Three-color chip with simplified structure and its preparation method

Abstract

The present disclosure provides a three-color chip with a simplified structure and a preparation method thereof, belonging to the technical field of chip manufacturing. The support substrate is provided with four through holes penetrating the first surface and the second surface. The first surface electrode and the second surface electrode connected on the support substrate can ensure the stable use of the obtained three-color chip, simplify the structure of the three-color chip and the occupied volume. The first surface electrode and the second surface electrode are prepared simultaneously, shortening the preparation cycle of the three-color chip. The distribution of the first surface electrode and the second surface electrode, and the insulating layer covers the chip group and the first surface. Then, it can ensure the stable connection between the chip group and the electrode traces and cooperate with the insulating layer to avoid short circuits between the three chips, reduce the required height of the three-color chip, and at the same time ensure that the three-color chip can emit light simultaneously or the chips of each color can emit light independently. Overall, it can reduce the volume of the three-color chip and at the same time reduce the preparation cycle of the three-color chip.

Description

Technical Field

[0001] The present disclosure relates to the technical field of chip manufacturing, and particularly relates to a three-color chip with a simplified structure and a preparation method thereof. Background Art

[0002] A light-emitting diode is a very widely used light-emitting device, which is commonly used in traffic signal lights, internal and external automobile lights, urban lighting, medical detection or purification, etc. A light-emitting diode chip is a basic structure for preparing a light-emitting diode. A three-color chip is a kind of light-emitting diode chip, and the three-color chip includes a support substrate and a red light-emitting diode chip, a green light-emitting diode chip and a blue light-emitting diode chip which are arranged on the support substrate and are interconnected. When the red light-emitting diode chip, the green light-emitting diode chip and the blue light-emitting diode chip are simultaneously powered on, the red light-emitting diode chip, the green light-emitting diode chip and the blue light-emitting diode chip can simultaneously emit light and emit white light obtained by mixing the light of three colors.

[0003] In the related art, in the three-color chip, the red light-emitting diode chip, the green light-emitting diode chip and the blue light-emitting diode chip are arranged in a vertically stacked structure. And after the three chips are stacked and formed, at least two of the chips in the three-color chip need to be etched with a large area to set electrode lines on the corresponding chips. The structure of the three-color chip is relatively complex, and the required preparation cost and preparation volume are both large. Summary of the Invention

[0004] The embodiments of the present disclosure provide a three-color chip, which can simplify the structure and volume of the three-color chip and reduce the preparation cycle of the three-color chip at the same time. The technical solution is as follows:

[0005] The embodiments of the present disclosure provide a three-color chip with a simplified structure. The three-color chip with a simplified structure includes a support substrate, electrode traces, a chip group and an insulating layer.

[0006] The support substrate has a first surface and a second surface which are parallel and opposite to each other, and four through holes which are spaced apart from each other and penetrate through the first surface and the second surface. The electrode traces include a first surface electrode and a second surface electrode. The first surface electrode includes a total electrode trace, a red electrode trace, a green electrode trace or a blue electrode trace which have equal thicknesses and correspond to the four through holes one by one. The total electrode trace, the red electrode trace, the green electrode trace and the blue electrode trace are respectively connected to the side walls of the through holes. The second surface electrode includes four pads located on the second surface and corresponding to the four through holes one by one. The four pads are respectively connected to the total electrode trace, the red electrode trace, the green electrode trace and the blue electrode trace one by one.

[0007] The chipset includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip that are arranged side by side on the first surface. The red light-emitting diode chip includes a red epitaxial layer, a red positive electrode, and a red negative electrode stacked on the red epitaxial layer. The green light-emitting diode chip includes a green epitaxial layer, a green positive electrode, and a green negative electrode stacked on the green epitaxial layer. The blue light-emitting diode chip includes a blue epitaxial layer, a blue positive electrode, and a blue negative electrode stacked on the blue epitaxial layer.

[0008] The red positive electrode, the green positive electrode, and the blue positive electrode are all connected to the total electrode trace. The red electrode trace is connected to the red negative electrode, the green electrode trace is connected to the green negative electrode, and the blue electrode trace is connected to the blue negative electrode. Or the red negative electrode, the green negative electrode, and the blue negative electrode are all connected to the total electrode trace. The red electrode trace is connected to the red positive electrode, the green electrode trace is connected to the green positive electrode, and the blue electrode trace is connected to the blue positive electrode.

[0009] The insulating layer covers the chipset and the first surface.

