A sensory fusion diagonal recognition and positioning system and method for X-ray detection of chip defects

Abstract

The present invention discloses a sensory fusion diagonal recognition and positioning system and method for X-ray detection of chip defects, comprising a chip defect detection terminal device and at least one stage; the chip defect detection terminal device comprises a reader / writer, a depth camera, an X-ray tube, an X-ray detector and a main controller, the depth camera is used to obtain image information and depth information, the reader / writer is used to send and receive radio frequency signals, the center of the reader / writer coincides with the center of the X-ray tube, the X-ray tube is used to emit X-ray rays, and the X-ray detector is used to receive X-ray rays and transmit data to the main controller; n radio frequency tags are evenly distributed on the stage, the n radio frequency tags divide the plane of the stage into m rectangular detection partitions, and the radio frequency tags are used to receive radio frequency signals emitted by the reader / writer; the accurate position of the target detection area is quickly located through the fusion recognition technology, and multi-angle and multi-directional scanning is performed, thereby improving the accuracy and efficiency of image processing, thereby improving the detection efficiency.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor chip defect detection, and in particular to a sensory fusion diagonal recognition and positioning system and method for detecting chip defects by X-ray. Background Art

[0002] A chip is an integrated circuit that consists of a large number of transistors. Different chips have different integration scales, ranging from hundreds of millions to tens or hundreds of transistors. Currently, chip testing is becoming more and more intelligent and unmanned, but the existing testing technology has problems such as slow efficiency and inaccurate detection.

[0003] When the existing X-ray equipment used for chip defect detection detects batches of semiconductor chips, it is easy to have the problem that the image obtained after the detection is not clear enough. If the clarity of the image is to be improved, the energy density of the X-ray rays in the detection area needs to be increased. However, the increase in the power of the X-ray emitter will prolong the charging time of the X-ray tube during each X-ray detection, resulting in a decrease in the detection speed. In addition, high-power X-ray emitters have the disadvantages of difficult maintenance and high cost. If a low-power X-ray emitter is used, it has the advantages of easy maintenance, low cost, and short charging time. However, it has the disadvantage of low power resulting in low clarity of the image after detection. However, this disadvantage can be solved by using the X-ray emitter to perform partition detection on the object. Although the power of the X-ray ray is reduced, the energy density of the X-ray ray in the area can be increased by reducing the scanning area of ​​the object detection, reaching the same X-ray ray energy density as that of the high-power X-ray tube, thereby obtaining a clear image. In order to improve the detection speed of each semiconductor chip, thanks to the small size of semiconductor chips, 1,000 or more semiconductor chips are used as a detection unit each time, and a detection unit is scanned in partitions, so that the total detection time is evenly distributed to each semiconductor chip. The detection range of an object is divided into multiple areas. Since the energy of X-rays decreases as the emission distance increases, the current partition detection method has the defects of low accuracy and speed, and has not yet solved the problems of slow detection efficiency and inaccuracy. Summary of the invention

[0004] The purpose of the present invention is to propose a sensory fusion diagonal recognition and positioning system and method for X-ray detection of chip defects to solve one or more technical problems existing in the above-mentioned background technology.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] A sensory fusion diagonal recognition and positioning system for detecting chip defects by X-ray, comprising a chip defect detection terminal device and at least one stage;

[0007] The chip defect detection terminal device includes a reader / writer, a depth camera, an X-ray tube, an X-ray detector and a main controller, wherein the depth camera is used to obtain image information and depth information, the reader / writer is used to send and receive radio frequency signals, the center of the reader / writer coincides with the center of the X-ray tube, the X-ray tube is used to emit X-rays, and the X-ray detector is used to receive X-rays and transmit data to the main controller;

[0008] There are n radio frequency tags evenly distributed on the stage, and the n radio frequency tags divide the plane of the stage into m rectangular detection partitions, and the radio frequency tags are used to receive radio frequency signals sent by the reader;

[0009] The X-ray tube and the X-ray detector are moved successively to the top and bottom of the center of each detection partition to obtain an X-ray image of each detection partition.

[0010] Preferably, the n radio frequency tags are equally spaced and symmetrically arranged on the diagonal line and the parallel line of the stage plane, and every two adjacent radio frequency tags on the diagonal line form a detection partition.

