Electrical connection with embedded electronic components

Abstract

Devices and methods for manufacturing the same are provided, including those for electrical connection to embedded electronic components. These devices include flexible electronic components embedded within a substrate. The free end of the flexible electronic component can be withdrawn to extend beyond the main plane of the substrate as a protruding contact.

Description

Background Technology

[0001] The integration of solid-state semiconductor dies with printed circuitry combines the computational power of semiconductor technology with the high throughput and form factor flexibility of web-based methods. The fabrication of flexible hybrid electronics requires reliable and accurate registration of the semiconductor die with printed traces on a moving web. Alignment mechanisms suitable for wafer-based semiconductor devices may not be easily adaptable to web-based methods. Summary of the Invention

[0002] In summary, in one aspect, this disclosure describes a method for fabricating a flexible device. The method includes: providing a flexible substrate extending along a main plane; providing a flexible electronic component including a free end embedded within the flexible substrate; and withdrawing the free end of the flexible electronic component such that the free end protrudes beyond the main plane of the flexible substrate.

[0003] In another aspect, this disclosure describes a flexible device comprising a flexible substrate extending along a main plane, and a flexible electronic component embedded within the flexible substrate. The flexible electronic component includes a free end protruding beyond the main plane of the flexible substrate.

[0004] In another aspect, this disclosure describes a method of manufacturing an apparatus. The method includes providing a circuit board having one or more contact pads on its main surface; providing a conductive element disposed on the main surface of the circuit board and in contact with the one or more contact pads; providing an adhesive film bonded to the main surface of the circuit board to secure the conductive element thereon, the adhesive film including one or more through-holes aligned with the one or more contact pads of the circuit board; providing a liquid containing conductive particles in the one or more through-holes to contact the one or more contact pads; and solidifying the liquid containing conductive particles to form one or more electrodes for electrical connection to the one or more contact pads of the circuit board and the conductive element.

[0005] In another aspect, this disclosure describes an apparatus comprising a circuit board including one or more contact pads on its main surface; a conductive element disposed on the main surface of the circuit board and in contact with the one or more contact pads; an adhesive film bonded to the main surface of the circuit board in an adhesive manner to secure the conductive element thereto, the adhesive film including one or more through-holes aligned with the one or more contact pads of the circuit board; and one or more electrodes formed in the one or more through-holes of the adhesive film for electrical connection to the one or more contact pads and the conductive element of the circuit board.

[0006] Various unexpected results and advantages are obtained in the exemplary embodiments of this disclosure. One such advantage of the exemplary embodiments of this disclosure is that the embedded electrical contact can be withdrawn to protrude toward the surface of the object to be inspected. In some cases, the method of manufacturing electrical contacts can separate the conductive and adhesive aspects by utilizing a dual-material system comprising a conductive ink for forming electrodes and an adhesive film for bonding. This method enables low temperatures and short curing cycles, which is beneficial for high-volume production.

[0007] Various aspects and advantages of the exemplary embodiments of this disclosure have been summarized. The above summary is not intended to describe every illustrative embodiment or every implementation of the presently available exemplary embodiments of this disclosure. The following drawings and detailed descriptions illustrate more specifically certain preferred embodiments using the principles disclosed herein. Attached Figure Description

[0008] This disclosure can be more fully understood in conjunction with the accompanying drawings and the following detailed description of various embodiments thereof, wherein:

[0009] Figure 1A This is a cross-sectional view of an apparatus according to one embodiment.

[0010] Figure 1B yes Figure 1A A perspective side view of the device.

[0011] Figure 2A To be based on an implementation plan from Figure 1A A cross-sectional view of the device obtained from the apparatus.

[0012] Figure 2B yes Figure 2A A perspective side view of the device.

[0013] Figure 3A This is a cross-sectional view of an apparatus according to one embodiment.

[0014] Figure 3B yes Figure 3A A perspective side view of the device.

[0015] Figure 4A To be based on an implementation plan from Figure 3A A cross-sectional view of the device obtained from the apparatus.

[0016] Figure 4B yes Figure 4A A perspective side view of the device.

[0017] Figure 5A This is a cross-sectional view of an apparatus for forming a window by laser etching according to one embodiment.

[0018] Figure 5Byes Figure 5A A cross-sectional view of the device, in which a needle is used.

[0019] Figure 5C From Figure 5B A cross-sectional view of the device obtained from the apparatus.