[0010] Optionally, the minimum width of the projection of the first surface electrode on the first surface is greater than the minimum width of the projection of the red, green, and blue positive and negative electrodes on the first surface.

[0011] Optionally, the thickness of the first surface electrode is 0.5 - 5 μm, and the thickness of the second surface electrode is 0.5 - 5 μm.

[0012] Optionally, the diameter of the through hole is 5 - 20 micrometers.

[0013] The embodiments of the present disclosure provide a preparation method for a three-color chip with a simplified structure. The preparation method for the three-color chip with a simplified structure is used to prepare the three-color chip with a simplified structure as described above. The preparation method includes:

[0014] Providing a support substrate, a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. The support substrate has a first surface and a second surface that are parallel and opposite to each other, and four through holes that are spaced apart from each other and penetrate both the first surface and the second surface. The red light-emitting diode chip includes a red epitaxial layer, a red positive electrode, and a red negative electrode stacked on the red epitaxial layer. The green light-emitting diode chip includes a green epitaxial layer, a green positive electrode, and a green negative electrode stacked on the green epitaxial layer. The blue light-emitting diode chip includes a blue epitaxial layer, a blue positive electrode, and a blue negative electrode stacked on the blue epitaxial layer.

[0015] A first surface electrode and a second surface electrode are respectively formed on the first surface and the second surface of the support substrate to obtain electrode traces. The first surface electrode includes a total electrode trace, a red light electrode trace, a green light electrode trace, or a blue light electrode trace that have equal thicknesses and respectively correspond to the four through holes. The total electrode trace, the red light electrode trace, the green light electrode trace, and the blue light electrode trace are respectively connected to the side walls of the through holes. The second surface electrode includes four pads located on the second surface and corresponding to the four through holes one by one. The four pads are respectively connected to the total electrode trace, the red light electrode trace, the green light electrode trace, and the blue light electrode trace one by one;

[0016] The red light emitting diode chip, the green light emitting diode chip, and the blue light emitting diode chip are transferred onto the support substrate to obtain a chip group in which the red light emitting diode chip, the green light emitting diode chip, and the blue light emitting diode chip are arranged side by side on the support substrate. The red positive electrode, the green positive electrode, and the blue positive electrode are all connected to the total electrode trace. The red light electrode trace is connected to the red negative electrode, the green light electrode trace is connected to the green negative electrode, and the blue light electrode trace is connected to the blue negative electrode. Or the red negative electrode, the green negative electrode, and the blue negative electrode are all connected to the total electrode trace. The red light electrode trace is connected to the red positive electrode, the green light electrode trace is connected to the green positive electrode, and the blue light electrode trace is connected to the blue positive electrode;

[0017] An insulating layer covering the chip group is formed on the first surface.

[0018] Optionally, the transferring the red light emitting diode chip, the green light emitting diode chip, and the blue light emitting diode chip onto the support substrate includes:

[0019] Red light regions, green light regions, and blue light regions are respectively marked on the first surface;

[0020] Transfer the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip to the red light region, the green light region, and the blue light region respectively, and the red positive electrode, the green positive electrode, and the blue positive electrode are all in contact with the total electrode trace. The red electrode trace is in contact with the red negative electrode, the green electrode trace is in contact with the green negative electrode, and the blue electrode trace is in contact with the blue negative electrode. Or the red negative electrode, the green negative electrode, and the blue negative electrode are all in contact with the total electrode trace. The red electrode trace is in contact with the red positive electrode, the green electrode trace is in contact with the green positive electrode, and the blue electrode trace is in contact with the blue positive electrode;

[0021] Cure the first surface electrode, the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip.

[0022] Optionally, curing the first surface electrode, the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip includes:

[0023] Spin-coat a black organic material on the part of the first surface other than the first surface electrode, and the height of the black organic material is flush with the first surface electrode;

[0024] Cure the black organic material;

[0025] Form a metal weld between the first surface electrode and the red, green, and blue positive and negative electrodes.

[0026] Optionally, cure the black organic material for 5 - 30 min under the condition that the temperature is 100 - 300 degrees Celsius.

[0027] Optionally, providing the support substrate includes: providing a base substrate; etching four through holes on the base substrate to obtain the support substrate.

[0028] Optionally, the first surface electrode is formed by electroplating, and the second surface electrode is formed by welding.

