A heat dissipation method and device

Abstract

The embodiment of the present application provides a heat dissipation method and device, the device comprises: a first liquid cooling plate, a second liquid cooling plate, at least one liquid pipeline, at least one heat dissipation fin, a driving pump and a fan; cooling liquid is built-in in the first liquid cooling plate and the second liquid cooling plate; the first liquid cooling plate is arranged on a chip to be cooled; the second liquid cooling plate is arranged on the first liquid cooling plate in a vertical direction at a set angle; the first liquid cooling plate and the second liquid cooling plate are communicated at a contact surface; the at least one liquid pipeline is used for exchanging the cooling liquid in the first liquid cooling plate and the second liquid cooling plate; the driving pump is arranged and is used for driving the cooling liquid to flow from the first liquid cooling plate to the second liquid cooling plate; and the at least one heat dissipation fin is arranged around the second liquid cooling plate according to an air duct direction. The device is used for improving the universality and heat dissipation efficiency of the heat dissipation device and reducing the space occupation of the equipment.

Description

Technical Field

[0001] The present application relates to the technical field of network equipment, and in particular to a heat dissipation method and device. Background Art

[0002] With the development of 5G communication technology and the continuous evolution of IT / switch equipment performance and service capabilities, the power consumption of individual chips (such as the heatsink chip and the switch chip) is increasing. Currently, switch chips consume over 500W and heatsink chips consume over 300W, essentially reaching the limits of conventional air cooling technology. The next generation of switch chips is expected to consume over 700W and heatsink chips over 400W. To address these high-power chips, air cooling alone is no longer sufficient to meet the thermal design requirements. To address this heat dissipation issue, liquid cooling technology has rapidly developed. Common liquid cooling technologies include cold plate cooling and immersion cooling. Immersion cooling requires strict immersion liquid selection, is expensive, and has significant limitations. While cold plate cooling is less demanding than immersion cooling in terms of liquid selection, its piping layout is complex, requiring more space for heat dissipation devices within the equipment, and lacks versatility.

[0003] Therefore, there is an urgent need for a heat dissipation method and device to improve the versatility and heat dissipation efficiency of the heat dissipation device and reduce the space occupied by the equipment. Summary of the Invention

[0004] The embodiments of the present application provide a heat dissipation method and device for improving the versatility and heat dissipation efficiency of the heat dissipation device and reducing the space occupied by the equipment.

[0005] In a first aspect, an embodiment of the present application provides a heat dissipation device, comprising: a first liquid cooling plate, a second liquid cooling plate, at least one liquid pipe, at least one heat dissipation fin, a drive pump, and a fan; the first liquid cooling plate and the second liquid cooling plate are provided with a built-in coolant;

[0006] The first liquid cooling plate is placed on the heat dissipation chip;

[0007] The second liquid cooling plate is arranged on the first liquid cooling plate at a set angle in the vertical direction; the first liquid cooling plate and the second liquid cooling plate are connected at a contact surface;

[0008] The at least one liquid pipe is used to exchange the cooling liquid in the first liquid cooling plate and the second liquid cooling plate;

[0009] The driving pump is configured to drive the cooling liquid to flow from the first liquid cooling plate to the second liquid cooling plate;

[0010] The at least one heat dissipation fin is arranged around the second liquid cooling plate in the direction of the air duct.

[0011] In the above device, a first liquid cooling plate is positioned above the heat-dissipating chip to absorb heat generated by the heat-dissipating chip. The cooling liquid, which has absorbed the heat from the heat-dissipating chip, is then transferred to a second liquid cooling plate via a liquid pipe. The second liquid cooling plate is positioned vertically at a set angle to the first liquid cooling plate. Driven by a drive pump, the cooling liquid in the second liquid cooling plate flows to the first liquid cooling plate to continue absorbing heat from the heat-dissipating chip. During this process, the cooling liquid in the second liquid cooling plate also flows to the first liquid cooling plate under the action of gravity, thereby conserving pump power. Furthermore, as the liquid cooling plate transfers the cooling liquid, which has absorbed the heat from the heat-dissipating chip, to the second liquid cooling plate, the cooling fins through which the liquid cooling plate passes effectively dissipate the heat, which is then removed from the device by a fan. In this manner, in devices with high heat-dissipating chips, a separate liquid cooling mechanism is provided for the heat-dissipating chip, which lowers its temperature. The fan then removes heat from the various heat-generating components in the device (including the heat-dissipating chip) and removes it from the device. This improves heat dissipation efficiency and reduces the space occupied by the heat dissipation device within the device, eliminating the need for piping and increasing the device's versatility.

