A chip mounter

Abstract

The present invention belongs to the technical field of semiconductor chip mounting, and discloses a chip mounter. It includes a workbench, a first moving component, a bonding component and a storage component. The first moving component, the bonding component and the storage component are installed on the workbench. A substrate is fixed inside the bonding component. The first moving component can transfer the chip from the storage component to the substrate. The bonding component includes a motor and a rotating member. The motor can drive the rotating member to rotate around the rotation axis. An installation surface is formed on the rotating member. The substrate is fixed on the installation surface, and the substrate and the installation surface correspond one by one; it solves the problems that the substrate occupies a relatively large area of the chip mounter, resulting in too long a moving distance of the chip suction head and a larger mounting error between the chip and the substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip mounting, and particularly to a chip mounter. Background Art

[0002] In the field of semiconductor technology processing, it is necessary to bond a chip to a substrate. During the bonding process, the chip needs to be moved to the upper end of the substrate by a suction head, and after the substrate is dispensed with glue by a dispenser, the chip is then mounted on the substrate.

[0003] In the prior art, the substrate to which the chip needs to be mounted is laid flat on the mounting table, occupying a relatively large area of the chip mounter, increasing the overall size of the chip mounter. This results in a relatively long distance for the suction head to move after picking up the chip to the designated position. When transporting the chip over a long distance, it is easy to generate a position error, ultimately leading to inaccurate mounting positions of the chip and affecting the mounting accuracy. Summary of the Invention

[0004] The purpose of the present invention is to provide a chip mounter, which solves the problems that the substrate occupies a relatively large area of the chip mounter, resulting in an overly long moving distance of the chip suction head and a larger mounting error between the chip and the substrate.

[0005] To achieve this purpose, the present invention adopts the following technical solutions: The present invention provides a chip mounter, including a workbench, a first moving component, a bonding component, and a storage component. The first moving component, the bonding component, and the storage component are installed on the workbench. A substrate is fixed inside the bonding component. The first moving component can transfer the chip from the storage component to the substrate. The bonding component includes a motor and a rotating member. The motor can drive the rotating member to rotate around the rotation axis. An installation surface is formed on the rotating member, and the substrate is fixed on the installation surface, with the substrate corresponding to the installation surface one by one.

[0006] Preferably, the rotating member is a cylinder, the axis of the motor shaft coincides with the axis of the rotating member, and the cross-section of the rotating member is triangular.

[0007] Preferably, the first moving component includes a guide rail and a first cross beam. The first cross beam moves along the length direction of the guide rail. A first slide rail is provided on the first cross beam, and the first slide rail is perpendicular to the guide rail. The first moving component further includes a picking device, and the picking device can move along the length direction of the first slide rail.

[0008] Preferably, there are two groups of the guide rails, and the guide rails are parallel to each other. The two ends of the first cross beam are respectively lapped on the guide rails.

[0009] Preferably, the picking device includes a suction nozzle and a vacuum machine. The vacuum machine is communicated with the suction nozzle, and the suction nozzle can suck the chip.

[0010] Preferably, the storage component includes a cartridge, a first placement area, a second placement area, and a cartridge transfer device 44. The cartridge transfer device 44 can transfer the cartridge from the first placement area to the second placement area, and the chip is placed in the cartridge in the first placement area.

[0011] Preferably, the bonding component further includes a dispensing member, which includes a dispensing head, a glue tank, and a telescopic device. The dispensing head is communicated with the glue tank, and the telescopic device can drive the dispensing head and the glue tank to reciprocate perpendicular to the workbench.

[0012] Preferably, the mounter further includes a second cross beam. The dispensing member is installed on the second cross beam. The dispensing member can reciprocate along the length direction of the second cross beam. The two ends of the second cross beam are lapped on the guide rails, and the second cross beam reciprocates along the length direction of the guide rails;

[0013] A second slide rail is installed on the second cross beam. The second slide rail is perpendicular to the guide rail. The dispensing member is sleeved on the second slide rail, and the dispensing member can move along the length direction of the second slide rail.

