Electronic device including a sound waveguide

Abstract

An electronic device is disclosed, which includes: a housing including a first surface, a second surface facing away from the first surface, and a side surface structure at least partially surrounding a space formed between the first surface and the second surface; a sound hole formed in the housing and configured to emit sound in a direction facing the first surface; a speaker disposed in the housing; and a first acoustic waveguide and a second acoustic waveguide together providing an acoustic path between the speaker and the sound hole, wherein the second acoustic waveguide is different from the first acoustic waveguide.

Description

Technical Field

[0001] Various embodiments of the present disclosure relate to audio output in an electronic device, and more particularly, to an electronic device having a sound waveguide for generating an audio channel within the electronic device. Background Art

[0002] The development of electronic communication technology has led to an integration trend, in which various functions are all included in a single electronic device. For example, a smart phone includes functions of a media player, an imaging device, and a scheduler / organizer, as well as traditional communication functions. In addition, additional functions can be implemented by installing any number of applications thereon. The use of portable electronic devices such as smart phones is now widespread, and the function integration of electronic devices is constantly becoming more complex to meet the diverse needs of users. Summary of the Invention

[0003] Technical Problem

[0004] An electronic device such as a smart phone may include a display on its front surface, and various additional devices may be provided around the active area ("active area" or "visible area") of the display (e.g., at the top of the front surface of the electronic device). For example, a receiver for voice calls, a camera for photographing an object, a sensor for identifying a user's face or iris, an infrared projector as a light source for measuring depth, and various sensors (such as a proximity sensor, an illuminance sensor, a temperature sensor, or an atmospheric pressure sensor) may be provided at the top of the front surface of the electronic device. Such electronic devices are increasingly used in the entertainment field, such as multimedia and games. For example, users' demands for the performance of electronic devices (such as a larger storage capacity, more advanced processor performance or communication speed, and improved image or sound quality) will increase. Various sensors or input / output devices of the electronic device can be used to meet such user demands.

[0005] Various additional devices installed on the front surface of the electronic device may provide: convenient functions (e.g., functions using a camera), such as taking selfies; security functions (e.g., functions using an infrared projector or a face or iris sensor), such as user identification; or operating environment functions (e.g., functions using a proximity sensor, a humidity sensor, a temperature / humidity or an atmospheric pressure sensor), such as for optimizing an operating state. However, in reality, when the entire front surface of the electronic device is designed or manufactured as the active area of the display to provide improved image quality (e.g., a larger screen and high-definition images), it may be difficult for such sensors to ensure a path for receiving or acquiring various information.

[0006] When an electronic device is equipped with a voice call function, a receiver may be disposed at the top of the front surface of the electronic device. An acoustic path connecting a speaker that outputs the sound (e.g., voice) of an incoming call and the receiver may be provided inside the electronic device to provide good call quality. However, as mentioned above, since other additional devices are disposed inside the upper end of the electronic device, it may be difficult to ensure the acoustic path connected to the receiver. For example, the voice call quality of the electronic device may deteriorate.

[0007] According to various embodiments, an electronic device may be provided that provides good voice call quality.

[0008] According to various embodiments, an electronic device may be provided that allows other additional devices to be easily arranged while providing an acoustic waveguide for transmitting the sound of an incoming call.

[0009]

Technical Solution

[0010] According to an embodiment, an electronic device includes: a housing including a first surface, a second surface facing away from the first surface, and a side surface structure at least partially surrounding a space formed between the first surface and the second surface; a sound hole formed in the housing and configured to emit sound in a direction facing the first surface; a speaker disposed in the housing; and a first acoustic waveguide and a second acoustic waveguide together providing an acoustic path between the speaker and the sound hole, wherein the second acoustic waveguide is different from the first acoustic waveguide.

[0011] According to an embodiment, an electronic device includes: a housing including a first surface, a second surface facing away from the first surface, and a side surface structure at least partially surrounding a space formed between the first surface and the second surface; a sound hole formed in the housing and configured to emit sound in a direction facing the first surface; a speaker disposed in the housing; an electronic component disposed inside the housing between the sound hole and the speaker; and a first acoustic waveguide bypassing the electronic component, the first acoustic waveguide and a second acoustic waveguide providing an acoustic path between the speaker and the sound hole, wherein the second acoustic waveguide is different from the first acoustic waveguide

[0012] Advantageous Effects

[0013] According to various embodiments, the electronic device may provide improved sound quality in a voice call by including a plurality of acoustic waveguides between a sound hole provided as a receiver and a speaker that outputs the sound of an incoming call. In one embodiment, other additional devices or electronic components may obtain a path for receiving or obtaining various information from the outside of the electronic device or outputting an optical signal through a space or region between the acoustic waveguides. For example, according to various embodiments, the electronic device may have other electronic components that can be easily placed therein, and may provide enhanced call quality in a voice call by providing a plurality of acoustic waveguides. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] When considered in conjunction with the accompanying drawings, a more complete understanding of the present disclosure and many of its attendant aspects will be readily obtained by reference to the following detailed description, as the present disclosure and many of its attendant aspects become better understood, wherein:

[0015] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment;

[0016] Figure 2 is a perspective view showing an electronic device according to an embodiment;

[0017] Figure 3 is a perspective view showing the electronic device as viewed from the rear;

[0018] Figure 4 is an exploded perspective view showing the electronic device according to an embodiment;

[0019] Figure 5 is an exploded perspective view showing the electronic device according to an embodiment;

[0020] Figure 6 is a plan view showing the front surface of the electronic device according to an embodiment;

[0021] Figure 7 is along Figure 6 a cross-sectional view of the electronic device taken along line S1;

[0022] Figure 8 is along Figure 6 a cross-sectional view of the electronic device taken along line S2;

[0023] Figure 9 is along Figure 6 a cross-sectional view of the electronic device taken along line S3;

[0024] Figure 10 is a perspective view showing an example pipe member in the electronic device according to an embodiment;

[0025] Figure 11 , Figure 12 and Figure 13 are views showing variations of the electronic device according to an embodiment; and

[0026] Figure 14 is a graph showing the acoustic characteristics of the electronic device according to an embodiment.

[0027] Throughout the drawings, the same reference numerals will be understood to refer to the same parts, components, and structures. DETAILED DESCRIPTION

[0028] Figure 1 is a block diagram showing an electronic device 1001 in a network environment 1000 according to various embodiments. Refer to Figure 1 , the electronic device 1001 in the network environment 1000 may communicate with the electronic device 1002 via a first network 1098 (e.g., a short-range wireless communication network), or communicate with the electronic device 1004 or the server 1008 via a second network 1099 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 1001 may communicate with the electronic device 1004 via the server 1008. According to an embodiment, the electronic device 1001 may include a processor 1020, a memory 1030, an input device 1050, a sound output device 1055, a display device 1060, an audio module 1070, a sensor module 1076, an interface 1077, a haptic module 1079, a camera module 1080, a power management module 1088, a battery 1089, a communication module 1090, a subscriber identification module (SIM) 1096, or an antenna module 1097. In some embodiments, at least one of the components (e.g., the display device 1060 or the camera module 1080) may be omitted from the electronic device 1001, or one or more other components may be added to the electronic device 1001. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 1076 (e.g., a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented as being embedded in the display device 1060 (e.g., a display).

