power supply chip
By designing the power chip and combining it with the isolated power supply transmitter module and the drive circuit control module, the problem of large motherboard size in switching power supply systems was solved, the driving function and integration of power devices were improved, and the system cost was reduced.
Patent Information
- Application Number
- CN202210655450.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-06-10
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2042-06-10
AI Technical Summary
The motherboards of existing switching power supply systems are relatively large, and their size needs to be reduced to improve integration.
The system employs a power chip design, including a first sub-chip, a second sub-chip, a transformer, and an isolator. By combining an isolated power transmitter module and a drive circuit control module, the power device can be driven without an auxiliary power supply, reducing the number of components and the system size.
Without adding an auxiliary power supply, the power device driving function is realized, the size of the switching power supply system motherboard is reduced, the integration is improved, and the cost is reduced.
Smart Images

Figure CN115021574B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of integrated circuits, and in particular to a power supply chip. BACKGROUND
[0002] In the field of power electronics, switching power supply systems are gradually widely used. The main board of a switching power supply system generally includes semiconductor switching devices (such as transistors, field effect tubes, thyristors, etc.), switching transformers, rectifiers, etc. In order to realize the functions of turning on, turning off, maintaining conduction, etc. of the semiconductor switching devices, the main board of the switching power supply system also includes an isolation power supply chip, a driving chip, and other circuits containing various semiconductor switching devices driven by the driving chip, etc., wherein the isolation power supply chip is used to supply power to the driving chip.
[0003] However, the main board of the current switching power supply system is relatively large in size, and therefore, how to reduce the size of the main board of the switching power supply system becomes a technical problem to be solved. SUMMARY
[0004] The present application provides a power supply chip, which can reduce the size of the main board of the switching power supply system.
[0005] In a first aspect, the present application provides a power supply chip, which includes a first sub-chip, a second sub-chip, a transformer, and an isolator. The first sub-chip includes an isolation power supply transmitting module and a driving circuit control module. The second sub-chip includes an isolation power supply receiving module and a driving circuit buffer module. The isolation power supply transmitting module in the first sub-chip is configured to convert a first current signal input from an input end of the power supply chip into a second current signal, and input a third current signal output after the second current signal is coupled by the transformer to the isolation power supply receiving module. The third current signal is configured to supply power to the driving circuit buffer module in the second sub-chip. The driving circuit control module in the first sub-chip is configured to output a driving signal based on a first control signal input from the input end of the power supply chip, and input the driving signal to the driving circuit buffer module in the second sub-chip through the isolator.
[0006] The first port of the isolation power supply transmitting module is connected to the first port of the transformer. The second port of the transformer is connected to the first port of the isolation power supply receiving module. The second port of the isolation power supply receiving module is connected to the first port of the driving circuit buffer module. The third port of the isolation power supply receiving module is connected to the first port of the isolator. The second port of the isolator is connected to the second port of the isolation power supply transmitting module. The third port of the isolator is connected to the first port of the driving circuit control module. The fourth port of the isolator is connected to the second port of the driving circuit buffer module.
[0007] In this aspect, the power supply chip comprises a first sub-chip, a second sub-chip, a transformer and an isolator, the first sub-chip comprises an isolated power supply transmitting module and a driving circuit control module, the second sub-chip comprises an isolated power supply receiving module and a driving circuit buffer module, and the third current signal is used to supply power to the driving circuit buffer module in the second sub-chip, so that the power supply chip can provide the driving function of the power device without an auxiliary power supply, and the functions are realized in one chip, thereby reducing the number of components of the system, reducing the volume of the mainboard of the switching power supply system, and improving the integration of the mainboard.
[0008] In combination with the first aspect, in a possible implementation manner, the first sub-chip, the second sub-chip, the transformer and the isolator are jointly encapsulated to form the power supply chip.
[0009] In this implementation manner, the first sub-chip, the second sub-chip, the transformer and the isolator are jointly encapsulated to form the power supply chip, so that the overall chip area can be reduced and the cost can be reduced.
[0010] In combination with the first aspect, in a possible implementation manner, the isolated power supply transmitting module comprises a power transmitting module and a power transmitting control module: an output end of the power transmitting control module is connected to an input end of the power transmitting module, and the power transmitting control module is used to input a second control signal to the power transmitting module; the power transmitting module is used to receive the first current signal, adjust the signal duty cycle of the corresponding power device based on the second control signal, and output a second current signal to the transformer.
[0011] The first port of the power transmitting module is connected to the first port of the transformer, the first port of the power transmitting control module is connected to the second port of the isolator, and the second port of the power transmitting control module is connected to the second port of the power transmitting module.
[0012] In combination with the first aspect, in a possible implementation manner, the isolated power supply receiving module comprises a power receiving module and a power feedback module, and an output end of the power receiving module is connected to an input end of the power feedback module; the power receiving module is used to receive the third current signal, rectify the third current signal, and output a first voltage; the power feedback module is used to receive the first voltage, and input a feedback signal obtained by subtracting a preset reference voltage from the first voltage to the power transmitting control module through the isolator; and the power transmitting control module is further used to output the second control signal based on the feedback signal.
