Transparent display device and manufacturing method thereof

Abstract

Transparent display device and manufacturing method thereof. A transparent display device, comprising: a transparent panel including pixels configured to generate an image; at least one flexible substrate bent backward, each of the flexible substrates having one end electrically connected to a pad area of ​​the transparent panel, each of the flexible substrates including at least one integrated circuit (IC) chip configured to apply a signal to a gate of a transistor in the pixel; a back cover located at the back side of the transparent panel; at least one thin film housing; a light shielding plate located between the transparent panel and the back cover, wherein one side of the thin film housing is disposed in the pad area of ​​the transparent panel to contact one side of the flexible substrate connected to the pad area, and the other side of the thin film housing is disposed on the back surface of the back cover to contact the other side of the flexible substrate disposed on the back surface of the back cover.

Description

[0001] This application is a divisional application of the invention patent application with application number 201511023165.1 (the application date is December 31, 2015, and the invention name is "back cover and transparent display device including the back cover"). Technical Field

[0002] The invention relates to a back cover and a transparent display device comprising the back cover. Background Art

[0003] The display device is applied to various electronic devices such as a portable phone, a tablet personal computer (PC), a notebook PC, a monitor, etc. Examples of the display device include a liquid crystal display (LCD) device, an organic light emitting display device, and the like.

[0004] Among such display devices, LCD devices are currently being most widely commercialized because they are easy to manufacture due to the development of manufacturing technology and achieve driving performance of drivers and high-quality images. Among such display devices, organic light emitting display devices have fast response time and low power consumption, and thus attract much attention as next-generation FPD devices.

[0005] Recently, for the purpose of satisfying the needs of users who like various functions and various designs, transparent display devices for transmitting light are being developed.

[0006] Figure 1 2 is an example diagram showing the front side of a transparent display device applied to the prior art. Figure 1 As shown, a gate driver chip-on film 31 equipped with a gate driver chip 32 is attached to at least one of the left and right sides of the front of a transparent panel 10 applied to a transparent display device of the prior art, and the gate driver chip 32 performs the function of a gate driver. In particular, the gate driver chip-on film 31 is attached to the pad portion 20 of the lower substrate configuring the transparent panel 10. One or more gate driver chip-on films 31 may be provided.

[0007] A data driver chip on film 41 equipped with a data driver chip 42 that performs a function of a data driver is attached to a lower end of the front side of the transparent panel 10 , and the data driver chip on film 41 is attached to a printed circuit board (PCB) 50 .

[0008] The active region of the transparent panel 10 applied to the related art transparent display device is transparent. If the gate driver COF 31 is bonded and attached to the rear surface of the transparent panel 10, the gate driver COF 31 may be disposed in the active region.

[0009] Therefore, in the transparent display device of the prior art, when the driver flip chip film 31 is selected, Figure 1 When arranged as shown, the gate driver COF 31 is installed in a closed space such as a housing. Therefore, in the prior art transparent display device, the size of the frame increases due to the size of the width of the gate driver COF 31.

[0010] For example, the size X of the frame on each of the left and right sides of the conventional transparent display device corresponds to the sum of the width A of the pad portion 20 and the width B of a portion of the gate driver COF 31 protruding outward from the pad portion 20 .

[0011] To provide additional description, in the transparent display device of the related art, the gate driver COF 31 installed on at least one of the left and right sides of the front of the transparent panel 10 protrudes from the side surface of the transparent panel 10. In a state where the gate driver COF 31 protrudes, the gate driver COF 31 is covered by a housing. For this reason, the sizes of the left and right frames of the transparent display device including the transparent panel 10 are increased. Summary of the invention

[0012] Embodiments relate to a transparent display device, the transparent display device comprising a transparent panel, at least one flexible substrate and a back cover. The transparent panel comprises pixels for generating an image. At least one flexible substrate is bent backward. Each of the flexible substrates has an end electrically connected to a pad area of ​​the transparent panel. Each of the flexible substrates comprises at least one integrated circuit (IC) chip configured to apply a signal to a gate of a transistor in the pixel. The back cover is disposed on the back side of the transparent panel. The back cover has at least one groove on the back surface of the back cover to accommodate the IC chip of the at least one flexible substrate.

[0013] In one embodiment, the transparent display device further comprises a shading plate between the transparent panel and the back cover, wherein the shading plate switches between a blocking mode and a transmission mode. In the blocking mode, the shading plate blocks the light entering through the back cover, and in the transmission mode, at least a portion of the light entering through the back cover is transmitted to the transparent panel via the shading plate.

[0014] In one embodiment, the back cover includes a curved edge, the curved edge abutting the bent flexible substrate to define a curvature of the flexible substrate.

