A GPP chip glass passivation powder wiping device

Abstract

The present invention provides a GPP chip glass passivation powder wiping device, comprising a box cover, wherein a swing arm assembly is provided inside the box cover, and the bottom end of the swing arm assembly is rotatably connected to a wiping plate assembly; the swing arm assembly is used to drive the wiping plate assembly to rise and fall and rotate; a powder wiping platform is fixed to the bottom end of the box cover, and a vacuum suction cup is cooperatively connected to the surface of the powder wiping platform; a main shaft is fixed to the bottom end of the vacuum suction cup, and the main shaft passes through the powder wiping platform; a lifting assembly is provided at the bottom end of the main shaft; the lifting assembly is used to drive the main shaft to rise and fall. The powder wiping device of the present invention adopts a liftable vacuum suction cup to adsorb a fixed silicon wafer, and utilizes a rotatable and liftable wiping plate assembly to perform a powder wiping operation on the fixed silicon wafer; when the device of the present invention is used for powdering, the pressure of the powder wiping can be stable and uniform, which can effectively ensure the processing quality of the silicon wafer, reduce the loss of the silicon wafer, and at the same time have high processing efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of chip processing, in particular to a GPP chip glass passivation powder wiping device. Background Art

[0002] GPP (Glassivation passivation parts) chips are made using a glass passivation process. The GPP chip glass passivation process includes applying glass powder paste to the silicon wafer surface, drying, wiping off residual powder, and high-temperature sintering. Glass passivation is a process unique to GPP chips. The chip's PN junction is protected by passivation glass. The glass layer is formed by melting glass powder by sintering at around 800 degrees Celsius and then cooling it to form a glass layer. This glass layer is fused to the chip and cannot be separated mechanically. The glass passivation process is much better. Products using the protective glue process can only withstand HTRB (high-temperature reverse bias) of around 100 degrees Celsius. However, GPP still performs very well at temperatures reaching 150 degrees Celsius.

[0003] The current processing method used in the market is to manually apply glass powder paste on the silicon wafer. After the powder paste solidifies, the excess residual powder paste is manually wiped off with a wipe paper.

[0004] This method of manually wiping off excess powder with a wiper paper results in varying degrees of powder residue on the wafer surface, and the pressure applied each time cannot be kept consistent. Consequently, the quality of the wafers after wiping varies and cannot be effectively guaranteed. Furthermore, manual processing is inefficient, with each person wiping one wafer per minute. Furthermore, manual loading and unloading of materials results in loss due to the wafers being thin and brittle. Summary of the Invention

[0005] In order to address the shortcomings of the existing technology, the present invention aims to provide a GPP chip glass passivation powder wiping device, which can solve the problem that the pressure during each manual wiping cannot be kept consistent, so the quality of the silicon wafers after wiping is uneven and cannot be effectively guaranteed; in addition, the manual processing efficiency is low, with each person working one minute per wafer, and there is a problem of loss during manual loading and unloading of materials because the silicon wafers are thin and brittle.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] The present invention is realized by the following technical solution: a GPP chip glass passivation powder wiping device, comprising a box cover, a swing arm assembly provided inside the box cover, and the bottom end of the swing arm assembly rotatably connected to the wiping disc assembly; the swing arm assembly is used to drive the wiping disc assembly to rise and fall and rotate;

[0008] A powdering platform is fixed to the inner bottom end of the box cover, and a vacuum suction cup is connected to the surface of the powdering platform; a main shaft is fixed to the bottom end of the vacuum suction cup, and the main shaft passes through the powdering platform; a lifting component is provided at the bottom end of the main shaft; the lifting component is used to drive the main shaft to rise and fall.

[0009] Furthermore, the swing arm assembly includes a lifting part and a swinging part, the lifting part is used to drive the swinging part to lift and lower; the lifting part includes a servo motor, a lead screw, a nut and a guide plate; a guide plate is fixed to the top end of the outer side of the servo motor, and the guide plate is fixed to the bottom end of the box cover; the output end of the servo motor is connected to the lead screw, and the lead screw is matched with a connecting nut; a linear rail is provided on the side of the guide plate.