[0013] The first port of the power receiving module is connected with the second port of the transformer, the second port of the power receiving module is connected with the first port of the power feedback module, and the second port of the power feedback module is connected with the first port of the isolator.
[0014] With reference to the first aspect, in a possible implementation manner, the power feedback module and the driving circuit buffer module are powered by the first voltage.
[0015] In this implementation manner, the voltage output by the power receiving module on the same chip substrate can power the power feedback module and the driving circuit buffer module, and the function of powering the driving circuit can be realized on the same chip, thereby realizing the driving function of the power device.
[0016] With reference to the first aspect, in a possible implementation manner, the power transmitting module comprises a full-bridge topology, the full-bridge topology comprises a first power switch, a second power switch, a third power switch and a fourth power switch; when the first power switch and the fourth power switch are turned on and the second power switch and the third power switch are turned off, the first power switch, the primary coil of the transformer and the fourth power switch form a first loop; when the first power switch and the fourth power switch are turned off and the second power switch and the third power switch are turned on, the second power switch, the primary coil of the transformer and the third power switch form a second loop.
[0017] In this implementation manner, the power transmitting module can be a full-bridge topology, and the signal duty cycle of the current signal is adjusted by using the full-bridge topology to output a current signal meeting the requirements.
[0018] With reference to the first aspect, in a possible implementation manner, the power transmitting control module is specifically configured to: when the first voltage is less than the preset reference voltage, increase the duty cycle of the gate signal of the first power switch, the second power switch, the third power switch and the fourth power switch to a first threshold value, so that the first voltage is equal to the preset reference voltage, and the first threshold value is less than or equal to 50%; when the first voltage is greater than the preset reference voltage, decrease the duty cycle of the gate signal of the first power switch, the second power switch, the third power switch and the fourth power switch to a second threshold value, so that the first voltage is equal to the preset reference voltage, and the second threshold value is less than or equal to 50% and greater than or equal to a preset minimum threshold value.
[0019] In the implementation, the duty cycle of the gate signal of the first power switch tube, the second power switch tube, the third power switch tube and the fourth power switch tube is controlled, so as to adjust the size of the output voltage of the power transmitting module.
[0020] With reference to the first aspect, in a possible implementation, if the second threshold value is equal to the preset minimum threshold value and the first voltage is greater than the preset reference voltage, the power transmitting control module enters a pulse skipping mode.
[0021] In the implementation, after the power transmitting control module enters the pulse skipping mode, part of the square wave in the interval is skipped, so as to continue to control and adjust the size of the output voltage of the power transmitting module.
[0022] With reference to the first aspect, in a possible implementation, the power transmitting module further includes a half-bridge topology, and the half-bridge topology includes a fifth power switch tube and a sixth power switch tube.
[0023] In the implementation, the power transmitting module can also be a half-bridge topology, so as to adjust the signal duty cycle of the current signal and output a suitable current signal.
[0024] With reference to the first aspect, in a possible implementation, the power transmitting module includes a capacitor, and the capacitor, together with the magnetizing inductance and leakage inductance of the primary coil of the transformer, constitutes an LLC resonant converter.
[0025] In the implementation, the capacitor, together with the magnetizing inductance and leakage inductance of the primary coil, constitutes an LLC resonant converter, so that the power transmitting control module can control the frequency of the square wave signal of the gate of the power switch tube, and the power transmitting module can more accurately output a suitable voltage.
[0026] With reference to the first aspect, in a possible implementation, the power receiving module includes a full-bridge rectifier, and the full-bridge rectifier is configured to convert alternating current into direct current.
[0027] In the implementation, the full-bridge rectifier can be used to rectify the received current signal.
[0028] With reference to the first aspect, in a possible implementation, the isolator includes a capacitor isolator, an isolation transformer or an optical coupling isolator, and the isolator is configured to perform preset conversion on the received input signal and output.
[0029] In the implementation, the capacitor isolator, the isolation transformer or the optical coupling isolator can be used for signal transmission from the power feedback module to the power transmitting module and from the driving circuit control module to the driving circuit buffer module.
[0030] With reference to the first aspect, in a possible implementation manner, the driving circuit control module comprises a driving controller.
[0031] In this implementation manner, the driving controller can be used to control the output driving signal.
[0032] With reference to the first aspect, in a possible implementation manner, the driving circuit buffer module comprises an under-voltage lockout (UVLO) module, and the UVLO module is configured to protect the driving circuit buffer module.
[0033] In this implementation manner, the UVLO module is used to protect the driving circuit buffer module, that is, the logic circuit of the output stage of the driving circuit buffer module is in a running state to output the driving signal only when the output voltage of the power receiving module meets the condition.
[0034] In a second aspect, the present application provides an electronic device, which comprises the power supply chip as described in the first aspect or any possible implementation manner thereof.