[0029] The processor 1020 may run software (e.g., program 1040) to control at least one other component (e.g., a hardware component or a software component) connected to the electronic device 1001 and may perform various data processing or computations. According to one embodiment, as at least part of the data processing or computation, the processor 1020 may load commands or data received from another component (e.g., the sensor module 1076 or the communication module 1090) into the volatile memory 1032, process the commands or data stored in the volatile memory 1032, and store the resulting data in the non-volatile memory 1034. According to an embodiment, the processor 1020 may include a main processor 1021 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 1023 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent of or combined with the main processor 1021. Additionally or alternatively, the auxiliary processor 1023 may be adapted to consume less power than the main processor 1021 or be adapted for a specific function. The auxiliary processor 1023 may be implemented as separate from the main processor 1021 or as part of the main processor 1021.

[0030] When the main processor 1021 is in an inactive (e.g., sleep) state, the auxiliary processor 1023 rather than the main processor 1021 may control at least some of the functions or states related to at least one of the components of the electronic device 1001 (e.g., the display device 1060, the sensor module 1076, or the communication module 1090), or when the main processor 1021 is in an active state (e.g., running an application), the auxiliary processor 1023 may control at least some of the functions or states related to at least one of the components of the electronic device 1001 (e.g., the display device 1060, the sensor module 1076, or the communication module 1090) together with the main processor 1021. According to an embodiment, the auxiliary processor 1023 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 1080 or the communication module 1090) that is functionally related to the auxiliary processor 1023.

[0031] The memory 1030 may store various data used by at least one component of the electronic device 1001 (e.g., the processor 1020 or the sensor module 1076). The various data may include, for example, software (e.g., program 1040) and input data or output data for commands related thereto. The memory 1030 may include a volatile memory 1032 or a non-volatile memory 1034.

[0032] The program 1040 may be stored as software in the memory 1030, and the program 1040 may include, for example, an operating system (OS) 1042, middleware 1044, or an application 1046.

[0033] The input device 1050 may receive commands or data to be used by other components (e.g., the processor 1020) of the electronic device 1001 from the outside of the electronic device 1001 (e.g., a user). The input device 1050 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0034] The sound output device 1055 may output a sound signal to the outside of the electronic device 1001. The sound output device 1055 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing a record, and the receiver may be used for incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of the speaker.

[0035] The display device 1060 may visually provide information to the outside of the electronic device 1001 (e.g., a user). The display device 1060 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 1060 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the intensity of a force caused by the touch.

[0036] The audio module 1070 may convert sound into an electrical signal and vice versa. According to an embodiment, the audio module 1070 may obtain sound via the input device 1050, or output sound via the sound output device 1055 or a headset of an external electronic device (e.g., the electronic device 1002) directly (e.g., wiredly) or wirelessly connected to the electronic device 1001.

[0037] The sensor module 1076 may detect an operating state of the electronic device 1001 (e.g., power or temperature) or an environmental state outside the electronic device 1001 (e.g., the state of a user), and then generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 1076 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0038] Interface 1077 may support one or more specific protocols for directly (e.g., wired) or wirelessly connecting the electronic device 1001 to an external electronic device (e.g., electronic device 1002). According to an embodiment, interface 1077 may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0039] Connection end 1078 may include a connector through which the electronic device 1001 may be physically connected to an external electronic device (e.g., electronic device 1002). According to an embodiment, connection end 1078 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0040] The haptic module 1079 may convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be recognized by the user through his sense of touch or kinesthesia. According to an embodiment, the haptic module 1079 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0041] The camera module 1080 may capture still images or moving images. According to an embodiment, the camera module 1080 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0042] The power management module 1088 may manage the power supply to the electronic device 1001. According to an embodiment, the power management module 1088 may be implemented as at least part of, for example, a Power Management Integrated Circuit (PMIC).

[0043] The battery 1089 may supply power to at least one component of the electronic device 1001. According to an embodiment, the battery 1089 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0044] The communication module 1090 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 1001 and an external electronic device (e.g., the electronic device 1002, the electronic device 1004, or the server 1008), and perform communication via the established communication channel. The communication module 1090 may include one or more communication processors capable of operating independently of the processor 1020 (e.g., an application processor (AP)), and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 1090 may include a wireless communication module 1092 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1094 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). Each corresponding one of these communication modules may communicate with an external electronic device via a first network 1098 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 1099 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or these various types of communication modules may be implemented as multiple separate components (e.g., multiple chips). The wireless communication module 1092 may identify and authenticate the electronic device 1001 in a communication network (such as the first network 1098 or the second network 1099) using user information (e.g., an international mobile subscriber identity (IMSI)) stored in the user identification module 1096.

[0045] The antenna module 1097 may transmit a signal or power to the outside of the electronic device 1001 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 1001 (e.g., an external electronic device). According to an embodiment, the antenna module may include an antenna, and the antenna includes a radiating element composed of a conductive material or a conductive pattern formed in a substrate (e.g., a printed circuit board (PCB)) or formed on the substrate. According to an embodiment, the antenna module 1097 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 1098 or the second network 1099) may be selected from the plurality of antennas by, for example, the communication module 1090 (e.g., the wireless communication module 1092). Subsequently, a signal or power may be transmitted or received between the communication module 1090 and an external electronic device via the selected at least one antenna. According to an embodiment, additional components (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 1097.

[0046] At least some of the above components may be interconnected via an inter-peripheral communication scheme (e.g., a bus, General-Purpose Input / Output (GPIO), Serial Peripheral Interface (SPI), or Mobile Industry Processor Interface (MIPI)) and communicate signals (e.g., commands or data) therebetween.

[0047] According to an embodiment, commands or data may be transmitted or received between the electronic device 1001 and an external electronic device 1004 via a server 1008 connected to a second network 1099. Each of the electronic devices 1002 and 1004 may be a device of the same type as the electronic device 1001 or a device of a different type from the electronic device 1001. According to an embodiment, all or some of the operations running on the electronic device 1001 may be run on one or more of the external electronic devices 1002, 1004, or 1008. For example, if the electronic device 1001 is to automatically perform a function or service or is to perform a function or service in response to a request from a user or another device, the electronic device 1001 may request at least a part of the function or service to be performed by the one or more external electronic devices instead of running the function or service, or in addition to running the function or service, the electronic device 1001 may also request at least a part of the function or service to be performed by the one or more external electronic devices. The one or more external electronic devices that receive the request may perform the requested at least part of the function or service, or perform additional functions or additional services related to the request, and transmit the result of the execution to the electronic device 1001. The electronic device 1001 may provide the result as at least part of a reply to the request with or without further processing of the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0048] An electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the present disclosure, the electronic device is not limited to the electronic devices described above.

