Housing, Electronic Device and Preparation Method of Housing

Abstract

The present application discloses a housing, an electronic device, and a method for manufacturing the housing, relating to the technical field of housings. In the housing, the first film group includes a first texture layer and a first optical film layer that are stacked; the substrate is stacked with the first film group and is located on the side of the first optical film layer away from the first texture layer; the second film group is stacked with the substrate and is located on the side of the substrate away from the first film group, and includes a second texture layer and a second optical film layer that are stacked, and the second optical film layer is located on the side of the second texture layer away from the substrate. The present application superimposes color effects through the first film group and the second film group located on both sides of the substrate. For example, the three-dimensional sense of the housing morphology is presented through the cooperation of the first texture layer, the first optical film layer, the second texture layer, and the second optical film layer, making the pattern colors more diverse and rich.

Description

Technical Field

[0001] This application relates to the technical field of housings, and particularly to a housing, an electronic device, and a method for manufacturing the housing. Background Art

[0002] For the back cover of a mobile phone in the prior art, a color effect is formed by coating on the surface, but the pattern color of the mobile phone back cover is single, and thus the appearance expressiveness of the mobile phone is poor. Summary of the Invention

[0003] The technical problem to be solved by this application is to provide a housing, comprising:

[0004] A first film group, comprising a first texture layer and a first optical film layer stacked;

[0005] A substrate, stacked with the first film group and located on a side of the first optical film layer away from the first texture layer; and

[0006] A second film group, stacked with the substrate and located on a side of the substrate away from the first film group, and comprising a second texture layer and a second optical film layer stacked, the second optical film layer being located on a side of the second texture layer away from the substrate.

[0007] The technical problem to be solved by this application is to provide an electronic device, comprising:

[0008] A housing, comprising:

[0009] A first film group, comprising a first texture layer and a first optical film layer stacked;

[0010] A substrate, stacked with the first film group and located on a side of the first optical film layer away from the first texture layer; and

[0011] A second film group, stacked with the substrate and located on a side of the substrate away from the first film group, and comprising a second texture layer and a second optical film layer stacked, the second optical film layer being located on a side of the second texture layer away from the substrate; and

[0012] A display screen, disposed on the housing to display information.

[0013] The technical problem to be solved by this application is to provide a method for manufacturing a housing, comprising:

[0014] Forming a first film group on a first carrier film, the first film group comprising a first texture layer and a first optical film layer stacked;

[0015] Forming a second film group on a second carrier film, the second film group comprising a second texture layer and a second optical film layer stacked;

[0016] An injection-molded substrate is formed and disposed between the first film group and the second film group to form the housing. The substrate is located on the side of the first optical film layer away from the first texture layer and on the side of the second texture layer away from the second optical film layer.

[0017] Adopting the technical solution of the present application has the following beneficial effects: The present application superimposes color effects through the first film group and the second film group on both sides of the substrate. For example, the three-dimensional sense of the housing morphology is presented through the cooperation of the first texture layer, the first optical film layer, the second texture layer, and the second optical film layer, making the pattern colors more diverse and rich. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 It is a schematic structural diagram of the housing in an embodiment of the present application;

[0020] Figure 2 For Figure 1 It is a schematic structural diagram when the first film group and the substrate are stacked and cooperated in the shown embodiment;

[0021] Figure 3 For Figure 2 It is a schematic structural diagram when the first film group and the substrate are stacked and cooperated in the shown embodiment;

[0022] Figure 4 For Figure 2 It is a schematic structural diagram when the first optical film layer and the substrate are stacked and cooperated in the shown embodiment;

[0023] Figure 5 For Figure 2 It is a schematic structural diagram when the first film group and the substrate are stacked and cooperated in the shown embodiment;

[0024] Figure 6 For Figure 1 It is a schematic structural diagram when the substrate and the second film group are stacked and cooperated in the shown embodiment;

[0025] Figure 7 For Figure 6 It is a schematic structural diagram when the substrate and the second film group are stacked and cooperated in the shown embodiment;

[0026] Figure 8 For Figure 7Schematic diagram of the structure when the second texture layer and the second optical film layer are stacked and combined in the illustrated embodiment;

[0027] Figure 9 is Figure 6 Schematic diagram of the structure when the substrate and the second film group are stacked and combined in the illustrated embodiment;

[0028] Figure 10 is Figure 1 Schematic diagram of the structure when the substrate and the second film group are stacked and combined in the illustrated embodiment;

[0029] Figure 11 is Figure 10 Schematic diagram of the structure when the substrate and the second film group are stacked and combined in the illustrated embodiment;

[0030] Figure 12 Schematic diagram of the structure of the housing in an embodiment of the present application;

[0031] Figure 13 Schematic diagram of the structure of the electronic device in an embodiment of the present application;

[0032] Figure 14 is Figure 13 Exploded view of the electronic device in the illustrated embodiment;

[0033] Figure 15 Schematic diagram of the structural composition of the electronic device in an embodiment of the present application;

[0034] Figure 16 Flow chart of the preparation method of the housing in an embodiment of the present application;

[0035] Figure 17 is Figure 16 Flow chart of step S101 in the illustrated embodiment;

[0036] Figure 18 is Figure 16 Flow chart of step S101 in the illustrated embodiment;

[0037] Figure 19 is Figure 16 Flow chart of step S102 in the illustrated embodiment;

[0038] Figure 20 is Figure 19 Flow chart of step S102 in the illustrated embodiment;

[0039] Figure 21 is Figure 19 Flow chart of step S102 in the illustrated embodiment. Detailed implementation manners

[0040] The present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be specifically noted that the following embodiments are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following embodiments are only partial embodiments of the present application rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0041] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0042] Next, a housing will be described. The housing can be applied to electronic devices such as mobile phones, tablet computers, and laptop computers. The housing can exhibit more diverse and rich pattern colors, and has better appearance expressiveness.

