System and method for aligning a photonic integrated circuit to a printed optical plate

Abstract

The present application discloses systems and methods for aligning a photonic integrated circuit with a printed optical board. Example implementations described herein involve an interface configured to redirect light between a connector connected to a printed optical board (POB) via an optical waveguide and a photonic integrated circuit (PIC), the interface involving a two-dimensional distributed wave plate (TDW) having a plurality of layers of p-doped and n-doped silicon, the TDW being configured to be driven to change a dielectric constant at a two-dimensional location on the TDW so that received light is redirected at the two-dimensional location.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This patent application is based upon and claims the benefit of priority of provisional U.S. patent application No. 63 / 038,004, filed on June 11, 2020, the entire disclosure of which is hereby incorporated by reference for all purposes. Technical Field

[0003] The present disclosure relates generally to electronic systems having photonic integrated circuits (PICs), and more particularly to systems and methods for aligning PICs with printed optical plates. Background Art

[0004] Recently there have been advances in electrical printed circuit boards with embedded optical waveguides for providing light to be converted to electrical signals and for providing electrical signals to be converted to light. Such systems are known as printed optical circuit boards and are referred to herein as printed optical boards (POBs).

[0005] In a system with a PIC on a POB (hereinafter, referred to as a 'PIC system'), optical connectors become crowded in close proximity to the System on Chip (SoC) as the copper traces of the PIC system collapse toward zero. Unfortunately, there is no optical input / output (I / O) standard for this crowded bus environment. The inputs and outputs of the PIC (equivalent to the I / O buffers and bonding pads of the electrical system), also known as the off-chip optical bus, do not have any candidate solutions, industry consensus, or standard activities. The lack of such a solution is a recent challenge facing connector manufacturers involving PIC components.

[0006] There have been recent advances in the design of printed optical boards (POBs) involving embedded waveguides within circuit boards. Figure 1 An example POB system is shown. Specifically, Figure 1 The optical waveguide core layer embedded in the printed circuit board (PCB) materials and processes is shown. The arrows indicate the direction of the light path from the optical module to the SoC. Since the optical and electrical layers are aligned in manufacturing, the assembly house does not need to provide additional alignment. However, the material system requires a new lamination process, which increases costs and produces unknown field product reliability. Summary of the invention

[0007] Aspects of the present disclosure relate to a system that relates to an interface configured to redirect light from a connector, facilitating single-mode waveguide light from a printed optical board to a photonic integrated circuit (PIC), the interface having a two-dimensional distributed wave plate (TDW), which may include multiple layers of p-doped and n-doped silicon, as an example. In general, the TDW is configured to be driven to change the dielectric constant at each two-dimensional location, so that light received from an internal functional IP block of the PIC through the waveguide is redirected at the two-dimensional location.

[0008] Various aspects of the present disclosure relate to a system configured to redirect light between a connector connected to a printed optical board (POB) via an optical waveguide and a photonic integrated circuit (PIC) package, the system may involve one or more two-dimensional distributed wave plates (TDWs), each of the one or more TDWs having multiple layers of p-doped and n-doped silicon, the one or more TDWs being configured to be driven to change a dielectric constant at a two-dimensional location on the one or more TDWs so that light received at the one or more TDWs is redirected toward a vertical grating coupler at the two-dimensional location.

[0009] Aspects of the present disclosure relate to a system that may involve: a connector configured to connect to a printed optical board (POB) via an optical waveguide; a photonic integrated circuit (PIC) package; and one or more two-dimensional distributed wave plates (TDWs) configured to redirect light between the POB and the PIC package, each of the one or more TDWs having multiple layers of p-doped and n-doped silicon, and the one or more TDWs configured to be driven to change a dielectric constant at a two-dimensional location on the one or more TDWs so that light received at the one or more TDWs is redirected toward a vertical grating coupler at the two-dimensional location. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 An example printed optical board (POB) system according to the prior art is shown.

[0011] Figure 2 An example system involving a POB and a PIC according to an example implementation is shown.

[0012] 3(a) and 3(b) illustrate example configurations of a PIC interface involving a TDW having multiple layers according to an example implementation.

