Transducer and oscillator

Abstract

Vibrator and oscillator. High-precision temperature compensation is possible. The vibrator has a vibrating element and a package that houses the vibrating element, the vibrating element having a quartz substrate with a first vibration portion, a second vibration portion, and a third vibration portion, a pair of first excitation electrodes formed on the first vibration portion, a pair of second excitation electrodes formed on the second vibration portion, and a pair of third excitation electrodes formed on the third vibration portion, one of the second excitation electrodes of the pair of second excitation electrodes being formed on a first inclined surface inclined with respect to two main surfaces, one of the third excitation electrodes of the pair of third excitation electrodes being formed on a second inclined surface inclined with respect to the two main surfaces and the first inclined surface, and the vibrating element having a fixed portion fixed to the package, the fixed portion being disposed between the first vibration portion and the second vibration portion and between the first vibration portion and the third vibration portion.

Description

Technical Field

[0001] This invention relates to oscillators and oscillators. Background Technology

[0002] Temperature-compensated crystal oscillators (TCXOs) are widely used to obtain stable frequency signals over a wide temperature range. These TCXOs incorporate temperature sensing elements and temperature compensation circuits. However, in a TCXO, the oscillating element made of quartz and the temperature sensing element are separate components. Consequently, a detection error arises between the temperature detected by the temperature sensing element and the temperature of the oscillating element, making high-precision temperature compensation difficult.

[0003] Therefore, as shown in Patent Document 1, a piezoelectric vibrator is disclosed that has a first vibrating part for oscillation signal output and a second vibrating part for temperature detection on a common piezoelectric plate. Since two vibrating parts are formed on the common piezoelectric plate, heat transfer between the first and second vibrating parts is rapid. Therefore, compared to cases where the oscillation signal output element and the temperature detection element are configured separately, the detection error between the temperature detected by the second vibrating part for temperature detection and the temperature of the first vibrating part for oscillation signal output is reduced, enabling more accurate temperature compensation.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2013-98841

[0005] However, regarding the piezoelectric oscillator described in Patent Document 1, when piezoelectric plates with excitation electrodes formed on the first and second oscillating portions are mounted in a package, conductive bumps are used to fix the two ends of the piezoelectric plates, which are arranged side-by-side, along their length. Therefore, heat applied to the piezoelectric oscillator is transferred to the piezoelectric plates via the conductive bumps. However, because the conductive bumps are separated, a temperature difference may occur between the first and second oscillating portions, resulting in the problem that the temperature of the first oscillating portion used for oscillation signal output cannot be detected with high precision. Summary of the Invention

[0006] The oscillator has a vibrating element and a package housing the vibrating element. The vibrating element includes: a quartz substrate having a first vibrating portion, a second vibrating portion disposed on one side of the first vibrating portion in a first direction, and a third vibrating portion disposed on the same side and arranged alongside the second vibrating portion along a second direction orthogonal to the first direction; a pair of first excitation electrodes formed on two main surfaces of the quartz substrate at the first vibrating portion; a pair of second excitation electrodes formed at the second vibrating portion such that they sandwich the second vibrating portion in the thickness direction of the quartz substrate; and a pair of third excitation electrodes. Excitation electrodes are formed at the third vibration portion to sandwich the third vibration portion in the thickness direction of the quartz substrate. At least one of the pair of second excitation electrodes is formed on a first inclined surface that is inclined relative to the two main surfaces. At least one of the pair of third excitation electrodes is formed on a second inclined surface that is inclined relative to the two main surfaces and the first inclined surface. The vibration element has a fixing portion that is fixed to the package. The fixing portion is disposed between the first vibration portion and the second vibration portion and between the first vibration portion and the third vibration portion.

[0007] The oscillator comprises: the oscillator described above; a first oscillation circuit electrically connected to a first excitation electrode and outputting a first oscillation signal; a second oscillation circuit electrically connected to a second excitation electrode and outputting a second oscillation signal; a third oscillation circuit electrically connected to a third excitation electrode and outputting a third oscillation signal; and a control signal output circuit that is input to at least one of the second oscillation signal and the third oscillation signal and outputs a control signal for controlling the oscillation frequency of the first oscillation signal based on the input signal. Attached Figure Description

[0008] Figure 1 This is a top view showing the oscillator of the first embodiment.

[0009] Figure 2 yes Figure 1 Sectional view along line AA in the diagram.

[0010] Figure 3 This is a top view showing the relay substrate.

[0011] Figure 4 yes Figure 1 BB line section view.

[0012] Figure 5 This is a diagram showing the cutting angle of a quartz substrate.

[0013] Figure 6 This is a graph showing the relationship between the cutting angle of a quartz substrate and its frequency-temperature characteristics.

[0014] Figure 7 This is a diagram illustrating an example of the frequency-temperature characteristics of a vibrating element.

[0015] Figure 8 This is a cross-sectional schematic diagram showing the manufacturing process of the vibrating element.

[0016] Figure 9 This is a cross-sectional schematic diagram showing the manufacturing process of the vibrating element.

[0017] Figure 10 This is a cross-sectional schematic diagram showing the manufacturing process of the vibrating element.

[0018] Figure 11 This is a cross-sectional schematic diagram showing the manufacturing process of the vibrating element.

[0019] Figure 12 This is a cross-sectional schematic diagram showing the manufacturing process of the vibrating element.

[0020] Figure 13 This is a cross-sectional schematic diagram showing the manufacturing process of the vibrating element.

[0021] Figure 14 This is a top view showing the vibrating element of the second embodiment.

[0022] Figure 15 yes Figure 14 The CC line section view.

[0023] Figure 16 This is a top view showing the vibrating element of the third embodiment.

[0024] Figure 17 yes Figure 16 DD line section view.

[0025] Figure 18 This is a top view showing the vibrating element of the fourth embodiment.

[0026] Figure 19 yes Figure 18 EE line section view.

[0027] Figure 20 This is a top view showing the vibrating element of the fifth embodiment.

[0028] Figure 21 yes Figure 20 FF line section view.

[0029] Figure 22 This is a top view showing the relay substrate of the sixth embodiment.

[0030] Figure 23 This is a top view showing the relay substrate of the seventh embodiment.

[0031] Figure 24 This is a top view showing the oscillator of the eighth embodiment.

[0032] Figure 25 yes Figure 24 The cross-sectional view along the GG line.

[0033] Figure 26 This is a block diagram showing the circuit structure of the oscillator.

[0034] Figure 27 This is a block diagram showing the circuit structure of the oscillator according to the ninth embodiment.

[0035] Figure 28 This is a graph illustrating an example of the relationship between the difference in the frequency change of an oscillator and temperature.

[0036] Label Explanation

[0037] 1, 1a, 1b, 1c, 1d: Vibrating element; 2: Quartz substrate; 3: First vibrating part; 4: First excitation electrode; 5: Second vibrating part; 6: Second excitation electrode; 7: Third vibrating part; 8: Third excitation electrode; 9: Fixing part; 10, 11, 12: Terminals; 13, 14, 15: Lead electrodes; 16a: First main surface; 16b: Second main surface; 17: First inclined surface; 17r 18: Second inclined surface; 18r: Surface; 19: Through electrode; 20, 20a, 20b: Relay substrate; 21, 22, 23: Fixed terminal; 21a: First main surface; 21b: Second main surface; 24, 25, 26: Connecting electrode; 27, 28, 29: Connecting terminal; 27a, 28a, 29a: Side electrode; 30: Package; 31: First substrate; 32: Second substrate 33: Sealing ring; 34: Internal terminal; 35: Mounting terminal; 36: Cover component; 37a, 37b, 37c, 38: Connecting component; 61a: First oscillation circuit; 61b: Second oscillation circuit; 60: IC chip; 61c: Third oscillation circuit; 63: Control signal output circuit; 64b, 64c: Input terminal; 65: Output terminal; 66: Varactor diode; 67: Frequency detection unit; 68: Temperature estimation unit; 69: Compensation voltage calculation unit; 70: Addition unit; 90: Output selection circuit; 91: Selection control unit; 92: Output selection unit; 93: Temperature sensor; 100: Vibrator; 200, 200a: Oscillator; S, S1, S2: Chamber; X1: First vibration element; X2: Second vibration element; X3: Third vibration element; θ1, θ2, θ3: Angle. Detailed Implementation

[0038] 1. First Implementation Method

[0039] 1.1. Oscillator

[0040] First, regarding the general structure of the oscillator 100 in the first embodiment, the structure using the relay substrate 20 is given as an example, see below. Figure 1 , Figure 2 , Figure 3 and Figure 4 Please provide an explanation.

[0041] In addition, Figure 1 In the illustration, to better illustrate the internal structure of the oscillator 100, the cover component 36 is shown with the oscillator removed. Furthermore, in subsequent... Figures 1-5 and Figures 8 to 25 The Y' and Z' axes in this context are the axes formed by rotating the Y and Z axes, which are orthogonal to each other, about the X-axis by a predetermined angle. Furthermore, the direction along the X-axis is referred to as the "X direction," the direction along the Y' axis as the "Y direction," and the direction along the Z' axis as the "Z direction." In this embodiment, the X direction corresponds to the first direction, and the Z' direction corresponds to the second direction.