[0043] Please refer to Figure 1 , Figure 1 which is a schematic structural diagram of the housing 100 in an embodiment of the present application. The housing 100 can include a first film group 10, a substrate 20, and a second film group 30 that are sequentially stacked. The first film group 10 and the second film group 30 can respectively exhibit patterns and / or colors to enhance the three-dimensional sense of the overall morphology of the housing 100 in cooperation with each other, and the pattern colors presented are more diverse and rich. The substrate 20 can serve to carry the first film group 10 and the second film group 30. Of course, in some scenarios, the substrate 20 can have textures, patterns, or colors to further enhance the overall appearance expressiveness of the housing 100. In some scenarios, when the user views the housing 100 on the side of the substrate 20 close to the first film group 10, the cooperation between the first film group 10 and the second film group 30 makes the housing 100 have better appearance expressiveness.

[0044] It should be noted that the terms "first", "second", "third", etc. in the present application are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first", "second", "third", etc. can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0045] The first film group 10 can be bonded to the substrate 20, for example, by glue. In some embodiments, it can be bonded by PUR (Polyurethane Reactive, moisture-curing reactive polyurethane hot melt adhesive) glue.

[0046] Please refer to Figure 1 and Figure 2 , Figure 2 which is Figure 1 a schematic structural diagram when the first film group 10 and the substrate 20 are stacked and matched in the illustrated embodiment. The first film group 10 may include a first texture layer 11 and a first optical film layer 12 which are stacked. The first optical film layer 12 is stacked with the substrate 20. The first texture layer 11 is located on the side of the first optical film layer 12 away from the substrate 20.

[0047] The first texture layer 11 is made of a transparent material. The first texture layer 11 may be a UV transfer layer. The UV transfer layer can form a texture effect, so that the housing 100 has a good texture. Moreover, the UV transfer layer itself has adhesiveness and can also adhere directly to adjacent laminates (for example, Figure 2 in the first texture layer 11 and the substrate 20 in the figure are both laminates adjacent to the first optical film layer 12).

[0048] Specifically, the UV transfer layer is a laminate formed by the UV transfer process, which can be understood as transferring the texture on the mold to the surface of a laminate by using UV glue (Ultraviolet Rays) with photocuring performance.

[0049] The first texture layer 11 may have a texture pattern or may be a texture without a pattern. In some embodiments, the texture of the first texture layer 11 can form a texture layer with a gradient effect. For example, the texture of the first texture layer 11 can be lines with a gradually changing width, or round holes, square grids, etc. with gradually changing sizes and densities.

[0050] It can be understood that the performance of the texture of the first texture layer 11, such as the arrangement, shape, three-dimensional sense, size, etc., can be adjusted according to the needs of those skilled in the art and will not be elaborated.

[0051] In some embodiments, the thickness of the first texture layer 11 may be 9 - 15 μm. In some embodiments, the thickness of the first texture layer 11 may be one of 10 μm, 11 μm, 12 μm, 13 μm, and 14 μm.

[0052] Please refer to Figure 2 and Figure 3 , Figure 3 which is Figure 2Schematic diagram of the structure when the first film group 10 and the substrate 20 are stacked and combined in the illustrated embodiment. The first optical film layer 12 can, in cooperation with light, make the housing 100 more colorful. The first optical film layer 12 can be adhesively fixed to the first texture layer 11 and the substrate 20 respectively.

[0053] The first optical film layer 12 can include a first varnish layer 121 and a first reflective layer 122 which are stacked. The first varnish layer 121 is stacked with the substrate 20. The first reflective layer 122 is located between the first varnish layer 121 and the substrate 20.

[0054] The first varnish layer 121 can be made by coating varnish. Varnish, a synthetic resin, is usually referred to as a surface transparent varnish now, made of a base material and additives, etc., without adding any pigments, and is shiny after forming a film. The first varnish layer 121 can increase the bonding force between it and the adjacent laminates (for example Figure 3 in the first varnish layer 121 can be the laminates adjacent to the first texture layer 11 and the first reflective layer 122 respectively), and avoid delamination and peeling of the laminates. In some embodiments, a transparent adhesive is coated between the first varnish layer 121 and the adjacent laminate to enhance the bonding strength. In one embodiment, the first varnish layer 121 can be adhesively fixed to the first texture layer 11 and the first reflective layer 122 respectively.

[0055] In some embodiments, the thickness of the first varnish layer 121 can be 8 - 12 μm. In some embodiments, the thickness of the first varnish layer 121 can be one of 8.5 μm, 9 μm, 9.5 μm, 10 μm, 10.5 μm, 11 μm and 11.5 μm.

[0056] The first reflective layer 122 is used to reflect the incident light, so that the reflected light passes through the first varnish layer 121 and the first texture layer 11, thereby making the housing 100 present a more bright and colorful effect. In one embodiment, the first reflective layer 122 can be adhesively fixed to the substrate 20.

[0057] Please refer to Figure 4 , Figure 4 which is Figure 2 a schematic diagram of the structure when the first optical film layer 12 and the substrate 20 are stacked and combined in the illustrated embodiment. The first reflective layer 122 can be an optical thin film coating layer or multiple optical thin film coating layers which are stacked with the first varnish layer 121 respectively and fixedly connected to each other. Each optical thin film coating layer in the first reflective layer 122 can be formed by any one of evaporation coating, sputtering coating (such as continuous line sputtering, magnetron sputtering, furnace body sputtering). The material of the first reflective layer 122 can be SiO 2 , ZrO 2 and TiO 2 one or more of them.

[0058] In one embodiment, the thickness of the first reflective layer 122 may be 150 - 400 nm to change the reflection effect of the first reflective layer 122, so that the first reflective layer 122 reflects better light, enabling the housing 100 to present a colorful effect. In one embodiment, the thickness of the first reflective layer 122 may be 200 - 300 nm. In one embodiment, the thickness of the first reflective layer 122 may be one of 175 nm, 225 nm, 250 nm, 275 nm, 325 nm, 350 nm, 375 nm.