[0015] In one embodiment, the transparent panel includes an upper substrate and a lower substrate, the lower substrate is located between the upper substrate and the back cover, the lower substrate includes the pad area, and the flexible substrate is bent backward on the lower substrate.

[0016] In one embodiment, the transparent display device further includes at least one thin film housing that covers the at least one flexible substrate and presses the IC chip of the at least one flexible substrate into the at least one groove.

[0017] In one embodiment, each of the film housings includes: a first portion, the first portion covers a portion of the front surface of the rear cover from which the transparent panel faces away; a second portion, the second portion covers a portion of the rear surface of the rear cover; and a third portion, the third portion connecting the first portion and the second portion. The first portion is pressed onto the front surface and the second portion is pressed onto the rear surface of the rear cover by elastic force.

[0018] In one embodiment, at least one of the grooves includes a plurality of grooves formed on the rear surface of the rear cover to accommodate a plurality of IC chips.

[0019] In one embodiment, the groove extends from one edge of the rear cover to another edge of the rear cover.

[0020] Embodiments also relate to a back cover in a transparent display device, the back cover comprising a front side, a back side and a curved edge. The front side faces a transparent panel, the transparent panel comprising pixels for generating an image. The back side is formed with at least one groove, at least one of the grooves is used to accommodate at least one integrated circuit IC chip, the at least one IC chip is mounted on at least one flexible substrate and applies a signal to a gate of a transistor in the transparent panel via the pad area to generate an image. Each of the flexible substrates has an end electrically connected to the pad area of ​​the transparent panel. The curved edge is adjacent to the at least one flexible substrate bent backward, and the curved edge is configured to define the curvature of the flexible substrate.

[0021] In one embodiment, the transparent panel includes an upper substrate and a lower substrate, wherein the lower substrate is located between the upper substrate and the back cover, the lower substrate includes the pad area, and the flexible substrate is bent backward on the lower substrate.

[0022] Embodiments also relate to the manufacture of a transparent display device. The end of the flexible substrate is connected to the pad area of ​​the transparent surface. The flexible substrate is bent backward on the curved edge of the back cover so that the rear surface of the flexible substrate is adjacent to the curved edge of the back cover, and the back cover is located on the back side of the transparent panel. An integrated circuit IC chip of the flexible substrate is accommodated in a groove, and the groove is located on the back side of the back cover. The IC chip applies a signal to the gate of the transistor located in the pixel.

[0023] In one embodiment, the flexible substrate is covered by a thin film housing.

[0024] In one embodiment, the flexible substrate is bent over an edge of a shading plate, and the shading plate switches between a blocking mode, in which the shading plate blocks light entering through the rear cover, and a transmission mode, in which at least a portion of the light entering through the rear cover is transmitted to the transparent panel via the shading plate.

[0025] In one embodiment, the rear cover is formed with the groove at a rear side of the rear cover.

[0026] In one embodiment, the flexible substrate is bent over a lower substrate of the transparent panel but is not bent over an upper substrate of the transparent panel, and the pad area is provided in the lower substrate of the transparent panel.

[0027] It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this application. The accompanying drawings illustrate embodiments of the present invention and together with the description serve to explain the principle of the present invention. In the drawings:

[0029] Figure 1 is an exemplary diagram showing the front side of a transparent panel of a transparent display device according to the prior art;

[0030] Figure 2 is an exemplary diagram showing a configuration of a transparent display device according to an embodiment of the present invention;

[0031] Figure 3 is an exemplary diagram showing the front side of the edge of the transparent display device according to the embodiment of the present invention;

[0032] Figure 4 It is shown Figure 3 An example diagram of the rear surface of the edge shown;

[0033] Figure 5 is another exemplary diagram showing the front side of the edge of the transparent display device according to the embodiment of the present invention;

[0034] Figure 6 It is shown Figure 5 An example diagram of the rear surface of the edge shown;

[0035] Figure 7is an exemplary diagram showing the front side of a transparent display device according to an embodiment of the present invention; and

[0036] Figure 8 is an exemplary diagram showing a rear surface of a transparent display device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0037] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals will be used throughout the drawings to refer to the same or like parts.

[0038] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0039] The advantages and features of the present invention and their implementation methods will become clear through the following embodiments described with reference to the accompanying drawings. However, the present invention can be specifically implemented in different forms and should not be interpreted as being limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. In addition, the present invention is limited only by the scope of the claims.

[0040] In this specification, when adding reference numerals for elements in each drawing, it should be noted that like reference numerals that have been used to designate like elements in other drawings are used for respective elements where possible.

