Microwave Measurement Apparatus and Method for Liquid Interface Position

Abstract

This disclosure provides a microwave measurement device for the position of a liquid interface, used to measure the position of the liquid interface formed between a first liquid layer and a second liquid layer. The microwave measurement device includes: a submerged microwave measurement unit placed in the first liquid layer for transmitting an initial microwave measurement signal to a detector; and a detector immersed in both the first and second liquid layers, allowing the initial microwave measurement signal to be transmitted along the detector. The signal is reflected at the interface between the first and second liquid layers and / or at a reflective structure to generate an echo signal. Based on the time difference between the transmitted initial signal and the received echo signal, the measured position values ​​of the liquid interface and the reflective structure are determined. This disclosure improves measurement errors caused by changes in the liquid medium by shortening the signal transmission path in the liquid through the submerged microwave measurement unit placed in the first liquid layer. This disclosure also provides methods for correcting and calibrating the position of the liquid interface.

Description

Technical Field

[0001] This disclosure relates to the field of radar technology, and more particularly to a microwave measuring device and method for liquid interface position. Background Technology

[0002] In many industrial applications, it is necessary to measure the interfaces inside containers. For example, in traditional oil tank farms, the upper layer is an oil layer, and below the oil layer there is a water layer of a certain thickness.

[0003] Currently, there are many technologies that can accurately measure the liquid level of oil layers, but there is a lack of high-precision measurement methods for the thickness of the water layer below the oil layer, that is, the location of the interface between the water layer and the oil layer. If the measurement of the thickness of the water layer below the oil layer is not accurate enough, then the measurement of the liquid level of the upper oil layer becomes meaningless.

[0004] Traditional methods for measuring the oil-water interface position include those using capacitance or radio frequency admittance principles. Both methods measure by detecting changes in capacitance. However, since the dielectric constant of oil varies with water content, temperature, and oil type, instruments using capacitance detection are significantly affected by the dielectric constant of the oil.

[0005] Therefore, instruments that utilize the principles of capacitance or radio frequency admittance have difficulty in accurately measuring the location of the oil-water interface. Furthermore, traditional guided wave radar methods often result in weak echo signals when measuring oil-water interfaces in large-range oil storage tanks, as the signal penetrates a thick layer of oil, making it difficult to achieve stable and accurate measurements. Summary of the Invention

[0006] To address at least one of the aforementioned technical problems, this disclosure provides a microwave measurement device and method for liquid interfaces.

[0007] According to one aspect of this disclosure, a microwave measuring device for measuring the position of a liquid interface is provided, for measuring the position of a liquid interface formed between a first liquid layer and a second liquid layer, the microwave measuring device for measuring the position of the liquid interface includes:

[0008] A submerged microwave measurement unit is placed in the first liquid layer to transmit the initial microwave measurement signal to the detector;

[0009] The detector is immersed in a first liquid layer and a second liquid layer, so that the initial microwave measurement signal is transmitted along the detector and the signal is reflected at the interface between the first liquid layer and the second liquid layer and / or at the reflective structure to generate an echo signal.

[0010] A microwave measuring device for liquid interface position according to at least one embodiment of the present disclosure further includes a high-frequency circuit signal processing module and a meter head. The high-frequency circuit signal processing module is disposed in the sinking microwave measuring unit or the meter head and is used to generate an initial signal and receive echo information.

[0011] The meter head does not contact the liquid layer, and the sinking microwave measurement unit is connected to the meter head through a connecting passage segment.

[0012] According to at least one embodiment of the liquid interface position microwave measuring device of the present disclosure, the sinking microwave measuring unit includes:

[0013] A signal acquisition and processing module is connected to the high-frequency circuit signal processing module and is used to process and transmit the initial signal, and to acquire and process the echo signal into echo information and transmit it to the high-frequency circuit signal processing module.

[0014] The signal converter is connected to the signal acquisition and processing module, receives the initial signal transmitted by the signal acquisition and processing module and converts it into an initial microwave measurement signal, which is then transmitted via the detector. The signal converter also receives and converts the echo signal transmitted by the detector and transmits it to the signal acquisition and processing module.

[0015] The high-frequency circuit signal processing module obtains the measured value of the echo signal position based on the time difference between the transmitted initial signal and the echo signal in the received echo information, thereby determining the measured value of the liquid interface position and / or the measured value of the reflective structure position.

[0016] According to at least one embodiment of the liquid interface position microwave measuring device of the present disclosure, the detector has a structure type of single rod structure, single cable structure, multi rod structure or coaxial structure.

[0017] The multi-rod structure includes a measuring probe and a grounding rod, the measuring probe and the grounding rod are arranged in parallel, and the number of grounding rods is at least one, preferably four; the coaxial structure consists of a central probe and an outer cylinder.

[0018] According to at least one embodiment of the liquid interface position microwave measuring device of the present disclosure, the bottom end of the detector is provided with a weight to prevent the liquid interface position microwave measuring device from floating upward due to buoyancy after entering the liquid layer and affecting the measurement.

[0019] According to at least one embodiment of the liquid interface position microwave measuring device of the present disclosure, the detector is provided with one or more echo reflection structures, the echo reflection structures being used to generate reference echo signals so that the liquid interface position microwave measuring device can correct and / or calibrate the measured value of the liquid interface position.

[0020] According to at least one embodiment of the microwave measuring device for liquid interface position of the present disclosure, the echo reflection structure includes a reflection structure formed at the connection between the detector and the signal converter, a reflection structure formed by changing the diameter of the measuring probe, a branch structure provided on the measuring probe, or a reflection component installed on the grounding rod.

[0021] The microwave measuring device for liquid interface position according to at least one embodiment of the present disclosure further includes:

[0022] A temperature detection and processing module is installed in the meter head of the microwave measuring device at the liquid interface, and is used to receive temperature information transmitted by the temperature measuring sensor.