[0059] In some embodiments, the first reflective layer 122 may include a first optical thin film coating and a second optical thin film coating that are sequentially stacked. The first optical thin film coating is located on the side of the first varnish layer 121 away from the first texture layer 11. The second optical thin film coating is located on the side of the first optical thin film coating away from the first varnish layer 121. In some embodiments, the material of the first optical thin film coating may be TiO 2 or SiO 2 . In some embodiments, the material of the second optical thin film coating may be ZrO 2 or TiO 2 or SiO 2 .

[0060] In some embodiments, the first reflective layer 122 may include an SiO 2 layer 1221, a ZrO 2 layer 1222, a TiO 2 layer 1223, an SiO 2 layer 1224, a TiO 2 layer 1225, an SiO 2 layer 1226, and a TiO 2 layer 1227. The SiO 2 layer 1221, the ZrO 2 layer 1222, the TiO 2 layer 1223, the SiO 2 layer 1224, the TiO 2 layer 1225, the SiO 2 layer 1226, and the TiO 2 layer 1227 are each an optical thin film coating. In some embodiments, the first reflective layer 122 may include an SiO 2 layer 1221, a ZrO 2 layer 1222, a TiO 2 layer 1223, an SiO 2 layer 1224, a TiO 2 layer 1225, an SiO 2 layer 1226, and a TiO 2At least one layer in layer 1227.

[0061] In some embodiments, ZrO 2 Layer 1222 can be a second optical thin film coating. In some embodiments, SiO 2 Layer 1221, TiO 2 Layer 1223, SiO 2 Layer 1224, TiO 2 Layer 1225, SiO 2 Layer 1226 and TiO 2 Layer 1227 can be respectively referred to as the first optical thin film coating or the second optical thin film coating. In some embodiments, SiO 2 Layer 1221, SiO 2 Layer 1224 and SiO 2 Layer 1226 can be respectively referred to as the first optical thin film coating. In some embodiments, TiO 2 Layer 1223, TiO 2 Layer 1225 and TiO 2 Layer 1227 can be respectively referred to as the second optical thin film coating.

[0062] In some embodiments, SiO 2 The thickness of layer 1221 is 5 - 10 nm. In some embodiments, SiO 2 The thickness of layer 1221 is one of 6 nm, 7 nm, 8 nm, and 9 nm.

[0063] In some embodiments, ZrO 2 The thickness of layer 1222 is 3 - 15 nm. In some embodiments, ZrO 2 The thickness of layer 1222 is one of 5 nm, 7 nm, 9 nm, 11 nm, and 13 nm.

[0064] In some embodiments, TiO 2 The thickness of layer 1223 is 50 - 150 nm. In some embodiments, TiO 2 The thickness of layer 1223 is one of 75, 100, and 125 nm.

[0065] In some embodiments, SiO 2 The thickness of layer 1224 is 10 - 50 nm. In some embodiments, SiO 2 The thickness of layer 1224 is one of 20 nm, 30 nm, and 40 nm.

[0066] In some embodiments, TiO 2 The thickness of layer 1225 is 20 - 120 nm. In some embodiments, TiO 2The thickness of layer 1225 is one of 40 nm, 60 nm, 80 nm, and 100 nm.

[0067] In some embodiments, SiO 2 The thickness of layer 1226 is 10 - 50 nm. In some embodiments, SiO 2 The thickness of layer 1226 is one of 20 nm, 30 nm, and 40 nm.

[0068] In some embodiments, TiO 2 The thickness of layer 1227 is 20 - 120 nm. In some embodiments, TiO 2 The thickness of layer 1227 is one of 40 nm, 60 nm, 80 nm, and 100 nm.

[0069] It can be understood that while the first reflective layer 122 reflects light, it also allows light to pass through and pass through the substrate 20 and the second film group 30. Of course, in certain embodiments, the above first reflective layer 122 can be replaced with an optical film having a reflective effect and an antireflection effect.

[0070] In some embodiments, please refer to Figure 5 , Figure 5 is Figure 2 a schematic structural diagram when the first film group 10 and the substrate 20 are stacked and combined in the illustrated embodiment. The first film group 10 further includes a pattern layer 13 disposed between the first texture layer 11 and the first optical film layer 12. The pattern layer 13 can have one or more of a LOGO (Logotype, logo), a pattern, or characters. In some embodiments, the pattern layer 13 can be bonded to the first texture layer 11 and the first optical film layer 12 respectively. In some embodiments, the pattern layer 13 can be fabricated by screen printing.

[0071] In some embodiments, the thickness of the pattern layer 13 can be 3 - 5 μm. In some embodiments, the thickness of the pattern layer 13 can be one of 3.5 μm, 4 μm, and 4.5 μm.

[0072] The substrate 20 can be entirely transparent. In some embodiments, the substrate 20 can also be translucent. The substrate 20 can be made by injection molding and / or compression molding. The substrate 20 can serve to support the first film group 10 and the second film group 30. In some embodiments, the material of the substrate 20 can be PC (polycarbonate, Polycarbonate). Of course, the substrate 20 can also be other materials such as materials that are convenient for injection molding and can be bonded to the first film group 10 and the second film group 30.

[0073] The second film group 30 can be bonded to the substrate 20, for example, by glue. In some embodiments, it can be bonded by PUR (Polyurethane Reactive, moisture-curing reactive polyurethane hot melt adhesive) glue.

[0074] Please refer to Figure 1 and Figure 6 , Figure 6 For Figure 1 the schematic structural diagram when the substrate 20 and the second film group 30 are stacked and matched in the illustrated embodiment. The second film group 30 may include a second texture layer 31 and a second optical film layer 32 which are stacked. The second texture layer 31 is stacked with the substrate 20. The second optical film layer 32 is located on the side of the second texture layer 31 away from the substrate 20.

[0075] For the general arrangement and structure of the second texture layer 31, reference can be made to the first texture layer 11, and no more details will be described here. Only the differences from the first texture layer 11 will be introduced.

[0076] In some embodiments, the texture effect of the second texture layer 31 may be different from that of the first texture layer 11. It can be understood that the texture of the second texture layer 31 cannot form moiré patterns with the texture of the first texture layer 11.

