Pick-up collets, pick-up devices and mounting devices

Abstract

The present invention provides a pickup collet, a pickup device, and an installation device that can pick up electronic components in a non-contact manner. The pickup collet (200) of the embodiment is a pickup collet (200) that sucks and holds an electronic component (2) and picks it up, and has a porous component (201). The porous component (201) has air permeability and ejects the supplied gas into the interior in a planar shape through the pores of the opposite surface (201a) facing the electronic component (2). A suction hole (201c) is provided in the porous component (201). The suction hole (201c) has an opening (201d) on the opposite surface (201a) and sucks the electronic component (2) by negative pressure. A non-supporting area is provided around the opening (201d) of the suction hole (201c). The non-supporting area does not support the electronic component (2) because the gas layer formed by ejecting the gas from the opposite surface (201a) does not support the electronic component (2).

Description

Technical Field

[0001] The present invention relates to a pickup collet, a pickup device and a mounting device. Background Art

[0002] When mounting electronic components such as semiconductor elements such as logic, memory, and image sensors on a substrate, the wafer on which the semiconductor elements are formed is cut into individual chips. These chips are then picked up one by one and transferred to the substrate for mounting.

[0003] One surface of the chip is a functional surface on which fine circuits are formed. If a member picked up during chip removal from a wafer comes into direct contact with the functional surface, the circuits may be damaged, and therefore there is a demand to avoid such contact.

[0004] Furthermore, the connection terminals on the chip surface are bonded to the connection terminals on the substrate facing each other. To ensure and improve the bonding between the connection terminals, the chip surface is sometimes treated with plasma or surface activation. To maintain the surface condition of the chip after such treatment, there is also a desire to avoid direct contact between the pickup component and the chip surface.

[0005] In order to meet the requirement of preventing the component from contacting the surface of the chip, the chip-holding surface of the collet, which is a component for picking up the chip, has been made into a tapered surface, so that the chip is held in a state where only the peripheral edge, not the surface of the chip, contacts the tapered surface of the collet (see Patent Document 1).

[0006] [Prior art literature]

[0007] [Patent Document]

[0008] [Patent Document 1] Japanese Utility Model Application Laid-Open No. 63-124746 Summary of the Invention

[0009] [Problems to be solved by the invention]

[0010] However, in conventional technologies like those described above, the chip's periphery also comes into contact with the collet. Therefore, contact with the chip's surface periphery can cause chip damage or cracking. Furthermore, contact between the chip and the collet inherently leads to the generation of particles. Therefore, a collet that can hold the chip's surface without contact is desired.

[0011] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a pickup collet, a pickup device, and a mounting device capable of picking up electronic components in a non-contact manner.

[0012] [Technical means to solve the problem]

[0013] The present invention is a picking-up barrel clamp for sucking, holding and picking up electronic components, comprising a porous component, wherein the porous component is air-permeable and the supplied gas is ejected into the interior in a planar shape through the fine pores on the opposing surface facing the electronic component, a suction hole is provided in the porous component, the suction hole has an opening on the opposing surface and sucks the electronic component by negative pressure, and an unsupported area is provided around the opening of the suction hole, wherein the unsupported area does not support the electronic component by forming a layer of gas by ejecting gas from the opposing surface.

[0014] In addition, the present invention is a picking device for picking up the electronic components from a sheet to which the electronic components are attached, comprising: the picking-up chuck; and a chuck moving mechanism, which enables the picking-up chuck to approach a position in the sheet where the electronic components can be sucked and held, and can peel off the sucked and held electronic components from the sheet and transfer them.

[0015] The mounting device of the present invention includes: the pickup device; a bonding head arranged to be movable relative to the pickup collet and receiving the electronic component from the pickup collet; and a mounting section that transfers the electronic component held by the bonding head to a substrate and mounts it.

[0016] [Effects of the Invention]

[0017] According to the pickup collet, the pickup device and the mounting device of the present invention, electronic components can be picked up in a non-contact manner. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a front view showing the transfer device and the mounting device of the embodiment.

[0019] Figure 2 It is a plan view showing a transfer device and an installation device according to an embodiment.

[0020] Figure 3 (A) is a cross-sectional schematic diagram showing the principle of holding electronic components using a pickup collet. Figure 3 (B) is a bottom side perspective view showing the base.

[0021] Figure 4 This is a bottom perspective view showing the pickup collet and the attachment and detachment section.

[0022] Figure 5 It is a perspective view showing the top side of the pickup collet and the attachment and detachment portion.

[0023] Figure 6 This is a block diagram showing the control device of the transfer device and the installation device.

[0024] Figure 7 This is a flowchart showing the procedure of the picking operation according to the embodiment.

[0025] Figure 8 (A)~ Figure 8 (D) is an explanatory diagram showing a picking action according to the embodiment.

[0026] Figure 9 It is a schematic cross-sectional view showing the suction force from the opening in the embodiment.

[0027] Figure 10 It is a schematic cross-sectional view showing a modified example in which the non-support region is used as the non-ejection portion.

[0028] Figure 11 It is a schematic cross-sectional view showing a modified example in which the non-support region is formed as a recessed portion.

[0029] Figure 12 It is a schematic cross-sectional view showing a modified example in which the non-support region is used as an inclined portion.

[0030] Figure 13 (A) Figure 13 (B) is a bottom view showing a modified example of the arrangement of the openings.

