Method for manufacturing a switching device, method for manufacturing an electrical component, and switching device

Abstract

An object of the present application is to suppress formation of a poor solder layer on a terminal surface. The present application relates to a manufacturing method of a switching device, a manufacturing method of an electrical component, and a switching device including a fixed contact provided in a housing, a terminal surface extending from the fixed contact to outside the housing, and a movable contact performing a contact separation operation with respect to the fixed contact, the manufacturing method of the switching device including a gold plating layer forming step of forming a first gold plating layer on the terminal surface, a solder sheet placement step of placing a solder sheet on a surface of the gold plating layer, and a preliminary solder layer forming step of forming a preliminary solder layer on the terminal surface by melting the solder sheet, wherein a ratio of a thickness of the first gold plating layer to a thickness of the solder sheet is 0.01 to 0.08:25.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a switching device, a method for manufacturing electrical components, and a switching device. Background Technology

[0002] Patent Document 1 discloses a technique for pre-plating tin on the terminal surfaces of a flat battery for welding.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Publication No. 6-80584

[0006] Conventionally, a method for forming a pre-solder layer on a terminal surface involves melting the solder sheet placed on the terminal surface via reflow. However, the inventors of this invention have discovered that when forming a pre-solder layer on a terminal surface using this method, poor formation of the pre-solder layer may occur. Summary of the Invention

[0007] In one embodiment of the manufacturing method of a switch device, the switch device includes: a fixed contact disposed within a housing; a terminal surface extending from the fixed contact to the outside of the housing; and a movable contact for performing contact separation action relative to the fixed contact. The manufacturing method of the switch device includes: a gold plating layer forming step, forming a first gold plating layer on the terminal surface; a solder sheet placement step, placing a solder sheet on the surface of the first gold plating layer; and a pre-solder layer forming step, forming a pre-solder layer on the terminal surface by melting the solder sheet, wherein the ratio of the thickness of the first gold plating layer to the thickness of the solder sheet is 0.01 to 0.08:25.

[0008] Invention Effects

[0009] According to a method for manufacturing a switching device according to one embodiment, poor formation of the pre-solder layer on the terminal face can be suppressed. Attached Figure Description

[0010] Figure 1 This is a perspective view of the switching device according to one embodiment.

[0011] Figure 2 This is a perspective view of the switching device according to one embodiment.

[0012] Figure 3 This is an exploded perspective view of a switching device according to one embodiment.

[0013] Figure 4 This is an exploded perspective view of a switching device according to one embodiment.

[0014] Figure 5This is a cross-sectional view along section A-A of a switching device according to one embodiment.

[0015] Figure 6 This is a perspective view of the first metal terminal component and the second metal terminal component included in a switching device according to one embodiment.

[0016] Figure 7 This is a perspective view of the first metal terminal component and the second metal terminal component included in a switching device according to one embodiment.

[0017] Figure 8 This is a flowchart illustrating the sequence of a method for manufacturing a switching device according to one embodiment.

[0018] Figure 9 This is a diagram illustrating an example of the formation area of ​​the gold plating layer and the pre-solder layer on the lower surface of the first metal terminal component and the second metal terminal component of a switching device according to an embodiment.

[0019] Figure 10 This is a diagram illustrating an example of a gold-plated layer formation area on the upper surface of a first metal terminal component and a second metal terminal component of a switching device according to an embodiment.

[0020] Figure 11 This figure shows an example of the stacked structure of a first terminal face and a second terminal face of a switching device according to one embodiment.

[0021] Figure 12 A diagram illustrating the implementation conditions and results of one embodiment.

[0022] In the picture:

[0023] 100 Switching device, 110 Housing, 110A Recess, 120 Frame, 120A Opening, 130 Core post, 131 Operating part, 134 Pressing part, 140 Metal contact, 151 First metal terminal component, 151A First fixed contact, 151B First terminal surface, 152 Second metal terminal component, 152A Second fixed contact, 152B Second terminal surface Detailed Implementation

[0024] Hereinafter, one embodiment will be described with reference to the accompanying drawings.

[0025] (Composition of the switching device 100)

[0026] Figure 1 as well as Figure 2 This is a perspective view of the external appearance of a switching device 100 according to one embodiment. Figure 3 as well as Figure 4 This is an exploded perspective view of a switching device 100 according to one embodiment. Figure 5 A-A cross-section of the switching device 100 according to one embodiment (refer to...) Figure 1 ) sectional view. Figure 6 as well as Figure 7 This is a perspective view of the first metal terminal component 151 and the second metal terminal component 152 included in a switching device 100 according to one embodiment.

