A thermal infrared ground object target simulator, control method and application

Abstract

The present invention belongs to the technical fields of thermal infrared imaging radiation calibration and discloses a thermal infrared ground object simulator, a control method, and applications. In the thermal infrared ground object simulator, a support rod is mounted on the upper side of a three-dimensional angle adjustment platform, and a high thermal conductivity substrate is mounted on the upper side of the support rod. The front side of the high thermal conductivity substrate adopts different surface treatment technologies, or uses thermal conductive adhesive to adhere thin film materials with different emissivities; the back side of the high thermal conductivity substrate is mounted with a temperature measuring resistor and an electric heating plate, and the temperature measuring resistor is connected to a high-precision temperature controller via a wire, and the high-precision temperature controller is connected to the electric heating plate; the front side of the high thermal conductivity substrate is provided with a thermal infrared imager and a non-contact thermal infrared thermometer, and a thermal infrared detector is provided to the right side of the thermal infrared imager. The thermal infrared ground object simulator of the present invention can simultaneously reflect the geometric characteristics and thermal red characteristics of the ground object target, and has the multi-dimensional control capability of the ground object target's constituent elements, physical properties, geometric characteristics, and observation angle.

Description

Technical Field

[0001] The present invention belongs to the technical field of thermal infrared imaging radiation calibration, and in particular relates to a thermal infrared ground object target simulator, a control method and an application thereof. Background Art

[0002] Currently, thermal infrared imagers operating in the 8-14μm spectral band can be used in technical fields such as night vision security, target identification, and remote sensing temperature measurement. Currently, surface-source blackbodies are commonly used for radiometric calibration of thermal infrared imagers, establishing a relationship between entrance pupil radiance and thermal infrared detector readings. However, the application scenarios of thermal infrared imagers differ significantly from laboratory calibration using surface-source blackbodies. Ground objects exhibit significant differences in physical properties, application environments, and observation conditions. Therefore, traditional surface-source blackbodies are difficult to directly apply to the simulation of thermal infrared ground objects. Furthermore, there is an urgent need for thermal infrared ground object simulators in specialized technical fields such as thermal infrared optical system development, radiometric calibration, research on thermal infrared remote sensing temperature measurement mechanisms, and thermal infrared radiation characteristics. Currently, there is a lack of a thermal infrared ground object simulator that can be designed and customized for ground objects. Such a simulator should simultaneously reflect the ground object's geometric and thermal infrared radiation characteristics and be capable of controlling target components, temperature, emissivity, geometry, and observation angle. Surface blackbodies are commonly used for radiometric calibration of thermal infrared imagers. However, due to significant differences in the physical properties of ground objects, the application environment, and observation conditions, they cannot be directly used as thermal infrared ground object simulators. In the field of thermal infrared imaging, optical systems generally require a large, uniform, and geometrically detailed surface target with a wide divergence angle and the characteristics of the target's thermal infrared radiation. Surface blackbodies are artificially created ideal light sources with an emissivity close to 1 and a nearly constant value. Their luminous surface is limited in size, lacks geometric details, and is relatively large. This is particularly true for thermal infrared optical systems that require a large field of view, high resolution, and high quantification.

[0003] Through the above analysis, the problems and defects of the existing technology are as follows: traditional surface source blackbodies are difficult to be directly applied to the simulation of thermal infrared ground objects. Traditional surface source blackbodies are usually used for radiation calibration of thermal infrared imagers, but are difficult to be used directly as thermal infrared ground object simulators. This is mainly due to the lack of multi-dimensional control capabilities of the ground object components, physical properties, geometric characteristics and observation angles, making it difficult to adapt to complex ground object environments and the increasingly high-standard quantitative requirements of instruments and equipment.

[0004] The difficulty in resolving these issues and deficiencies lies in the current lack of a thermal infrared ground object simulator that can be designed and customized based on the geometric and emissivity characteristics of the ground object. Such a simulator requires the ability to control the components, physical properties, geometric characteristics, and observation angles. It integrates multiple factors, possesses systemic complexity and expertise, and requires targeted design and research.