[0042] like Figure 1 and Figure 2 As shown, the oscillator 100 of this embodiment includes: a vibrating element 1 having a first vibrating element X1, a second vibrating element X2 and a third vibrating element X3; a relay board 20 for fixing the vibrating element 1; a package 30 for housing the vibrating element 1 and the relay board 20; and a cover member 36 made of glass, ceramic or metal.

[0043] like Figure 2 As shown, the package 30 is formed by stacking and mounting terminals 35, a first substrate 31, a second substrate 32, and a sealing ring 33. Furthermore, the package 30 has a chamber S that is open at the top. Additionally, by engaging the cover member 36 with the sealing ring 33, the chamber S housing the vibrating element 1 and the relay substrate 20 is hermetically sealed to a reduced-pressure environment or an inert gas environment such as nitrogen.

[0044] Vibration element 1 and relay substrate 20 are housed within the cavity S of package 30. Vibration element 1 is electrically connected to fixing terminals 21, 22, and 23 located above relay substrate 20 via bonding members 37a such as metal bumps, solder, or conductive adhesive at multiple through electrodes 19 provided at fixing portion 9, and is thus fixed to relay substrate 20. Relay substrate 20 is electrically connected to internal terminals 34 located above first substrate 31 via bonding members 37b such as conductive adhesive at connecting terminals 27, 28, and 29 located at both ends in the X direction, and is thus fixed to first substrate 31. That is, vibration element 1 is fixed to relay substrate 20 at fixing portion 9, and is fixed to package 30 via relay substrate 20. Furthermore, relay substrate 20 is fixed to package 30 at both ends, and fixing portion 9 of vibration element 1 is fixed to relay substrate 20 at its central portion sandwiched between the two ends of relay substrate 20.

[0045] Multiple mounting terminals 35 are provided on the outer bottom surface of the first substrate 31. In addition, the mounting terminals 35 are electrically connected to the internal terminals 34 provided on the upper part of the first substrate 31 via through electrodes (not shown) and interlayer wiring.

[0046] Furthermore, the first substrate 31 and the second substrate 32 of the package 30 are made of an insulating material. This material is not particularly limited; for example, various ceramics such as oxide-based ceramics, nitride-based ceramics, and carbide-based ceramics can be used. In addition, generally, tungsten (W), molybdenum (Mo), or other metallic wiring materials are screen-printed onto the insulating material and then fired, followed by plating with nickel (Ni), gold (Au), or the like, to form the internal terminals 34 and mounting terminals 35 disposed in the package 30.

[0047] like Figure 3 As shown, the relay substrate 20 is a flat plate with the XZ' surface as the main surface, having a first main surface 21a and a second main surface 21b parallel to the first main surface 21a, and is a rectangle with the X direction as the long side and the Y' direction as the thickness direction.

[0048] On the first main surface 21a, a plurality of fixed terminals 21, 22, and 23 are formed in the center of the relay substrate 20, and a plurality of connecting terminals 27, 28, and 29 are formed at both ends of the relay substrate 20 in the X direction. Furthermore, when viewed from above in the Y' direction, the fixed terminal 21 is arranged overlapping with the terminal 10 formed on the vibrating element 1, the fixed terminal 22 is arranged overlapping with the terminal 11 formed on the vibrating element 1, and the fixed terminal 23 is arranged overlapping with the terminal 12 formed on the vibrating element 1. In addition, a connecting electrode 24 is formed to electrically connect the fixed terminal 21 and the connecting terminal 27, a connecting electrode 25 to electrically connect the fixed terminal 22 and the connecting terminal 28, and a connecting electrode 26 to electrically connect the fixed terminal 23 and the connecting terminal 29.

[0049] Vibration element 1 is fixed above the fixed terminals 21, 22, and 23 formed on the first main surface 21a via a connecting member 37a. That is, the vibration element 1 is fixed in the central part of the relay substrate 20, which is sandwiched between the two ends of the relay substrate 20.

[0050] In the second main surface 21b, multiple connection terminals 27, 28, and 29 are formed at both ends of the relay substrate 20 in the X direction, at positions overlapping with the connection terminals 27, 28, and 29 formed on the first main surface 21a when viewed from the Y' direction. For example... Figure 2 and Figure 3 As shown, the connection terminals 27, 28, and 29 formed on the first main surface 21a and the connection terminals 27, 28, and 29 formed on the second main surface 21b are electrically connected by side electrodes 27a, 28a, and 29a formed on the side of the relay substrate 20.

[0051] Connection terminals 27, 28, and 29 formed on the second main surface 21b are fixed to the first substrate 31 of the package 30 via the coupling member 37b. That is, the relay substrate 20 is fixed to the package 30 at both ends of the relay substrate 20.

[0052] In this embodiment, the vibration element 1 is fixed to the package 30 via the relay substrate 20, so heat from the outside of the package 30 is not easily transferred to the vibration element 1. In addition, although the vibration element 1 is fixed to the package 30 via the relay substrate 20 in this embodiment, it is not limited to this, and the fixing part 9 of the vibration element 1 may also be directly fixed to the package 30.

[0053] In addition, the relay substrate 20 is made of an insulating material. This material is not particularly limited, and various ceramics such as oxide ceramics, nitride ceramics, and carbide ceramics, as well as glass and quartz, can be used.

[0054] like Figure 1 As shown, the vibration element 1 includes: a quartz substrate 2 having a first vibration section 3, a second vibration section 5, and a third vibration section 7; a first excitation electrode 4 formed on the first vibration section 3; a second excitation electrode 6 formed on the second vibration section 5; a third excitation electrode 8 formed on the third vibration section 7; terminals 10, 11, and 12 formed on a fixing section 9 located at the center of the quartz substrate 2 in the X direction; a lead electrode 13 connecting the first excitation electrode 4 and terminal 10; a lead electrode 14 connecting the second excitation electrode 6 and terminal 11; a lead electrode 15 connecting the third excitation electrode 8 and terminal 12; and a through electrode 19 penetrating the quartz substrate 2 and having metal embedded in the through hole. Alternatively, the through electrode 19 may be formed by laminating metal on the inner wall of the through hole.

[0055] Vibrating element 1 includes a first vibrating element X1, a second vibrating element X2, and a third vibrating element X3. The first vibrating element X1 has a first vibrating portion 3 with a pair of first excitation electrodes 4. The second vibrating element X2 has a second vibrating portion 5 with a pair of second excitation electrodes 6. The third vibrating element X3 has a third vibrating portion 7 with a pair of third excitation electrodes 8. The first vibrating element X1, the second vibrating element X2, and the third vibrating element X3 share a quartz substrate 2, thus creating a structure in which heat from the outside is easily and evenly transferred.

[0056] The quartz substrate 2 includes: a first vibrating part 3; a second vibrating part 5 disposed on one side of the first vibrating part 3 in the X direction, which is a first direction; a third vibrating part 7 disposed on one side of the first vibrating part 3 in the X direction and arranged alongside the second vibrating part 5 along the Z' direction, which is orthogonal to the X direction and is a second direction; and a fixing part 9 located between the first vibrating part 3 and the second vibrating part 5 and between the first vibrating part 3 and the third vibrating part 7, for fixing the quartz substrate 2 to the relay substrate 20. Furthermore, the quartz substrate 2 is a flat plate with the XZ' surface as its main surface, having a first main surface 16a and a second main surface 16b parallel to the first main surface 16a, and the Y' direction being the thickness direction.

[0057] The first vibrating part 3, the fixing part 9, the second vibrating part 5, and the third vibrating part 7 are arranged side by side in the X direction, with the fixing part 9 disposed at the center of the quartz substrate 2 in the X direction. That is, the first vibrating part 3, the second vibrating part 5, and the third vibrating part 7 are arranged with the fixing part 9 sandwiched in between. Therefore, heat from the outside of the package 30 can be easily and uniformly transferred to the first vibrating part 3, the second vibrating part 5, and the third vibrating part 7 via the relay substrate 20. Thus, when the second vibrating part 5 and the third vibrating part 7 are temperature sensing parts, the temperature of the first vibrating part 3 can be detected with high accuracy.

[0058] like Figure 2 As shown, the first vibration unit 3 has a first main surface 16a of the quartz substrate 2 and a second main surface 16b parallel to the first main surface 16a. A pair of first excitation electrodes 4 are formed on the first main surface 16a and the second main surface 16b of the first vibration unit 3, sandwiched together in the thickness direction of the quartz substrate 2. When viewed from above in the Y' direction, the first excitation electrode 4 on the first main surface 16a side and the first excitation electrode 4 on the second main surface 16b side are arranged overlappingly. Furthermore, the first main surface 16a and the second main surface 16b correspond to two main surfaces.