[0027] Figure 1 The switch device 100 shown is a conductive path mounted on a circuit board and is used to switch the conductive path on the circuit board between a connected state and a disconnected state by manually switching between an open state and a closed state.

[0028] like Figures 1-4 As shown, the switching device 100 includes a housing 110, a first metal terminal component 151, a second metal terminal component 152, a stem 130, a metal contact 140, and a frame 120.

[0029] The housing 110 is a container-shaped component made of resin and having a cuboid shape. A recess 110A, recessed downwards from the upper surface of the housing 110, is formed in the center of the housing 110. The recess 110A has a circular shape when viewed from above. At the center of the inner bottom surface of the recess 110A, a first fixing contact 151A is exposed. At the outer periphery of the inner bottom surface of the recess 110A, a pair of second fixing contacts 152A are exposed, separated from the first fixing contact 151A.

[0030] A pair of first terminal surfaces 151B are provided on the bottom surface of the housing 110 for connecting the first fixed contact 151A to the outside. The pair of first terminal surfaces 151B are integrally formed with the first fixed contact 151A through a first metal terminal component 151, which is integrally formed with the housing 110 by insert molding.

[0031] Furthermore, a pair of second terminal surfaces 152B are provided on the bottom surface of the housing 110 for connecting a pair of second fixed contacts 152A to the outside. The pair of second terminal surfaces 152B are integrally formed with the pair of second fixed contacts 152A through a second metal terminal component 152, which is integrally formed with the housing 110 by insert molding.

[0032] In addition, both the first terminal surface 151B and the second terminal surface 152B are smooth planes and have a rectangular shape when viewed from above.

[0033] The core post 130 is a resin-made, disc-shaped component for the operator to press downwards. The core post 130 is disposed within a recess 110A of the housing 110 above the metal contact 140. An upwardly protruding operating portion 131 is provided at the center of the upper surface of the core post 130. The operating portion 131 is for the operator to press downwards. A downwardly protruding pressing portion 134 is provided at the center of the bottom surface of the core post 130. The pressing portion 134 is for pressing the top of the metal contact 140.

[0034] Metal contact 140 is an example of a "movable contact". Metal contact 140 is a component formed using a metal sheet. Viewed from above, metal contact 140 has a circular shape and a dome-shaped projection pointing upwards. Metal contact 140 is mounted on the inner bottom surface of a recess 110A in housing 110. The outer periphery of metal contact 140 is always in contact with the second fixed contact 152A.

[0035] Frame 120 is an annular component with a circular opening 120A. Frame 120 is located on the upper side of core post 130. Frame 120 can press the outer periphery of core post 130 from above by inserting the operating part 131 of core post 130 through the opening 120A. The outer peripheral edge of frame 120 is fixed to the inner peripheral surface of recess 110A in housing 110. Thus, frame 120 can restrict the upward movement of core post 130, preventing core post 130 from falling out of recess 110A.

[0036] For the switching device 100, if the operating part 131 of the core 130 is pressed, the core 130 moves downward, and the pressing part 134 of the core 130 presses the top of the metal contact 140. Furthermore, if the top of the metal contact 140 is reversed, the back side of the top of the metal contact 140 contacts the first fixed contact 151A. Thus, for the switching device 100, the first fixed contact 151A and the second fixed contact 152A are in a state of mutual conduction (switch open state) via the metal contact 140.

[0037] (Manufacturing method of switch device 100)

[0038] Next, refer to Figure 8 The manufacturing method of a switching device 100 according to one embodiment will be described. Figure 8 This is a flowchart illustrating the sequence of a manufacturing method for a switching device 100 according to one embodiment.

[0039] First, the first metal terminal component 151 and the second metal terminal component 152 are formed by stamping the base material (metal plate) (step S201: metal terminal component forming process). In this embodiment, phosphor bronze is used as the raw material of the base material (metal plate).

[0040] Next, a nickel plating layer is formed on the entire first metal terminal component 151 and the second metal terminal component 152 (step S202: nickel plating layer formation process).

[0041] Next, a gold plating layer is formed on a portion of the first metal terminal component 151 and the second metal terminal component 152 (step S203: gold plating layer formation process). Specifically, a second gold plating layer is formed on each of the first fixed contact 151A and a pair of second fixed contacts 152A. In addition, a first gold plating layer is formed on each of a pair of first terminal surfaces 151B and a pair of second terminal surfaces 152B.