[0029] The beneficial effects brought by the technical solution provided by the embodiments of the present disclosure include:

[0030] In a three-color chip with a simplified structure, a support substrate is provided with four through holes penetrating through the first surface and the second surface, and electrode traces are arranged as first surface electrodes and second surface electrodes distributed on the first surface respectively. The first surface electrodes include a total electrode trace, a red light electrode trace, a green light electrode trace, or a blue light electrode trace with equal thickness and corresponding to the four through holes one by one. The total electrode trace, the red light electrode trace, the green light electrode trace, and the blue light electrode trace are respectively connected to the side walls of the through holes. The second surface electrodes include four pads located on the second surface and corresponding to the four through holes one by one. The four pads are respectively connected to the total electrode trace, the red light electrode trace, the green light electrode trace, and the blue light electrode trace one by one. The connected first surface electrodes and second surface electrodes on the support substrate can ensure the stable use of the obtained three-color chip. At the same time, there is no need for additional etching in the chip or occupying a large amount of space of the epitaxial material, which can simplify the structure and the occupied volume of the three-color chip. The first surface electrodes and the second surface electrodes can be prepared simultaneously, and it will not affect the formation of the chip group, nor is it necessary to etch a pattern on the chip group and then perform electrode traces. To a certain extent, it can also shorten the overall preparation time required for the three-color chip and shorten the preparation cycle of the three-color chip. And the electrode traces, the red positive electrode, the green positive electrode, and the blue positive electrode in the chip group are all connected to the total electrode trace. The red light electrode trace is connected to the red negative electrode, the green light electrode trace is connected to the green negative electrode, and the blue light electrode trace is connected to the blue negative electrode, or the red negative electrode, the green negative electrode, and the blue negative electrode are all connected to the total electrode trace. The red light electrode trace is connected to the red positive electrode, the green light electrode trace is connected to the green positive electrode, and the blue light electrode trace is connected to the blue positive electrode. An insulating layer covers the chip group and the first surface. Then it can ensure the stable connection between the chip group and the electrode traces and cooperate with the insulating layer to avoid short circuits between the three chips, reduce the required height of the three-color chip while ensuring that the three-color chip can emit light simultaneously or the chips of each color can emit light independently. Overall, it can reduce the volume of the three-color chip while reducing the preparation cycle of the three-color chip. Brief Description of the Drawings

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present disclosure. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0032] Figure 1 It is a schematic structural diagram of a three-color chip provided by an embodiment of the present disclosure;

[0033] Figure 2 It is a top view of the support substrate and the electrode traces provided by an embodiment of the present disclosure;

[0034] Figure 3 is a cross-sectional view of a support substrate and electrode traces provided by an embodiment of the present disclosure;

[0035] Figure 4 is a bottom view of a support substrate and electrode traces provided by an embodiment of the present disclosure;

[0036] Figure 5 is a flowchart of a method for manufacturing a three-color chip provided by an embodiment of the present disclosure;

[0037] Figures 6 to 7 is a schematic diagram of the manufacturing process of a three-color chip provided by an embodiment of the present disclosure;

[0038] Figure 8 is a schematic diagram of the structure of another three-color chip provided by an embodiment of the present disclosure. Detailed implementation manners

[0039] To make the objectives, technical solutions, and advantages of the present disclosure clearer, the following will further describe the embodiments of the present disclosure in detail with reference to the accompanying drawings.

[0040] Figure 1 is a schematic diagram of the structure of a three-color chip provided by an embodiment of the present disclosure. Referring to Figure 1 it can be seen that the embodiment of the present disclosure provides a three-color chip with a simplified structure. The three-color chip with a simplified structure includes a support substrate 1, electrode traces 2, a chip group 3, and an insulating layer 4.

[0041] Figure 2 is a top view of a support substrate and electrode traces provided by an embodiment of the present disclosure, Figure 3 is a cross-sectional view of a support substrate and electrode traces provided by an embodiment of the present disclosure, Figure 4 is a bottom view of a support substrate and electrode traces provided by an embodiment of the present disclosure. Combining Figures 2 to 4 , the support substrate 1 has a first surface and a second surface that are parallel and opposite to each other, and four through holes 11 that are spaced apart from each other and penetrate both the first surface and the second surface. The electrode traces 2 include a first surface electrode 21 and a second surface electrode 22. The first surface electrode 21 includes a total electrode trace 211, a red light electrode trace 212, a green light electrode trace 213, or a blue light electrode trace 214 that have equal thicknesses and correspond to the four through holes 11 one by one. The total electrode trace 211, the red light electrode trace 212, the green light electrode trace 213, and the blue light electrode trace 214 are respectively connected to the side walls of the through holes 11. The second surface electrode 22 includes four pads located on the second surface and corresponding to the four through holes 11 one by one. The four pads are respectively connected to the total electrode trace 211, the red light electrode trace 212, the green light electrode trace 213, and the blue light electrode trace 214 one by one.

