One-time lamination process for multi-layer IC card

Abstract

The invention discloses a one-time lamination process for a multi-layer IC card. In the invention, the material splicing method is: PET+ABS+matched COB antenna chip+ceramic metal hybrid shielding fiber monolith+ABS+PET, that is, the two sides of the matched antenna chip are two pieces of ABS material, and the laminated middle material is laminated with the two outermost PET fabrics; then, through one-time lamination, the processing time is shortened, thereby significantly improving the processing efficiency and avoiding the phenomenon of uneven thickness of the IC card; at the same time, the ceramic metal hybrid shielding fiber is attached to one side of the COB antenna chip, so that when people need to put the IC card together with mobile phones and other items in the subsequent use process, the side provided with the ceramic metal hybrid shielding fiber monolith is facing the mobile phone, thereby minimizing the interference of the IC card by other items and improving the stability and anti-interference of the IC card during use.

Description

Technical Field

[0001] The invention belongs to the technical field of IC card manufacturing, in particular to a one-time lamination process of a multi-layer IC card. Background Art

[0002] IC card is a card made by embedding a microelectronic chip in a card base that complies with ISO 7816 standard. The communication between IC card and reader can be contact or contactless. IC card has the characteristics of small size, easy to carry, large storage capacity, high reliability, long service life, strong confidentiality and high security.

[0003] In the current IC card processing, the usual practice is to first apply glue to the PVC protective layer adjacent to the chip on both sides, use a 200-mesh screen, and then use a semi-automatic machine to screen print, and then send it to the drying room for half an hour, and then laminate it with the middle chip layer PET, and then add a filling layer PVC on both sides, laminate it, and make it into a middle material layer, and then put two high-temperature cloths on each side, and then laminat it for the first time to get the middle material layer. Then apply glue to the back of the front printing layer and the front of the back printing layer, use a 300-mesh screen, and use a semi-automatic machine to screen print, and then laminate the front printing layer, middle material layer, and back printing layer in turn, and perform a second lamination to get the final IC card product.

[0004] Current IC cards are often disturbed and demagnetized when placed together with other objects with strong magnetism, such as mobile phones, affecting the convenience of use. Summary of the invention

[0005] The object of the present invention is to provide a one-time lamination process for a multi-layer IC card in order to solve the above-mentioned problems.

[0006] The technical solution adopted by the present invention is as follows: a one-time lamination process for a multi-layer IC card, the one-time lamination process for a multi-layer IC card comprising the following steps:

[0007] S1: First, select the sheet material formula, and the material splicing method is: PET+ABS+matched COB antenna chip+ceramic metal mixed shielding fiber single piece+ABS+PET, that is, the two sides of the matched antenna chip are two pieces of ABS material, and the laminated middle material is then laminated with the two outermost PET fabrics;

[0008] S2: Confirm the thickness of the sheet. The thickness of the ABS sheet is 0.16 mm, the thickness of the PET sheet is 0.1 mm, and the thickness of the ceramic-metal hybrid shielding fiber sheet is 0.1 to 0.15 mm;

[0009] S3: After applying glue on the PET layer facing the ABS layer, the PET protective layer and the ABS layer are laminated and compounded;

[0010] S4: Take a ceramic-metal hybrid shielding fiber monolith and apply glue to the antenna chip on the side of the ceramic-metal hybrid shielding fiber monolith facing the COB;

[0011] S5: After applying glue on the ABS layer facing the matched COB antenna chip, the ABS protective layer and the COB antenna chip layer are laminated and compounded; and at the same time, a raised mark is made on the PET layer on the side where the ceramic metal hybrid shielding fiber single sheet is provided;

[0012] S6: Then, glue the remaining PET layer and ABS layer on both sides of the antenna chip respectively;

[0013] S7: stacking the sheets in the order in which they were stacked and bonded in step S6; after the stacking is completed, laminating is performed once and heating is performed to a high temperature;

[0014] S8: Then the pressure is increased and maintained for a certain period of time, and then the temperature is lowered. After the pressure is increased and the holding time is taken as a cycle, after three cycles, it is determined that the raised mark is clearly visible, and the processing of the finished product is finally completed.

