Integrated cleaning equipment for wafer protective coating

Abstract

The present invention relates to an integrated cleaning device for wafer protective coating, which comprises a bracket, a cleaning box body is fixedly mounted on the bracket, the top of the cleaning box body is covered with a cover plate, the bottom is provided with a lifting column, a rotating disk is installed on the top of the lifting column, and a suction cup is provided on the upper surface of the rotating disk; the cleaning box body is provided with a soaking chamber, a first rinsing chamber and a second rinsing chamber in sequence from bottom to top, gates are provided between the soaking chamber and the first rinsing chamber and between the first rinsing chamber and the second rinsing chamber, a first spray water pipe is provided on the top of the soaking chamber, a first liquid spray pipe and a second spray water pipe are provided on the top of the first rinsing chamber, and a second liquid spray pipe and a third spray water pipe are provided on the top of the second rinsing chamber. It solves the technical problem that the wafer cannot be effectively protected during the transfer from soaking to cleaning, resulting in high cleaning difficulty and low efficiency.

Description

Technical Field

[0001] The present invention relates to a wafer protective coating cleaning device, and more particularly to a wafer protective coating integrated cleaning device, belonging to the technical field of semiconductor cleaning devices. Background Art

[0002] In the semiconductor packaging process, cleaning of the temporary protective coating on the wafer is a critical step. After cutting, the cleaning effect of the temporary protective coating on the wafer directly affects the yield of the subsequent process. If the temporary protective coating on the wafer is not completely cleaned, the efficiency of the subsequent process will be greatly reduced.

[0003] In order to improve the cleaning effect, it is usually necessary to soak the wafer protective coating before cleaning. The prior art CN216054589U discloses a cleaning device for wafer cleaning, including a soaking box, a lifting sealing cover, a vertical support platform, a lifting drive mechanism and a swinging drive mechanism. The lifting sealing cover is arranged above the soaking box, and a partition is arranged in the middle of the soaking box to divide it into two soaking tanks. A flow interval is arranged between the partition and the bottom surface of the soaking box, and the vertical support platform is arranged at the rear of the soaking box; the lifting drive mechanism includes a servo hydraulic cylinder and a sliding seat, and two linear guide rails are arranged on the front surface of the vertical support platform. The swinging drive mechanism includes two electric push rod drive groups and two fixed seats, and the two fixed seats are relatively arranged on the sliding seat, and the two electric push rod drive groups are respectively arranged on the two fixed seats. The present invention can place wafers in multiple baskets for soaking. At the same time, when soaking, the swinging drive mechanism can drive the basket to swing, and the stirred chemicals continuously impact the wafer surface, thereby accelerating the stripping speed of impurities on the wafer surface. However, when this solution is implemented, the wafers are placed in a basket, which cannot be orderly and stable, resulting in the wafers colliding with each other during shaking, causing wafer damage. There are even cases where two adjacent wafers overlap and cannot be soaked in the chemical solution, resulting in unsatisfactory subsequent cleaning effects.

[0004] In the subsequent cleaning process, the prior art CN104658947B discloses a wafer cleaning device, comprising: a cleaning tank; the cleaning tank is provided with a cavity; a wafer supporting device; the wafer supporting device is arranged in the cavity for supporting the wafer; at least one nozzle; the nozzle can spray liquid or gas toward the wafer; also includes at least one bracket; the bracket can be rotatably and liftably arranged; at least one nozzle wafer cleaning device is arranged on the bracket; also includes at least one third driving device; each of the third driving devices drives one of the brackets to perform lifting and lowering movements or drives one of the brackets to perform lifting and lowering movements through a third transmission device; also includes at least one fourth driving device; each of the fourth driving devices drives one of the brackets to rotate or drives one of the brackets to rotate through a fourth transmission device; also includes to The invention also comprises a liquid receiving tank; the liquid receiving tank is arranged on one side of the cleaning tank, and is used to collect the liquid sprayed by the nozzle outside the cavity; the invention also comprises a control host and at least one position detection device; each position detection device is used to detect the position of one of the brackets, and send a signal to the control host; the control host controls the operation of the fourth drive device, and determines the start or stop of the fourth drive device according to the signal of the position detection device; the position detection device comprises a proximity switch and a protrusion; the protrusion rotates synchronously with the bracket; the proximity switch is located on the travel path of the protrusion; the proximity switch sends different signals to the control host according to whether the protrusion is within the detection range of the proximity switch; the control host determines the operation of the fourth drive device according to the signal of the proximity switch. However, this cleaning device is open when cleaning, and the wafer protective layer needs to be cleaned in a closed state or in a nitrogen protection state. How to achieve this method has always been a technical problem that has troubled technicians in this field.

[0005] More importantly, these cleaning equipments are all separately set up, and the wafers need to be transferred to the cleaning equipment after soaking. The transfer process cannot be closed, and nitrogen protection cannot be achieved, which causes the protective coating on the wafer surface to be oxidized, increasing the cleaning difficulty and cleaning time, and reducing the cleaning efficiency of the wafer protective coating.

[0006] Therefore, in the field of semiconductor cleaning equipment technology, there is still a need for research and improvement of wafer protective coating integrated cleaning equipment. This is also a research hotspot and focus in the current field of semiconductor cleaning equipment technology, and it is also the starting point for the completion of the present invention. Summary of the invention

[0007] Based on the above-mentioned defects of the prior art, the technical problem to be solved by the present invention is: to provide an integrated wafer protective coating cleaning device to solve the technical problem that the wafer cannot be effectively protected during the transfer from immersion to cleaning, resulting in great cleaning difficulty and low efficiency.

[0008] In order to solve the above technical problems, the technical solution of the present invention is: to provide an integrated wafer protective coating cleaning device, the integrated wafer protective coating cleaning device includes a bracket, a cleaning box is fixedly installed on the bracket, the top of the cleaning box is covered with a cover plate, the bottom of the cleaning box is provided with a lifting column driven by a first power mechanism and vertically lifted, the lifting column is connected to a second power mechanism that drives the lifting column to rotate around a rotation center, the lifting column passes through the bottom surface of the cleaning box and extends into the cleaning box, a turntable is fixedly installed on the top of the lifting column, the lifting column has a central through hole, a plurality of suction cups are provided on the upper surface of the turntable, all of the suction cups are connected to the central through hole, and the bottom end of the lifting column is connected to a vacuum pump through a rotating joint; the cleaning box is provided with immersion chambers from bottom to top in sequence. , a first flushing chamber and a second flushing chamber, gates are provided between the immersion chamber and the first flushing chamber and between the first flushing chamber and the second flushing chamber, a first spray water pipe is provided at the top of the immersion chamber, a first drain pipe is provided at the bottom of the immersion chamber, a first liquid medicine spray pipe and a second spray water pipe are provided at the top of the first flushing chamber, the second spray water pipe is located above the first liquid medicine spray pipe, a second drain pipe is provided at the bottom of the first flushing chamber, a second liquid medicine spray pipe and a third spray water pipe are provided at the top of the second flushing chamber, the third spray water pipe is located above the second liquid medicine spray pipe, a third drain pipe is provided at the bottom of the second flushing chamber, the first liquid medicine spray pipe is connected to the first liquid medicine storage tank, the second liquid medicine spray pipe is connected to the second liquid medicine storage tank, and a nitrogen blowing pipe is provided at the top of the second flushing chamber.

