Position detection sensor and method for manufacturing a position detection sensor

Abstract

A position detection sensor is configured by adhering a sensor pattern portion to one face of a base material with an adhesive material, the sensor pattern portion being obtained by making each of a plurality of electrode conductors composed of a wire covered with insulation into a prescribed conductor pattern, and reducing deformation of wiring of the sensor pattern portion. The sensor pattern portion is composed of a first coil group in which a plurality of annular coils are arranged at prescribed intervals in a first direction, and a second coil group in which a plurality of annular coils are arranged at prescribed intervals in a second direction orthogonal to the first direction, the annular coils being composed by winding a wire a prescribed number of times. The annular coils of the first coil group and the annular coils of the second coil group are alternately stacked at intervals of 1 to a plurality, and are adhered to the base material with the adhesive material.

Description

TECHNICAL FIELD

[0001] The present application relates to a position detection sensor of an electromagnetic induction type and a manufacturing method of the position detection sensor. BACKGROUND

[0002] A position detection sensor of an electromagnetic induction type is configured such that a plurality of annular coils are arranged at a prescribed interval in an X-axis direction and a Y-axis direction on a substrate composed of an insulating material. As a method of forming the annular coils on the substrate, a cable wiring method and an etching method have been known in the past.

[0003] In the cable wiring method among them, for example, as described in Patent Document 1 (Patent Document 1: WO2016 / 194543), a pin table obtained by making a plurality of wiring pins arranged in the X-axis direction and the Y-axis direction stand upright is used, a wire composed of an insulated conductor is hung between the wiring pins in order and is folded back, thereby wiring patterns of X-axis direction annular coils and Y-axis direction annular coils, and thereby forming a sensor pattern portion composed of an X-axis direction annular coil group composed of a plurality of X-axis direction annular coils and a Y-axis direction annular coil group composed of a plurality of Y-axis direction annular coils as a quadrature wiring net. The X-axis direction annular coils and the Y-axis direction annular coils are formed as rectangular annular coils having the Y-axis direction and the X-axis direction as long sides.

[0004] In this case, the sensor pattern portion of the quadrature wiring net using the pin table is formed such that, after a layer of an adhesive material composed of, for example, a double-sided tape is formed on the pin table, all of the annular coils of one group of the X-axis direction annular coil group or the Y-axis direction annular coil group are wired in the past, and all of the annular coils of the other group are wired. Then, the substrate composed of an insulating material is adhered to the formed sensor pattern portion by the adhesive material (for example, the double-sided tape), and is extracted from the pin table, and thereafter, a protective sheet is adhered to the sensor pattern portion by the adhesive material to produce a position detection sensor.

[0005] The cable wiring method has the following advantages:

[0006] • It is suitable for a large position detection sensor because of low manufacturing cost;

[0007] • It has high degree of freedom of sensor shape;

[0008] • It can form a sensor pattern portion allowing overlapping of annular coils with narrow pitch because the wire composed of an insulated conductor is used, and the wire can be routed across the wire;

[0009] • In a case where lead wires (hereinafter, referred to as power supply lines) connecting one end and the other end of the annular coil are arranged at the periphery of the substrate, there are advantages that the lead wires can be routed across the wire and the dead space can be reduced because there is no need to provide a space for insulation between the wires.

[0010] Prior Art Documents

[0011] Patent Documents

[0012] Patent Document 1: WO2016 / 194543 SUMMARY

[0013] PROBLEMS TO BE SOLVED BY THE INVENTION

[0014] However, in the conventional cable routing method, in the position detection sensor formed, the deformation of the wiring is concentrated in the annular coil group in which the wiring is arranged later in the annular coil group constituting the sensor pattern portion in the X-axis direction or the Y-axis direction, and thus, it is found that the position detection accuracy of the position detection sensor deteriorates. Moreover, it is found that the deterioration of the position detection accuracy is more significantly caused in a case where the annular coils are arranged at a narrow pitch and at a high density in order to enable position detection with high accuracy.

[0015] Hereinafter, the reason why the problem is caused is investigated.

[0016] The annular coil is hung on the pin table in a state where the wire is applied with tension, and is bent to be formed into a rectangular annular coil. In this case, the respective long sides of the Y-axis direction annular coil and the X-axis direction annular coil, for example, rectangular, become relatively long lengths from one end to the other end in the X-axis direction and from one end to the other end in the Y-axis direction of the rectangular sensor region (position detection region) of the position detection sensor.

[0017] Here, for example, in a case where the wiring is performed on all of the annular coils of the Y-axis direction annular coil group after the wiring is performed on all of the annular coils of the X-axis direction annular coil group, even if a part of the X-axis direction annular coil initially wired overlaps the other X-axis direction annular coil, at least most of the long side portion directly adheres to the adhesive material on the pin table, and thus, the central portion of the sensor region is also firmly fixed by the adhesive material.

[0018] On the other hand, since the Y-axis direction annular coil to be wired later is arranged on the X-axis direction annular coil group that has already been formed, the long side portion thereof becomes a state of overlapping with the plurality of wires of the X-axis direction annular coil group that already exists on the sensor region, and a plurality of portions not fixed by the adhesive material exist in the central portion of the rectangular sensor region of the position detection sensor. Therefore, the fixing strength of the adhesion of the adhesive material of the long side portion of the Y-axis direction annular coil to be wired later becomes weak.

[0019] In the Y-axis direction annular coil, the more the portions that become a state of overlapping with the plurality of wires of the X-axis direction annular coil group and are not fixed by the adhesive material, the higher the position detection accuracy in the case of the position detection sensor in which the annular coils are arranged in a narrow pitch at a high density. Therefore, the more the position detection sensor is high precision, the weaker the fixing strength of the adhesion of the adhesive material of the long side portion of the Y-axis direction annular coil to be wired later.

[0020] Further, the long side portion of the Y-axis direction annular coil that is located in the central portion of the sensor region is a portion between the wiring pins, and is a portion in which, even if the wire is hung on the wiring pin to become a state in which tension is applied, position deviation is easily caused in the case of weak fixing strength.

