Process chamber for semiconductor devices

Abstract

The application provides a kind of process chamber of semiconductor equipment, transmission passage is opened in chamber body for wafer transmission;Bearing component is arranged in chamber body, with the bearing surface for bearing wafer;Needle assembly is arranged in the internal space of bearing component, and can be penetrated through bearing component to bearing surface;Drive assembly is arranged in the internal space of bearing component, is connected with needle assembly, for driving needle assembly to rise or drop;Inner door assembly is arranged in chamber body;Synchronization assembly is arranged in the internal space of bearing component, respectively with drive assembly and inner door assembly connection, for driving inner door assembly to drop or rise simultaneously with drive assembly driving needle assembly to rise or drop, by inner door assembly opening or closing transmission passage.The process chamber of semiconductor equipment provided by the application can improve the work efficiency and stability of semiconductor equipment, and can reduce the cost of semiconductor equipment.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a process chamber of a semiconductor equipment. Background Art

[0002] At present, the process chambers of some semiconductor vacuum equipment such as etchers include a chamber body, an inner door, a carrying component and a ejector pin assembly. Among them, the chamber body is used to provide a process environment for the semiconductor process, the chamber body is provided with a transmission channel for wafer transmission, the carrying component is arranged in the chamber body, and is used to carry the wafer for semiconductor processing, the inner door is arranged in the chamber body and is arranged corresponding to the transmission channel, and is used to close the transmission channel during the semiconductor process and open the transmission channel during the wafer transmission process, and the ejector pin assembly is arranged inside the carrying component and passes through the carrying component to the surface of the carrying component carrying the wafer, and is used to transfer the wafer between the robot and the carrying component.

[0003] Typically, the inner door, ejector assembly, and robot arm need to work in coordination to smoothly complete the wafer transfer. However, in order to avoid coordination errors among the inner door, ejector assembly, and robot arm, a delay time needs to be set between the drive of the inner door, the drive of the ejector assembly, and the drive of the robot arm, resulting in poor working efficiency of the semiconductor equipment. Furthermore, since the drive of the inner door is achieved by a cylinder, which is relatively unstable, the movement of the inner door may be delayed, causing the robot arm to collide with the inner door, causing the semiconductor equipment to shut down, resulting in poor working stability of the semiconductor equipment. Furthermore, since the inner door and ejector assembly are driven separately, separate drive components need to be configured, resulting in higher costs for the semiconductor equipment. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art and proposes a process chamber for semiconductor equipment, which can improve the working efficiency and working stability of the semiconductor equipment and reduce the cost of the semiconductor equipment.

[0005] To achieve the purpose of the present invention, a process chamber for semiconductor equipment is provided, comprising a chamber body, a carrying component, an ejector assembly, a drive assembly, an inner door assembly, and a synchronization assembly, wherein the chamber body is provided with a transmission channel for wafer transmission; the carrying component is disposed within the chamber body and has a carrying surface for carrying the wafer; the ejector assembly is disposed in the interior space of the carrying component and is capable of passing through the carrying component to the carrying surface; the drive assembly is disposed in the interior space of the carrying component and is connected to the ejector assembly for driving the ejector assembly to rise or fall;

[0006] The inner door assembly is arranged in the chamber body; the synchronization assembly is arranged in the internal space of the bearing component, and is respectively connected to the driving assembly and the inner door assembly, and is used to synchronously drive the inner door assembly to descend or rise while the driving assembly drives the ejector assembly to rise or fall, and open or close the transmission channel through the inner door assembly.

[0007] Optionally, the synchronization component includes a first connecting rod and a support rod, one end of the support rod is fixedly arranged at the bottom of the internal space of the bearing component, and the other end is connected to the middle part of the first connecting rod, and the first connecting rod can be rotated in the vertical direction, one end of the first connecting rod is rotatably connected to the driving component, and the other end is rotatably connected to the inner door component, one end of the first connecting rod can rise or fall under the drive of the driving component, and the other end can fall or rise at the same time, so as to synchronously drive the inner door assembly to fall or rise.

[0008] Optionally, a first connecting pin is provided at the other end of the support rod, and the other end of the support rod is rotatably connected to the middle portion of the first connecting rod through the first connecting pin.

[0009] Optionally, the driving assembly includes a driving member, a transmission rod, and a second connecting rod, wherein the driving member is connected to the ejector assembly via the transmission rod, so as to drive the ejector assembly to rise or fall by driving the transmission rod to rise or fall;

[0010] One end of the second connecting rod is connected to the driving member through the transmission rod, and the other end is provided with a second connecting pin. The other end of the second connecting rod is rotatably connected to one end of the first connecting rod through the second connecting pin.

[0011] Optionally, the inner door assembly includes a door body and a door guide rod, and the door body is arranged corresponding to the transmission channel;

[0012] The door guide rod is bent, one end of the door guide rod is connected to the bottom of the door body, and the other end penetrates into the internal space of the supporting component and is provided with a third connecting pin. The other end of the door guide rod is rotatably connected to the other end of the first connecting rod through the third connecting pin.

[0013] Optionally, the distance from the middle of the first connecting rod to the one end of the first connecting rod is a first distance, and the distance from the middle of the first connecting rod to the other end of the first connecting rod is a second distance, and the first distance is smaller than the second distance.

[0014] Optionally, the ratio of the first distance to the second distance is 1:3-1:2.

[0015] Optionally, a through hole is provided at the bottom of the supporting component for the door guide rod to penetrate into the internal space of the supporting component, and the inner door assembly further includes a sealing assembly, which is respectively sealedly connected to the through hole and the part of the door guide rod that penetrates into the internal space of the supporting component, for sealing the through hole.