[0011] Preferably, it also includes a SCARA robot, a manual inspection and repair conveyor belt and an inspection conveyor belt, wherein the manual inspection and repair conveyor belt and the inspection conveyor belt are parallel to each other and are respectively arranged on both sides of the SCARA robot, the inspection conveyor belt is used to transport the stage to the inspection position, and the SCARA robot is used to clamp defective chips from the stage after inspection and place them on the manual inspection and repair conveyor belt.

[0012] The present invention also provides a defect positioning method of a sensory fusion diagonal recognition and positioning system for detecting chip defects by X-ray, the method comprising the following steps:

[0013] Step S1: Arrange the chips to be tested on the stage and move the stage to the testing position, and obtain the center position of the stage plane through the pre-positioning of the depth camera;

[0014] Step S2: The reader sends out two radio frequency signals with different carrier frequencies. The radio frequency tag receives the signal and returns it to the reader, measures the distance between the radio frequency tag and the reader, and obtains the center position information of each detection zone.

[0015] Step S3: the X-ray tube moves to the center position of one of the detection partitions and emits X-rays. After the X-ray tube scans and obtains a top-view X-ray image of the detection partition, the position of the next detection partition is located, and the X-ray tube is moved to above the center position of the next detection partition to scan and obtain a top-view X-ray image of the next detection partition.

[0016] Step S4: whether the top-view X-ray images of all the detection partitions have been obtained, if not, repeat the above step S3, if yes, execute step S5;

[0017] Step S5: Determine whether there are any defective chips in each inspection zone. If yes, remove the defective chips from the stage.

[0018] Preferably, in step S1: when the stage reaches the detection position, the depth camera records and transmits the acquired image data to the main controller, and the center position of the stage plane is determined by measuring the distance D between the measurement point and the depth camera:

[0019]

[0020] Where c represents the speed of light, t p is the duration of the light pulse, S0 represents the charge collected by the earlier shutter, and S1 represents the charge collected by the delayed shutter.

[0021] Preferably, the detection partition is divided by n radio frequency tags on the stage plane that are equally spaced and symmetrically distributed on the diagonal line and parallel lines of the stage. There are m detection partitions, and both ends of the diagonal line of each detection partition have radio frequency tags. The same radio frequency tag is shared by multiple detection partitions. The relationship between m and n is:

[0022]

[0023]

[0024] m=N 2 N is a natural number, and N>1 (4)

[0025] Preferably, in step S2, the distance information between the RFID tag and the reader is measured as follows: the phase difference measured by the reader is Δφ, the distance between the reader and the RFID tag is d, the transmission time from the carrier signal emitted from the reader to the reflected signal received by the reader is t, and the propagation speed of electromagnetic waves in the air is c=3.0×10 8 m / s, then the distance d between the reader and the RFID tag is:

[0026]

[0027] The phase difference of the carrier signal in a one-way distance is

[0028] θ=2πfΔt (6)

[0029] According to formulas (5) and (6), we can deduce

[0030]

[0031] In order to eliminate phase ambiguity, the carrier signal frequency is set to f i When (i=1,2), the phase change of the carrier signal reflected by the RFID tag to the reader is θ i (i=1,2), we get the following formula (8):

[0032]

[0033]

[0034] Subtract formula (8) from formula (9) to get the distance value d

[0035]

[0036] Preferably, in step S3, the order in which the X-ray tube scans each detection partition is:

[0037] Determine whether the number of detection partitions m is an odd number or an even number;

[0038] If the number of detection partitions m is an odd number, the X-ray tube first scans the detection partition located at the center of the stage plane. After completing the scanning of the detection partition, the X-ray tube moves to the adjacent detection partition according to the distance information returned by the RFID tag, and scans the detection partitions around the outside of the center position one by one in turn. This process is repeated until all detection partitions are scanned.

[0039] If the number of detection partitions m is an even number, the X-ray tube first scans the detection partition located at one of the end positions of the stage plane. After completing the scan of the detection partition, the X-ray tube scans the stage plane line by line according to the distance information returned by the RFID tag until all detection partitions are scanned.

[0040] Preferably, step S5 also includes acquiring a side X-ray image and a front X-ray image of the stage through an X-ray tube, and integrating the top X-ray image, the side X-ray image and the front X-ray image of each detection partition, and the main controller processes the data to form a complete chip scan three-dimensional image.