[0014] Preferably, the mounter further includes an upper vision camera and a lower vision camera. The upper vision camera is installed on the workbench. The upper vision camera is arranged between the storage component and the bonding component. The lens of the upper vision camera is used to photograph the bottom surface of the chip; the lower vision camera is installed on the lower end surface of the telescopic device, and the lens of the lower vision camera is used to photograph the substrate.

[0015] Preferably, a third slide rail is installed on the workbench. The third slide rail is parallel to the guide rail. The motor and the rotating member are installed on the guide rail, and the motor and the rotating member can reciprocate along the length direction of the third slide rail.

[0016] Advantageous effects: In the present invention, the substrate that needs to bond the chip is integrated onto the rotating member. The rotating member can perform high-precision rotation under the control of the motor, move the substrates on different mounting surfaces of the rotating member to the positions where the chips can be bonded, and concentrate the substrates onto the rotating member, saving the area for placing the substrates on the workbench. At the same time, the bonding component does not need to move long distances when switching substrates, shortening its moving distance and making the bonding accuracy of the bonding component higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is the front view of the present invention;

[0018] Figure 2 is the enlarged view of the picking device of the present invention;

[0019] Figure 3 is the rear view of the present invention;

[0020] Figure 4 is an enlarged view of the dispensing member of the present invention.

[0021] In the figure: 1 - workbench; 2 - first moving assembly; 21 - guide rail; 22 - first cross beam; 221 - first slide rail; 23 - picking device; 231 - suction nozzle; 232 - vacuum machine; 31 - motor; 32 - rotating member; 33 - dispensing member; 331 - dispensing head; 332 - glue tank; 333 - telescopic device; 4 - storage assembly; 41 - cartridge; 42 - first placement area; 43 - second placement area; 44 - cartridge conveying device; 5 - second cross beam; 51 - second slide rail; 7 - upper viewing camera; 8 - lower viewing camera; 9 - third slide rail. Detailed implementation manners

[0022] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. Additionally, it should be noted that for the convenience of description, only the parts related to the present invention are shown in the drawings, rather than all the structures.

[0023] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0024] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "above and over", and "on the top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "below and under", and "beneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0025] In the description of this embodiment, the terms "upper", "lower", "right", and other orientation or position relationships are based on the orientation or position relationships shown in the drawings. They are only for the convenience of description and simplifying operations, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0026] In the field of semiconductor processing, it is necessary to fix a chip on a substrate. As Figure 1 shown, in existing chip mounters, all substrates are laid flat on the workbench 1 of the chip mounter and are moved by the moving components on the original chip mounter. Since all substrates are laid flat on the processing table of the chip mounter, this results in a very large area of the area to be processed composed of substrates, which makes the moving distance of the moving components longer, leading to a larger relative error between the chip and the substrate. At the same time, the substrates laid flat on the workbench 1 also occupy the volume of the workbench 1, increasing the placement cost of the chip mounter.

[0027] To solve the above problems, the present invention provides a chip mounter, which includes a workbench 1, a first moving component 2, a bonding component, and a storage component 4. The first moving component 2, the bonding component, and the storage component 4 are installed on the workbench 1. A substrate is fixed inside the bonding component. The first moving component 2 can transfer the chip from the storage component 4 to the substrate. The bonding component includes a motor 31 and a rotating member 32. The motor 31 can drive the rotating member 32 to rotate. At least two groups of mounting surfaces are formed on the rotating member 32. The substrates are fixed on the mounting surfaces, and the substrates correspond to the mounting surfaces one by one.

[0028] By installing a rotatable rotating member 32 on the workbench 1 of the chip mounter, substrates on which chips are to be mounted are arranged on the mounting surfaces, and the substrates without mounted chips are fixed on the mounting surfaces. When it is necessary to switch substrates after the chips are mounted on the substrates, the motor 31 drives the rotating member 32 to rotate, and the substrates without mounted chips are rotated to the area where the first moving component 2 can reach to complete the rotation, and the chip mounting continues. By driving the rotating member 32 to rotate by the motor 31, the moving distance required for the first moving component 2 to carry the chip is saved, making the accuracy of fixing the chip on the substrate higher. At the same time, the substrates are fixed in the circumferential direction of the rotating shaft in a three-dimensional arrangement. Compared with the existing method of laying all substrates flat on the workbench 1, the space on the workbench 1 is saved, making the volume of the workbench 1 smaller and further reducing the manufacturing cost.