[0042] The chipset 3 includes a red light-emitting diode chip 31, a green light-emitting diode chip 32, and a blue light-emitting diode chip 33 that are arranged side by side on the first surface. The red light-emitting diode chip 31 includes a red epitaxial layer, a red positive electrode, and a red negative electrode laminated on the red epitaxial layer. The green light-emitting diode chip 32 includes a green epitaxial layer, a green positive electrode, and a green negative electrode laminated on the green epitaxial layer. The blue light-emitting diode chip 33 includes a blue epitaxial layer, a blue positive electrode, and a blue negative electrode laminated on the blue epitaxial layer.

[0043] The red positive electrode, the green positive electrode, and the blue positive electrode are all connected to the total electrode trace 211. The red electrode trace 212 is connected to the red negative electrode. The green electrode trace 213 is connected to the green negative electrode. The blue electrode trace 214 is connected to the blue negative electrode. Alternatively, the red negative electrode, the green negative electrode, and the blue negative electrode are all connected to the total electrode trace 211. The red electrode trace 212 is connected to the red positive electrode. The green electrode trace 213 is connected to the green positive electrode. The blue electrode trace 214 is connected to the blue positive electrode. The insulating layer 4 covers the chipset 3 and the first surface.

[0044] In a three-color chip with a simplified structure, the support substrate 1 is provided with four through holes 11 penetrating through the first surface and the second surface, and the electrode traces 2 are arranged as the first surface electrodes 21 and the second surface electrodes 22 distributed on the first surface respectively. The first surface electrodes 21 include a total electrode trace 211, a red light electrode trace 212, a green light electrode trace 213, or a blue light electrode trace 214 with equal thickness and corresponding to the four through holes 11 one by one. The total electrode trace 211, the red light electrode trace 212, the green light electrode trace 213, and the blue light electrode trace 214 are respectively connected to the side walls of the through holes 11. The second surface electrodes 22 include four pads located on the second surface and corresponding to the four through holes 11 one by one. The four pads are respectively connected to the total electrode trace 211, the red light electrode trace 212, the green light electrode trace 213, and the blue light electrode trace 214 one by one. The connected first surface electrodes 21 and second surface electrodes 22 on the support substrate 1 can ensure the stable use of the obtained three-color chip. At the same time, there is no need for additional etching in the chip or occupying a large amount of space of the epitaxial material, which can simplify the structure and the occupied volume of the three-color chip. The first surface electrodes 21 and the second surface electrodes 22 can be prepared simultaneously, and it will not affect the formation of the chip group 3. There is no need to etch a pattern on the chip group 3 and then perform the electrode traces 2. To a certain extent, it can also shorten the overall preparation time required for the three-color chip and shorten the preparation cycle of the three-color chip. And the electrode traces 2, the red positive electrode, the green positive electrode, and the blue positive electrode in the chip group 3 are all connected to the total electrode trace 211. The red light electrode trace 212 is connected to the red negative electrode, the green light electrode trace 213 is connected to the green negative electrode, and the blue light electrode trace 214 is connected to the blue negative electrode. Or the red negative electrode, the green negative electrode, and the blue negative electrode are all connected to the total electrode trace 211. The red light electrode trace 212 is connected to the red positive electrode, the green light electrode trace 213 is connected to the green positive electrode, and the blue light electrode trace 214 is connected to the blue positive electrode. The insulating layer 4 covers the chip group 3 and the first surface. Then it can ensure the stable connection between the chip group 3 and the electrode traces 2 and cooperate with the insulating layer 4 to avoid short circuits between the three chips. While reducing the required height of the three-color chip, it can also ensure that the three-color chip can emit light simultaneously or the chips of each color can emit light independently. Overall, it can reduce the volume of the three-color chip and at the same time reduce the preparation cycle of the three-color chip.

[0045] Exemplarily, the thickness of the support substrate 1 can be 2 to 3 micrometers.

[0046] When the thickness of the support substrate 1 is within the above range, it can ensure the stable support of the electrode traces 2 and at the same time ensure that the quality of the electrode traces 2 formed on the support substrate 1 is also good.

[0047] Optionally, the axes of the four through-holes 11 can be respectively at the four corners of a rectangle. This can facilitate the formation of the through-holes 11 and also facilitate the arrangement and distribution of the electrode traces 2 near the through-holes 11.

