Plate processing control method, device, computer equipment and storage medium

Abstract

The embodiments of the present application belong to the field of sheet metal processing technology and relate to a sheet metal processing control method, apparatus, computer equipment, and storage medium. The method includes: obtaining an initial layout electronic drawing of a sheet metal to be cut, the initial layout electronic drawing including graphic objects of target components; calculating the graphic complexity of each graphic object based on the area and number of inflection points of each graphic object; using the graphic complexity as a layout factor, and arranging each graphic object based on a layout algorithm to obtain a standard layout electronic drawing; dividing the standard layout electronic drawing into a plurality of sub-drawing areas; running the same number of threads as the sub-drawing areas to determine a first cutting path within each sub-drawing area and a second cutting path between each sub-drawing area in parallel based on a path planning algorithm, thereby obtaining a standard cutting path; and controlling a laser cutter to cut the sheet metal to be cut according to the standard cutting path to obtain each target component. The present application improves sheet metal processing efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of plate processing, and in particular to a plate processing control method, device, computer equipment and storage medium. Background Art

[0002] In industrial production, lasers are often used to cut and process sheet metal, allowing the resulting components to be used to produce the desired product. Improving product output and processing efficiency is a must-have for manufacturers.

[0003] During sheet metal processing, multiple or even multiple components may be cut from a single sheet. Before cutting, the distribution of the components within the sheet and the cutting path are typically planned. However, when a large number of components need to be cut, these planning steps can be time-consuming and reduce sheet metal processing efficiency. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a plate processing control method, device, computer equipment and storage medium to solve the problem of low plate processing efficiency.

[0005] In order to solve the above technical problems, the present application provides a plate processing control method, which adopts the following technical solutions:

[0006] Obtaining an initial layout electronic drawing of the plate to be cut, wherein the initial layout electronic drawing includes a graphic object of the target component;

[0007] Calculating the graphic complexity of each graphic object according to the area and the number of inflection points of each graphic object;

[0008] Using the graphic complexity as a nesting factor, nesting the graphic objects based on a preset nesting algorithm to obtain a standard nested electronic drawing;

[0009] Dividing the standard layout electronic drawing into a plurality of sub-drawing areas;

[0010] Running a plurality of threads to determine, in parallel, a first cutting path within each sub-drawing area and a second cutting path between the sub-drawing areas based on a preset path planning algorithm, and obtaining a standard cutting path based on the first cutting path and the second cutting path, wherein the number of running threads is the same as the number of sub-drawing areas;

[0011] The laser cutter is controlled to cut the plate to be cut according to the standard cutting path to obtain target components.

[0012] In order to solve the above technical problems, the present application also provides a plate processing control device, which adopts the following technical solution:

[0013] A drawing acquisition module is used to acquire an initial layout electronic drawing of the plate to be cut, wherein the initial layout electronic drawing includes a graphic object of the target component;

[0014] A complexity calculation module, configured to calculate the graphic complexity of each graphic object based on the area and the number of inflection points of each graphic object;

[0015] An object nesting module, configured to nest the graphic objects based on a preset nesting algorithm using the graphic complexity as a nesting factor to obtain a standard nested electronic drawing;

[0016] A drawing division module, used for dividing the standard layout electronic drawing into a plurality of sub-drawing areas;

[0017] a path determination module, configured to run a plurality of threads to determine, in parallel, a first cutting path within each sub-drawing area and a second cutting path between the sub-drawing areas based on a preset path planning algorithm, and to obtain a standard cutting path based on the first cutting path and the second cutting path, wherein the number of running threads is the same as the number of sub-drawing areas;

[0018] The plate cutting module is used to control the laser cutter to cut the plate to be cut according to the standard cutting path to obtain various target components.

[0019] In order to solve the above technical problems, the embodiment of the present application further provides a computer device, which adopts the following technical solution:

[0020] Obtaining an initial layout electronic drawing of the plate to be cut, wherein the initial layout electronic drawing includes a graphic object of the target component;

[0021] Calculating the graphic complexity of each graphic object according to the area and the number of inflection points of each graphic object;

[0022] Using the graphic complexity as a nesting factor, nesting the graphic objects based on a preset nesting algorithm to obtain a standard nested electronic drawing;

[0023] Dividing the standard layout electronic drawing into a plurality of sub-drawing areas;

[0024] Running a plurality of threads to determine, in parallel, a first cutting path within each sub-drawing area and a second cutting path between the sub-drawing areas based on a preset path planning algorithm, and obtaining a standard cutting path based on the first cutting path and the second cutting path, wherein the number of running threads is the same as the number of sub-drawing areas;

[0025] The laser cutter is controlled to cut the plate to be cut according to the standard cutting path to obtain target components.

[0026] In order to solve the above technical problems, the embodiment of the present application further provides a computer-readable storage medium, which adopts the following technical solution:

[0027] Obtaining an initial layout electronic drawing of the plate to be cut, wherein the initial layout electronic drawing includes a graphic object of the target component;

[0028] Calculating the graphic complexity of each graphic object according to the area and the number of inflection points of each graphic object;

[0029] Using the graphic complexity as a nesting factor, nesting the graphic objects based on a preset nesting algorithm to obtain a standard nested electronic drawing;

[0030] Dividing the standard layout electronic drawing into a plurality of sub-drawing areas;

[0031] Running a plurality of threads to determine, in parallel, a first cutting path within each sub-drawing area and a second cutting path between the sub-drawing areas based on a preset path planning algorithm, and obtaining a standard cutting path based on the first cutting path and the second cutting path, wherein the number of running threads is the same as the number of sub-drawing areas;

[0032] The laser cutter is controlled to cut the plate to be cut according to the standard cutting path to obtain target components.