[0031] [Explanation of Symbols]

[0032] 1: Transfer device

[0033] 2: Electronic components

[0034] 10: Supply device

[0035] 11: Sheet

[0036] 12: Supply stage

[0037] 13: Stage moving mechanism

[0038] 20: Pickup device

[0039] 21: Pickup head

[0040] 22: Collet moving mechanism

[0041] 23: Direction conversion unit

[0042] 24: Sales promotion

[0043] 30: Carrying device

[0044] 31: Joint head

[0045] 31a: Nozzle

[0046] 32: Head moving mechanism

[0047] 50: Control device

[0048] 51: Supply device control unit

[0049] 52: Sales promotion control department

[0050] 53: Pickup control unit

[0051] 54: Bonding head control unit

[0052] 56: Substrate stage control unit

[0053] 57: Storage

[0054] 60: Substrate carrier

[0055] 61: Stage moving mechanism

[0056] 100: Installation

[0057] 200: Pick up collet

[0058] 201: Porous components

[0059] 201a: Facing surface

[0060] 201b: Back

[0061] 201c: Suction hole

[0062] 201d: Opening

[0063] 201e: Non-ejection part

[0064] 201f: Depression

[0065] 201g: inclined part

[0066] 202: Base

[0067] 202a: Air supply hole

[0068] 202b: Exhaust hole

[0069] 202c: Mounting hole

[0070] 221: Sliding mechanism

[0071] 221a, 321a: Support framework

[0072] 221b, 321b: guide rail

[0073] 221c, 321c: Sliders

[0074] 222, 322: lifting mechanism

[0075] 222a: Arm

[0076] 222b: Loading and unloading department

[0077] 222c: Pin

[0078] 241: Support

[0079] 321: Sliding mechanism

[0080] H1: Approaching position

[0081] H2: Peeling location

[0082] G: Gas

[0083] P1: Supply position

[0084] P2: Handover position

[0085] P3: Installation location

[0086] S01~S09: Steps DETAILED DESCRIPTION

[0087] The embodiments of the present invention will be described with reference to the accompanying drawings. The accompanying drawings are schematic diagrams, and the dimensions and ratios of the various parts are exaggerated for ease of understanding. Figure 1 and Figure 2 As shown, the pickup collet 200 of this embodiment is used in a transfer device 1 for electronic components 2. The transfer device 1 includes a pickup device 20, a loading device 30, and a control device 50. The pickup device 20 transfers the electronic components 2 to the loading device 30.

[0088] The electronic component 2 is, for example, a chip-shaped component. In this embodiment, the electronic component 2 is a semiconductor chip obtained by dividing a wafer into individual pieces. Furthermore, the mounting apparatus 100 is a device that mounts the electronic component 2 supplied from the supply apparatus 10 on a substrate via transfer using the transfer apparatus 1. Specifically, the mounting apparatus 100 includes, in addition to the components of the transfer apparatus 1, the supply apparatus 10 and a substrate stage 60 that supports the substrate.

[0089] The supply device 10 supplies electronic components 2 to the pickup device 20. The supply device 10 moves the electronic components 2 to be picked up to a supply position P1. The supply position P1 is the position where the pickup device 20 picks up the electronic components 2 to be picked up. The supply device 10 includes a supply stage 12 that supports a sheet 11 to which the electronic components 2 are attached, and a stage moving mechanism 13 that moves the supply stage 12. The stage moving mechanism 13 may be, for example, a linear guide that moves a slider on a guide rail using a ball screw mechanism driven by a servo motor.

[0090] Here, the sheet 11 to which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown). The electronic components 2 are arranged in a matrix on the sheet 11. In this embodiment, the electronic components 2 are arranged face-up with their functional surfaces exposed.

[0091] The supply stage 12 is a stage that horizontally supports the wafer ring to which the sheet 11 is attached. Specifically, the supply stage 12 supports the sheet 11 to which the electronic components 2 are attached via the wafer ring. The supply stage 12 is arranged to be movable horizontally by a stage moving mechanism 13. Because the sheet 11 is horizontally supported by the supply stage 12 and the stage moving mechanism 13, the sheet 11 and the electronic components 2 placed on the sheet 11 are also arranged to be movable horizontally.

[0092] Furthermore, if Figure 1 As shown, the horizontal direction in which the supply device 10 and the loading device 30 are arranged is called the X-axis direction, and the direction perpendicular to the X-axis is called the Y-axis direction. Furthermore, the direction perpendicular to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The "upward direction" refers to the direction of the side of the sheet 11 on which the electronic components 2 are placed, with the plane of the sheet 11 as the boundary. The "downward direction" refers to the direction of the side of the sheet 11 on which the electronic components 2 are not placed, with the plane of the sheet 11 as the boundary.

[0093] [Pickup device]

[0094] The pickup device 20 picks up the electronic component 2 from the supply device 10 and delivers the picked-up electronic component 2 to the loading device 30. The pickup device 20 includes a pickup collet 200, a collet moving mechanism 22, a direction changing unit 23, and a push-up pin 24.

[0095] like Figure 3 (A) Figure 3 (B)~ Figure 5 As shown, the pickup collet 200 is a member that sucks and holds the electronic component 2 and releases the suction and holding to release the electronic component 2. The pickup collet 200 includes a porous member 201 and a base 202.