[0016] Optionally, the sealing assembly includes a sealing ring, a sealing ring and a retractable bellows, the through hole is a stepped hole, the stepped surface of the stepped hole faces the internal space of the bearing component, and an annular sealing groove for the sealing ring to be embedded is provided on the stepped surface, the sealing ring is sleeved around the door guide rod and pressed tightly against the sealing ring and the stepped surface, the sealing ring is used to seal between the stepped surface and the sealing ring, the bellows is sleeved on the outside of the part of the door guide rod that penetrates into the internal space of the bearing component, one end of the bellows is sealedly connected to the part of the door guide rod that penetrates into the internal space of the bearing component, and the other end is sealedly connected to the sealing ring, for sealing between the door guide rod and the sealing ring that can be relatively lifted and lowered.

[0017] Optionally, the distance from one end of the bellows that is sealed and connected to the door guide rod to the other end of the bellows that is sealed and connected to the sealing ring is smaller than the original length of the bellows when not subjected to external force, so that the bellows can be in a compressed state, applying a clamping force to the sealing ring, and pressing the sealing ring against the sealing ring and the step surface.

[0018] The present invention has the following beneficial effects:

[0019] The process chamber of the semiconductor equipment provided by the present invention is connected to the drive assembly and the inner door assembly by providing a synchronization component respectively. The synchronization component can synchronously drive the inner door assembly to descend or ascend while the drive assembly drives the ejector assembly to ascend or descend, and the transmission channel is opened or closed by the inner door assembly. In this way, on the one hand, the inner door assembly and the ejector assembly can be driven synchronously by one drive component, thereby eliminating the need to set a delay time between the inner door assembly and the ejector assembly, thereby improving the working efficiency of the semiconductor equipment. On the other hand, since the synchronization component drives the inner door assembly to descend or ascend, it relies on the driving force of the drive component used to drive the ejector assembly to ascend or descend, and the drive component that drives the ejector assembly can be a motor, and the response speed of the motor is better than the response speed of the cylinder, thereby reducing the probability of the inner door assembly colliding with the robot due to the delay in cylinder drive, thereby improving the stability of the semiconductor equipment. On the other hand, since the inner door assembly and the ejector assembly can be raised and lowered by only one drive component with the help of the synchronization component, the cost of the semiconductor equipment can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic structural diagram of a process chamber of a semiconductor device not provided by the present invention that is currently being studied by the inventor of the present invention;

[0021] Figure 2 A schematic structural diagram of an inner door assembly and an ejector pin assembly of a process chamber of a semiconductor device provided by an embodiment of the present invention when they are located in a high position and a low position respectively;

[0022] Figure 3 A schematic structural diagram of an inner door assembly and an ejector pin assembly of a process chamber of a semiconductor device provided by an embodiment of the present invention when the inner door assembly and the ejector pin assembly are in a neutral position;

[0023] Figure 4 A schematic structural diagram of a process chamber of a semiconductor device provided by an embodiment of the present invention, wherein the inner door assembly and the ejector assembly are located in the middle position and a robot carries a wafer into the chamber body;

[0024] Figure 5 A schematic structural diagram of an inner door assembly and an ejector pin assembly of a process chamber of a semiconductor device provided by an embodiment of the present invention when they are located in a low position and a high position respectively;

[0025] Figure 6 A schematic structural diagram of a first connecting rod of a process chamber of a semiconductor device provided by an embodiment of the present invention;

[0026] Figure 7 A schematic structural diagram of a drive assembly and an ejector pin assembly of a process chamber of a semiconductor device provided by an embodiment of the present invention;

[0027] Figure 8 A schematic diagram of the structure of the cooperation between the sealing assembly and the door guide rod of the process chamber of the semiconductor equipment provided by the embodiment of the present invention;

[0028] Description of reference numerals:

[0029] 01-chamber body; 011-transmission channel; 02-carrying component; 021-interior space; 031-inner door; 032-inner door guide rod; 033-cylinder; 041-motor; 042-thrust pin; 043-thrust pin guide rod; 1-chamber body; 11-transmission channel; 2-carrying component; 21-carrying surface; 22-interior space; 23-stepped hole; 24-interface plate; 31-thrust pin; 32-needle guide rod; 41-driving member; 42-transmission rod; 43-second connecting rod; 44-second connecting pin; 45-fixed connecting piece; 51-door body; 52-door guide rod; 53-third connecting pin; 61-first connecting rod; 611-round hole; 612-first long hole; 613-second long hole; 62-support rod; 63-first connecting pin; 71-sealing ring; 72-sealing ring; 73-bellows; 8-lining; 81-transmission hole; 9-robot arm; 10-wafer. DETAILED DESCRIPTION

[0030] In order for those skilled in the art to better understand the technical solutions of the present application, first, a process chamber of a semiconductor device which is not provided by the present application and is being studied by the inventor of the present application will be described in conjunction with the drawings.