[0033] Compared with the prior art, the embodiments of the present application mainly have the following beneficial effects: obtaining an initial layout electronic drawing of the plate to be cut, the initial layout electronic drawing including the graphic object of the target component; calculating the graphic complexity of each graphic object according to the area and the number of inflection points of the graphic object; arranging the graphic objects according to the layout algorithm to make full use of the plate to be cut and reduce resource waste. The graphic complexity must also be combined during layout so that graphic objects of different complexities can be arranged separately to facilitate cutting control; dividing the standard layout electronic drawing obtained after layout into several sub-drawing areas, determining the first cutting path within each sub-drawing area and the second cutting path between each sub-drawing area based on the path planning algorithm to obtain a standard cutting path, and running multiple threads in parallel at the same time, each thread performs path planning on a sub-drawing area to improve the path planning efficiency; the standard cutting path is used to instruct the laser cutting head to cut the plate, reducing the moving path during cutting, and further improving the plate processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the solutions in this application, a brief introduction will be given below to the drawings required for use in the description of the embodiments of this application. Obviously, the drawings described below are some embodiments of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0035] Figure 1 is an exemplary system architecture diagram to which the present application may be applied;

[0036] Figure 2 is a flow chart of an embodiment of a plate processing control method according to the present application;

[0037] Figure 3 is a structural schematic diagram of an embodiment of a plate processing control device according to the present application;

[0038] Figure 4 It is a structural diagram of an embodiment of a computer device according to the present application. DETAILED DESCRIPTION

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meanings as commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the application are for the purpose of describing specific embodiments only and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0040] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0041] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0042] like Figure 1As shown, system architecture 100 may include a terminal 101, a network 102, and a cutting platform 103. Network 102 provides a communication link between terminal 101 and cutting platform 103. Network 102 may include various connection types, such as wired or wireless communication links or fiber optic cables. Terminal 101 may be, but is not limited to, various industrial computers, personal computers, and laptop computers. Terminal 101 may control cutting platform 103 to cut the plate.

[0043] It should be noted that the plate processing control method provided in the embodiment of the present application is generally executed by a terminal, and accordingly, the plate processing control device is generally set in the terminal.

[0044] It should be understood that Figure 1 The number of terminals and cutting platforms in the embodiment is merely illustrative. Any number of terminals and cutting platforms may be provided as required.

[0045] Continue to refer Figure 2 , shows a flow chart of an embodiment of a plate processing control method according to the present application. The plate processing control method comprises the following steps:

[0046] Step S201: obtaining an initial layout electronic drawing of a plate to be cut, wherein the initial layout electronic drawing includes a graphic object of a target component.

[0047] In this embodiment, the electronic device (eg Figure 1 The terminal shown in the figure can communicate with the cutting platform via a wired connection or a wireless connection. It should be noted that the wireless connection method may include but is not limited to 3G / 4G connection, WiFi connection, Bluetooth connection, WiMAX connection, Zigbee connection, UWB (ultra wideband) connection, and other wireless connection methods currently known or to be developed in the future.

[0048] Among them, the initial layout electronic drawing can be an electronic drawing for the layout design of the plate to be cut; the target component can be a component that needs to be cut from the plate to be cut; in the electronic drawing, it is necessary to draw a graphic according to the actual shape of the target component to obtain a graphic object of the target component, wherein the size of the graphic object and the actual size of the target component conform to a preset scale.

[0049] Specifically, the initial layout electronic drawing can be pre-drawn and stored in the terminal. The terminal, in response to a drawing acquisition instruction, reads the initial layout electronic drawing corresponding to the drawing number in the drawing acquisition instruction. In one embodiment, a user can also operate the terminal to draw the initial layout electronic drawing in the cutting control software. The initial layout electronic drawing includes a graphic object of a target component. There can be multiple types of target components, and the number of graphic objects for each target component can also be multiple.

[0050] In one embodiment, the initial layout electronic drawing may be a file in CAD (Computer Aided Design) format.

[0051] In one embodiment, the area of ​​the initial layout electronic drawing is larger than the area of ​​the sheet to be cut after being scaled down to a preset scale. Graphic objects within the initial layout electronic drawing can be positioned arbitrarily. The initial layout electronic drawing identifies a layout area that matches the shape and size of the sheet to be cut. Layout, also known as layout, involves rearranging the graphic objects within the layout area and placing as many graphic objects as possible within the layout area to fully utilize the sheet to be cut.

[0052] Step S202: Calculate the graphic complexity of each graphic object based on the area and the number of inflection points of each graphic object.

[0053] The graphic complexity may be a quantitative evaluation value of the complexity of the graphic object.

