A method for manufacturing a PCB, PCB washing equipment and water circulation system

Abstract

This application discloses a PCB manufacturing method, PCB washing equipment, and water circulation system. The PCB manufacturing method includes: providing a PCB to be manufactured; performing a developing process on the PCB to be manufactured; and performing a post-developing washing process. The post-developing washing process includes alternately applying positive pressure spraying and negative pressure back suction to the surface area of ​​the PCB to be manufactured, and performing multi-stage filtration on the circulating water generated by the positive pressure spraying and negative pressure back suction. Using the PCB manufacturing method disclosed in this application, debris generated during developing can be effectively removed, and the yield of PCBs with fine circuitry in terms of residual copper short circuits can be improved.

Description

Technical Field

[0001] This application relates to the field of PCB (Printed Circuit Board) technology, and in particular to a PCB manufacturing method, PCB washing equipment and water circulation system. Background Technology

[0002] As electronic products become smaller and thinner, PCB circuit designs are becoming increasingly sophisticated. Some current sophisticated circuit designs require line width / spacing of 2.5mil / 0.1mm and impedance tolerance within 5%.

[0003] While current etching lines can ensure the uniformity of circuitry in fine-line products, the intricate design of these circuits makes them prone to various problems during manufacturing. For example, during acid etching, tiny debris generated after PCB development can easily adhere to the dry film and the circuitry, proving difficult to remove completely during water rinsing. This results in residual copper between the etched circuit patterns. Residual copper can cause short circuits and is difficult to handle in subsequent processes, leading to high labor repair costs, product scrap costs, and delays in product delivery.

[0004] The industry's current solutions to the above-mentioned problems with PCBs featuring fine-line circuitry are as follows:

[0005] 1. Wet film exposure and development: This method replaces dry film with wet film. Wet film is acid resistant, but it has low alignment accuracy, making it difficult to meet the alignment requirements of fine circuits, and its surface is easily scratched.

[0006] 2. Ultrasonic water washing after development; Ultrasonic water washing has a certain effect on cleaning debris, but the improvement is not obvious, and there is a quality risk that the ultrasonic waves may loosen the dry film of fine circuits, leading to open circuits.

[0007] 3. Increase the frequency of production line maintenance; while increasing the frequency of production line maintenance can indeed improve the problem of residual copper short circuits in fine circuits, it results in a significant waste of materials, manpower, and equipment resources, leading to excessively high production costs.

[0008] 4. Designated production line; This method classifies and manages products of different dry film types. PCBs with fine circuits are made on designated production lines, and even equipped with equipment for flexible circuit board production. The cost is very high, but the equipment load is not high, which is not conducive to the stability control of the chemicals and the operating cost is high.

[0009] All of the above methods have certain shortcomings. The debris after development causes short circuits in the residual copper of fine circuit products, which has become a persistent problem in the industry. Summary of the Invention

[0010] The embodiments of this application aim to at least solve one of the problems of the prior art. To this end, the embodiments of this application provide a PCB manufacturing method, a PCB washing device, and a water circulation system to effectively remove debris generated during development and improve the yield of PCBs with fine lines in terms of residual copper short circuits.

[0011] One embodiment of this application provides a method for manufacturing a PCB. The method includes:

[0012] Provide a PCB to be manufactured;

[0013] The PCB to be manufactured is subjected to developing treatment and subsequent water washing treatment;

[0014] The post-development water washing process includes:

[0015] The surface area of ​​the PCB to be manufactured is alternately subjected to positive pressure spraying and negative pressure back suction; and the circulating water generated by the positive pressure spraying and the negative pressure back suction is subjected to multi-stage filtration.

[0016] Furthermore, the step of alternately applying positive pressure spraying and negative pressure back suction to the surface area of ​​the PCB to be manufactured includes:

[0017] The PCB to be manufactured is driven through a washing section, which includes spray heads and back suction heads arranged alternately along the moving direction of the PCB to be manufactured.

[0018] Furthermore, the spray heads are arranged on the upper and lower sides of the moving direction of the PCB to be manufactured, and the back suction heads are arranged on the upper and lower sides of the moving direction of the PCB to be manufactured.

[0019] Furthermore, the suction head includes a suction cover, which has a plurality of spaced suction slits. The extension direction of the suction slits is perpendicular to the moving direction of the PCB to be manufactured. The suction slits are parallel to and close to the surface of the PCB to be manufactured. The width of the suction slits is not greater than the width of the PCB to be manufactured.