[0041] The shapes, sizes, proportions, angles and numbers disclosed in the accompanying drawings for describing the embodiments of the present invention are only examples, and therefore, the present invention is not limited by the details shown in the drawings. Similar reference numerals always refer to similar elements. In the following description, when the detailed description of the relevant known functions or configurations is determined to be unnecessary to blur the focus of the present invention, the detailed description will be omitted. In the case of using 'comprising', 'having' and 'including' described in this specification, additional parts may be added unless 'only to' is used. Unless the opposite meaning is mentioned, the terms in the singular form may include the plural form.

[0042] When explaining an element, although not explicitly described, the element is interpreted as including an error range.

[0043] When describing a positional relationship, for example, when the positional relationship between two parts is described as 'on', 'above', 'below' and 'after', unless 'just' or 'directly' is used, one or more other parts may be arranged between the two parts.

[0044] In describing a time relationship, for example, when a time order is described as 'after', 'after', 'after', and 'before', discontinuous cases may be included unless 'only' or 'directly' is used.

[0045] The term "at least one" should be understood to include any and all combinations of one or more of the related listed items. For example, the meaning of "at least one of the first, second, and third items" means the combination of all items proposed from two or more of the first, second, and third items as well as the first, second, or third item.

[0046] It will be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and, similarly, a second element may be referred to as a first element, without departing from the scope of the present invention.

[0047] The features of the various embodiments of the present invention may be coupled or combined with each other in part or in whole, and may operate and technically drive with each other in various ways as will be fully understood by those skilled in the art. The embodiments of the present invention may be implemented independently of each other, or may be implemented together in a mutually dependent relationship.

[0048] Figure 2 2 is an exemplary diagram showing the configuration of a transparent display device according to an embodiment of the present invention. Figure 2 As shown, the transparent display device according to the embodiment of the present invention may include a transparent panel 110, a back cover 130, a shading plate 120, and a film housing 140, wherein the transparent panel 110 is transparent, the back cover 130 is transparent, the shading plate 120 is arranged on the rear surface of the transparent panel 110 and the front of the back cover 130 to adjust the light transmittance, and the film housing 140 is installed on the transparent panel 110, the shading plate 120, and the back cover 130 to cover the side surface of the transparent panel 110, the side surface of the shading plate 120, the side surface of the back cover 130, and the chip cover film 111. The shading plate 120 may be arranged in front of the back cover 130, and a chip slot 131 may be provided in the back surface of the back cover 130, the chip slot 131 being used to accommodate the gate driver chip 112 of the gate driver chip cover film 111 (connected to the transparent panel 110).

[0049] First, the transparent panel 110 can be implemented as a liquid crystal display panel, an organic light emitting display panel, etc. The transparent panel 110 may include a plurality of gate lines and a plurality of data lines. A plurality of pixels included in the transparent panel 110 may display an image according to a gate pulse provided by the gate line and a data voltage provided by the data line. If the transparent panel 110 is implemented as an organic light emitting display panel, the organic light emitting display panel may be manufactured in a top emission type. The transparent panel 110 with a top emission type may display an image in a direction in front of the position where the user is located. A plurality of pixels may be arranged in the transparent panel 110 and may be divided by a plurality of panel partition walls or a plurality of black matrices. For example, when the transparent panel 110 is a liquid crystal display panel, the pixels may be divided by a black matrices, and when the transparent panel 110 is an organic light emitting display panel, the pixels may be divided by a panel partition wall.

[0050] In each pixel, a region where an image is displayed may be referred to as a transmission portion, and another region where an image cannot be displayed due to a black matrix or a panel partition wall may be referred to as a non-transmission portion.

[0051] When the transparent panel 110 is a liquid crystal display panel, liquid crystal, a plurality of transparent pixel electrodes and a transparent common electrode may be arranged in the transmission portion, and a black matrix, gate lines, data lines and a plurality of thin film transistors (TFTs) for driving the liquid crystal may be provided in the non-transmission portion.

[0052] When the transparent panel 110 is an organic light emitting display panel, a plurality of organic light emitting diodes (OLEDs) that emit light may be arranged in the transmission portion, and partition walls and various elements for driving the respective OLEDs may be arranged in the non-transmission portion.

[0053] A gate driver chip-on-chip 111 equipped with a gate driver chip 112 that performs a gate driver function may be attached to at least one of the left and right sides of the front of the transparent panel 110. In particular, the gate driver chip-on-chip 111 may be attached to a pad portion of the lower substrate that configures the transparent panel 110.