[0020] Figure 6 It is a cross-sectional view of an apparatus including a covered metal wire according to one embodiment.

[0021] Figure 7A This is a cross-sectional view of a device including a cap according to one embodiment.

[0022] Figure 7B yes Figure 7A A cross-sectional view of the device, in which a needle is used.

[0023] Figure 7C From Figure 7B A cross-sectional view of the device obtained from the apparatus.

[0024] Figure 8A This is a cross-sectional view of an apparatus according to one embodiment.

[0025] Figure 8B yes Figure 8A A cross-sectional view of the device, in which a plug is applied.

[0026] Figure 8C yes Figure 8B A cross-sectional view of the device, in which an encapsulant layer has been applied.

[0027] Figure 8D By removing the plug from Figure 8C A cross-sectional view of the device obtained from the apparatus.

[0028] Figure 9A This is a cross-sectional view of a device including two plugs according to one embodiment.

[0029] Figure 9B yes Figure 9A A cross-sectional view of the device, in which an encapsulant layer has been applied.

[0030] Figure 9C yes Figure 9B A cross-sectional view of the device, wherein electrodes are formed in through holes.

[0031] Figure 9D By removing the plug from Figure 9C A cross-sectional view of the device obtained from the apparatus.

[0032] Figure 10A This is a cross-sectional view of an apparatus including a removable component according to one embodiment.

[0033] Figure 10B yes Figure 10A A cross-sectional view of the device, in which an encapsulant layer has been applied.

[0034] Figure 10C yes Figure 10B A cross-sectional view of the device, in which wires are inserted into the cavity.

[0035] Figure 10D yes Figure 10C A cross-sectional view of the device, showing the plug.

[0036] Figure 10E yes Figure 10D A cross-sectional view of the device, wherein electrodes are formed in through holes.

[0037] Figure 10F By removing the plug from Figure 9C A cross-sectional view of the device obtained from the apparatus.

[0038] Figure 11A It is a cross-sectional view of a device including a window according to one embodiment.

[0039] Figure 11B yes Figure 11A A cross-sectional view of the device in which conductive wires are applied.

[0040] Figure 11C yes Figure 11B A cross-sectional view of the device in which an adhesive film has been applied.

[0041] Figure 11D yes Figure 11C A cross-sectional view of the device, wherein electrodes are formed in through holes.

[0042] Figure 11E yes Figure 11D A cross-sectional view of the device, in which an encapsulant layer has been applied.

[0043] Figure 12 This is a schematic diagram of the method used to manufacture Example 1.

[0044] Figure 13 This is a schematic diagram of the method used to manufacture Example 2.

[0045] In the accompanying drawings, similar reference numerals indicate similar elements. While the foregoing drawings, which may be drawn not to scale, illustrate various embodiments of this disclosure, other embodiments as mentioned in the detailed description are also contemplated. In all instances, this disclosure is described by way of exemplary embodiments and not by way of limiting the scope of the disclosure. It should be understood that many other modifications and embodiments will arise for those skilled in the art, which fall within the scope and spirit of this disclosure. Detailed Implementation

[0046] For the terminology listed below, unless a different definition is provided elsewhere in the claims or description, these definitions shall apply throughout the application.

[0047] Glossary

[0048] While most terms used throughout the specification and claims are well-known, some interpretation may still be necessary. It should be understood that:

[0049] By using orientational terms such as "on top of," "on," "above," "cover," "topmost," "below," etc., in the positions of various elements in the disclosed coated articles, we refer to the relative positions of the elements with respect to a horizontally positioned, upward-facing substrate. However, unless otherwise specified, the present invention is not intended for the substrate or article to have any particular spatial orientation during or after manufacturing.

[0050] The terms “about” or “approximately” regarding numerical values ​​or shapes mean + / - 5% of that value, property, or characteristic, but explicitly include exact numerical values. For example, “about” a viscosity of 1 Pa-sec refers to a viscosity from 0.95 Pa-sec to 1.05 Pa-sec, but also explicitly includes a viscosity of exactly 1 Pa-sec. Similarly, the perimeter of “essentially square” is intended to describe a geometry with four lateral edges, where the length of each lateral edge is 95% to 105% of the length of any other lateral edge, but also includes geometries where each lateral edge has exactly the same length.