[0054] Specifically, before layout, the graphic complexity of each graphic object can be obtained first. The graphic complexity measures the graphic complexity of the graphic object. The higher the graphic complexity value, the more complex the graphic object. The graphic complexity can be determined by the area and the number of inflection points of the graphic object, where the inflection point is the intersection of two edges. Generally, the larger the area, the simpler the graphic can be considered, which can increase the cutting speed; the fewer the number of inflection points, the simpler the graphic, which can also increase the cutting speed. The terminal calculates the area of ​​the graphic object and identifies the number of inflection points. It calculates the area and the number of inflection points according to the preset complexity calculation method to obtain the graphic complexity; when calculating, it can also add weights to the area and the number of inflection points, so that the area and the number of inflection points have different degrees of influence on the graphic complexity.

[0055] Step S203 : Using the graphic complexity as a nesting factor, nesting is performed on each graphic object based on a preset nesting algorithm to obtain a standard nested electronic drawing.

[0056] Specifically, when the shape of a graphic object is complex, the equipment parameter settings for cutting are more complicated, while some graphic objects are simple and the equipment parameter settings for cutting are relatively simple. Therefore, when nesting, the complexity of the graphic can be used as a nesting factor to consider the influence of the graphic complexity during nesting.

[0057] The terminal can arrange the graphic objects according to a preset arrangement algorithm. During arrangement, the terminal can determine the more complex graphic objects according to the complexity of the graphics and arrange them in a preset area.

[0058] In one embodiment, the nesting algorithm implements the nesting steps including: drawing copying and filtering, loop identification, outermost contour judgment, envelope fitting processing, two-dimensional irregular collision and intersection calculation, and pre-assembly docking of parts.

[0059] Drawing copying and filtering involves copying the initial layout electronic drawing and performing layout on the copied copy without changing the original layout electronic drawing. Loop identification is to extract the original geometric feature information from the parameterized drawing. Outermost contour determination is to obtain the contour feature point set of the graphic object, and use this feature point set to perform operations such as graphic intersection calculation and envelope fitting. After obtaining the loop, the unique outermost contour loop is identified from the numerous loops, and the point set coordinates of the outermost contour are obtained. The point set coordinates are the basic data for the layout algorithm.

[0060] Envelope fitting involves first enclosing the outline of a two-dimensional irregular graphic object into a rectangle. This rectangle must completely encompass the endpoints of the graphic object and must also touch the edges of the graphic object. A graphic object can have multiple enclosing rectangles, and the one with the smallest area must be selected from these.

[0061] A key step in nesting is determining whether graphic objects overlap or interfere with each other. When two graphic objects overlap or interfere with each other, they must have an intersection. Based on this principle, algorithms such as moving scan lines, point-based intersection determination, contour projection vector-based determination, and bitmap-based collision determination are currently commonly used. When a minimum bounding rectangle is obtained, a separate intersection determination method based on the minimum bounding rectangle's envelope can be used. This method uses the coordinates of the minimum bounding rectangle to determine whether there is overlap or interference.

[0062] In nesting research, extracting and pre-combining graphic objects can often reduce gaps between them. For example, irregular graphic objects can be docked together through complementary combinations to reduce nesting gaps. When pre-combining and docking parts, three features can be used: area, enclosing rectangle coverage, and approximate major-minor axis ratio. The subtraction algorithm in dynamic clustering can be used to cluster the parts.

[0063] In one embodiment, after obtaining the initial layout electronic drawing, the drawing can be copied and filtered, loops can be identified, and the outermost contour can be judged. After obtaining the outermost contour, the graphic complexity can be calculated, and then envelope fitting processing, two-dimensional irregular collision and intersection calculation, and pre-assembly docking of parts can be performed.

[0064] Furthermore, the above-mentioned step S203 may include: dividing each graphic object into a first graphic object and a second graphic object according to the complexity of the graphic; nesting each first graphic object in the first area of ​​the initial nesting electronic drawing based on a preset nesting algorithm; and nesting each second graphic object in the second area of ​​the initial nesting electronic drawing based on the nesting algorithm to obtain a standard nesting electronic drawing.

[0065] Specifically, a preset complexity threshold is obtained, and graphic objects are classified according to the graphic complexity and the complexity threshold, wherein graphic objects with a complexity less than the complexity threshold can be classified as first graphic objects, and graphic objects with a complexity greater than the complexity threshold can be classified as second graphic objects.

[0066] The first graphic object can be nested within the first area of ​​the initial nested electronic drawing based on a preset nesting algorithm. In practice, the first area is not a designated area; nesting can begin from any corner of the drawing nesting area. The area where the first graphic object is nested is the first area. After nesting the first graphic object, the blank area where the first graphic object is not nested is the second area. The terminal nests the second graphic object within the second area based on the nesting algorithm, resulting in a final standard nested electronic drawing.

[0067] It can be understood that in actual applications, graphic objects can be divided into multiple categories, and are not necessarily limited to two categories.

[0068] In this embodiment, graphic objects are classified according to their complexity, and each type of graphic objects is separately arranged during nesting. Graphic objects of the same type can be arranged together during nesting, which facilitates cutting control.

[0069] Step S204: Divide the standard layout electronic drawing into a plurality of sub-drawing areas.

[0070] Specifically, the terminal can split the standard layout electronic drawing into several sub-drawing areas. Each sub-drawing area contains graphic objects, and each graphic object can only be divided into one sub-drawing area. The number of sub-drawing areas can be set according to actual conditions.

[0071] Furthermore, the above step S204 may include: dividing the first area in the standard layout electronic drawing into a plurality of sub-drawing areas; and dividing each second graphic object in the second area into a sub-drawing area.

