Antenna structure, electronic device, and method of manufacturing antenna structure

Abstract

This application provides an antenna structure, an electronic device, and a method for fabricating the antenna structure. The antenna structure includes a substrate and a coil layer. The substrate includes a first through-hole extending through the antenna structure along its thickness direction. The coil layer is disposed on the substrate and includes a coil body and a first pad portion and a second pad portion disposed on both sides of the coil body along its thickness direction. The first pad portion and the second pad portion are electrically connected to the coil body, and the first pad portion is located within the first through-hole. The antenna structure in this application embodiment can achieve double-sided soldering to structures such as a motherboard based on a single-layer coil, improving connection reliability without increasing additional costs and making it suitable for mass production.

Description

Technical Field

[0001] This application relates to the field of wireless communication technology, and in particular to an antenna structure, an electronic device, and a method for fabricating the antenna structure. Background Technology

[0002] With the development of mobile communication technology, mobile devices have become increasingly common in recent years, such as laptops, mobile phones, multimedia players, and other portable electronic devices with multiple functions. To meet people's needs, mobile devices usually have wireless communication capabilities.

[0003] The existing antenna structure is not firmly soldered to the motherboard, which can easily affect the normal use of the antenna structure. Summary of the Invention

[0004] This application provides an antenna structure, an electronic device, and a method for fabricating the antenna structure, which can improve the reliability of the connection with the motherboard.

[0005] In a first aspect, embodiments of this application provide an antenna structure, including a substrate and a coil layer. The substrate includes a first through-hole extending through the antenna structure along its thickness direction. The coil layer is disposed on the substrate and includes a coil body and a first pad portion and a second pad portion disposed on both sides of the coil body along its thickness direction. The first pad portion and the second pad portion are electrically connected to the coil body, and the first pad portion is located within the first through-hole.

[0006] In some embodiments, the antenna structure further includes an insulating layer disposed on the side of the coil layer away from the substrate, the insulating layer including a second through hole disposed through the thickness direction, and a second pad portion located within the second through hole.

[0007] In some embodiments, the number of first pad portions and second pad portions is multiple.

[0008] In some embodiments, the first pad portion and the second pad portion at least partially overlap in their orthographic projections onto the coil body.

[0009] In some embodiments, the coil body includes a third through hole formed along the thickness direction and a connecting portion located within the third through hole, the connecting portion being electrically connected to a first pad portion and a second pad portion.

[0010] In some embodiments, the first through hole and the second through hole are projected onto the coil body and cover the third through hole.

[0011] In some embodiments, the central axis of the first through hole, the central axis of the second through hole, and the central axis of the third through hole coincide.

[0012] In some embodiments, the coil body includes a body portion, and a first end portion and a second end portion located at both ends of the body portion, wherein the first end portion and the second end portion are respectively connected to at least one of the first pad portion and the second pad portion.

[0013] In some embodiments, both the first end and the second end are connected to the first pad portion and the second pad portion.

[0014] In some embodiments, the first through hole and the second through hole are projected onto the coil body within the outer contour of the first end and / or the second end.

[0015] In some embodiments, both the first end and the second end are provided with a third through hole.

[0016] In some embodiments, the antenna structure further includes a shielding layer disposed on the side of the substrate away from the coil layer, the shielding layer including a fourth through hole disposed through the thickness direction, the first through hole being connected to the fourth through hole.

[0017] In some embodiments, the orthographic projection of the fourth through hole onto the substrate coincides with that of the first through hole.

[0018] Secondly, embodiments of this application provide an electronic device including the antenna structure of any of the foregoing embodiments.

[0019] Thirdly, embodiments of this application provide a method for fabricating an antenna structure, including:

[0020] A coil body is formed on one side of the substrate, and a first through hole is provided on the substrate, which penetrates the substrate along the thickness direction of the antenna structure.

[0021] A first pad portion is formed in the first through hole, and a second pad portion is formed on the side of the coil body away from the substrate. The first pad portion and the second pad portion are electrically connected to the coil body.

[0022] In some embodiments, before forming a first pad portion within a first through-hole and forming a second pad portion on the side of the coil body away from the substrate, the method further includes:

[0023] An insulating layer is formed on the side of the coil body away from the substrate, and a second through hole is provided on the insulating layer along the thickness direction; a third through hole is formed on the coil body, and the third through hole penetrates the coil body along the thickness direction, and the first through hole and the second through hole are connected through the third through hole.