[0051] The term "substantially" in relation to a property or feature means that the property or feature is exhibited to a greater degree than its opposite surface. For example, a "substantially" transparent substrate is one that transmits more radiation (e.g., visible light) than a substrate that does not transmit (e.g., absorbs and reflects). Therefore, a substrate that transmits more than 50% of the visible light incident on its surface is substantially transparent, but a substrate that transmits 50% or less of the visible light incident on its surface is not substantially transparent.

[0052] As used in this specification and the accompanying embodiments, unless the content clearly indicates otherwise, the singular forms “an,” “a,” and “the / described” include multiple referents. Thus, for example, a reference to fine fibers containing “a compound” includes a mixture of two or more compounds. As used in this specification and the accompanying embodiments, unless the content expressly specifies otherwise, the term “or” is generally used in its meaning including “and / or.”

[0053] As used in this specification, a range of values ​​expressed by endpoints includes all values ​​included in that range (e.g., 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.8, 4, and 5).

[0054] Unless otherwise specified, all figures for expressions or measurements of components, properties, etc., used in this specification and embodiments should in all cases be understood to be modified by the term "about". Therefore, unless stated to the contrary, the numerical parameters shown in the foregoing specification and the appended list of embodiments may vary according to the desired properties sought by those skilled in the art using the teachings of this disclosure. At a minimum, and without attempting to limit the application of the doctrine of equivalence to the embodiments protected by the claims, each numerical parameter should be interpreted at least according to the number of significant digits reported and by applying customary rounding.

[0055] Various modifications and alterations may be made to the exemplary embodiments of this disclosure without departing from the spirit and scope of this disclosure. Therefore, it should be understood that the embodiments of this disclosure are not limited to the exemplary embodiments described below, but are subject to the limiting factors shown in the claims and any equivalents. Various exemplary embodiments of this disclosure will now be described with specific reference to the accompanying drawings.

[0056] Figures 1A to 1B as well as Figures 2A to 2B A method for manufacturing an electronic device 100 using a flexible substrate 10 according to one embodiment is shown. For example... Figure 1A As indicated by arrow 2, the flexible substrate 10 extends along the main plane. The flexible substrate 10 includes a flexible backing layer 12 having an adhesive surface 14. The flexible backing layer 12 may include, for example, a polymer film, such as a flexible polymer, including, for example, polyurethane, acrylate, silicone, polyester, polyimide, etc. The adhesive surface 14 may include any suitable adhesive, such as acrylate, silicone, polyurethane, etc. It should be understood that the backing layer 12 and the substrate 10 may also be at least partially rigid. In some embodiments, the substrate 10 may be formed into a circuit board including various circuits or electronic components.

[0057] The flexible electronic component 20 is attached to the adhesive surface 14. The substrate 10 also includes an encapsulant layer 16 attached to the flexible backing layer 12 on its first side 10a. The flexible electronic component 20 is sandwiched between the flexible backing layer 12 and the encapsulant layer 16.

[0058] exist Figures 1A to 1B as well as Figures 2A to 2BIn the depicted embodiments, the flexible electronic component 20 is a conductive wire embedded within the flexible substrate 10. The conductive wire may have a diameter, for example, from about 10 micrometers to about 2 mm. The wire may comprise any suitable metal (e.g., copper) or other conductive material. In some embodiments, the conductive element may be a metal wire covered along its length, but with a few areas of exposed metal for electrical contact. In some embodiments, the conductive element may comprise a metal trace or other conductive material on the flexible substrate. It should be understood that the flexible electronic component 20 can be any type of electronic component other than a conductive wire.

[0059] The conductive wire 20 is embedded in the flexible substrate 10, extends within the main plane 2 of the flexible substrate 10, and has a free end 22 adjacent to the edge 11 of the flexible substrate 10. In many embodiments, circuitry, such as one or more IC chips (not shown), may be disposed on the substrate 10. For example, the IC chip may be attached to an adhesive surface 14 and then covered by an encapsulant layer 16. The conductive wire 20 may be electrically connected to one or more components of the circuit. In the depicted embodiment, the circuitry also includes electrodes or contact pads 5 formed in through-holes extending through the backing layer 12 and the adhesive surface 14. The conductive wire 20 is electrically connected to the electrodes 5.