[0010] Furthermore, the swinging part includes a connecting shell, a swing arm shaft, a fixed box, a first reduction motor and a transmission assembly; a first slider is fixed to the side of the fixed box, and the first slider is slidably connected to the linear rail; a fixing box is fixed to the side of the nut, and the top end of the fixed box is rotatably connected to the swing arm shaft; a connecting shell is fixed to the top end of the swing arm shaft; the other end of the swing arm shaft is connected to the first reduction motor through a transmission assembly.

[0011] Furthermore, the disk wiping assembly includes a second reduction motor, a disk wiping head, and a wiping disk. The second reduction motor is installed on one side of the connecting shell, and the output end of the second reduction motor is connected to the disk wiping head; the bottom end of the disk wiping head is connected to the wiping disk.

[0012] Furthermore, a powder blowing gun is provided at the inner bottom end of the box cover, and a through hole is opened on the surface of the box cover; the through hole cooperates with the vacuum suction cup to be connected to the lifting position.

[0013] Furthermore, the lifting assembly includes a cylinder, a limiting column, a back plate, a second slider and a connecting plate, the back plate is fixed to the bottom end of the box cover, and the side of the back plate is fixed with a cylinder; the top of the cylinder is fixed with a second slider; the second slider is slidably connected to the limiting column, and the limiting column is fixed between the back plate and the box cover; the side of the second slider is fixed with a connecting plate, and the side of the connecting plate is fixed with a main shaft.

[0014] Furthermore, it also includes a support frame and a conveying member, the box cover is fixed inside the support frame, and the support frame is provided with a conveying member; the conveying member is used to convey the workpiece for loading and unloading; the conveying member includes a discharging conveying track, a feeding conveying track, a transmission component and a pushing member, and the two ends of the box cover are respectively fixed with a discharging conveying track and a feeding conveying track of the same structure, and a pushing member is provided at the end of the feeding conveying track, and the pushing member is used to push the workpiece into the feeding conveying track; a transmission component is provided at the top of the discharging conveying track and the feeding conveying track; the transmission component is used to move the workpiece.

[0015] Furthermore, the conveying assembly includes a film support frame, a pneumatic slider, a connecting frame, a pneumatic slide rail and a film placement slot. The pneumatic slide rail is fixed to the bottom end of the support frame, and the surface of the pneumatic slide rail is slidably connected to the pneumatic slider; the side of the pneumatic slider is fixed with a connecting frame, and the bottom end of the connecting frame is fixed with a film support frame; film slots are opened at both ends of the film support frame.

[0016] Furthermore, the pusher includes a fixed frame, a pushing assembly and a push plate. A push plate is provided at the top of the fixed frame, and a pushing assembly is provided between the push plate and the fixed frame; the pushing assembly is used to push the push plate to extend and retract in the fixed frame.

[0017] Furthermore, a groove is provided on the top of the feed film conveyor track, and a limit plate is provided on the side of the groove of the feed film conveyor track; the feed film conveyor track, the discharging film conveyor track, the push plate, and the support frame are at the same horizontal height.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The powder wiping device of the present invention adopts a liftable vacuum suction cup to adsorb and fix the silicon wafer, and utilizes a rotatable and liftable wiping disc assembly to perform a powder wiping operation on the fixed silicon wafer. When the device of the present invention is used for powder wiping, the pressure during the powder wiping process can be stable and uniform, which can effectively ensure the processing quality of the silicon wafer, reduce the loss of the silicon wafer, and at the same time improve the processing efficiency.

[0020] The powder wiping device of the present invention is also provided with a conveying part, which can transport and load silicon wafers that need to be processed and have been processed. When the conveying part transports and loads the materials, it uses the feed conveying track, the discharge conveying track, the pushing part and the transmission component to transport the materials, and reduces the contact area with the silicon wafer as much as possible during transportation, thereby reducing the loss and damage to the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The disclosure of the present invention is described with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of the present invention. In the drawings, the same reference numerals are used to refer to the same components. Among them:

[0022] Figure 1 This is a schematic structural diagram of a GPP chip glass passivation and powdering device according to the present invention;

[0023] Figure 2 This is a schematic diagram of the partial back structure of the present invention;