[0023] A temperature measurement sensor, at least one in number, is disposed inside the sealing layer of the connecting passage segment, and is used to acquire temperature information at the location of the temperature measurement sensor and transmit the temperature information to the temperature detection and processing module.

[0024] The microwave measuring device for liquid interface position according to at least one embodiment of the present disclosure further includes:

[0025] The power module is used to receive external power and supply power to the various components in the meter head, and to supply power to the sinking microwave measurement unit through the connection path segment.

[0026] The communication module is used for internal and external communication. The internal communication refers to the data communication inside the microwave measuring device for liquid interface position, and the external communication refers to the data communication between the microwave measuring device for liquid interface position and external devices.

[0027] The display module is used to display data processed by the high-frequency circuit signal processing module and data transmitted by the temperature detection and processing module.

[0028] The power module, communication module, and display module are located in the meter header.

[0029] According to another aspect of this disclosure, a correction method based on a microwave measurement device for liquid interface position is provided, comprising:

[0030] The initial signal generated by the high-frequency circuit signal processing module of the microwave measuring device is processed by the signal acquisition and processing module, signal converter and detector. At the liquid interface, an echo signal is generated, and at the i-th reflection structure, a reference echo signal is generated.

[0031] The echo signal from the liquid interface and the reference echo signal from the i-th reflection structure are respectively acquired by the signal acquisition and processing module after passing through the detector and the signal converter to obtain echo information.

[0032] The high-frequency circuit signal processing module receives echo information and obtains the measured value of the position of the reference echo signal corresponding to the i-th reflection structure by the time difference between the initial signal and the received reference echo signal corresponding to the i-th reflection structure. Since the position of the i-th reflection structure is known, the actual value of the position of the reference echo signal generated by the i-th reflection structure is obtained, and then the relationship between the measured value and the actual value of the position of the reference echo signal of the i-th reflection structure is obtained.

[0033] The high-frequency circuit signal processing module obtains the measured value of the liquid interface position by the time difference between the transmitted initial signal and the received echo signal corresponding to the liquid interface position; and

[0034] Based on the relationship between the actual value of the reference echo signal position of the i-th reflection structure and the measured value of the reference echo signal position of the i-th reflection structure, the measured value of the liquid interface position is corrected; where i is a natural number greater than or equal to 1.

[0035] According to another aspect of this disclosure, a correction method based on a microwave measurement device for liquid interface position is provided, comprising:

[0036] The measuring device transmits an initial signal through the high-frequency circuit signal processing module. During the Nth and N+1th measurements, the initial signal is transmitted to the i-th reflection structure and the liquid interface via the signal acquisition and processing module, the signal converter, and the detector. The Nth and N+1th measurements respectively generate the reference echo signal corresponding to the i-th reflection structure and the echo signal corresponding to the liquid level interface.

[0037] Calculate the measured value of the position of the Nth reference echo signal based on the reference echo signal corresponding to the i-th reflection structure in the Nth reflection;

[0038] Calculate the measured value of the position of the reference echo signal for the (N+1)th time based on the reference echo signal corresponding to the i-th reflection structure for the (N+1)th time.

[0039] The relationship between the measured values ​​of the reference echo signal positions corresponding to the Nth and N+1th reflection structures is obtained;

[0040] The measured value of the liquid interface position at the (N+1)th liquid interface is calculated based on the echo signal corresponding to the liquid interface position at the (N+1)th liquid interface position.

[0041] Based on the relationship between the measured values ​​of the reference echo signal positions corresponding to the i-th reflection structure in the Nth and N+1th reflections, the measured value of the echo signal position corresponding to the liquid interface in the N+1th reflection is corrected.

[0042] Where i is a natural number greater than or equal to 1, and N is a natural number greater than or equal to 1.

[0043] The correction method for a microwave measuring device based on the liquid interface position according to at least one embodiment of the present disclosure further includes: performing distance calibration on the measured value of the corrected liquid interface position.

[0044] Obtain the corrected measurement value of the liquid interface position;

[0045] The position of the i-th reflection structure is fixed and known. The actual height position information of the i-th reflection structure in the container is obtained, thereby obtaining the actual height value of the reference echo signal position generated by the i-th reflection structure in the container.

[0046] The high-frequency circuit signal processing module obtains the position measurement value of the reference echo signal generated by the i-th reflection structure each time based on the reference echo signal generated by the i-th reflection structure each time, thereby obtaining the relationship between the position measurement value of the reference echo signal generated by the i-th reflection structure each time and the measurement value of the corrected liquid interface position each time.

[0047] Based on the relationship between the actual height of the reference echo signal position generated by the i-th reflection structure in the container, the measured value of the reference echo signal position generated by the i-th reflection structure each time, and the measured value of the corrected liquid interface position each time, distance calibration is performed on the measured value of the corrected liquid interface position to obtain the actual height position information of the liquid interface position in the container. Attached Figure Description

[0048] The accompanying drawings illustrate exemplary embodiments of the present disclosure and, together with the description thereof, serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0049] Figure 1 This is a schematic diagram of a microwave measuring device for measuring the liquid interface position according to one embodiment of the present disclosure.

[0050] Figure 2 This is a schematic block diagram of a microwave measuring device for liquid interface position according to one embodiment of the present disclosure.

[0051] Figure 3 This is a schematic block diagram of a microwave measuring device for liquid interface position according to one embodiment of the present disclosure.

[0052] Figure 4 This is a schematic flowchart of a method for correcting the liquid interface position using a microwave measuring device for liquid interface position according to an embodiment of the present disclosure.

[0053] Figure 5 This is a schematic flowchart of a method for correcting the liquid interface position using a microwave measuring device for liquid interface position according to another embodiment of this disclosure.