[0013] 4(a) and 4(b) illustrate example structures of a PIC interface involving TDW according to an example implementation.

[0014] Figure 5 An example implementation of a MIMO type implementation of a TDW with a lens according to an example implementation is shown.

[0015] 6(a) and 6(b) illustrate example configurations for determining alignment between a PIC interface and a PIC, depending on the desired implementation.

[0016] Figure 7(a) to Figure 7(c) An example assembly of a TDW board interface as incorporated on a PIC as part of a PIC package is shown according to an example implementation.

[0017] Figure 8(a) to Figure 8(c) An example assembly of an aspheric lens and a TDW board interface as incorporated as part of a PIC package according to an example implementation is shown.

[0018] Figure 9(a) to Figure 9(c) An example assembly of a TDW board interface as incorporated on a connector is shown according to an example implementation. (PIs. Completed ray lines to the far end)

[0019] Figure 10(a) to Figure 10(c) An example assembly of an aspheric lens and TDW board interface as incorporated on a connector according to an example implementation is shown. DETAILED DESCRIPTION

[0020] The following detailed description further provides details of the drawings and example implementations of the present application. For clarity, the reference numerals and descriptions of redundant elements between the drawings are omitted. The terms used throughout the specification are provided as examples and are not intended to be limiting. The example implementations described herein can be used alone or in combination with other example implementations described herein or with any other desired implementation.

[0021] Example implementations described herein are generally directed to electronic systems involving photonic integrated circuits (PICs) on second-level integrated devices, such as electrical printed circuit boards with embedded optical waveguides, referred to herein as printed optical boards (POBs). More specifically, example implementations relate to such systems (hereinafter referred to as 'PIC systems') and methods for aligning PICs with printed optical boards. PICs are packaged electro-optical functional circuits that include electrical integrated circuits and optical integrated circuits monolithically as a single chip or separately on a substrate as a multi-chip module.

[0022] In a PIC system involving a POB with embedded waveguides, optical connectors are needed to facilitate the interface between board to PIC or between PIC and board, depending on the desired displacement of the vertical grating coupler. Since the copper trace length will eventually become zero, the optical to electrical system and interface will allow the chiplet to eventually be properly placed on the package, making the PIC a single chip that can handle both electronics and optics with existing electrical interfaces and the optical interface we describe in this article.

[0023] Figure 2 An example system involving a POB and a PIC according to an example implementation is shown. The POB 200 and the PIC 202 are connected by a connector 201 that facilitates chip-to-board connection. The PIC 202 is incorporated into an IC package that is bonded (e.g., wire bonded, electrically bonded) to the POB 200. The connector 201 is connected to the POB 200 through a POB interface 204 and to the PIC 202 through a PIC interface 203. In an example of the system, light is provided through a waveguide of the POB or a waveguide of the PIC 202, with signal flow in the opposite direction from the PIC to the waveguide of the POB.

[0024] In the manufacture of such a system, the PIC 202 is placed on the PIC interface 203. The lower surface of the PIC 202 includes a coupler, which may include an absorbing portion and a reflecting portion, wherein the absorbing portion is configured to absorb light directed from the connector 201 to the PIC 202, and the reflecting portion is configured to reflect the light back to the connector 201. The signal flow can also be reversed, wherein light is transmitted from the PIC 202 to the POB 200, which is absorbed by the connector 201 and redirected to the POB 200 through the single-mode waveguide.

[0025] However, in the assembly of such a system, it may be difficult to determine the alignment of the absorbing portion of PIC 202 with PIC interface 203. In particular, light directed from PIC interface 203 to the PIC may be lost due to incorrect alignment. Furthermore, realignment of PIC 202 with PIC interface 203 may be difficult to achieve by mechanical adjustment because it may be difficult to tell where light from PIC interface 203 is directed to PIC 202 or where light directed from PIC interface 203 is directed to connector 201.

[0026] The example implementation solves the above problems by introducing a PIC interface 203 involving one or more two-dimensional distributed wave plates (TDW) with multiple layers that shapes and positions an incident beam into a perpendicular output beam between two different media.

