Silicon wafer transfer device

Abstract

The present application relates to the field of silicon processing technology, and in particular to a silicon wafer transfer device, comprising: a transfer mechanism having a receiving portion; a first loading mechanism comprising a first receiving portion and a second receiving portion at least located on the same straight line; the second receiving portion obtains the silicon wafer on the second workstation; at a first interaction point, the first receiving portion receives the silicon wafer on the receiving portion, and after the receiving portion transfers the silicon wafer it carries to the first receiving portion, the receiving portion and / or the second receiving portion translates, so that the receiving portion interacts with the second receiving portion and receives the silicon wafer; a second loading mechanism having at least a third receiving portion; the projection of the second interaction point along the height direction of the second loading mechanism coincides with the second workstation. The present application shortens the path length, duration, and number of round trips for transporting silicon wafers by a single mechanism through the cooperation of the transfer mechanism, the first loading mechanism, and the second loading mechanism, thereby greatly improving the efficiency of silicon wafer transport, reducing the movement amplitude of the mechanism, reducing the difficulty of transport, and improving the transport accuracy of silicon wafers.

Description

Technical Field

[0001] The present application relates to the field of silicon processing technology, and in particular to a silicon wafer transfer device. Background Art

[0002] Silicon wafers, as excellent conductive materials, are widely used in technologies such as semiconductors and solar cells. Post-processing of silicon wafers generally includes chamfering, cleaning, and drying. The resulting wafers typically have sharp edges, so chamfering is necessary to round these edges.

[0003] However, in the processing technology of the prior art, when performing multiple processing steps such as positioning detection, chamfering, cleaning and drying on silicon wafers one by one, it is necessary to transfer the silicon wafers between the two stations through a transfer mechanism. For example, the transfer mechanism transfers the silicon wafer from the detection station to the chamfering station. If there is a silicon wafer that has been chamfered last time at the chamfering station, the transfer mechanism needs to first put down the silicon wafer obtained from the detection station and transfer the silicon wafer at the chamfering station. Only then can it return to the chamfering station to transfer the silicon wafer obtained from the detection station to the chamfering station. It can be seen that the transfer mechanism needs to go back and forth many times to complete the transfer of a silicon wafer, which seriously affects the efficiency of silicon wafer transportation and causes some processing stations to be vacant, affecting the overall processing efficiency of the silicon wafer; not only that, the movement distance of the transfer mechanism to transfer the silicon wafer from the detection station to the chamfering station is the interval between the two processing stations. The movement distance is long, resulting in more time spent on silicon wafer transportation, and the movement amplitude of the transfer mechanism is too large, resulting in difficulty in ensuring movement accuracy. Summary of the Invention

[0004] Based on this, it is necessary to provide a silicon wafer transfer device that can efficiently transfer silicon wafers.

[0005] The technical solutions provided in this application are as follows:

[0006] A silicon wafer transfer device capable of transferring silicon wafers between at least a first workstation and a second workstation; the silicon wafer transfer device comprises:

[0007] a transfer mechanism having a receiving portion for receiving a silicon wafer, the transfer mechanism being configured to receive and transfer the silicon wafer between at least the first station and the second station;

[0008] The first loading mechanism includes at least a first receiving portion and a second receiving portion, wherein the first receiving portion and the second receiving portion are located on the same straight line; the second receiving portion is used to obtain the silicon wafer on the second workstation and interact with the receiving portion at a first interaction point; at the first interaction point, the first receiving portion receives the silicon wafer on the receiving portion, and after the receiving portion transfers the silicon wafer it carries to the first receiving portion, the receiving portion and / or the second receiving portion moves horizontally so that the receiving portion interacts with the second receiving portion and receives the silicon wafer;

[0009] The second loading mechanism has at least one third receiving part for receiving silicon wafers; wherein, the projection of the second interaction point along the height direction of the second loading mechanism coincides with the second workstation, and the third receiving part receives the silicon wafer on the first receiving part at the second interaction point, and carries the obtained silicon wafer down in a straight line to the second workstation.

[0010] In one embodiment, the first loading mechanism includes: a first support; a first suspension arm, one end of the first suspension arm is arranged on the first support and can move relative to the first support, and the other end of the first suspension arm is provided with the first material receiving part and the second material receiving part; a first moving component, used to drive the first suspension arm to move relative to the first support, so as to drive the first material receiving part and the second material receiving part to receive the silicon wafer.

[0011] In one embodiment, the first moving component includes a first rotating component, the first rotating component includes a first driving member and a first rotating shaft, the first driving member is arranged on the first support, the first rotating shaft is respectively connected to the first driving member and the first boom, the first driving member drives the first rotating shaft to rotate, so as to drive the first boom to rotate around the first rotating shaft.

[0012] In one embodiment, the first moving assembly includes a first translation assembly, the first boom includes a first arm body and a second arm body, one end of the first arm body is connected to the first rotating shaft, and the other end is connected to the first translation assembly; the second arm body is connected to the first translation assembly, and the first material receiving part and the second material receiving part are provided on the second arm body; wherein, the first translation assembly is used to drive the second arm body to perform linear motion along the height direction of the first support, so as to drive the first material receiving part and the second material receiving part to translate along the height direction of the first support.