[0054] One or more gate driver flip chip films 111 may be provided. Figure 2 , a gate driver chip 112 is shown attached to the transparent panel 110 on each of the left and right sides of the transparent panel 110. Similarly, four gate driver flip film films 111 may be attached to Figure 2 Each of the left and right sides of the transparent panel 110 is shown.

[0055] The gate driver chip 112 may sequentially supply gate pulses to gate lines included in the transparent panel 110. While supplying the gate pulses, data voltages may be respectively supplied to data lines included in the transparent panel 110, and thus, an image may be displayed in units of one horizontal line corresponding to the gate line supplied with the gate pulses.

[0056] A data driver chip on film 113 equipped with a data driver chip 114 that performs a function of a data driver is attached to a lower end of the front side of the transparent panel 110 , and the data driver chip on film 113 may be attached to the PCB 115 .

[0057] The data driver chip 114 may respectively supply data voltages to the data lines while supplying gate pulses to corresponding gate lines through the gate driver chip 112 .

[0058] A controller (not shown) may be disposed on the PCB 115. The controller may generate a gate control signal for controlling the gate driver chip 112 and a data control signal for controlling the data driver chip 114, and may transmit the gate control signal and the data control signal to the gate driver chip 112 and the data driver chip 114, respectively.

[0059] According to an embodiment of the present invention, the gate driver chip 112 provided in the gate driver COF 111 may be inserted into a chip slot 131 included in the back cover 130. Therefore, the gate driver COF 111 may be referred to as COF 111, and the gate driver chip 112 may be referred to as chip 112.

[0060] Second, the light shielding plate 120 may be disposed on the rear surface of the transparent panel 110. The light shielding plate 120 may adjust the transmittance of light irradiated from the rear surface direction of the transparent display device and may transmit the transmittance-adjusted light to the transparent panel 110.

[0061] The transparent display device including the transparent panel 110 can allow the background of the transparent display device to be visible while displaying an image, and therefore is being widely used. However, some users may not desire to make the background of the transparent display device visible. In addition, the image displayed by the transparent display device may become unclear due to the background of the transparent display device. In this case, the user may change the transmittance of the visor 120.

[0062] The transparent display device has good contrast in a dark environment, but the contrast becomes deteriorated in a normal environment with light. Therefore, a light shielding plate 120 for implementing a light shielding mode for blocking light and a transmissive mode for transmitting light may be used to prevent the contrast from being deteriorated.

[0063] The light shielding plate 120 may use a panel having electrochromic characteristics, or may use a panel having liquid crystal. The configuration of the light shielding plate 120 will be briefly described below.

[0064] The light shielding plate 120 having an electrochromic property may include a lower base substrate, a lower auxiliary electrode, a lower main electrode, a lower substrate, an upper base substrate, an upper auxiliary electrode, an upper main electrode, an upper substrate on which a reverse material is coated, and an electrolytic material arranged between the lower substrate and the upper substrate. Here, the lower electrochromic material may be coated on the lower substrate, the upper base substrate, the upper auxiliary electrode, and the upper main electrode.

[0065] In this case, each of the lower base substrate and the upper base substrate may be a plastic film. Each of the lower auxiliary electrode and the upper auxiliary electrode may be an opaque electrode. The opaque electrode may be formed of materials such as copper (Cu) and aluminum (Al), but is not limited to these materials.

[0066] Each of the lower main electrode and the upper main electrode may be a transparent electrode. The transparent electrode may be formed of a material such as indium tin oxide (ITO) and indium zinc oxide (IZO), but is not limited to these materials.

[0067] When a voltage is applied to the lower main electrode and the upper main electrode, an oxidation-reduction reaction may be performed on the lower electrochromic material, the counter material, and the electrolytic material, and thus, the color of the lower electrochromic material may be changed.

[0068] The lower electrochromic material may include a core material such as a transparent conductive oxide (TCO) and an electrochromic material bonded to the core material. The core material may use TiO2, In2O3, SnO2, RuO2, or a material produced by surface-processing TiO2 on ITO.

[0069] The electrochromic material may use a material that has a specific color by absorbing a specific color when performing a reduction reaction, and the electrochromic material becomes transparent when performing a reduction reaction. For example, the electrochromic material may be 1,1'-dibenzyl-4,4'-bipyridiniumbistetrafluorborate.

[0070] The electrolytic material may include an electrolyte, a polymer and an ultraviolet (UV) initiator. The electrolyte may be lithium perchlorate, tert-butylammonium perchlorate, tert-butylammonium trifluoroborate or tetrabutylammonium trifluoromethanesulfonate. The polymer may be an acrylic polymer, a polyether polymer or an epoxy polymer. The UV initiator may be benzoester or amine.

