A high-sensitivity gas sensing device
Through the uniform distribution of heat of array integration and isolation units, the energy consumption and mechanical strength problems of gas sensor arrays are solved, and the stable operation and accurate temperature detection of high-sensitivity gas sensors in high-temperature environments are achieved, reducing energy consumption and creep risks.
Patent Information
- Application Number
- CN202210556652.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-05-20
- Publication Date
- 2025-07-22
- Estimated Expiration
- 2042-05-20
AI Technical Summary
The existing gas sensor arrays have problems in energy consumption and mechanical strength, and the sensors are prone to failure in high temperature environments. There are energy loss and creep problems during the switching of the operating mode of the sensor array, and inaccurate temperature detection leads to energy waste.
The array integration method is adopted, and the sensing unit is used periodically alternately as the work area and the backup area. The uniform heat distribution of the isolation unit and the capacitive temperature sensor are used for accurate temperature detection, the sensor layout is adjusted to reduce energy consumption, and the creep is reduced through gradual heating or cooling modes.
It improves the durability and energy efficiency of the sensor, reduces energy consumption, ensures the accuracy of temperature detection, and reduces the mechanical damage and energy waste of the sensor.
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Figure CN115078474B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of gas sensors, and in particular, to a highly sensitive gas sensing device. Background Art
[0002] Micro Electro-Mechanical System (MEMS) refers to a micro device or system that can be mass-produced and integrates a micro mechanism, a micro sensor, a micro actuator, as well as signal processing and control circuits, interfaces, communication, power supply, etc., and can perform specific functions. MEMS technology is an emerging interdisciplinary field that involves multiple fields such as microelectronics, automatic control, materials science, optics, aerodynamics, fluid mechanics, acoustics, magnetics, and biomedicine. It has developed with the semiconductor integrated circuit microfabrication technology and the ultra-precision machining technology, and has the advantages of small volume, low energy consumption, and convenient micro-operation. The micro electro-mechanical system is not just the miniaturization of traditional machinery in terms of scale, but has far exceeded the concept and scope of traditional machinery, and is based on modern science and technology and is an important part of the entire nanoscience and technology.
[0003] In the prior art, a multi-functional potentiometric gas sensor array with integrated temperature control and temperature sensors proposed in a patent document with the publication number of CN101889201A. The embodiments of this invention relate to gas sensors and methods for sensing one or more gases. One embodiment introduces a sensing electrode array maintained at similar or different temperatures, so that the sensitivity and species selectivity of the device can be precisely tuned between different sensing electrode pairs. A specific embodiment relates to a gas sensor array for monitoring combustion exhaust gases and / or by-products of chemical reactions. The embodiments of the device are fabricated on a single substrate. The devices can also be fabricated on individual substrates and monitored individually, just as if they were part of an array on a single substrate. The devices can introduce sensing electrodes in the same environment, which allows the electrodes to be coplanar, thus keeping the manufacturing cost low. Through surface temperature control, the embodiments of the device can provide improvements in sensitivity, selectivity, and signal interference.
[0004] A gas sensor proposed in a patent document with publication number CN110412084A, as well as a method for manufacturing and using the sensor. The gas sensor includes an insulator template, which includes a nanotube array formed by parallel-aligned open nanotubes; a sensing material, which is at least deposited on the inner surface of the nanotubes; and optionally, catalyst nanoparticles dispersed on the sensing material. The sensor further includes an electronic controller to activate electrodes made of different conductor materials so as to obtain a plurality of resistance measurement values on the insulator template. The resistance measurement values can be compared with a stored resistance curve to determine the gas type, concentration, and mixture in the nanotube array gas sensor.
[0005] The technical solution proposed in the above patent is designed for a sensor array, but the sensing units in the proposed array are relatively independent, and the problem of increased energy consumption caused by adding sensors is not fully considered, and the problem of a large amount of waste heat during the switching process of the array working mode is not fully solved.
