Chip module and card

Abstract

The application discloses a chip module and a card. The chip module provided by the application comprises a conductive sheet, a circuit board, a chip and a coil, the conductive sheet is packaged on the first side of the circuit board, and the chip and the coil are electrically connected to the second side of the circuit board. According to the application, the chip module comprises the coil, the conductive sheet and the chip and is electrically connected to the circuit board, when the coil is close to a card reader, current is induced under the magnetic field of the card reader to supply power to the circuit board, the card reader reads and writes the storage information in the chip module to realize non-contact communication; when the conductive sheet is in contact with the card reader to supply power, the circuit board is supplied with power, the card reader reads and writes the storage information in the chip module to realize contact communication, so that the non-contact communication function and the contact communication function are realized simultaneously through the chip module, and the integration of the chip module is improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of smart cards, and particularly relates to a chip module and a card. BACKGROUND

[0002] With the development of smart cards, two interactive communication modes of contactless communication and contact communication are gradually integrated into a single card, which is called a dual-interface card, a combination card or a dual-port card.

[0003] At present, the components for realizing the communication function in the dual-interface card include a first element for realizing the contactless communication function and a second element for realizing the contact communication function. The first element and the second element are arranged at different positions of the card body and need to be electrically connected. The first element is arranged in the card body, and the second element is arranged in the chip module. When the chip module is installed in the card body, the first element and the second element are in contact. The contact connection of the first element and the second element is completed in the process of installing the chip module in the card body, and the stability of the electrical connection of the first element and the second element needs to be improved.

[0004] Therefore, how to further improve the integration of the communication function components has become a problem to be solved in the field. SUMMARY

[0005] The embodiments of the present application provide a chip module and a card, which can improve the integration of the communication function components.

[0006] In one aspect, the embodiments of the present application provide a chip module, which includes a conductive sheet, a circuit board, a chip and a coil. The conductive sheet is packaged on the first side of the circuit board, and the chip and the coil are electrically connected to the second side of the circuit board.

[0007] In another aspect, the embodiments of the present application provide a card, which includes a card body and the above-mentioned chip module. The chip module is installed in the card body, and the conductive sheet is exposed to the outer surface of the card body.

[0008] The chip module and the card of the embodiments of the present application, by including the coil, the conductive sheet and the chip and being electrically connected to the circuit board, when the coil is close to the card reader, an electric current is induced under the magnetic field of the card reader to power the circuit board, the card reader reads and writes the storage information in the chip module to realize the contactless communication; when the conductive sheet is in contact with the card reader to be powered, the circuit board is powered, the card reader reads and writes the storage information in the chip module to realize the contact communication, so that the chip module simultaneously realizes the contactless communication function and the contact communication function, and the integration of the chip module is improved. BRIEF DESCRIPTION OF DRAWINGS

[0009] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly introduced. Those drawings can help the ordinary skilled in the art to obtain other drawings without any creative effort.

[0010] Figure 1 Front view of a chip module according to some embodiments of the present application;

[0011] Figure 2 Bottom view of a chip module according to some embodiments of the present application;

[0012] Figure 3 Top view of a chip module according to some embodiments of the present application;

[0013] Figure 4 Sectional view of a card according to some embodiments of the present application;

[0014] Figure 5 Sectional view of a card according to some other embodiments of the present application;

[0015] Figure 6 Sectional view of a card according to some other embodiments of the present application;

[0016] Figure 7 Top view of a card body according to some embodiments of the present application;

[0017] Figure 8 Top view of a card body according to some other embodiments of the present application;

[0018] Figure 9 Sectional view of a card according to some embodiments of the present application;

[0019] Figure 10 Sectional view of a card body according to some other embodiments of the present application;

[0020] Figure 11 Top view of a card according to some embodiments of the present application.

