A silicon wafer self-positioning dry etching device

Abstract

The present invention discloses a dry etching device with self-positioning of silicon wafers. A silicon wafer supporting device and a silicon wafer positioning device are provided on a lower warehouse body. The silicon wafer supporting device includes a supporting rod, and the silicon wafer positioning device includes a positioning rod. The supporting rod is driven by a first power device, and the positioning rod is driven by a second power device. A placing platform is provided with a supporting hole and a positioning hole. A cooling groove is provided on the placing platform in a silicon wafer placing area. An air intake interface is provided on the workbench. An upper mounting plate is installed on the upper warehouse body. An upper electrode reaction plate is fixed on the upper mounting plate. An etching hole is provided on the upper electrode reaction plate. The upper mounting plate is driven by a linear motor. A clamping structure is provided on the upper mounting plate. The device can accurately place the silicon wafer in the silicon wafer placing area through the positioning rod, and effectively fix the silicon wafer during etching to avoid leakage of cooling gas, so that the silicon wafer can be accurately etched, thereby ensuring production efficiency and production quality.

Description

Technical Field

[0001] The invention relates to a silicon chip self-positioning dry etching device, which is applicable to the field of semiconductor production. Background Art

[0002] In the semiconductor manufacturing process, the etching of single-crystal silicon and polycrystalline silicon usually includes wet etching and dry etching, and each method has its own advantages and disadvantages. Dry etching is a technology that uses plasma to etch thin films. When the gas exists in the form of plasma, it has two characteristics: on the one hand, the chemical activity of these gases in the plasma is much stronger than under normal conditions. According to the different materials to be etched, by selecting the appropriate gas, it can react with the material faster to achieve the purpose of etching and removal; on the other hand, the electric field can be used to guide and accelerate the plasma so that it has a certain energy. When it bombards the surface of the etched object, it will knock out the atoms of the etched material, thereby achieving the purpose of etching by physical energy transfer. The etched substance becomes a volatile gas, which is extracted by the exhaust system and finally etched to the depth we need to achieve according to the design graphic requirements. Therefore, dry etching is the result of a balance between physical and chemical processes on the wafer surface. At present, the dry etching device includes a workbench, on which a vacuum reaction device for dry etching of silicon wafers is installed. The vacuum reaction chamber comprises an upper chamber body and a lower chamber body fixedly matched with each other, a feed port is provided on the lower chamber body, a feed port opening and closing mechanism is installed at the feed port, a placement platform is provided in the lower chamber body, a silicon wafer placement area is provided on the placement platform, a liftable and slidable support rod is provided on the placement platform to support the silicon wafer fed from the feed port, a cooling groove for back cooling is provided on the placement platform, the silicon wafer is placed in the placement area and covers the cooling groove, cooling gas is introduced into the cooling groove to cool the silicon wafer during the etching process, however, due to errors in the process of silicon wafers being loaded by the loading robot, and errors may also occur when the support rods support the silicon wafers, this will result in the silicon wafers not being accurately placed in the placement area and covered with the cooling gas, so that the gas in the cooling groove will leak into the vacuum reaction chamber, the leaked gas affects the vacuum degree, and also affects the etching of the plasma gas, thereby resulting in a decrease in etching quality, and the leakage of cooling gas during the etching process leads to poor heat dissipation, resulting in deformation of the processed silicon wafers and low yield. Summary of the Invention

[0003] The technical problem to be solved by the present invention is: a self-positioning dry etching device for silicon wafers, which can accurately place the silicon wafer in the silicon wafer placement area through the positioning rod, so that the silicon wafer can be accurately etched to ensure production efficiency and production quality.