[0006] In addition, on the one hand, there are differences in the understanding of those skilled in the art; on the other hand, although the inventor studied a large number of documents and patents when making this invention, due to space limitations, not all details and contents are listed in detail. However, this does not mean that this invention does not have the features of these prior arts. On the contrary, this invention already has all the features of the prior arts, and the applicant reserves the right to add relevant prior arts in the background art. Summary of the Invention
[0007] The present invention discloses a high-sensitivity gas sensing device, including: an array formed by sensitive areas, each sensitive area including a sensing aperture that is integrally formed in the corresponding sensitive area and serves as a sensing unit, and an electrode electrically connected to the sensing unit.
[0008] According to a preferred embodiment, when detecting a gas, the first sensitive area and the second sensitive area are configured to respectively detect different components of the gas so that the sensing device with an array can perform multi-component detection on the gas.
[0009] According to a preferred embodiment, the non-sensing parts of the electrodes of the first sensitive area and the third sensitive area configured to detect the same specific component are shared to form at least two detection modes, thereby improving the identification ability of the high-sensitivity gas sensing device for the specific component.
[0010] According to a preferred embodiment, several heating sub-units included in the heating unit can enable the array to have sensitive areas at at least two temperatures.
[0011] Metal semiconductor oxides can specifically recognize different gases at different operating temperatures, so various components in the air can be detected by adjusting the temperature. To reduce the volume and improve the integration degree, in the prior art, a gas sensor array is usually formed on a single chip to achieve multi-component recognition. To avoid mutual interference between adjacent sensing units, in the prior art, the array-type sensor makes the sensing area in a relatively independent state by increasing the distance between adjacent heating devices in the array or by etching to form a suspended platform (there is a hollowed-out area between adjacent heating devices). The method of separating by a certain distance will increase the volume of the sensor, and the overall energy consumption of the sensor array will also increase exponentially. The method of etching to form a suspended platform has relatively low energy consumption, but its structure seriously affects the mechanical strength of the sensor. Although the above methods can effectively ensure the working stability of a single sensing unit, they also bring problems of increased energy consumption and weakened mechanical strength, which obviously cannot effectively exert the advantages of the array-type sensor. Therefore, the present invention designs the working mode during the operation of the multi-array sensor, and then adjusts the arrangement mode of the sensor array.
[0012] During the use of the sensor, the sensing material is in a high-temperature working environment for a long time, and components such as the sensing material and the electrode will fail accordingly, thereby affecting the performance of the sensor. Since the present invention adopts an array integration method and multiple sensing units are integrated in a limited volume, some sensing units in the array can be used as backups (taking four sensing units as an example for illustration, two sensing units are used as the backup area and two sensing units are used as the working area), and they are used alternately periodically to reduce the time of a single sensing unit at high temperature, thereby improving the overall durability.
[0013] According to a preferred embodiment, when the first sensitive area and the third sensitive area are in the working state, the first heating sub-unit and the third heating sub-unit can transfer their heat to the second sensitive area, and partial non-heating sections of the first heating sub-unit and the third heating sub-unit are shared.
[0014] According to a preferred embodiment, the first sensing electrode arranged between the isolation unit and the sensing unit can conduct the heat of the isolation unit to evenly distribute the heat from the isolation unit on several electrodes of the first sensing electrode.