[0024] Figure 3 Schematic diagram of the structure of the swing arm assembly of the present invention;

[0025] Figure 4 Schematic diagram of the connection structure between the swing arm assembly and the wiping plate assembly of the present invention;

[0026] Figure 5 It is a schematic diagram of the side structure of the lifting assembly of the present invention;

[0027] Figure 6 A schematic diagram of the overall structure of the present invention equipped with a conveying member and a supporting frame;

[0028] Figure 7 It is a structural schematic diagram of the conveying member of the present invention;

[0029] Figure 8 It is a structural schematic diagram of the transmission component of the present invention;

[0030] Figure 9 It is a structural schematic diagram of the feed conveyor track and the pusher of the present invention.

[0031] Explanation of the markings in the figure: 1. Box cover; 11. Through hole; 2. Swing arm assembly; 21. Connecting shell; 22. Swing arm shaft; 23. Fixing box; 231. First slider; 24. First reduction motor; 25. Transmission assembly; 26. Servo motor; 27. Screw; 28. Nut; 29. Guide plate; 291. Linear rail; 3. Wiping plate assembly; 31. Second reduction motor; 32. Wiping plate head; 33. Wiping plate; 4. Powder wiping platform; 5. Lifting assembly; 51. Cylinder; 52. Limiting column; 53. Back Plate; 54, second slider; 55, connecting plate; 6, main shaft; 61, vacuum suction cup; 7, weighing sensor; 71, powder blowing gun; 8, conveying part; 81, discharging conveyor track; 82, feeding conveyor track; 821, limit plate; 83, transmission component; 831, support rack; 832, pneumatic slider; 833, connecting frame; 834, pneumatic slide rail; 835, sheet placement slot; 84, pushing part; 841, fixing frame; 842, pushing assembly; 843, pushing plate; 9, support frame; 9, support frame. DETAILED DESCRIPTION

[0032] It is easy to understand that according to the technical solution of the present invention, without changing the essential spirit of the present invention, a person skilled in the art can propose a variety of interchangeable structural modes and implementation modes. Therefore, the following specific embodiments and drawings are only exemplary descriptions of the technical solution of the present invention and should not be regarded as the entire invention or as a limitation or restriction of the technical solution of the present invention.

[0033] A GPP chip glass passivation powdering device, such as Figure 1 and Figure 2 As shown, it includes a box cover 1, a swing arm assembly 2 is provided inside the box cover 1, and the bottom end of the swing arm assembly 2 is rotatably connected to the wiping disc assembly 3; the swing arm assembly 2 is used to drive the wiping disc assembly 3 to rise and fall and rotate;

[0034] The swing arm assembly 2 is used to adjust the height and angle of the wiping plate assembly 3, so that the wiping plate assembly 3 can reach a suitable position for wiping powder; the swing arm assembly 2 includes a lifting part for adjusting the height and a swing part for adjusting the angle, such as Figure 3 and Figure 4 As shown, the lifting portion is used to drive the swinging portion up and down, thereby driving the wiping plate assembly 3 up and down. The lifting portion includes a servo motor 26, a lead screw 27, a nut 28, and a guide plate 29. The guide plate 29 is fixed to the outer top end of the servo motor 26, and the guide plate 29 is fixed to the bottom end of the housing 1. The output end of the servo motor 26 is connected to the lead screw 27, which is in turn connected to the nut 28. The side of the guide plate 29 is provided with a linear rail 291. During lifting, the servo motor 26 is activated, which drives the lead screw 27 to rotate, thereby raising and lowering the nut 28 within the guide plate 29, thereby driving the swinging portion fixed to the nut 28 up and down.