[0015] In a preferred embodiment, in step S2, the total thickness is 0.1+0.16+0.16+0.1+0.1=0.62 mm.

[0016] In a preferred embodiment, in step S7, the heating to the high temperature is 150 degrees Celsius and the heating time is 200 to 300 seconds.

[0017] In a preferred embodiment, in step S8, the pressure is increased to 70 Bar and maintained for 300 seconds.

[0018] In a preferred embodiment, in step S8, the parameter setting of the laminating equipment needs to control the thickness of the intermediate material after lamination to be between 0.30-0.31 mm, that is, the thickness of the intermediate material near the chip position after lamination and cooling is 0.31 mm, and the thickness at the non-chip position is between 0.30-0.31 mm.

[0019] In a preferred embodiment, in step S8, the temperature is lowered to 25 to 35 degrees Celsius.

[0020] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0021] In the present invention, the processing time is shortened through one-time lamination, thereby significantly improving the processing efficiency and avoiding the phenomenon of uneven thickness of the IC card; at the same time, the ceramic-metal hybrid shielding fiber is attached to one side of the COB antenna chip, so that when people need to put the IC card together with items such as mobile phones during subsequent use, the side of the single chip provided with the ceramic-metal hybrid shielding fiber can be placed toward the mobile phone, thereby minimizing the interference of the IC card with other items and improving the stability and anti-interference of the IC card during use. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in combination with the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Embodiment 1:

[0024] A one-time lamination process for a multi-layer IC card, the one-time lamination process for a multi-layer IC card comprising the following steps:

[0025] S1: First, select the sheet material formula, and the material splicing method is: PET+ABS+matched COB antenna chip+ceramic metal mixed shielding fiber single piece+ABS+PET, that is, the two sides of the matched antenna chip are two pieces of ABS material, and the laminated middle material is then laminated with the two outermost PET fabrics;

[0026] S2: Confirm the thickness of the sheet. The thickness of the ABS sheet is 0.16 mm, the thickness of the PET sheet is 0.1 mm, and the thickness of the ceramic-metal hybrid shielding fiber sheet is 0.1 mm. In step S2, the total thickness is 0.1+0.16+0.16+0.1+0.1=0.62 mm.

[0027] S3: After applying glue on the PET layer facing the ABS layer, the PET protective layer and the ABS layer are laminated and compounded;

[0028] S4: Take a ceramic-metal hybrid shielding fiber monolith and apply glue to the antenna chip on the side of the ceramic-metal hybrid shielding fiber monolith facing the COB;

[0029] S5: After applying glue on the ABS layer facing the matched COB antenna chip, the ABS protective layer and the COB antenna chip layer are laminated and compounded; and at the same time, a raised mark is made on the PET layer on the side where the ceramic metal hybrid shielding fiber single sheet is provided;

[0030] S6: Then, glue the remaining PET layer and ABS layer on both sides of the antenna chip respectively;

[0031] S7: stacking the sheets in the order of stacking and bonding in step S6; after stacking, laminating once and heating to a high temperature; in step S7, heating to a high temperature of 150 degrees Celsius for a heating time of 200 to 300 seconds;

[0032] S8: Then start to increase the pressure, and keep it for a certain period of time, and then cool it down. After the pressure increase and holding time, it is regarded as a cycle. After three cycles, it is determined that the raised mark is clearly visible, and finally the processing of the finished product is completed; in step S8, the pressure is increased to 70Bar and the holding time is 300 seconds; in step S8, the parameter setting of the laminating equipment needs to control the thickness of the middle material after lamination to be between 0.30-0.31mm, that is, the thickness of the middle material near the chip position after lamination and cooling is 0.31mm, and the thickness of the non-chip position is between 0.30-0.31mm; in step S8, the temperature is reduced to 25-35 degrees Celsius.

[0033] In the present invention, the processing time is shortened through one-time lamination, thereby significantly improving the processing efficiency and avoiding the phenomenon of uneven thickness of the IC card; at the same time, the ceramic-metal hybrid shielding fiber is attached to one side of the COB antenna chip, so that when people need to put the IC card together with items such as mobile phones during subsequent use, the side of the single chip provided with the ceramic-metal hybrid shielding fiber can be placed toward the mobile phone, thereby minimizing the interference of the IC card with other items and improving the stability and anti-interference of the IC card during use.