[0048] Optionally, the diameter of the through-hole 11 is 5 to 20 microns.

[0049] When the diameter of the through-hole 11 is within the above range, a stable connection between the first surface electrode 21 and the second surface electrode 22 can be achieved, so as to improve the service quality of the finally obtained three-color chip.

[0050] Exemplarily, the minimum width of the orthographic projection of the first surface electrode 21 on the first surface is greater than the minimum width of the orthographic projections of the positive and negative electrodes of red, green, and blue light on the first surface.

[0051] When the orthographic projection of the first surface electrode 21 on the support substrate 1 and the orthographic projections of the electrodes of each chip on the support substrate 1 adopt the above structure, sufficient contact between the first surface electrode 21 and each chip can be ensured, a stable connection between the first surface electrode 21 and each chip can be ensured, and at the same time, each chip can be stably supported by the first surface electrode 21, improving the reliability of the obtained three-color chip.

[0052] In an implementation provided by the present disclosure, the total electrode trace 211, the red light electrode trace 212, the green light electrode trace 213, or the blue light electrode trace 214 included in the first surface electrode 21 can all be strip-shaped. This can facilitate the preparation of the first surface electrode 21 and reduce the space.

[0053] It should be noted that in other implementations provided by the present disclosure, the total electrode trace 211, the red light electrode trace 212, the green light electrode trace 213, or the blue light electrode trace 214 included in the first surface electrode 21 can also be set to regular or irregular shapes with a gradually changing width, and the present disclosure does not limit this.

[0054] Exemplarily, the material of the electrode trace 2 can include one or more of Ti, Ni, Au, Al, Pt, and Cu. This can facilitate the preparation of the electrode trace 2.

[0055] Exemplarily, the minimum width of the total electrode trace 211, the red light electrode trace 212, the green light electrode trace 213, or the blue light electrode trace 214 is greater than 50 microns. This can ensure a stable connection between the first surface electrode 21 and the electrodes of each chip.

[0056] Optionally, in the chipset 3, the minimum distance between the red light-emitting diode chip 31 and the green light-emitting diode chip 32 and the minimum distance between the green light-emitting diode chip 32 and the blue light-emitting diode chip 33 are equal. This can ensure the stable mixing of various lights to improve the usage quality of the finally obtained three-color chip.

[0057] Exemplarily, the distance between the red light-emitting diode and the green light-emitting diode can be 5 to 500. This can effectively improve the usage quality of the finally obtained three-color chip and also facilitate the preparation of the three-color chip.

[0058] Optionally, the total electrode trace 211 includes a first surface electrode 21 connected to the insulating layer 4 and a second surface electrode 22 connected to the insulating layer 4 and each positive electrode or each negative electrode. The projection of the first surface electrode 21 on the surface of the support substrate 1 is parallel to the arrangement direction of the red light-emitting diode, the green light-emitting diode, and the blue light-emitting diode.

[0059] By setting the total electrode trace 211 as the first surface electrode 21 and the second surface electrode 22 with the above structure, it is convenient to set the total electrode trace 211 and reduce the space occupied by the total electrode trace 211.

[0060] It should be noted that the red light-emitting diode chip 31, the green light-emitting diode chip 32, and the blue light-emitting diode chip 33 can all be prepared using common red, green, and blue materials, and the present disclosure does not limit this.

[0061] Figure 5 It is a flowchart of a method for preparing a three-color chip provided by an embodiment of the present disclosure. The embodiment of the present disclosure provides a method for preparing a three-color chip with a simplified structure. The method for preparing a three-color chip with a simplified structure is used to prepare the three-color chip with a simplified structure as described above. The preparation method includes:

[0062] S101: Provide a support substrate, a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. The support substrate has a first surface and a second surface that are parallel and opposite to each other and four through holes that are spaced apart and penetrate both the first surface and the second surface. The red light-emitting diode chip includes a red epitaxial layer and a red positive electrode and a red negative electrode stacked on the red epitaxial layer. The green light-emitting diode chip includes a green epitaxial layer and a green positive electrode and a green negative electrode stacked on the green epitaxial layer. The blue light-emitting diode chip includes a blue epitaxial layer and a blue positive electrode and a blue negative electrode stacked on the blue epitaxial layer.