[0071] The light shielding plate 120 using liquid crystal may include a lower substrate, an upper substrate, and a liquid material. In this case, the lower substrate may include a lower base substrate and a lower electrode, and the upper substrate may include an upper base substrate and an upper electrode. Each of the lower base substrate and the upper base substrate may be a plastic film.

[0072] The liquid material may be injected between a plurality of partition walls included in the lower substrate or the upper substrate and between the lower substrates or the upper substrates. The liquid material may be liquid crystal.

[0073] The refractive index of the liquid crystal may be changed by a voltage applied to the upper electrode and the lower electrode, and thus, the transmittance of the light blocking plate 120 may be changed. However, according to an embodiment of the present invention, the light blocking plate 120 may not be included in the transparent display device.

[0074] Third, the back cover 130 may be formed of a transparent material, and, for example, may be a transparent glass substrate.

[0075] The light shielding plate 120 may be disposed in front of the back cover 130 , and a chip groove 131 into which a chip 112 included in a chip on film 111 coupled to the transparent panel 110 is inserted may be disposed in a rear surface of the back cover 130 .

[0076] To provide additional description, the back cover 130 may include a front surface, a rear surface, and a side surface, wherein the transparent panel 110 is arranged on the front surface, the rear surface includes a chip groove 131, and the chip 112 included in the flip chip film 111 connected to the transparent panel 110 is inserted into the chip groove 131, and the side surface is a circular side surface for guiding the flip chip film 111.

[0077] Fourth, the film housing 140 may be mounted on the transparent panel 110 , the shading plate 120 , and the back cover 130 to cover side surfaces of the transparent panel 110 , the shading plate 120 , the back cover 130 , and the chip on film 111 .

[0078] If the light shielding plate 120 is omitted, the film cover 140 may cover only the side surfaces of the transparent panel 110 and the back cover 130 , and may cover the chip on film 111 .

[0079] When a plurality of chip-on-films 111 are attached to the transparent panel 110, the film housing 140 may cover each of the chip-on-films 111 and may also cover all of the chip-on-films 111. Figure 2 , a transparent panel 110 is shown on one side of which four COFs 111 are arranged, and therefore, four film housings 140 are shown for covering the four COFs 111. In an alternative embodiment of the present invention, all four COFs 111 may be covered by one film housing 140.

[0080] As described above, the present invention can be applied to a transparent display device using a transparent panel. The reason is that it is difficult for a transparent display device to use a gate-in-plane (GIP) type in which a gate driver is built into a transparent panel. For example, in order to make a non-display area with a gate driver having a GIP type built in transparent, the intervals between the various TFTs configured with the gate driver should be expanded. Moreover, an ultraviolet (UV) curing method can be used to bond the upper substrate to the lower substrate in a non-display area with a gate driver having a GIP type built in, in which case the intervals between the various TFTs configured with the gate driver should be expanded to perform the UV curing method. Therefore, the non-display area is expanded in a transparent panel using a GIP type. Therefore, in a transparent display device including a transparent panel according to the present invention, a chip-on-film 111 equipped with a chip 112 can be attached to a transparent panel 110.

[0081] Figure 3 is an exemplary diagram showing the front side of the edge of the transparent display device according to the embodiment of the present invention, and in particular, is a diagram showing Figure 2 An example diagram of region Y is shown. Figure 2 In the embodiment, the transparent panel 110, the light shielding plate 120 and the back cover 130 are separated from each other. Figure 3 A region Y where the transparent panel 110, the light shielding plate 120, and the back cover 130 are coupled to each other is shown. Figure 4 It is shown Figure 3 An example diagram of the rear surface of the edge is shown.

[0082] As described above, the transparent display device according to the embodiment of the present invention may include the transparent panel 110, the shading plate 120, the back cover 130, and the film housing 140. Here, the shading plate 120 and the film housing 140 may be omitted. Figure 3 and Figure 4 In the transparent display device shown in FIG. 1 , the film housing 140 may be omitted, and the light shielding plate 120 may be provided.

[0083] like Figure 3 As shown, the transparent panel 110 and the light shielding plate 120 may be arranged in front of the rear cover 130. Figure 4As shown, the rear surface of the back cover 130 may be formed with a chip groove 131 into which the chip 112 included in the chip on film 111 coupled to the transparent panel 110 is inserted.

[0084] The chip-on-film 111 may be formed along Figure 3 The rounded side surface of the rear cover 130 shown is curved, and may be arranged as shown in FIG. Figure 4 The chip 112 included in the COF 111 may be inserted into the chip groove 131 in the rear surface of the back cover 130 .