[0021] Therefore, in the case in which the Y-axis direction annular coil of the sensor pattern portion that is generated by forming the X-axis direction annular coil group and forming the Y-axis direction annular coil group thereon is adhered to the base material via the adhesive material, deformation of the wiring in which the position of the long side portion of the Y-axis direction annular coil in which the fixing strength of the adhesion is weak deviates from the original wiring position occurs. Therefore, the position detection accuracy of the position detection sensor deteriorates.

[0022] Further, as is clear from the above description, the more the position detection sensor is high precision, the greater the deformation of the wiring of the sensor pattern portion, and it can be impossible to obtain a position detection sensor of high precision.

[0023] An object of the present application is to provide a position detection sensor that can solve the above problems.

[0024] Technical solution for solving the problem

[0025] In order to solve the above problem, a position detection sensor is provided, which is configured by adhering a sensor pattern portion to one face of a base material via an adhesive material, the sensor pattern portion is obtained by making each of a plurality of electrode conductors composed of a wire covered with insulation become a prescribed conductor pattern, and the position detection sensor is characterized in that,

[0026] The sensor pattern portion is composed of a first annular coil group in which annular coils are arranged at a prescribed interval in a first direction, and a second annular coil group in which annular coils are arranged at a prescribed interval in a second direction orthogonal to the first direction, the annular coils being formed by winding the wire a prescribed number of times,

[0027] The annular coils of the first annular coil group and the annular coils of the second annular coil group are alternately stacked at intervals of 1 to several, and are adhered to the base material by the adhesive material.

[0028] In the position detection sensor of the above structure, the annular coils of the first annular coil group and the annular coils of the second annular coil group are alternately stacked at intervals of 1 to several, and are adhered to the base material by the adhesive material.

[0029] Therefore, the annular coils of the first annular coil group and the annular coils of the second annular coil group are arranged while being stably and uniformly adhered to the adhesive material. Thus, according to the position detection sensor of the above structure, not only can the deformation of the wiring be prevented from being concentrated in one of the first annular coil group or the second annular coil group, but also the first annular coil group and the second annular coil group can be stably formed in a state of having little deformation. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is a diagram for explaining a structure example of an embodiment of the position detection sensor of the present application.

[0031] Figure 2 is a diagram for explaining a structure example of a main part of an embodiment of the position detection sensor of the present application.

[0032] Figure 3 is a diagram for explaining a structure example of a position detection circuit connected to the position detection sensor of the present application.

[0033] Figure 4 is a diagram for explaining an example of a manufacturing device for manufacturing an embodiment of the position detection sensor of the present application.

[0034] Figure 5 is a diagram for explaining an embodiment of a manufacturing method of the position detection sensor of the present application.

[0035] Figure 6 is a diagram of a flowchart for explaining a flow of an embodiment of a manufacturing method of the position detection sensor of the present application.

[0036] Figure 7 is a diagram for explaining an embodiment of a manufacturing method of the position detection sensor of the present application.

[0037] Figure 8is a view for explaining a first embodiment of a manufacturing method of a position detection sensor of the present application.

[0038] Figure 9 is a view for explaining another structural example of a main part of an embodiment of a position detection sensor of the present application. DETAILED DESCRIPTION

[0039] Hereinafter, an embodiment of a position detection sensor of the present application and an embodiment of a manufacturing method thereof will be described with reference to the drawings.

[0040] [Embodiment of position detection sensor]

[0041] Figure 1 is a view for explaining a structure of the position detection sensor 1 of the present embodiment, Figure 1 (A) of is a view of a face of the position detection sensor 1 on which a sensor pattern portion is formed, as viewed from a direction orthogonal to the face, Figure 1 (B) of is a conceptual view of a structure of a cross section of the position detection sensor 1.

[0042] In the position detection sensor 1 of the present embodiment, as shown in (A) and (B) of Figure 1 , a sensor pattern portion 13 configured of a plurality of annular coils as a plurality of electrode conductors is adhered to one face 11a of a rectangular sheet-like or film-like base material (substrate) 11 configured of an insulating material, such as PET (Polyethylene Terephthalate), by an adhesive material 12S. Further, a rectangular protective sheet 14 configured of an insulating material, such as PET, is adhered and disposed by an adhesive material 12P in a manner of covering the entirety of the sensor pattern portion 13.

[0043] Further, a metal sheet 15 as an example of an electromagnetic shield layer is adhered by an adhesive material 12M in a manner of covering the entirety of a face on the side opposite to the one face 11a of the base material 11. In this example, the metal sheet 15 is configured of an aluminum sheet and an amorphous sheet. The amorphous sheet of the metal sheet 15 functions to prevent emission of electromagnetic waves radiated from the sensor pattern portion 13 to the outside on the side opposite to the one face 11a of the base material 11, and the aluminum sheet functions to prevent mixing of noise from the outside on the side opposite to the one face 11a of the base material 11 into the sensor pattern portion 13. In addition, the metal sheet 15 can be adhered in a manner of not covering the entirety of the face on the side opposite to the one face 11a of the base material 11 but covering only a region on the inner side of the region of the sensor pattern portion 13 in the face on the side opposite to the one face 11a of the base material 11.

[0044] In addition, as shown in (A) and (B) of Figure 1As shown in (B), on one side 11a of the substrate 11, in a region of the edge that does not overlap with the region where the sensor pattern portion 13 is disposed, a terminal portion 16 is adhered by an adhesive material 12T. This terminal portion 16 is configured such that terminal conductors 17 for electrical connection to each of the plurality of electrode conductors of the sensor pattern portion 13 are formed by printing, for example, a copper foil pattern, on a sheet or film substrate made of an insulating material, such as PET. In this embodiment, the upper part of the terminal portion 16 is not covered by the protective sheet 14.

[0045] like Figure 1 As shown in (A), the sensor pattern section 13 is composed of a plurality of loop coils, which are examples of a plurality of electrode conductors. In this example, the plurality of loop coils are composed of a plurality of loop coils 13X in the X-axis direction and a plurality of loop coils 13Y in the Y-axis direction.

[0046] The X-axis direction loop coil 13X is composed of a rectangular loop coil with its long side along the longitudinal direction of the substrate 11 (e.g., the Y-axis direction of the position coordinate). Multiple X-axis direction loop coils 13X are arranged at predetermined intervals along the transverse direction of the substrate 11 (e.g., the X-axis direction of the position coordinate). Similarly, the Y-axis direction loop coil 13Y is composed of a rectangular loop coil with its long side along the transverse direction of the substrate 11 (the X-axis direction of the position coordinate). The Y-axis direction loop coil 13Y is arranged at predetermined intervals along the longitudinal direction of the substrate 11 (the Y-axis direction of the position coordinate).