[0059] like Figure 4As shown, the second vibration unit 5 has a first inclined surface 17 inclined at a predetermined angle relative to the two main surfaces 16a and 16b, and a surface 17r parallel to the first inclined surface 17 on the back side of the first inclined surface 17. A pair of second excitation electrodes 6 are formed on the first inclined surface 17 and the surface 17r of the second vibration unit 5, such that the second vibration unit 5 is sandwiched in the thickness direction of the quartz substrate 2. When viewed from above in the Y' direction, the second excitation electrodes 6 on the first inclined surface 17 side and the second excitation electrodes 6 on the surface 17r side are arranged overlappingly.

[0060] In addition, the first inclined surface 17 is inclined such that the distance between it and the first main surface 16a increases as the second inclined surface 18 approaches the third vibrating part 7.

[0061] like Figure 4 As shown, the third vibration unit 7 has a second inclined surface 18 inclined at a predetermined angle relative to the two main surfaces 16a, 16b and the first inclined surface 17, and a surface 18r parallel to the second inclined surface 18 on its back side. A pair of third excitation electrodes 8 are formed on the second inclined surface 18 and the surface 18r of the third vibration unit 7, such that the third vibration unit 7 is sandwiched in the thickness direction of the quartz substrate 2. When viewed from above in the Y' direction, the third excitation electrodes 8 on the second inclined surface 18 side and the third excitation electrodes 8 on the surface 18r side are arranged overlappingly.

[0062] In addition, the second inclined surface 18 is inclined such that the distance between it and the first main surface 16a increases as the first inclined surface 17 approaches the second vibrating part 5.

[0063] The fixing part 9 has the following terminals formed on its first main surface 16a and second main surface 16b: a terminal 10 electrically connected to the first excitation electrode 4 formed in the first vibration part 3 via a lead electrode 13; a terminal 11 electrically connected to the second excitation electrode 6 formed in the second vibration part 5 via a lead electrode 14; and a terminal 12 electrically connected to the third excitation electrode 8 formed in the third vibration part 7 via a lead electrode 15.

[0064] Furthermore, terminals 10, 11, and 12 that are not connected to lead electrodes 13, 14, and 15 are formed on the first main surface 16a and the second main surface 16b of the fixing part 9, respectively. Terminals 10, 11, and 12 that are not connected to lead electrodes 13, 14, and 15 and terminals 10, 11, and 12 that are connected to lead electrodes 13, 14, and 15 are electrically connected via through electrodes 19. In addition, terminals 10, 11, and 12 formed on the second main surface 16b and through electrodes 19 are electrically connected via bonding member 37a to connection terminals 27, 28, and 29 formed on the first main surface 21a of the relay substrate 20. Specifically, terminal 10 is fixed to connection terminal 27 via bonding member 37a, terminal 11 is fixed to connection terminal 28 via bonding member 37a, and terminal 12 is fixed to connection terminal 29 via bonding member 37a.

[0065] The first vibration element X1 has a pair of first excitation electrodes 4 formed on the two main surfaces 16a and 16b of the first vibration part 3. Therefore, by applying voltage to the mounting terminal 35, the first vibration part 3 can be vibrated. The mounting terminal 35 is electrically connected to the internal terminal 34 which is electrically connected to the connection terminal 27 of the relay substrate 20.

[0066] The second vibration element X2 has a pair of second excitation electrodes 6 formed on the first inclined surface 17 and surface 17r of the second vibration part 5 in such a way that they are sandwiched in the thickness direction of the quartz substrate 2. Therefore, by applying voltage to the mounting terminal 35, the second vibration part 5 can be vibrated. The mounting terminal 35 is electrically connected to the internal terminal 34 which is electrically connected to the connection terminal 28 of the relay substrate 20.

[0067] The third vibration element X3 has a pair of third excitation electrodes 8 formed on the second inclined surface 18 and surface 18r of the third vibration part 7 in such a way that they are sandwiched in the thickness direction of the quartz substrate 2. Therefore, by applying voltage to the mounting terminal 35, the third vibration part 7 can be vibrated. The mounting terminal 35 is electrically connected to the internal terminal 34 which is electrically connected to the connection terminal 29 of the relay substrate 20.

[0068] Next, refer to Figure 5 The cutting angle of the quartz substrate 2 in this embodiment will be explained.

[0069] In addition, Figure 5 In the diagram, the arrow side of the axis and arrow R is called the "positive direction," and the side opposite to the arrow is called the "negative direction."

[0070] like Figure 5 As shown, piezoelectric materials such as quartz belong to the trigonal crystal system and have mutually orthogonal crystal axes, namely the X-axis, Y-axis, and Z-axis. The X-axis, Y-axis, and Z-axis are respectively called the electric axis, mechanical axis, and optical axis.

[0071] For example, as a piezoelectric substrate, a flat plate, known as a rotated Y-cut quartz substrate, is used as the quartz substrate 2, which is formed by cutting a plane from quartz along a plane after rotating the XZ plane about the X-axis by a predetermined angle θ1. In addition, the angle θ1 is also referred to as the cutting angle of the rotated Y-cut quartz substrate.

[0072] In addition, the direction of rotation of the XZ plane around the X-axis is indicated by the arrow R. When viewed from the positive direction of the X-axis, which becomes the axis of rotation, left rotation is defined as positive rotation and right rotation as negative rotation.

[0073] When the coordinate axis after rotating the Y-axis by an angle θ1 around the X-axis is designated as the Y' axis, and the coordinate axis after rotating the Z-axis by an angle θ1 around the X-axis is designated as the Z' axis, the rotated Y-cut quartz substrate can be represented by orthogonal crystal axes, namely the X-axis, Y'-axis, and Z'-axis. The thickness direction of the rotated Y-cut quartz substrate is the Y' direction, and the XZ' plane, which includes the X-axis and Z'-axis orthogonal to the Y'-axis, is the principal plane. Thickness shear vibration is excited on the principal plane as the principal vibration.

[0074] Here, a Y-cut quartz substrate with an angle θ1 of approximately 35°15′ is referred to as an AT-cut quartz substrate, which has excellent frequency-temperature characteristics. In this embodiment, an AT-cut quartz substrate will be used as an example of quartz substrate 2, but it is not limited to AT-cut quartz substrates; for example, a BT-cut quartz substrate or similar substrate with excitation thickness shear vibration could also be used. Furthermore, when using an AT-cut quartz substrate as quartz substrate 2, an angle θ1 of approximately 35°15′ is sufficient; for example, an angle θ1 could also be 35°17′.

[0075] Furthermore, in this embodiment, the angle θ1 of the quartz substrate 2 is 35°15′. Therefore, the cutting angle of the two main surfaces 16a and 16b of the quartz substrate 2 is angle θ1, i.e., 35°15′.

[0076] The first inclined surface 17 of the quartz substrate 2 is inclined at an angle θ2 with the first main surface 16a as a reference. That is, the first inclined surface 17 of the quartz substrate 2 rotates in the negative direction around the X-axis from the Z' axis. Therefore, the cutting angle of the first inclined surface 17 is θ1-θ2, i.e., 35°15′-θ2.

[0077] The second inclined surface 18 of the quartz substrate 2 is inclined at an angle θ3 with the first main surface 16a as a reference. That is, the second inclined surface 18 of the quartz substrate 2 rotates in the positive direction around the X-axis from the Z' axis. Therefore, the cutting angle of the second inclined surface 18 is θ1+θ3, i.e., 35°15′+θ3.

[0078] In this embodiment, the cutting angle of the first inclined surface 17 is θ1-θ2, the cutting angle of the second inclined surface 18 is θ1+θ3, and the cutting angles of the two main surfaces 16a and 16b, the cutting angle of the first inclined surface 17, and the cutting angle of the second inclined surface 18 are different.

[0079] The difference between the cutting angle of the first inclined surface 17 and the cutting angle of the second inclined surface 18 means that the second inclined surface 18 is inclined relative to the first inclined surface 17.

[0080] Next, refer to Figure 6 and Figure 7 The relationship between the cutting angle of the quartz substrate 2 and its frequency-temperature characteristics is explained.

[0081] Figure 6 This illustrates the relationship between frequency-temperature characteristics and cutting angle when the cutting angle is varied in 2-degree intervals in a rotating Y-cut quartz substrate, using an AT-cut quartz substrate with a cutting angle of 35°15′ as a reference. For example, in Figure 6 In the diagram, curve +10 shows the frequency-temperature characteristics of a rotary Y-cut quartz substrate with a cutting angle of 35°15′+10′, i.e., a cutting angle of 35°25′. Thus, by varying the cutting angle, the frequency change Δf / f relative to temperature changes can be adjusted.

[0082] Here, in this embodiment, a pair of second excitation electrodes 6 that excite the second vibration unit 5 are disposed on the first inclined surface 17 and surface 17r having the same cutting angle. Therefore, the frequency-temperature characteristic of the second vibration element X2 in this embodiment is the frequency-temperature characteristic corresponding to the cutting angle θ1-θ2=35°15′-θ2 of the first inclined surface 17, and the frequency change amount Δf / f of the second vibration element X2 relative to the temperature change is the frequency change amount Δf / f of the cutting angle 35°15′-θ2 relative to the temperature change.