[0063] S102: Form a first surface electrode and a second surface electrode on the first surface and the second surface of the support substrate respectively to obtain electrode traces. The first surface electrode includes a total electrode trace, a red light electrode trace, a green light electrode trace, or a blue light electrode trace with equal thickness and corresponding to four through holes one by one. The total electrode trace, the red light electrode trace, the green light electrode trace, and the blue light electrode trace are respectively connected to the side walls of the through holes. The second surface electrode includes four pads located on the second surface and corresponding to the four through holes one by one. The four pads are respectively connected to the total electrode trace, the red light electrode trace, the green light electrode trace, and the blue light electrode trace one by one.

[0064] S103: Transfer a red light emitting diode chip, a green light emitting diode chip, and a blue light emitting diode chip onto the support substrate to obtain a chip group in which the red light emitting diode chip, the green light emitting diode chip, and the blue light emitting diode chip are arranged side by side on the support substrate. And the red positive electrode, the green positive electrode, and the blue positive electrode are all connected to the total electrode trace. The red light electrode trace is connected to the red negative electrode. The green light electrode trace is connected to the green negative electrode. The blue light electrode trace is connected to the blue negative electrode. Or the red negative electrode, the green negative electrode, and the blue negative electrode are all connected to the total electrode trace. The red light electrode trace is connected to the red positive electrode. The green light electrode trace is connected to the green positive electrode. The blue light electrode trace is connected to the blue positive electrode.

[0065] S104: Form an insulating layer covering the chip group on the first surface.

[0066] The technical effects obtained after performing step S104 can refer to Figure 1 the technical effects corresponding to the structure of the three-color chip shown in

[0067] Exemplarily, in step S101, providing a support substrate includes: providing a basic substrate; etching four through holes on the basic substrate to obtain a support substrate.

[0068] Forming four through holes on the structure of the basic substrate to obtain a support substrate can ensure the strength and usage specifications of the obtained support substrate, and facilitate controlling the distance between the through holes and the size of the through holes.

[0069] Optionally, the material of the basic substrate can be alumina or glass. This can ensure the stable light emission of the obtained three-color chip.

[0070] Exemplarily, the etching of the basic substrate can be performed by dry etching, wet etching, or laser etching. This can ensure the quality of the obtained through holes, and the present disclosure does not limit this.

[0071] Optionally, in step S101, alignment marks corresponding to red, green, and blue lights can also be prepared on the support substrate. This is to facilitate the transfer and connection of each color chip.

[0072] Exemplarily, in step S101, providing a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip, includes:

[0073] Forming red light-emitting diode chips on a red growth substrate, a green growth substrate, and a blue growth substrate respectively; adhesively attaching a red temporary substrate, a green temporary substrate, and a blue temporary substrate to the sides of the red light-emitting diode chip away from the red growth substrate, the green light-emitting diode chip away from the green growth substrate, and the blue light-emitting diode chip away from the blue growth substrate respectively.

[0074] Before transferring the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip, growing basic epitaxial materials of different colors on each growth substrate first can improve the quality of the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip.

[0075] It should be noted that the red light-emitting diode chip includes a red epitaxial layer and a red positive electrode and a red negative electrode stacked on the red epitaxial layer, the green light-emitting diode chip includes a green epitaxial layer and a green positive electrode and a green negative electrode stacked on the green epitaxial layer, the blue light-emitting diode chip includes a blue epitaxial layer and a blue positive electrode and a blue negative electrode stacked on the blue epitaxial layer, and an insulating layer covers the surfaces of the chip group and the support substrate. Each growth substrate is a substrate facilitating the growth of epitaxial materials of corresponding colors.

[0076] Exemplarily, in step S102, electroplating and forming the first surface electrode, and welding and forming the second surface electrode.

[0077] The quality of the obtained first surface electrode and second surface electrode can be ensured.

[0078] In other implementation manners provided by the present disclosure, the first surface electrode can also be prepared by means of metal evaporation, and the present disclosure does not limit this.

[0079] Exemplarily, in step S103, transferring the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip to a support substrate, includes:

[0080] Mark the red light area, green light area, and blue light area on the first surface respectively; transfer the red light-emitting diode chip, green light-emitting diode chip, and blue light-emitting diode chip to the red light area, green light area, and blue light area respectively, and the red positive electrode, green positive electrode, and blue positive electrode are all in contact with the total electrode trace, the red electrode trace is in contact with the red negative electrode, the green electrode trace is in contact with the green negative electrode, the blue electrode trace is in contact with the blue negative electrode, or the red negative electrode, green negative electrode, and blue negative electrode are all in contact with the total electrode trace, the red electrode trace is in contact with the red positive electrode, the green electrode trace is in contact with the green positive electrode, and the blue electrode trace is in contact with the blue positive electrode; cure the first surface electrode and the red light-emitting diode chip, green light-emitting diode chip, and blue light-emitting diode chip.