[0047] In this embodiment, each of the plurality of X-axis direction annular coils 13X and the plurality of Y-axis direction annular coils 13Y constituting the sensor pattern section 13 is arranged on a surface 11a of the substrate 11 in an overlapping manner, permitted by wires 18 made of insulated wires. In this case, as Figure 1 As shown in (A), in this embodiment, the X-axis direction loop coil 13X and the Y-axis direction loop coil 13Y are respectively arranged at predetermined positions on a surface 11a of the substrate 11 to form a predetermined pattern, which in this example is a rectangular loop coil pattern.

[0048] In this case, in this embodiment, the X-axis direction annular coil 13X, in this example, originates from the rectangular substrate 11. Figure 1 The left edge of the coil faces the right edge, and they are arranged to overlap sequentially in the X-axis direction. Additionally, in this example, the Y-axis annular coil 13Y originates from the rectangular substrate 11. Figure 1 The upper edge of the coil faces the lower edge, and they are allowed to overlap and be configured sequentially in the Y-axis direction. Each of the X-axis ring coils 13X and each of the Y-axis ring coils 13Y can of course be configured without overlapping.

[0049] In this case, when the sensor pattern portion 13 is formed, either one of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y can be formed first, but in the following example, a case where the X-axis direction annular coil 13X is formed first is described.

[0050] In this embodiment, as shown in (A) of FIG. 10, after one X-axis direction annular coil 13X is formed, as shown in (B) of FIG. 10, one Y-axis direction annular coil 13Y is formed, and then, as shown in (C) of FIG. 10, the next X-axis direction annular coil 13X is formed, and then, as shown in (D) of FIG. 10, one Y-axis direction annular coil 13Y is formed, and so on, and the X-axis direction annular coils 13X and the Y-axis direction annular coils 13Y are arranged alternately at every one. Figure 2 Figure 2 Figure 2 Figure 2

[0051] At this time, the both end portions 13XE and 13YE of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y are set to predetermined positions on one face 11a of the base material 11, but as shown in (A) of FIG. 11, the both end portions 13XE and 13YE protrude from the protective sheet 14 to be aligned in a state where they are positioned on the corresponding terminal conductors 17 of the terminal portion 16 as portions to be connected to the both end portions 13XE and 13YE. The both end portions 13XE and 13YE of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y are in a state where the exposed conductive wires are exposed by peeling the insulating coverings, and as shown in (B) of FIG. 11, the exposed conductive wires are set to be positioned on the terminal conductors 17 of the terminal portion 16. Figure 1 Figure 1

[0052] Furthermore, although not shown, the terminal conductors 17 of the terminal portion 16 are electrically connected to the both end portions 13XE and 13YE of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y, respectively, by, for example, soldering. For example, the terminal conductors 17 of the terminal portion 16 are provided with solder in advance, respectively, and by heating the solder portions of the terminal conductors 17 of the terminal portion 16 where the both end portions 13XE and 13YE of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y are positioned, respectively, the terminal conductors 17 of the terminal portion 16 are soldered to the both end portions 13XE and 13YE of the X-axis direction annular coil 13X and the Y-axis direction annular coil 13Y, respectively.

[0053] ​​​​​​As described above, the position detection sensor 1 of the present embodiment uses the wire 18 to form the sensor pattern portion 13 composed of the X-axis direction loop coil 13X and the Y-axis direction loop coil 13Y, and fixes the sensor pattern portion 13 to the base material 11 by the adhesive material 12S. Further, the side of the sensor pattern portion 13 opposite to the base material 11 is fixed to the protective sheet 14 by the adhesive material 12P. Thus, the position detection sensor 1 can be manufactured at low cost.

[0054] In the position detection sensor 1 of the above-described embodiment, the terminal portion 16 in which the terminal conductor 17 is formed in advance is formed on one face 11a of the base material 11. Further, the covering of both end portions 13XE and 13YE of the X-axis direction loop coil 13X and the Y-axis direction loop coil 13Y disposed in the region of the base material 11 not overlapping with the terminal portion 16 is peeled off to expose the wire portions, and the exposed wire portions of both end portions 13XE and 13YE are disposed in alignment with the corresponding portions of the terminal conductor 17 of the terminal portion 16 in a manner capable of being connected thereto.

[0055] Thus, the terminal conductor 17 of the terminal portion 16 and both end portions 13XE and 13YE composed of the exposed wires of the X-axis direction loop coil 13X and the Y-axis direction loop coil 13Y of the sensor pattern portion 13, respectively, can be easily electrically connected to the corresponding terminal conductor 17 of the terminal portion 16 by soldering.

[0056] As described above, the position detection sensor 1 of the above-described embodiment uses the wire 18 composed of the wire covered with the insulating covering to constitute the loop coil as the electrode conductor, and can provide the position detection sensor of low cost and simple structure, and the connection of the position detection sensor 1 to the external circuit becomes very easy by using the terminal portion 16.

[0057] Further, in the sensor pattern portion 13, since the X-axis direction loop coil 13X and the Y-axis direction loop coil 13Y are disposed in an alternating manner at every 1, the X-axis direction loop coil 13X and the Y-axis direction loop coil 13Y are disposed while being stably and uniformly adhered to the adhesive material. Thus, in the position detection sensor 1, it is possible to avoid that the deformation of the wiring concentrates in one of the X-axis direction loop coil group or the Y-axis direction loop coil group, and it is possible to stably form the X-axis direction loop coil group and the Y-axis direction loop coil group in a state of less deformation.

[0058] [Position detection circuit using the position detection sensor of the embodiment]

[0059] Next, a structure example of the electromagnetic induction type position detection circuit 200 using the position detection sensor 1 of the above-described embodiment will be described. Further, as described above, the position detection circuit 200 is configured to detect the position indicated by the position indicator of the pen type. Figure 3 Next, a structure example of the electromagnetic induction type position detection circuit 200 using the position detection sensor 1 of the above-described embodiment will be described. Further, as described above, the position detection circuit 200 is configured to detect the position indicated by the position indicator of the pen type.Figure 3 As shown, the pen-type position indicator 3 used with the position detection sensor 1 of the present embodiment is built-in with a resonance circuit composed of a coil 31 and a capacitor 32 connected in parallel to the coil 31.