[0020] Furthermore, the step of performing multi-stage filtration on the circulating water generated by the positive pressure spray and the negative pressure back suction includes:

[0021] The circulating water is driven through a primary filter element, which includes a stainless steel filter screen and a mesh screen.

[0022] The circulating water that has passed through the primary filter element is driven through the secondary filter element, which includes a PP cotton filter element.

[0023] Furthermore, the PCB manufacturing method further includes, before developing the PCB to be manufactured, the following steps:

[0024] A dry film is applied to the surface of the PCB to be manufactured; and

[0025] The PCB to be manufactured is subjected to exposure processing.

[0026] Furthermore, the PCB manufacturing method, after developing and washing the PCB to be manufactured, further includes:

[0027] The PCB to be manufactured is subjected to etching, post-etching water washing, film removal, and post-film removal water washing.

[0028] The PCB manufacturing method in this application embodiment has at least the following beneficial effects: During the post-development water washing process, some fine debris on the PCB surface is washed away under positive pressure spraying. However, some debris remains on the PCB due to obstruction by the dry film circuit pattern or insufficient spraying intensity. Negative pressure back suction acts on the remaining debris, further separating it from the PCB. The alternating action of positive pressure spraying and negative pressure back suction can effectively remove debris generated during the development process, thereby reducing residual copper after PCB etching and improving the yield of PCBs with fine circuits in terms of residual copper short circuits. In addition, the PCB manufacturing method in this application embodiment uses a multi-stage filtration method to treat the circulating water, effectively removing debris carried in the circulating water and preventing debris from returning to the water and causing nozzle blockage or re-adhesion onto the PCB surface after positive pressure spraying.

[0029] Another embodiment of this application provides a PCB washing apparatus. The PCB washing apparatus includes:

[0030] A washing tank, the washing tank including a material inlet, a material outlet and a drain outlet;

[0031] Sprinkler heads;

[0032] Back suction heads, the spray heads and the back suction heads are arranged alternately on the conveying path from the material inlet to the material outlet;

[0033] A filtration device, comprising an inlet and an outlet, wherein the outlet is connected to the inlet and the outlet is connected to the spray head and the back suction head, and the filtration device comprises at least a primary filter element and a secondary filter element.

[0034] Furthermore, the suction head includes a suction cover, which has a plurality of spaced suction slits. The extension direction of the suction slits is perpendicular to the conveying path, and the suction slits are used to come close to the surface of the PCB to be manufactured.

[0035] Furthermore, the primary filter element includes a stainless steel filter screen and a mesh screen, and the secondary filter element includes a PP cotton filter element.

[0036] Another aspect of this application provides a water circulation system. The water circulation system includes a circulation loop and a first inlet channel, a second inlet channel, and a drain channel respectively connected to the circulation loop. The circulation loop is equipped with the aforementioned PCB washing equipment. The water circulation system also includes valves and pumps.

[0037] The PCB washing equipment and water circulation system are used to implement the aforementioned PCB manufacturing method. Therefore, the PCB washing equipment and water circulation system in this application embodiment have the beneficial effects brought about by the aforementioned PCB manufacturing method, which will not be elaborated further here.

[0038] Additional aspects and advantages of this application will be set forth in part in the description which follows. Some will become apparent from the description, or may be learned by practice of this application. Attached Figure Description

[0039] Figure 1 This is a flowchart illustrating a PCB fabrication method in some embodiments of this application;

[0040] Figure 2 This is a flowchart illustrating a PCB fabrication method in some other embodiments of this application;

[0041] Figure 3 This is a schematic diagram of the structure of the back suction hood used in some embodiments of this application;

[0042] Figure 4 This is a schematic diagram of the PCB washing equipment in some embodiments of this application;

[0043] Figure 5 This is a schematic diagram of the operation of the water circulation system in some embodiments of this application.

[0044] In the picture:

[0045] 10-PCB to be manufactured; 20-washing tank; 30-roller; 40-spray head; 50-back suction head; 51-back suction hood; 60-valve; 70-pump; 80-primary filter element; 90-secondary filter element. Detailed Implementation

[0046] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. The technical solutions between the various embodiments of this application can be combined with each other based on what those skilled in the art can implement.

[0047] In this application, terms such as “first” or “second” are used for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated.

[0048] To meet the performance requirements of electronic products, PCB circuit designs are becoming increasingly sophisticated. However, the tiny debris generated after developing these intricate PCB circuits can easily stick between the dry film and the circuitry, making them difficult to remove completely during the spray washing process.