[0060] In some embodiments, the electrode 5 can be formed by providing a liquid containing conductive particles into pores extending through the backing layer 12 and the adhesive surface 14. The liquid containing conductive particles may include conductive inks, such as conductive metals, silver inks, silver nanoparticle inks, reactive silver inks, copper inks, and conductive polymer inks, as well as liquid metals or alloys (e.g., metals or alloys that melt at relatively low temperatures and solidify at room temperature). The liquid containing conductive particles can be solidified or solidified by removing at least a portion of the liquid carrier to leave a continuous layer of conductive material that forms conductive contacts in pores or other microstructures on the substrate 10.

[0061] A laser beam 31, generated by a laser (not shown), is guided and focused onto the main surface 10b of the flexible substrate 10. The laser beam 31 moves across a selected portion of the main surface 10a or 10b to etch the substrate material at the edge 11, thereby exposing the free end 22 of the wire 20. A laser steering system can be used to control the movement of the laser beam 31 on the flexible substrate 10. The laser beam 31 can have any suitable wavelength suitable for removing this type of substrate material. For example, wavelengths such as green (approximately 532 nm), ultraviolet (approximately 266 nm), infrared (approximately 1,064 nm), or CO2 (approximately 10,640 nm) can be used.

[0062] like Figure 2BAs shown, a window 15a is formed by laser etching of the substrate material. The window 15a has dimensions that allow the embedded wire 20 to be partially withdrawn from the substrate 10, such that the free end 22 protrudes beyond the main plane 2 of the flexible substrate 10. In some embodiments, the free end 22 of the wire 20 may extend and act as a probe to contact the surface of the object to be inspected (e.g., skin).

[0063] Figures 3A to 3B as well as Figures 4A to 4B A method for manufacturing an electronic device 200 using a needle 40 according to another embodiment is illustrated. The needle 40 is provided to cut through a flexible substrate 10 and pull out the free end 22 of the flexible electronic component 20. In some embodiments, the needle 40 may be, for example, a hollow hypodermic needle. The inner diameter (ID) of the needle 40 may be larger than the outer diameter (OD) of the wire 20, such that the needle 40 can pick up the wire 20 while passing through the flexible substrate 10. The needle 40 forms a window 15b extending through the substrate 10, from which the free end 22 of the wire 20 protrudes from the main plane 2 of the substrate 10. It should be understood that the needle 40 may have various suitable configurations to pick up the wire 20 and pull the wire 20 through the window 15b.

[0064] Figures 5A to 5C A method for manufacturing an electronic device 300 according to another embodiment is illustrated. A laser beam 31 is guided and focused onto the main surface 10a or 10b of a flexible substrate 10. The laser beam 31 moves across a selected portion of the substrate 10 to etch the substrate material, thereby forming a window 15c that exposes a portion 24 of a wire 20 adjacent to a free end 22. A needle 40 is then inserted into the window 15c to pull out the free end 22, such that the free end 22 of the wire 20 extends beyond the main plane 2 of the substrate 10. Figure 5C In the depicted embodiments, the needle 40 may be secured in the window 15c to hold the wire 20 such that the free end 22 protrudes from the substrate 10. In many embodiments, the free end 22 extends beyond the main surface 10a of the substrate 10.

[0065] In some embodiments, the conductive wire 10 may be at least partially covered by another material, such as a polymer or metal, to protect the wire from the laser beam. Figure 6 An embodiment is shown in which the conductive wire 11 includes a sheath 11a surrounding a conductor 11b made of conductive material. The properties of the sheath material (e.g., thickness, thermal conductivity, melting point, etc.) are suitable for preventing heat buildup in the conductor 20 during laser ablation. A window 15d can be formed by laser etching, through which a portion of the conductor 11 can be extracted.

[0066] exist Figures 5A to 5CIn the depicted embodiment, after the window 15c is formed via laser etching, the free end 22 of the wire 20 remains embedded in the substrate 10. In some embodiments, the free end 22 of the wire 20 may be surface-treated to facilitate easy release from the substrate 10 when pulled out via the needle 40. Figures 7A to 7C In the depicted embodiment, the free end 22 of the wire 20 is placed in a cap 72 embedded in the substrate 10. A window 15e can be created on the substrate 10 by needle, laser etching, or a combination thereof. When the needle 40 is inserted into the window 15e to pull out the wire 20, the free end 22 of the wire 20 can be removed from the cap 72 and protrude from the main plane 2 of the substrate 10. The cap 72 can be made of any suitable material and has various configurations to allow easy release of the free end 22 therefrom.