[0096] The porous member 201 is a member that is air-permeable and supplies gas to the interior through the pores of the facing surface 201a that faces the electronic component 2. The porous member 201 of this embodiment is in the shape of a rectangular plate, and is densely and roughly evenly formed with interconnected microscopic spaces. The porous member 201 has air permeability due to this structure, but its conductivity is very low. Any one surface of the porous member 201 becomes the facing surface 201a. When gas is supplied to the interior from the back surface 201b on the opposite side of the facing surface 201a, gas is ejected from the densely and evenly distributed pores of the facing surface 201a. This ejection is essentially a planar ejection that extends across the entire surface of the ejected facing surface 201a. This ejection is extremely slow, almost like an oozing sensation, to the extent that the airflow can be slightly felt when approaching with a finger. Furthermore, the pores on surfaces other than the facing surface 201a and the back surface 201b may also be blocked.

[0097] The porous member 201 is a continuous structure in which the pores serving as the microscopic spaces inside are interconnected and gas can pass through the pores. Sintered metal, ceramics, resin, etc. can be used as such a porous member 201. Sintered metal is preferably used to prevent internal particles from separating and flowing out.

[0098] Furthermore, if Figure 3 (A) Figure 3 (B) and Figure 4 As shown, the porous member 201 is provided with a suction hole 201c. The suction hole 201c is a through hole having an opening 201d on the facing surface 201a and sucking the electronic component 2 by negative pressure. The suction hole 201c of this embodiment extends linearly from the center of the back surface 201b to the center of the facing surface 201a.

[0099] The base 202 is a member that covers the surface of the porous member 201 except for the facing surface 201a. In this embodiment, the base 202 is a rectangular box with an opening at the bottom. The porous member 201 is inserted through the opening of the base 202 with the bottom surface exposed as the facing surface 201a, assembled into the base 202, and fixed.

[0100] like Figure 3 (A) Figure 3 (B) and Figure 5As shown, an air supply hole 202a, an exhaust hole 202b, and a mounting hole 202c are provided on the top surface of the base 202. The air supply hole 202a is a through hole for supplying air to the porous member 201. The air supply hole 202a is formed at a position close to the outer edge of the base 202 due to the piping connected to the air supply hole 202a. The exhaust hole 202b is a through hole for generating a negative pressure at the opening 201d via the suction hole 201c. The exhaust hole 202b extends downward and is formed in a manner consistent with the suction hole 201c of the porous member 201. A space for gas retention is formed between the inner surface of the base 202 and the porous member 201 around the exhaust hole 202b. Furthermore, the exhaust hole 202b can also penetrate the suction hole 201c and reach the facing surface 201a. In this case, the suction hole 201c and the opening 201d of the porous member 201 are provided so as to be in close contact with the outside of the exhaust hole 202b reaching the facing surface 201a of the porous member 201. The mounting holes 202c are a pair of recessed holes for preventing displacement when connected to the collet moving mechanism 22.

[0101] The gas supply hole 202a is connected to a gas supply circuit via piping (not shown). The supply circuit comprises a gas supply source, a pump, a valve, and the like. Here, the gas supplied to the porous member 201 via the gas supply hole 202a is an inert gas. The exhaust hole 202b is connected to a negative pressure generating circuit comprising a vacuum pump, a valve, and the like via piping (not shown).

[0102] The collet moving mechanism 22 reciprocates the pickup head 21, equipped with the pickup collet 200, between the supply position P1 and the transfer position P2, and raises and lowers the pickup head 21 between the supply position P1 and the transfer position P2. The transfer position P2 is where the pickup device 20 transfers the electronic component 2 picked up at the supply position P1 to the bonding head 31, which functions as a receiving unit (described later). The supply position P1 and transfer position P2 primarily refer to positions in the X and Y axes, and not necessarily to positions in the Z axis.

[0103] In addition, even when referring to the position (height) in the Z-axis direction, the height has a predetermined width. The predetermined width includes the thickness of the electronic component 2, the distance to push the electronic component 2 upward, the distance to be able to adsorb the electronic component 2, etc. In particular, when referring to the position (height) in the Z-axis direction, at the supply position P1, the height at the approach position is set to H1, and the height at the peeling position is set to H2 (see Figure 8 (A)~ Figure 8 (D)).

[0104] The collet moving mechanism 22 has an arm 222a on which the pickup head 21 is mounted. The pickup collet 200 mounted on the pickup head 21 is moved by moving the arm 222a. A loading and unloading portion 222b is provided at the front end of the pickup head 21. The loading and unloading portion 222b includes a magnet inside, and uses the suction force of the magnet to adsorb and hold the base 202 of the pickup collet 200. Figure 4 and Figure 5 As shown, a pair of pins 222c are provided on the surface of the attachment portion 222b that contacts the base 202. The pins 222c engage with mounting holes 202c provided in the base 202, thereby preventing the pickup collet 200 from shifting relative to the attachment portion 222b. Furthermore, although not shown, the piping connected to the exhaust port 202b passes through the attachment portion 222b, and the piping connected to the air supply port 202a is supported by the attachment portion 222b.

[0105] The collet moving mechanism 22 includes a sliding mechanism 221 and a lifting mechanism 222. The sliding mechanism 221 reciprocates the pickup collet 200 between the supply position P1 and the delivery position P2 by moving the arm 222a to which the pickup head 21 is mounted. The sliding mechanism 221 comprises a guide rail 221b extending parallel to the X-axis and fixed to the support frame 221a, and a slider 221c that travels on the guide rail 221b. Although not shown, the slider 221c is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

[0106] The lifting mechanism 222 moves the pickup collet 200 in the vertical direction by moving the arm 222a to which the pickup head 21 is mounted. Specifically, the lifting mechanism 222 may use a linear guide that moves the slider on the guide rail via a ball screw mechanism driven by a servo motor. In other words, the pickup collet 200 is raised and lowered along the Z-axis by the servo motor. Furthermore, the pickup collet 200 is elastically supported by the pickup head 21 via the loading and unloading portion 222b and is configured to slide up and down relative to the pickup head 21 in the Z-axis direction. Furthermore, the pickup head 21 has a sensor that detects the movement of the slider.