[0083] Furthermore, a pair of third excitation electrodes 8 for exciting the third vibration section 7 are disposed on the second inclined surface 18 and surface 18r having the same cutting angle. Therefore, the frequency-temperature characteristic of the third vibration element X3 in this embodiment becomes the frequency-temperature characteristic corresponding to the cutting angle 35°15′+θ3 of the second inclined surface 18, and the frequency change Δf / f of the third vibration element X3 relative to the temperature change becomes the frequency change Δf / f of the third vibration element X3 relative to the temperature change when the cutting angle is 35°15′+θ3.

[0084] An example of the frequency-temperature characteristics of the vibrating element 1 in this embodiment is shown. Figure 7 In the diagram, AT1 shows the frequency-temperature characteristics of the first vibrating element X1, AT2 shows the frequency-temperature characteristics of the second vibrating element X2, and AT3 shows the frequency-temperature characteristics of the third vibrating element X3. For example... Figure 7 As shown, the frequency-temperature characteristics of the first vibration section 3 of the first vibration element X1, the second vibration section 5 of the second vibration element X2, and the third vibration section 7 of the third vibration element X3 are different.

[0085] The angle θ1 of the first vibrating element 3 is 35°15′. Since an AT-cut quartz substrate is used directly, the frequency change Δf / f of the first vibrating element X1 relative to temperature changes is relatively small. Therefore, by using the first vibrating element X1 to output the oscillation signal, a relatively stable oscillation signal relative to temperature changes can be obtained.

[0086] The second vibrating element 5 changes the angle θ2 of the first inclined surface 17, and the third vibrating element 7 changes the angle θ3 of the second inclined surface 18. This allows the frequency change Δf / f relative to temperature changes to be larger than the frequency change Δf / f of the first vibrating element 3. The larger frequency change Δf / f of the second vibrating element X2 and the third vibrating element X3 relative to temperature changes means that the resolution of temperature change relative to frequency change is high, enabling high-precision temperature detection. Therefore, by using the second vibrating element X2 and the third vibrating element X3 for temperature detection, high-precision temperature detection is possible.

[0087] In this embodiment, when the cutting angle of the two main surfaces 16a and 16b is θ1, the cutting angle of the first inclined surface 17 of the second vibrating part 5 is θ1-θ2, i.e., 35°15′-θ2. The cutting angle of the first inclined surface 17 of the second vibrating part 5 is smaller than the cutting angle θ1 of the two main surfaces 16a and 16b. Furthermore, the cutting angle of the second inclined surface 18 of the third vibrating part 7 is θ1+θ3, i.e., 35°15′+θ3, which is larger than the cutting angle θ1 of the two main surfaces 16a and 16b. By setting the cutting angles of the first inclined surface 17 of the second vibrating part 5 and the second inclined surface 18 of the third vibrating part 7 to be different angles, the frequency-temperature characteristics of the second vibrating element X2 and the third vibrating element X3 used for temperature detection can be made different.

[0088] By making the frequency-temperature characteristics of the second vibration element X2 and the third vibration element X3 for temperature detection different, for example, temperature detection is performed based on the second vibration element X2 within a temperature range in which the resolution of temperature change relative to frequency change of the second vibration element X2 is higher than that of the third vibration element X3, and temperature detection is performed based on the third vibration element X3 within the same temperature range. Thus, higher accuracy temperature detection is achieved.

[0089] For example, in Figure 7Within a temperature range T of -10°C to 60°C, the resolution of temperature change relative to frequency change for the third vibrating element X3 is higher than that for the second vibrating element X2. Therefore, temperature detection can be performed based on the third vibrating element X3. On the other hand, within a temperature range T that is lower than -10°C or higher than 60°C, the resolution of temperature change relative to frequency change for the third vibrating element X3 becomes lower, and consequently, the frequency change of the third vibrating element X3 no longer shows a monotonically increasing or decreasing trend relative to temperature change. Therefore, within a temperature range T that is lower than -10°C or higher than 60°C, temperature detection can be performed based on the second vibrating element X2, whose resolution of temperature change relative to frequency change is higher than that of the third vibrating element X3.

[0090] Furthermore, the temperature range for using the second vibration element X2 for temperature detection and the temperature range for using the third vibration element X3 for temperature detection are not limited to the above-mentioned temperature ranges, and can be arbitrarily set according to the frequency-temperature characteristics of the second vibration unit 5 and the third vibration unit 7.

[0091] Furthermore, since the first vibrating element X1, the second vibrating element X2, and the third vibrating element X3 are formed on a common quartz substrate 2, heat transfer between the first vibrating element X1 and the second vibrating element X2, between the first vibrating element X1 and the third vibrating element X3, and between the second vibrating element X2 and the third vibrating element X3 can be performed rapidly and with high accuracy. Therefore, the temperature of the first vibrating element X1 can be detected rapidly and with high accuracy using the second vibrating element X2 and the third vibrating element X3 for temperature detection, and thus, temperature compensation of the first vibrating element X1 can be performed rapidly and with high accuracy.

[0092] When using an AT-cut quartz substrate as the quartz substrate 2, and setting the cutting angle of the inclined surface with the larger cutting angle between the first inclined surface 17 and the second inclined surface 18 of the quartz substrate 2 as θa, and setting the cutting angle of the other inclined surface as θb, the preferred range for the cutting angle θb is θa-1° or more and θa-20° or less. When the cutting angle θb is θa-1° or more, the difference between the cutting angles of the first inclined surface 17 and the second inclined surface 18 of the quartz substrate 2 is sufficiently large. Therefore, the frequency-temperature characteristics of the second vibration element X2 and the third vibration element X3 for temperature detection are sufficiently different, enabling high-precision temperature detection. Furthermore, when the cutting angle θb is increased, it is difficult to form an inclined surface; therefore, it is preferable to set the cutting angle θb to θa-20° or less. In addition, in this embodiment, the cutting angle θ1-θ2 of the first inclined surface 17 is equivalent to θb, and the cutting angle θ1+θ3 of the second inclined surface 18 is equivalent to θa.

[0093] As described above, in this embodiment, the oscillator 100 fixes the central portion between the first vibration part 3 and the second vibration part 5 and between the first vibration part 3 and the third vibration part 7 of the vibration element 1 to the central portion sandwiched between the two ends of the relay substrate 20, and fixes the two ends of the relay substrate 20 to the package 30. Therefore, heat from the outside of the package 30 is not easily transferred, and the transferred heat is uniformly transferred from the central portion of the vibration element 1 to the first vibration part 3, the second vibration part 5 and the third vibration part 7. Therefore, the temperature difference between the first vibration part 3 and the second vibration part 5 and between the first vibration part 3 and the third vibration part 7 is reduced. When the first vibration part 3 is used to output an oscillation signal and the second vibration part 5 and the third vibration part 7 are used to detect the temperature, the temperature of the first vibration part 3 can be detected with high accuracy.

[0094] Furthermore, by setting the first vibration unit 3 to a cutting angle with a small frequency change in the frequency-temperature characteristic, and setting the first inclined surface 17 of the second vibration unit 5 and the second inclined surface 18 of the third vibration unit 7 to cutting angles with a large frequency change in the frequency-temperature characteristic, the second vibration unit 5 and the third vibration unit 7 can be used for high-resolution and high-precision temperature detection of temperature changes.

[0095] 1.2. Manufacturing method of vibrating element

[0096] Next, refer to Figures 8 to 13 The manufacturing method of the vibrating element 1 is described.

[0097] The manufacturing method of the vibration element 1 includes a quartz substrate preparation process, a resist coating process, a dry etching process, a monolithization process, and an electrode formation process.

[0098] 1.2.1 Quartz substrate preparation process

[0099] like Figure 8 As shown, considering the mass production capability and manufacturing cost of the vibrating element 1, a large quartz substrate 80 capable of batch manufacturing multiple vibrating elements 1 is prepared. Regarding the large quartz substrate 80, the raw quartz stone is cut at a predetermined cutting angle θ1, and then subjected to grinding, polishing, and other processing to achieve the desired thickness. Furthermore, in this embodiment, the cutting angle θ1 is 35°15′.

[0100] 1.2.2. Resist Coating Process

[0101] like Figure 9As shown, resists 82a and 82b are applied to the two main surfaces 16a and 16b of the large quartz substrate 80. Here, as a method for applying resist 82a to the first main surface 16a, the following method is used: a metal mold having a recess corresponding to the shape of the first inclined surface 17 where the second excitation electrode 6 is formed and the second inclined surface 18 where the third excitation electrode 8 is formed is filled; the resist 82a filled in the metal mold is transferred to the first main surface 16a and cured. Furthermore, as a method for applying resist 82b to the second main surface 16b, the following method is used: a metal mold having a protrusion corresponding to the shape of the surface 17r where the second excitation electrode 6 is formed and the surface 18r where the third excitation electrode 8 is formed is filled; the resist 82b filled in the metal mold is transferred to the second main surface 16b and cured.

[0102] 1.2.3. Dry Etching Process

[0103] Next, dry etching is used, such as... Figure 10 As indicated by the middle arrow, dry etching is performed from above each of the two main surfaces 16a and 16b using a plasma etching device or the like.