[0049] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for the corresponding embodiments. For the description of the drawings, like reference numerals may be used to refer to like or related elements. It will be understood that a singular noun corresponding to a term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any one or all possible combinations of the items listed together in the corresponding one of the plurality of phrases. As used herein, terms such as "first" and "second" or "1st" and "2nd" may be used to simply distinguish the corresponding components from another component, and do not limit the components in other respects (e.g., importance or order). It will be understood that in the case where the terms "operatively" or "communicatively" are used or where the terms "operatively" or "communicatively" are not used, if an element (e.g., a first element) is referred to as "coupled with another element (e.g., a second element)", "coupled to another element (e.g., a second element)", "connected with another element (e.g., a second element)", or "connected to another element (e.g., a second element)", it means that the one element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0050] As used herein, the term "module" may include a unit implemented in hardware, software, or firmware and may be used interchangeably with other terms (e.g., "logic", "logic block", "portion", or "circuit"). A module may be a single integrated component adapted to perform one or more functions or the smallest unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0051] The various embodiments described herein can be implemented as software (e.g., program 1040) including one or more instructions stored in a storage medium (e.g., internal memory 1036 or external memory 1038) readable by a machine (e.g., electronic device 1001). For example, under the control of a processor, a processor (e.g., processor 1020) of the machine (e.g., electronic device 1001) can call at least one of the one or more instructions stored in the storage medium and run the at least one instruction with or without using one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions can include code generated by a compiler or code that can be run by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. Herein, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being stored temporarily in the storage medium.

[0052] According to an embodiment, a method according to various embodiments of the present disclosure can be included and provided in a computer program product. The computer program product can be traded between a seller and a purchaser as a product. The computer program product can be published in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or can be published online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM), or can be directly distributed (e.g., downloaded or uploaded) between two user devices (e.g., smart phones). If it is published online, at least part of the computer program product can be generated temporarily, or at least part of the computer program product can be stored at least temporarily in a machine-readable storage medium (such as the memory of a manufacturer's server, an application store's server, or a forwarding server).

[0053] According to various embodiments, each of the above components (e.g., a module or a program) may include a single entity or multiple entities. According to various embodiments, one or more of the above components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding one of the multiple components performed one or more functions before integration. According to various embodiments, operations performed by a module, a program, or another component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0054] Figure 2 is a perspective view showing an electronic device 100 according to an embodiment. Figure 3 is a perspective view of the electronic device 100 shown as viewed from the rear. Figure 2 of the electronic device 100.

[0055] Referring to Figure 2 and Figure 3 , according to an embodiment, the electronic device 100 may include a housing 110 having a first (or front) surface 110A, a second (or rear) surface 110B, and side surfaces (or sidewalls) 110C surrounding a space between the first surface 110A and the second surface 110B. According to another embodiment (not shown), the housing 110 may represent a structure forming Figure 2 parts of the first surface 110A, the second surface 110B, and the side surfaces 110C.

[0056] According to an embodiment, at least a portion of the first surface 110A may have a substantially transparent front plate 102 (e.g., a glass plate or a polymer plate including various coatings). According to an embodiment, the front plate 102 may include a curved portion that curves from the first surface 110A to the rear surface 111 at least at one side edge portion and extends seamlessly.

[0057] According to an embodiment, the second surface 110B may be formed of a substantially opaque back plate 111. The back plate 111 may be formed of, for example, laminated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two thereof. According to an embodiment, the back plate 111 may include a curved portion that curves from the second surface 110B to the front surface 102 at least at one side edge portion and extends seamlessly.

[0058] According to an embodiment, the side surface 110C may be formed by a side surface structure (or "side member" or "side wall") 118 that is coupled to the front plate 102 and the rear plate 111 and includes metal and / or polymer. According to an embodiment, the rear plate 111 and the side surface structure 118 may be integrally formed together and include the same material (e.g., metal such as aluminum).

[0059] According to an embodiment, the electronic device 100 may include at least one or more of a display 101, audio modules 103 and 114, a sensor module, an opening area 105 (e.g., Figure 2 optical hole 205), a key input device 117, and a connector hole 108. According to an embodiment, the electronic device 100 may embed an optical module (e.g., a camera module, a light source, a proximity sensor, or an illuminance sensor) corresponding to the opening area 105. The opening area 105 may be located at the top of the electronic device 100 and may be formed in a central portion of the front surface (e.g., the first surface 110A) in the width direction (e.g., Figure 4 X direction in Figure 4 ), or the length direction (e.g., Figure 13 Y direction in Figure 2The optical hole 205) may be omitted or may be substantially part of the active area VA of the display 101. According to an embodiment, the electronic device 100 may not include at least one of the components (e.g., the key input device 117) or may add other components. For example, the electronic device 100 may include a sensor module (not shown). For example, in the area provided by the front plate 102, a proximity sensor or an illuminance sensor may be integrated in the display 101 or disposed at a position adjacent to the display 101. According to an embodiment, the electronic device 100 may further include a light emitting element, and the light emitting element may be disposed at a position adjacent to the display 101 in the area provided by the front plate 102. The light emitting element may provide information about the state of the electronic device 100, for example, in the form of light. According to an embodiment, the light emitting element may provide a light source that cooperates with the operation of an optical module (e.g., a camera module) disposed in the opening area 105. The light emitting element may include, for example, a light emitting device (LED), an infrared (IR) LED, or a xenon lamp.

[0060] The display 101 may be visually exposed through most of the front plate 102. According to an embodiment, the edge of the display 101 may be formed to be substantially the same in shape as the adjacent outer edge of the front plate 102. According to an embodiment (not shown), the interval between the outer edge of the display 101 and the outer edge of the front plate 102 may be kept substantially uniform to give the display 101 a larger exposure area. For example, when viewed from the top of the front plate 102, the screen display area VA of the display 101 and the peripheral area PA (e.g., the black matrix area) formed around the screen display area VA may substantially form the front surface (e.g., the first surface 110A) of the electronic device 100, and the area of the screen display area VA may be 90% or more, substantially 100%, of the area of the first surface 110A. According to an embodiment, a depression or an opening (e.g., the opening area 105) may be formed in a part of the screen display area VA of the display 101, and other electronic components, such as a camera module, a proximity sensor, or an illuminance sensor (not shown), may be included and aligned with the depression or the opening (e.g., the opening area 105). In another embodiment, the other electronic components aligned with the depression or the opening may include at least one of an infrared projector, an iris sensor, a gesture sensor, an infrared sensor, a temperature sensor, a humidity sensor, and an atmospheric pressure sensor.

[0061] According to an embodiment, at least one or more of the camera modules 112 or 113, the fingerprint sensor 116, and the flash 106 may be included on the rear surface of the screen display area VA of the display 101. According to an embodiment (not shown), the display 101 may be set to be coupled or adjacent to a touch detection circuit, a pressure sensor capable of measuring the touch intensity (pressure), and / or a digitizer for detecting a magnetic field type stylus.

[0062] The audio modules 103 and 114 may include a microphone hole and a speaker hole. The microphone hole may have a microphone inside to obtain external sounds. According to an embodiment, there may be multiple microphones to be able to detect the direction of the sound. According to an embodiment, the speaker hole and the microphone hole may be implemented as a single hole, or a speaker may be included without a speaker hole (e.g., a piezoelectric speaker). The speaker hole may include an external speaker hole and a phone receiver hole 114 (e.g., Figure 6 the sound hole 313).

[0063] The electronic device 100 may include a sensor module (not shown) and thus may generate an electrical signal or a data value corresponding to an internal operation state or an external environmental state of the electronic device. The sensor module may include a proximity sensor disposed on the first surface 110A of the housing 110, a fingerprint sensor integrated with or adjacent to the display 101, and / or a biometric sensor (e.g., a heart rate monitor (HRM) sensor) disposed on the second surface 110B of the housing 110. The electronic device 100 may also include a sensor module (not shown), such as at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0064] The camera modules 112, 113, and 106 may include a first camera device (e.g., a camera module corresponding to the opening area 105) disposed on the first surface 110A of the electronic device 100 and a second camera device 112 and 113 and a flash 106 disposed on the second surface 110B. The camera modules 112 and 113 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 106 may include, for example, a light emitting diode (LED) or a xenon lamp. According to an embodiment, two or more lenses (an infrared (IR) camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 100.