[0054] Explanation of reference numerals in the attached figures

[0055] 1000 Microwave Measurement Device for Liquid Interface Position

[0056] 1001 High-Frequency Circuit Signal Processing Module

[0057] 1002 Signal Acquisition and Processing Module

[0058] 1003 Signal Converter

[0059] Detector 1004

[0060] 1005 Temperature Detection and Processing Module

[0061] 1006 Power Module

[0062] 1007 Communication Module

[0063] 1008 Display Module

[0064] 1009 Submerged Microwave Measurement Unit

[0065] 1010 meter head

[0066] 1011 Connecting Path Segment

[0067] 1012 Temperature Measurement Sensor

[0068] 1013 Heavy Hammer

[0069] 1014 First Reflection Structure

[0070] 1015 Second Reflection Structure

[0071] 1016 Measuring probe

[0072] 1017 Grounding rod. Detailed Implementation

[0073] The present disclosure will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the disclosure. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present disclosure are shown in the accompanying drawings.

[0074] It should be noted that, where there is no conflict, the embodiments and features described in this disclosure can be combined with each other. The technical solutions of this disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0075] Unless otherwise stated, the exemplary implementations / embodiments shown are to be understood as providing exemplary features of various details that provide ways in which the technical concepts of this disclosure can be implemented in practice. Therefore, unless otherwise stated, the features of various implementations / embodiments may be additionally combined, separated, interchanged and / or rearranged without departing from the technical concepts of this disclosure.

[0076] The use of crosshairs and / or shading in the accompanying drawings is generally used to clarify the boundaries between adjacent components. Thus, unless otherwise stated, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for the specific material, material properties, dimensions, proportions, commonalities between the illustrated components, or any other characteristics, properties, etc., of the components. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of components may be exaggerated for clarity and / or descriptive purposes. When exemplary embodiments can be implemented differently, a specific process sequence may be performed in a different order than that described. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description. Furthermore, the same reference numerals denote the same components.

[0077] When a component is referred to as being "on" or "above" another component, "connected to," or "joined to" another component, the component may be directly on, directly connected to, or directly joined to the other component, or there may be intermediate components. However, when a component is referred to as being "directly on" another component, "directly connected to," or "directly joined to" another component, there are no intermediate components. Therefore, the term "connection" can refer to a physical connection, an electrical connection, etc., and may or may not have intermediate components.

[0078] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “the” are intended to include the plural forms as well. Furthermore, when the terms “comprising” and / or “including” and variations thereof are used in this specification, it indicates the presence of the stated features, integrals, steps, operations, parts, components, and / or groups thereof, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, parts, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximate terms rather than as terms of degree, thus explaining the inherent biases in measurements, calculated values, and / or provided values ​​that would be recognized by one of ordinary skill in the art.

[0079] Figure 1 This is a schematic diagram of a liquid interface position microwave measuring device according to one embodiment of the present disclosure for measuring liquid interfaces. In this embodiment, the liquid interface position microwave measuring device can be installed on the top of a container. A gas layer, a first liquid layer, and a second liquid layer are distributed from top to bottom inside the container, and a liquid interface is formed between the first liquid layer and the second liquid layer. Figure 2 This is a schematic block diagram of a microwave measuring device for liquid interface position according to one embodiment of the present disclosure.

[0080] refer to Figure 1 and Figure 2 The liquid interface position microwave measurement device 1000 of this embodiment includes: a sinking microwave measurement unit 1009, which is placed in the first liquid layer and is used to transmit the initial microwave measurement signal to the detector 1004.

[0081] Detector 1004 is immersed in the first liquid layer and the second liquid layer, so that the initial microwave measurement signal is transmitted along the detector 1004. The signal is reflected at the interface between the first liquid layer and the second liquid layer and / or at the reflective structure to generate an echo signal. That is, the echo signal includes the echo signal at the liquid interface and / or the reference echo signal at the reflective structure.

[0082] refer to Figure 2 The liquid interface position microwave measuring device 1000 disclosed herein also includes a meter head 1010, which can be installed on the top of the container without contacting the liquid layers (first liquid layer, second liquid layer, etc.). The sinking microwave measuring unit 1009 is connected to the meter head 1010 through a connection passage segment 1011 to realize power supply, communication, and signal transmission. It should be noted that the meter head 1010 may not be installed on the top of the container; it can be installed in other locations as long as it does not contact the liquid layer.

[0083] Figure 3 This is a schematic block diagram of a microwave measuring device for liquid interface position according to another embodiment of this disclosure.

[0084] Figure 3 and Figure 2 The difference lies in the location of the high-frequency circuit signal processing module 1001. Figure 2 The medium- and high-frequency circuit signal processing module 1001 is located in the meter head 1010. Figure 3 The medium- and high-frequency circuit signal processing module 1001 is located in the sunken microwave measurement unit 1009.

[0085] The high-frequency circuit signal processing module 1001 of the liquid interface position microwave measurement device 1000 can be set in the sinking microwave measurement unit 1009 or the meter head 1010. It is used to generate an initial signal and receive echo information. The meter head 1010 can be installed on the top of the container without contacting the liquid layer. The sinking microwave measurement unit 1009 and the meter head 1010 are connected through the connection passage 1011. The high-frequency circuit signal processing module 1001 is used to generate an initial signal and to receive echo information.

[0086] refer to Figure 2 In some embodiments of this disclosure, the sinking microwave measurement unit 1009 of the liquid interface position microwave measurement device 1000 includes:

[0087] The signal acquisition and processing module 1002 is connected to the high-frequency circuit signal processing module 1001 and is used to transmit the initial signal, acquire and process the echo signal into echo information and transmit it to the high-frequency circuit signal processing module 1001.

