Method, device and equipment for determining end point of sintering by partition based on thermal imaging

Abstract

The embodiment of the present application provides a method, device and equipment for determining the end point of sintering by partition based on thermal imaging, which relates to the field of sintering production technology. The method includes: obtaining temperature field data of a material layer section; dividing the material layer section into regions, and obtaining regional material layer section temperature field data according to the material layer section temperature field data; judging the sintering end state of the regional material layer section according to the regional material layer section temperature field data and the sintering end point position characteristic value model, wherein the sintering end state includes a normal state, an overburned state or an underburned state. The present application can improve the problem that the current method for obtaining the sintering end point position is not accurate enough in determining the sintering state, and achieve a more refined method for obtaining the sintering end point position, so as to improve the accuracy of determining the sintering state.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of sintering production, and in particular to a method, device and equipment for determining a sintering endpoint of a partition based on thermal imaging. Background Art

[0002] The sintering end point is an important parameter reflecting the sintering state. A reasonable sintering end point position can not only maximize the output of sintered ore, but also ensure the quality of sintered ore. Currently, the sintering end point position is usually obtained by measuring the wind box exhaust gas temperature.

[0003] In the process of realizing the present invention, the inventors found that the current method of obtaining the sintering endpoint position is not accurate enough to determine the sintering state. Summary of the invention

[0004] The embodiments of the present application provide a method, device and equipment for determining a partitioned sintering endpoint based on thermal imaging, which can improve the problem of inaccurate determination of the sintering state based on the current method of obtaining the sintering endpoint position.

[0005] In a first aspect of the present application, a method for determining a sintering endpoint by partition based on thermal imaging is provided, comprising:

[0006] Obtaining temperature field data of material layer cross section;

[0007] Divide the material layer section into regions, and obtain regional material layer section temperature field data according to the material layer section temperature field data;

[0008] According to the temperature field data of the regional material layer section and the sintering end point position characteristic value model, the sintering end point state of the regional material layer section is judged, and the sintering end point state includes a normal state, an overburned state or an underburned state.

[0009] By adopting the above technical scheme, by directly acquiring the temperature field data of the material layer section, and then dividing the material layer section into regions, the regional material layer section temperature field data is obtained according to the material layer section temperature field data, and then the sintering endpoint state of the regional material layer section is judged according to the regional material layer section temperature field data and the sintering endpoint position characteristic value model. The sintering endpoint state corresponding to the sintering endpoint in each area of ​​the material layer section can be obtained, which can improve the problem of insufficient accuracy in determining the sintering state according to the current method of obtaining the sintering endpoint position, and achieve a more refined sintering endpoint position to improve the accuracy of determining the sintering state.

[0010] In a possible implementation, the regional material layer section temperature field data includes the position and temperature value of each point in the regional material layer section;

[0011] The step of judging the sintering endpoint state of the regional material layer section according to the regional material layer section temperature field data and the sintering endpoint position characteristic value model comprises:

[0012] Based on the sintering endpoint position characteristic value model and according to the regional material layer cross section temperature field data, the characteristic value of the relative position of the highest temperature point in the material layer cross section is calculated;

[0013] The sintering endpoint state is determined according to the characteristic value.

[0014] In a possible implementation, the method for constructing the sintering endpoint position characteristic value model includes:

[0015] The sintering endpoint position characteristic value model is constructed according to the number of temperature points between the highest temperature point of the material layer section and the bottom of the trolley and / or the total number of temperature points of the material layer section.

[0016] In a possible implementation, judging the sintering endpoint state according to the characteristic value includes:

[0017] Determine whether the characteristic value is greater than a first preset characteristic value, and if so, the sintering end state is an under-burned state;

[0018] If not, determining whether the characteristic value is less than a second preset characteristic value, and if so, the sintering end state is an over-burned state;

[0019] If not, the sintering endpoint state is a normal state;

[0020] Among them, the first preset characteristic value is greater than the second preset characteristic value.

[0021] In a second aspect of the present application, a device for determining a sintering endpoint by partitioning based on thermal imaging is provided, comprising:

[0022] An acquisition module is used to obtain the temperature field data of the material layer cross section;

[0023] A division module is used to divide the material layer section into regions, and obtain regional material layer section temperature field data according to the material layer section temperature field data;

[0024] The judgment module is used to judge the sintering end state of the regional material layer section according to the temperature field data of the regional material layer section and the sintering end position characteristic value model, and the sintering end state includes a normal state, an overburned state or an underburned state.