[0004] In order to solve the above technical problems, the technical solution of the present invention is: a self-positioning dry etching device for silicon wafers, comprising a workbench, on which a vacuum reaction chamber for dry etching of silicon wafers is installed, the vacuum reaction chamber comprising an upper chamber body and a lower chamber body fixedly matched with each other, the lower chamber body being provided with a feed port, the feed port being provided with a feed port opening and closing mechanism, a placement platform being provided in the lower chamber body, a silicon wafer placement area being provided on the placement platform, a silicon wafer support device and a silicon wafer positioning device being provided on the lower chamber body, the silicon wafer support device comprising a plurality of axially retractable support rods extending from the silicon wafer placement area for supporting the silicon wafer, the silicon wafer positioning device comprising a plurality of axially retractable positioning rods extending around the silicon wafer placement area for positioning the silicon wafer, the support rods being driven by a first power device It moves back and forth between the support station and the first standby station, and the positioning rod is driven by the second power device to move back and forth between the positioning station and the second standby station. The placement platform is provided with support holes and positioning holes corresponding to the support rod and the positioning rod. A cooling groove for cooling the silicon wafer is provided in the silicon wafer placement area on the placement platform, and an air inlet interface for connecting the cooling gas to the cooling groove is provided on the workbench. An upper mounting plate is installed on the upper chamber body for lifting and sliding, and an upper electrode reaction plate is fixed on the upper mounting plate. A number of etching holes for introducing etching gas are provided on the upper electrode reaction plate. The upper mounting plate is driven by a linear motor to move back and forth between the etching station and the third standby station, and a clamping structure for elastically clamping the edge of the silicon wafer is provided on the upper mounting plate.

[0005] As a preferred solution, the support rod is fixedly mounted on the support seat, the positioning rod is fixedly mounted on the positioning seat, and two or more sliding rods are radially and evenly arranged on the support seat, and the positioning seat is provided with an axially extending strip through hole corresponding to the sliding rod one by one. The positioning seat is mounted on the support seat, and the sliding rod is constrained in the strip through hole. The support rod in the first standby position is lower than the positioning rod in the second standby position, and the support rod in the supporting position is higher than the positioning rod in the positioning position. A positioning force structure is provided between the positioning seat and the workbench to keep the positioning rod in the positioning position. The first power device and the second power device adopt a set of supporting positioning linear power devices, and the supporting positioning linear power devices are connected to the support seat.

[0006] As a preferred solution, the positioning force structure includes a force spring arranged between the positioning seat and the workbench. The elastic force of the force spring forces the positioning seat to move from the second standby position to the positioning position. When the positioning seat is in the positioning position, the force spring is in a free state.

[0007] As a preferred solution, the positioning force-applying structure includes a plurality of damping rings, which are arranged in the positioning holes or are fixedly mounted on the positioning rods.

[0008] As a preferred solution, the clamping structure includes a pressure ring, which is provided with a plurality of guide rods. The upper ends of the guide rods pass through the upper mounting plate, and the upper ends of the guide rods are fixed with limit blocks that contact the upper surface of the upper mounting plate. The guide rods are provided with buffer springs, and the buffer springs are located between the upper mounting plate and the pressure ring.

[0009] As a preferred solution, positioning plugs corresponding to the positioning holes and blocking the positioning holes are fixed around the pressure ring; the ends of the positioning plugs are conical.

[0010] As a preferred solution, the top of the positioning rod is provided with an inclination angle for guiding the silicon wafer to fall into the silicon wafer placement area when the support rod falls.

[0011] As a preferred solution, the feed port opening and closing mechanism includes a door frame arranged at the edge of the feed port, the door frame is provided with a slide groove, a door sealing plate is installed in the slide groove, and the door sealing plate is driven by a door sealing plate linear power device to open or close the feed port.