[0024] A first pad portion is formed within the first through-hole, and a second pad portion is formed on the side of the coil body away from the substrate, including:

[0025] Liquid pad material is filled into the first through hole, and at least a portion of the liquid pad material flows into the second through hole through the third through hole;

[0026] Liquid pad material is solidified to form a first pad portion located in a first through hole, a second pad portion located in a second through hole, and a connecting portion located in a third through hole, with the connecting portion connecting the first pad portion and the second pad portion.

[0027] This application provides an antenna structure, an electronic device, and a method for fabricating the antenna structure. The antenna structure can achieve double-sided welding with structures such as a motherboard based on a single-layer coil, improving connection reliability without increasing additional costs and making it suitable for mass production. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of an antenna structure provided in an embodiment of this application;

[0030] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of AA;

[0031] Figure 3 This is a schematic diagram of another antenna structure provided in the embodiments of this application;

[0032] Figure 4 yes Figure 3 Schematic diagram of the cross-sectional structure of BB;

[0033] Figure 5 This is a cross-sectional structural schematic diagram of another antenna structure provided in the embodiments of this application;

[0034] Figure 6 This is a cross-sectional structural schematic diagram of another antenna structure provided in the embodiments of this application;

[0035] Figure 7 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0036] Figure 8 This is a flowchart of a method for fabricating an antenna structure according to an embodiment of this application;

[0037] Figures 9a-9b This is a schematic diagram illustrating the process of fabricating an antenna structure according to an embodiment of this application;

[0038] Figure 10 This is a flowchart illustrating another method for fabricating an antenna structure provided in this application embodiment;

[0039] Figures 11a-11d This is a schematic diagram illustrating the process of another method for fabricating an antenna structure provided in this application embodiment;

[0040] Figure 12 This is a flowchart of another method for fabricating an antenna structure provided in the embodiments of this application.

[0041] Marker explanation:

[0042] 1. Substrate; 11. First through hole;

[0043] 2. Coil layer; 21. Coil body; 211. Body portion; 212. First end; 213. Second end; 214. Third through hole; 22. First pad portion; 23. Second pad portion; 24. Connecting portion;

[0044] 3. First adhesive layer

[0045] 4. Insulating layer; 41. Second through hole;

[0046] 5. Shielding layer; 51. Fourth through hole;

[0047] 6. Second adhesive layer;

[0048] X, thickness direction. Detailed Implementation

[0049] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0050] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0051] Antenna structures are used in electronic devices and need to be soldered integrally with motherboards and other structures. Current antenna structures typically employ two approaches. One approach involves a single-layer coil, with the motherboard fixing one surface of the coil. This method is less expensive, but the soldering between the coil and the motherboard is not very strong. The other approach involves placing a double-layer coil on both sides of the substrate. The double-layer coil can be soldered to the motherboard on both sides, but this method is more expensive and not conducive to large-scale manufacturing.

[0052] To solve the above problems, on the one hand, please refer to... Figure 1 and Figure 2 This application provides an antenna structure including a substrate 1 and a coil layer 2. The substrate 1 includes a first through-hole 11 extending along the thickness direction X of the antenna structure, and the coil layer 2 is disposed on one side of the substrate 1. The coil layer 2 includes a coil body 21 and a first pad portion 22 and a second pad portion 23 disposed on both sides of the coil body 21 along the thickness direction X. The first pad portion 22 and the second pad portion 23 are electrically connected to the coil body 21, and the first pad portion 22 is located within the first through-hole 11.

[0053] The coil layer 2 is disposed on the substrate 1, which supports the coil body 21 in the coil layer 2. The substrate 1 can be made of an insulating material to insulate the coil body 21 from other film structures. Optionally, a first adhesive layer 3 is disposed between the substrate 1 and the coil body 21 to fix the position of the coil body 21 to the substrate 1.

[0054] The coil layer 2 includes a coil body 21, a first pad portion 22 and a second pad portion 23. The coil body 21 is disposed on one side of the substrate 1 along the thickness direction X. The coil body 21 may include copper or other metal materials and is wound to form a ring structure to serve as an antenna.