[0021] Explanation of reference signs:

[0022] 1, chip module; 11, conductive sheet; 111, contact sheet; 12, circuit board; 13, chip; 14, coil;

[0023] 2, card base; 210, stepped hole; 211, first hole section; 212, second hole section; 213, embedding layer; 214, filling layer; 216, first wave-absorbing layer; 217, first opening; 200, substrate layer; 201, protective film layer; 22, mounting layer; 23, second wave-absorbing layer; 24, metal layer; 241, second opening; 25, adhesive layer; 251, first adhesive layer;

[0024] 3. frame; 31. fracture. DETAILED DESCRIPTION

[0025] In order to make the purposes, technical solutions, and advantages of the present application clearer, further understand the present application, the features and exemplary embodiments of various aspects of the present application will be described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, but not to limit the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0026] It should be noted that, in this paper, such as the first and second relationship terms are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the term "include", "contain" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent in such process, method, article or equipment. Without more limitations, the elements defined by the statement "include" do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

[0027] Embodiment one

[0028] As Figure 1 shown, the present application provides a chip module, the chip module 1 includes a conductive sheet 11, a circuit board 12, a chip 13 and a coil 14, the conductive sheet 11 is electrically connected to the first side of the circuit board 12, the chip 13 and the coil 14 are electrically connected to the second side of the circuit board 12. The circuit board 12 is provided with printed circuit, the conductive sheet 11, the chip 13 and the coil 14 can be electrically connected with the printed circuit of the circuit board 12. The chip 13 is generally located within the area surrounded by the coil 14.

[0029] When the coil 14 approaches the card reader, the coil 14 generates current under the action of the magnetic field of the card reader, and supplies power to the circuit board 12, the card reader reads and writes the storage information in the chip module 1, and realizes non-contact communication. When the conductive sheet 11 is in contact with the card reader and is powered on, it supplies power to the circuit board 12, and the card reader reads and writes the storage information in the chip module, and realizes contact communication.

[0030] The chip module 1 provided by the embodiment of the present application integrates the coil 14 and the chip 13 in the chip module 1, and can realize non-contact communication and contact communication by the single chip module 1, can reduce the design requirement of the card body provided with the chip module 1, simplify the structure of the card body, and thus simplify the production process of the card body.

[0031] In the embodiment, the first side is the upper side in the drawing, and the second side is the lower side in the drawing.

[0032] In some embodiments, the circuit board 12 contains or is made of wave-absorbing material. The wave-absorbing material can be at least one of ferrite, amorphous iron-carbon mixture and nanocrystalline iron-carbon mixture. When the chip module 1 is close to the magnetic field of the card reader, the conductive sheet 11 will generate eddy current under the action of the magnetic field of the card reader, and the eddy current formed in the conductive sheet 11 will generate an interference magnetic field. The circuit board 12 containing the wave-absorbing material can absorb the interference magnetic field generated by the conductive sheet 11, reduce the interference of the interference magnetic field on the coil 14, and thus ensure that the coil 14 can generate stable current and maintain good performance of non-contact communication. These embodiments are particularly suitable for metal card bodies, and of course are also suitable for card bodies made of other materials.

[0033] The chip module 1 provided by the embodiment of the present application is provided in a square or other conventional shape, can also be provided in a circular, waist-shaped, irregular shape as shown in Figure 2 , or any other special shape. The specific shape of the chip module 1 depends on the shape of the circuit board 12.

[0034] Optionally, the coil 14 is arranged in a ring shape, and can be arranged in a square or circular shape.

[0035] Optionally, when the chip module 1 is close to the magnetic field of the card reader, the induced current generated by the coil 14 can supply non-contact communication. The larger the surrounding area of the coil 14, the greater the induced current generated by the coil 14. Therefore, the coil 14 is arranged close to the edge of the circuit board 12 to increase the surrounding area of the coil 14 as much as possible. When the circuit board 12 is special-shaped, the shape surrounded by the coil 14 is similar to the shape of the circuit board 12.

[0036] Optionally, to further increase the surrounding area of the coil 14, the size of the chip module 1 can be increased, so that the size of the chip module 1 is larger than that of the existing chip module.

[0037] The conductive sheet 11 is special-shaped, and the special-shaped conductive sheet 11 has a functional area and a non-functional area. The part in the functional area contacts the card reader to realize the communication function, Figure 3 The part shown by the dashed line in the functional area is the functional area of the conductive sheet 11 contacting the card reader.

