Data processing method, device, electronic device and storage medium for radio frequency devices

Abstract

The present application relates to a data processing method, device, electronic device, computer-readable storage medium and computer program product for a radio frequency device. The method comprises: obtaining substrate test data of a packaging substrate in a target radio frequency device, the substrate test data being data obtained after testing a first test point of the packaging substrate; obtaining radio frequency test data of a radio frequency component mounted on the packaging substrate, the radio frequency test data being data obtained after testing a second test point of the radio frequency component, at least a portion of the sub-path in the second test path corresponding to the second test point coincides with at least a portion of the sub-path in the first test path corresponding to the first test point; de-embedding the radio frequency test data based on the substrate test data to obtain radio frequency characteristic data of the target radio frequency device. The use of this method can improve the data processing efficiency of radio frequency devices.

Description

Technical Field

[0001] The present application relates to the field of data processing technology, and in particular to a data processing method, device, electronic device, computer-readable storage medium, and computer program product for a radio frequency device. Background Art

[0002] With the rapid development of communications technology, wireless communication devices have higher requirements for information transmission. RF devices are fundamental components of wireless communication devices. They convert binary signals into high-frequency radio electromagnetic waves during transmission and convert received electromagnetic waves into binary digital signals during reception. During characterization testing of RF devices, many lack coaxial connectors. Testing can only be performed in a coaxial environment by connecting the RF device to a coaxial cable using a test fixture. To obtain the true characteristics of RF devices, it is essential to precisely eliminate fixture effects.

[0003] Traditional techniques often involve modeling fixtures using electromagnetic simulation software or constructing multiple calibration standards on non-coaxial RF device substrates for calibration to characterize and remove fixture effects. However, these methods are complex and time-consuming, resulting in low data processing efficiency for RF devices and an inability to quickly obtain the RF characteristics of RF devices. Summary of the Invention

[0004] Based on this, it is necessary to provide a data processing method, device, electronic device, computer-readable storage medium and computer program product for a radio frequency device, which can improve the data processing efficiency of the radio frequency device, in order to address the above technical problems.

[0005] In a first aspect, the present application provides a data processing method for a radio frequency device. The method comprises:

[0006] Acquire substrate test data of a package substrate in a target radio frequency device, wherein the substrate test data is data obtained after testing a first test point of the package substrate;

[0007] Obtaining radio frequency test data of a radio frequency component mounted on the packaging substrate, the radio frequency test data being data obtained after testing a second test point of the radio frequency component, wherein at least a portion of a subpath in a second test path corresponding to the second test point overlaps with at least a portion of a subpath in a first test path corresponding to the first test point;

[0008] De-embedding is performed on the radio frequency test data according to the substrate test data to obtain radio frequency characteristic data of the target radio frequency device.

[0009] In a second aspect, the present application further provides a data processing device for a radio frequency device. The device comprises:

[0010] A first acquisition module is configured to acquire substrate test data of a package substrate in a target radio frequency device, wherein the substrate test data is data obtained after testing a first test point of the package substrate;

[0011] a second acquisition module, configured to acquire radio frequency test data of a radio frequency component mounted on the packaging substrate, the radio frequency test data being data obtained after testing a second test point of the radio frequency component, wherein at least a portion of a subpath in a second test path corresponding to the second test point overlaps with at least a portion of a subpath in a first test path corresponding to the first test point;

[0012] The data processing module is used to perform de-embedding processing on the radio frequency test data according to the substrate test data to obtain radio frequency characteristic data of the target radio frequency device.

[0013] In a third aspect, the present application further provides an electronic device. The electronic device includes a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the following steps are performed:

[0014] Acquire substrate test data of a package substrate in a target radio frequency device, wherein the substrate test data is data obtained after testing a first test point of the package substrate;

[0015] Obtaining radio frequency test data of a radio frequency component mounted on the packaging substrate, the radio frequency test data being data obtained after testing a second test point of the radio frequency component, wherein at least a portion of a subpath in a second test path corresponding to the second test point overlaps with at least a portion of a subpath in a first test path corresponding to the first test point;

[0016] De-embedding is performed on the radio frequency test data according to the substrate test data to obtain radio frequency characteristic data of the target radio frequency device.

