A pin mechanism and a wafer handling device

Abstract

This invention provides a ejector pin mechanism and a wafer handling device. The ejector pin mechanism includes an ejector pin assembly, a movement drive module, and a spring guide assembly. The spring guide assembly includes a connecting seat, a spring, and a spring holder. The connecting arm has elastic deformation capabilities; when the connecting seat moves upward, the connecting arm experiences balanced forces in all directions and deforms uniformly, thus limiting and guiding the connecting seat and the ejector pin assembly fixedly connected to it. This invention improves the ejector pin guiding accuracy and achieves high-precision guiding by employing a spring guide.

Description

Technical Field

[0001] This invention belongs to the field of wafer handling technology, and particularly relates to a pin mechanism and wafer handling equipment. Background Technology

[0002] Ejector mechanisms are common devices in wafer handling equipment (such as automatic die bonders and die attachers). Their function is to separate the wafer from the die film. They are characterized by small movement distance and high response speed. As wafers are generally becoming smaller and thinner, and die bonding efficiency is required to be higher and higher, increasingly higher requirements are being placed on the positional accuracy and response speed of ejector mechanisms.

[0003] Most existing ejector mechanisms use linear bushings or linear guides for guidance. Linear bushings or linear guides have two main problems: first, low preload leads to gaps affecting guiding accuracy; second, high preload results in excessive resistance affecting smooth movement. Balancing these two issues places high demands on parts processing and assembly, leading to complex device structures and high material and assembly costs.

[0004] Meanwhile, the use of linear bushings or linear guides introduces friction in the guiding direction, leading to wear and tear on internal components of the guide or bushing, and generating significant noise. However, at high speeds, any lack of guiding accuracy or smoothness of movement is fatal. Consequently, existing ejector mechanisms are becoming increasingly inadequate to handle ever-increasing die-bonding speeds. Summary of the Invention

[0005] The purpose of this invention is to provide a pin mechanism and a wafer handling device, which aims to solve the problems of high cost and loss of accuracy after long-term use of existing guiding devices.

[0006] The present invention is implemented as follows: a ejector mechanism for separating a wafer from a crystal film, comprising an ejector assembly, a motion drive module for driving the ejector assembly to move, and a spring guide assembly for guiding the ejector assembly.

[0007] The connecting seat is connected to the power output end of the vertical linear drive module, and the vertical linear drive module is used to drive the connecting seat to move up / down.

[0008] The connecting seat is movably inserted into the spring plate seat. The spring plate has a fixed ring, a movable ring, and a connecting arm. The connecting seat is vertically inserted into the movable ring. The connecting arm connects the fixed ring and the movable ring and is evenly distributed along the circumferential direction of the fixed ring. The movable ring is fixedly connected to the connecting seat, and the fixed ring is fixedly connected to the spring plate seat.

[0009] The connecting arm has an elastic deformation function. When the connecting seat moves upward, the connecting arm is subjected to balanced forces in all directions and deforms evenly, which plays a limiting and guiding role for the connecting seat and the pin fixedly connected to it.

[0010] Furthermore, the ejector pin assembly includes a vertical linear drive module, an ejector pin, an ejector pin rod, an ejector pin cap, and an ejector pin cap seat. The ejector pin rod is fixed on the connecting seat, and the ejector pin is fixed on the top of the ejector pin rod for lifting the wafer upward. The ejector pin cap is used to adsorb the crystal film. The ejector pin cap is fixed on the ejector pin cap seat, and the ejector pin rod is movably inserted into the ejector pin cap seat. When the connecting seat moves upward / downward, it drives the ejector pin to move upward / downward.

[0011] Furthermore, the spring guide assembly includes a connecting seat, one or more springs spaced apart along the length direction of the connecting seat, and one or more spring seats spaced apart along the length direction of the connecting seat.

[0012] Furthermore, the spring includes an upper spring and a lower spring, and the spring seat includes an upper spring seat and a lower spring seat; the movable ring of the upper spring is fixedly connected to the top of the connecting seat, the upper spring seat is located on the outer periphery of the top of the connecting seat, and the fixed ring of the upper spring is fixedly connected to the upper spring seat; the movable ring of the lower spring is fixedly connected to the bottom of the connecting seat, the lower spring seat is located on the outer periphery of the bottom of the connecting seat, and the fixed ring of the lower spring is fixedly connected to the lower spring seat.

[0013] Furthermore, the vertical linear drive module includes a drive motor, an eccentric shaft, and a rolling bearing. The eccentric shaft is fixedly connected to the rotating shaft of the drive motor and passes through the rolling bearing. The connecting seat has a connection port, and the rolling bearing is located in the connection port. When the drive motor is working, it drives the rolling bearing to rotate eccentrically, thereby causing the connecting seat to move upward / downward.