[0072] Specifically, the first area of ​​a standard layout electronic drawing can be divided into several sub-drawing areas. The number of sub-drawing areas can be pre-set or temporarily set based on actual conditions. For graphic objects in the second area of ​​a standard layout electronic drawing, due to their high complexity, each graphic object can be individually divided into a sub-drawing area.

[0073] In this embodiment, different division methods are used for graphic objects of different graphic complexity. Graphic objects with higher graphic complexity can be separately divided into a sub-drawing area, which facilitates subsequent cutting control.

[0074] Step S205, running several threads to determine in parallel the first cutting path within each sub-drawing area and the second cutting path between each sub-drawing area based on a preset path planning algorithm, and obtaining a standard cutting path according to the first cutting path and the second cutting path, wherein the number of running threads is the same as the number of sub-drawing areas.

[0075] Specifically, directly planning the cutting path for a complete standard layout electronic drawing is time-consuming and inefficient. Therefore, the standard layout electronic drawing is divided into several sub-drawing areas, and threads equal in number to the sub-drawing areas are run in parallel. Each thread plans the cutting path for a sub-drawing area based on a preset path planning algorithm, obtaining the first cutting path within each sub-drawing area. The first cutting path indicates the movement path of the laser cutting head during cutting. When cutting according to the first cutting path, the laser cutting head can obtain the target element corresponding to each graphic object in the sub-drawing area with the shortest movement distance.

[0076] Since there are several sub-drawing areas, a second cutting path between each sub-drawing area needs to be determined according to a path planning algorithm. The second cutting path indicates the shortest path when moving in each sub-drawing area.

[0077] The path planning algorithm can construct the optimal solution of the cutting path based on the greedy algorithm. The greedy algorithm relies on the greedy criterion to ensure that the distance between the processing end point of the previous processing trajectory and the processing starting point of the next processing trajectory is the shortest.

[0078] Step S206 , controlling the laser cutter to cut the plate to be cut according to the standard cutting path to obtain target components.

[0079] Specifically, the standard cutting path defines the movement trajectory of the laser cutter during cutting. The terminal controls the laser cutter to cut the plate to be cut according to the standard cutting path, thereby obtaining each target component.

[0080] Furthermore, the above-mentioned step S206 may include: obtaining the graphic complexity of each graphic object in each sub-drawing area; determining the cutting speed of the laser cutter in each sub-drawing area based on the obtained graphic complexity; controlling the laser cutter to cut the plate to be cut according to the determined standard cutting path and cutting speed to obtain each target element.

[0081] Specifically, the cutting may be performed in units of sub-drawing areas. First, the target element of the graphic object in one sub-drawing area is obtained by cutting, and then cutting is performed according to another sub-drawing area.

[0082] When cutting a sub-drawing area, the graphic complexity of each graphic object in the sub-drawing area can be obtained, and the cutting speed of the laser cutter when cutting the sub-drawing area can be determined based on the graphic complexity. For example, the average graphic complexity of each graphic object in the sub-drawing area can be calculated, and the cutting speed corresponding to the average value can be searched in the cutting speed table; or, a uniform cutting speed can be used for the graphic objects in the first area, and another uniform cutting speed can be used for the graphic objects in the second area.

[0083] When the complexity of the graphics is high, the cutting speed needs to be reduced to ensure the cutting accuracy; when the complexity of the graphics is low, the cutting speed can be increased to improve the cutting efficiency.

[0084] The terminal controls the laser cutter to cut the plate to be cut according to the determined standard cutting path and cutting speed, and obtains each target component after the cutting is completed.

[0085] In one embodiment, the terminal can also simulate the cutting process according to the standard cutting path and cutting speed, calculate the processing time required, and display it through the display screen; it can also calculate the time required for the remaining progress in real time according to the current processing progress during the processing process, and display it through the display screen.

[0086] In this embodiment, the cutting speed corresponding to each sub-drawing area is determined according to the complexity of the graphics, and the laser cutter cuts according to the standard cutting path and cutting speed. During cutting, the moving distance of the laser cutter is reduced, the cutting efficiency is improved, and the cutting accuracy is guaranteed.

[0087] In this embodiment, an initial layout electronic drawing of the plate to be cut is obtained, and the initial layout electronic drawing includes the graphic objects of the target components; the graphic complexity of each graphic object is calculated according to the area and the number of inflection points of the graphic object; the graphic objects are arranged according to the layout algorithm to make full use of the plate to be cut and reduce resource waste. The graphic complexity needs to be taken into consideration during the layout so that graphic objects of different complexities can be arranged separately to facilitate cutting control; the standard layout electronic drawing obtained after the layout is divided into several sub-drawing areas, and the first cutting path within each sub-drawing area and the second cutting path between each sub-drawing area are determined based on the path planning algorithm to obtain a standard cutting path, and multiple threads are run in parallel, and each thread performs path planning on a sub-drawing area to improve the path planning efficiency; the standard cutting path is used to instruct the laser cutting head to cut the plate, thereby reducing the moving path during cutting and further improving the plate processing efficiency.

[0088] Furthermore, after the above step S203, it can also include: determining the candidate cutting area of ​​each target component on the plate to be cut according to the standard layout electronic drawing; adding a graphic code corresponding to the target component in the candidate cutting area, and the graphic code is used to obtain the component information of the target component from the database, and the component information includes processing information, storage information and logistics information.