[0041] The beneficial effects of the present invention are as follows: the present invention can quickly locate the exact position of the target detection area through the fusion recognition technology, and perform multi-angle and multi-directional scanning, thereby improving the accuracy and efficiency of image processing, thereby improving the detection efficiency. The acquired defect image can also be compared with the database to automatically generate a diagnostic test report, which provides great convenience for the semiconductor industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The accompanying drawings further illustrate the present invention, but the contents in the accompanying drawings do not constitute any limitation to the present invention.

[0043] Figure 1 is a schematic diagram of a system structure of one embodiment of the present invention;

[0044] Figure 2 It is a schematic diagram of the positions of the manual inspection and repair conveyor belt and the inspection conveyor belt in one embodiment of the present invention;

[0045] Figure 3 is a flow chart of a defect location method according to one embodiment of the present invention;

[0046] Figure 4 is a schematic diagram of the scanning sequence of the X-ray tube on each detection partition when m is an odd number in one embodiment of the present invention;

[0047] Figure 5 It is a schematic diagram of the scanning sequence of the X-ray tube on each detection partition when m is an even number according to one embodiment of the present invention. DETAILED DESCRIPTION

[0048] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0049] The sensory fusion diagonal recognition and positioning system for detecting chip defects by X-ray in this embodiment is shown in the attached Figure 1 , including a chip defect detection end device and at least one stage;

[0050] The chip defect detection terminal device includes a reader / writer, a depth camera using TOF technology, an X-ray tube, an X-ray detector and a main controller. The depth camera is used to obtain image information and depth information, the reader / writer is used to send and receive radio frequency signals, the center of the reader / writer coincides with the center of the X-ray tube, the X-ray tube is used to emit X-rays, and the X-ray detector is used to receive X-rays and transmit data to the main controller;

[0051] There are n radio frequency tags evenly distributed on the stage, which divide the plane of the stage into m rectangular detection zones. The radio frequency tags are used to receive radio frequency signals sent by the reader. The radio frequency tags use SAW-RFID tags. For SAW-RFID tags at different positions, each tag has an independent number. After the reader sends radio frequency signals to the SAW-RFID tags, different SAW-RFID tags reflect the radio frequency signals back with their own numbers. Different SAW-RFID tags are distinguished by different numbers, and then positioned.

[0052] The X-ray tube and X-ray detector are moved to the top and bottom of the center of each detection partition respectively, to obtain the X-ray scan image of each detection partition. X-rays are electromagnetic waves with extremely high frequency, extremely short wavelength and high energy. Due to their short wavelength and high energy, when they shine on a substance, only a part of them is absorbed by the substance, and most of them pass through the atomic gaps, showing strong penetrating power. The ability of X-rays to penetrate substances is related to the energy of X-ray photons. The shorter the wavelength of the X-rays, the greater the energy of the photons and the stronger the penetrating power. The penetrating power of X-rays is also related to the density of the substance. The property of differential absorption can be used to distinguish substances of different densities.

[0053] Therefore, this embodiment achieves rapid positioning of the detection chip on the stage by setting a depth camera, and sets the X-ray tube and X-ray detector to scan and obtain the X-ray image of the detection chip on the stage, and sets n radio frequency tags on the stage to divide the stage plane into m rectangular detection partitions. The reader obtains the specific positions of these detection partitions, and the positioning speed is fast, which solves the defects of low precision and speed in the existing partition detection method and improves the detection efficiency and accuracy.

[0054] Preferably, n radio frequency tags are equally spaced and symmetrically arranged on the diagonal and parallel lines of the stage plane, and each two adjacent radio frequency tags on the diagonal form a detection zone. Thus, by equidistantly and symmetrically arranging, n radio frequency tags are evenly distributed on the stage plane, and a detection zone can be formed between two radio frequency tags. By obtaining the positions of two adjacent radio frequency tags on the diagonal through a reader / writer, the position of the detection zone can be determined, thereby reducing the number of radio frequency tags to be set and saving manufacturing costs.