[0027] In the example implementations described herein, the proposed PIC interface 203 with one or more TDWs is configured with an electrically controllable dielectric distribution function of a dielectric constant (d(x,y)), where (x,y) are pixelated coordinates on a TDW sheet having a set of pixels, depending on the desired implementation, and depending on the use of a 2D grating structure or a metasurface according to the desired implementation. In the examples provided herein, the (x,y) pixelated coordinates are formed as a staggered configuration based on n-doped and p-doped silicon, however, other implementations may also be utilized depending on the desired implementation. With such example implementations, incident / outgoing light may constructively interfere to form substantially orthogonal turns on outgoing / incident light beams having a desired size and shape in a Gaussian waveform in free space or in a waveguide.

[0028] In the example implementations described herein, the TDW may involve multiple layers, each of which has a dielectric constant d n The associated distribution functions of (x, y) (where n is the layer n = 1, 2, ...) are defined separately. This sandwich structure spatially interferes with the incident light beam from the waveguide to fine-tune the position and shape of the output light beam to the space so that the overall channel performance reaches the maximum target value, or interferes with the incident light beam from the space to fine-tune the position and shape of the output light beam to the waveguide so that the overall channel performance reaches the maximum target value.

[0029] In an example implementation, bidirectionality between PIC 202 and PIC interface 203 is generally ensured by reciprocity of the physical optical paths.

[0030] 3(a) and 3(b) illustrate example configurations of a PIC interface involving one or more TDWs having multiple layers according to example implementations. As shown in FIG3(a) and FIG3(b), light is directed to TDWs 302, 303 through a waveguide 300, and TDWs 302, 303 are configured to redirect the light beam into space 301.

[0031] In the example of FIG3(a), the center of the outgoing beam can be moved to any desired position (x, y) on the PIC interface 302 by electrical control of the 2D grating structure or metasurface of the TDW. In the example of FIG3(b), the PIC interface 303 involves a multiple-input and multiple-output (MIMO) implementation, and a lens 304 for compensating for the d nThe PIC interface 303 is a limited range PIC interface that can be controlled by (x, y) because the MIMO beam forming parameters involve azimuth and polar angles, rather than (x, y) two-dimensional coordinates. Angular control of the beam can position the beam center at (d*sin(q)*cos(f), d*sin(q)sin(f)), where 'd' is the distance from the PIC interface to the aspheric lens. Therefore, the exit beam center can be moved to any desired position (x, y) and aimed in a desired direction by electrical control. In such an example implementation, the PIC interface 303 is configured to direct the beam at a steering angle (θ) and an angle (φ). Depending on the desired implementation, the range for coverage can be extended linearly by 'd'.

[0032] Figures 4(a) and 4(b) show an example structure of a PIC interface involving TDW according to an example implementation. As shown in Figure 4(a), multiple layers of TDW are arranged in a pixelated manner to promote a broadened and scattered right-angle upward Gaussian beam 402 centered at an arbitrary position (x, y) in a TDW pixel based on the adjustment of the dielectric constant. In the example implementation, the reciprocity of the optical path applies to the opposite direction.

[0033] As shown in Figure 4(a), the TDW is connected to the PIC interface circuit through an optical waveguide 401, which facilitates single-mode light 400 from the PIC interface circuit to the TDW layer. Depending on the desired implementation, the optical waveguide 401 can facilitate light into the TDW with or without a taper. Depending on the desired implementation, the optical waveguide 401 can be in the form of a single-mode waveguide or a multi-mode waveguide.

[0034] To control the dielectric constant at each layer, the TDW is configured to be voltage driven along the rows and columns of the layers, as shown in Figure 4(a). By adjusting the voltage on each row and column, the voltage at a specific pixel can be controlled, and the dielectric constant at a specific location (x, y) can be adjusted according to the desired implementation. With the adjusted dielectric constant, light entering the TDW can be directed to an adjacent pixel passing through the TDW, or redirected upward substantially orthogonally, according to the desired implementation.

[0035] Depending on the desired implementation, the TDW may be configured to be controlled by methods other than voltage. For example, an ultrasonic signal may also be used to adjust the dielectric constant. In another example, the surface plasmons on the electro-optical graphene structure may be adjusted according to any desired implementation known in the art. Other methods for changing the dielectric constant may also be utilized depending on the desired implementation, and the present disclosure is not limited thereto.