[0025] In a possible implementation, the determination module includes:

[0026] A calculation unit, for calculating the characteristic value of the relative position of the highest temperature point in the material layer section based on the sintering endpoint position characteristic value model and the temperature field data of the material layer section in the region;

[0027] A judging unit is used to judge the sintering end state according to the characteristic value.

[0028] In a possible implementation, the computing unit includes:

[0029] The construction subunit is used to construct the sintering end point position characteristic value model according to the number of temperature points between the highest temperature point of the material layer section and the bottom of the trolley and / or the total number of temperature points of the material layer section.

[0030] In a possible implementation, the judging unit includes:

[0031] A first judging subunit is used to judge whether the characteristic value is greater than a first preset characteristic value, and if so, the sintering end state is an under-burned state;

[0032] The second judgment subunit is used to judge whether the characteristic value is less than a second preset characteristic value if the characteristic value is not greater than the first preset characteristic value, and if so, the sintering end state is an over-burned state; if not, the sintering end state is a normal state;

[0033] Among them, the first preset characteristic value is greater than the second preset characteristic value.

[0034] In a third aspect of the present application, an electronic device is provided, which includes a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the method described above is implemented.

[0035] In a fourth aspect of the present application, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the steps of the method are implemented.

[0036] It should be understood that the contents described in the Summary of the Invention are not intended to limit the key or important features of the embodiments of the present application, nor are they intended to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The above and other features, advantages and aspects of the embodiments of the present application will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, wherein:

[0038] Figure 1 A flow chart showing a method for determining a sintering endpoint of a partition based on thermal imaging in an embodiment of the present application is shown;

[0039] Figure 2 The structure diagram of the device for determining the end point of sintering by partition based on thermal imaging in the embodiment of the present application is shown;

[0040] Figure 3 A schematic diagram of the structure of an electronic device suitable for implementing the embodiments of the present application is shown. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0042] It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application. In addition, it can also be understood that although the efforts made in this development process may be complex and lengthy, for ordinary technicians in the field related to the contents disclosed in the present application, some changes such as design, manufacturing or production based on the technical contents disclosed in the present application are only conventional technical means, and should not be understood as the contents disclosed in the present application are insufficient.

[0043] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0044] Unless otherwise defined, the technical terms or scientific terms involved in this application should be understood by people with ordinary skills in the technical field to which this application belongs. The words "one", "a", "a", "the" and the like involved in this application do not indicate a quantitative limitation, and may represent the singular or plural. The terms "include", "comprise", "have" and any of their variations involved in this application are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units that are not listed, or may also include other steps or units inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "multiple" involved in this application refers to greater than or equal to two. "And / or" describes the association relationship of associated objects, indicating that there can be three relationships, for example, "A and / or B" can represent: A exists alone, A and B exist at the same time, and B exists alone. The terms "first", "second", "third" and the like involved in the present application are merely used to distinguish similar objects and do not represent a specific ordering of the objects.

[0045] The partitioned sintering endpoint determination method based on thermal imaging provided in the embodiment of the present application can be applied to the field of sintering production technology. In the current sintering generation process, the sintering endpoint position is generally obtained by measuring the wind box exhaust gas temperature, thereby judging the sintering state. However, based on the current method of obtaining the sintering endpoint position, the method of judging the sintering state according to the sintering endpoint position is not accurate enough.

[0046] To solve this technical problem, an embodiment of the present application provides a method for determining a sintering endpoint of a partition based on thermal imaging. In some embodiments, the method for determining a sintering endpoint of a partition based on thermal imaging can be executed by an electronic device.

[0047] Figure 1 FIG. 2 shows a flow chart of a method for determining the end point of sintering by partition based on thermal imaging in an embodiment of the present application. Figure 1 In this embodiment, the method for determining the end point of sintering by partition based on thermal imaging includes:

[0048] Step S101: Acquire temperature field data of a material layer cross section.

[0049] Step S102: Divide the material layer section into regions, and obtain regional material layer section temperature field data according to the material layer section temperature field data.

[0050] Step S103: judging the sintering endpoint state of the regional material layer section according to the regional material layer section temperature field data and the sintering endpoint position characteristic value model, wherein the sintering endpoint state includes a normal state, an over-burned state or an under-burned state.

