Ibc cell and ibc cell assembly

Abstract

The embodiment of the application provides an IBC battery and an IBC battery assembly, relates to the photovoltaic power generation technical field, and the IBC battery comprises a silicon substrate, a main grid and a limiting component; the main grid is arranged on the back light surface of the silicon substrate; the limiting component is connected with the back light surface, and the limiting component is located on both sides of the main grid along the length direction of the main grid; along the vertical direction of the back light surface, the height of the limiting component is greater than the height of the main grid. By arranging the limiting component on both sides of the main grid, the limiting space can be formed to limit and fix the solder strip, and the alignment accuracy is improved. The offset between the solder strip and the main grid can be avoided, so that the short circuit of the IBC battery can be avoided, and the safety factor is improved.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic power generation technology, and in particular to an IBC cell and an IBC cell module. Background Technology

[0002] IBC (Interdigitated back contact) cells are solar cell structures with positive and negative metal electrodes arranged in an interdigitated manner on the back surface of the cell. The back surface of an IBC cell has a main grid, which is welded to solder strips to achieve current transmission and series connection of the cells.

[0003] In the prior art, there is a problem of inaccurate alignment between the main grid and the solder strip when welding the main grid and the solder strip. Since the positive and negative metal electrodes of the IBC cell are on the backlight side, it is easy to cause the IBC cell to short circuit. Summary of the Invention

[0004] This invention provides an IBC battery and an IBC battery module to solve the problem in the prior art where inaccurate alignment of the main grid and the solder strip during welding can easily lead to short circuits in the IBC battery.

[0005] To solve the above problems, the present invention is implemented as follows:

[0006] This invention provides an IBC battery, comprising: a silicon substrate, a main grid, and a limiting component;

[0007] The main gate is disposed on the back surface of the silicon substrate;

[0008] The limiting component is connected to the backlight surface, and the limiting component is located on both sides of the main gate along its own length direction;

[0009] The height of the limiting component is greater than the height of the main gate along the vertical direction of the backlight surface.

[0010] Optionally, the limiting component is a continuous structure along the length direction of the main gate.

[0011] Optionally, the limiting component includes multiple limiting members;

[0012] The plurality of the limiting members are respectively connected to the backlight surface;

[0013] Along the length of the main gate, a plurality of limiting members are spaced apart.

[0014] Optionally, the limiting members are symmetrically distributed on both sides of the main gate along its own length direction.

[0015] Optionally, the IBC battery also includes multiple solder pads;

[0016] The plurality of the pads are spaced apart along the length of the main gate;

[0017] The limiting component bends at the pad to form a clearance space, and the pad is located within the clearance space.

[0018] Optionally, the height of the limiting component is greater than the height of the pad in the direction perpendicular to the backlight surface.

[0019] Optionally, the end face of the limiting component facing away from the backlight surface is provided with a chamfer.

[0020] Optionally, the size of the limiting member is 1μm-100μm along the vertical direction of the backlight surface.

[0021] Optionally, the size of the limiting member is 1μm-10μm along the width direction of the main gate.

[0022] This invention also provides an IBC battery assembly, including the IBC battery described above.

[0023] In this embodiment of the invention, the IBC battery includes a silicon substrate, a main grid, and positioning components. The main grid is disposed on the backlight surface of the silicon substrate. The positioning components are connected to the backlight surface and are located on both sides of the main grid along its length. The height of the positioning components is greater than the height of the main grid in the direction perpendicular to the backlight surface. By setting positioning components on both sides of the main grid, a positioning space can be formed to limit and fix the solder ribbon, improving alignment accuracy. It also prevents misalignment between the solder ribbon and the main grid, thereby preventing short circuits in the IBC battery and improving the safety factor. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of one embodiment of an IBC battery structure according to the present invention;

[0026] Figure 2 A second schematic diagram illustrating an IBC battery structure according to an embodiment of the present invention;

[0027] Figure 3 A third schematic diagram illustrating an IBC battery structure according to an embodiment of the present invention;

[0028] Figure 4This describes an embodiment of the present invention. Figure 3 Cross-sectional view along the AA direction;

[0029] Figure 5 Fourth schematic diagram illustrating an IBC battery structure according to an embodiment of the present invention;

[0030] Figure 6 Fifth schematic diagram illustrating an IBC battery structure according to an embodiment of the present invention;

[0031] Figure 7 This describes an embodiment of the present invention. Figure 5 Cross-sectional view along the BB direction.