[0035] The swinging part includes a connecting shell 21, a swing arm shaft 22, a fixing box 23, a first reduction motor 24 and a transmission assembly 25; a first slider 231 is fixed to the side of the fixing box 23, and the first slider 231 is slidably connected to the linear rail 291, and the design of the first slider 231 and the linear rail 291 limits the lifting and lowering of the swinging part; a fixing box 23 is fixed to the side of the nut 28, and the top end of the fixing box 23 is rotatably connected to the swing arm shaft 22; the swing arm shaft 22 passes through and is rotatably connected to the box cover 1; the top end of the swing arm shaft 22 is fixed to the connecting shell 21; the other end of the swing arm shaft 22 is connected to the first reduction motor 24 through the transmission assembly 25. The transmission assembly includes a belt, or a combination of a chain and a sprocket; illustratively, the transmission assembly is a belt; when adjusting the angle of the wiping disc assembly 3, the first reduction motor 24 is started, and the first reduction motor 24 drives the belt to rotate, thereby driving the swing arm shaft 22 to rotate in the box cover 1, thereby changing the angle of the wiping disc assembly 3 in the box cover 1.

[0036] The wiping disc assembly 3 includes a second reduction motor 31, a wiping disc head 32, and a wiping disc 33. The second reduction motor 31 is installed on one side of the interior of the connecting shell 21, and the output end of the second reduction motor 31 is connected to the wiping disc head 32; the bottom end of the wiping disc head 32 is connected to the wiping disc 33; specifically, a spherical joint bearing is installed on the inner side of the bottom of the connecting shell 21, and the output end of the second reduction motor 31 includes an output shaft and a strong magnetic block; the output shaft of the second reduction motor 31 passes through the interior of the spherical joint bearing, and a strong magnetic block is installed at the bottom of the output shaft. The wiping disc head 32 is sucked onto the bottom of the strong magnetic block, and a soft wiping disc 33 is installed at the bottom of the wiping disc head 32.

[0037] A powdering platform 4 is fixed to the bottom of the inner portion of the box cover 1. The cross-section of the powdering platform 4 adopts a T-shaped structure. A vacuum suction cup 61 is connected to the surface of the powdering platform 4. A main shaft 6 is fixed to the bottom end of the vacuum suction cup 61, and the main shaft 6 passes through the powdering platform 4. A lifting assembly 5 is provided at the bottom end of the main shaft 6. The lifting assembly 5 is used to drive the main shaft 6 to rise and fall. Specifically, the main shaft 6 adopts a hollow structure, with the upper end connected to the vacuum suction cup 61, and the lower bottom end of the main shaft 6 is connected to a vacuum air nozzle, which is connected to a negative pressure device through a vacuum valve. The negative pressure device provides negative pressure to the vacuum suction cup 61 to ensure that the vacuum suction cup 61 can fix the workpiece.

[0038] Specifically, such as Figure 1 and Figure 5As shown, the lifting assembly 5 includes a cylinder 51, a limiting column 52, a back plate 53, a second slider 54, and a connecting plate 55. The back plate 53 is fixed to the bottom end of the box cover 1, and the cylinder 51 is fixed to the side of the back plate 53. The second slider 54 is fixed to the top of the cylinder 51. The second slider 54 is slidably connected to the limiting column 52, and the limiting column 52 is fixed between the back plate 53 and the box cover 1. The connecting plate 55 is fixed to the side of the second slider 54, and the spindle 6 is fixed to the side of the connecting plate 55. When the cylinder 51 is started, it can push the second slider 54 to slide upward on the surface of the limiting column 52, thereby driving the spindle 6 and the vacuum suction cup 61 to rise upward, so that the vacuum suction cup 61 can absorb and fix the workpiece.

[0039] In order to remove the floating powder on the surface of the powdered workpiece, a powder blowing gun 71 is provided at the bottom end of the interior of the box cover 1. The powder blowing gun 71 is connected to the air blowing equipment, and the floating powder generated by the processing is blown away by the powder blowing gun 71; and a through hole 11 is opened on the surface of the box cover 1; the through hole 11 is connected to the lifting vacuum suction cup 61; the through hole 11 facilitates the extension of the vacuum suction cup 61 to load and unload the workpiece.

[0040] A load cell 7 is installed between the powdering platform 4 and the housing 1. The load cell 7 is electrically connected to a controller, which in turn is connected to a servo motor 26. The load cell 7 detects the pressure applied to the workpiece, which is then processed by the electronic control unit. When the pressure reaches the desired value, the wiping disc 33 stops descending and the powdering operation begins. The controller is electrically connected to a vacuum valve and a solenoid valve; the solenoid valve is mounted on the cylinder 51.