[0015] Although the above measures improve the durability of the sensor to a certain extent, during the periodic alternation process, the cyclic effects of heating and annealing inevitably occur. The resulting energy loss and creep caused by the increase in the number of annealing heating cycles make the sensor more prone to fracture. Therefore, the present invention further processes the above situation. During the use of the sensor, when the heating unit is heating, the in-layer heat conduction of the insulating layer (the isolation unit of the present invention) of the heating unit inevitably generates a temperature gradient distribution within a certain area range outside the coverage area corresponding to the insulating layer. This is also what the array arrangement method in the prior art attempts to avoid because the gradient difference cannot ensure uniform heating in the area where it is located, so it cannot be used as a heat source area. In the present invention, by setting a sensing electrode on the surface of the isolation unit, the heat on the surface of the isolation unit is conducted in a timely manner, and the above gradient distribution interval is adjusted to be used as a heat source capable of stable heating (taking the linear arrangement as an example, two working areas in the working state are arranged on both sides of the backup area in the standby state, and the backup area effectively uses the waste heat of the working area to work), thereby re-fully utilizing the waste heat in the working area in the working state and greatly reducing the energy consumption.
[0016] Further, taking the linear arrangement as an example, the working area can be switched between a first working mode and a second working mode. The first working mode is at a first temperature, and the second working mode is at a second temperature, with the first temperature being higher than the second temperature. The sensing units on both sides of the backup area are in the first working mode, and the backup area is in the second working mode; the sensing units on both sides of the backup area are in the second working mode, and the backup area is in the backup state. When the backup area is in the backup state, part of the heat transferred by the working area can enable the backup state to have a certain temperature to avoid damage to the sensor caused by moisture in the humid working environment. The sensing units of the sensor work in a mode of gradually decreasing or increasing temperature. The amplitude of temperature decrease is reduced, and the corresponding possibility of creep occurrence is reduced. The mode of gradually decreasing temperature also avoids a large amount of heat dissipation.
[0017] Further, by adjusting the distance between the two working areas, the backup area located between them can have its predetermined working temperature (within the temperature coverage range of the two working areas, as the distance between the two working areas increases, the temperature of the backup area between the two working areas decreases). The preferred arrangement method is to adjust the distance between the two working areas so that the temperature of the backup area is not higher than its predetermined working temperature to facilitate supplementary heating by the heating unit of the backup area.
[0018] Furthermore, during the long-term operation of the sensor, the problem of frequent working temperature conversion occurs, so it is necessary to detect the working temperature of the sensitive area. The temperature detection in the prior art is achieved by introducing multiple heating electrodes in the microhotplate. Since there is an insulating layer (the isolation unit of the present invention) between the heating electrode and the sensing unit mainly used for detection in the sensitive area, a certain lag will occur in the process of the heating electrode acting as the temperature detection to detect the temperature of the sensing unit (the heat of the heating electrode needs to pass through the insulating layer to conduct to the sensing unit, and the insulating layer makes the temperature on one side of the heating electrode different from the temperature of the sensing unit, and the heating electrode used to detect the temperature cannot accurately measure the temperature of the sensing unit. During the preheating process, this lag and inaccuracy make the temperature slightly higher or slightly lower than the predetermined working temperature of the sensing unit, resulting in waste of energy and reducing the selectivity of the sensitive area). When the sensing electrode for dispersing the temperature gradient of the insulating layer in the present invention is in an insulating state with the sensing unit, it can act as a capacitive temperature sensor to detect the temperature of the sensing area. Compared with the detection method in the prior art, it can measure the temperature of the sensing unit more accurately. (When the sensing unit is a single-pass AAO substrate, the insulating layer and the bottom of the AAO substrate electrically insulate the sensing electrode, so the sensing electrode can be used for temperature detection, and its position makes the measurement of the working temperature of the sensor more accurate).
[0019] According to a preferred embodiment, the high-sensitivity gas sensing device further includes a first sensing electrode including a plurality of electrodes located in the corresponding sensitive area, and the plurality of electrodes of the first sensing electrode are located in the corresponding heating subunit through the isolation unit.
[0020] According to a preferred embodiment, the first sensing electrode at least includes a first electrode located in the first sensitive area, a second electrode located in the second sensitive area, and a third electrode located in the third sensitive area. When the first sensitive area and the third sensitive area are in the working state, the second electrode can act as the heating electrode of the second sensitive area by conducting the heat of the first sensitive area and the third sensitive area.
