Coil component and method of manufacturing the same

Abstract

This invention relates to coil components and methods for manufacturing the same. The invention provides a coil component comprising: a main body having a main surface; an inductor wiring conductor disposed within the main body; and a lead conductor disposed within the main body extending toward the main surface and electrically connected to the inductor wiring conductor. The lead conductor includes an end face exposed on the main surface of the main body and an extension integrally formed with the end face and disposed extending along the main surface.

Description

Technical Field

[0001] This disclosure relates to a coil component in which an inductor wiring conductor is embedded in a body and a method for manufacturing the same, and particularly to a lead-out structure and a method for manufacturing the inductor wiring conductor leading out to external terminal electrodes disposed on the surface of the body. Background Technology

[0002] For example, a coil component related to this disclosure is described in International Publication No. 2015 / 133310 (Patent Document 1).

[0003] The coil component described in Patent Document 1 includes an inductor wiring conductor built into a multilayer substrate. Within the multilayer substrate, a columnar lead-out conductor is provided to lead out the inductor wiring conductor. In paragraph 0253 of Patent Document 1, it is described that one end face of this lead-out conductor can also be exposed from the multilayer substrate, and that end face can function as an external terminal electrode.

[0004] Patent Document 1: International Publication No. 2015 / 133310

[0005] In the aforementioned coil components, when the end face of the columnar lead conductor within the multilayer substrate functions as an external terminal electrode, the contact strength between the lead conductor and the main body is sometimes insufficient. Furthermore, the relatively small area of ​​the end face of the columnar lead conductor sometimes results in poor reliability regarding its fixing strength relative to the mounting substrate. Summary of the Invention

[0006] Therefore, the purpose of this disclosure is to provide a structure and manufacturing method of a coil component that can solve the above-mentioned problems encountered when the end face of the lead conductor functions as an external terminal electrode.

[0007] One aspect of the coil component disclosed herein includes: a body having a main surface; an inductor wiring conductor disposed within the body; and a lead conductor disposed within the body extending toward the main surface and electrically connected to the inductor wiring conductor.

[0008] In the above-mentioned coil component, the lead conductor includes an end face exposed on the main surface and an extension integrally formed with the end face and arranged to extend along the main surface.

[0009] Another aspect of this disclosure relates to a method for manufacturing a coil component, comprising: preparing a structure having a main surface, having an inductor wiring conductor disposed therein and an outgoing conductor electrically connected to the inductor wiring conductor, the outgoing conductor extending toward the main surface; grinding the structure from the main surface side to expose the end face of the outgoing conductor on the main surface side; and forming an extension during grinding, the extension being integrally formed with the end face of the outgoing conductor and extending along the ground main surface.

[0010] According to the above-mentioned coil component, the combined surface area of ​​the end face and the extension is larger than the cross-sectional area of ​​the section extending in a direction parallel to the main surface of the lead conductor, which can improve the contact force of the lead conductor relative to the main body.

[0011] Furthermore, since the surface area can be further increased, the reliability of the fixing strength of the coil component relative to the mounting substrate can be improved.

[0012] The manufacturing method described above can improve reliability with a simple process. Attached Figure Description

[0013] Figure 1 This is a top view showing the appearance of the coil component.

[0014] Figure 2 It is shown in magnification Figure 1 A cross-sectional view of a portion of the coil component shown, (A) indicating along... Figure 1 The cross section of line AA, (B) represents the section along the line AA. Figure 1 The cross section of line BB.

[0015] Figure 3 It is used for explanation Figure 1 The cross-sectional view shown is a part of the prepared support substrate, illustrating the manufacturing method of the coil component.

[0016] Figure 4 It means to continue Figure 3 The cross-sectional view of the process shown illustrates the state in which a conductive seed layer is formed on the support substrate.

[0017] Figure 5 It means to continue Figure 4 The sectional view of the process shown indicates that it is in relation to... Figure 2 (A) shows a portion of the seed layer in which a first resist is applied.

[0018] Figure 6 It means to continue Figure 5 The sectional view of the process shown indicates that it is in relation to... Figure 2 (A) shows a portion that is equivalent to the inductor wiring conductor formed by electroplating on the seed layer through the opening of the first resist.

[0019] Figure 7 It means to continue Figure 6 The sectional view of the process shown indicates that it is in relation to... Figure 2 (A) shows a portion that is equivalent to the portion in which the first resist has been removed.