[0051] By adopting the above technical scheme, by directly acquiring the temperature field data of the material layer section, and then dividing the material layer section into regions, the regional material layer section temperature field data is obtained according to the material layer section temperature field data, and then the sintering endpoint state of the regional material layer section is judged according to the regional material layer section temperature field data and the sintering endpoint position characteristic value model. The sintering endpoint state corresponding to the sintering endpoint in each area of ​​the material layer section can be obtained, which can improve the problem of insufficient accuracy in determining the sintering state according to the current method of obtaining the sintering endpoint position, and achieve a more refined sintering endpoint position to improve the accuracy of determining the sintering state.

[0052] In step S101, the temperature field data of the material layer section is obtained by analyzing the thermal imaging video at the tail of the sintering machine to obtain the temperature field data of the material layer section at the moment when the trolley material layer falls off. The temperature field data of the material layer section includes the position and temperature value of each point (temperature point) of the material layer section.

[0053] In the embodiment of the present application, the thermal imaging video of the tail of the sintering machine is obtained from a thermal imaging device installed at the tail of the sintering machine. The thermal imaging device includes a handheld infrared thermal imager, a night vision infrared thermal imager, and an industrial high-temperature infrared thermal imager. When obtaining the thermal imaging video of the tail of the sintering machine, a water cooling protection device can be set around the thermal imaging device to reduce the impact of high temperature on the instrument.

[0054] Optionally, the thermal imaging device is an industrial high-temperature infrared thermal imager. Based on the adaptability of the industrial high-temperature infrared thermal imager to high temperatures, the industrial high-temperature infrared thermal imager is more suitable for the sintering production process on an industrial basis.

[0055] In the embodiment of the present application, the industrial high-temperature infrared thermal imager converts the electronic video signal measured by the infrared detector into an infrared thermal image through a two-dimensional plane imaging infrared system, and displays it on a display for real-time manual viewing. It can also intelligently identify indicators such as the temperature of the material layer section at the tail end of the sintering machine, the thickness of the red-hot layer, and the uniformity of the red-hot layer, and upload the result data in real time to a partitioned sintering endpoint determination device based on thermal imaging.

[0056] In the embodiment of the present application, the thermal imaging device is installed outside the dust cover at the tail of the sintering machine, facing the lower part of the material layer section at the tail of the sintering machine. The camera position of the thermal imaging device is at an angle of 10° to 15° with the bottom surface of the sintering trolley to ensure that the camera is perpendicular to the material layer section exposed when the sintered ore falls from the trolley.

[0057] Optionally, the camera of the thermal imaging device is positioned at 12° to the bottom surface of the sintering trolley.

[0058] In the embodiment of the present application, the number of temperature points of the material layer cross section included in the material layer cross section temperature field data can be set.

[0059] Optionally, the material layer section is set to include 3600 temperature points.

[0060] In step S102, the material layer section is divided into regions based on the number and position of the distribution gates. Specifically, the section of the tail of the sintering machine is divided into regions along the horizontal direction based on the number of distribution gates and the positions corresponding to the distribution gates. Based on this, according to the material layer section temperature field data, the number of distribution gates and the positions corresponding to the distribution gates, the material layer section temperature field data can be divided into several regional material layer section temperature field data. Among them, each regional material layer section corresponds to a distribution gate and the regional position of the material layer section corresponding to the distribution gate.

[0061] In other words, the material layer section is divided into regions according to the number of material distribution gates and the corresponding positions of the material distribution gates, so that the material layer section temperature field data is divided into several regional material layer section temperature field data.

[0062] In the embodiment of the present application, the number of material distribution gates and the corresponding positions of the material distribution gates can be determined according to actual conditions.

[0063] For example, a sintering machine has six distribution gates and each distribution gate is evenly spaced. Based on the number and position of the distribution gates, the material layer section can be divided into six areas of equal size, and each area corresponds to one distribution gate, that is, the material layer section temperature field data can be divided into six groups of material layer section temperature field data (i.e., six area material layer section temperature field data).

[0064] In step S103, based on the sintering endpoint position characteristic value model, the sintering endpoint state of the regional material layer section of each region is determined according to the regional material layer section temperature field data of each region (that is, according to the position and temperature value of the temperature point of each region).

[0065] In the embodiment of the present application, based on the sintering endpoint position characteristic value model, the smaller the characteristic value of the calculated temperature point is, the closer the combustion layer in the material layer section is to the bottom surface of the trolley, and the closer to complete sintering.