[0012] After adopting the above technical solution, the effect of the present invention is as follows: the dry etching device for self-positioning of silicon wafers includes a workbench, a vacuum reaction chamber for dry etching of silicon wafers is installed on the workbench, the vacuum reaction chamber includes an upper chamber body and a lower chamber body fixedly matched with each other, the lower chamber body is provided with a feed port, a feed port opening and closing mechanism is installed at the feed port, a placement platform is provided in the lower chamber body, a silicon wafer placement area is provided on the placement platform, a silicon wafer supporting device and a silicon wafer positioning device are provided on the lower chamber body, the silicon wafer supporting device includes a plurality of axially retractable support rods extending from the silicon wafer placement area for supporting the silicon wafer, and the silicon wafer positioning ... The present invention comprises a plurality of positioning rods that are axially retractable and extend around the silicon wafer placement area for positioning the silicon wafer. The support rods are driven by a first power device to reciprocate between the support station and the first standby station. The positioning rods are driven by a second power device to reciprocate between the positioning station and the second standby station. The placement platform is provided with support holes and positioning holes that correspond one to one with the support rods and the positioning rods. The placement platform is provided with a cooling groove for cooling the silicon wafer in the silicon wafer placement area. The workbench is provided with an air inlet interface for connecting the cooling gas to the cooling groove. An upper mounting plate is installed on the upper storage body for lifting and sliding, and an upper electrode is fixed on the upper mounting plate. Reaction plate, the upper electrode reaction plate is provided with a plurality of etching holes for introducing etching gas, the upper mounting plate is driven by a linear motor to reciprocate between the etching station and the third standby station, and the upper mounting plate is provided with a clamping structure for elastically clamping the edge of the silicon wafer; therefore, the opening and closing mechanism of the feed port is first opened, the first power device drives the support rod to rise to the supporting station, the manipulator places the silicon wafer on the support rod, the feed port is closed, the second power device drives the positioning rod to rise to the positioning station, and then the support rod gradually descends, the silicon wafer is positioned by the positioning rod, until the support rod returns to the first standby station, the silicon wafer falls into the silicon wafer placement area, and the positioning rod also descends to the second standby station The machine station is then driven by a linear motor to the upper mounting plate to the etching station, so that the clamping structure can elastically clamp the edge of the silicon wafer to ensure that the silicon wafer fits into the cooling groove and accurately covers the cooling groove. At the same time, cooling gas is introduced from the air inlet interface to evacuate the vacuum reaction chamber, and etching gas is also introduced into the etching holes on the upper electrode reaction plate to start etching reaction on the silicon wafer. After etching is completed, the support rod lifts the silicon wafer, the feed port is opened, and the silicon wafer is replaced by a robot arm. The device can accurately place the silicon wafer in the silicon wafer placement area through the positioning rod, and effectively fix the silicon wafer during etching to avoid leakage of cooling gas, so that the silicon wafer can be accurately etched, ensuring production efficiency and production quality.

[0013] The cam is fixedly mounted on the support base, and the positioning rod is fixedly mounted on the positioning base, and the support base is radially and evenly provided with two or more sliding rods, and the positioning base is provided with an axially extending strip through-hole corresponding to the sliding rod one by one. The positioning base is sleeved on the support base, and the sliding rod is constrained in the strip through-hole, and the support rod in the first standby position is lower than the positioning rod in the second standby position, and the support rod in the supporting position is higher than the positioning rod in the positioning position. A positioning force structure is provided between the positioning base and the workbench to keep the positioning rod in the positioning position, and the first power device and the second power device adopt a set of supporting and positioning linear power devices, and the supporting and positioning linear power devices are connected to the support base; a set of power devices is used to control the support and positioning of the silicon wafer, which effectively saves costs. When the sliding rod contacts the lower part of the strip through hole, it drives the positioning seat to move downward, so that the silicon wafer falls accurately into the silicon wafer placement area, and at the same time, it also drives the positioning seat to move downward to the second standby position. This simplified structure reduces costs and improves production quality.

[0014] When the support rod is moved from the first standby position to the second standby position, the force spring is in a free state, and when the support rod reaches the supporting position from the first standby position, the force spring is in a free state and will not rise again, thereby ensuring that the support rod is higher than the positioning rod. When the support rod returns to the first standby position from the supporting position, the force spring has a certain elastic force to place the positioning rod down until the sliding rod contacts the lower part of the strip through hole, driving the positioning rod to descend to the second standby position. At this time, the force spring is compressed, and after rebounding, the positioning rod can reach the positioning position next time, thereby ensuring accurate positioning of the silicon wafer.