[0013] In one embodiment, the second loading mechanism includes: a second support; a second lifting arm, one end of which is arranged on the second support and the other end of which is provided with at least one third receiving part, and the third receiving part is used to receive silicon wafers; a second moving assembly, the second moving assembly is arranged on the second support and connected to the second lifting arm, and is used to drive the second lifting arm to move relative to the second support, so as to drive the third receiving part to transfer silicon wafers with the first receiving part and transfer the obtained silicon wafers to the second workstation.

[0014] In one embodiment, the second moving assembly includes a second rotating assembly and a second translation assembly; the second rotating assembly is arranged on the second support, and is used to drive the second boom to perform rotational motion relative to the second support; the second translation assembly is arranged on the second support, and is used to drive the second boom to perform translational motion along the height direction of the second support.

[0015] In one embodiment, the second translation assembly includes: a guide rail, which is extended along the height direction of the second support and is arranged on the second support; a guide block, which is slidably arranged on the guide rail and connected to the second boom; and a second driving member, which is connected to the guide block and is used to drive the guide block to slide relative to the guide rail.

[0016] In one embodiment, the second loading mechanism also includes a third translation assembly, the second boom includes a third arm body and a fourth arm body, one end of the third arm body is connected to the second rotating assembly, and the other end is connected to the third translation assembly; the fourth arm body is connected to the third translation assembly, and the third material receiving part is provided on the fourth arm body; wherein, the third translation assembly is used to drive the fourth arm body to translate along the height direction of the second support, so as to drive the third material receiving part to translate along the height direction of the second support.

[0017] In one embodiment, the first loading mechanism includes a first boom and a first support, one end of the first boom is set on the first support, and the other end is suspended in the air, and the first boom can move relative to the first support; wherein, the first support and the second support are set as an integrated structure.

[0018] In one embodiment, the silicon wafer transfer device further includes a limiting member, which is respectively arranged on the movement paths of the first loading mechanism and the second loading mechanism, and is used to stop and limit the corresponding first loading mechanism and the second loading mechanism.

[0019] Compared with the prior art, the silicon wafer transfer device provided in the present application shortens the distance and time of a single transfer of each mechanism through the cooperation of a transfer mechanism, a first loading mechanism and a second loading mechanism, thereby improving the transfer efficiency; further, the first receiving part and the second receiving part are located on the same straight line, and the projection of the second interaction point along the height direction coincides with the second workstation. It can be understood that when transferring silicon wafers, the first loading mechanism obtains the processed silicon wafers through the second receiving part at the second workstation and moves to the first interaction point. At the first interaction point, the receiving part of the transfer mechanism transfers the silicon wafers on it to the first receiving part, and then the receiving part and / or the second receiving part are linearly translated so that the receiving part and the second receiving part interactively receive the silicon wafers (wherein, linear translation refers to translation in the horizontal direction or translation in the height direction of the first loading mechanism). In this way, the transfer mechanism can deliver the silicon wafers to the first loading mechanism while also receiving the silicon wafers transferred by the first loading mechanism. This reduces the number of round trips between the transfer mechanism and the first loading mechanism, significantly shortening the silicon wafer transfer process. The distance and time of transfer between the two workstations, and the linear translational motion are also beneficial to shortening the movement distance and movement amplitude of the transfer mechanism and the first loading mechanism, thereby improving the positioning and movement accuracy of the transfer mechanism and the first loading mechanism, reducing the difficulty of movement, and improving the efficiency of transfer; after the first loading mechanism completes the interaction with the transfer mechanism, the first receiving part moves to the second interaction point to interact with the third receiving part. After the third receiving part receives the silicon wafer on the first receiving part, it can move straight down to the second workstation and place the resulting silicon wafer at a predetermined position, thereby reducing the movement path length and movement amplitude of the third receiving part, thereby improving its positioning and movement accuracy, reducing the difficulty of movement, so that the silicon wafer can be accurately placed at the preset position, and avoiding the position of the silicon wafer to be adjusted again during subsequent processing at the second workstation; this application shortens the length of the transfer path through multi-faceted coordination among the transfer mechanism, the first loading mechanism, the second loading mechanism and the corresponding workstations, greatly improving the efficiency of silicon wafer transfer, simplifying the difficulty of transfer, and improving movement accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 This is a schematic diagram of the application of the silicon wafer transfer device provided in one embodiment of the present application.

[0022] Figure 2 A schematic structural diagram of the first feeding mechanism and the second feeding mechanism provided for an implementation of the present application.

[0023] Figure 3 for Figure 2 Right side view of the first feeding mechanism and the second feeding mechanism.

[0024] Figure 4 for Figure 2 A top view of the first feeding mechanism and the second feeding mechanism.

[0025] Figure 5 for Figure 4 Front view of the first feeding mechanism and the second feeding mechanism.

[0026] Figure 6 A schematic diagram of a first loading mechanism and a second loading mechanism installed on a work station provided for another embodiment of the present application.

[0027] Figure 7 for Figure 6 A partial enlarged view of point A in the figure.