[0041] In order to facilitate the automatic loading and unloading of workpieces, a powdering process is performed; the powdering machine is as follows Figure 6 As shown, it also includes a support frame 9 and a conveying member 8. The box cover 1 is fixed to the inside of the support frame 9, and a conveying member 8 is arranged in the support frame 9; the conveying member 8 is used to convey the workpiece for loading and unloading; the conveying member 8 includes a discharging conveying track 81, a feeding conveying track 82, a transmission component 83 and a pushing member 84. The two ends of the box cover 1 are respectively fixed with a discharging conveying track 81 and a feeding conveying track 82 with the same structure, and a pushing member 84 is provided at the end of the feeding conveying track 82, and the pushing member 84 is used to push the workpiece into the feeding conveying track 82; a transmission component 83 is provided at the top of the discharging conveying track 81 and the feeding conveying track 82; the transmission component 83 is used to move the workpiece.

[0042] Specifically, such as Figure 7 and Figure 8As shown, the conveying assembly 83 includes a sheet support frame 831, a pneumatic slider 832, a connecting frame 833, a pneumatic slide rail 834 and a sheet placement slot 835. The pneumatic slide rail 834 is fixed to the bottom end of the support frame 9, and the surface of the pneumatic slide rail 834 is slidably connected to the pneumatic slider 832; the side of the pneumatic slider 832 is fixed with a connecting frame 833, and the bottom end of the connecting frame 833 is fixed with a sheet support frame 831; two sheet placement slots 835 are opened at both ends of the sheet support frame 831, and the sheet placement slots 835 are used to place workpieces, with a small contact area with the workpiece and little damage to the workpiece surface.

[0043] like Figure 7 and Figure 9 As shown, the pusher 84 includes a fixed frame 841, a pushing assembly 842, and a push plate 843. The push plate 843 is provided at the top of the fixed frame 841, and the pushing assembly 842 is provided between the push plate 843 and the fixed frame 841. The pushing assembly 842 is used to push the push plate 843 to extend and retract within the fixed frame 841. The pushing assembly 842 includes a motor, a driving shaft, a driven shaft, and a conveyor belt. The driving shaft and the driven shaft are rotatably connected to the bottom of the fixed frame 841, and are connected by a conveyor belt. The motor is connected to the driving shaft, and the push plate 843 is fixed to the side of the conveyor belt. When the motor is started, it drives the conveyor belt to rotate via the driving shaft, thereby driving the push plate 843 to extend and retract within the fixed frame 841.

[0044] A groove is provided on the top of the feed sheet transport track 82, and a limit plate 821 is provided on the side of the groove of the feed sheet transport track 82; the workpiece can be supported, the contact area with the workpiece is small, the damage to the workpiece is small, and the placed workpiece can be limited at the same time; the feed sheet transport track 82, the discharging sheet transport track 81, the push plate 843, and the support frame 831 are at the same horizontal height.

[0045] When the silicon wafer is being powdered,

[0046] First, the material is loaded. When loading, the conveying assembly 83 is first activated to make the pneumatic slide 832 slide on the pneumatic slide rail 834, driving the wafer holder 831 to move toward the end (right end) of the feed wafer track 82; the silicon wafer to be powdered is placed on the feed wafer track 82 by external force, and then the pushing member 84 is activated to make the pushing assembly 842 start to use the extended push plate 843 to push the silicon wafer into the wafer placement slot 835 at the right end. Then the conveying assembly 83 is activated again to make the pneumatic slide 832 slide on the pneumatic slide rail 834 toward the end (left end) close to the discharge wafer track 81, and slide until the wafer placement slot 835 where the silicon wafer is placed is directly above the through hole 11 and stops sliding;