[0021] According to a preferred embodiment, when the second sensitive area is in the working state, the first electrode and the third electrode located near the second sensitive area can act as the heating electrodes of their corresponding sensitive areas by conducting the heat of the second sensitive area.
[0022] According to a preferred embodiment, the high-sensitivity gas sensing device further includes a second sensing electrode, and the plurality of electrodes of the second sensing electrode are located in the corresponding first sensing electrode through the sensing unit.
[0023] According to a preferred embodiment, the high-sensitivity gas sensing device further includes a plurality of isolation segments and a heating unit that are integrally formed into an isolation unit positioned in the sensitive area, and the heating unit is thermally coupled to the sensing unit through the isolation unit. Description of the Drawings
[0024] Figure 1 is a simplified overall structural schematic diagram of the array of Embodiment 2 of the present invention;
[0025] Figure 2 is a simplified overall structural schematic diagram of the high-sensitivity gas sensing device of the present invention;
[0026] Figure 3 is a simplified overall structural schematic diagram of the heating unit of Embodiment 1 of the present invention;
[0027] Figure 4 is a simplified overall structural schematic diagram of the array of Embodiment 1 of the present invention.
[0028] List of Reference Numerals
[0029] 100: Array; 200: Sensing unit; 300: Isolation unit; 400: Electrode; 500: Heating unit; 101: First sensitive area; 102: Second sensitive area; 103: Third sensitive area; 104: Fourth sensitive area; 201: First sensing aperture; 202: Second sensing aperture; 203: Third sensing aperture; 204: Fourth sensing aperture; 410: First sensing electrode; 411: First electrode; 412: Second electrode; 413: Third electrode; 414: Fourth electrode; 420: Second sensing electrode; 501: First heating sub-unit; 502: Second heating sub-unit; 503: Third heating sub-unit; 504: Fourth heating sub-unit. Detailed Description of the Embodiments
[0030] The present invention will be described in detail below with reference to the accompanying drawings.
[0031] As Figure 1 and Figure 2 shown, the array 100 formed by the sensor of the present invention includes a first sensitive area 101, a second sensitive area 102, a third sensitive area 103, and a fourth sensitive area 104. The sensitive areas 101, 102, 103, 104 include a sensing unit 200 for detecting gas, an isolation unit 300 for insulation, an electrode 400 for detecting changes in the electrical properties of the sensing unit 200, and a heating unit 500 for heating the sensing unit 200.
[0032] According to a preferred embodiment, the sensing unit 200 includes a substrate made of an insulating material for constructing sensing apertures 201, 202, 203, 204, and at least one metal oxide layer disposed on the walls of the sensing apertures 201, 202, 203, 204. The surface of the metal oxide layer is deposited with a catalytic metal to improve the adsorption ability of the metal oxide to the gas to be detected.
[0033] Preferably, the electrode 400 may include platinum (Pt), palladium (Pd), gold (Au), rhodium (Rh), rhenium (Re), ruthenium (Ru), indium (In), titanium (Ti), titanium nitride (TiN), tantalum nitride (TaN), or an alloy composed of one or more of these components.
[0034] Preferably, the metal oxide layer may include one or more of components such as SnO2, ZnO, In2O3, NiO, etc.
[0035] Preferably, the catalytic metal may include one or more of components such as platinum (Pt), palladium (Pd), etc.
[0036] According to a preferred embodiment, when detecting a gas, the first sensitive area 101 and the second sensitive area 102 are configured to detect different components of the gas respectively, so that the sensing device with the array 100 can perform multi-component detection of the gas.
[0037] According to a preferred embodiment, the non-sensing parts of the electrodes 400 of the first sensitive area 101 and the third sensitive area 103 configured to detect the same specific component are shared to form at least two detection modes, thereby improving the recognition ability of the high-sensitivity gas sensing device to the specific component.