[0066] In the embodiments of the present application, the sintering end state includes under-burned state, normal state and over-burned state, corresponding to the stage of the sintering process. For example, under-burned state refers to the sintering in which the sintering time is too short during the sintering process, resulting in the product not reaching the required performance. Over-burned state refers to the sintering residence time is too long during the sintering process, resulting in a decrease in the sintering machine capacity.

[0067] In some embodiments, the regional material layer section temperature field data includes the position and temperature value of each point in the regional material layer section; step S103 includes: step A1-step A2.

[0068] Step A1: Based on the sintering endpoint position characteristic value model and according to the regional material layer cross-section temperature field data, the characteristic value of the relative position of the highest temperature point in the material layer cross-section is calculated.

[0069] Step A2: judging the sintering endpoint state according to the characteristic value.

[0070] In the embodiment of the present application, the highest temperature point is set as the sintering end point position in the region, that is, the temperature point with the highest temperature value among the temperature points in the region is the sintering end point position in the region. According to the position and temperature value of the temperature points of the material layer section in each region, the characteristic value of the relative position of the temperature point with the highest temperature value among the temperature points in each region in the material layer section is calculated to determine the sintering end state of the material layer section in each region.

[0071] By adopting the above technical scheme, based on the characteristic value model of the sintering end point position, according to the temperature field data of the regional material layer section, the characteristic value of the relative position of the temperature point with the highest temperature value in each regional temperature point in the material layer section is calculated, and then the sintering end point state of the material layer section in each region is judged according to the characteristic value, so as to achieve a more refined sintering end point position, thereby improving the accuracy of determining the sintering state.

[0072] In some embodiments, the method for constructing the sintering endpoint position characteristic value model includes:

[0073] The sintering endpoint position characteristic value model is constructed according to the number of temperature points between the highest temperature point of the material layer section and the bottom of the trolley and / or the total number of temperature points of the material layer section.

[0074] In the embodiment of the present application, the sintering end point position characteristic value model is expressed by the following formula:

[0075] k=(K / N)×100-10

[0076] Among them, k represents the characteristic value of the sintering end point position, K represents the number of temperature points between the highest temperature point of the material layer section and the bottom of the trolley; N represents the total number of temperature points of the material layer section.

[0077] By adopting the above technical solution, the sintering endpoint state of the material layer section in each area is calculated based on the sintering endpoint position characteristic value model, so that the sintering endpoint position can be obtained more precisely to improve the accuracy of determining the sintering state.

[0078] In some embodiments, step A2 includes: step a1-step a3.

[0079] Step a1: determine whether the characteristic value is greater than a first preset characteristic value. If so, the sintering endpoint state is an under-burned state.

[0080] Step a2: If the characteristic value is not greater than the first preset characteristic value, determine whether the characteristic value is less than the second preset characteristic value. If so, the sintering endpoint state is an overburned state.

[0081] Step a3: If the characteristic value is not less than the second preset characteristic value, the sintering endpoint state is a normal state.

[0082] Among them, the first preset characteristic value is greater than the second preset characteristic value.

[0083] In the embodiment of the present application, the sintering endpoint state corresponding to each region is determined according to the characteristic value of the sintering endpoint position of each region. The first preset characteristic value and the second preset characteristic value can be set according to the experience value.

[0084] For example, the first preset characteristic value is set to 30, and the second preset characteristic value is set to 10. If the characteristic value of the sintering end point position of the region is greater than 30, the sintering end point state of the region is an under-burned state; if the characteristic value of the sintering end point position of the region is less than 10, the sintering end point state of the region is an over-burned state; if the characteristic value of the sintering end point position of the region is between 10 and 30, the sintering end point state of the region is a normal state.

[0085] For another example, based on the sintering endpoint position characteristic value model and according to the temperature field data of the material layer cross-section in the six regions, the calculated sintering endpoint position characteristic values ​​of the six regions (i.e., region 1, region 2, region 3, region 4, region 5, and region 6) are 8.7, 18.6, 20.3, 19.5, 18.5, and 10.5, respectively. The sintering endpoint state of region 1 is an overburned state, the sintering endpoint state of region 3 is an underburned state, and the sintering endpoint states of other regions are normal.