[0049] The debris mainly originates from the fine fragments produced during the continuous developing process, resulting from the developer dissolving the dry film. Although the PCB is spray-washed during the post-development rinse with a filter, the spray is insufficient to remove all debris adhering to the PCB. Furthermore, after a certain filtration time, the spray pressure decreases, reducing the effectiveness of the spray rinsing. Simultaneously, to ensure production efficiency, the PCB rinsing time should not be too long. All these factors combined make it difficult to effectively remove the fine debris adhering to the PCB surface.

[0050] One embodiment of this application provides a method for manufacturing a PCB. Please refer to... Figure 1 The manufacturing method includes:

[0051] Step S100: Provide a PCB10 to be manufactured.

[0052] Step S400: Perform development treatment and post-development water washing treatment on the PCB10 to be manufactured.

[0053] In step S400, the post-development water washing process includes: alternately applying positive pressure spraying and negative pressure back suction to the surface area of ​​the PCB10 to be manufactured; and performing multi-stage filtration on the circulating water generated by the positive pressure spraying and negative pressure back suction.

[0054] As mentioned above, after the development process is completed, the PCB10 to be manufactured needs to undergo a post-development water washing process. In this application, "surface area" refers to the area on the surface of the PCB10 to be manufactured that needs to be washed with water.

[0055] "Positive pressure spraying" refers to using the impact of water flow to detach debris from the PCB surface, while "negative pressure back suction" uses negative pressure to draw water containing debris from the PCB surface. This combination of suction and water suction effectively removes debris generated during the developing and rinsing processes.

[0056] "Recycled water" refers to the portion of water sprayed from the positive pressure spray system and water drawn in from the negative pressure backflow system that is recycled and reused. Generally, to reduce waste, both the water sprayed from the positive pressure spray system and the water drawn in from the negative pressure backflow system are recycled and reused. In some embodiments of this application, it is also possible to recycle and reuse only a portion of the water, such as only the water from the positive pressure spray system or only the water from the negative pressure backflow system.

[0057] "Multi-stage" refers to two or more stages, with each stage filtering debris of different particle sizes from coarse to fine. On the one hand, increasing the number of filtration stages can more effectively remove debris carried in the circulating water, preventing debris from returning to the water and causing nozzle blockage or re-adhesion onto the PCB10 board surface after positive pressure spraying. On the other hand, filtering out larger debris in the initial stage can also prevent subsequent filter layers from becoming clogged, thus avoiding a drop in water circulation pressure that could affect the effectiveness of positive pressure spraying.

[0058] Therefore, by combining positive pressure spraying and negative pressure back suction, and adding multi-stage filtration, this application overcomes the shortcomings of previous solutions, effectively removes debris generated during development, and improves the yield of PCBs with fine lines in terms of residual copper short circuits.

[0059] In some embodiments of this application, the step of alternately applying positive pressure spraying and negative pressure back suction to the surface area of ​​the PCB10 to be manufactured includes: driving the PCB10 to be manufactured through a water washing section, the water washing section including spray heads 40 and back suction heads 50 alternately arranged along the moving direction of the PCB10 to be manufactured.

[0060] As the PCB 10 to be manufactured moves along the washing section, it alternately passes through the spray head 40 and the back suction head 50, thereby achieving alternating positive pressure spraying and negative pressure back suction on the surface area of ​​the PCB 10. During this process, the PCB 10 does not need to stop conveying, achieving continuous debris washing without stopping the machine. The embodiments of this application combine the alternating spraying and back suction of the PCB 10 to be manufactured with the conveying process of the PCB 10, thereby improving the PCB manufacturing efficiency.

[0061] Specifically, in some embodiments of this application, spray heads are arranged on the upper and lower sides of the moving direction of the PCB 10 to be manufactured, and back suction heads are arranged on the upper and lower sides of the moving direction of the PCB 10 to be manufactured. This allows for simultaneous water washing of the surface areas on both sides of the PCB 10 to be manufactured, further improving the PCB manufacturing efficiency.

[0062] The back suction head 50 can be designed in various ways. For example, please refer to [link to relevant documentation]. Figure 3 In some embodiments of this application, the suction head 50 includes a suction cover 51, which has a plurality of spaced suction slits. The extension direction of the suction slits is perpendicular to the moving direction of the PCB10 to be manufactured, and the suction slits are close to the board surface of the PCB10 to be manufactured.