[0017] In a fourth aspect, the present application further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the following steps:

[0018] Acquire substrate test data of a package substrate in a target radio frequency device, wherein the substrate test data is data obtained after testing a first test point of the package substrate;

[0019] Obtaining radio frequency test data of a radio frequency component mounted on the packaging substrate, the radio frequency test data being data obtained after testing a second test point of the radio frequency component, wherein at least a portion of a subpath in a second test path corresponding to the second test point overlaps with at least a portion of a subpath in a first test path corresponding to the first test point;

[0020] De-embedding is performed on the radio frequency test data according to the substrate test data to obtain radio frequency characteristic data of the target radio frequency device.

[0021] In a fifth aspect, the present application further provides a computer program product. The computer program product includes a computer program that, when executed by a processor, implements the following steps:

[0022] Acquire substrate test data of a package substrate in a target radio frequency device, wherein the substrate test data is data obtained after testing a first test point of the package substrate;

[0023] Obtaining radio frequency test data of a radio frequency component mounted on the packaging substrate, the radio frequency test data being data obtained after testing a second test point of the radio frequency component, wherein at least a portion of a subpath in a second test path corresponding to the second test point overlaps with at least a portion of a subpath in a first test path corresponding to the first test point;

[0024] De-embedding is performed on the radio frequency test data according to the substrate test data to obtain radio frequency characteristic data of the target radio frequency device.

[0025] The above-mentioned RF device data processing method, apparatus, electronic device, computer-readable storage medium, and computer program product obtain substrate test data of a package substrate in a target RF device, the substrate test data being data obtained after testing a first test point on the package substrate; obtain RF test data of an RF component mounted on the package substrate, the RF test data being data obtained after testing a second test point on the RF component, at least a portion of a subpath in a second test path corresponding to the second test point overlapping with at least a portion of a subpath in a first test path corresponding to the first test point; and de-embedding the RF test data based on the substrate test data to obtain RF characteristic data of the target RF device. Using the method of the above-mentioned embodiment, there is no need to construct multiple additional calibration standards on the RF device to characterize and remove fixture effects. Instead, the fixture effects can be accurately removed directly through de-embedding, resulting in highly accurate RF characteristic data. The RF characteristics of the RF device can be quickly obtained, thereby improving the data processing efficiency of the RF device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1A diagram illustrating an application environment of a data processing method for a radio frequency device according to an embodiment;

[0027] Figure 2 1 is a flow chart of a data processing method for a radio frequency device according to an embodiment;

[0028] Figure 3 is a schematic diagram of a first test path and a second test path in one embodiment;

[0029] Figure 4 is a schematic diagram of a radio frequency component in a target radio frequency device in a specific embodiment;

[0030] Figure 5 is a schematic diagram of a packaging substrate in a target radio frequency device in a specific embodiment;

[0031] Figure 6 is a schematic diagram of a first test path and a second test path in a specific embodiment;

[0032] Figure 7 This is a structural block diagram of a data processing device for a radio frequency device in one embodiment;

[0033] Figure 8 is a diagram of the internal structure of an electronic device in one embodiment;

[0034] Figure 9 FIG. 4 is a diagram showing the internal structure of an electronic device in another embodiment. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0036] In one embodiment, the data processing method of the radio frequency device provided by the present application can be applied to Figure 1 In the application environment shown, the test device 102 communicates with the electronic device 104 via a network. The data storage system can store data that the electronic device 104 needs to process. The data storage system can be integrated with the electronic device 104 or placed on the cloud or other network servers.