[0015] Furthermore, since the positioning force structure includes a plurality of damping rings, which are arranged in the positioning holes or fixed on the positioning rods, when the support rods move downward, the positioning rods are kept in the positioning position due to the damping effect of the damping rings. In this way, the silicon wafer descends along with the support rods and is positioned by the positioning rods. Then, the sliding rod contacts the lower part of the strip-shaped through hole, which drives the positioning seat to move downward, and finally the silicon wafer falls into the silicon wafer placement area. At the same time, the positioning rod and the support rod are respectively in the second standby position and the first standby position, which can also realize that one power drives the positioning rod and the support rod at the same time.

[0016] Furthermore, since the clamping structure includes a pressure ring, a plurality of guide rods are provided on the pressure ring, and the upper ends of the guide rods pass through the upper mounting plate. A limit block in contact with the upper surface of the upper mounting plate is fixed to the upper end of the guide rod, and a buffer spring is mounted on the guide rod. The buffer spring is located between the upper mounting plate and the pressure ring. The pressure ring is connected to the upper mounting plate through the limit block and the guide rod, and the guide rod can move axially when the buffer spring is compressed. In this way, when pressure is applied to the silicon wafer, the guide rod guides the spring to avoid deviation in the compression of the spring, so that the silicon wafer is effectively compressed.

[0017] In addition, since the pressure ring is fixed with positioning plugs that correspond to the positioning holes one by one and block the positioning holes; the end of the positioning plug is conical, the sealing of the positioning holes is not good enough during the etching process, so the positioning holes are blocked by the positioning plugs to ensure good sealing, which can ensure that the vacuum degree in the vacuum reaction chamber meets the etching requirements, and also prevent gas from entering from the positioning holes, causing irregular flow of etching gas in the vacuum reaction chamber and causing a decrease in etching quality.

[0018] Furthermore, since the top of the positioning rod is provided with an inclination angle for guiding the silicon wafer to fall into the silicon wafer placement area when the support rod falls, the inclination angle can guide the silicon wafer to fall into the silicon wafer placement area during the support rod falling process, thereby improving accuracy.

[0019] In addition, since the feed port opening and closing mechanism includes a door frame arranged at the edge of the feed port, a slide groove is provided on the door frame, and a door sealing plate is installed in the slide groove, the door sealing plate is driven by a door sealing plate linear power device to open or close the feed port. Since the silicon wafer needs to undergo etching reaction in a closed environment, but a robot is required for loading, the loading of the silicon wafer can be facilitated by opening the door sealing plate. After closing the door sealing plate, a closed chamber is formed, and the etching reaction can be carried out. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below with reference to the accompanying drawings and examples.

[0021] Figure 1 is a perspective view of an embodiment of the present invention;

[0022] Figure 2 This is a schematic structural diagram of an embodiment of the present invention with the upper housing shell removed;

[0023] Figure 3 This is a left side view of the lower bin body of an embodiment of the present invention;

[0024] Figure 4 yes Figure 3 Cross-sectional view at AA;

[0025] Figure 5 2 is a schematic structural diagram of an upper bin body according to an embodiment of the present invention;

[0026] Figure 6 is a schematic structural diagram of a positioning rod and a support rod according to an embodiment of the present invention;

[0027] Figure 7 is a schematic structural diagram of a cooling groove according to an embodiment of the present invention;

[0028] In the accompanying drawings: 1. cover shell; 2. upper working platform; 3. middle working platform; 4. lower working platform; 5. first cylinder; 6. support seat; 61. sliding rod; 7. positioning seat; 71. strip through hole; 8. support rod; 9. positioning rod; 91. damping ring; 10. placement platform; 101. silicon wafer placement area; 102. support hole; 103. positioning hole; 11. cooling groove; 111. strip groove; 12. feed port; 13. door sealing plate; 14. door frame; 141. slide; 15. second cylinder; 16. air inlet interface; 17. linear motor; 18. upper mounting plate; 19. upper electrode reaction plate; 191. etching hole; 20. pressure ring; 21. guide rod; 22. buffer spring; 23. positioning plug; 24. limit block; 25. upper bin body; 26. lower bin body. DETAILED DESCRIPTION

[0029] The present invention is further described in detail below through specific examples.