[0063] Understandably, on the one hand, the reduced exit area of ​​the suction head 50 by the back suction slits increases the suction force; on the other hand, when the PCB 10 to be manufactured passes through the suction head 50, multiple suction slits repeatedly suction the surface area of ​​the PCB 10, thus improving the suction effect. The width of the suction slits corresponds to the width of the PCB 10 to be manufactured; the width of the suction slits should not exceed the width of the PCB 10, otherwise, the suction pressure will be low.

[0064] The multi-stage filtration of this application will be discussed next. In some embodiments of this application, the step of multi-stage filtration of circulating water generated by positive pressure spraying and negative pressure back suction includes: driving the circulating water through a primary filter element 80, which includes a stainless steel filter screen and a mesh screen; driving the circulating water that has passed through the primary filter element 80 through a secondary filter element 90, which includes a PP cotton filter element.

[0065] The primary filter element 80 performs coarse filtration of the circulating water. The mesh size of the stainless steel filter screen can be controlled between 100 and 150 mesh; for example, a 120 mesh screen can be selected. It's important to understand that "mesh" or "mesh count" refers to the number of sieve openings per square inch (1 inch ≈ 25.4 mm). In this case, the pore size of the stainless steel filter screen is approximately 125 μm. Larger debris will be filtered out by the primary filter element 80.

[0066] The secondary filter element 90 performs fine filtration of circulating water. The PP cotton filter element refers to the melt-blown filter element made of polypropylene fiber, which can achieve a maximum filtration accuracy of about 1μm, thereby further removing fine debris from the circulating water.

[0067] In previous solutions, although a filtration system was provided for circulating water, it was generally a single-stage filtration system with a PP cotton filter (i.e., a fine filter). This easily led to large debris clogging the inlet of the PP cotton filter, hindering the passage of circulating water and causing a drop in water circulation pressure. At the same time, filtering large debris also affected the service life of the PP cotton filter. The multi-stage filtration method used in this application can overcome this defect.

[0068] For a return to PCB fabrication methods, please refer to [link / reference]. Figure 2 In some embodiments of this application, the PCB fabrication method further includes, before developing the PCB10 to be fabricated, the following steps:

[0069] Step S200: Cover the surface of the PCB10 to be manufactured with a dry film;

[0070] Step S300: Expose the PCB10 to be fabricated.

[0071] Dry film is a polymer material that undergoes a polymerization reaction under ultraviolet light during exposure to form a stable substance that adheres to the board surface, thus blocking electroplating and etching. The process of applying dry film involves pressing it onto the PCB, for example, peeling off a polyethylene protective film from the dry film and then applying it to the PCB under heat and pressure.

[0072] Continue reading Figure 2 In some embodiments of this application, the PCB manufacturing method, after developing and washing the PCB10 to be manufactured, further includes:

[0073] Step S600: Etching, post-etching water washing, film removal, and post-film removal water washing are performed on the PCB10 to be manufactured.

[0074] Another embodiment of this application provides a PCB washing apparatus for performing the post-development washing process in the aforementioned PCB manufacturing method.

[0075] Please see Figure 4 In some embodiments of this application, the PCB washing equipment includes:

[0076] Washing tank 20 includes a material inlet, a material outlet and a drain outlet;

[0077] Spray head 40 and back suction head 50 are arranged alternately on the conveying route from material inlet to material outlet;

[0078] The filtration device includes an inlet and an outlet, with the outlet connected to the inlet and the outlet connected to the spray head 40 and the back suction head 50. The filtration device includes at least a primary filter element 80 and a secondary filter element 90.

[0079] For details, please refer to [link / reference]. Figure 4 The PCB washing equipment also includes rollers 30, which are arranged at intervals along a conveying route determined based on the washing tank 20. The rollers 30 are paired up, and the PCB 10 to be manufactured passes between a pair of rollers 30 and is conveyed from the material inlet to the material outlet under the rotation of the rollers 30.

[0080] Spray heads 40 are arranged on the upper and lower sides of the moving direction of the PCB 10 to be manufactured, and back suction heads 50 are arranged on the upper and lower sides of the moving direction of the PCB 10 to be manufactured, thereby allowing the PCB washing equipment to wash the surfaces of both sides of the PCB 10 to be manufactured at the same time.

[0081] Back Figure 3 As mentioned above, in order to improve the back suction effect of the back suction head 50, the back suction head 50 may include a back suction cover 51. The back suction cover 51 has a plurality of back suction slits arranged at intervals. The extension direction of the back suction slits is perpendicular to the conveying route. The back suction slits are used to be parallel to and close to the board surface of the PCB10 to be manufactured.