[0037] Specifically, the tester can use the test equipment 102 to test the target RF device, or the test equipment 102 can perform the test of the target RF device by itself. Then, the electronic device 104 obtains the substrate test data of the package substrate in the target RF device. The substrate test data is the data obtained after testing the first test point of the package substrate; obtains the RF test data of the RF component installed on the package substrate. The RF test data is the data obtained after testing the second test point of the RF component. At least a part of the sub-path in the second test path corresponding to the second test point coincides with at least a part of the sub-path in the first test path corresponding to the first test point; according to the substrate test data, the RF test data is de-embedded to obtain the RF characteristic data of the target RF device. Therefore, the RF characteristics of the target RF device can be evaluated based on the RF characteristic data.

[0038] In one embodiment, the RF device data processing method provided herein can be applied solely to test device 102 when the test device 102 also has data processing capabilities. Specifically, after testing a target RF device, test device 102 processes the data to obtain RF characteristic data of the target RF device. This RF characteristic data can then be used to evaluate the RF characteristics of the target RF device.

[0039] Test equipment 102 is RF testing equipment capable of testing RF components, including but not limited to signal analyzers, RF testers, RF power amplifiers, RF inductors, RF capacitors, and RF resistors. Electronic device 104 can be a terminal or server, including but not limited to various personal computers, smartphones, and tablet computers. The server can be implemented as a standalone server or a server cluster consisting of multiple servers.

[0040] In one embodiment, Figure 2 As shown, a data processing method for a radio frequency device is provided, and the method is applied to Figure 1 The test device 102 and / or electronic device 104 in FIG. 1 are used as an example to illustrate the present invention, including:

[0041] Step S202 : Acquire substrate test data of a package substrate in a target radio frequency device, where the substrate test data is data obtained after testing a first test point of the package substrate.

[0042] Radio Frequency (RF) technology is widely used in wireless communications. RF devices are the core of wireless communication connections and the fundamental components for signal transmission and reception. RF devices include, but are not limited to, RF filters, RF switches, and power amplifier chips. RF devices possess RF characteristics, including, but not limited to, RF inductance, RF capacitance, RF impedance, RF resistance, and transmit power.

[0043] RF devices are primarily packaged from RF materials and packaging substrate materials. In this embodiment, the RF materials are referred to as RF components, and the packaging substrate materials are referred to as packaging substrates. The target RF device refers to the RF device for which RF characteristics testing is required. In this embodiment, there are no restrictions on the type of target RF device, the material types of the RF components and packaging substrates contained in the target RF device, or the packaging method of the RF components and packaging substrates. Any applicable material type and achievable packaging method are acceptable.

[0044] In one embodiment, a ball grid array is provided on the RF component of the target RF device. The ball grid array (BGA) is a mounting device component without leads on the surface, which is made of a series of metal ball solders. The metal balls can be called solder balls and are used for interconnection, that is, the solder balls are interconnected through interconnection lines. It can be understood that whether there are interconnection lines between the solder balls needs to be set according to actual technical needs, and not every two solder balls have interconnection lines directly between them. For example, for two adjacent solder balls A and solder balls B, the interconnection line between the two can be very short, such as solder balls A and solder balls B are directly connected by interconnection line AB, and interconnection line AB is line segment AB. Alternatively, the interconnection line between the two can be very long, such as solder balls A and solder balls B are connected by interconnection line ACDB, and interconnection line ACDB includes line segment AC, line segment CD, and line segment DB.

[0045] The solder balls of the RF component are fixed to the packaging substrate of the target RF component, that is, the RF component is installed on the packaging substrate. Accordingly, the packaging substrate matches the RF component, is provided with through-holes, and is provided with interconnect lines between the through-holes that match the RF component. In a specific example, the RF component uses a plastic ball grid array (PBGA) packaging structure board with a ball grid array provided thereon. The packaging substrate uses a silicon (Si)-based grounded wafer substrate with through-silicon vias (TSVs) provided thereon.

[0046] The first test point refers to a test point selected arbitrarily on the packaging substrate. Since two probes are needed to lead out the link when testing the target RF device, the number of first test points is the same as the number of probes. The first test points include two. The first test points can specifically be two arbitrarily selected through-hole position points. The test link corresponding to the first test point is called the first test path. The data obtained after testing the first test point of the packaging substrate is called substrate test data. The test may include testing RF characteristic indicators such as capacitance, inductance, and resistance. The specific test process is not limited in this embodiment.