[0055] The first pad portion 22 and the second pad portion 23 are disposed on both sides of the coil body 21 along the thickness direction X, and both can be connected to a motherboard or other structure. The orthographic projections of the first pad portion 22 and the second pad portion 23 on the coil body 21 can overlap or be staggered, and this embodiment does not limit this.

[0056] The substrate 1 includes a first through-hole 11 extending along the thickness direction X. A first solder pad 22 is located within the first through-hole 11. The first through-hole 11 accommodates the first solder pad 22, and the through-hole 11 allows the first solder pad 22 to communicate with the outside, thus enabling soldering and fixing the motherboard to the first solder pad 22. Compared to traditional single-layer coil antenna structures, the antenna structure in this embodiment can achieve double-sided soldering to the motherboard, thereby improving connection reliability. Compared to traditional double-layer coil antenna structures, the antenna structure in this embodiment only requires a single-layer coil structure, thus reducing production costs.

[0057] The antenna structure provided in this application embodiment can achieve double-sided welding with the motherboard and other structures on the basis of a single-layer coil, thereby improving connection reliability without increasing additional costs and making it suitable for mass production.

[0058] It should be noted that the antenna structure provided in this application embodiment can be applied to NFC (Near Field Communication) technology, wireless charging technology, and other related fields, and this application embodiment does not impose any limitations on it. NFC is a contactless identification and interconnection technology that enables data exchange when devices are close to each other. For example, by integrating inductive card readers, inductive cards, and peer-to-peer communication functions on a single chip, mobile terminals can be used to realize applications such as mobile payment, electronic ticketing, access control, mobile identity recognition, and anti-counterfeiting.

[0059] Wireless charging is a power supply technology that charges the battery of a device wirelessly. Therefore, wireless charging technology enables energy transfer between the charger and the device via a magnetic field, eliminating exposed conductive contacts on both sides and thus providing a high level of safety.

[0060] In some embodiments, please refer to Figure 3 and Figure 4 The antenna structure also includes an insulating layer 4 disposed on the side of the coil layer 2 opposite to the substrate 1. The insulating layer 4 includes a second through-hole 41 extending along the thickness direction X, and the second pad portion 23 is located within the second through-hole 41. Figure 3 In the diagram, the structure of the coil body 21 is represented by dashed lines.

[0061] The insulating layer 4 is located on the side of the coil layer 2 facing away from the substrate 1. The insulating layer 4 is mainly used to insulate the coil body 21 from the external structure to avoid problems such as short circuits. The insulating layer 4 can be made of the same insulating material as the substrate 1 or a different insulating material than the substrate 1. This application embodiment does not limit this.

[0062] The insulating layer 4 includes a second through hole 41 that extends through the thickness direction X. The second through hole 41 has a similar function to the first through hole 11, which is used to set the second pad portion 23. At the same time, the motherboard and the second pad portion 23 can be soldered and fixed in the second through hole 41.

[0063] In this embodiment, a base 1 and an insulating layer 4 are respectively provided on both sides of the coil body 21. The base 1 and the insulating layer 4 together insulate the coil body 21 from the external structure, preventing the coil body 21 from contacting other structures and improving the reliability of the antenna structure.

[0064] In some embodiments, the number of first pad portions 22 and second pad portions 23 is multiple.

[0065] In this embodiment, the first pad portion 22 and the second pad portion 23 are disposed on both sides of the coil body 21 along the thickness direction X, and both can be connected to the motherboard or other structures. Based on this, the number of the first pad portion 22 and the second pad portion 23 can be set to multiple, thereby improving the connection strength between the antenna structure and the motherboard or other structures, and improving reliability.

[0066] In some embodiments, such as Figure 4 As shown, the first pad portion 22 and the second pad portion 23 at least partially overlap in their orthographic projections onto the coil body 21.

[0067] The position of the first pad portion 22 corresponds to the position of the first through-hole 11, and the position of the second pad portion 23 corresponds to the position of the second through-hole 41. Therefore, the orthographic projections of the first pad portion 22 and the second pad portion 23 on the coil body 21 at least partially overlap, that is, the orthographic projections of the first through-hole 11 and the second through-hole 41 on the coil body 21 at least partially overlap. Optionally, the orthographic projection of the first through-hole 11 on the coil body 21 is located within the orthographic projection of the second through-hole 41 on the coil body 21. This structure allows the substrate 1 and the insulating layer 4 to be set to the same structure during antenna fabrication, thereby simplifying the process flow.