[0038] When the first sensitive area 101 and the third sensitive area 103 detect the same gas component, the corresponding first electrode 411 and third electrode 413 are electrically connected through the shared non-sensing part, and at least three joints for connecting the first electrode 411 and the third electrode 413 are formed, so as to adjust the series-parallel state of the resistances formed by the first detection 411 and the third electrode 413 and their corresponding sensing units 200 to adjust the sensitivities of the first sensitive area and the third sensitive area, so that the first sensitive area 101 and the third sensitive area 103 can detect the same gas separately or as a whole.
[0039] According to a preferred embodiment, several heating sub-units 501, 502, 503, 504 included in the heating unit 500 can make the array 100 have sensitive areas 101, 102, 103, 104 at at least two temperatures.
[0040] According to a preferred embodiment, when the sensing unit 200 is a double-pass AAO substrate, an isolation unit 300 is disposed between the sensing unit 200 and the heating unit 500 to prevent the electrodes of the sensing unit 200 and the heating unit 500 from interfering with each other. The electrode disposed between the sensing unit 200 and the isolation unit 300 can conduct the heat of the isolation unit 300 to its corresponding sensing unit 200. When the sensing unit 200 is a single-pass AAO substrate, the barrier layer at the bottom of the AAO substrate can insulate the heating unit 500. When it is necessary to introduce an electrode between the heating unit 500 and the AAO substrate, an isolation unit 300 is disposed between the barrier layer at the bottom of the AAO substrate and the heating unit 500.
[0041] Embodiment 1
[0042] When the array 100 is linearly distributed, the heating unit 500 is arranged in the Figure 3 arrangement shown, which are the first heating sub-unit 501, the second heating sub-unit 502, the third heating sub-unit 503, and the fourth heating sub-unit 504 in sequence.
[0043] When the first heating sub-unit 501 and the third heating sub-unit 503 are in the working state, and when the second heating sub-unit 502 and the fourth heating sub-unit 504 are in the non-working state, the corresponding first sensitive area 101 and the third sensitive area 103 are the working areas, and the second sensitive area 102 and the fourth sensitive area 104 are the backup areas. The first sensitive area 101 and the third sensitive area 103 that are spaced apart are both in the first working state at the first temperature. Outside the sensitive area range corresponding to the heating sub-units 501 and 503 of the above two working areas, based on the heat conduction inside the isolation unit 300, part of the heat generated by the heating sub-units 501 and 503 can be transferred to the second sensitive area 102, so that the second sensitive area 102 is at the second temperature lower than the first temperature. Furthermore, the waste heat when the first sensitive area 101 and the third sensitive area 103 are in the working area is effectively utilized to make the second sensitive area 102 located between the above two sensitive areas be in the second working state. At this time, the fourth sensitive area 104 is in the third working state, and the waste heat in the isolation unit 300 is fully utilized to reduce the energy consumption of the sensor.
[0044] Optionally, the temperature range of the first working state is 500 to 700 °C, the temperature range of the second working state is 300 to 500 °C, and the working range of the third working state is 100 to 300 °C.
[0045] As Figure 4As shown, the first heating subunit 501 is provided with a corresponding first electrode 411 on the other side of the isolation unit 300, the second heating subunit 502 is provided with a corresponding second electrode 412 on the other side of the isolation unit 300, the third heating subunit 503 is provided with a corresponding third electrode 413 on the other side of the isolation unit 300, and the fourth heating subunit 504 is provided with a corresponding fourth electrode 414 on the other side of the isolation unit 300.
[0046] Optionally, the areas of the sensitive regions 101, 102, 103, and 104 are 400um * 400um, and the effective working area of the corresponding heating subunits 501, 502, 503, 504 and the first sensing electrode 410 is 400um * 400um.