[0047] Step S204: Acquire RF test data of the RF component mounted on the packaging substrate. The RF test data is data obtained after testing a second test point of the RF component. At least a portion of a sub-path in a second test path corresponding to the second test point overlaps with at least a portion of a sub-path in a first test path corresponding to the first test point.

[0048] The second test point refers to the test point on the RF component. Since two probes are needed to lead out the link when testing the target RF device, the number of second test points is the same as the number of probes. The second test points include two, and the second test points can be two solder ball position points. The test link corresponding to the second test point is called the second test path. The data obtained after testing the second test point of the RF component is called RF test data. The test may include testing RF characteristic indicators such as electricity, inductance, and resistance. The specific test process is not limited in this embodiment.

[0049] Due to the introduction of the packaging substrate, a fixture effect is inevitably generated during testing. Therefore, in order to effectively remove the fixture effect, when testing the second test point of the RF component, the second test point is determined based on the first test point. Specifically, the first test path corresponding to the first test point has the same path width as the test path corresponding to the second test point. At least a portion of the sub-path in the second test path corresponding to the second test point overlaps with at least a portion of the sub-path in the first test path corresponding to the first test point. The first test path also includes a first sub-path, and the second test path also includes a second sub-path parallel to the first sub-path. If the first sub-path is parallel to the second sub-path, and the path length and path width are the same, it means that the RF characteristics represented by the two paths are the same. Thus, it is convenient to perform vector subtraction processing on the test data of the two paths separately.

[0050] It is understood that in order to ensure the accuracy and consistency of the test data, the test environment parameters for testing the first test point of the package substrate and the second test point of the RF component are completely consistent. The test environment parameters specifically include humidity, temperature and other parameters.

[0051] For a specific example, see Figure 3 Taking the test of the RF characteristics between AA and C grounding as an example, since there are no solder balls or through-holes at the positions directly corresponding to the grounding of test points AA and C, it is necessary to determine the positions with solder balls or through-holes closest to the grounding of test points AA and C. The first test points of the package substrate are determined as test points B and D, and the second test points of the RF device are determined as test points A and D. At this time, the first test path corresponding to the first test point is the first sub-path B-BB, and the overlapping path C grounding-D, wherein point BB is included in the range of C grounding. The second test path corresponding to the second test point is the second sub-path A-AA, the RF characteristic path AA-C grounding, and the overlapping path C grounding-D. Among them, the first sub-path is parallel to the second sub-path and has the same width, that is, the RF characteristics of A-AA are completely consistent with the RF characteristics of B-BB. The data flow direction in the first test path is B-BB-D. The data flow direction in the second test path is A-AA-C grounding-D.

[0052] Step S206 , de-embedding the RF test data according to the substrate test data to obtain RF characteristic data of the target RF device.

[0053] De-embedding removes fixture effects to obtain accurate characteristic data. RF characteristic indicators are vectors, and de-embedding can be performed through vector subtraction. Specifically, the substrate test data and RF test data are vectors, and the vector direction corresponding to the substrate test data is the same as the vector direction corresponding to the RF test data. Therefore, vector subtraction can be performed between the RF test data and the substrate test data to obtain the RF characteristic data of the target RF device.

[0054] In one embodiment, the substrate test data includes substrate inductance test data, denoted as L1, the RF test data includes RF inductance test data, denoted as L2, and the RF characteristic data includes RF inductance characteristic data, denoted as L. Specifically, vector subtraction processing is performed on the RF inductance test data and the substrate inductance test data to obtain RF inductance characteristic data of the target RF device, i.e., L=L2-L1.

[0055] In this embodiment, when it is necessary to determine the RF inductance characteristic data, the relevant data of the substrate additionally introduced in the process of measuring the RF inductance test data can be removed by directly performing vector subtraction processing. There is no need to set up additional calibration standards for calibrating the inductance data, which effectively improves the efficiency of obtaining the RF inductance characteristic data of the target RF device. Therefore, the RF inductance characteristics of the target RF device can be directly analyzed based on the RF inductance characteristic data, thereby improving data processing efficiency.