[0065] The key input device 117 may be disposed on the side surface 110C of the housing 110. According to an embodiment, the electronic device 100 may not include all or some of the above key input devices 117, and the key input devices 117 not included may be implemented in another form (e.g., as soft keys) on the display 101. According to an embodiment, the key input device may include at least a part of the fingerprint sensor 116 disposed on the second surface 110B of the housing 110.

[0066] The connector hole 108 may receive a connector for transmitting power and / or data to / from an external electronic device and / or a connector for transmitting an audio signal to / receiving an audio signal from an external electronic device. For example, the connector hole 108 may include a Universal Serial Bus (USB) connector or a headphone jack.

[0067] Figure 4 is an exploded perspective view showing an electronic device 200 (e.g., Figure 1 electronic device 100) according to an embodiment.

[0068] Referring to Figure 4 , the electronic device 200 may include a side surface structure 210 (e.g., Figure 2 side surface structure 118), an intermediate plate (e.g., member 211 (e.g., a support plate or bracket)), a front plate 220 (e.g., Figure 2 front plate 102), a display 230 (e.g., Figure 1 display 101), a printed circuit board 240, a battery 250, and a rear plate 280. According to an embodiment, the display 230 may be disposed between the front plate 220 and the rear plate 280. The printed circuit board 240 may be disposed behind the display 230 (e.g., between the display 230 and the rear plate 280) in the thickness direction Z of the electronic device 200. According to an embodiment, a support member 211 may be disposed between the display 230 and the printed circuit board 240 to provide an electromagnetic isolation structure between the display 230 and the printed circuit board 240. According to an embodiment, the electronic device 200 may not include at least one of the components (e.g., the support member 211) or may add other components. At least one component of the electronic device 200 may be the same as or similar to Figure 2 or Figure 3 at least one component of the electronic device 100, and will not be described repeatedly below.

[0069] In one embodiment, when viewed from the top of the front plate 220, an opening area 205 (e.g., Figure 2 opening area 105) formed in the display 230 may be located at the upper end of the electronic device 200. For example, the opening area 205 may be formed in the central portion of the electronic device 200 in the width direction X of the electronic device 200. In various embodiments, the term "opening area" may refer to an area formed by passing through the display 230 (e.g., Figure 2The area formed by the holes of the display 101). In some embodiments, the term "opening area" may refer to a transparent area surrounded by the screen display area VA and lacking pixels therein. For example, the opening area 205 may provide a path through which light enters the interior from the exterior of the front plate 220. According to an embodiment, the opening area 205 may provide a path through which light propagates from the interior to the exterior of the front plate 220. In another embodiment, the "open area (e.g., Figure 2 or Figure 4 the opening area 105 or 205)" may have a structure that transmits light but separates the interior and exterior spaces of the electronic device 100 or 200. In another embodiment, the "opening area" may have the shape of a physical or mechanical hole that connects the interior / exterior spaces of the electronic device 100 or 200 while transmitting light. For example, when the electronic device 100 or 200 includes a temperature sensor or a humidity sensor, information about the surrounding environment of the electronic device 100 or 200 may be detected through the opening area 105 or 205.

[0070] The support member 211 may be disposed inside the electronic device 200 to be connected to or integrated with the side surface structure 210. The support member 211 may be formed of, for example, a metal and / or a non-metallic material (e.g., a polymer). The display 230 may be joined to one surface of the support member 211, and the printed circuit board 240 may be joined to the opposite surface of the support member 211. A processor, a memory, and / or an interface (e.g., Figure 1 the processor 1020, the memory 1030, and / or the interface 1077) may be mounted on the printed circuit board 240. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing device, an image signal processor, a sensor hub processor, or a communication processor.

[0071] The memory may include, for example, a volatile or non-volatile memory.

[0072] The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device 200 to an external electronic device, and may include a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector.

[0073] The battery 250 may be a device for supplying power to at least one component of the electronic device 200. The battery 250 (e.g., Figure 1The battery 250 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 250 may be disposed on substantially the same plane as the printed circuit board 240. The battery 250 may be integrally or removably disposed inside the electronic device 200.

[0074] According to an embodiment, the electronic device 200 may include a speaker 221a connected to a receiver (e.g., an audio module or a phone receiver hole provided together with the Figure 2 module 114) and an electronic component 221b disposed corresponding to the opening area 205. For example, the speaker 221a may output sound (e.g., a voice or sound of an incoming call) to the outside of the electronic device 200 through at least one acoustic waveguide (e.g., Figure 1 the acoustic waveguides 415a and 415b) provided inside the housing 110 of the electronic device 200 (e.g., Figure 6 connected to a receiver (e.g., Figure 6 the sound hole 313).

[0075] The electronic component 221b accommodated in the housing 110 may emit an optical signal (e.g., infrared light) through the opening area 205 or receive or obtain an optical signal from the outside. For example, the electronic component 221b disposed corresponding to the opening area 205 may include at least one of an infrared projector, a gesture sensor, a proximity sensor, an illuminance sensor, a camera, an infrared sensor, and a facial or iris sensor. According to an embodiment, the electronic component 221b disposed corresponding to the opening area 205 may include at least one of a temperature sensor, a humidity sensor, and an atmospheric pressure sensor. When the electronic component 221b includes at least one of a temperature sensor, a humidity sensor, and an atmospheric pressure sensor, the opening area 205 may have a through-hole structure, and the electronic component 221b may use air as a medium to detect the external environment (e.g., temperature, humidity, or atmospheric pressure).

[0076] The electronic device 200 may further include at least one through-hole 211a and 211b formed in the support member 211. Among the through-holes, the first through-hole 211a may be formed to correspond to the speaker 221a. For example, the speaker 221a may be disposed at the rear of the electronic device 200 behind the support member 211 (e.g., between the support member 211 and the rear plate 280), and radiate sound to the front of the support member 211 through the first through-hole 211a. Among the through-holes, the second through-hole 211b may be formed to correspond to the electronic component 221b. For example, the electronic component 221b may be disposed at the rear of the electronic device 200 between the sound hole 313 and the speaker 221a behind the support member 211 (e.g., between the support member 211 and the rear plate 280), and radiate an optical signal to the front of the support member 211 or receive or obtain various information about the external environment from the front of the support member 211 through the second through-hole 211b.

[0077] When describing the following embodiments, components that are easily understood from the descriptions of the electronic devices 100 and 200 according to the above embodiments may be represented with or without the same reference numerals, and their detailed descriptions may be skipped. When describing the following embodiments, for the sake of detailed description or simplicity of the drawings, reference may be made to the drawings or configurations related to the above embodiments.

[0078] Figure 5 is an exploded perspective view showing an electronic device 300 (e.g., Figures 1 to 4 the electronic devices 1000, 100, and 200) according to an embodiment. Figure 6 is a plan view showing the front surface of the electronic device 300 according to an embodiment.