[0088] Signal converter 1003 is connected to signal acquisition and processing module 1002. Signal converter 1003 receives the initial signal transmitted by signal acquisition and processing module 1002 and converts it into an initial microwave measurement signal, which is then transmitted and received via detector 1004. Signal converter 1003 converts the echo signal transmitted by detector 1004 and transmits it to signal acquisition and processing module 1002.

[0089] The high-frequency circuit signal processing module 1001 obtains the measured value of the echo signal position based on the time difference between the transmitted initial signal and the received echo signal in the echo information, thereby determining the measured value of the liquid interface (the interface between the first liquid layer and the second liquid layer) position and the measured value of the position of the reflective structure.

[0090] The signal acquisition and processing module 1002 and the signal converter 1003 are located in the sinking microwave measurement unit 1009 at the liquid interface position, and the high-frequency circuit signal processing module 1001 is located in the meter head 1010 of the liquid interface position microwave measurement device 1000. The sinking microwave measurement unit 1009 and the meter head 1010 are connected through the connecting passage section 1011.

[0091] When the microwave measuring device 1000 performs measurements at the liquid interface, the signal acquisition and processing module 1002 and the signal converter 1003 are located in the first liquid layer. They are used to transmit and convert the initial signal generated by the high-frequency circuit signal processing module 1001 into an initial microwave measurement signal and transmit it to the detector 1004.

[0092] The detector 1004 is immersed in the first liquid layer and the second liquid layer. During the process of transmitting the initial microwave measurement signal from top to bottom, when the initial microwave measurement signal encounters the interface between the first liquid layer and the second liquid layer and / or the reflective structure, it will be reflected to form an echo signal. The echo signal is transmitted by the detector 1004, converted by the signal converter 1003, acquired and received by the signal acquisition and processing module 1002, and then transmitted through the connection path segment 1011. Finally, it is received by the high-frequency circuit signal processing module 1001.

[0093] The high-frequency circuit signal processing module 1001 determines the measured value of the position of the liquid interface (the interface between the first liquid layer and the second liquid layer) and / or the measured value of the position of the reflective structure by comparing the time difference between the transmitted initial signal and the echo signal in the received echo information.

[0094] refer to Figure 3 In some embodiments of this disclosure, the sinking microwave measurement unit 1009 of the liquid interface position microwave measurement device 1000, in addition to including the high-frequency circuit signal processing module 1001, also includes:

[0095] The signal acquisition and processing module 1002 is connected to the high-frequency circuit signal processing module 1001 and is used to transmit the initial signal, acquire and process the echo signal into echo information and transmit it to the high-frequency circuit signal processing module 1001.

[0096] Signal converter 1003 is connected to signal acquisition and processing module 1002. It receives the initial signal transmitted by signal acquisition and processing module 1002 and converts it into an initial microwave measurement signal, which is then transmitted via detector 1004. It also receives and converts the echo signal transmitted by detector 1004 and transmits it to signal acquisition and processing module 1002.

[0097] The high-frequency circuit signal processing module 1001 obtains the measured value of the echo signal position based on the time difference between the transmitted initial signal and the echo signal in the received echo information, thereby determining the measured value of the liquid interface (the interface between the first liquid layer and the second liquid layer) position and / or the measured value of the position at the reflective structure.

[0098] The high-frequency circuit signal processing module 1001, the signal acquisition and processing module 1002, and the signal converter 1003 are disposed in the sinking microwave measurement unit 1009. The detector 1004 is immersed in the first liquid layer and the second liquid layer. Since the sinking microwave measurement unit 1009 is located in the first liquid layer, that is, when the microwave measurement device 1000 performs measurement at the liquid interface, the high-frequency circuit signal processing module 1001, the signal acquisition and processing module 1002, and the signal converter 1003 are all located in the first liquid layer. When the initial signal generated by the high-frequency circuit signal processing module 1001 is transmitted and converted into an initial microwave measurement signal and transmitted to the detector 1004, the detector 1004 transmits the initial microwave measurement signal from top to bottom. When the initial microwave measurement signal encounters the interface and / or reflection structure between the first liquid layer and the second liquid layer, it will be reflected to form an echo signal. The echo signal is transmitted by the detector 1004, converted by the signal converter 1003, and directly acquired and received by the signal acquisition and processing module 1002.

[0099] Existing measurement methods involve placing the echo signal acquisition unit within the meter head, which is typically located on a container outside the liquid layer. This results in a relatively long transmission distance for the echo signal. However, in the embodiments described above, the signal acquisition and processing module 1002 and the signal converter 1003 are located within the first liquid layer, reducing the transmission distance of the echo signal from generation to acquisition. This also reduces the transmission distance of the echo signal within the liquid, thereby improving the problem of unstable and inaccurate interface position measurement caused by changes in liquid content, temperature, quality, and other factors. Furthermore, the overall transmission distance of the echo signal is reduced, enhancing the strength of the received echo signal and improving the signal-to-noise ratio of the echo signal, thus improving measurement accuracy.

[0100] When the high-frequency circuit signal processing module 1001 is installed in the sinking microwave measurement unit 1009 in the first liquid layer, the path of the initial signal generated by the high-frequency circuit signal processing module 1001 from the initial signal transmission to the interface position and / or reflection structure of the first liquid layer and the second liquid layer is also reduced. Since the greater the transmission distance of the initial signal, the more the signal attenuates, it can also enhance the echo signal.

[0101] refer to Figures 1 to 3The detector 1004 disclosed herein includes a mechanical structure capable of transmitting an initial microwave measurement signal and an echo signal. The detector's structural type can be a single-rod structure, a single-cable structure, a coaxial structure, or a multi-rod structure.