[0056] In one embodiment, the substrate test data includes substrate capacitance test data, denoted as C1, the RF test data includes RF capacitance test data, denoted as C2, and the RF characteristic data includes RF capacitance characteristic data, denoted as C. Specifically, vector subtraction processing is performed on the RF capacitance test data and the substrate capacitance test data to obtain RF capacitance characteristic data of the target RF device, i.e., C=C2-C1.

[0057] In this embodiment, when it is necessary to determine the RF capacitance characteristic data, the relevant data of the substrate that is additionally introduced in the process of measuring the RF capacitance test data can be removed by directly performing vector subtraction processing. There is no need to set up additional calibration standards for calibrating the capacitance data, which effectively improves the efficiency of obtaining the RF capacitance characteristic data of the target RF device. Therefore, the RF capacitance characteristics of the target RF device can be directly analyzed based on the RF capacitance characteristic data, thereby improving data processing efficiency.

[0058] In one embodiment, the substrate test data includes substrate resistance test data, represented as R1, the RF test data includes RF resistance test data, represented as R2, and the RF characteristic data includes RF resistance characteristic data, represented as R. Specifically, vector subtraction processing is performed on the RF resistance test data and the substrate resistance test data to obtain RF resistance characteristic data of the target RF device, that is, R=R2-R1.

[0059] In this embodiment, when it is necessary to determine the RF resistance characteristic data, the relevant data of the substrate that is additionally introduced in the process of measuring the RF resistance test data can be removed by directly performing vector subtraction processing. There is no need to set up additional calibration standards for calibrating the resistance data, which effectively improves the efficiency of obtaining the RF resistance characteristic data of the target RF device. Therefore, the RF resistance characteristics of the target RF device can be directly analyzed based on the RF resistance characteristic data, thereby improving data processing efficiency.

[0060] It should be noted that the above embodiment is for the data processing of RF capacitance, RF inductance and RF resistance in RF characteristic indicators. In actual applications, relevant data processing can also be performed for more types of RF characteristic indicators.

[0061] For a specific example, see Figure 3Taking the RF characteristic test between AA and C grounding as an example, the RF characteristic data is the result of vector subtraction between the RF test data corresponding to the second test path and the substrate test data corresponding to the first test path. The test data corresponding to the second test path is represented as data A-AA + data AA-C grounding + data C grounding-D, and the test data corresponding to the first test path is represented as data B-BB + data BB-C grounding + data C grounding-D. After vector subtraction of the two, data AA-C grounding is obtained, that is, the RF characteristic data between test point AA and test point C grounding is obtained.

[0062] In one embodiment, after obtaining the RF characteristic data of the target RF device, the method further includes: obtaining the RF characteristic data of the target RF device within a preset time period, analyzing each RF characteristic data, and determining the stability of the RF characteristics of the target RF device. This provides guidance for subsequent practical applications of the target RF device.

[0063] In the above-mentioned data processing method for RF devices, substrate test data of the package substrate in the target RF device is obtained, the substrate test data being data obtained after testing a first test point on the package substrate; RF test data of the RF component mounted on the package substrate is obtained, the RF test data being data obtained after testing a second test point on the RF component, at least a portion of the subpath in the second test path corresponding to the second test point overlaps with at least a portion of the subpath in the first test path corresponding to the first test point; and the RF test data is de-embedded based on the substrate test data to obtain RF characteristic data of the target RF device. Using the method of the above-mentioned embodiment, there is no need to construct multiple additional calibration standards on the RF device to characterize and remove fixture effects. The fixture effects can be directly removed accurately through de-embedding processing, resulting in highly accurate RF characteristic data, and the RF characteristics of the RF device can be quickly obtained, thereby improving the data processing efficiency of the RF device.