[0107] The direction-changing unit 23 is provided between the pickup collet 200 and the collet moving mechanism 22. Here, the direction-changing unit 23 is an actuator comprising a drive source such as a motor for changing the orientation of the pickup collet 200, and a rotating guide such as a ball bearing. The orientation of the pickup collet 200 is defined as the orientation from the base 202 side of the pickup collet 200 toward the facing surface 201a. Changing the orientation means rotating the collet 200 by 0° to 180° in the vertical direction. For example, the pickup collet 200 with the facing surface 201a facing the supply stage 12 adsorbs and holds the electronic component 2 at the supply position P1. Subsequently, the direction-changing unit 23 changes the orientation of the pickup collet 200 so that the adsorption surface faces upward. At this time, the rotation angle is 180°.

[0108] The push pin 24 is provided below the sheet 11 of the feeding device 10. The push pin 24 is a needle-shaped member with a sharp tip. The push pin 24 is provided inside the support body 241 so that its longitudinal direction is parallel to the Z-axis direction.

[0109] The support body 241 has a driving mechanism for moving the push pin 24 in and out of the support body or retracting the push pin 24 into the support body 241. The moving in and out or retracting is performed in the vertical direction. The driving mechanism includes, for example, a slider guided by a vertical guide rail and a cylinder or cam mechanism for driving the slider.

[0110] [Equipped device]

[0111] The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it on the substrate. The mounting position P3 is the position where the electronic component 2 is mounted on the substrate. The mounting device 30 includes a bonding head 31 and a head moving mechanism 32.

[0112] The bonding head 31 functions as a receiving unit that receives the electronic component 2 from the pickup collet 200 at the transfer position P2 and mounts the electronic component 2 on the substrate at the mounting position P3. The bonding head 31 holds the electronic component 2 and releases the holding state after mounting to release the electronic component 2.

[0113] Specifically, the bonding head 31 includes a nozzle 31a. The nozzle 31a holds the electronic component 2 and releases the held state, releasing the electronic component 2. The nozzle 31a includes a nozzle hole. The nozzle hole opens on the suction surface at the tip of the nozzle 31a. The nozzle hole is connected to a negative pressure generating circuit (not shown), such as a vacuum pump. This circuit generates negative pressure, which attracts and holds the electronic component 2 on the suction surface of the nozzle 31a. Furthermore, releasing the negative pressure releases the electronic component 2 from the suction surface.

[0114] The head moving mechanism 32 is a mechanism that reciprocates the bonding head 31 between the transfer position P2 and the mounting position P3 and moves it up and down between the transfer position P2 and the mounting position P3. Specifically, the head moving mechanism 32 includes a slide mechanism 321 and a lift mechanism 322.

[0115] The sliding mechanism 321 reciprocates the bonding head 31 between the handover position P2 and the mounting position P3. The sliding mechanism 321 comprises two guide rails 321b extending parallel to the X-axis and fixed to a support frame 321a, and a slider 321c that travels on the guide rails 321b. Although not shown, the slider 321c is driven by a ball screw driven by a rotary motor, a linear motor, or the like.

[0116] Furthermore, although not shown, the sliding mechanism 321 includes a sliding mechanism that allows the bonding head 31 to slide in the Y-axis direction. The sliding mechanism may also include a guide rail in the Y-axis direction and a slider that travels on the guide rail. The slider is driven by a ball screw driven by a rotary motor, a linear motor, or the like. The lifting mechanism 322 moves the bonding head 31 in the vertical direction. Specifically, the lifting mechanism 322 may use a linear guide that moves the slider on the guide rail via a ball screw mechanism driven by a servo motor. In other words, the bonding head 31 is raised and lowered along the Z-axis direction by the servo motor.

[0117] The substrate stage 60 is a stage that supports the substrate on which the electronic component 2 is mounted. The substrate stage 60 is mounted on a stage moving mechanism 61. The stage moving mechanism 61 is a moving mechanism that slides the substrate stage 60 in the XY plane and positions the electronic component 2 at the intended mounting position P3 on the substrate. For example, the stage moving mechanism 61 can utilize a linear guide in which a slider moves on a guide rail via a ball screw mechanism driven by a servo motor.

[0118] [Control device]

[0119] The control device 50 controls the start, stop, speed, action timing, etc. of the supply device 10, the pickup device 20, the loading device 30, and the substrate carrier 60. That is, the control device 50 is a control device for the transfer device 1 and the installation device 100. The control device 50 can be implemented, for example, by a dedicated electronic circuit or a computer that operates according to a prescribed program. An input device for the operator to input instructions or information required for control and an output device for confirming the status of the device are connected to the control device 50. The input device can use a switch, a touch screen, a keyboard, a mouse, etc. The output device can use a display unit such as a liquid crystal or an organic electroluminescence (EL).