[0012] Optionally, the second liquid cooling plate is perpendicular to the first liquid cooling plate; and the at least one heat dissipating fin is perpendicular to the second liquid cooling plate.

[0013] In this device, the second liquid cooling plate is perpendicular to the first, improving heat dissipation efficiency. This also reduces the resistance to the pump exchanging coolant between the first and second cooling plates, aided by both driving force and gravity. The fins are perpendicular to the second cooling plate, further improving heat dissipation efficiency.

[0014] Optionally, it includes: the first liquid pipeline is placed outside the at least one heat dissipation fin; the second liquid pipeline extends from the top of the second liquid cooling plate to the end of the heat dissipation fin and bends downward to pass through the at least one heat dissipation fin and connect with the first liquid cooling plate; the second liquid pipeline is the liquid pipeline in the at least one liquid pipeline except the first liquid pipeline.

[0015] In the above device, the liquid pipe extends from the top of the second liquid cooling plate to the end of the heat sink fins and bends, then passes through the heat sink fins to connect with the first liquid cooling plate. This increases the contact area between the liquid and the heat sink fins, transferring heat from the liquid to the heat sink fins more quickly, thereby improving the heat exchange efficiency of the device.

[0016] Optionally, the second liquid pipeline is perpendicular to the first liquid cooling plate.

[0017] In the above device, the second liquid pipeline is perpendicular to the first liquid cooling plate, and the second liquid pipeline is perpendicular to the heat dissipation fins, which can evenly dissipate heat and improve heat dissipation efficiency.

[0018] Optionally, it also includes: a temperature control chip, connected to the heat dissipated chip, the heat-generating device outside the heat dissipated chip in the equipment, the fan and the driving pump, and used to determine the speed of the fan and the pumping force of the driving pump according to the temperature of the heat dissipated chip and the heat-generating device.

[0019] In this device, the fluid flow rate and wind speed can be adjusted according to the temperature of the chip being cooled and other heat-generating devices, maximizing the advantages of air cooling and liquid cooling to meet the heat dissipation needs of the device's heat-generating components. Compared to traditional air cooling, heat pipes are more intelligent and have a stronger circulation.

[0020] Optionally, the drive pump is an angle drive pump, which is arranged on the PCB board where the heat dissipated chip is located, and is connected to the bottom of the first liquid pipeline, and the bottom of the first liquid pipeline is connected to one end of the first liquid cooling plate.

[0021] In the above device, the heat dissipation chip is also arranged on the PCB board. Generally, the heat dissipation chip is small in thickness, so the driving pump is arranged on the PCB board, so that the driving pump and the liquid cooling plate are in a flush space and connected to the bottom of the first liquid pipeline. The fan duct can also bring the heat of the driving pump out of the equipment, thereby increasing the service life of the pump.

[0022] Optionally, the driving pump is a DC brushless micro water pump, which is arranged in the middle position of the first liquid pipeline.

[0023] In the above device, the driving pump is arranged in the middle of the first liquid pipeline, and the driving pump and the liquid cooling plate are in a flush space, so the air duct of the fan can bring the heat of the driving pump out of the equipment, thereby increasing the service life of the pump.

[0024] Optionally, the method further includes: filling a gap between the first liquid cooling plate and the heat dissipated chip with thermal paste.

[0025] In the above device, the thermal conductive paste has a high thermal conductivity, which can accelerate the transfer of heat from the heat dissipated chip to the first liquid cooling plate.