[0068] In this embodiment, the first pad portion 22, the second pad portion 23, the first through hole 11 and the second through hole 41 are circular. In other embodiments of this application, they can be triangular, quadrilateral, polygonal or other shapes.

[0069] In some embodiments, please refer to Figure 5 The coil body 21 includes a third through hole 214 formed along the thickness direction X and a connecting portion 24 located in the third through hole 214. The connecting portion 24 is electrically connected to the first pad portion 22 and the second pad portion 23.

[0070] The third through hole 214 penetrates the coil body 21, and the connecting part 24 is located inside the third through hole 214. The connecting part 24 is used to connect the first pad part 22 and the second pad part 23. The material of the connecting part 24 can be the same as that of the first pad part 22 and the second pad part 23, that is, the first pad part 22, the second pad part 23 and the connecting part 24 are all made of the same material.

[0071] This design simplifies the fabrication process of the first pad portion 22 and the second pad portion 23. Specifically, liquid pad material can be filled only in the first through-hole 11. The liquid pad material can pass through the third through-hole 214 and reach the second through-hole 41 under gravity. Then, the liquid pad material solidifies and forms the first pad portion 22 located in the first through-hole 11, the second pad portion 23 located in the second through-hole 41, and the connecting portion 24 located in the third through-hole 214, respectively. Similarly, liquid pad material can also be filled only in the second through-hole 41, which will not be described in detail in this embodiment.

[0072] In summary, by providing a third through hole 214 on the coil body 21, the first pad portion 22 and the second pad portion 23 can be fabricated simply by forming liquid pad material within the first through hole 11 or the second through hole 41 during the fabrication process. This simplifies the fabrication process and improves production efficiency.

[0073] In some embodiments, such as Figure 5 As shown, the first through hole 11 and the second through hole 41 are projected onto the coil body 21 and cover the third through hole 214.

[0074] In this embodiment, the dimensions of the first through hole 11 and the second through hole 41 are larger than that of the third through hole 214, which avoids material waste due to excessively large dimensions of the connecting portion 24. Optionally, the central axis of the first through hole 11 and the central axis of the second through hole 41 coincide with the central axis of the third through hole 214. This allows liquid pad material to flow more easily from the first through hole 11 or the second through hole 41 into the third through hole 214.

[0075] In some embodiments, such as Figure 3 and Figure 4 As shown, the coil body 21 includes a body portion 211 wound up, and a first end portion 212 and a second end portion 213 located at both ends of the extension direction of the body portion 211. The first end portion 212 and the second end portion 213 are respectively connected to at least one of the first pad portion 22 and the second pad portion 23.

[0076] The coil body 21 includes a body portion 211, a first end portion 212, and a second end portion 213, which can be an integral structure. In this embodiment, the body portion 211 is wound into a spiral shape, and the first end portion 212 and the second end portion 213 are located at the two ends of the body portion 211, wherein the first end portion 212 is positioned closer to the winding center than the second end portion 213.

[0077] The first end 212 and the second end 213 are respectively connected to at least one of the first pad portion 22 and the second pad portion 23. Specifically, the first end 212 may be connected only to the first pad portion 22, or only to the second pad portion 23, or the first end 212 may be connected to both the first pad portion 22 and the second pad portion 23 simultaneously. This application embodiment does not impose any limitations on this. Meanwhile, the structure of the second end 213 is similar to the structure of the first end 212, and will not be described again in this application embodiment.

[0078] In some embodiments, both the first end portion 212 and the second end portion 213 are connected to the first pad portion 22 and the second pad portion 23. The first end portion 212 is connected to the first pad portion 22 and the second pad portion 23 in the thickness direction X, and the second end portion 213 is connected to the first pad portion 22 and the second pad portion 23 in the thickness direction X. The present application embodiments feature a design that provides multiple first pad portions 22 and second pad portions 23, which can further improve the reliability of soldering between the antenna structure and the motherboard, as well as the reliability of signal transmission.

[0079] In some embodiments, the first through hole 11 and the second through hole 41 are projected onto the coil body 21 within the outer contour of the first end 212 and / or the second end 213.