[0009] The cleaning box is usually made of corrosion-resistant materials, such as polytetrafluoroethylene or stainless steel.

[0010] Specifically or preferably, the lifting column is vertically rotatably mounted on the lifting base and penetrates the lifting base. The lifting base slides vertically through a guide rail. A first power mechanism is provided below the lifting base. The first power mechanism is usually a hydraulic cylinder. The cylinder body of the hydraulic cylinder is fixed. The piston rod of the hydraulic cylinder is connected to the lifting base. The lifting base drives the lifting column to rise and fall synchronously. The rotation of the lifting column is driven by a second power mechanism. The second power mechanism includes a rotary motor fixedly mounted on the lifting base. A driving gear is fixedly mounted on the power output shaft of the rotary motor. A driven gear is fixedly mounted on the lifting column. The driven gear is coaxially arranged with the lifting column. The driving gear meshes with the driven gear. The rotation of the rotary motor drives the rotation of the lifting column. The rotation and lifting of the lifting column do not interfere with each other and can be performed simultaneously, which saves working time and improves cleaning efficiency.

[0011] Wherein, the rotary disk is provided with a plurality of air flow channels respectively connecting the suction cups with the central through hole, and all the suction cups are connected with the central through hole through the corresponding air flow channels.

[0012] The immersion chamber is filled with immersion liquid, and the wafer can be immersed in the immersion chamber. After the immersion is completed, the immersion liquid is removed by spraying with pure water through the first spray water pipe, and then the wafer can enter the first rinsing chamber under the push of the lifting column.

[0013] Among them, the wafer is first sprayed with the first liquid in the first rinsing chamber. The spraying is preferably carried out by a shower-type spray, which has a better effect. Then, pure water is used to rinse the first liquid remaining on the surface of the wafer through the second spray water pipe. After the first liquid is discharged through the second drain pipe, the wafer enters the second rinsing chamber.

[0014] The wafer is first sprayed with the second liquid in the second rinse chamber, and then the second liquid remaining on the wafer surface is rinsed with pure water through the third spray water pipe, and the second liquid is discharged through the third drain pipe.

[0015] The nitrogen blowing pipe is connected to positive pressure hot nitrogen to blow nitrogen to dry the wafer surface. After drying, the cover plate can be opened to take out the cleaned wafer, and then another wafer to be processed can be put in for further immersion cleaning.

[0016] Among them, the immersion, two rinses and drying operations of the wafer of the present invention are all completed in a closed cleaning box, and there is no need to transfer in exposed air, which effectively protects the wafer protective coating. It not only improves the cleaning effect of the wafer protective coating and the cleaning efficiency, but also the immersion liquid, the first liquid and the second liquid are collected separately to avoid cross contamination.

[0017] Among them, the first liquid medicine storage tank and the second liquid medicine storage tank are both provided with heating coils, so that the first liquid medicine and the second liquid medicine can meet the required flushing temperature, and the first liquid medicine storage tank and the second liquid medicine storage tank are both provided with stirring blades driven by a stirring motor, so that the temperature of the liquid medicine in the storage tank is uniform to achieve the best flushing effect.

[0018] In the wafer protective coating integrated cleaning equipment of the present invention, as an improvement, the gate includes a gate plate fixed on the cleaning box, the gate plate is provided with a mounting groove, the width of the center position of the mounting groove is greater than the diameter of the turntable, and a split telescopic joint is provided in the mounting groove.

[0019] The shape of the mounting groove is adapted to the shape of the telescopic joint, and is usually stepped.

[0020] In the wafer protective coating integrated cleaning device of the present invention, as an improvement, a sealing strip is provided between the periphery of the telescopic joint and the gate plate.

[0021] In the integrated wafer protective coating cleaning device of the present invention, as an improvement, the innermost end of the telescopic joint is provided with an arc-shaped groove matched with the lifting column.

[0022] With such a structural setting, when the two opposite telescopic joints are opened, the rotary disk can enter the upper cavity through the gap between the telescopic joints. When the two opposite telescopic joints are closed, the arc-shaped groove fits with the lifting column to form a seal, thereby preventing the liquid medicine in the cavity from leaking to the lower cavity, thereby effectively avoiding cross contamination of the liquid medicine.

[0023] In the wafer protective coating integrated cleaning device of the present invention, as an improvement, the gate plate has a protruding portion protruding upward, and the mounting groove is opened in the protruding portion.

[0024] Wherein, by making the gate plate have a protruding portion protruding upward, a recessed portion can be formed between the gate plate and the cleaning box body, so as to facilitate the installation of the drain valve to discharge the liquid.

[0025] The installation groove is provided in the protruding part, so that the position of the expansion joint is higher than the concave part, thereby preventing the liquid from leaking into the cavity below. When spraying the liquid medicine, the liquid medicine is thrown to the inner wall of the cleaning box by the rotating disk, and flows into the concave part along the inner wall, thereby effectively preventing the liquid medicine from cross-contamination.

[0026] As a more preferred technical solution, the telescopic joint includes a first section body fixedly installed on the gate plate, a second section body is slidably installed in the first section body, a third section body is slidably installed in the second section body, the outer end of the third section body is provided with an arc-shaped groove adapted to the lifting column, the first section body is connected to the second section body, a plunger slidably installed in the second section body is fixedly installed at the end of the third section body, a third center tube is provided in the third section body, an oil port is provided at the end of the third center tube away from the plunger, the other end of the third center tube passes through the plunger and extends into the second section body, the second center tube is sleeved in the third center tube, the second center tube is adapted to the second section body, the first center tube is sleeved in the second center tube, the first center tube is adapted to the first section body, a first working oil port connected to the oil port is provided at the end of the first section body, the second working oil port is connected to the A oil port of the reversing valve, the first working oil port is connected to the B oil port of the reversing valve, the P oil port of the reversing valve is connected to the oil inlet pipeline, and the T oil port of the reversing valve is connected to the oil return pipeline.

[0027] With such a structural setting, when the first working oil port is filled with oil, the second working oil port returns oil, the third section retracts to the second section, driving the second section to retract to the first section, and the gate is opened. When the second working oil port is filled with oil, the hydraulic oil pushes the third section and the second section out, closing the gate, and the arc-shaped groove blocks the lifting column, thereby achieving the bottom sealing of the cavity.