[0079] Referring to Figure 5 and Figure 6, the electronic device 300 may include a plurality of acoustic waveguides 415a and 415b that connect a connection slit (e.g., sound hole 313) and a speaker 221a. In one embodiment, the sound hole 313 may extend in the X direction and may be formed as a slit having a width measured in the Y direction of about 0.5 mm or less. According to an embodiment, the acoustic waveguides 415a and 415b may help form an acoustic propagation path from the speaker 221a to the sound hole 313 and may be interpreted as including a first through hole 211a. In one embodiment, the first acoustic waveguide 415a is connected from the first through hole 211a to one side of the sound hole 313 while bypassing the second through hole 211b, and the second acoustic waveguide 415b may be connected from the first through hole 211a to the other side of the sound hole 313 while bypassing the second through hole 211b. For example, the sound output from the speaker 221a (e.g., the voice or sound signal of an incoming phone call) may propagate to the sound hole 313 through the first through hole 211a and the first acoustic waveguide 415a or via the first through hole 211a and the second acoustic waveguide 415b, and is thus radiated to the external environment of the device (e.g., in the direction facing the first surface 110A of Figure 2 ). For example, the electronic device 300 may include a plurality of acoustic waveguides 415a and 415b. Although having a relatively small size (e.g., a width of about 0.5 mm or less), the plurality of acoustic waveguides 415a and 415b may transmit a specific volume level (e.g., the incoming call sound) through the sound hole 313.

[0080] According to an embodiment, the sound hole 313 may be at least partially defined by a first notch portion 313a formed on the inner wall of the side surface structure 210. For example, a part of the inner wall of the side surface structure 210 may at least partially surround the sound hole 313 by including a notch structure. According to an embodiment, a part of the sound hole 313 may be defined by the front plate 220 or a display (e.g., Figure 4 display 230). For example, when the front plate 220 is coupled to the side surface structure 210 or the support member 211, the sound hole 313 may be completed by the first notch portion 313a and the front plate 220 (or the display 230). In one embodiment, the sound hole 313 may have a slit shape extending in the width direction (e.g., along the Figure 1 direction X) or the length direction (e.g., along the Figure 4 direction Y) of the electronic device 300 (or Figure 4 the housing 110). Advantageously, the disclosed sound hole 313 may emit an incoming call sound (e.g., the voice of the caller) having a sufficient volume required for a call while having little impact on the size of the electronic device 300.

[0081] According to an embodiment, the front plate 220 (or the display 230) may include a second notch portion 313b corresponding to the first notch portion 313a. For example, the sound hole 313 may be formed by substantially combining the first notch portion 313a and the second notch portion 313b. Although, according to the present embodiment, the sound hole 313 is completed by combining the side surface structure 210 and the front plate 220 (or the display 230), embodiments of the present disclosure are not limited thereto. For example, in Figure 11 and Figure 12 the embodiments disclosed in, the sound hole 613 or 713 may be formed in the side surface structure 210 itself or in the front plate 220 (or the display 230) itself.

[0082] According to an embodiment, the mesh member 323 may be coupled to the sound hole 313. The mesh member 323 may be provided to close a part of the sound hole 313, which may prevent foreign substances from entering the sound hole 313. The mesh member 323 includes a mesh structure and / or a plurality of pores or micropores, thereby preventing foreign substances in the external environment from entering the sound hole 313 and interfering with the sound transmitted to the outside of the electronic device 300 through the (multiple) acoustic waveguides 415a and 415b. In this embodiment, although the sound hole 313 and the mesh member 323 are shown as separate structures, the sound hole 313 may be interpreted as a structure including the mesh member 323, and in another embodiment, the mesh member 323 may be omitted.

[0083] According to an embodiment, the electronic device 300 may further include a recessed portion 315 formed in the support member 211 (e.g., Figure 4 the support member 211). The recessed portion 315 may be formed in the support member 211 on a surface facing the first surface (e.g., Figure 2 the first surface 110A), and the display (e.g., Figure 4 the display 230) or the front plate 220 may be coupled to the front surface of the support member 211 to hide at least a part of the recessed portion 315. For example, when the front plate 220 is coupled to the support member 211, the space provided by the recessed portion 315 may substantially form at least a part of the first acoustic waveguide 415a or the second acoustic waveguide 415b. For example, the recessed portion 315 may surround at least a part of the first acoustic waveguide 415a by including a first recessed portion 315a formed on one side of the second through hole 211b, and may surround at least a part of the second acoustic waveguide 415b by including a second recessed portion 315b formed on the other side of the second through hole 211b.

[0084] According to an embodiment, the first acoustic waveguide 415a may be connected to the first portion P1 of the slit on one side of the sound hole 313, and the second acoustic waveguide 415b may be connected to the second portion P2 of the slit on the other side of the sound hole 313. In an embodiment, the first portion P1 and the second portion P2 may be symmetrically positioned with respect to the central portion C of the slit. In an embodiment, the first acoustic waveguide 415a and the second acoustic waveguide 415b may have different shapes or sizes, and the lengths of the paths through which sound actually propagates may be different. In an embodiment, the difference between the length of the acoustic path provided by the first acoustic waveguide 415a and the length of the acoustic path provided by the second acoustic waveguide 415b may be limited to about 20 mm or less. By limiting the difference in the lengths of the acoustic paths to a certain extent (e.g., within about 20 mm), interference between the sound reaching the sound hole via the first acoustic waveguide 415a and the sound reaching the sound hole 313 via the second acoustic waveguide 415b can be suppressed.

[0085] According to an embodiment, compared to an electronic device having a single acoustic waveguide, an electronic device having multiple acoustic waveguides (e.g., the first acoustic waveguide 415a and the second acoustic waveguide 415b) may provide enhanced sound quality (e.g., sound pressure level). For example, the sound quality according to the alignment of the receiver (e.g., the sound hole 313) and the user's body (e.g., the ear or ear canal) can be improved. Table 1 below shows the measurement results of the sound quality (e.g., sound pressure level) in different structures or when the performance of the electronic components is the same but the number of acoustic waveguides is different.

[0086] In Table 1, "one acoustic waveguide" may refer to a structure of one acoustic waveguide including connection to one of the first point P1 and the second point P2 Figure 6 , and "two acoustic waveguides" may refer to a structure including the first acoustic waveguide 415a and the second acoustic waveguide 415b as shown in Figure 5 or Figure 6 . In Table 1, "center alignment" may refer to the state (hereinafter, "proper position") in which the point indicated by "C" in Figure 6 (e.g., the central portion of the sound hole 313) is aligned with the user's body, "left alignment" may refer to the state in which the point indicated by "C" in Figure 6 is aligned with the user's body a few millimeters to the left of the proper position, and "right alignment" may refer to the state in which the point indicated by "C" in Figure 6 is aligned with the user's body a few millimeters to the right of the proper position. In Table 1 below, the difference in the sound pressure level between the left alignment and the right alignment is caused by the difference in the connection positions of the acoustic waveguide and the sound hole, or by the difference in the shapes of the acoustic waveguides when multiple acoustic waveguides (e.g., the first acoustic waveguide 415a and the second acoustic waveguide 415b) are provided, and the sound level measurement may vary slightly depending on the actually manufactured product.