[0005] The significance of solving the above problems and defects is that the thermal infrared ground object target simulator proposed in the present invention is of great significance for carrying out thermal infrared imaging performance verification, radiation calibration, remote sensing temperature measurement, ground object target identification, thermal radiation characteristic research, instrument and system quantitative research, etc. Summary of the Invention

[0006] To address the challenges of existing technologies, the present invention provides a thermal infrared ground object simulator, control method, and application. This invention provides a thermal infrared ground object simulator that can be designed and controlled based on the ground object's geometric characteristics and thermal infrared radiation signature, complementing the currently widely used surface source blackbody calibration technology. The proposed thermal infrared ground object simulator is of great significance for conducting thermal infrared imaging performance verification, radiation calibration, remote sensing and temperature measurement, ground object identification, thermal radiation signature research, and instrument and system quantitative research.

[0007] The present invention is achieved by providing a thermal infrared ground object target simulator, wherein the thermal infrared ground object target simulator is provided with a three-dimensional angle adjustment platform; a support rod is installed on the upper side of the three-dimensional angle adjustment platform, a high thermal conductivity substrate is installed on the upper side of the support rod, and a thin film material is attached to the high thermal conductivity substrate;

[0008] A temperature measuring resistor and an electric heating plate are installed on the back of the high thermal conductivity substrate. The temperature measuring resistor is connected to a high-precision temperature controller through a wire, and the high-precision temperature controller is connected to the electric heating plate.

[0009] A thermal infrared imager and a non-contact thermal infrared thermometer are arranged on the front of the high thermal conductivity substrate, and a thermal infrared detector is arranged on the right side of the thermal infrared imager.

[0010] Furthermore, the front surface of the high thermal conductivity substrate is divided into different areas, and thin-walled baffles are provided between the different areas.

[0011] Furthermore, the thin-walled baffle is a low-emissivity thin-walled baffle.

[0012] Furthermore, a polyimide thermal insulation pad is provided between the support rod and the high thermal conductivity substrate.

[0013] Furthermore, the high thermal conductivity substrate is a rectangle with a side length of 100 mm to 500 mm.

[0014] Furthermore, the front surface of the high thermal conductivity substrate is divided into regions according to the geometric features of the ground object, and different regions are subjected to different surface treatment technologies, or thin film materials with different emissivity are pasted using thermal conductive adhesive.

[0015] Furthermore, the surface treatment includes anodizing blackening, spraying black paint, spraying white paint, sandblasting, and covering with soil.

[0016] Furthermore, the film materials include frosted black film, glossy black film, silver film, gold film, glossy copper tape, aluminum foil, and A4 paper.

[0017] Another object of the present invention is to provide a thermal infrared ground object target simulator control method of the thermal infrared ground object target simulator, the thermal infrared ground object target simulator control method comprising:

[0018] Determine the size and surface emissivity of the high thermal conductivity substrate based on the geometric characteristics of the ground object and the optical technical parameters of the thermal infrared imager. Divide the front surface of the high thermal conductivity substrate into regions based on the geometric characteristics and thermal infrared characteristics of the ground object. Use different surface treatment technologies for each region, or use thermally conductive adhesive to adhere thin films of different emissivity.

[0019] An electric heating sheet and a temperature measuring resistor are attached to the back of the high thermal conductivity substrate, and the position and number of the temperature measuring resistors are reasonably set on the front of the high thermal conductivity substrate; a temperature measurement and control link is constructed using the electric heating sheet, the temperature measuring resistor and a high-precision temperature controller, and the connections are made; the angle of the ground object simulator is adjusted using a three-dimensional angle adjustment table, and the target temperature is set using a high-precision temperature controller; the thermal infrared ground object target simulator works normally after the temperature stabilizes; the temperature of the target simulator is calibrated using a contact temperature measuring resistor, a thermocouple or a non-contact thermal infrared thermometer.