[0028] Here, the first section, the second section and the third section are preferably hollow structures with square cross-sections, which are sequentially mounted together, and a sealing strip is provided between two adjacent sections to prevent leakage of hydraulic oil.

[0029] In order to improve the stability and accuracy of the sliding trajectory of the telescopic joint, it is further preferred that a third guide cylinder is provided in the third section, the third guide cylinder and the third center cylinder are parallel to each other, one end of the third guide cylinder is fixed to the end of the third section away from the plunger, the other end of the third guide cylinder passes through the plunger and extends into the second section, the second guide cylinder is sleeved in the third guide cylinder, the second guide cylinder is adapted to the second section, the first guide cylinder is sleeved in the second guide cylinder, the first guide cylinder is adapted to the first section, and the end of the first guide cylinder is fixed to the end of the first section.

[0030] Through such a structural arrangement, the first guide cylinder, the second guide cylinder and the third guide cylinder which are sheathed together play a good guiding role, avoiding the telescopic joint from tilting and getting stuck during the extension or retraction process, and making the telescopic joint extend and retract more smoothly.

[0031] In the wafer protective coating integrated cleaning equipment of the present invention, as another improvement, the first spray water pipe, the first liquid spray pipe, the second spray water pipe, the second liquid spray pipe and the third spray water pipe all extend into the cleaning box and the protruding ends are hingedly installed with a swing cylinder.

[0032] Among them, the cylinder body of the swing cylinder is hingedly installed on the cleaning box body, and the piston rod of the swing cylinder is hingedly installed on the corresponding first spray water pipe, first liquid spray pipe, second spray water pipe, second liquid spray pipe, third spray water pipe or nitrogen spray pipe.

[0033] In the wafer protective coating integrated cleaning equipment of the present invention, as a further improvement, the first spray water pipe, the first liquid spray pipe, the second spray water pipe, the second liquid spray pipe and the third spray water pipe are all installed on the cleaning box through self-aligning bearings.

[0034] Through such a structural setting, the corresponding first spray water pipe, first liquid medicine spray pipe, second spray water pipe, second liquid medicine spray pipe, third spray water pipe and nitrogen blowing pipe can be swung by the push of the swing cylinder. When in use, they can be swung and sprayed at the same time to thoroughly spray or blow the entire surface of the wafer.

[0035] In the wafer protective coating integrated cleaning equipment of the present invention, as a further improvement, sealing elements are provided between the first spray water pipe, the first liquid spray pipe, the second spray water pipe, the second liquid spray pipe and the third spray water pipe and the inner wall of the cleaning box.

[0036] Among them, the sealing element is usually a rubber sealing sleeve to seal the corresponding first spray water pipe, the first liquid medicine spray pipe, the second spray water pipe, the second liquid medicine spray pipe, the third spray water pipe and the nitrogen blowing pipe and the cleaning box body. The sealing sleeve is a very well-known common component, usually a corrugated sealing sleeve. Technical personnel in this field can choose to use it according to their needs, and will not go into details here.

[0037] With such a structural setting, the first spray water pipe, the first liquid medicine spray pipe, the second spray water pipe, the second liquid medicine spray pipe, the third spray water pipe and the nitrogen blowing pipe can swing in the cleaning box under the action of the swing cylinder. When the wafer needs to be sprayed or dried, it swings to the position above the turntable and swings back and forth under the action of the swing cylinder. When the spraying or drying is completed, when the turntable needs to move up under the action of the lifting column, it deviates from the upward movement trajectory of the turntable under the action of the swing cylinder to avoid interference with the turntable.

[0038] In the integrated cleaning equipment for wafer protective coating of the present invention, as another improvement, a rotating tube driven by a servo motor is rotatably installed on the cleaning box, and the rotating tube extends into the cleaning box along the radial direction of the turntable, and a sliding seat driven by a first cylinder is axially slidably installed in the rotating tube, and a diamond-shaped four-bar mechanism is installed on the side of the sliding seat away from the first cylinder, and the four-bar mechanism includes a first connecting rod, a second connecting rod, a third connecting rod and a fourth connecting rod hinged in sequence, and the hinge points of the first connecting rod and the fourth connecting rod are hinged on the sliding seat, and a second cylinder is installed on the sliding seat, and the hinge points of the second connecting rod and the third connecting rod are connected to the piston rod of the second cylinder, and the second connecting rod and the third connecting rod are both provided with extension parts extending from the hinge points, and the ends of the extension parts are provided with clamping parts.

[0039] Wherein, the servo motor can be connected to the rotary tube through a gear pair transmission.

[0040] The height position of the rotary pipe is usually set between the second liquid medicine spray pipe and the third spray water pipe.

[0041] Wherein, the cylinder body of the second cylinder is fixedly mounted on the slide seat, and the second cylinder and the first cylinder are located on the same side of the slide seat.

[0042] Among them, the clamping range of the clamping part is adapted to the thickness of the wafer. This structure can not only realize the automatic clamping and flipping of the wafer, but also under the action of the first cylinder, the clamping part can avoid the lifting and lowering trajectory of the turntable, avoiding interference with the lifting and lowering of the turntable, replacing manual flipping of the wafer, and further improving the production efficiency of the wafer.

[0043] In the integrated wafer protective coating cleaning device of the present invention, as a further improvement, a limiting element for limiting the maximum stroke of the first cylinder is provided on the rotary tube.

[0044] Among them, the limiting element usually chooses to use a limiting screw, which is threaded on the rotating tube. The distance from the initial state of the first cylinder to the limiting screw is smaller than the stroke of the first cylinder. The limiting screw limits the maximum position of the extension of the piston rod of the first cylinder. When the second cylinder pushes the four-bar linkage at this position, the force of the second cylinder acts on the limiting screw instead of the piston of the first cylinder, thereby protecting the piston of the first cylinder and extending the service life of the first cylinder.

[0045] Among them, the four-bar linkage is provided with a compression spring arranged radially along the rotating tube. The force of the compression spring can act on the four-bar linkage in time, making the clamping part open more quickly, thereby effectively preventing the wafer from being subjected to the radial force of the clamping part.