[0087]

Table 1

[0088] Left alignment Center alignment Right alignment One acoustic waveguide -0.85 dB -4.40 dB -5.56 dB Two acoustic waveguides -5.31 dB -6.78 dB -8.23 dB

[0089] As shown by the measurement results set forth in Table 1 above, the electronic device 300 according to an embodiment (e.g., Figures 1 to 6 electronic devices 1000, 100, and 200) includes a plurality of acoustic waveguides (e.g., a first acoustic waveguide 415a and a second acoustic waveguide 415b), and thus can provide an enhanced sound pressure level regardless of alignment as compared to an electronic device including a single acoustic waveguide. In an electronic device including one acoustic waveguide, there is a sound pressure level deviation of about 5 dB depending on the alignment between the sound hole and the user's body, but under the same operating performance conditions, the sound pressure level deviation in the electronic device 300 according to an embodiment can be improved to about 3 dB or less.

[0090] According to an embodiment, the electronic device 300 may include an adhesive member 303 that couples the front plate 220 (or the display 230) to the support member 211 (or the side surface structure 210). The adhesive member 303 may include a double-sided tape, such as a poron tape. In one embodiment, the adhesive member 303 generally attaches the edge of the front plate 220 (or the display 230) to the support member 211, thereby providing a waterproof structure between the front plate 220 and the support member 211. According to an embodiment, the adhesive member 303 may include a first adhesive member 331 and a second adhesive member 333. A portion of the first adhesive member 331 may be attached to the support member 211 in a region adjacent to the recessed portion 315. The second adhesive member 333 may be attached to the support member 211 around the second through-hole 211b and may be positioned adjacent to the recessed portion 315. For example, when viewed from the front surface of the electronic device 300 (e.g., Figure 2 the first surface 110A), the region between the first adhesive member 331 and the second adhesive member 333 may substantially at least partially overlap with the first recessed portion 315a or the second recessed portion 315b. According to an embodiment, the first adhesive member 331 and the second adhesive member 333 may be provided as a structure that defines portions of the first acoustic waveguide 415a and the second acoustic waveguide 415b. For example, the adhesive member 303 may be positioned to surround at least a portion of the first acoustic waveguide 415a and the second acoustic waveguide 415b. Further description of the structure that defines the first acoustic waveguide 415a and the second acoustic waveguide 415b is provided below with reference to Figures 7 to 9 FIGs.

[0091] Figure 7 FIG. Figure 6 is a cross-sectional view of the electronic device 300 taken along line S1 of Figure 8 FIG. Figure 6 is a cross-sectional view of the electronic device 300 taken along line S2 ofFigure 9 is taken along the Figure 6 line S3 and shows a cross-sectional view of the electronic device 300.

[0092] Referring to Figures 7 to 9 , the first through-hole 211a and the second through-hole 211b may be substantially aligned with each other in the length direction of the electronic device 300 (e.g., the Figure 5 Y direction). In one embodiment, the speaker 221a may be connected to the space formed by the recessed portion 315 through the first through-hole 211a, and the second through-hole 211b may be aligned with the opening area (e.g., the Figure 1 opening area 105). For example, the sound radiated from the speaker 221a may be transmitted through the first through-hole 211a into the space formed by the recessed portion 315, and the electronic component 221b may detect information related to the external environment of the electronic device 300 through the second through-hole 211b and / or the optical hole 205. In one embodiment, the electronic component 221b may receive or detect information about the external environment of the electronic device 300 through the area or space between the first acoustic waveguide 415a and the second acoustic waveguide 415b (e.g., the second through-hole 211b). In another embodiment, the electronic component 221b may include a light source such as an infrared projector, and the electronic component 221b may radiate a signal (e.g., an optical signal) to the outside of the electronic device 300 through the area or space between the first acoustic waveguide 415a and the second acoustic waveguide 415b. According to another embodiment, the second adhesive member 333 may include another through-hole 335 corresponding to the optical hole 205 or the second through-hole 211b, thereby providing an environment or a path for the electronic component 221b to detect the external environment. Here, the term "detecting the external environment" may be interpreted to include not only detecting illuminance, but also detecting the proximity of a user's body, a user's gesture, or the movement of an object or an object image.

[0093] According to an embodiment, the first acoustic waveguide 415a (or the second acoustic waveguide 415b) may include a bottom surface provided by the first recessed portion 315a (or the second recessed portion 315b), an inner sidewall provided by the first recessed portion 315a (or the second recessed portion 315b) and the first bonding member 331 (or the second bonding member 333), and / or a top surface provided by the front plate 220 (or the display 230). For example, when the recessed portion 315 of the support member 211 (e.g., the first recessed portion 315a and the second recessed portion 315b), the bonding member 303 (e.g., the first bonding member 331 and the second bonding member 333), and / or the front plate 220 (or the display 230) can be combined, the first acoustic waveguide 415a and the second acoustic waveguide 415b can be formed. In an embodiment, the first acoustic waveguide 415a and the second acoustic waveguide 415b may be at least partially located between the display 230 and the support member 211, and may connect the speaker 221a (or the first through hole 211a) to the slit (e.g., the sound hole 313), so as to transmit the sound output from the speaker 221a to the sound hole 313.

[0094] According to an embodiment, when the recessed portion 315 has a certain depth, the bonding member 303 may have a thickness sufficient to attach the front plate 220 (or the display 230) to the support member 211. For example, the bonding member 303 on the inner wall of the first acoustic waveguide 415a or the second acoustic waveguide 415b may be too thin to be recognized by the naked eye. In this case, the inner wall of the first acoustic waveguide 415a or the second acoustic waveguide 415b may be substantially formed by the inner wall of the first recessed portion 315a or the second recessed portion 315b. In another embodiment, the bonding member 303 may have a thickness sufficient to form the first acoustic waveguide 415a or the second acoustic waveguide 415b. When the bonding member 303 has a sufficient thickness required to form the first acoustic waveguide 415a or the second acoustic waveguide 415b, the first recessed portion 315a or the second recessed portion 315b may be formed to have a depth too small to be recognized by the naked eye, or may be completely omitted. In this case, the inner wall of the first acoustic waveguide 415a or the second acoustic waveguide 415b may be substantially formed by the bonding member 303.

[0095] According to an embodiment, when viewed from the front surface of the electronic device 300 (e.g., Figure 2 the first surface 110A), a part of the first acoustic waveguide 415a or a part of the second acoustic waveguide 415b may overlap with the electronic component 221b. For example, as Figure 9 shown, in the depth direction of the electronic device 300 (e.g., Figure 4A portion of the first acoustic waveguide 415a or a portion of the second acoustic waveguide 415b in the thickness direction (or the Z direction) may be located between the front plate 220 (or the display 230) and the electronic component 221b. According to an embodiment, the first acoustic waveguide 415a and the second acoustic waveguide 415b may be formed by forming a recessed portion 315 in the support member 211 or by the shape of the bonding member 303, rather than using a separate component or structure. According to an embodiment, the electronic device 300 may include a plurality of acoustic waveguides (e.g., the first acoustic waveguide 415a and the second acoustic waveguide 415b), wherein the shape of the support member 211, the front plate 220 (or the display 230), and / or the support member 303 is at least partially changed. For example, without substantially changing the structure, size, or shape of the electronic device 300 according to the embodiment, and as described above, the electronic device 300 may provide improved acoustic performance by including a plurality of acoustic waveguides.