[0060] In this case, in Figure 3 the example, the X-axis direction loop coil 13X is composed of n (n is an integer of 2 or more) rectangular loop coils 13X1 to 13Xn arranged in the X-axis direction, and further, the Y-axis direction loop coil 13Y is composed of m (m is an integer of 2 or more) loop coils 13Y1 to 13Ym arranged in the Y-axis direction. n m In the position detection sensor 1, the position detection region is composed of a plurality of X-axis direction loop coils 13X and a plurality of Y-axis direction loop coils 13Y.

[0061] The position detection sensor 1 is connected to a position detection circuit 200 via a terminal portion 16. In Figure 3 the example, the position detection circuit 200 is composed of a selection circuit 201, an oscillator 202, a current driver 203, a transceiver switching circuit 204, a reception amplifier 205, a position indication detection circuit 206, and a processing control portion 207.

[0062] The selection circuit 201 sequentially selects one loop coil from among the plurality of X-axis direction loop coils 13X and the plurality of Y-axis direction loop coils 13Y, transmits a signal to the position indicator 3 through the selected loop coil, and receives a signal fed back from the position indicator 3.

[0063] The transceiver switching circuit 204, which is switched and controlled by the processing control portion 207, is connected to the selection circuit 201. When the transceiver switching circuit 204 is connected to the transmission-side terminal T, an alternating-current signal is supplied from the oscillator 202 to the selection circuit 201, and when connected to the reception-side terminal R, a signal from the selection circuit 201 is supplied to the position indication detection circuit 206 through the reception amplifier 205.

[0064] The position indication detection circuit 206 detects a reception signal, that is, an induced voltage generated in the loop coil of the position detection sensor 1, converts the detected output signal to a digital signal, and outputs to the processing control portion 207. The processing control portion 207 calculates coordinate values of the indication position of the position indicator 3 in the X-axis direction and the Y-axis direction, based on the digital signal from the position indication detection circuit 206, that is, the level of the voltage value of the induced voltage generated in each loop coil.

[0065] [Embodiment of the manufacturing method of the position detection sensor 1 of the present embodiment]

[0066] Next, the Figure 1 ​An embodiment of a manufacturing method of the position detection sensor 1 of the illustrated structure will be described.

[0067] <Embodiment of Manufacturing Method of Position Detection Sensor>

[0068] Figure 4 and Figure 5 is a view for explaining an embodiment of a manufacturing method of the position detection sensor 1. Figure 4 is a view showing a structural example of a manufacturing apparatus of the position detection sensor which executes the manufacturing method of this embodiment. The manufacturing apparatus of the position detection sensor of this example is constituted by a wiring supply unit 100, a pretreatment unit 110, and a wiring unit 120.

[0069] The wiring unit 120 is constituted by a worktable 121 for forming the position detection sensor 1 and a 2-axis moving wiring device 122 provided on the worktable 121. The 2-axis moving wiring device 122 is provided with a moving bridge 1221 which slides and moves in the X-axis direction (direction of the arrow Ax in Figure 4 Figure 4 ) of the position detection sensor 1 and a wiring nozzle mechanism 1222 which slides and moves in the Y-axis direction (direction of the arrow direction Ay in

[0070] The moving bridge 1221 is provided with two legs 1221a and 1221b and a bridge portion 1221c which bridges between the two legs 1221a and 1221b across the position detection sensor 1 in the direction along the Y-axis direction. The two legs 1221a and 1221b of the moving bridge 1221 are respectively placed on two guide rails 121a and 121b provided in the X-axis direction on the worktable 121, and the moving bridge 1221 is guided by the two guide rails 121a and 121b to slide and move in the X-axis direction in a state in which the bridge portion 1221c maintains a state of being parallel to the Y-axis direction.

[0071] The wiring nozzle mechanism 1222 is movably mounted relative to the bridge portion 1221c of the moving bridge 1221 in the bridging direction thereof (the Y-axis direction (direction of the arrow direction Ay in Figure 4 ) of the position detection sensor 1). A wiring nozzle 1222a is mounted at a portion opposite to the face of the worktable 121 of the wiring nozzle mechanism 1222. The wiring nozzle 1222a sends out the coated wire which has been pretreated by the pretreatment unit 110 from the ejection port thereof to the outside.

[0072] With the above structure, the wiring nozzle 1222a is able to move in an arbitrary direction on the two-dimensional plane of the worktable 121 by the sliding movement in the X-axis direction of the moving bridge 1221 and the sliding movement in the Y-axis direction of the wiring nozzle mechanism 1222 in the 2-axis moving wiring device 122.​

[0073] 2-axis movement wiring device 122 has a movement control section that controls the sliding movement of movement bridge 1221 in the X-axis direction and the sliding movement of wiring nozzle mechanism 1222 in the Y-axis direction. Figure 4 In this embodiment, the movement control section is omitted from the drawing, but is configured to control the sliding movement of movement bridge 1221 in the X-axis direction and the sliding movement of wiring nozzle mechanism 1222 in the Y-axis direction. Furthermore, in this embodiment, the movement control section has stored therein information of movement trajectories for moving wiring nozzle 1222a so as to respectively arrange each of a plurality of X-axis direction annular coils 13X and each of a plurality of Y-axis direction annular coils 13Y.

[0074] The movement control section of 2-axis movement wiring device 122 controls the sliding movement of movement bridge 1221 in the X-axis direction and the sliding movement of wiring nozzle mechanism 1222 in the Y-axis direction in accordance with the stored information, and performs movement control of wiring nozzle 1222a so as to arrange each of a plurality of X-axis direction annular coils 13X and each of a plurality of Y-axis direction annular coils 13Y.

[0075] A pin table 123 is provided on worktable 121 of wiring unit 120, and the pin table 123 is provided with guide pins for guiding X-axis direction annular coils 13X and Y-axis direction annular coils 13Y so as to form annular coil patterns by wire 18.