[0035] In a third aspect, the present application provides a switching power supply system, which comprises the power supply chip as described in the first aspect or any possible implementation manner thereof. BRIEF DESCRIPTION OF DRAWINGS
[0036] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and serve to explain the principles of the present application together with the specification.
[0037] Figure 1 A schematic diagram of a conventional driving auxiliary power supply path structure is provided for an embodiment of the present application;
[0038] Figure 2 A schematic diagram of a power supply chip structure is provided for an embodiment of the present application;
[0039] Figure 3 A schematic diagram of a power supply chip structure is provided for another embodiment of the present application;
[0040] Figure 4 A schematic diagram of a power supply chip structure is provided for yet another embodiment of the present application;
[0041] Figure 5 A schematic diagram of a pulse skipping mode is provided for an embodiment of the present application;
[0042] Figure 6 A schematic diagram of a power supply chip structure is provided for yet another embodiment of the present application;
[0043] Figure 7 A schematic diagram of a power supply chip structure is provided for yet another embodiment of the present application;
[0044] Figure 8 This is a schematic diagram of the structure of a power chip provided in another embodiment of this application.
[0045] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation
[0046] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0047] In the field of power electronics, switching power supply systems are increasingly widely used. The mainboard of a switching power supply system typically includes semiconductor switching devices (such as transistors, MOSFETs, and SCRs), switching transformers, and rectifiers. To enable the switching of these semiconductor switching devices (turning them on, off, and maintaining their conduction), the mainboard also includes isolation power chips, driver chips, and other circuits driven by the driver chips, containing various semiconductor switching devices. The isolation power chips supply power to the driver chips.
[0048] Figure 1 This is a schematic diagram of a conventional auxiliary power supply path structure for driving, as provided in one embodiment of this application. Figure 1 As shown, the auxiliary power supply path structure includes an isolation power chip and a driver chip. The isolation power chip includes an isolation power transmitting module 101, an isolation power receiving module 201, a transformer 30, and an isolator 40. The isolation power transmitting module 101 includes a power transmitting module 1011 and a power transmitting control module 1012. The isolation power receiving module 201 includes a power receiving module 2011 and a power feedback module 2012. The driver chip includes a low dropout regulator (LDO) 203, a driver circuit control module 102, a driver circuit buffer module 202, a resistor 204, and a resistor 205.
[0049] The power transmitting module 1011 is configured to receive a voltage VBUS input from an external power supply and convert the VBUS into a voltage meeting a requirement through a transformer 30; the power receiving module 2011 is configured to receive the voltage converted by the transformer 30 and rectify the voltage to output a voltage Vout, and the power receiving module 2011 is further connected with a capacitor Cout for voltage stabilization; the power feedback module 2012 is configured to obtain a feedback signal by subtracting a preset reference voltage from the voltage Vout rectified by the power receiving module 2011; the power transmitting control module 1012 is configured to receive the feedback signal and output a corresponding control signal to the power transmitting module 1011, so that the power transmitting module 1011 adjusts the signal duty cycle accordingly. The LDO 203 in the drive chip is configured to receive the voltage Vout output from the power receiving module 2011 of the isolation power supply chip after rectification and input the voltage Vout to the drive circuit control module 102 after voltage stabilization, and the drive circuit control module 102 is further configured to receive a control signal input from an external source and control the drive circuit control module 102 to output a drive signal based on the control signal; the drive circuit buffer module 202 is configured to buffer and output the drive signal, and output the drive signal to the power switch through resistors 204 and 205 to control the opening, closing and maintaining of the power switch.
[0050] It should be noted that the isolation power supply chip is a power supply chip providing electrical isolation function, which can transmit energy from the power transmitter (TX) (i.e., the power transmitting module 1011) on the primary side to the power receiver (RX) (i.e., the power receiving module 2011) on the secondary side through a transformer. Generally, the power TX transmits energy to the secondary side through the primary side coil, and the power RX on the secondary side receives energy and rectifies the energy to supply power to other circuits in a certain form. The absolute potential difference between the TX and the RX can reach several hundred volts to several thousand volts, and the transformer can provide several thousand volts of electrical isolation capability to ensure the safety of personnel and equipment.
[0051] The drive chip is widely used in various switching power supply systems using semiconductor switching devices, for driving the semiconductor switching devices to perform opening, closing, maintaining conduction and other actions, and generally needs an isolation power supply chip to supply power, i.e., the power supply transmits energy from the TX end to the RX end through the transformer coil, and outputs to the control end and the drive output of the drive chip after rectification.
[0052] However, the main board of the current switching power supply system is relatively large in size, and therefore, how to reduce the size of the main board of the switching power supply system becomes a technical problem to be solved.
[0053] Therefore, the present application proposes a power supply chip which can reduce the size of the main board of the switching power supply system.