[0086] By adopting the above technical solution, based on the characteristic value, the first preset characteristic value and the second preset characteristic value, the sintering endpoint state of each area can be determined, so as to obtain the sintering endpoint position more precisely, so as to improve the accuracy of determining the sintering state.

[0087] In summary, the method of determining the end point of sintering by partition based on thermal imaging collects the temperature value and position of each point of the material layer section at the tail of the sintering machine, and partitions the material layer section according to the corresponding relationship of the material distribution gate, and then uses the temperature distribution characteristics of the material layer section of each partition to calculate the sintering end state of each partition, thereby achieving the purpose of determining the end point of sintering by partition. At the same time, after determining the end point state of sintering by partition, the material distribution can also be adjusted by partition to make the sintering end point more reasonable.

[0088] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required by the present application.

[0089] The above is an introduction to the method embodiment. The following is a further explanation of the scheme described in this application through an apparatus embodiment.

[0090] Figure 2 The structure diagram of a device for determining the end point of sintering by partition based on thermal imaging in an embodiment of the present application is shown. Figure 2 The partitioned sintering endpoint determination device based on thermal imaging includes an acquisition module 201, a division module 202 and a determination module 203.

[0091] The acquisition module 201 is used to acquire the temperature field data of the material layer cross section.

[0092] The division module 202 is used to divide the material layer section into regions, and obtain regional material layer section temperature field data according to the material layer section temperature field data.

[0093] The judgment module 203 is used to judge the sintering end state of the regional material layer section according to the temperature field data of the regional material layer section and the sintering end position characteristic value model, and the sintering end state includes a normal state, an over-burned state or an under-burned state.

[0094] In some embodiments, the determination module 203 includes:

[0095] A calculation unit, for calculating the characteristic value of the relative position of the highest temperature point in the material layer section based on the sintering endpoint position characteristic value model and the temperature field data of the material layer section in the region;

[0096] A judging unit is used to judge the sintering end state according to the characteristic value.

[0097] In some embodiments, the computing unit comprises:

[0098] The construction subunit is used to construct the sintering end point position characteristic value model according to the number of temperature points between the highest temperature point of the material layer section and the bottom of the trolley and / or the total number of temperature points of the material layer section.

[0099] In some embodiments, the determining unit includes:

[0100] A first judging subunit is used to judge whether the characteristic value is greater than a first preset characteristic value, and if so, the sintering end state is an under-burned state;

[0101] The second judgment subunit is used to judge whether the characteristic value is less than a second preset characteristic value if the characteristic value is not greater than the first preset characteristic value, and if so, the sintering end state is an over-burned state; if not, the sintering end state is a normal state;

[0102] Among them, the first preset characteristic value is greater than the second preset characteristic value.

[0103] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the described module can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0104] Figure 3 A schematic diagram of the structure of an electronic device suitable for implementing the embodiments of the present application is shown. Figure 3 As shown, Figure 3 The electronic device 300 shown includes: a processor 301 and a memory 303. The processor 301 and the memory 303 are connected. Optionally, the electronic device 300 may also include a transceiver 304. It should be noted that in actual applications, the transceiver 304 is not limited to one, and the structure of the electronic device 300 does not constitute a limitation on the embodiments of the present application.

[0105] Processor 301 may be a CPU (Central Processing Unit), a general purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array) or other programmable logic devices, transistor logic devices, hardware components or any combination thereof. It may implement or execute various exemplary logic blocks, modules and circuits described in conjunction with the disclosure of this application. Processor 301 may also be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, etc.

[0106] The bus 302 may include a path to transmit information between the above components. The bus 302 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus. The bus 302 may be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 3 Only one thick line is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0107] The memory 303 can be a ROM (Read Only Memory) or other types of static storage devices that can store static information and instructions, a RAM (Random Access Memory) or other types of dynamic storage devices that can store information and instructions, or an EEPROM (Electrically Erasable Programmable Read Only Memory), a CD-ROM (Compact Disc Read Only Memory) or other optical disk storage, optical disk storage (including compressed optical disk, laser disk, optical disk, digital versatile disk, Blu-ray disk, etc.), a magnetic disk storage medium or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of instructions or data structures and can be accessed by a computer, but is not limited to these.

[0108] The memory 303 is used to store the application code for executing the solution of the present application, and the execution is controlled by the processor 301. The processor 301 is used to execute the application code stored in the memory 303 to implement the contents shown in the above method embodiment.