[0077] In some embodiments, Figure 6 the second optical film layer 32 and the substrate 20 in are both laminated adjacent to the second texture layer 31. Furthermore, in some scenarios, the second texture layer 31 is bonded and fixed to the second optical film layer 32 and the substrate 20 respectively.

[0078] Please refer to Figure 6 and Figure 7 , Figure 7 For Figure 6 the schematic structural diagram when the substrate 20 and the second film group 30 are stacked and matched in the illustrated embodiment. The second optical film layer 32 can make the housing 100 more colorful in cooperation with the light passing through the substrate 20. The second optical film layer 32 can be bonded and fixed to the second texture layer 31.

[0079] The second optical film layer 32 may include a second reflective layer 321 and a second varnish layer 322 which are stacked. The second varnish layer 322 is stacked with the substrate 20. The second reflective layer 321 is located between the second varnish layer 322 and the substrate 20.

[0080] For the general arrangement and structure of the second reflective layer 321, reference can be made to the first reflective layer 122, and no more details will be described here. Only the differences from the first reflective layer 122 will be introduced.

[0081] The second reflection layer 321 is used to reflect the light incident from one side of the substrate 20, so that the reflected light passes through the second texture layer 31, the substrate 20, and the first film group 10, thereby making the housing 100 present a more bright and colorful effect. In one embodiment, the first reflection layer 122 can be adhesively fixed to the substrate 20.

[0082] Please refer to Figure 8 , Figure 8 For Figure 7 the schematic structural diagram when the second texture layer 31 and the second optical film layer 32 are stacked and matched in the illustrated embodiment. The second reflection layer 321 can be an optical thin film coating layer or multiple optical thin film coating layers stacked and fixedly connected to the second texture layer 31 respectively.

[0083] In one embodiment, the material of the second reflection layer 321 can be SiO 2 , In 2 O 3 and SnO, or one or more of them.

[0084] In one embodiment, the thickness of the second reflection layer 321 can be 50 - 100 nm. To change the reflection effect of the second reflection layer 321, so that the second reflection layer 321 reflects better light toward the first film group 10 side, so as to make the housing 100 present a colorful effect. In one embodiment, the thickness of the second reflection layer 321 can be 50 - 80 nm. In one embodiment, the thickness of the first reflection layer 122 can be one of 55 nm, 60 nm, 65 nm, 70 nm, and 75 nm.

[0085] In some embodiments, the second reflection layer 321 can include a first optical thin film coating layer and a second optical thin film coating layer stacked in sequence. The first optical thin film coating layer is located on the side of the second texture layer 31 close to the second clear coat layer 322. The second optical thin film coating layer is located on the side of the first optical thin film coating layer far from the second texture layer 31.

[0086] In some embodiments, the material of the first optical thin film coating layer can be SiO 2 . In some embodiments, the material of the second optical thin film coating layer can be In 2 O 3 or SnO.

[0087] In some embodiments, the second reflection layer 321 can include SiO 2 layer 3211, In 2 O 3 layer 3212, SiO 2 layer 3213, SnO layer 3214, and SiO 2 layer 3215. SiO 2 layer 3211, In2 O 3 Layer 3212, SiO 2 Layer 3213, SnO layer 3214 and SiO 2 Layer 3215 are each an optical thin film coating layer. In some embodiments, the first reflective layer 122 may include SiO 2 Layer 3211, In 2 O 3 Layer 3212, SiO 2 Layer 3213, SnO layer 3214 and SiO 2 At least one of layer 3215.

[0088] In some embodiments, SiO 2 Layer 3211, SiO 2 Layer 3213 and SiO 2 Layer 3215 may be respectively referred to as the first optical thin film coating layer. In some embodiments, In 2 O 3 Layer 3212 and SnO layer 3214 may be respectively referred to as the second optical thin film coating layer.

[0089] In some embodiments, the thickness of SiO 2 Layer 3211 is 5 - 10 nm. In some embodiments, the thickness of SiO 2 Layer 3211 is one of 6 nm, 7 nm, 8 nm, and 9 nm.

[0090] In some embodiments, the thickness of In 2 O 3 Layer 3212 is 20 - 50 nm. In some embodiments, the thickness of In 2 O 3 Layer 3212 is one of 25 nm, 30 nm, 35 nm, 40 nm, and 45 nm.

[0091] In some embodiments, the thickness of SiO 2 Layer 3213 is 5 - 10 nm. In some embodiments, the thickness of SiO 2 Layer 3213 is one of 6 nm, 7 nm, 8 nm, and 9 nm.

[0092] In some embodiments, the thickness of SnO layer 3214 is 5 - 15 nm. In some embodiments, the thickness of SnO layer 3214 is one of 7 nm, 9 nm, 11 nm, and 13 nm.

[0093] In some embodiments, the thickness of SiO 2 Layer 3215 is 5 - 10 nm. In some embodiments, the thickness of SiO 2The thickness of layer 3215 is one of 6 nm, 7 nm, 8 nm, and 9 nm.

[0094] Understandably, while the second reflective layer 321 reflects light, it also allows light to pass through and pass through the second varnish layer 322. Of course, in some embodiments, the second reflective layer 321 described above can be replaced with an optical film having a reflective effect and an antireflection effect.

[0095] For the general arrangement and structure of the second varnish layer 322, reference can be made to the first varnish layer 121, and no further elaboration will be made here. Only the differences from the first varnish layer 121 will be introduced.

[0096] In one embodiment, Figure 7 and Figure 8 in the second varnish layer 322 is a laminate adjacent to the second reflective layer 321. Further, in some embodiments, the second varnish layer 322 is adhesively fixed to the second reflective layer 321.