[0089] The candidate cutting area is an area on the plate to be cut. After cutting according to the area contour of the candidate cutting area, the target component can be obtained.

[0090] Specifically, after obtaining the standard layout electronic drawing, the terminal determines the candidate cutting area of ​​each target component on the plate to be cut, and adds a graphic code corresponding to the target component in the candidate cutting area. Among them, the graphic code includes but is not limited to a QR code and a barcode. The present application can record the component information of the target component through a database, and the component information includes processing information, storage information and logistics information. The processing information may include the production date of the target component, the type of workpiece, the size information, various processing states and state change time, the equipment operator during processing, etc. The storage information may record information related to the storage of the target component, such as the warehouse number where it is stored. The logistics information may record relevant information about the logistics process of the target component. The component information may also include the component number of the target component.

[0091] By scanning the graphic code, you can access the component information stored in the database, thereby enabling the monitoring and tracking of the target component from processing, warehousing and sales, facilitating the management of the target component and improving the management efficiency of the target component.

[0092] In this embodiment, a graphic code is added to the target component, and component information of the target component can be obtained from the database after scanning the graphic code, thereby realizing monitoring of the target component and improving management efficiency of the target component.

[0093] Furthermore, after the above step S206, the following steps may be included: obtaining a component image of each target component; and inspecting each target component according to the component image to obtain a component inspection result, wherein the component inspection result includes a size inspection result and a defect inspection result.

[0094] Specifically, after cutting is completed, the target components can be inspected using machine vision. The terminal captures images of each target component using an image acquisition device on the cutting platform. Based on these images, the terminal then inspects the target components, including both dimensional and defect detection. Dimensional inspection determines whether the target component's dimensions meet preset specifications. Defect detection determines whether the target component contains quality defects. Quality inspection can use morphological characteristics such as the kerf's dross rate, kerf width, heat-affected zone, roughness, kerf taper, and surface striations as indicators for evaluating laser cutting quality.

[0095] The terminal can perform digital image processing on component images to enable component inspection. Alternatively, component images can be input into a pre-trained neural network model for component inspection. After inspection, component inspection results are obtained, including dimensional and defect detection results. If component dimensions do not meet preset requirements or quality defects are present, an early warning command can be triggered, instructing the user to retrieve the target component that failed inspection according to the warning command, thereby improving the final yield rate.

[0096] In this embodiment, the target component is automatically detected according to the component image, and the component detection result is generated, thereby improving the detection efficiency.

[0097] Furthermore, after the above step S206, it may also include: obtaining an initial storage electronic drawing of the component storage area; based on a nesting algorithm, nesting the graphic objects of each target component in the initial storage electronic drawing to obtain a standard storage electronic drawing, and the standard storage electronic drawing is used to indicate the placement of each target component in the component storage area.

[0098] The component storage area may be a space for storing and placing target components. The initially stored electronic drawing may be a drawing drawn according to the actual shape of the component storage area, and the size of the initially stored electronic drawing and the size of the component storage area conform to a preset scale.

[0099] Specifically, the terminal retrieves the initially stored electronic drawing from the component storage area and nests the graphic objects of each target component in the initially stored electronic drawing according to a nesting algorithm to generate a standard electronic drawing. Nesting within the initially stored electronic drawing follows the same nesting algorithm as that used for the initial nested electronic drawing. The only requirement is that a certain distance be set between each target component to create a path between them for easy handling and movement.

[0100] Standard storage electronic drawings are used to indicate the placement of cut target components in the component storage area, and nesting algorithms are also used in component placement to fully utilize the storage space.

[0101] In this embodiment, after obtaining the initial storage electronic drawing of the component storage area, the graphic objects of each target component are nested in the initial storage electronic drawing based on the nesting algorithm, so that each target component can be stacked according to the nested standard storage electronic drawing, thereby fully utilizing the storage space.

[0102] Those skilled in the art will appreciate that all or part of the processes in the above-described method embodiments can be implemented by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When executed, the program can include the processes in the above-described method embodiments. The aforementioned storage medium can be a non-volatile storage medium such as a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

[0103] It should be understood that although the steps in the flowcharts of the accompanying drawings are shown in sequence as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some of the steps in the flowcharts of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a portion of the sub-steps or stages of other steps.

[0104] Further references Figure 3 , as a response to the above Figure 2 In order to realize the method shown in the figure, the present application provides an embodiment of a plate processing control device. Figure 2 Corresponding to the method embodiment shown, the device can be specifically applied to various electronic devices.

[0105] like Figure 3 As shown, the plate processing control device 300 of this embodiment includes: a drawing acquisition module 301, a complexity calculation module 302, an object layout module 303, a drawing division module 304, a path determination module 305 and a plate cutting module 306, wherein:

[0106] The drawing acquisition module 301 is used to acquire an initial layout electronic drawing of the plate to be cut, where the initial layout electronic drawing includes a graphic object of a target component.

[0107] The complexity calculation module 302 is used to calculate the graphic complexity of each graphic object according to the area and the number of inflection points of each graphic object.

[0108] The object nesting module 303 is configured to use the graphic complexity as a nesting factor and nest each graphic object based on a preset nesting algorithm to obtain a standard nested electronic drawing.