[0096] As described above, although the electronic component 221b is disposed between the speaker 221a and the acoustic hole 313, the electronic device 300 according to an embodiment (e.g., Figures 1 to 4 the electronic devices 1000, 100, and 200) may include acoustic waveguides (e.g., the first acoustic waveguide 415a and the second acoustic waveguide 415b) that bypass the optical hole 205 or the opening area 105 for the electronic component 221b, thereby facilitating good sound quality. According to an embodiment, since the electronic device 300 includes a plurality of acoustic waveguides, compared with a structure having a single acoustic waveguide, although the speaker performance is the same, the electronic device 300 may provide excellent volume, and the electronic device 300 may reduce the audio deviation (e.g., sound level difference) caused by the alignment between the acoustic hole 313 and the user's body.

[0097] Figure 10 is a perspective view showing an example duct member 515 in an electronic device according to an embodiment (e.g., Figures 1 to 9 the electronic devices 1000, 100, 200, and 300).

[0098] Referring to Figure 10 , the electronic device (e.g., Figures 5 to 9 the electronic device 300) may further include a duct member 515. The duct member 515 generally may include a third recessed portion 515a and a fourth recessed portion 515b corresponding to the recessed portion 315 (e.g., Figure 5 the first recessed portion 315a and the second recessed portion 315b). The duct member 515 may replace Figure 5Part of the bonding member 303. For example, the second bonding member 333 may be substantially replaced by a part of the duct member 515, and at least the part of the first bonding member 331 that is positioned adjacent to the first recessed portion 315a and the second recessed portion 315b may be replaced by another part of the duct member 515. For example, the duct member 515 may surround the acoustic waveguide (e.g., Figure 6 , Figure 8 or Figure 9 the first acoustic waveguide 415a and the second acoustic waveguide 415b therein), while replacing at least a part of the bonding member 303. In an embodiment, when the electronic device (e.g., Figures 5 to 9 the electronic device 300) includes the duct member 515, the recessed portions 315 (e.g., Figure 6 , Figure 8 or Figure 9 the first recessed portion 315a and the second recessed portion 315b) may be omitted when forming the acoustic waveguide (e.g., Figure 5 the first acoustic waveguide 415a and the second acoustic waveguide 415b). As described above, in the electronic device 300, when forming the acoustic waveguide (e.g., Figure 6 , Figure 8 or Figure 9 the first acoustic waveguide 415a and the second acoustic waveguide 415b), a separate component (e.g., the duct member 515) may be utilized, or in the absence of a separate component, a structure (e.g., the support member 211, the bonding member 303, the display 230, or the front plate 220) disposed around the space or region where the acoustic waveguide is to be formed may be used.

[0099] Figures 11 to 13 is a view showing variants 600, 700, and 800 of the electronic devices 1000, 100, 200, or 300 according to various embodiments, such as Figures 1 to 9 .

[0100] Referring to Figure 11 , the sound hole 613 of the electronic device 600 may include a slit defined by the side surface structure 210. For example, the sound hole 613 may be formed by the shape or structure of the side surface structure 210 itself. Referring to Figure 12 , the sound hole 713 of the electronic device 700 may include a slit formed to pass through the front plate 220 (or Figure 4 the display 230). For example, the sound hole 713 may be formed by the shape or structure of the front plate 220 (or the display 230) itself. Depending on the position of the sound hole 613 or 713 or the structure having the sound hole 613 or 713, when forming the acoustic waveguide (e.g., Figure 6 , Figure 8 or Figure 9The structures of the first acoustic waveguide 415a and the second acoustic waveguide 415b) (e.g., the recessed portion of the support member 211 (e.g., Figure 5 the recessed portion 315 in Figure 5 or the bonding member (e.g.,

[0101] Referring to Figure 13 , the electronic device 800 may further include a notch region NA formed in the active area VA of a display (e.g., Figure 4 the display 230 of

[0102] Figure 14 is a graph showing the acoustic characteristics of an electronic device (e.g., Figures 1 to 12 the electronic devices 1000, 100, 200, 300, 600, 700, and 800 of

[0103] Figure 14 is a graph showing the results of measuring the sound pressure level of an electronic device in an audible frequency band (e.g., a frequency band ranging from about 200 Hz to about 12,000 Hz), where "D1" indicates the sound pressure level of an electronic device provided with one acoustic waveguide, and "D2" indicates the sound pressure level of an electronic device including a plurality (e.g., two) of acoustic waveguides (e.g., Figure 5 or Figure 6 the electronic device 300 of Figure 14 As shown, it can be seen that, compared with an electronic device provided with one acoustic waveguide, an electronic device according to an embodiment (e.g., an electronic device provided with a plurality of acoustic waveguides) provides a greater sound pressure level over the entire audible frequency band. Although there are some differences depending on the frequency band, it can be recognized that by providing a plurality of acoustic waveguides, the sound pressure is increased by about 8 dB at about 12,000 Hz.

[0104] According to an embodiment, an electronic device (e.g., Figures 1 to 13 the electronic devices 1000, 100, 200, 300, 600, 700, and 800 of Figure 1 includes: a housing (e.g., Figure 2 the housing 110 of Figure 3 including a first surface (e.g., Figure 1 the first surface 110A ofFigure 4 lateral surface structure 210); sound holes (e.g., Figures 5 to 9 sound holes 313) of, formed in the housing and emitting sound in a direction facing the first surface; a speaker disposed in the housing (e.g., Figures 5 to 9 speaker 221a) of; a first acoustic waveguide (e.g., Figure 6 , Figure 8 or Figure 9 first acoustic waveguide 415a) of, providing an acoustic path between the speaker and the sound hole; and a second acoustic waveguide (e.g., Figure 6 , Figure 8 or Figure 9 second acoustic waveguide 415b) of, providing an acoustic path between the speaker and the sound hole, the second acoustic waveguide being different from the first acoustic waveguide.

[0105] According to an embodiment, the electronic device may further include a display disposed between the first surface and the second surface (e.g., Figure 5 display 230) of, and a support member disposed between the display and the second surface (e.g., Figures 5 to 9 support member 211) of. The first acoustic waveguide and the second acoustic waveguide may be at least partially located between the display and the support member.

[0106] According to an embodiment, the electronic device may further include an adhesive member (e.g., Figures 5 to 9 adhesive member 303) of that attaches the display to the support member. The adhesive member may be positioned to surround at least a portion of the first acoustic waveguide and the second acoustic waveguide.

[0107] According to an embodiment, the support member may include a recessed portion 315 formed in a surface facing the first surface. The recessed portion may be positioned to surround at least a portion of the first acoustic waveguide and the second acoustic waveguide.

[0108] According to an embodiment, the electronic device may further include an electronic component disposed in the housing (e.g., Figures 5 to 9 electronic component 221b) of. The electronic component may be configured to receive or detect information about the external environment of the electronic device through at least a portion of an area between the first acoustic waveguide and the second acoustic waveguide.

[0109] According to an embodiment, a portion of the first acoustic waveguide or a portion of the second acoustic waveguide may be located between the display and the electronic component.

[0110] According to an embodiment, the electronic device may further include a notch area (e.g., Figure 13 notch area NA) of formed inside an active area (e.g., Figure 13 active area VA) of the display, or an optical hole (e.g., Figures 5 to 9(optical hole 205). The electronic component may be disposed corresponding to the notch area or the optical hole.