[0120] Figure 6 This is a functional block diagram of the control device 50. The control device 50 includes a supply device control unit 51 that controls the supply device 10, a push pin control unit 52 and a pickup control unit 53 that control the pickup device 20, a bonding head control unit 54 that controls the mounting device 30, a substrate stage control unit 56 that controls the substrate stage 60, and a storage unit 57.

[0121] The supply device control unit 51 controls the movement of the supply stage 12 , that is, the movement of the electronic component 2 to be picked up placed on the sheet 11 . The push-up pin control unit 52 controls the movement of the push-up pin 24 , that is, the operation of the support 241 .

[0122] The pickup control unit 53 controls the movement of the pickup collet 200. Specifically, the pickup control unit 53 controls the operation of the collet moving mechanism 22 and the direction changing unit 23. Furthermore, the pickup control unit 53 controls the supply circuit connected to the air supply hole 202a and the negative pressure generating circuit connected to the air exhaust hole 202b, thereby controlling the holding and release of the electronic component 2.

[0123] The bonding head control unit 54 controls the movement of the bonding head 31, that is, the operation of the head movement mechanism 32. Furthermore, the bonding head control unit 54 controls the negative pressure generating circuit connected to the nozzle holes of the bonding head 31, thereby controlling the holding and release of the electronic component 2. The substrate stage control unit 56 controls the movement of the substrate stage 60, that is, the operation of the stage movement mechanism 61.

[0124] The storage unit 57 is a storage device that includes various memory devices (such as a hard disk drive (HDD) or a solid-state drive (SSD)) as recording media, as well as interfaces for recording media and external devices. The storage unit 57 pre-stores data and programs required for the operation of the transfer device 1, and also stores data required for the operation of the transfer device 1. This required data includes, for example, the gas supply rate, exhaust pressure, the position coordinates of the supply position P1, the transfer position P2, and the installation position P3, and the position coordinates of each moving mechanism. Each moving mechanism controls the movement of each structure based on these coordinates.

[0125] [Principle of suction and holding using a pickup collet]

[0126] Next, the principle of the electronic component 2 being sucked and held by the pickup collet 200 as described above will be described. Figure 3 As shown in (A), the gas G supplied from the gas supply hole 202a is ejected in a planar shape from the fine holes of the facing surface 201a, thereby forming a gas layer between the electronic component 2. The layer is, for example, 2μm to 10μm. Then, while negative pressure is applied to the suction hole 201c by the negative pressure generating circuit, the facing surface 201a is brought close to the electronic component 2, thereby sucking and holding the electronic component 2. At this time, a gas layer is formed between the facing surface 201a and the electronic component 2, so the facing surface 201a and the electronic component 2 maintain a non-contact state. In addition, by releasing the negative pressure generated by the negative pressure generating circuit, the negative pressure does not act on the suction hole 201c, and thus the electronic component 2 is released from the pickup collet 200.

[0127] [action]

[0128] Regarding the operation of picking up the electronic component 2 from the supply device 10 by the pickup device 20 and delivering the electronic component 2 to the loading device 30 in the transfer device 1 as described above, except for reference to Figures 1 to 6 In addition, refer to Figure 7 Flowchart, Figure 8 (A)~ Figure 8 The explanatory diagram of (D) is described below.

[0129] First, the pickup device 20 and the supply device 10 move the pickup collet 200 to the supply position P1 where the upper push pin 24 is located, so that the facing surface 201a of the pickup collet 200 faces the upper push pin 24 (step S01). At this time, pressurized gas is supplied to the porous member 201 through the air supply hole 202a, and the gas is blown out from the facing surface 201a. At this time, no exhaust is performed through the exhaust hole 202b, and no suction is performed through the opening 201d.

[0130] On the other hand, the supply device 10 moves the supply stage 12, as shown in FIG. Figure 8 As shown in (A), the electronic component 2 to be picked up is positioned at the supply position P1 (step S02). Afterwards, the pickup collet 200 supplied with gas G from the opposing surface 201a descends together with the pickup head 21 and approaches the electronic component 2. When the pickup collet 200 approaches the electronic component 2, the gas G on the opposing surface 201a is clamped by the opposing surface 201a and the electronic component 2 to form a gas layer. It is considered that the clamped gas layer at this time becomes a viscous flow layer. Therefore, the fluidity of the gas G in the gas layer itself is very poor, and there is almost no suction caused by exhaust from the exhaust hole 202b described later and no outflow from the outer edge of the gas layer. Then, as Figure 8 As shown in FIG. 5(B) , the pickup collet 200 stops descending relative to the electronic component 2 due to the gas layer that is no longer compressed (step S03 ).

[0131] Here, when the pickup collet 200 contacts the electronic component 2, the pickup collet 200 itself stops. Among them, the pickup collet 200 is elastically supported by the pickup head 21, so even if the pickup collet 200 stops, the pickup head 21 continues to descend, and the pickup head 21 slides relative to the pickup collet 200. When the sliding is detected by the sensor, the pickup control unit 53 recognizes that the pickup collet 200 is in contact with the electronic component 2 and stops the descent of the pickup head 21. At this time, the pickup collet 200 does not contact the electronic component 2. However, a gas layer is formed between the facing surface 201a and the electronic component 2, so the facing surface 201a does not get any closer to the electronic component 2 and stops. The height position of the pickup collet 200 at this time becomes the approach position H1. That is, the approach position H1 is not pre-set as a specific stop position.