[0054] Based on Figure 1 a structure diagram of a conventional driving auxiliary source power supply path shown in FIG. Figure 2 A structure diagram of a power supply chip is provided for an embodiment of the present application. As shown in the figure, Figure 2 The power supply chip includes a first sub-chip 10, a second sub-chip 20, a transformer 30, and an isolator 40, and the first sub-chip 10, the second sub-chip 20, the transformer 30, and the isolator 40 are disposed on the same chip substrate.
[0055] The first sub-chip 10 includes an isolated power supply transmitting module 101 and a driving circuit control module 102, and the second sub-chip 20 includes an isolated power supply receiving module 201 and a driving circuit buffer module 202.
[0056] As shown in the figure, Figure 2 The first port of the isolated power supply transmitting module 101 is connected to the first port of the transformer 30, the second port of the transformer 30 is connected to the first port of the isolated power supply receiving module 201, the second port of the isolated power supply receiving module 201 is connected to the first port of the driving circuit buffer module 202, the third port of the isolated power supply receiving module 201 is connected to the first port of the isolator 40, the second port of the isolator 40 is connected to the second port of the isolated power supply transmitting module 101, the first port of the driving circuit control module 102 is connected to the third port of the isolator 40, and the fourth port of the isolator 40 is connected to the second port of the driving circuit buffer module 202.
[0057] It should be noted that the first current signal (i.e., VBUS in Figure 2 ) input by the power supply chip input end can supply power to the isolated power supply transmitting module 101 and the driving circuit control module 102, such as the input VCC shown in Figure 2 .
[0058] The isolated power supply transmitting module 101 is configured to convert the first current signal input by the power supply chip input end into a second current signal, and input a third current signal output after the second current signal is coupled by the transformer 30 to the isolated power supply receiving module 201, and the third current signal is configured to supply power to the driving circuit buffer module 202.
[0059] The driving circuit control module 102 is configured to output a driving signal based on the first control signal input by the power supply chip input end, and input the driving signal to the driving circuit buffer module 202 through the isolator 40.
[0060] It should be noted that the first sub-chip can also be referred to as a first chip "die", and the second sub-chip can also be referred to as a second chip "die".
[0061] Understandably, the "die" refers to the die before the chip is packaged, which is a small piece cut from a silicon wafer by laser, and each "die" is an independent functional chip, which will be packaged as a unit to become the common chip.
[0062] Optionally, the first sub-chip 10, the second sub-chip 20, the transformer 30 and the isolator 40 are encapsulated to form the power supply chip, so as to reduce the area of the chip and the layout area of the device, and further reduce the volume of the mainboard of the switching power supply system.
[0063] Further, on the basis of the above embodiment, the isolated power supply transmitting module 101 includes a power transmitting module 1011 and a power transmitting control module 1012, the isolated power supply receiving module 201 includes a power receiving module 2011 and a power feedback module 2012, the output end of the power transmitting control module 1012 is connected to the input end of the power transmitting module 1011, and the output end of the power receiving module 2011 is connected to the input end of the power feedback module 2012, as shown in the specific embodiment. Figure 3 The first current signal (i.e., VBUS in the figure) input at the input end of the power supply chip can be used to supply power to the power transmitting module 1011, the power transmitting control module 1012 and the drive circuit control module 102, as shown in the figure. Figure 3 The power receiving module 2011 is connected with a capacitor Cout, which is used for voltage stabilization; and the drive circuit buffer module 202 outputs a drive signal to the power switch through resistors 204 and 205, so as to control the opening, closing and maintaining conduction of the power switch.
[0064] Optionally, when the power supply chip is normally working, the first voltage (Vout) output by the power receiving module 2011 can be used to supply power to the power feedback module 2012 and the drive circuit buffer module 202, that is, the voltage output by the power receiving module 2011 on the same chip substrate can be used to supply power to the drive circuit buffer module 202 and the drive circuit buffer module 202, so that the function of supplying power to the drive circuit can be realized on the same chip, and the driving function of the power device is realized, which can reduce the number of components and reduce the volume occupied by the mainboard.
[0065] Understandably, the power transmitting module 1011 is specifically configured to: receive a first current signal (a power supply signal), receive a second control signal from a second port of the power transmitting module 1011, adjust the signal duty cycle of a corresponding power device based on the second control signal, obtain a second current signal, and output the second current signal from a first port of the power transmitting module 1011.
[0066] The transformer 30 is specifically configured to input the second current signal from the first port of the transformer 30, perform voltage conversion on the second current signal to obtain a third current signal, and output the third current signal from the second port of the transformer 30.
[0067] The power receiving module 2011 is specifically configured to receive the third current signal from the first port of the power receiving module 2011, rectify the third current signal to obtain the first voltage, and output the first voltage from the second port of the power receiving module 2011.
[0068] The power feedback module 2012 is specifically configured to receive the first voltage from the first port of the power feedback module 2012, perform difference operation on the first voltage and a preset reference voltage to obtain a feedback signal, and output the feedback signal from the second port of the power feedback module 2012.
[0069] The power transmission control module 1012 is specifically configured to receive the feedback signal from the first port of the power transmission control module 1012, obtain a second control signal based on the feedback signal, and output the second control signal from the second port of the power transmission control module 1012.