[0020] Figure 8 It means to continue Figure 7 The sectional view of the process shown indicates that it is in relation to... Figure 2 (A) shows a portion that is equivalent to the seed layer in which a second resist is applied.

[0021] Figure 9 It means to continue Figure 8 The sectional view of the process shown indicates that it is in relation to... Figure 2 (A) shows a portion that, through the opening of the second resist, is electroplated onto the end of the inductor wiring conductor to form a lead conductor.

[0022] Figure 10 It means to continue Figure 9 The sectional view of the process shown indicates that it is in relation to... Figure 2 (A) shows a portion that is equivalent to the portion in which the second resist has been removed.

[0023] Figure 11 It means to continue Figure 10 The sectional view of the process shown indicates that it is in relation to... Figure 2 (A) represents a portion of the seed layer that has been removed from its unnecessary parts.

[0024] Figure 12 It means to continue Figure 11 The sectional view of the process shown indicates that it is in relation to... Figure 2 (A) shows a portion corresponding to which a first magnetic layer is provided to house the inductor wiring conductors and lead conductors inside.

[0025] Figure 13 It means to continue Figure 12 The sectional view of the process shown indicates that it is in relation to... Figure 2 (A) shows a portion where the first magnetic layer is ground to expose the end face of the lead conductor, and an extension connected to the end face of the lead conductor is formed along the main surface of the structure.

[0026] Figure 14 It means to continue Figure 13 The sectional view of the process shown indicates that it is in relation to... Figure 2 (A) shows a portion of the same type, in which the supporting substrate has been removed.

[0027] Figure 15 It means to continue Figure 14 The sectional view of the process shown indicates that it is in relation to... Figure 2 (A) shows a portion that corresponds to the second magnetic layer being disposed in a manner that contacts the first magnetic layer.

[0028] Figure 16This is a cross-sectional view showing the coil component.

[0029] Figure 17 This is a cross-sectional view showing the coil component.

[0030] Figure 18 This is a cross-sectional view showing the coil component.

[0031] Explanation of reference numerals in the attached figures

[0032] 1, 1a, 1b, 1c…coil components; 2…main body; 3, 4…main surface of the main body; 9-11…inductor wiring conductors; 13-18…lead conductors; 19-24…external terminal electrodes; 19a-24a…extensions; 34…structures; 35…main surface of the structure; 41…coating film. Detailed Implementation

[0033] [First Implementation Method]

[0034] Reference Figure 1 and Figure 2 The structure of the coil component 1, which is one embodiment of this disclosure, will be described.

[0035] The coil component 1 preferably includes a main body 2 made of a magnetic material. The magnetic material constituting the main body 2 is, for example, made of an organic material containing metallic magnetic powder. The metallic magnetic powder is, for example, a powder made of an Fe-containing alloy, such as an Fe-Si alloy, with an average particle size of 5 μm or less. Furthermore, the metallic magnetic powder can be crystalline or amorphous. Ferrite or other oxide magnetic powders can also be used instead of metallic magnetic powder. As the organic material, for example, epoxy resin, a mixture of epoxy resin and acrylic resin, or a mixture of epoxy resin, acrylic resin, and other resins are used.

[0036] The main body 2 is plate-shaped or cuboid-shaped, having a first main surface 3 and a second main surface 4 facing each other, and four end surfaces 5, 6, 7 and 8 connecting the first main surface 3 and the second main surface 4. In addition, "main surface" and "end surface" are additional names for ease of explanation and are determined relatively.

[0037] Three linear inductor wiring conductors 9, 10, and 11 are arranged within the main body 2. Inductor wiring conductors 9, 10, and 11 extend along the direction connecting the opposing end faces 5 and 6. Inductor wiring conductors 9 and 10 are straight, while inductor wiring conductor 11 is zigzag. Furthermore, inductor wiring conductor 9 is thicker than inductor wiring conductors 10 and 11.

[0038] Lead conductors 13 and 14 are respectively provided at one end and the other end of the inductor wiring conductor 9. Figure 2(A) The diagram shows one of the lead conductors 13. Lead conductors 15 and 16 are respectively provided at one end and the other end of the inductor wiring conductor 10. Lead conductors 17 and 18 are respectively provided at one end and the other end of the inductor wiring conductor 11. From Figure 2 As shown in Figure (A), the lead conductors 13-18 are respectively configured to overlap with the corresponding ends of the inductor wiring conductors 9-11, and are arranged in the main body 2 in a state of extending toward the first main surface 3. Preferably, each lead conductor 13-18 extends in a direction orthogonal to the first main surface 3.