[0102] In some embodiments of this disclosure, reference is made to Figure 1 The multi-rod structure includes a measuring probe 1016 and a grounding rod 1017. The grounding rod 1017 is arranged parallel to the measuring probe 1016, and the number of grounding rods 1017 is one or more, preferably four. The grounding rod 1017 can improve the intensity / amplitude of the echo signal.

[0103] In some embodiments of this disclosure, when the detector 1004 of the microwave measuring device 1000 for liquid interface position is a coaxial structure, it preferably includes a central probe rod and an outer cylinder.

[0104] According to a preferred embodiment of this disclosure, a weight 1013 is provided at the bottom of the detector 1004 to prevent the microwave measuring device 1000 at the liquid interface from floating upwards due to buoyancy after entering the liquid layer, thus affecting the measurement. The shape of the weight 1013 is not particularly limited and can be square, circular, triangular, conical, or other irregular shapes.

[0105] According to a preferred embodiment of this disclosure, the detector 1004 is provided with one or more echo reflection structures. The echo reflection structures are used to generate reference echo signals. The measured values ​​of the liquid interface positions are corrected and distance calibrated by measuring the positions of the reference echo signals, thereby outputting high-precision liquid interface positions.

[0106] In some embodiments of this disclosure, the echo reflection structure includes a reflection structure formed at the connection between the detector 1004 and the signal converter 1003, a reflection structure formed by changing the diameter of the measuring probe 1016, a branch structure provided on the measuring probe 1016, or a reflection structure installed on the grounding rod 1017.

[0107] For example, when changing the diameter of the measuring probe 1016 to form a reflective structure, the reflective structure can be formed by setting the diameter of the upper measuring probe to be smaller than the diameter of the lower measuring probe or the diameter of the upper measuring probe to be larger than the diameter of the lower measuring probe.

[0108] refer to Figure 1 , Figure 2 , Figure 3 In some embodiments of this disclosure, the microwave measuring device 1000 for liquid interface position further includes:

[0109] Temperature detection and processing module 1005 is installed in the meter head 1010 of the microwave measuring device 1000 at the liquid interface and is used to receive temperature information transmitted by the temperature measuring sensor.

[0110] Temperature measurement sensor 1012 (reference) Figure 1 The number of temperature measurement sensors 1012 is at least one, which is set inside the sealing layer of the connecting passage section 1011. It is used to obtain the temperature information of the location of the temperature measurement sensor 1012 and transmit the temperature information to the temperature detection and processing module 1005.

[0111] The temperature detection and processing module 1005 includes a detection circuit or an MCU.

[0112] One or more temperature measuring sensors 1012 are installed at preset positions inside the sealing layer of the connecting passage section 1011. The installation positions of the multiple temperature measuring sensors 1012 can be equally spaced or unequally spaced.

[0113] The temperature detection and processing module 1005 is pre-set with the location information of the temperature measurement sensors. After receiving the temperature information transmitted by each temperature measurement sensor, the temperature detection and processing module 1005 can obtain the temperature value at each location.

[0114] The temperature measurement sensor 1012 includes either a resistive temperature sensor or a digital temperature sensor. A resistive temperature sensor, such as a PT100, uses a platinum resistance thermometer; its resistance changes with temperature according to a specific function. The temperature detection and processing module 1005 detects the change in resistance to determine the temperature. A digital temperature sensor directly obtains the temperature value and outputs it to the temperature detection and processing module 1005.

[0115] In some embodiments of this disclosure, multiple temperature measurement sensors 1012 are arranged in the connection passage 1011 between the sinking microwave measurement unit 1009 and the meter head 1010 to form a multi-point temperature measurement system, thereby realizing the integration of multi-point temperature measurement and liquid interface microwave measurement device.

[0116] refer to Figures 1 to 3 In some embodiments of this disclosure, the microwave measuring device 1000 for liquid interface position further includes:

[0117] Power module 1006 is used to receive external power to power the components in meter 1010, and to power the sinking microwave measurement unit 1009 through connection channel segment 1011.

[0118] Communication module 1007 is used for internal communication and external communication. Internal communication refers to the data communication inside the liquid interface position microwave measuring device 1000, and external communication refers to the data communication between the liquid interface position microwave measuring device 1000 and external devices.

[0119] Display module 1008 is used to display data including data processed by high-frequency circuit signal processing module 1001 and data transmitted by temperature detection and processing module 1005.

[0120] The power module 1006, communication module 1007 and display module 1008 are located in the meter head 1010 of the liquid interface measuring device 1000.

[0121] The internal communication includes: transmitting the liquid interface position value transmitted by the high-frequency circuit signal processing module 1001 and the temperature value transmitted by the temperature detection and processing module 1005 to the display module 1008, or setting parameters through the display module 1008 and sending them to the liquid interface position microwave measuring device of this disclosure through the communication module 1007 for debugging and control.

[0122] The external communication includes transmitting the location of the interface and the temperature values ​​at each point to a central control room or a processing device next to the container outside the liquid interface position microwave measuring device 1000 disclosed herein via the communication module 1007, so as to facilitate the control or adjustment of related processes.

[0123] The communication module 1007 can use wired or wireless communication methods. Wired communication includes RS485, Ethernet port, and fiber optic, while wireless communication includes Bluetooth, 4G / 5G, LoRa, ZigBee, and NB-IoT.

[0124] The submerged microwave measurement unit 1009 is equipped with a sealed housing. The sealed housing is made of heat-resistant and corrosion-resistant material or heat-resistant material with anti-corrosion coating, so that the submerged microwave measurement unit 1009 can be immersed in liquid for a long time without liquid entering and without corrosion.

[0125] According to a preferred embodiment of the present disclosure, the detector 1004 of the microwave measuring device 1000 for liquid interface position is provided with at least one reflective structure, and the detector 1004 is of the following structural type: single rod structure, single cable structure, coaxial structure or multi-rod structure.