[0064] The present application will be further described in detail below with reference to the accompanying drawings and a specific embodiment. It should be understood that the specific embodiment described herein is only used to explain the present application and is not intended to limit the present application.

[0065] In a specific embodiment, the target radio frequency device is packaged by a radio frequency component and a packaging substrate. Figure 4 , the RF component is a plastic ball grid array package structure (PBGA) board with a ball grid array set on it. Figure 5 The package substrate is a silicon (Si)-based grounded wafer substrate with through-silicon vias (TSVs) arranged thereon. The array distribution of the ball grid array corresponds to the through-silicon via layout.

[0066] exist Figure 5 In the figure, both the white outer and inner rings are ground areas. To maintain the same voltage level between the two ground areas, as many interconnects as possible are designed as ground paths. AA and BB correspond to solder balls, and the two are grounded on the ring through a central ground plate and interconnects. In this embodiment, the central ground plate is represented as C ground.

[0067] Taking the measurement of RF characteristics of AA-C grounding as an example, the two probes can touch the point closest to AA and the point on the ground ring next to A. Figure 6 Indicated as A', and the point on the ground ring that contacts B closest to BB and the point next to B, which is in Figure 6 Indicated as B'.

[0068] See also Figure 6 The first test path is B-BB-C ground-interconnect-ground loop, and the second test path is A-AA-C ground-interconnect-ground loop. Path A-AA is parallel to path B-BB and has the same length and width. Both the first and second test paths include the same overlapping path, C ground-ground loop.

[0069] Since an additional path from the silicon substrate is introduced into the measurement result of A, namely Figure 5 and Figure 6 The A-AA and C ground-ground loops in the diagram are connected. Therefore, the B-BB path, which is parallel to the A-AA path, can be de-embedded. Since the path length and width of the B-BB path are identical to those of the A-AA path, the RF characteristics of the A-AA and B-BB paths are identical. By performing vector subtraction between the two paths, the RF characteristic data for the AA-C ground path can be obtained. Therefore, the RF characteristics can be analyzed based on this RF characteristic data.

[0070] It should be understood that, although the various steps in the flowcharts involved in the various embodiments described above are displayed in sequence according to the instructions of the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a portion of the steps in the flowcharts involved in the various embodiments described above can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a portion of steps or stages in other steps.

[0071] Based on the same inventive concept, the present application also provides a data processing device for a radio frequency device for implementing the data processing method for a radio frequency device involved above. The implementation solution provided by this device is similar to the implementation solution described in the above method. Therefore, the specific limitations of the embodiments of the data processing device for one or more radio frequency devices provided below can be found in the above-mentioned limitations of the data processing method for radio frequency devices, and will not be repeated here.

[0072] In one embodiment, Figure 7 As shown, a data processing device for a radio frequency device is provided, comprising: a first acquisition module 10, a second acquisition module 20 and a data processing module 30, wherein:

[0073] The first acquisition module 10 is configured to acquire substrate test data of a package substrate in a target radio frequency device, wherein the substrate test data is data obtained after testing a first test point of the package substrate.

[0074] The second acquisition module 20 is used to obtain RF test data of the RF component installed on the packaging substrate, where the RF test data is data obtained after testing a second test point of the RF component, and at least a portion of the sub-path in the second test path corresponding to the second test point overlaps with at least a portion of the sub-path in the first test path corresponding to the first test point.

[0075] The data processing module 30 is configured to perform de-embedding processing on the RF test data according to the substrate test data to obtain RF characteristic data of the target RF device.

[0076] In one embodiment, the first test path further includes a first sub-path, and the second test path further includes a second sub-path parallel to the first sub-path.

[0077] In one embodiment, the substrate test data and the radio frequency test data are vectors, and the vector direction corresponding to the substrate test data is the same as the vector direction corresponding to the radio frequency test data.

[0078] In one embodiment, the substrate test data includes substrate inductance test data, the RF test data includes RF inductance test data, and the RF characteristic data includes RF inductance characteristic data; the data processing module 30 is used to perform vector subtraction processing on the RF inductance test data and the substrate inductance test data to obtain the RF inductance characteristic data of the target RF device.