[0026] Optionally, the method further includes: a baffle being provided in the first liquid cooling plate and / or the second liquid cooling plate.

[0027] In the above device, baffles are provided in the first liquid cooling plate and / or the second liquid cooling plate to disrupt the boundary layer of the wall of the first liquid cooling plate and / or the second liquid cooling plate, increase the area of ​​the inner wall of the liquid cooling plate, and improve the heat transfer coefficient.

[0028] In a second aspect, an embodiment of the present application provides an electronic device, wherein the device comprises any device as described in the first aspect.

[0029] In a third aspect, an embodiment of the present application provides a heat dissipation method, the method comprising:

[0030] Determining the temperature of the heat dissipated chip and a heat generating device outside the heat dissipated chip in the device, and generating a first control instruction and a second control instruction, wherein the first control instruction is used to control the fan speed and the second control instruction is used to control the pump force of the driving pump;

[0031] Based on the second control instruction, the driving pump pumps the coolant in the first liquid cooling plate through the liquid pipeline to the second liquid cooling plate, and pumps the coolant in the second liquid cooling plate to the first liquid cooling plate. The coolant in the first liquid cooling plate absorbs heat generated by the heat dissipation chip transferred by the thermal paste and becomes higher in temperature than the coolant in the second liquid cooling plate.

[0032] Based on the second control instruction, the heat dissipated from the second liquid cooling plate to the heat dissipation fins is brought out of the device through the fan.

[0033] In the above method, the heat dissipation chip can be cooled using coolant and fans, while other components can be cooled using fans, thereby improving heat dissipation efficiency and reducing the space occupied by the heat dissipation device in the equipment. Through the first and second control instructions, the fluid flow rate and wind speed can be adjusted according to the temperature of the heat dissipation chip and other heat-generating components, maximizing the advantages of air cooling and liquid cooling to meet the heat dissipation needs of the heat-generating components in the equipment. Compared with the heat pipe used in traditional air cooling, it is more intelligent and has a stronger circulation force.

[0034] These implementations or other implementations of the present application will be more concise and understandable in the description of the following embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0036] Figure 1 A schematic diagram of an air-cooled heat dissipation device in the prior art provided in an embodiment of the present application;

[0037] Figure 2 A schematic diagram of a liquid cooling device in the prior art provided in an embodiment of the present application;

[0038] Figure 3 A schematic diagram of a liquid cooling device in the prior art provided in an embodiment of the present application;

[0039] Figure 4A schematic diagram of a partial structure of a heat dissipation device provided in an embodiment of the present application;

[0040] Figure 5 A schematic diagram of a partial structure of a heat dissipation device provided in an embodiment of the present application;

[0041] Figure 6 A schematic diagram of the coolant flow direction and air duct of a heat dissipation device provided in an embodiment of the present application;

[0042] Figure 7 A schematic diagram of a partial structure of a heat dissipation device provided in an embodiment of the present application;

[0043] Figure 8 A schematic diagram of a partial structure of a heat dissipation device provided in an embodiment of the present application;

[0044] Figure 9 A schematic diagram of a heat dissipation method according to an embodiment of the present invention;

[0045] Figure 10 A schematic diagram of a heat dissipation device provided in an embodiment of the present application;

[0046] Figure 11 A schematic diagram of a heat dissipation device provided in an embodiment of the present application;

[0047] Figure 12 A schematic diagram of a heat dissipation device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0048] To make the objectives, technical solutions, and advantages of this application more clear, this application will be further described in detail below with reference to the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.

[0049] At present, most equipment still uses air cooling technology to dissipate heat, such as Figure 1 As shown, the device may include a power supply area, a hard disk area, an external card, memory, a CPU, and a fan area. The fan's air duct (Flow) can carry heat from the heat-generating components in the device out of the device. Therefore, the higher the device's power consumption, the more heat it generates. To improve heat exchange capacity, a fan with a higher speed is required for heat dissipation. However, fans with higher speeds often produce greater noise pollution, which has adverse effects on the health of manufacturers and users. Higher speeds also require greater power consumption and consume a lot of electricity. In addition, the fan's volume requirement is also relatively high, which increases the size of the device and is not conducive to the development trend of smaller devices.