[0028] Reference numerals: 100, silicon wafer transfer device; 10, transfer mechanism; 11, receiving portion; 20, first loading mechanism; 21, first receiving portion; 22, second receiving portion; 23, first support; 24, first suspension arm; 241, first arm body; 242, second arm body; 25, first moving assembly; 251, first rotating assembly; 2511, first driving member; 2512, first rotating shaft; 252, first translation assembly; 2521, first cylinder; 2522, slider; 2523, slide rail; 30, second loading mechanism; 31, second support; 32. Second boom; 321. Third arm body; 322. Fourth arm body; 33. Third material receiving part; 34. Second moving assembly; 341. Second rotating assembly; 3411. Third driving member; 3412. Second rotating shaft; 342. Second translation assembly; 3421. Guide rail; 3422. Guide block; 3423. Second driving member; 343. Third translation assembly; 40. Limiting member; 200. Silicon wafer; 300. Positioning detection device; 400. Chamfering device; 500. Cleaning device; A1. First interaction point; A2. Second interaction point. DETAILED DESCRIPTION

[0029] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0030] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0032] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is higher in level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is lower in level than the second feature.

[0033] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more of the relevant listed items.

[0034] See also Figure 1An embodiment of the present application provides a silicon wafer transfer device 100, which can transfer silicon wafers 200 between at least a first workstation and a second workstation; the silicon wafer transfer device 100 includes a transfer mechanism 10, a first loading mechanism 20, and a second loading mechanism 30; wherein the transfer mechanism 10 has a receiving portion 11 for receiving the silicon wafer 200, and the transfer mechanism 10 is used to transfer the silicon wafer 200 between at least the first workstation and the second workstation; the first loading mechanism 20 includes at least a first receiving portion 21 and a second receiving portion 22, and the first receiving portion 21 and the second receiving portion 22 are located on the same straight line; the second receiving portion 22 is used to obtain the silicon wafer 200 on the second workstation and carry the obtained silicon wafer 200 to the first interaction point A1 Interacts with the receiving part 11; at the first interaction point A1, the first receiving part 21 receives the silicon wafer on the receiving part 11, and after the receiving part 11 transfers the silicon wafer 200 it carries to the first receiving part 21, the receiving part and / or the second receiving part 22 moves horizontally to make the receiving part 11 interact with the second receiving part 22 and receive the silicon wafer 200 on the second receiving part; the second loading mechanism 30 has at least one third receiving part 33 for receiving the silicon wafer 200; wherein, the projection of the second interaction point A2 along the height direction of the second loading mechanism 30 coincides with the second workstation, and the third receiving part 33 receives the silicon wafer 200 on the first receiving part 21 at the second interaction point A2, and carries the obtained silicon wafer 200 and moves straight down to the second workstation.

[0035] It can be understood that the silicon wafer transfer device 100 provided in the present application, through the cooperation of the transfer mechanism 10, the first loading mechanism 20 and the second loading mechanism 30, shortens the distance and time of a single transfer of each mechanism, and improves the transfer efficiency; further, the first receiving portion 21 and the second receiving portion 22 are located on the same straight line, and the projection of the second interaction point A2 along the height direction coincides with the second station. When the silicon wafer 200 is transferred, the first loading mechanism 20 obtains the processed silicon wafer 200 at the second station through the second receiving portion 22, and moves to the first interaction point A1, and at the first interaction point A 1, the receiving portion 11 of the transfer mechanism 10 transfers the silicon wafer 200 thereon to the first receiving portion 21, and then the receiving portion 11 and / or the second receiving portion 22 are linearly translated so that the receiving portion 11 and the second receiving portion 22 alternately receive the silicon wafer 200 (wherein, linear translation refers to translation in the horizontal direction or translation in the height direction of the first loading mechanism 20). In this way, the transfer mechanism 10 can deliver the silicon wafer 200 to the first loading mechanism 20 while receiving the silicon wafer 200 transferred by the first loading mechanism 20, thereby reducing the number of round trips between the transfer mechanism 10 and the first loading mechanism 20. , significantly shortening the distance and time of transferring the silicon wafer 200 between the two workstations, and the linear translation motion is also conducive to shortening the movement distance and movement amplitude of the transfer mechanism 10 and the first loading mechanism 20, thereby improving the positioning and movement accuracy of the transfer mechanism 10 and the first loading mechanism 20, reducing the movement difficulty, and improving the efficiency of transfer; after the first loading mechanism 20 completes the interaction with the transfer mechanism 10, the first receiving portion 21 moves to the second interaction point A2 to interact with the third receiving portion 33, and the third receiving portion 33 receives the silicon wafer 200 on the first receiving portion 21 and can move straight down to the second The first loading mechanism 20 and the second loading mechanism 30 cooperate with each other in many aspects, thereby shortening the length of the transfer path and the amplitude of the movement of the third receiving portion 33, thereby improving the accuracy of its positioning and movement, reducing the difficulty of movement, so that the silicon wafer 200 can be accurately placed at the preset position, and avoiding the need to adjust the position of the silicon wafer 200 again during subsequent processing at the second station; the present application shortens the length of the transfer path through the multi-faceted coordination of the transfer mechanism 10, the first loading mechanism 20, the second loading mechanism 30 and the corresponding stations, greatly improving the efficiency of silicon wafer transportation, simplifying the difficulty of transportation, and improving movement accuracy.