[0020] Another object of the present invention is to provide an application of the thermal infrared ground object target simulator in the technical fields of thermal infrared optical system development, radiation calibration, thermal infrared remote sensing temperature measurement mechanism research, and thermal infrared radiation characteristic research.

[0021] Combining all the above-mentioned technical solutions, the advantages and positive effects of the present invention are as follows: The present invention proposes a thermal infrared ground object target simulator that can be designed and customized for ground objects. This simulator can simultaneously reflect the geometric characteristics and thermal infrared radiation characteristics of the ground object target, and has the ability to multi-dimensionally control the ground object target's components, temperature, emissivity, geometric shape, and observation angle. Compared to surface source blackbodies with constant emissivity and no geometric detail features, the present invention has greater design flexibility and is particularly suitable for thermal infrared optical systems with a large field of view, high spatial resolution, and high quantitative requirements.

[0022] The present invention divides the area on the high thermal conductivity substrate, adopts surface treatment technology, or uses thermal conductive adhesive to stick thin film materials with different emissivity to achieve the simulation of the geometric characteristics and thermal infrared emissivity characteristics of the ground object. The present invention can artificially design and customize the surface type, composition structure and thermal infrared emissivity characteristics of the ground object through surface treatment technology or sticking thin film materials. The simulator of the present invention has high-precision temperature control capabilities based on the feedback principle and temperature measurement and calibration capabilities through multiple technical approaches, wherein the temperature measurement accuracy is better than 0.1K and the temperature control accuracy is better than 0.2K. The two-dimensional temperature field of the ground object simulator can be fitted through multi-point temperature measurement data. The present invention adopts multiple temperature measurement technologies such as temperature measuring resistors, thermocouples and non-contact temperature measurement, and cross-calibrates to reduce measurement errors. The present invention has three-dimensional angle adjustment capabilities and the ability to adjust the observation geometry of the thermal infrared imager. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Schematic diagram of the thermal infrared ground object target simulator provided by an embodiment of the present invention;

[0024] Figure 2 Schematic diagram of the structure of a high thermal conductivity substrate provided by an embodiment of the present invention;

[0025] Figure 2 Middle: Figure a, front side; Figure b, back side;

[0026] Figure 3 This is a schematic diagram of the connection structure of the temperature measuring resistor, the high-precision temperature controller and the electric heating plate provided in an embodiment of the present invention;

[0027] Figure 4 This is a distribution diagram of temperature measurement points on the front of the thermal infrared terrain target simulator provided by an embodiment of the present invention;

[0028] Figure 5 This is a schematic diagram of the imaging result of a target simulator taken using a thermal infrared imager provided by an embodiment of the present invention;

[0029] Figure 6 This is a flow chart of a temperature measurement and control method based on temperature feedback and temperature verification provided by an embodiment of the present invention;

[0030] In the figure: 1. High thermal conductivity substrate; 2. Thin film material; 3. Temperature measuring resistor; 4. Thin-walled baffle; 5. High-precision temperature controller; 6. Electric heating plate; 7. Polyimide insulation pad; 8. Support rod; 9. Three-dimensional angle adjustment table; 10. Thermal infrared imager; 11. Thermal infrared detector; 12. Non-contact thermal infrared thermometer; 13. First temperature measuring point; 14. Second temperature measuring point; 15. Third temperature measuring point; 16. Fourth temperature measuring point; 17. Fifth temperature measuring point; 18. Bright copper tape for marking. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0032] In view of the problems existing in the prior art, the present invention provides a thermal infrared ground object target simulator, a control method and an application thereof. The present invention is described in detail below with reference to the accompanying drawings.

[0033] Ordinary technicians in the field of thermal infrared target simulator provided by the present invention can also adopt other steps to implement the invention. Figure 1 The thermal infrared ground object target simulator provided by the present invention is only a specific embodiment.