[0050] To address this heat dissipation dilemma, liquid cooling technology has rapidly developed. Currently, there are two main types of liquid cooling: immersion cooling and cold plate cooling. Immersion cooling requires a high level of immersion liquid and is expensive, making it less widely used. Cold plate cooling, on the other hand, has lower requirements for the liquid, but it does impose significant limitations on the internal structure of the device. For example, cold plate cooling primarily comes in two types: open-circuit cold plates and loop cold plates.

[0051] Among them, the liquid pipe of the open-circuit cold plate extends from the inside of the device to transfer the coolant to the external cooling, and the device needs to be equipped with an external liquid cooling device, which increases the complexity of the device and is not easy to move. Moreover, if the liquid pipe extends from the front of the device, that is, from the side of the device panel, since the hard disk is generally arranged on the device panel side, in order to arrange the liquid pipe, some hard disks need to be removed, which will affect the performance of the system and the appearance of the device. If the liquid pipe extends from the back of the device, that is, from the side of the IO port of the device, such as Figure 2 As shown, heat-generating components in the device that require liquid cooling include memory and the CPU. Directing the coolant from the corresponding heat sinks through the device's I / O ports requires removing some I / O ports, which can also impact overall system performance. Furthermore, the large number of liquid pipes within the device is not only costly but also impacts the layout and heat dissipation of other components, increasing the risk of coolant leaks in the pipes.

[0052] Unlike open-circuit cold plates, which require layout changes on the panel or IO side of the equipment, loop-type cold plates do not require changes on the panel or IO side of the equipment, and have advantages in equipment structure design and mold opening costs. However, the current loop-type liquid cold plate structure is complex, such as Figure 3 As shown, the pump in the device corresponds to a cold plate, and the device chips, memory, CPU, power supply and heat exchanger that need heat dissipation are connected to the pump to convert high-temperature coolant and low-temperature coolant. As can be seen from the figure, the heat dissipation device occupies a large volume in the device, requires high pumping force from the pump, and affects the distribution of other components. If the liquid pipeline is blocked or the pump is damaged, it will immediately affect the normal operation of the equipment, and its reliability and maintainability are not high.

[0053] Based on the above, in order to save the volume occupied by the heat sink in the equipment, reduce the impact of the liquid pipeline layout on the internal device layout of the equipment, and improve the versatility of the equipment for installing the heat sink, a heat sink schematic diagram provided in an embodiment of the present application is as follows: Figure 4 As shown, it includes: a first liquid cooling plate, a second liquid cooling plate, at least one liquid pipe, at least one heat dissipation fin, a driving pump and a fan; the first liquid cooling plate and the second liquid cooling plate are built with cooling liquid;

[0054] The first liquid cooling plate is placed on the heat dissipation chip;

[0055] The second liquid cooling plate is arranged on the first liquid cooling plate at a set angle in the vertical direction; the first liquid cooling plate and the second liquid cooling plate are connected at a contact surface;

[0056] The at least one liquid pipe is used to exchange the cooling liquid in the first liquid cooling plate and the second liquid cooling plate;

[0057] The driving pump is configured to drive the cooling liquid to flow from the first liquid cooling plate to the second liquid cooling plate;

[0058] The at least one heat dissipation fin is arranged around the second liquid cooling plate in the direction of the air duct.

[0059] Here, the chip to be cooled can be any device that can generate heat, such as a memory chip, a CPU, etc.