[0070] The drive circuit control module 102 is specifically configured to receive the first current signal, receive the first control signal from the second port of the drive circuit control module 102, control the drive circuit control module 102 to output a drive signal based on the first control signal, and output the drive signal from the first port of the drive circuit control module 102.
[0071] The drive circuit buffer module 202 is specifically configured to input the drive signal from the second port of the drive circuit buffer module 202, temporarily store the drive signal, and output the drive signal from the third port of the drive circuit buffer module 202.
[0072] The isolator 40 is specifically configured to input the feedback signal from the first port of the isolator 40, output the feedback signal from the second port of the isolator 40, input the drive signal from the third port of the isolator 40, and output the drive signal from the fourth port of the isolator 40.
[0073] That is, the power transmission module 1011 receives the first current signal from the power supply and the second control signal from the power transmission control module 1012, adjusts the signal duty cycle of the corresponding power device based on the second control signal to obtain the second current signal, obtains the third current signal through the conversion of the transformer 30, and sends the third current signal to the power receiving module 2011. The power receiving module 2011 rectifies the third current signal to output the first voltage.
[0074] The power feedback module 2012 is powered by the first voltage, and obtains a feedback signal by subtracting a preset reference voltage from the first voltage. The feedback signal is transmitted to the power transmission control module 1012 through the isolator 40. The power transmission control module 1012 obtains a second control signal based on the received feedback signal, and sends the second control signal to the power transmission module 1011. The power transmission control module 1012 is powered by a power supply.
[0075] The driving circuit control module 102 is powered by a power supply, and receives the first control signal input from the outside. The driving circuit control module 102 controls the driving circuit control module 102 to output a driving signal based on the first control signal, and sends the driving signal to the driving circuit buffer module 202. The driving circuit buffer module 202 temporarily stores the driving signal, and outputs the driving signal to the power switch when needed, so as to control the opening, closing and maintaining of the power switch.
[0076] Optionally, the power feedback module 2012 and the driving circuit buffer module 202 are powered by the first voltage.
[0077] Further, the power transmission module 1011 includes a full-bridge topology, which includes a first power switch tube, a second power switch tube, a third power switch tube and a fourth power switch tube. When the first power switch tube and the fourth power switch tube are turned on, and the second power switch tube and the third power switch tube are turned off, the first power switch tube, the primary winding of the transformer and the fourth power switch tube form a first loop. When the first power switch tube and the fourth power switch tube are turned off, and the second power switch tube and the third power switch tube are turned on, the second power switch tube, the primary winding of the transformer and the third power switch tube form a second loop.
[0078] Optionally, the isolator includes a capacitive isolator, an isolation transformer or an optical coupling isolator, which is used to perform a preset conversion on the received input signal and output the converted signal.
[0079] Exemplarily, on the basis of the above Figure 3 The power transmission module 1011 includes a full-bridge topology power chip structure schematic diagram as shown in Figure 4As shown, the second port of the power transmission module 1011 is connected to the second port of the power transmission control module 1012, the first port of the power transmission module 1011 is connected to the first port of the transformer 30, the second port of the transformer 30 is connected to the first port of the power receiving module 2011, the second port of the power receiving module 2011 is connected to the first port of the power feedback module 2012, the third port of the power feedback module 2012 and the first port of the drive circuit buffer module 202, the second port of the power feedback module 2012 is connected to the first port of the isolator 40, the second port of the isolator 40 is connected to the first port of the power transmission control module 1012, the first port of the drive circuit control module 102 is connected to the third port of the isolator 40, the fourth port of the isolator 40 is connected to the second port of the drive circuit buffer module 202, and the third port of the drive circuit buffer module 202 is connected to resistors 204 and 205.
[0080] The full-bridge topology includes a first power switch M1, a second power switch M2, a third power switch M3, and a fourth power switch M4. The first end of the primary winding of the transformer 30 is connected between the first power switch M1 and the third power switch M3, and the second end of the primary winding is connected between the second power switch M2 and the fourth power switch M4.
[0081] When the first power switch M1 and the fourth power switch M4 are turned on, the second power switch M2 and the third power switch M3 are turned off. The first power switch M1, the primary winding of the transformer 30, and the fourth power switch M4 form the first circuit, with the voltage of the primary winding being positive at the top and negative at the bottom. When the second power switch M2 and the third power switch M3 are turned on, the first power switch M1 and the fourth power switch M4 are turned off. The second power switch M2, the primary winding of the transformer 30, and the third power switch M3 form the second circuit, with the voltage of the primary winding being negative at the top and positive at the bottom.
[0082] Optionally, the current in the primary coil will induce a current in the secondary coil, which is rectified by the power receiving module 2011 to obtain the output voltage, i.e., the first voltage (Vout).