[0029] As Figure 2As shown, the rotating part 32 of the present invention is a cylinder. The axis of the rotating shaft of the motor 31 coincides with the axis of the rotating part 32, and the cross-section of the rotating part 32 is triangular. The rotating body of the present invention is a triangular prism, and three groups of mounting surfaces are formed along the axial direction of the triangular prism. The present invention uses a triangular prism to maximize the area of the mounting surface. The larger the area of the mounting surface, the larger the area of the substrate will be. In this way, the mounting surface can adapt to substrates of different sizes, making the rotating body more versatile.

[0030] After the chips are mounted on the substrate on the mounting surface, the triangular prism is rotated 120° by the motor 31 to move the unmounted substrate to the dispensing member 33 for mounting the next group of substrates.

[0031] It should be particularly noted that the cylinder of the present invention is not limited to three mounting surfaces and can also be set as a quadrangular prism or a pentagonal prism, which can mount more substrates. However, at the same time, the area of a single substrate will also decrease as the mounting surface decreases.

[0032] As Figure 1 shown, the first moving component 2 of the present invention includes a guide rail 21 and a first cross beam 22. The first cross beam 22 moves along the length direction of the guide rail 21. A first slide rail 221 is provided on the first cross beam 22, and the first slide rail 221 is perpendicular to the guide rail 21. The first moving component 2 further includes a picking device 23, and the picking device 23 can move along the length direction of the first slide rail 221.

[0033] Through the guide rail 21 and the first slide rail 221, the picking device 23 of the present invention can move along the length directions of the guide rail 21 and the first slide rail 221 on the workbench 1 of the mounter according to computer instructions under the action of the motor. At the same time, the picking device 23 can move the chips in the storage component 4 to the substrate for bonding, and accurately bond the chips by means of horizontal and vertical positioning, reducing the relative error generated with the substrate.

[0034] As Figure 1 described, the guide rail 21 of the present invention includes two groups, and the guide rails 21 are parallel to each other. The two ends of the first cross beam 22 are respectively lapped on the guide rails 21, so that the first cross beam 22 is stably advanced during the movement, the jitter frequency of the picking device 23 is reduced, and the bonding error of the chips is reduced.

[0035] As Figure 2 shown, the picking device 23 includes a suction nozzle 231 and a vacuum machine 232. The vacuum machine 232 is communicated with the suction nozzle 231, and the suction nozzle 231 can suck the chips.

[0036] In order to reduce the damage caused by transporting chips, vacuum suction is used to transfer chips. The suction nozzle 231 is pressed against the chip, and the cavity surrounded by the suction nozzle 231 and the chip is evacuated through the vacuum machine 232, so that the chip is finally adsorbed on the suction nozzle 231 for installation. When placing it on the substrate with glue dispensing, air is added through the vacuum machine 232 to balance the air pressure inside and outside the suction nozzle 231, so that the chip will naturally separate from the suction nozzle 231, and the picking device 23 completes the transfer of the chip.

[0037] like Figure 1 As shown, the storage assembly 4 of the present invention includes a material box 41, a first placement area 42, a second placement area 43 and a material box 41 conveying device 44, and the material box 41 conveying device 44 can transfer the material box 41 from the first placement area 42 to the second placement area 43, and the chip is placed in the material box 41 in the first placement area 42.