[0060] Here we take the CPU as an example. Figure 4 FIG. 1 is a schematic diagram of a partial structure of a heat dissipation device provided in an embodiment of the present application (for ease of understanding the structure, Figure 4 Only the first liquid cooling plate, the second liquid cooling plate and the liquid pipeline are shown in the figure, and the driving pump, fan and heat dissipation fins will be described later). Among them, the first liquid cooling plate is arranged above the CPU of the device, and the internal cavity of the first liquid cooling plate is filled with cooling liquid; the internal cavity of the second liquid cooling plate is filled with cooling liquid, and the second liquid cooling plate is arranged on the first liquid cooling plate at a set angle in the vertical direction; the first liquid cooling plate and the second liquid cooling plate are connected at the contact surface, that is, the internal cavity of the first liquid cooling plate is connected to the internal cavity of the second liquid cooling plate. It should be noted that Figure 4 The vertical angle between the first and second liquid cooling plates is set to 90°, which is just an example and can also be 60°, 70°, etc. There is no specific limitation on the vertical angle between the first and second liquid cooling plates. At least one liquid pipe extends from the top of the second liquid cooling plate to the first liquid cooling plate, for exchanging the coolant in the first and second liquid cooling plates ( Figure 4 The figure shows that there are 7 at least one liquid pipeline, which is just an example and can be set to any number of liquid pipelines such as 2, 3, 4, 8, 9, etc. according to needs).

[0061] based on Figure 4 The embodiment of the present application provides a partial structure of a heat dissipation device, such as Figure 5As shown, the at least one heat sink fin is arranged around the second liquid cooling plate in the direction of the air duct. That is, the at least one heat sink fin is used to dissipate heat. The second liquid cooling plate can pass through the at least one heat sink fin, and the liquid pipeline passes through the at least one heat sink fin. This increases the contact area between the liquid pipeline and the liquid cooling plate and the heat sink fin, thereby improving heat dissipation efficiency. This describes only one type of heat sink fin, and the specific configuration of the heat sink fins is not limited. For example, the heat sink fins can also be circular, square, or other shapes, and can be arranged similarly to the shapes of the first and second liquid cooling plates. The first and second liquid cooling plates can be arranged according to the size and shape of the CPU to ensure efficient heat dissipation for the CPU. For example, if the CPU is round, the first and second liquid cooling plates, and heat sink fins can all be circular or elliptical. If the CPU is square, the first and second liquid cooling plates, and heat sink fins can all be square or trapezoidal. The description of the shape relationship between the CPU, the first and second liquid cooling plates, and the heat sink fins is merely an example and does not limit the specific configuration. For example, if the internal device configuration is considered, if the CPU is rectangular, the first liquid cooling plate and the second liquid cooling plate are both rectangular, but in order to adapt to a certain device in the device, the heat sink fins can be set to an irregular shape to leave enough space for the device. Figure 5 Part of the structure of the heat sink is based on Figure 4 The heat dissipation device structure is a simple schematic diagram, and does not limit the heat dissipation fins. Figure 4 There is a 60° angle between the first liquid cooling plate and the second liquid cooling plate. The heat dissipation fins can be oriented according to the angle of the second liquid cooling plate, and the angle between the edge lines of the two heat dissipation fins in the inclined direction of the second liquid cooling plate is 30°.

[0062] based on Figure 5 In the partial structure, the embodiment of the present application provides a cooling liquid flow direction of a heat dissipation device, such as Figure 6 As shown, a driving pump is used to drive the coolant in the first and second liquid cooling plates to exchange through at least one liquid pipe. After the first liquid cooling plate absorbs heat from the heat dissipated chip, the driving pump pumps the coolant in the first liquid cooling plate through the first of the at least one liquid pipes to the second liquid cooling plate. Under the dual action of the pump force and gravity, the coolant in the second liquid cooling plate is pumped through the second of the at least one liquid pipes (the second liquid pipe is a liquid pipe other than the first liquid pipe) to the first liquid cooling plate. During this process, the heat dissipated in the liquid pipes is dissipated by the heat fins surrounding the liquid pipes (the heat fins are not shown in the figure to ensure the visibility of the liquid flow direction and air ducts in the figure). The air duct of the fan located inside the heat dissipated chip passes through the heat fins and carries the heat out of the device.