[0036] It should be noted that suction cups for carrying and fixing silicon wafers are provided on both the first and second stations. The projection of the second interaction point A2 along the height direction of the second loading mechanism 30 coincides with the suction cup at the second station. In other words, when the third receiving portion 33 moves to the second interaction point A2, the projection of the center of the third receiving portion 33 along the height direction coincides with the center of the suction cup on the second station. In this way, the third receiving portion 33 can move downward in a straight line after receiving the silicon wafer on the first receiving portion 21, so that the silicon wafer on the third receiving portion 33 can be accurately placed on the suction cup of the corresponding station. In this way, the corresponding station does not need to adjust the position of the silicon wafer, or only needs to fine-tune the position of the silicon wafer to achieve the positioning of the silicon wafer, so as to facilitate the processing of the silicon wafer. In particular, in the chamfering device, if there is a large deviation in the placement position of the silicon wafer, the chamfering device will need to adjust the position of the silicon wafer and adjust the chamfering route accordingly before the chamfering operation can be performed.

[0037] In one embodiment, Figure 2 and Figure 7 As shown, along the height direction of the first loading mechanism 20, the first receiving portion 21 is located directly above the second receiving portion 22. In this way, after the receiving portion 11 interacts with the first receiving portion 21, the receiving portion 11 can move straight down to interact with the second receiving portion 22, or the second receiving portion 22 can move straight up relative to the receiving portion 11 and intersect the silicon wafer with the receiving portion 11. The straight-line distance between the two points is the shortest. In this way, the movement distance between the receiving portion 11 and the second receiving portion can be shortened, which is conducive to reducing the movement amplitude of the transfer mechanism and / or the first loading mechanism and improving the positioning and movement accuracy of the two. In addition, the first receiving portion 21 and the second receiving portion 22 are arranged along the height direction, thereby reducing the space occupied in the horizontal direction. Of course, in other embodiments, the first receiving portion 21 and the second receiving portion 22 can also be arranged in the same horizontal plane along the horizontal direction.

[0038] The silicon wafer transfer device 100 is used to transfer silicon wafers 200 between at least two workstations. Of course, the silicon wafers 200 can also be transferred between multiple workstations. When the silicon wafers 200 are transferred between more than two workstations, a first loading mechanism 20 can be equipped on multiple workstations, and multiple workstations can share a transfer mechanism 10.

[0039] In one embodiment, please continue to see Figure 1When the silicon wafers 200 are subjected to multiple processing steps such as positioning detection, chamfering, cleaning and drying one by one, the present application completes the transfer of the silicon wafers 200 between the positioning detection device 300, the chamfering device 400 and the cleaning device 500 through the silicon wafer transfer device 100. In this embodiment, the positioning detection device 300, the chamfering device 400 are set, and the cleaning device 500 is equipped with a workstation. It can be understood that when the silicon wafer 200 is transferred between the positioning detection device 300 and the chamfering device 400, the workstation where the positioning detection device 300 is located is the first workstation, and the workstation where the chamfering device 400 is located is the second workstation; when the silicon wafer 200 is transferred between the chamfering device 400 and the cleaning device 500, the workstation where the chamfering device 400 is located is the first workstation, and the workstation where the cleaning device 500 is located is the second workstation. Therefore, the first workstation and the second workstation are relative concepts and do not represent the order and number of workstations. The silicon wafer transfer device 100 of the present application is suitable for transferring silicon wafers 200 between multiple workstations.

[0040] Specifically, such as Figure 1 As shown, the chamfering device 400 and the cleaning device 500 are both provided with a first loading mechanism 20 and a second loading mechanism 30, and the positioning detection device 300, the chamfering device 400, and the cleaning device 500 are arranged on the surrounding side of the transfer mechanism 10. In this way, through the handover and cooperation between the transfer mechanism 10 and the first loading mechanism 20, silicon wafers 200 and the processed silicon wafers 200 can be provided to multiple workstations in a timely manner. In the present application, the transfer mechanism 10 transfers the uninspected silicon wafer 200 to the inspection device for inspection, then transfers the inspected silicon wafer 200 to the first interaction point A1 of the chamfering device 400 and transfers the silicon wafer 200 to the first loading mechanism 20 of the chamfering device 400. In this way, the first loading mechanism 20 obtains the inspected silicon wafer 200 and transfers the chamfered silicon wafer 200 to the transfer mechanism 10. The transfer mechanism 10 then moves to the first interaction point A1 of the cleaning device 500, transfers the chamfered silicon wafer 200 to the first loading mechanism 20 of the cleaning device 500, and receives the cleaned silicon wafer 200 obtained by the first loading mechanism 20 from the cleaning device 500, thereby transferring the cleaned silicon wafer 200 to the storage location, thereby completing the chamfering process of the silicon wafer 200. In other embodiments, the silicon wafer transfer device 100 can also be used in other processes for processing silicon wafers 200.