[0046] The specific operating principle and process flow of the wafer protective coating integrated cleaning equipment of the present invention are as follows: when in use, the operator opens the cover plate, fills an appropriate amount of soaking liquid in the soaking chamber, the hydraulic cylinder pushes the lifting column to move up, places the back of the wafer to be processed on the suction cup, starts the vacuum pump, and fixes the wafer on the turntable. Under the action of the hydraulic cylinder, the lifting column moves down, seals the cover plate, seals the cleaning box, and the turntable drives the wafer to sink into the soaking liquid in the soaking chamber for soaking. After the soaking is completed, the lifting column drives the turntable to start moving up to the position below the first spray water pipe. After the swing cylinder swings the first spray water pipe to the center position of the turntable, it swings back and forth at a certain swing amplitude. At this time, the first spray water pipe starts to spray pure water, and the lifting column is moved up after rinsing to remove the residual soaking liquid. The wafer is transferred to the first rinsing chamber, the telescopic joint at the bottom of the first rinsing chamber is closed, and then the rotary motor is started to drive the wafer to rotate. At this time, the swing cylinder moves the first liquid spray pipe to the top of the wafer, sprays and rinses the wafer surface, opens the second drain pipe, and the first liquid after rinsing flows out through the second drain pipe for collection. After the first liquid is rinsed, there is no need to turn off the rotary motor, swing the first liquid spray pipe out of the center position, swing the second spray water pipe to the center position, spray pure water on the wafer surface, rinse and remove the first liquid residue, and at the same time discharge the first liquid residue in the first rinsing chamber through the second drain pipe. The hydraulic cylinder drives the wafer to move up to the second rinsing chamber, closes the telescopic joint at the bottom of the second rinsing chamber, and the second liquid spray pipe swings to the center position to spray the wafer. The second liquid is sprayed on the surface, and the third liquid discharge pipe is opened at this time. The liquid is discharged and collected through the third liquid discharge pipe. After spraying, the third spray water pipe swings to the top of the wafer to start pure water spraying and rinsing. After rinsing, the rotary motor drives the wafer to continue to rotate, shakes off the residual water droplets on the front of the wafer, and then the rotary motor stops. If the back of the wafer does not need to be cleaned, the nitrogen spray pipe sprays nitrogen on the surface of the wafer for drying. After drying, the wafer can be taken out. If the back of some wafer products also needs to be cleaned, and the front of the wafer product allows suction by the suction cup, the first cylinder is activated to push the slide to move toward the turntable. After the clamp moves to the wafer position, the second cylinder is activated to push the four-bar linkage to deform, and the two opposite clamps merge to clamp the upper and lower surfaces of the wafer. The vacuum pump stops pumping air. The suction cup releases the wafer, the lifting column moves down a certain distance, the servo motor starts, the rotary tube drives the wafer to flip 180 degrees, the lifting column rises, the vacuum pump starts to pump air, the suction cup adsorbs the front of the wafer, the second cylinder pulls the four-bar mechanism to deform, the clamp opens, and then the first cylinder pulls back the slide, the lifting column moves down, the rotary motor starts to start, and the previous actions are repeated to continue spraying the first and second liquids on the back of the wafer. After spraying and rinsing, the nitrogen spray pipe sprays nitrogen on the surface of the wafer for drying. After drying, the nitrogen spray pipe deviates from the center position, the rotary motor stops, the cover is opened, the hydraulic cylinder drives the wafer to move up, the vacuum pump stops pumping vacuum, and the operator can take out the processed wafer, put in another wafer to be cleaned, and continue cleaning.

[0047] In order to reduce the operator's labor intensity and improve the degree of automation, a control unit such as a programmable controller or a microcomputer is usually used for control, and a temperature sensor is set at the corresponding position to make the action instructions and temperature control more accurate and timely control the relevant actuators. Those skilled in the art can implement it according to the actual situation, and will not be repeated here. In addition, the pressure or flow of the separate liquid spray pipe, spray water pipe and nitrogen spray pipe can be controlled to meet the use of wafers of different specifications.

[0048] As described above, the present invention provides a wafer protective coating integrated cleaning device, which has achieved many excellent technical effects through a unique structure, including but not limited to:

[0049] 1. The immersion, two-rinsing and drying operations of the wafers of the present invention are all completed in a closed cleaning box, and there is no need to transfer them in exposed air, which effectively protects the wafer protective coating. It not only improves the cleaning effect of the wafer protective coating and the cleaning efficiency, but also the immersion liquid, the first liquid and the second liquid are collected separately to avoid cross contamination.

[0050] 2. The first spray water pipe, the first chemical liquid spray pipe, the second spray water pipe, the second chemical liquid spray pipe, the third spray water pipe and the nitrogen blowing pipe of the present invention are all extended into the cleaning box and the extended ends are hingedly installed with a swing cylinder, which can spray or blow while swinging, not only can accurately achieve all-round spraying and drying of the wafer surface, but also can move the center position in time to avoid interference with the lifting and lowering of the turntable.

[0051] 3. The gate plate of the present invention has an upwardly protruding portion, so that a recessed portion is formed between the gate plate and the cleaning box body. The mounting groove is provided in the protruding portion, so that the position of the telescopic joint is higher than the recessed portion, so as to facilitate the installation of the drain valve to discharge the liquid. In particular, when spraying the liquid medicine, the liquid medicine is thrown to the inner wall of the cleaning box by the rotating disk and flows into the recessed portion along the inner wall, thereby preventing the liquid from leaking into the cavity below and effectively avoiding cross-contamination of the liquid medicine.

[0052] 4. The soaking liquid, the first liquid and the second liquid of the present invention can be recovered separately and recycled, thus saving the use cost.

[0053] 5. Since a rotating tube is provided on the cleaning box, a diamond-shaped four-bar mechanism is provided inside the rotating tube, and a clamping part is provided on the four-bar mechanism, not only can the automatic clamping and flipping of the wafer be realized, but also under the action of the first cylinder, the clamping part can also avoid the lifting and lowering trajectory of the turntable, avoiding interference with the lifting and lowering of the turntable, replacing manual flipping of the wafer, and further improving the wafer production efficiency.

[0054] As described above, the present invention provides an integrated cleaning device for wafer protective coatings. The integrated cleaning device for wafer protective coatings has achieved many excellent technical effects through a unique structural design, and can be applied to the cleaning of wafer protective coatings. It can greatly improve the cleaning efficiency and production efficiency, realize fully automated operation, and has good application potential in the field of semiconductor processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0056] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0057] Figure 1 is a schematic structural diagram of an embodiment of the present invention;

[0058] Figure 2 is a schematic structural diagram of a rotary disk in an embodiment of the present invention;

[0059] Figure 3 is a schematic diagram of the structure of the gate in an embodiment of the present invention;

[0060] Figure 4 yes Figure 3 A schematic diagram of a top view structure;

[0061] Figure 5 is a schematic structural diagram of an expansion joint in an embodiment of the present invention;

[0062] Figure 6 Schematic diagram of the installation structure of the first liquid medicine spray pipe in an embodiment of the present invention;

[0063] Figure 7 is a schematic diagram of another use state of the first liquid medicine spray pipe in an embodiment of the present invention;

[0064] Figure 8 Schematic diagram of the installation structure of the rotary tube in the embodiment of the present invention;

[0065] Fig. 9is a schematic diagram of a clamping state of a clamping portion in an embodiment of the present invention;

[0066] Fig.10 is a schematic diagram of the clamping part in the open state in an embodiment of the present invention;

[0067] Fig.11 Schematic diagram of the first liquid spraying state in an embodiment of the present invention;

[0068] Fig.12 Schematic diagram of the spraying state of the second liquid medicine in the embodiment of the present invention;

[0069] Among them, Figures 1 to 12 In the drawings, each numerical label refers to the following specific meanings, elements and / or components respectively.