[0047] Then the silicon wafer is placed in the box cover 1 and the silicon wafer is powdered. Specifically, before powdering, the powder blowing gun 71 is connected to the air blowing device; the vacuum suction cup 61 is connected to the negative pressure generating device, and the cylinder 51 is started. When the cylinder 51 is started, the second slider 54 can be pushed to slide upward on the surface of the limiting column 52, thereby driving the main shaft 6 and the vacuum suction cup 61 to rise upward; after the vacuum suction cup 61 contacts the silicon wafer, the vacuum suction cup 61 works to adsorb and fix the silicon wafer; at the same time, the conveying assembly 83 moves a certain distance to the left, and after the cylinder 51 is reset, it moves to the right to contact the feed conveyor track 82 to load the next silicon wafer. The next silicon wafer is in the wafer placement slot 835 at the right end of the wafer support 831. After loading is completed, it stays in place and waits for the previous silicon wafer to be powdered; when the previous silicon wafer is powdered, after the cylinder 51 is reset, The vacuum suction cup 61 is driven to reset on the surface of the powder wiping platform 4; the swing arm assembly 2 starts to work, and the first reduction motor 24 is started. The first reduction motor 24 drives the belt to rotate, and then drives the swing arm shaft 22 to rotate in the box cover 1, so that the wiping disc assembly 3 rotates to the top of the silicon wafer; then the servo motor 26 is started, and the servo motor 26 drives the lead screw 27 to rotate, so that the nut 28 descends in the guide plate 29; thereby driving the wiping disc assembly 3 to descend to the surface of the silicon wafer, and the degree of descent of the wiping disc assembly 3 is determined according to the pressure value of the weighing sensor 7. After reaching the appropriate value, the second reduction motor 31 is started. After the second reduction motor 31 is started, it drives the wiping disc 33 to rotate to wipe the silicon wafer; after the powdering is completed, the swing arm assembly is reset and moved away from the powder wiping platform 4; the lifting assembly 5 is started again to send the powdered silicon wafer through the through hole 11;

[0048] At this time, the waiting conveying component 83 moves toward the extended silicon wafer that has been powdered, and places the processed silicon wafer in the wafer placement slot 835 at the left end. The conveying component 83 moves toward the discharge wafer track 81 (left end) until the wafer placement slot 835 at the right end is at the upper end of the through hole 11, and then sends the next silicon wafer to the vacuum suction cup 61, and then continues to move toward the discharge wafer track 81 until it contacts the discharge wafer track 81, and then uses external force to place the processed silicon wafer at the left end of the wafer holder 831 on the discharge wafer track 81, completing the entire process.

[0049] The advantages of the present invention over the existing manual powdering process include: the manual process is inefficient, with an average of one tablet being applied in one minute per person; and the automated device of the present invention is highly efficient, with a tablet being applied in 40 seconds.

[0050] Manual processing of residual powder has poor consistency, with more or less residue on the product surface and over-wiping of the retained area. The automated device of the present invention has uniform wiping pressure and good consistency.

[0051] Since silicon wafers are thin, brittle and easily breakable, there is loss during manual loading and unloading of materials. The automated device of the present invention transports silicon wafers through conveying members, minimizing contact with the silicon wafers as much as possible, resulting in extremely low loss of silicon wafers.

[0052] The technical scope of the present invention is not limited to the contents of the above description. Those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical idea of the present invention, and these deformations and modifications should all fall within the protection scope of the present invention.

Claims

1. A GPP chip glass passivation powdering device, characterized by: It comprises a box cover (1), wherein a swing arm assembly (2) is provided inside the box cover (1), and the bottom end of the swing arm assembly (2) is rotatably connected to the wiping disc assembly (3); the swing arm assembly (2) is used to drive the wiping disc assembly (3) to rise and fall and rotate; A powder wiping platform (4) is fixed to the inner bottom end of the box cover (1), and a vacuum suction cup (61) is connected to the surface of the powder wiping platform (4); a main shaft (6) is fixed to the bottom end of the vacuum suction cup (61), and the main shaft (6) passes through the powder wiping platform (4); a lifting component (5) is provided at the bottom end of the main shaft (6); the lifting component (5) is used to drive the main shaft (6) to rise and fall. The swing arm assembly (2) includes a lifting part and a swing part, and the lifting part is used to drive the swing part to lift; the lifting part includes a servo motor (26), a lead screw (27), a nut (28) and a guide plate (29); the guide plate (29) is fixed to the top end of the outer side of the servo motor (26), and the guide plate (29) is fixed to the bottom end of the box cover (1); the output end of the servo motor (26) is connected to the lead screw (27), and the lead screw (27) cooperates with the connection nut (28); the side of the guide plate (29) is provided with a linear rail (291), The swing part includes a connecting shell (21), a swing arm shaft (22), a fixing box (23), a first reduction motor (24) and a transmission assembly (25); a first slider (231) is fixed to the side of the fixing box (23), and the first slider (231) is slidably connected to the linear rail (291); a fixing box (23) is fixed to the side of the nut (28), and the top of the fixing box (23) is rotatably connected to the swing arm shaft (22); a connecting shell (21) is fixed to the top of the swing arm shaft (22); the other end of the swing arm shaft (22) is connected to the first reduction motor (24) through the transmission assembly (25). The lifting assembly (5) includes a cylinder (51), a limiting column (52), a back plate (53), a second slider (54) and a connecting plate (55), wherein the back plate (53) is fixed to the bottom end of the box cover (1), and the side of the back plate (53) is fixed with the cylinder (51); the top end of the cylinder (51) is fixed with the second slider (54); the second slider (54) is slidably connected to the limiting column (52), and the limiting column (52) is fixed between the back plate (53) and the box cover (1); the side of the second slider (54) is fixed with the connecting plate (55), and the side of the connecting plate (55) is fixed with the main shaft (6).