[0132] In this manner, while the pickup collet 200 is stopped by the gas layer and the pickup head 21 is stopped, the gas is exhausted from the gas exhaust hole 202b, and suction is started through the suction hole 201c (step S04). That is, suction is started while the pickup collet 200 is pressing the electronic component 2 onto the sheet 11 supported by the support 241 through the gas layer, i.e., while the sheet 11 and the electronic component 2 are clamped between the pickup collet 200 and the support 241.

[0133] In the state described, Figure 8 As shown in (C), the pick-up collet 200 rises, and synchronously with this, the upward push caused by the rise of the push pin 24 starts (step S05). As a result, the sheet 11 starts to peel off from the back of the electronic component 2. Figure 8 As shown in (D), the pusher 24 stops when it has risen a predetermined amount. The electronic component 2, which is then drawn into the pickup collet 200 by negative pressure while maintaining the gap created by the gas layer, is peeled off from the sheet 11 and picked up (step S06). The height at which the electronic component 2 is completely peeled is the peeling position H2, but this is not a predetermined stop position.

[0134] The pickup device 20 uses the direction-changing unit 23 to reverse the pickup collet 200 (step S07). Specifically, the pickup collet 200 is rotated 180 degrees in the vertical direction, so that the facing surface 201a of the pickup collet 200 faces upward. While the reversal in step S07 is performed immediately after picking up the electronic component 2, it can also be performed at any point between the supply position P1 and the delivery position P2.

[0135] The pickup device 20 moves the picked-up electronic component 2 to the transfer position P2 using the collet moving mechanism 22 (step S08 ). At the transfer position P2 , the bonding head 31 of the mounting device 30 stands by, facing the facing surface 201 a of the pickup collet 200 via the electronic component 2 .

[0136] After the bonding head 31 is lowered toward the pickup collet 200 at the transfer position P2 and the electronic component 2 is held by the bonding head 31, the negative pressure in the pickup collet 200 is released, thereby transferring the electronic component 2 from the pickup collet 200 to the bonding head 31 (step S09). The bonding head 31 then ascends, moving away from the pickup collet 200, toward the mounting position P3, and mounts the electronic component 2 on the substrate.

[0137] [Effect]

[0138] (1) The pickup collet 200 of this embodiment is a pickup collet 200 that sucks and holds the electronic component 2 and picks it up. It has a porous member 201, and the porous member 201 is breathable and supplies gas to the inside through the fine pores of the facing surface 201a facing the electronic component 2. The porous member 201 is provided with a suction hole 201c having an opening 201d on the facing surface 201a for sucking the electronic component 2 to the facing surface 201a by negative pressure.

[0139] The pickup device 20 of this embodiment also includes a collet moving mechanism 22 that moves the pickup collet 200 to a position on the sheet 11 where it can suck and hold the electronic component 2 , thereby peeling the sucked and held electronic component 2 from the sheet 11 and transferring it.

[0140] Furthermore, the mounting device 100 of this embodiment includes: a bonding head 31, which is configured to be relatively movable relative to the pickup collet 200 and receives the electronic component 2 from the front end of the pickup collet 200; and a mounting portion, which transfers the electronic component 2 held by the bonding head 31 to the substrate and mounts it.

[0141] Therefore, when the electronic component 2 is picked up by suction from the suction hole 201c, the layer of gas exhausted from the pores of the porous member 201 prevents the electronic component 2 from coming into contact with the facing surface 201a, thereby suppressing damage to the electronic component 2. Furthermore, even when the electronic component 2 is being transferred, the possibility of damage to the electronic component 2 due to contact with the facing surface 201a is reduced, while the electronic component 2 is held and prevented from falling.

[0142] Here, we consider the following scenario: the gas exhausted from the space is caused to flow between the electronic component 2 and the surface facing the electronic component 2, thereby holding the electronic component 2 with a Bernoulli chuck that utilizes the negative pressure generated by the large airflow to generate suction force. In this case, the suction force is very weak. Even if the electronic component 2 can be held at a certain distance from the collet, it is impossible to obtain the suction force required to peel the electronic component 2 from the sheet 11. In addition, to achieve the Bernoulli effect, the gas flow rate per unit time must be very high, making it very difficult to adjust the suction force required to maintain contact while holding the electronic component 2. Furthermore, since a large amount of gas is blown around the pickup area, there is a concern that particles will be generated.

[0143] In addition, a gas ejection hole of the same size as the suction hole is provided on the surface of the collet facing the electronic component 2 instead of providing a fine hole like the porous member 201, and gas is ejected toward the electronic component 2 to make the electronic component 2 float. In the case where the electronic component 2 is to be sucked through the suction hole to counteract the floating force of the electronic component 2 caused by the ejection, as described above, it is very difficult to adjust the suction force for maintaining non-contact (floating) at the same time, and there is a concern that particles will be generated because a large amount of gas is blown toward the periphery of the pickup portion.

[0144] In contrast, in this embodiment, the flow rate of gas blown out in a planar manner from the entire facing surface 201a through the micropores of the facing surface 201a is extremely small. Therefore, there is no concern about the generation of particles. The blowing from the facing surface 201a does not actively float the electronic component 2, but rather forms a layer of gas in a viscous flow when the facing surface 201a and the electronic component 2 are close to each other. Therefore, the stronger the suction force, the easier it is to keep the facing surface 201a and the electronic component 2 in a non-contact state. Even if the suction force caused by the negative pressure from the suction hole 201c is set to be sufficient force to peel the electronic component 2 from the sheet 11, the layer of gas between the facing surface 201a and the electronic component 2 can prevent contact. Therefore, both obtaining a strong suction force and adjusting the suction force become easy.