[0126] refer to Figure 1 In some embodiments of this disclosure, the multi-rod structure includes a measuring probe 1016 and a grounding rod 1017, wherein the grounding rod 1017 is arranged parallel to the measuring probe 1016, and the number of grounding rods 1017 is one or more.

[0127] The echo reflection structure includes at least the reflection structure formed at the connection between the detector 1004 and the signal converter 1003, the reflection structure formed by changing the diameter of the measuring probe 1016, the branch structure set on the measuring probe 1016, or the reflection structure installed on the grounding rod 1017.

[0128] Preferably, refer to Figure 1 The detector 1004 is equipped with two echo reflection structures, namely the first reflection structure 1014 and the second reflection structure 1015.

[0129] The first reflective structure 1014 reflects the initial microwave measurement signal to generate a first reference echo signal, and the second reflective structure 1015 reflects the initial microwave measurement signal to generate a second reference echo signal. Preferably, the connection between the measuring probe 1016 and the grounding rod 1017 is the second reflective structure 1015, and the connection between the signal converter 1003 and the detector 1004 is the first reflective structure 1014.

[0130] The high-frequency circuit signal processing module 1001 of the microwave measuring device 1000 for liquid interface position disclosed herein can correct and calibrate the measured value of the liquid interface position by means of the relationship between the measured value and the actual value of the first / second reference echo signal position, so as to obtain a more accurate interface position.

[0131] Preferably, the meter head 1010 of the liquid interface position microwave measuring device 1000 of this disclosure is disposed on the top of the container. A connection passage 1011 is provided between the meter head 1010 and the submerged microwave measuring unit 1009. The connection passage 1011 constitutes a power supply, communication, and signal transmission link, and the connection passage 1011 is protected by a sealing layer. The outer sealing layer is made of a temperature-resistant and corrosion-resistant material, or an anti-corrosion coating is applied to a temperature-resistant material, allowing for long-term immersion in liquid for measurement without the liquid medium entering or causing corrosion. When the high-frequency circuit signal processing module 1001 is housed in the meter head 1010, the coaxial cable used for connecting the high-frequency circuit signal processing module 1001 and the submerged microwave measuring unit 1009 is also disposed in the connection passage 1011 and protected by the sealing layer.

[0132] Figure 4 This is a schematic flowchart illustrating a method for correcting the liquid interface position using a microwave measuring device for liquid interface position according to one embodiment of this disclosure.

[0133] like Figure 4 As shown, the method S100 for correcting the liquid interface position includes the following steps:

[0134] S102: The initial signal emitted by the microwave measuring device 1000 through the high-frequency circuit signal processing module 1001 is transmitted to the reflection structure (the i-th reflection structure, which can be the first reflection structure, the second reflection structure, the third reflection structure, the fourth reflection structure, etc., where i is a natural number greater than or equal to 1) and / or the liquid interface after passing through the signal acquisition and processing module 1002, the signal converter 1003 and the detector 1004, and generates an echo signal through the liquid interface and / or generates a reference echo signal through the reflection structure.

[0135] S104: The echo signal and the reference echo signal are transmitted through the detector 1004, the signal converter 1003 and the signal acquisition and processing module 1002 respectively, and then received by the high-frequency circuit signal processing module 1001.

[0136] S106: The high-frequency circuit signal processing module 1001 obtains the measured value of the position where the reference echo signal is generated through the initial signal and the reference echo signal, obtains the actual value of the position where the reference echo signal is generated based on the known position of the reflection structure, and then obtains the relationship between the measured value and the actual value of the position where the reference echo signal is generated.

[0137] S108: The high-frequency circuit signal processing module 1001 calculates the liquid interface position measurement value based on the time difference between the transmitted initial signal and the received echo signal.

[0138] S110: Correct the measured position of the liquid interface based on the relationship between the actual value and the measured value of the location where the reference echo signal is generated.

[0139] In some embodiments of this disclosure, the reflective structure includes a first reflective structure 1014 and / or a second reflective structure 1015.

[0140] The relationship between the measured value and the actual value of the location where the reference echo signal is generated includes, but is not limited to, the difference (change) between the two, the proportionality coefficient, etc. The measured value of the reflected echo signal location is corrected each time to ensure the accuracy of each reflected echo signal location measurement, that is, to guarantee the accuracy of each interface location measurement.

[0141] The concept of a reference echo signal can mitigate errors introduced during signal transmission, which can lead to large errors in the final measurement result. Since both the reference echo signal and the interface echo signal propagate within a liquid medium, changes in the liquid medium have the same impact on both. Correcting and calibrating the interface echo signal using the reference echo signal can minimize measurement errors caused by changes in the liquid medium, such as variations in water content, temperature, and quality. Furthermore, during measurement, immersing the microwave measurement unit and detector in the liquid layer reduces the signal transmission distance within the liquid, minimizing the influence of liquid medium changes on the measurement. This also enhances the echo signal and improves its signal-to-noise ratio, thereby increasing measurement accuracy.

[0142] Figure 5 This is a schematic flowchart of a correction method based on a microwave measuring device for liquid interface position according to one embodiment of the present disclosure.

[0143] like Figure 5 As shown, the correction method S200 based on the microwave measurement device for liquid interface position includes:

[0144] S202: The measuring device 1000 generates an initial signal through the high-frequency circuit signal processing module 1001. When the signal is received for the Nth and N+1th time, it is transmitted to the reflection structure (the i-th reflection structure, which can be the first reflection structure, the second reflection structure, the third reflection structure, the fourth reflection structure, etc., where i is a natural number greater than or equal to 1 and N is a natural number greater than or equal to 1) and / or the liquid interface, generating a reference echo signal and an echo signal respectively each time.