[0083] Optionally, such as Figure 4 As shown, the power feedback module 2012 has two voltages on its right side: one is the first voltage (Vout) output by the power receiving module 2011, and the other is the preset reference voltage (Vref). The power feedback module 2012 obtains a feedback signal based on the difference between the first voltage and the preset reference voltage, and transmits it to the power transmission control module 1012 through the isolator 40. This causes the power transmission control module 1012 to output a second control signal to the power transmission module 1011 to adjust the duty cycle of the gate signal of each power switch in the full-bridge topology, thereby adjusting the first voltage to the set value.
[0084] Optionally, Figure 4 The isolator 40 in the power transmitting module 1011 is a capacitive isolator.
[0085] Understandably, when the first voltage is less than the preset reference voltage, the duty cycle of the gate signal of the first power switch M1, the second power switch M2, the third power switch M3 and the fourth power switch M4 is increased to a first threshold value, so that the first voltage is equal to the preset reference voltage, wherein the first threshold value is less than or equal to 50%.
[0086] That is, when the first voltage is less than the preset reference voltage, the power transmitting control module 1012 will control the duty cycle of the gate signal of each power switch to increase, and the duty cycle is not greater than 50%.
[0087] When the first voltage is greater than the preset reference voltage, the duty cycle of the gate signal of the first power switch M1, the second power switch M2, the third power switch M3 and the fourth power switch M4 is decreased to a second threshold value, so that the first voltage is equal to the preset reference voltage, wherein the second threshold value is less than or equal to 50% and greater than or equal to a preset minimum threshold value.
[0088] Optionally, if the second threshold value is equal to the preset minimum threshold value and the first voltage is greater than the preset reference voltage, the power transmitting control module 1012 enters a pulse skipping mode.
[0089] That is, when the first voltage is greater than the preset reference voltage, the power transmitting control module 1012 will control the duty cycle of the gate signal of each power switch to decrease, and if the duty cycle of the gate signal of each power switch has been adjusted to the minimum, i.e., the preset minimum threshold value, and the first voltage is still higher than the preset reference voltage, the pulse skipping mode of the power transmitting control module 1012 will be triggered.
[0090] Exemplarily, a schematic diagram of the pulse skipping mode is shown in FIG. 5, and in a square wave signal with a duty cycle of 50%, for example, the period is 0 to 9T0, and the square wave should be emitted in the interval of 5T0 to 6T0, but after triggering the pulse skipping mode, the square wave in this interval is skipped. Figure 5
[0091] Optionally, the power transmitting module 1011 further comprises a half-bridge topology, and the half-bridge topology comprises a fifth power switch and a sixth power switch.
[0092] Optionally, the power transmitting module 1011 further comprises a capacitor, and the capacitor, together with the excitation inductance and the leakage inductance of the primary side coil, constitutes an LLC resonant converter (inductor-inductor-capacitor resonant converter).
[0093] The power transmitting module 1011 includes a half-bridge topology and a capacitor, and the isolator 40 is taken as an example of a capacitor isolator, Figure 6 The power transmitting module 1011 includes a half-bridge topology and a capacitor, and the isolator 40 is taken as an example of a capacitor isolator, Figure 6 As shown in the structural schematic diagram of the power supply chip provided in another embodiment of the present application, the power transmitting module 1011 includes a fifth power switch tube M5, a sixth power switch tube M6, and a series capacitor C R The series capacitor C R forms an LLC resonant converter with the magnetizing inductance L M and the leakage inductance L R of the primary coil of the transformer 30.
[0094] Understandably, after the capacitor, the magnetizing inductance, and the leakage inductance of the primary coil form the LLC resonant converter, the power transmitting control module 1012 can output a control signal, which can not only control the duty cycle of the gate signal of each power switch tube but also control the frequency of the square wave signal above the gate of each power switch tube, thereby better regulating the output voltage.
[0095] Alternatively, Figure 6 The half-bridge topology shown in the structural schematic diagram of the power supply chip provided in another embodiment of the present application can also be replaced by the full-bridge topology in the above embodiment, which achieves the same effect in combination with the LLC resonant converter.
[0096] Alternatively, the power transmitting control module 1012 can also control the frequency and duty cycle of the square wave signal above the gate of each power switch tube by a certain strategy according to different duty cycles or frequencies.
[0097] Alternatively, the power receiving module 2011 includes a rectifier circuit, which can be a full-bridge rectifier, and the full-bridge rectifier is used to convert alternating current into direct current.
[0098] Based on the structural schematic diagram of the power supply chip shown in the above Figure 3 , taken as an example of the full-bridge rectifier included in the power receiving module 2011, Figure 7 the structural schematic diagram of the power supply chip provided in another embodiment of the present application is shown in the structural schematic diagram of the power supply chip provided in another embodiment of the present application, Figure 7 As shown in the structural schematic diagram of the power supply chip provided in another embodiment of the present application, the power receiving module 2011 includes four diodes to constitute a full-bridge rectifier, so as to rectify the third current signal received from the power receiving module 2011 to obtain a first voltage.
[0099] Alternatively, the full-bridge rectifier included in the power receiving module 2011 is only an example, and other forms of rectifiers can also be used, which are not limited in the present application.