[0031] As shown in Figure 1 The process chamber of the semiconductor device which is not provided by the present application and is being studied by the inventor of the present application includes a chamber body 01, a bearing component 02, an inner door 031, an inner door guide rod 032, a gas cylinder 033, a motor 041, three top pins 042 and three top pin guide rods 043, wherein the chamber body 01 is used to provide a process environment for a semiconductor process, a transmission passage 011 for wafer transmission is arranged on the side wall of the chamber body 01, the bearing component 02 is arranged in the chamber body 01 and is used to bear a wafer for a semiconductor process, the inner door 031 is arranged in the chamber body 01 and is arranged correspondingly with the transmission passage 011, the gas cylinder 033 is arranged outside the chamber body 01, the inner door guide rod 032 penetrates through the bottom wall of the chamber body 01, one end of the inner door guide rod 032 is connected with the inner door 031 in the chamber body 01, and the other end of the inner door guide rod 032 is connected with the gas cylinder 033 outside the chamber body 01, the motor 041 is arranged in an inner space 021 of the bearing component 02, the three top pins 042 are arranged in the inner space 021 of the bearing component 02 and penetrate through the bearing component 02 to a bearing surface of the bearing component 02 bearing the wafer, and the three top pin guide rods 043 are arranged in the inner space 021 of the bearing component 02, one end of each of the three top pin guide rods 043 is connected with the motor 041, and the other end of each of the three top pin guide rods 043 is connected with one of the three top pins 042 correspondingly.

[0032] Among them, the top pin 042 is driven to rise and fall by the motor 041, and the inner door 031 is driven to rise and fall by the gas cylinder 033, because the top pin 042 is used to transfer the wafer between the mechanical hand and the bearing surface of the bearing component 02, and will contact and support the wafer to rise and fall, therefore, the rise and fall of the top pin 042 needs to be relatively stable, and the driving force of the motor 041 is relatively stable compared with the driving force of the gas cylinder 033, therefore, driving the rise and fall of the top pin 042 by the motor 041 can make the wafer rise and fall stably, and the inner door 031 is used to open and close the transmission passage 011, and only needs to be able to reach the position to open and close the transmission passage 011, and the cost of the gas cylinder 033 is relatively low compared with the cost of the motor 041, therefore, considering the cost, the rise and fall of the inner door 031 is driven by the gas cylinder 033.

[0033] In actual applications, the transmission of wafers includes the process of placing the wafers from the outside of the chamber body 01 to the carrying surface of the carrying component 02 before the start of the semiconductor process, and the process of taking the wafers from the carrying surface of the carrying component 02 to the outside of the chamber body 01 after the semiconductor process is completed. During the wafer transmission process, the control system sends control signals to the cylinder 033, the motor 041 and the robot respectively, and sets a delay time between each control signal to reduce the occurrence of direct coordination errors between the inner door 031, the ejector pin 042 and the robot. Among them, during the wafer placement process before the start of the semiconductor process, the cylinder 033 drives the inner door guide rod 032 to descend, driving the inner door 031 to descend, so that the inner door 031 does not block the transmission channel 011. After that, the robot carries the wafer through the transmission channel 011 into the chamber body 01 and is located above the supporting component 02. After that, the motor 041 drives the three ejector guide rods 043 to rise, driving the three ejector pins 042 to rise, and lifts the wafer on the robot to separate the wafer from the robot. After that, the robot exits to the outside of the chamber body 01 through the transmission channel 011. After that, the cylinder 033 drives the three inner door guide rods 032 to descend, driving the three ejector pins 042 to descend, and places the wafer on the supporting surface of the supporting component 02. The cylinder 033 drives the inner door guide rod 032 to rise, driving the inner door 031 to rise, so that the inner door 031 blocks the transmission channel 011. After that, the semiconductor process can be carried out.

[0034] After the semiconductor process is completed, during the wafer retrieval process, the motor 041 drives the three ejector guide rods 043 to rise, driving the three ejector pins 042 to rise, and lift the wafer on the carrying surface of the carrying component 02. After that, the cylinder 033 drives the inner door guide rod 032 to fall, driving the inner door 031 to fall, so that the inner door 031 no longer blocks the transmission channel 011. After that, the robot enters the chamber body 01 through the transmission channel 011 and is located under the wafer. After that, the motor 041 drives the three ejector guide rods 043 to fall, driving the three ejector pins 042 to fall, and places the wafer on the robot, and continues to drive the three ejector guide rods 043 to fall, driving the three ejector pins 042 to continue to fall, so that the three ejector pins 042 are separated from the wafer. After that, the robot carries the wafer through the transmission channel 011 and exits the chamber body 01. After that, the cylinder 033 drives the inner door guide rod 032 to rise, driving the inner door 031 to rise, so that the inner door 031 blocks the transmission channel 011.

[0035] However, in actual application, the inventors of the present invention found that when the control system sends control signals to the cylinder 033, the motor 041 and the manipulator, the control signals may sometimes be delayed in transmission, and the response speed of the cylinder 033 is relatively slow compared to the response speed of the motor 041. These factors may cause the manipulator to pass through the transmission channel 011 before the cylinder 033 drives the inner door 031 to descend and open the transmission channel 011, resulting in a collision between the manipulator and the inner door 031, causing the semiconductor equipment to shut down and the working stability of the semiconductor equipment to be poor. Therefore, the control system needs to set a delay time between each control signal sent to the cylinder 033, the motor 041 and the manipulator, which in turn will cause the wafer transmission time to be longer, resulting in lower working efficiency of the semiconductor equipment. In addition, since the ejector pin 042 and the inner door 031 are separately driven to rise and fall by the motor 041 and the cylinder 033 respectively, the cost of the semiconductor equipment is higher.

[0036] In order to enable those skilled in the art to better understand the technical solution of the present invention, the process chamber of the semiconductor device provided by the present invention is described in detail below with reference to the accompanying drawings.