2. A GPP chip glass passivation powdering device according to claim 1, characterized in that: The disk wiping assembly (3) comprises a second reduction motor (31), a disk wiping head (32), and a wiping disk (33). The second reduction motor (31) is installed on one side of the interior of the connecting shell (21), and the output end of the second reduction motor (31) is connected to the disk wiping head (32); the bottom end of the disk wiping head (32) is connected to the wiping disk (33).

3. A GPP chip glass passivation powdering device according to claim 1, characterized in that: A powder blowing gun (71) is provided at the inner bottom end of the box cover (1), and a through hole (11) is provided on the surface of the box cover (1); the through hole (11) cooperates with the vacuum suction cup (61) for connection and lifting.

4. A GPP chip glass passivation powdering device according to any one of claims 1 to 3, characterized in that: The invention also includes a support frame (9) and a conveying member (8), wherein the box cover (1) is fixed inside the support frame (9), and a conveying member (8) is provided inside the support frame (9); the conveying member (8) is used to convey the workpiece for loading and unloading; the conveying member (8) includes a discharging conveying track (81), a feeding conveying track (82), a conveying assembly (83) and a pushing member (84), and the two ends of the box cover (1) are respectively fixed with a discharging conveying track (81) and a feeding conveying track (82) of the same structure, and a pushing member (84) is provided at the end of the feeding conveying track (82), and the pushing member (84) is used to push the workpiece into the feeding conveying track (82); a conveying assembly (83) is provided at the top of the discharging conveying track (81) and the feeding conveying track (82); the conveying assembly (83) is used to move the workpiece.

5. A GPP chip glass passivation powdering device according to claim 4, characterized in that: The conveying assembly (83) includes a film support frame (831), a pneumatic slider (832), a connecting frame (833), a pneumatic slide rail (834) and a film placement slot (835), wherein the pneumatic slide rail (834) is fixed to the bottom end of the support frame (9), and the surface of the pneumatic slide rail (834) is slidably connected to the pneumatic slider (832); the connecting frame (833) is fixed to the side of the pneumatic slider (832), and the film support frame (831) is fixed to the bottom end of the connecting frame (833); and film placement slots (835) are provided at both ends of the film support frame (831).

6. A GPP chip glass passivation powdering device according to claim 5, characterized in that: The pushing member (84) comprises a fixed frame (841), a pushing assembly (842) and a pushing plate (843); a pushing plate (843) is provided at the top of the fixed frame (841), and a pushing assembly (842) is provided between the pushing plate (843) and the fixed frame (841); the pushing assembly (842) is used to push the pushing plate (843) to extend and retract within the fixed frame (841).

7. A GPP chip glass passivation powdering device according to claim 6, characterized in that: A groove is provided on the top of the feed film conveying track (82), and a limit plate (821) is provided on the side of the groove of the feed film conveying track (82); the feed film conveying track (82), the discharge film conveying track (81), the push plate (843), and the support frame (831) are at the same level.

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