[0042] In this embodiment, the thickness of the first gold plating layer is set such that the ratio of the thickness of the first gold plating layer to the thickness of the solder sheet is 0.01 to 0.08:25. In particular, in this embodiment, as a preferred example derived by the inventors, the thickness of the first gold plating layer is set to "0.01 μm to 0.08 μm".

[0043] Furthermore, in this embodiment, the thickness of the second gold plating layer is set to be greater than the thickness of the first gold plating layer. In particular, in this embodiment, as a preferred example derived by the inventors, the thickness of the second gold plating layer is set to "0.1 μm to 0.2 μm".

[0044] Next, the housing 110 is formed by inserting the first metal terminal component 151 and the second metal terminal component 152 (step S204: housing forming process).

[0045] Next, solder pads are placed on each of the pair of first terminal faces 151B and the pair of second terminal faces 152B (step S205: solder pad placement process). Specifically, solder pads of the same shape (i.e., rectangular shape in this embodiment) and size as the first terminal faces 151B and the second terminal faces 152B are placed in a manner that covers the entire first terminal face 151B and the second terminal face 152B.

[0046] In this embodiment, the thickness of the solder sheet is set such that the ratio of the thickness of the first gold plating layer to the thickness of the solder sheet is 0.01 to 0.08:25. In particular, in this embodiment, as a preferred example derived by the inventors, the thickness of the solder sheet is set to "10 μm to 25 μm".

[0047] Next, reflow is performed on each of the pair of first terminal faces 151B and the pair of second terminal faces 152B to melt the solder sheet, thereby forming a pre-solder layer (step S206: pre-solder layer formation process). Furthermore, while this process demonstrates a method of melting the solder sheet using reflow, it is not limited to this. For example, methods such as manually melting the solder sheet using a soldering iron, melting the solder sheet using heat press, jet soldering (spraying molten solder onto the terminals with hot air), and melting the solder by flowing high current to the terminals to heat them are also possible.

[0048] Finally, the various components (core 130, metal contact 140, and frame 120) are assembled into the housing 110 (step S207: assembly process). Thus, the switching device 100 is completed.

[0049] (An example of the area where the gold plating layer and the pre-solder layer are formed)

[0050] Figure 9 This is a diagram illustrating an example of the formation area of ​​the gold plating layer and the pre-solder layer on the lower surface of the first metal terminal component 151 and the second metal terminal component 152 of a switching device 100 according to an embodiment. Figure 10 This is a diagram illustrating an example of a gold-plated layer formation area on the upper surface of a first metal terminal component 151 and a second metal terminal component 152 included in a switching device 100 according to an embodiment.

[0051] like Figure 9 As shown, in this embodiment, a first gold plating layer is formed for each of a pair of first terminal surfaces 151B on the lower surface of the first metal terminal component 151 and a pair of second terminal surfaces 152B on the lower surface of the second metal terminal component 152, a solder sheet is placed on it, and the solder sheet is melted to form a pre-solder layer.

[0052] In addition, such as Figure 10 As shown, in this embodiment, a second gold plating layer with a thickness greater than the first gold plating layer is formed for each of the first fixed contact 151A on the upper surface of the first metal terminal component 151 and each of the pair of second fixed contacts 152A on the upper surface of the second metal terminal component 152.

[0053] (An example of the stacked structure of the first terminal face 151B and the second terminal face 152B)

[0054] Figure 11 This is a diagram illustrating an example of the stacked structure of a first terminal face 151B and a second terminal face 152B of a switching device 100 according to one embodiment. Figure 11This is an example of a stacked structure of a first terminal surface 151B and a second terminal surface 152B when a solder sheet is placed in a solder sheet placement process.

[0055] like Figure 11 As shown, a nickel plating layer is formed on the surface of the metal plate through the above-described nickel plating layer forming process on the first terminal surface 151B and the second terminal surface 152B (hereinafter referred to as "each terminal surface").

[0056] In addition, such as Figure 11 As shown, on each terminal face, a first gold plating layer is formed on the nickel plating layer through the above-mentioned gold plating layer forming process.

[0057] In addition, such as Figure 11 As shown, solder sheets are placed on the first gold plating layer on each terminal face through the above-described solder sheet placement process.

[0058] Here, as Figure 11 As shown, in this embodiment, as a preferred example, the thickness of the solder sheet is set to "25 μm". Furthermore, in this embodiment, as a preferred example, the thickness of the first gold plating layer is set to "0.01 μm to 0.08 μm". Therefore, in this embodiment, as a preferred example, the ratio of the thickness of the first gold plating layer to the thickness of the solder sheet is set to "0.01 to 0.08:25".