[0047] Optionally, when the first sensitive region 101 and the third sensitive region 103 are in the first working state, their working first temperature is approximately 500°C, and the temperature gradient coverage range is a region with an area of 1000um * 1000um. The second sensitive region 102 is within the temperature gradient coverage range of the first sensitive region 101 and the third sensitive region 103. The distance between the second sensitive region 102 and the first sensitive region 101 and the third sensitive region 103 is 100 to 150um, and the temperature of the second sensitive region 102 is 300°C. Based on the same arrangement method above, when the first sensitive region 101 and the third sensitive region 103 are in the second working state, their working second temperature is approximately 300°C, and the temperature of the second sensitive region 102 is approximately 100°C.
[0048] According to a preferred embodiment, by adjusting the distance between two mutually spaced sensitive regions as the working area, the other sensitive region as the backup area located between the two sensitive regions has its predetermined working temperature. Preferably, after adjusting the distance, the temperature of the backup area is slightly lower than its predetermined working temperature to facilitate supplementary heating by the heating subunit of the backup area.
[0049] Optionally, adjust the distance between the first sensitive region 101 and the third sensitive region 103, and the distance range is 100 to 400um, so that the temperature difference between the first sensitive region 101, the third sensitive region 103 and the second sensitive region 102 is within the range of 100 to 300°C.
[0050] According to a preferred embodiment, the sensitive area as the backup area can effectively utilize waste heat. However, there is a certain temperature gradient in the waste heat, and it will also cause uneven temperature distribution in the working area. Therefore, in the present invention, a first sensing electrode 410 is introduced at a position corresponding to the heating sub-unit of the isolation unit 300 to modify the heat source area on the surface of the isolation unit 300, so that the heat transfer from the heating sub-units 501, 502, 503, 504 to the sensing unit 200 can become more uniform through the adjustment of the first sensing electrode 410. The first sensing electrode 410 is generally made of a metal such as Pt. The characteristic of its high thermal conductivity enables the heat transferred to it to be evenly dispersed on the surface in contact with the sensing unit 200, thereby forming a more stable and uniform heat source to overcome the problem of temperature gradient distribution during the utilization of waste heat.
[0051] According to a preferred embodiment, during the long-term operation of the sensor, especially when it is in a situation of frequently switching working modes, it is necessary to timely adjust the stability of the sensitive area. The effect of waste heat makes it impossible for the control module to effectively heat the sensitive area to its predetermined temperature in a timely manner. Therefore, it is necessary to adjust the voltage and current parameters applied to the heating sub-unit based on temperature detection. Therefore, when the first sensing electrode 410 of the present invention is in an insulating state with the sensing unit 200, the first sensing electrode can be used as a capacitive thermometer to detect the temperature change of the sensing unit 200 during the complex heating process based on waste heat. Its position makes the working temperature of the sensor not affected by the isolation unit 300, and its measurement value is more accurate. Furthermore, it can reasonably control the voltage and current parameters of the heating sub-unit to heat the corresponding sensing unit 200 to its predetermined working temperature, avoiding temperature deviation from the optimal selectivity area and also avoiding the increase in energy loss caused by overheating.
[0052] According to a preferred embodiment, during the process of switching the working mode between the working area and the standby area, it will not only cause sensor creep but also cause a large amount of energy loss. Therefore, the present invention adopts a method of gradually cooling or heating to achieve the conversion between the working area and the standby area. The sensitive area in the working area includes at least two working modes, namely the first working mode and the second working mode. The first temperature in the first working mode is greater than the second temperature in the second working mode.