[0037] like Figure 2-Figure 5 As shown, an embodiment of the present invention provides a process chamber of a semiconductor device, comprising a chamber body 1, a carrying component 2, a pin assembly, a drive component, an inner door assembly and a synchronization component, wherein a transmission channel 11 for transmitting a wafer 10 is opened on the chamber body 1; the carrying component 2 is arranged in the chamber body 1, and has a carrying surface 21 for carrying the wafer 10; the pin assembly is arranged in the internal space 22 of the carrying component 2, and can pass through the carrying component 2 to the carrying surface 21; the drive component is arranged in the internal space 22 of the carrying component 2, and is connected to the pin assembly, and is used to drive the pin assembly to rise or fall; the inner door assembly is arranged in the chamber body 1; the synchronization component is arranged in the internal space 22 of the carrying component 2, and is respectively connected to the drive component and the inner door assembly, and is used to synchronously drive the inner door assembly to fall or rise while the drive component drives the pin assembly to rise or fall, and open or close the transmission channel 11 through the inner door assembly.

[0038] The process chamber of the semiconductor equipment provided by the embodiment of the present invention is provided with a synchronization component connected to the drive component and the inner door component respectively. The synchronization component can synchronously drive the inner door component to descend or ascend while the drive component drives the ejector component to ascend or descend. The transmission channel 11 is opened or closed by the inner door component. In this way, on the one hand, the inner door component and the ejector component can be driven synchronously by one drive component, so there is no need to set a delay time between the inner door component and the ejector component, thereby improving the working efficiency of the semiconductor equipment. On the other hand, since the synchronization component drives the inner door component to descend or ascend, it relies on the driving force of the drive component used to drive the ejector component to ascend or descend. The drive component that drives the ejector component can be a motor, and the response speed of the motor is better than the response speed of the cylinder. Therefore, the probability of the inner door component colliding with the robot 9 due to the delay in the cylinder drive can be reduced, thereby improving the stability of the semiconductor equipment. On the other hand, since the inner door component and the ejector component can be raised and lowered by only one drive component with the help of the synchronization component, the cost of the semiconductor equipment can be reduced.

[0039] Furthermore, by arranging the synchronization component in the internal space 22 of the carrier component 2 , it is possible to prevent the synchronization component from affecting the semiconductor process environment in the chamber body 1 and thus preventing the semiconductor process from being affected.

[0040] Specifically, in actual application, during the wafer placement process before the start of the semiconductor process, the driving component can drive the ejector assembly to rise from the low position to the middle position, so that the top of the ejector assembly rises from below the bearing surface 21 of the bearing component 2 to above the bearing surface 21 of the bearing component 2, and at the same time, the synchronization component can synchronously drive the inner door assembly to fall from the high position to the middle position, so that the inner door assembly falls from blocking the transmission channel 11 to not blocking the transmission channel 11, so as to open the transmission channel 11 (such as Figure 3 As shown), after that, the robot 9 can carry the wafer 10 through the transmission channel 11 into the chamber body 1 and is located above the carrier component 2 and above the ejector assembly (as shown). Figure 4 As shown), after that, the driving component can continue to drive the ejector assembly to rise to the high position, so that the ejector assembly lifts the wafer 10 on the robot 9, so that the wafer 10 is separated from the robot 9, and at the same time, the synchronization component can synchronously drive the inner door assembly to continue to descend to the low position, and then the robot 9 can exit the chamber body 1 through the transmission channel 11 (as shown). Figure 5 As shown), the driving component can then drive the ejector assembly to descend to a low position, so that the top of the ejector assembly is lower than the carrying surface 21 of the carrying component 2, and the wafer 10 is placed on the carrying surface 21 of the carrying component 2. At the same time, the synchronization component can synchronously drive the inner door assembly to rise to a high position, so that the inner door assembly blocks the transmission channel 11, thereby closing the transmission channel 11 (as shown). Figure 2As shown), after which semiconductor processing can be performed.

[0041] During the wafer removal process after the semiconductor process is completed, the driving component can drive the ejector component to rise to a high position to lift the wafer 10 on the carrying surface 21 of the carrying component 2, and at the same time, the synchronization component can synchronously drive the inner door component to descend to a low position so that the inner door component does not block the transmission channel 11 to open the transmission channel 11 (such as Figure 5 As shown), the robot 9 can then enter the chamber body 1 through the transmission channel 11 and be located below the wafer 10 lifted by the ejector assembly. The drive assembly can then drive the ejector assembly down to the middle position, placing the wafer 10 on the robot 9 and separating the ejector assembly from the wafer 10. At the same time, the synchronization assembly can drive the inner door assembly to rise, but without blocking the transmission channel 11, so as to keep the transmission channel 11 open (as shown). Figure 4 As shown), the robot 9 can then carry the wafer 10 through the transfer channel 11 and exit the chamber body 1 (as shown). Figure 3 As shown), after that, the driving component can continue to drive the ejector assembly to a low position, so that the top of the ejector assembly is lower than the bearing surface 21 of the bearing component 2, and at the same time, the synchronization component can synchronously drive the inner door assembly to rise to a high position, so that the inner door assembly blocks the transmission channel 11 to close the transmission channel 11 (as shown). Figure 2 shown).

[0042] Optionally, the distance that the inner door assembly descends from the high position to the middle position may be 10 mm to 14 mm.

[0043] Optionally, the distance that the ejector assembly rises from the low position to the middle position may be 5 mm to 7 mm.

[0044] Optionally, when the ejector assembly is in a low position, the top of the ejector assembly can be 3 mm lower than the bearing surface 21 of the bearing component 2. That is, when the ejector assembly is in a low position, the top of the ejector assembly is lower than the bearing surface 21 of the bearing component 2, and the distance between the top of the ejector assembly and the bearing surface 21 of the bearing component 2 can be 3 mm.