[0036] FIG4( b) shows an example cross section of a TDW according to an example implementation. The example cross section of FIG4( b) includes a vertical grating coupler (VGC) 410 fixed to a PCB and having an optical path to a vertical line. Such a VGC may include silicon dioxide or a cladding, depending on the desired implementation, and may be any form of VGC known in the art.

[0037] The intermediate layer 411 facilitates optical light to the silicon surface and may include silicon through which electrical connections (e.g., chip to board) are facilitated and may also involve a core for facilitating an optical path for connecting the POB. The intermediate layer 411 also includes a layer having p-doped and n-doped silicon in a pixelated formation and an underlying silicon layer that is either p-doped or n-doped.

[0038] Figure 5 An example implementation of a MIMO type implementation of a TDW with a lens 501 according to an example implementation is shown. Figure 5 In an example implementation of , TDW 500 receives light from PIC 520 through single mode waveguide 530 and used as coherent light MIMO, which is widened based on dielectric constant d(x, y) and configured to form a Gaussian beam 510 with an arbitrary angle (θ, φ) direction. Based on the desired angle, the beam 510 is processed by collimator lens 501 to a desired position (x, y) at a far plane.

[0039] Depending on the desired implementation, lens 501 may be an aspheric lens made of glass or plastic. Lens 501 is configured to direct angled light into a desired location in a substantially orthogonal orientation. Figure 5 As shown, the lens 501 may also be embedded in the package 502 .

[0040] In addition, the signal flow can also be reversed back to the PIC 520 and the single-mode waveguide 530 by entering the TDW 500 through the lens 501. In this case, the light flow is directed vertically from the PIC into the aspheric lens 510, and the light flow is redirected back toward the TDW 500 at a certain angle (e.g., in the opposite direction of arrows 510, 511, as shown in FIG. Figure 5 shown).

[0041] 6(a) and 6(b) illustrate example configurations for determining alignment between a PIC interface and a PIC, depending on the desired implementation.

[0042] In example implementations, there are various types of feedback mechanisms that can be employed depending on the location of the sensor in the optical path. One example of a feedback mechanism is a reflection method, where the sensor is located at one side of the light source so that the amount of the reflected signal indicates the amount of misalignment between the PIC and the interface. On the other hand, another example of a feedback mechanism involves a transmission method, where the sensor is located at the opposite side of the signal to be aligned so that the source and sensor pair are used to actively align the two optical components until the receiving element reaches maximum power. FIG. 6( a ) shows an example configuration that can be used for the reflection method and FIG. 6( b ) shows an example configuration that can be used for the transmission method.

[0043] In the example of FIG6(a), the target waveguide / PIC may involve a reflective portion 601 adjacent to a target coupler 602. The target coupler 602 absorbs light directed toward it, while the reflective portion 601 reflects light directed toward them, as indicated by the arrows. The reflected light is used as a reflection feedback signal, wherein the objective is to obtain a minimum value for the feedback signal. The reflection is monitored by a waveguide tap monitor having a photodiode sensor 600 attached to the PIC connector side. The reflective portion may be made of any material and may be any kind of coating with reflective properties, and is not particularly limited thereto.

[0044] In the example of FIG6(b), the transmitted light will be used as feedback for the maximum value of the optical signal. This signal is monitored by a waveguide tap monitor having a photodiode sensor 603 attached to the target waveguide / PIC side. Through this waveguide tap monitor, once aligned, the maximum signal value of the transmitted light from the PIC connector to the target waveguide / PIC side can therefore be known. Therefore, by using the photodiode sensor as shown in FIG6(a) and FIG6(b), the alignment calibration can be known based on the measurement results of the reflected light, and the TDW can therefore be driven to change the dielectric constant accordingly, even when the PIC package has been bonded to the connector.

[0045] By using the example implementations described herein, the interface of the PIC and the POB can thus be properly aligned by adjusting the dielectric constant of the interface of the TDW. Thus, even if the alignment is not optimal when the PIC is placed on the interface, the light can be redirected according to the desired 2D coordinate position on the TDW according to the desired implementation.