[0067] In some embodiments, one or more plugs may be used to form a window on the substrate 10 through which the free end of an embedded electrical component (e.g., a conductive wire) can be pulled out to protrude beyond the main plane of the substrate. Figures 8A to 8D In the embodiment depicted, the plug 82 is positioned on the adhesive surface 14 of the substrate 10, contacting the wire 20 adjacent to the free end 22 placed within the cap 72. The plug 82 is removed from the adhesive surface 14, leaving a window 15f extending through the encapsulant layer 16. A laser beam 31 can be used to etch the substrate material to further expose a portion of the wire 20 adjacent to the window 15f. The free end 22 of the wire 20 can then be pulled out of the cap 72 to protrude from the substrate 10, similar to... Figure 7C As shown in the image.

[0068] exist Figures 9A to 9D In the depicted embodiment, a first plug 92 and a second plug 94 are positioned on either side of the wire 20, adjacent to the free end 22 placed within the cap 72. The first plug 92 may be placed in a window 15g formed in the backing layer 12. The second plug 94 may be placed on the adhesive surface 14 and then covered by the encapsulant layer 16. The plugs 92 and 94 are then removed from the substrate 10, leaving back-to-back windows 15g and 15h in the substrate 10. The free end 22 of the wire 20 can then be pulled out of the cap 72 to extend beyond the substrate 10 using a needle 40. This embodiment may not use a laser beam.

[0069] exist Figures 10A to 10DIn the depicted embodiment, a removable element 102 is disposed on an adhesive surface 14 of the substrate 10 and then covered by an encapsulant layer 16. When the removable element 102 is removed from the substrate 10, a cavity 104 is formed. A wire 20 can be inserted into the cavity 104 and attached to the adhesive surface 14. The backing layer 12 also includes a window 15i for receiving a plug 106 and one or more through holes 107 to form a contact 108 electrically connected to the wire 20. The plug 106 is then removable. Laser etching and / or pin pulling can be applied to extract the free end 22 of the wire 20 to protrude beyond the substrate 10.

[0070] Figures 11A to 11E A method for manufacturing apparatus 400 according to another embodiment is shown. For example... Figure 11A As shown, substrate 10 includes one or more electrodes or contact pads 114 formed on a side 10b of substrate 10. Substrate 10 also includes an optional window or through-hole 112 extending through substrate 10. Figure 11B As shown, flexible electronic components 20 (e.g., conductive wires) are disposed on the side 10b of the substrate 10 to contact the electrode 114. Figure 11C As shown, the flexible adhesive film 118 has an adhesive surface 118a to cover the wire 20 and secure it to the flexible backing layer 12. The flexible adhesive film 118 includes a through-hole 117 aligned with an electrode 114 on the substrate 10. The wire 20 is secured to the substrate 10 such that it contacts the electrode 114 and extends through the through-hole 117. The wire 20 may also extend through an optional window 112.

[0071] like Figure 11D As shown, electrode 119 may be formed in through-hole 117, electrically connected to wire 20 and electrode 114. In some embodiments, electrode 119 may be formed by providing a liquid containing conductive particles into through-hole 117. The liquid containing conductive particles may include conductive inks, such as conductive metals, silver inks, silver nanoparticle inks, reactive silver inks, copper inks, and conductive polymer inks, as well as liquid metals or alloys (e.g., metals or alloys that melt at relatively low temperatures and solidify at room temperature). The liquid containing conductive particles may be solidified or solidified by removing at least a portion of the liquid carrier to leave a continuous layer of conductive material that forms conductive contacts in through-hole 117 or other microstructures on adhesive film 118. Electrode 119 formed by solidifying conductive ink in through-hole may create a connection between wire 20 and underlying electrode 114.

[0072] like Figure 11EAs shown, an encapsulant layer 111 may be provided to cover the adhesive film 118 to protect the electrode 119 and / or other circuitry formed thereon. The encapsulant layer 111 may be formed using a liquid-based encapsulation process. In some embodiments, a liquid encapsulant may be applied to the surface of the device and cured to form the encapsulant layer. For example, the liquid encapsulant may be cured by heat or ultraviolet light. A needle may be provided to be inserted into the window 112 from the side 10a of the substrate 10 to pull out the free end 22 of the wire 20 extending beyond the substrate 10.