[0059] (Example)

[0060] Figure 12 The diagram illustrates the implementation conditions and results of one embodiment. In this embodiment, for each of the multiple embodiments (first embodiment to fifth embodiment) with different thicknesses of the first gold plating layer formed on the first terminal surface 151B and the second terminal surface 152B (hereinafter referred to as "terminal surface"), multiple pre-solder layers are formed by reflow, and the formation state of each of the multiple pre-solder layers is confirmed.

[0061] <Common Conditions>

[0062] The common conditions for all embodiments are as follows.

[0063] Solder sheet thickness: 25μm

[0064] • Number of pre-solder layers: 40

[0065] <Judgment Method>

[0066] In this embodiment, if the pre-solder layer is formed without defects on the entire terminal surface, it is judged as "good". Furthermore, in this embodiment, if there are defects in the pre-solder layer and part of the gold plating layer formed on the terminal surface (i.e., the nickel plating layer is exposed), it is judged as "bad (NG)".

[0067] <First Embodiment>

[0068] like Figure 12 As shown, in the first embodiment, the thickness of the first gold plating layer is arbitrarily set within the range of 0.01 to 0.03 μm to form 40 pre-solder layers. In the first embodiment, the number of pre-solder layers judged as "defective" is "0".

[0069] <Second Embodiment>

[0070] In addition, such as Figure 12 As shown, in the second embodiment, the thickness of the first gold plating layer is arbitrarily set within the range of 0.03 to 0.05 μm to form 40 pre-solder layers. In the second embodiment, the number of pre-solder layers judged as "defective" is "0".

[0071] <Third Embodiment>

[0072] In addition, such as Figure 12 As shown, in the third embodiment, the thickness of the first gold plating layer is arbitrarily set within the range of 0.03 to 0.07 μm to form 40 pre-solder layers. In the third embodiment, the number of pre-solder layers judged as "defective" is "0".

[0073] <Fourth Embodiment>

[0074] In addition, such as Figure 12 As shown, in the fourth embodiment, the thickness of the first gold plating layer is arbitrarily set within the range of 0.05 to 0.08 μm to form 40 pre-solder layers. In the fourth embodiment, the number of pre-solder layers judged as "defective" is "0".

[0075] <Fifth Embodiment>

[0076] In addition, such as Figure 12 As shown, in the fifth embodiment, the thickness of the first gold plating layer is arbitrarily set within the range of 0.06 to 0.10 μm to form 40 pre-solder layers. In the fifth embodiment, the number of pre-solder layers judged as "defective" is "3". This is because it is formed by gold melting into the solder when the solder sheet melts. If the concentration of AuSn becomes high, the solder becomes brittle, so a portion of the AuSn will peel off from the nickel plating layer due to the surface tension of the solder, thus presumably resulting in the exposure of the nickel plating layer.

[0077] Through this embodiment, it was confirmed that when the thickness of the solder sheet is set to "25μm", and the thickness of the first gold plating layer is set to "0.01μm to 0.08μm", there will be almost no poor formation of the pre-solder layer.

[0078] Therefore, it has been confirmed that in the manufacturing method of the switching device 100 according to one embodiment, by setting the thickness of the first gold plating layer and the solder sheet in a ratio of "0.01 to 0.08:25", it is possible to cover the entire terminal surface through the pre-solder layer without exposing the nickel plating layer, in a manner that causes almost no defects in the formation of the pre-solder layer on the terminal surface. Thus, according to the manufacturing method of the switching device 100 according to one embodiment, defects in the formation of the pre-solder layer on the terminal surface can be suppressed.

[0079] Furthermore, it has been confirmed that in the manufacturing method of the switch device 100 according to one embodiment, by setting the thickness of the first gold plating layer to "0.01 μm to 0.08 μm" and the thickness of the solder sheet to "25 μm", it is possible to cover the entire terminal surface with the solder layer without exposing the nickel plating layer, in a manner that almost no defects in the formation of the solder layer occur on the terminal surface. Therefore, according to the manufacturing method of the switch device 100 according to one embodiment, defects in the formation of the solder layer on the terminal surface can be suppressed.