[0034] like Figure 1-Figure 3 As shown, a support rod 8 is mounted on the upper side of a three-dimensional angle adjustment platform 9 in a thermal infrared terrain target simulator provided by an embodiment of the present invention. A high thermal conductivity substrate 1 is mounted on the upper side of the support rod 8. A thin film material 2 or a treated surface is adhered to the high thermal conductivity substrate 1. The thin film material 2 has a specific geometric shape that reflects the characteristics of the terrain target to be simulated. A polyimide thermal insulation pad 7 is placed between the support rod 8 and the high thermal conductivity substrate 1. A temperature measuring resistor 3 and an electric heater 6 are mounted on the back of the high thermal conductivity substrate 1. The temperature measuring resistor 3 is connected to a high-precision temperature controller 5 via wires, which in turn is connected to the electric heater 6. The front of the high thermal conductivity substrate 1 is divided into different areas, with thin-walled baffles 4 placed between the different areas to prevent the influence of thermal radiation from different areas and environmental radiation. The thin-walled baffles 4 are low-emissivity thin-walled baffles. A thermal infrared imager 10 and a non-contact thermal infrared thermometer 12 are mounted on the front of the high thermal conductivity substrate 1. A thermal infrared detector 11 is located to the right of the thermal infrared imager 10.

[0035] The high thermal conductivity substrate 1 is designed based on the field of view of the thermal infrared imager, forming a rectangle with sides ranging from 100mm to 500mm. The front surface of the high thermal conductivity substrate 1 (the side facing the thermal infrared imager) can be divided into regions based on the geometric characteristics of the target. Different regions can be treated with different surface treatment techniques, or thin films 2 with different emissivities can be attached using thermally conductive adhesive to simulate the target's geometric and thermal infrared emissivity characteristics. The selected film material 2 should be easy to cut, and the film's geometry and emissivity characteristics can be designed and selected based on the target's geometric and emissivity characteristics. Surface treatment techniques include anodizing, black paint spraying, white paint spraying, sandblasting, and soil covering. Film materials 2 that can be used in the laboratory include matte black film, glossy black film, silver film, gold film, glossy copper tape, aluminum foil, and A4 paper. Thin-walled baffles 4 of a certain height are designed at the junction of different regions of the high thermal conductivity substrate 1 to prevent the influence of thermal radiation from different regions and environmental radiation. The present invention adopts a precise temperature control technology based on the feedback principle. The back of the high thermal conductivity substrate 1 is pasted with evenly distributed electric heating plates 6, and a high-precision simulator temperature control link is constructed through "temperature measuring resistor + high-precision temperature controller + electric heating plate". The local temperature can be verified in a variety of ways, including temperature measuring resistor 3, thermocouple or non-contact thermal infrared thermometer 12. The high thermal conductivity substrate 1 is installed on the three-dimensional angle adjustment platform 9 through the support rod 8. It has three-dimensional angle adjustment capability and can realize the control of the observation angle of the ground target. A polyimide insulation pad 7 for heat insulation is designed between the high thermal conductivity substrate 1 and the support rod 8. The three-dimensional angle adjustment platform 9 has an azimuth adjustment capability of ±90°, a pitch adjustment capability of ±25°, and a roll angle adjustment capability of ±25°, and the angle adjustment accuracy is better than 0.1°.

[0036] like Figure 4 As shown, the front of the high thermal conductivity substrate 1 is divided into four areas. The upper left corner area is provided with a first temperature measuring point 13 and a fourth temperature measuring point 16, the upper right corner area is provided with a bright copper tape 18 for marking, and the lower right corner area is provided with a second temperature measuring point 14, a third temperature measuring point 15 and a fifth temperature measuring point 17.

[0037] The technical solution of the present invention is described in detail below with reference to specific embodiments.