[0034] Embodiment 2:

[0035] A one-time lamination process for a multi-layer IC card, the one-time lamination process for a multi-layer IC card comprising the following steps:

[0036] S1: First, select the sheet material formula, and the material splicing method is: PET+ABS+matched COB antenna chip+ceramic metal mixed shielding fiber single piece+ABS+PET, that is, the two sides of the matched antenna chip are two pieces of ABS material, and the laminated middle material is then laminated with the two outermost PET fabrics;

[0037] S2: Confirm the thickness of the sheet. The thickness of the ABS sheet is 0.16 mm, the thickness of the PET sheet is 0.1 mm, and the thickness of the ceramic-metal hybrid shielding fiber sheet is 0.12 mm. In step S2, the total thickness is 0.1+0.16+0.16+0.1+0.1=0.62 mm.

[0038] S3: After applying glue on the PET layer facing the ABS layer, the PET protective layer and the ABS layer are laminated and compounded;

[0039] S4: Take a ceramic-metal hybrid shielding fiber monolith and apply glue to the antenna chip on the side of the ceramic-metal hybrid shielding fiber monolith facing the COB;

[0040] S5: After applying glue on the ABS layer facing the matched COB antenna chip, the ABS protective layer and the COB antenna chip layer are laminated and compounded; and at the same time, a raised mark is made on the PET layer on the side where the ceramic metal hybrid shielding fiber single sheet is provided;

[0041] S6: Then, glue the remaining PET layer and ABS layer on both sides of the antenna chip respectively;

[0042] S7: stacking the sheets in the order of stacking and bonding in step S6; after stacking, laminating once and heating to a high temperature; in step S7, heating to a high temperature of 150 degrees Celsius for a heating time of 200 to 300 seconds;

[0043] S8: Then start to increase the pressure, and keep it for a certain period of time, and then cool it down. After the pressure increase and holding time, it is regarded as a cycle. After three cycles, it is determined that the raised mark is clearly visible, and finally the processing of the finished product is completed; in step S8, the pressure is increased to 70Bar and the holding time is 300 seconds; in step S8, the parameter setting of the laminating equipment needs to control the thickness of the middle material after lamination to be between 0.30-0.31mm, that is, the thickness of the middle material near the chip position after lamination and cooling is 0.31mm, and the thickness of the non-chip position is between 0.30-0.31mm; in step S8, the temperature is reduced to 25-35 degrees Celsius.

[0044] In the present invention, the processing time is shortened through one-time lamination, thereby significantly improving the processing efficiency and avoiding the phenomenon of uneven thickness of the IC card; at the same time, the ceramic-metal hybrid shielding fiber is attached to one side of the COB antenna chip, so that when people need to put the IC card together with items such as mobile phones during subsequent use, the side of the single chip provided with the ceramic-metal hybrid shielding fiber can be placed toward the mobile phone, thereby minimizing the interference of the IC card with other items and improving the stability and anti-interference of the IC card during use.

[0045] Embodiment three:

[0046] A one-time lamination process for a multi-layer IC card, the one-time lamination process for a multi-layer IC card comprising the following steps:

[0047] S1: First, select the sheet material formula, and the material splicing method is: PET+ABS+matched COB antenna chip+ceramic metal mixed shielding fiber single piece+ABS+PET, that is, the two sides of the matched antenna chip are two pieces of ABS material, and the laminated middle material is then laminated with the two outermost PET fabrics;

[0048] S2: Confirm the thickness of the sheet. The thickness of the ABS sheet is 0.16 mm, the thickness of the PET sheet is 0.1 mm, and the thickness of the ceramic-metal hybrid shielding fiber sheet is 0.15 mm. In step S2, the total thickness is 0.1+0.16+0.16+0.1+0.1=0.62 mm.