[0081] Forming corresponding red, green, and blue light areas on the first surface of the support substrate can ensure a stable connection between the support substrate and each color chip. At the same time, curing after the first surface electrode is in contact with the electrodes of each color chip can enhance the connection stability between the support substrate and each color chip.

[0082] Optionally, curing the first surface electrode and the red light-emitting diode chip, green light-emitting diode chip, and blue light-emitting diode chip includes:

[0083] Spin-coat a black organic material on the part of the first surface other than the first surface electrode, and the height of the black organic material is flush with the first surface electrode; cure the black organic material; form a metal weld between the first surface electrode and the red, green, and blue positive and negative electrodes.

[0084] When realizing the connection between the first surface electrode and the electrodes of each color chip, adopting the method of spin-coating and curing first and then forming a metal weld can enhance the connection stability between the first surface electrode and the electrodes of each color chip, and effectively improve the quality of the finally obtained three-color chip.

[0085] Optionally, cure the black organic material for 5 - 30 min under the condition of a temperature of 100 - 300 degrees Celsius. This can improve the connection strength between the first surface electrode and the electrodes of each color chip.

[0086] In step S104, the material of the insulating layer can be an organic glue or an insulating glass material. This can reduce the possibility of leakage.

[0087] Figures 6 to 7 It is a schematic diagram of the preparation process of a three-color chip provided by an embodiment of the present disclosure. Figure 6 It shows that the red light-emitting diode chip 31 is connected to the red temporary substrate 100. Figure 7 It shows the structure in which the first surface electrode 21 is connected to the electrodes of each color chip.

[0088] Figure 8 is another structural schematic diagram of a three-color chip provided by an embodiment of the present disclosure. Referring to Figure 8 it can be seen that in other implementation manners provided by the present disclosure, an antireflection layer 5 can also be formed between the support substrate 1 and the insulating layer 4. The material of the antireflection layer 5 can be an organic black material, which can improve the light output contrast of the three-color chip.

[0089] In other implementation manners provided by the present disclosure, the Figure 5 preparation method shown in can also be applied to the preparation process of multiple chips. For example, after obtaining multiple three-color chips on the same substrate, the three-color chips are then cut and separated.

[0090] The above is not any form of limitation to the present disclosure. Although the present disclosure has been disclosed as above through embodiments, it is not intended to limit the present disclosure. Any person skilled in the art can make some changes or modifications to equivalent embodiments by using the technical content disclosed above within the scope of the technical solution of the present disclosure. However, as long as the content does not depart from the technical solution of the present disclosure, any simple modification, equivalent change, and modification made to the above embodiments based on the technical essence of the present disclosure still fall within the scope of the technical solution of the present disclosure.

Claims

1. A method for preparing a three-color chip with a simplified structure, characterized in that, the preparation method includes: providing a support substrate, a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. The support substrate has a first surface and a second surface that are parallel and opposite to each other, and four through holes that are spaced apart from each other and penetrate through the first surface and the second surface. The red light-emitting diode chip includes a red light epitaxial layer, a red light positive electrode, and a red light negative electrode stacked on the red light epitaxial layer. The green light-emitting diode chip includes a green light epitaxial layer, a green light positive electrode, and a green light negative electrode stacked on the green light epitaxial layer. The blue light-emitting diode chip includes a blue light epitaxial layer, a blue light positive electrode, and a blue light negative electrode stacked on the blue light epitaxial layer; forming a first surface electrode and a second surface electrode on the first surface and the second surface of the support substrate respectively to obtain electrode traces. The first surface electrode includes a total electrode trace, a red light electrode trace, a green light electrode trace, or a blue light electrode trace that have equal thicknesses and correspond to the four through holes one by one. The total electrode trace, the red light electrode trace, the green light electrode trace, and the blue light electrode trace are respectively connected to the side walls of the through holes. The second surface electrode includes four pads located on the second surface and corresponding to the four through holes one by one. The four pads are respectively connected to the total electrode trace, the red light electrode trace, the green light electrode trace, and the blue light electrode trace one by one; Transfer the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip to the support substrate to obtain a chip group in which the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip are arranged side by side on the support substrate, and the red positive electrode, the green positive electrode, and the blue positive electrode are all connected to the total electrode trace, the red electrode trace is connected to the red negative electrode, the green electrode trace is connected to the green negative electrode, the blue electrode trace is connected to the blue negative electrode, or the red negative electrode, the green negative electrode, and the blue negative electrode are all connected to the total electrode trace, the red electrode trace is connected to the red positive electrode, the green electrode trace is connected to the green positive electrode, the blue electrode trace is connected to the blue positive electrode; The transferring the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip to the support substrate includes: marking a red region, a green region, and a blue region on the first surface respectively; transferring the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip to the red region, the green region, and the blue region respectively, and the red positive electrode, the green positive electrode, and the blue positive electrode are all in contact with the total electrode trace, the red electrode trace is in contact with the red negative electrode, the green electrode trace is in contact with the green negative electrode, the blue electrode trace is in contact with the blue negative electrode, or the red negative electrode, the green negative electrode, and the blue negative electrode are all in contact with the total electrode trace, the red electrode trace is in contact with the red positive electrode, the green electrode trace is in contact with the green positive electrode, the blue electrode trace is in contact with the blue positive electrode; Cure the first surface electrodes and the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip; The curing the first surface electrodes and the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip includes: spin-coating a black organic material on the part of the first surface except the first surface electrodes, and the height of the black organic material is flush with the first surface electrodes; Cure the black organic material; Form a metal weld between the first surface electrodes and the red, green, and blue positive and negative electrodes. Form an insulating layer covering the chip group on the first surface.