[0063] exist Figure 4、 Figure 5 、 Figure 6 The first liquid cooling plate and the second liquid cooling plate can be set to a set angle. The set angle is not limited and can be any angle. In one possible design, the second liquid cooling plate can be perpendicular to the first liquid cooling plate; the at least one heat dissipating fin is perpendicular to the second liquid cooling plate. In this way, the second liquid cooling plate is perpendicular to the first liquid cooling plate, and the high-temperature coolant and the low-temperature coolant are set at a farther distance, which improves the heat dissipation efficiency and increases the gravity effect of the coolant in the second coolant flowing into the first coolant. Under the support of the driving force and gravity, the resistance of the driving pump to exchange the coolant in the first liquid cooling plate and the second liquid cooling plate is reduced. The heat dissipating fins are perpendicular to the second liquid cooling plate, so that the distance between the second liquid cooling plate and the heat dissipating fins is uniform, which is conducive to heat dissipation and can also improve heat dissipation efficiency.

[0064] What needs to be explained here is that Figure 5 The liquid pipeline structure shown in is a preferred structure. In a specific implementation, at least one liquid pipeline may not be distinguished between a first liquid pipeline and a second liquid pipeline. Figure 8 As shown, the driving pump can be set on the liquid cooling plate or the liquid pipeline, and there is no specific limitation. Figure 5 The heat dissipation device shown in the partial structure, the embodiment of the present application provides a liquid pipeline setting method, such as Figure 7 As shown, at least one liquid pipeline can be divided into a first liquid pipeline and a second liquid pipeline. The first liquid pipeline is placed outside the at least one heat sink fin. The second liquid pipeline extends from the top of the second liquid cooling plate to the end of the heat sink fin and bends downward to pass through the at least one heat sink fin and connect to the first liquid cooling plate. The second liquid pipeline is the liquid pipeline of the at least one liquid pipeline other than the first liquid pipeline. Placing the first liquid pipeline outside the at least one heat sink fin facilitates connection of the first liquid pipeline to a drive pump. The drive pump drives the coolant in the first and second liquid cooling plates through the first liquid pipeline, achieving the purpose of exchanging coolant between the first and second liquid cooling plates with less pumping force, thus saving pumping force. The second liquid pipeline extends from the top of the second liquid cooling plate to the end of the heat sink fin and bends. After bending, it passes through the heat sink fin and connects to the first liquid cooling plate. This increases the contact area between the liquid in the second liquid pipeline and the heat sink fin, transferring heat from the liquid to the heat sink fin more quickly, thereby improving the heat exchange efficiency of the device.

[0065] In one example, based on the above Figure 7 In the heat dissipation device structure, the second liquid pipe is perpendicular to the first liquid cooling plate. In this way, the second liquid pipe is perpendicular to the heat dissipation fins, which can evenly dissipate heat and improve heat dissipation efficiency.

[0066] In one example, based on the above Figure 5The heat dissipation device structure further comprises a temperature control chip connected to the heat dissipated chip, a heat-generating device outside the heat dissipated chip, the fan, and the drive pump, and configured to determine the fan speed and the pumping force of the drive pump based on the temperatures of the heat dissipated chip and the heat-generating device. This allows the fluid flow rate and wind speed to be adjusted based on the temperatures of the heat dissipated chip and the other heat-generating devices, maximizing the advantages of air cooling and liquid cooling to meet the heat dissipation requirements of the heat-generating devices in the device. Compared to heat pipes used in traditional air cooling, this is more intelligent and offers greater circulation. In one example, a temperature control chip is provided in the heat dissipation device, connected to the heat dissipated chip and the heat-generating device outside the heat dissipated chip. This chip can detect the temperatures of the heat dissipated chip and the heat-generating device. When the temperature of the heat-generating device is low but the temperature of the heat dissipated chip is high, the pumping force of the drive pump can be increased, while the fan speed remains unchanged. When the temperature of the heat-generating device and the temperature of the heat dissipated chip are high, the pumping force of the drive pump can be increased, thereby increasing the fan speed. When the temperature of the heat generating device is high and the temperature of the heat dissipated chip is low, the pump force can be kept constant and the fan speed can be increased. In this way, the power consumption and noise pollution of the fan and the power consumption of the driving pump can be reduced.