[0046] Furthermore, by using a photodiode sensor to measure the reflected light as described herein, alignment can be determined based on the measurements of the reflected light. Thus, even if the alignment is changed after assembly and alignment is complete, the measurements provided by one or more photodiode sensors can be used to accordingly change the dielectric constant of the post-assembly and post-alignment TDW to realign the PIC package to the connector.

[0047] Furthermore, the use of a waveguide tap monitor with one or more photodiode sensors allows for measurement of the signal as received by the connector or PIC package, depending on the desired implementation. Thus, even if the alignment is changed after assembly and alignment is complete, since the maximum signal value is known, the waveguide tap monitor measurement can be used to change the dielectric constant of the post-assembly TDW accordingly to realign the PIC package to the connector.

[0048] Although the example implementations described herein are directed to a TDW interface as provided on a connector or POB, the TDW interface may also be placed in a PIC to direct light to a desired location on the POB surface. In such an example implementation, Figure 5 The lens can be configured to focus the light beam to a desired location on the POB surface, wherein the beam angle perpendicular to the TDW is configured to be driven to change the dielectric constant at a two-dimensional location, so that the light received from the connector is redirected from the interface at a two-dimensional location to the lens at a certain angle. Therefore, the implementation of the TDW can be set in the connector or in the PIC package according to the desired implementation, wherein other structural elements are modified accordingly to facilitate such an implementation.

[0049] Figure 7(a) to Figure 7(c) An example assembly of a TDW board interface as incorporated on a PIC as part of a PIC package is shown according to an example implementation. In FIG. 7( a), a PIC package 705 is initially assembled onto a PIC connector 702 and bonded to solder balls 704. For the initial assembly, the TDW 706 portion of the PIC package 705 is placed on the VGC 703 of the PIC connector 702 for later alignment.

[0050] In FIG7( b), light is transmitted through the waveguide / PIC 707 to the TDW 706. Based on the configuration of the TDW as described in the example implementations herein, the light is directed 708 substantially orthogonally at the (x, y) pixel coordinates within the TDW to the PIC connector 702. The PIC connector 702 is aligned with the reflective portion (not shown) described in FIG6( a) so that light that does not reach the VGC 703 is reflected off the surface of the PIC connector 702 and is received by a photodiode sensor (not shown) as affixed to the PIC package 705, as shown in FIG6( a).

[0051] In Figure 7(c), once the reflected light is measured by the photodiode sensor, the TDW can be adjusted to redirect the light at different (x, y) coordinates based on the measurements from the photodiode sensor. The light is adjusted until it is aligned with the VGC 703. When the light is aligned 709, the light can then travel through the VGC 703 to be redirected accordingly by the waveguide 701 to the POB or otherwise depending on the desired implementation.

[0052] Figure 8(a) to Figure 8(c) An example assembly of an aspheric lens as incorporated as part of a PIC package and a TDW board interface according to an example implementation is shown. The structure and assembly of FIG8( a) is similar to that of FIG7( a), only the TDW 801 portion of the PIC package 705 is disposed at the position of the lens 800 opposite the VGC 703, and the PIC package 705 is positioned so that the lens 800 is positioned on the VGC 703. The TDW 801 portion of the PIC package 705 is configured as coherent optical MIMO to direct light to the lens 800 at arbitrary angles (θ, φ) based on the configuration.

[0053] In Figure 8(b), the implementation is similar to that of Figure 7(b) in that light not absorbed by VGC 703 is reflected by a reflective portion (not shown) of PIC connector 702, which is measured by a photodiode sensor. The light projected through lens 800 is directed substantially orthogonally toward PIC connector 702 in the same manner as in Figure 7(b), and as shown at 802. Based on the measurements of the photodiode sensor, TDW 706 is then driven to transmit light toward lens 800 at another angle until the light is aligned 803, as shown in Figure 8(c).

[0054] Figure 9(a) to Figure 9(c) An example assembly of a TDW board interface as incorporated on a connector is shown according to an example implementation. In the example assembly of FIG9( a), the structure is similar to that of FIG7( a), only the PIC connector 902 has a TDW 901 connected to a waveguide 701, and the PIC package 905 has a VGC 903 connected to a waveguide / PIC 907. Light is directed from the waveguide 701 to the TDW 901 to be directed substantially orthogonally toward the VGC 903.