[0041] In this embodiment, see Figure 5 and Figure 7The first receiving portion 21 and the second receiving portion 22 are both configured as suction cups, which generate suction to adsorb the silicon wafer 200 to prevent damage to the silicon wafer 200. Of course, they can also be configured as clamps to grip the silicon wafer 200. In addition, the suction cup of the first receiving portion 21 faces upward, while the suction cup of the second receiving portion 22 faces downward. In this way, when the second receiving portion 22 moves to the second station, it can directly translate along the height direction of the first support 23 until it adsorbs the silicon wafer 200 on the second station without adjusting the direction of the suction cup. Similarly, when the first receiving portion 21 interacts with the transfer mechanism 10, the transfer mechanism 10 can directly place the silicon wafer 200 on the suction cup of the first receiving portion 21.

[0042] like Figures 1 to 5 As shown, the first loading mechanism 20 includes a first support 23, a second lifting arm 32, and a first moving assembly 25. One end of the first lifting arm 24 is disposed on the first support 23 and is movable relative to the first support 23. The other end of the first lifting arm 24 is provided with a first receiving portion 21 and a second receiving portion 22. The first moving assembly 25 is used to drive the first lifting arm 24 to move relative to the first support 23, so that the first lifting arm 24 drives the first receiving portion 21 and the second receiving portion 22 to move and receive the silicon wafer 200. Of course, in other embodiments, the specific structure of the first loading mechanism 20 is not limited to the above. For example, the first receiving portion 21 and the second receiving portion 22 may be disposed on a multi-degree-of-freedom robotic arm, and the movement of the robotic arm drives the first receiving portion 21 and the second receiving portion 22 to receive the silicon wafer 200.

[0043] In this embodiment, the first moving component 25 can drive the first arm 24 to rotate and / or translate relative to the first support 23, thereby driving the first material receiving part 21 and the second material receiving part 22 to move and cooperate with the transfer mechanism 10 to achieve the acquisition and transportation of the silicon wafer 200.

[0044] Please continue reading Figures 2 to 5 In this embodiment, the first moving component 25 includes a first rotating component 251, and the first rotating component 251 includes a first driving member 2511 and a first rotating shaft 2512. The first driving member 2511 is arranged on the first support 23, and the first rotating shaft 2512 is respectively connected to the first driving member 2511 and the first hanging arm 24. The first driving member 2511 drives the first rotating shaft 2512 to rotate, so as to drive the first hanging arm 24 to rotate around the first rotating shaft 2512, so that the first hanging arm 24 can rotate relative to the first support 23, thereby adjusting the position of the first material receiving part 21 and the second material receiving part 22.

[0045] Please continue reading Figures 2 to 5In this embodiment, the first moving component 25 includes a first translation component 252, which is used to drive the first boom 24 to move along the height direction of the first support 23, so as to drive the first material receiving part 21 and the second material receiving part 22 to translate along the height direction of the first support 23.

[0046] Please continue reading Figures 2 to 5 The first arm 24 includes a first arm body 241 and a second arm body 242. One end of the first arm body 241 is connected to the first rotating shaft 2512, and the other end is connected to the first translation assembly 252. The second arm body 242 is connected to the first translation assembly 252, and the second arm body 242 is provided with a first material receiving portion 21 and a second material receiving portion 22. The first translation assembly 252 is used to drive the second arm body 242 to perform linear motion along the height direction of the first support 23, so as to drive the first material receiving portion 21 and the second material receiving portion 22 to translate along the height direction of the first support 23. The first translation assembly 252 cooperates with the first rotating assembly 251 to adjust the position of the first material receiving portion 21 and the second material receiving portion 22, and cooperates with the transfer mechanism 10 to complete the handover and transportation of the silicon wafer 200. Of course, the present application does not limit the specific structure of the first moving assembly 25, and the first moving assembly 25 is not limited to including the first rotating assembly 251 and the first translation assembly 252 described above.

[0047] like Figure 5 As shown, the first translation assembly 252 includes a first cylinder 2521, the telescopic rod of the cylinder is extended and retracted along the height direction of the first support 23, and the telescopic rod is connected to the second arm 242, so that when the telescopic rod of the cylinder is extended or retracted, the second arm 242 is driven to move up or down along the height direction of the first support 23. The specific structure of the first translation assembly 252 is not limited to the above description or the figure, and the location of the first translation assembly 252 is not limited to the above description. For example, in another embodiment, as shown in FIG. Figure 6 and Figure 7 As shown, the first cylinder 2521 is disposed on the first support 23, and the telescopic rod of the first cylinder 2521 extends in the height direction of the first support 23. One end of the first suspension arm 24 is connected to the telescopic rod and is slidably connected to the first support 23. In this way, when the telescopic rod is extended or retracted, it can drive the first suspension arm 24 to move in the height direction relative to the first support 23. The first suspension arm 24 is an integrated structure and does not need to be divided into a first arm body 241 and a second arm body 242.