[0045] Optionally, when the ejector assembly is in the middle position, the top of the ejector assembly can be 2mm-4mm higher than the bearing surface 21 of the bearing component 2. That is, when the ejector assembly is in the middle position, the top of the ejector assembly is higher than the bearing surface 21 of the bearing component 2, and the distance between the top of the ejector assembly and the bearing surface 21 of the bearing component 2 can be 2mm-4mm.

[0046] Optionally, when the ejector assembly is in the neutral position, after the manipulator 9 enters the chamber body 1, the manipulator 9 can be 7mm-8mm higher than the bearing surface 21 of the bearing member 2. In other words, when the ejector assembly is in the neutral position, the manipulator 9 is higher than the bearing surface 21 of the bearing member 2, and the distance between the manipulator 9 and the bearing surface 21 of the bearing member 2 can be 7mm-8mm. Since the top of the ejector assembly can be 2mm-4mm higher than the bearing surface 21 of the bearing member 2 when the ejector assembly is in the neutral position, the manipulator 9 can be positioned above the ejector assembly after entering the chamber body 1, preventing interference between the manipulator 9 and the ejector assembly.

[0047] like Figure 2-Figure 5 As shown, in a preferred embodiment of the present invention, the synchronization component may include a first connecting rod 61 and a support rod 62, one end of the support rod 62 is fixedly arranged at the bottom of the internal space 22 of the bearing component 2, and the other end is connected to the middle part of the first connecting rod 61, and the first connecting rod 61 can rotate in the vertical direction, one end of the first connecting rod 61 is rotatably connected to the driving component, and the other end is rotatably connected to the inner door component, one end of the first connecting rod 61 can rise or fall under the drive of the driving component, and at the same time the other end can fall or rise, so as to synchronously drive the inner door component to fall or rise.

[0048] Because the middle portion of the first connecting rod 61 is connected to the other end of the support rod 62 and the first connecting rod 61 is vertically rotatable, when one end of the first connecting rod 61 rises or falls, the first connecting rod 61 also rotates, and the other end of the first connecting rod 61 falls or rises. Thus, when the drive assembly drives the ejector assembly to rise, one end of the first connecting rod 61 also rises under the drive assembly's drive, and simultaneously, the first connecting rod 61 rotates vertically, while the other end of the first connecting rod 61 falls. This synchronously drives the inner door assembly down, achieving simultaneous lowering of the inner door assembly while the drive assembly drives the ejector assembly up. When the drive assembly drives the ejector assembly down, one end of the first connecting rod 61 also falls under the drive assembly's drive, and simultaneously, the first connecting rod 61 rotates vertically, while the other end of the first connecting rod 61 rises. This synchronously drives the inner door assembly up, achieving simultaneous raising of the inner door assembly while the drive assembly drives the ejector assembly down.

[0049] Optionally, the length of the first connecting rod 61 may be 70 mm-80 mm.

[0050] Optionally, the height of the first connecting rod 61 may be 5 mm-6 mm.

[0051] like Figure 2-Figure 6As shown, in a preferred embodiment of the present invention, the other end of the support rod 62 may be provided with a first connecting pin 63 , and the other end of the support rod 62 is rotatably connected to the middle portion of the first connecting rod 61 through the first connecting pin 63 .

[0052] Such a structure can achieve that the other end of the support rod 62 is connected to the middle portion of the first connecting rod 61 , and the first connecting rod 61 can rotate in the vertical direction.

[0053] like Figure 2-Figure 6 As shown, optionally, a circular hole 611 may be opened in the middle of the first connecting rod 61 , and the first connecting pin 63 may be rotatably inserted into the circular hole 611 .

[0054] Such a structure can achieve rotatable connection between the other end of the support rod 62 and the middle portion of the first connecting rod 61 through the first connecting pin 63 .

[0055] Optionally, the diameter of the circular hole 611 may be 3 mm to 3.2 mm.

[0056] Optionally, the first connecting pin 63 and the circular hole 611 may be clearance-fitted.

[0057] Optionally, the model of the first connecting pin 63 may be M3.

[0058] like Figure 2-Figure 6 As shown, in a preferred embodiment of the present invention, the driving assembly may include a driving member 41, a transmission rod 42 and a second connecting rod 43, wherein the driving member 41 is connected to the ejector assembly through the transmission rod 42, so as to drive the ejector assembly to rise or fall by driving the transmission rod 42 to rise or fall; one end of the second connecting rod 43 is connected to the driving member 41 through the transmission rod 42, and the other end is provided with a second connecting pin 44, and the other end of the second connecting rod 43 is rotatably connected to one end of the first connecting rod 61 through the second connecting pin 44.

[0059] like Figure 2-Figure 6 As shown, optionally, a first long hole 612 can be opened at one end of the first connecting rod 61, and the first long hole 612 has a long axis with the longest radial length and a short axis with the shortest radial length. The long axis of the first long hole 612 is in the same direction as the length direction of the first connecting rod 61, and the second connecting pin 44 can be rotatably passed through the first long hole 612.

[0060] In other words, the driving member 41 is used to provide a driving force that can drive the transmission rod 42 up or down. When the transmission rod 42 rises or falls, it not only drives the ejector assembly up or down, but also drives the second connecting rod 43 up or down, thereby driving one end of the first connecting rod 61 up or down via the second connecting rod 43. By rotatably inserting the second connecting pin 44 through the first elongated hole 612, the synchronization assembly and the driving assembly are connected. When the second connecting rod 43 drives one end of the first connecting rod 61 up or down, the second connecting pin 44 not only rotates within the first elongated hole 612 but also moves within the first elongated hole 612 along the long axis of the first elongated hole 612. This reduces the risk of the second connecting pin 44 getting stuck during rotation, allowing the second connecting rod 43 to smoothly drive one end of the first connecting rod 61 up or down, thereby improving the operating stability of the semiconductor device.