2. The preparation method according to claim 1, wherein, Cure the black organic material for 5 to 30 minutes under the condition that the temperature is 100 to 300 degrees Celsius.

3. The preparation method according to claim 1 or 2, wherein, The providing the support substrate includes: providing a base substrate; etching four through holes on the base substrate to obtain the support substrate.

4. The preparation method according to claim 1 or 2, wherein, The first surface electrode is formed by electroplating, and the second surface electrode is formed by welding.

5. A three-color chip with a simplified structure, characterized in that, the three-color chip with the simplified structure is prepared by the preparation method described in any one of claims 1 to 4. The three-color chip includes a support substrate, electrode traces, a chip group, and an insulating layer. The support substrate has a first surface and a second surface that are parallel and opposite to each other, and four through holes that are spaced apart from each other and penetrate both the first surface and the second surface. The electrode traces include a first surface electrode and a second surface electrode. The first surface electrode includes a total electrode trace, a red light electrode trace, a green light electrode trace, or a blue light electrode trace that have equal thicknesses and correspond to the four through holes one by one. The total electrode trace, the red light electrode trace, the green light electrode trace, and the blue light electrode trace are respectively connected to the side walls of the through holes. The second surface electrode includes four pads located on the second surface and corresponding to the four through holes one by one. The four pads are respectively connected to the total electrode trace, the red light electrode trace, the green light electrode trace, and the blue light electrode trace one by one. The chip group includes a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip that are arranged side by side on the first surface. The red light-emitting diode chip includes a red light epitaxial layer, a red light positive electrode, and a red light negative electrode stacked on the red light epitaxial layer. The green light-emitting diode chip includes a green light epitaxial layer, a green light positive electrode, and a green light negative electrode stacked on the green light epitaxial layer. The blue light-emitting diode chip includes a blue light epitaxial layer, a blue light positive electrode, and a blue light negative electrode stacked on the blue light epitaxial layer. The red light positive electrode, the green light positive electrode, and the blue light positive electrode are all connected to the total electrode trace. The red light electrode trace is connected to the red light negative electrode. The green light electrode trace is connected to the green light negative electrode. The blue light electrode trace is connected to the blue light negative electrode. Or the red light negative electrode, the green light negative electrode, and the blue light negative electrode are all connected to the total electrode trace. The red light electrode trace is connected to the red light positive electrode. The green light electrode trace is connected to the green light positive electrode. The blue light electrode trace is connected to the blue light positive electrode. The insulating layer covers the chip group and the first surface.

6. The three-color chip with the simplified structure according to claim 5, characterized in that, the minimum width of the orthographic projection of the first surface electrode on the first surface is greater than the minimum width of the orthographic projections of the red, green, and blue light positive and negative electrodes on the first surface.

7. The three-color chip with the simplified structure according to claim 5, characterized in that, the thickness of the first surface electrode is 0.5 - 5 microns, and the thickness of the second surface electrode is 0.5 - 5 microns.

8. The three-color chip with the simplified structure according to any one of claims 5 to 7, characterized in that, the diameter of the through hole is 5 - 20 microns.

Images