[0032] Explanation of reference numerals in the attached figures:

[0033] 10-Silicon substrate; 20-Main gate; 30-Limiting component; 40-Pad; 301-Limiting element. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0036] Reference Figures 1 to 2 As shown in the figure, an embodiment of the present invention proposes an IBC battery, including: a silicon substrate 10, a main grid 20, and a limiting component 30; the main grid 20 is disposed on the backlight surface of the silicon substrate 10; the limiting component 30 is connected to the backlight surface, and the limiting component 30 is located on both sides of the main grid 20 along its own length direction; along the vertical direction of the backlight surface, the height of the limiting component 30 is greater than the height of the main grid 20.

[0037] Specifically, such as Figures 1 to 2As shown, the silicon substrate 10 includes a light-facing surface and a back-light-facing surface arranged opposite each other. The light-facing surface is used to receive light. The back-light-facing surface has multiple parallel-arranged main grids 20, which mainly serve to collect and transmit current. The main grids 20 can be fabricated using a screen printing process. During the cell string bonding process, solder ribbons weld the main grids 20 of adjacent silicon substrates 10 together to achieve series connection.

[0038] Limiting components 30 are provided on both sides of the main gate 20 along its length, forming a limiting space in which at least part of the main gate 20 is located. The limiting components 30 can be formed on the back surface of the silicon substrate 10 by means of paste, inkjet printing, deposition, etc. The paste can be a silver paste-like metal paste, a polyimide-like polymer paste, or an alumina-like inorganic paste, etc., as long as the limiting components 30 can be formed on both sides of the main gate 20. This embodiment of the invention does not limit the specific application of the limiting components 30.

[0039] The limiting component 30 can be divided into a first part and a second part. The first part is located on the left side of the main gate 20 along its own length direction, and the second part is located on the right side of the main gate 20 along its own length direction. The first part and the second part are arranged in parallel, sandwiching the main gate 20 in the middle. Both the first part and the second part maintain a certain distance from the main gate 20, and the distance between them can be selected according to the size of the main gate 20 and the solder strip.

[0040] Along the vertical direction of the backlight surface, that is, the height direction of the main grid 20, the height of the limiting component 30 is greater than the height of the main grid 20. When the solder strip is welded to the main grid 20, the solder strip is at least partially embedded in the limiting space formed by the limiting component 30. Thus, the limiting component 30 can limit the two sides of the solder strip, preventing the solder strip from shifting relative to the main grid 20, thereby preventing short circuits between adjacent positive and negative electrodes.

[0041] In this embodiment of the invention, the IBC battery includes a silicon substrate 10, a main grid 20, and a limiting component 30. The main grid 20 is disposed on the backlight surface of the silicon substrate 10. The limiting component 30 is connected to the backlight surface and is located on both sides of the main grid 20 along its length. The height of the limiting component 30 is greater than the height of the main grid 20 in the direction perpendicular to the backlight surface. By providing the limiting component 30 on both sides of the main grid 20, a limiting space can be formed to limit and fix the solder ribbon, improving alignment accuracy. It also prevents misalignment between the solder ribbon and the main grid 20, thereby preventing short circuits in the IBC battery and improving the safety factor.

[0042] Optionally, refer to Figures 1 to 2 As shown, the limiting component 30 is a continuous structure along the length direction of the main gate 20.

[0043] Specifically, such as Figures 1 to 2As shown, in one embodiment of the present invention, the limiting component 30 includes a first part and a second part. The first part is located on the left side of the main gate 20 along its own length direction, and the second part is located on the right side of the main gate 20 along its own length direction. The first part and the second part are arranged in parallel, sandwiching the main gate 20 in the middle. Both the first part and the second part adopt a continuous structure, that is, the length of the first part and the second part is consistent with the length of the main gate 20. When the solder strip is bonded to the main gate 20, the limiting component 30 can achieve a limiting effect at any position where the solder strip contacts the main gate 20, greatly improving the limiting effect, improving the stability of the solder strip connection, and making it less prone to displacement.

[0044] Optionally, refer to Figures 3 to 4 As shown, the limiting component 30 includes a plurality of limiting members 301; the plurality of limiting members 301 are respectively connected to the backlight surface; the plurality of limiting members 301 are spaced apart along the length direction of the main grid 20.