[0039] The inductor wiring conductors 9-11 and lead conductors 13-18 may be made of, for example, Au, Pt, Pd, Ag, Cu, Al, Co, Cr, Zn, Ni, Ti, W, Fe, Sn or In, or compounds thereof. In particular, they are preferably made of ductile Au, Pt, Ag or Cu or compounds thereof, and more preferably, Cu or Cu alloys, taking cost into consideration.

[0040] The six external terminal electrodes 19 to 24 are arranged to be exposed on the first main surface 3 of the main body 2. In the above description, "main surface" and "end surface" are additional names for ease of explanation and are determined relatively, but "main surface" is defined as the surface on which the external terminal electrodes 19 to 24 are exposed.

[0041] One end of the inductor wiring conductor 9 is electrically connected to the external terminal electrode 19 via lead conductor 13, and the other end is electrically connected to the external terminal electrode 20 via lead conductor 14. One end of the inductor wiring conductor 10 is electrically connected to the external terminal electrode 21 via lead conductor 15, and the other end is electrically connected to the external terminal electrode 22 via lead conductor 16. One end of the inductor wiring conductor 11 is electrically connected to the external terminal electrode 19 via lead conductor 17, and the other end is electrically connected to the external terminal electrode 20 via lead conductor 18.

[0042] The external terminal electrode 19 consists of an end face exposed on the first main surface 3 of the lead conductor 13, and an extension 19a integrally formed with the end face and arranged to extend along the first main surface 3. That is, the lead conductor 13 includes an end face and an extension 19a. With this structure, the combined surface area of ​​the end face and the extension 19a of the external terminal electrode 19 is greater than the cross-sectional area of ​​a section extending in a direction parallel to the first main surface 3 of the lead conductor 13. Furthermore, when viewed from a direction orthogonal to the first main surface 3, the extension 19a is located only on one side of the end face. Specifically, the extension 19a... Figure 1 In the middle, it extends to the right side of the paper at the end face (in a direction orthogonal to the inductor wiring conductor 9).

[0043] The other external terminal electrodes 20 to 24 also have extensions 20a, 21a, 22a, 23a and 24a respectively.

[0044] Additionally, in coil component 1, such as Figure 1 As shown, three external terminal electrodes 19, 21, and 23 are arranged along the first main surface 3, and three external terminal electrodes 20, 22, and 24 are also arranged along the first main surface 3. Furthermore, the extensions 19a, 21a, and 23a of each of the three external terminal electrodes 19, 21, and 23 are oriented in the same direction relative to the end faces of the lead conductors 13, 15, and 17, respectively, and the extensions 20a, 22a, and 24a of each of the three external terminal electrodes 20, 22, and 24 are oriented in the same direction relative to the end faces of the lead conductors 14, 16, and 18, respectively. Specifically, the extensions 19a to 24a are oriented towards… Figure 1 It extends from the right side of the paper (in a direction orthogonal to inductor wiring conductors 9, 10, and 11). This structure is particularly important as described later. Figure 17 As shown in the embodiment, it is effective when the spacing between the multiple external terminal electrodes is narrow.

[0045] Next, refer to Figures 3 to 15 A preferred manufacturing method for coil component 1 will be described. Figures 3 to 15 The diagram illustrates the relationship between... Figure 2 (A) shows a manufacturing method associated with the portion having inductor wiring conductor 9 and lead conductor 13. For the other lead conductor 14 having inductor wiring conductor 9, and the other inductor wiring conductors 10 and 11 and lead conductors 15-18, a manufacturing method also implemented for the portion having inductor wiring conductor 9 and lead conductor 13. Figures 3 to 15 The processes shown are the same.

[0046] First, such as Figure 3 As shown, a support substrate 25 is prepared. The support substrate 25 consists of a base 26 and a coating portion 27. The base 26 is made of a material with relatively high flexural strength, such as a ceramic like ferrite or alumina, or a cured resin. The coating portion 27 covers one main surface of the base 26 and is made of a resin such as polyimide. The coating portion 27 is formed, for example, by spin-coating the resin onto the base 26 and then curing it.