[0076] Figure 5 is a drawing for explaining a structure example of the pin table 123. As shown in the upper part of Figure 5 , the pin table 123 is composed of a guide pin mounting plate 1231, an intermediate plate 1232, and a peeling sheet 1233. Furthermore, as shown in the lower part of Figure 5 , the pin table 123 is composed of the guide pin mounting plate 1231, the intermediate plate 1232, and the peeling sheet 1233 in combination. In addition, Figure 5 , the drawing of the pin table 123 in the lower part of Figure 5 is an enlarged view of the area corresponding to the area indicated by the broken line in the drawing in the upper part of

[0077] On guide pin mounting plate 1231, a plurality of guide pins 124 are mounted for guiding each of a plurality of X-axis direction annular coils 13X and each of a plurality of Y-axis direction annular coils 13Y to be formed by wire 18 discharged from wiring nozzle 1222a. In Figure 5 , for the sake of explanation, the guide pins 124 are shown as being mounted only at the end portions of guide pin mounting plate 1231, but in actuality, the guide pins 124 are provided at least at positions at which each of a plurality of X-axis direction annular coils 13X and each of a plurality of Y-axis direction annular coils 13Y are bent.

[0078] Intermediate plate 1232 is provided between guide pin mounting plate 1231 and peeling sheet 1233, and thus as shown inFigure 5 As shown, a through-hole 125 is formed in a position corresponding to each of the guide pins 124 provided to the guide pin mounting plate 1231.

[0079] The release sheet 1233 is composed of double-sided tape in this example, and is composed by removing the release paper on the side opposite to the side adhered to the intermediate plate 1232 after being provided on the intermediate plate 1232. Thus, the adhesive material (which becomes the adhesive material 12P in Figure 1 the intermediate plate 1232 is exposed. At this time, the guide pin 124 pierces the release sheet 1233, and becomes a state in which the tip of the guide pin 124 protrudes on the release sheet 1233. Further, the tip of the guide pin 124 is sharp in a needle shape in this example.

[0080] As described above, the guide pin mounting plate 1231, the intermediate plate 1232, and the release sheet 1233 are combined as shown in the lower part of Figure 5 to form a pin stand 123 in which a plurality of guide pins 124 are vertically provided at a prescribed position.

[0081] Further, on the adhesive material 12P exposed on the release sheet 1233 of this pin stand 123, the plurality of X-axis direction annular coils 13X and the plurality of Y-axis direction annular coils 13Y are respectively formed as prescribed annular coil patterns by the coated wires sent out from the wire spouting nozzle 1222a of the wire spouting nozzle mechanism 1222, and thus a sensor pattern portion 13 is formed. Further, since the release paper is still attached on the side of the intermediate plate 1232 of the release sheet 1233, the formed sensor pattern portion 13 can be easily peeled off from the pin stand 123.

[0082] A manufacturing apparatus of a position detection sensor having the above structure is used to manufacture the position detection sensor 1 according to the following steps. Further, Figure 4 The manufacturing apparatus of the position detection sensor of the present embodiment performs the manufacturing of the position detection sensor 1 by omitting the sequence control section to sequentially control the actions of the wire supply unit 100, the pretreatment unit 110, and the wire unit 120 respectively.

[0083] Figure 6 is a flowchart showing the flow of the procedure of the first embodiment of the manufacturing method of the position detection sensor 1 of the present embodiment, and the Figure 6 The manufacturing method of the position detection sensor of the present embodiment will be described. Further, the processing of each of the following steps is performed by the control of the sequence control section of the manufacturing apparatus of the position detection sensor.

[0084] First, the sequence control section instructs the wire supply unit 100, the pretreatment unit 110, and the wiring unit 120 to generate the X-axis direction loop coil 13X, respectively, and the wire supply unit 100 feeds the wire 18 to the pretreatment unit 110 (step S101). In the pretreatment unit 110 that has accepted the supply of the wire 18, the wire 18 from the wire supply unit 100 is cut to a length matching the X-axis direction loop coil 13X, and a pretreatment of stripping the covering of both end portions of the wire 18 to expose the conductor is performed, and the wire 18 that has undergone the pretreatment is transported to the wiring nozzle mechanism 1222 of the wiring unit 120 (step S102).

[0085] The wiring unit 120 performs movement control of the wiring nozzle 1222a of the wiring nozzle mechanism 1222 by the movement control section of the 2-axis movement wiring device 122, thereby forming the X-axis direction loop coil 13X while hanging the wire 18 on the guide pin on the pin table 123 (step S103. Refer to (A) of FIG. 10). Figure 2 In this case, as shown in (A) of FIG. 11, both end portions 13XE of the X-axis direction loop coil 13X, which expose the conductor of the wire 18, protrude from the pin table 123 in the X-axis direction. Also, the wire 18 is arranged by being guided by the guide pin 124, as shown in the description of the foregoing (B) of FIG. 10. Figure 7 Figure 1 The position of the both end portions 13XE becomes a state of being aligned in such a manner as to be positioned above the terminal conductor 17 corresponding to the terminal portion 16.

[0086] If the formation of the one X-axis direction loop coil 13X is completed, the sequence control section instructs the wire supply unit 100, the pretreatment unit 110, and the wiring unit 120 to generate the Y-axis direction loop coil 13Y, respectively, and the wire supply unit 100 feeds the wire 18 to the pretreatment unit 110 (step S104). In the pretreatment unit 110 that has accepted the supply of the wire 18, the wire 18 from the wire supply unit 100 is cut to a length matching the Y-axis direction loop coil 13Y, and a pretreatment of stripping the covering of both end portions of the wire 18 to expose the conductor is performed, and the wire 18 that has undergone the pretreatment is transported to the wiring nozzle mechanism 1222 of the wiring unit 120 (step S105).