[0030] like Figures 1 to 7As shown, a silicon wafer self-positioning dry etching device includes a workbench, on which a vacuum reaction chamber for dry etching of silicon wafers is installed. The vacuum reaction chamber includes an upper chamber body 25 and a lower chamber body 26 fixedly matched with each other. The lower chamber body 26 is provided with a feed port 12, and a feed port 12 opening and closing mechanism is installed at the feed port 12. A placement platform 10 is provided in the lower chamber body 26, and a silicon wafer placement area 101 is provided on the placement platform 10. The lower chamber body 26 is provided with a silicon wafer support The device and the silicon wafer positioning device, the silicon wafer supporting device includes a plurality of axially retractable support rods 8 extending from the silicon wafer placement area 101 for supporting the silicon wafer, the silicon wafer positioning device includes a plurality of axially retractable positioning rods 9 extending around the silicon wafer placement area 101 for positioning the silicon wafer, the support rods 8 are driven by a first power device to reciprocate between the support station and the first standby station, and the positioning rods 9 are driven by a second power device to reciprocate between the positioning station and the second standby station, the placement platform 10 is provided with support holes 102 and positioning holes 103 corresponding to the support rods 8 and the positioning rods 9, the placement platform 10 is provided with a cooling groove 11 for cooling the silicon wafer in the silicon wafer placement area 101, the workbench is provided with an air inlet interface 16 for connecting the cooling gas to the cooling groove 11, the upper mounting plate 18 is installed on the upper chamber 25 for lifting and sliding, the upper mounting plate 18 is fixed with an upper electrode reaction plate 19, and the upper electrode reaction plate 19 is provided with a plurality of channels for introducing etching gas The etching hole 191 is driven by the linear motor 17 to reciprocate between the etching station and the third standby station. The upper mounting plate 18 is provided with a clamping structure for elastically clamping the edge of the silicon wafer. The linear motor 17 is fixedly mounted on the top of the cover 1. The cover 1 is used to isolate the vacuum reaction chamber from external contact. Since the linear motor 17 has a simple structure, smooth movement and high precision, it can accurately control the distance between the upper electrode reaction plate 19 and the silicon wafer, thereby improving accuracy.

[0031] like Figure 3 and Figure 7 As shown, the cooling groove 11 is annular and also includes a strip groove 111 extending from the center of the circle and connected to the cooling groove 11. The strip groove 111 corresponds to the support rod 8 one by one, and the support rod 8 extends from the inner edge of the strip groove 111. Since the silicon wafer will generate heat during the etching process, overheating will cause the silicon wafer to deform and the etching will be inaccurate. The cooling gas is helium. When the silicon wafer is in the silicon wafer placement area 101, helium is introduced into the cooling groove 11 through the air inlet interface 16, and then the helium is evenly distributed through the strip groove to cool the back of the silicon wafer, so that the back temperature is controlled at about 20°C, effectively reducing heat and improving production quality.