[0045] Specifically, such as Figures 3 to 4 As shown, in one embodiment of the present invention, the limiting component 30 may also adopt a segmented structure. The limiting component 30 includes a plurality of limiting members 301, which are spaced apart along the length direction of the main gate 20. For example, ten limiting members 301 are distributed on the left side of the main gate 20, and ten limiting members 301 are also distributed on the right side of the main gate 20. The number of limiting members 301 on the left and right sides of the main gate 20 may be the same or different; the limiting members 301 may be symmetrically distributed or staggered on the left and right sides of the main gate 20. The spacing between adjacent limiting members 301 may be selected according to the solder strip and the size of the main gate 20, and the embodiments of the present invention do not limit this.

[0046] By setting multiple spaced limiting members 301 along the length of the main grid 20, the normal limiting function of the welding strip can be ensured, while the use of slurry can be reduced, which is conducive to reducing production costs and meeting the design requirements of lightweight products.

[0047] Optionally, refer to Figures 3 to 4 As shown, the limiting member 301 is symmetrically distributed on both sides of the main gate 20 along its own length direction.

[0048] Specifically, the limiting members 301 can be symmetrically distributed or staggered on the left and right sides of the main gate 20. In this embodiment of the invention, the limiting members 301 are symmetrically distributed on the left and right sides of the main gate 20. Figures 3 to 4 As shown, ten limiting members 301 are distributed on the left side of the main gate 20, and ten limiting members 301 are also distributed on the right side of the main gate 20. The limiting members 301 on the left and right sides are all corresponding to each other and symmetrically arranged.

[0049] The symmetrically distributed limiting components 301 can limit and fix both sides of the same position of the welding strip, greatly improving the limiting effect.

[0050] Optionally, refer to Figures 5 to 7 As shown, the IBC battery also includes a plurality of pads 40; the plurality of pads 40 are spaced apart along the length direction of the main grid 20; the limiting component 30 is bent at the pads 40 to form a clearance space, and the pads 40 are located within the clearance space.

[0051] Specifically, such as Figures 5 to 7 As shown, to improve the stability of the welding between the solder strip and the main gate 20, multiple solder pads 40 are spaced apart on the main gate 20, distributed along the length of the main gate 20. The width of the solder pads 40 is greater than the width of the main gate 20, thereby increasing the welding area between the main gate 20 and the solder strip when welding the main gate 20 and the solder strip using the solder pads 40, thus improving the welding stability. The solder pads 40 and the main gate 20 can be made of the same material, and the solder pads 40 and the main gate 20 can be manufactured using an integral molding process.

[0052] The first part of the limiting component 30 located on the left side of the main gate 20 bends to the left, extends along the length direction of the main gate 20 by a preset length, and then bends to the right; the second part of the limiting component 30 located on the right side of the main gate 20 bends to the right, extends along the length direction of the main gate 20 by a preset length, and then bends to the left, so that the limiting component 30 bends at the pad 40 to form an avoidance space, and the pad 40 is located in the avoidance space.

[0053] When the solder ribbon is soldered to the pad 40, the solder ribbon is at least partially embedded in the limiting space formed by the limiting component 30. Thus, the limiting component 30 can limit both sides of the solder ribbon, preventing the solder ribbon from shifting relative to the main gate 20, thereby avoiding short circuits between adjacent positive and negative electrodes and improving the safety factor.

[0054] Optionally, refer to Figures 5 to 7 As shown, along the vertical direction of the backlight surface, the height of the limiting component 30 is greater than the height of the pad 40.

[0055] Specifically, such as Figures 5 to 7 As shown, along the vertical direction of the backlight surface, that is, the height direction of the main gate 20, the height of the limiting component 30 is greater than the height of the pad 40. When the solder strip is soldered and bonded to the pad 40, the solder strip is at least partially embedded in the limiting space formed by the limiting component 30. Thus, the limiting component 30 can limit the two sides of the solder strip, preventing the solder strip from shifting relative to the pad 40, thereby preventing short circuits between adjacent positive and negative electrodes.

[0056] Optionally, the end face of the limiting component 30 facing away from the backlight surface is provided with a chamfer.