[0038] The workbench 1 of the present invention is provided with two adjacent placement areas, and the first placement area 42 and the second placement area 43 form a receiving groove, and the material box 41 is placed in the receiving groove. A material box 41 moving device is provided next to the two receiving grooves, and a guide rail 21 and a pallet are provided on the material box 41 moving device. When all the chips inside the material box 41 are mounted on the substrate, the pallet lifts the empty material box 41 and moves the material box 41 from the first placement area 42 to the second placement area 43. Since the material boxes 41 are placed in a stacked state, when the old material box 41 is removed, the new material box 41 will move upward from the first placement area 42, so that the picking device 23 can continue to pick up the chip for mounting. By switching the material box 41, chips can be continuously provided for installation, and the chips can be uniformly placed in three dimensions without occupying the working space on the workbench 1.

[0039] like Figure 4 As shown, the bonding component also includes a glue dispensing component 33, which includes a glue dispensing head 331, a glue groove 332 and a telescopic device 333. The glue dispensing head 331 is connected to the glue groove 332, and the telescopic device 333 can drive the glue dispensing head 331 and the glue groove 332 to reciprocate perpendicular to the workbench 1.

[0040] In order to fix the chip and the substrate together, the present invention generally uses glue to adhere the chip and the substrate. When the picking device 23 moves the chip from the material box 41 to the top of the substrate and completes the alignment, the glue in the glue groove 332 is guided to the substrate through the glue dispensing head 331, and then the chip is placed on the substrate and connected by glue to fix the chip and the substrate.

[0041] like Figure 1 and Figure 3As shown in the figure, the mounter of the present invention further includes a second cross beam 5. The dispensing member 33 is installed on the second cross beam 5. The dispensing member 33 can reciprocate along the length direction of the second cross beam 5. Both ends of the second cross beam 5 are lapped on the guide rail 21, and the second cross beam 5 reciprocates along the length direction of the guide rail 21.

[0042] A second slide rail 51 is installed on the second cross beam 5. The second slide rail 51 is perpendicular to the guide rail 21. The dispensing member 33 is sleeved on the second slide rail 51, and the dispensing member 33 can move along the length direction of the second slide rail 51.

[0043] To prevent the dispensing member 33 from colliding with the pick-up device 23, the dispensing member 33 can also move back and forth along the length direction of the guide rail 21 through the second cross beam 5. After the dispensing operation is completed, the second cross beam 5 drives the dispensing member 33 away from the substrate, so that the pick-up device 23 can smoothly mount the chip on the substrate without bumping, reducing the probability of errors between the chip and the substrate.

[0044] As Figures 1 to 4 shown in the figure, the mounter further includes an alignment assembly. The alignment assembly includes an upper vision camera 7 and a lower vision camera 8. The upper vision camera 7 is installed on the workbench 1. The upper vision camera 7 is arranged between the storage assembly 4 and the bonding assembly. The lens of the upper vision camera 7 is used to photograph the bottom surface of the chip; the lower vision camera 8 is installed on the lower end surface of the telescopic device 333, and the lens of the lower vision camera 8 is used to photograph the substrate.

[0045] In order to mount the chip at the correct position on the substrate in the present invention, a calibration area is provided on the lower end surface of each chip. At the same time, during the process of the pick-up device 23 moving towards the bonding assembly, it will pass by the upper vision camera 7. The upper vision camera 7 is installed on the workbench 1. After the chip is sucked by the suction nozzle 231, it will pass by the upper vision camera 7. When passing by, the upper vision camera 7 photographs the position information of the bottom of the chip and transmits the above information to the computer program; then the lower vision camera 8 on the lower end surface of the telescopic device 333 will also obtain the position information on the substrate. The above position is the position where the chip is to be mounted, and the lower vision camera 8 will also transmit the position information on the substrate back to the computer program. The computer program compares and calibrates the positions of the upper vision camera 7 and the lower vision camera 8, corrects the positions of the first cross beam 22 and the first slide rail 221 on the guide rail 21, and minimizes the position error of the finally mounted chip on the substrate.

[0046] As Figure 1 and Figure 3 shown in the figure, a third slide rail 9 is installed on the workbench 1 of the present invention. The third slide rail 9 is parallel to the guide rail 21. The motor 31 and the rotating member 32 are installed on the guide rail 21. The motor 31 and the rotating member 32 can reciprocate along the length direction of the third slide rail 9.