[0109] The drawing division module 304 is used to divide the standard layout electronic drawing into several sub-drawing areas.

[0110] The path determination module 305 is used to run several threads to determine the first cutting path within each sub-drawing area and the second cutting path between each sub-drawing area in parallel based on a preset path planning algorithm, and obtain a standard cutting path based on the first cutting path and the second cutting path, wherein the number of running threads is the same as the number of sub-drawing areas.

[0111] The plate cutting module 306 is used to control the laser cutter to cut the plate to be cut according to the standard cutting path to obtain various target components.

[0112] In this embodiment, an initial layout electronic drawing of the plate to be cut is obtained, and the initial layout electronic drawing includes the graphic objects of the target components; the graphic complexity of each graphic object is calculated according to the area and the number of inflection points of the graphic object; the graphic objects are arranged according to the layout algorithm to make full use of the plate to be cut and reduce resource waste. The graphic complexity needs to be taken into consideration during the layout so that graphic objects of different complexities can be arranged separately to facilitate cutting control; the standard layout electronic drawing obtained after the layout is divided into several sub-drawing areas, and the first cutting path within each sub-drawing area and the second cutting path between each sub-drawing area are determined based on the path planning algorithm to obtain a standard cutting path, and multiple threads are run in parallel, and each thread performs path planning on a sub-drawing area to improve the path planning efficiency; the standard cutting path is used to instruct the laser cutting head to cut the plate, thereby reducing the moving path during cutting and further improving the plate processing efficiency.

[0113] In some optional implementations of this embodiment, the object arrangement module 303 may include: an object division submodule, a first arrangement module, and a second arrangement module, wherein:

[0114] The object division submodule is used to divide each graphic object into a first graphic object and a second graphic object according to the complexity of the graphic.

[0115] The first nesting module is used to nest the first graphic objects in the first area of ​​the initial nesting electronic drawing based on a preset nesting algorithm.

[0116] The second nesting module is used to nest the second graphic objects in the second area of ​​the initial nesting electronic drawing based on the nesting algorithm to obtain a standard nesting electronic drawing.

[0117] In this embodiment, graphic objects are classified according to their complexity, and each type of graphic objects is separately arranged during nesting. Graphic objects of the same type can be arranged together during nesting, which facilitates cutting control.

[0118] In some optional implementations of this embodiment, the drawing division module 304 may include: a first division submodule and a second division submodule, wherein:

[0119] The first division submodule is used to divide the first area in the standard layout electronic drawing into a plurality of sub-drawing areas.

[0120] The second division submodule is used to divide each second graphic object in the second area into sub-drawing areas.

[0121] In this embodiment, different division methods are used for graphic objects of different graphic complexity. Graphic objects with higher graphic complexity can be separately divided into a sub-drawing area, which facilitates subsequent cutting control.

[0122] In some optional implementations of this embodiment, the plate cutting module 306 may include: a complexity acquisition submodule, a speed determination submodule, and a cutting control submodule, wherein:

[0123] The complexity acquisition submodule is used to obtain the graphic complexity of each graphic object in each sub-drawing area.

[0124] The speed determination submodule is used to determine the cutting speed of the laser cutter in each sub-drawing area according to the acquired graphic complexity.

[0125] The cutting control submodule is used to control the laser cutter to cut the plate to be cut according to the determined standard cutting path and cutting speed to obtain each target component.

[0126] In this embodiment, the cutting speed corresponding to each sub-drawing area is determined according to the complexity of the graphics, and the laser cutter cuts according to the standard cutting path and cutting speed. During cutting, the moving distance of the laser cutter is reduced, the cutting efficiency is improved, and the cutting accuracy is guaranteed.

[0127] In some optional implementations of this embodiment, the plate processing control device 300 may include: an area determination module and a graphic code adding module, wherein:

[0128] The area determination module is used to determine the candidate cutting area of ​​each target component on the plate to be cut according to the standard layout electronic drawing.

[0129] The graphic code adding module is used to add the graphic code corresponding to the target component in the candidate cutting area. The graphic code is used to obtain the component information of the target component from the database. The component information includes processing information, storage information and logistics information.

[0130] In this embodiment, a graphic code is added to the target component, and component information of the target component can be obtained from the database after scanning the graphic code, thereby realizing monitoring of the target component and improving management efficiency of the target component.

[0131] In some optional implementations of this embodiment, the plate processing control device 300 may include: an area determination module and a graphic code adding module, wherein:

[0132] The image acquisition module is used to acquire the component image of each target component.

[0133] The component detection module is used to detect each target component according to the component image to obtain component detection results, wherein the component detection results include size detection results and defect detection results.

[0134] In this embodiment, the target component is automatically detected according to the component image, and the component detection result is generated, thereby improving the detection efficiency.

[0135] In some optional implementations of this embodiment, the plate processing control device 300 may include: a storage drawing acquisition module and a storage drawing layout module, wherein:

[0136] The storage drawing acquisition module is used to acquire the initial storage electronic drawing of the component storage area.

[0137] The storage drawing nesting module is used to nest the graphic objects of each target component in the initial storage electronic drawing based on the nesting algorithm to obtain a standard storage electronic drawing. The standard storage electronic drawing is used to indicate the placement of each target component in the component storage area.