[0073] Figure 11E The device 400 has a multilayer structure including an adhesive film 118 having (i) an adhesive surface 11 for attaching to a substrate 10, and (ii) electrodes 119 in through-holes in the adhesive film 118 for forming electrical contact with electrodes below in the substrate 10. In this way, electrical contact can be provided for electrical components supported by the substrate 10. Exemplary electrical components may include, for example, IC chips, resistors, radio frequency identification (RFID) tags, near field communication (NFC) circuits, Bluetooth circuits, Wi-Fi circuits, microprocessor chips, dies, capacitors, accelerometer chips, etc.

[0074] Traditionally, electrical bonding materials such as solder and conductive epoxy resins are used to (i) establish electrical contacts between electrical components supported by a substrate, and (ii) establish adhesion between electrical components and a substrate. In these typical methods, the electrical bonding materials may undergo complex curing processes, which may include high temperatures exceeding 250°C for solder or long holding times (up to several hours) for conductive epoxy resins.

[0075] manufacture Figures 11A to 11E The exemplary method of apparatus 400 can separate the conductive and adhesive aspects by utilizing a two-material system comprising conductive ink for forming electrodes and an adhesive film for bonding. This method enables low temperatures and short curing cycles, which is beneficial for mass production.

[0076] The operation of this disclosure will be further described with reference to the following embodiments. These embodiments are provided to further illustrate various specific and preferred embodiments and techniques. However, it should be understood that many variations and modifications can be made while still falling within the scope of this disclosure.

[0077] List of exemplary implementation schemes

[0078] It should be understood that any of the implementation schemes 1 to 10, 11 to 15, 16 to 18, and 19 to 20 can be combined.

[0079] Implementation scheme 1 is a method for manufacturing a flexible device, the method comprising:

[0080] Provide a flexible substrate that extends along the main plane;

[0081] Provides a flexible electronic component, the flexible electronic component including a free end embedded within the flexible substrate; and

[0082] The free end of the flexible electronic component is extracted so that it protrudes beyond the main plane of the flexible substrate.

[0083] Implementation scheme 2 is the method of implementation scheme 1, wherein extracting the free end further includes at least partially laser etching a portion of the flexible substrate.

[0084] Implementation scheme 3 is the method of implementation scheme 2, wherein the portion of the flexible substrate includes the edge of the flexible substrate.

[0085] Implementation scheme 4 is a method of any one of implementation schemes 1 to 3, wherein extracting the free end further includes using a hollow needle to at least partially cut through the flexible substrate and pull out the free end of the flexible electronic component.

[0086] Implementation scheme 5 is a method of implementation scheme 4, further comprising providing a cap to receive the free end of the flexible electronic component within the flexible substrate, wherein the free end is removable from the cap when the hollow needle pulls the flexible electronic component.

[0087] Implementation 6 is a method of any one of Implementation 1 to 5, further comprising providing one or more removable plugs at least partially embedded in the flexible substrate to support the flexible electronic component.

[0088] Implementation scheme 7 is a method of any one of implementation schemes 1 to 6, wherein the flexible electronic component includes conductive wires.

[0089] Implementation scheme 8 is the method of implementation scheme 7, wherein the conductive wire includes a metal sheath.

[0090] Implementation scheme 9 is a method of any one of implementation schemes 1 to 8, wherein the flexible substrate includes a polymer film and an adhesive layer disposed thereon, and the flexible electronic component is disposed on the adhesive layer.

[0091] Implementation scheme 10 is the method of implementation scheme 9, wherein the flexible substrate further includes a polymer encapsulant layer to cover the flexible electronic component.

[0092] Implementation scheme 11 is a flexible device, the flexible device comprising:

[0093] A flexible substrate, the flexible substrate extending along a principal plane; and

[0094] Flexible electronic components, which are embedded within the flexible substrate.

[0095] The flexible electronic component includes a free end extending beyond the main plane of the flexible substrate.

[0096] Implementation scheme 12 is the apparatus of implementation scheme 11, wherein the flexible electronic component includes conductive wires.

[0097] Embodiment 13 is an apparatus of Embodiment 11 or 12, wherein the flexible substrate further comprises a polymer film and an adhesive layer disposed thereon, and the flexible electronic component is disposed on the adhesive layer.

[0098] Implementation scheme 14 is an apparatus of any one of implementation schemes 11 to 13, further comprising a hollow needle passing through the flexible substrate and supporting the free end of the flexible electronic component.