[0079] In one embodiment, the substrate test data includes substrate capacitance test data, the RF test data includes RF capacitance test data, and the RF characteristic data includes RF capacitance characteristic data; the data processing module 30 is used to perform vector subtraction processing on the RF capacitance test data and the substrate capacitance test data to obtain the RF capacitance characteristic data of the target RF device.

[0080] In one embodiment, the substrate test data includes substrate resistance test data, the RF test data includes RF resistance test data, and the RF characteristic data includes RF resistance characteristic data; the data processing module 30 is used to perform vector subtraction processing on the RF resistance test data and the substrate resistance test data to obtain the RF resistance characteristic data of the target RF device.

[0081] Each module in the data processing device of the above-mentioned radio frequency device can be implemented in whole or in part through software, hardware, or a combination thereof. Each of the above-mentioned modules can be embedded in or independent of the processor of the electronic device in the form of hardware, or can be stored in the memory of the electronic device in the form of software, so that the processor can call and execute the corresponding operations of each of the above modules.

[0082] In one embodiment, an electronic device is provided. The electronic device may be a server, and its internal structure diagram may be as follows: Figure 8 As shown. The electronic device includes a processor, a memory and a network interface connected via a system bus. The processor of the electronic device is used to provide computing and control capabilities. The memory of the electronic device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database of the electronic device is used to store data of the radio frequency device. The network interface of the electronic device is used to communicate with an external terminal via a network connection. When the computer program is executed by the processor, a data processing method for a radio frequency device is implemented.

[0083] In one embodiment, an electronic device is provided. The electronic device may be a terminal, and its internal structure diagram may be as follows: Figure 9As shown. The electronic device includes a processor, a memory, a communication interface, a display screen and an input device connected via a system bus. The processor of the electronic device is used to provide computing and control capabilities. The memory of the electronic device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The communication interface of the electronic device is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be achieved through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. When the computer program is executed by the processor, a data processing method for a radio frequency device is implemented. The display screen of the electronic device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the electronic device can be a touch layer covering the display screen, or a button, trackball or touchpad provided on the housing of the electronic device, or an external keyboard or mouse.

[0084] Those skilled in the art will understand that Figure 8 and Figure 9 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the electronic device to which the solution of the present application is applied. The specific electronic device may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0085] In one embodiment, an electronic device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the following steps are implemented:

[0086] Acquire substrate test data of a package substrate in a target radio frequency device, wherein the substrate test data is data obtained after testing a first test point of the package substrate;

[0087] Obtaining radio frequency test data of a radio frequency component mounted on the packaging substrate, the radio frequency test data being data obtained after testing a second test point of the radio frequency component, wherein at least a portion of a subpath in a second test path corresponding to the second test point overlaps with at least a portion of a subpath in a first test path corresponding to the first test point;

[0088] De-embedding is performed on the radio frequency test data according to the substrate test data to obtain radio frequency characteristic data of the target radio frequency device.

[0089] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0090] Acquire substrate test data of a package substrate in a target radio frequency device, wherein the substrate test data is data obtained after testing a first test point of the package substrate;

[0091] Obtaining radio frequency test data of a radio frequency component mounted on the packaging substrate, the radio frequency test data being data obtained after testing a second test point of the radio frequency component, wherein at least a portion of a subpath in a second test path corresponding to the second test point overlaps with at least a portion of a subpath in a first test path corresponding to the first test point;

[0092] De-embedding is performed on the radio frequency test data according to the substrate test data to obtain radio frequency characteristic data of the target radio frequency device.

[0093] In one embodiment, a computer program product is provided, comprising a computer program, which, when executed by a processor, implements the following steps:

[0094] Acquire substrate test data of a package substrate in a target radio frequency device, wherein the substrate test data is data obtained after testing a first test point of the package substrate;

[0095] Obtaining radio frequency test data of a radio frequency component mounted on the packaging substrate, the radio frequency test data being data obtained after testing a second test point of the radio frequency component, wherein at least a portion of a subpath in a second test path corresponding to the second test point overlaps with at least a portion of a subpath in a first test path corresponding to the first test point;

[0096] De-embedding is performed on the radio frequency test data according to the substrate test data to obtain radio frequency characteristic data of the target radio frequency device.