[0097] In some embodiments, please refer to Figure 9 , Figure 9 is Figure 6 a schematic structural diagram of the substrate 20 and the second film group 30 in a stacked and mated state in the illustrated embodiment. The second film group 30 further includes an offset printing layer 33 disposed between the second texture layer 31 and the second optical film layer 32. The offset printing layer 33 can be formed by offset printing, with a thickness of about 3 - 7 μm, to complete the production of the color effect, so as to form a psychedelic color effect. In some embodiments, the thickness of the offset printing layer 33 can be one of 4 μm, 5 μm, and 6 μm. In some embodiments, the color in the offset printing layer 33 can be one of red, blue, and purple. Even the color of the offset printing layer 33 is a gradient color.

[0098] In some embodiments, a dot structure can also be provided on the offset printing layer 33. For example, the dot structure is to use dots with delicate, uniform, and different line counts to enable the housing 100 to present different gradient effects.

[0099] Please refer to Figure 10 , Figure 10 is Figure 1 a schematic structural diagram of the substrate 20 and the second film group 30 in a stacked and mated state in the illustrated embodiment. The second film group 30 further includes a primer layer 34 disposed on the side of the second optical film layer 32 away from the second texture layer 31.

[0100] The primer layer 34 can be specifically formed on the second optical film layer 32 by processes such as spraying, silk screening, printing, and offset printing using color ink, pigments, dyes, etc. It can be set to be semi - transparent or opaque according to actual needs, so as to make the color presented by the housing 100 more abundant. Among them, the color presented by the primer layer 34 can be selected according to actual needs and is not limited here.

[0101] In one embodiment, the primer layer 34 may include one or more ink layers arranged in a stacked manner. In one embodiment, the color of each ink layer may be different.

[0102] In one embodiment, refer to Figure 11 , Figure 11 is Figure 10 a schematic structural diagram when the substrate 20 and the second film group 30 are stacked and matched in the illustrated embodiment. The primer layer 34 may include a fireproof ink layer 341 and a bottom ink layer 342 that are sequentially stacked on the side of the second optical film layer 32 away from the second texture layer 31. In one embodiment, the thickness of the fireproof ink layer 341 may be 5 - 20 μm. In some embodiments, the thickness of the fireproof ink layer 341 may be one of 8 μm, 11 μm, 14 μm, and 17 μm. In one embodiment, the thickness of the bottom ink layer 342 may be 5 - 10 μm. In some embodiments, the thickness of the bottom ink layer 342 may be one of 6 μm, 7 μm, 8 μm, and 9 μm.

[0103] It can be understood that the primer layer 34 may not be part of the second film group 30 either.

[0104] Refer to Figure 12 , Figure 12 is a schematic structural diagram of the housing 100 in an embodiment of the present application. Light can enter from one side of the first film group 10, pass through the first film group 10, the substrate 20, and the second film group 30, and be reflected by the first reflective layer 122 and the second reflective layer 321. The light can also pass through the first reflective layer 122 and the second reflective layer 321. With the cooperation of the first texture layer 11, the second texture layer 31, the pattern layer 13, the offset printing layer 33, and the primer layer 34, the three-dimensional sense of the overall shape of the housing 100 can also be presented, and the presented pattern colors are more diverse and rich.

[0105] Next, an electronic device will be described. The electronic device may adopt the housing 100 of the above embodiment.

[0106] As used herein, an "electronic device" (which may also be referred to as a "terminal" or "mobile terminal" or "electronic apparatus") includes, but is not limited to, a device configured to receive / transmit communication signals via a wired connection (such as via a Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), digital cable, direct cable connection, and / or another data connection / network) and / or via a wireless interface (such as for a cellular network, Wireless Local Area Network (WLAN), digital television network such as a DVB-H network, satellite network, AM-FM broadcast transmitter, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; Personal Communication System (PCS) terminals that may combine cellular radiotelephone with data processing, facsimile, and data communication capabilities; PDAs that may include a radiotelephone, pager, Internet / intranet access, Web browser, notepad, calendar, and / or Global Positioning System (GPS) receiver; and conventional laptop and / or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A mobile phone is an electronic device configured with a cellular communication module.

[0107] Please refer to Figure 13 and Figure 14 , Figure 13 which is a schematic structural diagram of an electronic device 300 in an embodiment of the present application. Figure 14 is Figure 13 an exploded view of the electronic device 300 in the illustrated embodiment. The electronic device 300 may include a display screen 50 for displaying information, a middle frame assembly 60 for mounting the display screen 50 on one side, a circuit main board 70 mounted on the middle frame assembly 60, a battery 80 mounted on the middle frame assembly 60, and a cover assembly 90 snap-connected to the other side of the middle frame assembly 60. It can be understood that the middle frame assembly 60 and the cover assembly 90 may form the housing of the electronic device 300. Of course, in some embodiments, the housing of the electronic device 300 may not include the middle frame assembly 60 and the cover assembly 90, but may be arranged in other ways, and then the display screen 50 is arranged on the housing, and electronic components such as cameras, circuit main boards 70, batteries 80, processors, antennas, and various types of sensors in the electronic device 300 are arranged inside the housing. In one embodiment, the cover assembly 90 may be the housing 100 in the above embodiment. In some embodiments, the housing may be the housing 100 in the above embodiment.

[0108] The display screen 50 may be a display screen of types such as a Liquid Crystal Display (LCD) or an Organic Light-Emitting Diode (OLED) display screen for displaying information and pictures.

[0109] The material of the middle frame assembly 60 can be metals such as magnesium alloy, aluminum alloy, stainless steel, etc. Of course, the material is not limited to this, and it can also be other materials such as insulating materials, for example, hard materials. The middle frame assembly 60 can be disposed between the display screen 50 and the cover plate assembly 90. The middle frame assembly 60 can be used to carry the display screen 50. The middle frame assembly 60 is snap-connected to the cover plate assembly 90 to form the outer contour of the electronic device 300 and form a receiving cavity inside. The receiving cavity can be used to accommodate electronic components such as cameras, circuit main boards 70, batteries 80, processors, antennas, and various types of sensors in the electronic device 300. It can be understood that the housing is not limited to the middle frame assembly 60 and the cover plate assembly 90, and can also include other structures, which will not be elaborated here. In some embodiments, the surface of the middle frame assembly 60 can also be provided with the housing 100 in the above embodiments.