[0109] Among them, electronic devices include but are not limited to: mobile terminals such as mobile phones, laptops, digital broadcast receivers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), vehicle-mounted terminals (such as vehicle-mounted navigation terminals), etc., and fixed terminals such as digital TVs, desktop computers, etc. Figure 3 The electronic device shown is merely an example and should not bring any limitation to the functions and scope of use of the embodiments of the present application.

[0110] The embodiment of the present application provides a computer-readable storage medium, on which a computer program is stored, and when the computer is run on a computer, the computer can execute the corresponding content in the aforementioned method embodiment. Compared with the prior art, in the embodiment of the present application, by directly obtaining the temperature field data of the material layer section, and then dividing the material layer section into regions, the regional material layer section temperature field data is obtained according to the material layer section temperature field data, and then the sintering end state of the regional material layer section is judged according to the regional material layer section temperature field data and the sintering end position characteristic value model, the sintering end state corresponding to the sintering end point in each region of the material layer section can be obtained, which can improve the problem of inaccurate determination of the sintering state according to the current method of obtaining the sintering end position, and achieve a more refined sintering end position to improve the accuracy of determining the sintering state.

[0111] It should be understood that, although the steps in the flowchart of the accompanying drawings are displayed in sequence as indicated by the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least a part of the steps in the flowchart of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a part of the sub-steps or stages of other steps.

[0112] The above description is only a partial implementation method of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A method for determining the end point of sintering by partition based on thermal imaging, characterized in that: include: Obtaining temperature field data of material layer cross section; Divide the material layer section into regions, and obtain regional material layer section temperature field data according to the material layer section temperature field data; According to the temperature field data of the regional material layer section and the sintering end point position characteristic value model, the sintering end point state of the regional material layer section is judged, and the sintering end point state includes a normal state, an overburned state or an underburned state; the temperature field data of the regional material layer section includes the position and temperature value of each point in the regional material layer section; The method of judging the sintering endpoint state of the regional material layer section according to the regional material layer section temperature field data and the sintering endpoint position characteristic value model includes: calculating the characteristic value of the relative position of the highest temperature point in the material layer section according to the regional material layer section temperature field data based on the sintering endpoint position characteristic value model; judging the sintering endpoint state according to the characteristic value; the method of constructing the sintering endpoint position characteristic value model includes: constructing the sintering endpoint position characteristic value model according to the number of temperature points between the highest temperature point of the material layer section and the bottom of the trolley and / or the total number of temperature points of the material layer section; judging the sintering endpoint state according to the characteristic value includes: judging whether the characteristic value is greater than a first preset characteristic value, if so, the sintering endpoint state is an under-burned state; if not, judging whether the characteristic value is less than a second preset characteristic value, if so, the sintering endpoint state is an over-burned state; if not, the sintering endpoint state is a normal state; wherein, the first preset characteristic value is greater than the second preset characteristic value.

2. A device for determining the end point of sintering by partition based on thermal imaging, characterized in that: include: An acquisition module is used to obtain the temperature field data of the material layer cross section; A division module is used to divide the material layer section into regions, and obtain the regional material layer section temperature field data according to the material layer section temperature field data; a judgment module is used to judge the sintering end state of the regional material layer section according to the regional material layer section temperature field data and the sintering end position characteristic value model, and the sintering end state includes a normal state, an overburned state or an underburned state; the judgment module includes: a calculation unit, which is used to calculate the characteristic value of the relative position of the highest temperature point in the material layer section according to the regional material layer section temperature field data based on the sintering end position characteristic value model; a judgment unit is used to judge the sintering end state according to the characteristic value; the calculation unit includes In summary: a construction subunit is used to construct the sintering end point position characteristic value model according to the number of temperature points between the highest temperature point of the material layer section and the bottom of the trolley and / or the total number of temperature points of the material layer section; the judgment unit includes: a first judgment subunit, used to judge whether the characteristic value is greater than a first preset characteristic value, if so, the sintering end state is an under-burned state; a second judgment subunit, used to judge whether the characteristic value is less than a second preset characteristic value if the characteristic value is not greater than the first preset characteristic value, if so, the sintering end state is an over-burned state; if not, the sintering end state is a normal state; wherein, the first preset characteristic value is greater than the second preset characteristic value.

3. An electronic device comprising a memory and a processor, wherein a computer program is stored in the memory, wherein: When the processor executes the computer program, the method according to claim 1 is implemented.

4. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to claim 1 are implemented.

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