[0038] Optionally, in combination with Figure 3As shown, the conductive sheet 11 includes a plurality of mutually independent contact pads 111, which are optionally six or eight. Each contact pad 111 is electrically connected to the circuit board 12, and at least a portion of each contact pad 111 is located in the functional area. The shape and size of the conductive sheet 11 can be any shape. Optionally, the shape and size of the conductive sheet 11 are substantially the same as the shape and size of the circuit board 12. The shape of each contact pad 111 can be any shape, and the arrangement of the six or eight contact pads 111 meets the standards specified by the ISO 7816 transmission protocol.

[0039] Embodiment Two

[0040] The embodiments of the present application provide a card, such as Figure 4 As shown, the card includes a card body and a chip module 1, which can be the chip module described in Embodiment One. The chip module 1 is installed in the card body, and the conductive sheet 11 is exposed to the first side surface of the card body. The coil 14 in the chip module 1 can be used to realize the non-contact communication function of the card, and the conductive sheet 11 exposed to the outer surface of the card body can be used to realize the contact communication function of the card.

[0041] The card body includes a card base 2, which is the main structure of the card body. The chip module 1 is installed in the card base 2, and the conductive sheet 11 is exposed to the first side surface of the card base 2.

[0042] As shown in Figure 4 The card base 2 is provided with a stepped hole 210 for installing the chip module 1. Along the direction from the first side of the card base 2 to the second side of the card base 2, the stepped hole 210 includes a first hole section 211 and a second hole section 212 that are in communication. The stepped hole 210 is provided on the first side surface of the card base 2, and the connection between the first hole section 211 and the second hole section 212 forms a step surface facing the first side of the card base 2.

[0043] Optionally, the cross sections of the first hole section 211 and the second hole section 212 are circular or square. The projections of the first hole section 211 and the second hole section 212 on the card base 2 at least partially coincide, and can be coaxially arranged.

[0044] When the chip module 1 is installed in the card base 2, the circuit board 12 is accommodated in the first hole section 211, the coil 14 and the chip 13 are accommodated in the second hole section 212, and the side surface of the circuit board 12 facing the step surface abuts against the step surface. The circuit board 12 is limited by the step surface between the first hole section 211 and the second hole section 212, thereby ensuring the stability of the chip module 1 in the card base 2.

[0045] Optionally, the first side surface of the conductive sheet 11 (i.e., the side surface of the conductive sheet 11 facing away from the circuit board 12) is flush with the first side surface of the card base 2, so as to improve the flatness of the card.

[0046] The material for making the card base 2 can be various. In some embodiments, the card base 2 is integrally formed by a metal material, which can improve the strength and texture of the card, and thus improve the durability and user experience of the card. In other embodiments, the card base 2 can be integrally formed by a plastic material such as PVC or PP.

[0047] In some embodiments, as shown in FIG. 2A, the stepped hole 210 is a through hole, and the stepped hole 210 penetrates the first side surface of the card base 2 and the second side surface of the card base 2. When the first side or the second side of the card faces the card reader, the magnetic lines in the magnetic field generated by the card reader can smoothly pass through the stepped hole 210, and the coil 14 can generate stable current, so that the card can maintain good non-contact communication. The card with this structure is suitable for the card base 2 made of metal material or other materials. Figure 4

[0048] Optionally, the second hole segment 212 is provided with an embedded layer 213, and the side surface of the embedded layer 213 away from the chip module 1 is flush with the second side surface of the card base 2, so as to improve the flatness of the card, and the embedded layer 213 can also protect the chip module 1. The embedded layer 213 can be made of a plastic material such as PVC, PET, PET-G or PC.