[0047] While the motor 31 in the fitting component is connected to the rotating member 32, the motor 31 and the rotating member 32 can move linearly along the third slide rail 9, making the installation position of the substrate more flexible. At the same time, during the rotation of the motor 31, the substrate on the rotating body does not collide with other components on the workbench 1, reducing the error value generated after the chip is bonded to the substrate.

[0048] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limitations on the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments, and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. A chip mounter, comprising: a workbench (1), a first moving component (2), a bonding component, and a storage component (4). The first moving component (2), the bonding component, and the storage component (4) are installed on the workbench (1). A substrate is fixed inside the bonding component. The first moving component (2) can transfer a chip from the storage component (4) to the substrate. It is characterized in that the bonding component includes a motor (31) and a rotating member (32). The motor (31) can drive the rotating member (32) to rotate around a rotation axis. An installation surface is formed on the rotating member (32). The substrate is fixed on the installation surface. The substrates and the installation surfaces are in one-to-one correspondence. The installation surfaces are arranged in the circumferential direction of the rotation axis of the rotating member (32); The rotating member (32) is a cylinder. The axis of the motor (31) rotating shaft coincides with the axis of the rotating member (32). The cross-section of the rotating member (32) is triangular; The first moving component (2) includes a guide rail (21) and a first cross beam (22). The first cross beam (22) moves along the length direction of the guide rail (21). A first slide rail (221) is provided on the first cross beam (22). The first slide rail (221) is perpendicular to the guide rail (21). The first moving component (2) further includes a picking device (23). The picking device (23) can move along the length direction of the first slide rail (221); The bonding component further includes a dispensing member (33). The dispensing member (33) includes a dispensing head (331), a glue tank (332), and a telescopic device (333). The dispensing head (331) is communicated with the glue tank (332). The telescopic device (333) can drive the dispensing head (331) and the glue tank (332) to reciprocate perpendicular to the workbench (1).

2. The chip mounter according to claim 1, characterized in that, There are two groups of the guide rails (21). The guide rails (21) are parallel to each other. Both ends of the first cross beam (22) are respectively lapped on the guide rails (21).

3. The chip mounter according to claim 1, characterized in that, The picking device (23) includes a suction nozzle (231) and a vacuum machine (232). The vacuum machine (232) is communicated with the suction nozzle (231). The suction nozzle (231) can suck the chip.

4. The chip mounter according to claim 1, characterized in that, The storage component (4) includes a cartridge (41), a first placement area (42), a second placement area (43), and a conveying device (44). The conveying device (44) can transfer the cartridge (41) from the first placement area (42) to the second placement area (43). The chips are placed in the cartridge (41) in the first placement area (42).

5. The chip mounter according to claim 1, characterized in that, The mounter further includes a second cross beam (5), the dispensing member (33) is mounted on the second cross beam (5), the dispensing member (33) can reciprocate along the length direction of the second cross beam (5), both ends of the second cross beam (5) are lapped on the guide rail (21), and the second cross beam (5) reciprocates along the length direction of the guide rail (21); A second slide rail (51) is mounted on the second cross beam (5), the second slide rail (51) is perpendicular to the guide rail (21), the dispensing member (33) is sleeved on the second slide rail (51), and the dispensing member (33) can move along the length direction of the second slide rail (51).

6. The mounter according to claim 1, characterized in that the mounter further includes an upper vision camera (7) and a lower vision camera (8), the upper vision camera (7) is mounted on the workbench (1), the upper vision camera (7) is arranged between the storage component (4) and the bonding component, and the lens of the upper vision camera (7) is used for photographing the bottom surface of the chip; the lower vision camera (8) is mounted on the lower end surface of the telescopic device (333), and the lens of the lower vision camera (8) is used for photographing the substrate.

7. The mounter according to claim 1, characterized in that a third slide rail (9) is mounted on the workbench (1), the third slide rail (9) is parallel to the guide rail (21), the motor (31) and the rotating member (32) are mounted on the guide rail (21), and the motor (31) and the rotating member (32) can reciprocate along the length direction of the third slide rail (9).

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