[0047] Next, as Figure 4As shown, a conductive seed layer 28 is formed on the support substrate 25. The seed layer 28 is used to supply charge when the inductor wiring conductors 9-11 are formed by electroplating. The seed layer 28 is preferably made of the same material as the inductor wiring conductors 9-11, such as Au, Pt, Pd, Ag, Cu, Al, Co, Cr, Zn, Ni, Ti, W, Fe, Sn, or In, or compounds thereof. The seed layer 28 is formed by electroless plating, sputtering, etc. In addition, the thickness of the seed layer 28 is not particularly limited as long as it can supply charge and fully function in electroplating, but it is preferably 2 μm or less, for example.

[0048] Next, as Figure 5 As shown, a first resist 29 is provided on the seed layer 28. The first resist 29 has openings 30 corresponding to the pattern of the inductor wiring conductor 9. The first resist 29 is formed, for example, from a dry film resist. More specifically, while peeling off the protective film, a dry film resist is laminated onto the seed layer 28 and patterned through exposure, development, and curing processes to form the first resist 29 with openings 30.

[0049] Next, as Figure 6 As shown, the inductor wiring conductor 9 is formed by electroplating a conductive metal such as Cu. The conductive metal that should become the inductor wiring conductor 9 is plated and grown on a seed layer 28 that has been supplied with charge through an opening 30 in the first resist 29, thus becoming the inductor wiring conductor 9. When the seed layer 28 is made of the same material as the inductor wiring conductor 9, the inductor wiring conductor 9 and the seed layer 28 become one.

[0050] Next, as Figure 7 As shown, the first resist 29 is peeled off and removed.

[0051] Next, as Figure 8 As shown, a second resist 31 is provided on the seed layer 28. The second resist 31 interacts with... Figure 2 The portion corresponding to the part shown in (A) has an opening 32 corresponding to the pattern of the lead conductor 13 electrically connected to the end of the inductor wiring conductor 9. The second resist 31 is formed, for example, by a dry film resist. More specifically, similar to the case of the first resist 29, a dry film resist is laminated onto the seed layer 28 while the protective film is peeled off, and patterned through exposure, development, and curing processes to form the second resist 31 with the opening 32.

[0052] Next, as Figure 9 As shown, electroplating of a conductive metal, such as Cu, is performed. At this time, in conjunction with... Figure 2The portion corresponding to the part shown in (A) is formed by electroplating on the end of the inductor wiring conductor 9 through the opening 32 of the second resist 31. The lead conductor 13 is preferably made of the same material as the inductor wiring conductor 9.

[0053] Next, as Figure 10 As shown, the second resist 31 is peeled off and removed.

[0054] Next, in Figure 10 Perform wet etching under the conditions shown, such as Figure 11 As shown, the unwanted portion of the seed layer 28, i.e. the portion exposed from the inductor wiring conductor 9, is removed.

[0055] Next, as Figure 12 As shown, a first magnetic layer 33, which forms part of the main body 2, is provided on the support substrate 25 so that the inductor wiring conductor 9 and the lead conductor 13 are located inside. The first magnetic layer 33 is obtained, for example, by stamping a sheet made of an organic material containing metallic magnetic powder. Figure 12 The structure 34 shown in the figure is then cured to form. That is, as described above, a structure 34 is prepared having a main surface 35, which is the upper surface of the first magnetic layer 33, and an inductor wiring conductor 9 and an outgoing conductor 13 electrically connected to the inductor wiring conductor 9 are disposed inside the structure, with the outgoing conductor 13 extending toward the main surface 35.

[0056] Next, in Figure 12 In the structure 34 shown, a process of grinding the structure 34 from the main surface 35 side is performed so that the end face of the lead conductor 13 is in contact with... Figure 2 The first main surface 3 shown is exposed on the side corresponding to the main surface 35. In this grinding process, it is preferable to apply a grinding operation to the main surface 35 only in the direction indicated by arrow 36. However, as long as the operation is performed in only one direction on the end face of the lead conductor 13, rotary grinding can also be performed on the main surface 35 as a grinding operation.

[0057] During the above grinding process, such as Figure 13 As shown, the end face of the lead conductor 13, which is part of the external terminal electrode 19, is exposed, and a portion of the lead conductor 13 is extended, thereby forming an extension 19a that is integrally formed with the end face of the lead conductor 13 and extends along the ground main surface 35.