[0082] Please see Figure 5 Another aspect of this application also provides a water circulation system, and the PCB water washing equipment provided in this application is a component of the water circulation system.

[0083] In some embodiments of this application, the water circulation system includes a circulation loop and a first water inlet channel, a second water inlet channel, and a drainage channel respectively connected to the circulation loop. The PCB water washing equipment of this application is installed in the circulation loop. The water circulation system controls the operation of the water flow through a valve 60 and a pump 70.

[0084] Continue reading Figure 5 The first water inlet channel is used to connect to the PCB washing water source, and at least a valve 60 marked 0# is installed in the first water inlet channel along the water flow direction;

[0085] The second water inlet channel is used to connect the system cleaning water source. The second water inlet channel is equipped with at least a pump 70 and a valve 60 marked 7# along the water flow direction.

[0086] The drainage channel is used to connect the wastewater discharge end, and the drainage channel is equipped with at least valve 60 and pump 70 with the number 3# along the water flow direction;

[0087] The loop includes the first branch, the second branch, and the third branch.

[0088] The first branch starts at the suction head 50 and ends at the inlet of the filter. The first branch is equipped with at least valve 60 (number 1#), pump 70 and valve 60 (number 2#) in sequence along the water flow direction.

[0089] The starting end of the second branch is connected to the drain outlet of the washing tank 20, and the ending end of the second branch is connected to the inlet of the filter device. The second branch is equipped with at least a pump 70 and a valve 60 labeled 4# in sequence along the water flow direction.

[0090] The starting end of the third branch is connected to the outlet of the filter device, and the ending end of the third branch is connected to the spray head 40. At least one valve 60 with the number 6# is installed in the third branch along the water flow direction.

[0091] Specifically, the water circulation system includes a normal operating state and a maintenance and cleaning state. The normal operating state corresponds to the post-development water washing process in the PCB manufacturing method. After completing the post-development water washing process, it can be switched to the maintenance and cleaning state as needed.

[0092] Under normal operating conditions, valves 60 labeled 3# and 7# are closed. First, valve 60 labeled 0# is opened to add water to the water circulation system until the required circulation level is met, and then it is closed. Next, valves 60 labeled 1#, 2#, 4#, 5#, and 6# are opened to achieve positive pressure spraying and negative pressure back suction circulation.

[0093] During maintenance and cleaning, the first step is to close valves 60 labeled 3# and 7#, and open the remaining valves 60 to circulate and clean the water circulation system. After completion, open valve 60 labeled 3# to drain the cleaning wastewater. This process can be repeated until the water circulation system is clean. The second step is to remove the primary filter element 80 and the secondary filter element 90. Except for valves 60 labeled 3# and 7#, close the remaining valves 60 to clean the primary filtration area in the water circulation system. After cleaning, install the new primary filter element 80 and the new secondary filter element 90 into the water circulation system.

[0094] To facilitate understanding of the technical solution of this application, the following text is combined with... Figures 2 to 5 A specific embodiment of this application is described—a PCB-based manufacturing method, in which the PCB10 to be manufactured is made into a PCB.

[0095] Please refer to the following first. Figure 2 The PCB-based fabrication method is carried out according to the following steps:

[0096] Step S100: Provide a PCB10 to be manufactured.

[0097] Step S200: Cover the surface of the PCB10 to be manufactured with a dry film;

[0098] Step S300: Expose the PCB10 to be fabricated.

[0099] Step S400: Develop the PCB10 to be manufactured and then wash it with water.

[0100] Step S500: Etch the PCB to be manufactured, wash it after etching, remove the film, and wash it after removing the film.

[0101] Specifically, in step S400, the post-development water washing process includes alternating positive pressure spraying and negative pressure back suction on the surface area of ​​the PCB10 to be manufactured through a water circulation system, and performing two-stage filtration on the circulating water generated by the positive pressure spraying and negative pressure back suction.

[0102] Please see Figure 5 The water circulation system includes valve 60, pump 70, pipelines, and PCB washing equipment.

[0103] Further reading Figure 4 PCB washing equipment includes:

[0104] Washing tank 20 includes a material inlet, a material outlet and a drain outlet;

[0105] Rollers 30 are arranged at intervals along a conveying route determined based on the washing tank 20. Rollers 30 are paired up. In step S500, the PCB10 to be manufactured passes through a pair of rollers 30 and is conveyed from the material inlet to the material outlet under the rotation of the rollers 30.