[0049] In other embodiments, as shown in FIG. 2B, the stepped hole 210 is a blind hole, and the stepped hole 210 is formed in the first side surface of the card base 2. At this time, the bottom of the stepped hole 210 can protect the chip module 1. Figure 5 Optionally, as shown in FIG. 2B, the stepped hole 210 is provided with a first wave-absorbing layer 216, and the first wave-absorbing layer 216 is located between the chip module 1 and the bottom of the stepped hole 210, and the first wave-absorbing layer 216 is made of a wave-absorbing material. The wave-absorbing material can be at least one of ferrite, amorphous iron-carbon mixture and nanocrystalline iron-carbon mixture. When the card base 2 is integrally formed by a metal material, the card base 2 close to the magnetic field of the card reader will generate eddy current under the action of the magnetic field of the card reader, which will greatly interfere with the current generated by the coil 14. The first wave-absorbing layer 216 can absorb the interference magnetic field generated by the part of the card base 2 located at the bottom of the stepped hole 210, reduce the influence of the interference magnetic field on the coil 14, and thus maintain the stability of the current generated by the coil 14 through electromagnetic induction, and improve the reliability of the non-contact performance of the card.

[0050] Figure 6

[0051] Optionally, as shown in FIG. 2B, the stepped hole 210 is provided with a first wave-absorbing layer 216, and the first wave-absorbing layer 216 is located between the chip module 1 and the bottom of the stepped hole 210, and the first wave-absorbing layer 216 is made of a wave-absorbing material. The wave-absorbing material can be at least one of ferrite, amorphous iron-carbon mixture and nanocrystalline iron-carbon mixture. When the card base 2 is integrally formed by a metal material, the card base 2 close to the magnetic field of the card reader will generate eddy current under the action of the magnetic field of the card reader, which will greatly interfere with the current generated by the coil 14. The first wave-absorbing layer 216 can absorb the interference magnetic field generated by the part of the card base 2 located at the bottom of the stepped hole 210, reduce the influence of the interference magnetic field on the coil 14, and thus maintain the stability of the current generated by the coil 14 through electromagnetic induction, and improve the reliability of the non-contact performance of the card. Figure 7 Figure 8 ​​​​As shown, the bottom of the stepped hole 210 is provided with a first opening 217, which penetrates the bottom of the stepped hole 210 and the second side surface of the card base 2. The first opening 217 can destroy the continuity of the part of the card base 2 at the bottom of the stepped hole 210, thereby destroying the interference magnetic field generated by the part of the card base 2 at the bottom of the stepped hole 210 in the process of approaching the magnetic field of the card reader, so as to reduce the interference current generated by the inductance of the coil and the interference magnetic field. Among the current generated by the electromagnetic induction of the coil 14, most of the stable induced current generated by the inductance of the coil is the inductance of the coil, which ensures the reliability of the non-contact performance of the card.

[0052] The first opening 217 can be of any shape. For example, the first opening 217 is provided with a plurality of first openings 217, which are independent of each other; or the projection of the first opening 217 on the card base 2 is a straight line or a curve.

[0053] Among them, the first opening 217 and the first wave-absorbing layer 216 can be provided at the same time.

[0054] Optionally, as shown in Figure 4 As shown, the second hole section 212 is provided with a filling layer 214, and the filling layer 214 abuts against the chip module 1. The filling layer 214 contains glue in its composition, which protects the chip module 1 by using the flexibility of the glue.

[0055] When the first wave-absorbing layer 216 is arranged in the second hole section 212, the filling layer 214 is filled between the chip module 1 and the first wave-absorbing layer 216. When the first wave-absorbing layer 216 is not arranged in the second hole section 212, the filling layer 214 is filled between the chip module 1 and the bottom of the stepped hole 210.

[0056] Optionally, as shown in Figure 4 , Figure 5 or Figure 6 As shown, the second side of the card base 2 is provided with a substrate layer 200. The substrate layer 200 is generally made of non-metallic material, and the side surface of the substrate layer 200 away from the card base 2 has a printed pattern or basic information of the card.

[0057] Optionally, the side surface of the substrate layer 200 away from the card base 2 is provided with a protective film layer 201 for protecting the substrate layer 200 and reducing the wear of the substrate layer 200.

[0058] In the above card structure, the card base 2 is of an integral structure, and the card base 2 is a basic component of the card. This type of card generally adopts a milling method to process the stepped hole 210 on the card base 2, then arranges the embedding layer 213 or the first wave-absorbing layer 216 in the second hole section 212, or processes the first opening 217, and finally fills the filling layer 214 into the stepped hole 210 and encapsulates the chip module 1 in the stepped hole 210.