[0104] Figure 11 The image shows the state after the resists 82a and 82b have been removed by dry etching. Figure 9 The shapes of the resist 82a and 82b, which are the inclined surfaces on the two main surfaces 16a and 16b formed in the process, are directly transferred to the large quartz substrate 80 and thinned. In this way, the first inclined surface 17, surface 17r, second inclined surface 18 and surface 18r are formed on the large quartz substrate 80.

[0105] 1.2.4. Single-piece manufacturing process

[0106] exist Figure 11 In this configuration, multiple quartz sheets are connected on a large quartz substrate 80, thus making the large quartz substrate 80 a single piece. Figure 11 Using the imaginary line LL as a reference, large quartz substrates 80 are monolithized by cutting or wet etching. Figure 12 The monolithic quartz substrate 2 is shown.

[0107] 1.2.5. Electrode Forming Process

[0108] like Figure 13 As shown, in a monolithic quartz substrate 2, a first excitation electrode 4, a second excitation electrode 6, a third excitation electrode 8, etc., are formed by vapor deposition or sputtering to become a vibration element 1.

[0109] The first inclined surface 17, surface 17r, second inclined surface 18, and surface 18r can also be formed by means other than those described above. For example, as a method for forming resists 82a and 82b that partially thin the wall, it is also possible to use grayscale exposure to expose resists 82a and 82b under different light intensity distribution conditions.

[0110] Alternatively, the following method can be used: before monolithizing the large quartz substrate 80, the first excitation electrode 4, the second excitation electrode 6, the third excitation electrode 8, etc. are formed on the large quartz substrate 80, and then monolithized to obtain the vibration element 1.

[0111] Furthermore, the first vibrating element X1, the second vibrating element X2, and the third vibrating element X3 are formed on a common quartz substrate 2, and heat transfer between the first vibrating element X1, the second vibrating element X2, and the third vibrating element X3 is carried out rapidly, respectively. In addition, the first inclined surface 17, surface 17r, the second inclined surface 18, and surface 18r can be formed using a dry etching method, which places less stress on the quartz substrate 2. Therefore, it is less likely to cause a decrease in the mechanical strength of the quartz substrate 2 or to deteriorate over time.

[0112] 2. Second Implementation Method

[0113] Reference Figure 14 and Figure 15 The general structure of the vibration element 1a in the second embodiment will be described. Structures identical to those in the first embodiment will be labeled with the same reference numerals, and repeated descriptions will be omitted.

[0114] like Figure 14 and Figure 15 As shown, in the quartz substrate 2a of this embodiment, the thickness of the second vibration portion 5a and the third vibration portion 7a is inclined in such a way that the first inclined surface 17 provided on the second vibration portion 5a and the second inclined surface 18 provided on the third vibration portion 7a become thinner as they approach each other.

[0115] The second vibrating part 5a has a first inclined surface 17 and a second main surface 16b. The first inclined surface 17 is an inclined surface that is inclined at a predetermined angle relative to the two main surfaces 16a and 16b.

[0116] The third vibrating part 7a has a second inclined surface 18 and a second main surface 16b. The second inclined surface 18 is an inclined surface that is inclined at a predetermined angle relative to the two main surfaces 16a, 16b and the first inclined surface 17.

[0117] The first inclined surface 17 of the quartz substrate 2a is rotated by an angle θ2 in the negative X-axis direction from the Z' axis. Therefore, when the cutting angle of the second main surface 16b is θ1, the cutting angle of the first inclined surface 17 becomes θ1-θ2, i.e., 35°15′-θ2, and the cutting angle of the second vibrating part 5a becomes θ1-θ2 / 2, i.e., 35°15′-θ2 / 2, which is smaller than the cutting angle θ1 of the second main surface 16b. Furthermore, the second inclined surface 18 of the quartz substrate 2a is rotated by an angle θ3 in the positive X-axis direction from the Z' axis. The cutting angle of the second inclined surface 18 becomes θ1+θ3, i.e., 35°15′+θ3, and the cutting angle of the third vibrating part 7a becomes θ1+θ3 / 2, i.e., 35°15′+θ3 / 2, which is larger than the cutting angle θ1 of the second main surface 16b.

[0118] According to this embodiment, the frequency-temperature characteristics of the second vibration element X2a having the second vibration section 5a and the third vibration element X3a having the third vibration section 7a can increase the frequency change amount compared with the frequency-temperature characteristics of the first vibration section 3. Therefore, when the second vibration element X2a and the third vibration element X3a are used for temperature detection, high-resolution and high-precision temperature detection of temperature change relative to frequency change can be performed, and the same effect as in the first embodiment can be obtained.

[0119] 3. Third Implementation Method

[0120] Reference Figure 16 and Figure 17 The general structure of the vibration element 1b in the third embodiment will be described. Structures identical to those in the first embodiment will be labeled with the same reference numerals, and repeated descriptions will be omitted.

[0121] like Figure 16 and Figure 17 As shown, in this embodiment, the quartz substrate 2b has two through holes 39a and 39b with the Z' direction as the length direction, provided between the first vibrating part 3 and the second vibrating part 5 and between the first vibrating part 3 and the third vibrating part 7. The through hole 39a is provided between the first vibrating part 3 and the second vibrating part 5, and the through hole 39b is provided between the first vibrating part 3 and the third vibrating part 7.

[0122] According to this embodiment, in addition to the effects of the first embodiment, the following effects can also be obtained.

[0123] By providing through holes 39a and 39b between the first vibration part 3 and the second vibration part 5, and between the first vibration part 3 and the third vibration part 7, the mutual influence between the vibration of the first vibration part 3, the vibration of the second vibration part 5, and the vibration of the third vibration part 7 can be suppressed.

[0124] Alternatively, a recess with an opening on the first main surface 16a or a recess with an opening on the second main surface 16b may be provided at the position where the through holes 39a and 39b are provided.

[0125] 4. Fourth Implementation Method

[0126] Reference Figure 18 and Figure 19 The general structure of the vibration element 1c in the fourth embodiment will be described. Structures identical to those in the first embodiment will be labeled with the same reference numerals, and repeated descriptions will be omitted.

[0127] like Figure 18 and Figure 19 As shown, in this embodiment, the quartz substrate 2c has protrusions 41 formed on its two main surfaces 16a and 16b in the first vibration section 3c. In the first vibration section 3c having the protrusions 41, a pair of first excitation electrodes 4 are formed in a manner that sandwiches them in the thickness direction of the quartz substrate 2c.

[0128] According to this embodiment, in addition to the effects of the first embodiment, the following effects can also be obtained.

[0129] The first vibrating element X1c excites the region containing the protrusion 41 of the first vibrating part 3c through the first excitation electrode 4. Therefore, the vibration energy of the first vibrating part 3c is confined within the region containing the protrusion 41, reducing vibration leakage to areas outside the region containing the protrusion 41, and stabilizing the vibration of the first vibrating element X1c. Furthermore, the impedance of the first vibrating element X1c can be reduced, and the Q value is improved. Therefore, when this first vibrating element X1c is used in an oscillator, a high-precision oscillator with a good carrier-to-noise ratio can be achieved.

[0130] In this embodiment, protrusions 41 are formed on both of the two main surfaces 16a and 16b of the first vibration part 3c, but protrusions 41 can also be formed on either of the two main surfaces 16a and 16b of the first vibration part 3c.

[0131] Furthermore, in this embodiment, the protrusion 41 is a platform shape that protrudes from the two main surfaces 16a and 16b in the first vibration part 3c in the Y' direction. However, the shape of the protrusion 41 can also be a spherical shape.

[0132] 5. Fifth Implementation Method

[0133] Reference Figure 20 and Figure 21 The general structure of the vibration element 1d in the fifth embodiment will be described. Structures identical to those in the first embodiment will be labeled with the same reference numerals, and repeated descriptions will be omitted.

[0134] like Figure 20 and Figure 21As shown, in this embodiment, the quartz substrate 2d has inclined portions 42a and 42b formed on the first main surface 16a of the first vibration portion 3d. The inclined portions 42a and 42b are inclined in such a way that the thickness of the quartz substrate 2 thins from the side of the first excitation electrode 4 toward the outer edge of the quartz substrate 2d.

[0135] According to this embodiment, in addition to the effects of the first embodiment, the following effects can also be obtained.

[0136] The first vibrating element X1d has inclined portions 42a and 42b formed around the first excitation electrode 4. These inclined portions 42a and 42b are inclined such that the thickness of the quartz substrate 2 thins towards the outer edge of the quartz substrate 2d. Therefore, the vibration energy of the first vibrating portion 3d can be confined near the first excitation electrode 4, reducing vibration leakage to the inclined portions 42a and 42b. Consequently, the impedance of the first vibrating element X1d can be reduced, and the Q value is improved. Therefore, when this first vibrating element X1d is used in an oscillator, a high-precision oscillator with a good carrier-to-noise ratio can be achieved.

[0137] In this embodiment, inclined portions 42a and 42b are formed only on the first main surface 16a of the first vibration portion 3d, but inclined portions 42a and 42b may also be formed on both main surfaces 16a and 16b of the first vibration portion 3d.