[0032] like Figure 1 and Figure 5As shown, the support rod 8 is fixedly mounted on the support seat 6, the positioning rod 9 is fixedly mounted on the positioning seat 7, the support seat 6 is radially and evenly provided with two or more sliding rods 61, the positioning seat 7 is provided with an axially extending strip through hole 71 corresponding to the sliding rod 61, the positioning seat 7 is sleeved on the support seat 6, the sliding rod 61 is constrained in the strip through hole 71, the support rod 8 in the first standby position is lower than the positioning rod 9 in the second standby position, the support rod 8 in the supporting position is higher than the positioning rod 9 in the positioning position, the positioning seat 7 A positioning force structure is provided between the workbench to keep the positioning rod 9 in the positioning position. The first power device and the second power device adopt a set of supporting and positioning linear power devices, and the supporting and positioning linear power devices are connected to the support seat 6; the supporting and positioning linear power devices adopt a first cylinder 5, and the workbench includes three-layer working platforms, including an upper working platform 2, a middle working platform 3 and a lower working platform 4. The first cylinder 5 is fixedly installed on the lower working platform 4, and the guide rod of the first cylinder 5 passes through the middle working platform 3 and is connected to the support seat 6. The positioning seat 7 is set on the support seat 6. The bottoms of the positioning seat 7 and the supporting seat 6 are flush with each other and the sliding rod 61 is at the lower part of the strip through hole 71. The positioning seat 7 and the supporting seat 6 are installed on the middle working platform 3. The supporting rod 8 fixed on the supporting seat 6 is driven upward by the first cylinder 5. At this time, the sliding rod 61 slides upward in the strip through hole 71 until it contacts the upper part of the strip through hole 71, and then drives the positioning seat 7 to move upward. At this time, the supporting rod 8 is higher than the positioning rod 9 and moves upward synchronously to ensure that the silicon wafer is not affected when it is placed. The supporting rod 8 forms a supporting area for placing the silicon wafer. After the silicon wafer is placed, the supporting rod 8 is driven downward by the first cylinder 5. At this time, the sliding rod 61 The movable rod 61 slides to the lower part in the strip-shaped through hole 71, and the support rod 8 is lower than the positioning rod 9. The silicon wafer on the support rod 8 falls into the positioning area formed by the positioning rod 9, and then the support seat 6 drives the positioning seat 7 downward synchronously until the silicon wafer falls into the silicon wafer placement area 101, completing the accurate placement of the silicon wafer and improving the production quality; the first standby position is the state where the support rod 8 and the support seat 6 are on the middle working platform 3, the second standby position is the state where the positioning rod 9 and the positioning seat 7 are on the middle working platform 3, and the support position is the state where the support rod 8 and the support seat 6 are level with the feed port 12.

[0033] When the support seat 6 moves from the supporting position to the first standby position, the support seat 6 first drops down, and the positioning seat 7 remains stationary due to the force spring until the sliding rod 61 contacts the lower part of the bar through hole 71, and then drives it to drop down together.

[0034] Furthermore, the positioning force applying structure can also adopt another solution, such as Figure 6 As shown, the positioning force structure includes a plurality of damping rings 91, and the damping rings 91 are arranged in the positioning hole 103 or are fixed on the positioning rod 9; the damping rings 91 can ensure that the positioning seat 7 will not move when the sliding rod 61 does not contact the upper or lower part of the bar through hole 71. Therefore, when the support seat 6 moves upward or downward, both schemes can ensure that the positioning seat 7 will not move with the support seat 6, and there will be no problems such as the support rod 8 being lower than the positioning rod 9 when in the supporting position or the support rod 8 being unable to descend alone when positioning is required, thereby ensuring the accuracy of positioning.

[0035] like Figure 2 and Figure 5 As shown, the clamping structure includes a pressing ring 20, and a plurality of guide rods 21 are provided on the pressing ring 20. The upper ends of the guide rods 21 pass through the upper mounting plate 18. The upper ends of the guide rods 21 are fixed with limit blocks 24 that contact the upper surface of the upper mounting plate 18. A buffer spring 22 is sleeved on the guide rod 21. The buffer spring 22 is located between the upper mounting plate 18 and the pressing ring 20. The pressing ring 20 can be connected to the upper mounting plate 18 through the limit blocks 24 and the guide rods 21. When the buffer spring 22 is compressed, The compression direction can be guided by the guide rod 21 to ensure the accuracy of compression; when the linear motor 17 drives the pressure ring 20 and the upper mounting plate 18 to descend, the pressure ring 20 first hits the silicon wafer. At this time, the buffer spring 22 is used to press the edge of the silicon wafer and the upper mounting plate 18 continues to descend until it reaches the etching station. In this way, the silicon wafer can be pressed and will not be offset. There is space between the upper electrode reaction plate 19 and the silicon wafer. The etching gas is introduced from the etching hole 191 to etch the silicon wafer, ensuring the accuracy of production.