[0048] Please continue reading Figure 6 and Figure 7The first translation assembly 252 also includes a slider 2522 and a slide rail 2523. The slide rail 2523 extends along the height direction of the first support 23. The slider 2522 is slidably arranged on the slide rail 2523. The telescopic rod of the first cylinder 2521 is connected to the slider 2522. One end of the first suspension arm 24 is connected to the slider 2522. When the telescopic rod of the first cylinder 2521 is extended or retracted, it drives the slider 2522 to move along the slide rail 2523. The cooperation between the slider 2522 and the slide rail 2523 prevents the movement path of the first suspension arm 24 from being deviated, and makes the movement of the first suspension arm 24 more stable. Among them, one end of the first suspension arm 24 is connected to the slider 2522. It can be understood that the first suspension arm 24 is indirectly connected to the slider 2522 through the first rotating shaft 2512. Figure 7 As shown, the first rotating shaft 2512 is rotatably connected to the slider 2522 , and the first hanging arm 24 is connected to the first rotating shaft 2512 , so that the first hanging arm 24 can rotate relative to the slider 2522 to adjust the positions of the first material receiving portion 21 and the second material receiving portion 22 .

[0049] Please continue reading Figures 1 to 7 The second loading mechanism 30 includes a second support 31 and a second lifting arm 32. One end of the second lifting arm 32 is arranged on the second support 31, and the other end is provided with at least one third receiving part 33. The third receiving part 33 is used to receive the silicon wafer 200; the second moving component 34 is arranged on the second support 31 and connected to the second lifting arm 32, and is used to drive the second lifting arm 32 to move relative to the second support 31, so as to drive the third receiving part 33 to transfer the silicon wafer 200 with the first loading mechanism 20 and transfer the obtained silicon wafer 200 to the second workstation.

[0050] Specifically, such as Figures 2 to 5 As shown, in one embodiment, the second moving assembly 34 includes a second rotation assembly 341 and a second translation assembly 342; the second rotation assembly 341 is disposed on the second support 31 and is used to drive the second lifting arm 32 to rotate relative to the second support 31; the second translation assembly 342 is disposed on the second support 31 and is used to drive the second lifting arm 32 to translate along the height direction of the second support 31, thereby adjusting the position of the third material receiving portion 33 so that the third material receiving portion 33 is transferred between the second interaction point A2 and the second workstation to transport the silicon wafer 200. Of course, in other embodiments, the specific structure of the second moving assembly 34 is not limited to the above description or the figure. For example, the second moving assembly 34 can also be configured as a multi-degree-of-freedom robotic arm or other driving assembly.

[0051] like Figures 2 to 7As shown, the second translation assembly 342 includes a guide rail 3421, a guide block 3422 and a second driving member 3423, wherein the guide rail 3421 is extended along the height direction of the second support 31 and is arranged on the second support 31, the guide block 3422 is slidably set on the guide rail 3421, and is connected to the second boom 32, and the second driving member 3423 is connected to the guide block 3422, for driving the guide block 3422 to slide relative to the guide rail 3421, thereby driving the second boom 32 to move along the height direction of the second support 31, and then adjusting and changing the position of the third material receiving part 33, so that the third material receiving part 33 is docked with the first loading structure and the second workstation and delivers the silicon wafer 200, and ensures the positioning and movement accuracy of the third material receiving part 33, and avoids the position of the third material receiving part from being offset.

[0052] In one embodiment, Figures 2 to 5 As shown, the second driving member 3423 is configured as a cylinder, and the telescopic rod of the cylinder is extended along the height direction of the second support 31, and the telescopic rod is connected to the guide block 3422, so that when the telescopic rod of the cylinder is extended or retracted, it can drive the guide block 3422 and the second boom 32 to move along the height direction of the second support 31. In other embodiments, the specific structure of the second driving member 3423 is not limited. For example, in another embodiment, Figure 6 and Figure 7 As shown, the second driving member 3423 is configured as a chain transmission member, and a transmission chain of the chain transmission member is connected to the guide block 3422 . When the transmission chain rotates, the guide block 3422 is driven to slide on the diffraction guide track 3421 .

[0053] In one embodiment, Figures 2 to 5 As shown, the second rotating assembly 341 includes a third driving member 3411 and a second rotating shaft 3412. The second rotating shaft 3412 is respectively connected to the third driving member 3411 and the second boom 32. When the third driving member 3411 drives the second rotating shaft 3412 to rotate, it drives the second boom 32 to rotate with the second rotating shaft 3412 as the rotation axis.

[0054] like Figures 2 to 7 As shown, the second loading mechanism 30 also includes a third translation assembly 343, which is used to further adjust the displacement of the second boom 32 along the height direction of the second support 31, and fine-tune the position of the third receiving part 33 when handing over the silicon wafer 200, so that the third receiving part 33 can obtain the silicon wafer 200.

[0055] Furthermore, in one embodiment, Figure 2 and Figure 3As shown, the second boom 32 includes a third arm body 321 and a fourth arm body 322, one end of the third arm body 321 is connected to the second rotating assembly 341, and the other end is connected to the third translation assembly 343; the fourth arm body 322 is connected to the third translation assembly 343, and the third material receiving part 33 is provided on the fourth arm body 322; the third translation assembly 343 drives the fourth arm body 322 to translate along the height direction of the second support 31, so as to drive the third material receiving part 33 to translate along the height direction of the second support 31.