[0057] Specifically, the limiting component 30 can be an approximately cuboid structure. Among a set of opposite faces of the cuboid, one face contacts the backlight surface, and the other face has a chamfer, which can be a rounded corner. When laying the solder strip, the solder strip can be smoothly embedded into the limiting space formed by the limiting component 30 under the guidance of the chamfer, avoiding the problem of solder strip jamming.

[0058] Optionally, the size of the limiting member 301 is 1μm-100μm along the vertical direction of the backlight surface.

[0059] Specifically, along the vertical direction of the backlight surface, i.e., the height direction of the main grid 20, the size of the limiting member 301 is 1μm-100μm. The size of the limiting member 301 cannot be too large, as this would affect the flatness of the cell surface and make the cell prone to microcracks. The size of the limiting member 301 also cannot be too small, as this would not provide adequate restraint for the solder ribbon. In this embodiment of the invention, the size of the limiting member 301 is 1μm-100μm, which ensures both the flatness of the cell surface and provides good restraint for the solder ribbon.

[0060] Optionally, the size of the limiting member 301 is 1μm-10μm along the width direction of the main gate 20.

[0061] Specifically, along the width direction of the main grid 20, the size of the limiting member 301 is 1μm-10μm. The size of the limiting member 301 cannot be too large, as it would occupy too much of the cell surface area, making it inconvenient to place other components. The size of the limiting member 301 also cannot be too small, as it would not provide a good limiting effect on the solder ribbon. In this embodiment of the invention, the size of the limiting member 301 is 1μm-100μm, which neither occupies too much of the cell surface area nor fails to provide a good limiting effect on the solder ribbon.

[0062] This invention also provides an IBC battery assembly, including the IBC battery described above.

[0063] Specifically, an IBC (Integrated Cell Module) is a photovoltaic power generation unit formed by connecting multiple IBC cells in series via solder ribbons. IBC cells can be classified into P-type IBCs and N-type IBCs based on their doping type. P-type IBCs refer to IBC cells with a P-type silicon substrate (doped with boron or gallium); N-type IBCs refer to IBC cells with an N-type silicon substrate (doped with phosphorus).

[0064] In this embodiment of the invention, the IBC battery module uses the aforementioned IBC battery, which includes a silicon substrate 10, a main grid 20, and a limiting component 30. The main grid 20 is disposed on the backlight surface of the silicon substrate 10. The limiting component 30 is connected to the backlight surface and is located on both sides of the main grid 20 along its length. The height of the limiting component 30 is greater than the height of the main grid 20 in the vertical direction of the backlight surface. By providing the limiting component 30 on both sides of the main grid 20, a limiting space can be formed to limit and fix the solder ribbon, improving alignment accuracy. It also prevents misalignment between the solder ribbon and the main grid 20, thereby preventing short circuits in the IBC battery and improving the safety factor.

[0065] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0066] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

Claims

1. An IBC battery, characterized in that, include: Silicon substrate, main gate, and limiting components; The main gate is disposed on the back surface of the silicon substrate; The limiting component is connected to the backlight surface, and the limiting component is located on both sides of the main gate along its own length direction; The height of the limiting component is greater than the height of the main gate along the vertical direction of the backlight surface; The limiting component includes multiple limiting elements; The plurality of the limiting members are respectively connected to the backlight surface; Along the length direction of the main grid, a plurality of limiting members are spaced apart; The size of the limiting member is 1μm-100μm along the vertical direction of the backlight surface.

2. The IBC battery according to claim 1, characterized in that, Along the length of the main gate, the limiting component is a continuous structure.

3. The IBC battery according to claim 1, characterized in that, The limiting members are symmetrically distributed on both sides of the main gate along its own length direction.

4. The IBC battery according to claim 1, characterized in that, It also includes multiple solder pads; The plurality of the pads are spaced apart along the length of the main gate; The limiting component bends at the pad to form a clearance space, and the pad is located within the clearance space.

5. The IBC battery according to claim 4, characterized in that, The height of the limiting component is greater than the height of the pad along the vertical direction of the backlight surface.

6. The IBC battery according to claim 1, characterized in that, The end face of the limiting component facing away from the backlight surface is chamfered.

7. The IBC battery according to claim 1, characterized in that, Along the width direction of the main gate, the size of the limiting member is 1μm-10μm.

8. An IBC battery module, characterized in that, Includes the IBC battery as described in any one of claims 1-7.

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