[0080] Furthermore, the specific gravity of the gold plating is "16". Additionally, the specific gravity of the solder sheet is "7.4". Therefore, when the ratio of the thickness of the first gold plating layer to the thickness of the solder sheet is "0.01 to 0.08:25", the weight percentage of gold contained in the pre-solder layer formed on the terminal surface, obtained by the gold plating melting into the solder sheet during reflow, is "0.08 to 0.76% wt". Therefore, for a switch device 100 manufactured by the manufacturing method of one embodiment, the weight percentage of gold contained in the pre-solder layer formed on the terminal surface is "0.08 to 0.76% wt". Therefore, for a switch device 100 of one embodiment, it can be determined that when manufacturing the switch device 100, the ratio of the thickness of the first gold plating layer to the thickness of the solder sheet is determined to be "0.01 to 0.08:25", and poor formation of the pre-solder layer on the terminal surface during the manufacturing of the switch device 100 is suppressed.

[0081] Furthermore, in the manufacturing method of the switch device 100 according to one embodiment and in the switch device 100 according to another embodiment, the thickness of the second gold plating layer is greater than the thickness of the first gold plating layer. In particular, in the manufacturing method of the switch device 100 according to one embodiment and in the switch device 100 according to another embodiment, as a preferred example derived by the inventors, the thickness of the second gold plating layer is set to 0.1 μm to 0.2 μm. As a result, the manufacturing method of the switch device 100 according to one embodiment and the switch device 100 according to another embodiment can suppress poor contact of the metal contacts 140 at the first fixed contact 151A and the pair of second fixed contacts 152A where the second gold plating layer is formed.

[0082] Furthermore, in one embodiment of the manufacturing method of the switch device 100 and in one embodiment of the switch device 100, the thickness of the preferred solder sheet is set to "10μm to 25μm". As a result, the manufacturing method of the switch device 100 and in one embodiment of the switch device 100 can suppress the overflow of solder from the terminal surface, which is the cause of short circuits, and can achieve sufficient adhesion of the terminal surface obtained by the solder.

[0083] The present invention has been described in detail above, but the present invention is not limited to this embodiment. Various modifications or alterations can be made within the scope of the spirit of the present invention as set forth in the claims.

[0084] For example, the present invention is not limited to switching devices, but can be applied to any electrical component as long as it forms a pre-solder layer at least on the terminal face.

Claims

1. A method for manufacturing a switching device, the switching device comprising: Fixed contacts are located inside the housing; terminal surface extending from the fixed contact to the outside of the housing; as well as The movable contact performs a contact separation action relative to the aforementioned fixed contact. Its features are, The manufacturing method of the above-mentioned switching device includes: In the gold plating layer formation process, a first gold plating layer is formed on the aforementioned terminal surface; The solder pad placement process involves placing a solder pad on the surface of the first gold plating layer; and The pre-solder layer formation process is performed immediately after the solder pad placement process by melting the solder pad to form a pre-solder layer on the terminal surface. The ratio of the thickness of the first gold plating layer to the thickness of the solder sheet is 0.01 to 0.08:

25. In the above-mentioned gold plating layer forming process, a second gold plating layer is formed at the above-mentioned fixed contact, and the thickness of the second gold plating layer is greater than the thickness of the first gold plating layer.

2. The method for manufacturing the switching device according to claim 1, characterized in that, The thickness of the aforementioned solder sheet is 10μm to 25μm.

3. The method for manufacturing the switching device according to claim 1 or 2, characterized in that, The thickness of the second gold plating layer is 0.1μm to 0.2μm.

4. A method of manufacturing an electrical component having a fixed contact provided in a housing and a terminal surface extending from the fixed contact to outside the housing, characterized by, The manufacturing method of the above-mentioned electrical components includes: In the gold plating layer formation process, a first gold plating layer is formed on the aforementioned terminal surface; The solder pad placement process involves placing a solder pad on the surface of the first gold plating layer; and The pre-solder layer formation process is performed immediately after the solder pad placement process by melting the solder pad to form a pre-solder layer on the terminal surface. The ratio of the thickness of the first gold plating layer to the thickness of the solder sheet is 0.01 to 0.08:

25. In the above-mentioned gold plating layer forming process, a second gold plating layer is formed at the above-mentioned fixed contact, and the thickness of the second gold plating layer is greater than the thickness of the first gold plating layer.

5. A switching device, characterized by have: Fixed contacts are located inside the housing; Terminal face, extending from the aforementioned fixed contact to the outside of the housing; and The movable contact performs a contact separation action relative to the aforementioned fixed contact. Among them, for the aforementioned terminal face, A pre-solder layer is formed on the first gold plating layer by melting. The gold content in the aforementioned pre-solder layer is 0.08–0.76% wt. A second gold plating layer is formed at the aforementioned fixed contact point. The thickness of the second gold plating layer is greater than the thickness of the first gold plating layer.

Images