[0014] Furthermore, the ejector mechanism also includes an origin setting component, which includes a photoelectric sensor, an origin light-blocking plate, and a controller. The origin light-blocking plate is fixed on the rotating shaft of the drive motor. When the origin light-blocking plate moves to the set origin position, it blocks the light emitted by the photoelectric sensor. The photoelectric sensor is electrically connected to the controller. When the photoelectric sensor detects that the light is blocked, it sends a signal to the controller.

[0015] Furthermore, the spring has at least two connecting arms, which are distributed circumferentially along the movable ring.

[0016] Furthermore, the ejector mechanism also includes a base, on which the ejector assembly and the spring guide assembly are both mounted; the moving drive module includes an X-axis adjusting slide and a Y-axis adjusting slide, the base is fixed on the X-axis adjusting slide, and the Y-axis adjusting slide is mounted on the Y-axis adjusting slide. By adjusting the Y-axis adjusting slide and the X-axis adjusting slide, the position of the base in the Y and X directions can be finely adjusted.

[0017] The present invention also provides a wafer handling device, including a robotic arm for loading and unloading wafers and a pin mechanism as described in any of the above. After the pin mechanism separates the wafer from the wafer film, the robotic arm transports the wafer to a target location.

[0018] Furthermore, the wafer handling equipment is an automatic die bonder, an automatic die attacher, or an automatic sorting machine.

[0019] Compared with the prior art, the beneficial effects of this invention are as follows:

[0020] The ejector mechanism of the present invention is provided with a spring guide assembly for guiding the ejector assembly. The spring guide assembly includes a connecting seat, a spring, and a spring seat. The connecting arm has an elastic deformation function. When the connecting seat moves upward, the connecting arm is subjected to balanced forces in all directions and deforms uniformly, which can limit and guide the connecting seat and the ejector assembly fixedly connected to it. By using a spring guide, the following effects can be achieved:

[0021] 1. Improved the guiding accuracy of the ejector pin assembly, achieving high-precision guiding;

[0022] 2. It eliminates the problem of inconsistent static and dynamic frictional resistance, achieving a smooth motion resistance without sudden changes;

[0023] 3. High precision can be maintained for a long time without the need for lubrication.

[0024] 4. No friction in the guiding direction, resulting in low noise;

[0025] 5. The difficulty of parts processing and assembly is reduced, production costs are lowered, and it is suitable for mass production. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the ejector pin mechanism provided in an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the structure of the ejector pin assembly and the spring guide assembly provided in an embodiment of the present invention;

[0028] Figure 3 This is an exploded structural diagram of the ejector pin assembly and spring guide assembly provided in an embodiment of the present invention;

[0029] Figure 4This is a schematic diagram of the structure of the spring sheet provided in an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of the linear drive module provided in an embodiment of the present invention;

[0031] Figure 6 This is a schematic diagram of the spring sheet of the spring sheet guide assembly provided in the embodiment of the present invention when the spring sheet is in its original state;

[0032] Figure 7 This is a schematic diagram of the spring sheet of the spring sheet guide assembly provided in the embodiment of the present invention when the spring sheet is in the lifted state. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0034] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. The terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0035] Please refer to Figure 1 This illustration shows a preferred embodiment of the present invention, a ejector mechanism for separating a wafer from a wafer film, comprising a base 1, an ejector assembly, a spring guide assembly 3 for guiding the ejector assembly, a motion drive module 4 for driving the ejector assembly to move, and an origin setting assembly 5. Both the ejector assembly and the spring guide assembly 3 are mounted on the base 1.

[0036] Please refer to the following: Figure 2 The ejector pin assembly includes a vertical linear drive module, an ejector pin 21, an ejector pin rod 22, an ejector pin cap 23, and an ejector pin cap seat 24. The spring guide assembly includes a connecting seat 31, a spring 32, and a spring seat 33.

[0037] The connecting seat 31 is connected to the power output end of the vertical linear drive module. The vertical linear drive module is used to drive the connecting seat 31 to move upwards / downwards. In this embodiment, the drive motor 20 is used as the power source of the vertical linear drive module. The ejector pin rod 22 is fixed on the connecting seat 31, and the ejector pin 21 is fixed on the top of the ejector pin rod 22 to lift the wafer upwards. The ejector pin cap 23 generates negative pressure through an external vacuum device to adsorb the crystal film. The ejector pin cap 23 is fixed on the ejector pin cap seat 24, and the ejector pin rod 22 moves movably through the ejector pin cap seat 24. When the connecting seat 31 moves upwards / downwards, the ejector pin 21 can move upwards / downwards.