[0087] The wiring unit 120 performs movement control of the wiring nozzle 1222a of the wiring nozzle mechanism 1222 by the movement control section of the 2-axis movement wiring device 122, thereby forming the Y-axis direction loop coil 13Y while hanging the wire 18 on the guide pin on the pin table 123 (step S106. Refer to (B) of FIG. 12). Figure 2 Figure 7 ​​As shown, the two end portions 13YE of the Y-axis direction coil 13Y that expose the wire of the wire 18 protrude from the pin stage 123 in the Y-axis direction. Also, the wire 18 is arranged by being guided by the guide pin 124, as described above Figure 1 As shown in the explanation of the above-described

[0088] If the formation of one X-axis direction coil 13X and one Y-axis direction coil 13Y is completed, the sequential control section ends the formation of all the X-axis direction coils 13X and Y-axis direction coils 13Y on the pin stage 123, and determines whether the sensor pattern section 13 is completed (step S107).

[0089] In this step S107, when it is determined that the sensor pattern section 13 is not completed, the sequential control section returns the process to step S101, and controls in such a manner that the same process as steps S101 to S106 is repeated for one X-axis direction coil 13X and one Y-axis direction coil 13Y at the next position, as shown in (C) and (D) of the above-described Figure 2 In this example, the X-axis direction coil 13X and the Y-axis direction coil 13Y at the next position are adjacent to the X-axis direction coil 13X and the Y-axis direction coil 13Y that have been formed previously.

[0090] In step S107, when it is determined that the sensor pattern section 13 is completed, the substrate 11 is pressed onto the sensor pattern section 13 on the pin stage 123 in a state of being aligned, via an adhesive material 12S, for example, made of a material obtained by peeling the release paper of a double-sided tape, and the sensor pattern section 13 on the pin stage 123 is adhered to the substrate 11 by the adhesive material 12S, as shown in Figure 7

[0091] In this case, as shown in Figure 7 On the surface 11a of the substrate 11 opposite to the pin stage 123, a plurality of terminal conductors 17 are formed (omitted in the above-described Figure 7 . Refer to Figure 1 ) of the terminal portions 16 are adhered in advance. In this embodiment, as shown in Figure 1 The substrate 11 has a region in which the terminal portions 16 are formed and a region 11s of the sensor pattern section 13 (refer to the region indicated by the broken line in the above-described Figure 7

[0092] ​​In this embodiment, the double-sided tape constituting the adhesive material 12S is set to a size corresponding to the size of the region 11s of the sensor pattern portion 13. In this example, the region where the terminal portion 16 is formed is positioned without the adhesive material 12S. Furthermore, the sensor pattern portion 13 of the substrate 11, which is positioned as the pin base 123, corresponds to the region 11s of the sensor pattern portion 13 and is pressed onto the pin base 123 via the adhesive material 12S.

[0093] The positioning of the double-sided adhesive tape 12S and the substrate 11 is achieved by designated components (e.g., components corresponding to the four corner positions of the regions 11s) of the guide pin 124 protruding from the pin base 123. Alternatively, the adhesive material 12S may be pre-adhered to the regions 11s of the substrate 11.

[0094] On the other hand, such as Figure 7 As shown, the sensor pattern section 13 on the pin platform 123 is in a state where it protrudes from the area 11s of the sensor pattern section 13 toward the terminal section 16, so that the two exposed ends 13XE and 13YE of the wires of the plurality of X-axis direction ring coils 13X or the plurality of Y-axis direction ring coils 13Y are respectively connected to the corresponding terminal conductors 17 of the terminal section 16.

[0095] As described above, if one side 11a of the substrate 11 is pressed against the pin stage 123 in an aligned state, the guide pin 124 penetrates and pierces the substrate 11, but the sensor pattern portion 13 is adhered to the area 11s of the substrate 11 by the adhesive material 12S. Furthermore, as... Figure 8 As shown, the two ends 13XE and 13YE of each of the multiple X-axis direction loop coils 13X or multiple Y-axis direction loop coils 13Y are positioned on the corresponding terminal conductors 17 of the terminal portion 16.

[0096] After the sensor pattern portion 13 is adhered to one surface 11a of the substrate 11 using the adhesive material 12S, the substrate 11 is peeled off from the pin holder 123 in step S108. In this case, by using a lifting mechanism such as a robot (not shown), the substrate 11, along with portions of the intermediate plate 1232 and the peeling piece 1233, is separated from the pin mounting plate 1231 and lifted off the guide pin 124. Alternatively, instead of lifting the substrate 11 along with portions of the intermediate plate 1232 and the peeling piece 1233, a robot (not shown) can be used to lower the pin mounting plate 1231 downwards above the height of the guide pin while holding the substrate 11, along with portions of the intermediate plate 1232 and the peeling piece 1233, to detach the substrate 11 from the guide pin 124.

[0097] As described above, the sensor pattern portion 13 is adhered to one face 11a of the substrate 11 taken off from the pin stand 123, and as described above, the covering of the wire 18 of each of the plurality of X-axis direction annular coils 13X or the plurality of Y-axis direction annular coils 13Y is peeled off to expose both end portions 13XE and 13YE of the wire in a state of being positioned above the corresponding terminal conductor 17 of the terminal portion 16.

[0098] In this embodiment, as shown in FIG. 12, on each terminal conductor 17 of the terminal portion 16 on one face 11a of the substrate 11, solder 19 is previously accumulated, and by heating a portion of the solder 19 of each terminal conductor 17 of the terminal portion 16, the solder 19 is melted, and the both end portions 13XE and 13YE of the wire 18 of which the covering is peeled off to expose the wire are soldered to the corresponding terminal conductor 17 of the terminal portion 16, thereby performing electrical connection (step S109). Figure 8

[0099] After that, the release paper is peeled off from the release sheet 1233 adhered to the sensor pattern portion 13 on one face 11a of the substrate 11 taken off from the guide pin 124 with the release sheet 1233, thereby exposing the adhesive material 12P. Then, by the adhesive material 12P, the protective sheet 14 is adhered and covered on the sensor pattern portion 13 on one face 11a of the substrate 11 (refer to FIG. 10) (step S110). Figure 1

[0100] Next, in this embodiment, the metal sheet 15 constituting the electromagnetic shield layer is adhered to the face on the side opposite to one face 11a of the substrate 11 by the adhesive material 12M constituted by, for example, double-sided tape (step S111).

[0101] Thus, the position detection sensor 1 can be manufactured. Further, in the case where the position detection sensor 1 is manufactured in the above procedure, when the size having a redundant area is manufactured, finally, by cutting unnecessary portions, the outer shape is made into a prescribed outer shape.