[0053] Optionally, the sensitive areas 101 and 103 of the workspace include at least two working modes, namely the first working mode and the second working mode. When the first sensitive area 101 and the third sensitive area 103 are in the first working state, the second sensitive area 102 and the fourth sensitive area 104 as backup areas are in the second working mode and the third working mode respectively; when the first sensitive area 101 and the third sensitive area 103 are in the second working state, the second sensitive area 102 and the fourth sensitive area 104 as backup areas are in the third working mode. Correspondingly, the process of converting the second sensitive area 102 and the fourth sensitive area 104 from the backup area to the workspace is also always realized in a gradually warming-up mode. The conversion between the backup area and the workspace is gradually completed in the above manner, avoiding the aggravation of creep caused by too rapid temperature change of the sensor, reducing the temperature reduction amplitude, avoiding a large amount of heat dissipation, and reducing the energy consumption of the sensor accordingly. The workspace and the backup area are at least maintained in the third working mode, that is, it contains a certain amount of heat but does not cause gas adsorption, and the heat it contains can enable the sensitive area to have a certain temperature to avoid damage to the sensor caused by moisture in the humid working environment.
[0054] According to a preferred embodiment, when the first sensitive area 101 and the third sensitive area 103 are in the working state, the first heating sub-unit 501 and the third heating sub-unit 503 can transfer their heat to the second sensitive area 102, and some non-heating sections of the first heating sub-unit 501 and the third heating sub-unit 503 are shared.
[0055] According to a preferred embodiment, the high-sensitivity gas sensing device further includes a first sensing electrode 410 including a plurality of electrodes located in the corresponding sensitive area, and the plurality of electrodes of the first sensing electrode 410 are located in the corresponding heating sub-units 501, 502, 503, 504 through the isolation unit 300.
[0056] According to a preferred embodiment, the first sensing electrode 410 arranged between the isolation unit 300 and the sensing unit 200 can conduct the heat of the isolation unit 300 to evenly distribute the heat from the isolation unit 300 on the plurality of electrodes of the first sensing electrode 410.
[0057] According to a preferred embodiment, the first sensing electrode 410 at least includes a first electrode 411 located in the first sensitive area 101, a second electrode 412 located in the second sensitive area 102, and a third electrode 413 located in the third sensitive area. When the first sensitive area 101 and the third sensitive area 103 are in the working state, the second electrode 412 can act as a heating electrode for the second sensitive area 102 by conducting the heat of the first sensitive area 101 and the third sensitive area 103.
[0058] According to a preferred embodiment, when the second sensitive area 102 is in a working state, the first electrode 411 and the third electrode 413 near the second sensitive area 102 can act as heating electrodes for their corresponding sensitive areas by conducting the heat of the second sensitive area 102.
[0059] According to a preferred embodiment, the high-sensitivity gas sensing device further includes a second sensing electrode 420, and several electrodes of the second sensing electrode 420 are positioned at corresponding first sensing electrodes 410 through the sensing unit 200.
[0060] According to a preferred embodiment, the high-sensitivity gas sensing device further includes several isolation sections of the integrated isolation unit 300 positioned at the sensitive areas 101, 102, 103, 104 and a heating unit 500, and the heating unit 500 is thermally coupled to the sensing unit 200 through the isolation unit 300.
[0061] Embodiment 2
[0062] As Figure 1 shown, when the array 100 is in a dot matrix distribution, the array 100 has the following types of working modes:
[0063] The first sensitive area 101 and the second sensitive area 102 are in a first working state as the working area, and the third sensitive area 103 and the fourth sensitive area 104 are in a second working state as the backup area, and then the working area and the backup area are alternately switched.
[0064] The first sensitive area 101 and the third sensitive area 103 are in a first working state as the working area, and the second sensitive area 102 and the fourth sensitive area 104 are in a third working state as the backup area, and then the working area and the backup area are alternately switched.
[0065] Throughout the text, the features guided by "preferably" are only an optional manner and should not be understood as a must be set. Therefore, the applicant reserves the right to waive or delete the relevant preferred features at any time.
[0066] It should be noted that the above specific embodiments are exemplary. Those skilled in the art can come up with various solutions inspired by the disclosure of the present invention, and these solutions also belong to the disclosure scope of the present invention and fall within the protection scope of the present invention. Those skilled in the art should understand that the description and drawings of the present invention are illustrative and do not constitute a limitation to the claims. The protection scope of the present invention is defined by the claims and their equivalents.