[0110] The circuit main board 70 is installed in the receiving cavity and can be installed at any position in the receiving cavity. The circuit main board 70 can be the main board of the electronic device 300. The processor of the electronic device 300 can be disposed on the circuit main board 70. One, two or more functional components such as a motor, a microphone, a speaker, a receiver, a headphone jack, a universal serial bus interface (USB interface), a camera, a distance sensor, an ambient light sensor, and a gyroscope can also be integrated on the circuit main board 70. At the same time, the display screen 50 can be electrically connected to the circuit main board 70.

[0111] The battery 80 is installed in the receiving cavity and can be installed at any position in the receiving cavity. The battery 80 can be electrically connected to the circuit main board 70 to enable the battery 80 to supply power to the electronic device 300. A power management circuit can be provided on the circuit main board 70. The power management circuit is used to distribute the voltage provided by the battery 80 to each electronic component in the electronic device 300, such as the display screen 50.

[0112] In some embodiments, the cover plate assembly 90 can wrap the middle frame assembly 60 and can carry the display screen 50, so that the cover plate assembly 90 becomes the outer shell of the electronic device 300. Structures such as a rear camera hole and a fingerprint recognition module installation hole can be formed on the cover plate assembly 90.

[0113] Next, an electronic device will be described. Please refer to Figure 15 , Figure 15Schematic diagram of the structural composition of an electronic device 500 in an embodiment of the present application. The electronic device 500 can be a mobile phone, a tablet computer, a laptop computer, a wearable device, etc. In this embodiment, a mobile phone is taken as an example. The structure of the electronic device 500 may include an RF circuit 510, a memory 520, an input unit 530, a display unit 540 (i.e., the display screen 50 in the above embodiment), a sensor 550, an audio circuit 560, a WiFi module 570, a processor 580, and a power supply 590, etc. Among them, the RF circuit 510, the memory 520, the input unit 530, the display unit 540, the sensor 550, the audio circuit 560, and the WiFi module 570 are respectively connected to the processor 580. The power supply 590 is used to provide electrical energy for the entire electronic device 500.

[0114] Specifically, the RF circuit 510 is used to receive and transmit signals. The memory 520 is used to store data instruction information. The input unit 530 is used to input information, and specifically may include a touch panel 5301 and other input devices 5302 such as operation buttons. The display unit 540 may include a display panel 5401, etc. The sensor 550 includes an infrared sensor, a laser sensor, etc., and is used to detect user proximity signals, distance signals, etc. The speaker 5601 and the microphone (or microphone, or receiver component) 5602 are connected to the processor 580 through the audio circuit 560 and are used to receive and transmit sound signals. The WiFi module 570 is used to receive and transmit WiFi signals. The processor 580 is used to process the data information of the electronic device.

[0115] Next, a method for preparing a housing will be described. This method can be used to prepare the housing 100 in the above embodiment. Please refer to Figure 16 , Figure 16 Schematic flowchart of the method for preparing a housing in an embodiment of the present application.

[0116] This method may include:

[0117] Step S101: Form a first film group on a first carrier film.

[0118] Step S101 can be fabricated according to the structure of the first film group 10 in the above embodiment, which will not be elaborated here.

[0119] The material of the first carrier film can be selected from anti - drip films (such as PO (propylene oxide) films), PET (polyethylene terephthalate), PVC (polyvinyl chloride), etc. In some embodiments, the thickness of the first carrier film can be one of 100μm, 125μm, 150μm, and 175μm. Of course, the thickness of the second carrier film can also be adjusted as needed. The first carrier film can achieve the effect of demolding.

[0120] Step S102: Form a second film group on the second carrier film.

[0121] Step S102 can be fabricated according to the structure of the second film group 30 in the above - mentioned embodiment, and will not be elaborated here.

[0122] The material of the second carrier film can be selected from anti - drip films (such as PO (propylene oxide) films), PET (polyethylene terephthalate), PVC (polyvinyl chloride), etc. In some embodiments, the thickness of the second carrier film can be one of 100μm, 125μm, 150μm, and 175μm. Of course, the thickness of the second carrier film can also be adjusted as needed. The second carrier film can achieve the effect of demolding.

[0123] Step S103: Inject - mold to form a base body, and dispose the base body between the first film group and the second film group to form a housing.

[0124] Step S103 can be fabricated according to the structure and shape of the base body 20 in the above - mentioned embodiment. In some embodiments, step S103 can use injection - molding to fabricate the base body 20. And the lamination of the first film group 10, the base body 20, and the second film group 30 can be realized to form the housing 100 according to the description in the above - mentioned embodiment.

[0125] In some embodiments, step S103 can use the molten injection - molding raw material to be injection - pre - molded into a light - transmissive base body 20, then discharged between the first film group 10 and the second film group 30, and then compression - molded into the housing 100.

[0126] In some embodiments, the injection - molding raw material can be first baked at a high temperature to remove water. Then it is transferred into the mold for high - temperature melting. In some embodiments, the water content of the injection - molding raw material after water removal can be less than 200 ppm.

[0127] In some embodiments, the female mold in the mold used for compression molding is used to mount the first film group 10, and the male mold is used to mount the second film group 30. In some embodiments, it is necessary to ensure that there is a tight fit without air bubbles between the female mold and the first film group 10, such as the first carrier film, and between the male mold and the second film group 30, such as the second carrier film.

[0128] In some embodiments, after the raw material to be injection-molded is preformed and discharged, when discharging, the female mold and the male mold are placed in the discharge port, and the base body 20 is directly placed between the first film group 10 and the second film group 30, and compression molding is performed in the mold. From the perspective of the manufacturing method of the housing 100, it is possible for the first film group 10, the second film group 30, and the base body 20 to be completed synchronously. By means of synchronous operation, the manufacturing process of the housing 100 is simplified. In addition, the investment in housing manufacturing equipment can also be reduced, and the cost is lowered.