[0102] Further, in the pretreatment unit 110, only the process of peeling off the covering of the wire 18 to expose the wire can be performed, and in the wiring nozzle mechanism 1222 of the wiring unit 120, the process of cutting to a length corresponding to each of the X-axis direction annular coil 13X or the Y-axis direction annular coil 13Y is performed.

[0103] ​​As described above, according to the manufacturing method of the position detection sensor of the present embodiment, it is possible to manufacture the position detection sensor 1 in which the sensor pattern portion 13 is simply arranged on one face 11a of the base material using the wire 18 composed of the insulated conductor, and the electrical connection of the terminal conductor 17 of the terminal portion 16 to each of the annular coils of the sensor pattern portion 13 can also be simply performed. Further, by using the manufacturing method of the present embodiment, mass production of the position detection sensor 1 can also be achieved.

[0104] Further, the X-axis direction annular coils 13X and the Y-axis direction annular coils 13Y of the sensor pattern portion 13 are alternately formed at every 1 on the pin stage, and are bonded with respect to the adhesive material 12P of the release sheet 1233, and thus the X-axis direction annular coils 13X and the Y-axis direction annular coils 13Y are stably and uniformly fixed by the adhesive material 12P. Therefore, when the base material 11 is adhered by the adhesive material 12S on the sensor pattern portion 13, the uniform fixed state of the X-axis direction annular coils 13X and the Y-axis direction annular coils 13Y is also maintained.

[0105] Thus, in the position detection sensor 1 of the present embodiment, it is possible to avoid the concentration of the deformation of the wiring in one of the X-axis direction annular coil group or the Y-axis direction annular coil group, and it is possible to stably form the X-axis direction annular coil group and the Y-axis direction annular coil group on the base material 11 in a state in which the deformation of the wiring is small.

[0106] Further, even if the X-axis direction annular coils 13X and the Y-axis direction annular coils 13Y are respectively formed in a narrow pitch, it is possible to stably form the X-axis direction annular coil group and the Y-axis direction annular coil group in a state in which the deformation of the wiring is small, and thus it is possible to easily achieve the high precision of the position detection sensor.

[0107] <Other Embodiment of the Manufacturing Method of the Position Detection Sensor>

[0108] In the manufacturing method of the position detection sensor of the above-described embodiment, the pin stage 123 in which the guide pin 124 is formed is used, but the position detection sensor 1 can also be formed without using the pin stage 123.

[0109] In another embodiment of the manufacturing method of the position detection sensor, a layer of the adhesive material 12S is provided on one face 11a of the base material 11, and the terminal portion 16 and the sensor pattern portion 13 are disposed on the layer of the adhesive material 12S by the wire nozzle mechanism. In this case, the wire nozzle mechanism of the wire unit does not form a loop coil pattern in a manner of hanging on a guide pin, but forms a loop coil pattern by moving the wire nozzle while adhering the wire material 18 to the adhesive material 12S side of one face 11a of the base material 11. The structure for this can use a known structure, and thus the structure example thereof is omitted here. The other aspects are the same as the above-described embodiment of the manufacturing method of the position detection sensor.

[0110] Further, in another embodiment of the manufacturing method of the position detection sensor described above, the case where the coated wire is adhered to the layer of the adhesive material after the layer of the adhesive material 12S is applied on the base material 11 is described, but instead of applying the layer of the adhesive material 12S, a coated wire with an adhesive material that is melted by heat, for example, can be used as the coated wire of the wire material 18, and the coated wire is adhered to the base material 11 while the adhesive material of the coated wire is melted by heat.

[0111] [Modified Example of the Position Detection Sensor of the Above-Described Embodiment]

[0112] In the position detection sensor 1 of the above-described embodiment, the X-axis direction loop coils 13X and the Y-axis direction loop coils 13Y are alternately formed every 1, but can be alternately formed every multiple. In this case, the X-axis direction loop coils 13X are also arranged to allow mutual overlapping in the X-axis direction in order from the left end edge side toward the right end edge side of the rectangular base material 11, and the Y-axis direction loop coils 13Y are also arranged to allow mutual overlapping in the Y-axis direction in order from the upper end edge side toward the lower end edge side of the rectangular base material 11. Figure 1 Figure 1

[0113] Figure 9 is an example in the case where the X-axis direction loop coils 13X and the Y-axis direction loop coils 13Y are alternately formed every 2. In the case of this example, the X-axis direction loop coils 13X are also arranged to allow mutual overlapping in the X-axis direction in order from the left end edge side toward the right end edge side of the rectangular base material 11, and the Y-axis direction loop coils 13Y are also arranged to allow mutual overlapping in the Y-axis direction in order from the upper end edge side toward the lower end edge side of the rectangular base material 11. Figure 1 Figure 1

[0114] That is, in the example of Figure 9 , first, as in Figure 9 ​​​​As shown in (A) of FIG. 10, two X-axis direction annular coils 13X1 and 13X2 adjacent to each other are formed. After that, as shown in (B) of FIG. 10, two Y-axis direction annular coils 13Y1 and 13Y2 adjacent to each other are formed. Figure 9

[0115] Next, as shown in (C) of FIG. 10, two X-axis direction annular coils 13X3 and 13X4 adjacent to the X-axis direction annular coils 13X1 and 13X2 formed before are formed. After the two X-axis direction annular coils 13X3 and 13X4 are formed, next, as shown in (D) of FIG. 10, two Y-axis direction annular coils 13Y3 and 13Y4 adjacent to the Y-axis direction annular coils 13Y1 and 13Y2 formed before are formed. Hereinafter, each two X-axis direction annular coils 13X adjacent to each other and each two Y-axis direction annular coils 13Y adjacent to each other are alternately formed in order. Figure 9 Figure 9

[0116] Further, instead of alternately forming the X-axis direction annular coils 13X and the Y-axis direction annular coils 13Y every two, it is also possible to alternately form the X-axis direction annular coils 13X and the Y-axis direction annular coils 13Y every three or more.