Claims
1. A high-sensitivity gas sensing device, comprising: An array (100) formed by sensitive regions (101, 102, 103, 104), each sensitive region including a sensing aperture (201, 202, 203, 204) that is integrally formed in the corresponding sensitive region to form a sensing unit (200), and an electrode (400) electrically connected to the sensing unit (200); And an isolation unit (300) for insulation provided between the sensing unit (200) and a heating unit (500), and the electrode provided between the sensing unit (200) and the isolation unit (300) can conduct the heat of the isolation unit (300) to the corresponding sensing unit (200); Characterized in that when detecting a gas, the working area can switch between a first working mode and a second working mode, the first working mode is a first temperature, the second working mode is a second temperature, the first temperature is higher than the second temperature, the first sensitive region (101) at the first temperature and the second sensitive region (102) at the second temperature are configured to detect different components of the gas respectively so that the sensing device with the array (100) can perform multi-component detection on the gas.
2. The high-sensitivity gas sensing device according to claim 1, characterized in that The non-sensing parts of the electrodes (400) of the first sensitive region (101) and the third sensitive region (103) configured to detect the same specific component are shared to form at least two detection modes, thereby improving the recognition ability of the high-sensitivity gas sensing device for the specific component.
3. The highly sensitive gas sensing device according to claim 2, characterized in that, The several heating sub-units (501, 502, 503, 504) included in the heating unit (500) can make the sensitive regions (101, 102, 103, 104) of the array (100) have at least two temperatures.
4. The high-sensitivity gas sensing device according to claim 3, characterized in that, When the first sensitive region (101) and the third sensitive region (103) are in a working state, the first heating sub-unit (501) and the third heating sub-unit (503) can transfer their heat to the second sensitive region (102), and partial non-heating sections of the first heating sub-unit (501) and the third heating sub-unit (503) are shared.
5. The highly sensitive gas sensing device according to claim 1, characterized in that, The high-sensitivity gas sensing device further includes a first sensing electrode (410) including several electrodes located in the corresponding sensitive region, and the several electrodes of the first sensing electrode (410) are located in the corresponding heating sub-units (501, 502, 503, 504) through the isolation unit (300).
6. The highly sensitive gas sensing device according to claim 5, characterized in that, The first sensing electrode (410) arranged between the isolation unit (300) and the sensing unit (200) can conduct the heat of the isolation unit (300) to evenly distribute the heat from the isolation unit (300) on the several electrodes of the first sensing electrode (410).
7. The highly sensitive gas sensing device according to claim 6, characterized in that, The first sensing electrode (410) at least includes a first electrode (411) positioned in the first sensitive area (101), a second electrode (412) positioned in the second sensitive area (102), and a third electrode (413) positioned in the third sensitive area (103). When the first sensitive area (101) and the third sensitive area (103) are in the working state, the second electrode (412) can act as a heating electrode for the second sensitive area (102) by conducting the heat of the first sensitive area (101) and the third sensitive area (103).
8. The highly sensitive gas sensing device according to claim 7, characterized in that, When the second sensitive area (102) is in the working state, the first electrode (411) and the third electrode (413) near the second sensitive area (102) can act as heating electrodes for their corresponding sensitive areas by conducting the heat of the second sensitive area (102).
9. The highly sensitive gas sensing device according to claim 1, characterized in that, The high-sensitivity gas sensing device further includes a second sensing electrode (420), and several electrodes of the second sensing electrode (420) are positioned at corresponding first sensing electrodes (410) through a sensing unit (200).
10. The highly sensitive gas sensing device according to claim 1, characterized in that, The high-sensitivity gas sensing device further includes several isolation sections of an integrally formed isolation unit (300) and a heating unit (500) positioned in the sensitive areas (101, 102, 103, 104), and the heating unit (500) is thermally coupled to the sensing unit (200) through the isolation unit (300).
Citation Information
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