[0129] In some embodiments, the compression molding process can be carried out under a vacuum state. After the housing 100 is cooled, the first carrier film and the second carrier film can be torn off. In some embodiments, before compression molding, the surfaces of the first film group 10 and the second film group 30 are coated with glue according to the above embodiments, so that the first film group 10 and the second film group 30 are firmly bonded to the base body 20 during compression molding.

[0130] Those skilled in the art can cut the shape of the housing 100 according to requirements.

[0131] The above manufacturing method of the housing 100 can better present the respective color pattern effects of the first film group 10 and the second film group 30 through superposition, enhancing the three-dimensional sense of the morphology of the housing 100, and making the pattern colors more diverse and rich.

[0132] In one embodiment, please refer to Figure 17 , Figure 17 For Figure 16 the flowchart of step S101 in the illustrated embodiment. Step S101 may include:

[0133] Step S111: Coat a primer and a release agent on the first carrier film in sequence.

[0134] In one embodiment, when coating the primer on the first carrier film, the microgravure coating method can be selected. Of course, the slot coating method can also be used.

[0135] In some embodiments, the primer can enhance the adhesion between the release agent and the first carrier film. In some embodiments, the thickness of the primer can be 1 - 3 μm. In some embodiments, the release agent can facilitate the separation of the first film group 10 and the first carrier film. In some embodiments, the thickness of the release agent can be 2 - 4 μm.

[0136] Step S112: Perform UV transfer printing on the first carrier film coated with a primer and a release agent to form a first texture layer.

[0137] In some embodiments, the first carrier film coated with a primer and a release agent can be cut to a suitable size and then UV transfer printing is performed. In some embodiments, the texture sub-pattern can be transferred onto the first carrier film coated with a primer and a release agent using UV glue, and after UV curing, the sub-mold is separated, thus forming the first texture layer 11 with a texture effect.

[0138] Step S113: Form a first optical film layer on the first texture layer.

[0139] In some embodiments, coating can be performed on the first texture layer 11 to form a first optical film layer 12. In some embodiments, magnetron sputtering can be used to coat the first optical film layer 12.

[0140] In some embodiments, please refer to Figure 18 , Figure 18 which is Figure 16 the flowchart of step S101 in the illustrated embodiment. Before step S113, the method may include:

[0141] Step S121: Form a pattern layer on the first texture layer.

[0142] The pattern layer 13 can be made by screen printing. In some embodiments, the thickness of the pattern layer 13 can be 3 - 5 μm.

[0143] Step S113 may include:

[0144] Step S122: Form a first optical film layer on the pattern layer.

[0145] In some embodiments, coating can be performed on the pattern layer 13 to form a first optical film layer 12. In some embodiments, magnetron sputtering can be used to coat the first optical film layer 12.

[0146] In some embodiments, referring to the above embodiments, when making the first optical film layer 12, screen printing of the first varnish layer 121 can be performed first, and then the first reflective layer 122 is plated.

[0147] In one embodiment, please refer to Figure 19 , Figure 19 which is Figure 16 the flowchart of step S102 in the illustrated embodiment. Step S102 may include:

[0148] Step S131: Coat a primer and a release agent on the second carrier film in sequence.

[0149] In one embodiment, when applying the primer on the second carrier film, a microgravure coating method can be selected. Of course, a slot coating method can also be used.

[0150] In some embodiments, the primer can enhance the adhesion between the release agent and the second carrier film. In some embodiments, the thickness of the primer can be 1-3 μm. In some embodiments, the release agent can facilitate the separation of the second film group 30 and the second carrier film. In some embodiments, the thickness of the release agent can be 2-4 μm.

[0151] Step S132: Form a second optical film layer on the second carrier film coated with the primer and the release agent.

[0152] In some embodiments, coating can be performed on the second carrier film coated with the primer and the release agent to form the second optical film layer 32. In some embodiments, magnetron sputtering can be used to coat the second optical film layer 32.

[0153] In some embodiments, the second carrier film coated with the primer and the release agent can be cut to a suitable size and then coated to form the second optical film layer 32.

[0154] Step S133: Perform UV transfer on the second optical film layer to form a second texture layer.

[0155] In some embodiments, the texture sub-pattern can be transferred onto the second optical film layer 32 with UV glue on the second optical film layer 32. At the same time, after UV curing, the sub-mold is separated, and the second texture layer 31 with a texture effect can be fabricated.

[0156] In one embodiment, please refer to Figure 20 , Figure 20 is Figure 19 the flowchart of step S102 in the illustrated embodiment.

[0157] Before step S132, the method further includes:

[0158] Step S141: Form a primer layer on the second carrier film coated with the primer and the release agent.

[0159] Specifically, the primer layer 34 can be formed on the second carrier film coated with the primer and the release agent by using color ink, pigment, dye, etc. through processes such as spraying, screen printing, printing, offset printing, etc. Specifically, it can be set to be semi-transparent or opaque according to actual needs. Among them, the color presented by the primer layer 34 can be selected according to actual needs and is not limited here.

[0160] Step S132 includes:

[0161] Step S142: Form a second optical film layer on the primer layer.

[0162] In some embodiments, coating can be performed on the primer layer to form the second optical film layer 32.

[0163] In one embodiment, when manufacturing the second optical film layer 32, a second varnish layer 322 can be first formed on the second carrier film coated with a primer and a release agent, and then a second reflective layer 321 can be formed on the second varnish layer 322. For details, reference can be made to the above-mentioned lamination arrangement in the housing 100.

[0164] In one embodiment, please refer to Figure 21 , Figure 21 is Figure 19 the flowchart of step S102 in the illustrated embodiment. Before step S133, the method includes:

[0165] Step S151: Form an offset printing layer on the second optical film layer.

[0166] In some embodiments, the offset printing layer 33 can be formed by offset printing, with a thickness of about 3 - 7 μm, to complete the production of the color effect and form a psychedelic color effect.

[0167] Step S133 includes:

[0168] Step S152: Perform UV transfer printing on the offset printing layer to form a second texture layer.