[0145] S204: The high-frequency circuit signal processing module 1001 calculates the measured value of the position where the reference echo signal is generated for the Nth time;

[0146] S206: The high-frequency circuit signal processing module 1001 calculates the measured value of the position where the reference echo signal is generated for the (N+1)th time;

[0147] S208: Obtain the relationship between the measured values ​​of the positions where the reference echo signal is generated for the Nth and N+1th time;

[0148] S210: The high-frequency circuit signal processing module 1001 calculates the measured value of the position where the echo signal is generated for the (N+1)th time;

[0149] S212: The high-frequency circuit signal processing module 1001 corrects the measured value of the position of the N+1th echo signal based on the relationship between the measured values ​​of the positions of the Nth and N+1th generation of the reference echo signal.

[0150] In some embodiments of this disclosure, the reference echo signal is generated by a first reflection structure 1014 and / or a second reflection structure 1015.

[0151] The relationship between the measured positions of the Nth and N+1th reflected echo signals includes, but is not limited to, the difference (change) between the two, the proportional coefficient, etc. The measured position of the N+1th reflected echo signal is corrected to ensure the accuracy of the position measurement of each reflected echo signal, that is, to ensure the accuracy of each interface position measurement.

[0152] based on Figure 5 The correction method shown obtains the measured value of the corrected liquid interface position, and then the measured value of the corrected liquid interface position is calibrated for distance. The process is as follows:

[0153] Obtain the corrected measurement value of the liquid interface position;

[0154] The position of the reflection structure (the i-th reflection structure, which can be the first reflection structure, the second reflection structure, the third reflection structure, the fourth reflection structure, etc., where i is a natural number greater than or equal to 1 and N is a natural number greater than or equal to 1) is fixed and known. The actual height position information of the i-th reflection structure in the container is obtained, thereby obtaining the actual height value of the reference echo signal position generated by the i-th reflection structure in the container.

[0155] The high-frequency circuit signal processing module obtains the position measurement value of the reference echo signal generated by the i-th reflection structure each time based on the reference echo signal generated by the i-th reflection structure each time, thereby obtaining the relationship between the position measurement value of the reference echo signal generated by the i-th reflection structure each time and the measurement value of the corrected liquid interface position each time.

[0156] Based on the relationship between the actual height of the reference echo signal position generated by the i-th reflection structure in the container, the measured value of the reference echo signal position generated by the i-th reflection structure each time, and the measured value of the corrected liquid interface position each time, distance calibration is performed on the measured value of the corrected liquid interface position to obtain the actual height position information of the liquid interface position in the container.

[0157] The microwave measurement device for liquid interface position disclosed herein is an improved guided wave radar. Unlike traditional guided wave radar for interface measurement, this disclosure submerges the signal acquisition and signal converter in the liquid layer, reducing the signal transmission distance in the liquid layer, thereby enhancing the echo signal, improving the signal-to-noise ratio of the echo signal, reducing the impact of changes in the liquid medium on the measurement results, and ensuring measurement accuracy.

[0158] Furthermore, a reference point capable of generating a reference echo is further set at a fixed position on the detector. The measured value of the echo position at the reference point is used to correct and / or calibrate the distance of the echo position at the interface, thereby improving the high accuracy of the interface position. Simultaneously, multiple temperature sensors are arranged to form a multi-point temperature measurement system, realizing the integration of multi-point temperature measurement and interface measurement into a single instrument.

[0159] In the description of this specification, the references to terms such as "one embodiment / mode," "some embodiments / modes," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment / mode or example is included in at least one embodiment / mode or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment / mode or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments / modes or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments / modes or examples described in this specification, as well as the features of different embodiments / modes or examples.

[0160] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0161] Those skilled in the art should understand that the above embodiments are merely for illustrating the present disclosure and are not intended to limit the scope of the disclosure. Those skilled in the art can make other changes or modifications based on the above disclosure, and these changes or modifications still fall within the scope of the present disclosure.

Claims

1. A microwave measuring device for liquid interface position, characterized in that, The microwave measuring device is used to measure the location of a liquid interface, wherein the interface is formed between a first liquid layer and a second liquid layer. A submerged microwave measurement unit, placed in the first liquid layer, is used to transmit the initial microwave measurement signal to the detector; and The detector is immersed in the first liquid layer and the second liquid layer, so that the initial microwave measurement signal is transmitted along the detector and the signal is reflected at the interface between the first liquid layer and the second liquid layer and at the echo reflection structure to generate an echo signal. The detector is provided with one or more echo reflection structures, which are used to generate reference echo signals so that the microwave measuring device can correct and / or calibrate the measurement value of the liquid interface position. The microwave measuring device includes a high-frequency circuit signal processing module and a meter head. The high-frequency circuit signal processing module is disposed in the sinking microwave measuring unit or the meter head and is used to generate an initial signal and receive echo information. The sinking microwave measurement unit includes: The signal acquisition and processing module is connected to the high-frequency circuit signal processing module and is used to process and transmit the initial signal, and to acquire and process the echo signal into echo information and transmit it to the high-frequency circuit signal processing module. The signal converter is connected to the signal acquisition and processing module, receives the initial signal transmitted by the signal acquisition and processing module and converts it into an initial microwave measurement signal, which is then transmitted through the detector. It also receives and converts the echo signal transmitted by the detector and transmits it to the signal acquisition and processing module. The high-frequency circuit signal processing module obtains the measured value of the echo signal position based on the time difference between the transmitted initial signal and the echo signal in the received echo information, and determines the measured value of the liquid interface position and the measured value of the echo reflection structure position.

2. The microwave measuring device for liquid interface position according to claim 1, characterized in that, The meter head does not contact the liquid layer, and the sinking microwave measurement unit is connected to the meter head through a connecting passage segment.