[0055] Preferably, refer to the attached Figure 2, also includes a SCARA robot, a manual inspection and repair conveyor belt and an inspection conveyor belt. The manual inspection and repair conveyor belt and the inspection conveyor belt are parallel to each other and are respectively arranged on both sides of the SCARA robot. The inspection conveyor belt is used to convey the stage to the inspection position. The SCARA robot is used to clamp the defective chip from the stage to the manual inspection and repair conveyor belt after inspection. Therefore, automatic inspection of the chip is realized by setting the SCARA robot, the manual inspection and repair conveyor belt and the inspection conveyor belt.

[0056] This embodiment also provides a defect positioning method of a sensory fusion diagonal recognition and positioning system for detecting chip defects by X-ray, Figure 3 , the method comprises the following steps:

[0057] Step S1: Arrange the chips to be tested on the stage and send the stage to the test position through the test conveyor belt, obtain the center position of the stage plane through the pre-positioning of the depth camera, that is, record the captured image data through the depth camera and send it back to the main controller, the main controller performs calculations to determine the center position of the test chips arranged on the stage plane;

[0058] Step S2: The reader sends out two radio frequency signals with different carrier frequencies. The radio frequency tag receives the signal and returns it to the reader, measures the distance between the radio frequency tag and the reader, and obtains the center position information of each detection partition, thereby ensuring that the center area of ​​the X-ray emitted by the X-ray tube can be aligned with the center of the detection partition to the greatest extent, so as to minimize the X-ray loss and optimize the imaging quality of the partition.

[0059] Step S3: the X-ray tube moves to the center of one of the detection partitions and emits X-rays, so that the center of the detection partition can coincide with the center of the X-rays emitted by the X-ray tube, so that the distance from the center of the X-rays to the center of the detection partition is the shortest, the X-ray loss is the smallest, and the partition imaging quality is the best;

[0060] After obtaining a top-view X-ray image of the inspection partition by scanning with an X-ray tube, locating the position of the next inspection partition, and moving the X-ray tube to above the center position of the next inspection partition, scanning to obtain a top-view X-ray image of the next inspection partition;

[0061] Step S4: repeat the above step S3 until the top-view X-ray images of all the detection partitions are obtained;

[0062] Step S5: Determine whether there are defective chips in each inspection partition. If so, compare the defect characteristics with the database, generate a corresponding inspection report and improvement suggestions, and send the report suggestions to the manual window. At the same time, the main controller will send instructions to the SCARA robot according to the number of the RFID tag, so that the suction cup at the end of the SCARA robot moves to the inspection partition where the defective chip is located. After sucking out the defective chip, it is sent to the manual inspection and repair conveyor belt.

[0063] Preferably, in step S1: when the stage reaches the detection position, the depth camera records and transmits the acquired image data to the main controller, and the center position of the stage plane is determined by measuring the distance D between the measurement point and the depth camera:

[0064]

[0065] , the stage is located at the vertex of the boundary and takes i measurement points. The distance D between different measurement points and the depth camera i , different D i satisfy:

[0066] D i =D i-1 =····=D0 (11)

[0067] Where c represents the speed of light, t p is the duration of the light pulse, S0 represents the charge collected by the earlier shutter, and S1 represents the charge collected by the delayed shutter. Thus, the image acquired by the depth camera can be used to determine the center position of the stage plane.

[0068] Preferably, the detection partition is divided by n radio frequency tags on the stage plane that are equally spaced and symmetrically distributed on the diagonal line and parallel lines of the stage. There are m detection partitions, and both ends of the diagonal line of each detection partition have radio frequency tags. The same radio frequency tag is shared by multiple detection partitions. The relationship between m and n is:

[0069]

[0070]

[0071] m=N 2 N is a natural number, and N>1 (4)

[0072] Thus, the position of the detection partition can be determined by obtaining the positions of two adjacent RFID tags on the diagonal line through the reader / writer, which reduces the number of RFID tags to be set and saves manufacturing and maintenance costs.