[0145] Research conducted by the inventors of this application has revealed that, for example, the following conditions allow the pickup collet 200 to maintain non-contact with the electronic component 2 while performing suction and retention. First, a porous member 201 is used that has a gas flow rate of approximately 0.7 L / min at a supply pressure of 0.3 MPa. The pressure of the gas (nitrogen) supplied to the porous member 201 can be within a range of approximately 0.1 MPa to 0.7 MPa. In this case, the pickup collet 200 can reliably maintain non-contact with the electronic component 2 by maintaining the gas flow rate through the porous member 201 within a range of approximately 0.3 L / min to 1.5 L / min. Furthermore, the electronic component 2 can be reliably picked up from the sheet 11 by maintaining the suction pressure within a range of -10 kPa to -90 kPa. At this time, the pressure in the gas layer between the electronic component 2 and the facing surface 201 a can be 0.1 MPa to 0.5 MPa.

[0146] As a comparative example, a stainless steel (SUS) collet with the same dimensions as the pickup collet 200 and lacking pores was used. This collet had 50 holes with a diameter of 0.3 mm arranged in a matrix. When gas was supplied at a pressure of 0.02 MPa through the holes, the suction pressure was -50 kPa. The pressure between the electronic component 2 and the facing surface 201a, which maintained non-contact between the electronic component 2 and the facing surface 201a, was extremely low at 0.025 MPa to 0.035 MPa. The width of the pressure was also small. This indicates that, unlike the pores of the porous member 201, when gas is blown through the multiple holes formed in the collet, even with minimal pressure or suction, or even with slight changes in pressure or suction, the electronic component 2 is likely to come into contact with the facing surface. Furthermore, increasing the supply pressure to increase the pressure between the electronic component 2 and the facing surface 201a makes the electronic component 2 more likely to fall off.

[0147] (2) When facing surface 201a and electronic component 2 face each other, opening 201d is positioned within the projection plane of electronic component 2, i.e., at a position overlapping electronic component 2. In this embodiment, a single opening 201d communicating with suction hole 201c is provided at the center of facing surface 201a. This prevents gas from flowing in from the outer edges of electronic component 2, ensuring a strong suction force using atmospheric pressure. Furthermore, multiple openings 201d may be provided, and their positions are not limited to the center, as long as they are located at a position where facing surface 201a and electronic component 2 overlap.

[0148] [Modification]

[0149] The present invention is not limited to the above-described embodiment. The basic structure is the same as that of the above-described embodiment, and the following modified examples are also applicable.

[0150] (1) A non-supporting region may be provided around the opening 201d of the suction hole 201c, where the gas layer formed by ejecting the gas from the facing surface 201a does not support the electronic component 2. The reason for providing such a non-supporting region is as follows.

[0151] With the pickup collet 200 described above, the held electronic component 2 is susceptible to movement within the horizontal facing surface 201a. This can occur when the acceleration and deceleration of the electronic component 2 are increased, particularly during inversion, transfer, or handover. Furthermore, there is a risk that the component 2 may fall out of the device due to loss of grip.

[0152] Here, in the opening 201d portion where the suction force acts, a force is generated by the electronic component 2 being drawn toward the center of the opening 201d (being pushed from the outside). Figure 9As shown by the hatched arrows, the force acts as a bending stress on the electronic component 2. Figure 9 In FIG. 2 , for ease of understanding, the electronic component 2 is shown as deformed. It is preferable to set the suction force to a level that does not actually cause deformation. Even in this case, such a force acts on the electronic component 2.

[0153] When this stress acts, the electronic component 2 is attracted to the center of the opening 201d, and its movement in the direction parallel to the facing surface 201a is restricted, thereby reducing the displacement or deviation from the position where the electronic component 2 is temporarily held. It is believed that if the distance from the opening 201d to the position that becomes the stress fulcrum becomes longer, the force of attraction becomes greater. Here, the suction force in the opening 201d acts evenly on the entire area directly below the opening 201d. However, if Figure 9 As shown, in the area offset from directly below opening 201d, due to the presence of a layer of gas from facing surface 201a, the suction force is not exerted, and electronic component 2 is supported by the gas layer. Therefore, in this case, the edge of opening 201d becomes a stress support point. Therefore, by providing an area around opening 201d where there is no layer of gas ejection, i.e., a non-supporting area, the position of the stress support point is moved away from the center of opening 201d, thereby increasing the stress applied to electronic component 2.

[0154] More specifically, the area around the opening for sucking the electronic component 2 and not supporting the electronic component 2 with the gas layer is set as the non-support area. Figure 10 As shown, the non-ejection area 201e formed around the opening 201d of the facing surface 201a, where no gas is ejected, is formed as a non-support area. The non-ejection area 201e can be formed by embedding or covering a member or material having no ventilation portion that is concentric with the opening 201d.

[0155] In addition, the concave area of ​​the facing surface 201a is set as a non-support area. Figure 11 As shown, a recessed portion 201f formed around opening 201d on facing surface 201a is used as a non-supporting area. Recessed portion 201f can be formed by forming a portion concentrically concave with opening 201d. In this case, gas ejection also occurs in the non-supporting area, but the distance from electronic component 2 is longer than that on the surface where the gas layer is formed. Therefore, a fully compressed gas layer is not formed, and support is not provided by the gas layer.