[0055] As shown in FIG9(b), and similar to the implementation of FIG7(b), light 904 is directed substantially orthogonally toward PIC package 905, which is provided with a reflective portion (not shown) that reflects light back to a photodiode sensor on PIC connector 902. Based on the measurement results of the photodiode sensor, TDW 901 is then driven to transmit light from different (x, y) pixel coordinates of TDW 901 until the light is aligned 908, as shown in FIG9(c).

[0056] Figure 10(a) to Figure 10(c)An example assembly of an aspheric lens and TDW board interface as incorporated on a connector according to an example implementation is shown. In the example assembly of FIG. 10( a), the structure is similar to that of FIG. 8( a) and FIG. 9( a), only the PIC connector 1002 has a coherent light MIMO TDW 1001 connected to the waveguide 701 and the lens 1000. Light is directed from the waveguide 701 to the TDW 1001 to be directed substantially orthogonally toward the VGC 903 through the lens 1000.

[0057] As shown in FIG10( b ), and similar to the implementation of FIG8( b ), light 1003 is directed from TDW 1001 to lens 1000 at an arbitrary angle (θ, φ) based on the configuration, whereupon lens 1000 is directed substantially orthogonally toward PIC package 905, which is provided with a reflective portion (not shown) that reflects light back to a photodiode sensor on PIC connector 1002. Based on the measurement results of the photodiode sensor, TDW 1001 is then driven to transmit light from different angles to lens 1000 until the light is aligned 1004, as shown in FIG10( c ).

[0058] Thus, Figures 7(a), 8(a), 9(a), and 10(a) illustrate an example initial completion of an assembly where the PIC and connector are somewhat misaligned. Figures 7(b), 8(b), 9(b), and 10(b) illustrate the execution of the alignment process described with respect to Figures 6(a) and 6(b). That is, the TDW is driven to modify the dielectric constant described in the example implementation until a final alignment setting is reached as shown in Figures 7(c), 8(c), 9(c), and 10(c). Once the TDW configuration setting process is complete, due to reciprocity, the configuration set (with values) is stored and used during actual operation of any signal directional path (i.e., bidirectional). Thus, bidirectional signals can thereby be facilitated by alignment and assembly according to the example implementations described herein.

[0059] As described herein, example implementations may involve a system configured to redirect light between a connector connected to a printed optical board (POB) via an optical waveguide and a photonic integrated circuit (PIC) package, the system involving one or more two-dimensional distributed wave plates (TDWs), each of the one or more TDWs having a plurality of layers of p-doped and n-doped silicon, the one or more TDWs being configured to be driven to change a dielectric constant at a two-dimensional location on the one or more TDWs so that light received at the one or more TDWs is redirected toward a vertical grating coupler at the two-dimensional location. The vertical grating coupler may be disposed at the connector or the PIC package.

[0060] As described herein, one or more TDWs can be configured to be driven by a change in voltage, an ultrasonic signal, and / or electro-optic surface plasmons to change the dielectric constant at a desired two-dimensional location on the one or more TDWs. Depending on the desired implementation, the change in the dielectric constant can redirect the received light substantially orthogonal to the TDW, or can be used to form an angled Gaussian beam directed toward a lens.

[0061] As described herein, one or more TDWs may be disposed in a connector and connected to a single-mode waveguide. In such an example implementation, the one or more TDWs are configured to be driven to change a dielectric constant at a two-dimensional location such that light received from the single-mode waveguide is redirected substantially orthogonally at the two-dimensional location toward a vertical grating coupler disposed in a PIC package. In such an example implementation, one or more photodiode sensors may be disposed on the connector and positioned to receive light reflected off the PIC package from redirected light transmitted from the one or more TDWs to determine alignment calibration. Depending on the desired implementation, a waveguide tap monitor having one or more photodiode sensors may be configured to measure light received by the PIC package to determine a maximum signal value when determining proper alignment.