[0038] The thermal infrared terrain target simulator of the present invention primarily comprises a high-thermal-conductivity substrate 1, a thin film material 2 with specific geometric features, a temperature measurement and control component, and a three-dimensional angle adjustment mechanism. The thermal infrared terrain target simulator utilizes a high-thermal-conductivity metal plate as the substrate 1. The substrate 1 is designed in a rectangular shape with sides ranging from 100 mm to 500 mm, based on the field of view of the thermal infrared imager 10, to cover or partially cover the effective field of view of the thermal infrared imager 10.

[0039] The front surface of the high-thermal-conductivity substrate 1 (the surface facing the thermal infrared imager 10) can be divided into regions based on the geometric characteristics of the ground object. Different surface treatment techniques can be used for different regions, or thin films 2 with different emissivities can be attached using thermally conductive adhesive to simulate the ground object's geometric and thermal infrared emissivity characteristics. The selected film material 2 should be easy to cut, and its geometry and emissivity characteristics can be designed and selected based on the ground object's geometric and emissivity characteristics. Surface treatment techniques that can be used in the laboratory include anodizing, black paint spraying, white paint spraying, sandblasting, and soil covering. Thin film materials 2 that can be used in the laboratory include matte black film, glossy black film, silver film, gold film, glossy copper tape, aluminum foil, and A4 paper. Table 1 summarizes the emissivity parameters of some surface treatment techniques or thin film materials 2. Through these measures, the emissivity characteristics of ground objects such as sand, soil, concrete buildings, grass, fallen leaves, and stainless steel plates can be simulated in the laboratory. The emissivity of the surface or film material 2 that has been technically treated should be tested using the same technical method to make test samples for emissivity measurement.

[0040] Table 1 Thermal infrared emissivity of some surface treatment technologies or film materials

[0041] Serial number Surface type Emissivity 1 Anodized black 0.93 2 Spray black paint 0.88 3 Spray white paint 0.87 4 sandblast 0.92 5 Bright copper strip 0.05 6 Silver film 0.04 7 A4 paper 0.93

[0042] Furthermore, to prevent interference between thermal radiation generated by different regions and the impact of the surrounding environment on the target simulator, thin-walled baffles 4 of a certain height should be designed at the intersection of different regions. The thermal infrared target simulator utilizes precision temperature control technology based on feedback principles, constructing a high-precision temperature control circuit based on a "temperature measuring resistor + high-precision temperature controller + electric heater." Evenly distributed electric heaters 6 are attached to the back of the high-thermal conductivity substrate 1 (the side facing away from the thermal infrared imager 10).

[0043] Based on the geometric characteristics of the ground object and the temperature measurement requirements, temperature measurement points are set at multiple locations on the front and back of the high thermal conductivity substrate 1. Contact temperature measurement is performed using a calibrated temperature measuring resistor 3, and the temperature measurement accuracy of a single point is required to be better than 0.1K. The temperature control accuracy of the system based on the high-precision temperature controller 5 should be better than 0.2K, and the temperature adjustment range should cover the 293K to 343K commonly used for laboratory system calibration. Using the multi-point temperature measurement data distributed on the high thermal conductivity substrate 1, combined with the thermal infrared intensity image that has been corrected for non-uniformity, the two-dimensional temperature distribution field of the ground object simulator can be fitted. The local temperature can also be verified in real time using the contact temperature measuring resistor 3, thermocouple or non-contact thermal infrared thermometer 12. Through the above multiple technical approaches, temperature measurement errors can be verified.

[0044] To achieve the regulation of the observation geometry of the thermal infrared imager 10, the ground object target simulator should have the ability to adjust three-dimensional angles. Specifically, the high thermal conductivity substrate 1 is installed on the three-dimensional angle adjustment stage 9 through the support rod 8. A polyimide heat insulation pad 7 for heat insulation is designed between the high thermal conductivity substrate 1 and the support rod 8. The three-dimensional angle adjustment stage 9 has an azimuth angle adjustment ability of ±90°, a pitch angle adjustment ability of ±25°, and a roll angle adjustment ability of ±25°, and the angle adjustment accuracy is better than 0.1°.