3. The microwave measuring device for liquid interface position according to claim 1, characterized in that, The detector can be a single-rod structure, a single-cable structure, a multi-rod structure, or a coaxial structure. The multi-rod structure includes a measuring probe and a grounding rod, with the measuring probe and grounding rod arranged in parallel, and the number of grounding rods being at least one; the coaxial structure consists of a central probe and an outer cylinder.

4. The microwave measuring device for liquid interface position according to claim 1, characterized in that, A counterweight is provided at the bottom of the detector to prevent the microwave measuring device at the liquid interface from floating upwards due to buoyancy after entering the liquid layer, thus affecting the measurement.

5. The microwave measuring device for liquid interface position according to claim 1, characterized in that, The echo reflection structure includes a reflection structure formed at the connection between the detector and the signal converter, a reflection structure formed by changing the diameter of the measuring probe, a branch structure set on the measuring probe, or a reflection component installed on the grounding rod.

6. The microwave measuring device for liquid interface position according to claim 2, characterized in that, Also includes: A temperature detection and processing module is installed in the meter head of the microwave measuring device at the liquid interface, and is used to receive temperature information transmitted by the temperature measuring sensor. as well as A temperature measurement sensor, at least one in number, is disposed inside the sealing layer of the connecting passage segment, and is used to acquire temperature information at the location of the temperature measurement sensor and transmit the temperature information to the temperature detection and processing module.

7. The microwave measuring device for liquid interface position according to claim 2, characterized in that, Also includes: The power module is used to receive external power and supply power to the various components in the meter head, and to supply power to the sinking microwave measurement unit through the connection path segment; The communication module is used for internal and external communication. The internal communication refers to the data communication inside the microwave measuring device for liquid interface position, and the external communication refers to the data communication between the microwave measuring device for liquid interface position and external devices. as well as The display module is used to display data processed by the high-frequency circuit signal processing module and data transmitted by the temperature detection and processing module. The power module, communication module, and display module are located in the meter header.

8. The microwave measuring device for liquid interface position according to claim 3, characterized in that, The number of grounding rods is four.

9. A correction method for the microwave measuring device for liquid interface position based on any one of claims 1 to 8, characterized in that, include: The initial signal generated by the high-frequency circuit signal processing module of the microwave measuring device is processed by the signal acquisition and processing module, signal converter and detector. At the liquid interface, an echo signal is generated, and at the i-th reflection structure, a reference echo signal is generated. The echo signal from the liquid interface and the reference echo signal from the i-th reflection structure are respectively acquired by the signal acquisition and processing module after passing through the detector and the signal converter to obtain echo information. The high-frequency circuit signal processing module receives echo information and obtains the measured value of the position of the reference echo signal corresponding to the i-th reflection structure by the time difference between the initial signal and the received reference echo signal corresponding to the i-th reflection structure. Since the position of the i-th reflection structure is known, the actual value of the position of the reference echo signal generated by the i-th reflection structure is obtained, and then the relationship between the measured value and the actual value of the position of the reference echo signal of the i-th reflection structure is obtained. The high-frequency circuit signal processing module obtains the measured value of the liquid interface position by the time difference between the transmitted initial signal and the received echo signal corresponding to the liquid interface position. as well as Based on the relationship between the actual value of the reference echo signal position of the i-th reflection structure and the measured value of the reference echo signal position of the i-th reflection structure, the measured value of the liquid interface position is corrected. Where i is a natural number greater than or equal to 1.

10. A correction method for the microwave measuring device for liquid interface position based on any one of claims 1 to 8, characterized in that, include: The measuring device transmits an initial signal through the high-frequency circuit signal processing module. During the Nth and N+1th measurements, the initial signal is transmitted to the i-th reflection structure and the liquid interface via the signal acquisition and processing module, the signal converter, and the detector. The Nth and N+1th measurements respectively generate the reference echo signal corresponding to the i-th reflection structure and the echo signal corresponding to the liquid level interface. Calculate the measured value of the position of the Nth reference echo signal based on the reference echo signal corresponding to the i-th reflection structure in the Nth reflection; Calculate the measured value of the position of the reference echo signal for the (N+1)th time based on the reference echo signal corresponding to the i-th reflection structure for the (N+1)th time. The relationship between the measured values ​​of the reference echo signal positions corresponding to the Nth and N+1th reflection structures is obtained; The measured value of the liquid interface position at the (N+1)th liquid interface is calculated based on the echo signal corresponding to the liquid interface position at the (N+1)th liquid interface position. as well as Based on the relationship between the measured values ​​of the reference echo signal positions corresponding to the i-th reflection structure in the Nth and N+1th reflections, the measured value of the echo signal position corresponding to the liquid interface in the N+1th reflection is corrected. Where i is a natural number greater than or equal to 1, and N is a natural number greater than or equal to 1.

11. The correction method according to claim 9 or 10, characterized in that, Also includes: Distance calibration was performed on the measured values ​​of the corrected liquid interface location: Obtain the corrected measurement value of the liquid interface position; The position of the i-th reflection structure is fixed and known. The actual height position information of the i-th reflection structure in the container is obtained, thereby obtaining the actual height value of the reference echo signal position generated by the i-th reflection structure in the container. The high-frequency circuit signal processing module obtains the position measurement value of the reference echo signal generated by the i-th reflection structure each time based on the reference echo signal generated by the i-th reflection structure each time, thereby obtaining the relationship between the position measurement value of the reference echo signal generated by the i-th reflection structure each time and the measurement value of the corrected liquid interface position each time. Based on the relationship between the actual height of the reference echo signal position generated by the i-th reflection structure in the container, the measured value of the reference echo signal position generated by the i-th reflection structure each time, and the measured value of the corrected liquid interface position each time, distance calibration is performed on the measured value of the corrected liquid interface position to obtain the actual height position information of the liquid interface position in the container.

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