[0070] In the figure: 1, bracket, 2, cleaning box, 201, soaking chamber, 202, first flushing chamber, 203, second flushing chamber, 3, cover plate, 4, lifting column, 401, central through hole, 5, lifting base, 6, turntable, 601, air flow channel, 7, suction cup, 8, hydraulic cylinder, 9, driving gear, 10, driven gear, 11, rotary motor, 12, rotary joint, 13, first spray water pipe, 14, first liquid spray pipe, 15, second spray water pipe, 16, second liquid spray pipe, 17, third spray water pipe, 18, gate, 1801, gate, 1802, telescopic joint, 1803, sealing strip, 1804, arc groove, 1805, first section, 1806, second section, 1807, third section, 1808, third center tube, 1809, second center tube, 1810 , the first center cylinder, 1811, the plunger, 1812, the third guide cylinder, 1813, the second guide cylinder, 1814, the first guide cylinder, 1815, the first working oil port, 1816, the second working oil port, 1817, the protrusion, 1818, the recessed portion, 19, the first drain pipe, 20, the second drain pipe, 21, the third drain pipe, 22, the self-aligning bearing, 23, the sealing element, 24, the swing cylinder, 25, the first liquid storage tank, 26, the second liquid storage tank, 27, the heating coil, 28, the stirring motor, 29, the stirring blade, 30, the rotary tube, 31, the servo motor, 32, the slide seat, 33, the first cylinder, 34, the second cylinder, 35, the first connecting rod, 36, the second connecting rod, 37, the third connecting rod, 38, the fourth connecting rod, 39, the clamping part, 40, the limit screw, 41, the nitrogen blowing pipe. DETAILED DESCRIPTION

[0071] The following is a description of the implementation of the present invention by specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0072] The terms such as "front", "back", "left", "right", "inside", "outside", "middle", etc. cited in this specification are only for the convenience of description and are not intended to limit the scope of implementation of the present invention. Changes or adjustments to their relative relationships should be regarded as within the scope of implementation of the present invention without substantially changing the technical content.

[0073] like Figure 1 As shown, the present invention provides an integrated cleaning device for wafer protective coating, which includes a bracket 1, on which a cleaning box 2 is fixedly installed. The cleaning box 2 is usually made of corrosion-resistant materials such as polytetrafluoroethylene or stainless steel. The top of the cleaning box 2 is covered with a cover plate 3, and the bottom of the cleaning box 2 is provided with a lifting column 4 driven by a first power mechanism and vertically lifted. The lifting column 4 is connected to a second power mechanism that drives the lifting column 4 to rotate around a rotation center. Specifically, the lifting column 4 is vertically rotatably installed on a lifting base 5 and penetrates the lifting base 5. The lifting base 5 slides vertically through a guide rail. A first power mechanism is provided below the lifting base 5. The first power mechanism is usually a hydraulic cylinder 8. The cylinder body of the hydraulic cylinder 8 is fixed, and the piston rod of the hydraulic cylinder 8 is connected to the lifting base 5. The lifting base 5 drives the lifting column 4 to rise and fall synchronously. The rotation of the lifting column 4 is driven by a second power mechanism, which includes a rotary motor 11 fixedly mounted on the lifting base 5, a driving gear 9 fixedly mounted on the power output shaft of the rotary motor 11, and a driven gear 10 fixedly mounted on the lifting column 4. The driven gear 10 is coaxially arranged with the lifting column 4, and the driving gear 9 meshes with the driven gear 10. The rotation of the rotary motor 11 drives the rotation of the lifting column 4, and the rotation and lifting of the lifting column 4 do not interfere with each other and can be performed simultaneously, which saves man-hours and improves cleaning efficiency. The lifting column 4 penetrates the bottom surface of the cleaning box 2 and extends into the cleaning box 2. Figure 2As shown, a turntable 6 is fixedly installed on the top of the lifting column 4, the lifting column 4 has a central through hole 401, a plurality of suction cups 7 are arranged on the upper surface of the turntable 6, a plurality of air flow channels respectively connecting the suction cups 7 and the central through hole 401 are opened on the turntable 6, all the suction cups 7 are connected with the central through hole 401 through corresponding air flow channels, and the bottom end of the lifting column 4 is connected to the vacuum pump through a rotary joint 12. When the wafer needs to be cleaned, the wafer surface is fitted with the suction cup 7, and the vacuum pump is started, and the suction cup 7 can adsorb the wafer and fix the wafer on the turntable 6. The cleaning box 2 is provided with a soaking chamber 201, a first rinsing chamber 202 and a second rinsing chamber 203 from bottom to top, and gates 18 are provided between the soaking chamber 201 and the first rinsing chamber 202 and between the first rinsing chamber 202 and the second rinsing chamber 203. A first spray water pipe 13 is provided at the top of the soaking chamber 201, and a first drain pipe 19 is provided at the bottom of the soaking chamber 201. The soaking chamber 201 is filled with soaking liquid, and the wafer can be soaked in the soaking chamber 201. After the soaking is completed, the soaking liquid can be removed by spraying pure water through the first spray water pipe 13, and then the wafer can enter the first rinsing chamber 202 under the push of the lifting column 4. A first liquid spray pipe 14 and a second spray water pipe 15 are provided at the top of the first rinse chamber 202. The second spray water pipe 15 is located above the first liquid spray pipe 14. A second drain pipe 20 is provided at the bottom of 202. The wafer is firstly sprayed with the first liquid in the first rinsing chamber 202. The spraying is preferably carried out in a shower-type spraying manner for better effect. Then, the first liquid remaining on the surface of the wafer is rinsed with pure water through the second spray water pipe 15. After the first liquid is discharged through the second drain pipe 20, the wafer enters the second rinsing chamber 203. A second liquid spray pipe 16 and a third spray water pipe 17 are provided at the top of the second rinsing chamber 203. The third spray water pipe 17 is located above the second liquid spray pipe 16. A third drain pipe 21 is provided at the bottom of the second rinsing chamber 203. The wafer is firstly sprayed with the second liquid in the second rinsing chamber 203. Then, the second liquid remaining on the surface of the wafer is rinsed with pure water through the third spray water pipe 17. The second liquid is discharged through the third drain pipe 21. A nitrogen blowing pipe 41 is provided on the top of the second rinsing chamber 203, and the nitrogen blowing pipe 41 is connected to positive pressure hot nitrogen to blow nitrogen to dry the surface of the wafer. After drying, the cover plate 3 can be opened to take out the cleaned wafer, and then another wafer to be processed is placed to continue soaking and cleaning. The soaking, two rinses and drying operations of the wafer of the present invention are all completed in the closed cleaning box 2, and there is no need to transfer in the exposed air, which effectively protects the wafer protective coating, not only improves the cleaning effect of the wafer protective coating, but also improves the cleaning efficiency, and the soaking liquid, the first liquid and the second liquid are collected separately to avoid cross contamination.The first liquid medicine spray pipe 14 is connected to the first liquid medicine storage tank 25, and the second liquid medicine spray pipe 16 is connected to the second liquid medicine storage tank 26. The first liquid medicine storage tank 25 and the second liquid medicine storage tank 26 are both provided with heating coils 27, so that the first liquid medicine and the second liquid medicine can meet the required flushing temperature. The first liquid medicine storage tank 25 and the second liquid medicine storage tank 26 are both provided with stirring blades 29 driven by a stirring motor 28, so that the temperature of the liquid medicine in the storage tank is uniform to achieve the best flushing effect.