[0045] The technical solution of the present invention will be described in detail below in combination with simulation experiments.

[0046] The present invention designs a dual-element thermal infrared ground object target simulator applied to laboratory conditions. The effective focal length of the thermal infrared optical system is 50 mm, the field of view angle is 7.5°×5.6°, and the working distance is 2000 mm. The high thermal conductivity substrate 1 of the ground object target simulator is made of an anodized blackened aluminum plate, square, with an effective size of 200 mm×200 mm, and the emissivity of the high thermal conductivity substrate 1 is 0.93. The front surface of the high thermal conductivity substrate 1 is divided into a "field" grid, and the diagonal regions of the "field" grid are set with the same surface emissivity characteristics. In the simulation experiment of the present invention, a marked bright copper strip 18 with an emissivity of 0.05 is pasted on the diagonal region of "upper left - lower right"; no film material 2 is pasted on the diagonal of "lower left - upper right", which is the anodized blackened high thermal conductivity substrate 1.

[0047] The ground object target simulator adopts a precision temperature control technology based on the feedback principle. A 150 mm×150 mm electric heating sheet 6 is pasted on the back surface of the high thermal conductivity substrate 1 of the simulator (i.e., the surface away from the thermal infrared imager 10); five Pt 100 patch-type platinum resistors are arranged on the front surface of the high thermal conductivity substrate 1 for local contact temperature measurement, which are respectively named the first temperature measurement point 13, the second temperature measurement point 14, the third temperature measurement point 15, the fourth temperature measurement point 16, and the fifth temperature measurement point 17. The position distribution of the temperature measurement points is as Figure 4 shown. The measured temperature data obtained is shown in Table 2 below. The above configuration meets the technical requirements of a temperature measurement accuracy better than 0.1 K and a temperature control accuracy better than 0.2 K, and the temperature adjustment range in the laboratory is 293 K to 343 K. The imaging result of the thermal infrared ground object target simulator obtained by using the thermal infrared imager 10 is as Figure 5 shown.

[0048] Table 2 Measured temperatures of the temperature measurement points in the experiment

[0049] Number in the figure name Real-time temperature 13 The first temperature measuring point 51.4℃ 14 The second temperature measuring point 49.8℃ 15 The third temperature measuring point 56.2℃ 16 The fourth temperature measuring point 55.4℃ 17 Fifth temperature measurement point 51.7℃

[0050] The high thermal conductivity substrate 1 of the terrain target simulator is mounted on a three-dimensional angle adjustment platform 9 via support rods 8, with a polyimide thermal insulation pad 7 installed between the simulator and the support rods 8. The three-dimensional angle adjustment platform 9 has an azimuth adjustment capability of ±90° and an elevation adjustment capability of ±25°.

[0051] The working principle of the present invention is as follows: according to the geometric characteristics of the ground object and the optical technical parameters of the thermal infrared imager, the size and surface emissivity characteristics of the high thermal conductivity substrate 1 are reasonably designed; according to the geometric characteristics and thermal infrared characteristics of the ground object, the front side (imaging surface) of the high thermal conductivity substrate 1 is divided into regions, and different surface treatment technologies are used in each region, or thin film materials 2 with different emissivities are pasted with thermal conductive adhesive, and the geometric shape and emissivity characteristics of the thin film material 2 should be able to reflect the characteristics of the ground object; an electric heating plate 6 is pasted on the back side of the high thermal conductivity substrate 1 and a temperature measuring resistor 3 is set; the position and number of the temperature measuring resistor 3 are reasonably set on the front side of the high thermal conductivity substrate 1; a temperature measurement and control link is constructed using the electric heating plate 6, the temperature measuring resistor 3 and the high-precision temperature controller 5, and connected; the angle of the ground object simulator is adjusted using the three-dimensional angle adjustment platform 9, the high-precision temperature controller 5 is turned on, and the target temperature is set; after the temperature is stable, the thermal infrared ground object target simulator can work normally; the target simulator is temperature calibrated using the contact temperature measuring resistor 3, the thermocouple or the non-contact thermal infrared thermometer 12.