[0100] Alternatively, based on the structural schematic diagram of the power supply chip shown in the above Figure 4 , Figure 8 the structural schematic diagram of the power supply chip provided in another embodiment of the present application is shown in the structural schematic diagram of the power supply chip provided in another embodiment of the present application,Figure 8 As shown, the power transmitting module 1011 includes a full-bridge topology, which includes a first power switch M1, a second power switch M2, a third power switch M3 and a fourth power switch M4. When the first power switch M1 and the fourth power switch M4 are on, and the second power switch M2 and the third power switch M3 are off, the first power switch M1, the primary winding of the transformer 30 and the fourth power switch M4 form a first loop. When the first power switch M1 and the fourth power switch M4 are off, and the second power switch M2 and the third power switch M3 are on, the second power switch M2, the primary winding of the transformer 30 and the third power switch M3 form a second loop. The power receiving module 2011 includes four diodes, which form a full-bridge rectifier to rectify the third current signal received from the power receiving module 2011 to obtain a first voltage. The isolator 40 uses a capacitor isolator.
[0101] Optionally, the drive circuit control module 102 can be composed of any drive controller, and the application does not limit the topology of the drive controller.
[0102] Optionally, the pulse width modulation (PWM) signal generated by the drive controller is transmitted to the drive circuit buffer module 202 through the isolator 40, and the energy required for the operation of the drive circuit buffer module 202 needs to be provided by the first voltage (Vout) rectified by the power receiving module 2011. In order to ensure the normal operation of the drive circuit buffer module 202, the drive circuit buffer module 202 includes an under voltage lock out (UVLO) module, and the logic circuit of the output stage of the drive circuit buffer module 202 is in a running state only when the output of the first voltage (Vout) meets the condition.
[0103] Optionally, the application further provides an electronic device, which includes the power supply chip as described in the above embodiments.
[0104] Optionally, the application further provides a switching power supply system, which includes the power supply chip as described in the above embodiments.
[0105] The power supply chip provided in the embodiments of the present application comprises a first sub-chip, a second sub-chip, a transformer and an isolator, the first sub-chip comprises an isolated power supply transmitting module and a driving circuit control module, the second sub-chip comprises an isolated power supply receiving module and a driving circuit buffer module; the isolated power supply transmitting module is configured to convert a first current signal input by an input end of the power supply chip into a second current signal, and input a third current signal output by the second current signal after coupling by the transformer to the isolated power supply receiving module, the third current signal is configured to supply power to the driving circuit buffer module; the driving circuit control module is configured to output a driving signal based on a first control signal input by the input end of the power supply chip, and input the driving signal to the driving circuit buffer module through the isolator, so that the power supply chip can provide the driving function of the power device without an auxiliary power supply, the number of components of the system is reduced, the volume of the mainboard of the switching power supply system is reduced, and the integration of the mainboard is improved.
[0106] It should be understood that the term "and / or" in this document merely describes an association relationship of associated objects, and indicates that there can be three relationships, for example, A and / or B can represent three cases of A alone, A and B together, and B alone, where A and B can be singular or plural. In addition, the character " / " in this document generally represents an "or" relationship between the front and rear associated objects, but can also represent an "and / or" relationship, which can be understood according to the context before and after.
[0107] In this application, "at least one" means one or more, and "multiple" means two or more. "At least one of the following" or the like means any combination of the items, including any combination of single item or multiple items. For example, at least one of a, b, or c can represent a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, and c can be single or multiple.
[0108] It should be understood that in various embodiments of the present application, the size of the sequence number of the above-mentioned processes does not mean the order of execution, and the execution order of the processes should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.
[0109] Those skilled in the art can realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed in this document can be realized by electronic hardware or a combination of computer software and electronic hardware. Whether the functions are executed in hardware or software depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.
[0110] Those skilled in the art can clearly understand the specific working process of the system, device and unit described above can refer to the corresponding process in the foregoing method embodiments for description convenience and brevity, and will not be repeated here.
[0111] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented in other ways. For example, the device embodiments described above are merely illustrative, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interfaces, devices or units, and can be electrical, mechanical or other forms.
[0112] The units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, that is, they can be located in one place or distributed on multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment scheme.
[0113] In addition, each functional unit in each embodiment of the present application can be integrated in one processing unit, or each unit can be physically present separately, or two or more units can be integrated in one unit.