[0038] Please refer to the following: Figure 4 The connecting seat 31 is movably inserted into the spring plate seat 33. The spring plate 32 has a fixed ring 321, a movable ring 322, and a connecting arm 323. The connecting seat 31 is vertically disposed in the movable ring 321. The connecting arm 323 connects the fixed ring 321 and the movable ring 322 and is evenly distributed along the circumferential direction of the fixed ring 321. The movable ring 322 is fixedly connected to the connecting seat 31, and the fixed ring 321 is fixedly connected to the spring plate seat 33.

[0039] The connecting arm 323 has an elastic deformation function. When the connecting seat 31 moves upward, the connecting arm 323 is subjected to balanced forces in all directions and deforms evenly, which plays a limiting and guiding role for the connecting seat 31 and the ejector pin 21 fixedly connected to it.

[0040] The spring guide assembly 3 includes a connecting seat 31, one or more springs 32 spaced apart along the length of the connecting seat 31, and one or more spring seats 33 spaced apart along the length of the connecting seat 31. The number of spring seats 33 is the same as the number of springs 32, and the distribution positions of the spring seats 33 correspond one-to-one with the distribution positions of the springs 32. In practical applications, the specific number of springs 32 and spring seats 33 is not limited.

[0041] like Figure 3 As shown, the spring 32 in this embodiment includes an upper spring 32a and a lower spring 32b, and the spring seat 33 includes an upper spring seat 33a and a lower spring seat 33b. The movable ring 322 of the upper spring 32a is fixedly connected to the top of the connecting seat 31, the upper spring seat 33a is located on the outer periphery of the top of the connecting seat 31, and the fixing ring 321 of the upper spring 32a is fixedly connected to the upper spring seat 33a. The movable ring 322 of the lower spring 32b is fixedly connected to the bottom of the connecting seat 31, the lower spring seat 33b is located on the outer periphery of the bottom of the connecting seat 31, and the fixing ring 321 of the lower spring 32b is fixedly connected to the lower spring seat 33b.

[0042] The spring clip 32 has at least two connecting arms 323, which are equidistantly distributed along the circumference of the movable ring 322. For example... Figure 4As shown, the spring 32 has three connecting arms 323, and the central angle between the center lines of two adjacent connecting arms 323 is 120 degrees.

[0043] Please refer to Figure 5 The vertical linear drive module includes a drive motor 20, an eccentric shaft 26, and a rolling bearing 27. The eccentric shaft 26 is fixedly connected to the rotating shaft 201 of the drive motor 20, and the eccentric shaft 26 passes through the rolling bearing 27. The connecting seat 31 has a connecting port 311, and the rolling bearing 27 is located in the connecting port 311. When the drive motor 20 is working, it drives the rolling bearing 27 to rotate eccentrically, thereby driving the connecting seat 31 to move up / down.

[0044] Please refer to Figure 1 The mobile drive module 4 includes an X-axis adjustment slide 41 and a Y-axis adjustment slide 42. The base 1 is fixed on the Y-axis adjustment slide 42, and the Y-axis adjustment slide 42 is mounted on the X-axis adjustment slide 41. By adjusting the Y-axis adjustment slide 42 and the X-axis adjustment slide 41, the position of the base 1 in the Y and X directions can be finely adjusted, thereby adjusting the position of the ejector pin 21.

[0045] The origin setting component includes a photoelectric sensor 51, an origin light-blocking plate 52, and a controller. The origin light-blocking plate 52 is fixed on the rotating shaft 201 of the drive motor 20. When the origin light-blocking plate 52 moves to the set origin position, it blocks the light emitted by the photoelectric sensor 51. The photoelectric sensor 51 is electrically connected to the controller. When the drive motor 20 is working, it can drive the origin light-blocking plate 52 to find the origin (when the photoelectric sensor 51 detects that the light is blocked, it means that the eccentric shaft 26 and the connecting seat 31 are at the origin position), and send a signal to the controller.

[0046] like Figure 6 and Figure 7 As shown, the guiding principle of the spring guide assembly 3 is as follows:

[0047] In their initial state, the upper spring piece 32a and the lower spring piece 32b are flat or have a predetermined initial shape. When the connecting seat 31 is subjected to an upward external force, the two spring pieces 32 begin to move upward vertically. Because the upper spring piece 32a and the lower spring piece 32b are subjected to balanced forces in each direction, the deformation of the center of the upper spring piece 32a and the lower spring piece 32b is uniform in each direction. Therefore, the deformation of the upper spring piece 32a and the lower spring piece 32b is ensured to move vertically upward along the center. The presence of two spring pieces 32 ensures the accuracy of movement over a long span. When subjected to a downward external force, the upper spring piece 32a and the lower spring piece 32b move downward and return to their original state. At this point, a complete ejector pin cycle is completed.