[0061] Optionally, the driving member 41 may be a motor.

[0062] Optionally, the length of the major axis of the first long hole 612 may be 6 mm to 8 mm.

[0063] Optionally, the length of the minor axis of the first long hole 612 may be 3 mm-3.2 mm.

[0064] Optionally, the second connecting pin 44 and the first long hole 612 may be clearance-fitted.

[0065] Optionally, the model of the second connecting pin 44 may be M3.

[0066] like Figure 2-Figure 5 and Figure 7 As shown, optionally, the ejector pin assembly may include three ejector pins 31 and three needle guide rods 32. The three ejector pins 31 are arranged at intervals and can all pass through the supporting component 2 to the supporting surface 21 of the supporting component 2 to jointly support the wafer 10. The three needle guide rods 32 are all bent and are all located in the internal space 22 of the supporting component 2. One end of the three needle guide rods 32 is connected to the bottom of the three ejector pins 31 in a one-to-one correspondence, and the other end is connected to the transmission rod 42.

[0067] When the transmission rod 42 rises or falls, the transmission rod 42 drives the three needle guide rods 32 to rise or fall, thereby driving the three ejector pins 31 to rise or fall through the three needle guide rods 32 .

[0068] like Figure 2-Figure 5As shown, optionally, the driving assembly may also include a fixed connecting member 45, which is arranged in the internal space 22 of the bearing component 2 and is respectively connected to the top of the bearing component 2 and the driving member 41, so that the driving member 41 is suspended in the internal space 22 of the bearing component 2.

[0069] like Figure 2-Figure 6 As shown, in a preferred embodiment of the present invention, the inner door assembly may include a door body 51 and a door guide rod 52, and the door body 51 is arranged corresponding to the transmission channel 11; the door guide rod 52 may be bent, one end of the door guide rod 52 is connected to the bottom of the door body 51, and the other end is inserted into the internal space 22 of the supporting component 2, and is provided with a third connecting pin 53, and the other end of the door guide rod 52 is rotatably connected to the other end of the first connecting rod 61 through the third connecting pin 53.

[0070] like Figure 2-Figure 6 As shown, optionally, a second long hole 613 is provided at the other end of the first connecting rod 61, and the second long hole 613 has a long axis with the longest radial length and a short axis with the shortest radial length. The long axis of the second long hole 613 is in the same direction as the length direction of the first connecting rod 61, and the third connecting pin 53 is rotatably provided in the second long hole 613.

[0071] Thus, when the other end of the first connecting rod 61 rises or falls, the first connecting rod 61 can drive the door guide rod 52 to rise or fall, thereby driving the door body 51 up or down through the door guide rod 52, so that the door body 51 blocks the transmission channel 11 to close the transmission channel 11, or opens the transmission channel 11 without blocking the transmission channel 11. By rotatably inserting the third connecting pin 53 through the second elongated hole 613, the synchronization assembly and the inner door assembly can be connected. Moreover, when the other end of the first connecting rod 61 rises or falls, the third connecting pin 53 not only rotates within the second elongated hole 613 but also moves within the second elongated hole 613 along the long axis of the second elongated hole 613, reducing the possibility of the third connecting pin 53 getting stuck during rotation. This allows the first connecting rod 61 to smoothly drive the door guide rod 52 up or down, thereby improving the operating stability of the semiconductor equipment.

[0072] Furthermore, by making the door guide rod 52 bendable and allowing the other end of the door guide rod 52 to penetrate into the internal space 22 of the supporting component 2, the straight length of the door guide rod 52 can be shortened compared with an inner door guide rod in a process chamber of a semiconductor device that is not provided by the present invention and is currently being studied by the inventor of the present invention. This can reduce the verticality requirement of the door guide rod 52, and further reduce the possibility of the door guide rod 52 or the door body 51 rubbing against the inner wall of the chamber body 1 during the lifting process due to the deflection of the door guide rod 52, thereby generating particles. This can thereby improve the yield of the semiconductor process.

[0073] As Figure 2-Figure 5 shown, optionally, the door guide rod 52 can include a first vertical section, a horizontal section and a second vertical section, wherein one end of the first vertical section is connected to the bottom of the door body 51, the other end is connected to one end of the horizontal section, the second vertical section penetrates through the bottom of the bearing component 2, one end is connected to the other end of the horizontal section, and the other end is provided with a third connecting pin 53.

[0074] Optionally, the length of the long axis of the second long hole 613 can be 6-8 mm.

[0075] Optionally, the length of the short axis of the second long hole 613 can be 3-3.2 mm.

[0076] Optionally, the third connecting pin 53 and the second long hole 613 can be clearance fit.

[0077] Optionally, the model of the third connecting pin 53 can be M3.

[0078] In a preferred embodiment of the present application, the distance from the middle of the first connecting rod 61 to one end of the first connecting rod 61 is a first distance, and the distance from the middle of the first connecting rod 61 to the other end of the first connecting rod 61 is a second distance, and the first distance can be less than the second distance.

[0079] That is, the distance from the center of the circular hole 611 to the end of the first connecting rod 61 connected to the drive assembly is a first distance, and the distance from the center of the circular hole 611 to the other end of the first connecting rod 61 connected to the inner door assembly is a second distance, and the first distance can be less than the second distance, which can make the lifting distance of one end of the first connecting rod 61 less than the lifting distance of the other end when the first connecting rod 61 rotates, so that the lifting distance of the door body 51 can be greater than the lifting distance of the thimble 31.

[0080] In a preferred embodiment of the present application, the ratio of the first distance to the second distance can be 1:3-1:2.