[0097] Those skilled in the art will appreciate that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, database or other media used in the embodiments provided in this application may include at least one of non-volatile and volatile memory. Non-volatile memory may include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory may include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM). The database involved in the various embodiments provided herein may include at least one of a relational database and a non-relational database. Non-relational databases may include, but are not limited to, distributed databases based on blockchains. The processor involved in the various embodiments provided herein may be, but are not limited to, a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic unit, a data processing logic unit based on quantum computing, and the like.

[0098] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0099] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A data processing method for a radio frequency device, characterized in that: The method comprises: Acquire substrate test data of a package substrate in a target radio frequency device, wherein the substrate test data is data obtained after testing a first test point of the package substrate; Obtaining radio frequency test data of a radio frequency component mounted on the packaging substrate, the radio frequency test data being data obtained after testing a second test point of the radio frequency component, wherein at least a portion of a subpath in a second test path corresponding to the second test point overlaps with at least a portion of a subpath in a first test path corresponding to the first test point; Performing vector subtraction processing on the radio frequency test data and the substrate test data to obtain radio frequency characteristic data of the target radio frequency device.

2. The method according to claim 1, characterized in that The first test path further includes a first sub-path, and the second test path further includes a second sub-path parallel to the first sub-path.

3. The method according to claim 1, characterized in that The substrate test data and the radio frequency test data are vectors, and the vector direction corresponding to the substrate test data is the same as the vector direction corresponding to the radio frequency test data.

4. The method according to claim 1, wherein The substrate test data includes substrate inductance test data, the radio frequency test data includes radio frequency inductance test data, and the radio frequency characteristic data includes radio frequency inductance characteristic data; The performing vector subtraction processing on the RF test data and the substrate test data to obtain RF characteristic data of the target RF device includes: Performing vector subtraction processing on the radio frequency inductance test data and the substrate inductance test data to obtain radio frequency inductance characteristic data of the target radio frequency device.

5. The method according to claim 1, wherein The substrate test data includes substrate capacitance test data, the radio frequency test data includes radio frequency capacitance test data, and the radio frequency characteristic data includes radio frequency capacitance characteristic data; The performing vector subtraction processing on the RF test data and the substrate test data to obtain RF characteristic data of the target RF device includes: Performing vector subtraction processing on the radio frequency capacitance test data and the substrate capacitance test data to obtain radio frequency capacitance characteristic data of the target radio frequency device.

6. The method according to claim 1, characterized in that The substrate test data includes substrate resistance test data, the radio frequency test data includes radio frequency resistance test data, and the radio frequency characteristic data includes radio frequency resistance characteristic data; The performing vector subtraction processing on the RF test data and the substrate test data to obtain RF characteristic data of the target RF device includes: Performing vector subtraction processing on the radio frequency resistance test data and the substrate resistance test data to obtain radio frequency resistance characteristic data of the target radio frequency device.

7. A data processing device for a radio frequency device, characterized in that: The device comprises: A first acquisition module is configured to acquire substrate test data of a package substrate in a target radio frequency device, wherein the substrate test data is data obtained after testing a first test point of the package substrate; a second acquisition module, configured to acquire radio frequency test data of a radio frequency component mounted on the packaging substrate, the radio frequency test data being data obtained after testing a second test point of the radio frequency component, wherein at least a portion of a subpath in a second test path corresponding to the second test point overlaps with at least a portion of a subpath in a first test path corresponding to the first test point; The data processing module is used to perform vector subtraction processing on the radio frequency test data and the substrate test data to obtain radio frequency characteristic data of the target radio frequency device.

8. An electronic device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 6 are implemented.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

10. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 6 are implemented.

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