[0080] The first through-hole 11 and the second through-hole 41 are used to form the first pad portion 22 and the second pad portion 23, respectively. The cross-sectional dimensions of the first through-hole 11 and the second through-hole 41 often determine the dimensions of the first pad portion 22 and the second pad portion 23. If the projected dimensions of the first through-hole 11 and the second through-hole 41 on the coil body 21 are set to be larger than the dimensions of the first end portion 212 or the second end portion 213, then during the preparation of the first pad portion 22 and the second pad portion 23, liquid pad material may flow through the first through-hole 11 and the second through-hole 41 to areas on the coil body 21 other than the first end portion 212 and the second end portion 213, which may easily lead to risks such as short circuits.

[0081] In some embodiments, both the first end and the second end are provided with a third through hole.

[0082] In this embodiment, the first through hole 11 and the second through hole 41 are projected onto the coil body 21 within the outer contour of the first end 212 and / or the second end 213, so that the first pad portion 22 and the second pad portion 23 are located on the first end 212 and / or the second end 213, reducing the risk of short circuits and other problems.

[0083] In some embodiments, please refer to Figure 3 and Figure 6 The antenna structure also includes a shielding layer 5 disposed on the side of the substrate 1 away from the coil layer 2. The shielding layer 5 includes a fourth through hole 51 disposed through the thickness direction X, and the first through hole 11 is connected to the fourth through hole 51.

[0084] A shielding layer 5 is located on one side of the coil layer 2. The shielding layer 5 can shield the magnetic field generated by the coil layer 2 and focus it in the desired direction. For this purpose, the shielding layer 5 can be made of a magnetic material. Exemplarily, the shielding layer 5 includes materials such as ferrite or permalloy. Optionally, a second adhesive layer 6 is provided between the shielding layer 5 and the substrate.

[0085] In this embodiment, the shielding layer 5 includes a fourth through hole 51, which communicates with the first through hole 11. The motherboard and the first solder pad portion 22 can be soldered and fixed within the first through hole 11 and the fourth through hole 51.

[0086] In some embodiments, such as Figure 6 As shown, the orthographic projection of the fourth through hole 51 onto the substrate 1 coincides with the first through hole 11.

[0087] This design allows for the mutual positioning of the shielding layer 5 and the substrate 1 by aligning the first through hole 11 and the fourth through hole 51 after the shielding layer 5 is formed, ensuring the accurate position of the shielding layer 5.

[0088] Secondly, please refer to Figure 7 This application provides an electronic device including an antenna structure of any of the foregoing embodiments.

[0089] The electronic devices provided in this application include, but are not limited to, mobile phones and tablets. The electronic devices provided in this application have the beneficial effects of the antenna structure provided in this application. For details, please refer to the specific descriptions of the antenna structure in the above embodiments. This embodiment will not repeat them here.

[0090] Thirdly, please refer to Figure 8 and Figure 9a , Figure 9b This application provides a method for fabricating an antenna structure, including:

[0091] S100: A coil body is formed on one side of the substrate, and a first through hole is provided on the substrate along the thickness direction of the antenna structure.

[0092] Please see Figure 9a In step S100, the substrate 1 is used to support the coil body 21. The substrate 1 can be made of insulating material, thereby isolating the coil body 21 from other film structures. Optionally, a first adhesive layer 3 is provided between the substrate 1 and the coil body 21, which is used to fix the position between the coil body 21 and the substrate 1.

[0093] The coil body 21 is formed on one side of the substrate 1 along the thickness direction X. The coil body 21 may include copper or other metal materials and is wound to form a ring or thread structure, thereby serving as an antenna.

[0094] The first through-hole 11 penetrates the substrate 1 and the first adhesive layer 3 along the thickness direction X. The size of the first through-hole 11 needs to be determined according to the size of the first pad portion 22 formed subsequently, and this embodiment does not limit this. It should be noted that the coil body 21 is formed by patterning a metal material such as copper foil through exposure etching. This embodiment does not limit the formation order of the coil body 21 and the substrate 1. Exemplarily, the substrate 21 is first attached to the copper foil material, and the substrate 21 is removed to form the first through-hole 11. Then, the copper foil material is exposed and etched to form the coil body 21. The coil body 21 includes a body portion and a first end portion and a second end portion located at both ends of the body portion.

[0095] S110: A first pad portion is formed in the first through hole, and a second pad portion is formed on the side of the coil body away from the substrate.