[0059] In some embodiments, the card base 2 comprises a plurality of layer structures, and the card base 2 is formed by laminating the plurality of layer structures.

[0060] In some embodiments, the card base 2 comprises a mounting layer 22, and the stepped hole 210 is formed in the mounting layer 22. The mounting layer 22 is made of a metal material or a plastic material. The stepped hole 210 penetrates the mounting layer 22, and the chip module 1 is mounted in the stepped hole 210, and the first side surface of the conductive sheet 11 is flush with the first side surface of the mounting layer 22, so as to improve the flatness of the card.

[0061] In some embodiments, as shown in Figure 9 the card base 2 further comprises a second wave-absorbing layer 23 and a metal layer 24, and the mounting layer 22, the second wave-absorbing layer 23 and the mounting layer 22 are sequentially laminated. The second wave-absorbing layer 23 is made of a wave-absorbing material. When the card base 2 is close to the magnetic field of the card reader, the metal layer 24 generates eddy current to form an interference magnetic field, and the second wave-absorbing layer 23 can absorb the interference magnetic field generated by the metal layer 24, so as to reduce the interference current generated by the coil 14 in the chip module 1 due to the interference magnetic field, thereby improving the stability of the induced current generated by the coil 14 and improving the reliability of the non-contact communication of the card.

[0062] The mounting layer 22, the second wave-absorbing layer 23 and the metal layer 24 are adhesively fixed by using a glue layer 25. The glue layer 25 between the mounting layer 22 and the second wave-absorbing layer 23 is a first glue layer 251.

[0063] In some embodiments, the first glue layer 251 has a notch at a position corresponding to the second hole segment 212, so as to avoid interference between the first glue layer 251 and the chip 13 and the coil 14 in the chip module 1.

[0064] In other embodiments, the first glue layer 251 is a continuous layer structure, and no notch is formed at a position corresponding to the second hole segment 212. During the adhesion of the mounting layer 22 and the second wave-absorbing layer 23, the first glue layer 251 can use its own fluidity to adhere the chip 13 and the coil 14 to the first glue layer 251.

[0065] In other embodiments, as shown in Figure 10As shown, the card base 2 further comprises a metal layer 24, the mounting layer 22 and the metal layer 24 are arranged in a stack, the metal layer 24 is provided with a second opening 241 penetrating the metal layer 24, a projection of the second opening 241 on the metal layer 24 at least partially overlaps a projection of the stepped hole 210 on the metal layer 24. When the card base 2 is close to the magnetic field of the card reader, the metal layer 24 will generate eddy current, thereby forming an interference magnetic field. The second opening 241 can divide and destroy the interference magnetic field generated by the metal layer 24, thereby weakening the interference magnetic field, reducing the interference current generated by the coil 14 in the chip module 1 due to the interference magnetic field, thereby improving the stability of the induced current generated by the coil 14, and improving the reliability of the card non-contact communication.

[0066] The metal layer 24 and the mounting layer 22 are fixedly connected by the adhesive layer 25.

[0067] The second opening 241 can be of any shape. For example, the second opening 241 is provided with a plurality of second openings 241, and the plurality of second openings 241 are independent of each other; or, a projection of the second opening 241 on the card base 2 is a straight line or a curve.

[0068] Optionally, the second side of the card base 2 is provided with a substrate layer 200, the substrate layer 200 is adhered to the lower side of the metal layer 24 by the adhesive layer 25. The surface of the substrate layer 200 away from the metal layer 24 is provided with a protective film layer 201.

[0069] The structure of the card described above can be produced by lamination. In the forming process, the chip module 1 is first installed in the stepped hole 210 of the mounting layer 22, and then the adhesive layer 25 is coated between the layers of the card base 2, and the layers are stacked and laminated to form the card base 2 with the chip module 1.

