the longitudinal linear drive module, the rectangular voice coil vertical lifting module driving the fixed crystal heads to vertically lift, the longitudinal linear drive module driving the rectangular voice coil vertical lifting module to longitudinally displace, the crosswise linear drive module driving the crossbeam base to transversely displace, so that the fixed crystal heads realize wafer operation in XYZ three-dimensional directions, the crosswise linear drive module comprising linear motors arranged between the fixed connecting plate and the crossbeam base, a gantry push plate and a limiting component, the crossbeam base and the fixed connecting plate matching in length and width, a motor support seat being arranged below the longitudinal linear drive module, the rectangular voice coil vertical lifting module being installed on the motor support seat, and a buffer component being arranged at the rear side of the motor support seat.

2. The dual-head die bonding apparatus of claim 1, wherein: The fixed crystal head comprises a fixed plate installed on the rectangular voice coil vertical lifting module, two suction head bases installed at the front end of the fixed plate, a suction rod installed in each suction head base, and a suction head at the lower end of the suction rod and a pneumatic unit at the upper end of the suction rod.

3. The dual-head die bonding apparatus of claim 2, wherein: Two steering motors are arranged at the rear end of the fixed plate, and a transmission wheel is arranged below the suction rod.

4. The dual-head die bonding apparatus of claim 2, wherein: A reading head component is installed at the outer side of each of the two suction head bases.

5. The dual-headed die bonding apparatus of claim 1, wherein: A position sensor is arranged between the longitudinal linear drive module and the crossbeam base.

6. The dual-headed die bonding apparatus of claim 1, wherein: The crossbeam base is in a trapezoidal structure with the upper part being larger and the lower part being smaller, and heat exchange channels are arranged at the two ends.

7. The dual-headed die bonding apparatus of claim 1, wherein: The two movers of the voice coil motor are independently driven by a control system.

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