[0058] In the above-described grinding process, at least two grinding stages, such as a first grinding stage and a subsequent second grinding stage, can also be performed. In this case, in the second grinding stage, abrasive grains smaller than those used in the first grinding stage are used. That is, during the above-described grinding, a first abrasive grain and a second abrasive grain smaller than the first abrasive grain are used, and grinding is performed with the second abrasive grain after grinding with the first abrasive grain. As a result, most of the extension 19a is effectively produced in the first grinding stage, and then, in the second grinding stage, the extension dimension of the extension 19a can be finely adjusted. Therefore, it is possible to produce an extension 19a with high dimensional accuracy.

[0059] Next, as Figure 14 As shown, the support substrate 25 is removed.

[0060] Next, as Figure 15 As shown, a second magnetic layer 37 is disposed in contact with the first magnetic layer 33. The second magnetic layer 37 is obtained, for example, by stamping a sheet made of an organic material containing metallic magnetic powder. Figure 15 The state shown is then solidified to form the main body 2. The main body 2 is composed of the second magnetic layer 37 and the first magnetic layer 33 described above.

[0061] Figure 15 The state shown is equivalent to Figure 2 The state shown in (A).

[0062] In this way, coil component 1 is manufactured. However, if the above process is performed in the mother state in order to manufacture multiple coil components 1 at the same time, then a process of cutting the assembly of coil components 1 in the mother state by means of, for example, a cutting machine is performed.

[0063] [Second Implementation]

[0064] Figure 16 This refers to the coil component 1a of the second embodiment of this disclosure. Figure 2 (A) Corresponding diagram. In Figure 16 In the middle, to and Figure 2 (A) Elements corresponding to the elements shown are labeled with the same reference numerals as shown in the attached figures, and repeated descriptions are omitted.

[0065] Reference Figure 16The second embodiment is characterized by further comprising a plating film 41 that covers the external terminal electrode 19, which is composed of the end face of the lead conductor 13 and the extension 19a. When viewed from a direction orthogonal to the main surface 3, the plating film 41 is formed to at least cover the end face of the lead conductor 13 exposed on the main surface 3 and the extension extending along the main surface 3. Thus, when viewed in a cross-section extending in a direction parallel to the first main surface 3, the plating film 41 has a cross-section larger than that of the lead conductor 13. Furthermore, in the second embodiment, the plating film 41 also has an area larger than that of the external terminal electrode 19. The plating film 41, for example, comprises a Cu non-electrolytic plating layer as a base layer, a Ni electroplating layer thereon, and an Au electroplating layer thereon.

[0066] [Third Implementation Method]

[0067] Figure 17 This refers to the coil component 1b of the third embodiment of this disclosure. Figure 2 (A) Corresponding diagram. In Figure 17 In the middle, to and Figure 2 (A) or Figure 1 Elements that are equivalent to those shown are labeled with the same reference numerals as those in the attached drawings, and repeated descriptions are omitted.

[0068] Reference Figure 17 For example, external terminal electrodes 19 and 21, consisting of the end faces of two lead conductors 13 and 15 and their extensions 19a and 21a, are arranged along the first main surface 3. Here, the spacing between the two external terminal electrodes 19 and 21 is relatively narrow. In this case, it is preferable that the extensions 19a and 21a of the two external terminal electrodes 19 and 21 extend in the same direction as each other.

[0069] By adopting such a structure, even if the spacing between the different external terminal electrodes 19 and 21 is narrowed, it is possible to prevent unwanted electrical short circuits between these external terminal electrodes 19 and 21 from occurring.

[0070] [Fourth Implementation Method]

[0071] Figure 18 This refers to the coil component 1c of the fourth embodiment of this disclosure. Figure 2 (A) corresponds to a portion of the diagram. Figure 18 In the middle, to and Figure 2 (A) Elements corresponding to the elements shown are labeled with the same reference numerals as shown in the attached figures, and repeated descriptions are omitted.

[0072] Reference Figure 18 The lead conductor 13 includes only an end face, an extension 19a, and an extension 19b, forming an external terminal electrode 19 composed of the end face, the extension 19a, and the extension 19b. Through the above... Figures 12 to 13The grinding process shown not only forms the extension 19a, but also forms an extension 19b located in a direction different from that of the extension 19a. The extension dimension Pb of the extension 19b is smaller than the extension dimension Pa of the extension 19a.