[0099] Implementation scheme 15 is an apparatus of any one of implementation schemes 11 to 14, wherein the flexible substrate includes a window through which the free end extends beyond the main plane of the flexible substrate.

[0100] Implementation scheme 16 is a method for manufacturing an apparatus, the method comprising:

[0101] A circuit board is provided that includes one or more contact pads on its main surface;

[0102] Provide a conductive element disposed on the main surface of the circuit board and in contact with the one or more contact pads;

[0103] An adhesive film is provided to be bonded to the main surface of the circuit board in an adhesive manner to secure the conductive element thereon, the adhesive film including one or more through holes aligned with one or more contact pads of the circuit board;

[0104] A liquid containing conductive particles is provided in one or more through-holes to contact one or more contact pads; and

[0105] The liquid containing conductive particles is solidified to form one or more electrodes for electrical connection to the one or more contact pads of the circuit board and the conductive elements.

[0106] Implementation scheme 17 is the method of implementation scheme 16, further comprising providing an encapsulant layer to cover the adhesive film.

[0107] Implementation scheme 18 is a method of implementation scheme 16 or 17, further comprising extracting the free end of the conductive element such that the free end protrudes beyond the main plane of the circuit board.

[0108] Implementation scheme 19 is an apparatus, the apparatus comprising:

[0109] A circuit board, the circuit board including one or more contact pads on its main surface;

[0110] A conductive element disposed on the main surface of the circuit board and in contact with one or more contact pads;

[0111] An adhesive film, adhesively bonded to the main surface of the circuit board to secure the conductive element thereto, the adhesive film including one or more through-holes aligned with one or more contact pads of the circuit board; and

[0112] One or more electrodes are formed in one or more through-holes in the adhesive film to electrically connect to one or more contact pads and the conductive elements of the circuit board.

[0113] Embodiment 20 is the apparatus of Embodiment 19, further comprising an encapsulant layer to cover the adhesive film.

[0114] The operation of this disclosure will be further described with reference to the embodiments detailed below. These embodiments are provided to further illustrate various specific and preferred implementations and techniques. However, it should be understood that many variations and modifications can be made while still falling within the scope of this disclosure.

[0115] Example

[0116] These embodiments are for illustrative purposes only and are not intended to unduly limit the scope of the appended claims. While the numerical ranges and parameters illustrating the broad scope of this disclosure are approximations, the values ​​shown in the specific examples are recorded as precisely as possible. However, any numerical value inherently contains some error, which is necessarily caused by the standard deviation present in the respective test measurements. At a minimum, and without attempting to limit the application of the doctrine of equivalence to the scope of the claims, each numerical parameter should at least be interpreted according to the number of significant digits reported and by applying customary rounding.

[0117] Material Summary

[0118] Unless otherwise stated, all parts, percentages, ratios, etc., in the embodiments and the remainder of this specification are by weight. Additionally, Table 1 provides abbreviations and sources for all materials used in the following embodiments:

[0119] Table 1

[0120]

[0121] Example 1

[0122] like Figure 12 As shown, a copper wire 2' with a diameter of 250 micrometers is placed on a flexible substrate 3' (circuit board). The substrate has two copper contact pads 4' and other circuitry. A 3.5 mil (0.089 mm) thick polyurethane (PU) film 62' is laminated onto a 1 mil (0.025 mm) thick 3M 200MP adhesive film 64'. Two through holes 63' with a diameter of at least 1 mm are formed by laser drilling through the stack 62' (64'). The drilled polyurethane adhesive film is placed on the circuit board 3' such that the through holes 63' are aligned with the pads 4' on the circuit board. The copper wire 2' is then secured under the adhesive 64'. Silver ink 7' is sprayed into the holes 63' at the top of the wire 2', thereby creating a connection between the wire 2' and the contact pads 4' below. A complete electrical connection is created by heating the ink to 100°C in a convection oven and holding for 5 minutes. Electrical measurements are performed by placing probes on the two contact pads and measuring the resistance between them. The resistance measured immediately after manufacturing and after aging tests is approximately 0.7 ohms.