[0138] 6. Sixth Implementation Method

[0139] Reference Figure 22 A general structure of the relay substrate 20a in the sixth embodiment will be described. Structures identical to those in the first embodiment will be labeled with the same reference numerals, and repeated descriptions will be omitted. Furthermore, in Figure 22 The diagrams of connecting electrodes 24, 25, and 26 that electrically connect fixed terminals 21, 22, and 23 and connecting terminals 27, 28, and 29 are omitted.

[0140] like Figure 22 As shown, the relay substrate 20a of this embodiment has a frame-shaped first frame portion 43 fixed to the package 30, a frame-shaped second frame portion 44 disposed inside the first frame portion 43, a vibration element support portion 45 disposed inside the second frame portion 44 and fixing the vibration element 1, a first beam portion 46 extending along the Z' direction and connecting the first frame portion 43 and the second frame portion 44, and a second beam portion 47 extending along the X direction and connecting the second frame portion 44 and the vibration element support portion 45.

[0141] According to this embodiment, in addition to the effects of the first embodiment, the following effects can also be obtained.

[0142] The relay substrate 20a is configured such that the first frame portion 43 and the second frame portion 44 are connected by the first beam portion 46, and the second frame portion 44 and the vibration element support portion 45 are connected by the second beam portion 47. This extends the path of external heat from the package 30 to the vibration element 1 via the connection terminals 27, 28, and 29 fixed to the package 30, making it less likely for external heat to be transferred to the vibration element 1. Furthermore, it makes it less likely for mounting distortions generated when fixed to the package 30 to be transferred to the vibration element 1.

[0143] 7. Seventh Implementation Method

[0144] Reference Figure 23 A general structure of the relay substrate 20b in the seventh embodiment will be described. Structures identical to those in the first embodiment will be labeled with the same reference numerals, and repeated descriptions will be omitted. Furthermore, in Figure 23 The diagrams of connecting electrodes 24, 25, and 26 that electrically connect fixed terminals 21, 22, and 23 and connecting terminals 27, 28, and 29 are omitted.

[0145] like Figure 23 As shown, the relay substrate 20b of this embodiment has a frame-shaped first frame portion 43b fixed to the package 30, a vibration element support portion 45b disposed inside the first frame portion 43b and fixing the vibration element 1, and a first beam portion 46b extending along the Z' direction and connecting the first frame portion 43b and the vibration element support portion 45b.

[0146] According to this embodiment, in addition to the effects of the first embodiment, the following effects can also be obtained.

[0147] The relay substrate 20b, which connects the first frame portion 43b and the vibration element support portion 45b via the first beam portion 46b, extends the path of external heat from the package 30 through the connection terminals 27, 28, and 29 fixed to the package 30 to the vibration element 1, making it less likely for external heat to be transferred to the vibration element 1. Furthermore, it makes it less likely for mounting distortions generated when fixed to the package 30 to be transferred to the vibration element 1.

[0148] 8. Implementation Method 8

[0149] Reference Figure 24 and Figure 25 The general structure of the oscillator 200 of the eighth embodiment will be described. In the oscillator 200 of the eighth embodiment, an oscillator having any one of the above-described vibration elements 1, 1a, 1b, 1c, 1d and relay substrates 20, 20a, 20b can be used. Hereinafter, an example of an oscillator 100 having the vibration element 1 and relay substrate 20 described in the first embodiment will be shown and described.

[0150] like Figure 24 As shown, the oscillator 200 includes: an oscillator 100 with a built-in vibrating element 1 and a relay substrate 20; and oscillation circuits 61a, 61b, and 61c for driving the vibrating element 1 (see reference). Figure 26 ) and control signal output circuit 63 (refer to) Figure 26 The IC chip 60; the package 50 that houses the oscillator 100 and the IC chip 60; and the cover component 58 made of glass, ceramic or metal.

[0151] like Figure 25 As shown, package 50 is formed by stacking and mounting terminals 57, third substrate 53, internal terminals 56, first substrate 51, internal terminals 55, second substrate 52, and sealing ring 54. Furthermore, package 50 has a cavity S1 open at the top and a cavity S2 open at the bottom.

[0152] An oscillator 100, which incorporates a vibrating element 1 and a relay substrate 20, is housed within chamber S1. The oscillator 100 is fixed to the package 50 by connecting the mounting terminal 35 of the oscillator 100 and the internal terminal 55 located above the first substrate 51, using a bonding member 37c such as a conductive adhesive. An IC chip 60 is housed within chamber S2. The IC chip 60 is fixed to the package 50 by connecting the IC chip 60 and the package 50 using a bonding member 38 such as a non-conductive adhesive. Furthermore, a connection terminal 60a located below the IC chip 60 and an internal terminal 56 located below the first substrate 51 are electrically connected via a metal bonding wire 61.

[0153] Furthermore, by connecting the cover component 58 with the sealing ring 54, the chamber S1 housing the oscillator 100 is hermetically sealed as a reduced pressure environment or an inert gas environment such as nitrogen. Additionally, the chamber S2 housing the IC chip 60 is filled with molding resin 40.

[0154] A plurality of mounting terminals 57 are provided on the outer bottom surface of the third substrate 53. In addition, the mounting terminals 57 are electrically connected to the internal terminals 56 provided below the first substrate 51 via side electrodes (not shown) and interlayer wiring.

[0155] IC chip 60 includes: a first oscillation circuit 61a that oscillates the first vibrating element X1 and outputs a first oscillation signal; a second oscillation circuit 61b that oscillates the second vibrating element X2 and outputs a second oscillation signal; a third oscillation circuit 61c that oscillates the third vibrating element X3 and outputs a third oscillation signal; and a control signal output circuit 63 that outputs a control signal to control the oscillation frequency of the first oscillation signal based on the second and third oscillation signals.

[0156] Next, refer to Figure 26The circuit structure of oscillator 200 will be explained. Furthermore, in the following explanation, an example of oscillator 200 will be provided using a TCXO.

[0157] The control signal output circuit 63 is a circuit that outputs a set frequency f0 from the output terminal 65, independent of or suppressing the influence of external temperature changes on the oscillator 200. The set frequency f0 is the output frequency obtained when a reference voltage V0 is applied to the first oscillation circuit 61a at a reference temperature T0.

[0158] The first oscillation circuit 61a is electrically connected to a pair of first excitation electrodes 4 of the first vibrating element X1 via terminal 10. Similarly, the second oscillation circuit 61b for temperature detection is electrically connected to a pair of second excitation electrodes 6 of the second vibrating element X2 via terminal 11. The third oscillation circuit 61c for temperature detection is electrically connected to a pair of third excitation electrodes 8 of the third vibrating element X3 via terminal 12.

[0159] like Figure 26 As shown, between the first oscillation circuit 61a, the second oscillation circuit 61b, and the third oscillation circuit 61c, there is an output selection circuit 90 that selects the frequency f output to the control signal output circuit 63; and a control signal output circuit 63 that estimates the temperature of the first vibrating element X1 based on the output signal (frequency f) output from the output selection circuit 90, and calculates the control voltage V, which is the control signal. C (V C =V0-ΔV), the control signal causes the first oscillation circuit 61a to obtain the set frequency f0 as the first oscillation signal at this temperature.

[0160] The output selection circuit 90 includes a selection control unit 91 and an output selection unit 92. The selection control unit 91 is electrically connected to the output selection unit 92, a temperature sensor 93, and a temperature estimation unit 68. The temperature sensor 93 detects the external temperature of the vibrating element 1. Based on the temperature detected by the temperature sensor 93, the selection control unit 91 selects the frequency f output to the control signal output circuit 63 from the oscillation frequency f2 (a second oscillation signal) output from the second oscillation circuit 61b and the oscillation frequency f3 (a third oscillation signal) output from the third oscillation circuit 61c. Furthermore, the selection control unit 91 controls the output selection unit 92 to switch the output signal, i.e., the frequency f, output from the output selection circuit 90. Based on the selection by the selection control unit 91, the output selection unit 92 outputs one of the oscillation frequency f2 output from the second oscillation circuit 61b and the oscillation frequency f3 output from the third oscillation circuit 61c as the output signal, i.e., the frequency f, output from the output selection circuit 90 to the control signal output circuit 63.

[0161] A reference voltage V is input from input terminal 64b of the second oscillation circuit 61b to the second oscillation circuit 61b. 10 A reference voltage V is input from the input terminal 64c of the third oscillation circuit 61c to the third oscillation circuit 61c. 11 The set frequency f0 is output from output terminal 65. Furthermore, the reference voltage V, stabilized by varactor diode 66, is input to the first oscillation circuit 61a, the second oscillation circuit 61b, and the third oscillation circuit 61c, respectively. 10 V 11 and control voltage V C .