[0081] That is, the ratio of the distance from the center of the circular hole 611 to the end of the first connecting rod 61 connected to the drive assembly to the distance from the center of the circular hole 611 to the other end of the first connecting rod 61 connected to the inner door assembly can be 1:3-1:2, which can make the ratio of the lifting distance of one end of the first connecting rod 61 to the lifting distance of the other end be 1:3-1:2 when the first connecting rod 61 rotates, so that the lifting distance of the door body 51 and the lifting distance of the thimble 31 can be 2:1-3:1.

[0082] As Figure 2-Figure 5 and Figure 8As shown, in a preferred embodiment of the present invention, a through hole can be opened at the bottom of the supporting component 2 for the door guide rod 52 to penetrate into the internal space 22 of the supporting component 2, and the inner door assembly can also include a sealing assembly, which is respectively sealed and connected to the through hole and the part of the door guide rod 52 that penetrates into the internal space 22 of the supporting component 2 for sealing the through hole.

[0083] This design is because semiconductor vacuum equipment such as an etcher (Etch) needs to evacuate the chamber body 1 when performing semiconductor processes. By sealing the through hole through the sealing component, the internal space 22 of the supporting part 2 can be separated from the chamber body 1, thereby facilitating the evacuation of the chamber body 1.

[0084] like Figure 2-Figure 5 and Figure 8 As shown, in a preferred embodiment of the present invention, the sealing assembly may include a sealing ring 71, a sealing ring 72 and a retractable bellows 73. The through hole may be a step hole 23. The step surface of the step hole 23 faces the internal space 22 of the bearing component 2. The step surface is provided with an annular sealing groove for the sealing ring 71 to be embedded. The sealing ring 72 is sleeved around the door guide rod 52 and pressed tightly on the sealing ring 71 and the step surface. The sealing ring 71 is used to seal between the step surface and the sealing ring 72. The bellows 73 is sleeved on the outside of the part of the door guide rod 52 that penetrates into the internal space 22 of the bearing component 2. One end of the bellows 73 is sealedly connected to the part of the door guide rod 52 that penetrates into the internal space 22 of the bearing component 2, and the other end is sealedly connected to the sealing ring 72, for sealing between the relatively liftable door guide rod 52 and the sealing ring 72.

[0085] With the help of the bellows 73, the door guide rod 52 and the step hole 23 can be sealed, and with the help of the sealing ring 71, the sealing ring 72 and the step surface can be sealed, thereby sealing the step hole 23. Moreover, since the bellows 73 can be extended and retracted, the bellows 73 can maintain the seal between the door guide rod 52 and the step hole 23 when the door guide rod 52 is raised or lowered. Moreover, since the sealing ring 72 is pressed against the sealing ring 71 and the step surface, the door guide rod 52 and the supporting component 2 can be easily disassembled and assembled.

[0086] Optionally, the stepped hole 23 may include a first hole segment and a second hole segment, wherein the first hole segment is located below the second hole segment, the diameter of the first hole segment is smaller than the diameter of the second hole segment, and the top surface of the first hole segment can serve as a stepped surface.

[0087] Optionally, the diameter of the door guide rod 52 may be 4.9 mm-5 mm.

[0088] Optionally, the diameter of the first hole section may be 5 mm-5.5 mm.

[0089] Optionally, the diameter of the second hole section may be 15 mm-15.2 mm.

[0090] Optionally, the depth of the stepped hole 23 may be 20 mm to 25 mm.

[0091] Optionally, the sealing ring 72 may be clearance-matched with the second hole section and the door guide rod 52 , respectively, so that the door guide rod 52 can be limited by the sealing ring 72 to keep the door guide rod 52 vertical.

[0092] Optionally, the diameter of the hole in the sealing ring 72 may be 5 mm to 5.1 mm.

[0093] Optionally, the outer diameter of the sealing ring 72 may be 14.9 mm-15 mm.

[0094] Optionally, the sealing ring 72 may be made of aluminum.

[0095] In a preferred embodiment of the present invention, the distance from one end of the bellows 73 that is sealedly connected to the door guide rod 52 to the other end of the bellows 73 that is sealedly connected to the sealing ring 72 can be smaller than the original length of the bellows 73 when not subjected to external force, so that the bellows 73 can be in a compressed state, exerting a clamping force on the sealing ring 72, and pressing the sealing ring 72 against the sealing ring 71 and the step surface.

[0096] Such a design can keep the bellows 73 in a compressed state at all times, so that the rebound force of the bellows 73 is applied to the sealing ring 72, thereby applying a pressing force to the sealing ring 72 and pressing the sealing ring 72 against the sealing ring 71 and the step surface.

[0097] Optionally, the distance from one end of the bellows 73 sealed with the door guide rod 52 to the step surface may be 45 mm to 50 mm.

[0098] Optionally, the thickness of the sealing ring 72 may be 4 mm to 6 mm.

[0099] Optionally, the original length of the bellows 73 when not subjected to external force may be 55 mm to 60 mm.

[0100] In this way, the distance from one end of the bellows 73 sealed with the door guide rod 52 to the other end of the bellows 73 sealed with the sealing ring 72 can be smaller than the original length of the bellows 73 when not subjected to external force.

[0101] Optionally, the ultimate compression length of the bellows 73 may be 10 mm to 15 mm, so that the effective stroke of the bellows 73 is 40 mm to 50 mm.