[0123] Example 2

[0124] like Figure 13 As shown, a 250-micrometer diameter copper wire 2' is pre-assembled onto a 3.5-mil thick polyurethane adhesive film 62', and then placed on a flexible substrate 3' (circuit board), wherein the adhesive film comprises a 1-mil (0.025 mm) thick 3M 200MP adhesive film 64'. The substrate 3' has two copper contact pads 4' and other circuitry. Two through-holes 63', each at least 1 mm in diameter, are formed by laser drilling through the stack 62' (64'). The drilled polyurethane adhesive film is placed on the circuit board 3' such that the through-holes 63' are aligned with the pads 4' on the circuit board 3'. The copper wire 2' is then secured under the adhesive 64'. Silver ink 7' is sprayed into the holes 63' at the top of the wire 2', thereby creating a connection between the wire 2' and the contact pads 4' below. A complete electrical connection is created by heating the ink to 100°C in a convection oven and holding for 5 minutes. Electrical measurements are performed by placing probes on the two contact pads and measuring the resistance between them. The resistance measured immediately after manufacturing and after aging tests is approximately 0.7 ohms.

[0125] Throughout this specification, the terms "an embodiment," "certain embodiments," "one or more embodiments," or "implementation," whether or not preceded by the term "exemplary," mean that a particular feature, structure, material, or characteristic described in connection with that embodiment is included in at least one of the exemplary embodiments of this disclosure. Therefore, phrases such as "in one or more embodiments," "in some embodiments," "in one embodiment," or "in an embodiment" appearing throughout this specification do not necessarily refer to the same embodiment of the exemplary embodiments of this disclosure. Furthermore, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

[0126] While certain exemplary embodiments have been described in detail in this specification, it should be understood that modifications, variations, and equivalents of these embodiments will readily occur to those skilled in the art upon understanding the foregoing. Therefore, it should be understood that this disclosure should not be unduly limited to the exemplary embodiments shown above. In particular, as used herein, numerical ranges expressed in terms of endpoints are intended to include all values ​​contained within that range (e.g., 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5). Furthermore, all numbers used herein are considered to be modified by the term “about”.

[0127] Furthermore, all publications and patents cited herein are incorporated herein by reference in their entirety, as if each individual publication or patent were specifically and individually indicated to be incorporated by reference. Various exemplary embodiments have been described. These and other embodiments are within the scope of the following claims.

Claims

1. A method of manufacturing a flexible device, the method comprising: providing a flexible substrate extending along a major plane; providing a flexible electronic component, the flexible electronic component comprising a free end embedded within the flexible substrate; and extracting the free end of the flexible electronic component such that the free end protrudes beyond the major plane of the flexible substrate; wherein extracting the free end further comprises using a hollow needle to at least partially cut through the flexible substrate and pull out the free end of the flexible electronic component.

2. The method of claim 1, wherein extracting the free end further comprises at least partially laser etching a portion of the flexible substrate.

3. The method of claim 2, wherein the portion of the flexible substrate comprises an edge of the flexible substrate.

4. The method of any one of claims 1-3, further comprising providing a cap to receive the free end of the flexible electronic component within the flexible substrate, wherein the free end is removable from the cap when the hollow needle pulls the flexible electronic component.

5. The method of any one of claims 1-3, further comprising providing one or more removable plugs at least partially embedded in the flexible substrate to support the flexible electronic component.

6. The method of any one of claims 1-3, wherein the flexible electronic component comprises a conductive wire.

7. The method of claim 6, wherein the conductive wire comprises a metal sheath.

8. The method of any one of claims 1-3, wherein the flexible substrate comprises a polymer film and an adhesive layer disposed thereon, and the flexible electronic component is disposed on the adhesive layer.

9. The method of claim 8, wherein the flexible substrate further comprises a polymer encapsulant layer to cover the flexible electronic component.

10. A flexible device, the flexible device comprising: a flexible substrate extending along a major plane; and a flexible electronic component embedded within the flexible substrate, wherein the flexible electronic component comprises a free end protruding beyond the major plane of the flexible substrate; and a hollow needle passing through the flexible substrate and supporting the free end of the flexible electronic component.

11. The device of claim 10, wherein the flexible electronic component comprises a conductive wire.

12. The device of claim 10 or 11, wherein the flexible substrate further comprises a polymer film and an adhesive layer disposed thereon, and the flexible electronic component is disposed on the adhesive layer.

13. The device of claim 10 or 11, wherein the flexible substrate comprises a window through which the free end protrudes beyond the major plane of the flexible substrate. ​ ​ ​

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