[0085] As described above, chip 112 may perform the function of a gate driver.

[0086] The transparent panel 110 may include an upper substrate 102 and a lower substrate 101. A COF 111 may be attached to the pad portion P of the lower substrate 101. One or more COFs 111 may be attached to the pad portion P. The four COFs 111 may be attached to Figure 2 The pad portion P is shown.

[0087] In this case, a plurality of chip slots 131 corresponding to the chip flip film 111 may be arranged in the rear surface of the back cover 130. The chip slots 131 for accommodating each of the chips 112 located on the chip flip film 111 may be respectively inserted in the rear surface of the back cover 130. For example, when four chip flip films 111 are attached to the pad portion P, four chip slots 131 may be respectively arranged in the rear surface of the back cover 130. In this case, each of the four chips 112 in the four chip flip films 111 may be inserted into each of the four chip slots 131. Since the chip slots 131 do not span the entire rear surface of the back cover 130, the chip slots 131 may be quickly formed.

[0088] Alternatively, if Figure 4 As shown, in order to insert the chip included in the COF into the chip slot 131, the chip slot 131 may be continuously arranged from one end to the other end of the rear surface of the back cover 130. Since the chip slot 131 is continuously arranged, the process of forming the chip slot 131 is simplified.

[0089] The width of the chip slot 131 may be equal to or greater than the width of the chip 112 .

[0090] Figure 5 is another exemplary diagram showing the front side of the edge of the transparent display device according to the embodiment of the present invention, and in particular, is a diagram showing Figure 2 An example diagram of region Y is shown. Figure 2 In the embodiment, the transparent panel 110, the light shielding plate 120 and the back cover 130 are separated from each other. Figure 5A region Y where the transparent panel 110, the light shielding plate 120, and the back cover 130 are coupled to each other is shown. Figure 6 It is shown Figure 5 An example diagram of the rear surface of the edge is shown.

[0091] As described above, the transparent display device according to the embodiment of the present invention may include the transparent panel 110, the shading plate 120, the back cover 130, and the film housing 140. The shading plate 120 and the film housing 140 may be omitted in some embodiments.

[0092] The film housing 140 may closely adhere the COF 111 to the side surfaces of the transparent panel 110, the shading plate 120, and the back cover 130 to fix the COF 111 to the back cover 130. Therefore, the film housing 140 may be omitted. However, Figure 5 and Figure 6 The transparent display device shown may include a film housing 140 and a light shielding plate 120 .

[0093] Figure 3 and Figure 4 The transparent display device shown may not include the film housing 140, but Figure 5 and Figure 6 The transparent display device shown may include a film housing 140. Therefore, in addition to Figure 5 and Figure 6 The transparent display device shown may further include a film housing 140. Figure 5 and Figure 6 The transparent display device shown may have Figure 3 and Figure 4 Therefore, hereinafter, only the thin film housing 140 will be described.

[0094] The film housing 140 may be mounted on the transparent panel 110, the shading plate 120, and the back cover 130 to cover side surfaces of the transparent panel 110, the shading plate 120, and the back cover 130. In particular, the film housing 140 may cover the chip on film 111.

[0095] In this case, if Figure 5 As shown, one side of the film housing 140 may be disposed in the pad portion P of the transparent panel 110 to cover one side of the chip on film 111 coupled to the pad portion P.

[0096] Moreover, if Figure 6 As shown, the other side of the film housing 140 may be disposed on the rear surface of the back cover 130 to cover the other side of the chip on film 111 disposed on the rear surface.

[0097] The film housing 140 may be elastic, which causes one side of the film housing 140 to deform toward the other side. Therefore, the film housing 140 may be closely adhered to the pad portion P and the rear surface of the back cover 130. Therefore, the film housing 140 may be fixed to the side surfaces of the transparent panel 110, the shading plate 120, and the back cover 130.

[0098] Also, since the film housing 140 is fixed to the side surfaces of the transparent panel 110, the shading plate 120, and the back cover 130, the chip-on-film 111 may be covered by the film housing 140, thereby protecting the chip-on-film 111. The film housing 140 may be formed of magnesium (Mg), rubber, urethane, and / or the like.

[0099] Figure 7 is an exemplary diagram showing the front side of a transparent display device according to an embodiment of the present invention, and Figure 8 is an exemplary diagram showing a rear surface of a transparent display device according to an embodiment of the present invention.

[0100] The transparent display device according to the embodiment of the present invention may include a transparent panel 110 and a rear cover 130 , and may further include a light blocking plate 120 and a film cover 140 . Figure 7 and Figure 8 The front and rear surfaces of the transparent display device including the thin film cover 140 according to the embodiment of the present invention are shown.