[0102] like Figure 2-Figure 5As shown, optionally, the process chamber may further include an inner liner 8, which is annular and arranged around the inner side of the inner wall of the chamber body 1, with one end connected to the top of the chamber body 1 and the other end arranged around the supporting component 2 for shielding the inner wall of the chamber body 1. A transmission hole 81 for transmitting the wafer 10 is also provided on the inner liner 8, and the transmission hole 81 is arranged corresponding to the transmission channel 11 to allow the robot 9 and the wafer 10 to pass through.

[0103] like Figure 2-Figure 5 As shown, optionally, an interface disk 24 is provided in the internal space 22 of the carrying component 2 , and a through hole is opened on the interface disk 24 for three ejector pins 31 to pass through.

[0104] In semiconductor equipment such as an etcher, a lower electrode is provided in the carrier component 2. The lower electrode is used to generate a lower radio frequency to attract the plasma in the chamber body 1 during the semiconductor process to bombard the wafer 10 on the carrier component 2. The circuit of the lower electrode can be passed through the interface disk 24.

[0105] In summary, the process chamber of the semiconductor equipment provided by the embodiment of the present invention can improve the working efficiency and working stability of the semiconductor equipment and reduce the cost of the semiconductor equipment.

[0106] It will be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art will be able to make various modifications and improvements without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A process chamber of a semiconductor device, characterized in that: The chamber comprises a chamber body, a carrying component, an ejector assembly, a drive assembly, an inner door assembly, and a synchronization assembly, wherein the chamber body is provided with a transmission channel for wafer transmission; the carrying component is arranged in the chamber body and has a carrying surface for carrying the wafer; the ejector assembly is arranged in the internal space of the carrying component and can pass through the carrying component to the carrying surface; the drive assembly is arranged in the internal space of the carrying component and is connected to the ejector assembly for driving the ejector assembly to rise or fall; The inner door assembly is arranged in the chamber body; the synchronization assembly is arranged in the internal space of the bearing component, and is respectively connected to the driving assembly and the inner door assembly, and is used to synchronously drive the inner door assembly to descend or rise while the driving assembly drives the ejector assembly to rise or fall, and open or close the transmission channel through the inner door assembly.

2. The process chamber of the semiconductor equipment according to claim 1, wherein: The synchronization component includes a first connecting rod and a support rod, one end of the support rod is fixedly arranged at the bottom of the internal space of the bearing component, and the other end is connected to the middle part of the first connecting rod, and the first connecting rod can be rotated in the vertical direction, one end of the first connecting rod is rotatably connected to the driving component, and the other end is rotatably connected to the inner door component, one end of the first connecting rod can rise or fall under the drive of the driving component, and the other end can fall or rise at the same time, so as to synchronously drive the inner door assembly to fall or rise.

3. The process chamber of the semiconductor equipment according to claim 2, wherein: The other end of the support rod is provided with a first connecting pin, and the other end of the support rod is rotatably connected to the middle part of the first connecting rod through the first connecting pin.

4. The process chamber of the semiconductor equipment according to claim 2, wherein: The driving assembly includes a driving member, a transmission rod and a second connecting rod, wherein the driving member is connected to the ejector assembly through the transmission rod, so as to drive the ejector assembly to rise or fall by driving the transmission rod to rise or fall; One end of the second connecting rod is connected to the driving member through the transmission rod, and the other end is provided with a second connecting pin. The other end of the second connecting rod is rotatably connected to one end of the first connecting rod through the second connecting pin.

5. The process chamber of the semiconductor equipment according to claim 2, wherein: The inner door assembly includes a door body and a door guide rod, and the door body is arranged corresponding to the transmission channel; The door guide rod is bent, one end of the door guide rod is connected to the bottom of the door body, and the other end penetrates into the internal space of the supporting component and is provided with a third connecting pin. The other end of the door guide rod is rotatably connected to the other end of the first connecting rod through the third connecting pin.

6. The process chamber of the semiconductor equipment according to claim 2, wherein: A distance from the middle of the first connecting rod to the one end of the first connecting rod is a first distance, and a distance from the middle of the first connecting rod to the other end of the first connecting rod is a second distance, and the first distance is smaller than the second distance.

7. The process chamber of the semiconductor equipment according to claim 6, wherein: The ratio of the first distance to the second distance is 1:3-1:

2.

8. The process chamber of the semiconductor equipment according to claim 5, wherein: A through hole is provided at the bottom of the bearing component for the door guide rod to penetrate into the internal space of the bearing component. The inner door assembly also includes a sealing assembly, which is respectively sealedly connected to the through hole and the part of the door guide rod that penetrates into the internal space of the bearing component to seal the through hole.

9. The process chamber of the semiconductor equipment according to claim 8, wherein: The sealing assembly includes a sealing ring, a sealing ring and a retractable bellows. The through hole is a stepped hole, the stepped surface of the stepped hole faces the internal space of the bearing component, and the stepped surface is provided with an annular sealing groove for the sealing ring to be embedded. The sealing ring is sleeved around the door guide rod and pressed against the sealing ring and the stepped surface. The sealing ring is used to seal between the stepped surface and the sealing ring. The bellows is sleeved on the outside of the part of the door guide rod that penetrates into the internal space of the bearing component. One end of the bellows is sealedly connected to the part of the door guide rod that penetrates into the internal space of the bearing component, and the other end is sealedly connected to the sealing ring, which is used to seal between the door guide rod and the sealing ring that can be relatively lifted and lowered.

10. The process chamber of the semiconductor equipment according to claim 9, wherein: The distance between one end of the bellows sealedly connected to the door guide rod and the other end of the bellows sealedly connected to the sealing ring is smaller than the original length of the bellows when not subjected to external force, so that the bellows can be in a compressed state, applying a clamping force to the sealing ring, and pressing the sealing ring against the sealing ring and the step surface.

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