[0048] This embodiment also provides a wafer handling device, including a robot for loading and unloading wafers and a ejector mechanism. After the ejector mechanism separates the wafer from the wafer film, the robot handles the wafer to the target location.

[0049] The wafer handling equipment in this embodiment can be any equipment that includes a mechanism for separating wafers from the wafer film, such as an automatic die bonder, an automatic die attacher, or an automatic sorting machine.

[0050] This embodiment achieves the following effect by using a spring guide assembly to guide the ejector pin 21:

[0051] 1. Improved the guiding accuracy of the ejector pin assembly, achieving high-precision guiding;

[0052] 2. It eliminates the problem of inconsistent static and dynamic frictional resistance, achieving a smooth motion resistance without sudden changes;

[0053] 3. High precision can be maintained for a long time without the need for lubrication.

[0054] 4. No friction in the guiding direction, resulting in low noise;

[0055] 5. The difficulty of parts processing and assembly is reduced, production costs are lowered, and it is suitable for mass production.

[0056] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A ejector mechanism for separating a wafer from a crystal film, characterized in that, The application relates to a vertical needle assembly, a vertical needle moving drive module, a spring guiding assembly and an original point setting assembly. The connecting seat is in transmission connection with the power output end of a vertical linear drive module, and the vertical linear drive module is used for driving the connecting seat to move upward / downward. The connecting seat is movably arranged in the spring seat, the spring has a fixed ring, a movable ring and connecting arms, the connecting seat is vertically arranged in the movable ring, the connecting arms are connected between the fixed ring and the movable ring and are uniformly distributed along the circumferential direction of the fixed ring, the movable ring is fixedly connected with the connecting seat, and the fixed ring is fixedly connected with the spring seat. The connecting arms have elastic deformation functions, the connecting arms are balanced in each direction when the connecting seat moves upward / downward, the connecting arms are uniformly deformed, and the connecting arms play a limiting and guiding role on the connecting seat and the vertical needle assembly. The spring guiding assembly comprises one connecting seat, one or more than two springs distributed along the length direction of the connecting seat and one or more than two spring seats distributed along the length direction of the connecting seat.

2. The pim mechanism of claim 1 wherein, The vertical needle assembly comprises a vertical needle, a vertical needle rod, a vertical needle cap and a vertical needle cap seat, the vertical needle rod is fixed on the connecting seat, the vertical needle is fixed on the top of the vertical needle rod and is used for upwardly lifting a wafer, the vertical needle cap is used for adsorbing a wafer film, the vertical needle cap is fixed on the vertical needle cap seat, the vertical needle rod is movably arranged in the vertical needle cap seat, and the connecting seat drives the vertical needle to move upward / downward when the connecting seat moves upward / downward.

3. The pim mechanism of claim 1 wherein, The vertical linear drive module comprises a driving motor, an eccentric shaft and a rolling bearing, the eccentric shaft is fixedly connected with the rotating shaft of the driving motor, and the eccentric shaft is arranged in the rolling bearing, the connecting seat is provided with a connecting port, the rolling bearing is arranged in the connecting port, and the driving motor drives the rolling bearing to eccentrically rotate and drives the connecting seat to move upward / downward when the driving motor works.

4. The pim mechanism of claim 3, wherein The original point setting assembly comprises an optical sensor, an original point light barrier and a controller, the original point light barrier is fixed on the rotating shaft of the driving motor, the original point light barrier blocks the light emitted by the optical sensor when the original point light barrier moves to a set original point position, the optical sensor is electrically connected with the controller, and the optical sensor sends a signal to the controller when the optical sensor detects that the light is blocked.

5. The needle mechanism of any one of claims 1 to 4, wherein, The spring has at least two connecting arms, and the at least two connecting arms are distributed along the circumferential direction of the movable ring.

6. The ejector mechanism according to any one of claims 1 to 4, wherein The base is also included, the needle assembly and the spring guide assembly are installed on the base; the movement driving module includes an X-direction adjusting sliding table and a Y-direction adjusting sliding table, the base is fixed on the Y-direction adjusting sliding table, the Y-direction adjusting sliding table is installed on the X-direction adjusting sliding table, and the position of the base in the Y-direction and the X-direction can be finely adjusted by adjusting the Y-direction adjusting sliding table and the X-direction adjusting sliding table.

7. A wafer handling apparatus comprising a wafer loading and unloading robot, characterized by The wafer handling equipment is an automatic die bonder, an automatic die bonder or an automatic sorting machine.

8. The wafer handling apparatus of claim 7, wherein The wafer handling equipment is an automatic die bonder, an automatic die bonder or an automatic sorting machine.

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