[0074] like Figure 3 and Figure 4 As shown together, the gate 18 includes a gate plate 1801 fixed on the cleaning box 2, and a mounting groove is opened on the gate plate 1801. The width of the center position of the mounting groove is larger than the diameter of the turntable 6. A split telescopic joint 1802 is provided in the mounting groove. The shape of the mounting groove is adapted to the shape of the telescopic joint 1802, and is usually stepped.

[0075] A sealing strip 1803 is provided between the periphery of the expansion joint 1802 and the gate plate 1801, and an arc-shaped groove 1804 adapted to the lifting column 4 is provided at the innermost end of the expansion joint 1802. When the two opposing expansion joints 1802 are opened, the turntable 6 can enter the upper cavity through the gap between the expansion joints 1802. When the two opposing expansion joints 1802 are closed, the arc-shaped groove 1804 fits with the lifting column 4 to form a seal, thereby preventing the medicine in the cavity from leaking to the cavity below, thereby effectively avoiding cross contamination of the medicine.

[0076] The gate plate 1801 has an upwardly protruding portion 1817, so that a recessed portion 1818 is formed between the gate plate 1801 and the cleaning box 2, so as to facilitate the installation of a drain valve to discharge liquid. The installation groove is provided in the protruding portion 1817, so that the position of the expansion joint 1802 is higher than the recessed portion 1818, thereby preventing liquid from leaking into the cavity below. When spraying liquid medicine, the liquid medicine is thrown to the inner wall of the cleaning box 2 by the rotating disk 6, and flows into the recessed portion 1818 along the inner wall, thereby effectively preventing liquid medicine from cross-contamination. Specifically, if Figure 5As shown, the telescopic joint 1802 includes a first joint body 1805 fixedly mounted on the gate plate 1801, a second joint body 1806 is slidably mounted in the first joint body 1805, a third joint body 1807 is slidably mounted in the second joint body 1806, an arc-shaped groove 1804 adapted to the lifting column 4 is provided at the outer end of the third joint body 1807, the first joint body 1805 is connected to the second joint body 1806, and a third joint body 1807 is fixedly mounted at the end of the third joint body 1807. The plunger 1811 in the second joint 1806, the third central tube 1808 is provided in the third joint 1807, the end of the third central tube 1808 away from the plunger 1811 is provided with an oil port, the other end of the third central tube 1808 passes through the plunger 1811 and extends into the second joint 1806, the second central tube 1809 is sleeved in the third central tube 1808, the second central tube 1809 is adapted to the second joint 1806, and the second central tube 1809 is sleeved in the second central tube 1809 There is a first center cylinder 1810, the first center cylinder 1810 is adapted to the first joint 1805, the end of the first center cylinder 1810 is provided with a first working oil port 1815 connected to the oil port, the end of the first joint 1805 is provided with a second working oil port 1816, the second working oil port 1816 is connected to the A oil port of the reversing valve, the first working oil port 1815 is connected to the B oil port of the reversing valve, the P oil port of the reversing valve is connected to the oil inlet pipeline, and the T oil port of the reversing valve is connected to the return oil pipe When oil flows into the first working oil port 1815, oil returns to the second working oil port 1816, and the third section 1807 retracts the second section 1806, driving the second section 1806 to retract the first section 1805, thereby opening the gate 18; when oil flows into the second working oil port 1816, the hydraulic oil pushes the third section 1807 and the second section 1806 out, thereby closing the gate 18, and the arc-shaped groove 1804 blocks the lifting column 4, thereby sealing the bottom of the cavity.

[0077] Here, the first section 1805, the second section 1806 and the third section 1807 are preferably hollow structures with square cross-sections, which are sequentially mounted together, and sealing strips are provided between two adjacent sections to prevent leakage of hydraulic oil.

[0078] In order to improve the stability and accuracy of the sliding trajectory of the telescopic joint 1802, a third guide cylinder 1812 is provided in the third section 1807. The third guide cylinder 1812 is parallel to the third center cylinder 1808. One end of the third guide cylinder 1812 is fixed to the end of the third section 1807 away from the plunger 1811. The other end of the third guide cylinder 1812 passes through the plunger 1811 and extends into the second section 1806. The third guide cylinder 1812 is sleeved with a second guide cylinder 1813. The second guide cylinder 1813 is parallel to the third center cylinder 1808. The second section 1806 is adapted to each other, and the first guide cylinder 1814 is installed in the second guide cylinder 1813. The first guide cylinder 1814 is adapted to the first section 1805, and the end of the first guide cylinder 1814 is fixed to the end of the first section 1805. The first guide cylinder 1814, the second guide cylinder 1813 and the third guide cylinder 1812 installed together play a good guiding role, avoiding the tilting and jamming of the telescopic joint 1802 during the extension or retraction process, making the telescopic joint 1802 extend and retract more smoothly.

[0079] like Figure 6 and Figure 7 As shown, the first spray water pipe 13, the first liquid medicine spray pipe 14, the second spray water pipe 15, the second liquid medicine spray pipe 16 and the third spray water pipe 17 all extend into the cleaning box 2 and the protruding ends are hingedly installed with a swing cylinder 24, the cylinder body of the swing cylinder 24 is hingedly installed on the cleaning box 2, and the piston rod of the swing cylinder 24 is hingedly installed on the corresponding first spray water pipe 13, the first liquid medicine spray pipe 14, the second spray water pipe 15, the second liquid medicine spray pipe 16, the third spray water pipe 17 or the nitrogen blowing pipe 41.

[0080] The first spray water pipe 13 , the first liquid medicine spray pipe 14 , the second spray water pipe 15 , the second liquid medicine spray pipe 16 , the third spray water pipe 17 and the nitrogen blowing pipe 41 are all mounted on the cleaning box 2 through the self-aligning bearing 22 .

[0081] In this way, the corresponding first spray water pipe 13, the first liquid spray pipe 14, the second spray water pipe 15, the second liquid spray pipe 16, the third spray water pipe 17 and the nitrogen blowing pipe 41 can be swung by the push of the swing cylinder 24. When in use, they can be swung and sprayed at the same time to thoroughly spray or blow on the entire surface of the wafer.