[0169] In some embodiments, the texture sub - mold pattern can be transferred onto the offset printing layer 33 with UV glue on the offset printing layer 33. At the same time, after UV curing, the sub - mold is separated, and the second texture layer 31 with a texture effect can be fabricated.

[0170] Please refer to Figure 12 , for Figure 12 the housing 100 in

[0171]

[0172]

[0173] After testing, it is shown that the housing 100 has better structural strength, better heat and cold resistance, and even a lower risk of peeling and cracking.

[0174] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structural or equivalent process transformation made using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A housing, characterized in that, comprising: A first film group, including a first texture layer and a first optical film layer stacked; A substrate, used for stacking with the first film group. In the housing, the substrate is located on the side of the first optical film layer away from the first texture layer; and A second film group, used for stacking with the substrate. In the housing, the second film group is located on the side of the substrate away from the first film group, and includes a second texture layer and a second optical film layer stacked, and the second optical film layer is located on the side of the second texture layer away from the substrate; wherein, before the substrate is stacked with the first film group, the first texture layer and the first optical film layer are stacked; before the substrate is stacked with the second film group, the second texture layer and the second optical film layer are stacked.

2. The housing according to claim 1, characterized in that, the first film group further includes: A pattern layer, located between the first texture layer and the first optical film layer.

3. The housing according to claim 1, characterized in that, the first optical film layer includes: A first reflective layer, stacked with the first texture layer; and A first varnish layer, located between the first reflective layer and the first texture layer.

4. The housing according to claim 3, characterized in that, the first reflective layer includes: The first optical thin film coating is located on the side of the first varnish layer away from the first texture layer, and the material is TiO 2 or SiO 2 ; The second optical thin film coating is located on the side of the first optical thin film coating away from the first varnish layer, and the material is one of ZrO 2 , TiO 2 and SiO 2 .

5. The housing according to claim 3, characterized in that, the reflective layer includes two first optical thin film coatings and one second optical thin film coating on the side of the first varnish layer away from the first texture layer, and the second optical thin film coating is located between the two first optical thin film coatings.

6. The housing according to claim 1, characterized in that, the second film group further includes: A offset printing layer, located between the second texture layer and the second optical film layer.

7. The housing according to claim 1, characterized in that, the second optical film layer includes: A second varnish layer, stacked with the second texture layer; A second reflective layer, located between the second varnish layer and the second texture layer.

8. The housing according to claim 7, characterized in that, the second reflective layer includes: Multi-layer SiO 2 layers are sequentially stacked on one side of the second varnish layer close to the second texture layer; In 2 O 3 layer, disposed between two adjacent SiO 2 layers; and The SnO layer is disposed between two adjacent SiO layers. 2 layers.

9. The housing according to claim 1, characterized in that, further comprising: A primer layer, stacked with the second film group and located on the side of the second film group away from the first film group.

10. The housing according to claim 9, characterized in that, the primer layer includes a fireproof ink layer and a bottom ink layer stacked in sequence on the side of the second film group away from the first film group.

11. An electronic device, characterized in that, comprising: A housing, including: A first film group, including a first texture layer and a first optical film layer stacked; A substrate, used for stacking with the first film group. In the housing, the substrate is located on the side of the first optical film layer away from the first texture layer; and A second film group, which is used to be stacked with the base body. In the housing, the second film group is located on a side of the base body away from the first film group, and includes a second texture layer and a second optical film layer that are stacked, and the second optical film layer is located on a side of the second texture layer away from the base body; and A display screen, which is arranged on the housing to display information; Wherein, before the base body and the first film group are stacked, the first texture layer and the first optical film layer are stacked; Before the base body and the second film group are stacked, the second texture layer and the second optical film layer are stacked.

12. A method for manufacturing a housing, Characterized in that, It includes: Forming a first film group on a first carrier film, and the first film group includes a first texture layer and a first optical film layer that are stacked; Forming a second film group on a second carrier film, and the second film group includes a second texture layer and a second optical film layer that are stacked; Injection molding to form a base body, and arranging the base body between the first film group and the second film group to form the housing, and the base body is located on a side of the first optical film layer away from the first texture layer and on a side of the second texture layer away from the second optical film layer.

13. The method according to claim 12, Characterized in that, The forming of the first film group on the first carrier film includes: Coating a primer and a release agent on the first carrier film in sequence; Performing UV transfer printing on the first carrier film coated with the primer and the release agent to form the first texture layer; Forming the first optical film layer on the first texture layer.

14. The method according to claim 13, Characterized in that, Before forming the first optical film layer on the first texture layer, it includes: Forming a pattern layer on the first texture layer; The forming of the first optical film layer on the first texture layer includes: Forming the first optical film layer on the pattern layer.

15. The method according to claim 13, Characterized in that, The forming of the first optical film layer on the first texture layer includes: Forming a first varnish layer on the first texture layer, and then forming a first reflective layer on the first varnish layer.

16. The method according to claim 12, Characterized in that, The forming of the second film group on the second carrier film includes: Coating a primer and a release agent on the second carrier film in sequence; Forming the second optical film layer on the second carrier film coated with the primer and the release agent; Performing UV transfer printing on the second optical film layer to form the second texture layer.

17. The method according to claim 16, Characterized in that, Before forming the second optical film layer on the second carrier film coated with the primer and the release agent, it further includes: Forming a primer layer on the second carrier film coated with the primer and the release agent; The forming of the second optical film layer on the second carrier film coated with the primer and the release agent includes: Forming the second optical film layer on the primer layer.

18. The method according to claim 17, wherein, forming the second optical film layer on the second carrier film coated with the primer and the release agent includes: forming a second varnish layer on the second carrier film coated with the primer and the release agent, and then forming a second reflective layer on the second varnish layer.

19. The method according to claim 16, wherein, before performing UV transfer printing on the second optical film layer to form the second texture layer, it includes: forming an offset printing layer on the second optical film layer; performing UV transfer printing on the second optical film layer to form the second texture layer includes: performing UV transfer printing on the offset printing layer to form the second texture layer.

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