[0073] Preferably, in step S2, the distance information between the RFID tag and the reader is measured as follows: the phase difference measured by the reader is Δφ, the distance between the reader and the RFID tag is d, the transmission time from the carrier signal emitted from the reader to the reflected signal received by the reader is t, and the propagation speed of electromagnetic waves in the air is c=3.0×10 8 m / s, then the distance d between the reader and the RFID tag is:

[0074]

[0075] , the phase difference of the carrier signal propagating in a one-way distance is

[0076] θ=2πfΔt (6)

[0077] , according to formula (5) and (6), we can deduce

[0078]

[0079] In order to eliminate phase ambiguity, the carrier signal frequency is set to f i When (i=1,2), the phase change of the carrier signal reflected by the RFID tag to the reader is θ i (i=1,2), we get the following formula (8):

[0080]

[0081]

[0082] , subtract formula (8) from formula (9) to get the distance value d between the reader and the RFID tag

[0083]

[0084] , the distance between the reader and the RFID tag number i is represented by d i , according to formula (10), if it satisfies:

[0085] d2=d3=d5=d6 (12)

[0086] The center position of the stage plane can be located. Therefore, the center position information of each detection partition can be obtained quickly and accurately through the above calculation.

[0087] Preferably, in step S3, the order in which the X-ray tube scans each detection partition is:

[0088] Determine whether the number of detection partitions m is an odd number or an even number;

[0089] If the number of detection partitions m is an odd number, refer to the attached Figure 4, the serial number in the figure is the scanning order, the dotted grid is the detection partition, and n is the radio frequency tag. The X-ray tube first scans the detection partition located at the center of the stage plane. After completing the scanning of the detection partition, the X-ray tube moves to its adjacent detection partition according to the distance information returned by the radio frequency tag, and scans the detection partitions around the outside of the center position one by one in turn. Repeat this process until all detection partitions are scanned;

[0090] If the number of detection partitions m is an even number, refer to the attached Figure 5 In the figure, the serial number is the scanning order, the dotted grid is the detection partition, and n is the radio frequency tag. The X-ray tube first scans the detection partition located at one of the end points of the stage plane. After completing the scan of the detection partition, the X-ray tube scans the stage plane line by line according to the distance information returned by the radio frequency tag until all the detection partitions are scanned.

[0091] Therefore, each detection partition is scanned according to the above scanning sequence, which effectively reduces the time consumed in the movement process of the X-ray tube and effectively improves the detection efficiency.

[0092] Preferably, step S5 also includes acquiring a side X-ray image and a front X-ray image of the stage through an X-ray tube, and integrating the top X-ray image, the side X-ray image and the front X-ray image of each detection partition, and the main controller processes the data to form a complete chip scan three-dimensional image.

[0093] Therefore, three-dimensional reconstruction and defect analysis are performed based on the two-dimensional information of the top-view X-ray image, the side-view X-ray image and the front-view X-ray image. After processing by the main controller, a complete three-dimensional image of the chip scan can be formed, and the defect characteristics are compared with the database to generate corresponding inspection reports and improvement suggestions, thereby improving the inspection accuracy.

[0094] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A sensory fusion diagonal recognition and positioning system for X-ray detection of chip defects, characterized in that: It includes a chip defect detection terminal device and at least one stage; The chip defect detection terminal device includes a reader / writer, a depth camera, an X-ray tube, an X-ray detector and a main controller, wherein the depth camera is used to obtain image information and depth information, the reader / writer is used to send and receive radio frequency signals, the center of the reader / writer coincides with the center of the X-ray tube, the X-ray tube is used to emit X-rays, and the X-ray detector is used to receive X-rays and transmit data to the main controller; There are n radio frequency tags evenly distributed on the stage, and the n radio frequency tags divide the plane of the stage into m rectangular detection partitions, and the radio frequency tags are used to receive radio frequency signals sent by the reader; The X-ray tube and the X-ray detector are moved successively to the upper and lower sides of the center of each detection partition to obtain an X-ray image of each detection partition; n radio frequency tags are equally spaced and symmetrically arranged on the diagonal line and the parallel line of the stage plane, and every two adjacent radio frequency tags on the diagonal line form a detection partition; Determine the center position of the stage plane through the image acquired by the depth camera; The positions of two adjacent RFID tags on the diagonal line are obtained by the reader / writer to determine the position of the detection zone.

2. According to claim 1, a sensory fusion diagonal recognition and positioning system for X-ray detection of chip defects is characterized in that: It also includes a SCARA robot, a manual inspection and repair conveyor belt, and an inspection conveyor belt. The manual inspection and repair conveyor belt and the inspection conveyor belt are parallel to each other and are respectively arranged on both sides of the SCARA robot. The inspection conveyor belt is used to convey the worktable to the inspection position. The SCARA robot is used to clamp defective chips from the worktable after inspection and place them on the manual inspection and repair conveyor belt.