[0106] Spray head 40 and back suction head 50 are arranged alternately on the conveying route from material inlet to material outlet. Spray head 40 is arranged on the upper and lower sides of the moving direction of PCB10 to be manufactured, and back suction head 50 is arranged on the upper and lower sides of the moving direction of PCB10 to be manufactured.

[0107] The filtration device includes an inlet and an outlet, with the outlet connected to the inlet and the outlet connected to the spray head 40 and the back suction head 50. The filtration device includes a primary filter element 80 and a secondary filter element 90.

[0108] See Figure 3 The suction head 50 includes a suction cover 51, which has a plurality of spaced suction slits. The extension direction of the suction slits is perpendicular to the conveying route. The suction slits are used to be parallel to and close to the surface of the PCB10 to be manufactured.

[0109] Back Figure 5In step S500, valves 60 labeled 3# and 7# are closed. First, valve 60 labeled 0# is opened to add water to the water circulation system until the circulation level is met, and then it is closed. Then, valves 60 labeled 1#, 2#, 4#, 5# and 6# are opened to achieve positive pressure spraying and negative pressure back suction circulation.

[0110] The PCB-based manufacturing method also includes step S410: cleaning the water circulation system.

[0111] Specifically, the first step is to close valves 60 labeled 3# and 7#, and open the remaining valves 60 to circulate and clean the water circulation system. After completion, open valve 60 labeled 3# to drain the cleaning wastewater. This process can be repeated until the water circulation system is clean. The second step is to remove the primary filter element 80 and the secondary filter element 90. Except for valves 60 labeled 3# and 7#, close the remaining valves 60 to clean the primary filtration area in the water circulation system. After cleaning, install new primary filter elements 80 and secondary filter elements 90 into the water circulation system.

[0112] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A method for manufacturing a PCB, characterized in that, include: Provide a PCB to be manufactured; The PCB to be manufactured is subjected to developing treatment and subsequent water washing treatment; The post-development water washing process includes: The surface area of ​​the PCB to be manufactured is alternately subjected to positive pressure spraying and negative pressure back suction; The PCB to be manufactured is driven through a water washing section, which includes spray heads and back suction heads arranged alternately along the moving direction of the PCB to be manufactured. The spray heads are arranged on the upper and lower sides of the moving direction of the PCB to be manufactured, and the back suction heads are arranged on the upper and lower sides of the moving direction of the PCB to be manufactured. The circulating water generated by the positive pressure spray and the negative pressure back suction is subjected to multi-stage filtration. The circulating water is driven through a primary filter element, which includes a stainless steel filter screen and a mesh screen. The circulating water that has passed through the primary filter element is driven through the secondary filter element, which includes a PP cotton filter element.

2. The PCB manufacturing method according to claim 1, characterized in that, The suction head includes a suction cover, which has a plurality of spaced suction slits. The extension direction of the suction slits is perpendicular to the moving direction of the PCB to be manufactured. The suction slits are parallel to and close to the surface of the PCB to be manufactured. The width of the suction slits is not greater than the width of the PCB to be manufactured.

3. The PCB manufacturing method according to claim 1, characterized in that, The PCB manufacturing method further includes, before developing the PCB to be manufactured, the following: A dry film is applied to the surface of the PCB to be manufactured; and The PCB to be manufactured is subjected to exposure processing.

4. A method for manufacturing a PCB according to claim 3, characterized in that, The PCB manufacturing method, after developing and washing the PCB to be manufactured, further includes: etching the PCB to be manufactured, washing it after etching, removing the film, and washing it after removing the film.

5. A PCB washing device, employing the PCB manufacturing method as described in claim 1, characterized in that, include: A washing tank, the washing tank including a material inlet, a material outlet and a drain outlet; Sprinkler heads; Back suction heads, the spray heads and the back suction heads are arranged alternately on the conveying path from the material inlet to the material outlet; A filtration device, comprising an inlet and an outlet, wherein the outlet is connected to the inlet and the outlet is connected to the spray head and the back suction head, and the filtration device comprises at least a primary filter element and a secondary filter element.

6. The PCB washing equipment according to claim 5, characterized in that: The suction head includes a suction cover, which has multiple spaced suction slits. The extension direction of the suction slits is perpendicular to the conveying path, and the suction slits are used to come close to the surface of the PCB to be manufactured.

7. A water circulation system, characterized in that: The water circulation system includes a circulation loop and a first water inlet channel, a second water inlet channel, and a drainage channel respectively connected to the circulation loop. The circulation loop is equipped with the PCB water washing equipment as described in claim 5 or 6. The water circulation system also includes valves and pumps.

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