[0138] In this embodiment, after obtaining the initial storage electronic drawing of the component storage area, the graphic objects of each target component are nested in the initial storage electronic drawing based on the nesting algorithm, so that each target component can be stacked according to the nested standard storage electronic drawing, thereby fully utilizing the storage space.

[0139] To solve the above technical problems, the present application also provides a computer device. Figure 4 , Figure 4 This is a basic structural block diagram of the computer device in this embodiment.

[0140] The computer device 4 includes a memory 41, a processor 42, and a network interface 43 that are interconnected through a system bus. It should be noted that the figure only shows a computer device 4 with components 41-43, but it should be understood that it is not required to implement all the components shown, and more or fewer components can be implemented instead. Among them, those skilled in the art can understand that the computer device here is a device that can automatically perform numerical calculations and / or information processing according to pre-set or stored instructions, and its hardware includes but is not limited to microprocessors, application-specific integrated circuits (ASICs), programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc.

[0141] The computer device may be a desktop computer, notebook computer, PDA, cloud server, etc. The computer device may interact with the user via a keyboard, mouse, remote control, touchpad, or voice control device.

[0142] The memory 41 includes at least one type of readable storage medium, including flash memory, a hard disk, a multimedia card, a card-type memory (e.g., SD or DX memory), random access memory (RAM), static random access memory (SRAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), programmable read-only memory (PROM), magnetic storage, a magnetic disk, an optical disk, etc. In some embodiments, the memory 41 may be an internal storage unit of the computer device 4, such as the hard disk or memory of the computer device 4. In other embodiments, the memory 41 may also be an external storage device of the computer device 4, such as a plug-in hard disk, a smart media card (SMC), a secure digital (SD) card, a flash memory card, etc. Of course, the memory 41 may also include both the internal storage unit of the computer device 4 and its external storage device. In this embodiment, the memory 41 is generally used to store the operating system and various application software installed on the computer device 4, such as computer-readable instructions for the plate processing control method. In addition, the memory 41 can also be used to temporarily store various types of data that have been output or are to be output.

[0143] In some embodiments, the processor 42 can be a central processing unit (CPU), a controller, a microcontroller, a microprocessor, or other data processing chip. The processor 42 is generally used to control the overall operation of the computer device 4. In this embodiment, the processor 42 is used to execute computer-readable instructions or process data stored in the memory 41, such as computer-readable instructions for executing the plate processing control method.

[0144] The network interface 43 may include a wireless network interface or a wired network interface. The network interface 43 is generally used to establish a communication connection between the computer device 4 and other electronic devices.

[0145] The computer device provided in this embodiment can execute the above-mentioned plate processing control method, which can be the plate processing control method of each of the above-mentioned embodiments.

[0146] In this embodiment, an initial layout electronic drawing of the plate to be cut is obtained, and the initial layout electronic drawing includes the graphic objects of the target components; the graphic complexity of each graphic object is calculated according to the area and the number of inflection points of the graphic object; the graphic objects are arranged according to the layout algorithm to make full use of the plate to be cut and reduce resource waste. The graphic complexity needs to be taken into consideration during the layout so that graphic objects of different complexities can be arranged separately to facilitate cutting control; the standard layout electronic drawing obtained after the layout is divided into several sub-drawing areas, and the first cutting path within each sub-drawing area and the second cutting path between each sub-drawing area are determined based on the path planning algorithm to obtain a standard cutting path, and multiple threads are run in parallel, and each thread performs path planning on a sub-drawing area to improve the path planning efficiency; the standard cutting path is used to instruct the laser cutting head to cut the plate, thereby reducing the moving path during cutting and further improving the plate processing efficiency.

[0147] The present application also provides another embodiment, namely, providing a computer-readable storage medium, which stores computer-readable instructions, and the computer-readable instructions can be executed by at least one processor to enable the at least one processor to perform the steps of the plate processing control method as described above.

[0148] In this embodiment, an initial layout electronic drawing of the plate to be cut is obtained, and the initial layout electronic drawing includes the graphic objects of the target components; the graphic complexity of each graphic object is calculated according to the area and the number of inflection points of the graphic object; the graphic objects are arranged according to the layout algorithm to make full use of the plate to be cut and reduce resource waste. The graphic complexity needs to be taken into consideration during the layout so that graphic objects of different complexities can be arranged separately to facilitate cutting control; the standard layout electronic drawing obtained after the layout is divided into several sub-drawing areas, and the first cutting path within each sub-drawing area and the second cutting path between each sub-drawing area are determined based on the path planning algorithm to obtain a standard cutting path, and multiple threads are run in parallel, and each thread performs path planning on a sub-drawing area to improve the path planning efficiency; the standard cutting path is used to instruct the laser cutting head to cut the plate, thereby reducing the moving path during cutting and further improving the plate processing efficiency.

[0149] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus the necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for enabling a terminal device (which can be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0150] Obviously, the embodiments described above are only some of the embodiments of the present application, rather than all of the embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned specific embodiments, or to make equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the present application specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present application.