[0070] In some embodiments, as shown in the drawings, Figure 11 As shown, the card further comprises a frame 3, the frame 3 wraps around the outer periphery of the card body to protect the card body. The frame 3 can be made of metal material, and the frame 3 can be made to a standard size. The width of a single side of the frame 3 is generally 3mm to 8mm, and other sizes can also be selected. The size of the card body can be calculated according to the size of the frame 3 to ensure that the card body can be stably fixed in the frame 3.

[0071] Optionally, the frame 3 has a break 31. The break 31 divides the frame 3 into a discontinuous ring structure, so as to wrap the frame 3 around the outer periphery of the card body.

[0072] Optionally, the frame 3 is provided with a second coil, and a projection of the chip module 1 on the card body falls within a projection of the second coil on the card body.

[0073] The above merely preferred embodiments of the present application and are not intended to limit the patent scope of the present application, any equivalent structure or equivalent process transformation using the content of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A card, characterized in that The chip module (1) is installed in the card base (2), the chip module (1) comprises a conductive sheet (11), a circuit board (12), a chip (13) and a coil (14), the conductive sheet (11) is electrically connected to the first side of the circuit board (12), the chip (13) and the coil (14) are electrically connected to the second side of the circuit board (12), and the conductive sheet (11) is exposed to the first side surface of the card base (2); The card base (2) is provided with a stepped hole (210) for installing the chip module (1); The card base (2) comprises a mounting layer (22) and a metal layer (24), the stepped hole (210) is arranged in the mounting layer (22), the mounting layer (22) and the metal layer (24) are arranged in layers, the metal layer (24) is provided with a second opening (241), the second opening (241) penetrates the metal layer (24), and the projection of the second opening (241) at least partially overlaps the projection of the stepped hole (210) in a direction perpendicular to the card base (2).

2. The card of claim 1, wherein, In a direction from the first side of the card base (2) to the second side of the card base (2), the stepped hole (210) comprises a first hole section (211) and a second hole section (212) in communication, and a connecting portion between the first hole section (211) and the second hole section (212) forms a stepped surface facing the first side of the card base (2).

3. The card of claim 2, wherein, The stepped hole (210) is a through hole, and the stepped hole (210) penetrates the first side surface of the card base (2) and the second side surface of the card base (2).

4. The card of claim 3, wherein, The second hole section (212) is provided with an embedded layer (213), and a side surface of the embedded layer (213) away from the chip module (1) is flush with the second side surface of the card base (2).

5. The card of claim 2, wherein, The stepped hole (210) is a blind hole, and the stepped hole (210) is arranged in the first side surface of the card base (2).

6. The card of claim 5, wherein, The card base (2) is integrally formed by a metal material, the stepped hole (210) is provided with a first wave-absorbing layer (216), the first wave-absorbing layer (216) is located between the chip module (1) and the bottom of the stepped hole (210), and the first wave-absorbing layer (216) is made of a wave-absorbing material.

7. The card of claim 5, wherein, The card base (2) is integrally formed by a metal material, the bottom of the stepped hole (210) is provided with a first opening (217), and the first opening (217) penetrates the bottom of the stepped hole (210) and the second side surface of the card base (2).

8. The card of claim 7, wherein, The first opening (217) is provided with a plurality of first openings (217), and the plurality of first openings (217) are independent of each other. Alternatively, the projection of the first opening (217) on the card base (2) is a straight line or a curve.

9. The card of claim 2, wherein, The second hole section (212) is provided with a filling layer (214), and the filling layer (214) abuts against the chip module (1).

10. The card of claim 1, wherein, The card base (2) further comprises a second wave-absorbing layer (23) and a metal layer (24), the mounting layer (22), the second wave-absorbing layer (23) and the metal layer (24) are sequentially stacked, and the second wave-absorbing layer (23) is made of or comprises a wave-absorbing material.

11. The card of claim 1, wherein, The card further comprises a frame (3) which surrounds the edge of the card body.

12. The card of claim 1, wherein, The circuit board (12) is made of or comprises a wave-absorbing material.

13. The card of claim 1, wherein, The conductive sheet (11) has a functional area, and the conductive sheet (11) comprises a plurality of independent contact sheets (111), and at least a part of each contact sheet (111) is located in the functional area.

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