[0067] Based on this, the embodiment of the present application also provides a heat dissipation method process, such as Figure 9 Shown, including:

[0068] Step 901: Determine the temperature of the heat dissipation chip and the heat generating device outside the heat dissipation chip in the device, and generate a first control instruction and a second control instruction, wherein the first control instruction is used to control the fan speed, and the second control instruction is used to control the pumping force of the driving pump;

[0069] Step 902: Based on the second control instruction, the driving pump pumps the coolant in the first liquid cooling plate through the liquid pipeline to the second liquid cooling plate, and pumps the coolant in the second liquid cooling plate to the first liquid cooling plate. The coolant in the first liquid cooling plate absorbs heat generated by the heat dissipation chip transferred by the thermal paste and becomes higher in temperature than the coolant in the second liquid cooling plate.

[0070] Step 903: Based on the second control instruction, the fan brings the heat dissipated from the second liquid cooling plate to the heat dissipation fins out of the device.

[0071] In the above method, the heat dissipation chip can be cooled using coolant and fans, while other components can be cooled using fans, thereby improving heat dissipation efficiency and reducing the space occupied by the heat dissipation device in the equipment. Through the first and second control instructions, the fluid flow rate and wind speed can be adjusted according to the temperature of the heat dissipation chip and other heat-generating components, maximizing the advantages of air cooling and liquid cooling to meet the heat dissipation needs of the heat-generating components in the equipment. Compared with the heat pipe used in traditional air cooling, it is more intelligent and has a stronger circulation force.

[0072] Based on the above-mentioned heat dissipation devices, an embodiment of the present application provides a heat dissipation device, including: the driving pump is an angle driving pump, which is arranged on the PCB board where the heat dissipation chip is located, and is connected to the bottom of the first liquid pipeline, and the bottom of the first liquid pipeline is connected to one end of the first liquid cooling plate. In one example, the angle driving pump is connected to the bottom of the first liquid pipeline, such as Figure 10 As shown. In this way, the heat dissipation chip is also set on the PCB board. Generally, the heat dissipation chip is thin, so the drive pump is set on the PCB board, so that the drive pump and the liquid cooling plate are in a flush space, and connected to the bottom of the first liquid pipeline. The fan duct can also carry the heat of the drive pump out of the device, increasing the service life of the pump. It should be noted that the setting position of the angle drive pump shown in the figure is only an example. It can also be set near the first liquid pipeline, or on the other side of the first liquid pipeline. There is no restriction on the specific setting position of the angle drive pump here, and it can be set according to the layout of each component in the device.

[0073] Based on the above heat dissipation devices, the embodiment of the present application provides a heat dissipation device, including: the driving pump is a DC brushless micro water pump, which is arranged in the middle of the first liquid pipeline. In one example, the DC brushless micro water pump is arranged in the middle of the first liquid pipeline, such as Figure 11 As shown. If the drive pump and the liquid cooling plate are flush, the fan's air duct can remove heat from the drive pump and extend the pump's service life. It should be noted that the placement of the brushless DC micro water pump shown in the figure is merely an example; it can also be placed near the first liquid pipeline or on the other side of the first liquid pipeline. The specific placement of the brushless DC micro water pump is not limited and can be determined based on the layout of the various components in the device.

[0074] Based on the above heat dissipation devices, the embodiment of the present application provides a heat dissipation device, such as Figure 12 As shown, the system further includes filling the gap between the first liquid cooling plate and the heat dissipated chip with thermal paste. The heat dissipated chip typically has uneven surfaces, leaving a gap between it and the first liquid cooling plate. Filling this gap with thermal paste, which has a high thermal conductivity, accelerates heat transfer from the heat dissipated chip to the first liquid cooling plate.

[0075] Based on the aforementioned heat dissipation devices, embodiments of the present application provide a heat dissipation device, further comprising: baffles disposed within the first and / or second liquid cooling plates. The baffles disrupt the boundary layer on the walls of the first and / or second liquid cooling plates, increasing the internal wall surface area of ​​the liquid cooling plates and improving the heat transfer coefficient.