[0062] As described herein, one or more TDWs may be disposed in a PIC package. In such an example implementation, the one or more TDWs may be configured to be driven to change a dielectric constant at a two-dimensional location such that light received from the PIC package is redirected substantially orthogonally at the two-dimensional location toward a vertical grating coupler such as disposed in the connector. In such an example implementation, one or more photodiode sensors may be disposed on the PIC package and positioned to receive light reflected away from the connector from the redirected light transmitted by the one or more TDWs to determine alignment calibration. Depending on the desired implementation, a waveguide tap monitor having one or more photodiode sensors may also be used to measure the light received by the connector once proper alignment is determined.

[0063] As described herein, example implementations may also involve a lens inserted between the PIC package and the connector, the lens being configured to focus redirected light from one or more TDWs toward a vertical grating coupler (disposed in the connector or in the PIC package); wherein one or more TDWs are configured to be driven to change a dielectric constant at a two-dimensional location such that light received at the one or more TDWs is redirected toward the lens as an angled Gaussian beam at the two-dimensional location.

[0064] As described herein, one or more TDWs may be disposed in a connector and connected to a single-mode waveguide. In such an example implementation, the one or more TDWs are configured to be driven to change a dielectric constant at a two-dimensional location such that light received from the single-mode waveguide is redirected toward a lens at a two-dimensional location as an angled Gaussian beam such that the lens redirects the angled Gaussian beam toward a vertical grating coupler disposed in the PIC package to be substantially orthogonal to the light received from the single-mode waveguide. In such an example implementation, one or more photodiode sensors may be disposed on the connector and positioned to receive light reflected off the PIC package from the redirected light transmitted from the one or more TDWs to determine alignment calibration. Depending on the desired implementation, a waveguide tap monitor having one or more photodiode sensors may be used to measure the light received by the PIC package to determine a maximum signal value.

[0065] As described herein, one or more TDWs are disposed in a PIC package. In such an example implementation, the one or more TDWs may be configured to be driven to change a dielectric constant at a two-dimensional location such that light received from the PIC package is redirected toward a lens at the two-dimensional location as an angled Gaussian beam such that the lens redirects the angled Gaussian beam toward a vertical grating coupler disposed in the connector to be substantially orthogonal to the light received from the PIC package. In such an example implementation, one or more photodiode sensors may be disposed on the PIC package and positioned to receive light reflected away from the connector from the redirected light transmitted from the one or more TDWs to determine alignment calibration. Depending on the desired implementation, a waveguide tap monitor having one or more photodiode sensors may be configured to measure the light received by the connector to determine a maximum signal value.

[0066] As described herein, multiple layers of p-doped and n-doped silicon may be arranged in a staggered configuration indicating a plausible two-dimensional location.

[0067] In addition, other implementations of the present application will be apparent to those skilled in the art in view of the description and practice of the teachings of the present application. Various aspects and / or components of the described example implementations may be used alone or in any combination. The description and example implementations are intended to be considered as examples only, and the true scope and spirit of the present application are indicated by the appended claims.

Claims

1. A system configured to redirect light between a connector connected to a printed optical board (POB) via an optical waveguide and a photonic integrated circuit (PIC) package, the system comprising: one or more two-dimensional distributed wave plates TDW, each of the one or more TDWs comprising a plurality of layers of p-doped and n-doped silicon, the one or more TDWs being configured to be driven to change a dielectric constant at a two-dimensional location on the one or more TDWs such that light received at the one or more TDWs is redirected towards a vertical grating coupler at the two-dimensional location, Therein, each of the plurality of layers of p-doped and n-doped silicon is individually defined by an associated distribution function of a dielectric constant.

2. The system according to claim 1, wherein: The one or more TDWs are configured to be driven by a change in voltage.

3. The system according to claim 1, wherein: The one or more TDWs are configured to be driven by an ultrasonic signal.

4. The system according to claim 1, wherein: The one or more TDWs are configured to be driven by electro-optical surface plasmons.

5. The system according to claim 1, wherein: The one or more TDWs are disposed in the connector and connected to the single mode waveguide; wherein the one or more TDWs are configured to be driven to change the dielectric constant at the two-dimensional location such that light received from the single-mode waveguide is redirected substantially orthogonally toward the vertical grating coupler at the two-dimensional location; Wherein, the vertical grating coupler is arranged in the PIC package.