[0049] S3: After applying glue on the PET layer facing the ABS layer, the PET protective layer and the ABS layer are laminated and compounded;

[0050] S4: Take a ceramic-metal hybrid shielding fiber monolith and apply glue to the antenna chip on the side of the ceramic-metal hybrid shielding fiber monolith facing the COB;

[0051] S5: After applying glue on the ABS layer facing the matched COB antenna chip, the ABS protective layer and the COB antenna chip layer are laminated and compounded; and at the same time, a raised mark is made on the PET layer on the side where the ceramic metal hybrid shielding fiber single sheet is provided;

[0052] S6: Then, glue the remaining PET layer and ABS layer on both sides of the antenna chip respectively;

[0053] S7: stacking the sheets in the order of stacking and bonding in step S6; after stacking, laminating once and heating to a high temperature; in step S7, heating to a high temperature of 150 degrees Celsius for a heating time of 200 to 300 seconds;

[0054] S8: Then start to increase the pressure, and keep it for a certain period of time, and then cool it down. After the pressure increase and holding time, it is regarded as a cycle. After three cycles, it is determined that the raised mark is clearly visible, and finally the processing of the finished product is completed; in step S8, the pressure is increased to 70Bar and the holding time is 300 seconds; in step S8, the parameter setting of the laminating equipment needs to control the thickness of the middle material after lamination to be between 0.30-0.31mm, that is, the thickness of the middle material near the chip position after lamination and cooling is 0.31mm, and the thickness of the non-chip position is between 0.30-0.31mm; in step S8, the temperature is reduced to 25-35 degrees Celsius.

[0055] In the present invention, the processing time is shortened through one-time lamination, thereby significantly improving the processing efficiency and avoiding the phenomenon of uneven thickness of the IC card; at the same time, the ceramic-metal hybrid shielding fiber is attached to one side of the COB antenna chip, so that when people need to put the IC card together with items such as mobile phones during subsequent use, the side of the single chip provided with the ceramic-metal hybrid shielding fiber can be placed toward the mobile phone, thereby minimizing the interference of the IC card with other items and improving the stability and anti-interference of the IC card during use.

[0056] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0057] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A one-time lamination process for a multi-layer IC card, characterized in that: The one-time lamination process of the multi-layer IC card comprises the following steps: S1: First, select the sheet material formula, and the material splicing method is: PET+ABS+matched COB antenna chip+ceramic metal mixed shielding fiber single piece+ABS+PET, that is, the two sides of the matched antenna chip are two pieces of ABS material, and the laminated middle material is then laminated with the two outermost PET fabrics; S2: Confirm the thickness of the sheet. The thickness of the ABS sheet is 0.16 mm, the thickness of the PET sheet is 0.1 mm, and the thickness of the ceramic-metal hybrid shielding fiber sheet is 0.1-0.15 mm; S3: After applying glue on the PET layer facing the ABS layer, the PET protective layer and the ABS layer are laminated and compounded; S4: Take a ceramic-metal hybrid shielding fiber monolith and apply glue to the antenna chip on the side of the ceramic-metal hybrid shielding fiber monolith facing the COB; S5: After applying glue on the ABS layer facing the matched COB antenna chip, the ABS protective layer and the COB antenna chip layer are laminated and compounded; and at the same time, a raised mark is made on the PET layer on the side where the ceramic metal hybrid shielding fiber single sheet is provided; S6: Then, glue the remaining PET layer and ABS layer on both sides of the antenna chip respectively; S7: stacking the sheets in the order in which they were stacked and bonded in step S6; after the stacking is completed, laminating is performed once and heating is performed to a high temperature; S8: Then, the pressure is increased and maintained for a certain period of time, and then the temperature is lowered. The pressure increase and the maintenance time are regarded as a cycle. After three cycles, it is determined that the raised mark is clearly visible, and finally the processing of the finished product is completed; In step S2, the total thickness is 0.1+0.16+0.16+0.1+0.1=0.62 mm; In the step S7, the heating is performed to a high temperature of 150 degrees Celsius for a heating time of 200 to 300 seconds; In step S8, the pressure is increased to 70 Bar and maintained for 300 seconds; In step S8, the parameter setting of the laminating equipment needs to control the thickness of the intermediate material after lamination to be between 0.30-0.31 mm, that is, the thickness of the intermediate material near the chip position after lamination and cooling is 0.31 mm, and the thickness of the non-chip position is between 0.30-0.31 mm; In step S8, the temperature is lowered to 25 to 35 degrees Celsius.