[0073] Even in this case, if the structure of the third embodiment described above is adopted, it is possible to prevent unwanted electrical short circuits from occurring. That is, if the extensions of the multiple external terminal electrodes, each with a large protrusion size, extend in the same direction as each other, as in the extension 19a of the external terminal electrode 19, it is possible to prevent unwanted electrical short circuits from occurring.

[0074] The present disclosure has been described above in connection with several embodiments illustrated, but various other modifications are possible within the scope of the present disclosure.

[0075] For example, the diagram shows that the cross-sectional shape of the lead conductors 13 to 18 is quadrilateral, but it is not limited to this; for example, it can also be circular.

[0076] Furthermore, the shape and quantity of the inductor wiring conductors in the coil component can be arbitrarily changed according to the design. For example, the inductor wiring conductors can also extend in a spiral shape.

[0077] Furthermore, there are no restrictions on the methods for forming the wiring conductors and lead conductors of the inductor. In addition to the electroplating method mentioned above, non-electrolytic plating, sputtering, vapor deposition, printing, and other methods can also be used.

[0078] Furthermore, the embodiments described in this specification are merely illustrative, and partial substitutions or combinations of structures can be made between different embodiments.

Claims

1. A coil component, wherein, Possessing: a main body having a main surface; an inductor wiring conductor disposed in the main body; an external terminal electrode exposed at the main surface; and an extraction conductor, which is an electroplated extraction conductor, disposed in the main body in a state of extending toward the main surface and extending in a direction orthogonal to the main surface, and electrically connected to the inductor wiring conductor, the external terminal electrode includes an end surface of the extraction conductor exposed at the main surface, and an extension portion integrally formed with the extraction conductor and disposed in a state of extending along the main surface, the extension portion is formed on the main surface by extending a portion of the extraction conductor so that the extension portion connected to the end surface of the extraction conductor is formed on the main surface, the extension portion is buried in the main surface, the extension portion is located only on one side of the end surface when viewed from a direction orthogonal to the main surface.

2. The coil component according to claim 1, wherein the coil component further possesses a second extraction conductor disposed in the main body in a state of extending toward the main surface, and electrically connected to the inductor wiring conductor, the second extraction conductor includes a second end surface exposed at the main surface, and a second extension portion integrally formed with the second end surface and disposed in a state of extending along the main surface, the extension portion and the second extension portion are located in the same direction with respect to the end surface and the second end surface, respectively.

3. The coil component according to claim 1 or 2, wherein the coil component further possesses: a second inductor wiring conductor disposed in the main body; and a third extraction conductor disposed in the main body in a state of extending toward the main surface, and electrically connected to the second inductor wiring conductor, the third extraction conductor includes a third end surface exposed at the main surface, and a third extension portion integrally formed with the third end surface and disposed in a state of extending along the main surface, the extension portion and the third extension portion are located in the same direction with respect to the end surface and the third end surface, respectively.

4. The coil component according to claim 1 or 2, wherein the extraction conductor is composed of copper or a copper alloy.

5. The coil component according to claim 1 or 2, wherein the main body contains a magnetic substance.

6. The coil component according to claim 1 or 2, wherein the coil component further possesses a plating film covering the end surface and the extension portion.

7. A method of manufacturing a coil component, wherein including the following steps: preparing a structure having a main surface, an inductor wiring conductor and an extraction conductor electrically connected to the inductor wiring conductor and formed by electroplating, which are disposed inside, the extraction conductor extending toward the main surface and extending in a direction orthogonal to the main surface; grinding the structure from the main surface side to expose an end surface of the extraction conductor at the main surface side; and forming an extension portion integrally formed with the end surface of the extraction conductor and extending along the main surface after grinding when the grinding is performed, the extension portion is formed on the main surface by extending a portion of the extraction conductor so that the extension portion connected to the end surface of the extraction conductor is formed on the main surface, the extension portion is buried in the main surface, the extension portion is located only on one side of the end surface when viewed from a direction orthogonal to the main surface. An external terminal electrode is formed by the end surface of the lead-out conductor and the extension portion exposed to the main surface, The extension portion is located on only one side of the end surface when viewed from a direction orthogonal to the main surface.

8. The manufacturing method of a coil component according to claim 7, wherein When the grinding is performed, the lead-out conductor is ground in only one direction.

9. The manufacturing method of a coil component according to claim 7 or 8, wherein When the grinding is performed, a first abrasive grain and a second abrasive grain smaller than the first abrasive grain are used, and the grinding is performed with the second abrasive grain after the grinding with the first abrasive grain.

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