[0096] Please see Figure 9b In step S110, the first solder pad 22 and the second solder pad 23 are disposed on both sides of the coil body 21 along the thickness direction X. Both the first solder pad 22 and the second solder pad 23 are electrically connected to the coil body 21. The first solder pad 22, the second solder pad 23, and the coil body 21 together form the coil layer 2 in the antenna structure. Simultaneously, the first solder pad 22 is disposed within the first through hole 11, thus allowing the first solder pad 22 and the motherboard to be soldered and fixed within the first through hole 11. The placement of the first solder pad 22 and the second solder pad 23 enables the antenna structure formed in this embodiment to achieve double-sided soldering to structures such as the motherboard, based on a single-layer coil. This improves connection reliability without increasing cost.

[0097] In some embodiments, please refer to Figure 10 and Figures 11a to 11d Before step S110, the method further includes:

[0098] S120: An insulating layer is formed on the side of the coil body away from the substrate, and a second through hole is provided on the insulating layer along the thickness direction.

[0099] Please see Figure 11b In step S120, the insulating layer 4 is located on the side of the coil body 21 facing away from the substrate 1. The insulating layer 4 is mainly used to insulate the coil body 21 from the external structure to avoid problems such as short circuits. The insulating layer 4 can be made of the same insulating material as the substrate 1 or a different insulating material than the substrate 1. This application embodiment does not limit this.

[0100] The insulating layer 4 includes a second through hole 41 that extends along the thickness direction X. The second through hole 41 has a similar function to the first through hole 11, which is used to set the second pad portion. At the same time, the motherboard and the second pad portion can be soldered and fixed in the second through hole 41. This will not be described in detail in the embodiments of this application.

[0101] It should be noted that the order in which the first through hole 11 and the second through hole 41 are formed is not limited in the embodiments of this application. Exemplarily, the first through hole 11 and the second through hole 41 can be formed after the substrate 1, the insulating layer 4, and the coil body 21 have been attached, and then the substrate 1 and the insulating layer 4 are removed respectively. Alternatively, the first through hole 11 and the second through hole 41 can be formed immediately after the substrate 1 and the insulating layer 4 have been prepared.

[0102] S130: A third through hole is formed in the coil body, and the third through hole penetrates the coil body along the thickness direction.

[0103] Please see Figure 11c In step S130, the third through hole 214 connects the first through hole 11 and the second through hole 41. The order in which the first through hole 11, the second through hole 41, and the third through hole 214 are formed is not limited in this embodiment. That is, the third through hole 214 can be formed before, after, or between the first through hole 11 and the second through hole 41.

[0104] For example, the third through hole 214 is located on the first end and the second end of the coil body 21, while the first through hole 11 and the second through hole 41 are both located on both sides of the first end and the second end along the thickness direction, that is, the first pad portion and the second pad portion are provided on both sides of the first end and the second end along the thickness direction.

[0105] Please see Figure 12 In step S110, the following is included:

[0106] S111: Liquid pad material is filled in the first through hole, and at least a portion of the liquid pad material flows into the second through hole through the third through hole.

[0107] In step S111, since the first pad portion and the second pad portion have the same function, they can both be made of the same liquid pad material. Furthermore, due to the presence of the third through-hole, the liquid pad material only needs to be filled into the first through-hole for it to flow into the second through-hole.

[0108] S112: The liquid pad material is solidified to form a first pad portion located in a first through hole, a second pad portion located in a second through hole, and a connecting portion located in a third through hole, and the connecting portion connects the first pad portion and the second pad portion.

[0109] In step S112, the solidified liquid pad material forms a first pad portion in the first through hole, a second pad portion in the second through hole, and a connecting portion in the third through hole. The connecting portion is used to connect the first pad portion and the second pad portion.

[0110] This embodiment of the application only requires the application of liquid solder pad material on one side of the coil body to form the first solder pad portion and the second solder pad portion located on both sides of the coil body, thereby achieving double-sided soldering of the antenna structure. This design can further simplify the manufacturing process, thereby improving production efficiency.

[0111] In some embodiments, please refer to Figure 6 The preparation method further includes: forming a shielding layer 5 on the side of the substrate 1 away from the coil body 21, and providing a fourth through hole 51 that penetrates along the thickness direction X on the shielding layer 5.