[0076] In the above-mentioned devices, heat is dissipated by driving pumps and fans. In terms of reliability, if the driving pump is damaged or the liquid pipeline is blocked, the fan speed can be increased to maintain heat dissipation, which is convenient for users to perform operations such as data saving. Since the liquid pipelines, heat dissipation fins and driving pumps of the heat dissipation device are simply arranged and do not require a long liquid pipeline layout, during maintenance, only the heat dissipation device needs to be maintained, which will not affect other devices. Among them, a large number of liquid pipelines and interfaces are not required, and the additional pump power costs caused by losses along the way and local resistance are avoided. At the same time, the liquid cooling device part of the heat dissipation device can be directly used in the air cooling system (there is no need to make too many requirements on the internal layout of the equipment, as long as the liquid cooling device part (such as Figure 10 Or 11) in a small space, the liquid cooling device can be installed on the equipment with only air cooling system, realizing both air cooling and liquid cooling) without the expense of re-reconstructing the system and opening the mold of the equipment.

[0077] Those skilled in the art will appreciate that the embodiments of the present application can be provided as methods, systems, or computer program products. Therefore, the present application can adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment in combination with software and hardware. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code.

[0078] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the present application. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0079] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0080] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0081] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A heat dissipation device, characterized in that: include: a first liquid cooling plate, a second liquid cooling plate, at least one liquid pipe, at least one heat dissipation fin, a driving pump, and a fan; Cooling liquid is built into the first liquid cooling plate and the second liquid cooling plate; The first liquid cooling plate is placed on the heat dissipation chip; The second liquid cooling plate is arranged on the first liquid cooling plate at a set angle in the vertical direction; the first liquid cooling plate and the second liquid cooling plate are connected at a contact surface; The at least one liquid pipe is used to exchange the cooling liquid in the first liquid cooling plate and the second liquid cooling plate; The at least one liquid pipeline includes: a first liquid pipeline and a second liquid pipeline; the first liquid pipeline is placed outside the at least one heat dissipation fin; the second liquid pipeline extends from the top of the second liquid cooling plate to the end of the heat dissipation fin and bends downward to pass through the at least one heat dissipation fin and communicate with the first liquid cooling plate; the air duct of the fan located inside the heat dissipation chip passes through the heat dissipation fin to remove heat from the heat dissipation fin out of the device; The driving pump is configured to drive the cooling liquid to flow from the first liquid cooling plate to the second liquid cooling plate; The at least one heat dissipation fin is arranged around the second liquid cooling plate in the direction of the air duct. The at least one heat dissipation fin is perpendicular to the second liquid cooling plate and parallel to the first liquid cooling plate. The second liquid cooling plate passes through the at least one heat dissipation fin.

2. The device as claimed in claim 1, characterized in that include: The second liquid cooling plate is perpendicular to the first liquid cooling plate.

3. The device as claimed in claim 2, characterized in that include: The second liquid pipeline is a liquid pipeline other than the first liquid pipeline in the at least one liquid pipeline.

4. The device as claimed in claim 3, characterized in that include: The second liquid pipeline is perpendicular to the first liquid cooling plate.

5. The device according to claim 1, characterized in that Also includes: A temperature control chip is connected to the heat dissipated chip, a heat generating device outside the heat dissipated chip in the device, the fan and the driving pump, and is used to determine the speed of the fan and the pumping force of the driving pump according to the temperature of the heat dissipated chip and the heat generating device.

6. The device as claimed in claim 1, characterized in that include: The driving pump is an angle-type driving pump, which is arranged on the PCB board where the heat dissipated chip is located and is connected to the bottom of the first liquid pipeline. The bottom of the first liquid pipeline is connected to one end of the first liquid cooling plate.

7. The device according to claim 1, characterized in that include: The driving pump is a DC brushless micro water pump, which is arranged in the middle of the first liquid pipeline.

8. The device according to claim 1, characterized in that Also includes: The gap between the first liquid cooling plate and the heat dissipated chip is filled with thermal paste.

9. The device according to claim 1, characterized in that Also includes: A baffle is provided in the first liquid cooling plate and / or the second liquid cooling plate.

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