[0101] The size K of the frame on each of the left and right sides of the transparent display device according to the embodiment of the present invention may correspond to the sum of the width A of the pad portion P and the width of a portion of the chip-on-film 111 protruding out of the pad portion P.

[0102] like Figure 7 and Figure 8 As shown, when the chip-on-film 111 is covered by the film housing 140, the size K of the border on each of the left and right sides of the transparent display device can correspond to the sum of the width A of the pad portion P and the width C of a portion of the film housing 140 that protrudes outside the pad portion P.

[0103] In this case, if Figure 8 As shown, the chip groove 131 may be arranged at a position corresponding to the pad portion P. Therefore, the chip groove 131 does not affect the size K of the frame of the transparent display device. In order to arrange the chip 112 in the chip groove 131, the thickness of the back cover 130 may be adjusted. In addition, the chip 112 may be arranged in the chip groove 131 by changing the thickness of the back cover 130 and the curvature of the side surface of the back cover 130 on which the chip cover film 111 is arranged.

[0104] The above-mentioned embodiment of the present invention will be briefly summarized. One of the purposes of the embodiment is to reduce the size of the frame in the left and right sides of the transparent panel to which the chip-on-film is attached. To this end, a transparent back cover 130 may be arranged on the rear surface of the transparent panel 110, and a chip slot 131 may be arranged in the rear surface of the back cover 130, and a chip 112 equipped in the chip-on-film 111 attached to the transparent panel 110 is inserted into the chip slot 131.

[0105] In the prior art, since the chip-on-film (in detail, the gate driver chip-on-film including the gate driver chip that performs the function of the gate driver) is installed without bending, the size of the frame increases due to the width of the chip-on-film. However, according to an embodiment of the present invention, the chip-on-film 111 equipped with the gate driver chip can be bent through the back cover 130, and the gate driver chip 112 mounted on the chip-on-film 111 can be inserted into the chip groove 131 and fixed to the chip groove 131. Therefore, the size of the frame of the transparent display device including the frame transparent panel 110 to which the chip-on-film 111 is attached is reduced.

[0106] Moreover, according to an embodiment of the present invention, in order to closely adhere the COF 111 (bent along the back cover 130) to the back cover 130, a film housing 140 may be used. For example, the film housing 140 may be installed on the side surfaces of the transparent panel 110 and the back cover 130 to cover the side surfaces of the transparent panel 110, the back cover 130, and the COF 111.

[0107] The thin film case 140 may be formed of magnesium (Mg), rubber, urethane, and / or the like. Since the side surface of the thin film case 140 is rounded, the chip on film 111 is not damaged.

[0108] As described above, according to the embodiment of the present invention, the chip-on-chip film included in the pad portion of the transparent panel is bent along the side surface of the back cover to the rear surface of the back cover, and the chip equipped in the chip-on-chip film is inserted into the chip groove arranged in the rear surface of the back cover. Therefore, the size of the frame of the transparent display device including the transparent panel can be reduced.

[0109] It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention. Therefore, the present invention is intended to encompass various modifications and variations of the present invention within the scope of the appended claims and their equivalents.

[0110] CROSS-REFERENCE TO RELATED APPLICATIONS

[0111] This application claims the benefit of Korean Patent Application No. 10-2015-0123260, filed on August 31, 2015, which is hereby incorporated by reference as if fully set forth herein.

Claims

1. A transparent display device, comprising: a transparent panel comprising pixels configured to generate an image; a plurality of flexible substrates bent backward at left and right sides of the transparent panel, each of the flexible substrates having one end electrically coupled to a pad region of the transparent panel, each of the flexible substrates comprising at least one gate driver IC chip configured to apply a gate pulse to a gate line connected to one of the pixels; a back cover, the back cover being located at the back side of the transparent panel, the back cover having two grooves, the two grooves being continuously arranged from one edge to the other edge of the back surface of the back cover to accommodate the at least one gate driver IC chip of each of the plurality of flexible substrates, the two grooves being arranged to correspond to the left side and the right side of the transparent panel, respectively, and each of the two grooves having a depth shallower than a thickness of the back cover; at least one membrane housing, wherein each of the film housings comprises: a first portion covering a portion of the front surface of the transparent panel facing away from the rear cover, a second portion covering a portion of the rear surface of the rear cover, and a third portion connecting the first portion and the second portion; and a shading plate, the shading plate being located between the transparent panel and the back cover, wherein the shading plate switches between a blocking mode and a transmission mode, in which the shading plate blocks the light entering through the back cover, and in which the shading plate transmits at least a portion of the light entering through the back cover to the transparent panel, The light shielding plate includes a lower substrate, an upper substrate, and a material disposed between the lower substrate and the upper substrate, and the material is a material selected from an electrolytic material and a liquid crystal material. wherein the plurality of flexible substrates are closely adhered to the side surface of the transparent panel, the side surface of the shading plate and the side surface of the back cover through the film housing, wherein one side of the thin film housing is disposed in the pad area of ​​the transparent panel to contact the side of the flexible substrate connected to the pad area, The other side of the film housing is disposed on the rear surface of the rear cover to contact the other side of the flexible substrate disposed on the rear surface of the rear cover, and The film housing presses the IC chips in the plurality of flexible substrates into the two grooves through elastic force.