[0112] The shielding layer 5 can be formed before or after step S110, and this application embodiment does not impose any limitation. Exemplarily, the shielding layer 5 is formed after the substrate 1, and the first through hole 11 and the fourth through hole 51 are formed simultaneously by excavation.

[0113] While the embodiments disclosed in this application are as described above, the content is merely for the purpose of facilitating understanding of this application and is not intended to limit the invention. Any person skilled in the art to which this application pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed in this application; however, the scope of protection of this application shall still be determined by the scope defined in the appended claims.

[0114] The above description is merely a specific embodiment of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, substitutions for other connection methods described above can be made by referring to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application.

Claims

1. An antenna structure, characterized by The antenna structure comprises: a substrate comprising a first through hole extending through the substrate along a thickness direction of the antenna structure; a coil layer disposed on the substrate, the coil layer comprising a coil body and first and second pad portions disposed on both sides of the coil body along the thickness direction, the first and second pad portions being electrically connected to the coil body, and the first pad portion being located in the first through hole; the antenna structure further comprises a shielding layer disposed on a side of the substrate away from the coil layer, the shielding layer comprising a fourth through hole extending through the shielding layer along the thickness direction, and the first through hole being in communication with the fourth through hole.

2. The antenna structure of claim 1, wherein, The antenna structure further comprises an insulating layer disposed on a side of the coil layer away from the substrate, the insulating layer comprising a second through hole extending through the insulating layer along the thickness direction, and the second pad portion being located in the second through hole.

3. The antenna structure of claim 2, wherein, The number of the first and second pad portions is plural.

4. The antenna structure of claim 3, wherein, The first and second pad portions at least partially overlap in a projection of the coil body.

5. The antenna structure of claim 2, wherein, The coil body comprises a third through hole extending through the coil body along the thickness direction and a connecting portion located in the third through hole, and the connecting portion being electrically connected to the first and second pad portions.

6. The antenna structure of claim 5, wherein, The first and second through holes cover the third through hole in the projection of the coil body.

7. The antenna structure of claim 6, wherein, The central axes of the first and second through holes and the third through hole coincide.

8. The antenna structure of claim 5, wherein, The coil body comprises a body portion and first and second end portions located at both ends of the body portion, and the first and second end portions being connected to at least one of the first and second pad portions, respectively.

9. The antenna structure of claim 8, wherein, The first and second end portions are both connected to the first and second pad portions.

10. The antenna structure of claim 8, wherein, The first and second through holes are located within the outer contour of the first and / or second end portions in the projection of the coil body.

11. The antenna structure of claim 10, wherein, The first and second end portions are both provided with the third through hole.

12. The antenna structure of claim 1, wherein, The fourth through hole coincides with the first through hole in the projection of the substrate.

13. An electronic device, comprising: The antenna structure comprises any one of claims 1 to 12.

14. A method of manufacturing an antenna structure, characterized by The antenna structure comprises: forming a coil body on a side of a substrate, the substrate being provided with a first through hole extending through the substrate along a thickness direction of the antenna structure; forming a first pad portion in the first through hole and a second pad portion on a side of the coil body away from the substrate, the first and second pad portions being electrically connected to the coil body; the antenna structure further comprises a shielding layer disposed on a side of the substrate away from the coil body, the shielding layer comprising a fourth through hole extending through the shielding layer along the thickness direction, and the first through hole being in communication with the fourth through hole.

15. The method of claim 14, wherein, Before forming the first pad portion in the first through hole and the second pad portion on the side of the coil body away from the substrate, the method further comprises: forming an insulating layer on the side of the coil body away from the substrate, the insulating layer being provided with a second through hole extending through the insulating layer along the thickness direction; A third through-hole is formed in the coil body, the third through-hole penetrating the coil body in the thickness direction, and the first through-hole and the second through-hole communicate through the third through-hole; The first pad portion formed in the first through-hole and the second pad portion formed on the side of the coil body facing away from the substrate include: The liquid pad material is filled in the first through-hole, and at least part of the liquid pad material flows into the second through-hole through the third through-hole; The liquid pad material is solidified to form the first pad portion in the first through-hole, the second pad portion in the second through-hole, and a connecting portion in the third through-hole, and the connecting portion connects the first pad portion and the second pad portion.

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