Claims

1. A plate processing control method, characterized in that: The steps include: Obtaining an initial layout electronic drawing of the plate to be cut, wherein the initial layout electronic drawing includes a graphic object of the target component; Calculating the graphic complexity of each graphic object according to the area and the number of inflection points of each graphic object; Using the graphic complexity as a nesting factor, nesting the graphic objects based on a preset nesting algorithm to obtain a standard nested electronic drawing, wherein a preset complexity threshold is obtained, and the graphic objects are classified according to the graphic complexity and the complexity threshold, with graphic objects whose graphic complexity is less than the complexity threshold being classified as first graphic objects, and graphic objects whose graphic complexity is greater than the complexity threshold being classified as second graphic objects. Nesting is started from any corner of the drawing nesting area, and the area where the first graphic object is nested is the first area. After the first graphic object is nested, the blank area where the first graphic object is not nested is the second area. Dividing the standard layout electronic drawing into a plurality of sub-drawing areas; Running a plurality of threads to determine, in parallel, a first cutting path within each sub-drawing area and a second cutting path between the sub-drawing areas based on a preset path planning algorithm, and obtaining a standard cutting path based on the first cutting path and the second cutting path, wherein the number of running threads is the same as the number of sub-drawing areas; The laser cutter is controlled to cut the plate to be cut according to the standard cutting path to obtain target components.

2. The plate processing control method according to claim 1, characterized in that: The step of using the graphic complexity as a nesting factor and nesting the graphic objects based on a preset nesting algorithm to obtain a standard nested electronic drawing includes: dividing the graphic objects into first graphic objects and second graphic objects according to the graphic complexity; Nesting each first graphic object in the first area of ​​the initial nesting electronic drawing based on a preset nesting algorithm; In the second area of ​​the initial nested electronic drawing, each second graphic object is nested based on the nesting algorithm to obtain a standard nested electronic drawing.

3. The plate processing control method according to claim 2, characterized in that: The step of dividing the standard layout electronic drawing into a plurality of sub-drawing areas includes: Dividing the first area in the standard layout electronic drawing into a plurality of sub-drawing areas; Each second graphic object in the second area is divided into sub-drawing areas.

4. The plate processing control method according to claim 3, characterized in that: The step of controlling the laser cutter to cut the plate to be cut according to the standard cutting path to obtain each target element includes: Obtaining the graphic complexity of each graphic object in each sub-drawing area; Determining a cutting speed of a laser cutter within each sub-drawing area according to the acquired graphic complexity; The laser cutter is controlled to cut the plate to be cut according to a determined standard cutting path and cutting speed to obtain target components.

5. The plate processing control method according to claim 1, characterized in that: After the step of using the graphic complexity as a nesting factor and nesting the graphic objects based on a preset nesting algorithm to obtain a standard nested electronic drawing, the method further includes: Determining candidate cutting areas for each target component on the plate to be cut according to the standard layout electronic drawing; A graphic code corresponding to the target component is added in the candidate cutting area, and the graphic code is used to obtain component information of the target component from a database, and the component information includes processing information, storage information and logistics information.

6. The plate processing control method according to claim 1, characterized in that: After the step of controlling the laser cutter to cut the plate to be cut according to the standard cutting path to obtain each target element, the method further includes: Acquiring a component image of each target component; The target components are inspected according to the component images to obtain component inspection results, wherein the component inspection results include size inspection results and defect inspection results.

7. The plate processing control method according to claim 1, characterized in that: After the step of controlling the laser cutter to cut the plate to be cut according to the standard cutting path to obtain each target element, the method further includes: Obtaining an initial storage electronic drawing of a component storage area; Based on the nesting algorithm, the graphic objects of the target components are nested in the initial stored electronic drawing to obtain a standard stored electronic drawing, and the standard stored electronic drawing is used to indicate the placement of the target components in the component storage area.

8. A plate processing control device, characterized in that: include: A drawing acquisition module is used to acquire an initial layout electronic drawing of the plate to be cut, wherein the initial layout electronic drawing includes a graphic object of the target component; A complexity calculation module, configured to calculate the graphic complexity of each graphic object based on the area and the number of inflection points of each graphic object; an object nesting module, configured to nest the graphic objects based on a preset nesting algorithm using the graphic complexity as a nesting factor to obtain a standard nested electronic drawing, wherein a preset complexity threshold is obtained, and graphic objects are classified according to the graphic complexity and the complexity threshold, with graphic objects whose graphic complexity is less than the complexity threshold being classified as first graphic objects, and graphic objects whose graphic complexity is greater than the complexity threshold being classified as second graphic objects, with nesting starting from any corner of the drawing nesting area, and the area where the first graphic objects are nested being the first area. After nesting the first graphic objects, the blank area where the first graphic objects are not nested being the second area; A drawing division module, used for dividing the standard layout electronic drawing into a plurality of sub-drawing areas; a path determination module, configured to run a plurality of threads to determine, in parallel, a first cutting path within each sub-drawing area and a second cutting path between the sub-drawing areas based on a preset path planning algorithm, and to obtain a standard cutting path based on the first cutting path and the second cutting path, wherein the number of running threads is the same as the number of sub-drawing areas; The plate cutting module is used to control the laser cutter to cut the plate to be cut according to the standard cutting path to obtain various target components.

9. A computer device comprising a memory and a processor, wherein the memory stores computer-readable instructions, and the processor implements the steps of the plate processing control method according to any one of claims 1 to 7 when executing the computer-readable instructions.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer-readable instructions, and when the computer-readable instructions are executed by a processor, the steps of the plate processing control method according to any one of claims 1 to 7 are implemented.

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