[0056] Among them, such as Figure 2 or Figure 7 As shown, the third translation assembly 343 is configured as a cylinder, the telescopic rod of the cylinder is telescopic along the height direction of the second support 31 , and the telescopic rod is connected to the fourth arm 322 .

[0057] See Figure 5 and Figure 7 The third receiving portion 33 is configured as a suction cup, which generates suction to adsorb the silicon wafer 200 to avoid damage to the silicon wafer 200. Of course, it can also be configured as a clamp to grab the silicon wafer 200 through the clamp.

[0058] In this embodiment, if Figures 2 to 5 As shown, the first support 23 and the second support 31 are configured as an integral structure, so that the first suspension arm 24 and the second suspension arm 32 are integrated and arranged on the same support, simplifying the structure and reducing costs, while facilitating the integrated installation of the first loading mechanism 20 and the second loading mechanism at the corresponding processing station. Of course, in other embodiments, the first support 23 and the second support 31 can also be separate, so that the first loading mechanism 20 and the second loading mechanism 30 can move relative to each other and their relative positions can be adjusted. In this way, the positions of the first loading mechanism 20 and the second loading mechanism 30 can be adjusted separately according to the various processing stations used.

[0059] like Figure 1 or Figure 7As shown, along the height direction of the second support 31, the second interaction point A2 is located directly above the second station, so that after the second loading mechanism 30 receives the silicon wafer 200 from the first receiving portion 21, it can directly move down along the height direction of the second support 31 to directly above the second station to place the silicon wafer 200, without rotating and adjusting the relative position of the third receiving portion 33 and the second station, simplifying the transfer action, thereby improving the efficiency of the transfer of silicon wafers 200. In the initial state (i.e., the state when the first loading mechanism 20 and the second loading mechanism 30 have not started to transport the silicon wafer 200), the first boom 24 and the second boom 32 are arranged perpendicular to each other, so that the relative rotation angle of the first boom 24 and the second boom 32 is less than or equal to 90°, which can drive the third receiving portion 33 and the first receiving portion 21 to move to the second interaction point A2, shortening the rotation path of the first boom 24 and the second boom 32, and improving the efficiency of the interaction. Specifically, for example, Figure 1 As shown, the first boom 24 and the second boom 32 can move to the second interaction point A2 by rotating 45 degrees toward each other, so that the movement paths of the first boom 24 and the second boom 32 are shortened, thereby shortening the time for both to move to the second interaction point A2. In another embodiment, as Figure 6 As shown, along the height direction of the second support 31, the projection of the third material receiving portion 33 overlaps with the second interaction point A2. In this way, when interacting, only the first boom 24 needs to be rotated 90° to reach the second interaction point A2, and the second boom 32 does not need to be rotated. In this way, there is no need to set a rotating component on the second feeding mechanism 30, which simplifies the structure of the second feeding mechanism 30 and saves costs.

[0060] In this embodiment, the silicon wafer transport device 100 further includes a limiter 40, which is respectively arranged on the movement paths of the first loading mechanism 20 and the second loading mechanism 30, and is used to stop and limit the corresponding first loading mechanism 20 and the second loading mechanism 30. Figure 2 and Figure 3 As shown, the limiting member 40 is a baffle provided on the support, and the first suspension arm 24 and the second suspension arm 32 stop moving when they rotate toward each other and abut against the baffle. Figure 7 As shown, the limiting member 40 is configured as a baffle, which is disposed on the first support 23. Thus, when the first arm 24 rotates until it abuts the baffle, it stops moving and is limited by the baffle. The baffle is fixed to the support, providing high limiting stability. Of course, in other embodiments, the limiting member 40 can also be a sensor that monitors the rotation angles of the first arm 24 and the second arm 32, respectively, and transmits the angle information to the first and second feeding mechanisms 20 and 30. The first and second feeding mechanisms 20 and 30 control the opening and closing of the first and second moving assemblies 25 and 34 based on the angle signals to achieve limiting.

[0061] In this embodiment, if Figure 1 As shown, the transfer mechanism 10 is configured as a multi-degree-of-freedom robotic arm, and a receiving portion 11 is provided at one end of the robotic arm. The receiving portion 11 is configured as a clamping claw that can grip the silicon wafer 200. Of course, in other embodiments, the specific structure of the receiving portion 11 is not limited to the above, and for example, it can also be configured as a suction cup.

[0062] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0063] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of patent protection for the present application shall be determined by the appended claims.