[0162] The second vibrating element X2 and the third vibrating element X3 are used as temperature sensing units. Based on the frequency-temperature characteristics of the second vibrating element X2, the oscillation frequency f2, which is the second oscillation signal output from the second oscillation circuit 61b driving the second vibrating element X2, becomes the output corresponding to the temperature T of the second vibrating element X2. Furthermore, based on the frequency-temperature characteristics of the third vibrating element X3, the oscillation frequency f3, which is the third oscillation signal output from the third oscillation circuit 61c driving the third vibrating element X3, becomes the output corresponding to the temperature T of the third vibrating element X3. In this way, the temperatures T of the second vibrating element X2 and the third vibrating element X3 can be determined.

[0163] The first vibrating element X1 is disposed on the same quartz substrate 2 as the second vibrating element X2 and the third vibrating element X3. The first vibrating element X1 is combined with the second vibrating element X2 and the third vibrating element X3. There is no time difference in heat transfer. Therefore, the temperature T of the first vibrating element X1 can be accurately estimated based on the temperature T of the second vibrating element X2 and the temperature T of the third vibrating element X3.

[0164] The cutting angles of the second vibrating part 5 and the third vibrating part 7 are different, therefore, the frequency-temperature characteristics of the second vibrating element X2 and the third vibrating element X3 are different. Therefore, for example, if the temperature T of the first vibrating element X1 is estimated based on the temperature T of the second vibrating element X2 within a temperature range where the resolution of temperature change relative to frequency change of the second vibrating element X2 is higher than that of the third vibrating element X3, and the temperature T of the first vibrating element X1 is estimated based on the temperature T of the third vibrating element X3 within a temperature range where the resolution of temperature change relative to frequency change of the third vibrating element X3 is higher than that of the second vibrating element X2, and the temperature T of the first vibrating element X1 is estimated based on the temperature T of the third vibrating element X3, then the temperature T of the first vibrating element X1 can be estimated with higher accuracy.

[0165] The control signal output circuit 63 calculates the control voltage V based on the temperature T of the one of the second vibrating element X2 and the third vibrating element X3 that has a larger frequency-temperature characteristic with a larger frequency change.C (V C =V0-ΔV), control voltage V C Used to output a set frequency f0 from the first oscillation circuit 61a as the first oscillation signal.

[0166] Specifically, the control signal output circuit 63 includes a frequency detection unit 67, such as a frequency counter, for measuring the frequency f output from the output selection circuit 90; a temperature estimation unit 68 for estimating the temperature T based on the frequency f measured in the frequency detection unit 67; a compensation voltage calculation unit 69 for calculating the compensation voltage ΔV based on the temperature T estimated by the temperature estimation unit 68; and a control voltage V obtained by subtracting the compensation voltage ΔV calculated by the compensation voltage calculation unit 69 from the reference voltage V0. C The output is sent to the adder 70 of the first oscillation circuit 61a.

[0167] The temperature estimation unit 68 stores the frequency-temperature characteristics of the second oscillation circuit 61b shown in equation (1) and the frequency-temperature characteristics of the third oscillation circuit 61c shown in equation (2).

[0168] When the output selection unit 92 selects the oscillation frequency f2 output from the second oscillation circuit 61b as the frequency f output to the control signal output circuit 63, the temperature estimation unit 68 can calculate the temperature T of the second vibrating element X2 based on the frequency-temperature characteristic of equation (1) and the oscillation frequency f2 output from the second oscillation circuit 61b, and estimate the temperature T of the first vibrating element X1 based on the temperature T of the second vibrating element X2.

[0169] When the output selection unit 92 selects the oscillation frequency f3 output from the third oscillation circuit 61c as the frequency f output to the control signal output circuit 63, the temperature estimation unit 68 can calculate the temperature T of the third vibrating element X3 based on the frequency-temperature characteristic of equation (2) and the oscillation frequency f3 output from the third oscillation circuit 61c, and estimate the temperature T of the first vibrating element X1 based on the temperature T of the third vibrating element X3.

[0170] f1 = f 10 {1+α2(TT 10 ) 3 +β2(TT 10 )+γ2}···(1)

[0171] f2=f 11 {1+α3(TT 11 ) 3 +β3(TT 11 )+γ3}···(2)

[0172] Furthermore, the compensation voltage calculation unit 69 has the temperature characteristics of the first oscillation circuit 61a, i.e., a cubic function generator, and is configured to calculate the compensation voltage ΔV according to the following equations (3) to (5) and the temperature T.

[0173] ΔV=V0(Δf / f0)···(3)

[0174] Δf / f0=α1(T-T0) 3 +β1(T-T0)+γ1···(4)

[0175] ΔV=V0{α1(T-T0) 3 +β1(T-T0)+γ1}···(5)

[0176] Here, α1, β1, γ1, α2, β2, γ2 and α3, β3, γ3 are inherent constants of the first oscillation circuit 61a, the second oscillation circuit 61b, and the third oscillation circuit 61c, respectively, and are determined by measuring the output frequency through various changes in temperature and reference voltage. Furthermore, Δf = f - f0, and f... 10 In the second oscillation circuit 61b, at the reference temperature T 10 Apply a reference voltage V 10 The output frequency f is obtained at that time. 11 In the third oscillation circuit 61c, at the reference temperature T 11 Apply a reference voltage V 11 The output frequency obtained at that time.

[0177] A control voltage V is input to the input terminal 64b of the second oscillation circuit 61b. 10 At that time, in the second oscillation circuit 61b, based on the temperature T of the second vibrating element X2, oscillation occurs at the oscillation frequency f1 obtained using equation (1) with thickness shear vibration of the fundamental wave. A control voltage V is input to the input terminal 64c of the third oscillation circuit 61c. 11 At that time, in the third oscillation circuit 61c, based on the temperature T of the third oscillation element X3, the fundamental wave oscillates at the oscillation frequency f2 obtained by using the above formula (2) with thickness shear vibration.

[0178] Based on the temperature detected by the temperature sensor 93, the output selection circuit 90 outputs one of the oscillation frequency f2, which is the second oscillation signal output from the second oscillation circuit 61b, and the oscillation frequency f3, which is the third oscillation signal output from the third oscillation circuit 61c, as the output signal f from the output selection circuit 90 to the control signal output circuit 63.

[0179] The frequency f is input to the temperature estimation unit 68 via the frequency detection unit 67. The temperature estimation unit 68, based on the selection by the output selection unit 92 of the output selection circuit 90, calculates the temperature T of the second vibrating element X2 or the temperature T of the third vibrating element X3, and estimates the temperature T of the first vibrating element X1. Then, in the compensation voltage calculation unit 69, the compensation voltage ΔV is calculated based on the temperature T obtained by the temperature estimation unit 68, and the control voltage V, which serves as a control signal, is added via the addition unit 70. C It is applied to the first oscillation circuit 61a. In the first oscillation circuit 61a, the temperature T and control voltage V of the first vibrating element X1 are controlled. C The corresponding frequency, which serves as the first oscillation signal, is the set frequency f0, at which the vibration is performed using thickness shear vibration.

[0180] That is, at temperature T, the first oscillation circuit 61a causes the oscillation frequency to deviate from the set frequency f0 along the frequency-temperature characteristic of the first oscillation circuit 61a by the difference (T-T0) between the set frequency f0 and the reference temperature T0. However, a control voltage V is set that is either lower or higher than the reference voltage V0 by an amount corresponding to the difference. C The frequency is applied to the first oscillation circuit 61a, so that the output frequency that cancels out the difference, i.e., the set frequency f0, can be obtained.

[0181] The oscillator 200 of this embodiment uses a transducer 100 in which the central portion between the first vibrating part 3 and the second vibrating part 5, and between the first vibrating part 3 and the third vibrating part 7 of the vibrating element 1 are fixed to the central portion sandwiched between the two ends of the relay substrate 20, and the two ends of the relay substrate 20 are fixed to the package 30. Therefore, heat from outside the package 30 is not easily transferred, and the transferred heat is uniformly transferred from the central portion of the vibrating element 1 to the first vibrating part 3, the second vibrating part 5, and the third vibrating part 7. Therefore, the temperature difference between the first vibrating part 3 and the second vibrating part 5, and between the first vibrating part 3 and the third vibrating part 7 is reduced. When the first vibrating part 3 is used to output an oscillation signal, and the second vibrating part 5 and the third vibrating part 7 are used to detect temperature, the temperature of the first vibrating part 3 can be detected with high precision, and temperature compensation can be performed with high precision. Therefore, a high-precision oscillator 200 with a stable set frequency f0 can be obtained.

[0182] Furthermore, the frequency-temperature characteristics of the first vibrating element X1 can be made suitable for oscillation signal output, and the frequency-temperature characteristics of the second vibrating element X2 and the third vibrating element X3 can be adjusted to be suitable for temperature detection. Therefore, temperature compensation can be performed quickly and with high accuracy on the set frequency f0 output from the first vibrating element X1 based on the oscillation frequency f2 of the second vibrating element X2 and the oscillation frequency f3 of the third vibrating element X3.

[0183] Furthermore, if the frequency-temperature characteristics of the second vibrating element X2 and the third vibrating element X3 are made different, and the temperature T of the first vibrating element X1 is estimated based on the temperature T of the vibrating element X2 or the third vibrating element X3 whose frequency change at temperature detected by the temperature sensor 93 is larger, then the temperature T of the first vibrating element X1 can be estimated with higher accuracy. Therefore, a high-precision oscillator 200 with a more stable set frequency f0 can be obtained.