[0052] In the description of the present invention, unless otherwise specified, "plurality" means two or more; terms such as "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," and "tail" indicate positions or relationships based on those shown in the accompanying drawings. These terms are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. Furthermore, terms such as "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0053] The above description is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications, equivalent substitutions and improvements made by any technician familiar with this technical field within the technical scope disclosed by the present invention and within the spirit and principles of the present invention should be covered by the scope of protection of the present invention.

Claims

1. A thermal infrared ground object simulator, characterized in that: The thermal infrared ground object target simulator is provided with: Three-dimensional angle adjustment table; A support rod is installed on the upper side of the three-dimensional angle adjustment table, a high thermal conductivity substrate is installed on the upper side of the support rod, and a thin film material is pasted on the high thermal conductivity substrate; A temperature measuring resistor and an electric heating plate are installed on the back of the high thermal conductivity substrate. The temperature measuring resistor is connected to a high-precision temperature controller through a wire, and the high-precision temperature controller is connected to the electric heating plate. A thermal infrared imager and a non-contact thermal infrared thermometer are set on the front of the high thermal conductivity substrate, and a thermal infrared detector is set on the right side of the thermal infrared imager; The front surface of the high thermal conductivity substrate is divided into different areas, and thin-walled baffles are provided between the different areas; The thin-wall baffle is a low-emissivity thin-wall baffle.

2. The thermal infrared ground object target simulator according to claim 1, characterized in that: A polyimide thermal insulation pad is provided between the support rod and the high thermal conductivity substrate.

3. The thermal infrared ground object target simulator according to claim 1, characterized in that: The high thermal conductivity substrate is a rectangle with a side length of 100 mm to 500 mm.

4. The thermal infrared ground object target simulator according to claim 1, characterized in that: The front surface of the high thermal conductivity substrate is divided into regions according to the geometric features of the ground object, and different regions are subjected to different surface treatment technologies, or thin film materials with different emissivity are pasted using thermal conductive adhesive.

5. The thermal infrared ground object target simulator according to claim 4, characterized in that: The surface treatment includes anodizing blackening, spraying black paint, spraying white paint, sandblasting, and covering with soil.

6. The thermal infrared ground object simulator according to claim 1, characterized in that: The film materials include frosted black film, glossy black film, silver film, gold film, glossy copper tape, aluminum foil, and A4 paper.

7. A method for controlling a thermal infrared ground object simulator according to any one of claims 1 to 6, characterized in that: The thermal infrared ground object target simulator control method comprises: Determine the size and surface emissivity of the high thermal conductivity substrate based on the geometric characteristics of the ground object and the optical technical parameters of the thermal infrared imager. Divide the front surface of the high thermal conductivity substrate into regions based on the geometric characteristics and thermal infrared characteristics of the ground object. Use different surface treatment technologies for each region, or use thermally conductive adhesive to adhere thin films of different emissivity. An electric heating sheet and a temperature measuring resistor are attached to the back of the high thermal conductivity substrate, and the position and number of the temperature measuring resistors are reasonably set on the front of the high thermal conductivity substrate; a temperature measurement and control link is constructed using the electric heating sheet, the temperature measuring resistor and a high-precision temperature controller, and the connections are made; the angle of the ground object simulator is adjusted using a three-dimensional angle adjustment table, and the target temperature is set using a high-precision temperature controller; the thermal infrared ground object target simulator works normally after the temperature stabilizes; the temperature of the target simulator is calibrated using a contact temperature measuring resistor, a thermocouple or a non-contact thermal infrared thermometer.

8. An application of the thermal infrared ground object simulator as claimed in any one of claims 1 to 6 in the technical fields of thermal infrared optical system development, radiation calibration, thermal infrared remote sensing temperature measurement mechanism research, and thermal infrared radiation characteristic research.

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