[0036] like Figure 4 and Figure 5 As shown, the pressure ring 20 is surrounded by positioning plugs 23 that correspond to and seal the positioning holes 103. The ends of the positioning plugs 23 are conical. Due to the presence of the positioning holes 103, insufficient sealing may occur during etching. Therefore, after the pressure ring 20 contacts the edge of the silicon wafer, the positioning plugs 23 enter the positioning holes 103, continuously compressing the buffer spring 22. The positioning plugs 23 penetrate deeper into the positioning holes 103 until they completely plug the positioning holes 103. The positioning plugs 23 block the positioning holes 103, ensuring a good seal. This ensures that the vacuum level within the vacuum reaction chamber meets etching requirements, while also preventing gas from entering through the positioning holes, causing irregular flow of etching gas within the vacuum reaction chamber and reducing etching quality.

[0037] like Figure 6 As shown, the top of the positioning rod 9 is provided with an inclination angle for guiding the silicon wafer to fall into the silicon wafer placement area 101 when the support rod 8 falls. The inclination angle has a certain slope, so when the support rod 8 falls, the silicon wafer falls into the positioning area, and the edge of the silicon wafer descends along the inclination angle for accurate positioning, effectively ensuring the placement accuracy.

[0038] In this embodiment, the opening and closing mechanism of the feed port 12 includes a door frame 14 arranged at the edge of the feed port 12, and a slide groove 141 is provided on the door frame 14. A door sealing plate 13 is installed in the slide groove 141. The door sealing plate 13 is driven by a linear power device of the door sealing plate 13 to open or close the feed port 12. The linear power device of the door sealing plate 13 includes a second cylinder 15, and the second cylinder 15 is fixedly installed on the lower warehouse body 26. The opening and closing of the door sealing plate 13 is controlled by the extension and retraction of the guide rod of the second cylinder 15, which facilitates the loading of silicon wafers and can close the feed port 12 to ensure a closed environment during etching.

[0039] The working principle of the present invention is as follows: first, the cover shell 1 is opened, the first cylinder 5 drives the support seat 6 to rise, and after the sliding rod 61 on the support seat 6 contacts the upper part of the strip through hole 71, it drives the positioning seat 7 to rise until the support rod 8 reaches the supporting position and the positioning rod 9 reaches the positioning position. Then the second cylinder 15 retracts the guide rod, drives the door sealing plate 13 to rise, opens the feed port 12, and places the silicon wafer to be etched on the support rod 8 by the manipulator. After the feed port 12 is closed, the first cylinder 5 starts to drive the support rod 8 to move to the first standby position, and the silicon wafer enters the positioning area and contacts the inclination angle of the positioning rod 9. After the sliding rod 61 slides from the upper part to the lower part of the strip through hole 71, it drives the positioning rod 9 to descend synchronously until the support rod 8 When it reaches the first standby station, the positioning rod 9 returns to the second standby station, and the silicon wafer falls accurately into the placement area. Then the linear motor 17 drives the upper mounting plate 18 and the upper electrode reaction plate 19 to descend. After reaching the etching station, the pressure ring 20 on the upper mounting plate 18 presses the edge position of the silicon wafer through the buffer spring 22, and the positioning plug 23 blocks the positioning hole 103. Then the etching gas is ejected from the etching hole 191 in the upper electrode reaction plate 19, and etching begins. Until the etching is completed, the upper electrode reaction plate 19 returns to the third standby station, and the support rod 8 and the positioning rod 9 repeat the above steps to reach the support station and the positioning station, open the feed port 12, take out the etched silicon wafer, place a new silicon wafer, and then repeat the above etching steps.

[0040] The above-described embodiments are merely descriptions of preferred implementations of the present invention and are not intended to limit the scope of the present invention. Various modifications and alterations to the technical solutions of the present invention without departing from the spirit of the present invention shall fall within the scope of protection defined by the claims of the present invention.