[0111] According to an embodiment, the electronic component may include at least one of a camera, an infrared projector, a proximity sensor, an illuminance sensor, an iris sensor, a gesture sensor, an infrared sensor, a temperature sensor, a humidity sensor, and an atmospheric pressure sensor.

[0112] According to an embodiment, the sound hole may include a slit extending in the length direction (e.g., Figure 4 length direction Y) or the width direction (e.g., Figure 4 width direction X) of the housing.

[0113] According to an embodiment, the first acoustic waveguide may be connected to the first portion (e.g., Figure 6 first portion P1) of the slit, and the second acoustic waveguide may be connected to the second portion (e.g., Figure 6 second portion P2) of the slit. The first portion and the second portion may be symmetrically positioned about the central portion (e.g., Figure 6 central portion C) of the slit.

[0114] According to an embodiment, the electronic device may further include an electronic component disposed in the housing. The first acoustic waveguide may be connected to the first portion of the slit, and the second acoustic waveguide may be connected to the second portion of the slit. The electronic component may be configured to receive or detect information about the external environment of the electronic device through the region between the first acoustic waveguide and the second acoustic waveguide.

[0115] According to an embodiment, a part of the first acoustic waveguide or a part of the second acoustic waveguide may be located between the first surface and the electronic component.

[0116] According to an embodiment, the side surface structure may be formed to surround at least a part of the slit.

[0117] According to an embodiment, the electronic device may further include a front plate (e.g., Figures 5 to 9 front plate 220) coupled to the side surface structure to form the first surface. The front plate may be formed to surround at least a part of the slit.

[0118] According to an embodiment, the front plate may be formed to surround a part of the slit, and the side surface structure may be formed to surround the remaining part of the slit.

[0119] According to an embodiment, an electronic device includes: a housing including a first surface, a second surface facing away from the first surface, and a side surface structure at least partially surrounding a space between the first surface and the second surface; a sound hole formed in the housing and emitting sound in a direction facing the first surface; a speaker disposed in the housing; an electronic component disposed inside the housing between the sound hole and the speaker; a first acoustic waveguide formed to bypass the electronic component and provide an acoustic path between the speaker and the sound hole; and a second acoustic waveguide formed to bypass the electronic component and provide an acoustic path between the speaker and the sound hole, the second acoustic waveguide being different from the first acoustic waveguide.

[0120] According to an embodiment, the electronic component may be configured to receive or detect information about an external environment of the electronic device through a region between the first acoustic waveguide and the second acoustic waveguide.

[0121] According to an embodiment, the electronic device may further include a notch region formed in an active area of the display, or an optical hole at least partially surrounded by the active area of the display. The electronic component may be disposed corresponding to the notch region or the optical hole.

[0122] According to an embodiment, the electronic device may further include a display disposed between the first surface and the second surface, a support member disposed between the display and the second surface, and an adhesive member attaching the display to the support member. The adhesive member may be positioned to surround at least a portion of the first acoustic waveguide and the second acoustic waveguide between the display and the support member.

[0123] According to an embodiment, the electronic device may further include a mesh member mounted on the sound hole and exposed to the first surface.

[0124] Although the present disclosure has been shown and described with reference to exemplary embodiments thereof, those of ordinary skill in the art will appreciate that various changes in form and detail may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. An electronic device (1001) includes: A housing (110) including a first surface (110A), a second surface (110B) facing away from the first surface, and a side surface structure (110C) at least partially surrounding a space formed between the first surface and the second surface; An acoustic hole (313) formed in the housing and configured to emit sound in a direction facing the first surface; A speaker (1070) disposed in the housing; A first acoustic waveguide (415a) and a second acoustic waveguide (415b) together providing an acoustic path between the speaker and the acoustic hole, wherein the second acoustic waveguide is different from the first acoustic waveguide; A display (101) disposed between the first surface and the second surface; A support member (211) disposed between the display and the second surface; And An adhesive member (303) attaching the display to the support member, wherein the adhesive member is between the display and the support member and surrounds at least a portion of the first acoustic waveguide and the second acoustic waveguide, Wherein the adhesive member includes: A first adhesive member (331), wherein a portion of the first adhesive member is adjacently attached to the support member with a portion of the first acoustic waveguide and the second acoustic waveguide; and A second adhesive member (333) attached to the support member between the first acoustic waveguide and the second acoustic waveguide and separated from the first adhesive member by the first acoustic waveguide and the second acoustic waveguide, Wherein the first acoustic waveguide and the second acoustic waveguide are at least partially disposed between the display and the support member, Wherein the support member includes a recessed portion (315) formed in a front surface facing the first surface, and wherein the recessed portion surrounds at least a portion of the first acoustic waveguide and the second acoustic waveguide, The display (101) is coupled to the front surface of the support member (211) to hide at least a portion of the recessed portion (315), and wherein when the display (101) is coupled to the support member, a space provided by the recessed portion (315) forms at least a portion of the first acoustic waveguide or the second acoustic waveguide, and Wherein the electronic device further includes: An electronic component (221b) disposed in the housing, the electronic component (221b) being visually exposed to an external environment through a notch area or an optical hole provided in the display to capture an image; and A through hole (335) formed through the second adhesive member and aligned with the electronic component.

2. The electronic device according to claim 1, wherein the electronic component is configured to receive or detect information about an external environment of the electronic device through the through hole.

3. The electronic device according to claim 2, wherein a portion of the first acoustic waveguide or a portion of the second acoustic waveguide is disposed between the display and the electronic component.

4. The electronic device according to claim 2 further includes a notch area (NA) formed within the active area of the display, or an optical hole (205) at least partially surrounded by the active area of the display, wherein the electronic component is aligned with the notch area or the optical hole.

5. The electronic device according to claim 2, wherein the electronic component (221b) includes at least one of a camera (1080), an infrared projector (1060), a proximity sensor (1076), an illuminance sensor (1076), an iris sensor (1080), a gesture sensor (1076), an infrared sensor (1076), a temperature sensor (1076), a humidity sensor (1076), and an atmospheric pressure sensor (1076).

6. The electronic device according to claim 1, wherein the sound hole (313) includes a slit (313) extending along the length or width of the housing.

7. The electronic device according to claim 6, wherein the first sound wave is led to a first portion of the slit, and the second sound wave is led to a second portion of the slit, and wherein the first portion and the second portion are symmetrically arranged around a central portion of the slit.

8. The electronic device according to claim 6 further includes an electronic component (221b) disposed in the housing, wherein the first sound wave is led to a first portion of the slit, and the second sound wave is led to a second portion of the slit, and wherein the electronic component is configured to receive or detect information about the external environment of the electronic device through an area between the first sound waveguide and the second sound waveguide.

9. The electronic device according to claim 8, wherein a portion of the first sound waveguide or a portion of the second sound waveguide is disposed between the first surface and the electronic component.

10. The electronic device according to claim 6, wherein the side surface structure surrounds at least a portion of the slit.

11. The electronic device according to claim 6 further includes a front plate (102) coupled to the side surface structure to form the first surface, wherein the front plate surrounds at least a portion of the slit.

12. The electronic device according to claim 11, wherein the side surface structure is formed to surround a remaining portion of the slit, the remaining portion being different from the portion of the slit surrounded by the front plate.

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