3. A defect location method of the sensory fusion diagonal recognition and positioning system for X-ray chip defect detection as claimed in claim 1 or 2, characterized in that: The method comprises the following steps: Step S1: Arrange the chips to be tested on the stage and move the stage to the testing position, and obtain the center position of the stage plane through the pre-positioning of the depth camera; Step S2: The reader sends out two radio frequency signals with different carrier frequencies. The radio frequency tag receives the signal and returns it to the reader, measures the distance between the radio frequency tag and the reader, and obtains the center position information of each detection zone. Step S3: the X-ray tube moves to the center position of one of the detection partitions and emits X-rays. After the X-ray tube scans and obtains a top-view X-ray image of the detection partition, the position of the next detection partition is located, and the X-ray tube is moved to above the center position of the next detection partition to scan and obtain a top-view X-ray image of the next detection partition. Step S4: whether the top-view X-ray images of all the detection partitions have been obtained, if not, repeat the above step S3, if yes, execute step S5; Step S5: Determine whether there are any defective chips in each inspection zone. If yes, remove the defective chips from the stage.

4. The defect location method of the sensory fusion diagonal recognition and positioning system for X-ray detection of chip defects according to claim 3 is characterized in that: In step S1: when the stage reaches the detection position, the depth camera records and transmits the acquired image data to the main controller, and determines the center position of the stage plane by measuring the distance D between the measurement point and the depth camera: (1) Where c represents the speed of light, is the duration of the light pulse, represents the charge collected by the earlier shutter, Represents the charge collected by the delayed shutter.

5. The defect location method of the sensory fusion diagonal recognition and positioning system for X-ray detection of chip defects according to claim 3 is characterized in that: The detection partition is divided by n RFID tags on the stage plane that are equally spaced and symmetrically distributed on the diagonal and parallel lines of the stage. There are m detection partitions. Both ends of the diagonal of each detection partition have RFID tags. The same RFID tag is shared by multiple detection partitions. The relationship between m and n is: (2) (3) (4)。 6. The defect location method of the sensory fusion diagonal recognition and positioning system for X-ray detection of chip defects according to claim 3 is characterized in that: In step S2, the distance information between the RFID tag and the reader is measured as follows: the phase difference measured by the reader is , the distance between the reader and the RFID tag is , the transmission time from the carrier signal emitted by the reader to the reflected signal received by the reader is , the speed at which electromagnetic waves propagate in the air , then the distance between the reader and the RFID tag is for: (5) The phase difference of the carrier signal in a one-way distance is t (6) According to formulas (5) and (6), we can deduce (7) In order to eliminate phase ambiguity, the carrier signal frequency is set to When , the phase change of the carrier signal reflected by the RFID tag to the reader is , we get the following formula (8): (8) (9) Subtract formula (8) from formula (9) to get the distance value , (10)。 7. The defect location method of the sensory fusion diagonal recognition and positioning system for X-ray detection of chip defects according to claim 3 is characterized in that: In step S3, the order in which the X-ray tube scans each detection partition is: Determine whether the number of detection partitions m is an odd number or an even number; If the number of detection partitions m is an odd number, the X-ray tube first scans the detection partition located at the center of the stage plane. After completing the scanning of the detection partition, the X-ray tube moves to the adjacent detection partition according to the distance information returned by the RFID tag, and scans the detection partitions around the outside of the center position one by one in turn. This process is repeated until all detection partitions are scanned. If the number of detection partitions m is an even number, the X-ray tube first scans the detection partition located at one of the end positions of the stage plane. After completing the scan of the detection partition, the X-ray tube scans the stage plane line by line according to the distance information returned by the RFID tag until all detection partitions are scanned.

8. The defect location method of the sensory fusion diagonal recognition and positioning system for X-ray detection of chip defects according to claim 3 is characterized in that: Step S5 also includes acquiring the side view X-ray image and the front view X-ray image of the stage through the X-ray tube, and integrating the top view X-ray image, the side view X-ray image and the front view X-ray image of each detection partition. The main controller processes the data to form a complete chip scan three-dimensional image.

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