6. The system of claim 5, further comprising one or more photodiode sensors disposed on the connector, the one or more photodiode sensors being positioned to receive light reflected off the PIC package from the redirected light transmitted by the one or more TDWs.

7. The system of claim 5, further comprising a waveguide tap monitor comprising one or more photodiode sensors, the waveguide tap monitor configured to measure light received by the PIC package.

8. The system according to claim 1, wherein: The one or more TDWs are disposed in the PIC package; wherein the one or more TDWs are configured to be driven to change the dielectric constant at the two-dimensional location such that light received from the PIC package is redirected substantially orthogonally toward the vertical grating coupler at the two-dimensional location; Wherein, the vertical grating coupler is arranged in the connector.

9. The system of claim 8, further comprising one or more photodiode sensors disposed on the PIC package, the one or more photodiode sensors being positioned to receive light reflected off the connector from the redirected light transmitted by the one or more TDWs.

10. The system of claim 8, further comprising a waveguide tap monitor comprising one or more photodiode sensors, the waveguide tap monitor configured to measure light received by the connector.

11. The system of claim 1 , further comprising: a lens interposed between the PIC package and the connector, the lens configured to focus redirected light from the one or more TDWs toward the vertical grating coupler; Wherein the one or more TDWs are configured to be driven to change the dielectric constant at the two-dimensional location so that light received at the one or more TDWs is redirected as an angled Gaussian beam at the two-dimensional location toward the lens.

12. The system according to claim 11, wherein: The one or more TDWs are disposed in the connector and connected to the single mode waveguide; wherein the one or more TDWs are configured to be driven to change the dielectric constant at the two-dimensional location such that light received from the single-mode waveguide is redirected as the angled Gaussian beam toward the lens at the two-dimensional location such that the lens redirects the angled Gaussian beam toward the vertical grating coupler to be substantially orthogonal to light received from the single-mode waveguide; Wherein, the vertical grating coupler is arranged in the PIC package.

13. The system of claim 12, further comprising one or more photodiode sensors disposed on the connector, the one or more photodiode sensors being positioned to receive light reflected off the PIC package from the redirected light transmitted by the one or more TDWs.

14. The system of claim 12, further comprising a waveguide tap monitor comprising one or more photodiode sensors, the waveguide tap monitor configured to measure light received by the PIC package.

15. The system according to claim 11, wherein: The one or more TDWs are disposed in the PIC package; wherein the one or more TDWs are configured to be driven to change the dielectric constant at the two-dimensional location such that light received from the PIC package is redirected as the angled Gaussian beam toward the lens at the two-dimensional location such that the lens redirects the angled Gaussian beam toward the vertical grating coupler to be substantially orthogonal to light received from the PIC package; Wherein, the vertical grating coupler is arranged in the connector.

16. The system of claim 15, further comprising one or more photodiode sensors disposed on the PIC package, the one or more photodiode sensors being positioned to receive light reflected off the connector from the redirected light transmitted by the one or more TDWs.

17. The system of claim 12, further comprising a waveguide tap monitor comprising one or more photodiode sensors, the waveguide tap monitor configured to measure light received by the connector.

18. The system of claim 1, wherein: The multiple layers of p-doped and n-doped silicon are arranged in a staggered configuration indicating a plausible two-dimensional position.

19. A system for redirecting light, comprising: a connector configured to be connected to a printed optical board POB via an optical waveguide; Photonic integrated circuit PIC packaging; as well as one or more two-dimensional distributed wave plates TDW, the one or more TDWs configured to redirect light between the connector and the PIC package, each of the one or more TDWs comprising a plurality of layers of p-doped and n-doped silicon, the one or more TDWs configured to be driven to change the dielectric constant at a two-dimensional location on the one or more TDWs so that light received at the one or more TDWs is redirected towards a vertical grating coupler at the two-dimensional location, Therein, each of the plurality of layers of p-doped and n-doped silicon is individually defined by an associated distribution function of a dielectric constant.

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