[0156] Furthermore, the inclined area between the facing surface 201a and the opening 201d is set as a non-support area. Figure 12As shown, the inclined portion 201g between the facing surface 201a and the opening 201d is used as a non-support region. Inclined portion 201g can be formed by forming a tapered surface concentric with the opening 201d and extending downward from the opening 201d. In this case, gas ejection also occurs in the non-support region. However, compared to the surface where the gas layer is formed, a uniform thin gap is not formed, including the portion that is farther away from the electronic component 2. Therefore, a fully compressed gas layer is not formed, and support is not provided by the gas layer.

[0157] By setting the non-support area as described above, the stress of the electronic component 2 being pushed to the center of the opening 201d due to the suction from the opening 201d is increased. As a result, the movement of the electronic component 2 in the direction parallel to the facing surface 201a is restricted, so even without setting a special mechanism, the deviation or displacement from the position where the electronic component 2 is held can be reduced. During transfer, the deviation or drop can be further reduced. Furthermore, Figures 9 to 12 In the figure, the electronic component 2 is shown to be deformed. It is preferable to set the suction force to a level that does not actually deform. Even in the above case, this force acts on the electronic component 2. Figure 9 same.

[0158] (2) The shape or position of the suction hole 201c and the opening 201d is not limited to the above embodiment. As described above, the shape of the opening 201d can be circular, rectangular, or other elliptical, polygonal, rounded polygonal, star-shaped, etc. In the case of setting the non-support area as described above, when the opening 201d is set to a circle, the stress toward the center of the opening 201d will act evenly in all directions, thereby reducing the damage to the electronic component 2. In addition, when the opening 201d is rectangular, the stress from the two adjacent sides of the rectangle is concentrated on the part of the electronic component 2 corresponding to the corner of the rectangle. If the opening 201d is set to a polygonal shape, the damage caused by the concentration of stress can be reduced.

[0159] In addition, as described above, when there is one opening 201d in the center of the facing surface 201a, the electronic component 2 can be positioned in the center of the facing surface 201a. However, when there is one opening 201d in the center, the electronic component 2 may rotate in a direction parallel to the facing surface 201a. Therefore, it is preferable to provide a plurality of openings 201d, that is, at least two openings 201d, to suppress rotation. For example, Figure 13 (A) Figure 13 As shown in (B), it can also be set within the projection surface of the electronic component 2 shown by the dotted line, that is, in the area overlapping with the electronic component 2, as shown in Figure 13As shown in (A), the opening 201d may be provided at the center of the facing surface 201a and at a position offset from the center, as shown in FIG. Figure 13 As shown in (B), a plurality of them may be provided symmetrically with respect to the center of the facing surface 201a.

[0160] (3) The number and size of the suction holes 201c and the openings 201d are not limited to the above embodiment. On the facing surface 201a of the porous member 201, the suction holding state and the non-contact state can be maintained by balancing the area of ​​the electronic component 2 supported by the gas layer and the total area of ​​the openings 201d.

[0161] (4) The pickup collet 200 is designed to be replaceable, so that it can be replaced according to the shape and size of the electronic component 2. As such a replaceable structure, a structure that can be held by magnetic suction is simple and easy to replace. However, any structure that allows the pickup collet 200 to be replaced is sufficient. For example, a structure that uses negative pressure suction and retention or a mechanical retention structure can be used.

[0162] [Other embodiments]

[0163] The present invention is not limited to the above-described embodiments and also includes other embodiments described below. Furthermore, the present invention also includes forms in which all or any combination of the above-described embodiments and other embodiments described below is obtained. Furthermore, various omissions, substitutions, and modifications may be made to these embodiments without departing from the scope of the invention, and such modifications are also included in the present invention.

Claims

1. A pickup collet for sucking and holding electronic components and picking them up, characterized in that: The porous member has air permeability and ejects the supplied gas into the interior in a planar shape through the fine pores on the surface facing the electronic component. The porous member is provided with a suction hole, the suction hole having an opening on the facing surface and sucking the electronic component by negative pressure, A non-supporting area is provided around the opening of the suction hole, and a gas layer formed by ejecting gas from the facing surface in the non-supporting area does not support the electronic component. The non-supporting region is arranged at the same height as the facing surface and does not eject the gas, or includes a portion that is farther from the electronic component than the distance from the facing surface to the electronic component, and ejects the gas.

2. The pickup collet according to claim 1, characterized in that The non-supporting area is an area where the facing surface is recessed.

3. The pickup collet according to claim 1, characterized in that The non-supporting region is an inclined region between the facing surface and the opening.

4. The pickup collet according to claim 1, characterized in that The suction holes create a negative pressure, and the electronic component is held on the facing surface via a gas layer formed by gas supplied from the facing surface.

5. The pickup collet according to claim 1, characterized in that When the facing surface and the electronic component face each other, the opening is located within a projection plane of the electronic component.

6. A pickup device for picking up the electronic component from a sheet on which the electronic component is attached, characterized in that: have: A pick-up collet as claimed in any one of claims 1 to 5; and The collet moving mechanism moves the pickup collet close to a position on the sheet where the electronic component can be sucked and held, and can peel the sucked and held electronic component from the sheet and transfer the same.

7. A mounting device, characterized in that: have: The pickup device according to claim 6; a bonding head configured to be movable relative to the pickup collet and to receive the electronic component from the pickup collet; as well as The mounting section transfers the electronic component held by the bonding head to a substrate and mounts the electronic component thereon.

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