2. The transparent display device according to claim 1, wherein: The transparent panel includes an upper substrate and a lower substrate, the lower substrate being located between the upper substrate and the back cover, wherein the lower substrate includes the pad area, and wherein the flexible substrate is bent backward on the lower substrate.

3. The transparent display device according to claim 1, in, The back cover comprises: a front surface, the front surface facing the transparent panel; a rear surface having the two grooves; and a curved edge, the curved edge being adjacent to the plurality of flexible substrates bent backward, the curved edge being configured to define a curvature of the flexible substrate, wherein at least a portion of the curved edge is configured to be covered by a thin film housing, the thin film housing having a circular shape corresponding to the curved edge and covering the plurality of flexible substrates, and The third portion has a circular shape corresponding to the curved edge of the back cover to cover the bent flexible substrate and the curved edge of the back cover.

4. The transparent display device according to claim 2, wherein: The first portion is pressed onto the front surface and the second portion is pressed onto the rear surface of the rear cover by elastic force.

5. A method for manufacturing a transparent display device, the method comprising the following steps: electrically coupling one end of each of the plurality of flexible substrates to a pad region of the transparent panel; bending the plurality of flexible substrates backwards to above the curved edge of the rear cover at the left and right sides of the transparent panel so that the rear surfaces of the flexible substrates are adjacent to the curved edge of the rear cover; a gate driver IC chip for accommodating each of the plurality of flexible substrates in a groove located at the rear surface of the rear cover, the gate driver IC chip being used to apply a gate pulse to a gate line connected to one of the pixels, the groove being provided as two grooves arranged continuously from one edge to the other edge of the rear surface of the rear cover, the two grooves being provided to correspond to the left side and the right side of the transparent panel, respectively, and each of the two grooves having a depth shallower than a thickness of the rear cover; as well as The flexible substrate is covered by a thin film housing, wherein one side of the thin film housing is disposed in the pad area of ​​the transparent panel to contact the side of the flexible substrate connected to the pad area, The other side of the thin film housing is disposed on the rear surface of the rear cover to contact the other side of the flexible substrate disposed on the rear surface of the rear cover, The plurality of flexible substrates are bent above the edge of a light shielding plate, and the light shielding plate is located between the transparent panel and the back cover. The shading plate switches between a blocking mode and a transmission mode. In the blocking mode, the shading plate blocks the light entering through the rear cover, and in the transmission mode, at least a portion of the light entering through the rear cover is transmitted to the transparent panel via the shading plate. The light shielding plate includes a lower substrate, an upper substrate, and a material disposed between the lower substrate and the upper substrate, and the material is a material selected from an electrolytic material and a liquid crystal material. wherein the plurality of flexible substrates are closely adhered to the side surface of the transparent panel, the side surface of the shading plate and the side surface of the back cover through the film housing, and The film housing presses the IC chips in the plurality of flexible substrates into the two grooves through elastic force.

6. The method according to claim 5, wherein: The back cover comprises: a front surface, the front surface facing the transparent panel; a rear surface having the two grooves formed thereon; and a curved edge, the curved edge being adjacent to the plurality of flexible substrates bent backward, the curved edge being configured to define a curvature of the flexible substrate, wherein at least a portion of the curved edge is configured to be covered by a thin film housing, the thin film housing having a circular shape corresponding to the curved edge and covering the plurality of flexible substrates, The film housing includes: a first portion covering a portion of the front surface of the transparent panel away from the rear cover, a second portion covering a portion of the rear surface of the rear cover, and a third portion connecting the first portion and the second portion. The third portion has a circular shape corresponding to the curved edge of the back cover, so that the third portion covers the bent flexible substrate and the curved edge of the back cover.

7. The method according to claim 5, wherein: The flexible substrate is bent over a lower substrate of the transparent panel but is not bent over an upper substrate of the transparent panel, and the pad area is disposed in the lower substrate of the transparent panel.

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