[0117] Further, in the case where the X-axis direction annular coils 13X and the Y-axis direction annular coils 13Y are alternately formed every several, in the above-described example, the number of the X-axis direction annular coils 13X and the Y-axis direction annular coils 13Y is set to be the same number every several, but it is also possible to set the number of the X-axis direction annular coils 13X and the Y-axis direction annular coils 13Y to be different numbers every several. In this case, the different numbers of the X-axis direction annular coils 13X and the Y-axis direction annular coils 13Y can be considered as the number of the X-axis direction annular coils 13X and the number of the Y-axis direction annular coils 13Y.

[0118] Further, in the X-axis direction annular coil group composed of a plurality of X-axis direction annular coils 13X, the number of the Y-axis direction annular coils alternately formed therein can be not the same number every one, two, or the like, but a state where different numbers exist mixed. The same is true for the Y-axis direction annular coil group composed of a plurality of Y-axis direction annular coils 13Y. That is, for example, it is also possible to alternately form the X-axis direction annular coils and the Y-axis direction annular coils every two in the annular coil group, and alternately form the X-axis direction annular coils and the Y-axis direction annular coils every one from the middle. In this case, the number of the change and the position of the change in the number, and the like can of course be determined independently in the X-axis direction annular coils and the Y-axis direction annular coils, respectively.

[0119] [Other Embodiments or Modifications]

[0120] ​​​In the above-described embodiment, the position detection sensor has a rectangular shape, but the shape is not limited to a rectangular shape and can be any shape. In addition, the base material has a planar shape, but can have a curved surface shape. In addition, the pattern shape of the annular coil is of course not limited to the rectangular shape of the above-described embodiment.

[0121] In addition, in the above-described embodiment, the terminal portion is formed at one end of one side of the rectangular base material, but the terminal portion can be formed at a plurality of ends of one side, or can be formed at ends of a plurality of sides of the rectangular base material.

[0122] Further, in the above-described manufacturing method of the position detection sensor, the insulating covering of the wire 18 is peeled off to expose the internal conductor wire by the pretreatment unit 110 before the sensor pattern portion based on the covered conductor wire is formed by the wiring unit 120, but peeling off the insulating covering of the wire 18 is not necessary before the process of forming the sensor pattern portion is performed. For example, the process of peeling off the insulating covering of the wire 18 at the end of the pattern of the plurality of electrode conductors of the sensor pattern portion 13 can be performed after the sensor pattern portion 13 is formed.

[0123] Explanation of Reference Numerals

[0124] 1… position detection sensor, 11… base material, 12S, 12P, 12M… adhesive material, 13… sensor pattern portion, 14… protective sheet, 15… metal sheet, 16… terminal portion, 17… terminal conductor, 18… wire, 13X… X-axis direction annular coil, 13Y… Y-axis direction annular coil

Claims

1. A position detection sensor configured by adhering a sensor pattern portion to one face of a base material with an adhesive material, the sensor pattern portion being obtained by making each of a plurality of electrode conductors configured of a wire material in which a wire is covered with insulation into a prescribed conductor pattern, the position detection sensor characterized in that: the sensor pattern portion is configured of a first annular coil group in which annular coils configured of winding the wire material a prescribed number of times are arranged a plurality of times at prescribed intervals in a first direction, and a second annular coil group in which annular coils configured of winding the wire material a prescribed number of times are arranged a plurality of times at prescribed intervals in a second direction orthogonal to the first direction, the annular coils of the first annular coil group and the annular coils of the second annular coil group are alternately laminated every 1 to a plurality of the annular coils, and are adhered to the base material with the adhesive material.

2. The position detection sensor according to claim 1, characterized in that: each 1 annular coil of the first annular coil group and the second annular coil group is alternately laminated.

3. The position detection sensor according to claim 1, characterized in that: each plurality of adjacent annular coils of the first annular coil group and each plurality of adjacent annular coils of the second annular coil group are alternately laminated.

4. The position detection sensor according to claim 1, characterized in that: in a case where each plurality of annular coils of the first annular coil group and each plurality of annular coils of the second annular coil group are alternately laminated, the plurality of annular coils are the same number in the first annular coil group and the second annular coil group.

5. The position detection sensor according to claim 1, characterized in that: in a case where each 1 to a plurality of annular coils of the first annular coil group and each 1 to a plurality of annular coils of the second annular coil group are alternately laminated, the 1 to a plurality of annular coils are different in the first annular coil group and the second annular coil group.

6. The position detection sensor according to claim 1, characterized in that: the annular coils of the first annular coil group and the annular coils of the second annular coil group are respectively arranged in a state that allows overlapping with each other.

7. The position detection sensor according to claim 6, characterized in that: a plurality of annular coils of the first annular coil group are sequentially laminated arranged every the 1 to a plurality of annular coils from one end side toward the other end side of the first direction, and a plurality of annular coils of the second annular coil group are sequentially laminated arranged every the 1 to a plurality of annular coils from one end side toward the other end side of the second direction.

8. The position detection sensor according to claim 1, characterized in that: the sensor pattern portion is covered with a protective sheet adhered via the adhesive material. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 9. A manufacturing method of a position detection sensor configured by adhering a sensor pattern portion to one face of a base material with an adhesive material, the sensor pattern portion being configured by a first coil group in which a plurality of annular coils are arranged at a prescribed interval in a first direction and a second coil group in which a plurality of annular coils are arranged at a prescribed interval in a second direction orthogonal to the first direction, the annular coils being configured by winding a wire material in which a wire is covered with insulation a prescribed number of times, the manufacturing method of the position detection sensor characterized by comprising the following steps: a first step of forming one or more annular coils in the first coil group; a second step of forming one or more annular coils in the second coil group; a third step of alternately repeating the first step and the second step to form the sensor pattern portion; and a fourth step of adhering the sensor pattern portion to the base material by pressing the one face side of the base material to the sensor pattern portion formed by the third step via the adhesive material.

10. The manufacturing method of the position detection sensor according to claim 9, wherein the first step and the second step form the annular coils by winding the wire material a prescribed number of times using a guide pin on a pin mounting plate on which the guide pin is disposed, and wherein the fourth step separates the base material to which the sensor pattern portion is adhered from the pin mounting plate after adhering the sensor pattern portion to the base material.

11. The manufacturing method of the position detection sensor according to claim 10, wherein the manufacturing method of the position detection sensor includes a fifth step of joining a protective sheet to a side of the sensor pattern portion opposite the base material side before or after the fourth step. ​ ​ ​ ​

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