Claims

1. A silicon wafer transfer device capable of transferring a silicon wafer (200) between at least a first station and a second station; characterized in that: The silicon wafer transfer device comprises: A transfer mechanism (10) having a receiving portion (11) for receiving a silicon wafer (200), wherein the transfer mechanism (10) is used to receive and transfer the silicon wafer (200) between at least the first station and the second station; A first loading mechanism (20) comprises at least a first receiving portion (21) and a second receiving portion (22), wherein the first receiving portion (21) and the second receiving portion (22) are located on the same straight line; the second receiving portion (22) is used to obtain the silicon wafer (200) on the second workstation and interact with the receiving portion (11) at a first interaction point (A1); at the first interaction point (A1), the first receiving portion (21) receives the silicon wafer (200) on the receiving portion (11), and after the receiving portion (11) transfers the silicon wafer (200) it carries to the first receiving portion (21), the receiving portion (11) and / or the second receiving portion (22) are translated so that the receiving portion (11) interacts with the second receiving portion (22) and receives the silicon wafer (200); The second loading mechanism (30) has at least one third receiving portion (33) for receiving the silicon wafer (200); wherein the projection of the second interaction point (A2) along the height direction of the second loading mechanism (30) coincides with the second workstation, and the third receiving portion (33) receives the silicon wafer (200) on the first receiving portion (21) at the second interaction point (A2), and carries the obtained silicon wafer (200) and moves linearly downward to the second workstation. Wherein, the first feeding mechanism (20) comprises: First support (23); a first suspension arm (24), one end of the first suspension arm (24) being disposed on the first support (23) and being movable relative to the first support (23), and the other end of the first suspension arm (24) being provided with the first material receiving portion (21) and the second material receiving portion (22); The first moving assembly (25) is used to drive the first suspension arm (24) to move relative to the first support (23), so as to drive the first receiving portion (21) and the second receiving portion (22) to receive the silicon wafer (200).

2. The silicon wafer transfer device according to claim 1, characterized in that: The first moving component (25) includes a first rotating component (251), and the first rotating component (251) includes a first driving member (2511) and a first rotating shaft (2512). The first driving member (2511) is arranged on the first support (23), and the first rotating shaft (2512) is respectively connected to the first driving member (2511) and the first suspension arm (24). The first driving member (2511) drives the first rotating shaft (2512) to rotate, so as to drive the first suspension arm (24) to rotate around the first rotating shaft (2512).

3. The silicon wafer transfer device according to claim 2, wherein: The first moving assembly (25) includes a first translation assembly (252); the first suspension arm (24) includes a first arm body (241) and a second arm body (242); one end of the first arm body (241) is connected to the first rotating shaft (2512), and the other end is connected to the first translation assembly (252); the second arm body (242) is connected to the first translation assembly (252), and the first material receiving portion (21) and the second material receiving portion (22) are provided on the second arm body (242); The first translation assembly (252) is used to drive the second arm (242) to perform linear motion along the height direction of the first support (23), thereby driving the first material receiving portion (21) and the second material receiving portion (22) to translate along the height direction of the first support (23).

4. The silicon wafer transfer device according to claim 1, wherein: The second feeding mechanism (30) comprises: a second support (31); A second suspension arm (32), one end of which is disposed on the second support (31), and the other end of which is provided with at least one third receiving portion (33), wherein the third receiving portion (33) is used to receive a silicon wafer (200); A second moving assembly (34) is provided on the second support (31) and is connected to the second suspension arm (32), and is used to drive the second suspension arm (32) to move relative to the second support (31), so as to drive the third material receiving portion (33) to transfer the silicon wafer (200) with the first material receiving portion (21) and transfer the obtained silicon wafer (200) to the second workstation.

5. The silicon wafer transport device according to claim 4, characterized in that: The second moving assembly (34) includes a second rotating assembly (341) and a second translating assembly (342); The second rotating assembly (341) is arranged on the second support (31) and is used to drive the second boom (32) to perform rotational motion relative to the second support (31); the second translation assembly (342) is arranged on the second support (31) and is used to drive the second boom (32) to perform translational motion along the height direction of the second support (31).

6. The silicon wafer transport device according to claim 5, characterized in that: The second translation assembly (342) includes: A guide rail (3421) is provided on the second support (31) and extends along a height direction of the second support (31); a guide block (3422), the guide block (3422) being slidably disposed on the guide rail (3421) and connected to the second suspension arm (32); The second driving member (3423) is connected to the guide block (3422) and is used to drive the guide block (3422) to slide relative to the guide rail (3421).

7. The silicon wafer transporting device according to claim 5, characterized in that: The second feeding mechanism (30) further includes a third translation assembly (343); the second suspension arm (32) includes a third arm body (321) and a fourth arm body (322); one end of the third arm body (321) is connected to the second rotation assembly (341), and the other end is connected to the third translation assembly (343); the fourth arm body (322) is connected to the third translation assembly (343), and the third material receiving portion (33) is provided on the fourth arm body (322); The third translation assembly (343) is used to drive the fourth arm (322) to translate along the height direction of the second support (31), thereby driving the third material receiving portion (33) to translate along the height direction of the second support (31).

8. The silicon wafer transporting device according to claim 5, characterized in that: The first loading mechanism (20) comprises a first suspension arm (24) and a first support (23), one end of the first suspension arm (24) is arranged on the first support (23), and the other end is suspended in the air, and the first suspension arm (24) can move relative to the first support (23); Wherein, the first support (23) and the second support (31) are configured as an integral structure.

9. The silicon wafer transporting device according to claim 1, wherein: The silicon wafer transfer device further comprises a limiting member (40), which is respectively arranged on the movement paths of the first loading mechanism (20) and the second loading mechanism (30), and is used for stopping and limiting the corresponding first loading mechanism (20) and the second loading mechanism (30).

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