[0082] Sealing elements 23 are provided between the first spray water pipe 13 , the first chemical liquid spray pipe 14 , the second spray water pipe 15 , the second chemical liquid spray pipe 16 , the third spray water pipe 17 and the nitrogen blowing pipe 41 and the inner wall of the cleaning box 2 .

[0083] The sealing element 23 is usually a rubber sealing sleeve, which seals the gaps between the corresponding first spray water pipe 13, the first liquid medicine spray pipe 14, the second spray water pipe 15, the second liquid medicine spray pipe 16, the third spray water pipe 17 and the nitrogen blowing pipe 41 and the cleaning box 2. This sealing sleeve is a commonly used component, usually a corrugated sealing sleeve. Those skilled in the art can choose to use it according to their needs, which will not be repeated here.

[0084] The first spray water pipe 13, the first chemical liquid spray pipe 14, the second spray water pipe 15, the second chemical liquid spray pipe 16, the third spray water pipe 17 and the nitrogen blowing pipe 41 can be swung in the cleaning box 2 under the action of the swing cylinder 24. When it is necessary to spray or dry the wafer, they are swung to the position above the turntable 6 under the action of the swing cylinder 24 and reciprocate. When the spraying or drying is completed and the turntable 6 needs to move upward under the action of the lifting column 4, they are deviated from the upward movement trajectory of the turntable 6 under the action of the swing cylinder 24 to avoid interference with the turntable 6.

[0085] like Figure 8 , 9 As shown in Figures 10 and 11 , a rotating tube 30 driven by a servo motor 31 is rotatably mounted on the cleaning box 2 through a bearing. Usually, the servo motor 31 is connected to the rotating tube 30 through a gear pair. The rotating tube 30 extends into the cleaning box 2 along the radial direction of the rotating disk 6. The height position of the rotating tube 30 is usually set between the second liquid spray pipe 16 and the third spray water pipe 17. A slide seat 32 driven by a first cylinder 33 is axially slidably mounted in the rotating tube 30. A diamond-shaped four-bar linkage is mounted on the side of the slide seat 32 away from the first cylinder 33. The four-bar linkage includes a first connecting rod 35, a first connecting rod 36, and a second connecting rod 37 which are hinged in sequence. The hinge points of the second connecting rod 36, the third connecting rod 37 and the fourth connecting rod 38, the first connecting rod 35 and the fourth connecting rod 38 are hinged on the slide 32, the slide 32 is equipped with a second cylinder 34, the cylinder body of the second cylinder 34 is fixedly installed on the slide 32, and the second cylinder 34 and the first cylinder 33 are located on the same side of the slide 32, the hinge points of the second connecting rod 36 and the third connecting rod 37 are connected to the piston rod of the second cylinder 34, the second connecting rod 36 and the third connecting rod 37 are both provided with an extension extending out of the hinge point, and the end of the extension is provided with a clamping part 39, and the clamping range of the clamping part 39 is adapted to the thickness of the wafer. This structure can not only realize the automatic clamping and flipping of the wafer, but also under the action of the first cylinder 33, the clamping part 39 can also avoid the lifting and lowering trajectory of the turntable, avoid interfering with the lifting and lowering of the turntable, replace the manual flipping of the wafer, and further improve the production efficiency of the wafer.

[0086] A limiting element for limiting the maximum stroke of the first cylinder 33 is provided on the rotating tube 30. The limiting element is usually a limiting screw 40, which is threadedly connected to the rotating tube 30. The distance from the initial state of the first cylinder 33 to the limiting screw 40 is less than the stroke of the first cylinder 33. The limiting screw 40 limits the maximum position of the extension of the piston rod of the first cylinder 33. When the second cylinder 34 pushes the four-bar linkage at this position, the force of the second cylinder 34 acts on the limiting screw 40 instead of on the piston of the first cylinder 33, thereby protecting the piston of the first cylinder 33 and extending the service life of the first cylinder 33.

[0087] The four-bar linkage is provided with a compression spring arranged radially along the rotating tube 30 , and the force of the compression spring can act on the four-bar linkage in time, so as to open the clamping part 39 more quickly, thereby effectively preventing the wafer from being subjected to the radial force of the clamping part 39 .

[0088] The specific operating principle and process flow of the wafer protective coating integrated cleaning device of the present invention are as follows: when in use, the operator opens the cover plate 3, fills an appropriate amount of soaking liquid in the soaking chamber 201, and the hydraulic cylinder 8 pushes the lifting column 4 to move up, and the back of the wafer to be processed is placed on the suction cup 7, and the vacuum pump is started to fix the wafer on the turntable 6. Under the action of the hydraulic cylinder 8, the lifting column 4 moves down, blocks the cover plate 3, and blocks the cleaning box 2. Figure 1 As shown, the turntable 6 drives the wafer to sink into the soaking liquid in the soaking chamber 201 for soaking. After the soaking is completed, the lifting column 4 drives the turntable 6 to start moving up to the position below the first spray water pipe 13. After the swing cylinder 24 swings the first spray water pipe 13 to the center position of the turntable 6, it swings back and forth at a certain swing amplitude. At this time, the first spray water pipe 13 starts to spray pure water to rinse and remove the soaking liquid residue. After that, the lifting column 4 moves up. Fig.11 As shown, the wafer is transferred to the first rinsing chamber 202, the telescopic joint 1802 at the bottom of the first rinsing chamber 202 is closed, and then the rotary motor 11 is started to drive the wafer to rotate. At this time, the swing cylinder 24 moves the first liquid spray pipe 14 to the top of the wafer, sprays and rinses the wafer surface, and opens the second drain pipe 20. The first liquid after rinsing flows out through the second drain pipe 20 for collection. After the first liquid is rinsed, there is no need to turn off the rotary motor 11. The first liquid spray pipe 14 is swung out of the center position, and the second spray water pipe 15 is swung to the center position to spray pure water on the wafer surface to rinse and remove the first liquid residue. At the same time, the first liquid residue in the first rinsing chamber 202 is discharged through the second drain pipe 20. Fig.12As shown, the hydraulic cylinder 8 drives the wafer to move up to the second rinsing chamber 203, closes the telescopic joint 1802 at the bottom of the second rinsing chamber 203, and the second liquid spray pipe 16 swings to the center position to spray the second liquid on the surface of the wafer. At this time, the third drain pipe 21 is opened, and the liquid is discharged and collected through the third drain pipe 21. After spraying, the third spray water pipe 17 swings to the top of the wafer to start pure water spraying and rinsing. After rinsing, the rotary motor 11 drives the wafer to continue to rotate, shakes off the residual water droplets on the front of the wafer, and then the rotary motor 11 stops. If the back of the wafer does not need to be cleaned, the nitrogen spray pipe 41 sprays nitrogen on the surface of the wafer for drying. After drying, the wafer can be taken out. If the back of some wafer products also needs to be cleaned, and the front of the wafer product allows suction cup adsorption, the first cylinder 33 is actuated to push the slide 32 to move toward the turntable 6. After the clamping part 39 moves to the wafer position, the second cylinder 34 is actuated to push the four-bar linkage to deform. The two opposing clamps 39 merge to clamp the upper and lower surfaces of the wafer, the vacuum pump stops exhausting, the suction cup 7 releases the wafer, the lifting column 4 moves down a certain distance, the servo motor 31 starts, the rotary tube 30 drives the wafer to flip 180 degrees, the lifting column 4 rises, the vacuum pump starts exhausting, the suction cup 7 adsorbs the front side of the wafer, the second cylinder 34 pulls the four-bar mechanism to deform, the clamps 39 open, and then the first cylinder 33 pulls back the slide 32, the lifting column 4 moves down, the rotary motor 11 starts to start, and the previous actions are repeated to continue spraying the first and second liquid chemicals on the back side of the wafer. After the spraying and rinsing is completed, the nitrogen blowing pipe 41 sprays nitrogen to the wafer surface for drying treatment. After drying, the nitrogen blowing pipe 41 deviates from the center position, the rotary motor 11 stops, the cover plate 3 is opened, the hydraulic cylinder 8 drives the wafer to move up, the vacuum pump stops exhausting, and the operator can take out the processed wafer, and then put in another wafer to be cleaned to continue cleaning.