Claims

1. A self-positioning dry etching device for silicon wafers, comprising a workbench, on which is mounted a vacuum reaction chamber for dry etching silicon wafers, the vacuum reaction chamber comprising an upper chamber body and a lower chamber body fixedly engaged with each other, the lower chamber body being provided with a feed port, the feed port being provided with a feed port opening and closing mechanism, the lower chamber body being provided with a placement platform, the placement platform being provided with a silicon wafer placement area, and characterized in that: The lower warehouse body is provided with a silicon wafer supporting device and a silicon wafer positioning device, the silicon wafer supporting device includes a plurality of axially retractable supporting rods extending from the silicon wafer placement area for supporting the silicon wafer, the silicon wafer positioning device includes a plurality of axially retractable positioning rods extending around the silicon wafer placement area for positioning the silicon wafer, the support rods are driven by a first power device to reciprocate between the supporting station and the first standby station, and the positioning rods are driven by a second power device to reciprocate between the positioning station and the second standby station. The placement platform is provided with supporting holes and positioning holes corresponding to the support rods and the positioning rods one by one, and a cooling groove for cooling the silicon wafer is provided on the placement platform in the silicon wafer placement area, and an air inlet interface for connecting the cooling gas to the cooling groove is provided on the workbench. An upper mounting plate is installed on the upper warehouse body for lifting and sliding, and an upper electrode reaction plate is fixed on the upper mounting plate. The upper electrode reaction plate is provided with a plurality of etching holes for passing the etching gas, and the upper mounting plate The cam is fixedly mounted on the support frame, and the positioning rod is fixedly mounted on the positioning seat, and the support frame is radially and evenly provided with two or more sliding rods. The positioning seat is provided with an axially extending strip through hole corresponding to the sliding rod one by one. The positioning seat is sleeved on the support seat, and the sliding rod is constrained in the strip through hole. The support rod in the first standby position is lower than the positioning rod in the second standby position, and the support rod in the supporting position is higher than the positioning rod in the positioning position. A positioning force structure is provided between the positioning seat and the workbench to keep the positioning rod in the positioning position. The first power device and the second power device adopt a set of supporting and positioning linear power devices, and the supporting and positioning linear power devices are connected to the support seat, and the supporting and positioning linear power devices adopt a first cylinder.

2. The silicon wafer self-positioning dry etching device according to claim 1, characterized in that: The positioning force structure includes a force spring arranged between the positioning seat and the workbench. The elastic force of the force spring forces the positioning seat to move from the second standby position to the positioning position. When the positioning seat is in the positioning position, the force spring is in a free state.

3. The silicon wafer self-positioning dry etching device according to claim 1, characterized in that: The positioning force-applying structure includes a plurality of damping rings, which are arranged in the positioning holes or are fixedly sleeved on the positioning rods.

4. A silicon wafer self-positioning dry etching device according to claim 2 or 3, characterized in that: The clamping structure includes a pressing ring, which is provided with a plurality of guide rods. The upper ends of the guide rods pass through the upper mounting plate. The upper ends of the guide rods are fixed with limit blocks that contact the upper surface of the upper mounting plate. The guide rods are provided with buffer springs, which are located between the upper mounting plate and the pressing ring.

5. The silicon wafer self-positioning dry etching device according to claim 4, characterized in that: Positioning plugs corresponding to the positioning holes and blocking the positioning holes are fixed around the pressure ring; the ends of the positioning plugs are conical.

6. The silicon wafer self-positioning dry etching device according to claim 5, characterized in that: The top of the positioning rod is provided with an inclination angle which facilitates guiding the silicon wafer to fall into the silicon wafer placement area when the support rod falls.

7. The silicon wafer self-positioning dry etching device according to claim 6, characterized in that: The feed port opening and closing mechanism includes a door frame arranged at the edge of the feed port, a slide groove is provided on the door frame, a door sealing plate is installed in the slide groove, and the door sealing plate is driven by a door sealing plate linear power device to open or close the feed port.

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