[0114] The above is merely a specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A power supply chip, characterized by comprising: The power supply chip comprises a first sub-chip, a second sub-chip, a transformer and an isolator, the first sub-chip comprises an isolated power supply transmitting module and a driving circuit control module, and the second sub-chip comprises an isolated power supply receiving module and a driving circuit buffer module; The first port of the isolated power supply transmitting module is connected with the first port of the transformer, and the second port of the isolated power supply transmitting module is connected with the second port of the isolator; the first port of the isolated power supply receiving module is connected with the second port of the transformer, the second port of the isolated power supply receiving module is connected with the first port of the driving circuit buffer module, and the third port of the isolated power supply receiving module is connected with the first port of the isolator; the first port of the driving circuit control module is connected with the third port of the isolator, and the second port of the driving circuit buffer module is connected with the fourth port of the isolator; The isolated power supply transmitting module in the first sub-chip is configured to convert a first current signal input by the power supply chip input end into a second current signal, and input a third current signal output by the second current signal after coupling by the transformer to the isolated power supply receiving module, and the third current signal is configured to supply power to the driving circuit buffer module in the second sub-chip; The driving circuit control module in the first sub-chip is configured to output a driving signal based on a first control signal input by the power supply chip input end, and input the driving signal to the driving circuit buffer module in the second sub-chip through the isolator.
2. The power supply chip of claim 1, wherein, The first sub-chip, the second sub-chip, the transformer and the isolator are combined to form the power supply chip.
3. The power supply chip of claim 2, wherein, The isolated power supply transmitting module comprises a power transmitting module and a power transmitting control module; The output end of the power transmitting control module is connected with the input end of the power transmitting module, and the power transmitting control module is configured to input a second control signal to the power transmitting module; The power transmitting module is configured to receive the first current signal, adjust the signal duty cycle of a corresponding power device based on the second control signal, and output the second current signal to the transformer.
4. The power supply chip of claim 3, wherein, The isolated power supply receiving module comprises a power receiving module and a power feedback module, and the output end of the power receiving module is connected with the input end of the power feedback module; The power receiving module is configured to receive the third current signal, rectify the third current signal, and output a first voltage; The power feedback module is configured to receive the first voltage, and input a feedback signal obtained by subtracting a preset reference voltage from the first voltage to the power transmitting control module through the isolator; The power transmitting control module is further configured to output the second control signal based on the feedback signal.
5. The power supply chip of claim 4, wherein, The power feedback module and the driving circuit buffer module are powered by the first voltage.
6. The power supply chip of any one of claims 4 to 5, wherein, The power transmitting module comprises a full-bridge topology, and the full-bridge topology comprises a first power switch tube, a second power switch tube, a third power switch tube and a fourth power switch tube; When the first power switch tube and the fourth power switch tube are turned on, and the second power switch tube and the third power switch tube are turned off, the first power switch tube, the primary winding of the transformer and the fourth power switch tube form a first loop. When the first power switch tube and the fourth power switch tube are turned off, and the second power switch tube and the third power switch tube are turned on, the second power switch tube, the primary winding of the transformer and the third power switch tube form a second loop.
7. The power supply chip of claim 6, wherein, The power transmission control module is specifically configured to: when the first voltage is less than a preset reference voltage, control the duty cycle of the gate signal of the first power switch tube, the second power switch tube, the third power switch tube and the fourth power switch tube to increase to a first threshold value, so that the first voltage is equal to the preset reference voltage, and the first threshold value is less than or equal to 50%. When the first voltage is greater than the preset reference voltage, control the duty cycle of the gate signal of the first power switch tube, the second power switch tube, the third power switch tube and the fourth power switch tube to decrease to a second threshold value, so that the first voltage is equal to the preset reference voltage, and the second threshold value is less than or equal to 50% and greater than or equal to a preset minimum threshold value.
8. The power supply chip of claim 7, wherein, If the second threshold value is equal to the preset minimum threshold value and the first voltage is greater than the preset reference voltage, the power transmission control module enters a pulse skipping mode.
9. The power supply chip according to any one of claims 3 to 5, 7 to 8, characterized in that, The power transmission module further comprises a half-bridge topology, and the half-bridge topology comprises a fifth power switch tube and a sixth power switch tube.
10. The power supply chip according to any one of claims 3 to 5, 7 to 8, characterized in that, The power transmission module comprises a capacitor, and the capacitor and the excitation inductance and leakage inductance of the primary winding of the transformer form an LLC resonant converter.
11. The power supply chip of any one of claims 4-5, 7-8, wherein, The power receiving module comprises a full-bridge rectifier, and the full-bridge rectifier is used to convert alternating current into direct current.
12. The power supply chip of any one of claims 1 to 5, 7 to 8, wherein, The isolator comprises a capacitor isolator, an isolation transformer or an optical coupling isolator, and the isolator is used to perform preset conversion on the received input signal and output.
13. The power supply chip of any one of claims 1 to 5, 7 to 8, wherein, The drive circuit control module comprises a drive controller.
14. The power supply chip of any one of claims 1 to 5, 7 to 8, wherein, The drive circuit buffer module comprises an under-voltage lockout (UVLO) module, and the UVLO module is used to protect the drive circuit buffer module.
15. An electronic device, comprising: The electronic device comprises the power supply chip according to any one of claims 1 to 14.
16. A switching power supply system characterized by comprising: The switching power supply system comprises the power supply chip according to any one of claims 1 to 14.
Citation Information
Patent Citations
Drive circuit of power switching tubes
CN104953994A
Power tube driving circuit and power tube driving method
WO2022033276A1