[0089] In order to reduce the operator and their labor intensity and improve the degree of automation, a control unit such as a programmable controller or a microcomputer is usually used for control, and a temperature sensor is set at the corresponding position to make the action instructions and temperature control more accurate and timely control the relevant actuators. Those skilled in the art can implement it according to the actual situation, and will not be repeated here. The pressure or flow of the separate liquid spray pipe, spray water pipe and nitrogen blowing pipe 41 can be controlled to meet the use of wafers of different specifications.

[0090] As described above, the present invention provides an integrated cleaning device for wafer protective coating. The integrated cleaning device for wafer protective coating has achieved many excellent technical effects through unique structural design. It can realize immersion, spraying and drying in a closed cleaning box. It not only has good immersion and cleaning effects, but also shortens the immersion and cleaning time, thereby improving the production efficiency of the wafer. It can greatly improve the cleaning efficiency and production efficiency, realize fully automated operation, and has good application potential in the field of semiconductor processing.

[0091] Although the present invention has been described in detail above by general description and specific embodiments, it is obvious to those skilled in the art that some modifications or improvements can be made to the present invention. Therefore, these modifications or improvements made without departing from the spirit of the present invention all belong to the scope of protection claimed by the present invention.

Claims

1. A wafer protective coating integrated cleaning device, comprising a bracket, a cleaning box is fixedly mounted on the bracket, and the top of the cleaning box is covered with a cover plate, characterized in that: The bottom of the cleaning box is provided with a lifting column driven by a first power mechanism and lifted vertically, the lifting column is connected to a second power mechanism that drives the lifting column to rotate around a rotation center, the lifting column passes through the bottom surface of the cleaning box and extends into the cleaning box, a rotating disk is fixedly installed on the top of the lifting column, the lifting column has a central through hole, a plurality of suction cups are provided on the upper surface of the rotating disk, all of the suction cups are connected to the central through hole, and the bottom end of the lifting column is connected to a vacuum pump through a rotating joint; the cleaning box is provided with a soaking chamber, a first rinsing chamber and a second rinsing chamber from bottom to top, and gates are provided between the soaking chamber and the first rinsing chamber and between the first rinsing chamber and the second rinsing chamber, the gate includes a gate plate fixed on the cleaning box, an installation groove is provided on the gate plate, the width of the center position of the installation groove is greater than the diameter of the rotating disk, and a split telescopic joint is provided in the installation groove A sealing strip is provided between the periphery of the telescopic joint and the gate plate, an arc-shaped groove adapted to the lifting column is provided at the innermost end of the telescopic joint, the gate plate has a protrusion protruding upward, the mounting groove is opened at the protrusion, a first spray water pipe is provided at the top of the immersion chamber, a first drain pipe is provided at the bottom of the immersion chamber, a first liquid medicine spray pipe and a second spray water pipe are provided at the top of the first flushing chamber, the second spray water pipe is located above the first liquid medicine spray pipe, a second drain pipe is provided at the bottom of the first flushing chamber, a second liquid medicine spray pipe and a third spray water pipe are provided at the top of the second flushing chamber, the third spray water pipe is located above the second liquid medicine spray pipe, a third drain pipe is provided at the bottom of the second flushing chamber, the first liquid medicine spray pipe is connected to the first liquid medicine storage tank, the second liquid medicine spray pipe is connected to the second liquid medicine storage tank, and a nitrogen blowing pipe is provided at the top of the second flushing chamber.

2. The integrated wafer protective coating cleaning device according to claim 1, characterized in that: The first spray water pipe, the first liquid medicine spray pipe, the second spray water pipe, the second liquid medicine spray pipe, the third spray water pipe and the nitrogen blowing pipe all extend into the cleaning box body and the extended ends are hingedly mounted with a swing cylinder.

3. The integrated wafer protective coating cleaning device according to claim 2, characterized in that: The first spray water pipe, the first liquid medicine spray pipe, the second spray water pipe, the second liquid medicine spray pipe, the third spray water pipe and the nitrogen blowing pipe are all installed on the cleaning box through self-aligning bearings.

4. The integrated wafer protective coating cleaning device according to claim 3, characterized in that: Sealing elements are provided between the first spray water pipe, the first liquid medicine spray pipe, the second spray water pipe, the second liquid medicine spray pipe, the third spray water pipe and the nitrogen blowing pipe and the inner wall of the cleaning box.

5. The integrated cleaning device for wafer protective coating according to any one of claims 1 to 4, characterized in that: A rotating tube driven by a servo motor is rotatably installed on the cleaning box, and the rotating tube extends into the cleaning box along the radial direction of the turntable, and a sliding seat driven by a first cylinder is axially slidably installed in the rotating tube, and a diamond-shaped four-bar mechanism is installed on the side of the sliding seat away from the first cylinder, and the four-bar mechanism includes a first connecting rod, a second connecting rod, a third connecting rod and a fourth connecting rod hinged in sequence, and the hinge points of the first connecting rod and the fourth connecting rod are hinged on the sliding seat, and the second cylinder is installed on the sliding seat, and the hinge points of the second connecting rod and the third connecting rod are connected to the piston rod of the second cylinder, and the second connecting rod and the third connecting rod are both provided with extension parts extending from the hinge points, and the ends of the extension parts are provided with clamping parts.

6. The integrated wafer protective coating cleaning device according to claim 5, characterized in that: The rotary tube is provided with a limiting element for limiting the maximum stroke of the first cylinder.

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