[0184] 9. The 9th implementation method

[0185] Reference Figure 27 and Figure 28 The circuit structure of the oscillator 200a in the ninth embodiment will be described. Structures identical to those in the eighth embodiment will be labeled with the same reference numerals, and repeated descriptions will be omitted.

[0186] This implementation method is as follows: the sum or difference between the oscillation frequency f2 of the second vibrating element X2 and the oscillation frequency f3 of the third vibrating element X3 is calculated, and the frequency f calculated in this way is used as the temperature detection signal.

[0187] like Figure 27 As shown, a control signal output circuit 63b is provided between the first oscillation circuit 61a, the second oscillation circuit 61b, and the third oscillation circuit 61c. This control signal output circuit 63b is used to estimate the temperature of the first oscillation element X1 based on the oscillation frequency f2, which is the second oscillation signal output from the second oscillation circuit 61b of the second oscillation element X2, and the oscillation frequency f3, which is the third oscillation signal output from the third oscillation circuit 61c of the third oscillation element X3, and to calculate the control voltage V, which is the control signal. C (V C =V0-ΔV), the control signal causes the first oscillation circuit 61a to obtain the set frequency f0 as the first oscillation signal at this temperature.

[0188] The control signal output circuit 63b includes frequency detection units 67b and 67c, temperature estimation unit 68b, compensation voltage calculation unit 69, and addition unit 70.

[0189] The oscillation frequency f2 output from the second oscillation circuit 61b is input to the temperature estimation unit 68b via the frequency detection unit 67b. The oscillation frequency f3 output from the third oscillation circuit 61c is input to the temperature estimation unit 68b via the frequency detection unit 67c.

[0190] The temperature estimation unit 68b calculates the difference (f3-f2) between the oscillation frequency f2 and the oscillation frequency f3, and estimates the temperature T of the first vibrating element X1 based on the frequency difference (f3-f2) and the relationship data between the frequency difference (f3-f2) and the temperature T obtained through calculation.

[0191] Figure 28 An example of the relationship between the frequency difference (f3-f2) and temperature T is shown, obtained by subtracting the cubic frequency-temperature characteristic of the third vibrating element X3 from the cubic frequency-temperature characteristic of the second vibrating element X2. According to... Figure 28 It can be seen that the calculated frequency difference (f3-f2) is roughly proportional to the temperature T.

[0192] The temperature estimation unit 68b has a storage unit for storing the relationship data between the frequency difference (f3-f2) and temperature T, an arithmetic unit for calculating the difference (f3-f2) between the oscillation frequency f2 and the oscillation frequency f3, and a readout unit for reading the temperature T corresponding to the frequency difference (f3-f2) from the relationship data in the storage unit (not shown).

[0193] Alternatively, instead of calculating the difference between oscillation frequencies f2 and f3 (f3-f2), the sum of oscillation frequencies f2 and f3 (f2+f3) can be obtained, and the temperature T can be calculated by referring to the relationship between the sum of frequencies (f2+f3) and temperature T. Furthermore, instead of calculating the difference between oscillation frequencies f2 and f3, the difference between V2 (obtained by voltage conversion of oscillation frequency f2) and V3 (obtained by voltage conversion of oscillation frequency f3) can be obtained, and the temperature T can be calculated by referring to the relationship between the voltage difference (V3-V2) and temperature T.

[0194] The oscillator 200a of this embodiment can adjust the frequency-temperature characteristics of the first vibrating element X1 to be suitable for oscillation signal output, and adjust the frequency-temperature characteristics of the second vibrating element X2 and the third vibrating element X3 to be suitable for temperature detection. Therefore, temperature compensation can be performed quickly and accurately on the set frequency f0 output from the first vibrating element X1 based on the oscillation frequency f2 of the second vibrating element X2 and the oscillation frequency f3 of the third vibrating element X3. Thus, a high-precision oscillator 200a with a stable set frequency f0 can be obtained.

[0195] Furthermore, if the frequency-temperature characteristics of the second vibrating element X2 and the third vibrating element X3 are made different, and the temperature T of the first vibrating element X1 is estimated based on the sum or difference of the oscillation frequency f2 of the second vibrating element X2 and the oscillation frequency f3 of the third vibrating element X3, then the temperature T of the first vibrating element X1 can be estimated with higher accuracy. Therefore, a high-precision oscillator 200a with a more stable set frequency f0 can be obtained.

Claims

1. An oscillator having a vibrating element and a package housing the vibrating element, the vibrating element comprising: a quartz substrate having a first vibrating portion, a second vibrating portion disposed on one side of the first vibrating portion in a first direction, and a third vibrating portion disposed on the same side of the first vibrating portion in the first direction and arranged alongside the second vibrating portion along a second direction orthogonal to the first direction; a pair of first excitation electrodes formed at the first vibrating portion on two main surfaces of the quartz substrate; and a pair of second excitation electrodes formed at the second vibrating portion such that they sandwich the first vibrating portion in the thickness direction of the quartz substrate.

2. A vibrating part; and a pair of third excitation electrodes formed at the third vibrating part to sandwich the third vibrating part in the thickness direction of the quartz substrate, at least one of the pair of second excitation electrodes being formed on a first inclined surface inclined relative to the two main surfaces, and at least one of the pair of third excitation electrodes being formed on a second inclined surface inclined relative to the two main surfaces and the first inclined surface, the vibrating element having a fixing part fixed to the package, the fixing part being disposed between the first vibrating part and the second vibrating part and between the first vibrating part and the third vibrating part.

2. The oscillator according to claim 1, wherein, The oscillator has a relay substrate fixed to the package, and the vibrating element is fixed to the relay substrate at the fixing part and fixed to the package via the relay substrate.

3. The oscillator according to claim 2, wherein, The relay substrate is fixed to the package at both ends of the relay substrate, and the fixing part of the vibration element is fixed to the relay substrate at the central part sandwiched between the two ends of the relay substrate.

4. The oscillator according to claim 2 or 3, wherein, The relay substrate has: a frame-shaped first frame portion fixed to the package; a frame-shaped second frame portion disposed inside the first frame portion; a vibration element support portion disposed inside the second frame portion for fixing the vibration element; a first beam portion extending along the second direction to connect the first frame portion and the second frame portion; and a second beam portion extending along the first direction to connect the second frame portion and the vibration element support portion.

5. The oscillator according to claim 2 or 3, wherein, The relay substrate has: a frame-shaped first frame portion fixed to the package; a vibration element support portion disposed inside the first frame portion to fix the vibration element; and a first beam portion extending along the second direction to connect the first frame portion and the vibration element support portion.

6. The oscillator according to any one of claims 1 to 3, wherein, The cutting angle of the first inclined surface is smaller than the cutting angle of the two main surfaces, and the cutting angle of the second inclined surface is larger than the cutting angle of the two main surfaces.

7. The oscillator according to any one of claims 1 to 3, wherein, The first, second, and third vibrating parts have different frequency-temperature characteristics.

8. The oscillator according to claim 7, wherein, The frequency variation of the frequency-temperature characteristics of the second and third vibration parts is greater than that of the first vibration part.

9. The oscillator according to any one of claims 1 to 3, wherein, The second vibration part has a surface parallel to the first inclined surface on the back side of the first inclined surface, and the third vibration part has a surface parallel to the second inclined surface on the back side of the second inclined surface.

10. The oscillator according to any one of claims 1 to 3, wherein, The first inclined surface and the second inclined surface are inclined in such a way that the thickness of the second vibrating part and the third vibrating part becomes thinner as they approach each other.

11. The oscillator according to any one of claims 1 to 3, wherein, The first vibrating part has a protrusion formed on at least one main surface.

12. The oscillator according to any one of claims 1 to 3, wherein, The vibrating element has through holes between the first vibrating part and the second vibrating part, and between the first vibrating part and the third vibrating part.

13. An oscillator having: The oscillator according to any one of claims 1 to 12; A first oscillation circuit, electrically connected to a first excitation electrode, outputs a first oscillation signal; a second oscillation circuit, electrically connected to a second excitation electrode, outputs a second oscillation signal; a third oscillation circuit, electrically connected to a third excitation electrode, outputs a third oscillation signal; and a control signal output circuit, which is input to at least one of the second and third oscillation signals, and outputs a control signal to control the oscillation frequency of the first oscillation signal according to the input signal.

14. The oscillator according to claim 13, wherein, The oscillator also has: A temperature sensor; and an output selection circuit, which is input to the second oscillation signal and the third oscillation signal, and selectively outputs the second oscillation signal or the third oscillation signal according to the temperature detection result of the temperature sensor, and the control signal output circuit outputs the control signal according to the output signal of the output selection circuit.

15. The oscillator according to claim 14, wherein, The output selection circuit selects and outputs the frequency-temperature characteristic of the second oscillation signal and the third oscillation signal that has a larger frequency change at the temperature detected by the temperature sensor.

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